Test element group, large display panel, preparation method of display panel and display device

Abstract

The invention provides a test element group, a display panel, a preparation method of a display panel and a display device, relates to the technical field of display, and solves the problem that the lap joint condition of a cathode of a display product cannot be determined in the prior art. The test element group comprises a substrate, a leading-out structure, a supporting structure, a plurality of isolation structures and a test electrode, the leading-out structure is located on one side of the substrate, and the supporting structure is located on one side, deviating from the substrate, of the leading-out structure; the plurality of isolation structures comprise a first isolation structure and a second isolation structure which are arranged on the side, away from the substrate, of the supporting structure and are arranged at intervals, and the first isolation structure and the second isolation structure are electrically connected with the leading-out structure; each of the first isolation structure and the second isolation structure comprises a first part and a second part; the first part comprises a first side wall and a second side wall, the orthographic projection of the first side wall on the substrate is located in the orthographic projection of the supporting structure on the substrate, and the second side wall protrudes out of the supporting structure; the test electrode is in lap joint with the first side wall and is separated from the second side wall.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a test element group, a display panel, a display panel manufacturing method and a display device. BACKGROUND

[0002] Organic light emitting diode (OLED) and flat display devices based on light emitting diode (LED) technology have been widely applied to mobile phones, televisions, notebook computers, desktop computers and other consumer electronic products due to their high image quality, power saving, thin body and wide application range, and have become the mainstream of display devices.

[0003] However, the current display product cathode overlap cannot be determined. SUMMARY

[0004] Therefore, the present application provides a test element group, a display panel, a display panel manufacturing method and a display device, which solve the problem that the cathode overlap of the display product cannot be determined in the prior art.

[0005] The first aspect of the present application provides a test element group, including a substrate, an extraction structure, a support structure, a plurality of isolation structures and a test electrode, the extraction structure is located on one side of the substrate, the extraction structure includes a first wire and a second wire, and the support structure is located on the side of the extraction structure away from the substrate; the plurality of isolation structures includes a first isolation structure and a second isolation structure arranged on the side of the support structure away from the substrate and spaced apart from each other, the first isolation structure is electrically connected with the first wire, and the second isolation structure is electrically connected with the second wire; wherein the first isolation structure and the second isolation structure each include a first part and a second part; the first part includes a first sidewall and a second sidewall connected to the first sidewall, the orthographic projection of the first sidewall on the substrate is located within the orthographic projection of the support structure on the substrate, and the second sidewall protrudes out of the support structure; the test electrode is located on the side of the support structure away from the substrate, the test electrode is overlapped with the first sidewall and is spaced apart from the second sidewall.

[0006] In some possible embodiments in combination with the first aspect, the orthographic projection of the test electrode on the substrate surrounds the orthographic projection of the support structure on the substrate; preferably, the test electrode includes a first electrode part and a second electrode part, the first electrode part is overlapped with the first sidewall, and the second electrode part is in contact with the support structure and is spaced apart from the second sidewall; preferably, the test element group further includes a conductive part, the conductive part is located on the side of the second part away from the first part, and the conductive part is arranged spaced apart from the test electrode; preferably, the conductive part and the test electrode are arranged in the same layer and are made of the same material; preferably, further including a light emitting material layer, which is located between the test electrode and the support structure, between the conductive part and the first isolation structure, and between the conductive part and the second isolation structure.

[0007] In conjunction with the first aspect, in some possible embodiments, the test element group further includes a blocking structure located on one side of the substrate, the blocking structure and the support structure being disposed in the same layer and surrounding the periphery of the support structure, the blocking structure and the support structure being spaced apart to form a groove between them, the first electrode portion and the second electrode portion being located within the groove and spaced apart from the conductive portion covering the adjacent second portion; preferably, the blocking structure and the support structure are made of the same material and both include inorganic materials.

[0008] In conjunction with the first aspect, in some possible embodiments, the plurality of isolation structures further includes a third isolation structure located on the side of the barrier structure facing away from the substrate; a portion of the orthographic projection of the third isolation structure on the substrate is located outside the orthographic projection of the barrier structure on the substrate, and a portion of the orthographic projection is located on the side of the barrier structure's orthographic projection close to the orthographic projection of the support structure on the substrate; preferably, the third isolation structure includes a third portion and a fourth portion, the fourth portion extending from the side of the third portion facing away from the substrate to cover at least a portion of the sidewall of the third portion near the support structure; preferably, on the side of the third portion away from the support structure, the fourth portion protrudes from the edge of the third portion; preferably, the orthographic projection of the test electrode on the substrate covers the interval region between the orthographic projections of the barrier structure and the support structure on the substrate. In conjunction with the first aspect, in some possible embodiments, on the side where the first sidewall is located, a second portion protrudes from the edge of the first portion; preferably, the second portion extends from the side of the first portion facing away from the substrate to cover at least a portion of the second sidewall; preferably, on the side where the second sidewall is located, the second portion protrudes from the edge of the first portion.

[0009] In conjunction with the first aspect, in some possible embodiments, the first isolation structure and the second isolation structure are arranged along a first direction, and the first sidewall of the first isolation structure and the first sidewall of the second isolation structure are located on the same side of the first direction; preferably, the first sidewall of the first isolation structure and the first sidewall of the second isolation structure are parallel or coplanar; preferably, the first sidewall is a plane.

[0010] In conjunction with the first aspect, in some possible embodiments, the support structure includes a first support portion, a second support portion, and a connecting portion, wherein the connecting portion connects the first support portion and the second support portion; a first isolation structure is located on the side of the first support portion away from the substrate, and a second isolation structure is located on the side of the second support portion away from the substrate; preferably, the first support portion and the second support portion are arranged along a first direction, and in a second direction perpendicular to the first direction, the width of the connecting portion is smaller than the width of the first support portion and the width of the second support portion.

[0011] In conjunction with the first aspect, in some possible embodiments, the first support portion includes a third sidewall, the connecting portion includes a fourth sidewall, and the second support portion includes a fifth sidewall, with the third, fourth, and fifth sidewalls connected sequentially; preferably, the third, fourth, and fifth sidewalls are coplanar; preferably, the first sidewall, the portion of the first support portion facing away from the substrate, and the third sidewall in the first isolation structure constitute a first stepped structure, and the first sidewall, the portion of the second support portion facing away from the substrate, and the fifth sidewall in the second isolation structure constitute a second stepped structure; preferably, the orthographic projection of the support structure onto the substrate is U-shaped.

[0012] In conjunction with the first aspect, in some possible embodiments, the lead-out structure further includes a first conductive pad and a second conductive pad, the first conductive pad being connected to the first wire, and the second conductive pad being connected to the second conductive wire; preferably, the first conductive pad includes a first sub-conductive pad and a second sub-conductive pad that are electrically connected, and the second conductive pad includes a third sub-conductive pad and a fourth sub-conductive pad that are electrically connected.

[0013] In conjunction with the first aspect, in some possible embodiments, a first package portion is further included, the first package portion being located on the side of the test electrode away from the substrate; preferably, the orthographic projection of the first package portion on the substrate covers the orthographic projections of the test electrode and the conductive portion on the substrate respectively; preferably, the plurality of isolation structures further includes a third isolation structure located on the side of the blocking structure away from the substrate; the orthographic projection of the first package portion on the substrate also covers at least a portion of the orthographic projection of the third isolation structure on the substrate.

[0014] A second aspect of this application provides a display panel including multiple display panels and the aforementioned test element group, wherein the test element group is located around the display panels; wherein the display panels and the test element group share a substrate; the display panel includes a fourth isolation structure and a sub-pixel located on one side of the substrate, the fourth isolation structure enclosing an isolation opening; the sub-pixel includes a first electrode located within the isolation opening and overlapping with the fourth isolation structure; the test electrode and the first electrode are disposed on the same layer.

[0015] In conjunction with the second aspect, in some possible embodiments, the fourth isolation structure in the display panel and the isolation structure in the test element group are disposed on the same layer; preferably, the sub-pixel further includes a second electrode located on the side of the first electrode near the substrate; at least part of the second electrode is located within the isolation opening; preferably, the sub-pixel further includes a light-emitting layer located between the first electrode and the second electrode; preferably, the light-emitting material layer and the light-emitting layer are disposed on the same layer.

[0016] In conjunction with the second aspect, in some possible embodiments, the display panel further includes a pixel definition structure located between the fourth isolation structure and the substrate; the pixel definition structure encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate; the pixel definition structure and the support structure are disposed on the same layer.

[0017] In conjunction with the second aspect, some possible embodiments further include an encapsulation structure, which includes a first encapsulation portion and a second encapsulation portion. The first encapsulation portion is located on the side of the sub-pixel facing away from the substrate, and the second encapsulation portion is located on the side of the test electrode facing away from the substrate. Preferably, the first encapsulation portion and the second encapsulation portion are disposed on the same layer. Preferably, the encapsulation structure further includes an organic encapsulation layer located on the side of the first encapsulation portion facing away from the substrate, and the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projections of the first encapsulation portion and the fourth isolation structure on the substrate. Preferably, the encapsulation structure further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer facing away from the substrate, and the orthographic projection of the inorganic encapsulation layer on the substrate is located at the same level as the orthographic projection of the organic encapsulation layer on the substrate.

[0018] In conjunction with the second aspect, in some possible embodiments, the display panel and the test element group correspond one-to-one.

[0019] In conjunction with the second aspect, in some possible embodiments, multiple display panel arrays are arranged, with one test element group corresponding to each row of display panels; preferably, the test element group is arranged on any side of a row of display panels in the row direction.

[0020] A third aspect of this application provides a method for fabricating a display panel, comprising fabricating a plurality of display panels and at least one test element group on one side of a substrate, the test element group being located around the display panels and used to test the electrode bonding resistance in the display panels; cutting and removing the test element group, and cutting the plurality of display panels into a plurality of independent display panels.

[0021] In conjunction with the third aspect, in some possible embodiments, fabricating a plurality of display panels and at least one test element group on one side of the substrate includes: fabricating a second electrode and a lead-out structure on one side of the substrate, the lead-out structure including a first wire and a second wire; fabricating an insulating layer on the side of the second electrode and the lead-out structure away from the substrate, the insulating layer including a pixel definition structure and a support structure; the pixel definition structure enclosing a pixel opening, the pixel opening exposing at least a portion of the second electrode, the support structure being located on the side of the lead-out structure away from the substrate; fabricating an isolation structure layer on the side of the insulating layer away from the substrate, the isolation structure layer including a first isolation structure, a second isolation structure and a fourth isolation structure; the fourth isolation structure being located on the side of the pixel definition portion away from the substrate, the fourth isolation structure enclosing an isolation opening, the isolation opening exposing at least a portion of the second electrode, the first isolation structure and the second isolation structure... The isolation structures are all located on the side of the support structure away from the substrate. The first isolation structure is electrically connected to the first wire, and the second isolation structure is electrically connected to the second wire. Both the first isolation structure and the second isolation structure include a first part and a second part, with at least a portion of the second part located on the side of the first part away from the substrate. The first part includes a first sidewall and a second sidewall connecting the two ends of the first sidewall. The orthographic projection of the first sidewall on the substrate is within the orthographic projection range of the support structure on the substrate, and the second sidewall protrudes from the support structure. A light-emitting layer is prepared on the side of the second electrode away from the substrate. An electrode layer is prepared on the side of the isolation structure layer and the light-emitting layer away from the substrate. The electrode layer includes a first electrode and a test electrode. The first electrode is located on the side of the light-emitting layer away from the substrate and overlaps with the fourth isolation structure. The test electrode is located on the side of the support structure away from the substrate and overlaps with the first sidewall and the second sidewall.

[0022] In conjunction with the third aspect, in some possible embodiments, a packaging structure is prepared on the side of the electrode layer away from the substrate. The packaging structure includes multiple packaging portions, including a first packaging portion and a second packaging portion. The first packaging portion is located on the side of the sub-pixel away from the substrate, and the second packaging portion is located on the side of the test electrode away from the substrate.

[0023] The fourth aspect of this application provides a display device, including the above-described test element group, or the display panel obtained by cutting the above-described display large plate, or the display panel obtained by the above-described preparation method.

[0024] The test element group, display board, display panel preparation method and display device provided in this application embodiment are connected to the first wire through the first isolation structure and the second wire through the second isolation structure. The test electrode is connected to the first isolation structure and the second isolation structure on one side respectively. Multiple probes of the resistance test element are connected to the first wire and the second wire respectively, thereby obtaining the overlap resistance between the test electrode and the isolation structure, and thus achieving the purpose of monitoring the overlap between the test electrode and the isolation structure. Attached Figure Description

[0025] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0026] Figure 1 This is a top view of the test element group provided in the first embodiment of this application.

[0027] Figure 2 yes Figure 1 The diagram shows a cross-sectional structure of the test element group.

[0028] Figure 3 yes Figure 1 A top view of the support structure for the test component group shown.

[0029] Figure 4 yes Figure 1 A top view of the isolation structure of the test element group shown.

[0030] Figure 5 This is a schematic diagram of the cross-sectional structure of the test element group provided in the second embodiment of this application.

[0031] Figure 6 This is a schematic diagram of the cross-sectional structure of the test element group provided in the third embodiment of this application.

[0032] Figure 7 This is a top view of the display panel provided in the first embodiment of this application.

[0033] Figure 8 This is a top view of the display panel provided in the second embodiment of this application.

[0034] Figure 9 for Figure 7 The diagram shows a partial cross-sectional structure of the display panel.

[0035] Figure 10 This is a partial cross-sectional structural diagram of the display panel of the display board provided in the third embodiment of this application.

[0036] Figure 11 This is a flowchart of the method for manufacturing a display panel provided in the first embodiment of this application.

[0037] Figure 12 This is a flowchart of the method for preparing a display panel according to the second embodiment of this application. Detailed Implementation

[0038] As mentioned in the background section, with the rapid development of display technology, panel size is no longer limited by fine metal masks. As an alternative technology, an isolation structure is typically incorporated into the display panel to isolate the film layers deposited on top of the isolation structure, such as the organic light-emitting functional layer of adjacent light-emitting devices or the cathode layer. This eliminates the need for a fine metal mask in the display panel manufacturing process. In this case, the cathode needs to overlap with the isolation structure layer. However, in current display panels, the overlap resistance between the cathode and the isolation structure cannot be monitored, meaning the overlap condition between the cathode and the isolation structure cannot be determined.

[0039] In view of this, the test element group, display board, display panel preparation method and display device provided in the embodiments of this application are connected to the first wire through the first isolation structure and the second wire through the second isolation structure, and the test electrode is connected to the first isolation structure and the second isolation structure on one side respectively. Multiple probes of the resistance test element are connected to the first wire and the second wire respectively, thereby obtaining the overlap resistance between the test electrode and the isolation structure, and thus achieving the purpose of monitoring the overlap between the test electrode and the isolation structure.

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0042] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0043] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0044] Figure 1 This is a top view of the test element assembly provided in the first embodiment of this application. Figure 2 yes Figure 1 The diagram shows a cross-sectional structure of the test element assembly. Figure 1 and Figure 2As shown, the test element group 10 is used to test the overlap resistance of the electrodes. The test element group 10 includes a substrate 11, a lead structure 12, a support structure 13, multiple isolation structures 14, and test electrodes 15. The lead structure 12 is located on one side of the substrate 11 and includes a first wire 121 and a second wire 122. The support structure 13 is located on the side of the lead structure 12 away from the substrate 11. The multiple isolation structures 14 include a first isolation structure 1401 and a second isolation structure 1402 disposed on the side of the support structure 13 away from the substrate 11 and spaced apart from each other. The first isolation structure 1401 is electrically connected to the first wire 121, and the second isolation structure 1402 is electrically connected to the second wire 122. The first isolation structure 1401 and the second isolation structure 1402 both include a first part 141 and a second part 142 stacked along a direction away from the substrate 11. The first part 141 includes a first sidewall 1411 and a second sidewall 1412 connecting the two ends of the first sidewall 1411. The orthographic projection of the first sidewall 1411 on the substrate 11 lies within the orthographic projection of the support structure 13 on the substrate 11. The second sidewall 1412 protrudes from the support structure 13. The test electrode 15 is located on the side of the support structure 13 away from the substrate 11. The test electrode 15 overlaps with the first sidewall 1411 and is spaced apart from the second sidewall 1412.

[0045] The substrate 11 includes a substrate 110 and at least one metal layer 111, with the at least one metal layer 111 located on one side of the substrate 110, and the lead-out structure 12 connected to the metal layer 111.

[0046] Furthermore, the substrate 11 may also include a planarization layer 112, which is disposed between the metal layer 111 and the support structure 13, and the planarization layer 112 is used to ensure the planarity of the substrate 11.

[0047] In one embodiment, the lead-out structure 12 further includes a first conductive pad 123 and a second conductive pad 124, wherein the first conductive pad 123 is connected to the first wire 121, and the second conductive pad 124 is connected to the second wire 122.

[0048] In one embodiment, there are two first conductive pads 123. The two first conductive pads 123 can cancel out the line loss of the first wire 121, ensuring more accurate measurement of the overlap resistance. Specifically, the first conductive pad 123 includes a first sub-conductive pad 1231 and a second sub-conductive pad 1232 that are electrically connected.

[0049] In one embodiment, there are two second conductive pads 124. The two second conductive pads 124 can cancel out the line loss of the second wire 121, ensuring more accurate measurement of the overlap resistance. Specifically, the first conductive pad 124 includes a third sub-conductive pad 1241 and a fourth sub-conductive pad 1242 that are electrically connected.

[0050] Figure 3 yesFigure 1 A top view of the support structure for the test component group shown. (See attached image.) Figure 3 As shown, in one embodiment, the support structure 13 includes a first support portion 131, a second support portion 132 and a connecting portion 133. The connecting portion 133 connects the first support portion 131 and the second support portion 132. The first isolation structure 1401 is located on the side of the first support portion 131 away from the substrate 11, and the second isolation structure 1402 is located on the side of the second support portion 132 away from the substrate 11.

[0051] In one embodiment, the first isolation structure 1401 is electrically connected to the metal layer 112 through a through hole penetrating the first support portion 131, and the second isolation structure 1402 is electrically connected to the metal layer 112 through a through hole penetrating the second support portion 132.

[0052] In one embodiment, the first support portion 131 and the second support portion 132 are arranged along the first direction X, and in the second direction Y perpendicular to the first direction X, the width W1 of the connecting portion 133 is smaller than the width W2 of the first support portion 131 and the width W3 of the second support portion 132.

[0053] In one embodiment, the first support portion 131 includes a third sidewall 1311, the connecting portion 133 includes a fourth sidewall 1331, the second support portion 132 includes a fifth sidewall 1321, and the third sidewall 1311, the fourth sidewall 1331 and the fifth sidewall 1331 are connected in sequence.

[0054] In one embodiment, the third sidewall 1311, the fourth sidewall 1331, and the fifth sidewall 1331 are coplanar.

[0055] In one embodiment, the orthographic projection of the support structure 13 onto the substrate 11 is U-shaped.

[0056] Please refer to it again. Figure 2 In one embodiment, the first sidewall 1411, the partial surface of the first support structure 131 facing away from the substrate 11, and the third sidewall 1311 in the first isolation structure 1401 constitute a first stepped structure, and the first sidewall 1411, the partial surface of the second support structure 132 facing away from the substrate 11, and the fifth sidewall 1321 in the second isolation structure 1402 constitute a second stepped structure.

[0057] In one embodiment, the test element group further includes a barrier structure 16 located on one side of the substrate 11. The barrier structure 16 and the support structure 13 are disposed in the same layer and surround the periphery of the support structure 13. The barrier structure 16 and the support structure 13 are spaced apart to form a groove between them. The barrier structure 16 is used to block the outflow of etching solution.

[0058] In one embodiment, the blocking structure 16 and the supporting structure 13 are disposed in the same layer and made of the same material.

[0059] In one embodiment, the materials of the blocking structure 16 and the supporting structure 13 include inorganic materials.

[0060] Figure 4 yes Figure 1 A top view of the isolation structure of the test element group shown. (See attached image.) Figure 4 As shown, in one embodiment, the first isolation structure 1401 and the second isolation structure 1402 are arranged along the first direction X, and the first sidewall 1411 of the first isolation structure 1401 and the first sidewall 1411 of the second isolation structure 1402 are located on the same side of the first direction X.

[0061] In one embodiment, the first sidewall 1411 of the first isolation structure 1401 and the first sidewall 1411 of the second isolation structure 1402 are parallel or coplanar.

[0062] In one embodiment, the first sidewall 1411 is planar, which facilitates the calculation of the unit overlap resistance between the test electrode 15 and the isolation structure 14. Furthermore, it simplifies the manufacturing process. The planar design makes it easier to achieve precise geometric shape control during manufacturing, whether it is photolithography etching or deposition. The planar wall reduces complexity, improves the repeatability and yield of processing, reduces manufacturing costs, and also improves contact reliability. As a contact surface, the planar wall can provide a larger contact area, making the contact with the test electrode 15 more stable, reducing contact resistance, improving the reliability of conductivity, ensuring the continuity and stability of signal transmission, reducing the resistance variability of the contact surface, and reducing stress concentration. The planar design helps to distribute stress evenly, avoids stress concentration that may occur at sharp corners or irregular shapes, protects the stability of the isolation structure 14 under thermal expansion or mechanical stress, and extends the service life of the test element group 10.

[0063] Please refer to it again. Figure 2 In one embodiment, on the side where the first sidewall 1411 is located, the second part 142 protrudes beyond the edge of the first part 141.

[0064] In one embodiment, the second portion 142 extends from the first portion 141 on the side opposite to the substrate 11 and covers at least a portion of the second sidewall 1412.

[0065] Figure 5 This is a schematic cross-sectional view of the test element assembly provided in the second embodiment of this application. Figure 5 As shown, in one embodiment, on the side where the second sidewall 1412 is located, the second part 142 protrudes beyond the edge of the first part 141.

[0066] For example, the first part 141 can be designed as an independent film layer, meaning there is no physical interface within the first part 141, and all parts are made of the same material, such as aluminum or copper. Alternatively, the second part 122 can be designed as a combination of at least two film layers. For example, the second part 122 can be formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. For example, the first part 141 includes a conductive sub-part, or the first part 141 itself is a conductive structure. The first part 141 overlaps with the test electrode 15. The material of the second part 142 can be an organic material, an inorganic material, or a metallic material. If the second part 142 is a metallic material, the material of the first part 121 can be titanium.

[0067] In one embodiment, the first isolation structure 1401 and the second isolation structure 1402 may further include a fifth portion, which is located between the support mechanism 13 and the first portion 141, and the orthographic projection of the first portion 141 on the substrate 11 lies within the orthographic projection of the fifth portion on the substrate 11. For example, the fifth portion is a conductive film layer made of molybdenum.

[0068] In one embodiment, the plurality of isolation structures 14 further includes a third isolation structure 1403 located on the side of the blocking structure 16 away from the substrate 11. A portion of the orthographic projection of the third isolation structure 1403 on the substrate 11 is located outside the orthographic projection of the blocking structure 16 on the substrate 11, and a portion of the orthographic projection is located on the side of the orthographic projection of the blocking structure 16 close to the orthographic projection of the support structure 13 on the substrate 11.

[0069] In one embodiment, the third isolation structure 1403 includes a third portion 144 and a fourth portion 145, the fourth portion 144 extending from the side of the third portion 145 away from the substrate 11 to cover at least a portion of the sidewall of the third portion 144 near the support structure 13.

[0070] In one embodiment, on the side of the third part 144 away from the support structure 13, the fourth part 145 protrudes from the edge of the third part 144.

[0071] In one embodiment, the third part 144 and the first part 141 are arranged on the same layer.

[0072] In one embodiment, the material of the third part 144 is the same as the material of the first part 141.

[0073] In one embodiment, the fourth part 145 and the second part 142 are arranged on the same layer.

[0074] In one embodiment, the material of the fourth part 145 is the same as the material of the second part 142.

[0075] In one embodiment, the third isolation structure 1403 further includes a sixth part located between the blocking structure 16 and the third part 144, wherein the orthographic projection of the third part 144 on the substrate 11 is located within the orthographic projection of the sixth part on the substrate 11.

[0076] In one embodiment, the sixth and fifth parts are arranged on the same layer.

[0077] In one embodiment, the material of the sixth part is the same as the material of the fifth part.

[0078] In one embodiment, the orthographic projection of the test electrode 15 onto the substrate 11 covers the spaced regions between the orthographic projections of the blocking structure 16 and the support structure 13 onto the substrate 11.

[0079] In one embodiment, the orthographic projection of the test electrode 15 on the substrate 11 surrounds the orthographic projection of the support mechanism 13 on the substrate 11.

[0080] In one embodiment, the material of the test electrode 15 includes any one of magnesium, silver, or a magnesium-silver alloy.

[0081] In one embodiment, the test electrode 15 includes a first electrode portion 151 and a second electrode portion 152. The first electrode portion 151 overlaps with a first sidewall 1411, and the second electrode portion 152 contacts a support structure 13 and is spaced apart from a second sidewall 1412. Both the first electrode portion 151 and the second electrode portion 152 are located within the groove formed by the blocking structure 16 and the support structure 13 and are spaced apart from the conductive portion 17 covering the adjacent second portion 142.

[0082] In this application, the test electrode 15 is a cathode. During the whole-layer evaporation deposition, the cathode partially covers the second part 142 to form a conductive part 17, and partially deposits into the groove to form a first electrode part 151 and a second electrode part 152 respectively. The support structure 13, the first part 141 and the second part 142 together form a step with the planarization layer, so that the first electrode part 151 and the second electrode part 152 are disconnected from the conductive part 17 respectively.

[0083] In one embodiment, the test element group 10 further includes a conductive portion 17 located on the side of the second portion 142 away from the first portion 141, and the conductive portion 17 is spaced apart from the test electrode 15.

[0084] In one embodiment, the conductive part 17 and the test electrode 15 are disposed in the same layer and made of the same material.

[0085] In one embodiment, the test element group 10 further includes a light-emitting material layer 18, which is located between the test electrode 15 and the support structure 13, between the conductive portion and the first isolation structure 1401, and between the second conductive portion 172 and the second isolation structure 1402.

[0086] Figure 6 This is a schematic cross-sectional view of the test element assembly provided in the third embodiment of this application. Figure 6 As shown, in one embodiment, the test element group 10 further includes a first package 19, which is located on the side of the test electrode 15 away from the substrate 11.

[0087] In one embodiment, the orthographic projection of the first package portion 19 on the substrate 11 covers the orthographic projections of the test electrode 15 and the conductive portion 17 on the substrate 11.

[0088] In one embodiment, the orthographic projection of the first package portion 19 on the substrate 11 also covers at least a portion of the orthographic projection of the third isolation structure 1403 on the substrate 11.

[0089] For example, the material of the first package portion 19 is silicon oxide, silicon oxynitride, or silicon nitride. The first package portion 19 can be a single layer, multiple layers, composite layers, etc.

[0090] The test element group, display board, display panel preparation method and display device provided in this application embodiment are connected to the first wire through the first isolation structure and the second wire through the second isolation structure. The test electrode is connected to the first isolation structure and the second isolation structure on one side respectively. Multiple probes of the resistance test element are connected to the first wire and the second wire respectively, thereby obtaining the overlap resistance between the test electrode and the isolation structure, and thus achieving the purpose of monitoring the overlap between the test electrode and the isolation structure.

[0091] This application also provides a large display panel. Figure 7 This is a top view of the display panel provided in the first embodiment of this application. Figure 8 This is a top view of the display panel provided in the second embodiment of this application. (See attached image.) Figure 7 and Figure 8 As shown, the display panel includes multiple display panels 20 and at least one of the aforementioned test element groups 10, with the test element group 10 located around the display panel 20.

[0092] The display panel 20 and the test element group 10 share the same substrate 11.

[0093] like Figure 7 As shown, in one embodiment, the display panel 20 and the test element group 10 correspond one-to-one. Specifically, multiple test element groups 20 are located on the same side of multiple display panels 20.

[0094] like Figure 8 As shown, in one embodiment, a plurality of display panels 20 are arranged in an array, and one test element group 10 is set for each row of display panels 20. Specifically, the test element group 10 is set on any side of a row of display panels in the row direction.

[0095] Figure 9 for Figure 7 The diagram shows a partial cross-sectional structure of the display panel. Figure 9 As shown, the display panel 20 includes a fourth isolation structure 21 and a sub-pixel 22 located on one side of the substrate 11. The fourth isolation structure 21 encloses an isolation opening Q. The sub-pixel 21 includes a first electrode 211 located inside the isolation opening Q and overlapped with the fourth isolation structure 21. The test electrode 15 and the first electrode 211 are disposed on the same layer.

[0096] In one embodiment, the sub-pixel 22 further includes a second electrode 222 located on the side of the first electrode 221 near the substrate 11, with at least a portion of the second electrode 221 located within the isolation opening Q. Exemplarily, the first electrode 221 may be a cathode, and the second electrode 222 may be an anode.

[0097] In one embodiment, the sub-pixel 22 further includes a light-emitting layer 223, which is located between the first electrode 221 and the second electrode 223.

[0098] In one embodiment, the light-emitting layer 223 and the light-emitting material layer 18 are disposed in the same layer.

[0099] In one embodiment, the sub-pixel 22 may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the light-emitting layer 223, and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the light-emitting layer 223.

[0100] In one embodiment, the fourth isolation structure 21 in the display panel 20 and the isolation structure 14 in the test element group 10 are arranged on the same layer.

[0101] In one embodiment, the fourth isolation structure 21 is used to electrically isolate adjacent sub-pixels 22, specifically isolating at least a portion of the light-emitting layer 223 and the first electrode 221 of adjacent sub-pixels 22. In one embodiment, the isolation structure 21 includes a stacked first sub-part 211 and a second sub-part 212, the first sub-part 211 being located on the side of the second sub-part 212 closer to the substrate 11, and the orthographic projection of the second sub-part 212 on the substrate 11 covering the orthographic projection of the first sub-part 211 on the substrate 11. Exemplarily, the first sub-part 211 can be designed as an independent film layer, that is, there is no physical interface inside the first sub-part 211, and each part is made of the same material, for example, the material of the first sub-part 211 is aluminum or copper. Alternatively, the first sub-part 211 can be designed to be composed of at least two stacked film layers. For example, the first sub-part 211 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. For example, the first sub-part 211 includes a conductive sub-part, or the first sub-part 211 itself is a conductive structure. The first sub-part 211 and the first electrode 221 of the sub-pixel 22 overlap, so that the first electrodes 221 of adjacent sub-pixels 22 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the second sub-part 212 can be an organic material, an inorganic material, or a metallic material. If the second sub-part 212 is a metallic material, the material of the first part 211 can be titanium.

[0102] In one embodiment, the first sub-part 211, the first part 141, and the third part 144 are disposed on the same layer and made of the same material.

[0103] In one embodiment, the second sub-part 212 and the second part 142 and the fourth part 145 are disposed on the same layer and made of the same material.

[0104] In one embodiment, the fourth isolation structure 21 further includes a third sub-part located on the side of the first sub-part 211 near the substrate 11, wherein the orthographic projection of the first sub-part 211 onto the substrate 11 falls within the orthographic projection range of the third sub-part onto the substrate 11. For example, the first sub-part 211 is a conductive film layer made of aluminum, and the third sub-part is a conductive film layer made of molybdenum. In this case, the cross-section of the fourth isolation structure 21 is I-shaped.

[0105] In one embodiment, the third sub-section, the fifth sub-section, and the sixth sub-section are arranged on the same layer and made of the same material.

[0106] In one embodiment, the display panel 20 further includes a pixel definition structure 23, which is located between the fourth isolation structure 21 and the substrate 11. The pixel definition structure 23 encloses a pixel opening P, and the orthographic projection of the pixel opening P on the substrate 11 is located within the orthographic projection of the isolation opening Q on the substrate 11.

[0107] In one embodiment, the pixel definition structure 23 and the support structure 13 are arranged on the same layer.

[0108] In one embodiment, the pixel definition structure 23 is made of the same material as the support structure 13.

[0109] In one embodiment, the pixel definition structure 23 and the blocking structure 16 are arranged on the same layer.

[0110] In one embodiment, the material of the pixel definition structure 23 is the same as the material of the blocking structure 163.

[0111] In one embodiment, the display panel further includes a packaging structure, which includes a first packaging part 19 and a second packaging part 24, with the second packaging part 24 located on the side of the sub-pixel 22 away from the substrate 11.

[0112] In one embodiment, the first encapsulation part 19 and the second encapsulation part 24 are disposed in the same layer and made of the same material.

[0113] Figure 10 This is a partial cross-sectional structural diagram of the display panel of the large display panel provided in the third embodiment of this application. For example... Figure 10 As shown, in one embodiment, the encapsulation structure further includes an organic encapsulation layer 25, which is located on the side of the second encapsulation portion 24 facing away from the substrate 11. The orthographic projection of the organic encapsulation layer 25 on the substrate 11 covers the orthographic projections of the first encapsulation portion 24 and the fourth isolation structure 21 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 25 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 25 can be a single layer, multiple layers, composite layers, etc.

[0114] In one embodiment, the encapsulation structure further includes an inorganic encapsulation layer 26, which is located on the side of the organic encapsulation layer 25 facing away from the substrate 11. The orthographic projection of the inorganic encapsulation layer 26 onto the substrate 11 covers the orthographic projection of the organic encapsulation layer 25 onto the substrate. Exemplarily, the material of the inorganic encapsulation layer 26 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer 26 can be a single layer, multiple layers, composite layers, etc.

[0115] This application also provides a method for manufacturing a display panel. Figure 11 This is a flowchart illustrating a method for fabricating a display panel according to the first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 11 As shown, the preparation method includes:

[0116] Step S100: Prepare multiple display panels and at least one test element group on one side of the substrate.

[0117] The test element group is located around the display panel and is used to test the electrode connection resistance in the display panel.

[0118] Step S200: Cut and remove the test component group, and cut the multiple display panels into multiple independent display panels.

[0119] Figure 12 This is a flowchart of the method for manufacturing a display panel according to the second embodiment of this application. Figure 12 As shown, step S100 includes:

[0120] Step S110: A second electrode and lead-out structure are fabricated on one side of the substrate.

[0121] The lead-out structure includes a first conductor and a second conductor.

[0122] Step S120: An insulating layer is prepared on the side of the second electrode and lead-out structure away from the substrate.

[0123] The insulating layer includes a pixel definition structure and a support structure. The pixel definition structure encloses a pixel opening, which exposes at least part of the second electrode. The support structure is located on the side of the lead-out structure away from the substrate.

[0124] Step S130: Prepare an isolation structure layer on the side of the insulating layer away from the substrate.

[0125] The isolation structure layer includes a first isolation structure, a second isolation structure, and a fourth isolation structure. The fourth isolation structure is located on the side of the pixel definition portion away from the substrate, and the fourth isolation structure encloses an isolation opening that exposes at least a portion of the second electrode. Both the first and second isolation structures are located on the side of the support structure away from the substrate. The first isolation structure is electrically connected to the first wire, and the second isolation structure is electrically connected to the second wire. Both the first and second isolation structures include a first part and a second part, with at least a portion of the second part located on the side of the first part away from the substrate. The first part includes a first sidewall and a second sidewall connecting the two ends of the first sidewall. The orthographic projection of the first sidewall on the substrate is within the orthographic projection range of the support structure on the substrate, and the second sidewall protrudes from the support structure.

[0126] Step S140: Prepare a light-emitting layer on the side of the second electrode away from the substrate.

[0127] Step S150: An electrode layer is prepared on the side of the isolation structure layer and the light-emitting layer that is away from the substrate.

[0128] The electrode layer includes a first electrode and a test electrode. The first electrode is located on the side of the light-emitting layer away from the substrate and overlaps with the fourth isolation structure. The test electrode is located on the side of the support structure away from the substrate and overlaps with the first sidewall and the second sidewall.

[0129] In one embodiment, the fabrication method further includes the step of: fabricating a packaging structure on the side of the electrode layer away from the substrate.

[0130] The packaging structure includes multiple packaging sections, including a first packaging section and a second packaging section. The first packaging section is located on the side of the sub-pixel away from the substrate, and the second packaging section is located on the side of the test electrode away from the substrate.

[0131] This application also provides a display device. The display device is a product with image display functionality. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0132] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0133] The display device includes the test element group 20 provided in any of the above embodiments, or the display panel 20 obtained by cutting a large display board provided in any of the above embodiments, or the display panel 20 obtained according to the preparation method provided in the above embodiments. The display panel 20 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0134] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0135] It is understood that the display panel 20 can be applied to a display device, such as a mobile terminal, tablet computer, computer monitor, television, wearable device or information query machine, or any product or component with display function.

[0136] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0137] It should also be noted that in this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this application. Although several exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A test element assembly, characterized in that, The test element group includes: substrate; A lead-out structure is located on one side of the substrate, and the lead-out structure includes a first wire and a second wire; A support structure is located on the side of the lead-out structure opposite to the substrate; Multiple isolation structures, including a first isolation structure and a second isolation structure disposed on the side of the support structure away from the substrate and spaced apart from each other, wherein the first isolation structure is electrically connected to the first wire and the second isolation structure is electrically connected to the second wire; Both the first isolation structure and the second isolation structure include a first part and a second part; the first part includes a first sidewall and a second sidewall connecting the two ends of the first sidewall, the orthographic projection of the first sidewall on the substrate lies within the orthographic projection of the supporting structure on the substrate, and the second sidewall protrudes from the supporting structure; and The test electrode is located on the side of the support structure opposite to the substrate. The test electrode overlaps with the first sidewall and is spaced apart from the second sidewall.

2. The test element set according to claim 2, characterized in that, The orthogonal projection of the test electrode on the substrate surrounds the orthogonal projection of the support structure on the substrate; Preferably, the test electrode includes a first electrode portion and a second electrode portion, the first electrode portion overlapping the first sidewall, and the second electrode portion contacting the support structure and being spaced apart from the second sidewall; Preferably, the test element group further includes a conductive portion located on the side of the second portion opposite to the first portion, and the conductive portion is spaced apart from the test electrode; Preferably, the conductive part and the test electrode are disposed in the same layer and made of the same material; Preferably, the method further includes a luminescent material layer located between the test electrode and the support structure, between the conductive portion and the first isolation structure, and between the conductive portion and the second isolation structure.

3. The test element assembly according to claim 2, characterized in that, The test element group also includes a blocking structure located on one side of the substrate. The blocking structure and the support structure are disposed in the same layer and surround the periphery of the support structure. The blocking structure and the support structure are spaced apart to form a groove between them. The first electrode portion and the second electrode portion are both located in the groove and are spaced apart from the conductive portion covering the adjacent second portion. Preferably, the blocking structure and the supporting structure are made of the same material and both include inorganic materials.

4. The test element assembly according to claim 3, characterized in that, The plurality of isolation structures further include a third isolation structure located on the side of the blocking structure away from the substrate; a portion of the orthographic projection of the third isolation structure on the substrate is located outside the orthographic projection of the blocking structure on the substrate, and the portion of the orthographic projection is located on the side of the orthographic projection of the blocking structure close to the orthographic projection of the support structure on the substrate; Preferably, the third isolation structure includes a third part and a fourth part, wherein the fourth part extends from the side of the third part away from the substrate to cover at least a portion of the sidewall of the third part near the support structure; Preferably, on the side of the third part away from the supporting structure, the fourth part protrudes from the edge of the third part; Preferably, the orthographic projection of the test electrode on the substrate covers the interval between the orthographic projections of the blocking structure and the supporting structure on the substrate.

5. The test element assembly according to claim 1, characterized in that, On the side where the first sidewall is located, the second part protrudes beyond the edge of the first part; Preferably, the second portion extends from the side of the first portion away from the substrate to cover at least a portion of the second sidewall; Preferably, on the side where the second sidewall is located, the second part protrudes beyond the edge of the first part.

6. The test element assembly according to claim 1, characterized in that, The first isolation structure and the second isolation structure are arranged along a first direction, and the first sidewall of the first isolation structure and the first sidewall of the second isolation structure are located on the same side of the first direction; Preferably, the first sidewall of the first isolation structure and the first sidewall of the second isolation structure are parallel or coplanar; Preferably, the first sidewall is a plane.

7. The test element assembly according to claim 1, characterized in that, The support structure includes a first support portion, a second support portion, and a connecting portion, wherein the connecting portion connects the first support portion and the second support portion; the first isolation structure is located on the side of the first support portion away from the substrate, and the second isolation structure is located on the side of the second support portion away from the substrate; Preferably, the first support portion and the second support portion are arranged along a first direction, and in a second direction perpendicular to the first direction, the width of the connecting portion is smaller than the width of the first support portion and the width of the second support portion.

8. The test element assembly according to claim 7, characterized in that, The first support portion includes a third sidewall, the connecting portion includes a fourth sidewall, and the second support portion includes a fifth sidewall, wherein the third sidewall, the fourth sidewall, and the fifth sidewall are connected in sequence; Preferably, the third sidewall, the fourth sidewall, and the fifth sidewall are coplanar; Preferably, the first sidewall, the portion of the first support facing away from the substrate, and the third sidewall in the first isolation structure constitute a first stepped structure, and the first sidewall, the portion of the second support facing away from the substrate, and the fifth sidewall in the second isolation structure constitute a second stepped structure. Preferably, the orthographic projection of the support structure onto the substrate is U-shaped.

9. The test element assembly according to claim 1, characterized in that, The lead-out structure further includes a first conductive pad and a second conductive pad, wherein the first conductive pad is connected to the first wire, and the second conductive pad is connected to the second conductive wire; Preferably, the first conductive pad includes a first sub-conductive pad and a second sub-conductive pad that are electrically connected, and the second conductive pad includes a third sub-conductive pad and a fourth sub-conductive pad that are electrically connected.

10. The test element assembly according to claim 9, characterized in that, It also includes a first packaging section, which is located on the side of the test electrode away from the substrate; Preferably, the orthographic projection of the first package portion on the substrate covers the orthographic projections of the test electrode and the conductive portion on the substrate respectively; Preferably, the plurality of isolation structures further includes a third isolation structure located on the side of the barrier structure opposite to the substrate; The orthographic projection of the first package portion on the substrate also covers at least a portion of the orthographic projection of the third isolation structure on the substrate.

11. A large display panel, characterized in that, include: Multiple display panels; and At least one test element group according to any one of claims 1-10, the test element group being located on the periphery of the display panel; The display panel and the test element group share the substrate; the display panel includes a fourth isolation structure and a sub-pixel located on one side of the substrate, and the fourth isolation structure encloses an isolation opening; The sub-pixel includes a first electrode, which is located within the isolation opening and overlaps with the fourth isolation structure; the test electrode and the first electrode are disposed in the same layer.

12. The display panel according to claim 11, characterized in that, The fourth isolation structure in the display panel and the isolation structure in the test element group are arranged on the same layer; Preferably, the sub-pixel further includes a second electrode located on the side of the first electrode closer to the substrate; at least a portion of the second electrode is located within the isolation opening; Preferably, the sub-pixel further includes a light-emitting layer located between the first electrode and the second electrode; Preferably, the luminescent material layer and the luminescent layer are disposed in the same layer.

13. The display panel according to claim 11, characterized in that, The display panel further includes a pixel definition structure located between the fourth isolation structure and the substrate; The pixel definition structure encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection range of the isolation opening on the substrate; The pixel definition structure and the support structure are set on the same layer.

14. The display panel according to claim 13, characterized in that, It also includes a packaging structure, which includes a first packaging part and a second packaging part, wherein the first packaging part is located on the side of the sub-pixel away from the substrate, and the second packaging part is located on the side of the test electrode away from the substrate. Preferably, the first packaging portion and the second packaging portion are disposed on the same layer; Preferably, the packaging structure further includes an organic encapsulation layer located on the side of the first packaging portion away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projections of the first packaging portion and the fourth isolation structure on the substrate; Preferably, the encapsulation structure further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate is located at the orthographic projection of the organic encapsulation layer on the substrate.

15. The display panel according to claim 11, characterized in that, The display panel and the test component group are in one-to-one correspondence.

16. The display panel according to claim 11, characterized in that, Multiple display panels are arranged in an array, with one test element group corresponding to each row of display panels; Preferably, the test element group is arranged on either side of the display panel in the row direction.

17. A method for manufacturing a display panel, characterized in that, include: Multiple display panels and at least one test element group are fabricated on one side of a substrate. The test element group is located around the display panels and is used to test the electrode contact resistance in the display panels. The test element group is cut off and the multiple display panels are cut into multiple independent display panels.

18. The preparation method according to claim 17, characterized in that, The process of fabricating multiple display panels and at least one group of test elements on one side of the substrate includes: A second electrode and an lead-out structure are fabricated on one side of the substrate, the lead-out structure including a first wire and a second wire; An insulating layer is formed on the side of the second electrode and the lead-out structure away from the substrate. The insulating layer includes a pixel definition structure and a support structure. The pixel definition structure encloses a pixel opening, which exposes at least a portion of the second electrode. The support structure is located on the side of the lead-out structure away from the substrate. An isolation structure layer is prepared on the side of the insulating layer away from the substrate. The isolation structure layer includes a first isolation structure, a second isolation structure, and a fourth isolation structure. The fourth isolation structure is located on the side of the pixel definition portion away from the substrate and encloses an isolation opening that exposes at least a portion of the second electrode. Both the first and second isolation structures are located on the side of the support structure away from the substrate. The first isolation structure is electrically connected to the first wire, and the second isolation structure is electrically connected to the second wire. Both the first and second isolation structures include a first part and a second part, with at least a portion of the second part located on the side of the first part away from the substrate. The first part includes a first sidewall and a second sidewall connecting the two ends of the first sidewall. The orthographic projection of the first sidewall on the substrate is within the orthographic projection range of the support structure on the substrate, and the second sidewall protrudes from the support structure. A light-emitting layer is prepared on the side of the second electrode opposite to the substrate; An electrode layer is fabricated on the side of the isolation structure layer and the light-emitting layer away from the substrate. The electrode layer includes a first electrode and a test electrode. The first electrode is located on the side of the light-emitting layer away from the substrate and overlaps with the fourth isolation structure. The test electrode is located on the side of the support structure away from the substrate and overlaps with the first sidewall and the second sidewall.

19. The preparation method according to claim 17, characterized in that, Also includes: An encapsulation structure is fabricated on the side of the electrode layer away from the substrate. The encapsulation structure includes multiple encapsulation portions, including a first encapsulation portion and a second encapsulation portion. The first encapsulation portion is located on the side of the sub-pixel away from the substrate, and the second encapsulation portion is located on the side of the test electrode away from the substrate.

20. A display device, characterized in that, The panel includes the test element group according to any one of claims 1-10, or the display panel obtained by cutting the display panel according to any one of claims 11-16, or the display panel obtained by the preparation method according to any one of claims 17-19.

Images