CT bulb tube electroplating method and electroplating tool

Abstract

The invention belongs to metal material surface treatment, and particularly discloses a CT bulb tube electroplating method and an electroplating tool, and the method comprises the following steps: carrying out insulation shielding on a CT bulb tube; hanging the CT bulb tube after insulation shielding; and immersing the hung CT bulb tube in an electroplating solution for electroplating to obtain the CT bulb tube with an electroplated layer. The hard chromium-black chromium composite coating which is uniform, high in binding force and high in radiation efficiency can be prepared on the surface of the CT bulb tube, so that the performance of the CT bulb tube is improved, and the service life of the CT bulb tube is prolonged.

Description

Technical Field

[0001] This application belongs to the field of metal material surface treatment technology, specifically relating to a CT tube electroplating method and electroplating fixture. Background Technology

[0002] Increasing the thermal emissivity of the tube shell can significantly enhance its heat dissipation efficiency. According to the Stefan-Boltzmann law, the thermal radiation power of an object is proportional to the fourth power of its absolute temperature and also to its surface emissivity. A higher thermal emissivity means that, at the same temperature, the tube shell can dissipate heat into the surrounding environment more quickly through thermal radiation, thereby effectively reducing the component temperature and improving the reliability and performance of the X-ray tube.

[0003] To achieve a high thermal radiation coefficient, shell and tube assemblies typically employ spray coating technology. However, in practice, the resulting coating exhibits some unevenness and carries risks such as particle shedding, discoloration, peeling, and flaking under high-temperature conditions. Electroplating black chrome, through electrodeposition, forms a black coating with a unique microstructure, exhibiting excellent adhesion, corrosion resistance, and hardness. This microstructure effectively enhances the absorption and emission of thermal radiation. However, chromium anhydride plating solutions suffer from low current efficiency, poor dispersion, and poor coverage. Therefore, whether using hard chrome or black chrome plating, complex-shaped parts cannot be uniformly covered with the coating during functional plating. This is a common technical problem in chrome plating processes, which can be improved by optimizing process conditions to enhance plating uniformity and coverage. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the purpose of this application is to provide a CT tube electroplating method and electroplating tooling. The purpose of this application is to prepare a uniform, strong, and highly radiative hard chromium-black chromium composite coating on the surface of the CT tube to improve its heat dissipation performance, long-term stability and service life.

[0005] To achieve the above objectives, this application provides the following technical solution: A method for electroplating a CT tube, the method comprising: insulating and shielding the CT tube; mounting the insulating and shielded CT tube; immersing the mounted CT tube in an electroplating solution for electroplating to obtain a CT tube with an electroplated layer.

[0006] Optionally, the insulation shielding of the CT tube includes: cleaning the outer surface of the CT tube; and coating and curing the cleaned outer surface of the CT tube with a shielding material.

[0007] Optionally, the step of immersing the mounted CT tube in an electroplating solution for electroplating to obtain a CT tube with an electroplated layer includes: electrolyzing the mounted CT tube to remove oil; purifying the CT tube after electrolyzing to remove oil; electroplating hard chrome in the electroplating area of ​​the purified CT tube to form a hard chrome electroplated layer in the electroplating area of ​​the CT tube; and electroplating a black chrome layer on the hard chrome electroplated layer.

[0008] Optionally, the electrolytic degreasing of the mounted CT tube includes: immersing the mounted CT tube in an electrolytic degreasing tank equipped with an ultrasonic-assisted and periodic commutation current system; applying a periodic commutation current to the periodic commutation current system to switch the polarity of the CT tube, thereby achieving electrolytic degreasing.

[0009] Optionally, the purification of the CT tube after electrolytic degreasing includes: immersing the CT tube after electrolytic degreasing in a composite acid etching solution; agitating the CT tube immersed in the composite acid etching solution; and rinsing the agitated CT tube.

[0010] Optionally, the step of electroplating hard chromium in the electroplating area of ​​the purified CT tube to form a hard chromium electroplating layer in the electroplating area of ​​the CT tube includes: connecting the purified CT tube as a cathode to the negative electrode of the rectifier; immersing the CT tube in a composite chromium plating solution and stirring the composite chromium plating solution to perform hard chromium electroplating on the CT tube.

[0011] Optionally, the step of electroplating a black chromium layer on the hard chromium plating layer includes: transferring a CT tube with a hard chromium plating layer to a black chromium plating bath; connecting the CT tube as a cathode pre-pulse power supply; and electroplating a black chromium layer on the hard chromium plating layer by electrodeposition.

[0012] This application also provides an electroplating fixture for mounting a CT tube. The electroplating fixture includes a first hanger and a second hanger. Both the first and second hangers include a hanging rod and a hook. One side of the hanging rod of the first and second hangers is integrally connected by a connector. The middle part of the hanging rod is connected by two symmetrically arranged bakelite boards of the same specifications, and an insulating gap is left between the two symmetrically arranged bakelite boards. The fixture also includes a fixing structure for fixing the CT tube. The fixture also includes a figurative auxiliary anode, which is located inside the cavity of the CT tube and one end is connected to the bottom of the CT tube.

[0013] Optionally, the tooling further includes: a copper busbar, one end of which is connected to the side of the pictographic auxiliary anode that is not connected to the bottom of the CT tube, and the other end of which passes through the insulating gap between two symmetrically arranged bakelite boards and extends in the direction of the hook located on the other side of the hanging rod of the first and second hangers.

[0014] Optionally, the fixing structure includes: a first clamping plate and a second clamping plate, wherein the first clamping plate is located between the connector and the CT tube, the first clamping plate includes a first base, the side of the first base facing the CT tube is provided with a circular groove, and the bottom end of the CT tube is located in the circular groove; the first base is also symmetrically provided with a first threaded hole, symmetrically provided with a through hole in the same direction as the first threaded hole, and symmetrically provided with a first hollow structure orthogonal to the directions of the first threaded hole and the through hole, wherein the connector is fixedly connected to the first base through the through hole; the second clamping plate is located inside the CT tube and includes a second base, the second base is symmetrically provided with a second threaded hole, and symmetrically provided with a second hollow structure orthogonal to the direction of the second threaded hole; The symmetrically arranged second threaded holes correspond to the symmetrically arranged first threaded holes, and the symmetrically arranged second hollow structure corresponds to the symmetrically arranged first hollow structure.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: This application utilizes optimized insulation and shielding processes, customized chemical coatings and a pictographic auxiliary anode system, composite electroplating solution formulations, and pulse electroplating technology to sequentially prepare a hard chromium layer and a black chromium functional layer with excellent adhesion on the surface of a CT tube. Combined with laser recrystallization and vapor deposition post-treatment, it can improve the uniformity, adhesion, hardness, and thermal radiation performance of the coating, effectively avoiding the problems of peeling, discoloration, and particle release that are prone to occur in traditional spraying processes. This significantly improves the heat dissipation efficiency, long-term stability, and service life of the CT tube. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of a CT X-ray tube electroplating method provided in one embodiment of this application; Figure 2 [Xu Chen 1] is a structural schematic diagram of an electroplating fixture provided in another embodiment of this application; Figure 3 This is a schematic diagram of the structure of the first clamping plate provided in another embodiment of this application; Figure 4 This is a schematic diagram of the structure of the second clamping plate provided in another embodiment of this application; Figure 5 This is a schematic diagram of the electroplated CT tube coating surface under non-light illumination, provided in another embodiment of this application; Figure 6 This is a schematic diagram of the electroplated CT tube coating surface under light, provided in another embodiment of this application.

[0017] The annotations in the attached figures are explained as follows: 1. Pictographic auxiliary anode; 2. CT X-ray tube; 3. First clamping plate; 3-1. First base; 3-2. Circular groove; 3-3. First threaded hole; 3-4. Through hole; 3-5. First hollow structure; 4. Copper busbar; 5. First pendant; 6. Second pendant; 7. Bakelite board; 8. Connectors; 9. Second clamping plate; 9-1. Second base; 9-2. Second hollow structure; 9-3. Second threaded hole. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0020] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0021] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0022] Figure 1 This application provides an embodiment of a CT X-ray tube electroplating method, such as... Figure 1 As shown, the method includes the following steps: S100: Provides insulation and shielding for the CT tube; S200: Mounting the CT tube after insulation and shielding; S300: The mounted CT tube is immersed in an electroplating solution for electroplating to obtain a CT tube with an electroplated layer.

[0023] In another exemplary embodiment, step S100, the insulation shielding of the CT tube, includes the following steps: S101: Clean the outer surface of the CT tube; In this step, the electroplated area and shielding area on the outer surface of the CT tube are first wiped with an organic solvent (such as acetone or ethanol) and a non-woven cloth to remove oil, fingerprints, and dust. Next, the wiped electroplated and shielding areas are treated with low-pressure sandblasting (using fine glass beads or alumina sand) to increase the adhesion of the subsequent shielding adhesive to the shielding area on the outer surface of the CT tube.

[0024] S102: Apply and cure shielding material to the outer surface of the cleaned CT tube.

[0025] In this step, firstly, using a laser marking machine or a peelable marker, the boundary lines between the shielded and unshielded areas are precisely marked on the CT tube, providing a reference for subsequent adhesive application. Secondly, a quantitative and uniform coating of an electrolyte-resistant, high-temperature (>200℃) UV-curable insulating resin is applied to the shielded areas, ensuring sufficient adhesive thickness in critical areas (such as edges and around holes), without breaks or bubbles. After coating, the insulating resin is pre-cured under low-intensity UV light (365nm wavelength) for 5 to 10 seconds, allowing the adhesive to initially set while maintaining a slightly tacky surface. Finally, the tube coated with the cured insulating resin is placed in a rotary UV curing oven, where the CT tube is irradiated with omnidirectional and uniform UV light (395nm wavelength) for 60 to 90 seconds to ensure complete resin curing.

[0026] In another exemplary embodiment, step S300, immersing the mounted CT tube in the electroplating solution for electroplating, includes the following steps: S301: Electrolytically degrease the mounted CT tube; In this step, the mounted CT tube is immersed in an electrolytic degreasing tank equipped with an ultrasonic-assisted, periodically commutating current system (the periodically commutating current system is an existing technology that achieves efficient degreasing and hydrogen embrittlement prevention by periodically switching between cathode and anode modes, combined with ultrasonic assistance. This system itself is not the core content to be protected in this solution, but rather serves as a mature technological foundation for the pre-treatment of CT tubes before electroplating). The tank solution is a composite alkaline system containing 40g / L to 60g / L sodium hydroxide, 30g / L to 50g / L sodium carbonate, 10g / L to 40g / L sodium phosphate, and 3g / L to 10g / L sodium silicate. First, a periodically commutating current is applied to the periodically commutating current system through an external rectifier. When the system is set to cathode mode, the CT tube acts as the cathode, and hydrogen gas is released from its surface. The mechanical peeling force of the bubbles tears and disperses the oil film. Subsequently, the system switches to a short-term (10s to 20s) anodic mode, during which the CT tube becomes the anode, and oxygen is released from its surface to eliminate the potential hydrogen embrittlement that may occur during the cathodic treatment, and to further oxidize and remove residual organic contaminants. Simultaneously, ultrasonic vibration is used throughout the process, utilizing its cavitation effect to thoroughly clean the complex geometric interior of the CT tube and the tooling gaps. An online alkalinity sensor monitors the bath solution status in real time, enabling automated replenishment and ensuring the stability and reproducibility of the degreasing process. Finally, after thorough deionized water rinsing, a highly active and completely clean metal surface is provided for subsequent processes. S302: Purify the CT tube after electrolytic degreasing; In this step, the CT tube, after electrolytic degreasing and thorough cleaning with deionized water, is precisely transferred by an automated robotic arm to a closed intelligent activation station integrating an acid mist suppression and exhaust gas spray neutralization system. The tube is then completely immersed in a composite acid etching solution (such as a mixture of 5 vol% to 30 vol% nitric acid, an appropriate amount of hydrogen peroxide, and a grain boundary corrosion inhibitor) with constant temperature (20±2℃) and online concentration monitoring. A multi-axis swing mechanism driven by a servo motor drives the CT tube to perform three-dimensional precision oscillation at a specific frequency and angle, ensuring that the complex geometric inner cavity and outer surface of the tube receive uniform micro-etching activation for 120s to 180s, thereby thoroughly removing the oxide film and exposing fresh, highly active crystal lattices. Afterward, the tube undergoes multi-stage countercurrent spraying and ultrasonic rinsing with ultrapure water, providing an interface with atomic-level cleanliness and optimal adhesion for subsequent electroplating. It should be noted that after electrolytic degreasing, although the surface of the CT X-ray tube is free of oil, a very thin, invisible oxide film (such as Cu2O or CuO) or alkali film will form. This film severely hinders the formation of direct and strong metallic bonds between the base metal and the coating metal. Acid etching can destroy this barrier, exposing the highly reactive metal lattice structure on the surface of the CT X-ray tube. Furthermore, acid etching increases the free energy of the CT X-ray tube surface, allowing the plating solution to effectively wet the surface and ensuring that metal ions in the solution can unimpededly access every corner of the tube, laying the foundation for obtaining a uniform and leak-free coating. More importantly, due to the slight corrosive effect of acid, microscopic, peak-and-valley-shaped pits are formed on the tube surface, increasing the contact area between the coating and the tube. This allows the subsequently deposited coating to embed into these microscopic pits, forming a strong mechanical interlock.

[0027] In summary, acid etching provides a highly clean, micro-rough, and highly active metal surface for subsequent electroplating processes, ensuring a strong and coherent metallic bond between the coating and the CT tube, preventing peeling and flaking of the coating. If the acid etching step is skipped, even if the CT tube surface appears clean, the coating will only be deposited on the invisible oxide film, resulting in extremely poor adhesion between the coating and the tube. Under stress or heat, the coating will easily peel off in whole pieces, like tape, thus affecting the electroplating quality.

[0028] S303: Hard chrome plating is performed on the electroplating area of ​​the cleaned CT tube to form a hard chrome plating layer in the electroplating area of ​​the CT tube. In this step, during the hard chrome plating process, the purified CT tube is first connected to the negative electrode of the rectifier as the cathode, and a custom-designed shaped auxiliary anode based on the three-dimensional structure of the tube shell is connected to the positive electrode of the rectifier. Precise control of the current density in different areas is achieved through an independent power supply module. Secondly, the CT tube is immersed in a composite chrome plating solution at 65°C to 75°C (its components are chromic anhydride 200g / L to 300g / L, sulfate 2g / L to 3g / L, and oxalic acid 8g / L to 15g / L). With the addition of L, boric acid (1g / L to 10g / L) and low-carbon alkyl sulfonic acid (1g / L to 5g / L), under the action of pulse power supply and mechanical and air-assisted stirring, chromate ions in the plating solution are efficiently reduced on the cathode surface. By adjusting the pulse parameters (on and off time and peak current), the coating dispersion ability is effectively improved and the internal stress is reduced, thereby depositing a dense, uniform and bright hard chromium coating on the surface of the X-ray tube within 5 to 10 minutes, providing a foundation for the subsequent black chromium coating.

[0029] S304: A black chrome layer is formed by electroplating on a hard chrome plating layer.

[0030] In this step, the CT tube with a hard chromium plating is transferred to a black chromium plating bath equipped with a two-stage cascade precision refrigeration system (temperature control accuracy ±0.5℃). The bath solution consists of 220 g / L to 400 g / L chromic anhydride, 5 g / L to 15 g / L sodium nitrate, 20 g / L to 30 g / L boric acid, 0.1 g / L to 0.5 g / L special additives, and 1.5 g / L to 2.5 g / L rare earth additives. The CT tube is used as the cathode and connected to the pulse power supply. The pictographic auxiliary anode, which is digitally designed according to the tube shell morphology, adopts a zoned independent power supply technology. The deposition rate of each area is adjusted by real-time current density feedback. In a low-temperature environment of 5℃ to 30℃, eddy current stirring and cathode movement are turned on. Utilizing the cathode polarization and anode stripping effect of the pulse reverse (PR) power supply, after 20 min to 25 min of electrodeposition, a finely crystalline, firmly bonded, high-hardness, and excellent thermal radiation performance (emissivity > 0.9) velvety black chromium plating layer is finally formed on the surface of the hard chromium plating layer of the CT tube.

[0031] In another exemplary embodiment, the method further includes the following step: S400: post-processing the CT tube on which the electroplating layer is formed.

[0032] In this embodiment, the post-processing of the CT tube with the electroplated layer includes the following steps: First, a short-pulse fiber laser is used to selectively scan the surface of the black chromium plating layer. By precisely controlling the energy density, the surface of the plating layer is micro-melted and recrystallized, thereby eliminating micro-cracks and pores and improving the adhesion between the plating layer and the CT tube. Subsequently, the laser-scanned CT tube is transferred to a chemical vapor deposition (CVD) furnace, and a silicon-containing precursor gas is introduced at a low temperature (<200°C). Utilizing the high activity of the pre-treated plating surface, the gas... The penetration and reaction of phase molecules into the microstructure generates an amorphous SiO2 nanolayer to completely seal defects on the surface of the CT tube. Finally, an ultrathin (~50 nm), dense yttrium oxide (Y2O3) nanocoating with extremely high thermal stability is constructed on the surface of the CT tube using atomic layer deposition (ALD) technology. This coating can not only further inhibit high-temperature oxidation and chromium volatilization, but also improve the radiation coefficient and anti-carbon deposition ability of the CT tube surface, ultimately obtaining a composite functional surface with excellent mechanical properties, extreme environmental stability and high heat dissipation efficiency.

[0033] It should be noted that if the CT tube with the electroplated layer is not post-treated, the micro-cracks and pores in the black chromium plating layer cannot be effectively sealed, thereby reducing its adhesion to the substrate. In subsequent high temperature, high humidity or mechanical stress environments, these pores become channels for corrosive media to penetrate, leading to peeling and flaking of the plating layer. At the same time, the thermal radiation performance of the unsealed and unstrengthened plating surface will deteriorate due to high temperature oxidation and chromium volatilization under the long-term high temperature operation of the CT tube, and may be accelerated by surface defects, ultimately seriously affecting the long-term heat dissipation stability, environmental tolerance and service life of the product.

[0034] In another exemplary embodiment, this application also provides an electroplating fixture for mounting a CT tube, such as... Figure 2 As shown, the electroplating fixture includes: a first hanger 5 and a second hanger 6. Both the first hanger 5 and the second hanger 6 include a hanging rod and a hook. The hanging rods of the first hanger 5 and the second hanger 6 are integrally connected on one side by a connector 8. The middle part of the hanging rod is connected by two symmetrically arranged bakelite boards 7 of the same specification, and an insulating gap is left between the two symmetrically arranged bakelite boards 7. The fixture also includes a fixing structure for fixing the CT tube. The fixture also includes a figurative auxiliary anode 1, which is located inside the cavity of the CT tube and one end is connected to the bottom of the CT tube.

[0035] In this embodiment, the fixture uses the first hanger 5 and the second hanger 6 as the main suspension components. The integral molding of the connector 8 ensures overall rigidity. The symmetrically arranged bakelite boards 7 in the middle of the hanging rod provide insulation support to prevent short circuits. The CT tube is fixed to the fixture via a fixing structure, preventing displacement or vibration during electroplating. A shaped auxiliary anode, customized according to the internal shape of the CT tube, is placed inside the tube cavity and connected to the bottom. This shaped auxiliary anode acts as the anode during electroplating, forming a uniform electric field distribution, thus ensuring consistent deposition of hard chrome and black chrome layers on the complex geometric surface of the CT tube. The entire fixture is suspended in the electroplating tank and connected to the power system via hooks, enabling precise current control and ensuring the uniformity, adhesion, and heat dissipation performance of the plating layer.

[0036] In another exemplary embodiment, reference continues to be made to... Figure 2 The tooling also includes a copper busbar 4, one end of which is connected to the side of the pictographic auxiliary anode 1 that is not connected to the bottom of the CT tube, and the other end of which passes through the insulation gap between two symmetrically arranged bakelite boards 7 and extends along the direction of the hook on the other side of the hanging rod of the first hanging piece 5 and the second hanging piece 6.

[0037] In this embodiment, the copper busbar 4 can be used to construct an efficient current path from the figurative auxiliary anode 1 to the external power supply. One end of the copper busbar is reliably connected to the upper end of the figurative auxiliary anode 1 located inside the CT tube cavity, conducting the current to the auxiliary anode. The other end passes through the insulation gap between the two bakelite boards 7 and extends along the hanging rod towards the hook, finally connecting to the positive terminal of the rectifier outside the electroplating tank through the hook. This layout utilizes the excellent conductivity of the copper busbar 4 to ensure that the current can be transmitted stably and with low loss to the figurative auxiliary anode. At the same time, its design of passing through the insulating bakelite board can effectively prevent the current from leaking to other parts of the tooling during transmission. This ensures that the current can be concentrated and accurately released through the figurative auxiliary anode 1 during the electroplating process, thereby forming a uniform electric field distribution on the complex inner surface of the CT tube, laying the foundation for achieving a high-quality, uniformly thick functional coating.

[0038] In another exemplary embodiment, such as Figure 3 and Figure 4As shown, the fixing structure includes a first clamping plate 3 and a second clamping plate 9. The first clamping plate 3 is located between the connector 8 and the CT tube. The first clamping plate 3 includes a first base 3-1. A circular groove 3-2 is provided on the side of the first base 3-1 facing the CT tube, and the bottom end of the CT tube is located in the circular groove 3-2. The first base 3-1 is also symmetrically provided with a first threaded hole 3-3, a through hole 3-5 symmetrically provided with the same direction as the first threaded hole 3-3, and a first perforation orthogonal to the directions of the first threaded hole 3-3 and the through hole 3-5. The hollow structure 3-5 includes a connector 8 that is fixedly connected to the first base 3-1 through a through hole 3-4; the second clamping plate 9 is located inside the CT tube (not shown in the figure) and includes a second base 9-1, on which second threaded holes 9-3 are symmetrically arranged, and a second hollow structure 9-2 that is symmetrically arranged orthogonal to the direction of the second threaded holes 9-3 is also arranged; in addition, the symmetrically arranged second threaded holes 9-3 correspond to the symmetrically arranged first threaded holes 3-3, and the symmetrically arranged second hollow structure 9-2 corresponds to the symmetrically arranged first hollow structure 3-5.

[0039] In this embodiment, the circular groove of the first clamping plate 3 is used to initially support and radially limit the bottom end of the CT tube. Subsequently, by fasteners passing through the corresponding first and second threaded holes, the second clamping plate 9 forms an axial clamp with the first clamping plate 3 inside the tube, thus firmly holding the tube. In addition, the symmetrically arranged through holes 3-5 are used to fix the connector 8 to the first base 3-1, which can ensure the stability of the entire fixture. The orthogonally arranged first and second hollow structures have multiple technical effects: on the one hand, they can reduce the overall weight of the first clamping plate 3 and the second clamping plate 9, reducing the load on the fixture; on the other hand, they can provide a smooth flow channel for the electroplating solution, ensuring full contact between the inner and outer surfaces of the tube shell and the electrolyte, thereby helping to avoid the formation of electroplating blind spots and providing a good foundation for the tube to obtain a coating with uniform thickness and excellent adhesion in complex electroplating environments.

[0040] Figure 5 This is a schematic diagram of the electroplated CT tube coating surface under non-light illumination, provided in another embodiment of this application; Figure 6 This is a schematic diagram of the electroplated coating surface of a CT tube under illumination, provided in another embodiment of this application. Figure 5 and Figure 6As can be seen, the CT tube plating surface after electroplating based on the scheme described in this application exhibits a uniform black, grayish-black, or pure black color, without any perceptible color deviation or local color difference. Moreover, the plating completely covers the substrate without any defects such as missed plating or exposed substrate. Furthermore, on a macroscopic scale, the plating surface is smooth and dense, without obvious pinholes, pits (diameter ≤0.3mm and unit area density meets requirements), bubbles, or peeling. This fully demonstrates the excellent ability of the process described in this application to form a uniform, complete, and high-quality black chromium functional plating on the surface of complex workpieces. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A method for electroplating a CT X-ray tube, characterized in that, The method includes: Insulate and shield the CT tube; Install the insulated and shielded CT tube; The mounted CT tube is immersed in an electroplating solution for electroplating to obtain a CT tube with an electroplated layer.

2. The method according to claim 1, characterized in that, The insulation and shielding of the CT tube includes: Clean the outer surface of the CT tube; The outer surface of the cleaned CT tube is coated with a shielding material and then cured.

3. The method according to claim 2, characterized in that, The process of immersing the mounted CT tube in an electroplating solution for electroplating to obtain a CT tube with an electroplated layer includes: Electrolytic degreasing is performed on the mounted CT tube; The CT tube is purified after electrolytic degreasing. Hard chrome plating is performed on the electroplating area of ​​the cleaned CT tube to form a hard chrome plating layer in the electroplating area of ​​the CT tube. A black chrome layer is formed by electroplating on the hard chrome plating layer.

4. The method according to claim 3, characterized in that, The electrolytic degreasing of the mounted CT tube includes: The mounted CT tube is immersed in an electrolytic degreasing tank equipped with an ultrasonic-assisted and periodic commutation current system. A periodic commutation current is applied to the periodic commutation current system to switch the polarity of the CT tube, thereby achieving electrolytic degreasing.

5. The method according to claim 3, characterized in that, The purification of the CT tube after electrolytic degreasing includes: The CT tube after electrolytic degreasing is immersed in a composite acid etching solution; The CT tube immersed in the composite acid etching solution was vibrated. The CT tube was rinsed after oscillation.

6. The method according to claim 3, characterized in that, The process of electroplating hard chrome in the electroplating area of ​​the cleaned CT tube to form a hard chrome plating layer in the electroplating area of ​​the CT tube includes: The purified CT tube is connected to the negative terminal of the rectifier as the cathode. The CT tube is immersed in a composite chromium plating solution, and the solution is stirred to perform hard chromium plating on the CT tube.

7. The method according to claim 3, characterized in that, The process of electroplating a black chromium layer onto a hard chromium plating layer includes: The CT tube with a hard chrome plating is transferred to a black chrome plating bath. The CT tube is connected as the cathode pre-pulse power supply, and a black chromium layer is formed by electrodeposition on the hard chromium plating layer.

8. An electroplating fixture for mounting CT tubes, characterized in that, The electroplating fixture includes: The first and second hanging accessories both include a hanging rod and a hook. The first and second hanging rods are integrally connected on one side by a connector. The middle part of the hanging rod is connected by two symmetrically arranged bakelite boards of the same specifications, and an insulation gap is left between the two symmetrically arranged bakelite boards. The fixture also includes a fixing structure for fixing the CT tube; The tooling also includes a figurative auxiliary anode, which is located inside the lumen of the CT tube and one end is connected to the bottom of the CT tube.

9. The electroplating fixture according to claim 8, characterized in that, The tooling also includes: Copper busbar, One end of the copper busbar and the side of the shaped auxiliary anode that is not connected to the bottom of the CT tube are connected. The other end of the copper busbar passes through the insulating gap between two symmetrically arranged bakelite boards and extends along the direction of the hook on the other side of the hanging rod of the first and second hangers.

10. The electroplating fixture according to claim 8, characterized in that, The fixing structure includes: First clamping plate and second clamping plate, wherein... The first clamp is located between the connector and the CT tube. The first clamp includes a first base. A circular groove is provided on the side of the first base facing the CT tube, and the bottom end of the CT tube is located in the circular groove. The first base is also symmetrically provided with a first threaded hole, a through hole symmetrically provided with the same direction as the first threaded hole, and a first hollow structure symmetrically provided with the same direction as the first threaded hole and the through hole. The connector is fixedly connected to the first base through the through hole. The second clamp is located inside the CT tube and includes a second base. The second base is symmetrically provided with second threaded holes and a second hollow structure symmetrically provided with the direction of the second threaded holes. The symmetrically arranged second threaded holes correspond to the symmetrically arranged first threaded holes, and the symmetrically arranged second hollow structure corresponds to the symmetrically arranged first hollow structure.

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