Sampling circuit board and energy storage system

Abstract

The invention discloses a sampling circuit board and an energy storage system, the sampling circuit board comprises a signal sampling interface, an output interface, a controller, a plurality of conditioning circuits and a plurality of sampling devices which are arranged on a printed circuit board, each conditioning circuit is connected with the corresponding sampling device through the signal sampling interface, the output interface is connected with an upper computer, and the controller is connected with the upper computer. The conditioning circuit is used for sampling through a corresponding sampling device and processing a sampling signal to obtain an analog signal; and the controller is used for calibrating the plurality of conditioning circuits according to the calibration parameters stored in the controller or the external storage equipment, and is also used for converting the analog signals obtained by each conditioning circuit into digital signals and sending the digital signals to the upper computer. Therefore, by arranging the conditioning circuit and the corresponding sampling device on the same printed circuit board, decoupling of the controller and the conditioning circuit and the corresponding sampling device on the same printed circuit board is realized, and the maintenance cost is reduced on the basis of ensuring the sampling precision.

Description

Technical Field

[0001] This application relates to the field of circuit technology, and in particular to a sampling circuit board and an energy storage system. Background Technology

[0002] Currently, energy storage systems need to estimate the SOC (state of charge) in real time to enable battery management, system performance optimization, user experience improvement, and battery life protection.

[0003] The accuracy of the State of Charge (SOC) depends on the sampling accuracy of the energy storage system (such as the accuracy of current and voltage sampling). To improve the sampling accuracy of the energy storage system, software calibration of sampling signals such as voltage and current is required. However, calibration parameters are generally stored in the system controller. When the system controller is damaged and replaced, the calibration parameters stored in the new system controller may differ from the original calibration parameters, resulting in sampling accuracy failing to meet the standard. Summary of the Invention

[0004] To address the aforementioned issues, this application provides a sampling circuit board and an energy storage system, aiming to improve sampling accuracy.

[0005] The embodiments of this application disclose the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a sampling circuit board, including: a plurality of conditioning circuits and a plurality of sampling devices disposed on the printed circuit board; the printed circuit board is also provided with a signal sampling interface, an output interface and a controller; each conditioning circuit is connected to a corresponding sampling device through the signal sampling interface; the output port is connected to a host computer.

[0007] The conditioning circuit is used to sample the signal through the corresponding sampling device and process the sampled signal to obtain an analog signal;

[0008] The controller is used to calibrate multiple conditioning circuits according to calibration parameters; it is also used to convert the analog signals obtained by each conditioning circuit into digital signals and send the digital signals to the host computer; wherein, the calibration parameters are stored in the controller or an external storage device.

[0009] Optionally, it also includes: a temperature acquisition device; the temperature acquisition device is disposed on the printed circuit board; and a controller, which is also used to acquire the temperature of the printed circuit board through the temperature acquisition device and compensate the analog signal obtained by the conditioning circuit according to the temperature.

[0010] Optionally, when the conditioning circuit is a current sampling circuit, the sampling device corresponding to the current sampling circuit is one of a shunt, a current transformer, or a Hall effect sensor.

[0011] Optionally, when the sampling device corresponding to the current sampling circuit is a shunt, it further includes: an isolation operational amplifier component; the isolation operational amplifier component is disposed between the separator and the current sampling circuit; the distance between the primary side and the secondary side of the isolation operational amplifier component is greater than a first preset distance.

[0012] Optionally, when the sampling device corresponding to the current sampling circuit is a current transformer, the distance between the primary side and the secondary side of the current transformer is greater than the second preset distance;

[0013] When the sampling device corresponding to the current sampling circuit is a Hall effect sensor, the distance between the primary and secondary sides of the Hall effect sensor is greater than the third preset distance.

[0014] Optionally, when the conditioning circuit is a voltage sampling circuit, the sampling device corresponding to the voltage sampling circuit is one of a voltage transformer, a voltage divider resistor, or a Hall sensor.

[0015] Optionally, when the sampling device corresponding to the voltage sampling circuit is a plurality of voltage divider resistors, the distance between two adjacent voltage divider resistors is greater than a fourth preset distance;

[0016] Alternatively, when the sampling device corresponding to the voltage sampling circuit is a plurality of voltage divider resistors, it also includes an isolation operational amplifier component; the isolation operational amplifier component is disposed between the last two adjacent voltage divider resistors among the plurality of voltage divider resistors; the distance between the primary side and the secondary side of the isolation operational amplifier component is greater than a fifth preset distance.

[0017] Optionally, when the sampling device corresponding to the voltage sampling circuit is a voltage transformer, the distance between the primary and secondary sides of the voltage transformer is greater than a sixth preset distance.

[0018] Optionally, the controller is wired to the host computer via an isolation device, and the distance between the primary and secondary sides of the isolation device is greater than a seventh preset distance;

[0019] Alternatively, the controller can be wirelessly connected to the host computer.

[0020] Optionally, when the sampling device is a shunt, the shunt is fixed to the bottom layer of the printed circuit board by screws, soldering, or glue.

[0021] Secondly, embodiments of this application provide an energy storage system, which includes a system controller, an energy storage converter and / or a battery cluster, and a sampling circuit board as described in the first aspect.

[0022] Compared with the prior art, this application has the following beneficial effects:

[0023] The sampling circuit board provided in this application includes a signal sampling interface, an output interface, a controller, multiple conditioning circuits, and multiple sampling devices disposed on a printed circuit board. Each conditioning circuit is connected to the corresponding sampling device through the signal sampling interface, and the output port is connected to a host computer. The conditioning circuit is used to sample through the corresponding sampling device and process the sampled signal to obtain an analog signal. The controller is used to calibrate the multiple conditioning circuits according to the calibration parameters stored in the controller or external storage device, and is also used to convert the analog signals obtained by each conditioning circuit into digital signals and send the digital signals to the host computer.

[0024] Thus, in this embodiment, the conditioning circuit and the corresponding sampling device are placed on the same printed circuit board, that is, the conditioning circuit and the corresponding sampling device are bundled on the same printed circuit board, thereby decoupling the controller from the conditioning circuit and the corresponding sampling device on the same printed circuit board. If the controller is damaged, the replacement controller can be used to calibrate all the conditioning circuits on the printed circuit board without replacing the whole machine, thus reducing maintenance costs while ensuring sampling accuracy. If the conditioning circuit or the sampling device is damaged, only the corresponding conditioning circuit and the sampling device can be replaced without replacing the whole machine, resulting in low maintenance costs. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of a switch box or DC-DC converter provided for related technologies;

[0027] Figure 2 A schematic diagram of a conditioning circuit provided for related technologies;

[0028] Figure 3 This is a schematic diagram of the structure of a sampling circuit board provided in an embodiment of this application;

[0029] Figure 4 A schematic diagram illustrating the insulation method of a current sampling circuit provided in an embodiment of this application;

[0030] Figure 5 A schematic diagram illustrating the insulation method of a voltage sampling circuit provided in an embodiment of this application;

[0031] Figure 6 A schematic diagram illustrating a communication insulation method provided in an embodiment of this application;

[0032] Figure 7 A first schematic diagram of a printed circuit board and a shunt provided in an embodiment of this application;

[0033] Figure 8 A second schematic diagram of a printed circuit board and a shunt provided in an embodiment of this application;

[0034] Figure 9 This is a third schematic diagram of a printed circuit board and a shunt provided in an embodiment of this application. Detailed Implementation

[0035] Currently, in energy storage systems of this technology, some sampling devices and conditioning circuits are not located on the same printed circuit board (PCB). Figure 1 As shown, Figure 1 A schematic diagram of a switch box or DC-DC converter is shown. Figure 1 The sampling device (shunt R1) shown is located in the main circuit. The control system A1 may be located on the same PCB, or it may be located on two or more PCBs to maintain structural size compatibility. Because the sampling devices corresponding to the conditioning circuit in control system A1 are distributed, software calibration conditions may be limited, requiring calibration of the entire system. However, due to the large size and weight of the entire system, whole-system calibration is difficult to achieve.

[0036] Since the calibration parameters are stored in the control system A1 and are only valid for the current conditioning circuit, if the control system A1 is damaged and only the control system A1 board is replaced, the new board is the same as the old board in terms of hardware. However, due to minor differences in the production process (such as component tolerance, layout and wiring, etc.), the conditioning circuit on the new control system A1 may have slight differences in electrical characteristics compared to the conditioning circuit on the old control system A1. These differences will cause the original calibration parameters to no longer be applicable, thereby reducing the sampling accuracy.

[0037] Therefore, if a component on the control system A1 is damaged, the entire machine needs to be replaced, which increases maintenance costs and is inconvenient.

[0038] To address the aforementioned problems, this application provides a sampling circuit board and an energy storage system. The sampling circuit board includes a signal sampling interface, an output interface, a controller, multiple conditioning circuits, and multiple sampling devices mounted on a printed circuit board. Each conditioning circuit is connected to its corresponding sampling device via the signal sampling interface, and its output port is connected to a host computer. The conditioning circuits are used to sample signals through their respective sampling devices and process the sampled signals to obtain analog signals. The controller is used to calibrate the multiple conditioning circuits according to calibration parameters stored in the controller or an external storage device, and also to convert the analog signals obtained by each conditioning circuit into digital signals and send the digital signals to the host computer.

[0039] Thus, in this embodiment, the conditioning circuit and the corresponding sampling device are placed on the same printed circuit board, that is, the conditioning circuit and the corresponding sampling device are bundled on the same printed circuit board, thereby decoupling the controller from the conditioning circuit and the corresponding sampling device on the same printed circuit board. If the controller is damaged, the replacement controller can be used to calibrate all the conditioning circuits on the printed circuit board without replacing the whole machine, thus reducing maintenance costs while ensuring sampling accuracy. If the conditioning circuit or the sampling device is damaged, only the corresponding conditioning circuit and the sampling device can be replaced without replacing the whole machine, resulting in low maintenance costs.

[0040] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0041] To facilitate understanding of the following embodiments, the nouns or technical terms that may appear in the following embodiments will first be explained:

[0042] State of Charge (SOC) refers to the remaining charge of the battery. SOC reflects the ratio of remaining usable charge to the charge level after a period of use or storage.

[0043] A PCB (Printed Circuit Board) is an important electronic component and a crucial part of electronic products. The main function of a PCB is to transfer circuit patterns from a physical circuit board onto printed circuit lines, forming a functional circuit structure.

[0044] A sampling device is a device or component that observes the value of an input variable at a specific time and converts it into a sampled output variable.

[0045] A signal conditioning circuit, also known as a signal conditioning circuit, is a circuit used to acquire, process, and condition analog signals. This process typically includes operations such as amplifying, buffering, and scaling the analog signal to make it suitable for the input of an analog-to-digital converter (ADC). For example... Figure 2 As shown, Figure 2 A schematic diagram of a conditioning circuit is shown. The conditioning circuit receives a sampled signal through a signal input port and sends the conditioned sampled signal to a controller (such as an MCU).

[0046] MCU (Microcontroller Unit), also known as a single-chip microcomputer, is a small computer system that integrates a microprocessor core, memory, input / output interfaces, and other functional modules.

[0047] The AD (Analog-to-Digital) function is a function that converts continuously changing analog signals into discrete digital signals.

[0048] An operational amplifier (op amplifier) ​​is an electronic circuit component with special functions. Its operation is based on a feedback control mechanism. When an input signal is applied to the op amplifier's input, the amplifier amplifies the signal and outputs it. The feedback loop feeds a portion of the output signal back to the op amplifier's input, thereby controlling the output signal and changing the amplifier's gain. Specifically, if the feedback signal is the same as and inversely opposite to the input signal, they cancel each other out, thus reducing the gain; conversely, if the feedback signal is opposite to and forward-biased to the input signal, they add together, increasing the amplifier's gain.

[0049] A voltage divider resistor is a simple circuit element that divides voltage using resistors connected in series in a circuit. In voltage sampling circuits, voltage divider resistors are often used to reduce the voltage to be measured to the input range of an ADC or operational amplifier.

[0050] A current transformer (CT) is a special type of transformer whose primary winding is connected in series with the circuit being measured, while its secondary winding is connected in series with the measuring instrument or protection circuit. When current flows through the primary winding, an induced electromotive force is generated in the secondary winding. By measuring the current or voltage in the secondary winding, the current in the primary winding can be calculated.

[0051] A Hall effect sensor is a sensor based on the Hall effect, which uses a Hall element to convert changes in magnetic field into changes in electrical charge. When a magnetic field changes the direction of motion of charge carriers in a conductor, these charge carriers deviate from their original paths, inducing an electric potential. This potential can be measured by a Hall effect sensor, and the magnitude of voltage or current can be indirectly obtained from the potential.

[0052] A voltage follower (also known as a unity-gain amplifier, buffer amplifier, or isolation amplifier) ​​is a special type of operational amplifier circuit with a voltage gain of 1, meaning its output voltage directly follows the input voltage, and the two are numerically equal. Due to its high input impedance and low output impedance, the voltage follower can effectively isolate preceding and following circuits, preventing mutual interference between them.

[0053] Analog signals are continuously varying signals that are smooth and continuous in time or space. Analog signals can represent continuous changes in any physical quantity, such as sound, temperature, pressure, and images. In analog signals, information is represented through continuously varying parameters such as amplitude, frequency, and phase.

[0054] A sampled signal is an intermediate step in the analog-to-digital signal conversion process. Sampling refers to the process of measuring the amplitude of an analog signal at regular time intervals (called the sampling period or sampling rate). Through sampling, the continuous time axis of the analog signal is discretized, but the value at each sampling point remains analog (i.e., continuous). The sampled signal is called a sampled signal or a discrete-time signal. A sampled signal retains the information of the analog signal at the sampling points but removes the temporal continuity.

[0055] A digital signal is a discrete signal, discrete in both time and amplitude. A digital signal consists of a series of discrete numerical values ​​(usually binary numbers) that represent the amplitude or state of the signal.

[0056] EEPROM (Electrically Erasable Programmable Read-Only Memory) refers to electrically erasable programmable read-only memory.

[0057] FLASH is a non-volatile memory, meaning that data will not be lost after power is turned off.

[0058] NAND Flash is a type of non-volatile memory based on NAND technology.

[0059] An SD (Secure Digital) card is a type of memory card used to store digital data.

[0060] An NTC (Negative Temperature Coefficient) resistor is a type of resistor with unique electrical properties. An NTC resistor is a thermistor whose resistance decreases exponentially with increasing temperature.

[0061] The primary side refers to the electrical input terminal, also known as the high-voltage side or primary winding. It refers to the coil where the power source is connected. When current flows through the primary side, a magnetic flux is generated in the iron core, inducing a voltage. The primary side typically consists of a multi-turn coil, with the number of turns determining the magnitude of the induced voltage. The main function of the primary side is to input electrical energy from the power source into the transformer and convert it into magnetic energy through magnetic induction.

[0062] The secondary side refers to the power output terminal, also known as the low-voltage side or secondary winding. When electromagnetic lines of force are induced in the primary side to form a magnetic field in the iron core, a voltage is also induced on the secondary side, thus outputting electrical energy. The main function of the secondary side is to output the electrical energy converted by the transformer to the load, thereby achieving efficient utilization and distribution of electrical energy. The output voltage and current of the secondary side are inversely proportional to the input voltage and current of the primary side.

[0063] ARM (Advanced RISC Machines) is a high-performance, low-power Reduced Instruction Set Computer (RISC) architecture. ARM processors are widely used in various embedded systems, such as smartphones, tablets, smart wearable devices, and network equipment.

[0064] A DSP (Digital Signal Processor) is a microprocessor specifically designed for digital signal processing. Compared to general-purpose processors (such as ARM), DSPs are specially designed in terms of architecture, instruction set, and instruction system, enabling them to execute digital signal processing algorithms at high speed.

[0065] See Figure 3 This figure is a schematic diagram of a sampling circuit board provided in an embodiment of this application, combined with... Figure 3 As shown, the sampling circuit board provided in this application embodiment may include: a plurality of conditioning circuits 301, a plurality of sampling devices 302, a signal sampling interface 303, an output interface 304 and a controller 305 disposed on a printed circuit board; each conditioning circuit 301 is connected to the corresponding sampling device 302 through the signal sampling interface 303; the output port 304 is connected to a host computer.

[0066] It should be noted that since one side of the printed circuit board has circuitry printed on it (called the top layer or front side) and the other side has no printing (called the bottom layer or back side), multiple conditioning circuits, signal sampling interfaces, output interfaces and controllers are located on the top layer, while sampling devices are located on the bottom layer of the printed circuit board.

[0067] The signal sampling interface 303 is used to connect the conditioning circuit and the corresponding sampling device. The number of signal sampling interfaces can be determined according to one or more of the user requirements, the number of current sampling channels, or the number of voltage sampling channels M, and is not specifically limited here.

[0068] Output port 304 is used to realize communication between the controller and the host computer. The number of output ports can be one or more. The number of output ports is determined by the system wiring method or user requirements, and is not specifically limited here.

[0069] As one possible implementation, in this embodiment of the application, the connection between the conditioning circuit 301 and the sampling device 302 through the signal sampling interface can be understood as bundling the conditioning circuit and the sampling device together and encapsulating them into a module (referred to as a sampling module). Subsequent processing and calibration of the conditioning circuit are all performed on a unit basis using the sampling module.

[0070] The conditioning circuit 301 is used to sample the signal through the corresponding sampling device 302 and process the sampled signal to obtain an analog signal.

[0071] The controller 305 is used to calibrate multiple conditioning circuits 301 according to calibration parameters; it is also used to convert the analog signals obtained by each conditioning circuit 301 into digital signals and send the digital signals to the host computer; wherein, the calibration parameters are stored in the controller 305 or an external storage device.

[0072] Calibration parameters refer to the parameters used to calibrate the conditioning circuit. External storage devices refer to devices used to store calibration parameters, such as EEPROM, FLASH, NAND FLASH, SD cards, etc., without specific limitations here.

[0073] It should be understood that the controller has an AD function, which is to convert analog signals into digital signals, so that the host computer can analyze and process the received digital signals.

[0074] It should be understood that since multiple conditioning circuits and sampling devices involved in the system are all located on the same printed circuit board, calibration of the conditioning circuits is not limited by the structure and connection relationship of the entire system. The calibration process is simple and convenient. In addition, by pre-storing the calibration parameters, it is convenient to calibrate newly replaced sampling modules (conditioning circuits and corresponding sampling devices) in the future, thereby improving calibration efficiency. At the same time, by storing the calibration parameters on an external storage device, it can be ensured that after the controller is replaced, calibration is performed according to the original calibration parameters, avoiding the reduction in sampling accuracy caused by the difference between the calibration parameters of the new controller and the original calibration parameters. This application does not require the replacement of the entire machine; only the failed or damaged sampling module or controller needs to be replaced and recalibrated, thus reducing maintenance costs while ensuring sampling accuracy.

[0075] Based on the sampling circuit board provided in the above embodiments, further research revealed that the sampling device may be affected by temperature, resulting in a significant error between the acquired sampling signal and the actual sampling signal. To address this technical problem, as a possible implementation, the sampling circuit board may further include a temperature acquisition device disposed on the printed circuit board. The temperature acquisition device refers to a device used to acquire the temperature of the printed circuit board, such as a thermistor, temperature sensor, etc., and is not specifically limited here.

[0076] The controller 305 is also used to acquire the temperature of the printed circuit board through a temperature acquisition device and to compensate the analog signal obtained by the conditioning circuit 301 based on the temperature. It should be understood that, since the sampling device may be non-insulatory and located on the bottom layer of the printed circuit board, in order to ensure the safety of the system, the temperature acquisition device needs to be located on the top layer of the printed circuit board and close to the sampling device, so as to indirectly measure the temperature of the sampling device by measuring the temperature of the printed circuit board.

[0077] Compensating the analog signal obtained by the conditioning circuit 301 based on temperature refers to temperature drift compensation of the analog signal. Temperature drift compensation means that when the temperature changes, a certain method or algorithm is used to correct the measurement error caused by the temperature change, so as to ensure the accuracy and stability of the measurement results.

[0078] As an example, suppose the ambient temperature Ta = 25℃, the sampling device is a shunt, the resistance of the shunt is X, and the coefficient of change of the shunt with temperature is α. At this time, the temperature sampled by the temperature acquisition device is β. Then the resistance at this time is X + α*(β-25), which is α*(β-25) different from the resistance of the shunt at ambient temperature. Therefore, the voltage flowing through the shunt at this time is not I*X, but I*[X + α*(β-25)]. That is, the resistance change caused by temperature is included in the analog signal to reduce sampling error and ultimately improve the current sampling accuracy.

[0079] Based on the sampling circuit board provided in the above embodiments, as one possible implementation, when the conditioning circuit 301 is a current sampling circuit, the sampling device 302 corresponding to the current sampling circuit is one of a shunt, a current transformer, or a Hall effect sensor. A current sampling circuit refers to a circuit that samples the current in a circuit.

[0080] It should be noted that due to the high voltage of energy storage systems and the insulation requirements for various devices and circuits, insulation treatment is necessary. The following section will discuss this further. Figure 4 The insulation method for a current sampling circuit in the conditioning circuit is explained.

[0081] In some possible implementations, combining Figure 4 As shown in Figure a, when the sampling device 302 corresponding to the current sampling circuit is a shunt, it further includes: an isolation operational amplifier component disposed between the separator and the current sampling circuit. The distance between the primary and secondary sides of the isolation operational amplifier component is greater than a first preset distance.

[0082] An isolated operational amplifier (op-amp) is a component that provides electrical isolation between its input, output, and power supply, such as an isolation amplifier. The core function of an isolated op-amp is to provide electrical isolation, preventing direct electrical connections between the input, output, and power supply, thereby avoiding problems such as ground loop interference and common-mode interference.

[0083] In some other possible implementations, combining Figure 4 As shown in b, when the sampling device 302 corresponding to the current sampling circuit is a current transformer, the distance between the primary and secondary sides of the current transformer is greater than a second preset distance; or, when the sampling device 302 corresponding to the current sampling circuit is a Hall effect sensor, the distance between the primary and secondary sides of the Hall effect sensor is greater than a third preset distance.

[0084] It should be understood that since current transformers or Hall effect sensors can perform current acquisition and have electrical isolation functions, the insulation requirements can be met simply by ensuring that the distance between the primary and secondary sides of the current transformer is greater than the second preset distance, or the distance between the primary and secondary sides of the Hall effect sensor is greater than the third preset distance.

[0085] Based on the sampling circuit board provided in the above embodiments, as another possible implementation, when the conditioning circuit 301 is a voltage sampling circuit, the sampling device 302 corresponding to the voltage sampling circuit is one of a voltage transformer, a voltage divider resistor, or a Hall sensor.

[0086] It should be noted that due to the high voltage of energy storage systems and the insulation requirements for various devices and circuits, insulation treatment is necessary. The following section will discuss this further. Figure 5The insulation method for a voltage sampling circuit as a conditioning circuit is explained.

[0087] In some possible implementations, combining Figure 5 As shown in Figure a, when the sampling device 302 corresponding to the voltage sampling circuit is a plurality of voltage divider resistors, the distance between two adjacent voltage divider resistors is greater than a fourth preset distance. It should be understood that voltage sampling can be insulated by voltage divider resistors, that is, ensuring that the loop current is <10mA and the total resistance interval is ≥ the standard total distance, which can meet the insulation requirements.

[0088] In some other possible implementations, combining Figure 5 As shown in b, when the sampling device 302 corresponding to the voltage sampling circuit consists of multiple voltage divider resistors, it also includes an isolation operational amplifier component. The isolation operational amplifier component is positioned between the last two adjacent voltage divider resistors among the multiple voltage divider resistors. The distance between the primary and secondary sides of the isolation operational amplifier component is greater than a fifth preset distance. It should be understood that when space is insufficient or design requirements do not support meeting the fourth preset distance between two adjacent voltage divider resistors, an isolation operational amplifier component can be set to achieve electrical isolation and meet insulation requirements.

[0089] Among some possible implementation methods, combining Figure 5 As shown in Figure c, when the sampling device 302 corresponding to the voltage sampling circuit is a voltage transformer, the distance between the primary and secondary sides of the voltage transformer is greater than the sixth preset distance. It should be understood that since the voltage transformer has the function of collecting voltage and the function of electrical isolation, it is only necessary to ensure that the distance between the primary and secondary sides of the voltage transformer is greater than the sixth preset distance to achieve insulation.

[0090] Based on the sampling circuit board provided in the above embodiments, in one possible implementation, combined with... Figure 6 As shown, the controller 305 is wired to the host computer via an isolation device, or the controller 305 and the host computer are wirelessly connected via a wireless module. When the connection is wired, the controller on the sampling circuit board and the host computer can communicate via RS485, CAN, SPI, I2C, daisy chain, wired network, etc.; when the connection is wireless, the controller and the host computer can communicate via Bluetooth, WIFI, etc.

[0091] The host computer refers to the communication management unit above the controller, such as a circuit composed of ARM, DSP, processor, etc., or a cloud platform, without specific limitations here.

[0092] It should be noted that due to the high voltage of energy storage systems and the insulation requirements for various devices and circuits, insulation treatment is necessary. Combined with... Figure 6As shown, when the controller and the host computer are connected by a wire, the distance between the primary and secondary sides of the isolation device is greater than the seventh preset distance. An isolation device refers to a device that achieves communication isolation, such as an isolation IC. An isolation IC (isolation IC) is a key component in an electronic system used to isolate circuits from different physical parts. Its main purpose is to ensure that the entire system is not disturbed and can operate normally, while improving the system's security and reliability.

[0093] It should be noted that the first, second, third, fourth, fifth, sixth, and seventh preset distances can be determined based on user requirements or actual insulation requirements. The method of determining the preset distances is not limited here. The values ​​of the first, second, third, fourth, fifth, sixth, and seventh preset distances can be the same or different, and this is not limited here either.

[0094] Based on the insulation methods provided in the above embodiments, in some possible implementations, the insulation between the voltage sampling circuit, the current sampling circuit, the controller, and the host computer can be basic insulation, reinforced insulation, or no insulation. The specific insulation strategy depends on the system insulation requirements.

[0095] System insulation refers to the insulation between the high-voltage measurement (voltage sampling or current sampling) and the host computer.

[0096] Enhanced insulation means that the protection against electric shock meets preset requirements to ensure that sufficient protection is still provided in the event of insulation failure or accident, or that maintenance personnel can touch the equipment.

[0097] Basic insulation refers to safety measures that isolate the live parts of electrical equipment from the human body or other objects to prevent electric shock caused by current flow. However, maintenance personnel must not touch the equipment or must not be able to touch the equipment.

[0098] No insulation means that the equipment is not insulated, and maintenance personnel cannot or do not know how to touch the equipment.

[0099] As one possible implementation, if the insulation (system insulation) between the high-voltage side and the host computer is reinforced insulation, then the insulation method is shown in Table 1:

[0100] Table 1: System insulation is reinforced insulation

[0101] Voltage insulation Current insulation Communication insulation System insulation Basic insulation Basic insulation Basic insulation Strengthen insulation No insulation No insulation Strengthen insulation Strengthen insulation Strengthen insulation Strengthen insulation No insulation Strengthen insulation

[0102] It should be understood that when the system insulation is reinforced insulation, the insulation strength of voltage insulation (insulation of the voltage sampling circuit), current insulation (insulation of the current sampling circuit), and communication insulation (communication insulation between the controller and the host computer) must be reinforced insulation. As an example, assuming the insulation class is 0, the basic insulation class is 1, and the reinforced insulation class is 2, then when the system insulation is reinforced insulation, the sum of the insulation classes of voltage insulation, current insulation, and communication insulation must be greater than or equal to 2 to meet the requirements of reinforced insulation.

[0103] As one possible implementation, if the insulation between the high-voltage side and the host computer (system insulation) is basic insulation, then the insulation method is as shown in Table 2:

[0104] Table 2: System insulation is basic insulation

[0105]

[0106]

[0107] It should be understood that when the system insulation is basic insulation, the sum of the insulation levels of voltage insulation, current insulation and communication insulation must be greater than or equal to 1 in order to meet the requirements of reinforced insulation.

[0108] As one possible implementation, if the insulation between the high-voltage side and the host computer (system insulation) is basic insulation, then the insulation method is as shown in Table 3:

[0109] Table 3: System insulation is non-insulated.

[0110] Voltage insulation Current insulation Communication insulation System insulation No insulation No insulation No insulation No insulation

[0111] It should be understood that when the system insulation is basic insulation, it is necessary to ensure that voltage insulation, current insulation and communication insulation can all be exempted from insulation in order to meet the requirements of reinforced insulation.

[0112] Based on the sampling circuit board provided in the above embodiments, in one possible implementation, when the sampling device 302 is a shunt, the shunt is fixed to the bottom layer of the printed circuit board by screw fixing, welding or glue connection.

[0113] Screw-fixed connection refers to fixing the shunt to the bottom layer of the printed circuit board using screws. Figure 7 As shown, the printed circuit board (PCB) has screw holes, and the shunt also has screw holes. The PCB is placed directly on top of the shunt and secured with screws, thus completing the binding (fixed connection) of the PCB and the shunt. The screw-fixed connection offers advantages such as secure fixation, easy disassembly and assembly, and convenient maintenance and replacement.

[0114] Soldering is achieved by welding the pads and pins together using wave soldering or manual soldering methods, thus securing them together. Figure 8 As shown, mounting pads are added to the printed circuit board (PCB), and solder pins are added to the shunt. The number of pads and solder pins depends on the size of the PCB, ensuring sufficient mechanical strength. The PCB is positioned above the shunt, and its vias are placed directly onto the solder pins of the shunt (provided the solder pins and vias on the PCB align perfectly). After wave soldering or manual soldering, the binding process is complete. Soldering provides high mechanical strength and electrical connection stability while reducing the need for additional fasteners.

[0115] Adhesive bonding refers to applying adhesive to the connection points between the printed circuit board and the shunt to secure them together. Figure 9 As shown, the shunt and printed circuit board can be directly stacked together, and the connection can be secured with adhesive. Adhesive bonding is simple and inexpensive, and the adhesive provides cushioning and shock absorption, helping to protect the PCB and shunt from external impacts.

[0116] It should be noted that the above is only an example of using the sampling device as a shunt. The connection method between other sampling devices (such as current transformers, voltage divider resistors, etc.) and the printed circuit board can also refer to the connection method between the shunt and the printed circuit board, and no specific limitation is made here.

[0117] Furthermore, this application also provides an energy storage system, which includes a system controller, an energy storage converter and / or a battery cluster, and a sampling circuit board as described in any of the above embodiments.

[0118] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0119] In the embodiments of this application, the terms "first" and "second" (if they exist) are used only as name identifiers and do not represent the order of first and second.

[0120] The above description is merely one specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A sampling circuit board, characterized in that, include: Multiple conditioning circuits and multiple sampling devices are disposed on a printed circuit board; the printed circuit board is also provided with a signal sampling interface, an output interface and a controller; Each conditioning circuit is connected to its corresponding sampling device via the signal sampling interface; the output port is connected to the host computer. The conditioning circuit is used to sample the signal through a corresponding sampling device and process the sampled signal to obtain an analog signal; The controller is used to calibrate the plurality of conditioning circuits according to calibration parameters; it is also used to convert the analog signals obtained by each conditioning circuit into digital signals and send the digital signals to the host computer; wherein the calibration parameters are stored in the controller or an external storage device.

2. The sampling circuit board according to claim 1, characterized in that, Also includes: Temperature acquisition devices; The temperature acquisition device is mounted on the printed circuit board; The controller is also configured to acquire the temperature of the printed circuit board through the temperature acquisition device, and compensate the analog signal obtained by the conditioning circuit according to the temperature.

3. The sampling circuit board according to claim 1, characterized in that, When the conditioning circuit is a current sampling circuit, the sampling device corresponding to the current sampling circuit is one of a shunt, a current transformer, or a Hall effect sensor.

4. The sampling circuit board according to claim 3, characterized in that, When the sampling device corresponding to the current sampling circuit is a shunt, it further includes: an isolation operational amplifier assembly; the isolation operational amplifier assembly is disposed between the separator and the current sampling circuit; the distance between the primary side and the secondary side of the isolation operational amplifier assembly is greater than a first preset distance.

5. The sampling circuit board according to claim 3, characterized in that, When the sampling device corresponding to the current sampling circuit is a current transformer, the distance between the primary side and the secondary side of the current transformer is greater than the second preset distance. When the sampling device corresponding to the current sampling circuit is a Hall effect sensor, the distance between the primary side and the secondary side of the Hall effect sensor is greater than a third preset distance.

6. The sampling circuit board according to claim 1, characterized in that, When the conditioning circuit is a voltage sampling circuit, the sampling device corresponding to the voltage sampling circuit is one of a voltage transformer, a voltage divider resistor, or a Hall sensor.

7. The sampling circuit board according to claim 6, characterized in that, When the sampling device corresponding to the voltage sampling circuit is a plurality of voltage divider resistors, the distance between two adjacent voltage divider resistors in the plurality of voltage divider resistors is greater than a fourth preset distance; Alternatively, when the sampling device corresponding to the voltage sampling circuit is a plurality of voltage divider resistors, it also includes an isolation operational amplifier component; the isolation operational amplifier component is disposed between the last two adjacent voltage divider resistors among the plurality of voltage divider resistors; the distance between the primary side and the secondary side of the isolation operational amplifier component is greater than a fifth preset distance.

8. The sampling circuit board according to claim 6, characterized in that, When the sampling device corresponding to the voltage sampling circuit is a voltage transformer, the distance between the primary side and the secondary side of the voltage transformer is greater than a sixth preset distance.

9. The sampling circuit board according to any one of claims 1-8, characterized in that, The controller is wired to the host computer via an isolation device, and the distance between the primary and secondary sides of the isolation device is greater than a seventh preset distance. Alternatively, the controller can be wirelessly connected to the host computer.

10. The sampling circuit board according to any one of claims 1-8, characterized in that, When the sampling device is a shunt, the shunt is fixed to the bottom layer of the printed circuit board by screws, welding, or glue.

11. An energy storage system, characterized in that, The energy storage system includes a system controller, an energy storage converter and / or a battery cluster, and a sampling circuit board as described in any one of claims 1-10.

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