Space station heating furnace temperature field calculation method, device, equipment and medium

Abstract

The invention relates to a space station heating furnace temperature field calculation method, device and equipment and a medium, and relates to the technical field of thermal calculation, and the method comprises the steps: obtaining geometric models, thermophysical parameters and movement displacement conditions of a heating furnace and materials in the furnace, generating an initial calculation grid, determining a target calculation grid at the current time based on the movement displacement conditions, and calculating the temperature field of the heating furnace. The heating power of the heating furnace is determined through a PID control algorithm, the surface radiation angle coefficient is calculated through a semi-cube method according to the target calculation grid and the simulation temperature of the previous moment, so that the surface heat radiation flux is obtained, and finally new temperature field distribution is determined by combining a transient heat conduction equation. The method achieves the technical effects of accurately calculating the temperature field distribution of the heating furnace and the materials in the furnace, considering factors such as material movement and radiation heat exchange, and being more suitable for actual working conditions.

Description

Technical Field

[0001] This invention relates to the field of thermal calculation technology, and in particular to a method, apparatus, equipment and medium for calculating the temperature field of a space station heater. Background Technology

[0002] In the field of high-temperature furnace material heating experiments, temperature field calculations are crucial for the accuracy and reliability of the experiments. With the development of related technologies, research on the material heating process inside the furnace has become increasingly in-depth, and it has wide applications in various industries such as materials science and metallurgy.

[0003] Currently, the conventional approach to calculating the temperature field during the heating process of materials in a furnace mainly involves considering complex heat transfer processes such as thermal radiation, thermal convection, and thermal conduction. For example, this involves establishing heat conduction model equations to describe the internal heat conduction of the material and using the Stefan-Boltzmann law to calculate the surface thermal radiation flux.

[0004] However, existing methods for calculating the temperature field of heating furnaces only consider complex heat transfer processes such as thermal radiation, thermal convection, and thermal conduction, without coupling the calculation with the furnace temperature control system. Therefore, they cannot reproduce the temperature control process of the heating furnace. Furthermore, existing methods do not consider the impact of the moving heating process on thermal radiation, leading to significant deviations between the calculated results and actual conditions. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a method, apparatus, equipment and medium for calculating the temperature field of a space station heating furnace, in order to solve at least one of the above-mentioned technical problems.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: Firstly, this application provides a method for calculating the temperature field of a space station heater, employing the following technical solution: A method for calculating the temperature field of a space station heater includes: Obtain the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside it. Based on the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside it, generate an initial computational grid. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal properties of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. Each initial computational grid includes the thermal properties of the materials and an initial temperature. Based on the displacement conditions and the initial computational grid, determine the target computational grid for the current time; Based on the target temperature at the current time, the simulated temperature at the previous time, and the preset PID control algorithm, the heating power of the furnace at the current time is determined. Based on the target computational grid at the current time and the simulation temperature at the previous time, determine the surface thermal radiation flux of each target computational grid at the current time; Based on the target computational grid, heating power, surface thermal radiation flux, and preset transient heat conduction equations at the current time, determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

[0007] The beneficial effects of this invention are as follows: By fully coupling and solving the closed-loop PID control model of the heating furnace temperature control system, the dynamic mesh model of the material movement process, and the physical fields of thermal radiation and heat conduction, a high-fidelity temperature field calculation method is established. This method can directly reproduce the actual temperature control process of the heating furnace based on the temperature control process curve, and simulate the dynamic influence of the relative movement of the furnace body and the material on radiative heat transfer. This effectively solves the problem of large calculation errors caused by neglecting the coupling of the temperature control system and the moving heating effect in the existing technology, improves the accuracy of temperature field calculation, and provides a more reliable digital simulation means for heating furnace process optimization.

[0008] Based on the above technical solution, the present invention can be further improved as follows.

[0009] Furthermore, determining the target computational grid for the current time based on the displacement condition and the initial computational grid includes: Based on the current time point, obtain the corresponding displacement data from the displacement conditions; Based on the displacement data, the node coordinates of the initial computational grid are updated to generate a target computational grid corresponding to the current physical position; wherein, the displacement condition characterizes the law of relative movement between the heating furnace and the material over time.

[0010] The beneficial effect of adopting the above-mentioned further scheme is that, when there is relative movement between the heating furnace and the material, the target calculation grid for the current time is determined according to the displacement conditions and the initial calculation grid, thereby accurately characterizing the relative movement effect between the furnace body and the material during the heating process, and effectively solving the technical problem that the traditional static grid method cannot accurately simulate the dynamic radiation heat transfer during the moving heating process.

[0011] Furthermore, determining the heating power of the furnace at the current time based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm includes: Based on the current time and the temperature control process curve of the heating furnace, determine the target temperature at the current time; Calculate the difference between the target temperature at the current time and the simulated temperature at the previous time. The difference is input into a preset PID control algorithm to obtain the heating power of the furnace at the current time; The PID control algorithm is as follows: ; in, The deviation between the preset target temperature and the actual temperature. These are the proportional, integral, and differential coefficients, respectively. This refers to the temperature data measured inside the furnace chamber of the heating furnace. This represents the target temperature of the corresponding heating zone at the current time.

[0012] The beneficial effects of adopting the above-mentioned further scheme are as follows: the target temperature is determined according to the temperature control process curve of the heating furnace, the difference is calculated by combining the simulated temperature at the previous moment, and the heating power is determined by using the PID control algorithm. The heating furnace temperature control system model can be introduced and directly input into the heating furnace thermal control process curve for calculation, avoiding the simple assumption of the heat source model under a single working condition, greatly improving the calculation accuracy, and truly reproducing the temperature control principle of the heating furnace.

[0013] Furthermore, the determination of the surface thermal radiation flux of each target computational grid at the current time, based on the target computational grid at the current time and the simulation temperature at the previous time, includes: Based on the target computation grid at the current time and the preset half-cube method, calculate the viewing angle coefficient between each radiation surface; Based on the surface temperature of the temperature field distribution of the previous time and the Stefan-Boltzmann law, calculate the spontaneous radiative exitance of each surface; Based on the aforementioned viewing angle coefficient, spontaneous emission emissivity, and emissivity of each surface, a set of radiative heat transfer equations is established between the surfaces. These equations characterize the radiative energy balance formed between the surfaces through multiple reflections and absorptions. Based on the aforementioned set of radiation heat transfer equations, the surface thermal radiation flux of each target computational grid at the current time is obtained.

[0014] The beneficial effects of adopting the above-mentioned further scheme are: by dynamically calculating the radiation viewing angle coefficient and establishing a complete set of radiation energy balance equations characterizing multiple reflections and absorptions, a high-precision simulation of the radiation heat transfer process between complex surfaces in the heating furnace is realized. This effectively overcomes the deviation in heat flow calculation caused by ignoring viewing angle changes, multiple reflections, or using the average angle coefficient in traditional methods, and improves the ability to capture the dynamic characteristics of radiation heat transfer during the moving heating process and the accuracy of the overall temperature field calculation.

[0015] Furthermore, the set of radiative heat transfer equations includes the surface net radiative heat flux equation, the surface emitted radiation equation, the incident radiation calculation equation, and the surface property relationship equation. The surface net radiative heat flux equation represents the difference between spontaneous radiation and absorbed radiation, the surface emitted radiation equation represents the composition of spontaneous radiation and reflected radiation, the incident radiation flux equation represents the total radiation contribution received by the surface calculated through the viewing angle coefficient, and the surface property relationship equation represents the equivalent relationship between absorptivity and emissivity.

[0016] The beneficial effects of adopting the above-mentioned further scheme are: by constructing a closed set of radiation heat transfer equations consisting of net surface radiation, outgoing radiation, incident radiation and surface property relationship equations, the complex radiation energy exchange process between the inner surfaces of the heating furnace, which involves multiple reflections and absorptions, is fully described, overcoming the limitations of the traditional simplified model, thereby improving the calculation accuracy and physical reality of dynamic radiation heat transfer during the moving heating process.

[0017] Furthermore, the determination of the new temperature field distribution of the heating furnace and the materials within it at the current time, based on the target computational grid, heating power, surface thermal radiation flux, and a preset transient heat conduction equation, includes: Based on the nonlinear finite element method and the target computational grid at the current time step, the transient heat conduction equation is discretized on the target computational grid at the current time step to form a set of nonlinear equations. Using the heating power as the internal heat source and the surface thermal radiation flux as the boundary condition, the nonlinear equations are iteratively solved until the convergence condition is met, thus obtaining the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

[0018] The beneficial effects of adopting the above-mentioned further scheme are as follows: by using the nonlinear finite element method to discretize the transient heat conduction equation on the target computational grid to form a nonlinear equation system, and iteratively solving it with heating power as the internal heat source and surface thermal radiation flux as the boundary condition, the new temperature field distribution of the heating furnace and the materials inside the furnace at the current time can be accurately determined, improving the calculation accuracy and engineering realism, making the calculation results more realistically reproduce the temperature control principle of the heating furnace. At the same time, due to the coupling of multiple factors, the versatility of the model is improved, and it can be applied to the calculation of the temperature field of most vacuum heating furnaces.

[0019] Furthermore, the preset transient heat conduction equation is: ; in, For material density, For specific heat capacity, For temperature, Thermal conductivity, This refers to the power of the heating wire.

[0020] The beneficial effects of adopting the above-mentioned further scheme are: accurately simulating the heat conduction process inside the heating furnace and materials, and combining the heating wire power to provide accurate calculation basis for determining the new temperature field distribution of the heating furnace and materials.

[0021] Secondly, this application provides a space station heater temperature field calculation device, which adopts the following technical solution: A temperature field calculation device for a space station heater furnace, mainly comprising: An initial computational grid generation module is used to acquire the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace. Based on the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace, an initial computational grid is generated. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal property parameters of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. The displacement conditions represent the rules describing the movement of the furnace body and the materials over time. Each initial computational grid includes the thermal property parameters of the materials and an initial temperature. The target computational grid determination module is used to determine the target computational grid for the current time based on the displacement conditions and the initial computational grid. The heating power determination module is used to determine the heating power of the furnace at the current time based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm. The surface thermal radiation determination module is used to determine the surface thermal radiation flux of each target computational grid at the current time based on the target computational grid at the current time and the simulation temperature at the previous time. The temperature field distribution generation module is used to determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time based on the target calculation grid, heating power, surface thermal radiation flux and preset transient heat conduction equations.

[0022] Thirdly, this application provides an electronic device that adopts the following technical solution: An electronic device includes a memory and a processor, wherein the memory stores a computer program capable of being loaded by the processor and executing a method for calculating the temperature field of a space station heater furnace as described in any of the first aspects.

[0023] Fourthly, this application provides a computer-readable storage medium, which adopts the following technical solution: A computer-readable storage medium storing a computer program capable of being loaded by a processor and executing the method for calculating the temperature field of a space station heater furnace as described in any of the first aspects.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0025] Figure 1 A flowchart illustrating a method for calculating the temperature field of a space station heater furnace, provided in one embodiment of the present invention; Figure 2 This is a schematic diagram of the target temperature curve of the furnace and the temperature measurement data of four thermocouples in the furnace according to the present invention; Figure 3 This is a schematic diagram showing the temperature measurement data of five thermocouples inside the sample box of the present invention; Figure 4 These are temperature field distribution cloud maps of the furnace body cross-section at three different times according to the present invention; Figure 5 This is a schematic diagram comparing simulation data and experimental data of thermocouple temperature inside the furnace in this invention. Figure 6 This is a schematic diagram comparing the simulation data and experimental data of the thermocouple temperature in the sample box of the present invention. Figure 7 This is a schematic diagram of the structure of a space station heating furnace temperature field calculation device according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the structure of an electronic device provided in one embodiment of the present invention. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0028] This application provides a method for calculating the temperature field of a space station heater furnace. This method can be executed by an electronic device, which can be a server or a mobile terminal device. The server can be an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server that provides cloud computing services. The mobile terminal device can be a laptop computer, a desktop computer, etc., but is not limited to these.

[0029] like Figure 1 As shown, a method for calculating the temperature field of a space station heater mainly includes: S101, Obtain the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace, and generate an initial calculation grid based on the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal properties of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. Each initial calculation grid includes the thermal properties of the materials and an initial temperature. In this embodiment, the geometric model can be constructed using 3D modeling software based on the actual shape and size of the heating furnace and materials. The geometric model accurately represents the 3D shape and spatial position of the heating furnace and materials, and the material's thermophysical parameters can be obtained through experimental measurement or by consulting relevant literature. Based on this information, an initial computational mesh is generated using a mesh generation algorithm. Each initial computational mesh contains material thermophysical parameters and an initial temperature. The mesh generation algorithm can be a finite element mesh generation algorithm, a finite difference mesh generation algorithm, or something similar.

[0030] S102, Based on the displacement conditions and the initial computational grid, determine the target computational grid for the current time; Specifically, S102 includes: Based on the current time point, obtain the corresponding displacement data from the displacement conditions; Based on the displacement data, the node coordinates of the initial computational grid are updated to generate a target computational grid corresponding to the current physical position; wherein, the displacement condition characterizes the law of relative movement between the heating furnace and the material over time.

[0031] In this embodiment, firstly, based on the current time point, the corresponding displacement data is obtained from the displacement condition. The displacement condition can be a time-displacement function. By substituting the current time into this function, the corresponding displacement data is obtained. Then, based on the displacement data, the node coordinates of the initial computational grid are updated to generate a target computational grid corresponding to the current physical location. For example, if the heating furnace or material moves a certain distance in a certain direction, the node coordinates of the corresponding part in the initial computational grid must be adjusted accordingly in that direction.

[0032] S103, based on the target temperature at the current time, the simulated temperature at the previous time, and the preset PID control algorithm, determine the heating power of the furnace at the current time; Furthermore, determining the heating power of the furnace at the current time based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm includes: Based on the current time and the temperature control process curve of the heating furnace, determine the target temperature at the current time; Calculate the difference between the target temperature at the current time and the simulated temperature at the previous time. The difference is input into a preset PID control algorithm to obtain the heating power of the furnace at the current time; The PID control algorithm is as follows: ; in, The deviation between the preset target temperature and the actual temperature. These are the proportional, integral, and differential coefficients, respectively. This refers to the temperature data measured inside the furnace chamber of the heating furnace. This represents the target temperature of the corresponding heating zone at the current time.

[0033] In this embodiment, the temperature control process curve can be a pre-set curve showing the temperature changing over time. The target temperature is then located on the curve at the current time. Next, the difference between the target temperature at the current time and the simulated temperature at the previous time is calculated. This difference is input into a pre-set PID control algorithm to obtain the heating power of the furnace at the current time. The PID control algorithm is a classic control algorithm that processes temperature deviations using proportional, integral, and derivative coefficients to output appropriate heating power. The proportional coefficient is used for rapid response to temperature deviations, the integral coefficient is used to eliminate steady-state errors, and the derivative coefficient is used to suppress temperature fluctuations.

[0034] S104, Based on the target computational grid at the current time and the simulation temperature at the previous time, determine the surface thermal radiation flux of each target computational grid at the current time; Optionally, determining the surface thermal radiation flux of each target computational grid at the current time based on the target computational grid at the current time and the simulation temperature at the previous time includes: Based on the target computation grid at the current time and the preset half-cube method, calculate the viewing angle coefficient between each radiation surface; Based on the surface temperature of the temperature field distribution of the previous time and the Stefan-Boltzmann law, calculate the spontaneous radiative exitance of each surface; Based on the aforementioned viewing angle coefficient, spontaneous emission emissivity, and emissivity of each surface, a set of radiative heat transfer equations is established between the surfaces. These equations characterize the radiative energy balance formed between the surfaces through multiple reflections and absorptions. Based on the aforementioned set of radiation heat transfer equations, the surface thermal radiation flux of each target computational grid at the current time is obtained.

[0035] In this embodiment, the viewing angle coefficients between the radiating surfaces are first calculated based on the target computational grid at the current time and a preset semi-cube method. The semi-cube method is a commonly used method for calculating viewing angle coefficients; it divides the radiating surface into multiple small facets and then calculates the viewing angle relationship between each facet. Next, based on the surface temperature of the temperature field distribution at the previous time and the Stefan-Boltzmann law, the spontaneous radiative exitance of each surface is calculated. The Stefan-Boltzmann law states that the radiative exitance of an object is proportional to the fourth power of the object's temperature. Then, based on the viewing angle coefficients, spontaneous radiative exitance, and the emissivity of each surface, a set of radiative heat transfer equations between the surfaces is established. This set of equations characterizes the radiative energy balance formed between the surfaces through multiple reflections and absorptions. Finally, based on the radiative heat transfer equations, the surface thermal radiation flux of each target computational grid at the current time is obtained.

[0036] The radiative heat transfer equations include the surface net radiative heat flux equation, the surface emitted radiation equation, the incident radiation calculation equation, and the surface property relationship equation. The surface net radiative heat flux equation represents the difference between spontaneous radiation and absorbed radiation, the surface emitted radiation equation represents the composition of spontaneous radiation and reflected radiation, the incident radiation flux equation represents the total radiation contribution received by the surface calculated through the viewing angle coefficient, and the surface property relationship equation represents the equivalent relationship between absorptivity and emissivity.

[0037] In this embodiment, the surfaces of the high-temperature furnace and the sample container dissipate heat through thermal radiation. The heat flux outward from the surface... Represented as: ; The heat flux on the outer surface of the furnace is the difference between the surface's self-heating radiation and the received ambient radiant heat. ,in, For surface emissivity, It is the Stefan-Boltzmann constant. The ambient temperature.

[0038] The surface heat flux inside the furnace also needs to consider the radiant energy from other surfaces. The surface heat radiation flux is expressed as: ; In this table, the first term on the right represents the spontaneous radiation flux of the surface, and the second term represents the incident radiation flux absorbed by the surface. Let be the absorptivity of the surface. According to Kirchhoff's laws, the absorptivity here equals the emissivity. . The radiant flux incident on this surface from other surfaces and in an unenclosed environment, including the sum of radiation projected onto this surface from all other surfaces. and the radiative heat flux from the non-enclosed system environment to the surface. .

[0039] ; in, Let be the radiation angle coefficient between surface j and the surface. Let be the outgoing radiation flux from surface j. This represents the radiation angle coefficient of the non-enclosed portion. ; Outgoing radiation flux of surface j It includes two parts: spontaneous emission flux and reflected flux. It can be represented as: ; in, Let j be the emissivity of surface j. Let j be the temperature of the surface. Let the absorptivity of surface j be . Let be the incident radiant flux at surface j. Here, the surface is opaque, and the transmitted portion is neglected; therefore, the reflectivity of surface j is given. .

[0040] S105, based on the target computational grid, heating power, surface thermal radiation flux and preset transient heat conduction equation at the current time, determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

[0041] Furthermore, the determination of the new temperature field distribution of the heating furnace and the materials within it at the current time, based on the target computational grid, heating power, surface thermal radiation flux, and a preset transient heat conduction equation, includes: Based on the nonlinear finite element method and the target computational grid at the current time step, the transient heat conduction equation is discretized on the target computational grid at the current time step to form a set of nonlinear equations. Using the heating power as the internal heat source and the surface thermal radiation flux as the boundary condition, the nonlinear equations are iteratively solved until the convergence condition is met, thus obtaining the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

[0042] In this embodiment, the nonlinear finite element method is a method for discretizing and solving continuous physical problems, which can more accurately handle complex physical processes. Using heating power as the internal heat source and surface thermal radiation flux as the boundary condition, the nonlinear equations are iteratively solved until the convergence condition is met, yielding the new temperature field distribution of the furnace body and the materials inside the furnace at the current time.

[0043] The preset transient heat conduction equation is: ; in, For material density, For specific heat capacity, For temperature, Thermal conductivity, This refers to the power of the heating wire.

[0044] The following example illustrates this point using the directional solidification experiment in the high-temperature furnace of the space station.

[0045] The calculation results were verified using temperature measurements taken within the high-temperature furnace and sample box. During the experiment, the sample box was heated using a mid-section furnace, while the upper and lower sections were not heated. Once the mid-section furnace reached the target temperature, the furnace body was moved to achieve directional solidification and growth of the crystals.

[0046] After heating begins, the intermediate furnace follows... Figure 2 The sample was heated according to the target temperature curve shown. First, the temperature was raised to 600℃ within 2 hours, then to 1000℃ within 3 hours, and finally to 1140℃ within 2 hours. After holding at 1140℃ for 1 hour, the upper, middle and lower furnace bodies were moved downwards by 70mm at a moving rate of 3.75mm / h until the sample was completely solidified. Then, the high-temperature furnace was cooled down to 740℃ within 3 hours, then to 100℃ within another 3 hours. Finally, the heating command was turned off, and the sample was allowed to cool naturally to room temperature.

[0047] The accuracy of this method is verified by comparing simulation results with experimental measurement data. Figure 3The temperature change curves of the five thermocouples inside the sample box are displayed. The simulation results (dashed line) are in high agreement with the experimental data (solid line), and the experimental measurement data (solid line) of the five thermocouples inside the sample box show a consistent trend with the simulation results (dashed line).

[0048] like Figure 4 As shown, temperature field contour maps are displayed at three typical moments (mid-heating, holding period, and late-movement). The contour maps clearly reflect the changes in temperature gradient during the furnace movement, demonstrating the effectiveness of the dynamic mesh model in simulating dynamic heating processes.

[0049] like Figures 5 to 6 As shown, simulation and experimental data of the furnace thermocouples and the sample box thermocouples were further compared. The maximum error of the furnace thermocouple occurred during the heating stage, while the error of the sample box thermocouple was the smallest during the heat preservation stage. The method of this invention can accurately reproduce the actual temperature control process of a heating furnace and meet engineering accuracy requirements.

[0050] This method couples the heating furnace temperature control system with complex heat transfer processes such as thermal radiation and thermal conduction, and considers the impact of the moving heating process on thermal radiation, avoiding the simplistic assumptions of single-condition heat source models in existing methods. It can directly calculate the temperature field distribution of the heating furnace and materials based on the furnace's temperature control process curve, significantly improving calculation accuracy and realistically reproducing the temperature control principle of the heating furnace. Furthermore, the proposed coupled calculation framework of thermal radiation model, thermal conduction model, temperature control model, and moving heating process effectively improves the model's versatility, making it applicable to the calculation of temperature fields in most vacuum heating furnaces, providing a more scientific and accurate basis for optimizing heating processes in industrial fields such as material processing and heat treatment.

[0051] Figure 7 A schematic diagram of a temperature field calculation device 200 for a space station heater furnace is shown.

[0052] like Figure 7 As shown, a space station heating furnace temperature field calculation device 200 mainly includes: The initial computational grid generation module 201 is used to acquire the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace, and to generate an initial computational grid based on the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal property parameters of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. The displacement conditions represent the rules describing the movement of the furnace body and the materials over time. Each initial computational grid includes the thermal property parameters of the materials and an initial temperature. The target computational grid determination module 202 is used to determine the target computational grid for the current time based on the displacement conditions and the initial computational grid. The heating power determination module 203 is used to determine the heating power of the heating furnace at the current time based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm. The surface thermal radiation determination module 204 is used to determine the surface thermal radiation flux of each target computational grid at the current time based on the target computational grid at the current time and the simulation temperature at the previous time. The temperature field distribution generation module 205 is used to determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time based on the target calculation grid, heating power, surface thermal radiation flux and preset transient heat conduction equation.

[0053] In one example, the module in any of the above devices may be one or more integrated circuits configured to implement the above methods, such as one or more application-specific integrated circuits (ASICs), or one or more digital signal processors (DSPs), or one or more field-programmable gate arrays (FPGAs), or a combination of at least two of these integrated circuit forms.

[0054] For example, when modules in a device can be implemented via a processing element scheduler, the processing element can be a general-purpose processor, such as a central processing unit (CPU) or other processor capable of calling programs. Alternatively, these modules can be integrated together as a system-on-a-chip (SOC).

[0055] In this application, various objects such as messages / information / devices / network elements / systems / apparatus / actions / operations / processes / concepts may be named. It is understood that these specific names do not constitute a limitation on the relevant objects. The names may be changed depending on the scenario, context, or usage habits. The understanding of the technical meaning of the technical terms in this application should be mainly determined from their functions and technical effects embodied / performed in the technical solution.

[0056] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and modules described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0057] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0058] Figure 8 This is a structural block diagram of an electronic device 300 according to an embodiment of this application.

[0059] like Figure 8 As shown, the electronic device 300 includes a processor 301 and a memory 302, and may further include one or more of an information input / output (I / O) interface 303, a communication component 304, and a communication bus 305.

[0060] The processor 301 controls the overall operation of the electronic device 300 to complete all or part of the steps in the aforementioned method for calculating the temperature field of a space station heater furnace. The memory 302 stores various types of data to support the operation of the electronic device 300. This data may include, for example, instructions for any application or method operating on the electronic device 300, as well as application-related data. The memory 302 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as one or more of the following: Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0061] I / O interface 303 provides an interface between processor 301 and other interface modules, such as keyboards, mice, and buttons. These buttons can be virtual or physical. Communication component 304 is used to test wired or wireless communication between electronic device 300 and other devices. Wireless communication includes Wi-Fi, Bluetooth, Near Field Communication (NFC), 2G, 3G, or 4G, or a combination thereof. Therefore, the corresponding communication component 304 may include a Wi-Fi component, a Bluetooth component, and an NFC component.

[0062] The communication bus 305 may include a path for transmitting information between the aforementioned components. The communication bus 305 may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus 305 may be divided into an address bus, a data bus, a control bus, etc.

[0063] The electronic device 300 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to execute a method for calculating the temperature field of a space station heater furnace as described in the above embodiments.

[0064] The following describes the computer-readable storage medium provided in the embodiments of this application. The computer-readable storage medium described below can be referred to in correspondence with the method for calculating the temperature field of a space station heater described above.

[0065] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-described method for calculating the temperature field of a space station heater furnace.

[0066] The computer-readable storage medium may include various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0067] The terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0068] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the foregoing application concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions claimed in this application.

Claims

1. A method for calculating the temperature field of a space station heater, characterized in that, include: Obtain the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside it. Based on the geometric model, thermal properties, temperature control process curve, and displacement conditions of the heating furnace and the materials inside it, generate an initial computational grid. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal properties of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. Each initial computational grid includes the thermal properties of the materials and an initial temperature. Based on the displacement conditions and the initial computational grid, determine the target computational grid for the current time; Based on the target temperature at the current time, the simulated temperature at the previous time, and the preset PID control algorithm, the heating power of the furnace at the current time is determined. Based on the target computational grid at the current time and the simulation temperature at the previous time, determine the surface thermal radiation flux of each target computational grid at the current time; Based on the target computational grid, heating power, surface thermal radiation flux, and preset transient heat conduction equations at the current time, determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

2. The method for calculating the temperature field of a space station heater furnace according to claim 1, characterized in that, The process of determining the target computational grid for the current time based on the displacement conditions and the initial computational grid includes: Based on the current time point, obtain the corresponding displacement data from the displacement conditions; Based on the displacement data, the node coordinates of the initial computational grid are updated to generate a target computational grid corresponding to the current physical position; wherein, the displacement condition characterizes the law of relative movement between the heating furnace and the material over time.

3. The method for calculating the temperature field of a space station heater furnace according to claim 1, characterized in that, The determination of the heating power of the furnace at the current time, based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm, includes: Based on the current time and the temperature control process curve of the heating furnace, determine the target temperature at the current time; Calculate the difference between the target temperature at the current time and the simulated temperature at the previous time. The difference is input into a preset PID control algorithm to obtain the heating power of the furnace at the current time; The PID control algorithm is as follows: ； in, The deviation between the preset target temperature and the actual temperature. These are the proportional, integral, and differential coefficients, respectively. For the temperature measurement data of the heating furnace, This represents the target temperature of the corresponding heating zone at the current time.

4. The method for calculating the temperature field of a space station heater furnace according to claim 1, characterized in that, The surface thermal radiation flux of each target computational grid at the current time is determined based on the target computational grid at the current time and the simulation temperature at the previous time, including: Based on the target computation grid at the current time and the preset half-cube method, calculate the viewing angle coefficient between each radiation surface; Based on the surface temperature of the temperature field distribution of the previous time and the Stefan-Boltzmann law, calculate the spontaneous radiative exitance of each surface; Based on the aforementioned viewing angle coefficient, spontaneous emission emissivity, and emissivity of each surface, a set of radiative heat transfer equations is established between the surfaces. These equations characterize the radiative energy balance formed between the surfaces through multiple reflections and absorptions. Based on the aforementioned set of radiation heat transfer equations, the surface thermal radiation flux of each target computational grid at the current time is obtained.

5. The method for calculating the temperature field of a space station heater furnace according to claim 4, characterized in that, The set of radiative heat transfer equations includes the surface net radiative heat flux equation, the surface emitted radiation equation, the incident radiation calculation equation, and the surface property relationship equation. The surface net radiative heat flux equation represents the difference between spontaneous radiation and absorbed radiation, the surface emitted radiation equation represents the composition of spontaneous radiation and reflected radiation, the incident radiation flux equation represents the total radiation contribution received by the surface calculated through the viewing angle coefficient, and the surface property relationship equation represents the equivalent relationship between absorptivity and emissivity.

6. The method for calculating the temperature field of a space station heater furnace according to claim 1, characterized in that, The determination of the new temperature field distribution of the furnace and its materials at the current time, based on the target computational grid, heating power, surface thermal radiation flux, and a preset transient heat conduction equation, includes: Based on the nonlinear finite element method and the target computational grid at the current time step, the transient heat conduction equation is discretized on the target computational grid at the current time step to form a set of nonlinear equations. Using the heating power as the internal heat source and the surface thermal radiation flux as the boundary condition, the nonlinear equations are iteratively solved until the convergence condition is met, thus obtaining the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time.

7. The method for calculating the temperature field of a space station heater according to claim 6, characterized in that, The preset transient heat conduction equation is: ; in, For material density, For specific heat capacity, For temperature, Thermal conductivity, This refers to the power of the heating wire.

8. A device for calculating the temperature field of a space station heater furnace, characterized in that, include: An initial computational grid generation module is used to acquire the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace. Based on the geometric model, thermal property parameters, temperature control process curve, and displacement conditions of the heating furnace and the materials inside the heating furnace, an initial computational grid is generated. The geometric model represents the three-dimensional shape and spatial position of the heating furnace and the materials. The thermal property parameters of the materials include density, specific heat capacity, thermal conductivity, and surface emissivity. The displacement conditions represent the rules describing the movement of the furnace body and the materials over time. Each initial computational grid includes the thermal property parameters of the materials and an initial temperature. The target computational grid determination module is used to determine the target computational grid for the current time based on the displacement conditions and the initial computational grid. The heating power determination module is used to determine the heating power of the furnace at the current time based on the target temperature at the current time, the simulated temperature at the previous time, and a preset PID control algorithm. The surface thermal radiation determination module is used to determine the surface thermal radiation flux of each target computational grid at the current time based on the target computational grid at the current time and the simulation temperature at the previous time. The temperature field distribution generation module is used to determine the new temperature field distribution of the heating furnace and the materials inside the heating furnace at the current time based on the target calculation grid, heating power, surface thermal radiation flux and preset transient heat conduction equations.

9. An electronic device, characterized in that, Includes a processor, which is coupled to a memory; The processor is configured to execute a computer program stored in the memory to cause the electronic device to perform the method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, Includes a computer program or instructions that, when run on a computer, cause the computer to perform the method as described in any one of claims 1-7.

Images