Multifunctional USB device capable of being used for infrared circuit configuration

Abstract

The invention discloses a multifunctional USB device capable of being used for infrared circuit configuration, and relates to the technical field of USBs, the multifunctional USB device comprises a USB assembly, a bidirectional level conversion module, a communication module and an infrared signal processing circuit, the USB assembly carries out batch configuration through a register of the infrared signal processing circuit, the communication module supports SPI / UART and I2C protocol transmission, and the bidirectional level conversion module is used for converting the infrared signal processing circuit into the SPI / UART and I2C protocol transmission. The USB assembly is connected with the bidirectional level conversion module and is used for the infrared signal processing circuit to carry out level sequence program control output, and the infrared signal processing circuit is connected with an infrared detector. The multifunctional USB device capable of being used for infrared circuit configuration is used for replacing peripheral equipment and instruments, the operation process is simple, carrying and field debugging are convenient, meanwhile, a personalized configuration interface is further provided for the multifunctional USB device capable of being used for infrared circuit configuration, a user can conveniently modify test conditions and a register batch configuration transmission mode in real time, and the test efficiency is improved. The practical value is improved; and the operation process is simple.

Description

Technical Field

[0001] This invention relates to the field of USB technology, and in particular to a multifunctional USB device that can be configured with infrared circuitry. Background Technology

[0002] An infrared image processing system uses an infrared detector to collect infrared light, converts the optical signal into an electrical signal, and then uses an infrared signal processing circuit to analyze, process, calculate, and output the collected infrared electrical signal. The system then uses the output infrared signal to create an image. The infrared signal processing circuit is an integrated circuit specifically designed for infrared processing; it can be an infrared preprocessing SIP circuit or an infrared focal plane array circuit.

[0003] As infrared signal circuits become larger and more complex, the required external conditions also become more intricate. This necessitates different controls over the circuit's registers, voltages, and timing to ensure the infrared imaging system functions properly. Conventional methods of applying control conditions to the circuit involve manually assembling external instruments in a modular fashion. This process is complex in both setup and operation, requires numerous instruments, significantly impacts debugging efficiency, and increases the overall complexity of building an infrared image processing system. Summary of the Invention

[0004] The purpose of this invention is to provide a multifunctional USB device that can be used in infrared circuit configuration to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multifunctional USB device that can be used for infrared circuit configuration, comprising a USB component, a bidirectional level conversion module, a communication module, and an infrared signal processing circuit. The USB component performs batch configuration of the registers of the infrared signal processing circuit. The communication module supports SPI / UART and I2C protocol transmission. The USB component is connected to the bidirectional level conversion module and used for level timing programmable output of the infrared signal processing circuit. The infrared signal processing circuit is connected to an infrared detector.

[0006] Preferably, the USB component includes: USB plug, the USB plug being used for inserting a USB interface; The housing has the USB plug mounted on one end. A controller, which is mounted in the middle of the housing, has its chip pins connected to a USB plug; Left pad, which is fixedly attached to one end of the inner wall of the outer casing; A button, which is mounted through the front of the housing; A low-dropout voltage regulator is installed inside the housing and is connected to a USB plug via a button. The right pad is fixedly attached to the other end of the inner wall of the outer shell. The left pad, right pad, and button are all electrically connected to the controller. The first male double-row pin has a through-hole mounting on the outer wall of the other end of the housing. Multiple pins of the first male double-row pin are electrically connected to the controller. The first male double-row pin is used to receive signals from the controller. The first male double-row pin is electrically connected to the USB plug. The indicator light is fixed to the outer wall of the housing, and the indicator light, USB plug and low dropout voltage regulator are all electrically connected to the controller.

[0007] Preferably, the power supply of the USB plug is connected to the output terminal of the low-dropout regulator via a button, and the output terminal of the low-dropout regulator is connected to the power supply terminal of the controller.

[0008] Preferably, the left and right pads are connected to the pins of the controller, and both the left and right pads are made of gold-tin material. The right pad is connected to one of the pins of the controller, and the left pad is connected to the other pin of the controller. The right pad is used for charge sensing, and the left pad is used as a control port for programming the controller program.

[0009] Preferably, the bidirectional level conversion module includes a DuPont wire-through connector, a female dual-row pin header, a rail-mounted operational amplifier, a bidirectional level converter, and a second male dual-row pin header. A PCB is soldered to the bottom of the rail-mounted operational amplifier. The bidirectional level converter is soldered to the PCB. The female and second male dual-row pin headers are soldered to opposite ends of the PCB. The DuPont wire-through connector is connected to the first male dual-row pin header. The controller drives the low-voltage terminal VCCA of the bidirectional level converter via the rail-mounted operational amplifier's follower output. The high-voltage terminal VCCB of the bidirectional level converter is connected to the VDD voltage of the female dual-row pin header. The bidirectional level converter is used for low-voltage (below 3.3V) level timing programmable output. The rail-mounted operational amplifier is a single-channel, low-voltage, low-power operational amplifier.

[0010] Preferably, the communication module and the infrared signal processing circuit transmit signals via three-wire SPI, four-wire SPI, UART, or I2C communication protocols, and the communication module is used to perform batch register configuration for the infrared signal processing circuit.

[0011] Preferably, the indicator light consists of LED1 and LED2. The cathode of LED1 is connected to ground via a 1K resistor, and the anode of LED1 is connected to one of the pins of the controller. The cathode of LED2 is connected to ground via a 1K resistor, and the anode of LED2 is connected to another pin of the controller. When the controller is transmitting data normally, LED1 flashes. When the controller is burning the initialization program, LED2 brightens.

[0012] Preferably, the infrared detector is used to convert infrared light into an electrical signal, and the infrared detector transmits the electrical signal to the infrared signal processing circuit for signal processing.

[0013] A parallel I / O operation interface for a multi-functional USB device is provided, applied to the USB component of the aforementioned multi-functional USB device that can be configured with infrared circuits. The operation interface includes a serial I / O operation interface and a parallel I / O operation interface. The serial I / O operation interface includes a serial I / O function module, a serial I / O configuration module, a transmission configuration module, an independent I / O configuration module, an independent I / O control module, an import module, a receiving module, and a single-frame transmission module. The parallel I / O operation interface includes a parallel I / O function module, a parallel I / O configuration module, a half-byte configuration module, and a direction configuration module.

[0014] An operating interface for a bidirectional level conversion module is provided, which is applied to the aforementioned bidirectional level conversion module of a multifunctional USB device that can be configured with infrared circuits. The USB component is connected to the bidirectional level conversion module, and multiple I / O ports of the female double-row pin header are connected to the B port of the bidirectional level conversion module. The second male double-row pin header is connected to the A port of the rail operational amplifier.

[0015] The technical effects and advantages of this invention are as follows: (1) This invention replaces peripheral equipment and instruments with a multi-functional USB device that can be used for infrared circuit configuration. The operation process is simple, easy to carry and debug on site. At the same time, a set of personalized configuration interface is provided for the multi-functional USB device for infrared circuit configuration, which makes it easy for users to modify test conditions and batch configuration of registers in real time, thereby improving practical value and simplifying the operation process.

[0016] (2) The device of the present invention can support four communication protocols: three-wire, four-wire SPI, UART and I2C. It can be freely selected and switched by the host computer. It has diversified functions. The infrared circuit detection imaging system has the ability to configure registers, control bias voltage and debug online, which improves the testing and verification efficiency of the infrared circuit imaging system.

[0017] (3) The operation interface of the multi-functional USB device and the operation interface of the bidirectional level conversion module provided by the present invention have many functions and are easy to operate, which can realize human-machine delivery and improve the convenience of using the device.

[0018] (4) The present invention performs batch configuration of registers through the operation interface of the host computer multi-functional USB device, which reduces the occurrence of errors and garbled characters caused by external interference when the circuit is configured through SPI / UART / I2C protocol, and improves the efficiency and accuracy of register configuration. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention, but do not constitute a limitation thereof. In the drawings: Figure 1 A schematic diagram of a preferred embodiment of a multifunctional USB device provided by the present invention; Figure 2 A PCB assembly diagram of a preferred embodiment of a multifunctional USB device provided by the present invention; Figure 3 A circuit diagram of a preferred embodiment of a USB device provided in Embodiment 1 of the present invention; Figure 4 This is a circuit diagram of a preferred embodiment of a bidirectional level conversion module provided in Embodiment 1 of the present invention; Figure 5 This is a serial I / O operation interface diagram of a multi-functional USB device provided in Embodiment 1 of the present invention; Figure 6 This is a single-frame "write" transmission configuration diagram of the I2C protocol for a multi-functional USB device provided in Embodiment 1 of the present invention; Figure 7 This is a single-frame "read" transmission configuration diagram of a multi-functional USB device I2C protocol provided in Embodiment 1 of the present invention; Figure 8 This is a data diagram of a single frame "readback" of the I2C protocol for a multifunctional USB device provided in Embodiment 1 of the present invention; Figure 9 This is a timing diagram of a four-wire SPI protocol transmission for a multi-functional USB device provided in Embodiment 1 of the present invention; Figure 10 This is a timing diagram of a three-wire SPI protocol transmission for a multi-functional USB device provided in Embodiment 1 of the present invention; Figure 11 This is a diagram of the parallel I / O operation interface of a multi-functional USB device provided in Embodiment 1 of the present invention; Figure 12 This is a diagram of the operation interface of a bidirectional level conversion module provided in Embodiment 1 of the present invention. Attached Figure

[0020] 1. USB plug; 2. Housing; 3. Controller; 4. Left pad; 5. Button; 6. Low dropout voltage regulator; 7. Right pad; 8. First male dual-row pin header; 9. Indicator light; 10. DuPont wire connector; 11. Female dual-row pin header; 12. Rail-mount operational amplifier; 13. Bidirectional level conversion chip; 14. Second male dual-row pin header; 15. Communication module; 16. Infrared signal processing circuit. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This invention provides, for example Figure 1-12 The diagram shows a multi-functional USB device that can be configured with infrared circuitry.

[0023] Example 1: As Figure 1-2 As shown, the device includes a USB component, a bidirectional level conversion module, a communication module 15, and an infrared signal processing circuit 16. The USB component performs batch configuration of the registers of the infrared signal processing circuit 16. The communication module 15 supports SPI / UART and I2C protocol transmission. The device uses the USB component alone to perform batch register configuration of the infrared signal processing circuit 16 using the SPI / UART / I2C communication protocol of the communication module 15. The USB component is connected to the bidirectional level conversion module and used for level and timing programmable output of the infrared signal processing circuit 16. The level or timing can be programmed by directly plugging the USB component into the bidirectional level conversion module or by interconnecting it through jumper caps, making it highly practical in low-voltage level and timing control.

[0024] The USB component includes a USB plug 1, a housing 2, a controller 3, a left pad 4, a button 5, a low-dropout regulator 6, a right pad 7, a first male dual-row pin header 8, and an indicator light 9. The USB plug 1 is used for inserting the USB interface and is mounted at one end of the housing 2. The controller 3 is mounted in the middle of the housing 2. The controller 3 uses a PIC18F24K50 chip, and its pins are connected to the USB plug 1, specifically the D- and D+ data pins. The left pad 4 is fixedly attached to one end of the inner wall of the housing 2, and the button 5 passes through it. Mounted on the front of housing 2, button 5 defaults to 5V. Pressing button 5 selects 3.3V to power controller 3. Low-dropout regulator 6 is installed inside housing 2. The low-dropout regulator 6 uses an SP62USB1 chip, which converts 5V to 3.3V output. The low-dropout regulator 6 is used for level conversion. It connects to USB plug 1 via button 5. The power supply to USB plug 1 is connected to the output of low-dropout regulator 6 via button 5. The output of low-dropout regulator 6 is connected to the power supply of controller 3. The right solder pad 7 is fixedly attached to... At the other end of the inner wall of the outer casing 2, the left pad 4, right pad 7, and button 5 are electrically connected to the controller 3. A first male double-row pin header 8 is mounted through the outer wall of the other end of the outer casing 2. An indicator light 9 is fixed to the outer wall of the outer casing 2. That is, part of the structure of button 5 and the first male double-row pin header 8 extends beyond the outer wall of the outer casing 2, facilitating connection between the USB component and external devices. Multiple pins of the first male double-row pin header 8 are electrically connected to the controller 3. Pins three through ten of the first male double-row pin header 8 are electrically connected to the controller 3. The first male double-row pin header 8 is used to receive signals from the controller 3. The first male double-row pin header 8 and the USB... Connector 1 is electrically connected. Indicator light 9, USB plug 1, and low-dropout regulator 6 are all electrically connected to controller 3. The controller 3 can be supplied with operating voltage either through the low-dropout regulator 6 after level conversion or directly through USB plug 1. At the same time, the second pin of the first male double-row pin 8 outputs the selected voltage. The third to fifth pins of the first male double-row pin 8 are on the front of the housing 2, and the sixth to tenth pins of the first male double-row pin 8 are on the back of the housing 2. The first pin of the first male double-row pin 8 is ground, and the first male double-row pin 8 is electrically connected to the connection terminal of USB plug 1.

[0025] The structure consisting of the USB plug 1, controller 3, and low-dropout regulator 6 is similar to that of an existing USB flash drive. The USB plug 1 is used to connect to the USB interface of a computer or other device. The controller 3 transmits data with other devices through the first male double-row pin 8. The left solder pad 4 and the right solder pad 7 are connected to the pins of the controller 3 respectively. Both the left solder pad 4 and the right solder pad 7 are made of gold-tin material, which has higher conductivity. The right solder pad 7 is connected to one of the pins of the controller 3, and the left solder pad 4 is connected to the other pin of the controller 3. The right solder pad 7 is used for charge sensing, and the left solder pad 4 is used as the control port for programming the controller 3. In use, indicator light 9 consists of LED1 and LED2. The cathode of LED1 is connected to ground via a 1K resistor, and the anode of LED1 is connected to one of the pins of controller 3. The cathode of LED2 is connected to ground via a 1K resistor, and the anode of LED2 is connected to the other pin of controller 3. When controller 3 is transmitting data normally, LED1 flashes. When controller 3 is burning the initialization program, LED2 brightens. When controller 3 is transmitting data normally, LED1 flashes continuously to indicate that the signal is in normal transmission state. When controller 3 is initializing the program, LED2 brightens to indicate that controller 3 is in program burning state. During use, the low-dropout regulator 6 circuit converts the +5V of the USB plug 1 to a +3.3V output. In the default state, button 5 is connected to the +5V of the USB plug 1. When button 5 is pressed, it is connected to the +3.3V converted by the low-dropout regulator 6. When the controller 3 receives a control signal, the LED1 of the indicator light 9 will flash continuously to indicate to the user that the device is in signal transmission mode and is working normally.

[0026] Specifically, the bidirectional level conversion module includes a DuPont through-hole connector 1, a female dual-row pin header 11, a rail-mounted operational amplifier 12, a bidirectional level converter 13, and a second male dual-row pin header 14. The bottom of the rail-mounted operational amplifier 12 is soldered to a PCB. The bidirectional level converter 13 is soldered to the PCB. The female dual-row pin header 11 and the second male dual-row pin header 14 are soldered to both ends of the PCB, allowing a portion of the female and male dual-row pin headers 11 and 14 to be soldered onto the PCB while a portion remains exposed. The rail-mounted operational amplifier 12 is a single-pass type. A low-voltage, low-power operational amplifier, such as the LMV321, is used to follow the input voltage. The IN pin of the rail-mounted op-amp 12 is connected to pin 6 (RA2) of the female dual-row pin header 11. A DuPont through-hole connector 1 is connected to pin 8 of the first male dual-row pin header. The controller 3 drives the low-voltage terminal (VCCA) of the bidirectional level converter 13 via the output of the rail-mounted op-amp 12. The high-voltage terminal (VCCB) of the bidirectional level converter 13 is connected to the VDD voltage of the female dual-row pin header 11. The bidirectional level converter 13 is used for voltage levels below 3.3V. The timing-controlled output, bidirectional level converter 13 is an eight-bit bidirectional voltage-level converter with a data transmission rate of up to 110Mbps. The model can be TXS0108E converter. The VCCA of the bidirectional level converter 13 is connected to the OUT of the rail operational amplifier 12. The OUT provides 1.5V~3.3V. The VCCB of the bidirectional level converter 13 is connected to the second pin VDD of the female dual-row pin 11. VDD provides a voltage of 3.3V~5V. The controller 3 has a built-in DAC, which can generate the IN input voltage through port RA2. After being followed by the rail operational amplifier 12, it drives the low-voltage end VCCA of the bidirectional level converter 13. The high-voltage end VCCB of the bidirectional level converter 13 is connected to the 3.3V or 5V of VDD for power supply. At this time, the voltage applied to the low-voltage end VCCA is lower than the voltage of the high-voltage end VCCB. The USB component and the bidirectional level conversion module are connected through the first male dual-row pin 8 and the female dual-row pin 11 to perform multi-channel bidirectional level control, thereby performing low-voltage timing control of the infrared signal processing circuit.

[0027] Furthermore, the communication module 15 and the infrared signal processing circuit 16 transmit signals via three-wire SPI, four-wire SPI, UART, and I2C communication protocols. The communication module 15 is used to perform batch register configuration for the infrared signal processing circuit 16, and the level signal is 3.3V or 5V.

[0028] The infrared signal processing circuit 16 is connected to an infrared detector, which is used to convert infrared light into electrical signals. The infrared detector transmits the electrical signals to the infrared signal processing circuit 16 for signal processing. The infrared signal processing circuit 16 collects and processes the electrical signals, and the infrared signal processing circuit 16 needs to configure the circuit connection registers, voltage, timing, etc.

[0029] A parallel I / O operation interface for a multi-functional USB device is provided, applied to the USB component of the aforementioned multi-functional USB device that can be configured with infrared circuits. The operation interface includes a serial I / O operation interface and a parallel I / O operation interface. The serial I / O operation interface includes a serial I / O function module, a serial I / O configuration module, a transmission configuration module, an independent I / O configuration module, an independent I / O control module, an import module, a receive module, and a single-frame transmission module. The parallel I / O operation interface includes a parallel I / O function module, a parallel I / O configuration module, a half-byte configuration module, and a direction configuration module.

[0030] An operation interface for a bidirectional level conversion module is provided. This module is used in a multi-functional USB device that can be configured with infrared circuits. The USB component is connected to the bidirectional level converter 13. Multiple I / O ports of the female double-row pin header 11 are connected to the B port of the bidirectional level converter 13. The second male double-row pin header 14 is connected to the A port of the rail operational amplifier 12. The serial or parallel I / O operation interface is started. Clicking on the digital I / O level will bring up the "Input New Level Value" dialog box. Entering a value less than VDD will enable programmable control.

[0031] Example 2: Based on Example 1, as follows Figure 3 As shown, the controller 3 is a chip U1, model PIC18F24K50, and the low dropout regulator 06 is also a chip U2, model SP62USB01. The ground pin GND of the USB plug 1 is grounded, and the data pins USB_N and USB_P are connected to the data pins D- and D+ of the chip U1, respectively. The power supply pin +5V is connected to the input of SP62USB01 or the power supply VDD of the controller 3 by selecting VIN+ through the button. In the default state, the button connects the +5V of the USB plug 1 to the power supply VDD of the controller 3.

[0032] The cathode of LED1 on indicator light 9 is connected to ground via a 1K resistor, and the anode is connected to pin RC0 of chip U1. The cathode of LED2 on indicator light 9 is connected to ground via a 1K resistor, and the anode is connected to pin RC1 of chip U1. When chip U1 is transmitting data normally, LED1 flashes continuously. When the initialization program of chip U1 is written, LED2 becomes brighter.

[0033] The right pad 7 is connected to pin RA0 of chip U1, and the left pad 4 is connected to pin RA1 of chip U1. The pads are made of gold-tin material. The right pad 7 is used as a sensor (which can be realized by detecting the charge capacity on the pad after the human body touches the pad). The left pad 4 is used as the control port input for burning the initialization program of controller 3.

[0034] Example 3: Based on Example 1, as follows Figure 4 As shown, the track-mount operational amplifier 12 is an LMV321 chip, the bidirectional level converter 13 is a TXS0108E chip, pin 6 (RA2) of the female dual-row pin header 11 is connected to pin 1 (IN+) of the LMV321, pin 4 (OUT) of the LMV321 is connected to pin 3 (IN-) and pin 2 (VCCA) of the TXS0108E chip, pin 19 (VCCB) of the TXS0108E chip is connected to VDD, pins 12-18 of the TXS0108E chip and the pins of the female dual-row pin header 11 are connected as indicated in the figure, and pins 3-9 of the TXS0108E chip and the pins of the second male dual-row pin header 14 are connected as indicated in the figure.

[0035] The low-voltage terminal VCCA of pin 2 of the TXS0108E chip can support a voltage of 1.2V to 3.3V. Using the built-in DAC of controller 3, the output is sent to the RA2 terminal and followed by the LMV321 op-amp to drive the low-voltage terminal VCCA of the TXS0108E. Its high-voltage terminal VCCB is connected to the VDD voltage of the female dual-row pin 11. Here, the voltage is 3.3V or 5V.

[0036] The remaining 7 I / O ports of the female double-row pin 11 are connected to the B port of the bidirectional level converter 13 (RB0-B5, RB1-B6, RB3-B8, RC2-B2, RC6-B3, RC7-B4, RB2-B7). At the same time, the second male double-row pin 14 is connected to the A port of the bidirectional level converter 13 (RB0A-A5, RB1A-A6, RB3A-A8, RC2A-A2, RC6A-A3, RC7A-A4, RB2A-A7).

[0037] Example 4: Based on Example 1, as follows Figure 5 As shown, by inserting the USB plug 1 from the device into the computer's USB port, double-click the HIDplayer.exe program to launch and open it. Figure 5 The interface includes modules such as "Serial I / O Function", "Serial I / O Configuration", "Transmission Configuration", "Independent I / O Configuration", "Independent I / O Control", "Import", "Receive", and "Single Frame Transmission".

[0038] Among them, the "serial IO function" can select four-wire SPI, three-wire SPI, I2C and UART data format transmission, and the protocol conversion is performed by the host computer program and the controller 3 in the device; After selecting "Serial IO Function" in "Serial IO Configuration", the corresponding connection relationship will be displayed for the ports. The correspondence is as follows: For I2C transmission, SCL corresponds to RB1 and SDA corresponds to RB0; for four-wire SPI transmission, SCLK corresponds to RB1, SDO corresponds to RB3, SDI corresponds to RB0, and CS corresponds to RB2; for three-wire SPI transmission, SCLK corresponds to RB1, SDO corresponds to RB3, and CS corresponds to RB2. The “Transmission Configuration” allows you to set the I2C baud rate, the number of bytes per frame (control + data), and the data direction. "Independent I / O Configuration" allows you to select the remaining I / O ports RC6 and RC7; "Independent I / O control" can set the remaining I / O ports RC6 and RC7 to 0 and 1 respectively; The "Import" function imports the register data that needs to be configured in batches according to the data transmission format of the infrared signal processing circuit. You can select the address to be imported through the "Import Module" and then select "Batch Transmission". You can set the interval between the data transmission lines by using "Batch Interval". The "Receive" function can read back the batch of imported registers in real time to determine whether the registers have been configured successfully, and can also "clear" the data received last time. "Single-frame transmission" allows for the configuration and data transfer of a single register, facilitating circuit debugging.

[0039] The HIDplayer.exe software in this invention also comes with a 24LC128 readback template, which can be used to read back 24LC128 data in batches, such as... Figure 5 As shown, batch multi-byte data is read out, with each frame containing 8 bytes. Note that the number of bytes per frame is set to 9 in the transmission configuration because "A1" is also included in the calculation. Simply click "Import Template" and "Batch Transmission" (circled in red) to read a large amount of data from the 24LC128 via the I2C bus at once. The readback data is shown in the "Receive" window, where "07" indicated by the arrow is the readback code value.

[0040] When transmitting in batches, the length of the data bytes is automatically determined, so the template file can contain data frames of different lengths. However, when transmitting a single frame, the "bytes per frame" setting in the transmission configuration must be manually modified.

[0041] Example 5: Based on Example 1, as follows Figure 6 , 7 As shown in Figure 8, the configuration for single-frame "write" transfer, "read" transfer, and "read-back" data in the USB device I2C protocol is provided. The following is a detailed explanation of the register configuration of the circuit using the HIDplayer.exe software, taking the I2C transfer protocol as an example: Figure 5 The serial I / O configuration shown requires only four wires to operate: power, ground, SDA, and SCL. I2C is divided into address and data R / W control. The address is further divided into device address and data address, and the data address has 8-bit and 16-bit modes. The first byte of an I2C communication frame consists of a 7-bit device address and a 1-bit R / W flag. The I2C protocol is explained in detail by communicating with a 24LC128. In the diagram, "A0" represents the address + W of the 24LC128 device. The device address is 1010000, a total of 7 bits. +0 indicates a write operation. The operation of writing the data address first and then reading the data requires retransmitting the device address.

[0042] The following uses single-frame transmission as an example. Figure 5 In the "Transmission Configuration," the number of bytes per frame is controlled by a + data setting of 3+1, meaning 1 byte for the device address, 2 bytes for the data address, and 1 byte for the data. One byte (0x07) is written to the data address 0x0001 in the 24LC128 at I2C device address 0xA0, and the transmitted codeword is "A0000107." The "Single Frame Transmission" configuration is as follows. Figure 6 As shown, set the number of bytes per frame control + data in the "Transmission Configuration" to 3+2, that is, 1 byte for the device address, 2 bytes for the data address, and 2 bytes for the data. Send a read command to the 24LC128, transmitting the codeword "A00001A1FF". The "Single Frame Transmission" configuration is as follows. Figure 7 As shown, once the device detects 0xA1FF, it automatically switches to read timing and can receive the read-back frame. The read-back data is as follows: Figure 8 As shown, the final "07" represents the valid data read back.

[0043] Example 6: Based on Example 1, as follows Figure 9-10 As shown, the four-wire mode does not have the same SDIO direction issue as the three-wire mode, while the three-wire mode requires attention to the SDIO direction. Generally, in the three-wire mode, 1-2 control bytes must be sent first, and then data bytes must be sent or read back, such as... Figure 5 As shown, a communication frame consists of a control byte and a data byte. The data direction has three options: "send", "read back", and "auto". "Auto" uses the highest bit of the first byte as the R / W judgment flag.

[0044] In four-wire mode, the receive window will only display data from SDI. The following example demonstrates four-wire SPI protocol transmission using the transmission codeword "810355": If the data direction is set to "Auto," and the number of bytes per frame (control + data) is set to 1 + 2 (control 1 indicates 1 byte of control; data 2 indicates 2 bytes of data), SDIO sends control byte 0x81, then the SDIO line becomes high impedance, and then 2 data bytes are read back and displayed in the receive window; 0x0355 will be ignored. If the data direction is set to "Transmit," and the number of bytes per frame (control + data) is set to 2 + 1 (control 2 indicates 2 bytes of control; data 1 indicates 1 byte of data), SDIO sends control byte 0x8103, then continues sending data byte 0x55, with no data read back. The transmission timing is as follows: Figure 9 As shown.

[0045] In three-wire mode, the transmitted data will be displayed in the receiving window. The following example demonstrates three-wire SPI protocol transmission of the transmission codeword "710355": Data direction is set to "Auto," and the number of bytes per frame (control + data) is set to 2 + 1 (control 2 means 2 bytes of control; data 1 means 1 byte of data). SDO (RB0) is kept high, SDIO sends control byte 0x7103, then continues sending data byte 0x55, with no data read back. The transmission timing is as follows... Figure 10 As shown.

[0046] Example 7: Based on Example 1, double-click HIDplayer.exe to start "Parallel I / O". The interface is shown in the figure. You can see that the interface includes modules such as "Parallel I / O Function", "Parallel I / O Configuration", "Novum Configuration", and "Direction Configuration". The "parallel I / O function" allows for data transmission in 16-bit, 8-bit, 4-bit, and 1-bit modes. The “Parallel I / O Configuration” allows you to select PORT A, PORT B, PORT C, PORT D (currently unavailable) for data port output. PORT A represents output port A2, PORT B ​​represents output ports B0, B1, B2, and B3, and PORT C represents output ports C2, C6, and C7. The "nibble configuration" option allows you to choose to output either the high 4 bits or the low 4 bits of a byte. The "Direction Configuration" can be set to either all inputs or all outputs.

[0047] The device's parallel I / O operation interface is initially set to parallel 1-bit mode with full output, meaning all 8 I / Os are low. Each time a tab is switched, the corresponding functions will be reinitialized. For example, if RC7 is already set high in the serial I / O tab, switching to the parallel I / O tab will initialize all I / Os, including RC7, to low. The preset will then return to the initial power-on state, requiring you to click "Connect" again.

[0048] Example 7: Based on Example 1, as follows Figure 12 As shown, the operation interface of the preferred embodiment of the bidirectional level conversion module is shown. The first male double-row pin 8 of the device is connected to the female double-row pin 11 of the bidirectional level conversion module. The USB plug 1 of the device is inserted into the USB interface of the computer. Then, the button 5 is powered by 5V in the default state and 3.3V when pressed.

[0049] Since the RA2 pin of the female connector of the bidirectional level conversion module is used for voltage control, only 7 IO pins are actually available for level conversion. It's also very simple to use; you only need to... Figure 5 and Figure 11 In the HIDplayer.exe software interface, click "Digital I / O Level" at the bottom. A dialog box will appear asking you to "Enter New Level Value." Enter a value less than VDD and click "OK." This module can also be used to convert the output voltage value when configuring the registers of an infrared circuit using the SPI protocol.

[0050] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-functional USB device that can be configured with infrared circuitry, characterized in that, The device includes a USB component, a bidirectional level conversion module, a communication module (15), and an infrared signal processing circuit (16). The USB component performs batch configuration on the registers of the infrared signal processing circuit (16). The communication module (15) supports SPI / UART and I2C protocol transmission. The USB component is connected to the bidirectional level conversion module and is used for level timing programmable output of the infrared signal processing circuit (16). The infrared signal processing circuit (16) is connected to an infrared detector.

2. The multifunctional USB device that can be used in infrared circuit configuration according to claim 1, characterized in that: The USB component includes: USB plug (1), the USB plug (1) is used for inserting a USB interface; The outer casing (2) has the USB plug (1) installed at one end of it; The controller (3) is installed in the middle of the housing (2), and the pins of the controller (3) chip are connected to the USB plug (1); Left pad (4), the left pad (4) is fixedly attached to one end of the inner wall of the outer shell (2); Button (5), which is mounted through the front of the housing (2); Low dropout regulator (6), the low dropout regulator (6) is installed in the inner cavity of the housing (2), and the low dropout regulator (6) is connected to the USB plug (1) via button (5); The right pad (7) is fixedly attached to the other end of the inner wall of the outer shell (2). The left pad (4), the right pad (7), and the button (5) are all electrically connected to the controller (3). The first male double-row pin (8) is installed through the outer wall of the other end of the housing (2). Multiple pins of the first male double-row pin (8) are electrically connected to the controller (3). The first male double-row pin (8) is used to receive signals from the controller (3). The first male double-row pin (8) is electrically connected to the USB plug (1). Indicator light (9) is fixed to the outer wall of housing (2). Indicator light (9), USB plug (1) and low voltage regulator (6) are all electrically connected to controller (3).

3. A multi-functional USB device that can be used in infrared circuit configuration according to claim 2, characterized in that: The power supply of the USB plug (1) is connected to the output terminal of the low dropout regulator (6) via the button (5), and the output terminal of the low dropout regulator (6) is connected to the power supply terminal of the controller (3).

4. A multi-functional USB device that can be configured with infrared circuitry according to claim 2, characterized in that: The left pad (4) and right pad (7) are respectively connected to the pins of the controller (3). The pads of the left pad (4) and right pad (7) are both made of gold and tin. The right pad (7) is connected to one of the pins of the controller (3), and the left pad (4) is connected to the other pin of the controller (3). The right pad (7) is used for charge sensing, and the left pad (4) is used as the control port for programming the controller (3).

5. A multi-functional USB device that can be used in infrared circuit configuration according to claim 2, characterized in that: The bidirectional level conversion module includes a DuPont wire connector (1), a female dual-row pin header (11), a rail operational amplifier (12), a bidirectional level converter (13), and a second male dual-row pin header (14). The bottom of the rail operational amplifier (12) is soldered to a PCB. The bidirectional level converter (13) is soldered to the PCB. The female dual-row pin header (11) and the second male dual-row pin header (14) are soldered to the two ends of the PCB respectively. The DuPont wire connector (1) is connected to the first male dual-row pin header (8). The controller (3) drives the low-voltage terminal VCCA of the bidirectional level converter (13) through the rail operational amplifier (12). The high-voltage terminal VCCB of the bidirectional level converter (13) is connected to the VDD voltage of the female dual-row pin header (11). The bidirectional level converter (13) is used for low-voltage timing programmable output below 3.3V. The rail operational amplifier (12) is a single-channel low-voltage low-power operational amplifier.

6. A multi-functional USB device that can be used in infrared circuit configuration according to claim 2, characterized in that: The communication module (15) and the infrared signal processing circuit (16) transmit signals through three-wire SPI, four-wire SPI, UART, and I2C communication protocols. The communication module (15) is used to perform batch register configuration for the infrared signal processing circuit (16).

7. A multi-functional USB device that can be used in infrared circuit configuration according to claim 2, characterized in that: The indicator light (9) consists of LED1 and LED2. The cathode of LED1 is connected to ground via a 1K resistor, and the anode of LED1 is connected to one of the pins of the controller (3). The cathode of LED2 is connected to ground via a 1K resistor, and the anode of LED2 is connected to another pin of the controller (3). When the controller (3) is transmitting data normally, LED1 flashes. When the controller (3) is burning the initialization program, LED2 becomes brighter.

8. A multi-functional USB device that can be used in infrared circuit configuration according to claim 1, characterized in that: The infrared detector is used to convert infrared light into electrical signals, and the infrared detector transmits the electrical signals to the infrared signal processing circuit (16) for signal processing.

9. A parallel I / O operation interface for a multi-functional USB device, applied to a USB component of a multi-functional USB device that can be configured with an infrared circuit according to claim 2, characterized in that: The operation interface includes a serial I / O operation interface and a parallel I / O operation interface. The serial I / O operation interface includes a serial I / O function module, a serial I / O configuration module, a transmission configuration module, an independent I / O configuration module, an independent I / O control module, an import module, a receiving module, and a single frame transmission module. The parallel I / O operation interface includes a parallel I / O function module, a parallel I / O configuration module, a half-byte configuration module, and a direction configuration module.

10. An operating interface for a bidirectional level conversion module, applied to the bidirectional level conversion module of the multifunctional USB device that can be configured with infrared circuits as described in claim 5, characterized in that: The USB component is connected to the bidirectional level converter (13), and the multiple I / O ports of the female double-row pin (11) are connected to the B port of the bidirectional level converter (13) respectively. The second male double-row pin (14) is connected to the A port of the rail operational amplifier (12) respectively.

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