Cleaning device for semiconductor plastic encapsulation mold and control method thereof

Abstract

The application provides a cleaning device for a semiconductor plastic sealing mold and a control method thereof, which comprises a support frame, an execution assembly, a driving assembly, a blowing assembly and a suction assembly. The execution assembly comprises an intermediate plate, a sliding fitting module, a bearing plate and a brush plate; the driving assembly comprises a motor, a rotating shaft and an eccentric wheel, and the eccentric wheel is connected with the bearing plate. During the cleaning process, the brush plates on both sides form a relatively sealed environment with the upper die and the lower die of the plastic sealing mold, the motor drives the rotating shaft to rotate, the eccentric wheel on the rotating shaft drives the bearing plates and the brush plates on both sides to swing, so as to clean the residues on the surface of the plastic sealing mold in all directions. At the same time, the blowing assembly blows the residues through the blowing holes, and the suction assembly sucks the blown residues from the suction holes and the dust suction cavities, so as to greatly improve the cleaning effect and efficiency, guarantee the size precision and cleanliness of the subsequent packaging products, maintain the stable operation of the mold and adapt to the high-precision semiconductor plastic sealing process requirements.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor plastic packaging, in particular to a cleaning device for a semiconductor plastic packaging mold and a control method thereof. BACKGROUND

[0002] Semiconductor plastic packaging is a key process in the field of semiconductor packaging. The specific process is as follows: a chip frame or substrate with internal bonding completed is placed in a special plastic packaging mold, and is wrapped with molten epoxy resin molding compound. After heating, pressurizing and curing, a protective packaging shell is formed. In the process of implementing the process, the molten epoxy resin molding compound is prone to overflow, and the formed epoxy resin residues will adhere to the inner wall of the cavity of the plastic packaging mold. If the residues are not removed in time, it will directly affect the size accuracy, packaging sealing performance and other core quality indicators of the subsequent packaging products, and also damage the long-term stable operation performance of the mold. Therefore, reliable cleaning of the cavity of the plastic packaging mold is an indispensable link in the plastic packaging process.

[0003] At present, the mainstream plastic packaging mold cleaning solution in the industry adopts a cleaning device with blowing or suction function, which cooperates with a brush to perform physical cleaning. However, the existing cleaning technology has many defects and cannot meet the cleaning requirements of high-precision packaging:

[0004] Firstly, the existing cleaning device can only realize single blowing or suction action. If only blowing cleaning is adopted, the airflow will drive the residues to scatter irregularly in the surrounding area of the mold, which not only interferes with the normal operation of the equipment, but also pollutes the production environment and reduces the cleanliness of the subsequent products.

[0005] Secondly, the movement track of the supporting brush is single, which can only extend into the mold cavity along a fixed direction, and the cleaning action is stiff, so that the corners, gaps and other areas of the mold cavity cannot be effectively covered, and there are cleaning dead angles.

[0006] Thirdly, the brush is mostly of a roller type structure, and the installation layout design is unreasonable. During the cleaning process, the brush and the wall of the plastic packaging mold cavity cannot form a relatively closed cleaning space. On the one hand, when performing suction cleaning, external air will flow into through the gap between the brush and the mold, which reduces the vacuum degree of the target cleaning area, the suction force is dispersed, and the capturing and removing efficiency of the residues is greatly reduced. On the other hand, when performing blowing cleaning, if the blowing pressure is increased to improve the cleaning intensity, due to the lack of closed space constraint, the airflow will carry the residues that have not been removed to escape from the gap between the brush and the mold, further aggravating the problem of residue scattering and pollution. SUMMARY

[0007] The present application aims at solving the problems in the prior art, and provides a cleaning device for a semiconductor plastic encapsulation mold, which effectively improves the cleaning efficiency and effect of the plastic encapsulation mold and meets the demand of high-precision semiconductor plastic encapsulation process.

[0008] The present application aims at solving the problems in the prior art, and provides a cleaning device for a semiconductor plastic encapsulation mold, which effectively improves the cleaning efficiency and effect of the plastic encapsulation mold and meets the demand of high-precision semiconductor plastic encapsulation process.

[0009] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0010] According to the first aspect of the present application, a cleaning device for a semiconductor plastic encapsulation mold is provided, which comprises a support frame, an execution assembly, a driving assembly, a blowing assembly and a suction assembly.

[0011] The execution assembly is arranged on the inner side of the support frame, and comprises an intermediate plate, a sliding fitting module, a bearing plate and a brush plate arranged in sequence on the upper and lower sides of the intermediate plate and away from the intermediate plate, the sliding fitting module on the upper side of the intermediate plate is arranged along a first direction, and the sliding fitting module on the lower side of the intermediate plate is arranged along a second direction; a dust suction cavity is arranged between the brush plate and the corresponding bearing plate, a plurality of blowing holes and a plurality of suction holes are arranged on the brush plate, and each suction hole is communicated with the corresponding dust suction cavity.

[0012] The driving assembly comprises a motor, a rotating shaft and two eccentric wheels, the motor is arranged on the support frame, the rotating shaft is arranged on the support frame in a vertical direction, and the motor is drivingly connected with the rotating shaft; the two eccentric wheels are arranged on the rotating shaft at intervals, and the geometric center axes of the two eccentric wheels are respectively parallel to the center axis of the rotating shaft, and the two eccentric wheels are respectively connected with the bearing plates on the two sides.

[0013] The blowing assembly is communicated with each blowing hole.

[0014] The suction assembly is communicated with each dust suction cavity.

[0015] During the cleaning process, the brush plates on the upper and lower sides form a relatively sealed environment with the upper mold and the lower mold of the plastic encapsulation mold respectively, the motor drives the rotating shaft to rotate, the two eccentric wheels on the rotating shaft drive the bearing plates and the brush plates on the two sides to swing respectively, so as to clean the residues on the surface of the plastic encapsulation mold, at the same time, the blowing assembly blows up the residues through each blowing hole, and the suction assembly sucks up the blown-up residues from each suction hole and each dust suction cavity.

[0016] Preferably, the sliding fit module comprises a slidable sliding rail and a sliding block, the sliding rail is arranged on one of the intermediate plate and the corresponding bearing plate, and the sliding block is arranged on the other one of the intermediate plate and the corresponding bearing plate.

[0017] Preferably, the side edge of each bearing plate is provided with a matching hole, a bearing is arranged in the matching hole, and each eccentric wheel is rotatably arranged in the corresponding bearing.

[0018] Preferably, the structures of the upper and lower brush plates are matched with the structures of the upper die and the lower die of the plastic packaging mold respectively.

[0019] Preferably, the air blowing assembly comprises a high-pressure gas system, an air blowing pipe, a nozzle and a control valve, the nozzle is arranged in the corresponding air blowing hole, the nozzle is communicated with the high-pressure gas system through the air blowing pipe, and the control valve is arranged on the air blowing pipe.

[0020] Preferably, the air sucking assembly comprises a vacuum system, an air sucking pipe and a filter, the air sucking pipe is communicated with each dust collection cavity, and the filter is arranged between the air sucking pipe and the vacuum system.

[0021] Preferably, the air sucking pipe comprises an air sucking main pipe and a plurality of air sucking branch pipes; the air sucking assembly further comprises a converging box, the converging box has a gas outlet and a plurality of gas inlets, the gas outlet is communicated with the vacuum system through the air sucking main pipe, the filter is arranged on the air sucking main pipe, and the plurality of gas inlets are respectively communicated with the corresponding dust collection cavities through the air sucking branch pipes.

[0022] Preferably, the bearing plate is provided with a connecting cavity, and the connecting cavity is respectively communicated with the corresponding air sucking pipe and the corresponding dust collection cavity.

[0023] Preferably, the cleaning device for the semiconductor plastic packaging mold further comprises a mounting assembly, the mounting assembly comprises a mounting frame, a linear movement module, a moving frame and a lifting module, the mounting frame is used to be mounted on the plastic packaging mold, the linear movement module is arranged on the mounting frame in the horizontal direction, the moving frame is movably arranged on the linear movement module, the lifting module is arranged on the moving frame in the vertical direction, and the supporting frame is movably arranged on the lifting module.

[0024] According to a second aspect of the present application, a control method of the cleaning device for the semiconductor plastic packaging mold is provided, the control method comprises:

[0025] S1: moving the cleaning device into the plastic packaging mold, so that the upper and lower brush plates form a relatively sealed environment with the upper die and the lower die of the plastic packaging mold respectively.

[0026] S2: Turn on the air suction assembly, air blowing assembly and motor, drive the rotating shaft to rotate by the motor, the two eccentric wheels on the rotating shaft drive the two bearing plates and brush plates on the two sides to swing, to clean the residues on the surface of the plastic packaging mold, at the same time, the air blowing assembly blows the residues through each air blowing hole, and the air suction assembly sucks the blown residues from each air suction hole and each dust suction cavity.

[0027] S3: After reaching the set cleaning time, remove the cleaning device from the plastic packaging mold, and turn off the motor, air blowing assembly and air suction assembly.

[0028] Compared with the prior art, the beneficial effects of the present application are:

[0029] In the cleaning device for the semiconductor plastic packaging mold, the driving assembly and the executing assembly cooperate, the rotating shaft can drive the upper and lower brush plates to swing when the motor drives the rotating shaft to rotate, breaking through the single trajectory limitation, realizing full coverage cleaning of the plastic packaging mold cavity, eliminating the cleaning dead angle; the brush plate and the plastic packaging mold form a relatively sealed environment, the executing assembly, the driving assembly, the air blowing assembly and the air suction assembly work cooperatively, which not only avoids residue dispersion pollution of the environment, but also guarantees the vacuum degree during air suction, improves the residue capture efficiency, thereby greatly improving the cleaning effect and efficiency, guaranteeing the size precision and cleanliness of the subsequent packaging products, maintaining the stable operation of the mold, and adapting to the high-precision semiconductor plastic packaging process demand.

[0030] The control method of the cleaning device for the semiconductor plastic packaging mold can greatly improve the cleaning effect and efficiency, guarantee the size precision and cleanliness of the subsequent packaging products, maintain the stable operation of the mold, and adapt to the high-precision semiconductor plastic packaging process demand. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a structural schematic view of a cleaning device for a semiconductor plastic packaging mold.

[0032] Figure 2 It is a sectional view of a cleaning device for a semiconductor plastic packaging mold.

[0033] Figure 3 It is Figure 2 It is a structural enlarged view of position A in the middle.

[0034] Figure 4 It is a sectional view of an executing assembly in a cleaning device for a semiconductor plastic packaging mold.

[0035] Figure 5 It is a split structural schematic view of part of devices in the executing assembly.

[0036] Figure 6 It is a structural schematic view of an air blowing assembly in a cleaning device for a semiconductor plastic packaging mold.

[0037] Figure 7 A structure diagram of an air suction assembly of a cleaning device for a semiconductor plastic encapsulation mold.

[0038] Figure 8 A structure diagram of another cleaning device for a semiconductor plastic encapsulation mold.

[0039] In the figure, 10 is a support frame, 20 is an execution assembly, 21 is an intermediate plate, 22 is a sliding fitting module, 221 is a sliding rail, 222 is a sliding block, 23 is a bearing plate, 231 is a fitting hole, 232 is a bearing, 233 is a connecting cavity, 24 is a brush plate, 241 is a blowing hole, 242 is an air suction hole, 25 is a dust suction cavity, 30 is a driving assembly, 31 is a motor, 32 is a rotating shaft, 33 is an eccentric wheel, 40 is a blowing assembly, 41 is a high-pressure gas system, 42 is a blowing pipe, 43 is a nozzle, 44 is a control valve, 50 is an air suction assembly, 51 is a vacuum system, 52 is an air suction pipe, 521 is a main air suction pipe, 522 is a branch air suction pipe, 53 is a filter, 54 is a converging box, 60 is a mounting assembly, 61 is a mounting frame, 62 is a linear movement module, 63 is a moving frame, and 64 is a lifting module. DETAILED DESCRIPTION

[0040] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the described embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort belong to the scope of protection of the present application. It can be understood that some technical means of the various embodiments described herein can be replaced or combined with each other without conflict.

[0041] In the description of the present application, if there are terms such as “first”, “second”, etc., they are only used to distinguish the described objects, and do not have any order or technical meaning. Therefore, the objects defined with “first”, “second”, etc. can be explicitly or implicitly included one or more of the objects. And “one” or “an” and the like similar words do not represent quantity limitation, but represent the existence of at least one, and “multiple” represents no less than two.

[0042] In the description of the present application, reference to "one embodiment" or "some embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrases "in one embodiment", "in some embodiments", "in other embodiments", "in additional embodiments" and so on, in various places in the specification are not necessarily all referring to the same embodiment, unless otherwise are specifically stated to be such.

[0043] According to a first aspect of the present application, there is provided a cleaning device for semiconductor plastic encapsulation mold, referring to Figure 1 In some embodiments, the cleaning device for semiconductor plastic encapsulation mold comprises a support frame 10, an execution assembly 20, a driving assembly 30, a blowing assembly 40 and a suction assembly 50. The support frame 10 is the installation base of each assembly, the driving assembly 30 is used to drive the execution assembly 20 to clean the residues in the plastic encapsulation mold, the blowing assembly 40 is used to blow up the residues, and the suction assembly 50 is used to suck up the residues.

[0044] Specifically, referring to Figure 1 , Figure 2 and Figure 3 , the support frame 10 is a hollow frame structure, and the execution assembly 20 is arranged inside the support frame 10. The execution assembly 20 comprises a middle plate 21, a sliding fitting module 22, a bearing plate 23 and a brush plate 24 arranged in sequence along the direction away from the middle plate 21 on the upper and lower sides of the middle plate 21 respectively. The sliding fitting module 22 on the upper side of the middle plate 21 is arranged along a first direction, and the sliding fitting module 22 on the lower side of the middle plate 21 is arranged along a second direction. The middle plate 21 and the bearing plate 23 on the upper side can slide relative to each other in the first direction, and the middle plate 21 and the bearing plate 23 on the lower side can slide relative to each other in the second direction.

[0045] Referring to Figure 4 , the brush plate 24 and the corresponding bearing plate 23 are provided with a dust collection cavity 25, the brush plate 24 is provided with a plurality of blowing holes 241 and a plurality of suction holes 242, and each suction hole 242 is in communication with the corresponding dust collection cavity 25.

[0046] Referring to Figure 2 and Figure 3The driving assembly 30 comprises a motor 31, a rotating shaft 32 and two eccentric wheels 33. The motor 31 is arranged on the support frame 10, the rotating shaft 32 is arranged on the support frame 10 in the vertical direction, and the motor 31 is drivingly connected to the rotating shaft 32. The two eccentric wheels 33 are arranged on the rotating shaft 32 at intervals, the rotation center axes of the two eccentric wheels 33 coincide with the center axis of the rotating shaft 32, and the geometric center axes of the two eccentric wheels 33 are respectively parallel to the center axis of the rotating shaft 32, and the two eccentric wheels 33 are respectively connected to the two side bearing plates 23 in a matched mode. When the motor 31 drives the rotating shaft 32 to rotate, the two eccentric wheels 33 rotate with the rotating shaft 32, and the upper eccentric wheel 33 drives the upper bearing plate 23 and the upper brush plate 24 to swing, and the lower eccentric wheel 33 drives the lower bearing plate 23 and the lower brush plate 24 to swing. At the same time, the middle plate 21 and the two side bearing plates 23 are respectively formed in a sliding fit through the corresponding sliding fit modules 22, so as to ensure the overall operation reliability and stability of the device.

[0047] The air blowing assembly 40 is communicated with each air blowing hole 241.

[0048] The air suction assembly 50 is communicated with each dust suction cavity 25.

[0049] During the cleaning process, the upper and lower brush plates 24 form a relatively sealed environment with the upper die and the lower die of the plastic packaging mold respectively, the motor 31 drives the rotating shaft 32 to rotate, and the two eccentric wheels 33 on the rotating shaft 32 drive the two side bearing plates 23 and the brush plates 24 to swing, so as to clean the residues on the surface of the plastic packaging mold. At the same time, the air blowing assembly 40 blows up the residues through each air blowing hole 241, and the air suction assembly 50 sucks up the blown-up residues from each air suction hole 242 and each dust suction cavity 25.

[0050] In the cleaning device for the semiconductor plastic packaging mold, the driving assembly 30 cooperates with the execution assembly 20, the motor 31 drives the rotating shaft 32 to rotate, and the upper and lower brush plates 24 can be driven to swing, which breaks through the limitation of a single track, realizes omnibearing cleaning of the plastic packaging mold cavity, eliminates the cleaning dead angle, forms a relatively sealed environment between the brush plate 24 and the plastic packaging mold, and the execution assembly 20, the driving assembly 30, the air blowing assembly 40 and the air suction assembly 50 work cooperatively, which not only avoids residue dispersion and environmental pollution, but also guarantees the vacuum degree during air suction, improves the residue capture efficiency, greatly improves the cleaning effect and efficiency, guarantees the size precision and cleanliness of the subsequent packaging product, maintains the stable operation of the mold, and meets the high-precision semiconductor plastic packaging process demand.

[0051] In some preferred embodiments, the sliding fit module comprises a slidable sliding rail and a sliding block. The sliding rail is arranged on one of the middle plate and the corresponding bearing plate, and the sliding block is arranged on the other one of the middle plate and the corresponding bearing plate. Figure 5In an embodiment, each sliding fitting module 22 comprises a slidable fitting sliding rail 221 and a sliding block 222, the bottom of the upper carrier plate 23 is provided with the sliding rail 221 along a first direction, and the top of the middle plate 21 is provided with the sliding block 222 matching the sliding rail 221; the top of the lower carrier plate 23 is provided with a sliding rail along a second direction, and the bottom of the middle plate 21 is provided with a sliding block matching the sliding rail. However, the present application is not limited thereto, and in other embodiments, the sliding fitting module can also adopt other reasonable structural designs.

[0052] With reference to Figure 3 and Figure 5 In some preferred embodiments, the side edge (the side close to the driving assembly 30) of each carrier plate 23 is provided with a matching hole 231, a bearing 232 is arranged in the matching hole 231, and each eccentric wheel 33 is rotatably arranged in the corresponding bearing 232, so as to ensure the stability of the eccentric wheel 33 during rotation.

[0053] In some preferred embodiments, the structures of the brush plates 24 on the upper and lower sides are respectively matched with the structures of the upper die and the lower die of the plastic packaging mold. Further, the brush plates 24 on the two sides can respectively adopt an integral plate structure, or can be respectively formed by splicing different sub-plate blocks, so as to better match the structures of the upper die and the lower die of the plastic packaging mold. In addition, the height and distribution density of the brushes on the brush plates 24 can be matched and designed according to the structures of the upper die and the lower die, so as to ensure that the brush plates 24 on the upper and lower sides respectively form a relatively sealed environment with the upper die and the lower die of the plastic packaging mold. Figure 2 In an embodiment, the brush plates on the two sides are respectively formed by splicing different sub-plate blocks, and the brush density of the edge of each sub-plate block is greater than that of the inner side.

[0054] Further, each air blowing hole 241 is arranged at a middle position of the corresponding brush plate 24, and each air suction hole 242 is arranged around the corresponding air blowing hole 241, so as to improve the capture efficiency of the air suction assembly 50 on the residues in the relatively sealed environment, and achieve a better cleaning effect.

[0055] With reference to Figure 2 , Figure 4 and Figure 6 In some preferred embodiments, the air blowing assembly 40 comprises a high-pressure gas system 41, an air blowing pipe 42, a nozzle 43, and a control valve 44, the nozzle 43 is arranged in the corresponding air blowing hole 241, the nozzle 43 is in communication with the high-pressure gas system 41 through the air blowing pipe 42, and the control valve 44 is arranged on the air blowing pipe 42. During the cleaning process, after the control valve 44 is opened, the high-pressure gas generated by the high-pressure gas system 41 is delivered to each nozzle 43 through the air blowing pipe 42, and each nozzle 43 blows out the high-pressure gas from each air blowing hole 241, so as to blow up the residues, thereby facilitating the air suction assembly 50 to suck and remove the residues.

[0056] Further, referring to Figure 2 and Figure 5 , the intermediate plate 21 is provided as a hollow frame structure, the sliding fitting module 22 is arranged at the edge of the intermediate plate 21, and the internal space of the intermediate plate 21 can be used for installing the nozzle 43 and the air blowing pipe 42 wiring, thereby improving the integration of the device and reducing the volume of the device.

[0057] Referring to Figure 2 and Figure 7 , the air suction assembly 50 includes a vacuum system 51, an air suction pipe 52, and a filter 53. The air suction pipe 52 is in communication with each dust suction cavity 25, and the filter 53 is arranged between the air suction pipe 52 and the vacuum system 51. The vacuum system 51 can be a vacuum pump or the like. When the vacuum system 51 is turned on, the residues between the cleaning device and the plastic packaging mold can be sucked out of each air suction hole 242 and each dust suction cavity 25. The filter 53 can filter the residues in the air suction pipe 52 for subsequent processing.

[0058] Referring to Figure 2 and Figure 7 , in some preferred embodiments, the air suction pipe 52 includes an air suction main pipe 521 and a plurality of air suction branch pipes 522. The air suction assembly 50 further includes a converging box 54 having an air outlet and a plurality of air inlets. The air outlet is in communication with the vacuum system 51 through the air suction main pipe 521, and the filter 53 is arranged on the air suction main pipe 521. The plurality of air inlets are respectively in communication with the corresponding dust suction cavities 25 through the air suction branch pipes 522.

[0059] Referring to Figure 4 , the connecting cavity 233 is arranged on the side of the bearing plate 23 close to the driving assembly 30, which facilitates the installation and connection of the air suction pipe 52 and helps to improve the integration of the device.

[0060] Referring to Figure 8 , in other embodiments, the cleaning device for the semiconductor plastic packaging mold further includes a mounting assembly 60. The mounting assembly 60 includes a mounting frame 61, a linear movement module 62, a moving frame 63, and a lifting module 64. The mounting frame 61 is used to be mounted on the plastic packaging mold. The linear movement module 62 is arranged on the mounting frame 61 in the horizontal direction. The moving frame 63 is movably arranged on the linear movement module 62. The lifting module 64 is arranged on the moving frame 63 in the vertical direction. The support frame 10 is movably arranged on the lifting module 64. In the cleaning operation, the linear movement module 62 can drive the moving frame 63, the lifting module 64, and the support frame 10 to move as a whole in the horizontal direction, so that the execution assembly 20 enters or exits the plastic packaging mold. The lifting module 64 can drive the support frame 10 to move up and down, so that each brush plate 24 better adheres to the upper mold and the lower mold of the plastic packaging mold and forms a relatively sealed environment.

[0061] According to a second aspect of the present application, a control method of the cleaning device for a semiconductor plastic encapsulation mold is provided, which comprises:

[0062] S1: moving the cleaning device into the plastic encapsulation mold, so that the upper and lower brush plates 24 form a relatively sealed environment between the upper and lower molds of the plastic encapsulation mold.

[0063] This step can build a relatively closed cleaning area to avoid the escape of residues during cleaning, prevent pollution of the production environment and surrounding equipment. At the same time, the relatively sealed environment can reduce the air leakage of the air blowing assembly 40 and the suction loss of the air suction assembly 50, provide a stable air flow field for the subsequent operation of blowing up and sucking off the residues, and improve the effectiveness of the cleaning operation.

[0064] S2: turning on the air suction assembly 50, the air blowing assembly 40 and the motor 31, driving the rotating shaft 32 to rotate by the motor 31, and driving the two eccentric wheels 33 on the rotating shaft 32 to swing the two bearing plates 23 and the brush plates 24 on the two sides, so as to clean the residues on the surface of the plastic encapsulation mold. At the same time, the air blowing assembly 40 blows up the residues through the air blowing holes 241, and the air suction assembly 50 sucks off the blown-up residues from the air suction holes 242 and the dust suction cavities 25.

[0065] Compared with the one-way motion track of the roller brush in the prior art, the motor 31 drives the rotating shaft 32 to rotate, and then the eccentric wheels 33 drive the brush plates 24 to swing, which can increase the contact angle and coverage of the brush with the mold surface, efficiently remove the residues, dust and other impurities in the mold surface, parting surface and corner gap, and improve the thoroughness of cleaning. At the same time, the air blowing assembly 40 blows up the stubborn residues adhered to the mold surface through the air blowing holes 241, breaks the adhesion between the residues and the mold; the air suction assembly 50 synchronously sucks off the blown-up residues through the air suction holes 242 and the dust suction cavities 25, avoids the secondary settlement and adhesion of the residues on the mold surface, realizes integrated cleaning, and greatly improves the cleaning efficiency.

[0066] S3: after reaching the set cleaning time, moving the cleaning device out of the plastic encapsulation mold, and turning off the motor 31, the air blowing assembly 40 and the air suction assembly 50. The cleaning time can be reasonably set according to the actual situation, for example, 30 seconds, 1 minute, etc. The motor 31, the air blowing assembly 40 and the air suction assembly 50 are sequentially turned off in order. When the motor 31 and the air blowing assembly 40 stop working, there may be suspended residues that are not completely sucked off in the cleaning space, and residues adhered to the inner wall of the brush plate 24 and the dust suction cavity 25. The air suction assembly 50 is delayed to be turned off, which can suck away these residual impurities through the continuous negative pressure suction, ensure that the mold cleanliness meets the standard, and ensure the thoroughness of cleaning.

[0067] The control method of the cleaning device for the semiconductor plastic encapsulation mold of the application can greatly improve the cleaning effect and efficiency, guarantee the size precision and cleanliness of the subsequent packaging products, maintain the stable operation of the mold, and adapt to the high-precision semiconductor plastic encapsulation process requirements.

[0068] The application has been described by the above related embodiments, however, the above embodiments are only examples for implementing the application. It must be pointed out that the disclosed embodiments do not limit the scope of the application. On the contrary, changes and modifications made without departing from the spirit and scope of the application are within the scope of the patent protection of the application.

Claims

1. A cleaning device for semiconductor molding compounds, characterized in that: The cleaning device for semiconductor molding dies includes a support frame, an execution component, a drive component, an air blowing component, and an air suction component; The execution component is located inside the support frame. The execution component includes a middle plate, and sliding engagement modules, a support plate, and a brush plate arranged sequentially on the upper and lower sides of the middle plate away from the middle plate. The sliding engagement modules on the upper side of the middle plate are arranged in a first direction, and the sliding engagement modules on the lower side of the middle plate are arranged in a second direction. The middle plate and the upper support plate are slidably engaged relative to each other in the first direction, and the middle plate and the lower support plate are slidably engaged relative to each other in the second direction. A dust collection chamber is provided between the brush plate and the corresponding support plate. The brush plate is provided with a plurality of air blowing holes and a plurality of air suction holes, and each air suction hole is connected to the corresponding dust collection chamber. The drive assembly includes a motor, a rotating shaft, and two eccentric wheels. The motor is mounted on the support frame, and the rotating shaft is mounted vertically on the support frame. The motor drives the rotating shaft. The two eccentric wheels are spaced apart on the rotating shaft, and the geometric center axes of the two eccentric wheels are parallel to the center axis of the rotating shaft. The two eccentric wheels are respectively connected to the bearing plates on both sides. The air blowing assembly is connected to each air blowing hole; The air intake assembly is connected to each dust collection chamber; During the cleaning process, the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively. The motor drives the rotating shaft to rotate, and the two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing, so as to clean the residue on the surface of the molding die. At the same time, the blowing assembly blows the residue through each blowing hole, and the suction assembly sucks the blown residue from each suction hole and each suction chamber.

2. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The sliding engagement module includes a sliding rail and a slider that can be slidably engaged. The sliding rail is disposed on one of the intermediate plate and the corresponding support plate, and the slider is disposed on the other of the intermediate plate and the corresponding support plate.

3. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: Each bearing plate has a mating hole on its side, and a bearing is installed in the mating hole. Each eccentric wheel is rotatably installed in the corresponding bearing.

4. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The structure of the brush plates on the top and bottom sides is matched with the structure of the upper and lower molds of the plastic sealing mold, respectively.

5. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The air blowing assembly includes a high-pressure gas system, an air blowing pipe, a nozzle, and a control valve. The nozzle is disposed in a corresponding air blowing hole. The nozzle is connected to the high-pressure gas system through the air blowing pipe. The control valve is disposed on the air blowing pipe.

6. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The suction assembly includes a vacuum system, a suction pipe, and a filter. The suction pipe is connected to each dust collection chamber, and the filter is located between the suction pipe and the vacuum system.

7. The cleaning apparatus for semiconductor molding compounds as described in claim 6, characterized in that: The suction pipe includes a main suction pipe and several suction branch pipes; the suction assembly also includes a manifold box, which has an air outlet and several air inlets. The air outlet is connected to the vacuum system through the main suction pipe. The filter is located on the main suction pipe, and the several air inlets are connected to the corresponding dust collection chambers through the respective suction branch pipes.

8. The cleaning apparatus for semiconductor molding compounds as described in claim 6, characterized in that: The support plate is provided with a connecting cavity, which is connected to the corresponding air suction pipe and the corresponding dust suction chamber respectively.

9. The cleaning apparatus for semiconductor molding compounds as described in claim 1, characterized in that: The cleaning device for semiconductor molding compounds further includes a mounting assembly, which includes a mounting frame, a linear motion module, a moving frame, and a lifting module. The mounting frame is used to mount the molding compound onto the molding compound. The linear motion module is horizontally mounted on the mounting frame. The moving frame is movably mounted on the linear motion module. The lifting module is vertically mounted on the moving frame. The support frame is movably mounted on the lifting module.

10. A control method for a cleaning apparatus for semiconductor molding compounds as described in any one of claims 1-9, characterized in that: The control method includes: S1: Move the cleaning device into the molding die so that the brush plates on the upper and lower sides form a relatively sealed environment with the upper and lower molds of the molding die, respectively. S2: Turn on the suction component, the blowing component and the motor. The motor drives the rotating shaft to rotate. The two eccentric wheels on the rotating shaft drive the bearing plates and brush plates on both sides to swing to clean the residue on the surface of the plastic sealing mold. At the same time, the blowing component blows the residue through each blowing hole, and the suction component sucks the blown residue out from each suction hole and each dust collection chamber. S3: After the set cleaning time is reached, remove the cleaning device from the plastic seal mold and turn off the motor, blowing assembly and suction assembly.

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