Epoxy molding compound for packaging and preparation method and application thereof

Abstract

The invention relates to the technical field of epoxy plastic packaging materials, and discloses an epoxy plastic packaging material for packaging and a preparation method and application thereof. The raw material composition of the epoxy molding compound for packaging contains epoxy resin, a curing agent, a solid filler and an accelerant, the epoxy resin comprises first epoxy resin as shown in a formula (I); the curing agent is a curing agent as shown in a formula (II) and / or a formula (III); wherein in the formula (I), n is an integer from 1 to 10; in the formula (II), m is an integer of 1-10, and n1 is an integer of 1-10; in the formula (III), n2 is an integer of 1-10; r1 and R3 are respectively and independently selected from alkyl or aryl; and R2 is a dicyclopentadienyl group or an alkylene group. The epoxy molding compound for packaging has good high pressure resistance at a high temperature, and can meet the examination time requirement of HTRB 1000 h and above. The formula (I), the formula (II) and the formula (III) are shown in the description.

Description

Technical Field

[0001] This invention relates to the field of epoxy molding compound technology, specifically to an epoxy molding compound for encapsulation, its preparation method, and its application. Background Technology

[0002] Epoxy resin, as the main resin and curing agent, is cured at high temperature under the action of curing accelerator. The combination of epoxy resin and phenolic resin is the mainstream of electronic molding compounds today. In the above materials, inorganic fillers such as silica and calcium carbonate, as well as flame retardants and various additives, can be added to prepare molding materials that meet the needs of electronic packaging. However, with the development of the semiconductor industry, the market demand for cost is also increasing. In order to control costs, many chips have made adjustments to the manufacturing process (no coating or passivation layer). Therefore, the requirements for packaging materials have also increased, especially for some special application devices, especially high voltage power devices. Existing molding compounds often cannot meet the HTB 1000h or longer test requirements.

[0003] Patent application CN109651762A discloses a high-pressure resistant epoxy resin composition. This composition, by employing a special structure epoxy resin and a coupling agent with a special functional structure, enables the epoxy resin composition to resist high-pressure impact after molding, with a high voltage resistance of 5000V or even higher. However, it does not mention the high-pressure resistance performance of the product at high temperatures. Therefore, there is an urgent need to provide an epoxy molding material that not only meets the performance requirements of the basic molding compound but also withstands high voltage at high temperatures. Summary of the Invention

[0004] The purpose of this invention is to overcome the problem that existing epoxy molding compounds have poor high-pressure resistance at high temperatures and cannot meet the HTRB 1000h time requirement, and to provide an epoxy molding compound for encapsulation that has good high-pressure resistance at high temperatures and meets the HTRB 1000h and above test time requirements.

[0005] To achieve the above objectives, the present invention provides an epoxy molding compound for encapsulation, wherein the raw material composition of the epoxy molding compound for encapsulation contains epoxy resin, curing agent, solid filler and accelerator; The epoxy resin includes the first epoxy resin shown in formula (Ⅰ); Equation (I) The curing agent is a curing agent represented by formula (II) and / or formula (III); Formula (II) Formula (III) In equation (Ⅰ), n is an integer from 1 to 10; In equation (II), m is an integer from 1 to 10, and n1 is an integer from 1 to 10; In formula (Ⅲ), n2 is an integer from 1 to 10; R1 and R3 are each independently selected from alkyl or aryl groups; R2 is dicyclopentadienyl or alkylene.

[0006] Preferably, the total weight of the raw material composition of the epoxy molding compound for encapsulation is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, and the content of the accelerator is 0.01-1 wt%.

[0007] Preferably, the epoxy resin further comprises a second epoxy resin, which is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, naphthalene ring epoxy resin, and multifunctional epoxy resin.

[0008] Preferably, the weight ratio of the second epoxy resin to the first epoxy resin is 1:1-4.

[0009] Preferably, the solid filler is crystalline silica powder and / or molten silica powder.

[0010] Preferably, the promoter is a triphenylphosphine-benzoquinone adduct and / or a tetraphenylphosphine salt.

[0011] Preferably, the raw material composition of the epoxy molding compound for encapsulation further includes at least one of a release agent, a colorant, a coupling agent, a low-stress modifier, and an ion trapping agent.

[0012] Preferably, the release agent is carnauba wax and / or oxidized polyethylene wax.

[0013] Preferably, the colorant is carbon black and / or titanium black.

[0014] Preferably, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane.

[0015] Preferably, the low-stress modifier is selected from one or more of the following: silicone-modified epoxy resin, silicone resin, liquid-terminated carboxyl-terminated nitrile rubber, and triblock copolymers containing silicone components.

[0016] Preferably, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, anion-cation composite ion scavengers, and hydrotalcite compounds.

[0017] Preferably, the total weight of the raw material composition of the epoxy molding compound for encapsulation is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, the content of the accelerator is 0.01-1 wt%, the content of the release agent is 0.1-1 wt%, the content of the colorant is 0.1-1 wt%, the content of the coupling agent is 0.1-1 wt%, the content of the low-stress modifier is 0.1-1 wt%, and the content of the ion scavenger is 0.1-1 wt%.

[0018] A second aspect of the present invention provides a method for preparing the above-mentioned epoxy molding compound for encapsulation, the method comprising: (1) The raw material composition of the epoxy molding compound for encapsulation is heated and mixed; (2) The resulting mixture is melt-extruded, then cooled, pulverized and preformed.

[0019] Preferably, the specific process of step (1) includes: heating and mixing the curing agent, optional low-stress modifier and optional release agent, discharging and cooling to obtain an intermediate, and then mixing the intermediate, epoxy resin, solid filler, accelerator, optional colorant, optional coupling agent and optional ion trapping agent.

[0020] Preferably, in step (2), the conditions for melt extrusion include a temperature of 85-105°C.

[0021] A third aspect of the present invention provides the application of the above-mentioned epoxy molding compound for packaging in high-voltage power electrical appliance packaging.

[0022] Compared with the prior art, the technical solution of the present invention has the following advantages: The raw material composition of the epoxy molding compound for encapsulation described in this invention contains a first epoxy resin with a specific structure as shown in formula (I) and a curing agent with a specific structure as shown in formula (II) and / or formula (III). Due to the first epoxy resin and the curing agent, the addition of the first epoxy resin with the specific structure and the curing agent with the specific structure results in fewer polar groups in the epoxy molding compound prepared after the crosslinking reaction, and a lower dielectric constant at high temperature. This greatly improves the high-pressure resistance of the epoxy molding compound for encapsulation at high temperature, and HTRB can meet the testing time requirements of 1000h and above. Detailed Implementation

[0023] The following provides a detailed description of specific embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the scope of the invention.

[0024] The endpoints and any values ​​of the ranges disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoint values ​​of the various ranges, the endpoint values ​​of the various ranges and individual point values, and individual point values ​​can be combined with each other to obtain one or more new numerical ranges, which should be considered as specifically disclosed herein.

[0025] In one aspect, the present invention provides an epoxy molding compound for encapsulation, wherein the raw material composition of the epoxy molding compound for encapsulation contains epoxy resin, curing agent, solid filler and accelerator; The epoxy resin includes the first epoxy resin shown in formula (Ⅰ); Equation (I) The curing agent is a curing agent represented by formula (II) and / or formula (III); Formula (II) Formula (III) In equation (Ⅰ), n is an integer from 1 to 10; In equation (II), m is an integer from 1 to 10, and n1 is an integer from 1 to 10; In formula (Ⅲ), n2 is an integer from 1 to 10; R1 and R3 are each independently selected from alkyl or aryl groups; R2 is dicyclopentadienyl or alkylene.

[0026] According to the present invention, the epoxy molding compound for encapsulation prepared from the raw materials of the first epoxy resin and the curing agent with the above-described specific structure has good high pressure resistance at high temperature, and can meet the HTRB test time requirements of 1000h and above.

[0027] In a further preferred embodiment, the alkyl group is a C1-C8 alkyl group; the aryl group is a phenyl or naphthyl group; and the alkylene group is a C1-C8 alkylene group.

[0028] In a preferred embodiment, in order to further improve the high temperature and high pressure resistance of the epoxy encapsulation material while ensuring other basic properties of the epoxy encapsulation material, the total weight of the raw material composition of the epoxy encapsulation material is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, and the content of the accelerator is 0.01-1 wt%.

[0029] In a preferred embodiment, the epoxy resin further comprises a second epoxy resin, which is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, naphthalene ring epoxy resin, and multifunctional epoxy resin.

[0030] In a further preferred embodiment, in order to further improve the high temperature and high pressure resistance of the epoxy molding compound for encapsulation, the weight ratio of the second epoxy resin to the first epoxy resin is 1:1-4; specifically, the weight ratio of the second epoxy resin to the first epoxy resin can be 1:1, 1:1.5, 1:2, 1:2.5, 1:3, 1:3.5 or 1:4.

[0031] In a preferred embodiment, the solid filler is crystalline silica powder and / or molten silica powder; preferably molten silica powder, which accounts for 75-90 wt% of the total weight of the raw material composition.

[0032] In a preferred embodiment, the maximum particle size of the solid filler is 160-200 μm, and the median particle size is 15-35 μm.

[0033] In a preferred embodiment, the promoter is a triphenylphosphine-benzoquinone adduct and / or a tetraphenylphosphine salt; specifically, it can be triphenylphosphine-p-benzoquinone.

[0034] In a preferred embodiment, the raw material composition of the epoxy molding compound for encapsulation further includes at least one of a release agent, a colorant, a coupling agent, a low-stress modifier, and an ion trapping agent; preferably, the raw material composition of the epoxy molding compound for encapsulation includes a release agent, a colorant, a coupling agent, a low-stress modifier, and an ion trapping agent.

[0035] In a preferred embodiment, the release agent is carnauba wax and / or oxidized polyethylene wax.

[0036] In a preferred embodiment, the colorant is carbon black and / or titanium black.

[0037] In a preferred embodiment, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ-mercaptopropyltrimethoxysilane.

[0038] In a preferred embodiment, the low-stress modifier is selected from one or more of the following: silicone-modified epoxy resin, silicone resin, liquid-terminated carboxyl-terminated nitrile rubber, and triblock copolymers containing silicone components.

[0039] In a preferred embodiment, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, anion-cation composite ion scavengers, and hydrotalcite compounds.

[0040] In a preferred embodiment, the total weight of the raw material composition of the epoxy molding compound for encapsulation is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, the content of the accelerator is 0.01-1 wt%, the content of the release agent is 0.1-1 wt%, the content of the colorant is 0.1-1 wt%, the content of the coupling agent is 0.1-1 wt%, the content of the low-stress modifier is 0.1-1 wt%, and the content of the ion scavenger is 0.1-1 wt%.

[0041] A second aspect of the present invention provides a method for preparing the above-mentioned epoxy molding compound for encapsulation, the method comprising: (1) The raw material composition of the epoxy molding compound for encapsulation is heated and mixed; (2) The resulting mixture is melt-extruded, then cooled, pulverized and preformed.

[0042] In a preferred embodiment, the specific process of step (1) includes: heating and mixing the curing agent, optional low-stress modifier and optional release agent, discharging and cooling to obtain an intermediate, and then mixing the intermediate, epoxy resin, solid filler, accelerator, optional colorant, optional coupling agent and optional ion trapping agent.

[0043] In a preferred embodiment, in step (2), the conditions for melt extrusion include a temperature of 85-105°C.

[0044] In one specific embodiment, the method for preparing the above-mentioned epoxy molding compound for encapsulation specifically includes: (1) The curing agent, optional low-stress modifier and optional release agent are heated and mixed at 100-150℃, and the intermediate is obtained after discharge and cooling. Then the intermediate, epoxy resin, solid filler, accelerator, optional colorant, optional coupling agent and optional ion scavenger are mixed. (2) The obtained mixture is subjected to twin-screw melt extrusion at a temperature of 85-105℃, followed by cooling, pulverization and preforming.

[0045] A third aspect of the present invention provides the application of the above-mentioned epoxy molding compound for packaging in high-voltage power electrical appliance packaging.

[0046] Because the aforementioned epoxy molding compound has good high-voltage resistance at high temperatures and can meet the HTRB 1000h and above test time requirements, it has good application prospects in the packaging of high-voltage power electrical appliances.

[0047] The following examples further illustrate the epoxy molding compound for encapsulation, its preparation method, and its application according to the present invention. These examples are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following examples.

[0048] Unless otherwise specified, the experimental methods used in the following embodiments are conventional methods in the art. Unless otherwise specified, the experimental materials used in the following embodiments are commercially available. First epoxy resin: The epoxy resin shown in formula (Ⅰ) was purchased from DIC and its brand name is HP7200. Curing agent: The curing agent shown in formula (II) was purchased from Nippon Steel & Sumitomo Chemical, with the brand name HE-510-05; the curing agent shown in formula (III) was purchased from Seiquan, with the brand name SH-6808. Second epoxy resin: o-cresol epoxy resin, purchased from Shengquan, brand name SQCN700-3; multifunctional epoxy resin, purchased from DIC, brand name HP7241; biphenyl type epoxy resin, purchased from Mitsubishi, brand name YX4000. Solid filler: fused silica powder, purchased from Lianrui, with a maximum particle size of 75 μm and a median particle size of 15-30 μm; Accelerator: Triphenylphosphine-p-benzoquinone (TPP-BQ), purchased from Nanjing Lanbian Biochemical Technology Co., Ltd.; Low-stress modifier: silicone-modified epoxy resin, purchased from Dow Corning, brand name SF-8241EG; Coupling agent: purchased from Jiangsu Chenguang Company, brand name KH560; Release agent: Oxidized polyethylene wax, purchased from Clariant, brand name PED522; Ion scavenging agent: hydrotalcite, purchased from Kyowa Chemical Industry Co., Ltd., Japan, brand name DHT-4A; The raw material components and dosages in the embodiments are shown in Table 1. Table 1

[0049] Example 1 (1) Weigh each component according to the components and proportions in Table 1 Example 1, heat and melt the curing agent, low stress modifier and release agent, then heat and mix them at 140°C, and obtain an intermediate after cooling. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 100°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0050] Example 2 (1) Weigh each component according to the components and proportions in Table 1 Example 2, heat and melt the curing agent, low stress modifier and release agent, then heat and mix at 140°C, and obtain an intermediate after discharge and cooling. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 105°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0051] Example 3 (1) Weigh each component according to the components and proportions in Table 1 Example 3, heat and melt the curing agent, low stress modifier and release agent, then heat and mix them at 140°C, and obtain an intermediate after cooling. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 100°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0052] Example 4 (1) Weigh each component according to the components and proportions in Table 1 Example 4, heat and melt the curing agent, low stress modifier and release agent, then heat and mix at 140°C, and obtain an intermediate after discharge and cooling. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 85°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0053] Example 5 (1) Weigh each component according to the components and proportions in Table 1 Example 5, heat and melt the curing agent, low stress modifier and release agent, then heat and mix at 140°C, and obtain an intermediate after discharge and cooling. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 100°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0054] Example 6 (1) Weigh each component according to the components and proportions in Table 1 Example 6. Heat and melt the curing agent, low stress modifier and release agent, then heat and mix them at 140°C. After cooling the material, an intermediate is obtained. Then stir and mix the intermediate, epoxy resin, solid filler, accelerator, colorant, coupling agent and ion capture agent. (2) The obtained mixture is subjected to twin-screw melt extrusion at 100°C, followed by tableting, cooling, pulverizing, and pre-pressing with a briquetting machine.

[0055] Comparative Example 1 The implementation was carried out in accordance with Example 1, except that the first epoxy resin HP 7200 was replaced with an equal weight of the second epoxy resin, biphenyl type epoxy resin YX 4000.

[0056] Comparative Example 2 The implementation was carried out in accordance with Example 2, except that the curing agent SH-6808 shown in Formula (III) was replaced with an equal weight of curing agent XYLOK phenolic resin.

[0057] Comparative Example 3 The implementation was carried out in accordance with Example 3, except that the curing agent HE-510-05 shown in Formula (II) and the curing agent SH-6808 shown in Formula (III) were both replaced with an equal weight of curing agent biphenyl phenolic resin.

[0058] Comparative Example 4 The implementation was carried out in accordance with Example 4, except that the first epoxy resin HP7200 in Formula (I) was replaced with an equal weight of the second epoxy resin o-cresol epoxy resin SQCN700-3; and the curing agent HE-510-05 in Formula (II) and the curing agent SH-6808 in Formula (III) were both replaced with an equal weight of the curing agent linear phenolic resin.

[0059] Test case The gelation time, flowability, dielectric constant, and electrical properties of the epoxy molding compounds prepared in the examples and comparative examples were tested. The test results are shown in Table 2. The test methods for each are as follows: Gelation time: Heat the hot plate to 175±1℃, take 2-3g of sample and place it on the iron plate, stir continuously with a small needle, and test the time it takes for the sample to change from a fluid to a gel state. Flowability: A 30g sample was used in a resin transfer injection molding machine with a spiral flow metal mold for testing. The injection pressure was 70 kgf / cm². 2 The mold temperature was 175±1℃, and the flow distance of the sample was measured. Dielectric constant: The dielectric constant of the sample was tested at 25℃ and 175℃ using a dielectric constant tester at a frequency of 40Hz. Electrical performance: Taking TO-247 as an example, after the sample was encapsulated at 175℃, it was cured at 175℃ for 8 hours, and then tested at 150℃ with a reverse voltage of 1500V for 1000 hours and 1500 hours respectively to evaluate the electrical performance.

[0060] Table 2

[0061] As can be seen from the data in Table 2, the encapsulation epoxy resin obtained by using a first epoxy resin with a specific structure and a curing agent with a specific structure has a low dielectric constant at high temperatures, thus exhibiting good high-voltage resistance and meeting the HTRB 1000h and above test time requirements. It has good application prospects in the encapsulation of high-voltage power devices.

[0062] The preferred embodiments of the present invention have been described in detail above; however, the present invention is not limited thereto. Within the scope of the inventive concept, various simple modifications can be made to the technical solutions of the present invention, including combinations of various technical features in any other suitable manner. These simple modifications and combinations should also be considered as the content disclosed in the present invention and are all within the protection scope of the present invention.

Claims

1. An epoxy molding compound for encapsulation, characterized in that, The raw material composition of this epoxy molding compound for encapsulation contains epoxy resin, curing agent, solid filler and accelerator; The epoxy resin includes the first epoxy resin shown in formula (Ⅰ); Equation (I) The curing agent is a curing agent represented by formula (II) and / or formula (III); Formula (II) Formula (III) In equation (Ⅰ), n is an integer from 1 to 10; In equation (II), m is an integer from 1 to 10, and n1 is an integer from 1 to 10; In formula (Ⅲ), n2 is an integer from 1 to 10; R1 and R3 are each independently selected from alkyl or aryl groups; R2 is dicyclopentadienyl or alkylene.

2. The epoxy molding compound for encapsulation according to claim 1, characterized in that, The total weight of the raw material composition of the epoxy molding compound for encapsulation is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, and the content of the accelerator is 0.01-1 wt%.

3. The epoxy molding compound for encapsulation according to claim 1 or 2, characterized in that, The epoxy resin further comprises a second epoxy resin, which is selected from one or more of o-cresol epoxy resin, biphenyl epoxy resin, aralkyl epoxy resin, naphthalene ring epoxy resin and multifunctional epoxy resin. Preferably, the weight ratio of the second epoxy resin to the first epoxy resin is 1:1-4.

4. The epoxy molding compound for encapsulation according to any one of claims 1-3, characterized in that, The solid filler is crystalline silica powder and / or molten silica powder.

5. The epoxy molding compound for encapsulation according to any one of claims 1-4, characterized in that, The accelerator is a triphenylphosphine-benzoquinone adduct and / or a tetraphenylphosphine salt.

6. The epoxy molding compound for encapsulation according to any one of claims 1-5, characterized in that, The raw material composition of the epoxy molding compound for encapsulation further includes at least one of a release agent, a colorant, a coupling agent, a low-stress modifier, and an ion trapping agent; Preferably, the release agent is carnauba wax and / or oxidized polyethylene wax; Preferably, the colorant is carbon black and / or titanium black; Preferably, the coupling agent is selected from one or more of γ-glycidoxypropyltrimethoxysilane, γ-aminopropyltriethoxysilane and γ-mercaptopropyltrimethoxysilane; Preferably, the low-stress modifier is selected from one or more of the following: silicone-modified epoxy resin, silicone resin, liquid-terminated carboxyl-terminated nitrile rubber, and triblock copolymers containing silicone components. Preferably, the ion scavenger is selected from one or more of anion scavengers, cation scavengers, anion-cation composite ion scavengers, and hydrotalcite compounds.

7. The epoxy molding compound for encapsulation according to claim 6, characterized in that, The total weight of the raw material composition of the epoxy molding compound for encapsulation is 100%, the content of the epoxy resin is 4-20 wt%, the content of the curing agent is 3-10 wt%, the content of the solid filler is 70-90 wt%, the content of the accelerator is 0.01-1 wt%, the content of the release agent is 0.1-1 wt%, the content of the colorant is 0.1-1 wt%, the content of the coupling agent is 0.1-1 wt%, the content of the low-stress modifier is 0.1-1 wt%, and the content of the ion scavenger is 0.1-1 wt%.

8. A method for preparing the epoxy molding compound for encapsulation according to any one of claims 1-7, characterized in that, The method includes: (1) The raw material composition of the epoxy molding compound for encapsulation is heated and mixed; (2) The resulting mixture is melt-extruded, then cooled, pulverized and pre-formed.

9. The method according to claim 8, characterized in that, The specific process of step (1) includes: heating and mixing the curing agent, optional low-stress modifier and optional release agent, discharging and cooling to obtain an intermediate, and then mixing the intermediate, epoxy resin, solid filler, accelerator, optional colorant, optional coupling agent and optional ion trapping agent; and / or In step (2), the conditions for melt extrusion include a temperature of 85-105℃.

10. The application of the epoxy molding compound for encapsulation according to any one of claims 1-7 in the packaging of high-voltage power electrical appliances.

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