Service configuration method, service execution method, upper computer and semiconductor equipment
By acquiring service configuration information of semiconductor equipment and introducing priority management, the problem of machine downtime caused by abnormal machine status was solved, enabling flexible and accurate service delivery and timely status monitoring, thereby improving production efficiency and product quality.
Patent Information
- Application Number
- CN202411111661.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2026-02-17
AI Technical Summary
In the semiconductor manufacturing process, equipment may become abnormal due to long-term use or untimely maintenance, resulting in alarms that cannot be handled in a timely manner, affecting mass production. Furthermore, customers are unfamiliar with alarm handling and cannot handle them properly, leading to equipment downtime and a series of other problems.
By acquiring the service configuration information of semiconductor devices, including target monitoring channels and associated target services, the system monitors and distributes appropriate services in real time based on target parameters, and introduces a priority management mechanism to ensure that services are executed in priority order.
It improved the flexibility and accuracy of service delivery, enabled timely status monitoring and service response, reduced the risk of machine downtime, and improved production efficiency and product quality.
Smart Images
Figure CN121541930A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor technology, and in particular to a service configuration method, a service execution method, a host computer, and a semiconductor device. Background Technology
[0002] In the semiconductor manufacturing industry, it is common for a module in a machine to malfunction due to prolonged use or lack of timely maintenance. The machine's status is often reflected in the parameters of its channels, such as abnormal temperature, pressure, voltage, or current. These abnormalities typically trigger alarms at the factory, which then performs machine maintenance based on these alarms. However, in current technology, customers may not be able to handle alarms immediately after they are reported to the factory, leading to prolonged machine downtime and impacting mass production. Furthermore, if the customer on duty is unfamiliar with the alarm, they may not be able to handle it appropriately, resulting in a series of machine problems. Summary of the Invention
[0003] In view of the above problems, embodiments of the present invention are proposed to provide a service configuration method, a service execution method, a host computer, and a semiconductor device that overcome or at least partially solve the above problems.
[0004] To address the aforementioned problems, this invention discloses a service configuration method applied to a host computer, the method comprising:
[0005] Obtain service configuration information for semiconductor devices; the service configuration information includes: a target monitoring channel for transmitting target parameters that need to be monitored, triggering conditions for the target parameters, and a target service associated with the target monitoring channel;
[0006] Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is sent to the semiconductor device.
[0007] Optionally, the service configuration information further includes triggering conditions for the target parameters, wherein the step of sending the target service associated with the target monitoring channel to the semiconductor device based on the target parameters obtained from the target monitoring channel includes:
[0008] When the target parameters obtained from the target monitoring channel meet the triggering conditions, the target service associated with the target monitoring channel is sent to the semiconductor device.
[0009] Optionally, obtaining service configuration information for semiconductor devices includes:
[0010] Obtain a channel list for the semiconductor device, the channel list including monitoring channels corresponding to multiple parameters;
[0011] In the channel list, determine the target monitoring channel selected by the user for transmitting the target parameters that need to be monitored.
[0012] Optionally, obtaining service configuration information for semiconductor devices includes:
[0013] Obtain a list of services for the semiconductor device; the service list includes various services.
[0014] In the service list, determine the target service selected by the user;
[0015] The target service is associated with the target monitoring channel to obtain the target service associated with the target monitoring channel.
[0016] The present invention also discloses a service execution method applied to a semiconductor device, the method comprising:
[0017] The target parameters to be monitored are transmitted to the host computer through the target monitoring channel.
[0018] Receive the target service associated with the target monitoring channel sent by the host computer, and execute the target service.
[0019] Optionally, executing the target service includes:
[0020] Determine whether the semiconductor device is in an idle state;
[0021] If the semiconductor device is in an idle state, then the target service is executed;
[0022] If the semiconductor device is not in an idle state, a priority list is obtained, which includes the priorities of various services, processes, and tasks. The priority order of the target service is determined according to the priority list. The target service is then executed according to the priority order of the target service. The various processes include the processes being executed by the chamber of the semiconductor device, the various tasks include the tasks being participated in by the chamber of the semiconductor device, and the various services include other services being executed by the chamber of the semiconductor device and the target service.
[0023] Optionally, executing the target services according to their priority order includes:
[0024] If the semiconductor device is performing other services, and the priority of the other services in the priority list is higher than the priority of the target service, then the target service will be executed after the other services have finished running.
[0025] If the semiconductor device is currently performing other services, and the priority of the target service in the priority list is higher than the priority of the other services, then the other services are paused and the target service is executed.
[0026] Optionally, executing the target services according to their priority order includes:
[0027] If the semiconductor device is executing a process, and the priority of the process in the priority list is higher than the priority of the target service, then wait for the process to complete before executing the target service;
[0028] If the semiconductor device is executing a process, and the priority of the target service in the priority list is higher than the priority of the process, then the process is paused and the target service is executed.
[0029] Optionally, executing the target services according to their priority order includes:
[0030] If the semiconductor device is executing a task, and the priority of the task in the priority list is higher than the priority of the target service, then wait for the task to complete before executing the target service;
[0031] If the semiconductor device is performing a task, and the priority of the target service in the priority list is higher than the priority of the task, then the task is paused and the target service is executed.
[0032] Optionally, when one target monitoring channel corresponds to multiple target services, executing the target service includes:
[0033] Determine the execution order of the multiple target services;
[0034] The multiple target services are executed in the order they are executed.
[0035] The present invention also discloses a host computer, comprising: a processor and a memory, wherein the memory stores a computer program, and when the processor executes the computer program, it performs the steps of the above-described service configuration method.
[0036] The present invention also discloses a semiconductor device, comprising: a processor and a memory, wherein the memory stores a computer program, and when the processor executes the computer program, it performs the steps of the above-described service execution method.
[0037] The embodiments of the present invention have the following advantages:
[0038] This invention discloses a service configuration method, comprising: acquiring service configuration information for a semiconductor device; the service configuration information including: a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel; and, based on the target parameters obtained from the target monitoring channel, distributing the target service associated with the target monitoring channel to the semiconductor device. This invention can customize monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. This invention can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users. Attached Figure Description
[0039] Figure 1 This is a flowchart of the steps of a service configuration method provided in an embodiment of the present invention;
[0040] Figure 2 This is a flowchart illustrating the process of obtaining and configuring service configuration information according to an embodiment of the present invention.
[0041] Figure 3 This is a flowchart of the steps of a service execution method provided in an embodiment of the present invention;
[0042] Figure 4 This is a flowchart illustrating a service execution method provided in an embodiment of the present invention. Detailed Implementation
[0043] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0044] In the semiconductor manufacturing industry, it is common for a certain module in a machine to become abnormal during operation due to long-term use or lack of timely maintenance, resulting in various problems such as module damage, task interruption, and triggering safety hazards.
[0045] The status of a machine can often be fed back based on the channel parameters on the machine, such as abnormal machine temperature, abnormal pressure, abnormal voltage, abnormal current, etc. Usually, the above anomalies will trigger an alarm to the factory, and the factory will then perform machine maintenance based on the alarm. However, this mode has the following problems:
[0046] 1) Factory-side customer response time: When an alarm is reported to the factory, the customer may not be able to handle the alarm immediately, which will cause the machine to be shut down for a long time and affect mass production.
[0047] 2) The factory customer's proficiency in alarm handling: When an alarm is reported to the factory, if the customer on duty is not familiar with the alarm, they will not be able to handle it properly, which will lead to a series of problems with the machine.
[0048] Currently, CTC (Cluster Tool Controller) has an Auto service module. AutoService is a function that automatically sends a service to the machine based on software timing logic. For example, the current machine will automatically execute two types of services, AutoLeakRate and Auto O2 Burn, based on two modes: Idle (the machine is idle for a certain period of time) and Time (the machine is based on a timed mode).
[0049] AutoLeakRate (Automatic Leak Rate Testing): Automatic leak rate testing is an important part of semiconductor manufacturing. It is used to detect leaks in vacuum systems or sealed components. In the semiconductor manufacturing process, many steps need to be carried out under high vacuum or specific atmospheric conditions to ensure the purity of materials and the performance of devices.
[0050] AutoLeakRate service typically refers to an automated program that can automatically perform leak rate tests, including steps such as vacuuming, filling with test gas, and detecting the gas leakage rate. This automation service can improve the accuracy and repeatability of the test while reducing human error and time costs.
[0051] Leakage rate test results are crucial for ensuring the performance of semiconductor devices, as even tiny leaks can allow contaminants to enter the system, affecting the reliability and performance of the device.
[0052] Auto O2 Burn: In semiconductor manufacturing, Auto O2 Burn typically refers to a high-temperature processing step using oxygen to remove organic residues, photoresist, or other contaminants. This process is also known as "burning" or "ablation" because it involves using oxygen at high temperatures to oxidize organic materials and convert them into gas, thereby removing them from the wafer surface.
[0053] Auto O2 Burn service is an automated process that automatically controls parameters such as oxygen flow, temperature, and processing time to ensure that each wafer receives a consistent and high-quality cleaning result. This automation service can improve process stability and repeatability while reducing the workload of operators.
[0054] Oxygen combustion is a critical step in semiconductor manufacturing because it directly affects the success rate of subsequent process steps and the performance of the final device.
[0055] Both of these automation services are important tools for improving process control and production efficiency in semiconductor manufacturing. Automation can reduce human error, improve process consistency and reliability, and thus improve the quality and yield of semiconductor products.
[0056] Table 1 shows a parameter table for an AutoService provided in an embodiment of the present invention.
[0057]
[0058] Table 1
[0059] Taking the example of a user selecting AutoLeakRate, the user selects the ChamberLeakRate service, sets the Mode to Time, edits the Day Interval, Time(h), and Time(m), and finally sets Enable to True. After clicking save, AutoChamberLeakRate will take effect immediately.
[0060] When the following three conditions are met:
[0061] 1) The chamber is in standby mode.
[0062] 2) There are no wafers in the chamber.
[0063] 3) The current time is Time(h) hours and Time(m) minutes after Day Interval.
[0064] The PM (process module) automatically switches the state to Mainmode and issues the ChamberLeakRate service.
[0065] It can be seen that the service delivery process in the relevant technologies cannot be executed during the Job process, and it is a timed delivery, which has low flexibility, limited service options, and cannot monitor the machine status to deliver appropriate services based on the machine status.
[0066] One of the core concepts of this invention is that it acquires service configuration information for semiconductor devices. This service configuration information includes a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is distributed to the semiconductor device. This invention can customize monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. It can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users.
[0067] Reference Figure 1 The diagram illustrates a service configuration method provided in an embodiment of the present invention, applied to a host computer. The method includes:
[0068] Step 101: Obtain service configuration information for semiconductor devices; the service configuration information includes: target monitoring channel for transmitting target parameters that need to be monitored, and target service associated with the target monitoring channel.
[0069] In this embodiment of the invention, service configuration information refers to the target monitoring channel that needs to be monitored and the target service associated with the target monitoring channel, configured for monitoring the status of semiconductor devices.
[0070] The target monitoring channel can be used to transmit the target parameters that need to be monitored. The target parameters refer to the process parameters in the semiconductor equipment. The process parameters can be one of temperature, pressure, current, and voltage, and there is no limitation. For example, if the target monitoring channel is a chamber process channel, the target parameter is the chamber pressure.
[0071] In one embodiment of the present invention, obtaining service configuration information for a semiconductor device includes: obtaining a channel list for the semiconductor device, the channel list including monitoring channels corresponding to multiple parameters; and determining, in the channel list, the target monitoring channel selected by the user for transmitting the target parameters that need to be monitored.
[0072] In this embodiment of the invention, the channel list may include all channels in the semiconductor device. The channel list allows the user to select the target monitoring channel to be monitored. After obtaining the channel list for the semiconductor device, the user can select the target monitoring channel that transmits the target parameters to be monitored from the channel list. For example, the channel list includes a first channel for chamber temperature, a second channel for chamber pressure, and a third channel for chamber power. The user can select the first channel for chamber temperature as the target monitoring channel.
[0073] In one embodiment of the present invention, obtaining service configuration information for a semiconductor device includes: obtaining a service list for the semiconductor device; the service list includes multiple services; determining the target service selected by the user in the service list; and associating the target service with a target monitoring channel to obtain the target service associated with the target monitoring channel.
[0074] In this embodiment of the invention, the service list may include multiple different services. Users can select a target service from the service list. The target service is used to handle the abnormal state of the target monitoring channel. Then, the target service can be associated with the target monitoring channel. Thus, when the target parameters of the target monitoring channel meet the triggering conditions, the target service associated with the target monitoring channel can be sent.
[0075] In one application scenario, the target monitoring channel is a single channel, which is a chamber pressure channel for chamber pressure parameters, and the target service is a single service, which is a pressure regulation service.
[0076] In another application scenario, there are three target monitoring channels: channel 1 for monitoring chamber temperature parameters, channel 2 for monitoring chamber pressure parameters, and channel 3 for monitoring chamber power parameters. The target services selected by the user are temperature regulation services related to temperature control, pressure regulation services related to pressure regulation, and power regulation services related to power regulation. The temperature regulation service can include multiple services, namely service 1 and service 2; the pressure regulation service can include multiple services, namely service a, service b, and service c; and the power regulation service can include multiple services, namely service m and service n. Then, the temperature regulation service can be associated with monitoring channel 1, the pressure regulation service can be associated with monitoring channel 2, and the power regulation service can be associated with monitoring channel 3.
[0077] Step 102: Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is sent to the semiconductor device.
[0078] In this embodiment of the invention, the host computer can obtain target parameters from the target monitoring channel, and then determine whether the state of the semiconductor device is abnormal based on the obtained target parameters, and then send the target service associated with the target monitoring channel to the semiconductor device.
[0079] Specifically, the triggering conditions for sending target services associated with a target monitoring channel to semiconductor devices can be set according to single-channel or multi-channel configurations. For example, when the target monitoring channel is a single channel, if the parameter value of the associated channel exceeds a first set value or is higher than a second set value, the target service will be sent. When the target monitoring channel is multi-channel, the user can set upper limits for each channel, such as upper limit 20 for channel 1, upper limit 30 for channel 2, upper limit 40 for channel 3, and upper limit 50 for channel 4. When the value of one channel exceeds the set value, the target service will be sent. The user can associate multiple channels and set lower limits for each channel, such as lower limit 20 for channel 1, lower limit 30 for channel 2, lower limit 40 for channel 3, and lower limit 50 for channel 4. When the value of one channel is lower than the set value, the target service will be sent.
[0080] In one example, the target monitoring channel can be a channel that transmits the temperature parameters of the chamber to be monitored. The target services associated with the target monitoring channel are Service 1, Service 2, and Service 3. The normal temperature range of the chamber to be monitored is generally below 30 degrees Celsius. When the host computer receives a temperature value of 35 degrees Celsius transmitted by the target monitoring channel, it indicates that the temperature of the chamber is abnormal. At this time, Service 1, Service 2, and Service 3 can be sent to the semiconductor device.
[0081] In one embodiment of the present invention, the service configuration information further includes triggering conditions for target parameters. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is sent to the semiconductor device, including: when the target parameters obtained from the target monitoring channel meet the triggering conditions, the target service associated with the target monitoring channel is sent to the semiconductor device.
[0082] In this embodiment of the invention, the triggering condition is a condition used to determine whether the target parameters transmitted in the target monitoring channel of the semiconductor device are abnormal. Continuing with the above example, the triggering condition can be that the chamber pressure is greater than 30 degrees Celsius. The host computer can obtain the target parameters from the target monitoring channel. When the obtained target parameters meet the triggering condition, the target service associated with the target monitoring channel can be sent to the semiconductor device.
[0083] In one embodiment of the present invention, the triggering conditions include the value of the target parameter of a single target monitoring channel reaching a first set value, or the value of the target parameter in multiple target monitoring channels satisfying a preset algorithm. The preset algorithm includes the sum of the values of the target parameters of multiple target monitoring channels reaching a second set value and the product of the values of the target parameters of multiple target monitoring channels reaching a third set value.
[0084] In this embodiment of the invention, when there is only one target monitoring channel, the triggering condition may be that the value of the target parameter of the target monitoring channel reaches a first set value. In one example, the target monitoring channel may be a channel that transmits the temperature parameter of the chamber to be monitored, and the triggering condition may be that the temperature of the chamber is greater than or equal to 30 degrees Celsius.
[0085] When there are multiple target monitoring channels, the triggering condition can be that the values of the target parameters in the multiple target monitoring channels meet preset conditions. For example, when the target monitoring channels are channel A1 for transmitting the temperature parameters of the first chamber to be monitored and channel A2 for transmitting the temperature parameters of the second chamber to be monitored, the preset algorithm can be that the temperature value of A1 + the temperature value of A2 is greater than or equal to 70 degrees Celsius, or the product of the temperature value of A1 and the temperature value of A2 reaches a third set value. The first set value, the second set value, and the third set value can be set according to the user's needs and are not limited here.
[0086] In one embodiment of the present invention, the triggering condition may also be that the value of the target parameter of at least one of the multiple target monitoring channels reaches a preset value. For example, when either of the two monitored channels MT1 and MT2 is greater than 30 or greater than 40, the associated target service will be issued.
[0087] In this embodiment of the invention, MT1 refers to the temperature of channel A1, and MT2 refers to the temperature of channel A2.
[0088] In one embodiment of the present invention, when the target monitoring channels are A1 and A2 respectively, the triggering condition can be one of the following: MT1+MT2>set value; MT1-MT2>set value; MT1*MT2>set value; MT1 / MT2=set value; MT1>set value&&MT2>set value; MT1>set value&&MT2>set value; MT1!=set value. Thus, users can set monitoring conditions according to their own needs, providing convenience for users.
[0089] like Figure 2 This diagram illustrates a method for obtaining service configuration information according to an embodiment of the present invention. After obtaining the service list, a target service can be selected from it. If there is only one target service, its priority is set and then saved to the service list. If there are multiple target services, their execution order is set, their priority is set, and then the information is saved to the service list. After obtaining the channel list, the target monitoring channel to be monitored can be obtained from it. If there is only one target monitoring channel, its trigger condition can be set. If there are multiple target monitoring channels, their trigger conditions can be set and then saved to the channel list. Finally, the target monitoring channel can be associated with the target service.
[0090] This invention discloses a service configuration method. The method involves acquiring service configuration information for semiconductor devices. This information includes a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is distributed to the semiconductor device. This invention allows for customization of monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. It can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users.
[0091] Reference Figure 3 The diagram illustrates a service execution method according to an embodiment of the present invention, applied to a semiconductor device. The method may include the following steps:
[0092] Step 201: Transmit the target parameters to be monitored to the host computer through the target monitoring channel.
[0093] Step 202: Receive the target service associated with the target monitoring channel sent by the host computer and execute the target service.
[0094] In one embodiment of the present invention, executing a target service includes: determining whether the semiconductor device is in an idle state; if the semiconductor device is in an idle state, then executing the target service; if the semiconductor device is not in an idle state, then obtaining a priority list, the priority list including the priorities of multiple services, multiple processes, and multiple tasks, determining the priority order of the target service according to the priority list; and executing the target service according to the priority order of the target service; the multiple processes include the processes being executed by the chamber of the semiconductor device, the multiple tasks include the tasks being participated in by the chamber of the semiconductor device, and the multiple services include other services being executed by the chamber of the semiconductor device and the target service.
[0095] In this embodiment of the invention, after receiving the target service associated with the target monitoring channel sent by the host computer, the semiconductor device needs to first determine whether the semiconductor device is in an idle state. In semiconductor technology, "Idle" usually refers to the state in which the device or system is idle, that is, the state in which no process operation or processing task is performed. When semiconductor manufacturing equipment or production line is not used to perform specific process steps or tasks, they are considered to be in an idle state.
[0096] If the semiconductor device is determined to be in an idle state, it means that the semiconductor device is not being used to perform a specific process step or task. In this case, after receiving the target task sent by the host computer, the semiconductor device can directly execute the target task.
[0097] The priority list can include the process being performed in the semiconductor equipment chamber, the tasks the semiconductor equipment is participating in, other services being performed in the semiconductor equipment chamber, and the priority of the target service. The priority order of the target service can be determined based on the priority list, and then the target service can be executed according to the priority order of the target service.
[0098] It should be noted that the priorities of the semiconductor equipment chambers in the priority list, such as those in the process of manufacturing, those not yet in the process of manufacturing, those performing other services, and the target service, can be set according to the user's needs and are not limited here.
[0099] In one example, the semiconductor device is performing a task. In the priority list, the priority of the target service is higher than that of the currently running task. In this case, it can be determined that the priority order of the target service is higher than that of the currently running task. At this time, the currently running task can be paused first, the target service can be executed first, and the currently running task can be executed after the target service is completed.
[0100] In one embodiment of the present invention, executing the target service according to the priority order of the target service includes: if the semiconductor device is currently executing other services and the priority of other services in the priority list is higher than the priority of the target service, then wait for the other services to finish running before executing the target service; if the semiconductor device is currently executing other services and the priority of the target service in the priority list is higher than the priority of other services, then pause the other services and execute the target service.
[0101] In this embodiment of the invention, when the semiconductor device is executing other services and the priority of other services in the priority list is higher than the priority of the target service, the priority order of the target service can be determined as executing other services first and then executing the target service. In this case, when the semiconductor device receives the target service, it can execute other services first and then execute the target service after waiting for the other services to finish executing.
[0102] When a semiconductor device is performing other services, and the priority of the target service is higher than that of other services in the priority list, this indicates that the target service has a higher priority order than the others. Upon receiving the target service from the host computer, other running services can be paused, and the target service can be executed first. Once the target service is completed, other services can resume execution. This invention allows the target service to be executed according to a user-defined priority order, introducing a priority management mechanism to ensure that services are executed in the correct priority order when multiple tasks are running concurrently, thus improving productivity.
[0103] In one example, the target monitoring channel is chamber a, the target service corresponding to chamber a is temperature regulation service, the semiconductor device is performing other services, and the priority of the target service is higher than the priority of other services. In this case, the other services that the semiconductor device is running can be paused first, and then the temperature regulation service can be executed. After the temperature regulation service is completed, the other services can continue to be executed.
[0104] In one embodiment of the present invention, executing target services according to their priority order includes: if the semiconductor device is executing a process and the priority of the process in the priority list is higher than the priority of the target service, then wait for the process to complete before executing the target service; if the semiconductor device is executing a process and the priority of the target service in the priority list is higher than the priority of the process, then pause the process and execute the target service.
[0105] In this embodiment of the invention, if the semiconductor device is not idle and is executing a process, and the priority of the process being executed in the priority list is higher than the priority of the target service, then after receiving the target service, the currently executing process can continue to be executed, and the target service can be executed after the process is completed.
[0106] If the semiconductor device is not idle and is executing a process, and the priority of the target service in the priority list is higher than the priority of the process, it means that the priority order of the target service is higher than that of the process. After receiving the target service, the semiconductor device will first pause the process, execute the target service, and then execute the process again after the target service is completed.
[0107] In one embodiment of the present invention, executing target services according to their priority order includes: if the semiconductor device is executing a task and the priority of the task in the priority list is higher than the priority of the target service, then wait for the task to finish running before executing the target service; if the semiconductor device is executing a task and the priority of the target service in the priority list is higher than the priority of the task, then pause the task and execute the target service.
[0108] In this embodiment of the invention, if the semiconductor device is not in an idle state but is in the state of executing a task, and the priority of the task being executed in the priority list is higher than the priority of the target service, then after receiving the target service, the task being executed can continue to be executed, and the target service can be executed after the task is completed.
[0109] If the semiconductor device is not idle and is executing a task, and the priority of the target service in the priority list is higher than the priority of the task, it means that the priority order of the target service is higher than that of the task. After receiving the target service, the semiconductor device will first pause the running task, execute the target service, and then execute the task after the target service is completed.
[0110] In one embodiment of the present invention, if the semiconductor device is not idle and the priority list contains Recipe, Task, and Service, and the order is Recipe > Task > Service > Target Service, then Recipe, Task, and Service can be executed sequentially before the Target Service is executed.
[0111] In one embodiment of the present invention, when a target monitoring channel corresponds to multiple target services, the target services are executed, including: determining the execution order of the multiple target services; and executing the multiple target services according to the execution order of the multiple target services.
[0112] In this embodiment of the invention, when a target monitoring channel corresponds to multiple target services, for example, the target services associated with a target monitoring channel are service 1, service 2, and service 3, the execution order of service 1, service 2, and service 3 is to execute service 1 first, then service 2, and finally service 3. That is to say, when the semiconductor device receives service 1, service 2, and service 3 associated with the target monitoring channel, it can first determine the execution order of service 1, service 2, and service 3, and then execute these three target services in the order of service 1, service 2, and service 3.
[0113] In this embodiment of the invention, when a target monitoring channel corresponds to multiple target services, namely service a, service b, and service c, and the execution order of service a takes precedence over service c, and the execution order of service c takes precedence over service b, and the semiconductor device is currently executing other services, and the priority order of the target services is to execute other services first and then the target service, after receiving service a, service b, and service c, the semiconductor device can execute other services first. After the execution of other services is completed, it can be determined that the execution order of service a, service b, and service c is that the execution order of service a takes precedence over service c, the execution order of service c takes precedence over service b, then service a is executed first, then service c is executed, and finally service b is executed.
[0114] Specifically, if the user selects the pressure channel as the target monitoring channel, the pressure channel will be monitored. When the pressure channel meets the trigger condition (i.e., the leak rate > the set value), the correct process for the engineer is to automatically execute the BaseParessure service (Service1) and the LeakRate service (Service2) in the order of execution.
[0115] like Figure 4The diagram illustrates a service execution method according to an embodiment of the present invention. After receiving a target service from a host computer, the semiconductor device first determines the priority of the target service. If the current state of the semiconductor device is idle, the priority can be disregarded and the target service can be executed directly. If there is only one target service, the single target service is executed directly. If there are multiple target services, they are executed in the order of execution of the multiple target services.
[0116] If the priority is 1) Target Service > Process > Task > Other Services, and the semiconductor device is currently executing a process, then the currently executing process can be paused, the target service can be executed first, and the currently executing process can be executed after the target service is completed. If the priority is 2) Process > Task > Other Services > Target Service, and the semiconductor device is currently executing a process, then the currently executing process can be executed first, and the target service can be executed after the currently executing process is completed. If the priority is 3) Process > Target Service > Task > Other Services, then the currently executing process can be executed first, and the target service can be executed after the currently executing process is completed. If the priority is 4) Process > Task > Target Service > Other Services, then the process and task can be executed first, the target service can be executed after they are completed, and the other services can be executed last.
[0117] If the priority is 1) Target Service > Process > Task > Other Services, and the semiconductor device is currently executing a task, the currently executing task can be paused, the target service can be executed first, and the currently executing task can be executed after the target service is completed. If the priority is 2) Process > Task > Other Services > Target Service, and the semiconductor device is currently executing a task, the currently executing task can be executed first, and the target service can be executed after the currently executing task is completed. If the priority is 3) Process > Target Service > Task > Other Services, and the semiconductor device is currently executing a task, the target task can be executed first, and the currently executing task can be executed after the target task is completed. If the priority is 4) Process > Task > Target Service > Other Services, and the semiconductor device is currently executing a task, the task can be executed first, the target service can be executed after the task is completed, and the other services can be executed last.
[0118] If the priority is 1) Target Service > Process > Task > Other Services, and the semiconductor device is currently executing other services, then the currently executing process can be paused, the target service can be executed first, and the other services can be executed after the target service is completed. If the priority is 2) Process > Task > Other Services > Target Service, and the semiconductor device is currently executing other services, then the currently executing other services can be executed first, and the target task can be executed after the currently executing other services are completed. If the priority is 3) Process > Target Service > Task > Other Services, and the semiconductor device is currently executing other services, then the target service can be executed first, and the other services can be executed after the target service is completed. If the priority is 4) Process > Task > Target Service > Other Services, and the semiconductor device is currently executing other services, then the target service can continue to be executed first, and the other services can be executed last after the target service is completed.
[0119] Specifically, the following illustrates a service execution flow according to the present invention:
[0120] 1) The software will monitor the values of the three channels T1, P1, and W1 in real time.
[0121] 2) When the triggering condition of one of the three channels is met, for example, the parameter of machine T1 suddenly rises to 51.
[0122] 3) A service named S1 (Service1+Service2) will be sent to the machine.
[0123] 4) The software will detect whether the current machine is performing other functions.
[0124] 5) If the machine is currently executing a Recipe, service S1 will wait for the Recipe to finish before executing.
[0125] 6) If the machine is executing a Task or Service, the service will pause the current Task or Service, prioritize the execution of S1, and resume the execution of the Task or Service after S1 is completed.
[0126] This invention obtains service configuration information for semiconductor devices. This service configuration information includes a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is distributed to the semiconductor device. This invention can customize monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. This invention can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users.
[0127] It should be noted that, for the sake of simplicity, the method embodiments are all described as a series of actions. However, those skilled in the art should understand that the embodiments of the present invention are not limited to the described order of actions, because according to the embodiments of the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions involved are not necessarily essential to the embodiments of the present invention.
[0128] This invention provides a host computer, including a processor and a memory. The memory stores a computer program, and when the processor executes the computer program, it performs the steps of the service configuration method described above.
[0129] This invention obtains service configuration information for semiconductor devices. This service configuration information includes a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is distributed to the semiconductor device. This invention can customize monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. This invention can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users.
[0130] An embodiment of the present invention provides a semiconductor device, comprising: a processor and a memory, wherein the memory stores a computer program, and when the processor executes the computer program, it performs the steps of the above-described service execution method.
[0131] This invention obtains service configuration information for semiconductor devices. This service configuration information includes a target monitoring channel for transmitting target parameters to be monitored and a target service associated with the target monitoring channel. Based on the target parameters obtained from the target monitoring channel, the target service associated with the target monitoring channel is distributed to the semiconductor device. This invention can customize monitoring channels and service distribution strategies according to actual production needs, improving the flexibility and accuracy of service distribution. This invention can monitor the status of semiconductor devices in real time and distribute appropriate target services based on the target parameters obtained from the target channel, improving the timeliness of service distribution and providing convenience for users.
[0132] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0133] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0134] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0135] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing terminal device to operate in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.
[0136] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal equipment, causing a series of operational steps to be performed on the computer or other programmable terminal equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable terminal equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0137] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.
[0138] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.
[0139] The above provides a detailed description of the service configuration method, service execution method, host computer, and semiconductor device provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.
Claims
1. A service configuration method, characterized by, The method is applied to a host computer, and the method comprises: obtaining service configuration information for a semiconductor device; the service configuration information comprises a target monitoring channel for transmitting a target parameter to be monitored and a target service associated with the target monitoring channel; according to a target parameter obtained from the target monitoring channel, issuing the target service associated with the target monitoring channel to the semiconductor device.
2. The method of claim 1, wherein, The service configuration information further comprises a trigger condition for the target parameter, and the method of issuing the target service associated with the target monitoring channel to the semiconductor device according to the target parameter obtained from the target monitoring channel comprises: when the target parameter obtained from the target monitoring channel meets the trigger condition, issuing the target service associated with the target monitoring channel to the semiconductor device.
3. The method of claim 1, wherein, The method of obtaining service configuration information for a semiconductor device comprises: obtaining a channel list for the semiconductor device, wherein the channel list comprises monitoring channels corresponding to a plurality of parameters; in the channel list, determining a target monitoring channel for transmitting a target parameter to be monitored selected by a user.
4. The method of claim 1, wherein, The method of obtaining service configuration information for a semiconductor device comprises: obtaining a service list for the semiconductor device, wherein the service list comprises a plurality of services; in the service list, determining a target service selected by a user; associating the target service with the target monitoring channel to obtain a target service associated with the target monitoring channel.
5. A service execution method characterized by, The method is applied to a semiconductor device, and the method comprises: transmitting a target parameter to be monitored to a host computer through a target monitoring channel; receiving a target service associated with the target monitoring channel sent by the host computer and executing the target service.
6. The method of claim 5, wherein, The method of executing the target service comprises: determining whether the semiconductor device is in an idle state; if the semiconductor device is in the idle state, executing the target service; if the semiconductor device is not in the idle state, obtaining a priority list, wherein the priority list comprises priorities of a plurality of services, a plurality of processes and a plurality of tasks, determining a priority order of the target service according to the priority list, and executing the target service according to the priority order of the target service; the plurality of processes comprise a process being executed by a chamber of the semiconductor device, the plurality of tasks comprise a task being participated by the chamber of the semiconductor device, and the plurality of services comprise other services being executed by the chamber of the semiconductor device and the target service.
7. The method of claim 6, wherein, The method of executing the target service according to the priority order of the target service comprises: if the semiconductor device is executing other services and the priority of the other services in the priority list is higher than the priority of the target service, waiting for the other services to be executed and then executing the target service; if the semiconductor device is executing other services and the priority of the target service in the priority list is higher than the priority of the other services, pausing the other services and executing the target service.
8. The method of claim 6, wherein, The method of executing the target service according to the priority order of the target service comprises: if the semiconductor device is executing a process and the priority of the target service is higher than the priority of the process in the priority list, then waiting for the process to run to completion before executing the target service; if the semiconductor device is executing a process and the priority of the target service is higher than the priority of the process in the priority list, then suspending the process and executing the target service.
9. The method of claim 6, wherein, the executing of the target service according to the priority order of the target service comprises: if the semiconductor device is executing a task and the priority of the target service is higher than the priority of the task in the priority list, then waiting for the task to run to completion before executing the target service; if the semiconductor device is executing a task and the priority of the target service is higher than the priority of the task in the priority list, then suspending the task and executing the target service.
10. The method of claim 5, wherein, when one of the target monitoring channels corresponds to multiple target services, the executing of the target service comprises: determining an execution order of the multiple target services; executing the multiple target services according to the execution order of the multiple target services.
11. A host computer, characterized by comprising: a processor and a memory, the memory storing a computer program, the processor executing the computer program to perform the steps of the service configuration method of any one of claims 1-4.
12. A semiconductor device, characterized by comprising: comprising: a processor and a memory, the memory storing a computer program, the processor executing the computer program to perform the steps of the service execution method of any one of claims 5-10.