Shielding ring device, grounding ring device and etching equipment

Abstract

The invention provides a shielding ring device, a grounding ring device and etching equipment, the shielding ring device comprises a plurality of ring bodies and a plurality of first supporting bones, the grounding ring device comprises an inner ring, an outer ring and a plurality of second supporting bones, and part of the second supporting bones are overlapped with the first supporting bones. The first supporting bone at the overlapped position comprises a first fixed support and at least one first sliding support, and the first sliding supports are moved and adjusted to reduce the overlapped area of the first supporting bone and the second supporting bone. The second supporting bone at the overlapping position comprises a second fixed support and at least one second sliding support, and the second sliding support is moved and adjusted to reduce the overlapping area of the second supporting bone and the first supporting bone. According to the invention, by reducing the overlapping area, the deposition of by-products below the grounding ring device at the overlapping position can be greatly reduced, the wafer yield is improved, and the preventive maintenance frequency and difficulty are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a shielding ring device, a grounding ring device and an etching equipment. BACKGROUND

[0002] The etching equipment includes a shower head, an electrostatic chuck, a shielding ring, a grounding ring and a turbo molecular pump. The electrostatic chuck is used for adsorbing a wafer. The shielding ring is used for shielding plasma and protecting the chamber below. The grounding ring is used for leading away the charges on the shielding ring and the charges of the chamber, and protecting the chamber below. The turbo molecular pump is used for pumping away the gas and by-products in the chamber. When the by-products are generated, they will pass through the equivalent ion flow shielding ring and the grounding ring to reach the turbo molecular pump.

[0003] The shielding ring is a ring-in-ring structure supported by a skeleton, which provides holes for the extraction of by-products. The grounding ring includes two rings and a skeleton connecting the two rings. The shielding ring skeleton and the grounding ring skeleton partially overlap. The thickness of the overlapping area of the shielding ring skeleton and the grounding ring skeleton increases, which hinders the flow of gas and causes the by-products to accumulate easily below the grounding ring in the overlapping area. However, the by-products accumulated below the grounding ring are difficult to pump away, which leads to wafer defects, an increase in the frequency and difficulty of preventive maintenance.

[0004] Therefore, it is necessary to provide a shielding ring, a grounding ring and an etching equipment to solve the above problems. SUMMARY

[0005] The present application aims to provide a shielding ring device, a grounding ring device and an etching equipment to solve the problem of by-products accumulating easily below the grounding ring in the overlapping area of the skeleton of the existing shielding ring device and the skeleton of the grounding ring.

[0006] The present application provides a shielding ring device arranged between the sidewall of the chamber of the etching equipment and the electrostatic chuck. The shielding ring device includes multiple ring bodies nested and spaced apart, and multiple first support skeletons arranged along the circumference of the ring bodies and spaced apart. A grounding ring device is arranged below the shielding ring device. The grounding ring device has multiple second support skeletons arranged along the circumference of the grounding ring device and spaced apart. Some of the second support skeletons overlap with the first support skeletons. The first support skeletons at the overlapping positions include first fixed supports supporting the ring bodies and at least one first sliding support sliding on the ring bodies. Each first sliding support corresponds to at least one ring body. The first sliding support is adjusted by moving to reduce the overlapping area of the first support skeletons and the second support skeletons.

[0007] In a possible embodiment, the first fixed support is supported between the outermost ring body and the innermost ring body. Each of the intermediate annular bodies, except the outermost annular body and the innermost annular body, is arranged on the first fixed support in a lifting-adjustable manner through a lifting mechanism, the lifting mechanism is used for driving the intermediate annular bodies to be synchronously lifted and adjusted, adjusting the vertical distance between the intermediate annular bodies and the wafer adsorbed on the electrostatic chuck, and further adjusting the direction and / or flow rate of the gas flow passing through the annular bodies; or Each of the intermediate annular bodies, except the outermost annular body and the innermost annular body, is provided with a first lifting assembly, and the intermediate annular body is arranged on the first fixed support in a lifting-adjustable manner through the corresponding first lifting assembly, the first lifting assembly is used for individually lifting and adjusting the intermediate annular body, adjusting the vertical distance between the intermediate annular body and the wafer, and further adjusting the direction and / or flow rate of the gas flow passing through the annular bodies.

[0008] In a possible embodiment, each of the intermediate annular bodies is slidably connected with a second lifting assembly, and the intermediate annular body is connected with the corresponding first sliding support through the second lifting assembly, the second lifting assembly is used for adjusting the height of the first sliding support.

[0009] In a possible embodiment, a first sliding assembly connected with the second lifting assembly and used for driving the second lifting assembly to move is further included.

[0010] In a possible embodiment, the intermediate annular body is provided with a sliding groove along the circumference thereof, and the top of the second lifting assembly is slidably arranged in the sliding groove; or The intermediate annular body is provided with a sliding rail along the circumference thereof, and the top of the second lifting assembly is slidably arranged on the sliding rail.

[0011] In a possible embodiment, the heights h of the intermediate annular bodies are equal, the distances d between the annular bodies are equal, and the height difference L between the top surfaces of the adjacent two annular bodies needs to satisfy: L≤h+d.

[0012] In a possible embodiment, the first sliding support is one and spans at least one annular body in the radial direction of the shielding ring device; or The first sliding support is a plurality of, each of the first sliding supports spans at least one annular body in the radial direction of the shielding ring device, and the plurality of first sliding supports are arranged in a staggered manner in the circumferential direction of the shielding ring device when the plurality of first sliding supports move to the corresponding overlapping positions; or The first sliding support is a group, the first sliding supports in the group are located on the same straight line in the radial direction of the shielding ring device when the first sliding supports in the group move to the corresponding overlapping positions, and each of the first sliding supports spans at least one annular body in the radial direction of the shielding ring device; or The first sliding support is a plurality of groups, the first sliding supports in each of the groups are located on the same straight line in the radial direction of the shielding ring device when the first sliding supports in each of the groups move to the corresponding overlapping positions, the first sliding supports in the plurality of groups are arranged in a staggered manner in the circumferential direction of the shielding ring device when the first sliding supports in the plurality of groups move to the corresponding overlapping positions, and each of the first sliding supports spans at least one annular body in the radial direction of the shielding ring device; or There are multiple first sliding supports, which are located on the same side of the corresponding first fixed support or on both sides of the corresponding first fixed support.

[0013] The present invention also provides a grounding ring device, which is disposed between the chamber sidewall of the etching equipment and the electrostatic chuck. A shielding ring device is provided above the grounding ring device, and the shielding ring device has a plurality of first support bones spaced apart along the circumference of the shielding ring device. The grounding ring device includes an inner ring, an outer ring, and a plurality of second support bones that support and connect the inner ring and the outer ring and are spaced apart along the circumference of the inner ring, with some of the second support bones overlapping the first support bones; The second support bone at the overlapping position includes a second fixed support that supports and connects the inner ring and the outer ring, and at least one second sliding support that slides between the inner ring and the outer ring. By moving and adjusting the second sliding support, the overlapping area between the second support bone and the first support bone can be reduced.

[0014] In one possible embodiment, a second sliding component is further included, which is connected to the second sliding support and is used to drive the second sliding support to move.

[0015] In one possible embodiment, there is at least one second sliding brace, and each second sliding brace has its two ends slidably disposed on the inner ring and the outer ring, respectively; or... There are multiple second sliding supports, and the end of each second sliding support is slidably disposed on the inner ring or the outer ring; or, The second sliding support comes in two types: one type has its two ends slidingly mounted on the inner ring and the outer ring respectively; the other type has one end slidingly mounted on either the inner ring or the outer ring; or... There are multiple second sliding supports, which are located on the same side of the corresponding second fixed support or on both sides of the corresponding second fixed support.

[0016] The present invention also provides an etching apparatus, comprising: a chamber, an electrostatic chuck, and a shielding ring device as described in the above embodiments.

[0017] The present invention also provides an etching apparatus, comprising: a chamber, an electrostatic chuck, and a grounding ring device as described in the above embodiments.

[0018] The beneficial effects of the shielding ring device, grounding ring device, and etching equipment provided by this invention are as follows: 1. The first support bone at the overlapping position is designed as an expandable or retractable structure, and the shape of the first support bone of the shielding ring device is adjustable. The first support bone at the overlapping position includes a first fixed support with a fixed position and a first sliding support with a slidable displacement. By moving and adjusting the first sliding support, the overlapping area between the first support bone and the second support bone is reduced, thereby reducing the deposition of by-products under the grounding ring device at the overlapping position.

[0019] 2. The intermediate rings are synchronously raised and lowered by a lifting mechanism; or, the intermediate rings are raised and lowered individually by the first lifting component, which can adjust the vertical distance between the intermediate rings and the wafer, thereby adjusting the direction and / or velocity of the airflow passing between the rings, so as to adjust the etching rate of the wafer edge.

[0020] 3. By driving the corresponding second lifting component to move along the circumference of the ring body through the first sliding component, the movement and adjustment of the first sliding support connected to the second lifting component can be achieved, thus realizing automated and precise control of the movement position of the first sliding support.

[0021] 4. The plasma shielding efficiency of the shielding ring device is ensured by setting the height difference L between the top surfaces of two adjacent rings to be less than or equal to the sum of the height h of the middle ring and the spacing d of the middle ring.

[0022] 5. The second support bone at the overlapping position is designed as an expandable or retractable structure, and the shape of the second support bone of the grounding ring device can be adjusted. The second support bone at the overlapping position includes a fixed second support and a sliding second support. By moving and adjusting the second sliding support, the overlapping area between the second support bone and the first support bone can be reduced, thereby reducing the deposition of by-products under the grounding ring device at the overlapping position.

[0023] 6. Adjust the first sliding support by moving it to make the first support bone of the shielding ring device symmetrical, or adjust the second sliding support by moving it to make the second support bone of the grounding ring device symmetrical, so as to ensure the symmetry of the airflow. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the flow phenomenon around a bluff body.

[0025] Figure 2 This is a partial schematic diagram of the first support bone in the closed state of the shielding ring device of the present invention.

[0026] Figure 3 This is a partial schematic diagram of the first support bone in the shielding ring device of the present invention in an unfolded state in one embodiment.

[0027] Figure 4 This is a partial schematic diagram of the first support bone in the shielding ring device of the present invention in an unfolded state in another embodiment.

[0028] Figure 5 This is a perspective view of the ring body and the first fixing support in the shielding ring device of the present invention.

[0029] Figure 6 This is a diagram showing the state when all intermediate rings in the shielding ring device of the present invention are at the same height.

[0030] Figure 7This is a schematic diagram showing the distribution of each intermediate ring at the same height in the shielding ring device of the present invention.

[0031] Figure 8 This is a schematic diagram of airflow when all intermediate rings in the shielding ring device of the present invention are at the same height.

[0032] Figure 9 This is a diagram showing the state of each intermediate ring in the shielding ring device of the present invention when they are located at different heights.

[0033] Figure 10 This is a schematic diagram showing the distribution of the intermediate rings at different heights in the shielding ring device of the present invention.

[0034] Figure 11 This is a schematic diagram of airflow when the intermediate rings in the shielding ring device of the present invention are located at different heights.

[0035] Figure 12 This is a schematic diagram of the airflow before the shielding ring device of the present invention rises when all intermediate rings are at the same height.

[0036] Figure 13 This is a schematic diagram of the airflow after the intermediate rings in the shielding ring device of the present invention are at the same height.

[0037] Figure 14 This is a schematic diagram of airflow when the intermediate rings in the shielding ring device of the present invention are located at different heights.

[0038] Figure 15 This is a partial schematic diagram of the intermediate ring body and the first fixed support in the shielding ring device of the present invention.

[0039] Figure 16 for Figure 15 Cross-sectional view along the EE direction.

[0040] Figure 17 This is a partial schematic diagram of the intermediate ring body and the first sliding support in the shielding ring device of the present invention.

[0041] Figure 18 for Figure 17 Cross-sectional view along the FF direction.

[0042] Figure 19 This is a schematic diagram of the first lifting component, the intermediate ring body, and the first fixed support in the shielding ring device of the present invention.

[0043] Figure 20 This is a schematic diagram of the second lifting component, the intermediate ring body, and the first sliding support in the shielding ring device of the present invention.

[0044] Figure 21 This is a schematic diagram showing the arrangement of the intermediate rings in the shielding ring device of the present invention.

[0045] Figure 22 This is a schematic diagram of the first support bone in one embodiment of the shielding ring device of the present invention.

[0046] Figure 23 This is a schematic diagram of the first support bone in another embodiment of the shielding ring device of the present invention.

[0047] Figure 24 This is a partial schematic diagram of the second support bone in the grounding ring of the present invention in the retracted state.

[0048] Figure 25 This is a partial schematic diagram of the second support bone in the grounding ring of the present invention in an unfolded state in one embodiment.

[0049] Figure 26 This is a partial schematic diagram of the second support bone in the grounding ring of the present invention in an unfolded state in another embodiment.

[0050] Figure 27 This is a schematic diagram of the etching apparatus of the present invention.

[0051] Explanation of reference numerals in the attached drawings: 100, shielding ring device; 110, ring body; 111, outermost ring body; 112, innermost ring body; 113, intermediate ring body; 1131, sliding groove; 120, first support rib; 121, first fixed support; 122, first sliding support; 130, first lifting assembly; 140, second lifting assembly; 150, first sliding assembly; 200, grounding ring; 210, inner ring; 220, outer ring; 230, second support rib; 231, second fixed support; 232, second sliding support; 300, chamber; 400, electrostatic chuck; 500, wafer. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0053] In fluid mechanics, when a fluid (airflow, water, etc.) passes over a bluff body during its flow, the direction of the airflow changes, bypassing the obstacle and causing a flow around it, which is called the bluff body flow around phenomenon. When the flow around occurs, a wake region is formed behind the obstacle, and the pressure in the wake region is low.

[0054] See Figure 1The overlapping area between the skeleton of the shielding ring device 100 and the skeleton of the grounding ring device 200 is prone to bluff body flow phenomena, forming a low-pressure zone below the grounding ring device 200 in the skeleton overlap area. Byproducts from the etching equipment easily enter this low-pressure zone when passing through, causing byproduct accumulation. Furthermore, bypassing the skeleton overlap area increases the length of the airflow. Compared to the single-layer grounding ring device 200, the low-velocity region S1 area of ​​the skeleton overlap area is larger than the low-velocity region S2 area of ​​the single-layer grounding ring device 200. Moreover, due to surface friction, the airflow velocity in the skeleton overlap area will also decrease more significantly, which will make it easier for byproducts to accumulate here and difficult to carry away.

[0055] To address the problems existing in the prior art, embodiments of the present invention provide a shielding ring device 100, see [link to previous document]. Figures 1 to 4 , Figure 27 A shielding ring device 100 is disposed between the side wall of the chamber 300 of the etching equipment and the electrostatic chuck 400. The shielding ring device 100 includes multiple nested and spaced-apart rings 110 and multiple first support bones 120 spaced circumferentially around each ring 110. A grounding ring device 200 is disposed below the shielding ring device 100. The grounding ring device 200 has multiple second support bones 230 spaced circumferentially around the grounding ring device 200, with some of the second support bones 230 overlapping the first support bones 120. Figures 2 to 4 As shown, A and B are the projected positions of the second support bone 230 on the shielding ring device 100, respectively. A is the overlapping position of the second support bone 230 and the first support bone 120; B is the non-overlapping position. The first support bone 120 at the overlapping position includes a first fixed support 121 supporting and connecting each ring body 110 and at least one first sliding support 122 sliding on the ring body 110. Each first sliding support 122 corresponds to at least one ring body 110. By moving and adjusting the first sliding support 122, the overlapping area between the first support bone 120 and the second support bone 230 can be reduced.

[0056] In this embodiment, the first support bone 120 of the shielding ring device 100 at the overlapping position is divided into two parts. One part is the first fixed support 121 located at the overlapping position and fixed in position, which plays a supporting and positioning role for each ring body 110. The other part is the first sliding support 122 that can slide and move. The first sliding support 122 does not bear weight, and the shape of the first support bone 120 can be adjusted by the sliding displacement of the first sliding support 122. When the first support rib 120 is retracted, the first sliding support 122 and the first fixed support 121 are retracted and located in the overlapping position. When the first support rib 120 is unfolded, the first sliding support 122 is moved and adjusted so that the first sliding support 122 leaves the overlapping position, thereby reducing the overlapping area between the first support rib 120 and the second support rib 230. On the one hand, this avoids the formation of a low-pressure area below the grounding ring device 200 at the overlapping position, significantly reducing the bluff body flow effect. On the other hand, it shortens the airflow path at the overlapping position and increases the airflow velocity at the overlapping position. Therefore, it can greatly reduce the deposition of by-products below the grounding ring device 200 at the overlapping position, improve the wafer 500 yield, and reduce the frequency and difficulty of preventive maintenance.

[0057] It is worth noting that the retraction or expansion of the first supporting bone 120 refers to the first sliding support 122 retracting to the overlapping position or leaving the overlapping position.

[0058] In the first embodiment, see Figure 5 The first fixed support 121 is connected between the outermost ring 111 and the innermost ring 112. (See also...) Figure 7 , Figure 8 , Figure 12 and Figure 13 Each intermediate ring 113, except for the outermost ring 111 and the innermost ring 112, is mounted on the first fixed support 121 in a height-adjustable manner via a lifting mechanism. The lifting mechanism is used to drive each intermediate ring 113 to move up and down synchronously, adjusting the vertical distance y between the intermediate ring 113 and the wafer 500 adsorbed on the electrostatic chuck 400, thereby adjusting the direction and / or speed of the airflow passing between the rings 110.

[0059] The wafer 500 is adsorbed onto the electrostatic chuck 400. The shielding ring device 100 is arranged around the electrostatic chuck 400. The intermediate rings 113 can be raised or lowered synchronously through the lifting mechanism, thereby reducing or increasing the vertical distance y between the intermediate rings 113 and the wafer 500, and thus adjusting the direction and / or flow rate of the airflow passing between the rings 110 to adjust the etching rate of the edge of the wafer 500. Figure 12 This is a schematic diagram of the airflow before each intermediate annulus 113 rises. Figure 13This is a schematic diagram of the airflow after each intermediate ring 113 rises. When the intermediate ring 113 rises, the vertical distance y between the intermediate ring 113 and the wafer 500 decreases, the airflow direction changes, and the airflow velocity changes.

[0060] It should be noted that the components of the lifting mechanism are miniaturized to reduce space occupation. The specific structure and arrangement of the lifting mechanism are not specifically limited here and can be flexibly configured according to actual process requirements. For example, the lifting mechanism includes a first connecting member connected to each intermediate ring 113 and a telescopic member connected to the first connecting member and adjustable in length. The telescopic member can be a cylinder, hydraulic cylinder, etc., to adjust the height of the support and its intermediate rings. As another example, the lifting mechanism includes a second connecting member connected to each intermediate ring 113 and a drive assembly connected to the second connecting member. The drive assembly can be a linear module, a gear and toothed rail structure driven by a motor, a screw structure driven by a motor, etc.

[0061] In the second embodiment, see Figure 5 The first fixed support 121 is connected between the outermost ring 111 and the innermost ring 112. (See also...) Figures 6 to 16 Each intermediate ring 113, except for the outermost ring 111 and the innermost ring 112, is provided with a first lifting component 130. The intermediate ring 113 is adjustablely mounted on the first fixed support 121 by the corresponding first lifting component 130. The first lifting component 130 is used to adjust the lifting of the intermediate ring 113 individually, adjust the vertical distance y between the intermediate ring 113 and the wafer 500, and thereby adjust the direction and / or velocity of the airflow passing between the rings 110.

[0062] See Figure 14 , Figure 16 and Figure 19 Each intermediate ring 113 is individually equipped with a first lifting component 130. Each first lifting component 130 allows for individual lifting and lowering adjustment of each intermediate ring 113, enabling independent adjustment of the vertical distance y between each intermediate ring 113 and the wafer 500. This, in turn, adjusts the direction and / or velocity of the airflow passing between the rings 110, thereby adjusting the etching rate at the edge of the wafer 500. See also... Figures 9 to 11 The shape of the shielding ring device 100 can be adjusted by individually adjusting the height of each intermediate ring 113. (See also...) Figure 14 By adjusting the height of each intermediate ring 113 from equal to increasing from the inside out, the airflow direction and airflow velocity are changed.

[0063] It should be noted that the first lifting component 130 is a miniaturized device, reducing its space occupation. The specific structure and arrangement of the first lifting component 130 are not specifically limited here and can be flexibly configured according to actual process requirements. For example, the first lifting component 130 can be a retractable and adjustable device such as a cylinder or hydraulic cylinder. Alternatively, the first lifting component 130 can be a linear module, a gear and toothed rail structure driven by a motor, or a screw structure driven by a motor.

[0064] In one embodiment, see Figure 17 , Figure 18 and Figure 20 Each intermediate ring 113 is slidably connected to a second lifting assembly 140. The intermediate ring 113 is connected to a corresponding first sliding support 122 via the second lifting assembly 140. The second lifting assembly 140 is used to adjust the height of the first sliding support 122. In this embodiment, the first sliding support 122 is essentially suspended from the intermediate ring 113 by the second lifting assembly 140. Since the intermediate ring 113 is adjusted in height by a lifting mechanism or the first lifting assembly 130 (i.e., adjusting the height of the intermediate ring 113 relative to the first fixed support 121), the second lifting assembly 140 works in conjunction with the lifting mechanism or the first lifting assembly 130 to prevent the first sliding support 122 from being affected by the raising of the intermediate ring 113. For example, in the case where one first sliding support 122 corresponds to multiple intermediate rings 113, when adjusting the height of one intermediate ring 113, it is necessary to simultaneously adjust the second lifting assembly 140 and the lifting mechanism or the first lifting assembly 130 on that intermediate ring 113 to ensure that the first sliding support 122 does not move with the intermediate ring 113. Of course, it is also possible to achieve this, with the first sliding support 122 always at the same height as the first fixed support 121.

[0065] It should be noted that the second lifting component 140 is a miniaturized device, reducing its space occupation. The specific structure and arrangement of the second lifting component 140 are not specifically limited here and can be flexibly configured according to actual process requirements. For example, the second lifting component 140 can be a retractable and adjustable device such as a cylinder or hydraulic cylinder. Alternatively, the second lifting component 140 can be a linear module, a gear and toothed rail structure driven by a motor, or a screw structure driven by a motor.

[0066] In yet another embodiment, see Figure 18 and Figure 20The shielding ring device 100 also includes a first sliding component 150 connected to the second lifting component 140 and used to drive the second lifting component 140 to move. Specifically, the first sliding component 150 is a miniature structure, reducing space occupation. In this embodiment, since the second lifting component 140 is slidably connected to the corresponding intermediate ring body 113, and the first sliding support 122 is connected to the second lifting component 140, the first sliding component 150 drives the second lifting component 140 to move circumferentially along the ring body 110, thereby driving the first sliding support 122 to move circumferentially along the ring body 110, so that the first sliding support 122 leaves the overlapping position, thereby reducing the overlapping area of ​​the first support bone 120 and the second support bone 230, thereby reducing the deposition of by-products below the grounding ring device 200 at the overlapping position.

[0067] In one embodiment, see Figure 18 and Figure 20 The intermediate ring 113 has a groove 1131 along its circumference, and the top of the second lifting assembly 140 slides within the groove 1131. Specifically, the groove 1131 is located on the bottom or side surface of the intermediate ring 113. In this embodiment, the groove 1131 defines the movement path of the second lifting assembly 140 and also serves as a guide and limiter, that is, it vertically limits the top of the second lifting assembly 140 to prevent the top of the second lifting assembly 140 from disengaging from the groove 1131.

[0068] Furthermore, there are multiple slides 1131, with a corresponding slide 1131 between the overlapping first support bone 120 and its adjacent first support bone 120, and the slides 1131 define the movement path of the second lifting assembly 140 in the circumferential direction of the ring body 110.

[0069] Furthermore, see Figure 18 and Figure 20 The first sliding component 150 is located within the slide groove 1131. The specific structure and arrangement of the first sliding component 150 are not specifically limited here and can be flexibly configured according to actual process requirements. For example, the first sliding component 150 includes a first gear rail disposed within the slide groove 1131 along its extending direction, a first gear meshing with the first gear rail, and a first rotary drive component connected to the first gear. The first gear is rotatably disposed on the top of the second lifting component 140 via a first rotating shaft, and the first rotary drive component is a motor, etc.

[0070] In another embodiment, the intermediate ring 113 is provided with a slide rail along its circumference, and the top of the second lifting assembly 140 is slidably mounted on the slide rail.

[0071] In a specific example, the slide rail is a second gear rail, and the first sliding assembly 150 includes a second gear meshing with the second gear rail and a second rotary drive connected to the second gear. The second gear is rotatably disposed on the top of the second lifting assembly 140 via a second rotating shaft, and the second rotary drive is a motor or the like.

[0072] In another specific example, the first sliding assembly 150 includes a pulley rotatably disposed on top of the second lifting assembly 140, a first rotation drive connected to the pulley, and a first brake for providing braking force to the pulley. The pulley can be driven to move along the slide rail by the first rotation drive, which can be a motor or the like. The movement of the pulley is limited by the first brake to keep the pulley stationary.

[0073] In one embodiment, see Figure 21 The height h of each intermediate ring 113 is equal, the spacing d of each ring 110 is equal, and the height difference L between the top surfaces of two adjacent rings 110 must satisfy: L ≤ h + d. In this embodiment, by limiting the height difference L between the top surfaces of two adjacent rings 110 to be less than or equal to the sum of the height h of the intermediate ring 113 and the spacing d of the intermediate rings 113, the rising height of the intermediate ring 113 is controlled to ensure the plasma shielding efficiency of the shielding ring device 100. Furthermore, the lifting mechanism or the first lifting component 130 is used to adjust the lifting of the intermediate ring 113 relative to the first fixed support 121. The minimum lowering height of the intermediate ring 113 depends on the first fixed support 121 and the specific structure and arrangement of the lifting mechanism or the first lifting component 130. For example, by reasonably installing the intermediate ring 113 at its minimum lowering height, the bottom surfaces of each ring 110 are on the same horizontal plane.

[0074] It should be noted that, in order to ensure the efficiency of plasma shielding, the width (i.e., the spacing d) of the gap in the ring 110 should be as small as possible, and the depth of the gap in the ring 110 should be as deep as possible. However, a deeper and smaller gap means a higher aspect ratio, which is not conducive to the removal of by-products. By reasonably setting the gap aspect ratio, it is possible to ensure that the plasma shielding efficiency is improved while ensuring the full and effective removal of by-products.

[0075] The different structural settings of the first sliding brace 122 are explained below with relevant examples.

[0076] In the first example, the first sliding support 122 is a single element that radially spans at least one ring body 110 along the shielding ring assembly 100. For example, the first sliding support 122 radially spans a first ring body 110 along the shielding ring assembly 100, such as... Figure 20 As shown; or, the first sliding support 122 radially spans a portion of the ring 110 along the shielding ring device 100, as shown. Figure 3 and Figure 4As shown, the length of the first sliding support 122 is greater than or equal to the overall width of each ring 110 it spans along the radial direction of the shielding ring device 100; or, the first sliding support 122 spans each ring 110 along the radial direction of the shielding ring device 100, and the length of the first sliding support 122 is adapted to the radial width of the shielding ring device 100.

[0077] In the second example, there are multiple first sliding supports 122, each of which spans at least one ring 110 radially across the shielding ring device 100. When the multiple first sliding supports 122 move to their corresponding overlapping positions, they are staggered circumferentially across the shielding ring device 100. In other words, the first support ribs 120 at the overlapping positions are divided circumferentially from the shielding ring device 100 into multiple first sliding supports 122. When the multiple first sliding supports 122 are retracted to their corresponding overlapping positions, they are arranged side-by-side circumferentially across the shielding ring device 100. The multiple first sliding supports 122 may span the same or different numbers of rings 110 radially across the shielding ring device 100.

[0078] In the third example, see Figures 2 to 4 The first sliding supports 122 form a group. When the group of first sliding supports 122 moves to the corresponding overlapping position, they are located on the same straight line along the radial direction of the shielding ring device 100. Each first sliding support 122 crosses at least one ring body 110 along the radial direction of the shielding ring device 100. In other words, the first support bone 120 at the overlapping position is divided into multiple first sliding supports 122 in the radial direction of the shielding ring device 100. When the first sliding supports 122 in a group are closed to the corresponding overlapping position, the first sliding supports 122 in the group are arranged side by side along the radial direction of the shielding ring device 100. Each first sliding support 122 can cross the same or different number of ring bodies 110 along the radial direction of the shielding ring device 100.

[0079] In the fourth example, there are multiple sets of first sliding supports 122. When each set of first sliding supports 122 moves to the corresponding overlapping position, they are located on the same straight line radially along the shielding ring device 100. When multiple sets of first sliding supports 122 move to the corresponding overlapping position, they are staggered around the shielding ring device 100. Each first sliding support 122 crosses at least one ring body 110 radially along the shielding ring device 100. In other words, the first support bone 120 at the overlapping position is divided into multiple sets of first sliding supports 122 circumferentially from the shielding ring device 100, and each set of first sliding supports 122 is further divided into multiple first sliding supports 122 radially from the shielding ring device 100, realizing displacement adjustment in more complex situations.

[0080] In the fifth example, there are multiple first sliding supports 122, which are located on the same side of the corresponding first fixed supports 121 or on both sides of the corresponding first fixed supports 121. For example, the first support bone 120 at the overlapping position includes one first fixed support 121 and one first sliding support 122, such as... Figure 22 As shown; for example, the first supporting bone 120 at the overlapping position includes a first fixed support 121 and first sliding supports 122 located on both sides of the first fixed support 121, as shown. Figure 23 As shown.

[0081] By rationally setting the number and position distribution of the first support bones 120, and combining the movement adjustment of each first sliding support 122, the first support bones 120 of the shielding ring device 100 can be made to have a symmetrical structure, so as to ensure that the airflow passing through the shielding ring device 100 is symmetrically distributed in space, thereby ensuring the uniformity of etching.

[0082] When the thickness of the overlapping area of ​​the skeleton that obstructs airflow increases, the area of ​​the low-velocity region increases. Therefore, at the same RF clock cycle, the root of the overlapping area between the shielding ring device 100 and the grounding ring device 200 skeletons is more prone to accumulating byproducts due to the effect of the sidewall of the chamber 300 and the thickened skeleton. To solve this problem, see [link to relevant documentation]. Figure 3 and Figure 4 At least one first sliding support 122 extends to the outermost ring 111, ensuring that the area of ​​the first support bone 120 near the side wall of the chamber 300 at the overlapping position can be slidably adjusted, thereby reducing the overlap area between the first support bone 120 near the side wall of the chamber 300 and the second support bone 230 at the overlapping position.

[0083] The present invention also provides a grounding ring device 200, see [link to documentation]. Figures 24 to 27 A grounding ring device 200 is disposed between the side wall of the etching equipment chamber 300 and the electrostatic chuck 400. A shielding ring device 100 is disposed above the grounding ring device 200. The shielding ring device 100 has a plurality of first support bones 120 spaced apart circumferentially along the shielding ring device 100. The grounding ring device 200 includes an inner ring 210, an outer ring 220, and a plurality of second support bones 230 supporting and connecting the inner ring 210 and the outer ring 220 and spaced apart circumferentially along the inner ring 210. Some of the second support bones 230 overlap with the first support bones 120. Figures 24 to 26 As shown, C is the overlapping position of the second support bone 230 and the first support bone 120, and D is the non-overlapping position. The second support bone 230 at the overlapping position includes a second fixed support 231 supporting and connecting the inner ring 210 and the outer ring 220, and at least one second sliding support 232 sliding between the inner ring 210 and the outer ring 220. By moving and adjusting the second sliding support 232, the overlapping area between the second support bone 230 and the first support bone 120 can be reduced.

[0084] In this embodiment, the second support bone 230 of the grounding ring device 200 at the overlapping position is divided into two parts. One part is the second fixed support 231 located at the overlapping position and fixed in position, which plays the role of supporting and fixing the inner ring 210 and the outer ring 220. The other part is the second sliding support 232 that can slide and displace. The second sliding support 232 does not bear weight, and the shape of the second support bone 230 can be adjusted by the sliding displacement of the second sliding support 232. When the second support 230 is retracted, the second sliding support 232 and the second fixed support 231 are retracted and located in the overlapping position. When the second support 230 is extended, the second sliding support 232 is moved and adjusted so that the second sliding support 232 leaves the overlapping position, thereby reducing the overlapping area between the second support 230 and the first support 120. On the one hand, this avoids the formation of a low-pressure area below the grounding ring device 200 at the overlapping position, significantly reducing the bluff body flow effect. On the other hand, it shortens the airflow path at the overlapping position and increases the airflow velocity at the overlapping position. Therefore, it can greatly reduce the deposition of by-products below the grounding ring device 200 at the overlapping position, improve the wafer 500 yield, and reduce the frequency and difficulty of preventive maintenance.

[0085] It is worth noting that the retraction or expansion of the second support bone 230 refers to the second sliding support 232 retracting to the overlapping position or leaving the overlapping position.

[0086] In one embodiment, the grounding ring device 200 further includes a second sliding component connected to the second sliding support 232 and used to drive the second sliding support 232 to move. Specifically, the second sliding component is a miniature structure to reduce space occupation.

[0087] In one specific embodiment, the inner ring 210 has an inner groove along its circumference, and the outer ring 220 has an outer groove along its circumference. The two ends of the second sliding support 232 are respectively slidably disposed in the inner groove and the outer groove. In this embodiment, the inner groove and the outer groove limit the movement path of the second sliding support 232 and also serve as guides and limiters to prevent the second sliding support 232 from disengaging from the inner groove and the outer groove.

[0088] Furthermore, there are multiple sliding grooves 1131, and the second fixed support 231 and its adjacent second support bone 230 correspond to an inner groove and an outer groove, which limit the movement path of the second sliding support 232 in the circumferential direction of the grounding ring device 200.

[0089] Furthermore, the second sliding assembly may be a single component disposed in the inner or outer groove; alternatively, there may be two second sliding assemblies, each disposed in an inner or outer groove. The specific structure and arrangement of the second sliding assembly are not specifically limited here and can be flexibly configured according to actual process requirements. For example, the second sliding assembly may include a third gear rail disposed in the inner or outer groove, a third gear meshing with the third gear rail, and a third rotary drive component connected to the third gear. The third gear is rotatably disposed at the end of the second sliding support 232 via a third rotating shaft, and the third rotary drive component may be a motor, etc.

[0090] In another specific embodiment, the inner ring 210 is provided with an inner rail along its circumference, the outer ring 220 is provided with an outer rail along its circumference, and the two ends of the second sliding support 232 are respectively slidably mounted on the inner rail and the outer rail.

[0091] In one specific example, the inner rail and / or outer rail is a fourth gear rail, and the second sliding assembly includes a fourth gear meshing with the fourth gear rail and a fourth rotary drive connected to the fourth gear. The fourth gear is rotatably disposed at the end of the second sliding support 232 via a fourth rotating shaft, and the fourth rotary drive is a motor or the like.

[0092] In another specific example, the second sliding assembly includes a wheel rotatably disposed at the end of the second sliding support 232, a second rotation drive connected to the wheel, and a second brake for providing braking force to the wheel. The second rotation drive, such as a motor, can drive the wheel to move along the inner and outer rails. The second brake restricts the movement of the wheel to keep it stationary.

[0093] The different structural configurations of the second sliding brace 232 will be explained below with relevant examples.

[0094] In the first example, see Figure 24 and Figure 25 There is at least one second sliding support 232, and the two ends of each second sliding support 232 are respectively slidably disposed on the inner ring 210 and the outer ring 220.

[0095] In the second example, see Figure 26 There are multiple second sliding supports 232, and the end of each second sliding support 232 is slidably disposed on the inner ring 210 or the outer ring 220.

[0096] In the third example, the second sliding support 232 is divided into two types. In one type, the two ends of the second sliding support 232 are slidably disposed on the inner ring 210 and the outer ring 220, respectively. In the other type, the end of the second sliding support 232 is slidably disposed on the inner ring 210 or the outer ring 220.

[0097] In the fourth example, there are multiple second sliding supports 232, and the multiple second sliding supports 232 are respectively located on the same side of the corresponding second fixed supports 231 (e.g.,Figures 24 to 26 (as shown) or located on both sides of the corresponding second fixed support 231.

[0098] By rationally setting the number and position distribution of the second support bones 230, and combining the movement adjustment of each second sliding support 232, the second support bones 230 of the grounding ring device 200 can be made to have a symmetrical structure, so as to ensure that the airflow passing through them is symmetrically distributed in space, thereby ensuring the uniformity of etching.

[0099] The present invention also provides an etching apparatus, see [link to relevant documentation]. Figure 26 The etching apparatus includes: a chamber 300, an electrostatic chuck 400, and a shielding ring device 100 as described in the above embodiment.

[0100] The present invention also provides an etching apparatus, see [link to relevant documentation]. Figure 26 The etching apparatus includes: a chamber 300, an electrostatic chuck 400, and a grounding ring device 200 as described in the above embodiment.

[0101] In the description of this invention, the terms “comprising” and “having” and any variations thereof are intended to cover non-exclusive inclusion. In the description of this invention, unless otherwise stated, “a plurality of” means two or more.

[0102] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the present invention. Furthermore, the present invention described herein may have other embodiments and can be implemented or carried out in various ways. Unless otherwise defined, the technical or scientific terms used herein should be understood in their ordinary sense by one of ordinary skill in the art to which this invention pertains.

Claims

1. A shielding ring device, characterized in that, Located between the chamber sidewall of the etching equipment and the electrostatic chuck, the shielding ring device includes multiple nested and spaced rings and multiple first support bones spaced apart along the circumference of each ring. Below the shielding ring device is a grounding ring device, which has a plurality of second support bones spaced apart along the circumference of the grounding ring device, and some of the second support bones overlap with the first support bones. The first support bone at the overlapping position includes a first fixed support supporting and connecting each of the ring bodies and at least one first sliding support sliding on the ring body. Each first sliding support corresponds to at least one of the ring bodies. By moving and adjusting the first sliding support, the overlapping area between the first support bone and the second support bone can be reduced.

2. The shielding ring device according to claim 1, characterized in that, The first fixed support is connected between the outermost ring and the innermost ring; Except for the outermost and innermost rings, each intermediate ring is adjustablely mounted on the first fixed support via a lifting mechanism. The lifting mechanism drives each intermediate ring to move up and down synchronously, adjusting the vertical distance between the intermediate ring and the wafer adsorbed on the electrostatic chuck, thereby adjusting the direction and / or velocity of the airflow passing between the rings; or... In addition to the outermost ring and the innermost ring, each intermediate ring is provided with a first lifting component. The intermediate ring is adjustablely mounted on the first fixed support by the corresponding first lifting component. The first lifting component is used to adjust the lifting of the intermediate ring individually, adjust the vertical distance between the intermediate ring and the wafer, and thereby adjust the direction and / or velocity of the airflow passing between the rings.

3. The shielding ring device according to claim 2, characterized in that, Each of the intermediate rings is slidably connected to a second lifting component. The intermediate ring is connected to the corresponding first sliding support through the second lifting component. The second lifting component is used to adjust the height of the first sliding support.

4. The shielding ring device according to claim 3, characterized in that, It also includes a first sliding component connected to the second lifting component and used to drive the second lifting component to move.

5. The shielding ring device according to claim 3, characterized in that, The intermediate ring body is provided with a sliding groove along its circumference, and the top of the second lifting assembly slides within the sliding groove; or... The intermediate ring is provided with a slide rail along its circumference, and the top of the second lifting assembly slides on the slide rail.

6. The shielding ring device according to claim 2, characterized in that, The height h of each of the intermediate rings is equal, the spacing d between each of the rings is equal, and the height difference L between the top surfaces of two adjacent rings must satisfy: L≤h+d.

7. The shielding ring device according to any one of claims 1-6, characterized in that, The first sliding brace is one and spans at least one of the ring bodies radially along the shielding ring device; or... There are multiple first sliding supports, each of which spans at least one ring body radially along the shielding ring device. When the multiple first sliding supports move to their corresponding overlapping positions, they are staggered circumferentially along the shielding ring device; or... The first sliding brace is a group, and when the group of first sliding braces moves to the corresponding overlapping position, they are located on the same straight line radially along the shielding ring device, and each first sliding brace traverses at least one ring body radially along the shielding ring device; or... The first sliding support is in multiple groups. When each group of the first sliding support moves to the corresponding overlapping position, they are located on the same straight line radially along the shielding ring device. When multiple groups of the first sliding support move to the corresponding overlapping position, the multiple groups of the first sliding support are staggered in the circumferential direction of the shielding ring device. Each first sliding support spans at least one ring body radially along the shielding ring device; or... There are multiple first sliding supports, and the multiple first sliding supports are located on the same side of the corresponding first fixed support or on both sides of the corresponding first fixed support.

8. A grounding ring device, characterized in that, Located between the chamber sidewall of the etching equipment and the electrostatic chuck, a shielding ring device is provided above the grounding ring device, and the shielding ring device has a plurality of first support bones spaced apart along the circumference of the shielding ring device; The grounding ring device includes an inner ring, an outer ring, and a plurality of second support bones that support and connect the inner ring and the outer ring and are spaced apart along the circumference of the inner ring, with some of the second support bones overlapping the first support bones; The second support bone at the overlapping position includes a second fixed support that supports and connects the inner ring and the outer ring, and at least one second sliding support that slides between the inner ring and the outer ring. By moving and adjusting the second sliding support, the overlapping area between the second support bone and the first support bone can be reduced.

9. The grounding ring device according to claim 8, characterized in that, It also includes a second sliding component connected to the second sliding support and used to drive the second sliding support to move.

10. The grounding ring device according to claim 8 or 9, characterized in that, The second sliding support is at least one, and the two ends of each second sliding support are respectively slidably disposed on the inner ring and the outer ring; or, The second sliding support is multiple, and the end of each second sliding support slides on the inner ring or the outer ring; or, The second sliding support is of two types: in one type, both ends of the second sliding support are respectively slidably disposed on the inner ring and the outer ring; in the other type, one end of the second sliding support is slidably disposed on either the inner ring or the outer ring; or... There are multiple second sliding supports, and the multiple second sliding supports are located on the same side of the corresponding second fixed support or on both sides of the corresponding second fixed support.

11. An etching apparatus, characterized in that, include: The chamber, the electrostatic chuck, and the shielding ring device as described in any one of claims 1-7.

12. An etching apparatus, characterized in that, include: The chamber, the electrostatic chuck, and the grounding ring device as described in any one of claims 8-10.

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