Temperature control device and semiconductor equipment

Abstract

The invention relates to the field of semiconductors, in particular to a temperature control device and semiconductor equipment. The temperature control device comprises a first-stage temperature control module, a second-stage temperature control module, a third-stage temperature control module and a fourth-stage temperature control module; the first-stage temperature control module, the second-stage temperature control module, the third-stage temperature control module and the fourth-stage temperature control module are connected in sequence, so that a temperature-controlled medium can flow through the first-stage temperature control module, the second-stage temperature control module, the third-stage temperature control module and the fourth-stage temperature control module in sequence; the first-stage temperature control module is used for cooling a temperature-controlled medium, so that the temperature of the cooled temperature-controlled medium is lower than a preset temperature; the second-stage temperature control module is used for performing primary heating on the cooled temperature-controlled medium, so that the temperature of the temperature-controlled medium subjected to primary heating is a preset temperature; the third-stage temperature control module is used for homogenizing the temperature-controlled medium subjected to primary heating; and the fourth-stage temperature control module is used for secondarily heating the homogenized temperature-controlled medium. The temperature control precision of the temperature-controlled medium is higher, and the temperature control requirement of the semiconductor equipment can be met.

Description

Technical Field

[0001] This application relates to the semiconductor field, and in particular to a temperature control device and semiconductor equipment. Background Technology

[0002] Temperature control of semiconductor equipment is one of the key factors in ensuring its performance stability and reliability. In existing technologies, compressor refrigeration is widely used in the temperature control systems of semiconductor equipment due to its high refrigeration efficiency and wide adjustment range. It indirectly controls the temperature by adjusting the flow rate or pressure of the heat exchange medium through electronic proportional valves.

[0003] This temperature control mechanism has significant limitations in semiconductor devices: (1) The temperature control accuracy of the compressor refrigeration system is limited by the adjustment capability of the electronic proportional valve and the response characteristics of the system itself, making it difficult to achieve stable mK-level temperature fluctuation control; (2) The mechanical vibration generated during compressor operation is transmitted to the semiconductor, and high-precision semiconductors are extremely sensitive to vibration. Even a small vibration can lead to a decrease in device performance or failure; (3) The compressor refrigeration system is complex, has a high failure rate, and has low overall system reliability. Therefore, within the framework of existing technologies, the temperature control system of semiconductor devices is difficult to meet the requirements of high temperature control accuracy, low vibration, and high reliability. Summary of the Invention

[0004] The purpose of this application is to provide a temperature control device and a semiconductor device for accurately controlling the temperature of the controlled medium, so as to meet the temperature control requirements of high-precision semiconductor devices.

[0005] This application provides a temperature control device, including a primary temperature control module, a secondary temperature control module, a tertiary temperature control module, and a quaternary temperature control module; The primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module are connected in sequence so that the temperature-controlled medium can flow through the primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module in sequence. The first-level temperature control module is used to cool the temperature-controlled medium so that the temperature of the cooled temperature-controlled medium is lower than the preset temperature; the second-level temperature control module is used to heat the cooled temperature-controlled medium once so that the temperature of the heated temperature-controlled medium is the preset temperature; the third-level temperature control module is used to homogenize the temperature-controlled medium after the first heating; and the fourth-level temperature control module is used to heat the homogenized temperature-controlled medium a second time.

[0006] In the above technical solution, the primary temperature control module further includes a heat exchanger, a first temperature sensor, a first feedback controller, and an electronically controlled valve; The temperature-controlled medium flows through the heat exchanger; the first temperature sensor is located at the outlet of the heat exchanger to detect the first real-time temperature of the temperature-controlled medium. The heat exchanger is provided with a flow pipe, through which the cooling medium enters the heat exchanger; the electrically controlled valve is installed on the flow pipe. The first temperature sensor is communicatively connected to the first feedback controller, which is communicatively connected to the electronically controlled valve. Based on the first real-time temperature, the first feedback controller controls the opening of the electronically controlled valve to adjust the flow rate of the cooling medium.

[0007] In the above technical solution, the heat exchanger is further described as a plate heat exchanger, a finned heat exchanger, or a shell-and-tube heat exchanger.

[0008] In the above technical solution, the temperature-controlled medium is further defined as a liquid medium or a gaseous medium.

[0009] In the above technical solution, the electrically controlled valve is further described as a three-way valve; the three-way valve is provided with a first inlet, a second inlet, and a manifold outlet; The flow pipe includes an inlet pipe and an outlet pipe; the inlet pipe includes a main pipe, a first branch pipe and a second branch pipe; the outlet end of the main pipe is connected to the inlet end of the first branch pipe and the inlet end of the second branch pipe; the outlet end of the first branch pipe is connected to the first inlet; the outlet end of the second branch pipe is connected to the heat exchanger; the inlet end of the outlet pipe is connected to the heat exchanger; and the outlet end of the outlet pipe is connected to the second inlet. One portion of the cooling medium flows sequentially through the main pipe, the first branch pipe, and the three-way valve, while another portion of the cooling medium flows sequentially through the main pipe, the second branch pipe, the heat exchanger, the liquid outlet pipe, and the three-way valve. Both portions of the cooling medium flow out from the manifold outlet.

[0010] In the above technical solution, the secondary temperature control module further includes a first heater, a second temperature sensor, and a second feedback controller; The inlet of the first heater is connected to the outlet of the heat exchanger so that the cooled temperature-controlled medium flows through the first heater; the second temperature sensor is located at the outlet of the first heater to detect the second real-time temperature of the temperature-controlled medium. The second temperature sensor is communicatively connected to the second feedback controller, which is communicatively connected to the first heater. Based on the second real-time temperature, the second feedback controller controls the output power of the first heater.

[0011] In the above technical solution, the three-stage temperature control module further includes a heat stabilizing tank, the inlet end of which is connected to the outlet end of the first heater.

[0012] In the above technical solution, the four-stage temperature control module further includes a second heater, a third temperature sensor, and a third feedback controller; The inlet of the second heater is connected to the outlet of the heat stabilizer, so that the homogenized temperature-controlled medium flows through the second heater; the third temperature sensor is located at the outlet of the second heater to detect the third real-time temperature of the temperature-controlled medium. The third temperature sensor is communicatively connected to the third feedback controller, which is communicatively connected to the second heater. Based on the third real-time temperature, the third feedback controller controls the output power of the second heater.

[0013] In the above technical solution, the first feedback controller, the second feedback controller, and the third feedback controller are all proportional-integral-derivative controllers.

[0014] This application also provides a semiconductor device, including the temperature control device described above.

[0015] Compared with the prior art, the beneficial effects of this application are as follows: The temperature control device provided in this application adopts a hierarchical, functional, and progressive temperature control architecture design. By setting up four-level temperature control modules, the stability of the temperature control of the controlled medium can reach the mK level, realizing higher precision temperature control of the controlled medium, thereby meeting the temperature control requirements of high-precision semiconductor equipment.

[0016] This application also provides a semiconductor device, including the temperature control device described in the above solution. Based on the above analysis, it is clear that the semiconductor device also possesses the aforementioned beneficial effects, which will not be elaborated upon further here. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the temperature control device provided in this application; Figure 2 This is a schematic diagram of the structure of the primary temperature control module provided in this application.

[0019] In the diagram: 1-Heat exchanger; 2-First temperature sensor; 3-First heater; 4-Second temperature sensor; 5-Heat stabilizer tank; 6-Second heater; 7-Third temperature sensor; 8-Three-way valve; 9-First feedback controller; 10-Second feedback controller; 11-Third feedback controller; 12-Main pipe; 13-First branch pipe; 14-Second branch pipe; 15-Outlet pipe. Detailed Implementation

[0020] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] Example 1 See Figure 1 and Figure 2 As shown, the temperature control device provided in this application includes a primary temperature control module, a secondary temperature control module, a tertiary temperature control module, and a quaternary temperature control module; the primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module are connected in sequence so that the temperature-controlled medium can flow through the primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module in sequence.

[0024] The first-level temperature control module is used to cool the controlled medium so that the temperature of the cooled medium is lower than the preset temperature; the second-level temperature control module is used to heat the cooled medium once so that the temperature of the heated medium is the preset temperature; the third-level temperature control module is used to homogenize the heated medium; and the fourth-level temperature control module is used to heat the homogenized medium a second time.

[0025] Specifically, this application achieves higher temperature control stability (reaching the mK level) through a four-level temperature control scheme. The key is that the scheme adopts a hierarchical, functional, and progressive temperature control architecture design, with each level having a clear technical division of labor and collaborative optimization mechanism.

[0026] The primary temperature control module is used for coarse cooling of the controlled medium, ensuring that the medium's temperature drops below the preset temperature. This means there is a difference ΔT between the target temperature controlled by the primary module and the system's preset temperature. This allows for upward adjustment by subsequent temperature control modules, enabling the temperature control device to establish a unidirectional adjustment path and achieving temperature control stability at the mK level. Furthermore, heating is easier to adjust precisely, quickly, and reversibly than cooling, allowing the subsequently heated controlled medium to approach the preset temperature more closely.

[0027] The secondary temperature control module is used to heat the cooled medium in one step. As the main heating module, the secondary temperature control module can use a high-power heater to quickly heat the medium to the preset temperature and achieve rapid response.

[0028] The three-stage temperature control module is used to homogenize the temperature-controlled medium after the first heating. It can "smooth out peaks and fill valleys" in temperature fluctuations, eliminate temperature fluctuations caused by the heating of the two-stage temperature control module, and thus output a more stable temperature field, providing high-quality input for the subsequent four-stage temperature control.

[0029] The four-stage temperature control module is used for secondary heating of the homogenized temperature-controlled medium, enabling fine-tuning of the temperature. The four-stage temperature control module can use a heater with lower power to adjust the final output temperature and suppress minor deviations.

[0030] The temperature control device provided in this application adopts a hierarchical, functional, and progressive temperature control architecture design. By setting up four-level temperature control modules, the stability of the temperature control of the controlled medium can reach the mK level, realizing higher precision temperature control of the controlled medium, thereby meeting the temperature control requirements of high-precision semiconductor equipment.

[0031] In this embodiment, the optional solution includes a primary temperature control module comprising a heat exchanger 1, a first temperature sensor 2, a first feedback controller 9, and an electrically controlled valve. The temperature-controlled medium flows through the heat exchanger 1. The first temperature sensor 2 is located at the outlet of the heat exchanger 1 to detect the first real-time temperature of the temperature-controlled medium. The heat exchanger 1 is provided with a flow pipe, through which the cooling medium enters the heat exchanger 1. The electrically controlled valve is installed in the flow pipe. The first temperature sensor 2 is communicatively connected to the first feedback controller 9, and the first feedback controller 9 is communicatively connected to the electrically controlled valve. Based on the first real-time temperature, the first feedback controller 9 controls the opening degree of the electrically controlled valve to adjust the flow rate of the cooling medium.

[0032] In this embodiment, by placing the first temperature sensor 2 at the outlet of the heat exchanger 1 and forming a closed-loop control system with the first feedback controller 9 and the electronically controlled valve, the flow rate of the cooling medium can be monitored and dynamically adjusted in real time, thereby precisely controlling the output temperature after the first-stage heat exchange. This design not only improves the response speed and adjustment accuracy of the refrigeration process but also avoids the vibration interference and reliability problems caused by traditional compressor refrigeration. It provides a high-quality temperature input foundation for subsequent multi-stage heating and temperature stabilization, and is one of the key technical prerequisites for achieving ultra-high temperature stability at the mK level.

[0033] In this embodiment, the heat exchanger 1 can be a plate heat exchanger, a finned heat exchanger, or a shell-and-tube heat exchanger.

[0034] Optionally, the temperature-controlled medium is a liquid medium or a gas medium.

[0035] In this embodiment, the type of heat exchanger 1 can be flexibly selected according to the actual operating conditions: when high heat exchange efficiency and compact structure are desired, plate heat exchangers are preferred. When the temperature-controlled medium is a gaseous medium, finned heat exchangers or shell-and-tube heat exchangers can be used. Finned heat exchangers can enhance the heat transfer of the extended surface, while in high-temperature and high-pressure environments, shell-and-tube heat exchangers are selected to ensure the safety and reliability of the system.

[0036] In the optional solutions of this embodiment, such as Figure 2 As shown, the electrically controlled valve is a three-way valve 8; the three-way valve 8 is provided with a first inlet, a second inlet, and a manifold outlet; the flow pipe includes an inlet pipe and an outlet pipe 15; the inlet pipe includes a main pipe 12, a first branch pipe 13, and a second branch pipe 14; the outlet end of the main pipe 12 is connected to the inlet end of the first branch pipe 13 and the inlet end of the second branch pipe 14; the outlet end of the first branch pipe 13 is connected to the first inlet; the outlet end of the second branch pipe 14 is connected to the heat exchanger 1; the inlet end of the outlet pipe 15 is connected to the heat exchanger 1; and the outlet end of the outlet pipe 15 is connected to the second inlet. A portion of the cooling medium flows sequentially through the main pipe 12, the first branch pipe 13, and the three-way valve 8, while another portion of the cooling medium flows sequentially through the main pipe 12, the second branch pipe 14, the heat exchanger 1, the outlet pipe 15, and the three-way valve 8. Both portions of the cooling medium flow out from the manifold outlet.

[0037] In this embodiment, an electrically controlled three-way valve 8 is installed on the inlet pipe, causing the cooling medium to be divided into two paths before entering the heat exchanger 1: one path returns directly through a bypass branch, and the other path flows through the heat exchanger 1 before merging back into the loop. The two cooling media are remixed within the three-way valve 8 and then output uniformly from the confluence outlet. By controlling the position or opening of the valve core inside the three-way valve 8, the flow ratio of the cooling medium entering from the first inlet (bypass path) and the second inlet (heat exchange path) can be adjusted, achieving on-demand distribution of the cooling medium flow. This satisfies the need for efficient heat dissipation while preventing overcooling, significantly improving the response speed and stability of temperature control. Furthermore, the system requires no additional components, has a simple structure, and high reliability, making it particularly suitable for temperature control devices with high requirements for energy efficiency, space, and control precision.

[0038] In an optional embodiment, the secondary temperature control module includes a first heater 3, a second temperature sensor 4, and a second feedback controller 10. The inlet of the first heater 3 is connected to the outlet of the heat exchanger 1 so that the cooled temperature-controlled medium flows through the first heater 3. The second temperature sensor 4 is located at the outlet of the first heater 3 to detect the second real-time temperature of the temperature-controlled medium. The second temperature sensor 4 is communicatively connected to the second feedback controller 10, which is also communicatively connected to the first heater 3. Based on the second real-time temperature, the second feedback controller 10 controls the output power of the first heater 3.

[0039] In this embodiment, a closed-loop heating control circuit for the temperature-controlled medium is formed by setting a first heater 3 on the outlet side of the heat exchanger 1 and configuring a second temperature sensor 4 and a second feedback controller 10. Specifically, the second temperature sensor 4 detects the temperature of the temperature-controlled medium in real time. When the temperature of the temperature-controlled medium is lower than the preset temperature, the second temperature sensor 4 transmits a signal to the second feedback controller 10. The second feedback controller 10 dynamically adjusts the duty cycle of the first heater 3 according to the measured real-time temperature, thereby controlling the output power of the first heater 3 so that the temperature of the temperature-controlled medium rises and stabilizes within the target range. This structure effectively solves the overcooling problem existing in traditional cooling systems, realizes temperature compensation after cooling, and significantly improves the accuracy, safety, and environmental adaptability of the temperature control system.

[0040] In an optional embodiment, the three-stage temperature control module includes a thermal stabilizing tank 5, the inlet of which is connected to the outlet of the first heater 3.

[0041] In this embodiment, the temperature-controlled medium, after being heated once, enters the thermal stabilization tank 5, where temperature homogenization and dynamic buffering are completed before being output to the four-stage temperature control module. The thermal stabilization tank 5 acts as a smoothing average filter, smoothing peaks and filling valleys in the temperature-controlled medium heated by the first heater 3, further improving the stability of the temperature-controlled medium. This effectively suppresses temperature fluctuations of the temperature-controlled medium after high-power heating, creating a relatively stable input for secondary heating and improving the control accuracy of secondary heating.

[0042] In this optional embodiment, the four-stage temperature control module includes a second heater 6, a third temperature sensor 7, and a third feedback controller 11. The inlet of the second heater 6 is connected to the outlet of the heat stabilizing tank 5 so that the homogenized temperature-controlled medium flows through the second heater 6. The third temperature sensor 7 is located at the outlet of the second heater 6 to detect the third real-time temperature of the temperature-controlled medium. The third temperature sensor 7 is communicatively connected to the third feedback controller 11, and the third feedback controller 11 is communicatively connected to the second heater 6. Based on the third real-time temperature, the third feedback controller 11 controls the output power of the second heater 6.

[0043] In this embodiment, a third temperature sensor 7 is placed at the outlet of the second heater 6 to detect the third real-time temperature of the temperature-controlled medium. The third feedback controller 11 dynamically adjusts the duty cycle of the second heater 6 based on the temperature signal to control the output power of the second heater 6, forming a closed-loop control at the end. This four-stage temperature control structure achieves final calibration of temperature deviation, effectively compensates for heat changes during transmission, and significantly improves the temperature accuracy and stability of the output temperature-controlled medium.

[0044] Example 2 The temperature control device in this second embodiment is an improvement on the above embodiments. The technical content disclosed in the above embodiments will not be described again, and the content disclosed in the above embodiments also belongs to the content disclosed in this second embodiment.

[0045] In the optional scheme of this embodiment, the first feedback controller 9, the second feedback controller 10 and the third feedback controller 11 are all proportional-integral-derivative controllers (PID controllers). PID controllers can achieve smooth, fast and stable dynamic adjustment, ensuring the stability and accuracy of the final output temperature of the controlled medium, and significantly improving the dynamic performance, anti-interference ability and engineering practicality of the system.

[0046] Optionally, the first feedback controller 9, the second feedback controller 10, and the third feedback controller 11 may be standard PID controllers, fuzzy PID controllers, or adaptive PID controllers.

[0047] Example 3 This application provides a semiconductor device in embodiment three, which includes the temperature control device of any of the above embodiments. Therefore, it has all the beneficial technical effects of the temperature control device of any of the above embodiments, which will not be repeated here.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In addition, those skilled in the art can understand that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are meant to be within the scope of this application and form different embodiments.

Claims

1. A temperature control device, characterized in that, It includes a primary temperature control module, a secondary temperature control module, a tertiary temperature control module, and a quaternary temperature control module; The primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module are connected in sequence so that the temperature-controlled medium can flow through the primary temperature control module, the secondary temperature control module, the tertiary temperature control module, and the quaternary temperature control module in sequence. The first-level temperature control module is used to cool the temperature-controlled medium so that the temperature of the cooled temperature-controlled medium is lower than the preset temperature; the second-level temperature control module is used to heat the cooled temperature-controlled medium once so that the temperature of the heated temperature-controlled medium is the preset temperature; the third-level temperature control module is used to homogenize the temperature-controlled medium after the first heating; and the fourth-level temperature control module is used to heat the homogenized temperature-controlled medium a second time.

2. The temperature control device according to claim 1, characterized in that, The primary temperature control module includes a heat exchanger, a first temperature sensor, a first feedback controller, and an electrically controlled valve; The temperature-controlled medium flows through the heat exchanger; the first temperature sensor is located at the outlet of the heat exchanger to detect the first real-time temperature of the temperature-controlled medium. The heat exchanger is provided with a flow pipe, through which the cooling medium enters the heat exchanger; the electrically controlled valve is installed on the flow pipe. The first temperature sensor is communicatively connected to the first feedback controller, which is communicatively connected to the electronically controlled valve. Based on the first real-time temperature, the first feedback controller controls the opening of the electronically controlled valve to adjust the flow rate of the cooling medium.

3. The temperature control device according to claim 2, characterized in that, The heat exchanger is a plate heat exchanger, a finned heat exchanger, or a shell-and-tube heat exchanger.

4. The temperature control device according to claim 3, characterized in that, The temperature-controlled medium is a liquid medium or a gaseous medium.

5. The temperature control device according to claim 2, characterized in that, The electrically controlled valve is a three-way valve; the three-way valve is provided with a first inlet, a second inlet, and a manifold outlet; The flow pipe includes an inlet pipe and an outlet pipe; the inlet pipe includes a main pipe, a first branch pipe and a second branch pipe; the outlet end of the main pipe is connected to the inlet end of the first branch pipe and the inlet end of the second branch pipe; the outlet end of the first branch pipe is connected to the first inlet; the outlet end of the second branch pipe is connected to the heat exchanger; the inlet end of the outlet pipe is connected to the heat exchanger; and the outlet end of the outlet pipe is connected to the second inlet. One portion of the cooling medium flows sequentially through the main pipe, the first branch pipe, and the three-way valve, while another portion of the cooling medium flows sequentially through the main pipe, the second branch pipe, the heat exchanger, the liquid outlet pipe, and the three-way valve. Both portions of the cooling medium flow out from the manifold outlet.

6. The temperature control device according to claim 2, characterized in that, The secondary temperature control module includes a first heater, a second temperature sensor, and a second feedback controller; The inlet of the first heater is connected to the outlet of the heat exchanger so that the cooled temperature-controlled medium flows through the first heater; the second temperature sensor is located at the outlet of the first heater to detect the second real-time temperature of the temperature-controlled medium. The second temperature sensor is communicatively connected to the second feedback controller, which is communicatively connected to the first heater. Based on the second real-time temperature, the second feedback controller controls the output power of the first heater.

7. The temperature control device according to claim 6, characterized in that, The three-stage temperature control module includes a heat stabilizing tank, the inlet of which is connected to the outlet of the first heater.

8. The temperature control device according to claim 7, characterized in that, The four-stage temperature control module includes a second heater, a third temperature sensor, and a third feedback controller. The inlet of the second heater is connected to the outlet of the heat stabilizer, so that the homogenized temperature-controlled medium flows through the second heater; the third temperature sensor is located at the outlet of the second heater to detect the third real-time temperature of the temperature-controlled medium. The third temperature sensor is communicatively connected to the third feedback controller, which is communicatively connected to the second heater. Based on the third real-time temperature, the third feedback controller controls the output power of the second heater.

9. The temperature control device according to claim 8, characterized in that, The first feedback controller, the second feedback controller, and the third feedback controller are all proportional-integral-derivative (PID) controllers.

10. A semiconductor device, characterized in that, Includes the temperature control device as described in any one of claims 1 to 9.

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