Intelligent monitoring system for high-voltage power transmission

Abstract

The invention discloses an intelligent monitoring system for high-voltage power transmission, and the system comprises a main control module, a DC conversion circuit, a display circuit, a control circuit, an inversion control circuit, an inversion drive circuit, a detection circuit, an LED drive circuit, and a communication circuit. The display circuit can feed back working information of the system, the control circuit comprises a power supply control circuit and a numerical control voltage circuit, the inversion control circuit can control on-off conditions of an MOS tube through PWM signal waves, the inversion driving circuit can perform signal driving of the system, and the detection circuit can detect current, voltage and frequency information. The LED driving circuit can control the working state of the LED lamp, the communication circuit can carry out high-speed data transmission with peripheral electronic equipment, electric quantity information during high-voltage power transmission can be intelligently monitored, position and data information can be fed back, and the intelligent high-voltage power transmission system has important significance on high-voltage circuit protection.

Description

Technical Field

[0001] This invention relates to the field of high-voltage power transmission monitoring, specifically to an intelligent monitoring system for high-voltage power transmission. Background Technology

[0002] In power transmission, high-voltage power transmission is often used. According to the principle of constant power transformation, when the voltage increases, the current will decrease accordingly. At this time, the loss generated during high-voltage power transmission will be reduced. However, high-voltage electricity poses a great threat to people. Every year, there are frequent incidents of people being seriously injured or even killed due to high-voltage accidents. For something as invisible and intangible as high-voltage electricity, it is difficult for people to take measures to avoid electric shock. Summary of the Invention

[0003] This invention addresses the shortcomings of existing high-voltage power transmission monitoring systems by providing an intelligent monitoring system for high-voltage power transmission that can detect current, voltage, and frequency information during power transmission and issue timely alarms.

[0004] The technical solution adopted by this invention to solve its technical problem is:

[0005] A high-voltage power transmission intelligent monitoring system is provided, comprising: a main control module, a DC conversion circuit, a display circuit, a control circuit, an inverter control circuit, an inverter drive circuit, a detection circuit, an LED drive circuit, and a communication circuit. The DC conversion circuit provides a stable power supply voltage for the entire monitoring system. The display circuit can provide feedback on the system's operating information. The control circuit includes a power control circuit and a digitally controlled voltage circuit. The inverter control circuit can control the on / off state of MOSFETs using PWM signal waves. The inverter drive circuit can drive the system's signals. The detection circuit can detect current, voltage, and frequency information. The LED drive circuit can control the operating state of LEDs. The communication circuit can perform high-speed data transmission with peripheral electronic devices.

[0006] Furthermore, the main control module includes a chip U1 and an interface H1. Pins 5 and 3 of the chip U1 are grounded via capacitors C12 and C13, respectively. A crystal oscillator Y1 is located between pins 5 and 3 of the chip U1. The first lead of pin 7 of the chip U1 is connected to the power supply via capacitor C11, and the second lead is grounded via resistor R14. A switch K1 is located at both ends of capacitor C11. Pins 2, 3, and 4 of the interface H1 are connected to pins 34, 37, and 7 of the chip U1, respectively. The model of the chip U1 is STM32L151C8T6.

[0007] Furthermore, the DC conversion circuit includes chips U2 and U3, interfaces H2-H6, and interfaces J1-J3. Pin 1 of chip U2 is connected to pin 2 of interface H2 via inductor L3; pin 3 is connected to pin 2 of interface H4 via inductor L5; pin 7 is connected to pin 1 of interface H5 via inductor L4 and diode D15; pin 2 is connected to pin 1 of interface J3; and pin 2 of interface J3 is connected to pin 2 of interface H3. Chip U2... Pin 10 is connected to pin 2 of interface J2, pin 9 is connected to the source of MOSFET Q8, the drain of MOSFET Q8 is grounded, the gate is connected to pin 7 of chip U3, pin 8 of chip U3 is connected to the power supply via diode VD1, pin 6 is connected to the power supply via capacitor C27, pin 1 is connected to the power supply, and capacitor C28 is placed between the power supply and ground. The model of chip U2 is PMU, and the model of chip U3 is IR2104SPBF.

[0008] Furthermore, the display circuit includes a chip U4, with pins 2 and 15 of the chip U4 connected to the power supply, pin 3 grounded via an adjustable resistor RP2, and pins 14-4 connected to pins 28-25, 22, 21, 46, 45, 10, 11, and 14 of the chip U1, respectively. The model of the chip U4 is LCD1602.

[0009] Furthermore, the power control circuit includes MOSFETs Q3 and Q2. The drains of MOSFETs Q3 and Q2 are connected to the power supply via inductors L1 and L2, respectively. The gates of MOSFETs Q3 and Q2 are connected to pins 1 and 2 of limit switch SW3 via resistors R1 and R5, respectively. The sources are grounded. Diodes D4 and D2, and resistors R4 and R6 are positioned between the gates of the MOSFETs and ground. Diodes D1 and D3 are positioned between the power supply, the gate of the MOSFETs, and the limit switch SW3. The numerical control voltage circuit includes chips U5 and U6, and interfaces H7 and H8. The first and second leads of pin 3 of chip U5 are connected to pins 2 and 1 of interface H7 via diodes D6 and D7, respectively. The third and fourth leads are grounded via capacitors C1 and C6, respectively. The first lead is connected to pin 3 of chip U5 via diodes D8 and D5. The second lead is grounded via capacitor C8. The first lead of pin 2 of chip U5 is connected to pin 7 of chip U6 via resistor R2. The second lead is connected to the source of MOSFET Q1. The drain of MOSFET Q1 is connected to pin 2 of interface H8. The gate is connected to the collector of transistor Q4 via resistor R9. The emitter of transistor Q4 is grounded. The base is connected to pin 39 of chip U1 via resistor R10. Pin 8 of chip U6 is connected to the power supply. Pin 6 is connected to pins 1 and 2 of interface H7 via diodes D9 and D10 respectively. The model of chip U5 is LM317, and the model of chip U6 is MCP4161-502 / SN.

[0010] Furthermore, the inverter control circuit includes chips U7-U9. The first lead of pin 1 of chip U7 is connected to the power supply, and the second lead is grounded through capacitor C61. Pin 8 of chip U7 is connected to the power supply through diode D18. Pin 5 is connected to the base of transistors Q15 and Q16. Pin 7 is connected to the base of transistors Q10 and Q11. Pin 2 is connected to pin 18 of chip U1. Pin 6 is connected to the collector of transistor Q11. The emitter of transistor Q10 is connected to the emitter of transistor Q11. Capacitor C59 is placed between the collector of transistor Q10 and the collector of transistor Q11. The wiring method of chips U8 and U9 is the same as that of chip U7, and will not be described in detail here. The model of chips U7-U9 is IR2109S.

[0011] Furthermore, the inverter drive circuit includes MOSFETs Q12-14 and Q17-19, interfaces H9 and H10. The sources of MOSFETs Q13-15 are connected to the power supply via capacitors C59, C70, and C77, respectively. The sources of MOSFETs Q17-19 are connected to the power supply via capacitors C60, C73, and C80, respectively. Pins 1, 2, and 3 of interface H9 are connected to pins 6 of chips U7, U8, and U9 via inductors L11, L12, and L13, respectively. The drains of MOSFETs Q12-14 and Q17-19 are connected to the power supply, and their sources are grounded. Capacitors C63-69 are positioned between the power supply and ground.

[0012] Furthermore, the detection circuit includes a voltage detection circuit, a current detection circuit, a frequency detection circuit, and a safety detection circuit. The voltage detection circuit includes a chip U10. The first lead of pin 2 of chip U10 is grounded through resistor RB2, and the second lead is connected to pin 6 of chip U10 through resistor RB1. Pin 7 of chip U10 is connected to the power supply, pin 6 is connected to pin 42 of chip U10, and pin 3 is grounded through resistor RB3. The model of chip U10 is OP07CSZ. The current detection circuit includes a chip U11 and an interface J4. The transistor of chip U11... Pins 1 and 2 are connected to pin 1 of interface J4, pins 3 and 4 are connected to pin 2 of interface J4, pin 6 is grounded via capacitor C26, pin 7 is connected to pin 15 of chip U1, the first lead of pin 8 is connected to the power supply, and the second lead is grounded via capacitor C25. The model of chip U11 is ACS712ELCTR-20A-T. The frequency detection circuit includes chips U12, U13, and interface H11. Pin 4 of chip U12 is connected to pin 2 of interface H11 via resistor R60, pin 3 is connected to pin 1 of chip U12 via a 10K resistor, and pin 1 is connected to a resistor... R61 and R63 are connected to pin 4 of chip U13. Pin 4 of chip U13 is connected to pin 1 of chip U13 via capacitor C39. Pin 3 is grounded. Pin 1 is connected to pin 16 of chip U1. Chips U12 and U13 are both model AD8519AKSZ-REEL7. The security detection circuit includes chips U14 and U15, and interfaces J5 and J6. Pin 1 of chip U14 is connected to the gate of MOSFET Q6 via resistor R46. Pin 2 is connected to the source of MOSFET Q7 via resistor R52. The first lead of pin 5 is connected to resistor ZD2 and... Capacitor C24 is grounded. The second lead is connected to pin 1 of chip U15 via resistor R51 and diode D13. Pin 1 of chip U15 is connected to pin 1 of interface J5. The first lead of pin 4 is connected to the source of MOSFET Q7 via resistor R44, and the second lead is connected to the drain of transistor Q6 via resistor R45. The first lead of pin 8 of chip U15 is connected to the gate of MOSFET Q7 via diode ZD1 and resistor R50, and the second lead is connected to pin 2 of interface J6. The model of chip U14 is DW01A-G, and the model of chip U15 is AO4407.

[0013] Furthermore, the LED driving circuit includes a chip U16. Pin 1 of the chip U16 is connected to the source of the MOSFET Q8, pin 4 is connected to pin 1 of the interface H12, pin 6 is connected to pin 32 of the chip U1 via resistor R69, pin 7 is connected to the drain of the MOSFET Q9 via resistor R67 and diode D16, the drain of the MOSFET Q9 is connected to the power supply via inductor L6, capacitor C42 is placed between the power supply and ground, and pin 8 of the chip U16 is connected to the gate of the MOSFET Q9. The chip U16 is model MT7285.

[0014] Furthermore, the communication circuit includes chips U17 and U18, interfaces J7 and J8. Pin 8 of chip U17 is connected to the power supply. The first lead of pin 6 is connected to the power supply via resistor R39, and the second lead is connected to pin 1 of interface J7 via resistor R42. Pin 7 of chip U17 is connected to pin 2 of interface J7 via resistor R40. Pins 1, 2, and 4 are connected to pins 30, 29, and 31 of chip U17. Chip U17 is model MAX3082, and chip U18... Pins 1 and 4 are connected to pins 3 and 5 of chip U18 via capacitors C19 and C21, respectively. Pin 6 is grounded via capacitor C22. Pin 2 is connected to the power supply via capacitor C18. Pin 16 is connected to the power supply. Pin 15 is grounded. Capacitor C20 is placed between the power supply and ground. Pins 13 and 14 of chip U18 are connected to pins 2 and 3 of interface J8, respectively. Pins 12 and 11 are connected to pins 12 and 13 of chip U1, respectively. The model of chip U18 is SP232EEN-L / TR.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. It has multiple detection circuits, which can complete the detection of various indicators according to different external environments. For example, the frequency detection circuit can detect frequency changes, the voltage detection circuit can perform voltage tracking, and the current detection circuit can detect the magnitude of the circuit's operating current.

[0017] 2. Equipped with 485 communication circuits, the system can transmit signals via wired means and can be networked through 485 communication modules for real-time monitoring of high-voltage power transmission and distribution systems;

[0018] 3. It has a complete circuit system, which can perform circuit testing, ZVS high voltage switching circuit and other functions. At the same time, the DC-DC power supply provides a stable power source for the system, which can ensure the long-term stable operation of the system.

[0019] 4. Equipped with multiple sensors to ensure system operation, the LCD display circuit can show the system's working status in real time. In case of system failure, an alarm can be triggered via the 485 module circuit. The LED driver circuit can provide light energy when there is insufficient light.

[0020] 5. It has a voltage output short-circuit protection circuit, which can protect the output voltage circuit. The inverter circuit can convert DC to AC for long-distance transmission. Attached Figure Description

[0021] Appendix Figure 1 This is a schematic diagram of the principle structure of the main control module of the present invention;

[0022] Appendix Figure 2 This is a schematic diagram of the DC conversion circuit of the present invention.

[0023] Appendix Figure 3 This is a schematic diagram of the display circuit of the present invention.

[0024] Appendix Figure 4 , 5 This is a schematic diagram of the control circuit of the present invention.

[0025] Appendix Figure 6 This is a schematic diagram of the inverter control circuit of the present invention.

[0026] Appendix Figure 7 This is a schematic diagram of the principle structure of the inverter drive circuit of the present invention;

[0027] Appendix Figure 8 , 9 10 and 11 are schematic diagrams of the principle structure of the detection circuit of the present invention;

[0028] Appendix Figure 12 This is a schematic diagram of the LED driving circuit of the present invention.

[0029] Appendix Figure 13 , 14 This is a schematic diagram of the principle structure of the communication circuit of the present invention. Detailed Implementation

[0030] To facilitate understanding of the present invention, the present invention will be described in more detail below with reference to the accompanying drawings and specific embodiments. The accompanying drawings show preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. Rather, these embodiments are provided so that the disclosure of the present invention will be more thorough and complete.

[0031] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention.

[0032] The present invention will now be described in detail with reference to the accompanying drawings.

[0033] Example 1: A high-voltage power transmission intelligent monitoring system includes: a main control module, a DC conversion circuit, a display circuit, a control circuit, an inverter control circuit, an inverter drive circuit, a detection circuit, an LED drive circuit, and a communication circuit. The DC conversion circuit provides a stable power supply voltage for the entire monitoring system. The display circuit can provide feedback on the system's operating information. The control circuit includes a power control circuit and a digitally controlled voltage circuit. The inverter control circuit can control the on / off state of the MOSFET using a PWM signal wave. The inverter drive circuit can drive the system's signals. The detection circuit can detect current, voltage, and frequency information. The LED drive circuit can control the operating state of the LED lights. The communication circuit can perform high-speed data transmission with peripheral electronic devices.

[0034] Example 2, as Figure 1 As shown, the main control module includes a chip U1 and an interface H1. Pins 5 and 3 of the chip U1 are grounded via capacitors C12 and C13, respectively. A crystal oscillator Y1 is located between pins 5 and 3 of the chip U1. The first lead of pin 7 of the chip U1 is connected to the power supply via capacitor C11, and the second lead is grounded via resistor R14. A switch K1 is located at both ends of capacitor C11. Pins 2, 3, and 4 of the interface H1 are connected to pins 34, 37, and 7 of the chip U1, respectively. The model of the chip U1 is STM32L151C8T6.

[0035] In this embodiment, the main control chip is an STM32L151C8T6 chip, which controls the operation of peripheral devices through GPIO ports. The crystal oscillator can be an active or passive device. The main control module communicates with the host computer through a serial port.

[0036] Example 3, as Figure 2 As shown, the DC conversion circuit includes chips U2 and U3, interfaces H2-H6, and interfaces J1-J3. Pin 1 of chip U2 is connected to pin 2 of interface H2 via inductor L3; pin 3 is connected to pin 2 of interface H4 via inductor L5; pin 7 is connected to pin 1 of interface H5 via inductor L4 and diode D15; pin 2 is connected to pin 1 of interface J3; pin 2 of interface J3 is connected to pin 2 of interface H3; pin 10 of chip U2 is connected to pin 2 of interface J2; pin 9 is connected to the source of MOSFET Q8; the drain of MOSFET Q8 is grounded; and the gate is connected to pin 7 of chip U3. Pin 8 of chip U3 is connected to the power supply via diode VD1; pin 6 is connected to the power supply via capacitor C27; pin 1 is connected to the power supply; and capacitor C28 is placed between the power supply and ground. The model of chip U2 is PMU, and the model of chip U3 is IR2104SPBF.

[0037] In this embodiment, a DC converter circuit is used to power the system. On the one hand, it can provide the necessary power for the system to work, and on the other hand, the voltage can be adjusted at any time, which is safer. Using a DC power supply can ensure the continuous operation of the monitoring system during power transmission.

[0038] Example 4, as Figure 3 As shown, the display circuit includes a chip U4. Pins 2 and 15 of the chip U4 are connected to the power supply, pin 3 is grounded through an adjustable resistor RP2, and pins 14-4 are connected to pins 28-25, 22, 21, 46, 45, 10, 11, and 14 of the chip U1, respectively. The model of the chip U4 is LCD1602.

[0039] In this embodiment, the display circuit displays real-time system information through the LCD1602, which can promptly display information such as power consumption, frequency, and transmission losses. It can quantify and provide feedback on various information while displaying the working status of the monitoring system.

[0040] Example 5, as Figure 4 , 5 As shown, the power control circuit includes MOSFETs Q3 and Q2. The drains of MOSFETs Q3 and Q2 are connected to the power supply via inductors L1 and L2, respectively. The gates are connected to pins 1 and 2 of limit switch SW3 via resistors R1 and R5, respectively. The sources are grounded. Diodes D4 and D2, and resistors R4 and R6 are positioned between the gates of the MOSFETs and ground. Diodes D1 and D3 are positioned between the power supply, the gate of the MOSFETs, and the limit switch SW3. The digital control voltage circuit includes chips U5 and U6, and interfaces H7 and H8. The first and second leads of pin 3 of chip U5 are connected to pins 2 and 1 of interface H7 via diodes D6 and D7, respectively. The third and fourth leads are grounded via capacitors C1 and C6, respectively. The source of pin 1 of chip U5... The first lead is connected to pin 3 of chip U5 via diodes D8 and D5. The second lead is grounded via capacitor C8. The first lead of pin 2 of chip U5 is connected to pin 7 of chip U6 via resistor R2. The second lead is connected to the source of MOSFET Q1. The drain of MOSFET Q1 is connected to pin 2 of interface H8. The gate is connected to the collector of transistor Q4 via resistor R9. The emitter of transistor Q4 is grounded. The base is connected to pin 39 of chip U1 via resistor R10. Pin 8 of chip U6 is connected to the power supply. Pin 6 is connected to pins 1 and 2 of interface H7 via diodes D9 and D10 respectively. The model of chip U5 is LM317, and the model of chip U6 is MCP4161-502 / SN.

[0041] In this embodiment, the power control circuit outputs a control signal through the PB4 port, which can control the set value during high voltage transmission. At the same time, the set value of voltage transmission can also be manually adjusted. The digital voltage control circuit can precisely control the output voltage value by controlling the resistance value of the potentiometer, and at the same time, it uses a MOSFET to control the on and off state, so as to control the voltage signal within a controllable range to the maximum extent.

[0042] Example 6, as Figure 6 As shown, the inverter control circuit includes chips U7-U9. The first lead of pin 1 of chip U7 is connected to the power supply, and the second lead is grounded through capacitor C61. Pin 8 of chip U7 is connected to the power supply through diode D18. Pin 5 is connected to the base of transistors Q15 and Q16. Pin 7 is connected to the base of transistors Q10 and Q11. Pin 2 is connected to pin 18 of chip U1. Pin 6 is connected to the collector of transistor Q11. The emitter of transistor Q10 is connected to the emitter of transistor Q11. Capacitor C59 is placed between the collector of transistor Q10 and the collector of transistor Q11. The wiring method of chips U8 and U9 is the same as that of chip U7, and will not be described in detail here. The model of chips U7-U9 is IR2109S.

[0043] In this embodiment, the inverter control circuit consists of three PWM signals, which can control the three IR2109S through the output PWM waves, thereby controlling the on / off state of the MOSFETs.

[0044] Example 7, as Figure 7 As shown, the inverter drive circuit includes MOSFETs Q12-14 and Q17-19, interfaces H9 and H10. The sources of MOSFETs Q13-15 are connected to the power supply via capacitors C59, C70, and C77, respectively. The sources of MOSFETs Q17-19 are connected to the power supply via capacitors C60, C73, and C80, respectively. Pins 1, 2, and 3 of interface H9 are connected to pins 6 of chips U7, U8, and U9 via inductors L11, L12, and L13, respectively. The drains of MOSFETs Q12-14 and Q17-19 are connected to the power supply, and their sources are grounded. Capacitors C63-69 are placed between the power supply and ground.

[0045] In this embodiment, the inverter drive circuit consists of three MOS circuits, which can transmit control signals to the main control module and work together with the inverter control circuit to regulate voltage transmission.

[0046] Example 8, as Figure 8 , 9As shown in Figures 10 and 11, the detection circuit includes a voltage detection circuit, a current detection circuit, a frequency detection circuit, and a safety detection circuit. The voltage detection circuit includes a chip U10. The first lead of pin 2 of chip U10 is grounded through resistor RB2, and the second lead is connected to pin 6 of chip U10 through resistor RB1. Pin 7 of chip U10 is connected to the power supply, and pin 6 is connected to pin 42 of chip U1. Pin 3 is grounded through resistor RB3. The model of chip U10 is OP07CSZ. The current detection circuit includes a chip U11 and an interface J4. Pins 1 and 2 of chip U1 are connected to pin 1 of interface J4, pins 3 and 4 are connected to pin 2 of interface J4, pin 6 is grounded via capacitor C26, pin 7 is connected to pin 15 of chip U1, the first lead of pin 8 is connected to the power supply, and the second lead is grounded via capacitor C25. The model of chip U11 is ACS712ELCTR-20A-T. The frequency detection circuit includes chips U12, U13, and interface H11. Pin 4 of chip U12 is connected to pin 2 of interface H11 via resistor R60, pin 3 is connected to pin 1 of chip U12 via a 10K resistor, and pin 1 is connected to... Resistors R61 and R63 are connected to pin 4 of chip U13. Pin 4 of chip U13 is connected to pin 1 of chip U13 via capacitor C39. Pin 3 is grounded. Pin 1 is connected to pin 16 of chip U1. Chips U12 and U13 are both model AD8519AKSZ-REEL7. The security detection circuit includes chips U14 and U15, and interfaces J5 and J6. Pin 1 of chip U14 is connected to the gate of MOSFET Q6 via resistor R46. Pin 2 is connected to the source of MOSFET Q7 via resistor R52. The first lead of pin 5 is connected to resistor ZD2. Capacitor C24 is grounded. The second lead is connected to pin 1 of chip U15 via resistor R51 and diode D13. Pin 1 of chip U15 is connected to pin 1 of interface J5. The first lead of pin 4 is connected to the source of MOSFET Q7 via resistor R44, and the second lead is connected to the drain of transistor Q6 via resistor R45. The first lead of pin 8 of chip U15 is connected to the gate of MOSFET Q7 via diode ZD1 and resistor R50, and the second lead is connected to pin 2 of interface J6. The model of chip U14 is DW01A-G, and the model of chip U15 is AO4407.

[0047] In this embodiment, the frequency measurement circuit can effectively measure frequency changes, the safety detection circuit controls the MOSFET through the DW01A-G chip to effectively control voltage output short circuits, the voltage detection circuit transmits voltage information to the main control module for processing through the OP07CSZ and its peripheral circuits, and displays the currently detected voltage value on the display screen, and the current detection circuit is composed of the ACS712ELCTR-20A-T chip and its peripheral circuits, which can acquire 0-20A current signals.

[0048] Example 9, as Figure 12 As shown, the LED driving circuit includes a chip U16. Pin 1 of the chip U16 is connected to the source of the MOSFET Q8, pin 4 is connected to pin 1 of the interface H12, pin 6 is connected to pin 32 of the chip U1 via resistor R69, pin 7 is connected to the drain of the MOSFET Q9 via resistor R67 and diode D16, the drain of the MOSFET Q9 is connected to the power supply via inductor L6, capacitor C42 is placed between the power supply and ground, and pin 8 of the chip U16 is connected to the gate of the MOSFET Q9. The chip U16 is model MT7285.

[0049] In this embodiment, the LED driving circuit consists of an MT7285 power driver chip and its peripheral circuits. When the LED driving circuit receives control information sent from the main control module through port PA11, it can drive the LED to adjust its brightness.

[0050] Example 10, as Figure 13 , 14 As shown, the communication circuit includes chips U17 and U18, interfaces J7 and J8. Pin 8 of chip U17 is connected to the power supply. The first lead of pin 6 is connected to the power supply via resistor R39, and the second lead is connected to pin 1 of interface J7 via resistor R42. Pin 7 of chip U17 is connected to pin 2 of interface J7 via resistor R40. Pins 1, 2, and 4 are connected to pins 30, 29, and 31 of chip U17. Chip U17 is model MAX3082. The transistor of chip U18... Pins 1 and 4 are connected to pins 3 and 5 of chip U18 via capacitors C19 and C21, respectively. Pin 6 is grounded via capacitor C22. Pin 2 is connected to the power supply via capacitor C18. Pin 16 is connected to the power supply. Pin 15 is grounded. Capacitor C20 is placed between the power supply and ground. Pins 13 and 14 of chip U18 are connected to pins 2 and 3 of interface J8, respectively. Pins 12 and 11 are connected to pins 12 and 13 of chip U1, respectively. The model of chip U18 is SP232EEN-L / TR.

[0051] In this embodiment, the serial port circuit enables the system to connect to the computer, and the serial port debugging assistant can effectively collect real-time system information. The 485 communication circuit uses three GPIO ports to achieve high-speed data communication with peripheral electronic devices.

[0052] The working principle of this invention is as follows: The controller circuit consists of a main control module and its peripheral circuits. It realizes the input and output functions of system signals through external circuits. The current detection circuit, voltage detection circuit, safety detection circuit, and frequency measurement circuit can detect the power transmission status in a timely manner. When the data is abnormal, it can perform short circuit handling to reduce the risk of high voltage leakage. The LED driver circuit can display the system's working status information and provide lighting supplement during power maintenance in low light conditions. The inverter drive and control circuit provides signal support for short circuit emergency handling. All data detected by the system can be transmitted to peripheral electronic devices through the communication circuit.

[0053] It should be noted that the above-mentioned technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this invention specification; and, for those skilled in the art, improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An intelligent monitoring system for high-voltage power transmission, characterized in that, include: The system includes a main control module, a DC conversion circuit, a display circuit, a control circuit, an inverter control circuit, an inverter drive circuit, a detection circuit, an LED drive circuit, and a communication circuit. The DC conversion circuit provides a stable power supply voltage for the entire monitoring system. The display circuit can provide feedback on the system's operating information. The control circuit includes a power control circuit and a digitally controlled voltage circuit. The inverter control circuit can control the on / off state of the MOSFETs using PWM signal waves. The inverter drive circuit can drive the system's signals. The detection circuit can detect current, voltage, and frequency information. The LED drive circuit can control the operating state of the LEDs. The communication circuit can perform high-speed data transmission with peripheral electronic devices.

2. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The main control module includes a chip U1 and an interface H1. Pins 5 and 3 of the chip U1 are grounded via capacitors C12 and C13, respectively. A crystal oscillator Y1 is located between pins 5 and 3 of the chip U1. The first lead of pin 7 of the chip U1 is connected to the power supply via capacitor C11, and the second lead is grounded via resistor R14. A switch K1 is located at both ends of capacitor C11. Pins 2, 3, and 4 of the interface H1 are connected to pins 34, 37, and 7 of the chip U1, respectively. The model of the chip U1 is STM32L151C8T6.

3. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The DC conversion circuit includes chips U2 and U3, interfaces H2-H6, and interfaces J1-J3. Pin 1 of chip U2 is connected to pin 2 of interface H2 via inductor L3; pin 3 is connected to pin 2 of interface H4 via inductor L5; pin 7 is connected to pin 1 of interface H5 via inductor L4 and diode D15; pin 2 is connected to pin 1 of interface J3; pin 2 of interface J3 is connected to pin 2 of interface H3; pin 10 of chip U2 is connected to pin 2 of interface J2; pin 9 is connected to the source of MOSFET Q8; the drain of MOSFET Q8 is grounded; and the gate is connected to pin 7 of chip U3. Pin 8 of chip U3 is connected to the power supply via diode VD1; pin 6 is connected to the power supply via capacitor C27; pin 1 is connected to the power supply; and capacitor C28 is placed between the power supply and ground. Chip U2 is a PMU, and chip U3 is an IR2104SPBF.

4. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The display circuit includes a chip U4. Pins 2 and 15 of the chip U4 are connected to the power supply, pin 3 is grounded through an adjustable resistor RP2, and pins 14-4 are connected to pins 28-25, 22, 21, 46, 45, 10, 11, and 14 of the chip U1, respectively. The model of the chip U4 is LCD1602.

5. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The power control circuit includes MOSFETs Q3 and Q2. The drains of MOSFETs Q3 and Q2 are connected to the power supply via inductors L1 and L2, respectively. The gates of MOSFETs Q3 and Q2 are connected to pins 1 and 2 of limit switch SW3 via resistors R1 and R5, respectively. The sources are grounded. Diodes D4 and D2, and resistors R4 and R6 are placed between the gates of the MOSFETs and ground. Diodes D1 and D3 are placed between the power supply, the gate of the MOSFETs, and the limit switch SW3. The digital control voltage circuit includes chips U5 and U6, and interfaces H7 and H8. The first and second leads of pin 3 of chip U5 are connected to pins 2 and 1 of interface H7 via diodes D6 and D7, respectively. The third and fourth leads are grounded via capacitors C1 and C6, respectively. The first lead of pin 1 of chip U5 is connected to ground. The first lead of chip U5 is connected to pin 3 of chip U5 via diodes D8 and D5. The second lead is grounded via capacitor C8. The first lead of pin 2 of chip U5 is connected to pin 7 of chip U6 via resistor R2. The second lead is connected to the source of MOSFET Q1. The drain of MOSFET Q1 is connected to pin 2 of interface H8. The gate is connected to the collector of transistor Q4 via resistor R9. The emitter of transistor Q4 is grounded. The base is connected to pin 39 of chip U1 via resistor R10. Pin 8 of chip U6 is connected to the power supply. Pin 6 is connected to pins 1 and 2 of interface H7 via diodes D9 and D10 respectively. The model of chip U5 is LM317, and the model of chip U6 is MCP4161-502 / SN.

6. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The inverter control circuit includes chips U7-U9. The first lead of pin 1 of chip U7 is connected to the power supply, and the second lead is grounded through capacitor C61. Pin 8 of chip U7 is connected to the power supply through diode D18. Pin 5 is connected to the base of transistors Q15 and Q16. Pin 7 is connected to the base of transistors Q10 and Q11. Pin 2 is connected to pin 18 of chip U1. Pin 6 is connected to the collector of transistor Q11. The emitter of transistor Q10 is connected to the emitter of transistor Q11. Capacitor C59 is placed between the collector of transistor Q10 and the collector of transistor Q11. The wiring method of chips U8 and U9 is the same as that of chip U7, and will not be described in detail here. The model of chips U7-U9 is IR2109S.

7. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The inverter drive circuit includes MOSFETs Q12-14 and Q17-19, and interfaces H9 and H10. The sources of MOSFETs Q13-15 are connected to the power supply via capacitors C59, C70, and C77, respectively. The sources of MOSFETs Q17-19 are connected to the power supply via capacitors C60, C73, and C80, respectively. Pins 1, 2, and 3 of interface H9 are connected to pins 6 of chips U7, U8, and U9 via inductors L11, L12, and L13, respectively. The drains of MOSFETs Q12-14 and Q17-19 are connected to the power supply, and their sources are grounded. Capacitors C63-69 are placed between the power supply and ground.

8. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The detection circuit includes a voltage detection circuit, a current detection circuit, a frequency detection circuit, and a safety detection circuit. The voltage detection circuit includes a chip U10. The first lead of pin 2 of chip U10 is grounded via resistor RB2, and the second lead is connected to pin 6 of chip U10 via resistor RB1. Pin 7 of chip U10 is connected to the power supply, and pin 6 is connected to pin 42 of chip U10. Pin 3 is grounded via resistor RB3. The model of chip U10 is OP07CSZ. The current detection circuit includes a chip U11 and an interface J4. Pins 1 and 2 of chip U11... Pin 1 of interface J4 is connected to pin 2 of interface J4. Pin 6 is grounded via capacitor C26. Pin 7 is connected to pin 15 of chip U1. The first lead of pin 8 is connected to the power supply, and the second lead is grounded via capacitor C25. The model of chip U11 is ACS712ELCTR-20A-T. The frequency detection circuit includes chips U12 and U13, and interface H11. Pin 4 of chip U12 is connected to pin 2 of interface H11 via resistor R60. Pin 3 is connected to pin 1 of chip U12 via a 10K resistor. Pin 1 is connected to pin 2 via resistor R61. R63 is connected to pin 4 of chip U13. Pin 4 of chip U13 is connected to pin 1 of chip U13 via capacitor C39. Pin 3 is grounded. Pin 1 is connected to pin 16 of chip U1. Chips U12 and U13 are both model AD8519AKSZ-REEL7. The security detection circuit includes chips U14 and U15, and interfaces J5 and J6. Pin 1 of chip U14 is connected to the gate of MOSFET Q6 via resistor R46. Pin 2 is connected to the source of MOSFET Q7 via resistor R52. The first lead of pin 5 is connected to resistor ZD2 and capacitor C... 24 is grounded. The second lead is connected to pin 1 of chip U15 via resistor R51 and diode D13. Pin 1 of chip U15 is connected to pin 1 of interface J5. The first lead of pin 4 is connected to the source of MOSFET Q7 via resistor R44. The second lead is connected to the drain of transistor Q6 via resistor R45. The first lead of pin 8 of chip U15 is connected to the gate of MOSFET Q7 via diode ZD1 and resistor R50. The second lead is connected to pin 2 of interface J6. The model of chip U14 is DW01A-G. The model of chip U15 is AO4407.

9. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The LED driving circuit includes a chip U16. Pin 1 of the chip U16 is connected to the source of the MOSFET Q8, pin 4 is connected to pin 1 of the interface H12, pin 6 is connected to pin 32 of the chip U1 via resistor R69, pin 7 is connected to the drain of the MOSFET Q9 via resistor R67 and diode D16, the drain of the MOSFET Q9 is connected to the power supply via inductor L6, capacitor C42 is placed between the power supply and ground, and pin 8 of the chip U16 is connected to the gate of the MOSFET Q9. The chip U16 is model MT7285.

10. The intelligent monitoring system for high-voltage power transmission according to claim 1, characterized in that, The communication circuit includes chips U17 and U18, interfaces J7 and J8. Pin 8 of chip U17 is connected to the power supply. The first lead of pin 6 is connected to the power supply via resistor R39, and the second lead is connected to pin 1 of interface J7 via resistor R42. Pin 7 of chip U17 is connected to pin 2 of interface J7 via resistor R40. Pins 1, 2, and 4 are connected to pins 30, 29, and 31 of chip U17. Chip U17 is model MAX3082. The pins of chip U18... Pins 1 and 4 are connected to pins 3 and 5 of chip U18 via capacitors C19 and C21, respectively. Pin 6 is grounded via capacitor C22. Pin 2 is connected to the power supply via capacitor C18. Pin 16 is connected to the power supply. Pin 15 is grounded. Capacitor C20 is placed between the power supply and ground. Pins 13 and 14 of chip U18 are connected to pins 2 and 3 of interface J8, respectively. Pins 12 and 11 are connected to pins 12 and 13 of chip U1, respectively. The model of chip U18 is SP232EEN-L / TR.

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