Vehicle-mounted controller partition PCB layout and system for suppressing electromagnetic interference

Abstract

The invention provides a vehicle-mounted controller partition PCB layout and system for suppressing electromagnetic interference, and relates to the field of PCB layout, and the method comprises the steps: dividing a controller into a high-speed digital domain, an analog sampling domain, a radio frequency communication domain, a power conversion domain and the like in a design stage, and analyzing the backflow path and noise characteristics of the controller; generating a verifiable pseudo-random ground copper topology according to the unique identification information so as to destroy a periodic resonance condition and keep low-frequency backflow continuous; polarization channel mapping is established through a directional via array and an in-layer conductor so as to realize spatial polarization isolation; after manufacturing, performing impedance spectrum, reference voltage and polarization distribution detection to confirm the electromagnetic performance; the design seeds and detection data of the qualified board are written into a traceability database to support reproducible production; during assembly, the segmented cover bodies are pressed in the polarization direction to form multi-stage shielding.

Description

Technical Field

[0001] This invention relates to the field of PCB layout, specifically to a partitioned PCB layout and system for an in-vehicle controller that suppresses electromagnetic interference. Background Technology

[0002] As the level of electrification of intelligent vehicles continues to increase, the electrical design complexity of the vehicle controller, as the core unit for vehicle signal processing and execution, is rapidly increasing. In a multi-domain coupled circuit environment, how to achieve both high-speed signal processing and stable power supply has become a key issue in the design of vehicle electronic systems. At the same time, the electromagnetic compatibility requirements of the whole vehicle are also constantly increasing, which puts forward higher standards for signal integrity and electromagnetic interference control inside the controller.

[0003] In existing technologies, engineers typically reduce coupling interference by dividing the circuit board into functional areas, optimizing routing methods, and adding ground planes and shielding layers. Some solutions introduce multi-layer stacked designs to establish isolation channels between different signal layers. Other solutions evaluate board-level performance during the manufacturing stage through impedance measurement and conformance testing. These methods improve electromagnetic compatibility characteristics to some extent, but there is still room for optimization.

[0004] Existing solutions still face limitations in handling the mutual influence between complex signal domains; return channels between different electrical functional areas are difficult to coordinate systematically, and local layout optimization often relies on experience-based adjustments; at the same time, the results of manufacturing and testing have a low correlation with the design model, resulting in poor consistency in reproduction. Summary of the Invention

[0005] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a partitioned PCB layout and system for vehicle controllers that suppresses electromagnetic interference, thereby solving the limitations faced in the aforementioned background technologies when dealing with the mutual influence between complex signal domains; the difficulty in systematically coordinating return current channels between different electrical functional areas; and the problem that local layout optimization often relies on empirical adjustments.

[0006] Technical solution

[0007] To achieve the above objectives, the present invention provides the following technical solution: a partitioned PCB layout and system for suppressing electromagnetic interference in a vehicle controller, comprising the following steps: S1. During the design phase of the vehicle controller, the vehicle controller is divided into high-speed digital domain, analog sampling domain, radio frequency communication domain and power conversion domain according to electrical functions. The sensitive devices, noise sources, ground copper allowable return current area, high-speed differential trace location and power and heat dissipation key areas of each domain are determined respectively. S2 uses the unique identifier of each vehicle controller as a deterministic seed in the layout design input, and generates a serialized pseudo-random ground copper topology based on the preset ground copper geometric primitive library and connectivity constraint rules. This serialized pseudo-random ground copper topology forms an aperiodic distribution of ground islands and gaps across the entire board, while retaining a continuous global low-frequency return channel to maintain the integrity of DC and low-frequency references. S3, in the stacked design, assigns the main return channels of the high-speed digital domain, analog sampling domain, radio frequency communication domain, and power conversion domain according to the polarization category determined based on the main current direction and noise field vector distribution of each domain, and establishes polarization channel mapping with the straight conductor segment in the layer through the directional via array, and then maps the polarization channel to the contact direction of the segmented cover to form spatial polarization isolation; S4. During the manufacturing stage, the above-mentioned serialized pseudo-random ground copper topology and polarization channel mapping are converted into production files. After the manufacturing is completed, each circuit board is subjected to return impedance spectrum measurement under bandwidth-controlled excitation, reference voltage consistency measurement under low-noise sampling state, and near-field polarization distribution measurement to confirm that there is no narrowband high-Q resonance, the low-frequency return channel is continuous, and the polarization isolation meets the requirements. S5. For circuit boards that pass the inspection, the corresponding deterministic seed, layout file, impedance spectrum, reference measurement results and polarization measurement data are recorded into the manufacturing traceability database, and a reproduction mapping relationship is established based on the unique identification information. S6. During the assembly stage, the conductive contact surfaces of the segmented cover are pressed together with the ground copper position of the serialized pseudo-random ground copper topology according to the contact direction of the segmented cover, forming a multi-segment shielding structure to complete grounding coupling and polarization radiation suppression.

[0008] Preferably, during the design phase of the vehicle controller, the controller is divided according to its electrical functions, resulting in four regions: a high-speed digital domain, an analog sampling domain, a radio frequency (RF) communication domain, and a power conversion domain. In the high-speed digital domain, high-speed sensitive devices such as processors, memory chips, and high-speed interface chips are first identified. The signal return paths for these devices are determined, and symmetrical paths for high-speed differential traces and permissible ground copper return areas are defined. In the analog sampling domain, low-noise sensitive devices such as analog signal input terminals, analog-to-digital converters, and reference power supply regulator modules are identified. The ground copper range for the signal sampling loop is determined, and the noise source distribution area within this range is defined. In the RF communication domain, antenna modules, RF power amplifiers, low-noise amplifiers, and matching networks are identified. The RF energy transmission path and return copper surface are determined, and the permissible range for high-frequency coupling areas is set. In the power conversion domain, devices such as power transistors, inductors, capacitors, and rectifier units are identified. The power path is determined. The design process involves defining the path and location of heat concentration areas, and delineating critical heat dissipation areas and allowable copper thickness regions. After completing the initial division of each domain, designers define the boundary areas of all domains as electrical separation lines and record the noise source type, sensitive device list, return path configuration, and power distribution diagram for each domain. The attribute information of each domain is stored in a structured manner in the design database for retrieval in subsequent layout stages. All regions must not overlap in spatial distribution and must maintain unidirectional return control electrically. The differential signal return of the high-speed digital domain must be closed on the same layer. The reference level of the analog sampling domain must maintain continuous copper surface coverage. The energy return path of the RF communication domain must avoid the high-speed signal layer. The power heat dissipation of the power conversion domain must form a complete heat conduction channel within the ground copper layer. Through this stage of division, the electrical structure of the vehicle controller is defined as a stable framework with four independent domains, controllable return, and noise separation, providing a foundation for subsequent layout input and ground copper topology generation.

[0009] Preferably, when setting up a local shielding structure within the high-speed digital domain of the vehicle controller, the designer first inserts a continuous metal shielding plane between the high-speed signal chip and the ground copper layer; slits equidistant from the high-speed differential traces are opened in the continuous metal shielding plane to close the signal return current in the local path; during the layout process, the dielectric thickness between the shielding plane and the signal layer is maintained in the range of 0.1 mm to 0.2 mm to ensure stable electromagnetic field coupling strength; within the analog sampling domain, a single low-frequency return band is established at all analog signal convergence points and directly connected to the ground node of the reference power supply regulator module via copper wire; a passive transient softening chain composed of capacitors and ferrite beads connected in series is inserted between the low-frequency return band and the surrounding ground island to absorb transient energy generated by ground potential switching and suppress ground potential fluctuations; a parallel multi-path passive coupling grid is arranged at the power conversion domain entrance, each grid consisting of several conductor squares and distributed resistance, allowing different frequency bands to be coupled. The high-frequency transients propagate along their respective dissipation paths; the grid design controls the side length of the squares to be no more than 5 mm to ensure high-frequency attenuation capability; high-impedance isolation gaps are set at the boundaries of the RF communication domain, with the gap width maintained in the range of 0.3 mm to 0.5 mm, and limited conduction is achieved through controlled bridging points at preset positions; the bridging points are connected by microstrip capacitors, which can form high-impedance isolation at high frequencies and allow limited DC return at low frequencies; common-mode interference between the antenna module and the main control circuit is weakened at the bridging points to ensure that the electric field direction inside the RF channel remains stable; after completing local electromagnetic constraints in all domains, a complete continuity test is performed on the indirect ground plane of each domain to confirm that the electrical connectivity of local shielding, low-frequency return, passive coupling and high-impedance isolation all meet the design requirements; through the above structure, the four domains achieve interference isolation in space and energy stratification dissipation in the frequency range, thereby providing an isolation basis for the subsequent copper ground topology generation stage.

[0010] Preferably, during the layout design input stage, a serialized pseudo-random ground copper topology generation operation is performed using the unique identifier information of each vehicle controller as a deterministic seed. Designers first call four types of primitives—rectangles, triangles, sectors, and slot strips—from the ground copper geometric primitive library. Each primitive contains definable boundary point coordinates, thickness parameters, and connection interfaces. When generating the initial topology, the deterministic seed is expanded into a 4096-bit bit sequence using a pseudo-random sequence algorithm. This bit sequence controls the shape selection and rotation angle of the primitives by grouping them into 8-bit groups. Connectivity constraint rules require that adjacent primitives maintain at least single-node contact or continuous edge overlap, prohibiting the existence of suspended ends or broken areas. In the area below high-speed differential traces, the algorithm automatically performs connectivity analysis to ensure that no gaps or breaks appear below the traces. In power and heat dissipation critical areas, the generator... The system automatically locks the continuous ground copper pattern, maintaining consistent copper thickness and forming a complete heat dissipation path. After all primitives are arranged, the system performs a global return path verification, analyzing the continuity of DC channels and low-frequency paths. If a low-frequency loop interruption is detected, the generation module rearranges the relevant primitives until the path is complete. After the topology is completed, a serialized pseudo-random ground copper topology file and verification report are automatically output, and the report is written to the manufacturing traceability database with corresponding unique identification information. The entire generation process ensures the formation of a non-periodic ground island and gap distribution across the entire board, while maintaining a continuous global low-frequency return path to maintain the integrity of DC and low-frequency references. Through the control of deterministic seeds, each circuit board has a reproducible ground copper distribution pattern during the generation stage, thereby maintaining consistent electrical characteristics and avoiding the generation of periodic resonance conditions during manufacturing and testing.

[0011] Preferably, during the stack-up design phase, the polarization category is determined based on the main current direction and noise field vector distribution of the high-speed digital domain, analog sampling domain, RF communication domain, and power conversion domain. Designers first analyze the current density vector direction within the main return channel of each domain, determining the polarization direction by the cross product of the current flow direction and the magnetic field distribution direction. When the current in the high-speed digital domain flows along the horizontal axis, its main polarization is defined as linear polarization. When the current vector in the RF communication domain is perpendicular to the magnetic field vector in the power conversion domain, a cross-polarization channel is defined. In the interlayer structure design, polarization channel mapping is formed by arranging directional via arrays. Each via array consists of 3 to 5 through-holes with a diameter maintained within the 0.25 mm range and an array spacing controlled within 1 mm. In the design of straight conductor segments within the layer, the minimum straight segment length is specified to be no less than 2 mm, and the arrangement angle is set at 0 degrees or 90 degrees according to the polarization category. The polarization is arranged in a directional manner to ensure polarization purity. Long-distance parallel lines are prohibited for different polarization channels to prevent mutual coupling. After the polarization channels are mapped, the mapping direction is matched one-to-one with the contact direction of the segmented enclosure, so that each enclosure segment maintains the same direction as the corresponding polarization channel during assembly. After the channel allocation is completed, polarization consistency verification is performed. If any area is found to have cross error or angle deviation exceeding 3 degrees, the via array position is readjusted until the error is eliminated. After verification, the four functional domains form independent polarization distribution areas in space. The linear polarization area, cross polarization area, and mixed transition area do not overlap, and their respective return paths are closed according to the polarization direction. The spatial isolation structure established by polarization channel mapping isolates the interference energy between the high-speed digital domain and the RF communication domain at the board level and forms a stable polarization channel network, providing a clear reference for polarization measurement in the subsequent manufacturing stage.

[0012] Preferably, after the circuit board production is completed during the manufacturing stage, the inspection personnel first connect each circuit board to a bandwidth-controlled excitation device and apply a pulse signal with a frequency range of 10 Hz to 1 GHz; continuously measure the spectrum of the return impedance as a function of frequency using an impedance analyzer, and record all peak points in the impedance curve; if the quality factor Q value at any frequency point exceeds 20, it is determined that there is a narrowband high Q peak and marked as abnormal; when the impedance spectrum is smooth and there are no high Q peaks, continue to perform reference voltage consistency measurement under low-noise sampling conditions; this process drives the reference nodes of the high-speed digital domain, analog sampling domain, RF communication domain, and power conversion domain with a reference signal with a noise amplitude not exceeding 1 microvolt; measure the potential difference between the reference nodes of each domain using a high-precision voltage differential instrument, and calculate the DC continuity of the return channel; if the potential difference of any node exceeds 2 millivolts, it is determined that the return impedance is abnormal. The flow channel is discontinuous and anomalies are recorded. Once the DC continuity meets the requirements, the testing personnel activate the near-field polarization measurement device and use a scanning probe to collect polarization distribution data at a distance of 1 mm from the board surface. The measured polarization angle is calculated by the signal processing unit and compared with the design polarization channel mapping. If the deviation angle is less than 3 degrees, the polarization isolation is deemed to meet the requirements. All test results are recorded in a data file and bound to the unique identification information of the circuit board. When the impedance spectrum is smooth, the low-frequency return current is continuous, and the polarization isolation meets the standard, the circuit board is deemed to have passed the test. If any condition is not met, the circuit board serial number is registered as unqualified and sent to the engineering closed-loop operation for correction. Through the above testing process, it is ensured that all circuit boards meet the design standards in terms of spatial anti-harmonic characteristics, low-frequency reference integrity, and polarization isolation performance, providing a reliable testing basis for the manufacturing traceability database.

[0013] Preferably, during the manufacturing traceability phase, data recording is performed on each circuit board that passes inspection. Inspection personnel first retrieve the unique identifier information, then read the corresponding deterministic seed, layout file, return current impedance spectrum, reference measurement results, and polarization measurement data. All information is verified and written to the manufacturing traceability database. The database structure consists of an index table, a data file area, and a reproduction mapping table. The index table uses the unique identifier information as the primary key to ensure that the data for each circuit board can be uniquely located. The data file area stores the original binary format of the layout file, impedance spectrum, and measurement data. The reproduction mapping table records the correspondence between the unique identifier information and the deterministic seed, used for reproduction during the remanufacturing phase. When an error occurs during operation... When replacing or reproducing a requirement, manufacturing personnel input the unique identifier of the original circuit board into the database. The system automatically retrieves and calls the corresponding deterministic seed. The generation module re-executes the serialized pseudo-random ground copper topology generation process to produce a reproducible layout that is completely consistent with the original layout. After the reproducible layout is exported, it is replicated by the manufacturing process department and enters the same testing process to confirm performance consistency. After confirming that the impedance spectrum, reference measurement, and polarization distribution all meet the standards, the reproducible circuit board is installed into the assembly line to replace the original component. The entire operation process ensures that the electromagnetic characteristics of the reproduced product are completely consistent with the original product. The manufacturing traceability database simultaneously records the reproducible batch number, manufacturing time, and test results, forming a traceable closed-loop record.

[0014] Preferably, during the assembly stage, the segmented covers are positioned one by one according to the direction corresponding to the polarization channel mapping. Assemblers first fix the circuit board on the tooling platform and determine the placement order of each segmented cover according to the polarization channel mapping direction in the design documents. The conductive contact surface of each segmented cover is pressed against the ground copper surface of the serialized pseudo-random ground copper topology using elastic conductive contacts. The pressure applied during pressing is maintained between 50 and 80 Newtons to ensure sufficient contact and no deformation. After pressing, a high-precision micro-ohmmeter is used to measure the contact resistance of each segmented contact point, with the allowable deviation controlled between 0.2 milliohms and 0.5 milliohms. Testing personnel repeat the measurement under three environmental conditions: ambient temperature (25 degrees Celsius), low temperature (−20 degrees Celsius), and high temperature (85 degrees Celsius) to verify contact stability. If the resistance of any contact point deviates from the allowable range, the pressing force is readjusted or adjusted. Replace the contacts until the measured values ​​return to the specified range; after all segments are inspected, the assembly personnel mechanically fix the edges of each segment of the enclosure, with the torque value of the fixing screws set to 0.5 N·m; after pressing and fixing, each segment of the enclosure is connected in the same direction as the corresponding polarization channel, so that the spatial current distribution between different polarization channels forms a phase misalignment; the phase misalignment angle is maintained in the range of 45 degrees to 90 degrees to weaken the excitation conditions of cavity resonance; after assembly, an overall shielding effectiveness verification is performed, using a bandwidth control signal to excite the outside of the enclosure and measure the internal electromagnetic response; when the internal field strength attenuation is greater than 40 dB, it is confirmed that the assembly process meets the polarization radiation suppression requirements; through this assembly process, the external shielding structure of the vehicle controller and the internal ground copper topology form a multi-segment cooperative shielding system, thereby suppressing polarization radiation in space and ensuring the stability of the electrical structure.

[0015] Preferably, during the closed-loop operation phase of the project, when the manufacturing inspection results fail, the inspection personnel first match the abnormal frequency bands appearing in the inspection data with the spatial location of the serialized pseudo-random ground copper topology; based on the matching relationship between the frequency point and the coordinates on the board, the location of the abnormal frequency band in the island, gap, or polarization channel is determined; the designer marks the corresponding area as a constraint violation in the design database and records the violation type, frequency band range, and coordinate information; then, the pseudo-random generation module is called again, and the current topology structure is loaded according to the deterministic seed corresponding to the original unique identifier information; the generation module adjusts the primitive layout according to the violation marked area, and redistributes the rotation angle, boundary length, and connection nodes of the relevant geometric primitives; after each adjustment, a connectivity check is immediately performed to ensure that the low-frequency return channel under the new layout remains connected; after the generation is completed, a new topology file is output, and the process is restarted. The manufacturing and testing process begins; the manufacturing department re-produces the circuit boards according to the new documents; testing personnel perform bandwidth-controlled excitation, return current impedance spectrum measurement, reference voltage measurement, and polarization distribution measurement again; if the impedance spectrum is smooth, the low-frequency return current is continuous, and the polarization isolation meets the standards in the test results, it is judged as passed; if there are still abnormalities, the closed-loop operation is triggered again; when the standard is not met after three consecutive regenerations, the production line automatically stops the production of the current batch and marks the corresponding serial number as requiring manual verification; during the manual verification stage, engineers check the ground copper distribution documents, polarization mapping documents, and measurement data to find the source of structural deviations and correct the design rules; after the closed-loop operation is completed, all test indicators are re-verified until the specified standards are met; through the above closed-loop process, the manufacturing process has the ability to automatically correct errors and reproduce designs, ensuring that the output results of all circuit boards are stable and the electromagnetic characteristics are consistent.

[0016] Preferably, throughout the entire process of design, manufacturing, testing, and assembly, the relationships between each stage form a closed loop linked by data files and identification information. After completing the division of the high-speed digital domain, analog sampling domain, RF communication domain, and power conversion domain, designers generate a complete structural parameter file. This file records the current direction, noise distribution, return current path, and polarization type for each domain, serving as the initial data source for the layout input module. During the layout input stage, a serialized pseudo-random ground copper topology is generated using unique identification information, and a seed is simultaneously registered in the database. In the manufacturing stage, circuit boards are produced based on the topology file, and return current impedance spectroscopy, reference voltage consistency measurement, and polarization distribution measurement are performed during the testing phase. The test results file and the layout file are written together into the manufacturing traceability database, forming a reproducible production record. In the assembly stage, the polarization is then read from the database. The channel mapping file and segmented enclosure contact direction data guide the segmented enclosure pressing operation; when the test fails, the engineering closed-loop operation module reads the violation mark and topology coordinates, and readjusts the primitive layout; all regenerated layouts and test results are rewritten to the database and replace the original records; at any point in time when re-production or maintenance is required, the manufacturing personnel only need to input the unique identification information of the circuit board, and the system can call the corresponding deterministic seed to regenerate the ground copper topology consistent with the original version; after the re-produced circuit board completes the test, it is reassembled into the controller structure; through this closed-loop transfer mechanism between stages, strict data consistency is maintained between design input, layout generation, manufacturing execution, test verification and assembly implementation; the information flow of each stage is recorded in chronological order to prevent data loss or parameter mismatch, thereby ensuring that the vehicle controller maintains stable electromagnetic performance throughout its entire life cycle.

[0017] Preferably, all functional domains form a coordinated relationship at the spatial and electrical levels according to the partitioning results in the design documents; the high-speed digital domain completes high-frequency signal processing in the main control area and establishes a closed return channel through a continuous copper layer; the analog sampling domain forms a low-noise sampling loop around the power supply regulation area, and its single low-frequency return band absorbs potential switching energy with the surrounding ground island through a passive transient softening chain; the RF communication domain forms a high-impedance isolation boundary at the board edge, so that the common-mode interference between the antenna module and the main control circuit is limited to the boundary; the power conversion domain forms a multi-path passive coupling grid at the power input, guiding the high-frequency transient energy to diffuse along the dissipation path; the main return channels of all domains establish polarization channel mapping with the straight conductor segments in the layer through a directional via array, and the polarization channels are distributed in space as non-interfering linear polarization regions and cross-polarization regions; each segment cover is pressed to the corresponding ground copper position according to the mapping direction during assembly. This design creates a phase-displaced connection between the shielding layer and the ground copper surface. This phase displacement, between 45 and 90 degrees, allows high-frequency energy to form non-resonant interference within the enclosure. During manufacturing and testing, impedance spectroscopy and polarization distribution are used to verify structural consistency, confirming continuous low-frequency return, polarization isolation meeting standards, and the absence of narrowband high-Q resonance. All test data, layout files, deterministic seeds, and reproduction records are stored in a manufacturing traceability database. When the controller enters the maintenance or replacement phase, the original generated data can be retrieved using unique identification information to achieve complete reproduction. The entire structure forms a complete closed loop from design partitioning, topology generation, polarization allocation, manufacturing testing, to assembly. The four functional domains are spatially decoupled and operate in layers in the frequency dimension. Electromagnetic stability control is achieved through the ground copper topology and enclosure structure during energy transmission, ensuring that the vehicle controller has anti-resonance and low-noise characteristics in the working environment.

[0018] Beneficial effects

[0019] This invention provides a partitioned PCB layout and system for an automotive controller to suppress electromagnetic interference. It offers the following advantages: This invention introduces a collaborative design of serialized pseudo-random ground copper topology and polarization channel mapping during the design phase of the vehicle controller, enabling the circuit board to form a non-periodic structural distribution in space, effectively disrupting the formation conditions of fixed resonant modes; at the same time, it maintains the continuity of the low-frequency return channel and electrical reference integrity; thereby achieving wideband anti-harmonic and low-noise performance improvement without adding an additional shielding layer; and improving the electromagnetic compatibility stability of the entire vehicle system.

[0020] This invention achieves quantitative confirmation of the spatial electromagnetic behavior of each circuit board by performing return current impedance spectrum measurement, reference potential consistency measurement, and near-field polarization comparison during the manufacturing and testing stages; it establishes a manufacturing traceability database by combining unique identification information, making the topological characteristics and test results of each circuit board reproducible; the original topology can be reproduced through deterministic seeds during subsequent maintenance and remanufacturing processes; it ensures that replacement parts are consistent with the original parts in electromagnetic characteristics; thereby improving product consistency and long-term system reliability. Detailed Implementation

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Example 1:

[0023] This invention provides a partitioned PCB layout and system for suppressing electromagnetic interference in an automotive controller. The system involves the following steps: In the production and assembly of the automotive controller, design engineers first divide the entire control board into four functional areas based on the controller's electrical functions: a high-speed digital domain, an analog sampling domain, a radio frequency communication domain, and a power conversion domain. During this division, the design engineers establish an electrical model in a computer-aided design platform, determining the boundary lines of each domain using parameters such as input current direction, signal type, and power supply level. The processor and high-speed interface chip are placed in the high-speed digital domain. Differential signal lines are defined as paired traces in the design software using differential constraint instructions, and each pair of signals... The ground copper surface below the signal line serves as a local return path; the analog sampling domain maintains a low-noise connection path between the signal input and the analog-to-digital converter, and is connected to the reference power supply regulator module via a ground copper strip, forming a single low-frequency return band; the RF communication domain sets high-impedance isolation gaps with a width of 0.3 mm to 0.5 mm around the antenna module, and inserts microstrip capacitors at designated locations to form controlled jumpers, maintaining RF signal isolation at high frequencies and conduction at low frequencies; the power conversion domain arranges a passive coupling grid composed of conductor squares at the power input, with each square having a side length of 5 mm, and distributes resistance between different paths to achieve high-frequency energy dissipation; after the design is completed, Engineers input the controller's unique identifier as a deterministic seed into the pseudo-random generation module to generate a serialized pseudo-random ground copper topology. During topology generation, the system selects rectangular, triangular, and strip copper sheets from the geometric primitive library and arranges them randomly, ensuring the ground copper surface remains continuous under low-frequency paths through connectivity constraints. After generation, the system automatically outputs the ground copper topology file and verification report, which are then imported into the circuit board production equipment by the manufacturing department. In the manufacturing stage, the circuit board uses multi-layer copper-clad laminate, with each layer precisely etched according to the topology file to form a non-periodic distribution of ground islands and gaps. After production is completed, a controlled pulse excitation with a bandwidth of 10 Hz to 1 GHz is applied to the circuit board, and through resistance... An impedance analyzer measures the return current impedance spectrum and performs low-noise voltage difference measurements on the reference nodes of each domain using a reference voltage driver. When the test results show that the impedance spectrum is smooth, the low-frequency return current is continuous, and the polarization isolation meets the standards, the test personnel enter the circuit board number and test data into the manufacturing traceability database. After entering the assembly stage, the operators position the segmented enclosures according to the direction indicated in the polarization channel mapping file. The conductive contact surface of each segmented enclosure is pressed against the ground copper surface through elastic conductive contacts, with the pressing force controlled between 50 and 80 Newtons. After pressing, the contact resistance is measured under three conditions: room temperature, low temperature, and high temperature, with the deviation range maintained between 0.2 milliohms and 0.The electromagnetic field strength is between 5 milliohms; after assembly, external electromagnetic excitation is applied to the overall shielding structure and the internal field strength attenuation is measured. When the attenuation value exceeds 40 dB, the shielding effect is confirmed to meet the requirements; all assembly and testing data are recorded in the database for future reproduction; the entire implementation process forms a closed loop in the four stages of design, manufacturing, testing, and assembly. Each step is linked to a unique identifier in the database to ensure that the electromagnetic performance of each circuit board remains consistent, thus completing the full implementation of the vehicle controller.

[0024] Example 2:

[0025] The difference between this embodiment and Embodiment 1 lies in the structural optimization of the power conversion domain and the RF communication domain, as well as the measurement strategies during the manufacturing and testing phases. During the design phase, the power conversion domain employs a three-layer composite copper surface structure to enhance the balance of power distribution. A 0.08 mm thick main power return copper surface is laid at the bottom layer, a 0.04 mm thick equalization copper strip is laid in the middle layer, and a 0.05 mm thick heat dissipation copper area is laid at the top layer. The three layers are connected by vertical vias to form a vertical heat dissipation path. This multi-layer structure improves the heat dissipation capability of the power conversion domain while maintaining continuous return. In the RF communication domain, the high-impedance isolation gap around the antenna module is adjusted from a single-layer structure to a double-layer structure. The structure features a layered design with a 0.3 mm gap in the upper layer and a 0.4 mm gap in the lower layer, separated by an insulating layer and bridged by a microstrip capacitor. This structure offers superior high-frequency isolation compared to a single-layer isolation gap, further suppressing common-mode interference. During the ground copper topology generation stage, the bit sequence extension length of the pseudo-random generation module is increased from 4096 bits to 8192 bits, resulting in a more refined distribution of the ground copper geometric primitives. After generation, during connectivity analysis, a low-frequency impedance distribution detection step is added to the verification program to ensure that the low-frequency path resistance is below 10 milliohms. The manufacturing stage employs a precision etching process, with the etching depth controlled between 18 and 20 micrometers to ensure a smooth ground copper layer surface. The detection stage... In addition to impedance spectroscopy measurements, frequency domain resolution scanning was added, with a scanning step interval set to 1 kHz to capture minute resonance peaks. The low-noise reference measurement process was changed from single-point measurement to multi-point synchronous sampling, with eight sampling points. Differential calculations were used to obtain more accurate return voltage consistency results. In polarization distribution measurements, the probe scanning step was reduced to 0.5 mm to improve polarization angle measurement accuracy. All test data were directly written into the manufacturing traceability database via the data acquisition module and indexed using unique identification information. During the assembly stage, the polarization channel pressing sequence was maintained consistent with Example 1, but a dynamic torque retest was added after pressing to verify the long-term stability of the screw fixation. The compressive force was maintained between 50 and 80 Newtons, and the torque value was retested and kept within 0.5 N·m with a deviation of no more than 0.05 N·m. After assembly, in the electromagnetic shielding verification, the upper limit of the external excitation frequency was increased to 2 GHz to verify the high-frequency suppression performance. The test results showed that the internal field strength attenuation reached more than 45 dB, indicating that the structure's anti-resonance performance in the high-frequency range was enhanced. In Example 2, while maintaining the overall structure and working principle of Example 1, the application of a multi-layer power conversion domain structure, a double-layer radio frequency isolation gap, and high-resolution detection technology further improved the electromagnetic performance consistency and anti-interference capability of the vehicle controller, completing a more precise implementation process.

[0026] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A partitioned PCB layout for a vehicle controller that suppresses electromagnetic interference, the layout comprising: The method comprises the following steps: S1, in the vehicle-mounted controller design stage, the vehicle-mounted controller is divided into high-speed digital domain, analog sampling domain, radio frequency communication domain and power conversion domain according to electrical functions, and the sensitive devices, noise sources, ground copper allowed backflow area, high-speed differential wire position and power and heat dissipation key area of each domain are determined respectively; S2, in the layout design input, the unique identification information of each vehicle-mounted controller is taken as a deterministic seed, and a serialized pseudo-random ground copper topology is generated according to a preset ground copper geometric primitive library and a connectivity constraint rule, so that the serialized pseudo-random ground copper topology forms a non-periodic island and gap distribution in the whole board range, while a continuous global low-frequency backflow channel is reserved to maintain the integrity of the direct current and low-frequency reference; S3, in the layering design, the main return channels of the high-speed digital domain, the analog sampling domain, the radio frequency communication domain and the power conversion domain are distributed according to the polarization category determined based on the main current direction and the noise field vector distribution of each domain, and the polarization channel mapping is established through the directional via array and the in-layer straight conductor segment, and then the polarization channel mapping is corresponded with the contact direction of the segmented cover body to form spatial polarization isolation; S4, in the manufacturing stage, the above-mentioned serialized pseudo-random ground copper topology and polarization channel mapping are converted into production files, and after manufacturing is completed, the backflow impedance spectrum measurement under the bandwidth controlled excitation, the reference voltage consistency measurement under the low noise sampling state and the near-field polarization distribution measurement are performed on each circuit board to confirm that the narrowband high-Q resonance, the low-frequency backflow channel continuity and the polarization isolation meet the requirements; S5, the corresponding deterministic seed, layout file, impedance spectrum, reference measurement result and polarization measurement data of the circuit board detected through the detection are recorded into the manufacturing traceability database, and a reproduction mapping relationship is established according to the unique identification information; S6, in the assembly stage, the conductive contact surface of the segmented cover body is pressed to the ground copper position of the serialized pseudo-random ground copper topology according to the contact direction of the segmented cover body, and a multi-section shielding structure is formed to complete the grounding coupling and polarization radiation suppression.

2. The partitioned PCB layout of a vehicle controller for suppressing electromagnetic interference according to claim 1, wherein, In S1, a local shielding structure is arranged inside the high-speed digital domain, and the local reference plane is kept complete, so that the high-speed backflow current is closed in the local path; a single low-frequency backflow band is established at the convergence point of the analog sampling domain, and a passive transient softening chain is inserted between the single low-frequency backflow band and the surrounding island to absorb the transient energy of the ground potential switching; A parallel multi-path passive coupling grid is configured at the entrance of the power conversion domain to form differentiated backflow paths at different frequency bands, so as to guide the high-frequency transient to disperse and propagate along the dissipation path; a high-resistance isolation gap is arranged at the boundary of the radio frequency communication domain, and limited conduction is realized through a controlled cross point, so that the common mode interference between the internal antenna module and the main control circuit is weakened at the boundary.

3. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, In S2, connectivity analysis is performed on each candidate geometric primitive in the process of generating the serialized pseudo-random copper topology to ensure that there are no broken gaps under high-speed differential traces and that the power and heat dissipation key areas remain continuous copper; the electrical role is marked for each primitive during the generation stage, and global backflow channel verification is performed after the layout is completed to confirm the low-frequency path through; the layout file and verification report are automatically output after the generation is completed, and the verification report is stored in the manufacturing traceability database to ensure that the manufacturing stage can directly produce according to the layout file, forming a controlled pseudo-random but verifiable serialized pseudo-random copper topology, which destroys the periodic resonance condition in space while maintaining functional integrity.

4. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, In S3, the polarization category is determined according to the main current direction and noise field vector distribution of the high-speed digital domain, analog sampling domain, radio frequency communication domain, and power conversion domain, and directional via array is arranged on the corresponding level to form linear polarization or cross-polarized backflow channel; In the interlayer conductor segment design, the via cluster arrangement angle and minimum straight segment length are limited to maintain polarization purity and prevent long-distance parallel of different polarization channels, and stable polarization distribution is formed at the board level to achieve directional isolation between return paths.

5. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, In S4, a bandwidth-controlled pulse excitation is applied to each manufactured circuit board, and the continuous spectrum of return flow impedance with frequency is measured to detect whether there is a narrowband high-Q peak; In the same detection process, a low-noise sampling signal is used to drive the system, the potential difference between the reference nodes of the high-speed digital domain, analog sampling domain, radio frequency communication domain, and power conversion domain is measured, and the DC continuity of the backflow channel is calculated; at the same time, the polarization distribution is collected by a near-field polarization measurement device, and the measured polarization angle is compared with the design mapping; when the detection results show that the impedance spectrum is smooth, the low-frequency return flow is continuous, and the polarization isolation meets the requirements, the circuit board is determined to be qualified; when the detection results do not meet the conditions, the corresponding serial number is marked as unqualified and sent to the engineering closed-loop operation; and through detection, it is ensured that the produced circuit boards meet the spatial anti-harmonic requirements, low-frequency reference integrity, and polarization isolation requirements.

6. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, In S5, the unique identification information, deterministic seed, layout file, impedance spectrum, and polarization measurement data of each detected circuit board are written into the manufacturing traceability database; When the system needs to be replaced or reproduced during operation, the original generation seed is called using the unique identification, and the serialized pseudo-random copper topology generation process is re-executed to obtain a reproduction layout consistent with the original product topology; the reproduction layout is loaded into the system after being confirmed by the same manufacturing and detection process, thereby ensuring that the electromagnetic behavior of the replaced component is completely consistent with the original component.

7. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, In S6, the segmented shield body is sequentially positioned according to the corresponding direction of the polarization channel mapping during assembly, and is pressed against the copper surface of the serialized pseudo-random copper topology through the elastic conductive contact, to form a controllable contact interface; after pressing, the contact resistance of each segmented contact point is measured, and the measurement is repeated under various environmental conditions to confirm the contact stability; when the resistance of any contact point deviates from the allowed range, the pressing force is adjusted or the contact is replaced until the measurement value is stable within the specified range; after assembly is completed, each segment of the shield body is connected in a consistent direction with the corresponding polarization channel, so that the spatial shielding structure forms a phase misalignment between different polarization channels, thereby reducing the excitation conditions of cavity resonance.

8. The partitioned PCB layout of a vehicle controller to suppress electromagnetic interference according to claim 1, wherein, When the detection performed after manufacturing is not passed, the abnormal frequency band appearing in the detection result is corresponded to the spatial position of the serialized pseudo-random copper topology, and is marked as a constraint violation in the design database; the pseudo-random generation module is called again, and the primitive layout is adjusted according to the deterministic seed corresponding to the original unique identification information, so as to eliminate the violation; After generating a new topology, the manufacturing and detection process is performed again until the detection result meets the specified standard; when multiple reproductions cannot pass the detection, the corresponding serial number is marked as needing manual verification, and the current batch production is stopped.

9. The system for partitioning a PCB layout of a vehicle controller to suppress electromagnetic interference of claim 1, wherein, Comprise: A design division module is used for dividing the controller circuit into high-speed digital domain, analog sampling domain, radio frequency communication domain and power conversion domain according to electrical functions in the design stage of the vehicle-mounted controller, and identifying sensitive devices, noise sources, ground copper allowed backflow area, high-speed differential wire position and power and heat dissipation key area in each domain; A pseudo-random ground copper generation module is used for generating a deterministic seed based on the unique identification information of each vehicle-mounted controller in the layout design stage, and generating a serialized pseudo-random ground copper topology according to a preset ground copper geometric primitive library and a connectivity constraint rule, so that the generated ground copper topology forms aperiodic distribution of islands and gaps in the whole board range, while maintaining a continuous low-frequency backflow channel; A polarization channel design module is used for determining the polarization category according to the main current direction and noise field vector distribution of each domain in the layering design, establishing a polarization channel mapping through a directional via array and an in-layer conductor segment, and corresponding to the contact direction of the segmented shield body, to form spatial polarization isolation; A manufacturing and detection module is used for converting the ground copper topology and polarization channel mapping into a production file in the manufacturing stage, and performing backflow impedance spectrum measurement, reference voltage consistency measurement and near-field polarization distribution measurement under a bandwidth-controlled excitation after the board is manufactured, to confirm that the design requirements of no narrowband high-Q resonance, continuous low-frequency backflow channel and polarization isolation are met; A manufacturing traceability and reproduction module is used for storing the deterministic seed, layout file, impedance spectrum, reference voltage and polarization measurement data of each circuit board that passes the detection together with the unique identification information into a manufacturing traceability database, to establish a reproduction mapping relationship, and realize consistent reproduction of the layout and electromagnetic characteristics based on the original seed in the remanufacturing or maintenance stage. An assembly shielding module is used to press the conductive contact surface of the segmented cover to the ground copper topology position in the direction of the polarization channel mapping during the assembly stage, forming a multi-segment shielding structure to achieve ground coupling and polarization radiation suppression.