Semiconductor grinding brush resistant to hydrofluoric acid corrosion and preparation process thereof

Abstract

The invention relates to the field of semiconductor grinding brushes, in particular to a hydrofluoric acid corrosion resistant semiconductor grinding brush and a preparation process thereof, and adopts the technical scheme that an inner cavity sleeve is mounted in a rotating shaft device, and the upper end of the inner cavity sleeve is connected with a first air pressure device; an air guide pipe is arranged on one side of the lower end of the flushing cabin; a lifting pipe is installed on the top face of the built-in brush head, the lifting pipe is installed in the inner cavity sleeve in a sliding mode, bristles are implanted into the bottom of the built-in brush head, and a bristle filter is installed at the bottom of the flushing cabin. Then a first air pressure device is started to empty air in the inner cavity sleeve to enable the lifting pipe in the inner cavity sleeve to retract, the lifting pipe drives the built-in brush head to pull the bristles back into the washing cabin, and meanwhile, the bristle filter intercepts the hydrofluoric acid solution on the surfaces of the bristles, so that the effect of effectively removing the hydrofluoric acid solution on the surfaces of the bristles is achieved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor polishing brushes, and more specifically to a semiconductor polishing brush resistant to hydrofluoric acid corrosion and its manufacturing process. Background Technology

[0002] Chemical mechanical planarization (CMP) machines are key equipment in semiconductor manufacturing processes. In the CMP process, the polishing brush is one of the most important components. It is mainly used to contact the surface of semiconductor materials during the CMP process to help remove oxides, particles or other impurities from the surface. Polishing brushes are usually made of fine fibers, polymers or similar materials. The bristles can help apply a certain mechanical force and work with the chemical solution to treat the surface. In the chemical mechanical planarization (CMP) process, hydrofluoric acid (HF) is typically used to remove oxide layers from silicon wafers or other semiconductor materials. However, hydrofluoric acid is highly corrosive to certain plastics and polymers. Common semiconductor abrasive brush bristle materials include nylon, polytetrafluoroethylene (PTFE), and polyester. While these materials generally possess strong chemical stability, prolonged exposure to hydrofluoric acid or exposure to high concentrations can cause the following problems: 1. Polymer degradation: Hydrofluoric acid can accelerate the degradation of certain plastics and polymers, causing the bristles to become brittle, harden, or break, which reduces the effective friction and removal capacity of the bristles. 2. Bristle damage: For polyester bristles, hydrofluoric acid may cause changes in their surface structure, reducing the durability of the bristles. Long-term contact with hydrofluoric acid may affect the structure, strength, and cleaning ability of the bristles. 3. Corrosion of brush holder: Hydrofluoric acid may affect the brush holder of abrasive brushes, especially in a high-concentration HF environment, which may cause gradual corrosion or embrittlement of the material and affect the structural stability of the brush holder. Therefore, it is necessary to invent a semiconductor polishing brush resistant to hydrofluoric acid corrosion and its preparation process. Summary of the Invention

[0003] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor polishing brush resistant to hydrofluoric acid corrosion, comprising a brush head drive chamber, a brush head flushing chamber, and a self-cleaning brush head; The brush head drive chamber includes an outer shell, a layer plate installed in the middle of the inner wall of the outer shell, a rotating shaft installed at the bottom of the layer plate, an inner sleeve installed inside the rotating shaft, a first air pressure device connected to the upper end of the inner sleeve, and a connecting frame installed at the lower end of the inner sleeve. The brush head rinsing chamber includes a rinsing chamber, with an inlet pipe and an outlet pipe respectively provided on both sides of the rinsing chamber. The connecting frame is rotatably installed on the inner wall of the rinsing chamber, and an air guide pipe is provided on one side of the lower end of the rinsing chamber. The self-cleaning brush head includes a built-in brush head disposed inside the rinsing chamber. A lifting tube is installed on the top surface of the built-in brush head and is slidably installed inside the inner cavity sleeve. A second air pressure device is connected to the upper end of the lifting tube. An air hole is provided at the bottom of the built-in brush head, and bristles are embedded at the bottom of the built-in brush head. A bristle guide frame is installed at the bottom of the rinsing chamber, and the lower ends of the bristles pass through the bristle guide frame. A bristle filter is installed at the bottom of the bristle guide frame.

[0004] Preferably, the bottom of the built-in brush head, the bristle guide frame, and the bristle filter all adopt a hemispherical structure. The surface of the bristle guide frame and the bristle filter is provided with a plurality of bristle through holes. The lower ends of the bristles pass through the bristle through holes of the bristle guide frame and the bristle filter in sequence and extend to the outside of the rinsing chamber. A sealing ring is installed between the lower end of the rinsing chamber and the bristle filter.

[0005] Preferably, the bristle filter chamber is made of rubber material, the bristle filter has an internal interlayer, the upper outer side of the bristle filter has an opening connecting to the upper end of the interlayer, the upper end of the bristle guide frame is turned outward and wrapped around the upper outer side of the bristle filter, the outer side of the turned-out portion of the bristle guide frame has several side through holes, the side through holes are at the same horizontal plane as the air guide pipe, and the air guide pipe is connected to an external inflation device.

[0006] Preferably, the first air pressure device includes a first air pump, which is installed on one side of the outer wall of the shaft assembly. The output end of the first air pump is connected to a first conduit, which is connected to the upper end of the inner cavity sleeve. A motor is installed on the top surface of the layer plate, and the output end of the motor passes through the layer plate and is connected to the top surface of the shaft assembly. The outer wall of the outer casing is provided with a plurality of heat dissipation holes.

[0007] Preferably, the second air pressure device includes a second air pump, which is installed on the outer wall of the shaft away from the first air pump. The output end of the second air pump is connected to a second conduit, which passes through the inner sleeve and is connected to the upper end of the lifting pipe. The inlet end of the water pipe is connected to an external water supply device, and the outlet end of the water pipe is connected to an external drainage device.

[0008] A process for fabricating a semiconductor polishing brush resistant to hydrofluoric acid corrosion includes S1-S4; S1. Preparation of the brush head drive chamber: The metal sheet is rolled into a tube using a rolling mill, and then the seam is welded using a TIG welding gun to form the outer shell body. Heat dissipation holes are cut on the surface of the outer shell using a laser cutting machine. Then, a layer plate is welded in the middle of the outer shell. Next, the shaft, inner sleeve, lifting tube and outer shell top cover are cut and processed using a CNC machine tool. Holes are drilled at corresponding positions on the surface of the shaft and inner sleeve using a drilling machine. The first air pump and the second air pump are installed on the outer wall of the shaft. Then, the motor is installed and the motor output end is connected to the shaft with bolts. Finally, the outer shell top cover is installed with bolts. S2. Preparation of the brush head rinsing chamber: The metal sheet is rolled into a tube shape using a rolling mill, and then the joint is welded with a TIG welding gun to form the main body of the rinsing chamber. Holes are drilled on the surface of the rinsing chamber using a drilling machine. Then, the water inlet pipe, water outlet pipe and air guide pipe are welded to the corresponding holes on the surface of the rinsing chamber using a TIG welding gun. A connecting frame is welded using ring and steel strip materials, and then cooled, ground and polished. A sealing ring is prepared using a molding machine. S3. Preparation of self-cleaning brush head: Use stamping equipment to produce built-in brush head and bristle guide frame. Then use laser drilling equipment to open through holes and implantation holes on the surface of built-in brush head and bristle guide frame. Use staged thermoplastic molding equipment to produce bristle filter. Use bristle implantation equipment to insert bristles through the through holes on the surface of bristle filter and bristle guide frame and implant them into the implantation holes on the surface of built-in brush head. Finally, weld the lower end of the lifting tube to the top of the built-in brush head. S4. Assembly: First, insert the lifting tube into the inner sleeve and connect the lifting tube to the second air pump using the second conduit. Then, connect the bristle guide frame to the bottom of the connecting frame with bolts. Next, install the connecting frame and the bristle guide frame into the rinsing chamber. Inject adhesive into the bottom opening of the swivel. Then, insert the inner sleeve into the bottom opening of the swivel and connect the inner sleeve to the first air pump using the first conduit. Next, fix the rinsing chamber to the outer shell with bolts. Finally, glue the sealing ring to the bottom of the rinsing chamber to complete the assembly of the semiconductor polishing brush.

[0009] Preferably, the stamping forming equipment includes a stamping bracket, a stamping base is installed at the bottom of the stamping bracket, a stamping heating table is installed on the top surface of the stamping base, a second electric heater is built into the stamping heating table, a stamping rod is installed on the top of the stamping bracket, and a stamping plate is installed at the lower output end of the stamping rod.

[0010] Preferably, a first stamping die, a second stamping die, and a third stamping die are fixedly installed on the top surface of the stamping heating table, and a fourth stamping die, a fifth stamping die, and a sixth stamping die are fixedly installed on the bottom of the stamping plate. The fourth stamping die is located below the first stamping die, the fifth stamping die is located below the second stamping die, and the sixth stamping die is located below the third stamping die.

[0011] Preferably, the staged thermoplastic molding equipment includes a thermoplastic support frame, a thermoplastic base installed at the bottom of the thermoplastic support frame, a thermoplastic heating platform installed on the top surface of the thermoplastic base, a first electric heater built into the thermoplastic heating platform, a lower slide rail provided on the top surface of the thermoplastic heating platform, a hydraulic rod installed on the top of the thermoplastic support frame, a thermoplastic plate installed at the lower output end of the hydraulic rod, and an upper slide rail provided at the bottom of the thermoplastic plate.

[0012] Preferably, a first thermoplastic mold and a third thermoplastic mold are slidably mounted on the lower slide rail, and the first thermoplastic mold and the third thermoplastic mold are respectively disposed on both sides of the lower slide rail. A second thermoplastic mold and a fourth thermoplastic mold are slidably mounted on the upper slide rail, and the second thermoplastic mold and the fourth thermoplastic mold are respectively disposed on both sides of the upper slide rail.

[0013] The beneficial effects of this invention are: 1. After the bristles are ground on the surface of the silicon wafer coated with hydrofluoric acid, air is injected into the bristle filter through the air duct to make it expand. The expanded bristle filter will clamp the surface of the bristles. Then, the first air pressure device is activated to vent the air in the inner sleeve, causing the internal lifting tube to retract. The lifting tube drives the built-in brush head to pull the bristles back into the rinsing chamber. At the same time, the bristle filter traps the hydrofluoric acid solution on the surface of the bristles, so as to effectively remove the hydrofluoric acid solution on the surface of the bristles, reduce the contact time of the bristles with hydrofluoric acid, avoid the bristles from becoming brittle, hardening or breaking, thereby improving the durability of the bristles. 2. After the built-in brush head pulls the bristles back into the rinsing chamber, water is injected into the rinsing chamber through the water inlet pipe to rinse the built-in brush head and bristles. At the same time, hydrofluoric acid wastewater is discharged through the water outlet pipe. Then, the second air pressure device is activated to pressurize the lifting pipe and the built-in brush head. Air is ejected from the air hole at the bottom of the built-in brush head to further clean the surface of the built-in brush head and the roots of the bristles of residual hydrofluoric acid. This stabilizes the structure, strength and cleaning ability of the bristles, and also prevents the built-in brush head from gradually corroding or becoming brittle, thus improving the structural stability of the built-in brush head. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the bristle extension provided by the present invention; Figure 2 This is a schematic diagram of the bristle retraction provided by the present invention; Figure 3 A cross-sectional view of the outer shell and flushing chamber provided by the present invention; Figure 4 A cross-sectional view of the shaft assembly provided by the present invention; Figure 5 A cross-sectional view of the built-in brush head provided by the present invention; Figure 6 This is a schematic diagram of the movement of the lifting tube in the extended state of the brush bristles provided by the present invention; Figure 7This is a cross-sectional view of the built-in brush head with the bristles extended, as provided by the present invention. Figure 8 A schematic diagram of the brush bristles passing through the brush bristle guide frame and the brush bristle filter provided by the present invention; Figure 9 Detailed cross-sectional view of the brush guide frame and brush filter provided by the present invention; Figure 10 This is a schematic diagram of the stamping forming equipment provided by the present invention; Figure 11 A schematic diagram of the stamping die and corresponding output components provided by the present invention; Figure 12 A schematic diagram of the first stage structure of the staged thermoplastic molding equipment provided by the present invention; Figure 13 A schematic diagram of the first-stage thermoplastic mold and the corresponding output components provided by the present invention; Figure 14 This is a schematic diagram of the second stage structure of the staged thermoplastic molding equipment provided by the present invention; Figure 15 This is a schematic diagram of the second-stage thermoplastic mold and the corresponding output components provided by the present invention.

[0015] In the diagram: 111. Outer shell; 112. Shelf; 113. Heat dissipation hole; 121. Flushing chamber; 122. Water inlet pipe; 123. Water outlet pipe; 124. Air guide pipe; 125. Sealing ring; 131. Shaft assembly; 132. Motor; 133. Inner cavity sleeve; 134. First air pump; 135. First conduit; 141. Lifting pipe; 142. Built-in brush head; 143. Air hole; 144. Second air pump; 145. Second conduit; 146. Brush bristles; 151. Connecting frame; 152. Brush bristle guide frame; 153. Side through hole; 154. Brush bristle filter; 161. Thermoplastic bracket; 162. Thermoplastic base; 1 63. Thermoplastic heating table; 164. First electric heater; 165. Lower slide rail; 166. Hydraulic rod; 167. Thermoplastic plate; 168. Upper slide rail; 171. First thermoplastic mold; 172. Second thermoplastic mold; 173. Third thermoplastic mold; 174. Fourth thermoplastic mold; 181. Stamping bracket; 182. Stamping base; 183. Stamping heating table; 184. Second electric heater; 185. Stamping rod; 186. Stamping plate; 191. First stamping die; 192. Second stamping die; 193. Third stamping die; 194. Fourth stamping die; 195. Fifth stamping die; 196. Sixth stamping die. Detailed Implementation

[0016] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0017] like Figure 1 - Figure 9 As shown, a semiconductor polishing brush resistant to hydrofluoric acid corrosion according to the first aspect of the present invention includes a brush head drive chamber, a brush head flushing chamber, and a self-cleaning brush head. The brush head drive chamber includes an outer shell 111, a shelf 112 is installed in the middle of the inner wall of the outer shell 111, a rotatable shaft 131 is rotatably installed at the bottom of the shelf 112, an inner sleeve 133 is installed inside the rotatable shaft 131, a first air pressure device is connected to the upper end of the inner sleeve 133, and a connecting frame 151 is installed at the lower end of the inner sleeve 133. The brush head rinsing chamber includes a rinsing chamber 121. A water inlet pipe 122 and a water outlet pipe 123 are respectively provided on both sides of the rinsing chamber 121. A connecting frame 151 is rotatably installed on the inner wall of the rinsing chamber 121. An air guide pipe 124 is provided on one side of the lower end of the rinsing chamber 121. The self-cleaning brush head includes a built-in brush head 142, which is disposed in the rinsing chamber 121. A lifting pipe 141 is installed on the top surface of the built-in brush head 142 and is slidably installed in the inner sleeve 133. A second air pressure device is connected to the upper end of the lifting pipe 141. An air hole 143 is provided at the bottom of the built-in brush head 142. Brush bristles 146 are embedded at the bottom of the built-in brush head 142. A bristle guide frame 152 is installed at the bottom of the rinsing chamber 121. The lower ends of the bristles 146 pass through the bristle guide frame 152. A bristle filter 154 is installed at the bottom of the bristle guide frame 152.

[0018] In the above embodiments, it should be noted that the bristles 146 are made of nylon, polytetrafluoroethylene or polyester, which have strong chemical stability and are resistant to hydrofluoric acid corrosion. The outer shell 111, the flushing chamber 121 and the bristle guide frame 152 are all made of high alloy stainless steel. High alloy stainless steel is a high alloy material containing elements such as nickel, molybdenum and chromium, which has excellent acid and alkali corrosion resistance. The bristle filter 154 is made of fluororubber, which has good chemical resistance and aging resistance. The top surface of the outer shell 111 is provided with a connection port. The outer shell 111 can be connected to the semiconductor polishing machine by bolts and the connection port. The semiconductor polishing machine is existing technology and has a position adjustment function, which can drive the polishing brush of the outer shell 111 to move to a designated position. This invention needs to be installed on the semiconductor polishing machine to be used. By activating the first air pressure device to pressurize the inner sleeve 133, the lifting tube 141 is pushed to drive the built-in brush head 142 downward. The built-in brush head 142 drives the bristles 146 to extend downward. Then, the semiconductor polishing machine controls the brush head to move to the silicon wafer surface and starts the rotating shaft 131 to rotate, driving the self-cleaning brush head to rotate as a whole, so as to achieve the effect of removing oxides, particles or other impurities from the surface through the bristles 146. After the bristles 146 are ground on the surface of the silicon wafer coated with hydrofluoric acid, air is injected into the bristle filter 154 through the air pipe 124 to make it expand. The expanded bristle filter 154 will clamp the surface of the bristles 146. Then, the first air pressure device is activated to vent the air in the inner sleeve 133, causing the internal lifting pipe 141 to retract. The lifting pipe 141 drives the built-in brush head 142 to pull the bristles 146 back into the rinsing chamber 121. At the same time, the bristle filter 154 traps the hydrofluoric acid solution on the surface of the bristles 146 to effectively remove the hydrofluoric acid solution from the surface of the bristles 146, reduce the time the bristles are in contact with hydrofluoric acid, avoid the bristles from becoming brittle, hardening or breaking, and thus improve the durability of the bristles. After the built-in brush head 142 pulls the bristles 146 back into the rinsing chamber 121, water is injected into the rinsing chamber 121 through the water inlet pipe 122 to rinse the built-in brush head 142 and the bristles 146. At the same time, the water outlet pipe 123 discharges hydrofluoric acid wastewater. Then, the second air pressure device is activated to pressurize the lifting pipe 141 and the built-in brush head 142. Air is ejected from the air hole 143 at the bottom of the built-in brush head 142, agitating bubbles at the base of the bristles 146. This loosens the hydrofluoric acid adhering to the base of the bristles 146 and the surface of the built-in brush head 142, thereby further cleaning the surface of the built-in brush head 142 and the base of the bristles 146 to remove residual hydrofluoric acid. This stabilizes the structure, strength, and cleaning ability of the bristles 146, and also prevents the built-in brush head 142 from gradually corroding or becoming brittle, thus improving the structural stability of the built-in brush head 142.

[0019] like Figure 3 - Figure 9 As shown, a semiconductor polishing brush resistant to hydrofluoric acid corrosion also includes a built-in brush head 142. The bottom of the built-in brush head 142, the bristle guide frame 152, and the bristle filter 154 are all hemispherical structures. The surfaces of the bristle guide frame 152 and the bristle filter 154 are provided with a plurality of bristle through holes. The lower ends of the bristles 146 pass through the bristle through holes of the bristle guide frame 152 and the bristle filter 154 in sequence and extend to the outside of the rinsing chamber 121. The lower end of the rinsing chamber 121 is connected to the bristle filter 154. Equipped with a sealing ring 125, the bristle filter 154 chamber is made of rubber material. The bristle filter 154 has an internal interlayer. The upper outer side of the bristle filter 154 has an opening connecting to the upper end of the interlayer. The upper end of the bristle guide frame 152 is turned outward and wrapped around the upper outer side of the bristle filter 154. Several side through holes 153 are provided on the outer side of the turned-out part of the bristle guide frame 152. The side through holes 153 are on the same horizontal plane as the air duct 124. The air duct 124 is connected to an external inflation device.

[0020] In the above embodiments, it should be noted that, through the side through hole 153 provided on the outward-turned part of the bristle guide frame 152 and the upper opening of the connecting interlayer provided on the outer side of the upper end of the bristle filter 154, the air duct 124 can inflate the bristle filter 154 with air regardless of the angle to which the bristle guide frame 152 and the bristle filter 154 are rotated. The external inflation device includes an air pump, an air pressure regulator, an inflation pipe, a control panel, and a power supply. The output end of the inflation pipe is connected to the air guide pipe 124. The air pump is started through the control panel to inject air into the air guide pipe 124 through the inflation pipe. The air in the air guide pipe 124 passes through the side through hole 153 and the upper opening of the bristle filter 154 to achieve the effect of injecting into the bristle filter 154 and causing it to expand. This causes the inner wall of the bristle through hole on the surface of the bristle filter 154 to contract and clamp the bristles 146. The sealing ring 125 is made of silicone material, which has good chemical resistance, aging resistance and high temperature resistance. When the brush filter 154 and the brush guide frame 152 rotate, the surface of the brush filter 154 and the sealing ring 125 will continuously rub against each other and generate high temperature. Therefore, the sealing ring 125 is made of silicone material.

[0021] like Figure 3 - Figure 7 As shown, a semiconductor polishing brush resistant to hydrofluoric acid corrosion further includes a first air pressure device, which includes a first air pump 134. The first air pump 134 is installed on one side of the outer wall of the shaft 131. The output end of the first air pump 134 is connected to a first conduit 135, which is connected to the upper end of the inner sleeve 133. A motor 132 is installed on the top surface of the shelf 112. The output end of the motor 132 passes through the shelf 112 and is connected to the top surface of the shaft 131. The outer wall of the outer casing 111 is provided with a plurality of heat dissipation holes 113. A second air pressure device includes a second air pump 144, which is installed on the side of the outer wall of the shaft 131 away from the first air pump 134. The output end of the second air pump 144 is connected to a second conduit 145, which passes through the inner sleeve 133 and is connected to the upper end of the lifting pipe 141. The input end of the water inlet pipe 122 is connected to an external water supply device, and the output end of the water outlet pipe 123 is connected to an external drainage device.

[0022] In the above embodiments, it should be noted that the first air pump 134, the second air pump 144 and the motor 132 are connected to an external power supply and an MCU controller. The MCU controller is connected to a control panel, and the control panel controls the opening and closing of the first air pump 134, the second air pump 144 and the motor 132 through the MCU controller. By activating the first air pump 134, air is injected into the inner sleeve 133 through the first conduit 135, thereby pressurizing the inner sleeve 133 and pushing the lifting tube 141 to extend. Conversely, the first air pump 134 draws air into the inner sleeve 133 through the first conduit 135, thereby creating a negative pressure in the inner sleeve 133 and causing the lifting tube 141 to retract. By activating the second air pump 144, air is injected into the lifting pipe 141 through the second conduit 145, so that the air is sprayed out from the air hole 143 at the bottom of the built-in brush head 142. The motor 132 drives the shaft 131 to rotate, the shaft 131 drives the connecting frame 151 and the inner sleeve 133 to rotate, the connecting frame 151 drives the brush guide frame 152 to rotate, the brush guide frame 152 drives the brush filter 154 to rotate, and the inner sleeve 133 drives the lifting tube 141 and the built-in brush head 142 to rotate, so as to achieve the effect of driving the entire brush head to rotate. The external water supply equipment is responsible for introducing water into the inlet pipe 122, including an inlet valve, a water pump, a check valve, and a connecting pipe. The connecting pipe is fixedly connected to the inlet pipe 122 through a flange. The water pump is started to inject water from the public water network into the inlet pipe 122. The external drainage equipment is responsible for safely discharging the wastewater from the outlet pipe 123. It includes a drain valve, a drain pump, and a drain pipe. The drain pipe is fixedly connected to the outlet pipe 123 via a flange. The wastewater enters the drain pipe through the outlet pipe 123 and is then discharged to the sewer pipe by the drain pump.

[0023] like Figure 7 As shown, a process for manufacturing a semiconductor polishing brush resistant to hydrofluoric acid corrosion includes S1-S4. S1. Preparation of brush head drive chamber: The metal sheet is rolled into a tube using a rolling mill, and then the seam is welded using a TIG welding gun to form the main body of the outer shell 111. Heat dissipation holes 113 are cut on the surface of the outer shell 111 using a laser cutting machine. Then, a layer plate 112 is welded in the middle of the outer shell 111. Next, the shaft 131, inner sleeve 133, lifting tube 141 and top cover of the outer shell 111 are cut and processed using a CNC machine tool. Holes are drilled at corresponding positions on the surfaces of the shaft 131 and inner sleeve 133 using a drilling machine. The first air pump 134 and the second air pump 144 are installed on the outer wall of the shaft 131. Then, the motor 132 is installed and the output end of the motor 132 is connected to the shaft 131 by bolts. Finally, the top cover of the outer shell 111 is installed by bolts. S2. Preparation of the brush head rinsing chamber: The metal sheet is rolled into a tube shape using a rolling mill, and then the joint is welded with a TIG welding gun to form the main body of the rinsing chamber 121. Holes are drilled on the surface of the rinsing chamber 121 using a drilling machine. Then, the water inlet pipe 122, water outlet pipe 123 and air guide pipe 124 are welded to the corresponding holes on the surface of the rinsing chamber 121 using a TIG welding gun. The connecting frame 151 is welded using ring and steel strip materials and then cooled, ground and polished. The sealing ring 125 is prepared using a molding machine. S3. Preparation of self-cleaning brush head: Use stamping equipment to produce built-in brush head 142 and bristle guide frame 152. Then use laser drilling equipment to open through holes and implantation holes on the surface of built-in brush head 142 and bristle guide frame 152. Use staged injection molding equipment to produce bristle filter 154. Use bristle implantation equipment to insert bristles 146 through the through holes on the surface of bristle filter 154 and bristle guide frame 152 and implant them into the implantation holes on the surface of built-in brush head 142. Finally, weld the lower end of lifting tube 141 to the top of built-in brush head 142. S4. Assembly: First, insert the lifting tube 141 into the inner sleeve 133, and use the second conduit 145 to connect the lifting tube 141 and the second air pump 144. Then, connect the bristle guide frame 152 to the bottom of the connecting frame 151 with bolts. Then, install the connecting frame 151 together with the bristle guide frame 152 into the rinsing chamber 121. Inject adhesive into the bottom opening of the shaft 131. Then, insert the inner sleeve 133 into the bottom opening of the shaft 131, and use the first conduit 135 to connect the inner sleeve 133 and the first air pump 134. Then, fix the rinsing chamber 121 to the outer shell 111 with bolts. Finally, glue the sealing ring 125 to the bottom of the rinsing chamber 121 to complete the assembly of the semiconductor polishing brush.

[0024] In the above embodiments, it should be noted that the rolling mill uses the rotation of multiple rollers to gradually bend the metal sheet into the desired circular or tubular shape by means of pressure and friction, which is the prior art. TIG welding torches, also known as tungsten inert gas welding torches, are tools that use tungsten electrodes and inert gases (usually argon or helium) for welding. TIG welding torches are widely used for precision welding of various materials. Laser cutting machines are devices that use a high-power laser beam as a heat source. By focusing the beam onto the surface of a material, the material is heated to a melting or vaporized state, thereby achieving processing operations such as cutting, engraving, or drilling. Laser cutting machines are widely used in the precision processing of metal and non-metal materials, and are characterized by high precision, high efficiency, and high automation. A drilling machine is a type of machine tool commonly used in metalworking for operations such as drilling, reaming, and boring. It cuts material using a rotating drill bit and is widely used in manufacturing. The CNC machine tool for machining the shaft 131, inner sleeve 133, lifting tube 141 and outer shell 111 is a high-precision CNC lathe, suitable for machining cylindrical or conical workpieces, and widely used in metal processing; After the welded connection frame 151 is formed, the weld points need to be removed by grinding with a grinder and then polished with a polishing machine before it can be put into use. Molding presses play a crucial role in the production of silicone products such as sealing rings. They use heating and pressure to mold silicone material into a mold. Molding presses are particularly suitable for manufacturing various sealing materials such as sealing rings, gaskets, automotive parts, and electronic product seals. The basic working principle of the bristle implantation device is to use mechanical or pneumatic principles to fix the bristles to the built-in brush head 142. The device will use a robotic arm or automated tools to precisely insert the bristles into the predetermined position to ensure that each bristle can be firmly fixed. Common implantation methods include thermal implantation, mechanical pressing, or fixing the bristles with laser welding technology. After the bristles are implanted, the device will fix the bristles firmly by heating, cooling, pressing, etc. to prevent them from falling off during use. After all components are manufactured, workers need to manually assemble them. The assembled semiconductor polishing brushes also need to undergo quality inspection and testing, bristle strength and fixation testing, performance testing and adjustment, and cleaning and disinfection to ensure that their performance and quality meet the requirements.

[0025] like Figure 10 and Figure 11 As shown, a process for manufacturing a semiconductor polishing brush resistant to hydrofluoric acid corrosion also includes a stamping forming device. The stamping forming device includes a stamping bracket 181, a stamping base 182 mounted at the bottom of the stamping bracket 181, a stamping heating table 183 mounted on the top surface of the stamping base 182, a second electric heater 184 built into the stamping heating table 183, a stamping rod 185 mounted on the top of the stamping bracket 181, a stamping plate 186 mounted at the lower output end of the stamping rod 185, a first stamping die 191, a second stamping die 192 and a third stamping die 193 fixedly mounted on the top surface of the stamping heating table 183, and a fourth stamping die 194, a fifth stamping die 195 and a sixth stamping die 196 fixedly mounted on the bottom of the stamping plate 186. The fourth stamping die 194 is located below the first stamping die 191, the fifth stamping die 195 is located below the second stamping die 192, and the sixth stamping die 196 is located below the third stamping die 193.

[0026] In the above embodiments, it should be noted that the top of the stamping bracket 181 is equipped with a PLC controller, a hydraulic drive system (including a hydraulic cylinder, a hydraulic pump, a pressure motor and a pressure valve), an electrical control panel, an electric heating control system and a temperature monitoring system. The hydraulic drive system is connected to the stamping rod 185, and the electric heating control system is connected to the second electric heater 184. The cut metal raw materials are placed on the fourth stamping die 194, the fifth stamping die 195, and the sixth stamping die 196 respectively. The second electric heater 184 is activated to heat the die, and at the same time, the hydraulic drive system is activated to start the stamping rod 185 to drive the stamping plate 186 downward, so that the first stamping die 191, the second stamping die 192, and the third stamping die 193 press the fourth stamping die 194, the fifth stamping die 195, and the sixth stamping die 196 downward, so as to achieve the effect of stamping and forming the brush guide frame, the built-in brush head A part, and the built-in brush head B part. Afterwards, the built-in brush head A part and the built-in brush head B part need to be welded together using a tungsten inert gas welding gun. Then, the weld points are removed by grinding with a grinder, and after polishing with a polishing machine, the brush guide frame and the built-in brush head can be put into use.

[0027] like Figure 12 - Figure 15 As shown, a process for manufacturing a semiconductor polishing brush resistant to hydrofluoric acid corrosion also includes a staged thermoplastic molding device. The staged thermoplastic molding device includes a thermoplastic support 161, a thermoplastic base 162 mounted at the bottom of the thermoplastic support 161, a thermoplastic heating platform 163 mounted on the top surface of the thermoplastic base 162, a first electric heater 164 built into the thermoplastic heating platform 163, a lower slide rail 165 provided on the top surface of the thermoplastic heating platform 163, and a hydraulic rod 166 mounted on the top of the thermoplastic support 161. The hydraulic rod 166 lowers... A thermoplastic plate 167 is installed at the output end. An upper slide rail 168 is provided at the bottom of the thermoplastic plate 167. A first thermoplastic mold 171 and a third thermoplastic mold 173 are slidably installed on the lower slide rail 165. The first thermoplastic mold 171 and the third thermoplastic mold 173 are respectively located on both sides of the lower slide rail 165. A second thermoplastic mold 172 and a fourth thermoplastic mold 174 are slidably installed on the upper slide rail 168. The second thermoplastic mold 172 and the fourth thermoplastic mold 174 are respectively located on both sides of the upper slide rail 168.

[0028] In the above embodiments, it should be noted that the top of the thermoplastic bracket 161 is equipped with a PLC controller, a hydraulic drive system (including a hydraulic cylinder, a hydraulic pump, a pressure motor and a pressure valve), an electrical control panel, an electric heating control system and a temperature monitoring system. The hydraulic drive system is connected to the hydraulic rod 166, and the electric heating control system is connected to the first electric heater 164. The first stage of thermoplastic molding: The cut fluororubber raw materials are placed on the first thermoplastic mold 171 and the third thermoplastic mold 173 respectively. The first electric heater 164 is started to heat the molds. At the same time, the hydraulic drive system is started to start the hydraulic rod 166 to drive the thermoplastic plate 167 downward, so that the second thermoplastic mold 172 and the fourth thermoplastic mold 174 are pressed into the first thermoplastic mold 171 and the third thermoplastic mold 173 respectively. After cooling and molding, the second thermoplastic mold 172 and the fourth thermoplastic mold 174 are lifted to achieve the effect of producing the brush filter A part and the brush filter B part. In addition, the brush filter C part is composed of multiple fluororubber hollow short tubes. The fluororubber hollow tubes are extruded by a rubber extruder and then cut into several short tubes by a cutting machine. The second stage of thermoplastic molding: Slide the first thermoplastic mold 171 to the middle of the lower slide rail 165, attach the brush filter C part to the short rod inside the first thermoplastic mold 171 and place it above the brush filter A part, then place the brush filter B part inside the first thermoplastic mold 171 and place it on the top surface of the brush filter C part, slide the fourth thermoplastic mold 174 to the middle of the upper slide rail 168, start the first electric heater 164 to heat the mold, and at the same time start the hydraulic drive system to start the hydraulic rod 166 to drive the thermoplastic plate 167 downward, so that the fourth thermoplastic mold 174 is pressed into the first thermoplastic mold 171, so that the brush filter A part, brush filter C part and brush filter B part are heat-fused together to form a shape. After complete cooling and demolding, the hollow brush filter 154 can be produced.

[0029] The usage process of this invention is as follows: Those skilled in the art install the outer casing 111 on a semiconductor polishing machine, start the first air pump 134 to pressurize the inner sleeve 133, push the lifting tube 141 to drive the built-in brush head 142 downwards, and the built-in brush head 142 drives the bristles 146 to extend downwards. Then, the semiconductor polishing machine controls the brush head to move to the silicon wafer surface, starts the motor 132 to drive the shaft 131 to rotate, causing the self-cleaning brush head to rotate as a whole, and removes oxides, particles, or other impurities from the surface through the bristles 146. After the bristles 146 polish the silicon wafer surface coated with hydrofluoric acid, air is injected into the bristle filter 154 through the air pipe 124 to make it expand. The expanded bristle filter 154 clamps the surface of the bristles 146. Then, the first air pump 134 is started to vent the air from the inner sleeve 133. The air causes the internal lifting pipe 141 to retract, and the lifting pipe 141 drives the built-in brush head 142 to pull the bristles 146 back into the rinsing chamber 121. At the same time, the bristle filter 154 traps the hydrofluoric acid solution on the surface of the bristles 146. After the built-in brush head 142 pulls the bristles 146 back into the rinsing chamber 121, water is injected into the rinsing chamber 121 through the water inlet pipe 122 to rinse the built-in brush head 142 and the bristles 146. At the same time, the water outlet pipe 123 discharges the hydrofluoric acid wastewater. Then, the second air pump 144 is started to pressurize the lifting pipe 141 and the built-in brush head 142. Air is sprayed out from the air hole 143 at the bottom of the built-in brush head 142, agitating bubbles at the base of the bristles 146, loosening the hydrofluoric acid adhering to the base of the bristles 146 and the surface of the built-in brush head 142, and further cleaning the residual hydrofluoric acid on the surface of the built-in brush head 142 and the base of the bristles 146.

[0030] The above description is merely a preferred embodiment of the present invention. Any person skilled in the art can modify the present invention or modify it into an equivalent technical solution using the technical solutions described above. Therefore, any simple modifications or equivalent substitutions made based on the technical solutions of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A semiconductor polishing brush resistant to hydrofluoric acid corrosion, comprising a brush head drive chamber, a brush head flushing chamber, and a self-cleaning brush head, characterized in that: The brush head drive chamber includes an outer shell, a layer plate installed in the middle of the inner wall of the outer shell, a rotating shaft installed at the bottom of the layer plate, an inner sleeve installed inside the rotating shaft, a first air pressure device connected to the upper end of the inner sleeve, and a connecting frame installed at the lower end of the inner sleeve. The brush head rinsing chamber includes a rinsing chamber, with an inlet pipe and an outlet pipe respectively provided on both sides of the rinsing chamber. The connecting frame is rotatably installed on the inner wall of the rinsing chamber, and an air guide pipe is provided on one side of the lower end of the rinsing chamber. The self-cleaning brush head includes a built-in brush head disposed inside the rinsing chamber. A lifting tube is installed on the top surface of the built-in brush head and is slidably installed inside the inner cavity sleeve. A second air pressure device is connected to the upper end of the lifting tube. An air hole is provided at the bottom of the built-in brush head, and bristles are embedded at the bottom of the built-in brush head. A bristle guide frame is installed at the bottom of the rinsing chamber, and the lower ends of the bristles pass through the bristle guide frame. A bristle filter is installed at the bottom of the bristle guide frame.

2. The semiconductor polishing brush resistant to hydrofluoric acid corrosion according to claim 1, characterized in that: The bottom of the built-in brush head, the bristle guide frame, and the bristle filter all adopt a hemispherical structure. The surface of the bristle guide frame and the bristle filter is provided with several bristle through holes. The lower end of the bristles passes through the bristle through holes of the bristle guide frame and the bristle filter in sequence and extends to the outside of the rinsing chamber. A sealing ring is installed between the lower end of the rinsing chamber and the bristle filter.

3. The semiconductor polishing brush resistant to hydrofluoric acid corrosion according to claim 1, characterized in that: The bristle filter chamber is made of rubber material. The bristle filter has an internal interlayer. The upper outer side of the bristle filter has an opening connecting to the upper end of the interlayer. The upper end of the bristle guide frame is turned outward and wrapped around the upper outer side of the bristle filter. The outer side of the turned-out portion of the bristle guide frame has several side through holes. The side through holes are at the same horizontal plane as the air guide pipe. The air guide pipe is connected to an external inflation device.

4. The semiconductor grinding brush resistant to hydrofluoric acid corrosion according to claim 1, characterized in that: The first air pressure device includes a first air pump, which is installed on one side of the outer wall of the shaft assembly. The output end of the first air pump is connected to a first conduit, which is connected to the upper end of the inner cavity sleeve. A motor is installed on the top surface of the shelf, and the output end of the motor passes through the shelf and is connected to the top surface of the shaft assembly. The outer wall of the outer casing is provided with several heat dissipation holes.

5. A semiconductor polishing brush resistant to hydrofluoric acid corrosion according to claim 1, characterized in that: The second air pressure device includes a second air pump, which is installed on the outer wall of the shaft away from the first air pump. The output end of the second air pump is connected to a second conduit, which passes through the inner sleeve and is connected to the upper end of the lifting pipe. The inlet pipe is connected to an external water supply device, and the outlet pipe is connected to an external drainage device.

6. A process for preparing the semiconductor polishing brush according to any one of claims 1-5, characterized in that: Including S1-S4: S1. Preparation of the brush head drive chamber: The metal sheet is rolled into a tube using a rolling mill, and then the seam is welded using a TIG welding gun to form the outer shell body. Heat dissipation holes are cut on the surface of the outer shell using a laser cutting machine. Then, a layer plate is welded in the middle of the outer shell. Next, the shaft, inner sleeve, lifting tube and outer shell top cover are cut and processed using a CNC machine tool. Holes are drilled at corresponding positions on the surface of the shaft and inner sleeve using a drilling machine. The first air pump and the second air pump are installed on the outer wall of the shaft. Then, the motor is installed and the motor output end is connected to the shaft with bolts. Finally, the outer shell top cover is installed with bolts. S2. Preparation of the brush head rinsing chamber: The metal sheet is rolled into a tube shape using a rolling mill, and then the joint is welded with a TIG welding gun to form the main body of the rinsing chamber. Holes are drilled on the surface of the rinsing chamber using a drilling machine. Then, the water inlet pipe, water outlet pipe and air guide pipe are welded to the corresponding holes on the surface of the rinsing chamber using a TIG welding gun. A connecting frame is welded using ring and steel strip materials, and then cooled, ground and polished. A sealing ring is prepared using a molding machine. S3. Preparation of self-cleaning brush head: Use stamping equipment to produce built-in brush head and bristle guide frame. Then use laser drilling equipment to open through holes and implantation holes on the surface of built-in brush head and bristle guide frame. Use staged thermoplastic molding equipment to produce bristle filter. Use bristle implantation equipment to insert bristles through the through holes on the surface of bristle filter and bristle guide frame and implant them into the implantation holes on the surface of built-in brush head. Finally, weld the lower end of the lifting tube to the top of the built-in brush head. S4. Assembly: First, insert the lifting tube into the inner sleeve and connect the lifting tube to the second air pump using the second conduit. Then, connect the bristle guide frame to the bottom of the connecting frame with bolts. Next, install the connecting frame and the bristle guide frame into the rinsing chamber. Inject adhesive into the bottom opening of the swivel. Then, insert the inner sleeve into the bottom opening of the swivel and connect the inner sleeve to the first air pump using the first conduit. Next, fix the rinsing chamber to the outer shell with bolts. Finally, glue the sealing ring to the bottom of the rinsing chamber to complete the assembly of the semiconductor polishing brush.

7. The semiconductor polishing brush manufacturing process according to claim 6, characterized in that: The stamping forming equipment includes a stamping bracket, a stamping base is installed at the bottom of the stamping bracket, a stamping heating table is installed on the top surface of the stamping base, a second electric heater is built into the stamping heating table, a stamping rod is installed on the top of the stamping bracket, and a stamping plate is installed at the lower output end of the stamping rod.

8. The semiconductor polishing brush manufacturing process according to claim 7, characterized in that: The top surface of the stamping heating table is fixedly equipped with a first stamping die, a second stamping die, and a third stamping die. The bottom of the stamping plate is fixedly equipped with a fourth stamping die, a fifth stamping die, and a sixth stamping die. The fourth stamping die is located below the first stamping die, the fifth stamping die is located below the second stamping die, and the sixth stamping die is located below the third stamping die.

9. The semiconductor polishing brush manufacturing process according to claim 6, characterized in that: The staged thermoplastic molding equipment includes a thermoplastic support frame, a thermoplastic base installed at the bottom of the thermoplastic support frame, a thermoplastic heating platform installed on the top surface of the thermoplastic base, a first electric heater built into the thermoplastic heating platform, a lower slide rail provided on the top surface of the thermoplastic heating platform, a hydraulic rod installed on the top of the thermoplastic support frame, a thermoplastic plate installed at the lower output end of the hydraulic rod, and an upper slide rail provided at the bottom of the thermoplastic plate.

10. The semiconductor polishing brush manufacturing process according to claim 9, characterized in that: A first thermoplastic mold and a third thermoplastic mold are slidably mounted on the lower slide rail, and the first thermoplastic mold and the third thermoplastic mold are respectively located on both sides of the lower slide rail. A second thermoplastic mold and a fourth thermoplastic mold are slidably mounted on the upper slide rail, and the second thermoplastic mold and the fourth thermoplastic mold are respectively located on both sides of the upper slide rail.

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