A wafer thinning device and its multi-station polishing method

Abstract

This invention discloses a wafer thinning apparatus and its multi-station polishing method, specifically relating to the field of wafer thinning. The apparatus includes a worktable with a rough grinding station, a fine grinding station, and a loading / unloading station. An indexer is installed inside the worktable, and multiple wafer carriers are mounted at the output end of the indexer. The indexer drives the wafer carriers to move between the rough grinding station, the fine grinding station, and the loading / unloading station. Each wafer carrier includes a mounting frame, and a suction cup is mounted above the mounting frame to pick up and support the wafer. This invention employs a method where the wafer carrier and the TGV glass substrate move synchronously during unloading, ensuring that the suction cup is always directly below the TGV glass substrate. This prevents water droplets remaining on the surface of the TGV glass substrate during polishing from falling onto the suction cup surface, thus preventing fine particles from the suction cup from affecting the placement accuracy of the TGV glass substrate and ensuring uniform thickness of the polished TGV glass substrate.

Description

Technical Field

[0001] This invention relates to the field of wafer thinning technology, and more specifically, to a wafer thinning apparatus and a multi-station polishing method thereof. Background Technology

[0002] TGV glass substrates are glass wafers with vertically conductive vias, used for interconnection and packaging. As a core component of various advanced packaging technologies, TGV glass substrates demonstrate irreplaceable technological advantages in the 3D packaging field due to their superior physical and chemical properties. TGV glass substrate thinning is a crucial step in the glass substrate manufacturing process, primarily used to optimize the substrate's mechanical strength, thermal properties, and the reliability of subsequent packaging processes. Thinning is typically achieved by grinding and polishing to remove damaged layers from the glass surface or adjusting the thickness to a target value.

[0003] The wafer thinning apparatus mainly consists of a polishing assembly and a wafer stage. The polishing assembly primarily includes rough grinding and fine grinding, while the wafer stage typically uses a chuck. During thinning, the TGV glass substrate is placed on the chuck and fixed using vacuum adsorption. Then, the polishing assembly performs rough grinding and fine grinding to reduce the thickness of the TGV glass substrate from 725 micrometers to below 50 micrometers. Ultrapure water is used for cooling to prevent overheating.

[0004] However, after polishing, some water droplets remain on the surface of the TGV glass substrate. These droplets contain fine particles from the polishing process. When the robotic arm removes the TGV glass substrate, these droplets fall onto the suction cup. As production progresses, the number of water droplets and fine particles increases. When the TGV glass substrate is placed on the suction cup, these fine particles affect the placement accuracy, meaning the upper surface of the suction cup is not parallel to the lower surface of the TGV glass substrate. This results in uneven thickness of the TGV glass substrate after processing, especially when processing very large TGV glass substrates (e.g., 510mm*515mm). Summary of the Invention

[0005] The present invention provides a wafer thinning device and its multi-station polishing method, which aims to solve the following problem: water droplets containing fine particles fall onto the suction cup, and the fine particles affect the placement accuracy of the TGV glass substrate. The upper surface of the suction cup is not parallel to the lower surface of the TGV glass substrate, resulting in uneven thickness of the TGV glass substrate after processing.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer thinning device, comprising a worktable, a rough grinding station, a fine grinding station, and a loading / unloading station. An indexer is installed inside the worktable, and multiple wafer carriers are installed at the output end of the indexer. The indexer is used to drive the wafer carriers to move between the rough grinding station, the fine grinding station, and the loading / unloading station. Each wafer carrier includes a mounting frame, and a suction cup is installed above the mounting frame. The suction cup is used to adsorb and carry wafers. A robotic arm is installed on one side of the loading / unloading station, used to pick up and place wafers on the suction cup. A partition is installed on the side of the loading / unloading station near the edge of the worktable. A pushing component is installed at the output end of the indexer, used to push and pull the wafer carriers, thereby moving the wafer carriers into or out of the partition.

[0007] Preferably, a circular track is installed at the bottom of the inner side of the workbench, a slider is slidably installed on the circular track, a guide rail is installed on the slider, and the mounting bracket is slidably installed on the guide rail.

[0008] Preferably, the suction cup includes a disc-shaped structure consisting of a central disc and multiple fan discs surrounding the central disc. A driving component is mounted on the mounting frame. The driving component is used to drive the central disc to move vertically and rotate. When the central disc moves downward, the multiple fan discs also move downward, so that the multiple fan discs and the central disc are at different heights and staggered from each other. When the fan discs rotate, the multiple fan discs are driven to move towards the center at the same time.

[0009] Preferably, the top of the mounting bracket is fixedly equipped with multiple slide rails that correspond one-to-one with the fan discs. Each slide rail has a vertically movable upright inserted inside, and the upright can slide along the length of the slide rail. The upper ends of the multiple uprights are fixedly connected to the bottom surface of the fan discs.

[0010] Preferably, an upper limit block is fixedly installed on the upper side of the slide rail, and a lower limit block is fixedly connected on the lower side of the slide rail. When multiple fan discs are at the same height, the lower limit block on each upright is at the same height. When multiple fan discs are at different heights, the upper limit block on each upright is at the same height.

[0011] Preferably, a drive plate is fixedly installed at the bottom of the central plate, and the drive plate has inclined grooves on its circumference that correspond one-to-one with the uprights. A guide rod is installed at the bottom of each upright, and the bottom of the guide rod is located in the inclined groove.

[0012] Preferably, the driving component includes a mounting plate fixedly mounted on a mounting frame, a turntable rotatably connected to the mounting plate, a rotating shaft vertically slidably mounted on the turntable, a drive motor and a cylinder mounted on the mounting frame, the output end of the drive motor being connected to the turntable for transmission, and the output end of the cylinder being rotatably connected to the bottom of the rotating shaft.

[0013] Preferably, a coarse grinding component is provided at the coarse grinding station, and a fine grinding component is provided at the fine grinding station. A universal nozzle is provided on one side of both the coarse grinding component and the fine grinding component.

[0014] Preferably, the robotic arm includes cylinder two, and the output end of cylinder two is sequentially connected to rotating arm one, rotating arm two, rotating arm three and a picking plate. Rotating arm one, rotating arm two and rotating arm three are all driven by motors, and the picking plate is used to pick up wafers.

[0015] The present invention also provides a multi-station polishing method for wafer thinning, using the above-mentioned wafer thinning apparatus, comprising the following steps:

[0016] Step 1: Use a robotic arm to place the wafer onto a suction cup, and fix it in place by suction cup adsorption;

[0017] Step 2: The indexing device drives the wafer stage to rotate, so that the wafer is coarsely polished at the coarse grinding station and finely polished at the fine grinding station.

[0018] Step 3: After polishing, the wafer carrier is rotated by the indexer to transport the wafer to the loading and unloading station;

[0019] Step 4: The robotic arm picks up the wafer from the top, and then the robotic arm moves the wafer, while the pusher pushes the wafer stage, so that the wafer and the wafer stage move synchronously towards the partition.

[0020] Step 5: When the wafer and the wafer stage are above and below the partition respectively, the pusher pulls the wafer stage to reset.

[0021] The technical effects and advantages of this invention are as follows:

[0022] 1. This invention employs a method in which the receiving stage and the TGV glass substrate move synchronously during unloading, ensuring that the suction cup is always directly below the TGV glass substrate. This prevents water droplets remaining on the surface of the TGV glass substrate from falling onto the suction cup during polishing, thus preventing fine particles from the suction cup from affecting the placement accuracy of the TGV glass substrate and ensuring uniform thickness of the TGV glass substrate after polishing.

[0023] 2. By employing a method of offsetting the fan discs and moving them closer to the center, the projected area of ​​the suction cup in the vertical direction is reduced. When the robot arm moves the TGV glass substrate and the substrate stage synchronously, water droplets are less likely to fall onto the surface of the suction cup. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a partial structural diagram of the present invention;

[0026] Figure 3 This is a schematic diagram of the indexing device, the plate support, and the pushing component of the present invention;

[0027] Figure 4 This is a schematic diagram showing that the fan plates in the plate-holding stage of the present invention are at the same height;

[0028] Figure 5 For the present invention Figure 5 Partial structural diagram;

[0029] Figure 6 This is a schematic diagram showing the fan plate in the plate-bearing stage of the present invention at different heights;

[0030] Figure 7 For the present invention Figure 6 Partial structural diagram;

[0031] Figure 8 This is a schematic diagram of the coarse grinding assembly and the universal nozzle of the present invention;

[0032] Figure 9 This is a schematic diagram of the structure of the robotic arm of the present invention;

[0033] Figure 10 This is a flowchart of the multi-station polishing method for wafer thinning according to the present invention.

[0034] The attached diagram is labeled as follows: 1. Workbench; 11. Rough grinding station; 12. Fine grinding station; 13. Loading and unloading station; 14. Partition; 2. Rough grinding assembly; 3. Fine grinding assembly; 4. Indexer; 5. Plate holder; 51. Mounting bracket; 52. Suction cup; 521. Center plate; 522. Fan plate; 53. Slide rail; 54. Upright rod; 541. Upper limit block; 542. Lower limit block; 543. Guide rod; 55. Drive plate; 551. Inclined chute; 56. Drive component; 561. Mounting plate; 562. Turntable; 563. Rotating shaft; 564. Drive motor; 565. Cylinder 1; 6. Pushing component; 7. Guide rail; 71. Slider; 72. Circular track; 8. Robotic arm; 81. Cylinder 2; 82. Rotating arm 1; 83. Rotating arm 2; 84. Rotating arm 3; 85. Material handling plate; 9. Universal nozzle. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Refer to the instruction manual appendix Figures 1-9A wafer thinning apparatus includes a worktable 1, on which a rough grinding station 11, a fine grinding station 12, and a loading / unloading station 13 are arranged. A rough grinding assembly 2 is arranged at the rough grinding station 11, and a fine grinding assembly 3 is arranged at the fine grinding station 12. A universal nozzle 9 is provided on one side of both the rough grinding assembly 2 and the fine grinding assembly 3. The rough grinding assembly 2 and the fine grinding assembly 3 are driven by a three-axis moving device to move the grinding wheel in the X, Y, and Z axes, and the grinding wheel is driven to rotate by a motor to perform rough grinding and fine grinding on the wafer, respectively. During the polishing process, ultrapure water is sprayed from the universal nozzle 9 for cooling to prevent overheating.

[0037] In this embodiment, as Figure 2 As shown, a separator 4 is installed inside the worktable 1. Multiple wafer carriers 5 are installed at the output end of the separator 4. The separator 4 is used to drive the wafer carriers 5 to rotate between the rough grinding station 11, the fine grinding station 12, and the loading and unloading station 13. The separator 4 is used to drive the wafer carriers 5 to rotate intermittently to realize the transfer of wafers.

[0038] In this embodiment, as Figure 4 As shown, the wafer mounting stage 5 includes a mounting frame 51, and a suction cup 52 is provided above the mounting frame 51. The suction cup 52 is used to adsorb and support the wafers. A robot arm 8 is provided on one side of the loading / unloading station 13. The robot arm 8 is used to pick up and place wafers on the suction cup 52. A partition 14 is provided on the side of the loading / unloading station 13 near the edge of the worktable 1. A pusher 6 is installed at the output end of the indexer 4. The pusher 6 is used to push and pull the wafer mounting stage 5, so that the wafer mounting stage 5 moves into or out of the bottom of the partition 14.

[0039] Furthermore, such as Figure 2 As shown, a ring track 72 is installed on the bottom of the inner side of the workbench 1, a slider 71 is slidably installed on the ring track 72, a guide rail 7 is installed on the slider 71, and the mounting bracket 51 is slidably installed on the guide rail 7.

[0040] It should be noted that the slider 71 has an arc-shaped structure with a U-shaped cross-section and is slidably mounted on the annular track 72. When the indexer 4 drives the bearing platform 5 to rotate, the slider 71 slides on the annular track 72. The pushing component 6 is a cylinder, one end of which is hinged to the disc at the output end of the indexer 4, and the other end is hinged to the mounting bracket 51. Through the extension and retraction of the pushing component 6, the mounting bracket 51 can be driven to slide on the guide rail 7.

[0041] Furthermore, such as Figure 9 As shown, the robotic arm 8 includes a second cylinder 81. The output end of the second cylinder 81 is connected in sequence to a first rotating arm 82, a second rotating arm 83, a third rotating arm 84, and a picking plate 85. The first rotating arm 82, the second rotating arm 83, and the third rotating arm 84 are all driven by motors. The picking plate 85 is used to pick up wafers.

[0042] It should be noted that the pick-up plate 85 has multiple holes connected to a vacuum pump, which picks up the wafers by vacuum adsorption. The corresponding motor drives the rotating arms 82, 83, and 84 to rotate, moving the pick-up plate 85 to the wafer position, and picking up the wafers to the suction cup 52 at the loading / unloading station 13 or picking them up from the suction cup 52.

[0043] In this embodiment, a TGV glass substrate is used as an example. Specifically, firstly, a robotic arm 8 picks up the TGV glass substrate and places it onto a suction cup 52 at the loading / unloading station 13, where it is fixed by vacuum adsorption. Then, the indexing device 4 drives the substrate support 5 to rotate, while the slider 71 slides on the annular track 72. When the substrate support 5 is rotated to the rough grinding station 11, the rough grinding assembly 2 performs rough polishing on the TGV glass substrate, while simultaneously spraying ultrapure water for cooling. Then, the indexing device 4 drives the substrate support 5 to rotate to the fine grinding station 12, where the fine grinding assembly 3 performs fine polishing on the TGV glass substrate, while simultaneously spraying ultrapure water for cooling. Secondly, the indexing device 4 rotates the substrate mounting platform 5 to the loading / unloading station 13. The robotic arm 8 then picks up the TGV glass substrate and moves it vertically upwards. Once the substrate reaches the required height (higher than the upper surface of the partition 14), the robotic arm 8 and the pushing component 6 move simultaneously. The robotic arm 8 drives the TGV glass substrate and the pushing component 6 to move the substrate mounting platform 5, thus synchronizing their movement. During this process, water droplets remaining on the surface of the TGV glass substrate from the polishing process fall off from all sides as it moves. The suction cup 52 remains directly below the TGV glass substrate, preventing water droplets from falling onto its surface. Finally, when the TGV glass substrate and the substrate mounting platform 5 are above and below the partition 14 respectively, water droplets will only fall onto the partition 14, allowing the substrate mounting platform 5 to be reset.

[0044] The above technical solution adopts a method in which the receiving stage 5 and the TGV glass substrate move synchronously during the unloading process, so that the suction cup 52 is always located directly below the TGV glass substrate. This prevents water droplets remaining on the surface of the TGV glass substrate from falling from all sides during the polishing process and falling onto the surface of the suction cup 52. This prevents fine particles from the polishing from sticking to the suction cup 52 and affecting the placement accuracy of the TGV glass substrate, and ensures that the thickness of the TGV glass substrate is uniform after polishing.

[0045] Refer to the instruction manual appendix Figures 4-7In order to ensure stable support for the TGV glass substrate during the polishing process and to prevent water droplets from falling onto the surface of the suction cup 52, the suction cup 52 needs to have the same area as the TGV glass substrate. However, during the synchronous unloading process, water droplets on the surface of the TGV glass substrate may be shifted due to environmental factors, such as air flow, and drip onto the surface of the suction cup 52. Therefore, the following technical solution is proposed.

[0046] Specifically, the suction cup 52 includes a disc-shaped structure consisting of a central disc 521 and multiple fan discs 522 surrounding the central disc 521. A drive component 56 is mounted on the mounting bracket 51. The drive component 56 is used to drive the central disc 521 to move vertically and rotate. When the central disc 521 moves downward, the multiple fan discs 522 also move downward, so that the multiple fan discs 522 and the central disc 521 are at different heights and staggered from each other. When the fan discs 522 rotate, the multiple fan discs 522 are driven to move towards the center at the same time.

[0047] It should be noted that, as Figure 4 As shown, the suction cup 52 is divided into a central disk 521 and four fan disks 522. The upper surface of the central disk 521 and the fan disks 522 are provided with small holes, and the interior of each disk is provided with a cavity connected to a vacuum pump. After the TGV glass substrate is placed on the surface of the central disk 521 and the fan disks 522, it can be fixed by vacuum adsorption.

[0048] Furthermore, the top of the mounting bracket 51 is fixedly equipped with multiple slide rails 53 corresponding one-to-one with the fan plate 522. Each slide rail 53 has a vertically movable upright rod 54 inserted inside, and the upright rod 54 can slide along the length direction of the slide rail 53. The upper ends of the multiple upright rods 54 are respectively fixedly connected to the bottom surface of the fan plate 522.

[0049] Furthermore, an upper limit block 541 is fixedly installed on the upper side of the slide rail 53 on the upright 54, and a lower limit block 542 is fixedly connected on the lower side of the slide rail 53. When multiple fan discs 522 are at the same height, the lower limit block 542 on each upright 54 is at the same height. When multiple fan discs 522 are at different heights, the upper limit block 541 on each upright 54 is at the same height.

[0050] Furthermore, a drive disk 55 is fixedly installed at the bottom of the center disk 521. The drive disk 55 has inclined grooves 551 on its circumference that correspond one-to-one with the uprights 54. A guide rod 543 is installed at the bottom of each upright 54, and the bottom of the guide rod 543 is located in the inclined groove 551.

[0051] In this embodiment, the driving component 56 includes a mounting plate 561 fixedly mounted on a mounting bracket 51, a turntable 562 rotatably connected to the mounting plate 561, a rotating shaft 563 vertically slidably mounted on the turntable 562, a driving motor 564 and a cylinder 565 mounted on the mounting bracket 51, the output end of the driving motor 564 being connected to the turntable 562 in a transmission connection, and the output end of the cylinder 565 being rotatably connected to the bottom of the rotating shaft 563.

[0052] It should be noted that the rotating shaft 563 is slidably connected to the turntable 562 via a spline. When the drive motor 564 drives the turntable 562 to rotate, the rotating shaft 563 can also rotate. The cylinder 565 can also drive the rotating shaft 563 to move up and down. The upper end of the rotating shaft 563 is fixedly connected to the central disk 521, so that the central disk 521 can be driven to move vertically and rotate.

[0053] In this embodiment, the specific implementation method is as follows: Figure 4 As shown, the central disk 521 and the fan disks 522 are at the same height, and the lower limit block 542 on each upright 54 is at the same height, that is, in contact with the upper surface of the slide rail 53, and the upper surface of the drive disk 55 presses against the lower surface of the lower limit block 542. During unloading, the robot arm 8 first picks up the TGV glass substrate and moves it vertically upward. Then, the drive component 56 drives the central disk 521 downward. Under the action of gravity, the four fan disks 522 also move downward until the upper limit block 541 presses against the upper surface of the slide rail 53. The distance between the upper limit block 541 and the lower limit block 542 of each upright 54 is set differently, so that the falling distance of the fan disks 522 is different. The specific distance is to ensure that the four fan disks 522 are at different heights and staggered after falling. Then, the driving component 56 drives the central disk 521 and the driving disk 55 to rotate. Under the action of the inclined groove 551, the four fan disks 522 move towards the center, thereby reducing the projected area of ​​the suction cup 52 in the vertical direction. To reset the central disk 521 and the four fan disks 522, simply reverse the operation.

[0054] The above technical solution reduces the vertical projection area of ​​the suction cup 52 by staggering the fan disks 522 and moving them closer to the center. When the robot arm 8 moves the TGV glass substrate and the substrate stage 5 synchronously, water droplets are less likely to fall onto the surface of the suction cup 52.

[0055] Refer to the instruction manual appendix Figure 10 A multi-station wafer thinning and polishing method, using the aforementioned wafer thinning apparatus, includes the following steps:

[0056] Step 1: Use the robotic arm 8 to place the wafer on the suction cup 52, and fix it by suction cup 52;

[0057] Step 2: The indexer 4 drives the wafer stage 5 to rotate, so that the wafer is coarsely polished at the coarse grinding station 11 and finely polished at the fine grinding station 12.

[0058] Step 3: After polishing, the wafer carrier 5 is rotated by the indexer 4 to transport the wafer to the loading and unloading station 13;

[0059] Step 4: The robot arm 8 picks up the wafer from the top, and then the robot arm 8 drives the wafer to move. The pusher 6 pushes the wafer support stage 5, so that the wafer and the wafer support stage 5 move synchronously towards the partition 14.

[0060] Step 5: When the wafer and the substrate 5 are above and below the partition 14 respectively, the pusher 6 pulls the substrate 5 to reset.

[0061] In conclusion, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer thinning device, characterized in that: Includes a workbench (1), on which a rough grinding station (11), a fine grinding station (12) and a loading / unloading station (13) are provided. An indexer (4) is installed inside the workbench (1), and multiple plate-bearing platforms (5) are installed at the output end of the indexer (4). The indexer (4) is used to drive the plate-bearing platforms (5) to move between the rough grinding station (11), the fine grinding station (12) and the loading / unloading station (13). The wafer stage (5) includes a mounting frame (51), and a suction cup (52) is provided above the mounting frame (51). The suction cup (52) is used to adsorb and carry the wafer. A robotic arm (8) is provided on one side of the loading / unloading station (13). The robotic arm (8) is used to pick up and place wafers on the chuck (52). A partition (14) is provided on the side of the loading / unloading station (13) near the edge of the worktable (1). A pusher (6) is installed at the output end of the indexer (4). The pusher (6) is used to push and pull the wafer support (5), so that the wafer support (5) moves into or out from the bottom of the partition (14).

2. The wafer thinning apparatus according to claim 1, characterized in that: A ring track (72) is installed on the bottom of the inner side of the workbench (1). A slider (71) is slidably installed on the ring track (72). A guide rail (7) is installed on the slider (71). The mounting bracket (51) is slidably installed on the guide rail (7).

3. The wafer thinning apparatus according to claim 1, characterized in that: The suction cup (52) includes a disc-shaped structure consisting of a central disc (521) and multiple fan discs (522) surrounding the central disc (521). A driving component (56) is mounted on the mounting bracket (51). The driving component (56) is used to drive the central disc (521) to move vertically and rotate. When the central disc (521) moves downward, the multiple fan discs (522) also move downward, so that the multiple fan discs (522) and the central disc (521) are at different heights and staggered from each other. When the fan discs (522) rotate, they drive the multiple fan discs (522) to move towards the center at the same time.

4. The wafer thinning apparatus according to claim 3, characterized in that: The top of the mounting bracket (51) is fixedly equipped with multiple slide rails (53) that correspond one-to-one with the fan plate (522). Each slide rail (53) has a vertically movable upright (54) inserted inside, and the upright (54) can slide along the length of the slide rail (53). The upper ends of the multiple uprights (54) are respectively fixedly connected to the bottom surface of the fan plate (522).

5. A wafer thinning apparatus according to claim 4, characterized in that: The upright (54) is fixedly installed with an upper limit block (541) on the upper side of the slide rail (53), and a lower limit block (542) is fixedly connected on the lower side of the slide rail (53). When multiple fan discs (522) are at the same height, the lower limit block (542) on each upright (54) is at the same height. When multiple fan discs (522) are at different heights, the upper limit block (541) on each upright (54) is at the same height.

6. The wafer thinning apparatus according to claim 5, characterized in that: A drive disk (55) is fixedly installed at the bottom of the central disk (521). The drive disk (55) has a circumferential groove (551) that corresponds to the upright (54). A guide rod (543) is installed at the bottom of each upright (54), and the bottom of the guide rod (543) is located in the groove (551).

7. A wafer thinning apparatus according to claim 6, characterized in that: The drive component (56) includes a mounting plate (561) fixedly mounted on a mounting bracket (51), a turntable (562) rotatably connected to the mounting plate (561), a rotating shaft (563) vertically slidably mounted on the turntable (562), a drive motor (564) and a cylinder (565) mounted on the mounting bracket (51), the output end of the drive motor (564) being connected to the turntable (562) in a transmission connection, and the output end of the cylinder (565) being rotatably connected to the bottom of the rotating shaft (563).

8. The wafer thinning apparatus according to claim 1, characterized in that: A coarse grinding component (2) is provided at the position of the coarse grinding station (11), and a fine grinding component (3) is provided at the position of the fine grinding station (12). A universal nozzle (9) is provided on one side of both the coarse grinding component (2) and the fine grinding component (3).

9. A wafer thinning apparatus according to claim 1, characterized in that: The robotic arm (8) includes a second cylinder (81), and the output end of the second cylinder (81) is connected in sequence to a first rotating arm (82), a second rotating arm (83), a third rotating arm (84) and a picking plate (85). The first rotating arm (82), the second rotating arm (83), and the third rotating arm (84) are all driven by motors, and the picking plate (85) is used to pick up wafers.

10. A multi-station polishing method for wafer thinning, using the wafer thinning apparatus as described in any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Use the robotic arm (8) to place the wafer on the suction cup (52) and fix it by adsorption (52); Step 2: The indexer (4) drives the wafer stage (5) to rotate, so that the wafer is coarsely polished at the coarse grinding station (11) and finely polished at the fine grinding station (12). Step 3: After polishing, the wafer carrier (5) is rotated by the indexer (4) to transport the wafer to the loading and unloading station (13). Step 4: The robot (8) picks up the wafer from the top, and then the robot (8) moves the wafer. The pusher (6) pushes the wafer support stage (5) so that the wafer and the wafer support stage (5) move synchronously towards the partition (14). Step 5: When the wafer and the substrate (5) are above and below the partition (14) respectively, the pusher (6) pulls the substrate (5) to reset.

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