Stacked cooling device and m.2 cold plate, device and mounting method based thereon

Abstract

The application provides a laminated cooling device and an M.2 cold plate, equipment and mounting method based on the same, and relates to the technical field of hard disk cooling, wherein the laminated cooling device comprises a cold plate main body; at least three heat transfer pieces, the heat transfer pieces are connected with the cold plate main body, the heat transfer pieces are distributed at intervals, an accommodation cavity for accommodating a to-be-cooled piece is formed between two adjacent heat transfer pieces, and the two adjacent heat transfer pieces are used for being in contact with at least two surfaces of the to-be-cooled piece. The laminated cooling device and the M.2 cold plate, equipment and mounting method based on the same provided by the application solve the problem of poor heat dissipation effect in the related art when multiple solid state disks are cooled at the same time.

Description

Technical Field

[0001] This application relates to the field of hard disk cooling technology, and more particularly to a stacked cooling device and an M.2 cold plate, equipment and installation method based thereon. Background Technology

[0002] M.2 SSDs are memory modules widely used in servers, data centers, and high-performance computing devices. They are a type of solid-state drive and are typically mounted on a PCB board. Secondly, fans are used to cool the solid-state drive, with airflow passing over its surface to remove heat.

[0003] In related technologies, to meet data storage requirements, at least two solid-state drives (SSDs) are often mounted on a PCB board in a stacked configuration. Specifically, the PCB board has connectors with at least two slots and hard drive locking fasteners. During installation, one end of each SSD is plugged into the corresponding slot on the connector, and then the other end of each SSD is locked in place using the hard drive locking fasteners, resulting in a stacked arrangement of the SSDs.

[0004] However, when cooling multiple stacked solid-state drives using the same fan, the airflow to some of the solid-state drives may be obstructed, resulting in poor cooling performance when cooling multiple solid-state drives simultaneously. Summary of the Invention

[0005] This application provides a stacked cooling device and an M.2 cold plate, equipment, and installation method based thereon to solve the problem of poor heat dissipation effect when simultaneously cooling multiple solid-state drives in related technologies.

[0006] In a first aspect, this application provides a stacked cooling device, comprising:

[0007] Cold-rolled steel plate body;

[0008] At least three heat transfer elements are connected to the cold plate body. The heat transfer elements are spaced apart and a receiving cavity is formed between two adjacent heat transfer elements to accommodate the heat-dissipating component. The two adjacent heat transfer elements are used to contact at least two surfaces of the heat-dissipating component.

[0009] In one possible implementation, at least three heat transfer elements include a lower heat transfer element, a middle heat transfer element, and an upper heat transfer element, wherein the upper heat transfer element, the middle heat transfer element, and the lower heat transfer element are arranged sequentially at intervals.

[0010] The lower heat transfer element is fixedly connected to the cold plate body, while the middle heat transfer element and the upper heat transfer element are detachably connected to the cold plate body.

[0011] In one possible implementation, the cold plate body is provided with at least two connecting slots, and the ends of the middle heat transfer element and the ends of the upper heat transfer element are correspondingly inserted into the connecting slots.

[0012] At least one locking component is detachably provided on the main body of the cold plate, and the locking component keeps the middle heat transfer component and the upper heat transfer component correspondingly inserted into the connecting groove.

[0013] In one possible implementation, at least one first limiting groove is provided on the middle heat transfer element, and at least one second limiting groove is provided on the upper heat transfer element.

[0014] The locking assembly includes a slider, which is detachably connected to the cold plate body. The slider has a first stop and a second stop, the first stop engaging with the first limiting groove, and the second stop engaging with the second limiting groove.

[0015] In one possible implementation, the slider is also slidably connected to the cold plate body, and in the sliding direction of the slider, the length of the first stop is greater than the length of the second stop, so that the slider switches between a first state, a second state and a third state.

[0016] When the slider is in the first state, the first stop is not engaged with the first limiting groove, and the second stop is not engaged with the second limiting groove;

[0017] When the slider is in the second state, the first stop block is engaged with the first limiting groove, and the second stop block is not engaged with the second limiting groove;

[0018] When the slider is in the third state, the first stop is engaged with the first limiting groove, and the second stop is engaged with the second limiting groove.

[0019] In one possible implementation, the slider has at least one mounting hole, which is a strip-shaped hole and extends along the sliding direction of the slider;

[0020] A fastener is inserted into the mounting hole to secure the slider to the cold plate body. At least one of the mounting holes has a first slot, a second slot, and a third slot for engaging the fastener, so that when the fastener engages the first slot, the second slot, or the third slot, the slider is in the first state, the second state, or the third state respectively.

[0021] In one possible implementation, the upper heat transfer element is connected to a side heat transfer element, the side heat transfer element is arranged at an angle to the upper heat transfer element, and at least one of the lower heat transfer element and the middle heat transfer element has its end away from the cold plate body in contact with the side heat transfer element.

[0022] And / or, at least one of the lower heat transfer element, the middle heat transfer element and the upper heat transfer element has a heat-conducting layer disposed on the surface facing the heat dissipation component.

[0023] Secondly, this application provides an M.2 cold plate, which includes the stacked cooling device described in any of the above embodiments.

[0024] Thirdly, the device provided in this application includes a PCB board, at least two heat-dissipating components, and the stacked cooling device described in any of the above embodiments;

[0025] The component to be cooled is mounted on the PCB board;

[0026] The cold plate body in the stacked cooling device is disposed on the PCB board, and the heat dissipation component is correspondingly housed in the receiving cavity of the stacked cooling device, so that two adjacent heat transfer components in the stacked cooling device are in contact with at least two surfaces of the heat dissipation component.

[0027] Fourthly, this application provides an installation method for installing the stacked cooling device described in any of the above embodiments, comprising the following steps:

[0028] At least three heat transfer elements in the stacked cooling device are connected to the cold plate body in the stacked cooling device, so that a receiving cavity is formed between two adjacent heat transfer elements in the stacked cooling device.

[0029] At least two heat transfer elements are respectively housed in the receiving cavity, and the two adjacent heat transfer elements are in contact with at least two surfaces of the heat transfer elements.

[0030] This application provides a stacked cooling device, an M.2 cold plate based thereon, equipment, and installation method. The stacked cooling device comprises: a cold plate main body; at least three heat transfer elements connected to the cold plate main body, spaced apart, with a cavity formed between adjacent heat transfer elements to accommodate the component to be cooled, and the adjacent heat transfer elements contacting at least two surfaces of the component. During installation, the cold plate main body is mounted on a PCB board, and the at least three heat transfer elements are connected to the cold plate main body, forming a cavity between adjacent heat transfer elements. At least two solid-state drives (SSDs) mounted on the PCB board are correspondingly accommodated within the cavity, with the adjacent heat transfer elements contacting at least two surfaces of the SSDs. During operation, each SSD can transfer heat through at least two of its surfaces to the two adjacent heat transfer elements, which then transfer the heat to the cold plate main body, thereby achieving heat dissipation for the SSDs. This results in high heat dissipation efficiency when simultaneously cooling multiple SSDs, solving the problem of poor heat dissipation when simultaneously cooling multiple SSDs in related technologies. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0032] Figure 1 A schematic diagram of the mounting structure of a stacked cooling device on a PCB board provided in an embodiment of this application;

[0033] Figure 2 for Figure 1 An exploded view of the mid-layer stacked cooling device mounted on a PCB board;

[0034] Figure 3 for Figure 2 Exploded view of the main body of the intermediate cooling plate;

[0035] Figure 4 for Figure 2 A schematic diagram of the overall structure of the upper and middle heat transfer components and the side heat transfer components;

[0036] Figure 5 for Figure 3 A schematic diagram of the middle slider;

[0037] Figure 6 for Figure 3 A schematic diagram of the middle slider in its first state;

[0038] Figure 7 for Figure 3 A schematic diagram of the middle slider in the second state;

[0039] Figure 8 for Figure 3A schematic diagram of the structure when the middle slider is in the third state;

[0040] Figure 9 This is a schematic diagram of the structure of a device provided in an embodiment of this application.

[0041] Explanation of reference numerals in the attached figures:

[0042] 10-PCB board; 11-Connector;

[0043] 20-Solid State Drive;

[0044] 30 - Hard drive lock head;

[0045] 100 - Cold-rolled steel plate body; 110 - Connecting groove; 111 - Positioning protrusion; 112 - Positioning notch;

[0046] 200 - Heat transfer component; 210 - Lower heat transfer component; 220 - Middle heat transfer component; 221 - First limiting groove; 222 - Handle; 230 - Upper heat transfer component; 231 - Second limiting groove; 240 - Side heat transfer component; 241 - Positioning groove; 242 - Positioning block;

[0047] 300 - Reception cavity;

[0048] 400 - Locking assembly; 410 - Slider; 411 - First stop; 412 - Second stop; 413 - Mounting hole; 4131 - First position slot; 4132 - Second position slot; 4133 - Third position slot; 414 - Handle; 420 - Fastener;

[0049] 500 - Thermal conductive layer; 510 - Thermal conductive pad; 520 - PI film.

[0050] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0051] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0052] In related technologies, M.2 SSD is a type of memory module widely used in servers, data centers, and high-performance computing devices. It is a type of solid-state drive and is typically mounted on a printed circuit board (PCB). Secondly, a fan is used to dissipate heat from the solid-state drive by airflow passing over its surface.

[0053] To meet data storage requirements, at least two solid-state drives (SSDs) are typically mounted on a PCB in a stacked configuration. Specifically, the PCB has connectors with at least two slots and drive locking fasteners. During installation, one end of each SSD is plugged into the corresponding slot on the connector, and then the other end of each SSD is locked in place using the drive locking fasteners, resulting in a stacked arrangement of SSDs.

[0054] However, when using the same fan to cool multiple stacked SSDs, airflow to some SSDs may be obstructed, resulting in poor cooling performance when cooling multiple SSDs simultaneously. For example, SSDs closer to the fan may obstruct airflow, reducing the airflow to other SSDs and the airflow in the gaps between adjacent SSDs, and making the airflow unstable, thus leading to poor cooling performance.

[0055] Based on this, this application provides a stacked cooling device and an M.2 cold plate, equipment, and installation method based thereon. The stacked cooling device includes: a cold plate body; at least three heat transfer elements connected to the cold plate body, spaced apart, with a cavity formed between adjacent heat transfer elements to accommodate the component to be cooled, and the adjacent heat transfer elements contacting at least two surfaces of the component to be cooled. Thus, during installation, the cold plate body can be mounted on a PCB board, and the at least three heat transfer elements are connected to the cold plate body, forming a cavity between adjacent heat transfer elements. At least two solid-state drives (SSDs) mounted on the PCB board are correspondingly accommodated within the cavity, with the adjacent heat transfer elements contacting at least two surfaces of the SSDs. During operation, each SSD can transfer heat through at least two of its surfaces to the two adjacent heat transfer elements, which then transfer the heat to the cold plate body, thereby achieving heat dissipation for the SSDs. This results in high heat dissipation efficiency when simultaneously cooling multiple SSDs, solving the problem of poor heat dissipation when simultaneously cooling multiple SSDs in related technologies.

[0056] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0057] like Figure 1 and Figure 2 As shown in the embodiment of this application, a stacked cooling device includes:

[0058] Cold plate body 100;

[0059] At least three heat transfer elements 200 are connected to the cold plate body 100. The heat transfer elements 200 are spaced apart. A receiving cavity 300 for accommodating the heat dissipation component is formed between two adjacent heat transfer elements 200. The two adjacent heat transfer elements 200 are used to contact at least two surfaces of the heat dissipation component.

[0060] The component to be cooled can be a solid-state drive 20 (such as an M.2 SSD), a hard disk drive (HDD), or other electronic devices requiring heat dissipation. In this embodiment, the solid-state drive 20 is used as an example, and there are two solid-state drives 20. It should be noted that the PCB board 10 has connectors 11 adapted to the solid-state drives 20, and each connector 11 has two slots. During installation, the ends of the two solid-state drives 20 with interfaces (usually located at the length end of the solid-state drive 20) are inserted into the slots on the connector 11.

[0061] In this embodiment, the cold plate body 100 can be mounted on a horizontally positioned PCB board by screwing, welding, bonding or other means; in other embodiments, the cold plate body 100 can also be installed on other parts of the site according to actual needs, such as chassis, brackets, etc.

[0062] The cold plate body 100 is a liquid-cooled plate, and the model is not limited. For example, the cold plate body 100 may include a plate body and a coolant channel disposed inside the plate body. An inlet pipe and an outlet pipe, communicating with the coolant channel, can be integrally formed, screwed, welded, or connected to the outside of the plate body by means of welding, screwing, or other methods. In use, coolant (such as water or refrigerant) is introduced into the coolant channel through the inlet pipe and then output through the outlet pipe, allowing the coolant to carry away the heat transferred to the cold plate body 100, thus achieving the purpose of heat dissipation for the solid-state drive 20. Alternatively, the cold plate body 100 may also use a cold plate from an existing product.

[0063] In this embodiment, three heat transfer elements 200 are provided. The heat transfer elements 200 can be made of materials such as stainless steel, copper, aluminum, alloy, or other materials with good thermal conductivity. All three heat transfer elements 200 are connected to the cold plate body 100, and all three heat transfer elements 200 are located on the side of the cold plate body 100 in the same direction.

[0064] During installation, the cold plate body 100 can be mounted on the PCB board 10, and three heat transfer elements 200 can be connected to the cold plate body 100, so that a receiving cavity 300 is formed between two adjacent heat transfer elements 200. At the same time, two solid-state drives 20 are correspondingly housed in the receiving cavity 300, so that two adjacent heat transfer elements 200 are in contact with at least two surfaces of the solid-state drives 20.

[0065] During operation, each solid-state drive 20 can transfer heat to two adjacent heat transfer elements 200 through at least two of its surfaces, and then the heat transfer elements 200 transfer the heat to the cold plate body 100, thereby achieving heat dissipation of the solid-state drive 20. This results in high heat dissipation efficiency when cooling multiple solid-state drives 20 at the same time, solving the problem of poor heat dissipation effect when cooling multiple solid-state drives 20 at the same time in related technologies.

[0066] It should be noted that when the solid-state drives 20 are set to three or other quantities, the number of heat transfer components 200 can be reasonably set according to the number of solid-state drives 20, so that multiple heat transfer components 200 can construct multiple receiving cavities 300 that match the number of solid-state drives 20. For example, when there are three solid-state drives 20, four heat transfer components 200 are set; when there is one solid-state drive 20, two heat transfer components 200 are set.

[0067] like Figure 1 and Figure 2 As shown, in some embodiments, at least three heat transfer elements 200 include a lower heat transfer element 210, a middle heat transfer element 220 and an upper heat transfer element 230, which are arranged at intervals from top to bottom.

[0068] The lower heat transfer element 210 is fixedly connected to the cold plate body 100, while the middle heat transfer element 220 and the upper heat transfer element 230 are detachably connected to the cold plate body 100.

[0069] In this embodiment, the three heat transfer elements 200 are an upper heat transfer element 230, a middle heat transfer element 220, and a lower heat transfer element 210, which are distributed at intervals from top to bottom. The upper heat transfer element 230, the middle heat transfer element 220, and the lower heat transfer element 210 are all horizontally arranged and can all be rectangular plate structures, or other shapes, without limitation.

[0070] Secondly, the upper heat transfer element 230, the middle heat transfer element 220, the lower heat transfer element 210, and the cold plate body 100 extend in the same direction. The long side of both the middle heat transfer element 220 and the upper heat transfer element 230 can be detachably connected to the cold plate body 100. The long side of the lower heat transfer element 210 can be fixedly connected to the cold plate body 100 through integral molding, welding, or other methods. Furthermore, the cold plate body 100 is connected to the PCB board 10 via the lower heat transfer element 210. At this time, a cavity 300 is formed between the lower heat transfer element 210 and the middle heat transfer element 220, and another cavity 300 is formed between the middle heat transfer element 220 and the upper heat transfer element 230.

[0071] For example, multiple through holes can be made on the lower heat transfer component 210, and then screws are passed through the through holes and threaded to the PCB board 10 to fasten the lower heat transfer component 210 to the PCB board 10, thereby simultaneously completing the installation of the lower heat transfer component 210 and the cold plate body 100 on the PCB board 10.

[0072] Therefore, when installing the two solid-state drives 20, the lower heat transfer component 210 and the cold plate body 100 can be installed together on the PCB board 10 first. Then, one of the solid-state drives 20 is installed on the upper surface of the lower heat transfer component 210, and the middle heat transfer component 220 is connected to the cold plate body 100, covering the solid-state drive 20. Next, the other solid-state drive 20 is installed on the upper surface of the middle heat transfer component 220, and the upper heat transfer component 230 is connected to the cold plate body 100, covering the solid-state drive 20.

[0073] Therefore, the heat from the lower solid-state drive 20 can be transferred to the middle heat transfer element 220 and the lower heat transfer element 210 through the upper and lower surfaces, respectively. Similarly, the heat from the upper solid-state drive 20 can be transferred to the upper heat transfer element 230 and the middle heat transfer element 220 through the upper and lower surfaces, respectively. The heat is then transferred to the cold plate body 100 through the heat transfer element 200 to achieve efficient heat dissipation.

[0074] How are the middle heat transfer element 220 and the upper heat transfer element 230 detachably connected to the cold plate body 100? For example... Figure 2 and Figure 3 As shown, in some embodiments, the cold plate body 100 is provided with at least two connecting grooves 110, and the ends of the middle heat transfer component 220 and the upper heat transfer component 230 are respectively inserted into the connecting grooves 110.

[0075] At least one locking component 400 is detachably provided on the cold plate body 100, which holds the middle heat transfer component 220 and the upper heat transfer component 230 in corresponding plug-in connection slots 110.

[0076] In this embodiment, two connecting grooves 110 are formed on the side surface of the cold plate body 100 facing the lower heat transfer element 210. The extending direction of the connecting grooves 110 is consistent with the extending direction of the cold plate body 100, and the two connecting grooves 110 are distributed vertically at intervals. The end of the middle heat transfer element 220 with its long side and the end of the upper heat transfer element 230 with its long side are respectively inserted into the two connecting grooves 110.

[0077] A locking assembly 400 is detachably mounted on the cold plate body 100. The locking assembly 400 can be one, two, or other quantities. In this embodiment, two locking assemblies 400 are provided, and the two locking assemblies 400 are located on opposite sides of the length of the cold plate body 100. Furthermore, each locking assembly 400 simultaneously restricts one end of the middle heat transfer element 220 and one end of the upper heat transfer element 230 within their corresponding connecting grooves 110.

[0078] Therefore, during installation, the middle heat transfer component 220 and the upper heat transfer component 230 can be inserted into the connecting slot 110 respectively, and then locked by the locking assembly 400, thereby realizing a detachable connection between the middle heat transfer component 220 and the upper heat transfer component 230 and the cold plate body 100, and the connection has good stability. This allows both the middle heat transfer component 220 and the upper heat transfer component 230 to transfer the heat from the solid-state drive 20 they are in contact with to the cold plate body 100, and then the cold plate body 100 dissipates the heat.

[0079] In practice, before the middle heat transfer element 220 and the upper heat transfer element 230 are inserted into the corresponding connecting groove 110, a thermally conductive interface material can be filled into the connecting groove 110. This ensures that after the end of the middle heat transfer element 220 or the end of the upper heat transfer element 230 is inserted into the connecting groove 110, the thermally conductive interface material will fill the three-sided gaps at the corresponding ends, thereby optimizing the heat transfer effect between the middle heat transfer element 220 or the upper heat transfer element 230 and the cold plate body 100. The thermally conductive interface material can be thermally conductive paste, thermally conductive adhesive, etc., filled in the connecting groove 110, or it can be a thermally conductive sheet pasted into the connecting groove 110.

[0080] like Figure 2 and Figure 3 As shown, during implementation, at least one positioning protrusion 111 can also be provided in the connecting groove 110. At this time, the end of the middle heat transfer component 220 facing the connecting groove 110 and the end of the upper heat transfer component 230 facing the connecting groove 110 are both provided with positioning notches 112 that are adapted to the positioning protrusion 111.

[0081] Understandably, when the middle heat transfer component 220 or the upper heat transfer component 230 is inserted into the connecting groove 110, the positioning notch 112 on it can engage with the positioning protrusion 111 to further position the insertion process of the middle heat transfer component 220 or the upper heat transfer component 230, improve the installation accuracy of the two, and facilitate the subsequent locking assembly 400 to lock the middle heat transfer component 220 and the upper heat transfer component 230.

[0082] like Figure 2 and Figure 4 As shown, in some embodiments, the upper heat transfer element 230 is connected to a side heat transfer element 240, the side heat transfer element 240 is arranged at an angle to the upper heat transfer element 230, and at least one of the lower heat transfer element 210 and the middle heat transfer element 220 has its end away from the cold plate body 100 in contact with the side heat transfer element 240.

[0083] In this embodiment, the lateral heat transfer element 240 can be a plate-like structure or other shapes. The lateral heat transfer element 240 is connected to the end of the upper heat transfer element 230 away from the cold plate body 100, and the lateral heat transfer element 240 is perpendicular to the upper heat transfer element 230, so that the overall structure formed by the upper heat transfer element 230 and the lateral heat transfer element 240 is an L-shaped plate structure. The lateral heat transfer element 240 and the upper heat transfer element 230 can be integrally formed, or they can be connected by welding or other methods. In other embodiments, the upper heat transfer element 230 and the lateral heat transfer element 240 can also form other angles, such as 85 degrees, 80 degrees, etc., without limitation.

[0084] It should be noted that when the upper heat transfer element 230 is inserted into the connecting groove 110, the side heat transfer element 240 extends vertically and is located at the end of the upper heat transfer element 230 away from the cold plate body 100. This allows the side heat transfer element 240 to simultaneously contact the surface of the lower heat transfer element 210 away from the cold plate body 100 and the surface of the middle heat transfer element 220 away from the cold plate body 100.

[0085] Therefore, the heat on the lower heat transfer element 210 and the middle heat transfer element 220 can also be transferred to the cold plate body 100 through the side heat transfer element 240 and the upper heat transfer element 230. In other words, both ends of the lower heat transfer element 210 and the middle heat transfer element 220 can transfer heat to the cold plate body 100, further improving the heat dissipation efficiency of each solid-state drive 20.

[0086] In implementation, upwardly folded flanges can be provided at the ends of the lower heat transfer element 210 and the middle heat transfer element 220 away from the cold plate body 100, so that the flanges can abut against the ends of the solid-state drive 20 away from the cold plate body 100, allowing the solid-state drive 20 to be stably accommodated within the receiving cavity 300. At this time, the side heat transfer element 240 simultaneously contacts the surfaces of the two flanges away from the cold plate body 100.

[0087] like Figure 2 , Figure 3 and Figure 4 As shown, in some embodiments, at least one of the lower heat transfer element 210, the middle heat transfer element 220 and the upper heat transfer element 230 is provided with a heat-conducting layer 500 on the surface facing the heat dissipation element.

[0088] In this embodiment, a heat-conducting layer 500 is provided on the surfaces of the lower heat transfer element 210, the middle heat transfer element 220, the upper heat transfer element 230 and the side heat transfer element 240 facing the solid-state drive 20 by means of bonding, embedding or other methods.

[0089] Specifically, the upper surface of the lower heat transfer component 210 is provided with a heat-conducting layer 500, both the upper and lower surfaces of the middle heat transfer component 220 are provided with a heat-conducting layer 500, the lower surface of the upper heat transfer component 230 is provided with a heat-conducting layer 500, and the surface of the side heat transfer component 240 facing the cold plate body 100 is provided with a heat-conducting layer 500.

[0090] The lower heat transfer element 210, middle heat transfer element 220, and upper heat transfer element 230 are all in contact with the solid-state drive 20 through the thermally conductive layer 500. This improves the heat transfer effect between the lower heat transfer element 210, middle heat transfer element 220, and upper heat transfer element 230 and the solid-state drive 20, while also providing some protection to the solid-state drive 20 and reducing the possibility of wear and tear. The side heat transfer element 240 is in contact with the lower heat transfer element 210 and middle heat transfer element 220 through the thermally conductive layer 500, thereby improving the heat transfer effect between the lower heat transfer element 210 and middle heat transfer element 220 and the side heat transfer element 240.

[0091] In implementation, the thermally conductive layer 500 may include a laminated thermally conductive pad 510 and a PI film 520, with the PI film 520 located on the side of the thermally conductive pad 510 facing the solid-state drive 20. The thermally conductive pad 510 may be made of a silicon-based or graphite-based thermally conductive material, etc.; the PI film is a polyimide film. Alternatively, some thermally conductive layers 500 may consist only of the thermally conductive pad 510; for example, the thermally conductive layer 500 on the side heat transfer element 240 may consist only of the thermally conductive pad 510. Of course, the thermally conductive layer 500 on the side heat transfer element 240 may also be formed by filling the gaps between the lower heat transfer element 210 and the middle heat transfer element 220 and the side heat transfer element 240 with a thermally conductive interface material.

[0092] In other embodiments, the lateral heat transfer element 240 may also only contact the surface of the lower heat transfer element 210 away from the cold plate body 100 or the surface of the middle heat transfer element 220 away from the cold plate body 100.

[0093] Furthermore, such as Figure 3 and Figure 4 As shown, at least one positioning groove 241 can also be formed at one end of the lower heat transfer element 210 facing the side heat transfer element 240. In practice, the positioning groove 241 can be formed on the flange portion of the lower heat transfer element 210. A positioning block 242 adapted to the positioning groove 241 is provided on the side heat transfer element 240. The positioning block 242 can be integrally formed, welded or otherwise provided on the side heat transfer element 240.

[0094] Therefore, when installing the upper heat transfer component 230 and the side heat transfer component 240 as a whole, the positioning block 242 can be engaged with the positioning groove 241, while the upper heat transfer component 230 is inserted into the connecting groove 110, and then the upper heat transfer component 230 is locked in place by the locking assembly 400. This improves the stability and reliability of the overall installation of the upper heat transfer component 230 and the side heat transfer component 240.

[0095] In other embodiments, the positioning groove 241 may also be formed on the middle heat transfer element 220.

[0096] Based on this, the middle heat transfer element 220 is completely covered by the upper heat transfer element 230 and the side heat transfer element 240. Therefore, in order to facilitate the operation of the middle heat transfer element 220, such as... Figure 2 As shown, a handle 222 can also be provided at the end of the middle heat transfer element 220 away from the cold plate body 100. The handle 222 can be provided on the middle heat transfer element 220 by integral molding, welding or other means. At this time, an avoidance notch can be opened at the part of the side heat transfer element 240 corresponding to the handle 222, so that the handle 222 can extend out of the side heat transfer element 240 from the avoidance notch.

[0097] In practice, to facilitate operation of the upper heat transfer element 230, a handle 222 may be provided on the upper surface of the upper heat transfer element 230 by integral molding, welding or other means. The shape of the handle 222 is not limited.

[0098] like Figure 2 and Figure 5 As shown, in some embodiments, the middle heat transfer element 220 is provided with at least one first limiting groove 221, and the upper heat transfer element 230 is provided with at least one second limiting groove 231.

[0099] The locking assembly 400 includes a slider 410, which is detachably connected to the cold plate body 100. The slider 410 has a first stop 411 and a second stop 412. The first stop 411 engages with the first limiting groove 221, and the second stop 412 engages with the second limiting groove 231.

[0100] In this embodiment, the middle heat transfer element 220 has a first limiting groove 221 at both ends in its length direction, and the first limiting groove 221 is located near the end of the middle heat transfer element 220 facing the connecting groove 110. The upper heat transfer element 230 has a second limiting groove 231 at both ends in its length direction, and the second limiting groove 231 is located near the end of the upper heat transfer element 230 facing the connecting groove 110.

[0101] The locking assembly 400 includes a slider 410, which is detachably connected to the side surface of one end of the cold plate body 100 along its length. A first stop 411 and a second stop 412 are provided on the surface of the slider 410 facing the cold plate body 100. The first stop 411 is spaced below the second stop 412, allowing the first stop 411 to engage with the first limiting groove 221 and the second stop 412 to engage with the second limiting groove 231. Both the first stop 411 and the second stop 412 can be integrally formed, welded, bonded, or otherwise disposed on the slider 410.

[0102] Therefore, after the middle heat transfer element 220 and the upper heat transfer element 230 are correspondingly inserted into the connecting groove 110, the slider 410 can be fastened to the side surface of the cold plate body 100, and the first stop 411 is engaged in the first limiting groove 221, and the second stop 412 is engaged in the second limiting groove 231. This restricts the long side of the middle heat transfer element 220 and the long side of the upper heat transfer element 230 within their corresponding connecting grooves 110, completing the installation of the middle heat transfer element 220 and the upper heat transfer element 230 on the cold plate body 100.

[0103] like Figure 5 As shown, the slider 410 is further slidably connected to the cold plate body 100, and in the sliding direction of the slider 410, the length of the first stop 411 is greater than the length of the second stop 412, so that the slider 410 switches between the first state, the second state and the third state.

[0104] When the slider 410 is in the first state, the first stop 411 is not engaged with the first limiting groove 221, and the second stop 412 is not engaged with the second limiting groove 231.

[0105] When the slider 410 is in the second state, the first stop 411 is engaged with the first limiting groove 221, and the second stop 412 is not engaged with the second limiting groove 231.

[0106] When the slider 410 is in the third state, the first stop 411 is engaged with the first limiting groove 221, and the second stop 412 is engaged with the second limiting groove 231.

[0107] Specifically, in the sliding direction of slider 410, the length of the first stop 411 is greater than the length of the second stop 412. The sliding direction of slider 410 is... Figure 5 In the Z-direction of the XYZ coordinate system, that is, the length of the first stop block 411 in the Z-direction is greater than the length of the second stop block 412 in the Z-direction. In practice, assuming that the thickness of each solid-state drive 20 is equal, preferably, the length of the first stop block 411 in the Z-direction can be set to twice the length of the second stop block 412 in the Z-direction.

[0108] Therefore, when installing two solid-state drives 20, the slider 410 can be kept connected to the cold plate body 100 first (at this time, the slider 410 is in the first state). Then, one of the solid-state drives 20 is installed on the upper surface of the lower heat transfer component 210, and the middle heat transfer component 220 is inserted into the corresponding connecting slot 110 of the solid-state drive 20, so that the middle heat transfer component 220 covers the solid-state drive 20. Then, the slider 410 is slid to the second state so that the first stop 411 engages with the first limiting slot 221, and then the middle heat transfer component 220 is locked.

[0109] Next, another solid-state drive 20 is installed on the upper surface of the middle heat transfer component 220, and then the upper heat transfer component 230 is inserted into the corresponding connection slot 110 of the solid-state drive 20, so that the upper heat transfer component 230 covers the solid-state drive 20. Then, the slider 410 is slid to the third state, so that while the first stop 411 is engaged with the first limiting slot 221, the second stop 412 is engaged with the second limiting slot 231. Thus, while the middle heat transfer component 220 is locked, the upper heat transfer component 230 is also locked.

[0110] It should be noted that clearance channels can be provided at the locations corresponding to the first stop 411 and the second stop 412 on the cold plate body 100, and the first limiting groove 221 and the second limiting groove 231 are both located within the clearance channels. Therefore, during the sliding of the slider 410, the cold plate body 100 is less likely to restrict the sliding of the first stop 411 and the second stop 412.

[0111] like Figure 3 and Figure 5 As shown, in some embodiments, the slider 410 has at least one mounting hole 413, which is a strip-shaped hole and extends along the sliding direction of the slider 410.

[0112] A fastener 420 is inserted into the mounting hole 413. The fastener 420 secures the slider 410 to the cold plate body 100. At least one mounting hole 413 has a first stop groove 4131, a second stop groove 4132, and a third stop groove 4133 for engaging the fastener 420. When the fastener 420 engages the first stop groove 4131, the second stop groove 4132, or the third stop groove 4133, the slider 410 is in the first state, the second state, or the third state respectively.

[0113] In this embodiment, the slider 410 is rectangular, and four mounting holes 413 are provided on the slider 410, corresponding to the four corners of the slider 410. Furthermore, the mounting holes 413 are strip-shaped holes and extend along the sliding direction of the slider 410.

[0114] Fastener 420 is a screw, but it can also be a bolt or pin. Four fasteners 420 are provided, and each fastener 420 is inserted into a corresponding mounting hole 413. The fasteners 420 are threadedly connected to the cold plate body 100. That is to say, the surface of the cold plate body 100 corresponding to the slider 410 has threaded holes that are adapted to the fasteners 420.

[0115] Secondly, the two mounting holes 413 near the upper end of the slider 410 have a first gear groove 4131, a second gear groove 4132, and a third gear groove 4133 distributed along the sliding direction of the slider 410. Specifically, the first gear groove 4131, the second gear groove 4132, and the third gear groove 4133 are distributed sequentially from bottom to top. In other embodiments, the first gear groove 4131, the second gear groove 4132, and the third gear groove 4133 may also be provided in other positions or in other numbers of mounting holes 413, and there is no limitation on this.

[0116] Based on this, during installation, the slider 410 can be secured to the cold plate body 100 using multiple fasteners 420 (i.e., screws). The slider 410 can then be slid, and the fasteners 420 in the two mounting holes 413 near the upper end of the slider 410 can be engaged with the first stop groove 4131, the second stop groove 4132, or the third stop groove 4133, thereby completing the switching of the slider 410 between the first, second, and third states. See also... Figure 6 This refers to the position of slider 410 in the first state; see [link / reference]. Figure 7 This refers to the position of slider 410 in the second state; see [link / reference]. Figure 8 , which is the position of slider 410 in the third state.

[0117] It should be noted that when the fastener 420 is engaged with the first slot 4131, the second slot 4132 or the third slot 4133, the fastener 420 can be pulled out of the mounting hole 413 and then reinserted into the mounting hole 413.

[0118] Alternatively, two smaller protrusions can be provided within the mounting hole 413, spaced apart to divide the internal space of the mounting hole 413 into a first positioning groove 4131, a second positioning groove 4132, and a third positioning groove 4133. In this case, while maintaining the locking slider 410 (i.e., restricting the slider 410's freedom in its thickness direction), the fastener 420 can slide the slider 410, causing the fastener 420 to pass through the protrusions and engage with the first positioning groove 4131, the second positioning groove 4132, or the third positioning groove 4133. Based on this, when installing the solid-state drive 20, the middle heat transfer component 220, and the upper heat transfer component 230 on-site, a screwless fixing method can be achieved, improving installation efficiency and convenience.

[0119] In practice, position markings can be provided on the side surface of the slider 410. For example, the position markings can be "2, 1, 0" distributed from bottom to top to indicate that the slider 410 is in the first, second, and third states, respectively. That is, position 2 corresponds to the first position slot 4131, position 1 corresponds to the second position slot 4132, and position 0 corresponds to the third position slot 4133. At this time, a pointer or other indicator can be provided on the cold plate body 100 to indicate one of the position markings, so as to clearly indicate the position state of the slider 410.

[0120] Secondly, such as Figure 5 As shown, a handle 414 can also be provided at the upper end of the slider 410. The handle 414 extends toward the side of the slider 410 away from the cold plate body 100, so as to operate the slider 410 through the handle 414. The handle 414 can be integrally formed, welded or otherwise provided on the slider 410.

[0121] In other embodiments, the slider 410 may also be detachably connected to the cold plate body 100 by means of snap-fit, pin-fit or other means.

[0122] For example, when slider 410 is in position 2, both the middle heat transfer component 220 and the upper heat transfer component 230 are removable, suitable for scenarios where both SSDs 20 require maintenance. When slider 410 is in position 1, the middle heat transfer component 220 is not removable, but the upper heat transfer component 230 is removable, suitable for scenarios where the upper SSD 20 requires maintenance. When slider 410 is in position 0, neither the middle heat transfer component 220 nor the upper heat transfer component 230 is removable; at this time, both SSDs 20 are in a stable working state, and neither can be maintained.

[0123] In summary, the stacked cooling device provided in this application embodiment allows each solid-state drive 20 to transfer heat to two adjacent heat transfer elements 200 through at least two of its surfaces during operation, and then the heat transfer elements 200 transfer the heat to the cold plate body 100, thereby achieving heat dissipation of the solid-state drive 20. This results in high heat dissipation efficiency when cooling multiple solid-state drives 20 simultaneously, solving the problem of poor heat dissipation effect when cooling multiple solid-state drives 20 simultaneously in related technologies.

[0124] This application provides an M.2 cold plate, including the stacked cooling device described in any of the above embodiments. Specifically, it includes at least two M.2 solid-state drives (SSDs), such that each M.2 SSD is installed within a cavity 300 in the stacked cooling device, resulting in high heat dissipation efficiency when simultaneously cooling multiple M.2 SSDs.

[0125] This application provides an embodiment of a device, including a PCB board 10, at least two components to be cooled, and a stacked cooling device as described in any of the above embodiments;

[0126] The heat sink is placed on the PCB board 10. The heat sink can be a solid-state drive 20, or other types of hard drives or other electronic devices, and there are no restrictions on this.

[0127] The main body 100 of the cold plate in the stacked cooling device is disposed on the PCB board 10, and the component to be cooled is correspondingly housed in the receiving cavity 300 in the stacked cooling device, so that two adjacent heat transfer components 200 in the stacked cooling device are in contact with at least two surfaces of the component to be cooled.

[0128] The stacked cooling device has been described in detail in the above embodiments and will not be repeated here.

[0129] like Figure 9 As shown, in this embodiment, the component to be cooled is a solid-state drive 20, and there are two solid-state drives 20. The PCB board 10 also has a connector 11 with two slots, allowing the two solid-state drives 20 to be inserted into the two slots on the connector 11. Simultaneously, the PCB board 10 also has a hard drive locking head 30. The hard drive locking head 30 can adopt the structure of existing products, allowing it to lock onto the end of each solid-state drive 20 furthest from the connector 11, thereby ensuring the stability of the connection between the solid-state drive 20 and the connector 11.

[0130] Therefore, each solid-state drive 20 can transfer heat to the two adjacent heat transfer elements 200 through at least two of its surfaces, and then the heat transfer elements 200 transfer the heat to the cold plate body 100, thereby achieving heat dissipation of the solid-state drive 20. This results in higher heat dissipation efficiency when multiple solid-state drives 20 are cooled at the same time, solving the problem of poor heat dissipation effect when cooling multiple solid-state drives 20 at the same time in related technologies.

[0131] This application provides an installation method for installing the stacked cooling device in any of the above embodiments, comprising the following steps:

[0132] At least three heat transfer elements 200 in the stacked cooling device are connected to the cold plate body 100 in the stacked cooling device, so that a receiving cavity 300 in the stacked cooling device is formed between two adjacent heat transfer elements 200.

[0133] At least two heat transfer elements are housed in the receiving cavity 300, and two adjacent heat transfer elements 200 are in contact with at least two surfaces of the heat transfer elements.

[0134] The stacked cooling device has been described in detail in the above embodiments and will not be repeated here. The component to be cooled can be a solid-state drive 20, or other types of hard drives or other electronic devices, and there are no restrictions on this.

[0135] In this embodiment, the component to be cooled is a solid-state drive 20, and two solid-state drives 20 are provided. The cold plate body 100 is used to mount on the PCB board 10, and the PCB board 10 also has a connector 11 and a hard drive locking head 30. The specific installation steps include the following ten steps:

[0136] Step 1: Align the cold plate body 100 and the lower heat transfer component 210 on the PCB board 10 to maintain their relative positions with the connector 11 and the hard drive lock head 30.

[0137] Step 2: Securely fasten the lower heat transfer component 210 to the PCB board 10 with screws.

[0138] Step 3: Insert one of the solid-state drives 20 into the connector 11 at an angle, and then adjust the angle to keep it in good contact with the upper surface of the lower heat transfer component 210.

[0139] Step 4: Use the hard drive lock 30 to lock the first solid-state drive 20.

[0140] Step 5: Position slider 410 in position 2, push the middle heat transfer component 220 horizontally into the corresponding connecting groove 110 on the cold plate body 100, and make the middle heat transfer component 220 fit against the upper surface of the first solid-state drive 20.

[0141] Step 6: Adjust slider 410 from position 2 to position 1 to lock the middle heat transfer component 220. At this time, the first solid-state drive 20 has completed the installation.

[0142] Step 7: Insert the second solid-state drive 20 into the connector 11 at an angle, and then adjust the angle to keep it in good contact with the upper surface of the middle heat transfer component 220.

[0143] Step 8: Use the hard drive lock 30 to lock the second solid-state drive 20.

[0144] Step 9: Push the upper heat transfer component 230 horizontally into the corresponding connecting groove 110 on the cold plate body 100, and make the positioning block 242 on the side heat transfer component 240 engage with the positioning groove 241 on the lower heat transfer component 210.

[0145] Step 10: Adjust slider 410 from position 1 to position 0 to lock the upper heat transfer component 230. At this point, the second solid-state drive 20 is installed.

[0146] Disassembly can be performed by simply repeating the above steps in reverse.

[0147] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A stacked cooling device, characterized in that, include: Cold plate body (100); At least three heat transfer elements (200) are connected to the cold plate body (100), and the heat transfer elements (200) are spaced apart. A receiving cavity (300) for accommodating the heat dissipation component is formed between two adjacent heat transfer elements (200), and two adjacent heat transfer elements (200) are used to contact at least two surfaces of the heat dissipation component. At least three of the heat transfer elements (200) include a lower heat transfer element (210), a middle heat transfer element (220) and an upper heat transfer element (230), wherein the upper heat transfer element (230), the middle heat transfer element (220) and the lower heat transfer element (210) are arranged at intervals in sequence; The lower heat transfer element (210) is fixedly connected to the cold plate body (100), and the middle heat transfer element (220) and the upper heat transfer element (230) are detachably connected to the cold plate body (100). The cold plate body (100) is provided with at least two connecting grooves (110), and the ends of the middle heat transfer component (220) and the upper heat transfer component (230) are respectively inserted into the connecting grooves (110). At least one locking component (400) is detachably provided on the cold plate body (100), and the locking component (400) keeps the middle heat transfer component (220) and the upper heat transfer component (230) correspondingly inserted into the connecting groove (110). At least one first limiting groove (221) is provided on the middle heat transfer component (220), and at least one second limiting groove (231) is provided on the upper heat transfer component (230). The locking assembly (400) includes a slider (410), which is detachably connected to the cold plate body (100). The slider (410) has a first stop (411) and a second stop (412). The first stop (411) engages with the first limiting groove (221), and the second stop (412) engages with the second limiting groove (231). The slider (410) is also slidably connected to the cold plate body (100), and in the sliding direction of the slider (410), the length of the first stop (411) is greater than the length of the second stop (412), so that the slider (410) can switch between the first state, the second state and the third state; When the slider (410) is in the first state, the first stop (411) is not engaged with the first limiting groove (221), and the second stop (412) is not engaged with the second limiting groove (231). When the slider (410) is in the second state, the first stop (411) is engaged with the first limiting groove (221), and the second stop (412) is not engaged with the second limiting groove (231). When the slider (410) is in the third state, the first stop (411) engages with the first limiting groove (221), and the second stop (412) engages with the second limiting groove (231).

2. The stacked cooling device according to claim 1, characterized in that, The slider (410) has at least one mounting hole (413), which is a strip-shaped hole and extends along the sliding direction of the slider (410); A fastener (420) is inserted into the mounting hole (413) to fasten the slider (410) to the cold plate body (100). At least one of the mounting holes (413) has a first slot (4131), a second slot (4132), and a third slot (4133) for engaging the fastener (420). When the fastener (420) engages the first slot (4131), the second slot (4132), or the third slot (4133), the slider (410) is in the first state, the second state, or the third state respectively.

3. The stacked cooling device according to any one of claims 1-2, characterized in that, The upper heat transfer element (230) is connected to a side heat transfer element (240), the side heat transfer element (240) and the upper heat transfer element (230) are arranged at an angle, and at least one of the lower heat transfer element (210) and the middle heat transfer element (220) is in contact with the side heat transfer element (240) at the end away from the cold plate body (100); And / or, at least one of the lower heat transfer element (210), the middle heat transfer element (220) and the upper heat transfer element (230) is provided with a thermally conductive layer (500) on the surface facing the heat dissipation element.

4. An M.2 cold-rolled steel plate, characterized in that, Includes the stacked cooling device as described in any one of claims 1-3.

5. A device, characterized in that, Includes a PCB board (10), at least two heat-dissipating components, and a stacked cooling device as described in any one of claims 1-3; The heat-dissipating component is disposed on the PCB board (10); The cold plate body (100) in the stacked cooling device is disposed on the PCB board (10), and the heat dissipation component is correspondingly housed in the receiving cavity (300) in the stacked cooling device, so that two adjacent heat transfer components (200) in the stacked cooling device are in contact with at least two surfaces of the heat dissipation component.

6. An installation method, characterized in that, For installing the stacked cooling device according to any one of claims 1-3, the following steps are included: At least three heat transfer elements (200) in the stacked cooling device are connected to the cold plate body (100) in the stacked cooling device, so that a receiving cavity (300) in the stacked cooling device is formed between two adjacent heat transfer elements (200). At least two heat transfer elements are respectively housed in the receiving cavity (300), and two adjacent heat transfer elements (200) are in contact with at least two surfaces of the heat transfer elements.

Images