Control unit reliability testing device

Abstract

The invention relates to the technical field of control unit working reliability testing, in particular to a control unit reliability testing device, which comprises an environmental stress simulation module, a multi-source signal injection module, a control unit reliability testing module, a control unit reliability testing module and a control unit reliability testing module, the power supply module is used for supplying power to the tested piece; and the data acquisition and analysis module is used for monitoring signals of an equipment test point, an interface connector and the like in real time, determining the operation state of the control unit, and performing reliability evaluation according to the collected data. According to the invention, complex conditions of a chip, a circuit board and a control cabinet working environment can be rapidly simulated in multiple dimensions, so that the reliability of the control unit can be comprehensively evaluated.

Description

Technical Field

[0001] This invention relates to the field of control unit reliability testing technology, and in particular to a control unit reliability testing device. Background Technology

[0002] Control units are crucial components in industrial control, rail transportation, and automotive electronics. As core components of control systems, those using domestically produced chips are vital to the overall system stability. Existing testing equipment often fails to fully simulate the complex environments of real-world operating conditions, leading to reliability issues in practical applications.

[0003] Therefore, there is a need to provide a testing device for evaluating the reliability of control units using domestically produced chips. Summary of the Invention

[0004] To address the aforementioned technical problems, a control unit reliability testing device is provided. This invention can simulate complex conditions in the operating environment of chips, circuit boards, and control chassis in a multi-dimensional and rapid manner to comprehensively evaluate the reliability of the control unit.

[0005] The technical means employed in this invention are as follows: A control unit reliability testing device includes: an environmental stress simulation module, a multi-source signal injection module, a power supply module, and a data acquisition and analysis module, wherein: the environmental stress simulation module is used to simulate environmental conditions, including temperature, humidity, vibration, and air pressure; the multi-source signal injection module is used to simulate signal excitation conditions of different voltages and frequencies; the power supply module is used to provide power to the test piece; and the data acquisition and analysis module is used to monitor signals from the device's test points, interface connectors, etc., in real time, determine the operating status of the control unit, and perform reliability assessment based on the collected data.

[0006] Furthermore, the inputs of the multi-source signal injection module include: digital input, analog input, communication input, and communication interference.

[0007] Furthermore, the environmental stress simulation module integrates temperature control, humidity control, vibration table, and air pressure control devices to achieve environmental simulation.

[0008] Furthermore, the power module provides power to the device under test and other modules, and provides power fluctuation function to the test piece.

[0009] Furthermore, the data acquisition and analysis module integrates testing instruments and thermal imagers to determine the operating status of the control unit, takes the signals from the test points and interface connectors of the real-time monitoring equipment as inputs, establishes a failure model based on the input-output relationship, and performs reliability assessments based on the collected data.

[0010] Furthermore, the control unit reliability testing device can simultaneously apply electrical stress, environmental stress, and mechanical stress to simulate the combined failure mechanism under real working conditions, realize multi-stress coupling testing, and evaluate the welding reliability of the device by using current mutation and temperature rise tests under multi-dimensional stress simulation.

[0011] Compared with the prior art, the present invention has the following advantages: The control unit reliability testing device provided by this invention proposes a multi-dimensional composite environment simulation testing device, which realizes full-condition reliability verification of the control unit through a multi-stress coupling mechanism. The device adopts a modular architecture design, integrating environmental stress simulation, electrical stress loading, mechanical stress excitation, and intelligent analysis systems. It can accurately reproduce composite failure scenarios under real-world operating conditions and evaluate the reliability of the test control unit. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the control unit reliability testing device in this invention. Detailed Implementation

[0014] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present invention or its application or use. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of exemplary embodiments according to the invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0017] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0018] like Figure 1 As shown, this invention provides a control unit reliability testing device, comprising: an environmental stress simulation module, a multi-source signal injection module, a power supply module, and a data acquisition and analysis module, wherein: the environmental stress simulation module is used to simulate environmental conditions, including temperature, humidity, vibration, and air pressure; the multi-source signal injection module is used to simulate signal excitation conditions of different voltages and frequencies; the power supply module is used to provide power to the test piece; and the data acquisition and analysis module is used to monitor signals from equipment test points, interface connectors, etc. in real time, determine the operating status of the control unit, and perform reliability assessment based on the collected data.

[0019] The test device is placed in a separate test chamber, which has clamps to secure the device under test, ensuring a stable connection between the device and the test platform. The tester needs to understand the input conditions and output results, but does not need to understand the specific internal working logic of the device under test.

[0020] In a specific implementation, as a preferred embodiment of the present invention, the inputs of the multi-source signal injection module include: digital inputs (pulse, step signal), analog inputs, communication inputs, and communication interference (noise superposition).

[0021] In a specific implementation, as a preferred embodiment of the present invention, the environmental stress simulation module integrates temperature control, humidity control, a vibration table (simulating mechanical impact vibration) and air pressure control device to achieve environmental simulation.

[0022] In a specific implementation, as a preferred embodiment of the present invention, the power module provides power to the device under test and other modules, and provides power fluctuation function to the test piece.

[0023] In a specific implementation, as a preferred embodiment of the present invention, the data acquisition and analysis module integrates testing instruments and thermal imagers to determine the operating status of the control unit, takes the signals from the test points and interface connectors of the real-time monitoring equipment as inputs, establishes a failure model based on the input-output relationship, and performs a reliability assessment based on the collected data.

[0024] In a specific implementation, as a preferred embodiment of the present invention, the control unit reliability testing device can simultaneously apply electrical stress, environmental stress, and mechanical stress to simulate the composite failure mechanism under real working conditions, realize multi-stress coupling testing, and evaluate the welding reliability of the device by using current mutation and temperature rise tests under multi-dimensional stress simulation.

[0025] Example The device of this invention can be used to perform leakage current testing. The purpose of leakage current testing is to measure unexpected current flow. Using the product at the nominal maximum operating temperature, a differentiation method is used to screen out products with large leakage current deviations. The larger the leakage current deviates from the standard parameter, the worse the product reliability.

[0026] Leakage current testing is an indispensable part of this invention for evaluating reliability characteristics, especially providing key data on power consumption and manufacturing quality. Combined with other conventional testing methods (functional testing, dynamic parameter analysis), it evaluates the reliability performance of the control unit.

[0027] Chassis leakage current testing uses a leakage current tester, connecting one end to the metal casing of the chassis and the other end to ground, measuring the current flowing through the chassis to ground. Circuit board leakage current testing uses a leakage current tester to measure unexpected current between power rails and ground, signal lines and ground, or other conductive paths. Chip-level leakage current testing includes leakage from I / O pins to power rails; a signal simulation module applies specified voltage conditions, and a signal acquisition and analysis module monitors the total current consumption of each pin. This three-tiered testing strategy systematically covers reliability risks from the micro-chip level to the macro-chassis level, ensuring products meet functional reliability and safety compliance requirements.

[0028] This invention employs a method for evaluating soldering reliability using current surge and temperature rise tests to detect the quality and long-term reliability of solder joints inside electronic components that are invisible to the naked eye. The method involves applying a varying current load through a signal simulation module to observe the solder joint's performance under certain conditions, and then analyzing its thermal effects in conjunction with temperature changes to assess soldering quality. This invention establishes a failure correlation model by collecting control unit, circuit board, and chip-level electrical parameters and board-level signals (such as power supply noise spectrum). Specifically, the signal simulation module starts with a low current and gradually increases it until it reaches the expected maximum operating current or even higher to simulate instantaneous overload conditions in actual use. The control unit monitors the response, closely monitoring changes in current and voltage throughout the process, paying particular attention to any abnormal fluctuations or sudden drops, which can be used to assess soldering problems. Before applying additional load, the reference temperature of the device under test surface is recorded. A load is applied and heating is performed, and a thermal imager is used to track temperature changes near the solder joint in real time. The thermal conductivity of the solder joint is judged based on the rate and magnitude of the temperature rise. If the temperature rises abnormally at a certain point, it indicates a potential soldering problem at that location.

[0029] By integrating multidimensional stress simulation, chip-board-chassis collaborative analysis and diagnostic technologies, it solves the problems of traditional testing methods being singular, inefficient, and difficult to pinpoint root causes. It is especially suitable for the research and development, quality control, and rapid aging tests of control units with high reliability requirements, and has significant market and application value.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A control unit reliability testing device, characterized in that, include: The module includes an environmental stress simulation module, a multi-source signal injection module, a power supply module, and a data acquisition and analysis module, among which: The environmental stress simulation module is used to simulate environmental conditions, including temperature, humidity, vibration, and air pressure. The multi-source signal injection module is used to simulate signal excitation conditions with different voltages and frequencies; The power module is used to provide power to the test specimen; The data acquisition and analysis module is used to monitor signals from equipment test points, interface connectors, etc. in real time, determine the operating status of the control unit, and perform reliability assessment based on the collected data.

2. The control unit reliability testing device according to claim 1, characterized in that, The inputs of the multi-source signal injection module include: digital input, analog input, communication input, and communication interference.

3. The control unit reliability testing device according to claim 1, characterized in that, The environmental stress simulation module integrates temperature control, humidity control, vibration table and air pressure control devices to achieve environmental simulation.

4. The control unit reliability testing device according to claim 1, characterized in that, The power module provides power to the device under test and other modules, and provides power fluctuation function to the test piece.

5. The control unit reliability testing device according to claim 1, characterized in that, The data acquisition and analysis module integrates testing instruments and thermal imagers to determine the operating status of the control unit. It takes the signals from the test points and interface connectors of the real-time monitoring equipment as inputs, establishes a failure model based on the input-output relationship, and performs reliability assessments based on the collected data.

6. The control unit reliability testing device according to claim 1, characterized in that, The control unit reliability testing device can simultaneously apply electrical stress, environmental stress, and mechanical stress to simulate the combined failure mechanism under real working conditions, realize multi-stress coupling testing, and evaluate the welding reliability of the device by using current mutation and temperature rise tests under multi-dimensional stress simulation.

Images