An automated chip testing device

Abstract

The application discloses an automatic chip testing device and belongs to the chip testing field.The automatic chip testing device comprises a work plate, supporting legs fixedly connected to the lower surface of the work plate, a mounting mechanism installed on the upper surface of the work plate, a testing mechanism installed on one side of the upper surface of the work plate, a mounting plate slidably connected to the upper surface of the work plate, and mounting grooves in a rectangular array formed in the upper surface of the mounting plate.The driving motor is started according to the position of the chip body, the threaded rod drives the abutting spring and the bearing plate to move, the position of the chip body is finely adjusted, the positioning is more accurate, the connection pressure of the pin and the elastic probe is monitored in real time through the setting of the pressure sensor, the chip body is driven to move up and down according to the pressure setting threshold and the electric push rod, the connection of the pin and the elastic probe is adjusted, and the chip body is more accurately connected with the elastic probe.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip testing, and particularly relates to an automatic chip testing device. BACKGROUND

[0002] The electric vehicle chip is the "brain" and "nerve center" of the electric vehicle, and its importance is just like that of the chip to the computer and the mobile phone. Compared with the traditional fuel vehicle, the electric vehicle has an exponential growth in the demand for the number, performance and types of chips. The chip is a core component that determines the intelligent and electric level of the electric vehicle. The electric vehicle chip is a core technology that promotes the transformation of the automobile industry. It makes the automobile evolve from a simple transportation tool into a mobile intelligent terminal, an energy storage unit and a digital space. Understanding the classification and function of these chips is the key to understanding the competitive pattern and technical development of modern intelligent electric vehicles.

[0003] According to the search, the invention patent discloses an automatic testing device for chip testing (publication number: CN114200174B), which comprises: a test workbench; a chip detection device installed on one side of the upper end face of the test workbench; a first conveying belt embedded and installed on the side of the upper end face of the test workbench away from the chip detection device, and a plurality of chips to be detected are uniformly arranged on the first conveying belt; a second conveying belt for conveying and removing unqualified chips after detection; a transfer assembly vertically arranged in the middle of the upper end face of the test workbench and capable of relative rotation, the transfer assembly is used for transferring the chips to be detected from the first conveying belt to the chip detection device for detection, and when the detection is qualified, the chips are transferred and positioned again, and when the detection is unqualified, the chips are transferred to the second conveying belt; and a taking and placing assembly symmetrically arranged on both sides of the transfer assembly.

[0004] Although the above-mentioned patent sets up the taking and placing assembly and the taking and placing assembly can tilt, adsorb and clamp the chip to be detected, so that when the chip to be detected is placed in the detection slot, it can preferentially contact the inverted L-shaped buckle on the detection slot through the low edge of the inclined part, and then the chip to be detected is placed horizontally under the deflection of the adsorption fixing device, thereby avoiding surface scratches of the chip to be detected after contacting the test probe and effectively improving the test efficiency, but in the process of testing the chip, most traditional test boards adopt fixed pin slots or manual welding to install the chip, which may cause metal point wear and increase contact resistance after long-term use of the slot, thereby increasing the current measurement error, thus reducing the test precision of the chip and affecting the final test result of the chip.

[0005] Therefore, the present application provides an automatic chip testing device to solve the above-mentioned problems. SUMMARY

[0006] (I) Technical problems solved

[0007] The present application provides an automatic chip testing device, aiming at solving the problems proposed in the background art.

[0008] (II) Technical solutions

[0009] To achieve the above object, the present application provides the following technical solutions: an automatic chip testing device, comprising a workbench and a supporting leg fixedly connected to the lower surface of the workbench, a mounting mechanism mounted on the upper surface of the workbench, and a testing mechanism mounted on one side of the upper surface of the workbench.

[0010] The mounting mechanism comprises a mounting plate slidingly connected to the upper surface of the workbench, a mounting groove formed in a rectangular array on the upper surface of the mounting plate, a bearing plate slidingly connected to the two inner walls of the mounting groove, a compression spring fixedly connected to the two edges of the outer side of the bearing plate, a threaded rod fixedly connected to one end of the two compression springs, a threaded sleeve threadedly sleeved on the surface of the threaded rod, a drive motor fixedly connected to one end of the threaded sleeve through a bolt, and an electric push rod fixedly connected to the lower surface of the drive motor and the mounting plate.

[0011] As a preferred technical solution of the present application, the testing mechanism comprises a test box fixedly connected to one side of the upper surface of the workbench, an installation rack fixedly connected to the inside of the test box, a pneumatic push rod fixedly connected to the lower surface of the installation rack in a rectangular array, a hollow box fixedly connected to the output end of the pneumatic push rod, and a compression plate fixedly connected to the inside of the hollow box.

[0012] As a preferred technical solution of the present application, the testing mechanism further comprises a reset spring fixedly connected to the inside of the hollow box in a rectangular array, and a protection box slidingly connected to the hollow box and having one end of a plurality of reset springs fixedly connected thereto, the protection box corresponding to the mounting groove, and the two inner walls of the protection box fixedly connected to the electromagnetic coils corresponding to the mounting groove in a path array.

[0013] As a preferred technical solution of the present application, the testing mechanism further comprises a plurality of air pumps fixedly connected to the inside of the test box in a path array and divided into two groups, the output ends of the air pumps in one group fixedly connected to heating pipes, and the output ends of the air pumps in the other group fixedly connected to cooling pipes, the surfaces of the heating pipes and the cooling pipes fixedly connected to air inlet pipes in a path array and in communication with the hollow box.

[0014] As a preferred technical scheme of the present application, the test mechanism further comprises electromagnetic valves fixedly connected to the surface of the air inlet pipe in an array of paths and in communication with the air inlet pipe, wherein the input end of one group of the air pumps is fixedly connected with the heat inlet pipe, the input end of another group of the air pumps is fixedly connected with the conveying pipe, and the inside of the test box is fixedly connected with Peltier semiconductor refrigeration modules corresponding to the heat inlet pipe and the conveying pipe respectively.

[0015] As a preferred technical scheme of the present application, the mounting mechanism further comprises elastic probes mounted in the mounting slot in an array of paths, the lower surfaces of the elastic probes are fixedly connected with pressure sensors fixedly connected to the inner bottom wall of the mounting slot, the surfaces of the elastic probes are attached with pins, and the surfaces corresponding to the pins are fixedly connected with the chip body corresponding to the mounting slot.

[0016] As a preferred technical scheme of the present application, the hollow box and the protective box correspond to the chip body, the two sides of the chip body are attached to the corresponding bearing plates, one side of the upper surface of the mounting plate is fixedly connected with a heat insulation box in which a high-precision digital universal meter, an oscilloscope and a power analyzer are arranged, and the high-precision digital universal meter, the oscilloscope and the power analyzer are electrically connected to the chip body.

[0017] As a preferred technical scheme of the present application, the high-precision digital universal meter, the oscilloscope and the power analyzer are electrically connected to the chip body, the inside of the heat insulation box is provided with a power supply, the upper surface of the test box is fixedly connected with a control panel, and one side of the upper surface of the test box is fixedly connected with a power supply assembly electrically connected to the test mechanism.

[0018] As a preferred technical scheme of the present application, the mounting mechanism further comprises a push plate fixedly connected to one side of the mounting plate, the surface of the push plate is threadedly connected with a lead screw, one end of the lead screw is fixedly connected with a servo motor fixedly connected to the mounting plate, and one side of the push plate is sleeved with a guide rod fixedly connected to the mounting plate.

[0019] As a preferred technical scheme of the present application, the edge of the upper surface of the mounting plate is fixedly connected with a mechanical arm corresponding to the mounting plate, the surface of the end effector of the mechanical arm is fixedly connected with a high-definition camera, and the mechanical arm and the high-definition camera correspond to the mounting slot and the chip body.

[0020] (Three) beneficial effects

[0021] Based on the cooperation of the installation mechanism and the test mechanism and other structures, the chip body is placed in the installation slot through the mechanical arm and the end effector, so that the pins are attached to the elastic probes, the chip body position is positioned according to the high-definition camera, the driving motor is started according to the chip body position, the threaded rod drives the abutting spring and the bearing plate to move, the chip body position is fine-tuned, the positioning is more accurate, and the connection pressure of the pins and the elastic probes is monitored in real time through the pressure sensor, the chip body is moved up and down according to the pressure setting threshold and the electric push rod, the connection of the pins and the elastic probes is adjusted, the chip body is connected to the elastic probe more accurately, and through the adjustment of the elastic probe and the chip body position, the test of the chip body is avoided by the fixed pin slot or the manual welding method, and the test result of the chip body is affected by the wear of the metal point;

[0022] Based on the installation of the installation mechanism, the chip body is installed through the mechanical arm and the end effector, the movement of the chip body is realized through the cooperation of the servo motor and the screw rod, so that the chip body electric variable automatic test is realized through the high-precision digital universal meter, the oscilloscope and the power analyzer, and based on the setting of the high-definition camera, the surface of the chip body is detected when the mechanical arm is installed, the chip body with scratches on the surface is avoided to be tested, and the test workload is reduced.

[0023] Based on the setting of the test mechanism and other structures, when the chip body is tested, the chip body is isolated based on the hollow box and the protection box, a plurality of abutting plates are realized based on a plurality of pneumatic push rods, a plurality of chip bodies bear different pressures, and different temperature regulation is realized inside different hollow boxes based on the cooperation of the peltier semiconductor refrigeration module and the air pump, so that the test device can test a plurality of chips under different conditions, realize comparison test of a plurality of chips under different test intensities, not only improve the test efficiency of the chip body, but also further simulate the electric variable test of the chip body under different environments, and improve the accuracy of the test result of the chip body.

[0024] Based on the setting of the electromagnetic coil and the electromagnetic valve and other structures, when the chip body is tested in the hollow box, the opening degree of the electromagnetic valve is controlled according to the test requirement, the temperature of the environment where the chip body is located is regulated, the magnetic field is generated according to the electromagnetic coil, the electric variable of the chip body under different magnetic fields is simulated, and the real simulation of the environment is further realized through the coupling of the magnetic field and the temperature, the electric variable of the chip body under different environments is tested, so that the state of the chip body is tested more accurately. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 It is a structural schematic view of an automatic chip test device;

[0026] Figure 2 Structure diagram of a second perspective view of an automatic chip testing device;

[0027] Figure 3 Structure diagram of a testing mechanism in an automatic chip testing device;

[0028] Figure 4 Structure diagram of a pneumatic push rod, a hollow box, and a gas pump in an automatic chip testing device;

[0029] Figure 5 Structure diagram of a pneumatic push rod, a hollow box, and a protective box in an automatic chip testing device;

[0030] Figure 6 Structure diagram of a mounting mechanism in an automatic chip testing device;

[0031] Figure 7 Structure diagram of a mounting plate, a mounting slot, and an elastic probe in an automatic chip testing device;

[0032] Figure 8 Structure diagram of a bearing plate, an electric push rod, and a pressing spring in an automatic chip testing device;

[0033] Figure 9 Structure diagram of a mounting mechanism and a testing mechanism in an automatic chip testing device;

[0034] Figure 10 Structure diagram of a mechanical arm and a high-definition camera in an automatic chip testing device.

[0035] In the figure:

[0036] 1, work plate; 2, mounting mechanism; 201, mounting plate; 202, mounting slot; 203, bearing plate; 204, pressing spring; 205, threaded rod; 206, threaded cylinder; 207, drive motor; 208, electric push rod; 209, elastic probe; 210, pressure sensor; 211, pin; 212, chip body; 213, push plate; 214, screw rod; 215, servo motor; 3, testing mechanism; 301, testing box; 302, mounting frame; 303, pneumatic push rod; 304, hollow box; 305, pressing plate; 306, return spring; 307, protective box; 308, electromagnetic coil; 309, gas pump; 310, heating pipe; 311, cooling pipe; 312, air inlet pipe; 313, electromagnetic valve; 314, hot air inlet pipe; 315, conveying pipe; 316, Peltier semiconductor refrigeration module; 4, heat insulation box; 5, control panel; 6, power supply assembly; 7, mechanical arm; 8, high-definition camera. DETAILED DESCRIPTION

[0037] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0038] The present application provides an automatic chip testing device, as shown in Figures 1-10 Three embodiments are provided as shown in the drawings:

[0039] Embodiment one:

[0040] The automatic chip testing device comprises a workbench 1 and a supporting leg fixedly connected to the lower surface of the workbench 1, and the upper surface of the workbench 1 is provided with a mounting mechanism 2, and one side of the upper surface of the workbench 1 is provided with a testing mechanism 3;

[0041] The edge of the upper surface of the mounting plate 201 is fixedly connected with a mechanical arm 7 corresponding to the mounting plate 201, the surface of the end effector of the mechanical arm 7 is fixedly connected with a high-definition camera 8, and the mechanical arm 7 and the high-definition camera 8 correspond to the mounting groove 202 and the chip body 212;

[0042] The mechanical arm 7 and the end effector are used for clamping and mounting the chip;

[0043] The high-definition camera 8 is used for displaying the state of the chip;

[0044] The mounting mechanism 2 comprises a mounting plate 201 slidably connected to the upper surface of the workbench 1, the upper surface of the mounting plate 201 is provided with a mounting groove 202 in a rectangular array, both inner walls of the mounting groove 202 are slidably connected with a bearing plate 203, both edges of the outer side of the bearing plate 203 are fixedly connected with a pressing spring 204, one end of the two pressing springs 204 is fixedly connected with a threaded rod 205, the surface of the threaded rod 205 is threadedly sleeved with a threaded cylinder 206, one end of the threaded cylinder 206 is fixedly connected with a driving motor 207 slidably connected with the mounting plate 201 through a bolt, and the lower surface of the driving motor 207 is fixedly connected with an electric push rod 208 fixedly connected with the mounting plate 201;

[0045] The mounting plate 201 is used for transmitting the chip and mounting the chip;

[0046] The mounting groove 202 and the bearing plate 203 are used for limiting the chip;

[0047] The pressing spring 204 and the bearing plate 203 cooperate with each other to clamp and position the chip;

[0048] The threaded rod 205, the threaded cylinder 206 and the driving motor 207 are used for adjusting the position of the chip;

[0049] The electric push rod 208 is used for adjusting the mounting strength between the chip and the mounting mechanism 2;

[0050] Specifically, the mechanical arm 7 is started to make the end effector clamp the chip, the high-definition camera 8 is used to shoot the chip, and whether there is a scratch on the surface of the chip is observed. The chip with scratches is directly regarded as defective product and is not installed in the inside of the mounting groove 202. The chip without scratches is installed in the inside of the mounting groove 202 through the end effector. The chip is clamped based on the cooperation of the bearing plate 203 and the abutting spring 204, the action of inserting the chip into the mounting groove 202 is completed, and the position of the chip in the mounting groove 202 is positioned according to the high-definition camera 8;

[0051] When the position is offset, the driving motor 207 is started to drive the threaded cylinder 206 to rotate, so that the threaded rod 205 moves to drive the corresponding abutting spring 204 and the bearing plate 203 to move, so that the bearing plate 203 pushes the chip to move, the position of the chip is fine-tuned, and the chip mounting position is more accurate;

[0052] The mounting mechanism 2 further comprises elastic probes 209 installed in the inside of the mounting groove 202 in the form of an array. The lower surfaces of the elastic probes 209 are fixedly connected with pressure sensors 210 fixedly connected with the bottom wall in the mounting groove 202. The surfaces of the elastic probes 209 are attached with pins 211, and the surfaces of the pins 211 are fixedly connected with chip bodies 212 corresponding to the mounting groove 202;

[0053] The elastic probes 209 are used for connecting with the pins 211 of the chip bodies 212;

[0054] The pressure sensors 210 are used for monitoring the connection pressure of the pins 211 and the elastic probes 209 in real time;

[0055] Specifically, after the chip body 212 is inserted into the mounting groove 202, the pin 211 is in contact with the elastic probe 209, the pressure of the contact between the pin 211 and the elastic probe 209 is monitored based on the arrangement of the pressure sensor 210, when the pressure exceeds a threshold value, the electric push rod 208 is started to drive the driving motor 207 to move upward, based on the threaded rod 205 and the abutting spring 204, the corresponding bearing plate 203 is driven to move, and based on the elastic force of the abutting spring 204, the chip body 212 is more closely attached to the bearing plate 203, thereby driving the other bearing plate 203 to move, achieving the position adjustment of the chip body 212, thereby adjusting the connection pressure of the pin 211 and the elastic probe 209, and making the chip body 212 more accurately connected to the elastic probe 209, avoiding the test board using fixed pin insertion slot or manual welding method to install the chip, which causes metal point wear and affects the test result of the chip body 212;

[0056] The mounting mechanism 2 further comprises a push plate 213 fixedly connected to one side of the mounting plate 201, the surface of the push plate 213 is threadedly connected with a lead screw 214, one end of the lead screw 214 is fixedly connected with a servo motor 215 fixedly connected with the mounting plate 201, and one side of the push plate 213 is sleeved with a guide rod fixedly connected with the mounting plate 201;

[0057] Specifically, the push plate 213 corresponds to the feeding groove and achieves a sealing effect on the feeding groove, and the push plate 213 is used to push the mounting plate 201 to achieve the conveying of the chip body 212.

[0058] Specifically, the push plate 213 corresponds to the feeding groove and achieves a sealing effect on the feeding groove, and the push plate 213 is used to push the mounting plate 201 to achieve the conveying of the chip body 212.

[0059] Specifically, when the installation of the chip body 212 is completed, the servo motor 215 is started to drive the lead screw 214 to rotate, so that the push plate 213 slides on the workbench 1, thereby conveying the mounting plate 201 and the chip body 212 to the inside of the test box 301.

[0060] In the second embodiment based on the first embodiment, the test mechanism 3 further comprises a test box 301 fixedly connected to one side of the upper surface of the workbench 1, the inside of the test box 301 is fixedly connected with a mounting frame 302, the lower surface of the mounting frame 302 is fixedly connected with a pneumatic push rod 303 in a rectangular array, the output end of the pneumatic push rod 303 is fixedly connected with a hollow box 304, and the inside of the hollow box 304 is fixedly connected with an abutting plate 305.

[0061] The test box 301 is used to isolate the external environment.

[0062] The mounting frame 302 is used to mount the pneumatic push rod 303.

[0063] The pneumatic push rod 303 is used to drive the hollow box 304 and the abutting plate 305 to move;

[0064] The hollow box 304 is used to isolate the chip body 212;

[0065] The abutting plate 305 is used to provide a downward pressure on the chip body 212;

[0066] The test mechanism 3 further comprises a plurality of reset springs 306 fixedly connected in a rectangular array inside the hollow box 304, one end of the plurality of reset springs 306 being fixedly connected with a protective box 307 that is slidingly connected with the hollow box 304, the protective box 307 corresponding to the mounting groove 202, both inner walls of the protective box 307 being fixedly connected in a path array with electromagnetic coils 308 corresponding to the mounting groove 202;

[0067] The reset spring 306 is used for resetting the protective box 307;

[0068] The protective box 307 is slidingly connected inside the hollow box 304, so that the pneumatic push rod 303 can adjust the downward pressure of the abutting plate 305 on the chip body 212 after driving the hollow box 304 to move;

[0069] The electromagnetic coil 308 is used to simulate the change of the magnetic field around the chip body 212 during use;

[0070] Specifically, after the chip body 212 moves into the test box 301, the pneumatic push rod 303 is started to drive the hollow box 304, the abutting plate 305 and the protective box 307 to move downward, so that the protective box 307 and the hollow box 304 isolate the chip body 212, and then based on the sliding connection between the protective box 307 and the hollow box 304, the pneumatic push rod 303 can adjust the downward pressure of the hollow box 304 and the abutting plate 305 on the chip body 212, so as to realize the electrical variable test of the chip body 212 under different pressures;

[0071] At the same time, according to the test requirements, the electromagnetic coil 308 is started to form a magnetic field inside the hollow box 304 and the protective box 307, simulating the change of the magnetic field around the chip body 212 during use, so that the test result of the chip body 212 is more accurate, and according to the plurality of pneumatic push rods 303, the plurality of abutting plates 305 can realize that the plurality of chip bodies 212 bear different pressures, so as to realize the comparative test of the plurality of chip bodies 212 under different test intensities, not only improving the test efficiency of the chip body 212, but also further simulating the electrical variable test of the chip body 212 under different environments;

[0072] The test mechanism 3 further comprises air pumps 309 fixedly connected to the inside of the test box 301 in a path array and evenly divided into two groups, wherein the output ends of one group of air pumps 309 are fixedly connected with heating pipes 310, and the output ends of the other group of air pumps 309 are fixedly connected with cooling pipes 311, and the surfaces of the heating pipes 310 and the cooling pipes 311 are fixedly connected with air inlet pipes 312 in a path array and in communication with the hollow boxes 304;

[0073] The air pumps 309 are used for air transmission.

[0074] The heating pipes 310 are used for hot air transmission, and the cooling pipes 311 are used for cold air transmission.

[0075] The air inlet pipes 312 are used for guiding the hot air or the cold air.

[0076] The test mechanism 3 further comprises electromagnetic valves 313 fixedly connected to the surfaces of the air inlet pipes 312 in a path array and in communication with the air inlet pipes 312, wherein the input ends of one group of air pumps 309 are fixedly connected with hot air inlet pipes 314, and the input ends of the other group of air pumps 309 are fixedly connected with delivery pipes 315, and the inside of the test box 301 is fixedly connected with Peltier semiconductor refrigeration modules 316 corresponding to the hot ends and the cold ends of the hot air inlet pipes 314 and the delivery pipes 315.

[0077] The electromagnetic valves 313 are used for controlling the opening and closing degrees of the air inlet pipes 312.

[0078] The hot air inlet pipes 314 and the delivery pipes 315 are respectively used for transmitting the hot air or the cold air into the corresponding hollow boxes 304 and the protection boxes 307.

[0079] The hot ends and the cold ends of the Peltier semiconductor refrigeration modules 316 are used for making cold air or hot air.

[0080] Specifically, after the abutting plate 305 abuts against the chip body 212, based on the test requirement, the air pumps 309 are started to transmit the cold air and the hot air into the corresponding air inlet pipes 312, according to the requirement of the temperature inside the corresponding hollow boxes 304, the electromagnetic valves 313 are started to control the opening and closing degrees of the air inlet pipes 312 to control the transmission of the cold air and the hot air, so that the cold air and the hot air are neutralized inside the hollow boxes 304 to realize the regulation of the temperature inside the hollow boxes 304, thereby realizing the simultaneous test of the changes of the electrical variables of the multiple chip bodies 212 under different environments.

[0081] Through the coupling of the magnetic field and the temperature, the real simulation of the environment is further realized, and the electrical variables of the chip body 212 under different environments are tested, so that the state of the chip body is more accurately tested.

[0082] Based on the embodiment one and the embodiment two, further, the hollow box 304 and the protective box 307 correspond to the chip body 212, two sides of the chip body 212 are respectively attached to the corresponding bearing plate 203, one side of the test box 301 is provided with a feeding slot corresponding to the mounting plate 201, one side of the upper surface of the mounting plate 201 is fixedly connected with a heat insulation box 4 internally provided with a high-precision digital universal meter, an oscilloscope and a power analyzer;

[0083] Wherein, the protective box 307 corresponds to the chip body 212 to better protect and isolate the chip body 212;

[0084] Wherein, the feeding slot is used for the mounting plate 201 to convey the chip body 212 to the inside of the test box 301, and the feeding slot is sealed by the pushing plate 213 to avoid the influence of the external environment on the inside of the test box 301;

[0085] Wherein, the heat insulation box 4 is used to isolate the temperature inside the test box 301, so as to avoid the influence of the temperature on the high-precision digital universal meter, the oscilloscope and the power analyzer, and affect the precision of the high-precision digital universal meter, the oscilloscope and the power analyzer electric variable test;

[0086] The high-precision digital universal meter, the oscilloscope and the power analyzer are electrically connected with the chip body 212, the inside of the heat insulation box 4 is provided with a power supply, the upper surface of the test box 301 is fixedly connected with a control panel 5, one side of the upper surface of the test box 301 is fixedly connected with a power supply assembly 6 electrically connected with the test mechanism 3;

[0087] Wherein, the high-precision digital universal meter, the oscilloscope and the power analyzer are used for detecting and recording the data of the electric variable of the chip body 212;

[0088] Wherein, the control panel 5 is used for controlling the electrical elements in the automatic chip test device;

[0089] Wherein, the power supply assembly 6 is used for supplying power to the electrical elements in the test mechanism 3.

[0090] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. An automated chip testing apparatus, characterized by: Including the work board and the support leg fixedly connected to the lower surface of the work board, the upper surface of the work board is provided with a mounting mechanism, and one side of the upper surface of the work board is provided with a test mechanism; The mounting mechanism comprises a mounting plate slidably connected to the upper surface of the work plate, a rectangular array of mounting grooves is formed in the upper surface of the mounting plate, both inner walls of the mounting groove are slidably connected with a bearing plate, both edges of the outer side of the bearing plate are fixedly connected with a clamping spring, one end of the two clamping springs is fixedly connected with a threaded rod, the surface of the threaded rod is threadedly connected with a threaded cylinder, one end of the threaded cylinder is fixedly connected with a driving motor slidably connected with the mounting plate through bolts, and the lower surface of the driving motor is fixedly connected with an electric push rod fixedly connected with the mounting plate; The test mechanism comprises a test box fixedly connected to one side of the upper surface of the work plate, the inside of the test box is fixedly connected with a mounting frame, the lower surface of the mounting frame is fixedly connected with a pneumatic push rod in a rectangular array, the output end of the pneumatic push rod is fixedly connected with a hollow box, and the inside of the hollow box is fixedly connected with a clamping plate; The test mechanism further comprises a plurality of reset springs fixedly connected to the inside of the hollow box in a rectangular array, one end of the plurality of reset springs is fixedly connected with a protective box slidably connected with the hollow box, the protective box corresponds to the mounting groove, and both inner walls of the protective box are fixedly connected with an electromagnetic coil corresponding to the mounting groove in a path array; The test mechanism further comprises a plurality of air pumps fixedly connected to the inside of the test box in a path array and divided into two groups, the output end of one group of air pumps is fixedly connected with a heating pipe, and the output end of the other group of air pumps is fixedly connected with a cooling pipe, the surface of the heating pipe and the cooling pipe is fixedly connected with an air inlet pipe in communication with the hollow box in a path array; The test mechanism further comprises a plurality of electromagnetic valves fixedly connected to the surface of the air inlet pipe in a path array and in communication with the air inlet pipe, the input end of one group of air pumps is fixedly connected with a heat inlet pipe, and the input end of the other group of air pumps is fixedly connected with a conveying pipe, and the inside of the test box is fixedly connected with a Peltier semiconductor refrigeration module corresponding to the heat inlet pipe and the conveying pipe; The mounting mechanism further comprises a plurality of elastic probes installed in the mounting groove in a path array, the lower surface of each of the plurality of elastic probes is fixedly connected with a pressure sensor fixedly connected with the inner bottom wall of the mounting groove, the surface of the elastic probe is attached with a pin, and the surface corresponding to the pin is fixedly connected with a chip body corresponding to the mounting groove.

2. The automated chip testing apparatus of claim 1, wherein: The hollow box and the protective box correspond to the chip body, the two sides of the chip body correspond to the bearing plate, one side of the test box is provided with a feeding slot corresponding to the mounting plate, and the upper surface of the mounting plate is fixedly connected with a heat insulation box internally provided with a high-precision digital universal meter, an oscilloscope and a power analyzer.

3. The automated chip testing apparatus of claim 2, wherein: The high-precision digital universal meter, the oscilloscope and the power analyzer are electrically connected with the chip body, the inside of the heat insulation box is provided with a power supply, the upper surface of the test box is fixedly connected with a control panel, and one side of the upper surface of the test box is fixedly connected with a power supply assembly electrically connected with the test mechanism.

4. The automated chip testing apparatus of claim 1, wherein: The mounting mechanism further comprises a push plate fixedly connected to one side of the mounting plate, a screw rod threadedly connected to the surface of the push plate, a servo motor fixedly connected to one end of the screw rod and fixedly connected with the mounting plate, and a guide rod fixedly connected with the mounting plate and sleeved with one side of the push plate.

5. The automated chip testing apparatus of claim 1, wherein: A mechanical arm corresponding to the mounting plate is fixedly connected to the edge of the upper surface of the mounting plate, a high-definition camera is fixedly connected to the surface of the end effector of the mechanical arm, and the mechanical arm and the high-definition camera correspond to the mounting groove and the chip body.

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