Airtight packaging photoelectric transceiver module

Abstract

The invention discloses an air-tight packaging photoelectric transceiver module, which comprises: a housing, which comprises a shell and a ceramic substrate, and in which a mounting space is formed; the ceramic substrate comprises an elastic sheet bonding pad and a BGA (Ball Grid Array) solder ball; the electric connector is fixedly connected with the shell, the electric connector is provided with a plurality of elastic sheets, and the elastic sheets are in contact connection with the elastic sheet bonding pads so as to realize transmission of electric signals; the PCB is located in the installation space, the PCB is provided with a wire bonding pad, and the wire bonding pad is welded and fixed with the BGA solder balls; the airtight optical fiber assembly is fixedly connected with the PCB; the optical end face of the airtight optical fiber assembly is in active coupling with an optical chip on the PCB. According to the optical module, airtight packaging of the optical module is achieved through cooperation of the ceramic substrate and the shell, 24-channel photoelectric transmission is achieved, the high transmission rate of 25 Gbps is achieved through a single channel, and meanwhile the optical module is smaller in packaging size and weight and lower in energy consumption; and high quality reliability of the optical module is ensured.

Description

Technical Field

[0001] This invention relates to the technical field of optical modules, and more specifically to a hermetically sealed optoelectronic transceiver module. Background Technology

[0002] Currently, optical modules have large package sizes and lack fully hermetically sealed metal packaging, making them unsuitable for harsh working environments. Military optical modules operate in even harsher environments, including extreme high and low temperatures, salt spray, mold, and radiation-resistant conditions found in aerospace applications. These requirements necessitate higher quality and reliability, placing increasingly stringent demands on their structural design.

[0003] In summary, there is a need to design an hermetically sealed optoelectronic transceiver module to solve the aforementioned problems in the existing technology. Summary of the Invention

[0004] To address the problems in the prior art, the present invention provides a hermetically sealed optoelectronic transceiver module, which solves the problem of unreliable packaging in existing optical modules.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A hermetically sealed optoelectronic transceiver module, comprising: The housing includes a shell and a ceramic substrate, wherein the shell forms a mounting space; the ceramic substrate is fixed in the mounting space by solder pads; the ceramic substrate includes spring pads and BGA solder balls; An electrical connector is fixedly connected to the housing. The electrical connector is provided with a plurality of spring contacts, which are in contact with the spring contact pads to realize the transmission of electrical signals. A PCB is located within the mounting space. The PCB is provided with wire bonding pads, which are soldered and fixed to the BGA solder balls. An airtight fiber optic assembly is inserted into the housing and is fixedly connected to the PCB; the optical end face of the airtight fiber optic assembly is actively coupled to the optical chip on the PCB.

[0006] In some embodiments of the present invention, the bottom plate of the housing includes a cutout portion and a mounting portion; the ceramic substrate is correspondingly disposed with the cutout portion; the spring pad is exposed through the cutout portion on the bottom plate and connected to the spring of the electrical connector; the mounting portion is fixedly connected to the back of the PCB, and the wire bonding pad is disposed on the back of the PCB to be soldered and fixed to the BGA solder balls.

[0007] In some embodiments of the present invention, the hollow portion is located in the middle of the base plate, and the mounting portion is disposed on both sides of the hollow portion along the connection direction of the airtight optical fiber assembly; the height of the mounting portion is greater than the thickness of the hollow portion.

[0008] In some embodiments of the present invention, the outer periphery of the hollow portion is a ceramic welding surface, the outer periphery surface of the spring pad is a first welding surface, and the ceramic welding surface is welded and fixed to the first welding surface by a first solder sheet; the top surface of the side wall of the housing is the housing welding surface, and the housing welding surface is welded and fixed to the cover plate by a second solder sheet.

[0009] In some embodiments of the present invention, positioning portions are provided on both sides of the hollow portion; the positioning portions extend in a direction away from the ceramic substrate; the positioning portions include positioning posts and positioning bosses, wherein the positioning posts are disposed at the free end of the positioning portions, the positioning bosses are fixedly connected to the hollow portion, and the positioning bosses cooperate with the positioning groove of the electrical connector for positioning the electrical connector.

[0010] In some embodiments of the present invention, the housing structure further includes a tail tube, one end of which is fixed to one side of the housing by a third solder piece, and the other end of which is a fiber optic outlet.

[0011] In some embodiments of the present invention, the top of the tail tube is provided with a groove for filling solder.

[0012] In some embodiments of the present invention, the side wall of the housing is provided with a tail tube welding surface, and the shape of the third solder sheet is adapted to the tail tube welding surface; both the third solder sheet and the tail tube welding surface are U-shaped structures.

[0013] In some embodiments of the present invention, the outer shell further includes a sealing ring, which is fixedly connected to the shell by a second solder piece; The sealing ring includes a second welding surface and a third welding surface, and the top of the tail tube is also provided with a fourth welding surface. The second welding surface is welded and fixed to the shell by the second solder sheet; the third welding surface is welded and fixed to the fourth welding surface by the second solder sheet.

[0014] In some embodiments of the present invention, the PCB further includes a support pad and an adhesive marking; the support pad is used to fix the soldering frame, the soldering frame and the PCB form a first support cavity, the adhesive marking is used to fix the pad, the pad and the PCB form a second support cavity, the first support cavity and the second support cavity are respectively fixed with the fixing groove of the airtight optical fiber assembly to fix the optical path.

[0015] The technical solution of the present invention has the following technical effects compared with the prior art: This invention achieves hermetically sealed packaging of the optical module by using a ceramic substrate and a housing, enabling 24-channel optoelectronic transmission with a high transmission rate of 25Gbps per channel. It also features a smaller package size and weight, and lower power consumption. Furthermore, the optical module housing structure of this invention incorporates superior thermal design, electromagnetic interference shielding design, packaging process design, and optocoupler design, ensuring high quality and reliability of the optical module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of the hermetically sealed optoelectronic transceiver module shown in an embodiment of the present invention.

[0018] Figure 2 This is an exploded view of the hermetically sealed optoelectronic transceiver module shown in an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the overall structure of the outer shell as shown in an embodiment of the present invention.

[0020] Figure 4 This is an exploded view of the outer shell structure shown in an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the structure of the housing shown in an embodiment of the present invention. Figure 1 .

[0022] Figure 6 This is a schematic diagram of the structure of the housing shown in an embodiment of the present invention. Figure 2 .

[0023] Figure 7 This is a schematic diagram of the structure of the ceramic substrate shown in an embodiment of the present invention.

[0024] Figure 8 This is a schematic diagram of the sealing ring component shown in an embodiment of the present invention.

[0025] Figure 9 The schematic diagram of the PCB structure shown in the embodiment of the present invention is as follows. Figure 1 .

[0026] Figure 10The schematic diagram of the PCB structure shown in the embodiment of the present invention is as follows. Figure 2 .

[0027] Figure 11 This is a schematic diagram of the structure of the welding frame shown in an embodiment of the present invention.

[0028] Figure 12 This is a schematic diagram of the structure of the pad shown in an embodiment of the present invention.

[0029] Figure 13 This is a schematic diagram of the structure of the airtight optical fiber assembly shown in an embodiment of the present invention.

[0030] Reference numerals: 100, outer casing; 10, housing; 11, housing welding surface; 12, ceramic welding surface; 13, cutout; 14, mounting part; 15, positioning part; 16, tail tube welding surface; 17, threaded hole; 21, first solder sheet; 22, second solder sheet; 23, third solder sheet; 30, ceramic substrate; 31, spring pad; 32, first welding surface; 33, BGA solder ball; 40, sealing ring; 41, second welding surface; 42, third welding surface; 50, tail tube; 51, pigtail outlet; 52, groove; 53, fourth welding surface; 60, cover plate; 210. Electrical chip; 220. Optical chip; 300. Electrical connector; 310. Positioning groove; 410. First protective cover; 411. Positioning hole; 420. Second protective cover; 500. Hermetic fiber optic assembly; 510. Optical connector; 520. Sealing joint; 530. Optical fiber; 540. Fixing slot; 550. Optical end face; 600, PCB; 610, Support pad; 620, Adhesive label; 630, Surface mount label; 640, Wire bonding pad; 650, Mounting surface; 700, pigtail sheath; 800. Welding frame; 810. First support cavity; 820. Sixth welding surface; 900, pad; 910, second support cavity; 920, bonding surface. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0033] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, direct connections, or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] The following disclosure provides many different embodiments or examples for implementing different structures of the invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0037] Reference Figures 1-2 As shown, a hermetically sealed optoelectronic transceiver module includes: The housing 100 includes a housing 10 and a ceramic substrate 30, wherein the housing 10 forms an installation space; the ceramic substrate 30 is fixed in the installation space by solder pads; the ceramic substrate 30 includes spring pads 31 and BGA solder balls 33. An electrical connector 300 is fixedly connected to the housing 10. The electrical connector 300 is provided with a plurality of spring contacts, which are in contact with the spring contact pads 31 to realize the transmission of electrical signals. PCB600 is located within the mounting space. PCB600 is provided with wire bonding pads 640, which are soldered and fixed to BGA solder balls 33. An airtight fiber optic assembly 500 is inserted into the housing 10 and is fixedly connected to the PCB 600; the optical end face 550 of the airtight fiber optic assembly 500 is actively coupled to the optical chip 220 on the PCB 600.

[0038] In this embodiment, the ceramic substrate 30 and the housing 10 are hermetically sealed. At the same time, multiple pads are provided on the ceramic substrate 3030, which can be fixedly connected with the corresponding chip or electrical connector 300 to achieve communication, realizing 24-channel optoelectronic transmission, and a high transmission rate of 25Gbps per channel.

[0039] Furthermore, the ceramic substrate 30 and the housing 10 have similar coefficients of thermal expansion, which makes the optical module have a temperature range of -45℃ to 85℃, and can be used in special fields with harsh temperature environments.

[0040] In some embodiments of the present invention, reference is made to... Figure 3 As shown, this depicts the three-dimensional structure of the outer shell 100 from a top-down perspective. It should be noted that the description of the bottom and top surfaces is based solely on the perspective shown in the figure.

[0041] In some embodiments of the present invention, for the housing 10 structure, refer to Figure 3 As shown, the housing 10 is an upward-opening groove structure, specifically including a bottom plate and side walls. This groove structure forms an installation space for mounting the ceramic substrate 30 and the PCB600 board, etc.

[0042] In some embodiments of the present invention, reference is made to... Figure 4 and Figure 5 As shown, the bottom plate of the housing 1010 includes a cutout portion 13 and a mounting portion 14; the ceramic substrate 30 is correspondingly disposed with respect to the cutout portion 13; the spring pad 31 is exposed through the cutout portion 13 on the bottom plate and is connected to the spring of the electrical connector 300.

[0043] The mounting part 14 is fixedly connected to the back of the PCB 600, and the wire bonding pad 640 is fixed to the BGA solder ball 33 by being located on the back of the PCB 600.

[0044] For example, based on the actual dimensions of the ceramic substrate 30 and the PCB 600 board, the size of the cutout portion 13 is smaller than the size of the mounting portion 14.

[0045] In some embodiments of the present invention, reference continues to be made to... Figure 5 As shown, the hollowed-out portion 13 is located in the middle of the base plate, and the mounting portion 14 is provided on both sides of the hollowed-out portion 13 along the direction of the pigtail connection; the height of the mounting portion 14 is greater than the thickness of the hollowed-out portion 13.

[0046] For example, there are two mounting portions 14, located on either side of the cutout portion 13 along the length of the housing 100 structure. The mounting portions 14 are provided to accommodate a larger PCB 600. In other words, the cutout portion 13 for mounting the ceramic substrate 30 is positioned between the two mounting portions 14, thus not affecting the connection between the ceramic substrate 30 and the electrical connector 300, while also allowing the mounting space to accommodate a larger PCB 600.

[0047] In some embodiments of the present invention, Figure 5 For example, the outer periphery of the hollow portion 13 is a ceramic welding surface 12, which is located on the upper surface of the base plate and on the outer periphery of the hollow portion 13, and is used to connect with the ceramic substrate 30. Furthermore, a first welding surface 32 is provided on the outer periphery of the spring pad 31 of the ceramic substrate 30. The ceramic welding surface 12 is welded and fixed to the first welding surface 32 by a first solder sheet 21. In other words, the ceramic substrate 30 and the hollow portion 13 are welded and fixed by the first solder sheet 21, achieving a tight, airtight connection and a leakage rate not exceeding 5 × 10⁻⁶. -9 Pa*m 3 / s ensures the reliability of the optical module.

[0048] In some embodiments of the present invention, reference is made to... Figure 6 As shown, positioning portions 15 are provided on both sides of the hollow portion 13; the positioning portions 15 extend along a direction away from the ceramic substrate 30; the positioning portions 15 are positioned and fixed with the electrical connector 300.

[0049] For example, the positioning part 15 specifically includes a positioning post and a positioning boss, wherein the positioning boss is fixedly connected to the hollow part 13. In some other embodiments, the positioning boss and the hollow part 13 can be integrally formed. The positioning boss is used for positioning the electrical connector 300, ensuring that the spring contacts of the electrical connector 300 can be accurately connected to the ceramic pads. Specifically, the positioning boss cooperates with the positioning groove 310 of the electrical connector 300 for positioning the electrical connector 300; continuing to refer to... Figure 2 As shown, there are two positioning grooves 310, located on the short side of the electrical connector 300. To mate with the positioning boss, the positioning groove 310 has an arc-shaped groove structure. During the installation of the electrical connector 300, the sides of the positioning part 15, i.e., the sides of the hollow part 13, are fixed and sealed to the sides of the electrical connector 300 by applying adhesive through a gap, thereby fixing the electrical connector 300 to the housing 10.

[0050] The positioning post is set at the free end of the positioning part 15 for the installation and positioning of the optical module, ensuring that the spring contact of the optical module electrical connector 300 can be accurately connected to the customer's PCB pads.

[0051] In some embodiments of the present invention, reference is made to... Figure 6 As shown, a threaded hole 17 is provided at the top corner of the housing 10. This threaded hole 17 is used for the installation and fixation of the optical module; for example, there are four threaded holes 17. Specifically, during installation, the electrical connector 300 is located between the housing 100 and the customer's PCB. The housing 100 is fixedly connected to the customer's PCB through the threaded hole 17. At this time, the spring in the electrical connector 300 is pressed against the spring in the spring pad 34 of the ceramic substrate 30, thereby realizing the transmission of electrical signals.

[0052] In some embodiments of the present invention, reference is made to... Figure 2 As shown, the outer casing 100 also includes a first protective cover 410 located on the bottom side wall of the casing 10, and the first protective cover 410 is disposed opposite to the hollow portion 13.

[0053] Specifically, the first protective cover 410 is used to protect and fix the electrical connector 300. The first protective cover 410 has symmetrically provided positioning holes 411, the positions of which are opposite to the positioning posts. During the installation of the first protective cover 410, the positioning posts are inserted into the positioning holes 411, thereby completing the fixation of the first protective cover 410 to the housing 10.

[0054] In some embodiments of the present invention, reference is made to... Figure 3 and Figure 4As shown, the outer shell 100 structure also includes a tail tube 50. One end of the tail tube 50 is fixed to one side of the shell 10 by a third solder piece 23, and the other end is a fiber optic outlet 51. The fiber optic outlet 51 serves as the fiber optic outlet 51 of the optical module, and achieves an airtight seal with the fiber optic through solder.

[0055] by Figure 3 For example, the tailpipe 50 is fixed to the right side wall of the housing 10. Specifically, refer to... Figure 6 As shown, the right side wall of the housing 10 has an opening, which forms the welding surface 16 of the tail tube 50; the third solder piece 23 is adapted to the shape of the welding surface 16 of the tail tube 50; in this embodiment, both the third solder piece 23 and the welding surface 16 of the tail tube 50 are U-shaped structures, which can effectively achieve the fixation and airtightness of the housing 10 and the tail tube 50, and achieve a leakage rate of no more than 5×10. -9 Pa*m 3 / s ensures higher quality and reliability of the optical module.

[0056] In some embodiments of the present invention, the tail tube 50 is fixedly connected to the pigtail sheath 700, and the pigtail sheath 700 is sleeved over the airtight optical fiber assembly 500; the top of the tail tube 50 is provided with a groove 52, which is used to fill solder, and the sealing joint 520 of the outer shell 100 tail tube 50 and the airtight optical fiber assembly 500 are welded together by the solder, so as to achieve fixation and airtightness, and achieve a leakage rate of no more than 5×10. -9 Pa*m 3 / s ensures higher quality and reliability of the optical module.

[0057] In some embodiments of the present invention, the top surface of the side wall of the housing 10 is the welding surface of the housing 10, and the welding surface of the housing 10 is welded and fixed to the cover plate 60 by a second solder sheet 22. The cover plate 60 is welded and sealed to the bottom surface of the side wall of the housing 10 by laser welding around its perimeter.

[0058] In some embodiments of the present invention, reference is made to... Figure 4 As shown, the outer casing 100 also includes a sealing ring 40, which is fixedly connected to the casing 10 via a second solder piece 22; this achieves a fixed airtightness and ensures a leakage rate of no more than 5 × 10⁻⁶. -9 Pa*m 3 / s ensures the reliability of the optical module.

[0059] In some embodiments of the present invention, reference is made to... Figure 8 As shown, the sealing ring 40 includes a second welding surface 41 and a third welding surface 42. The second welding surface 41 is welded and fixed to the housing 10 by the second solder sheet 22; the third welding surface 42 is welded and fixed to the tail pipe 50 by the second solder sheet 22.

[0060] Specifically, the sealing ring 40 is adapted to the top surface shape of the housing 10, wherein, in order to match the structure of the tail tube 50, the third welding surface 42 for connecting with the tail tube 50 is lower than the second welding surface 41.

[0061] In some embodiments of the present invention, reference continues to be made to... Figure 4 As shown, the top of the tail tube 50 is also provided with a fourth welding surface 53; the fourth welding surface 53 and the groove 52 are located on the same plane, that is, both are located on the top surface of the tail tube 50.

[0062] The third welding surface 42 is welded and fixed to the fourth welding surface 53 via the second solder sheet 22, thereby welding the tail pipe 50 and the sealing ring 40 together to achieve fixation and airtightness, ensuring a leakage rate of no more than 5×10. -9 Pa*m 3 / s ensures higher quality and reliability of the optical module.

[0063] In some embodiments of the present invention, the first solder sheet 21, the second solder sheet 22 and the third solder sheet 23 can all be welded and fixed to each welding surface by laser welding.

[0064] In some embodiments of the present invention, for the ceramic substrate 30, refer to Figure 4 As shown, the BGA solder ball 33 is positioned close to the second solder pad 22, and the spring pad 31 is positioned close to the first solder pad 21.

[0065] In some embodiments of the present invention, reference is made to... Figure 7 As shown, this is a structural schematic diagram of the lower surface of the ceramic substrate 30, which is the side closest to the electrical connector 300. The spring pad 31 is located on the bottom surface of the ceramic substrate 30 and is designed and simulated using high-speed electrical signals to connect with the spring of the electrical connector 300.

[0066] The spring pad 31 is a periodic arrangement of springs with a diamond structure.

[0067] In some embodiments of the present invention, reference is made to... Figure 3 As shown, the BGA solder ball 33 is located on the top surface of the ceramic substrate 30. It is designed and simulated using high-speed electrical signals for connection to the PCB 600.

[0068] As mentioned above, the height of the mounting portion 14 is greater than the thickness of the cutout portion 13. That is, the distance from the upper surface of the mounting portion 14 to the top of the housing 10 is less than the distance from the ceramic welding surface 12 to the top of the housing 10, thereby providing clearance space for the connection between the BGA solder balls 33 in the ceramic substrate 30 and the PCB 600.

[0069] In some embodiments of the present invention, for PCB600, refer to Figure 9 As shown in the figure, the top surface structure of PCB 600 can be defined. The top surface is provided with multiple patch markers 630 and adhesive markers 620. The patch markers 630 can be used to attach and fix the optical chip 220 and the electrical chip 210. The adhesive markers 620 are used to fix the pad 900. PCB 600 also includes support pads 610, which are used to fix the soldering frame 800.

[0070] Reference Figure 11 As shown, a first supporting cavity 810 is formed between the welding frame 800 and the PCB 600. The first supporting cavity 810 is fixed in conjunction with the fixing groove 540 of the airtight optical fiber assembly 500 to fix the optical path.

[0071] Specifically, the welding frame 800 has a U-shaped structure, and its connection position with the PCB 600 is the sixth welding surface 820. The sixth welding surface 820 is welded and fixed to the support pad 610.

[0072] Reference Figure 12 As shown, a second supporting cavity 910 is formed between the pad 900 and the PCB 600. The second supporting cavity 910 is fixed in conjunction with the fixing groove 540 of the airtight optical fiber assembly 500 to fix the optical path. Specifically, the pad 900 has a U-shaped structure, and its connection with the PCB 600 is at the adhesive surface 920, which is fixed with the adhesive mark 620.

[0073] In some embodiments of the present invention, reference is made to... Figure 10 As shown, the back of PCB 600 has wire bonding pads 640, which are connected to BGA solder balls 33 on the ceramic substrate 30 via solder to achieve electrical signal connection. The traces on the ceramic substrate are simulated using high-speed signals to ensure a single channel can meet a transmission rate of 25Gbps.

[0074] The outer periphery of the wire bonding pad 640 is a mounting surface 650, which mates with the mounting part 14 of the housing 10. The two can be fixedly connected by dispensing glue or solder.

[0075] In some embodiments of the present invention, reference is made to... Figure 13 As shown, one end of the airtight optical fiber assembly 500 is an optical connector 510, which is used to connect the optical signal of the optical module; the other end is connected to the optical end face 550 after the optical fiber 530 is divided into multiple optical fiber bundles through the sealing joint 520. The optical end face 550 is precisely aligned with the optical chip 220 on the PCB 600 to perform active coupling, thereby completing the reception or transmission of optical signals.

[0076] In some embodiments of the present invention, reference is made to... Figure 2 As shown, the optical connector 510 is also provided with a second protective cover 420 on the outside. The second protective cover 420 is sleeved on the outside of the optical connector 510 to protect the optical connector 510.

[0077] The airtight fiber optic assembly 500 also includes a fixing groove 540. As described above, the fixing groove 540 is inserted into the first support cavity 810, and the two can be fixed by dispensing adhesive. In addition, the fixing groove 540 is snapped onto the pad 900, which realizes the fixation of the optical path and ensures the precise distance between the optical end face 550 and the optical chip 220.

[0078] The technical solution of the present invention has the following technical effects compared with the prior art: This invention discloses a hermetically sealed optoelectronic transceiver module, achieving hermetically sealed optical module packaging and enabling 24-channel optoelectronic transmission. A single channel achieves a high transmission rate of 25Gbps, a first in the industry. It also features a smaller package size and weight, and lower power consumption. This hermetically sealed optoelectronic transceiver module incorporates superior thermal design, electromagnetic interference shielding design, packaging process design, and optocoupler design, ensuring high quality and reliability. The hermetically sealed packaging achieves a leakage rate of no more than 5×10⁻⁶. -9 Pa*m 3 / s. The hermetically sealed photoelectric transceiver module of the present invention achieves a product temperature resistance range of -45℃ to 85℃, and can be applied in special fields with harsh temperature environments.

[0079] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0080] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A hermetically sealed optoelectronic transceiver module, characterized in that, include: The housing includes a shell and a ceramic substrate, wherein the shell forms a mounting space; the ceramic substrate is fixed in the mounting space by solder pads; the ceramic substrate includes spring pads and BGA solder balls; An electrical connector is fixedly connected to the housing. The electrical connector is provided with a plurality of spring contacts, which are in contact with the spring contact pads to realize the transmission of electrical signals. A PCB is located within the mounting space. The PCB is provided with wire bonding pads, which are soldered to the BGA solder balls. An airtight fiber optic assembly is inserted into the housing and is fixedly connected to the PCB; the optical end face of the airtight fiber optic assembly is actively coupled to the optical chip on the PCB.

2. The hermetically sealed optoelectronic transceiver module according to claim 1, characterized in that, The bottom plate of the housing includes a cutout portion and a mounting portion; the ceramic substrate is correspondingly disposed with the cutout portion; the spring pad is exposed through the cutout portion on the bottom plate and connected to the spring of the electrical connector; the mounting portion is fixedly connected to the back of the PCB, and the wire bonding pad is disposed on the back of the PCB to be soldered and fixed to the BGA solder balls.

3. The hermetically sealed optoelectronic transceiver module according to claim 2, characterized in that, The hollowed-out portion is located in the middle of the base plate, and the mounting portion is located on both sides of the hollowed-out portion along the connection direction of the airtight optical fiber assembly; the height of the mounting portion is greater than the thickness of the hollowed-out portion.

4. The hermetically sealed optoelectronic transceiver module according to claim 2, characterized in that, The outer periphery of the hollowed-out portion is a ceramic welding surface, and the outer periphery of the spring pad is a first welding surface. The ceramic welding surface is welded and fixed to the first welding surface by a first solder sheet. The top surface of the side wall of the shell is the shell welding surface, and the shell welding surface is welded and fixed to the cover plate by a second solder sheet.

5. A hermetically sealed optoelectronic transceiver module according to claim 2, characterized in that, Positioning portions are provided on both sides of the hollow portion; the positioning portions extend in a direction away from the ceramic substrate; the positioning portions include positioning posts and positioning bosses, wherein the positioning posts are provided at the free end of the positioning portions, the positioning bosses are fixedly connected to the hollow portion, and the positioning bosses cooperate with the positioning groove of the electrical connector for positioning the electrical connector.

6. The hermetically sealed optoelectronic transceiver module according to claim 1, characterized in that, The outer shell structure also includes a tail tube, one end of which is fixed to one side of the shell by a third solder piece, and the other end of which is a fiber optic outlet.

7. A hermetically sealed optoelectronic transceiver module according to claim 6, characterized in that, The top of the tail tube is provided with a groove for filling with solder.

8. A hermetically sealed optoelectronic transceiver module according to claim 6, characterized in that, The side wall of the housing is provided with a tail tube welding surface, and the shape of the third solder sheet is adapted to the tail tube welding surface; both the third solder sheet and the tail tube welding surface are U-shaped structures.

9. A hermetically sealed optoelectronic transceiver module according to claim 6, characterized in that, The outer casing also includes a sealing ring, which is fixedly connected to the casing by a second solder piece; The sealing ring includes a second welding surface and a third welding surface, and the top of the tail tube is also provided with a fourth welding surface. The second welding surface is welded and fixed to the shell by the second solder sheet; the third welding surface is welded and fixed to the fourth welding surface by the second solder sheet.

10. A hermetically sealed optoelectronic transceiver module according to claim 1, characterized in that, The PCB also includes support pads and bonding marks; the support pads are used to fix the welding frame, and a first support cavity is formed between the welding frame and the PCB; the bonding marks are used to fix the pad, and a second support cavity is formed between the pad and the PCB; the first support cavity and the second support cavity are respectively fixed with the fixing groove of the airtight optical fiber assembly to fix the optical path.

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