Dynamic power module temperature change characteristic analysis method and related equipment

Abstract

The invention provides a dynamic power module temperature change characteristic analysis method and related equipment, and belongs to the technical field of temperature change characteristic analysis. The method comprises the following steps: receiving dynamic power data; the dynamic power data comprises module power and an efficiency factor; performing energy equivalent processing on the dynamic power data to obtain average heating power; performing steady-state thermal simulation analysis according to the average heating power to obtain parameter information of a preset selected part; the parameter information comprises stable state temperature and surface heat flux density; analyzing and calculating according to the parameter information to obtain an equivalent convective heat transfer coefficient; calculating according to the equivalent convective heat transfer coefficient to obtain a time constant; obtaining a transient temperature response expression based on the time constant and the environment temperature; and performing analysis according to the transient temperature response expression to obtain temperature change characteristic information of the dynamic power module. According to the invention, computing resources can be reduced, simulation time can be saved, and dynamic temperature characteristics of the system under different input conditions can be rapidly obtained.

Description

Technical Field

[0001] This application relates to the field of temperature change characteristic analysis technology, and in particular to a method and related equipment for analyzing the temperature change characteristics of a dynamic power module. Background Technology

[0002] In the thermal simulation of related technologies, if the heat generation power of the module changes dynamically over time, transient thermal simulation methods are required. Transient methods usually require high-precision mesh generation and small time steps, which consume a lot of computational resources and have a long simulation cycle, making it difficult to meet the design requirements of rapid iteration.

[0003] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the Invention

[0004] The main objective of this application is to propose a method and related equipment for analyzing the temperature characteristics of a dynamic power module, which can reduce computing resources, save simulation time, and quickly obtain the dynamic temperature characteristics of the system under different input conditions.

[0005] To achieve the above objectives, one aspect of this application proposes a method for analyzing the temperature variation characteristics of a dynamic power module, the method comprising the following steps: Receive dynamic power data; the dynamic power data includes module power and efficiency factor; The dynamic power data is processed by energy equivalence to obtain the average heating power; Steady-state thermal simulation analysis is performed based on the average heat generation power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density; Based on the parameter information, the equivalent convective heat transfer coefficient is obtained through analysis and calculation. The time constant is obtained by calculation based on the equivalent convective heat transfer coefficient. Based on the time constant and ambient temperature, the transient temperature response expression is obtained; Based on the transient temperature response expression, the temperature change characteristics of the dynamic power module are obtained through analysis.

[0006] In some embodiments, the formula used to perform energy equivalence processing on the dynamic power data to obtain the average heating power includes: ; in, This represents the average heating power. Total time; for Module power at any moment; The efficiency factor is... In the time module The proportion converted into effective output; the effective output includes mechanical work or light energy.

[0007] In some embodiments, the step of performing steady-state thermal simulation analysis based on the average heat generation power to obtain parameter information of preset selected components includes: Steady-state thermal simulation analysis is performed based on the average heat generation power. A simulation model is established according to the steady-state thermal simulation process, boundary conditions are set, and the solution is obtained to obtain the parameter information of the preset selected components.

[0008] In some embodiments, the formula used to obtain the equivalent convective heat transfer coefficient by analyzing and calculating based on the parameter information includes: ; in, It is the equivalent convective heat transfer coefficient; This is a correction factor; The average surface heat flux density of the component; The steady-state temperature of the component; The ambient temperature.

[0009] In some embodiments, the formula used to calculate the time constant based on the equivalent convective heat transfer coefficient includes: ; in, It is a time constant; The density of the material; Specific heat capacity; For volume; The equivalent convective heat transfer coefficient is mentioned above; is the surface area.

[0010] In some embodiments, the formula used to derive the transient temperature response expression based on the time constant and the ambient temperature includes: ; in, for The transient temperature response expression of the components of the dynamic power module at any given time; The steady-state temperature of the component; The ambient temperature; is the time constant.

[0011] To achieve the above objectives, another aspect of this application proposes a dynamic power module temperature variation characteristic analysis system for implementing the method described above. The system includes: The first module is used to receive dynamic power data; the dynamic power data includes module power and efficiency factor. The second module is used to perform energy equivalence processing on the dynamic power data to obtain the average heating power; The third module is used to perform steady-state thermal simulation analysis based on the average heat generation power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density. The fourth module is used to analyze and calculate based on the parameter information to obtain the equivalent convective heat transfer coefficient; The fifth module is used to calculate the time constant based on the equivalent convective heat transfer coefficient. The sixth module is used to obtain the transient temperature response expression based on the time constant and the ambient temperature; The seventh module is used to analyze the transient temperature response expression to obtain the temperature change characteristic information of the dynamic power module.

[0012] To achieve the above objectives, another aspect of this application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the method described above.

[0013] To achieve the above objectives, another aspect of the embodiments of this application proposes a computer-readable storage medium storing a computer program that, when executed by a processor, implements the methods described above.

[0014] To achieve the above objectives, another aspect of the embodiments of this application proposes a computer program product, including a computer program that, when executed by a processor, implements the aforementioned method.

[0015] The embodiments of this application include at least the following beneficial effects: This application provides a method, system, electronic device, storage medium, and program product for analyzing the temperature variation characteristics of a dynamic power module. The invention includes: receiving dynamic power data; the dynamic power data includes module power and efficiency factor; performing energy equivalence processing on the dynamic power data to obtain average heating power; performing steady-state thermal simulation analysis based on the average heating power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density; performing analysis and calculation based on the parameter information to obtain the equivalent convective heat transfer coefficient; calculating based on the equivalent convective heat transfer coefficient to obtain the time constant; obtaining a transient temperature response expression based on the time constant and ambient temperature; and analyzing based on the transient temperature response expression to obtain dynamic power module temperature variation characteristic information. This application can reduce computational resources, save simulation time, and quickly obtain the dynamic temperature characteristics of the system under different input conditions. Attached Figure Description

[0016] Figure 1 This is a flowchart of the dynamic power module temperature change characteristic analysis method provided in the embodiments of this application; Figure 2 This is a flowchart illustrating the steps of the dynamic power module temperature change characteristic analysis method provided in the embodiments of this application; Figure 3 This is a schematic diagram of an electronic device box provided in an embodiment of this application; Figure 4 This is a schematic diagram of the transient simulation analysis results provided in the embodiments of this application; Figure 5 This is a schematic diagram of the simulation analysis results of the electronic device box provided in the embodiments of this application; Figure 6 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application.

[0017] Reference numerals: 1-Circuit board, 2-Heating element, 3-Cover plate, 4-Box. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit it. In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with those of this application; they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this application as detailed in the appended claims.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0020] Before providing a detailed description of the embodiments of this application, some of the nouns and terms involved in the embodiments of this application will be explained first. The nouns and terms involved in the embodiments of this application are subject to the following interpretations.

[0021] 1) LabVIEW, an engineering tool and method for acquiring high-precision dynamic power data through actual measurements; 2) ANSYS Icepak, an electronic thermal management simulation software.

[0022] This invention takes into account that many electronic device failures are caused by heat. Studies on the environmental failure rate of aircraft have shown that approximately 55% of all electronic device failures are related to thermal events (such as high temperatures and thermal cycling). Therefore, thermal management strategies need to be fully considered during the electronic engineering design phase, and thermal design should be performed on the product.

[0023] The power of many heat-generating modules is not constant; their power characteristics often change dynamically over time. For example, PWM modulation devices generate high-frequency power ripples during switching; the power of digital power amplifiers such as Class D amplifiers changes in real time with the signal amplitude, exhibiting significant time-domain discontinuities. When devices drive different loads, real-time fluctuations in current and voltage lead to instantaneous power changes; furthermore, the negative temperature coefficient of semiconductor materials creates a power-temperature negative feedback loop, resulting in a 15%-30% difference between steady-state and cold-state power. Conventional thermal simulation analysis typically uses the maximum heat generation power or the most frequently occurring state during the device's operating cycle as input conditions. These dynamic characteristics make it difficult for conventional thermal analysis methods to accurately predict device temperature rise, potentially leading to inadequate or excessively redundant heat dissipation design.

[0024] In related technologies, if the module's heat generation power changes dynamically over time, transient thermal simulation methods are required. Transient methods typically require high-precision mesh generation and tiny time steps, resulting in high computational resource consumption and strict time step requirements. High-frequency power fluctuations necessitate microsecond-level time steps, leading to a dramatic increase in computational load. Furthermore, computational efficiency is low, and high-precision simulations are too time-consuming, making it difficult to meet the demands of rapid iteration. Therefore, establishing an efficient thermal analysis method for dynamic power modules is of great significance for the thermal design optimization and reliability assessment of such products.

[0025] In view of this, this application provides a method for analyzing the temperature characteristics of a dynamic power module. This method reduces computational resources, saves simulation time, and can quickly obtain the dynamic temperature characteristics of the system under different input conditions.

[0026] The dynamic power module temperature change characteristic analysis method provided in this application relates to the field of temperature change characteristic analysis technology. This method can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, or desktop computer, but is not limited to these. The server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms. The server can also be a node server in a blockchain network. The software can be an application implementing the dynamic power module temperature change characteristic analysis method, but is not limited to the above forms.

[0027] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics devices, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0028] Figure 1 This is an optional flowchart of the dynamic power module temperature change characteristic analysis method provided in the embodiments of this application. Figure 1 The method may include, but is not limited to, steps S101 to S107.

[0029] Step S101: Receive dynamic power data; the dynamic power data includes module power and efficiency factor; Step S102: Perform energy equivalence processing on the dynamic power data to obtain the average heating power; Step S103: Perform steady-state thermal simulation analysis based on average heat generation power to obtain parameter information of the preset selected components; the parameter information includes steady-state temperature and surface heat flux density. Step S104: Analyze and calculate based on the parameter information to obtain the equivalent convective heat transfer coefficient; Step S105: Calculate the time constant based on the equivalent convective heat transfer coefficient; Step S106: Based on the time constant and ambient temperature, obtain the transient temperature response expression; Step S107: Analyze the transient temperature response expression to obtain the temperature change characteristic information of the dynamic power module.

[0030] Steps S101 to S107, as illustrated in the embodiments of this application, convert the energy into an average power through the energy equivalence processing in step S102. This eliminates the need for complex tasks and specialized knowledge requirements in the simulation step S103, such as setting the time step, defining a complex time-varying power function, and waiting for long-term convergence calculations in transient simulations, thus reducing the workload and operational threshold for technical personnel.

[0031] In step S101 of some embodiments, a high-precision measuring device can be connected in series in the power supply circuit of the power module to measure the voltage and current in real time, and directly calculate and output the instantaneous power. The waveform file of the power module's power is available. Alternatively, it can be used in conjunction with current sensors and voltage probes to synchronously collect the current flowing through the power module and the voltage across its terminals. In host computer software (such as LabVIEW), the collected voltage and current signals are multiplied to synthesize the instantaneous power curve in real time. This method is not limited to this.

[0032] In some embodiments, step S102 may include, but is not limited to, step S201: Step S201, the formula used includes: ; in, This represents the average heating power. Total time; for Module power at any moment; The efficiency factor is... In the time module The proportion converted into effective output; effective output includes mechanical work or light energy.

[0033] In step S201 of some embodiments, the fundamental cause of temperature rise is the accumulation of heat, i.e., energy. The formula accurately captures the cumulative effect of dynamic power on the thermal effect by calculating the total heat generated over a period of time and averaging it over time.

[0034] In some embodiments, step S103 may include, but is not limited to, step S301: Step S301: Perform steady-state thermal simulation analysis based on average heat generation power, establish a simulation model according to the steady-state thermal simulation process, set boundary conditions for solution, and obtain the parameter information of the preset selected components.

[0035] In step S301 of some embodiments, the simulation model can be established in professional simulation software (such as ANSYS Icepak) by creating or importing a three-dimensional geometric model of the electronic device. This includes the chassis (device box), circuit board, heat-generating device (chip), heat sink, and other key structures. Setting boundary conditions is the step of transforming the physical problem into a mathematical model. The "average heat generation power" calculated in step S201 can be applied as an input power to a preset heat-generating component (such as a chip). This is the difference between this step and transient simulation—it uses the average power representing the total energy of the entire cycle, rather than the power that changes instantaneously. The parameter information of the component includes the steady-state temperature and surface heat flux density. Surface heat flux density = heat flow rate / area. The steady-state temperature is the average or highest temperature of the component (such as a chip). This embodiment of the invention simplifies the simulation process, lowers the technical threshold, and reduces the requirements for computing resources.

[0036] In some embodiments, step S104 may include, but is not limited to, step S401: Step S401, the formula used includes: ; in, It is the equivalent convective heat transfer coefficient; This is a correction factor; The average surface heat flux density of the component; The steady-state temperature of the component; The ambient temperature.

[0037] In step S401 of some embodiments, the equivalent convective heat transfer coefficient is calculated. This coefficient no longer distinguishes between various heat dissipation methods, but represents the "total heat dissipation capacity" from the surface of the component to the ambient air.

[0038] In some embodiments, step S105 may include, but is not limited to, step S501: Step S501, the formula used includes: ; in, It is a time constant; The density of the material; Specific heat capacity; For volume; It is the equivalent convective heat transfer coefficient; is the surface area.

[0039] In step S501 of some embodiments, a larger time constant means that the system heats up and cools down slowly, and has a large thermal inertia; a smaller time constant means that the system heats up and cools down quickly, and has a small thermal inertia.

[0040] In some embodiments, step S106 may include, but is not limited to, step S601: Step S601, the formula used includes: ; in, for The transient temperature response expression of the components of the dynamic power module at any given time; The steady-state temperature of the component; The ambient temperature; is the time constant.

[0041] In step S601 of some embodiments, a transient temperature response expression is constructed, thereby realizing transient temperature prediction.

[0042] This application also provides a dynamic power module temperature variation characteristic analysis system for implementing the aforementioned method. The system includes: The first module is used to receive dynamic power data; the dynamic power data includes module power and efficiency factor. The second module is used to perform energy equivalence processing on dynamic power data to obtain average heating power. The third module is used to perform steady-state thermal simulation analysis based on the average heat generation power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density. The fourth module is used to analyze and calculate based on parameter information to obtain the equivalent convective heat transfer coefficient; The fifth module is used to calculate the time constant based on the equivalent convective heat transfer coefficient; The sixth module is used to derive the transient temperature response expression based on the time constant and ambient temperature; The seventh module is used to analyze the transient temperature response expression and obtain the temperature change characteristics information of the dynamic power module.

[0043] It is understood that the content of the above method embodiments is applicable to this system embodiment. The specific functions implemented in this system embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0044] This application proposes a method for analyzing the temperature variation characteristics of dynamic power modules that integrates steady-state simulation and analytical calculation, thereby providing a thermal analysis solution for dynamic power modules with low resource consumption and high efficiency.

[0045] refer to Figure 2 The dynamic power module temperature variation characteristic analysis method of this invention includes: 1. Using the energy equivalence method, dynamic power is converted into equivalent steady-state power. The total energy is calculated by integration and then averaged over the time period. The expression is as follows: (Formula 1) In the formula: Average heating power (W); Total time; for t Module power at any given time (W); As an efficiency factor, t In the time module The proportion that is converted into effective output (such as mechanical work, light energy, etc.).

[0046] 2. Based on the above, perform steady-state thermal simulation analysis to obtain parameters such as steady-state temperature and surface heat flow of key components (pre-selected components).

[0047] 3. Using the simulated heat flux density and steady-state temperature of the chip surface, combined with material parameters, the equivalent convective heat transfer coefficient is calculated (the heat transfer portion is also calculated as convection). The expression is as follows: (Formula 2) In the formula: Equivalent convective heat transfer coefficient (W / m) 2 ·℃); The correction factor is adjusted based on simulation or experimental results; The average surface heat flux density of the chip (W / m 2 ); The chip temperature (°C) under stable conditions; The ambient temperature is (°C).

[0048] Expression for the natural time constant: (Formula 3) In the formula: Material density (kg / m³) 3 ); Specific heat capacity (J / kg·℃); Volume (m) 3 ); Surface area (m²) 2 ).

[0049] Based on the above calculations and simulations, the transient temperature expression for key components (such as chips) of the dynamic power module is obtained as follows: (Formula 4) The following is a detailed description and explanation of the solutions in the embodiments of the present invention, using specific application examples: 1. Problem Description like Figure 3 The diagram shows an electronic device box containing a circuit board 1 and a heating element 2. The box also includes a cover plate 3 and a box body 4. The heating element 2 operates in a cycle of 9 seconds of emission and 3 seconds of reception. The heating power during emission is 0.2W, and the heating power during reception is 2W. Find the maximum temperature of the heating element 2 at room temperature of 25℃.

[0050] 2. A transient simulation scheme is adopted. Transient thermal simulation technology was used for data acquisition and model building. The transient simulation analysis results are as follows: Figure 4 As shown, the temperature of heating device 2 at the final simulation time of 15552s is 47.4℃. Initially, due to the change in power of heating device 2 during the time process, the temperature curve fluctuates due to the inertia of heating device 2. As time goes by, this inertial effect weakens, and the system stabilizes. At this point, the temperature change curve tends to be flat, and the system can be considered to have reached a steady state.

[0051] 3. Using the solution of this invention Using the analysis scheme of this invention, after data collection, the equivalent steady-state power is calculated using the energy equivalence method according to Formula 1:

[0052] A simulation model was established according to the steady-state thermal simulation process, boundary conditions were set, and the solution was obtained. The simulation analysis results of the electronic device box are as follows: Figure 5 As shown, the simulated steady-state temperature of heating device 2 is The results are basically consistent with those obtained after the transient simulation analysis has stabilized. This demonstrates that the present invention can effectively perform transient thermal simulation of such dynamic power modules, proving the accuracy of the equivalent power method.

[0053] Comparing the transient thermal simulation results, the correction factor in the formula for calculating the convective heat transfer coefficient is taken:

[0054] The average surface heat flux density of the chip was extracted using steady-state thermal simulation.

[0055] Ambient temperature:

[0056] Calculate the equivalent convective heat transfer coefficient of the chip surface according to Formula 2:

[0057] Chip density Specific heat capacity ;volume Surface area Calculate the time constant using Formula 3:

[0058] The transient temperature response expression of the chip, obtained from Formula 4, is as follows:

[0059] The method proposed in this invention, which combines steady-state simulation with analytical calculation (a method for analyzing the temperature variation characteristics of dynamic power modules), has the following beneficial effects in obtaining the temperature variation law of dynamic power modules over time: 1. The simulation process is simplified by using steady-state simulation analysis combined with computational analysis to replace transient simulation analysis to obtain the dynamic response of the dynamic power module. This eliminates steps such as time step setting and transient function design, effectively reducing the workload of simulation engineers.

[0060] 2. It reduces computing resources and saves simulation time. For the case in this paper, under the same computing hardware and software resources, the conventional simulation method takes 613 seconds, while the simulation method of this invention takes 186 seconds, saving 70% of the computing time. When facing complex systems, its time-saving effect is considerable, meeting the design requirements of rapid iteration.

[0061] 3. The convective heat transfer coefficient, corrected by experiments or simulations, can well represent the system characteristics. The dynamic characteristic curves of the key components can effectively represent the transient characteristics of the system, thereby quickly obtaining the dynamic temperature characteristics of the system under different input conditions.

[0062] This application also provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the above-described method. This electronic device can be any smart terminal, including tablet computers, desktop computers, etc.

[0063] It is understood that the content of the above method embodiments is applicable to this device embodiment. The specific functions implemented by this device embodiment are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0064] Please see Figure 6 , Figure 6 The hardware structure of an electronic device according to another embodiment is illustrated. The electronic device includes: The processor 601 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application. The memory 602 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 602 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 602 and is called and executed by the processor 601 using the methods described in the embodiments of this application. The input / output interface 603 is used to implement information input and output; The communication interface 604 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.). Bus 605 transmits information between various components of the device (e.g., processor 601, memory 602, input / output interface 603, and communication interface 604); The processor 601, memory 602, input / output interface 603, and communication interface 604 are connected to each other within the device via bus 605.

[0065] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described method.

[0066] It is understood that the content of the above method embodiments is applicable to this storage medium embodiment. The specific functions implemented in this storage medium embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0067] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0068] It is understood that the content of the above method embodiments is applicable to the embodiments of this program product. The specific functions implemented by the embodiments of this program product are the same as those of the above method embodiments, and the beneficial effects achieved are also the same as those achieved by the above method embodiments.

[0069] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0070] The dynamic power module temperature change characteristic analysis method, system, electronic device, storage medium, and program product provided in this application simplify the simulation process. They replace transient simulation analysis with a method combining steady-state simulation analysis and computational analysis to obtain the dynamic response of the dynamic power module, eliminating steps such as time step setting and transient function design, effectively reducing the workload of simulation engineers. This invention also reduces computational resources and saves simulation time. In the case presented in this paper, under the same computing hardware and software resources, the conventional simulation method takes 613 seconds, while the simulation method of this invention takes 186 seconds, saving 70% of the computation time. When dealing with complex systems, its time-saving effect is considerable, meeting the design requirements of rapid iteration. Based on experimentally or simulated corrections, the convective heat transfer coefficient of this invention can well represent the system characteristics. The dynamic characteristic curves of key components obtained can effectively represent the transient characteristics of the system, thereby quickly obtaining the dynamic temperature characteristics of the system under different input conditions.

[0071] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0072] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0073] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0074] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0075] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0076] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0077] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0078] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0079] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0080] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0081] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A method for analyzing the temperature variation characteristics of a dynamic power module, characterized in that, The method includes the following steps: Receive dynamic power data; the dynamic power data includes module power and efficiency factor; The dynamic power data is processed by energy equivalence to obtain the average heating power; Steady-state thermal simulation analysis is performed based on the average heat generation power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density; Based on the parameter information, the equivalent convective heat transfer coefficient is obtained through analysis and calculation. The time constant is obtained by calculation based on the equivalent convective heat transfer coefficient. Based on the time constant and ambient temperature, the transient temperature response expression is obtained; Based on the transient temperature response expression, the temperature change characteristics of the dynamic power module are obtained through analysis.

2. The method according to claim 1, characterized in that, The formula used to perform energy equivalence processing on the dynamic power data to obtain the average heating power includes: ； in, This represents the average heating power. Total time; for Module power at any moment; The efficiency factor is... In the time module The proportion converted into effective output; the effective output includes mechanical work or light energy.

3. The method according to claim 1, characterized in that, The steady-state thermal simulation analysis based on the average heat generation power yields parameter information for pre-selected components, including: Steady-state thermal simulation analysis is performed based on the average heat generation power. A simulation model is established according to the steady-state thermal simulation process, boundary conditions are set, and the solution is obtained to obtain the parameter information of the preset selected components.

4. The method according to claim 1, characterized in that, The equivalent convective heat transfer coefficient is obtained by analyzing and calculating based on the parameter information, and the formula used includes: ； in, It is the equivalent convective heat transfer coefficient; This is a correction factor; The average surface heat flux density of the component; The steady-state temperature of the component; The ambient temperature.

5. The method according to claim 1, characterized in that, The time constant is calculated based on the equivalent convective heat transfer coefficient, and the formula used includes: ； in, It is a time constant; The density of the material; Specific heat capacity; For volume; The equivalent convective heat transfer coefficient is mentioned above; is the surface area.

6. The method according to claim 1, characterized in that, The transient temperature response expression, derived based on the time constant and ambient temperature, includes the following formulas: ； in, for The transient temperature response expression of the components of the dynamic power module at any given time; The steady-state temperature of the component; Ambient temperature; is the time constant.

7. A dynamic power module temperature variation characteristic analysis system, used to implement the method as described in any one of claims 1 to 6, characterized in that, The system includes: The first module is used to receive dynamic power data; the dynamic power data includes module power and efficiency factor. The second module is used to perform energy equivalence processing on the dynamic power data to obtain the average heating power; The third module is used to perform steady-state thermal simulation analysis based on the average heat generation power to obtain parameter information of preset selected components; the parameter information includes steady-state temperature and surface heat flux density. The fourth module is used to analyze and calculate based on the parameter information to obtain the equivalent convective heat transfer coefficient; The fifth module is used to calculate the time constant based on the equivalent convective heat transfer coefficient. The sixth module is used to obtain the transient temperature response expression based on the time constant and the ambient temperature; The seventh module is used to analyze the transient temperature response expression to obtain the temperature change characteristic information of the dynamic power module.

8. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the method according to any one of claims 1 to 6.

9. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method of any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the method of any one of claims 1 to 6.

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