Composite circuit board, display module and display device

Abstract

The embodiment of the invention discloses a composite circuit board, a display module and a display device, a display panel is bound on a first binding terminal of the composite circuit board, and a second binding terminal of the composite circuit board is used for binding a fingerprint chip. The panel signal processing circuit and the fingerprint signal processing circuit are integrated on the same composite circuit board, so that on one hand, the panel signal processing circuit and the fingerprint signal processing circuit can be manufactured together in the same process, and the preparation cost, the device cost and the transportation cost are further saved; on the other hand, a connector of a flexible circuit board corresponding to the fingerprint chip and a connector of a flexible circuit board corresponding to the display panel can be omitted, and the influence on signal transmission stability caused by poor contact of the connectors is avoided; in addition, a connector is omitted, space can be saved, and the overall space utilization rate corresponding to the display device is improved.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a composite circuit board, a display module, and a display device. Background Technology

[0002] Display devices with fingerprint recognition capabilities are becoming increasingly widely used.

[0003] In the existing technology, display devices with fingerprint recognition function have problems such as high cost and poor signal transmission stability. Summary of the Invention

[0004] This invention provides a composite circuit board, a display module, and a display device to reduce the cost of the display device and improve the stability of signal transmission.

[0005] According to one aspect of the present invention, a display module is provided, comprising:

[0006] Display panel;

[0007] The composite circuit board includes a panel signal processing circuit and a fingerprint signal processing circuit, which are integrated on the same composite circuit board. The composite circuit board also includes a main control interface, a first bonding terminal and a second bonding terminal. The panel signal processing circuit and the fingerprint signal processing circuit are respectively connected to the main control interface. The panel signal processing circuit is connected to the first bonding terminal. The display panel is bonded to the first bonding terminal. The fingerprint signal processing circuit is connected to the second bonding terminal.

[0008] The panel signal processing circuit is used for signal processing and / or transmission between the main control interface and the first bonding terminal; the fingerprint signal processing circuit is used for signal processing and / or transmission between the main control interface and the second bonding terminal.

[0009] Optionally, the panel signal processing circuit includes a first power management circuit and a first communication line; the two ends of the first power management circuit are respectively connected to the main control interface and the first bonding terminal, and are used to process the first main control power signal from the main control interface to obtain the panel power signal and transmit it to the display panel through the first bonding terminal; the two ends of the first communication line are respectively connected to the main control interface and the first bonding terminal, and are used to transmit the panel communication signal between the main control interface and the first bonding terminal.

[0010] And / or, the fingerprint signal processing circuit includes a second power management circuit and a second communication line; the two ends of the second power management circuit are respectively connected to the main control interface and the second bonding terminal, and are used to process the second main control power signal of the main control interface to obtain the fingerprint power signal and transmit it to the second bonding terminal; the two ends of the second communication line are respectively connected to the main control interface and the second bonding terminal, and are used to transmit the fingerprint communication signal between the main control interface and the second bonding terminal.

[0011] Optionally, the composite circuit board includes at least two conductive layers, with an insulating layer disposed between adjacent conductive layers; the panel signal processing circuit is located on at least one conductive layer, and the fingerprint signal processing circuit is located on at least one conductive layer; the orthographic projection of the second communication line on the insulating layer does not overlap with at least one of the first power management circuit, the first communication line, and the second power management circuit.

[0012] Optionally, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power management circuit on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power management circuit on the insulating layer.

[0013] Optionally, the first power management circuit includes a first main circuit and a first power trace, the first power trace being connected to the first main circuit and / or the main control interface; the first main circuit is used to process the first main control power signal of the main control interface to obtain a panel power signal, and transmit it to the first bonding terminal through the first power trace; and / or,

[0014] The second power management circuit includes a second main circuit and a second power trace. The second power trace is connected to the second main circuit and / or the main control interface. The second main circuit is used to process the second main control power signal of the main control interface to obtain the fingerprint power signal, and transmit it to the second bonding terminal through the second power trace.

[0015] Optionally, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the first power line on the insulating layer, and / or, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the second power line on the insulating layer.

[0016] Optionally, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power supply line on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power supply line on the insulating layer.

[0017] Optionally, the first main circuit includes at least one of a boost module, a buck module, a voltage regulator module, and an electrostatic discharge protection module, used to perform at least one of boost, buck, voltage regulation, or electrostatic discharge protection processing on the first main control power signal;

[0018] The second main circuit includes at least one of a boost module, a buck module, a voltage regulator module, and an electrostatic discharge protection module, used to perform at least one of the following processing on the second main control power signal: boost, buck, voltage regulation, or electrostatic discharge protection.

[0019] Optionally, the composite circuit board also includes a device area, in which the first main circuit and the second main circuit are disposed;

[0020] Multiple first circuit devices of the first main circuit and multiple second circuit devices of the second main circuit are arranged in the device area.

[0021] Optionally, at least two conductive layers include a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are the two outermost conductive layers in the thickness direction of the composite circuit board; the first conductive layer includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points.

[0022] Optionally, the device area includes a first sub-area and a second sub-area, a first main circuit is disposed in the first sub-area, a second main circuit is disposed in the second sub-area, and the distance between the first sub-area and the second sub-area is less than or equal to a preset distance;

[0023] Optional, the preset distance is less than or equal to 10 mm.

[0024] Optionally, the display module also includes a support plate, which is located on the side of the second conductive layer away from the first conductive layer; the support plate corresponds to the position of the device area, and the positions of the first main circuit and the second main circuit correspond to the same support plate.

[0025] Optionally, the composite circuit board includes a main body portion, with first bonding terminals and second bonding terminals disposed on both sides of the main body portion along a first direction. The number of first bonding terminals is multiple, and the multiple first bonding terminals are arranged along a second direction, with the first direction intersecting the second direction. A first main circuit and a second main circuit are disposed in the main body portion.

[0026] Optionally, the first power supply trace includes a first sub-trace and a second sub-trace. The first sub-trace connects the main control interface and the main circuit, and the second sub-trace connects the main circuit and the first bonding terminal.

[0027] Optionally, the second power supply trace includes a third sub-trace and a fourth sub-trace. The third sub-trace connects to the main control interface and the second main circuit, and the fourth sub-trace connects the second main circuit and the second bonding terminal.

[0028] Optionally, the second sub-wiring is located in the main body;

[0029] Optionally, the first main circuit and the second main circuit are located in the device area of ​​the main body;

[0030] Optionally, along the first direction, the second sub-trace is located on both sides of the device area.

[0031] Optionally, along the first direction, the distance between the first main circuit and the first bonding terminal is less than the distance between the first main circuit and the second bonding terminal;

[0032] Along the first direction, the distance between the second main circuit and the first bonding terminal is less than the distance between the second main circuit and the second bonding terminal.

[0033] Optionally, the second sub-trace includes a first type of second sub-trace, which is disposed on the side of the device area near the first bonding terminal and extends along a second direction;

[0034] Optionally, the second sub-trace also includes a second type of second sub-trace, the second type of second sub-trace transmitting a different signal than the first type of second sub-trace; at least a portion of the second type of second sub-trace has a different extension direction than the first type of first sub-trace, and at least a portion of the second type of second sub-trace is located in a different conductive layer than the first type of second sub-trace, and the orthographic projections of the second type of second sub-trace and the first type of second sub-trace on the insulating layer overlap;

[0035] Optionally, the second type of second sub-trace includes a first trace portion, a second trace portion, and a third trace portion. The first trace portion and the third trace portion extend along a first direction, and the second trace portion extends along a second direction. A first end of the first trace portion is connected to a first end of the second trace portion, and a second end of the first trace portion is connected to at least one first bonding terminal on a first side of a plurality of first bonding terminals. A first end of the third trace portion is connected to a second end of the second trace portion, and a second end of the third trace portion is connected to at least one first bonding terminal on a second side of a plurality of first bonding terminals. The first side and the second side are opposite sides in the second direction.

[0036] Optionally, the first and third traces are located on the same conductive layer, while the second trace is located on a different conductive layer from the first trace; the second trace and the second sub-trace of the first type are located on the same conductive layer; the first and second traces transmitting the same signal are connected through a first via penetrating the insulating layer, and the second and third traces transmitting the same signal are connected through a second via penetrating the insulating layer.

[0037] Optionally, the orthographic projections of the first trace and the second sub-trace of the first type on the insulating layer overlap;

[0038] Optionally, the orthographic projections of the third trace and the second sub-trace of the first type on the insulating layer overlap;

[0039] Optionally, the second trace is located on the side of the device area away from the first bonding terminal;

[0040] Optionally, along the second direction, the first sub-trace and the third trace are arranged on both sides of the device area.

[0041] Optionally, at least a portion of the third sub-trace extends along the first direction, and the orthographic projection of the third sub-trace on the insulating layer overlaps with that of the second sub-trace on the side of the device region away from the first bonding terminal, and the third sub-trace and the second sub-trace on the side of the device region away from the first bonding terminal are located in different conductive layers.

[0042] At least a portion of the fourth sub-trace extends along the first direction, and the orthographic projection of the fourth sub-trace on the insulating layer overlaps with that of the second sub-trace on the side of the device region away from the first bonding terminal, and the fourth sub-trace and the second sub-trace on the side of the device region away from the first bonding terminal are located in different conductive layers.

[0043] Optionally, the third sub-trace and the fourth sub-trace are located on the same conductive layer;

[0044] Optionally, the second power supply trace also includes a fifth sub-trace, which extends along the second direction, and the third sub-trace is connected to the second main circuit through the fifth sub-trace.

[0045] Optionally, the fifth sub-trace and the third sub-trace are located on different conductive layers;

[0046] Optionally, the connection point of the fifth sub-trace and the corresponding second main circuit is located on the same conductive layer.

[0047] Optionally, the second communication line is located on the side of the device area away from the first bonding terminal.

[0048] Optionally, along the first direction, a portion of the second sub-trace is disposed between the second communication line and the device area;

[0049] Optionally, the second communication line is disposed near the first edge of the main body, the main body including the first edge and the second edge, both extending along the second direction and disposed opposite to each other; a plurality of first bonding terminals are disposed on the second edge.

[0050] Optionally, the display module further includes a first protrusion, which is an integral structure with the main body and is located on the side of the main body away from the first bonding terminal; one end of the first protrusion is connected to the main body, and the other end is provided with a second bonding terminal.

[0051] Optionally, the fourth sub-line extends from the main body to the first protruding part; the second communication line extends from the main body to the first protruding part;

[0052] Optionally, multiple second bonding terminals are arranged along the first direction.

[0053] Optionally, the first protrusion has a curved structure;

[0054] Optionally, the first protrusion is arc-shaped, or the first protrusion is S-shaped.

[0055] Optionally, the first communication line includes a fourth trace portion, which extends along a first direction and is located in the main body portion. The fourth trace portion overlaps with the orthographic projection of the second sub-trace extending along a second direction on the insulating layer and are located in different conductive layers.

[0056] Optionally, the fourth trace may overlap with the fifth sub-trace in terms of their orthogonal projections on the insulating layer, and the third sub-trace may be connected to the second power management circuit via the fifth sub-trace.

[0057] Optionally, the display module further includes a second extension portion, which extends along a first direction; one end of the second extension portion is provided with a main control interface, and the other end is connected to the main body portion; wherein at least a portion of the first sub-line and the third sub-line are provided in the second extension portion; and a portion of the first communication line and a portion of the second communication line are provided in the second extension portion.

[0058] Optionally, the second extension is an integral part of the main body, or the second extension is connected to the main body via a connector.

[0059] Optionally, the second extension is located on the side of the main body away from the first bonding terminal;

[0060] Along the second direction, there is a gap between the second protrusion and the first protrusion.

[0061] According to another aspect of the present invention, a composite circuit board is provided, comprising: a panel signal processing circuit and a fingerprint signal processing circuit, wherein the panel signal processing circuit and the fingerprint signal processing circuit are integrated on the same composite circuit board;

[0062] The composite circuit board includes a main control interface, a first bonding terminal and a second bonding terminal. The first terminal of the panel signal processing circuit and the first terminal of the fingerprint signal processing circuit are respectively connected to the main control interface. The second terminal of the panel signal processing circuit is connected to the first bonding terminal, and the second terminal of the fingerprint signal processing circuit is connected to the second bonding terminal.

[0063] The panel signal processing circuit is used for signal processing and / or transmission between the main control interface and the first bonding terminal; the fingerprint signal processing circuit is used for signal processing and / or transmission between the main control interface and the second bonding terminal.

[0064] Optionally, the panel signal processing circuit includes a first power management circuit and a first communication line; the two ends of the first power management circuit are respectively connected to the main control interface and the first bonding terminal, and are used to process the first main control power signal from the main control interface to obtain the panel power signal and transmit it to the display panel through the first bonding terminal; the two ends of the first communication line are respectively connected to the main control interface and the first bonding terminal, and are used to transmit the panel communication signal between the main control interface and the first bonding terminal.

[0065] And / or, the fingerprint signal processing circuit includes a second power management circuit and a second communication line; the two ends of the second power management circuit are respectively connected to the main control interface and the second bonding terminal, and are used to process the second main control power signal of the main control interface to obtain the fingerprint power signal and transmit it to the second bonding terminal; the two ends of the second communication line are respectively connected to the main control interface and the second bonding terminal, and are used to transmit the fingerprint communication signal between the main control interface and the second bonding terminal.

[0066] Optionally, the composite circuit board includes at least two conductive layers, with an insulating layer disposed between adjacent conductive layers; the panel signal processing circuit is located on at least one conductive layer, and the fingerprint signal processing circuit is located on at least one conductive layer; the orthographic projection of the second communication line on the insulating layer does not overlap with at least one of the first power management circuit, the first communication line, and the second power management circuit.

[0067] Optionally, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power management circuit on the insulating layer, and / or the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power management circuit on the insulating layer.

[0068] Optionally, the first power management circuit includes a first main circuit and a first power trace, the first power trace being connected to the first main circuit and / or the main control interface; the first main circuit is used to process the first main control power signal of the main control interface to obtain a panel power signal, and transmit it to the first bonding terminal through the first power trace; and / or, the second power management circuit includes a second main circuit and a second power trace, the second power trace being connected to the second main circuit and / or the main control interface, the second main circuit being used to process the second main control power signal of the main control interface to obtain a fingerprint power signal, and transmit it to the second bonding terminal through the second power trace;

[0069] Optionally, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the first power line on the insulating layer, and / or, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the second power line on the insulating layer.

[0070] Optionally, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power supply line on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power supply line on the insulating layer.

[0071] Optionally, the composite circuit board also includes a device area, in which the first main circuit and the second main circuit are disposed;

[0072] Multiple first circuit devices of the first main circuit and multiple second circuit devices of the second main circuit are arranged in the device area.

[0073] Optionally, at least two conductive layers include a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are the two outermost conductive layers in the thickness direction of the composite circuit board; the first conductive layer includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points.

[0074] Optionally, the composite circuit board includes a main body portion, with first bonding terminals and second bonding terminals disposed on both sides of the main body portion along a first direction. The number of first bonding terminals is multiple, and the multiple first bonding terminals are arranged along a second direction, with the first direction intersecting the second direction. A first main circuit and a second main circuit are disposed in the main body portion.

[0075] The composite circuit board also includes a first protrusion, which is an integral structure with the main body and is located on the side of the main body away from the first bonding terminal; one end of the first protrusion is connected to the main body and the other end is provided with a second bonding terminal;

[0076] Optionally, multiple second bonding terminals are arranged along the first direction;

[0077] Optionally, the first protrusion has a curved structure;

[0078] Optionally, the first protrusion is arc-shaped, or the first protrusion is S-shaped;

[0079] Optionally, the composite circuit board further includes a second extension that extends along the first direction; one end of the second extension is provided with a main control interface, and the other end is connected to the main body; a portion of the first communication line and a portion of the second communication line are provided in the second extension.

[0080] Optionally, the second extension is an integral part of the main body, or the second extension is connected to the main body via a connector.

[0081] According to another aspect of the present invention, a display device is provided, optionally including a composite circuit board of any embodiment of the present invention, and further including a display panel and a fingerprint chip;

[0082] The display panel and the composite circuit board are bonded together via the first bonding terminal, and the fingerprint chip and the composite circuit board are bonded together via the second bonding terminal.

[0083] Optionally, the display panel includes a display area, a bending area, and a bonding area. The bending area is located between the display area and the bonding area, and the bonding area is bent to the backlight surface of the display panel through the bending area. A first bonding terminal and a second bonding terminal are disposed in the bonding area, and the fingerprint chip is attached to the backlight surface of the panel.

[0084] Optionally, the fingerprint chip is an ultrasonic fingerprint chip.

[0085] The composite circuit board, display module, and display device of this invention have a display panel bonded to a first bonding terminal of the composite circuit board, and a second bonding terminal of the composite circuit board for bonding a fingerprint chip. The panel signal processing circuit and the fingerprint signal processing circuit are respectively connected to the main control interface. Thus, the panel signal processing circuit can realize signal processing and / or transmission between the main control interface and the first bonding terminal, and the fingerprint signal processing circuit can realize signal processing and / or transmission between the main control interface and the second bonding terminal. The panel signal processing circuit and the fingerprint signal processing circuit are integrated on the same composite circuit board. On the one hand, this allows the panel signal processing circuit and the fingerprint signal processing circuit to be fabricated together in the same process, thereby saving manufacturing costs, component costs, and transportation costs. On the other hand, it eliminates the need for connectors between the flexible circuit board corresponding to the fingerprint chip and the flexible circuit board corresponding to the display panel, avoiding the impact of poor connector contact on signal transmission stability. Furthermore, eliminating the connectors also saves space and improves the overall space utilization of the display device.

[0086] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0087] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0088] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention;

[0089] Figure 2 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0090] Figure 3 This is a schematic diagram of a pixel circuit in related technologies;

[0091] Figure 4 This is a schematic diagram of another pixel circuit structure in related technologies;

[0092] Figure 5 This is a top view of a composite circuit board.

[0093] Figure 6 This is a cross-sectional view of a composite circuit board provided in an embodiment of the present invention;

[0094] Figure 7 This is a schematic diagram of another composite circuit board structure provided in an embodiment of the present invention;

[0095] Figure 8 This is a schematic diagram of the structure of a display panel provided in an embodiment of the present invention;

[0096] Figure 9 This is a schematic diagram of another composite circuit board structure provided in an embodiment of the present invention;

[0097] Figure 10 This is a schematic diagram of another composite circuit board structure provided in an embodiment of the present invention;

[0098] Figure 11 This is a schematic diagram of another display module provided in an embodiment of the present invention;

[0099] Figure 12 This is a schematic diagram of the structure of a composite circuit board provided in an embodiment of the present invention;

[0100] Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention;

[0101] Figure 14 This is a schematic diagram of another display device provided in an embodiment of the present invention. Detailed Implementation

[0102] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0103] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0104] As described in the background section, existing display devices with fingerprint recognition functionality suffer from high cost and poor signal transmission stability. The inventors have discovered that this problem arises because, in the display device, the fingerprint recognition module is connected to a first flexible circuit board, the display panel is connected to a second flexible circuit board, and the first flexible circuit board is connected to the second flexible circuit board via a connector, and then connected to the mainboard of the display device via the second flexible circuit board. This results in two problems: firstly, the flexible circuit boards for the panel and the fingerprint recognition module need to be manufactured independently, increasing manufacturing costs; secondly, the connector connection method increases the risk of poor contact, affecting the stability of signal transmission.

[0105] For the reasons stated above, embodiments of the present invention provide a display module. Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention, for reference. Figure 1 The display module includes a display panel 100 and a composite circuit board 200, including a panel signal processing circuit 210 and a fingerprint signal processing circuit 220, which are integrated on the same composite circuit board 200. The composite circuit board 200 also includes a main control interface J1, a first bonding terminal J2, and a second bonding terminal J3. The panel signal processing circuit 210 and the fingerprint signal processing circuit 220 are respectively connected to the main control interface J1, the panel signal processing circuit 210 is connected to the first bonding terminal J2, the display panel 100 is bonded to the first bonding terminal J2, and the fingerprint signal processing circuit 220 is connected to the second bonding terminal J3. The panel signal processing circuit 210 is used for signal processing and / or transmission between the main control interface J1 and the first bonding terminal J2; the fingerprint signal processing circuit 220 is used for signal processing and / or transmission between the main control interface J1 and the second bonding terminal J3.

[0106] The display panel 100 can be a panel structure with display function, such as a liquid crystal display (LCD) panel or a light emitting diode (LED) display panel. LED display panels can be, for example, organic light-emitting diode (OLED) display panels, micro light-emitting diode (Micro LED) display panels, or quantum dot light-emitting diode (QLED) display panels. In some embodiments, the display panel 100 also integrates touch functionality. For example, the display panel 100 includes a display sub-panel with display function and a touch sub-panel with touch function, with the touch sub-panel disposed on one side of the display sub-panel. In this case, the touch function layer of the touch sub-panel and the display function layer of the display sub-panel are different film layers, and they are fabricated independently. In the display panel 100, the touch function layer can also be fabricated in the same process as the display function layer, that is, at least a portion of the film layers of the touch function layer and the display function layer are located in the same layer. This embodiment of the invention does not specifically limit the specific application of this invention.

[0107] The display module also includes a composite circuit board 200, which includes a main control interface J1, a panel signal processing circuit 210, a fingerprint signal processing circuit 220, a first bonding terminal J2, and a second bonding terminal J3. The main control interface J1 is used to connect to the motherboard of the display device. The composite circuit board 200 can receive signals from the motherboard through the main control interface J1, and can also send signals to the motherboard through the main control interface J1. The panel signal processing circuit 210 is connected to the main control interface J1 and also to the first bonding terminal J2. Thus, the panel signal processing circuit 210 can perform signal processing and / or transmission between the main control interface J1 and the first bonding terminal J2. When the display panel 100 is bonded to the first bonding terminal J2, the panel signal processing circuit 210 can perform signal processing or transmission between the main control interface J1 and the display panel 100. The signals transmitted between the main control interface J1 and the first bonding terminal J2 are referred to as panel signals. Panel signals include, but are not limited to, panel power signals and panel communication signals. Panel power signals may include display power signals and / or touch power signals, and panel communication signals include, but are not limited to, display communication signals and / or touch communication signals. The panel signal processing circuit 210 may include a first circuit section and a first wiring section, wherein the first circuit section can be used for panel signal processing, and the first wiring section can be used for panel signal transmission.

[0108] The fingerprint signal processing circuit 220 is connected to the main control interface J1 and also to the second bonding terminal J3. Thus, the fingerprint signal processing circuit 220 can realize signal processing and / or transmission between the main control interface J1 and the second bonding terminal J3. In the display device, the fingerprint chip is bonded to the second bonding terminal J3, and the fingerprint signal processing circuit 220 can realize signal processing or transmission between the main control interface J1 and the fingerprint signal. The signal transmitted between the main control interface J1 and the second bonding terminal J3 is denoted as the fingerprint signal, which includes, but is not limited to, fingerprint power signals and fingerprint communication signals. The fingerprint signal processing circuit 220 may include a second circuit section and a second wiring section, wherein the second circuit section can be used for fingerprint signal processing, and the second wiring section can be used for fingerprint signal transmission.

[0109] As described above, the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 are respectively connected to the main control interface J1. Optionally, the main control interface J1 includes multiple pins, and the pins of the main control interface J1 to which the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 are connected are different. That is, the panel signal and the fingerprint signal are transmitted through different pins of the main control interface J1. In this embodiment of the invention, the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 are integrated on the same composite circuit board 200. That is, the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 are fabricated on the same circuit board, and the composite circuit board 200 integrating the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 is connected to the motherboard of the display device through the main control interface J1.

[0110] In this embodiment of the invention, the display module has a display panel bonded to a first bonding terminal of a composite circuit board, and a second bonding terminal of the composite circuit board for bonding a fingerprint chip. The panel signal processing circuit and the fingerprint signal processing circuit are respectively connected to the main control interface. Thus, the panel signal processing circuit can perform signal processing and / or transmission between the main control interface and the first bonding terminal, and the fingerprint signal processing circuit can perform signal processing and / or transmission between the main control interface and the second bonding terminal. Integrating the panel signal processing circuit and the fingerprint signal processing circuit on the same composite circuit board allows them to be fabricated together in the same process, thereby saving manufacturing costs, component costs, and transportation costs. Furthermore, it eliminates the need for connectors between the flexible circuit board corresponding to the fingerprint chip and the flexible circuit board corresponding to the display panel, avoiding the impact of poor connector contact on signal transmission stability. Additionally, eliminating the connectors saves space and improves the overall space utilization of the display device.

[0111] Figure 2 This is a schematic diagram of another display module provided in an embodiment of the present invention, for reference. Figure 2 In some optional embodiments, the panel signal processing circuit 210 includes a first power management circuit 211 and a first communication line 212; the two ends of the first power management circuit 211 are respectively connected to the main control interface J1 and the first bonding terminal J2, and are used to process the first main control power signal from the main control interface J1 to obtain the panel power signal and transmit it to the display panel 100 through the first bonding terminal J2; the two ends of the first communication line 212 are respectively connected to the main control interface J1 and the first bonding terminal J2, and are used to transmit the panel communication signal between the main control interface J1 and the first bonding terminal J2.

[0112] One end of the first power management circuit 211 is connected to the main control interface J1, and the other end is connected to the first bonding terminal J2. The motherboard can transmit the first main control power signal to the first power management circuit 211 through the main control interface J1. The first power management circuit 211 processes the first main control power signal to obtain the panel power signal and transmits it to the first bonding terminal J2. In this way, it is ensured that the motherboard can supply power to the display panel 100 through the composite circuit board 200, and that the obtained panel power signal can meet the actual needs of the display panel 100.

[0113] Optionally, the display panel 100 includes multiple pixel circuits. Figure 3 This is a schematic diagram of a pixel circuit in related technologies, for reference. Figure 3 The pixel circuit includes a data writing module 10, a driving module 20, and a storage module 30. The first end of the data writing module 10 is connected to the data line Data, and the second end of the data writing module 10 is connected to the control terminal of the driving module 20. The storage module 30 is also connected to the control terminal of the driving module 20. The first end of the driving module 20 is connected to the first power line VDD, and the second end of the driving module 20 is connected to the first end of the light-emitting module 40. The second end of the light-emitting module 40 is connected to the second power line VSS. The storage module 30 is also connected to the first power line VDD. Figure 4 This is a schematic diagram of another pixel circuit structure in related technologies, for reference. Figure 4The pixel circuit includes a data writing module 10, a driving module 20, a compensation module 50, a first light-emitting control module 60, a second light-emitting control module 70, a first initialization module 80, a second initialization module 90, and a storage module 30. The first end of the data writing module 10 is connected to the data line Data, and the second end of the data writing module 10 is connected to the first end of the driving module 20. The compensation module 50 is connected between the control terminal and the second terminal of the driving module 20. The first light-emitting control module 60 is connected between the first power line VDD and the first terminal of the driving module 20. The second light-emitting control module 70 is connected between the second terminal of the driving module 20 and the first terminal of the light-emitting module 40, and the second terminal of the light-emitting module 40 is connected to the second power line VSS. One end of the first initialization module 80 is connected to the first initialization signal line Vref1, and the other end is connected to the control terminal of the driving module 20. One end of the second initialization module 90 is connected to the second initialization signal line Vref2, and the other end is connected to the first terminal of the light-emitting module 40. The two ends of the storage module 30 are respectively connected to the control terminal of the driving module 20 and the first power line VDD.

[0114] Optionally, the panel power signals include, but are not limited to, the first power supply voltage on the first power line VDD, the second power supply voltage on the second power line VSS, the first initialization voltage on the first initialization signal line Vref1, and the second initialization voltage on the second initialization signal line Vref2.

[0115] Continue to refer to Figure 2The first communication line 212 is connected at one end to the main control interface J1 and at the other end to the first bonding terminal J2. The pins of the first communication line 212 and the main control interface J1 to which the first power management circuit 211 is connected are different, and the first bonding terminal J2 to which the first communication line 212 and the first power management circuit 211 are also different. The motherboard can transmit panel communication signals to the first communication line 212 through the main control interface J1, and the display panel 100 can also transmit feedback signals to the motherboard through the first communication line 212. Thus, normal communication between the display panel 100 and the motherboard can be achieved through the composite circuit board 200. The panel communication signals include, but are not limited to, panel clock signals, panel reset signals, and image data signals corresponding to the display panel 100, or other communication signals that enable the display panel 100 to perform display and / or touch functions. For example, the motherboard inputs image data signals to the composite circuit board 200 through the main control interface J1. The composite circuit board transmits the image data signals to the first bonding terminal J2 through the first communication line 212. The first bonding terminal J2 can transmit the image data signals to the display driver chip of the display module. The display driver chip outputs the corresponding data voltage to the pixel circuit in the display panel according to the image data signals, thereby realizing the display of the image. For example, the motherboard inputs touch control signals (such as configuration parameters of the touch driver chip, such as scanning frequency and power consumption mode) to the composite circuit board 200 through the main control interface J1. The composite circuit board transmits image data signals to the first bonding terminal J2 through the first communication line 212. The first bonding terminal J2 can transmit the touch control signals to the touch driver chip of the display module. The touch driver chip outputs touch driving signals to the touch transmitting electrode in the display panel according to the touch control signals. The touch receiving electrode can feed back the corresponding touch feedback signals to the touch driver chip. The touch driver chip processes the touch feedback signals and packages the obtained processing results (such as the final touch coordinates, touch pressure and gesture type) and sends them back to the motherboard through the first communication line 212.

[0116] Continue to refer to Figure 2 In some optional embodiments, the fingerprint signal processing circuit 220 includes a second power management circuit 221 and a second communication line 222; the two ends of the second power management circuit 221 are respectively connected to the main control interface J1 and the second bonding terminal J3, and are used to process the second main control power signal of the main control interface J1 to obtain a fingerprint power signal that is transmitted to the second bonding terminal J3; the two ends of the second communication line 222 are respectively connected to the main control interface J1 and the second bonding terminal J3, and are used to transmit the fingerprint communication signal between the main control interface J1 and the second bonding terminal J3.

[0117] One end of the second power management circuit 221 is connected to the main control interface J1, and the other end is connected to the second bonding terminal J3. The motherboard can transmit the second main control power signal to the second power management circuit 221 through the main control interface J1. The second power management circuit 221 processes the second main control power signal to obtain the fingerprint power signal and transmits it to the second bonding terminal J3. In this way, it is ensured that the motherboard can supply power to the fingerprint chip through the composite circuit board 200 and that the obtained fingerprint power signal can meet the actual needs of the fingerprint chip.

[0118] The second communication line 222 is connected at one end to the main control interface J1 and at the other end to the second bonding terminal J3. The pins of the second communication line 222 and the main control interface J1 connected to the second power management circuit 221 are different, and the second bonding terminal J3 connected to the second power management circuit 221 is also different. The motherboard can transmit fingerprint communication signals to the second communication line 222 through the main control interface J1, and the fingerprint chip can also transmit feedback signals to the motherboard through the second communication line 222. Thus, normal communication between the fingerprint chip and the motherboard can be achieved through the composite circuit board 200. The fingerprint communication signals include, but are not limited to, start commands to control the fingerprint chip to begin fingerprint recognition, stop commands to control the fingerprint chip to stop fingerprint recognition, fingerprint clock signals, or communication signals that enable the fingerprint chip to perform fingerprint recognition. For example, the motherboard inputs a fingerprint recognition command (e.g., a start image acquisition command or a low-power monitoring mode command) to the composite circuit board 200 via the main control interface J1. The composite circuit board transmits the fingerprint recognition command to the second bonding terminal J3 via the second communication line 222. The second bonding terminal J3 can transmit the fingerprint recognition command to the fingerprint chip, and the fingerprint chip performs corresponding actions according to the fingerprint recognition command. For instance, the fingerprint chip outputs a detection signal based on the start image acquisition command. For example, for an ultrasonic fingerprint chip, it emits ultrasonic pulses of a specific frequency. When the ultrasonic waves reach the finger surface, the reflection intensity and reflection time differ between the ridges (contact screen) and valleys (with air gaps). The reflection is faster and stronger at the ridges, and slower and weaker at the valleys. The fingerprint chip receives these reflected ultrasonic waves (echoes) and calculates the depth information of the finger surface texture based on the intensity and time of the echoes, thereby constructing a three-dimensional, high-precision fingerprint image. Then, the fingerprint chip can determine whether the fingerprint recognition is successful based on the comparison between the fingerprint image and a pre-stored image, and then feed back the result to the motherboard via the second communication line 222. In other embodiments, the fingerprint chip can feed back the obtained fingerprint image to the motherboard via the second communication line 222, and the motherboard can determine whether the fingerprint recognition is successful.

[0119] Optionally, the composite circuit board 200 includes at least two conductive layers, with an insulating layer between adjacent conductive layers; the panel signal processing circuit 210 is located on at least one conductive layer, and the fingerprint signal processing circuit 220 is located on at least one conductive layer; the orthographic projection of the second communication line 222 onto the insulating layer does not overlap with at least one of the first power management circuit 211, the first communication line 212, and the second power management circuit 221. This ensures that the signal transmitted by the second communication line 222 is not interfered with by the signals transmitted by the first power management circuit 211, the first communication line 212, and the second power management circuit 221, thereby guaranteeing the accuracy and reliability of the signal transmitted by the second communication line 222. Optionally, the insulating layer is made of a flexible material to ensure that the composite circuit board 200 has good flexibility. For example, the insulating layer is made of polyimide.

[0120] In some embodiments, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the first power management circuit 211 on the insulating layer, and / or, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the second power management circuit 221 on the insulating layer. This allows for a more compact arrangement of lines and circuit components in the composite circuit board 200, optimizes the layout of lines and circuit components in the composite circuit board 200, reduces the area of ​​the composite circuit board 200, and thus allows for more space to be reserved for other structural modules in the display device.

[0121] Where the orthographic projections of the first communication line 212 and the first power management circuit 211 on the insulating layer overlap, the first communication line 212 and the first power management circuit 211 are on different conductive layers at the overlapping location. Similarly, where the orthographic projections of the first communication line 212 and the second power management circuit 221 on the insulating layer overlap, the first communication line 212 and the second power management circuit 221 are on different conductive layers at the overlapping location.

[0122] Continue to refer to Figure 2 Optionally, the first power management circuit 211 includes a first main circuit 2111 and a first power line L1. The first power line L1 is connected to the first main circuit 2111 and / or the main control interface J1. The first main circuit 2111 is used to process the first main control power signal of the main control interface J1 to obtain the panel power signal, and transmit it to the first bonding terminal J2 through the first power line L1.

[0123] Optionally, the first power supply trace L1 includes a first sub-trace L11 and a second sub-trace L12. The first sub-trace L11 connects the main control interface J1 and the first main circuit 2111, and is used to transmit the first main control power signal. The second sub-trace L12 connects the main circuit and the first bonding terminal J2, and is used to transmit the panel power signal. The first main circuit 2111 includes multiple first circuit devices, which include active devices and / or passive devices. Passive devices include, but are not limited to, resistors, capacitors, and inductors. Active devices include, but are not limited to, transistors, integrated circuits (chips), and diodes. The first main circuit 2111 can process the first main control power signal to obtain the panel power signal. Optionally, the first main circuit 2111 includes at least one of a boost module, a buck module, a voltage regulator module, and an electrostatic discharge protection module, used to perform at least one of the following processing on the first main control power signal: boost, buck, voltage regulation, or electrostatic discharge protection, so that the obtained panel power signal meets the power supply requirements of the display panel 100.

[0124] Continue to refer to Figure 2 Optionally, the second power management circuit 221 includes a second main circuit 2211 and a second power line L2. The second power line L2 is connected to the second main circuit 2211 and / or the main control interface J1. The second main circuit 2211 is used to process the second main control power signal of the main control interface J1 to obtain the fingerprint power signal, and transmit it to the second bonding terminal J3 through the second power line L2.

[0125] Optionally, the second power supply trace L2 includes a third sub-trace L21 and a fourth sub-trace L22. The third sub-trace L21 connects to the main control interface J1 and the second main circuit 2211, and is used to transmit the second main control power signal. The fourth sub-trace L22 connects the second main circuit 2211 and the second bonding terminal J3, and is used to transmit the fingerprint power signal. The second main circuit 2211 includes multiple second circuit devices, including active devices and / or passive devices. The second main circuit 2211 can process the second main control power to obtain the fingerprint power signal. Optionally, the second main circuit 2211 includes at least one of a boost module, a buck module, and an electrostatic discharge (ESD) protection module, used to perform at least one of the following processing on the second main control power signal: boost, buck, voltage regulation, or ESD protection, so that the obtained fingerprint power signal meets the power supply requirements of the fingerprint chip.

[0126] Optionally, the orthographic projection of the second communication line 222 on the insulating layer does not overlap with the orthographic projection of the first power supply line L1 on the insulating layer, and / or, the orthographic projection of the second communication line 222 on the insulating layer does not overlap with the orthographic projection of the second power supply line L2 on the insulating layer, thereby reducing the mutual influence between the signals transmitted by the second communication line 222 and the signals transmitted by the first power supply line L1, and / or reducing the mutual influence between the signals transmitted by the second communication line 222 and the signals transmitted by the second power supply line L2, ensuring the accuracy and reliability of the signals transmitted by the composite circuit.

[0127] In some embodiments, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the first power trace L1 on the insulating layer, and / or, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the second power trace L2 on the insulating layer. This allows the lines to be arranged more densely on the composite circuit board 200, optimizing the layout of the lines on the composite circuit board 200 and reducing space occupation.

[0128] Figure 5 This is a top view schematic diagram of a composite circuit board 200, for reference. Figure 5 Optionally, the composite circuit board 200 further includes a device area A1, in which a first main circuit 2111 and a second main circuit 2211 are disposed; a plurality of first circuit devices of the first main circuit 2111 and a plurality of second circuit devices of the second main circuit 2211 are disposed in the device area A1.

[0129] In this embodiment, device area A1 is used to house the first circuit components of the first main circuit 2111 and the second circuit components of the second main circuit 2211. To ensure the thinness and lightness of the display device, device area A1 may have certain height restrictions. In this embodiment, by integrating the panel signal processing circuit 210 and the fingerprint signal processing circuit 220 onto the same composite circuit board 200, the first main circuit 2111 and the second main circuit 2211 are located on the same circuit board, allowing them to be located in the same device area A1. Compared to existing technologies where the fingerprint chip and the display panel 100 are connected to different flexible circuit boards, this allows the first and second circuit components to be centrally located, meaning the distance between the first main circuit 2111 and the second main circuit 2211 is closer, or the first main circuit 2111 and the second main circuit 2211 are integrated, for example, the first... The same type of circuit components in the first main circuit 2111 and the second main circuit 2211 are clustered together. For example, the resistors of the first main circuit 2111 and the second main circuit 2211 are set in the same area, and the capacitors of the first main circuit 2111 and the second main circuit 2211 are set in the same area. In this way, the component area A1 with limited height requirements is concentrated. Correspondingly, the area with unlimited height requirements of the composite circuit board 200 will also be concentrated, making the continuous unlimited height area larger. Then, other structural modules of the display device, such as cameras or other sensors, can be set in the unlimited height area, optimizing the space utilization of the display device, while ensuring that the display device is relatively thin and light.

[0130] Optionally, at least two conductive layers 230 include a first conductive layer 231 and a second conductive layer 232, wherein the first conductive layer 231 and the second conductive layer 232 are the two outermost conductive layers in the thickness direction of the composite circuit board 200; the first conductive layer 231 includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points. Optionally, the connection points include pads, and the first circuit device and the second circuit device can be soldered to the corresponding pads.

[0131] Optionally, device area A1 includes a first sub-area A11 and a second sub-area A12. A first main circuit 2111 is disposed in the first sub-area A11, and a second main circuit 2211 is disposed in the second sub-area A12. The distance between the first sub-area A11 and the second sub-area A12 is less than or equal to a preset distance. In this embodiment, the first main circuit 2111 and the second main circuit 2211 are disposed in different sub-areas of device area A1. That is, multiple first circuit devices of the first main circuit 2111 are centrally disposed, and multiple second circuit devices of the second main circuit 2211 are centrally disposed. The fact that the first main circuit 2111 and the second main circuit 2211 are disposed in different sub-areas reduces the mutual interference of signals between them. Simultaneously, the distance d1 between the first sub-area A11 and the second sub-area A12 is less than or equal to a preset distance. Optionally, the preset distance is less than or equal to 10 mm, ensuring that the first and second circuit devices are relatively concentrated, thus optimizing the space utilization of the display device.

[0132] Figure 6 This is a cross-sectional view of a composite circuit board provided in an embodiment of the present invention, with reference to... Figure 6 In some embodiments, the display module further includes a support plate 300, which is located on the side of the second conductive layer 232 away from the first conductive layer 231. The support plate 300 corresponds to the position of the device area A1, and the positions of the first main circuit 2111 and the second main circuit 2211 correspond to the same support plate 300. An insulating layer 240 is disposed between adjacent conductive layers 230.

[0133] Optionally, the composite circuit board 200 is a flexible circuit board. The rigidity of the support plate 300 is greater than that of the composite circuit board 200. By setting the support plate 300, the composite circuit board 200 can be made flat and less prone to deformation at the position of the device area A1, so that the first circuit device and the second circuit device can be stably connected at the connection point, thereby ensuring the reliability of signal transmission. Since the positions of the first main circuit 2111 and the second main circuit 2211 are close or merged, and the positions of the first main circuit 2111 and the second main circuit 2211 correspond to the same support plate 300, there is no need to set different support plates 300 for the first main circuit 2111 and the second main circuit 2211, and the area of ​​the support plate 300 is kept small, reducing the space occupied by the support plate 300 and further optimizing the space utilization of the display device.

[0134] Optionally, the support plate 300 is made of steel. This ensures that the support plate 300 has good rigidity and provides good support for the device area A1 of the composite circuit board 200.

[0135] Optionally, a protective layer 250 is provided between the support plate 300 and the second conductive layer 232. This ensures that the support plate 300 will not damage the lines or circuit devices on the composite circuit board 200. The protective layer 250 is made of an insulating material, thereby ensuring good insulation between the support plate 300 and the second conductive layer 232.

[0136] Continue to refer to Figure 1 and Figure 2 Optionally, the composite circuit board 200 includes a main body 201. Along the first direction x, a first bonding terminal J2 and a second bonding terminal J3 are disposed on both sides of the main body 201. The number of first bonding terminals J2 is multiple. The multiple first bonding terminals J2 are arranged along the second direction y, and the first direction x intersects the second direction y. A first main circuit 2111 and a second main circuit 2211 are disposed in the main body 201.

[0137] by Figure 1 and Figure 2 Taking the display module shown as an example, the first direction x can be the length direction of the display module, and the second direction y can be the width direction of the display panel 100. Optionally, the main body 201 of the composite circuit board 200 is the part where the first main circuit 2111 and the second main circuit 2211 are located, that is, the device area A1 is set in the main body 201 of the composite circuit board 200, and the first main circuit 2111 and the second main circuit 2211 are set in the device area of ​​the main body 201. In some embodiments, the composite circuit board 200 also includes other branches besides the main body 201. Optionally, the area of ​​the main body 201 is larger than the area of ​​each branch. Since there are a large number of first bonding terminals J2, in this embodiment, along the first direction x, the first bonding terminals J2 and the second bonding terminals J3 are set on both sides of the main body 201, so that the first bonding terminals J2 have a larger setting space on one side of the main body 201, thus optimizing the bonding terminal layout of the composite circuit board 200. Since the fingerprint chip is usually attached to the backlight surface of the display module, the first bonding terminal J2 is located on the side close to the panel terminal of the display panel 100. The first bonding terminal J2 can be bonded to the panel terminal. The second bonding terminal J3 is far away from the panel terminal relative to the first bonding terminal J2, so that there is no panel terminal at the position of the second bonding terminal J3. This ensures that the bonding of the first bonding terminal J2 to the panel terminal and the bonding of the second bonding terminal J3 to the chip terminal of the fingerprint chip will not affect each other, thus ensuring the reliability of the transmission of panel signals and fingerprint signals in the display device.

[0138] Figure 7 This is a schematic diagram of another composite circuit board 200 provided in an embodiment of the present invention, for reference. Figure 7 , Figure 7The diagram shows a first power supply trace L1 and a second power supply trace L2. As described above, the first power supply trace L1 includes a first sub-trace L11 and a second sub-trace L12. The first sub-trace L11 connects the main control interface J1 and the main circuit, and the second sub-trace L12 connects the main circuit and the first bonding terminal J2. The second power supply trace L2 includes a third sub-trace L21 and a fourth sub-trace L22. The third sub-trace L21 connects the main control interface J1 and the second main circuit 2211, and the fourth sub-trace L22 connects the second main circuit 2211 and the second bonding terminal J3. Optionally, the second sub-trace L12 is located in the main body 201. In some embodiments, along the first direction x, the second sub-trace L12 is located on both sides of the device region A1. Because the power signal transmission traces are relatively wide, placing all the first sub-traces L11 on the same side of the device area A1 would cause the device area A1 along the first direction x to deviate significantly from the center of the main body 201. In other words, the device area A1 along the first direction x would be close to the edge of the composite circuit board 200, making the devices in device area A1 prone to damage at the edge. In this embodiment, the second sub-traces L12 are positioned on both sides of the device area A1 along the first direction x, meaning the device area A1 along the first direction x is located between the second sub-traces L12. This makes the device area A1 relatively centered along the first direction x, reducing the risk of device damage in device area A1, thereby ensuring the reliability of signal transmission from the composite circuit board 200 and ultimately ensuring a good display effect for the display module.

[0139] Continue to refer to Figure 7 Optionally, along the first direction x, the distance d2 between the first main circuit 2111 and the first bonding terminal J2 is less than the distance d3 between the first main circuit 2111 and the second bonding terminal J3; along the first direction x, the distance d4 between the second main circuit 2211 and the first bonding terminal J2 is less than the distance d5 between the second main circuit 2211 and the second bonding terminal J3.

[0140] Specifically, when the display panel 100 displays an image, it is significantly affected by the voltage drop of the power signal, which in turn affects the uniformity of the displayed image. In this embodiment, the distance d2 between the first main circuit 2111 and the first bonding terminal J2 along the first direction x is set to be less than the distance d3 between the first main circuit 2111 and the second bonding terminal J3. This makes the distance d2 between the first main circuit 2111 and the first bonding terminal J2 relatively short. Consequently, the voltage drop on the first sub-trace L11 connecting the first main circuit 2111 and the first bonding terminal J2 is smaller. Thus, the voltage drop of the panel power signal transmitted to the first bonding terminal J2 on the first sub-trace L11 is smaller, which helps to improve the uniformity of the display. In this embodiment, the distance d4 between the second main circuit 2211 and the first bonding terminal J2 along the first direction x is set to be less than the distance d5 between the second main circuit 2211 and the second bonding terminal J3. This allows the second main circuit 2211 and the first main circuit 2111 to be positioned close to each other in the main body 201 along the first direction x. This makes the distance between the second main circuit 2211 and the first main circuit 2111 closer, thus concentrating the device area A1 with finite height requirements. Correspondingly, the area of ​​the composite circuit board 200 with infinite height requirements will also be concentrated, optimizing the space utilization of the display device.

[0141] Continue to refer to Figure 7 Optionally, the second sub-trace L12 includes a first-type second sub-trace L121. The first-type second sub-trace L121 is disposed on the side of the device area A1 near the first bonding terminal J2 and extends along the second direction y. Thus, the first-type second sub-trace L121 is very close to the first bonding terminal J2, which can reduce the transmission voltage drop of the panel power signal, thereby improving the display effect. Optionally, the first-type second sub-trace L121 includes at least one; in some embodiments, the first-type second sub-trace L121 includes at least two, and the signals transmitted by different first-type second sub-tracees L121 can be different.

[0142] Continue to refer to Figure 7 Optionally, the second sub-trace L12 also includes a second type of second sub-trace L122, which transmits a different signal than the first type of second sub-trace L121. At least a portion of the second type of second sub-trace L122 extends in a different direction than the first type of first sub-trace L11, and at least a portion of the second type of second sub-trace L122 is located on a different conductive layer than the first type of second sub-trace L121. Furthermore, the orthographic projections of the second type of second sub-trace L122 and the first type of second sub-trace L121 on the insulating layer overlap. This configuration optimizes the spatial layout of the second sub-trace L12 on the composite circuit board 200, which helps to reduce the area of ​​the composite circuit board 200.

[0143] Optionally, the second type of second sub-trace L122 includes at least one; in some embodiments, the second type of second sub-trace L122 includes at least two, and the signals transmitted by different second type of second sub-trace L122 may be different. For example, the second type of second sub-trace L122 at least includes a function for transmitting signals to… Figure 3 and Figure 4 The second sub-trace L121 of the first type includes at least a sub-trace for transmitting the second power supply voltage to the second power supply line; Figure 3 and Figure 4 The first power line is a sub-trace that transmits the first power supply voltage.

[0144] In some embodiments, the second sub-trace L122 of the second type includes a first trace portion L122a, a second trace portion L122b, and a third trace portion L122c. The first trace portion L122a and the third trace portion L122c extend along a first direction x, and the second trace portion L122b extends along a second direction y. The first end of the first trace portion L122a is connected to the first end of the second trace portion L122b, and the second end of the first trace portion L122a is connected to at least one first bonding terminal J2 on the first side of a plurality of first bonding terminals J2. The first end of the third trace portion L122c is connected to the second end of the second trace portion L122b, and the second end of the third trace portion L122c is connected to at least one first bonding terminal J2 on the second side of a plurality of first bonding terminals J2. The first side and the second side are opposite sides in the second direction y. Thus, the second sub-trace L122 of the second type is connected to the first bonding terminal J2 via the first trace portion L122a on the first side, and to the second bonding terminal J3 via the third trace portion L122c on the second side. Accordingly, in the display panel 100, power lines can be provided on both the first and second edges of the display panel 100, thereby reducing the signal transmission voltage drop of the power lines and improving the display effect of the display panel 100. Figure 8 This is a schematic diagram of the structure of a display panel 100 provided in an embodiment of the present invention, for reference. Figure 7 and Figure 8 Optionally, the second power line VSS is at least partially disposed around the display area AA of the display panel 100. For example, if the first side is the left side and the second side is the right side, and the bonding area of ​​the display panel 100 is located on the lower side of the display panel 100, then the second power line VSS is disposed at least on the left, right, and upper sides of the display area. In some embodiments, the second power line VSS is also disposed on the lower side of the display area, that is, the second power line VSS completely surrounds the display area AA. The second power line VSS is connected to the first trace L122a and the third trace L122c respectively, so that the second power line VSS transmits voltage to the cathode of the light-emitting device from at least two directions of the display area AA, thereby reducing the voltage drop on the cathode.

[0145] Optionally, the first trace L122a and the third trace L122c are located on the same conductive layer, while the second trace L122b is located on a different conductive layer from the first trace L122a. The second trace L122b and the second sub-trace L121 of the first type are located on the same conductive layer. The first trace L122a and the second trace L122b, which transmit the same signal, are connected through a first via penetrating the insulating layer, and the second trace L122b and the third trace L122c, which transmit the same signal, are connected through a second via penetrating the insulating layer. Optionally, the orthographic projections of the first trace L122a and the second sub-trace L121 of the first type on the insulating layer overlap. Optionally, the orthographic projections of the third trace L122c and the second sub-trace L121 of the first type on the insulating layer overlap. This configuration allows for a smaller number of conductive layers in the composite circuit board 200; for example, the composite circuit board 200 may include two conductive layers. On the other hand, by setting overlapping traces in different conductive layers, the topological area of ​​the traces in the composite circuit board 200 can be reduced, thereby reducing the area of ​​the composite circuit board 200. Simultaneously, the orthographic projections of the first trace portion L122a and the second sub-trace L121 of the first type on the insulating layer overlap, and the orthographic projections of the third trace portion L122c and the second sub-trace L121 of the first type on the insulating layer overlap. This ensures that, in the second direction y, the first trace portion L122a and the second trace portion L122b do not exceed the edge of the first type sub-trace, resulting in a smaller size of the composite circuit board 200 in the second direction y, thus ensuring that the composite circuit board 200 can be placed within the width range of the display panel 100.

[0146] like Figure 7 As shown, optionally, the second trace portion L122b is located on the side of the device area A1 away from the first bonding terminal J2, thereby realizing a composite circuit board 200 structure in the first direction x where the second sub-trace L12 is located on both sides of the device area A1. Furthermore, this makes the distance between the first type of second sub-trace L121 and the second type of second sub-trace L122 larger, reducing the mutual interference of the signals transmitted by the two.

[0147] In some embodiments, along the second direction y, the first sub-trace L11 and the third trace L122c are arranged on both sides of the device area A1. That is, along the second direction y, the device area A1 is located between the first sub-trace L11 and the third trace L122c, making the device area A1 relatively centered along the second direction y, reducing the risk of device damage in the device area A1, thereby ensuring the reliability of signal transmission of the composite circuit board 200, and thus ensuring a good display effect of the display module.

[0148] Figure 9 This is a schematic diagram of another composite circuit board structure provided in an embodiment of the present invention. Figure 10This is a schematic diagram of another composite circuit board structure provided in an embodiment of the present invention. Figure 9 The first communication line 212 and the second communication line 222 are shown in the figure. Figure 10 The diagram shows the first power supply trace L1, the second power supply trace L2, the first communication line 212, and the second communication line 222. (Refer to...) Figure 9 and Figure 10 Optionally, at least a portion of the third sub-trace L21 extends along the first direction x, and the orthographic projection of the third sub-trace L21 on the side of device region A1 away from the first bonding terminal J2 overlaps with that of the second sub-trace L12 on the side of device region A1 away from the first bonding terminal J2 on the insulating layer, and the third sub-trace L21 and the second sub-trace L12 on the side of device region A1 away from the first bonding terminal J2 are located in different conductive layers; at least a portion of the fourth sub-trace L22 extends along the first direction x, and the orthographic projection of the fourth sub-trace L22 on the side of device region A1 away from the first bonding terminal J2 overlaps with that of the second sub-trace L12 on the side of device region A1 away from the first bonding terminal J2 on the insulating layer, and the fourth sub-trace L22 and the second sub-trace L12 on the side of device region A1 away from the first bonding terminal J2 are located in different conductive layers.

[0149] Optionally, the third sub-trace L21 connects to the second main circuit 2211 from the first side of the second main circuit 2211; the fourth sub-trace L22 connects to the second main circuit 2211 from the second side of the second sub-trace L12. The third sub-trace L21 and the second sub-trace L12 overlap with the orthographic projection of the second sub-trace L12 on the side of the device area A1 away from the first bonding terminal J2 on the insulating layer, further optimizing the trace layout in the composite circuit board 200, reducing the topological area of ​​the traces on the composite circuit board 200, and thus reducing the area of ​​the composite circuit board 200.

[0150] Optionally, the third sub-trace L21 and the fourth sub-trace L22 are located on the same conductive layer; in this way, the number of conductive layers in the composite circuit board 200 can be reduced, ensuring that the composite circuit board 200 is thinner and has good bending performance.

[0151] Continue to refer to Figure 10 In some embodiments, the second power supply line L2 further includes a fifth sub-line L23, which extends along the second direction y, and the third sub-line L21 is connected to the second main circuit 2211 through the fifth sub-line L23.

[0152] Optionally, the fifth sub-trace L23 and the third sub-trace L21 are located on different conductive layers, and the fifth sub-trace L23 and the third sub-trace L21 can be connected through vias; in some embodiments, the connection point of the fifth sub-trace L23 and the corresponding connection point of the second main circuit 2211 are located on the same conductive layer. In this way, the fifth sub-trace L23 and the connection point do not need to be connected through vias, reducing the number of conductive layers of the composite circuit board 200 and facilitating the connection of the third sub-trace L21 and the corresponding connection point of the second main circuit 2211.

[0153] Continue to refer to Figure 7 , Figure 9 and Figure 10 Optionally, the second communication line 222 is located on the side of the device area A1 away from the first bonding terminal J2.

[0154] Specifically, along the first direction x, the first bonding terminal J2 and the second bonding terminal J3 are located on both sides of the device area A1. In this embodiment, the second communication line 222 is located on the side of the device area A1 away from the first bonding terminal J2, so that the distance between the second communication line 222 and the second bonding terminal J3 is relatively short, which facilitates the connection between the second communication line 222 and the second bonding terminal J3, and makes the second communication line 222 shorter, which is beneficial to ensuring the timeliness of communication.

[0155] Continue to refer to Figure 7 , Figure 9 and Figure 10 In some embodiments, along the first direction x, a portion of the second sub-trace L12 is disposed between the second communication line 222 and the device area A1. This arrangement ensures that the second communication line 222 is close to the second bonding terminal J3 relative to the second sub-trace L12, and that the second communication line 222 does not overlap with the first communication line 212 or the first power management circuit. This minimizes the impact of other signals on the communication signal on the second communication line 222, thus guaranteeing the communication reliability of the second communication line 222.

[0156] Optionally, the second communication line 222 is disposed near the first edge 261 of the main body 201. The main body 201 includes a first edge 261 and a second edge 262, both of which extend along a second direction x and are disposed opposite to each other. A plurality of first bonding terminals J2 are disposed on the second edge 262. This arrangement ensures that the second communication line 222 does not overlap with the first power management circuit 211 and the first communication line 212, and ensures that the distance of the second communication line 222 is shorter, thus ensuring the reliability and accuracy of the signal transmitted by the second communication line 222.

[0157] Continue to refer to Figure 7 , Figure 9 and Figure 10Optionally, the display module includes a first protrusion 202, which is an integral structure with the main body 201 and is located on the side of the main body 201 away from the first bonding terminal J2; one end of the first protrusion 202 is connected to the main body 201, and the other end is provided with a second bonding terminal J3.

[0158] Specifically, a portion of the second communication line 222 is disposed in the first extension portion 202, and a portion of the second power supply line L2 is disposed in the first extension portion 202. For example, the fourth sub-line L22 extends from the main body portion 201 to the first extension portion 202, and the second communication line 222 extends from the main body portion 201 to the first extension portion 202. The first extension portion 202 and the main body portion 201 are integrally structured, ensuring that the second communication line 222, the second power supply line L2, the first communication line 212, and the first power supply line L1 are on the same circuit board, rather than being connected through connectors, thus ensuring the reliability of signal transmission and saving costs.

[0159] Optionally, multiple second bonding terminals J3 are arranged along the first direction x.

[0160] In some embodiments, the first protrusion 202 has a curved structure. Specifically, since a robotic arm or other automated mechanical device is used to pull the first protrusion 202 during the manufacturing process of the display device, and then the first protrusion 202 is attached to the backlight surface of the display panel 100, setting the first protrusion 202 to have a curved structure makes the length of the first protrusion 202 longer and enhances its stress resistance. This reduces the probability of damage to the composite circuit board 200 when the robotic arm pulls in different directions or when there is a misalignment between the robotic arm and the first protrusion 202. It also reduces circuit breakage or other damage caused by pulling the first protrusion 202, ensuring higher reliability of the composite circuit board 200.

[0161] In some embodiments, the first protrusion 202 is arc-shaped. Figure 11 This is a schematic diagram of another display module provided in an embodiment of the present invention, for reference. Figure 11 In other embodiments, the first protrusion 202 is S-shaped, which allows the length of the first protrusion 202 to be further increased within a limited space, and further enhances its ability to withstand stress in different directions, thereby reducing damage to the composite circuit board 200.

[0162] Optionally, the first communication line 212 includes a fourth trace 2121 extending along a first direction x. The fourth trace is located in the main body 201. The orthographic projection of the fourth trace 2121 onto the insulating layer overlaps with that of the second sub-trace L12 extending along a second direction y, and they are located on different conductive layers. This ensures that the fourth trace 2121 does not exceed the length of the second sub-trace L12 along the second direction y, thereby preventing the fourth trace 2121 from widening the size of the composite circuit board 200 in the second direction y. This further optimizes the circuit layout of the composite circuit board 200 and reduces its area. Optionally, the first communication line 212 also includes a fifth trace 2122. One end of the fifth trace 2122 is connected to the main control interface J1, and the other end is connected to the first end of the fourth trace 2121. The second end of the fourth trace 2121 can be connected to the first bonding terminal J2. Optionally, the fifth trace 2122 and the fourth trace 2121 are located on different conductive layers and are connected by vias.

[0163] In some embodiments, the fourth trace 2121 also overlaps with the orthographic projection of the fifth sub-trace L23 on the insulating layer, and the third sub-trace L21 is connected to the second power management circuit through the fifth sub-trace L23.

[0164] Continue to refer to Figure 7 , Figure 9 and Figure 10 Optionally, the display module further includes a second extension 203, which extends along a first direction x. One end of the second extension 203 is provided with a main control interface J1, and the other end is connected to the main body 201. At least a portion of the first sub-line L11 and the third sub-line L21 are provided in the second extension 203; and a portion of the first communication line 212 and a portion of the second communication line 222 are provided in the second extension 203. By providing the second extension 203 and the main control interface J1 at the first end of the second extension 203, the connection between the composite circuit board 200 and the main board of the display device is facilitated.

[0165] In some embodiments, the second protrusion 203 and the main body 201 are an integral structure. In this case, the wiring on the second protrusion 203 and the wiring on the main body 201 are manufactured simultaneously using the same process, reducing manufacturing costs. In other embodiments, the second protrusion 203 and the main body 201 are connected by a connector. This allows for replacement of both parts if one of them is damaged, reducing subsequent maintenance costs.

[0166] Optionally, the second protrusion 203 is disposed on the side of the main body 201 away from the first bonding terminal J2; along the second direction y, there is a gap between the second protrusion 203 and the first protrusion 202. In this way, the structure of the composite circuit board 200 can be omitted between the second protrusion 203 and the first protrusion 202, and other structural modules of the display device can be arranged in the space between them, thus optimizing the spatial layout of the display device.

[0167] Optional, Figure 7 , Figure 9 and Figure 10 In the diagram, the red lines and green lines are located on the same conductive layer. The composite circuit board includes a structure with two conductive layers, resulting in fewer conductive layers and a smaller thickness. Optionally, in the conductive layers where signal lines (including the first power supply line, the second power supply line, the first communication line, and the second communication line) are not located, a grounding conductor can be installed. The grounding conductor is insulated from the signal lines.

[0168] This invention also provides a composite circuit board. Figure 12 This is a schematic diagram of a composite circuit board provided in an embodiment of the present invention, for reference. Figure 12 The composite circuit board 200 includes a panel signal processing circuit 210 and a fingerprint signal processing circuit 220, which are integrated on the same composite circuit board 200.

[0169] The composite circuit board 200 includes a main control interface J1, a first bonding terminal J2 and a second bonding terminal J3. The first end of the panel signal processing circuit 210 and the first end of the fingerprint signal processing circuit 220 are respectively connected to the main control interface J1. The second end of the panel signal processing circuit 210 is connected to the first bonding terminal J2, and the second end of the fingerprint signal processing circuit 220 is connected to the second bonding terminal J3.

[0170] The panel signal processing circuit 210 is used for signal processing and / or transmission between the main control interface J1 and the first bonding terminal J2; the fingerprint signal processing circuit 220 is used for signal processing and / or transmission between the main control interface J1 and the second bonding terminal J3.

[0171] In this embodiment of the invention, the composite circuit board integrates the panel signal processing circuit and the fingerprint signal processing circuit on the same composite circuit board. On the one hand, this allows the panel signal processing circuit and the fingerprint signal processing circuit to be fabricated together in the same process, thereby saving manufacturing costs, component costs, and transportation costs. On the other hand, it eliminates the need for connectors on the flexible circuit board corresponding to the fingerprint chip and the flexible circuit board corresponding to the display panel, avoiding the impact of poor connector contact on signal transmission stability. In addition, eliminating the connectors also saves space and improves the overall space utilization of the display device.

[0172] Combination Figure 10 and Figure 12 Optionally, the panel signal processing circuit 210 includes a first power management circuit 211 and a first communication line 212; the two ends of the first power management circuit 211 are respectively connected to the main control interface J1 and the first bonding terminal J2, and are used to process the first main control power signal from the main control interface J1 to obtain the panel power signal and transmit it to the display panel 100 through the first bonding terminal J2; the two ends of the first communication line 212 are respectively connected to the main control interface J1 and the first bonding terminal J2, and are used to transmit the panel communication signal between the main control interface J1 and the first bonding terminal J2.

[0173] And / or, the fingerprint signal processing circuit 220 includes a second power management circuit 221 and a second communication line 222; the two ends of the second power management circuit 221 are respectively connected to the main control interface J1 and the second bonding terminal J3, and are used to process the second main control power signal of the main control interface J1 to obtain a fingerprint power signal that is transmitted to the second bonding terminal J3; the two ends of the second communication line 222 are respectively connected to the main control interface J1 and the second bonding terminal J3, and are used to transmit the fingerprint communication signal between the main control interface J1 and the second bonding terminal J3;

[0174] Optionally, the composite circuit board 200 includes at least two conductive layers, with an insulating layer disposed between adjacent conductive layers; the panel signal processing circuit 210 is located on at least one conductive layer, and the fingerprint signal processing circuit 220 is located on at least one conductive layer; the orthographic projection of the second communication line 222 on the insulating layer does not overlap with at least one of the first power management circuit 211, the first communication line 212, and the second power management circuit 221.

[0175] Optionally, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the first power management circuit 211 on the insulating layer, and / or the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the second power management circuit 221 on the insulating layer.

[0176] Optionally, the first power management circuit 211 includes a first main circuit 2111 and a first power trace L1, the first power trace L1 being connected to the first main circuit 2111 and / or the main control interface J1; the first main circuit 2111 is used to process the first main control power signal of the main control interface J1 to obtain a panel power signal, and transmit it to the first bonding terminal J2 through the first power trace L1; and / or, the second power management circuit 221 includes a second main circuit 2211 and a second power trace L2, the second power trace L2 being connected to the second main circuit 2211 and / or the main control interface J1; the second main circuit 2211 is used to process the second main control power signal of the main control interface J1 to obtain a fingerprint power signal, and transmit it to the second bonding terminal J3 through the second power trace L2;

[0177] Optionally, the orthographic projection of the second communication line 222 on the insulating layer does not overlap with the orthographic projection of the first power line L1 on the insulating layer, and / or, the orthographic projection of the second communication line 222 on the insulating layer does not overlap with the orthographic projection of the second power line L2 on the insulating layer.

[0178] Optionally, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the first power line L1 on the insulating layer, and / or, the orthographic projection of the first communication line 212 on the insulating layer overlaps with the orthographic projection of the second power line L2 on the insulating layer.

[0179] Combination Figure 5 , Figure 6 and Figure 10 Optionally, the composite circuit board 200 also includes a device area A1, in which the first main circuit 2111 and the second main circuit 2211 are disposed;

[0180] Multiple first circuit devices of the first main circuit 2111 and multiple second circuit devices of the second main circuit 2211 are disposed in device area A1;

[0181] Optionally, at least two conductive layers include a first conductive layer 231 and a second conductive layer 232. The first conductive layer 231 and the second conductive layer 232 are the two outermost conductive layers in the thickness direction of the composite circuit board 200. The first conductive layer 231 includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points.

[0182] Optionally, the composite circuit board 200 includes a main body 201. Along the first direction x, first bonding terminals J2 and second bonding terminals J3 are disposed on both sides of the main body 201. The number of first bonding terminals J2 is multiple. The multiple first bonding terminals J2 are arranged along the second direction y, and the first direction x intersects the second direction y. A first main circuit 2111 and a second main circuit 2211 are disposed in the main body 201.

[0183] The composite circuit board 200 also includes a first protrusion 202, which is integral with the main body 201 and is located on the side of the main body 201 away from the first bonding terminal J2; one end of the first protrusion 202 is connected to the main body 201, and the other end is provided with a second bonding terminal J3.

[0184] Optionally, a plurality of second bonding terminals J3 are arranged along the first direction x;

[0185] Optionally, the first protrusion 202 has a curved structure;

[0186] Optionally, the first protrusion 202 is arc-shaped, or the first protrusion 202 is S-shaped;

[0187] Optionally, the composite circuit board 200 further includes a second extension 203, which extends along the first direction x; one end of the second extension 203 is provided with a main control interface J1, and the other end is connected to the main body 201; a portion of the lines of the first communication line 212 and a portion of the lines of the second communication line 222 are provided in the second extension 203.

[0188] Optionally, the second extension 203 and the main body 201 are integral structures, or the second extension 203 and the main body 201 are connected by a connector.

[0189] This invention also provides a display device. Figure 13 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, for reference. Figure 13 The display device includes a composite circuit board 200 according to any of the above embodiments of the present invention, and also includes a display panel 100 and a fingerprint chip 400. The display panel 100 is bonded to the composite circuit board 200 through a first bonding terminal J2, and the fingerprint chip 400 is bonded to the composite circuit board 200 through a second bonding terminal J3. The display device can be a mobile phone or any electronic product with display function, including but not limited to the following categories: display panels in products such as televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, automotive displays, medical devices, industrial control equipment, and touch interactive terminals. The embodiments of the present invention do not impose any special limitations on these categories.

[0190] The composite circuit board 200, with its single circuit board structure, enables signal transmission between the display panel 100 and the motherboard, as well as between the fingerprint chip 400 and the motherboard. Optionally, the fingerprint chip 400 includes a fingerprint recognition sensor and a driving circuit for the fingerprint recognition sensor; in some embodiments, the driving circuit is in chip form.

[0191] The display device of the present invention includes the composite circuit board 200 of any of the above embodiments of the present invention, or includes the display module of any of the above embodiments of the present invention, and has the beneficial effects of the composite circuit board 200 and the display module of any of the above embodiments of the present invention.

[0192] In some embodiments, the fingerprint chip 400 is an ultrasonic fingerprint chip. In other optional embodiments of the present invention, the fingerprint chip 400 may also be other forms of fingerprint chip 400, and the embodiments of the present invention are not specifically limited thereto.

[0193] Figure 14 This is a schematic diagram of another display device provided in an embodiment of the present invention, for reference. Figure 14 Optionally, the display panel 100 includes a display area AA, a bending area NAA1, and a bonding area NAA2. The bending area NAA1 is located between the display area AA and the bonding area NAA2. The bonding area NAA2 is bent to the backlight surface of the display panel 100 through the bending area NAA1. A first bonding terminal J2 and a second bonding terminal J3 are disposed in the bonding area NAA2, and the fingerprint chip 400 is attached to the backlight surface of the display panel 100. This ensures that the fingerprint chip 400 is reliably fixed.

[0194] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display module, characterized in that, include: Display panel; A composite circuit board includes a panel signal processing circuit and a fingerprint signal processing circuit, which are integrated on the same composite circuit board. The composite circuit board also includes a main control interface, a first bonding terminal, and a second bonding terminal. The panel signal processing circuit and the fingerprint signal processing circuit are respectively connected to the main control interface. The panel signal processing circuit is connected to the first bonding terminal. The display panel is bonded to the first bonding terminal, and the fingerprint signal processing circuit is connected to the second bonding terminal. The panel signal processing circuit is used for signal processing and / or transmission between the main control interface and the first bonding terminal; the fingerprint signal processing circuit is used for signal processing and / or transmission between the main control interface and the second bonding terminal.

2. The display module according to claim 1, characterized in that, The panel signal processing circuit includes a first power management circuit and a first communication line; the two ends of the first power management circuit are respectively connected to the main control interface and the first bonding terminal, and are used to process the first main control power signal from the main control interface to obtain the panel power signal and transmit it to the display panel through the first bonding terminal; the two ends of the first communication line are respectively connected to the main control interface and the first bonding terminal, and are used to transmit the panel communication signal between the main control interface and the first bonding terminal; And / or, the fingerprint signal processing circuit includes a second power management circuit and a second communication line; the two ends of the second power management circuit are respectively connected to the main control interface and the second bonding terminal, and are used to process the second main control power signal of the main control interface to obtain a fingerprint power signal for transmission to the second bonding terminal; the two ends of the second communication line are respectively connected to the main control interface and the second bonding terminal, and are used to transmit fingerprint communication signals between the main control interface and the second bonding terminal; Preferably, the composite circuit board includes at least two conductive layers, and an insulating layer is disposed between adjacent conductive layers; the panel signal processing circuit is located on at least one of the conductive layers, and the fingerprint signal processing circuit is located on at least one of the conductive layers; the orthographic projection of the second communication line on the insulating layer does not overlap with at least one of the first power management circuit, the first communication line, and the second power management circuit. Preferably, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power management circuit on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power management circuit on the insulating layer.

3. The display module according to claim 2, characterized in that, The first power management circuit includes a first main circuit and a first power trace, the first power trace being connected to the first main circuit and / or the main control interface; the first main circuit is used to process the first main control power signal of the main control interface to obtain the panel power signal, and transmit it to the first bonding terminal through the first power trace; and / or, The second power management circuit includes a second main circuit and a second power trace. The second power trace is connected to the second main circuit and / or the main control interface. The second main circuit is used to process the second main control power signal of the main control interface to obtain the fingerprint power signal, and transmit it to the second bonding terminal through the second power trace. Preferably, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the first power line on the insulating layer, and / or, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the second power line on the insulating layer; Preferably, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power supply line on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power supply line on the insulating layer.

4. The display module according to claim 3, characterized in that, The first main circuit includes at least one of a boost module, a buck module, a voltage regulator module, and an electrostatic discharge protection module, used to perform at least one of boost, buck, voltage regulation, or electrostatic discharge protection processing on the first main control power signal; The second main circuit includes at least one of a boost module, a buck module, a voltage regulator module, and an electrostatic discharge protection module, used to perform at least one of the following processing on the second main control power signal: boost, buck, voltage regulation, or electrostatic discharge protection.

5. The display module according to claim 3, characterized in that, The composite circuit board further includes a device area, in which the first main circuit and the second main circuit are disposed; A plurality of first circuit devices of the first main circuit and a plurality of second circuit devices of the second main circuit are disposed in the device area; Preferably, the at least two conductive layers include a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are the two outermost conductive layers in the thickness direction of the composite circuit board; the first conductive layer includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points.

6. The display module according to claim 5, characterized in that, The device area includes a first sub-area and a second sub-area. The first main circuit is disposed in the first sub-area, and the second main circuit is disposed in the second sub-area. The distance between the first sub-area and the second sub-area is less than or equal to a preset distance. Preferably, the preset distance is less than or equal to 10 millimeters.

7. The display module according to claim 5, characterized in that, It also includes a support plate, which is located on the side of the second conductive layer away from the first conductive layer; the support plate corresponds to the position of the device area, and the positions of the first main circuit and the second main circuit correspond to the same support plate.

8. The display module according to claim 3, characterized in that, The composite circuit board includes a main body portion. Along a first direction, first bonding terminals and second bonding terminals are disposed on both sides of the main body portion. The number of first bonding terminals is multiple. The multiple first bonding terminals are arranged along a second direction, and the first direction intersects the second direction. A first main circuit and a second main circuit are disposed in the main body portion. Preferably, the first power supply trace includes a first sub-trace and a second sub-trace, the first sub-trace connecting the main control interface and the main circuit, and the second sub-trace connecting the main circuit and the first bonding terminal; Preferably, the second power supply trace includes a third sub-trace and a fourth sub-trace, the third sub-trace connecting the main control interface and the second main circuit, and the fourth sub-trace connecting the second main circuit and the second bonding terminal; Preferably, the second sub-trace is located in the main body portion; Preferably, the first main circuit and the second main circuit are disposed in the device area of ​​the main body; Preferably, along the first direction, the second sub-trace is located on both sides of the device region.

9. The display module according to claim 8, characterized in that, Along the first direction, the distance between the first main circuit and the first bonding terminal is less than the distance between the first main circuit and the second bonding terminal; Along the first direction, the distance between the second main circuit and the first bonding terminal is less than the distance between the second main circuit and the second bonding terminal.

10. The display module according to claim 8, characterized in that, The second sub-trace includes a first type of second sub-trace, which is disposed on the side of the device region near the first bonding terminal and extends along the second direction; Preferably, the second sub-trace further includes a second type of second sub-trace, the second type of second sub-trace transmitting a different signal than the first type of second sub-trace; at least a portion of the second type of second sub-trace has a different extension direction than the first type of first sub-trace, and at least a portion of the second type of second sub-trace is located in a different conductive layer than the first type of second sub-trace, and the orthographic projections of the second type of second sub-trace and the first type of second sub-trace on the insulating layer overlap; Preferably, the second sub-trace of the second type includes a first trace portion, a second trace portion, and a third trace portion. The first trace portion and the third trace portion extend along the first direction, and the second trace portion extends along the second direction. A first end of the first trace portion is connected to a first end of the second trace portion, and a second end of the first trace portion is connected to at least one first bonding terminal on a first side of a plurality of first bonding terminals. A first end of the third trace portion is connected to a second end of the second trace portion, and a second end of the third trace portion is connected to at least one first bonding terminal on a second side of a plurality of first bonding terminals. The first side and the second side are opposite sides in the second direction. Preferably, the first trace and the third trace are located in the same conductive layer, and the second trace and the first trace are located in different conductive layers; the second trace and the second sub-trace of the first type are located in the same conductive layer; the first trace and the second trace that transmit the same signal are connected through a first via penetrating the insulating layer, and the second trace and the third trace that transmit the same signal are connected through a second via penetrating the insulating layer. Preferably, the first trace portion and the second sub-trace of the first type overlap on the insulating layer in terms of their orthographic projections; Preferably, the third trace portion overlaps with the orthographic projection of the second sub-trace of the first type onto the insulating layer; Preferably, the second trace is located on the side of the device area away from the first bonding terminal; Preferably, along the second direction, the first sub-trace and the third trace are arranged on both sides of the device region.

11. The display module according to claim 8, characterized in that, At least a portion of the third sub-trace extends along the first direction, and the third sub-trace overlaps with the orthographic projection of the second sub-trace on the side of the device region away from the first bonding terminal on the insulating layer, and the third sub-trace and the second sub-trace on the side of the device region away from the first bonding terminal are located in different conductive layers. At least a portion of the fourth sub-trace extends along the first direction, and the fourth sub-trace overlaps with the orthographic projection of the second sub-trace on the side of the device region away from the first bonding terminal on the insulating layer, and the fourth sub-trace and the second sub-trace on the side of the device region away from the first bonding terminal are located in different conductive layers. Preferably, the third sub-trace and the fourth sub-trace are located in the same conductive layer; Preferably, the second power supply trace further includes a fifth sub-trace, which extends along the second direction, and the third sub-trace is connected to the second main circuit through the fifth sub-trace; Preferably, the fifth sub-trace and the third sub-trace are located in different conductive layers; Preferably, the connection point between the fifth sub-trace and the second main circuit is located on the same conductive layer.

12. The display module according to claim 8, characterized in that, The second communication line is located on the side of the device area away from the first bonding terminal.

13. The display module according to claim 12, characterized in that, Along the first direction, a portion of the second sub-trace is disposed between the second communication line and the device area; Preferably, the second communication line is disposed near the first edge of the main body portion, the main body portion including the first edge and the second edge, the first edge and the second edge both extending along the second direction and disposed opposite to each other; a plurality of first bonding terminals are disposed on the second edge.

14. The display module according to claim 8, characterized in that, It also includes a first protrusion, which is integral with the main body and located on the side of the main body away from the first bonding terminal; one end of the first protrusion is connected to the main body and the other end is provided with the second bonding terminal; Preferably, the fourth sub-line extends from the main body to the first protruding part; the second communication line extends from the main body to the first protruding part; Preferably, a plurality of second bonding terminals are arranged along the first direction.

15. The display module according to claim 14, characterized in that, The first protrusion has a curved structure; Preferably, the first protrusion is arc-shaped, or the first protrusion is S-shaped.

16. The display module according to claim 8, characterized in that, The first communication line includes a fourth trace portion, which extends along the first direction and is located in the main body portion. The fourth trace portion overlaps with the orthographic projection of the second sub-trace extending along the second direction on the insulating layer and is located in different conductive layers. Preferably, the fourth trace overlaps with the orthographic projection of the fifth sub-trace on the insulating layer, and the third sub-trace is connected to the second power management main circuit through the fifth sub-trace.

17. The display module according to claim 14, characterized in that, It also includes a second extension portion, which extends along a first direction; one end of the second extension portion is provided with the main control interface, and the other end is connected to the main body portion; wherein, at least a portion of the first sub-wire and the third sub-wire are provided in the second extension portion; and a portion of the first communication line and a portion of the second communication line are provided in the second extension portion; Preferably, the second protrusion is integral with the main body, or the second protrusion is connected to the main body via a connector.

18. The display module according to claim 17, characterized in that, The second protrusion is located on the side of the main body away from the first bonding terminal; Along the second direction, there is a gap between the second protrusion and the first protrusion.

19. A composite circuit board, characterized in that, include: A panel signal processing circuit and a fingerprint signal processing circuit are integrated on the same composite circuit board. The composite circuit board includes a main control interface, a first bonding terminal, and a second bonding terminal. The first terminal of the panel signal processing circuit and the first terminal of the fingerprint signal processing circuit are respectively connected to the main control interface. The second terminal of the panel signal processing circuit is connected to the first bonding terminal, and the second terminal of the fingerprint signal processing circuit is connected to the second bonding terminal. The panel signal processing circuit is used for signal processing and / or transmission between the main control interface and the first bonding terminal; the fingerprint signal processing circuit is used for signal processing and / or transmission between the main control interface and the second bonding terminal.

20. The composite circuit board according to claim 19, characterized in that, The panel signal processing circuit includes a first power management circuit and a first communication line; the two ends of the first power management circuit are respectively connected to the main control interface and the first bonding terminal, and are used to process the first main control power signal from the main control interface to obtain the panel power signal and transmit it to the display panel through the first bonding terminal; the two ends of the first communication line are respectively connected to the main control interface and the first bonding terminal, and are used to transmit the panel communication signal between the main control interface and the first bonding terminal. And / or, the fingerprint signal processing circuit includes a second power management circuit and a second communication line; the two ends of the second power management circuit are respectively connected to the main control interface and the second bonding terminal, and are used to process the second main control power signal of the main control interface to obtain a fingerprint power signal for transmission to the second bonding terminal; the two ends of the second communication line are respectively connected to the main control interface and the second bonding terminal, and are used to transmit fingerprint communication signals between the main control interface and the second bonding terminal; Preferably, the composite circuit board includes at least two conductive layers, and an insulating layer is disposed between adjacent conductive layers; the panel signal processing circuit is located on at least one of the conductive layers, and the fingerprint signal processing circuit is located on at least one of the conductive layers; the orthographic projection of the second communication line on the insulating layer does not overlap with at least one of the first power management circuit, the first communication line, and the second power management circuit. Preferably, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power management circuit on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power management circuit on the insulating layer. Preferably, the first power management circuit includes a first main circuit and a first power trace, the first power trace being connected to the first main circuit and / or the main control interface; the first main circuit is used to process the first main control power signal of the main control interface to obtain the panel power signal, and transmit it to the first bonding terminal through the first power trace; and / or, the second power management circuit includes a second main circuit and a second power trace, the second power trace being connected to the second main circuit and / or the main control interface, the second main circuit being used to process the second main control power signal of the main control interface to obtain the fingerprint power signal, and transmit it to the second bonding terminal through the second power trace; Preferably, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the first power line on the insulating layer, and / or, the orthographic projection of the second communication line on the insulating layer does not overlap with the orthographic projection of the second power line on the insulating layer; Preferably, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the first power supply line on the insulating layer, and / or, the orthographic projection of the first communication line on the insulating layer overlaps with the orthographic projection of the second power supply line on the insulating layer.

21. The composite circuit board according to claim 20, characterized in that, The composite circuit board further includes a device area, in which the first main circuit and the second main circuit are disposed; A plurality of first circuit devices of the first main circuit and a plurality of second circuit devices of the second main circuit are disposed in the device area; Preferably, the at least two conductive layers include a first conductive layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are the two outermost conductive layers in the thickness direction of the composite circuit board; the first conductive layer includes connection points, and the first circuit device and the second circuit device are respectively connected to the connection points.

22. The composite circuit board according to claim 20, characterized in that, The composite circuit board includes a main body portion. Along a first direction, first bonding terminals and second bonding terminals are disposed on both sides of the main body portion. The number of first bonding terminals is multiple. The multiple first bonding terminals are arranged along a second direction, and the first direction intersects the second direction. A first main circuit and a second main circuit are disposed in the main body portion. The composite circuit board further includes a first protrusion, which is integral with the main body and located on the side of the main body away from the first bonding terminal; one end of the first protrusion is connected to the main body, and the other end is provided with the second bonding terminal; Preferably, a plurality of second bonding terminals are arranged along the first direction; Preferably, the first protrusion has a curved structure; Preferably, the first protrusion is arc-shaped, or the first protrusion is S-shaped; Preferably, the composite circuit board further includes a second extension portion, which extends along a first direction; one end of the second extension portion is provided with the main control interface, and the other end is connected to the main body portion; a portion of the first communication line and a portion of the second communication line are provided in the second extension portion; Preferably, the second protrusion is integral with the main body, or the second protrusion is connected to the main body via a connector.

23. A display device, characterized in that, The composite circuit board according to any one of claims 19-22 further includes a display panel and a fingerprint chip; The display panel is bonded to the composite circuit board via the first bonding terminal, and the fingerprint chip is bonded to the composite circuit board via the second bonding terminal.

24. The display device according to claim 23, characterized in that, The display panel includes a display area, a bending area, and a bonding area. The bending area is located between the display area and the bonding area, and the bonding area is bent to the backlight surface of the display panel through the bending area. The first bonding terminal and the second bonding resistor are disposed in the bonding area, and the fingerprint chip is attached to the backlight surface of the panel.

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