Method for testing LED module comprising pixel array and driving array

Abstract

The invention discloses a method for testing an LED module comprising a pixel array and a driving array, and the method comprises the steps: providing the LED module comprising the pixel array and the driving array, bonding a first electrode of each LED with a first electrode of a corresponding pixel circuit in the driving array, bonding a second electrode of each LED with a second electrode of a pixel circuit corresponding to the second electrode in the driving array; placing the LED module on a test machine, and electrically connecting a plurality of communication pins in the LED module with a plurality of salient points or a plurality of probes of the test machine in a one-to-one correspondence manner; the testing machine carries out photoelectric testing on the LED module, generates corresponding compensation current and provides the compensation current to the driving array. The display effect and the brightness consistency of the LED module can be improved, and light emitting is more uniform.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a testing method for an LED module comprising a pixel array and a driver array. Background Technology

[0002] MicroLED (Micro Light Emitting Diode Display) features self-illumination, long lifespan, high contrast, high resolution, fast response, wider viewing angle, rich colors, ultra-high brightness, and lower power consumption.

[0003] Because MicroLEDs have smaller pixel sizes, they can achieve higher resolution. Furthermore, compared to traditional LED backlighting and traditional direct-view LEDs, MicroLED modules contain a significantly larger number of MicroLEDs. How to quickly and accurately test the photoelectric parameters of this massive number of MicroLEDs in a MicroLED module is a major challenge currently facing the development of MicroLEDs. Summary of the Invention

[0004] In view of the above problems, the purpose of this application is to provide a testing method for an LED module including a pixel array and a driver array, so as to improve the testing efficiency of the LED module.

[0005] According to one aspect of the present invention, a testing method for an LED module comprising a pixel array and a driving array is provided. The pixel array includes a plurality of LEDs, and the driving array includes a driving circuit, a plurality of communication pins, and a plurality of pixel circuits corresponding one-to-one with each LED in the pixel array, comprising:

[0006] An LED module comprising a pixel array and a driving array is provided, wherein the first electrode of each LED light-emitting diode in the pixel array is bonded to the first electrode of the corresponding pixel circuit in the driving array, and the second electrode of each LED light-emitting diode in the pixel array is bonded to the second electrode of the corresponding pixel circuit in the driving array;

[0007] The LED module is placed on a testing machine, and the plurality of communication pins in the LED module are electrically connected to the plurality of bumps or probes of the testing machine, one by one; and

[0008] The testing machine performs photoelectric testing on the LED module and generates a corresponding compensation current to provide to the driving array.

[0009] Optionally, the first electrodes of the plurality of LEDs are electrically connected to each other, and the second electrodes of each LED are independent of each other.

[0010] Optionally, the first electrode of each LED is located around the second electrode, the first electrodes of adjacent LEDs are connected to each other, the first electrode is one of an N electrode and a P electrode, and the second electrode is the other of an N electrode and a P electrode.

[0011] Optionally, the testing machine performs photoelectric testing on the LED module and generates a corresponding compensation current to provide to the driving array, including:

[0012] The test machine provides test current to the drive circuit of the drive array through the multiple bumps or multiple probes to illuminate the pixel array;

[0013] The tester senses the first light test data of the pixel array and generates a compensation current based on the first light test data;

[0014] The test machine provides the compensation current to the driving circuit of the driving array through the multiple bumps or multiple probes, and the driving circuit dims the pixel array according to the compensation current.

[0015] Optionally, electrically connecting the plurality of communication pins in the LED module to the plurality of bumps or probes of the testing machine in a one-to-one correspondence includes:

[0016] The test machine obtains the position and spacing of the plurality of communication pins;

[0017] The testing machine adjusts the position and spacing of the multiple bumps or probes based on the position and spacing of the multiple communication pins, so that the multiple communication pins correspond one-to-one with the multiple bumps or probes and are electrically connected.

[0018] Optionally, the pixel array comprises n matrix units, each matrix unit comprising at least one LED, where n is a positive integer, and the first light test data sensed by the testing machine from the pixel array includes:

[0019] The test machine steps along the light-collecting direction and performs multiple light collections to traverse the pixel array and obtain multiple intermediate light test data.

[0020] The first optical test data is obtained based on the multiple intermediate optical test data.

[0021] Optionally, each light-receiving area includes m LEDs, where m is an integer, and the collection of the light-receiving areas from multiple light-receiving events constitutes the pixel array.

[0022] Optionally, the light-collecting areas of adjacent sequential light-collecting operations may partially overlap.

[0023] Optionally, the light-receiving direction is a first direction, a second direction, or a serpentine pattern.

[0024] Optionally, providing the pixel array includes:

[0025] Provide substrate;

[0026] An epitaxial layer is formed on the substrate, the epitaxial layer comprising a first semiconductor layer, a light-emitting layer, and a second semiconductor layer sequentially formed on the surface of the substrate;

[0027] Steps are formed on the epitaxial layer to form a plurality of LED functional units, wherein at least a portion of the first semiconductor layer and the second semiconductor layer in each LED functional unit are exposed to the outside;

[0028] A first electrode is formed in each LED functional unit and is electrically connected to one of the first semiconductor layer and the second semiconductor layer;

[0029] A second electrode is formed in each LED functional unit, which is electrically connected to the first semiconductor layer and the second semiconductor layer.

[0030] Optionally, it further includes: the tester providing a test current to the pixel array to illuminate the pixel array.

[0031] Optionally, the tester provides a test current to the pixel array to illuminate the pixel array by: electrically connecting the first electrode of the plurality of LEDs in the pixel array to the first bump or a first type of probe of the tester, and electrically connecting the second electrode of the plurality of LEDs in the pixel array to the second bump or a second type of probe of the tester, so as to provide a test current to the pixel array.

[0032] This application provides a testing method for an LED module comprising a pixel array and a driver array. The method involves bonding the first electrode of each LED in the pixel array to the first electrode of its corresponding pixel circuit in the driver array, and bonding the second electrode of each LED in the pixel array to the second electrode of its corresponding pixel circuit in the driver array to form an LED module. The LED module is then placed on a testing machine to perform photoelectric testing and generate a corresponding compensation current to be supplied to the driver array. This application obtains the compensation current required by the pixel array through photoelectric testing of the LED module, thereby dimming the LEDs in the pixel array to improve the display effect and brightness uniformity of the LED module, resulting in more uniform light emission.

[0033] Furthermore, this application performs a lighting test on the LEDs in the pixel array before forming the LED module, and discards any unqualified matrix units or pixel arrays to avoid integrating unqualified pixel arrays into the LED module. This improves the efficiency of photoelectric testing of the LED module.

[0034] Furthermore, the first electrodes of the LEDs in the pixel array of this application are connected to each other, which can reduce the number of bumps or probes electrically connected to the first electrodes in the testing machine, thereby improving testing efficiency. Attached Figure Description

[0035] The above and other objects, features and advantages of the present invention will become more apparent from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0036] Figure 1 A flowchart illustrating a testing method for an LED module comprising a pixel array and a driving array according to an embodiment of this application is shown.

[0037] Figure 2 A partial schematic diagram of the pixel array in an LED module provided according to an embodiment of this application is shown;

[0038] Figure 3 A schematic diagram of the driving array in an LED module according to an embodiment of this application is shown;

[0039] Figure 4 A schematic diagram of an LED module provided according to an embodiment of this application is shown;

[0040] Figure 5 A schematic diagram of a testing machine provided according to an embodiment of this application is shown;

[0041] Figure 6 A schematic diagram of another testing machine provided according to an embodiment of this application is shown;

[0042] Figure 7 A cross-sectional schematic diagram of the LEDs in the LED light-emitting diode matrix of the LED module provided according to an embodiment of this application is shown;

[0043] Figure 8 Show Figure 1 A flowchart of step S440. Detailed Implementation

[0044] Various embodiments of the invention will now be described in more detail with reference to the accompanying drawings. In the various drawings, the same elements are indicated by the same or similar reference numerals. For clarity, the various parts in the drawings are not drawn to scale.

[0045] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0046] Figure 1 This diagram illustrates a flowchart of a testing method for an LED module comprising a pixel array and a driver array according to an embodiment of this application. Figure 2 A partial schematic diagram of the pixel array in an LED module provided according to an embodiment of this application is shown. Figure 3 A schematic diagram of the driving array in an LED module provided according to an embodiment of this application is shown. Figure 4 A schematic diagram of an LED module provided according to an embodiment of this application is shown. Figure 5 A schematic diagram of a testing machine provided according to an embodiment of this application is shown. Figure 6 A schematic diagram of another testing machine provided according to an embodiment of this application is shown. Figure 7 A cross-sectional schematic diagram of the LEDs in the LED light-emitting diode matrix of an LED module provided according to an embodiment of this application is shown. Figure 8 Show Figure 1 A flowchart of step S440.

[0047] like Figure 1 As shown, the packaging and testing method for an LED module provided in this application includes the following steps:

[0048] Step S410: The tester provides test current to the pixel array to light up the pixel array.

[0049] The pixel array comprises multiple LEDs. These LEDs are arranged in an array, for example. Further, the first electrodes of the multiple LEDs are electrically connected to each other, and the second electrodes of each LED are independent of each other. Exemplarily, the first electrode of each LED is located outside the second electrode, and the first electrodes of adjacent LEDs are connected to each other. The first electrode is one of an N-electrode and a P-electrode, and the second electrode is the other of an N-electrode and a P-electrode.

[0050] Figure 2 The diagram shows a portion of the LEDs in a pixel array, such as MicroLEDs. Exemplarily, the narrow bezel dimension of the MicroLED is ≤50µm. MicroLEDs utilize micrometer-sized inorganic LED devices as light-emitting pixels to achieve high-pixel counts with active illumination. The pixel array of this embodiment offers higher resolution, higher brightness, and better contrast.

[0051] Further, the pixel array includes n matrix units 110, each matrix unit 110 including at least one LED light-emitting diode, where n is a positive integer. Further, when n>1, the n matrix units 110 are arranged along a first direction (e.g., the X direction) or a second direction (e.g., the Y direction). The multiple LED light-emitting diodes in the pixel array are located in the plane formed by the first and second directions. Further, Figure 2 For example, two matrix units 110 are shown, each matrix unit 100 including 10×10 LEDs. The first electrodes 101 of the LEDs in each matrix unit 110 are electrically connected to each other, and the second electrodes 102 of each LED in each matrix unit 110 are independent of each other. The first electrode 101 is an N-electrode or a P-electrode.

[0052] Furthermore, the steps of forming a pixel array or a portion of the LED light-emitting diodes in the pixel array include, for example, providing a substrate and forming an epitaxial layer on the surface of the substrate, the epitaxial layer including at least a first semiconductor layer, a light-emitting layer, and a second semiconductor layer, forming steps on the epitaxial layer to form a plurality of LED functional units, at least a portion of the first semiconductor layer and the second semiconductor layer in each LED functional unit being exposed to the outside, forming a first electrode and a second electrode respectively electrically connected to the first semiconductor layer and the second semiconductor layer in each LED functional unit, the first electrode and the second electrode directly or indirectly contacting one of the first semiconductor layer and the second semiconductor layer, wherein the first electrodes of the plurality of LED light-emitting diodes are electrically connected to each other.

[0053] For example, Figure 2 The multiple LEDs shown share a common N-electrode, where the N-electrode can be either the first or second electrode. See also... Figure 7 The LED light-emitting diode 130 includes, but is not limited to: a substrate 131, an epitaxial layer, a first ohmic contact layer 135, a second ohmic contact layer 136, a first electrode 101, a second electrode 102, and a dielectric layer 137. The epitaxial layer includes, for example, a first semiconductor layer 132, a light-emitting layer 133, and a second semiconductor layer 134. The LED light-emitting diode of the present invention is not limited to... Figure 7 As shown.

[0054] Further, the epitaxial layer may also include, for example, a buffer layer, an aluminum nitride layer, a superlattice layer, and an electron blocking layer. The epitaxial layer includes a buffer layer, an aluminum nitride layer, a superlattice layer, a first semiconductor layer 132, a light-emitting layer 133, an electron blocking layer, and a second semiconductor layer 134, sequentially stacked on the first surface of the substrate 131. The epitaxial layer includes one of the reciprocating continuous progressive epitaxial layers composed of AlGaN / AlInGaN material systems, and its preferred embodiment is an AlGaN structure epitaxial layer containing different Al compositions. Among them, the superlattice layer is, for example, an AlN / AlGaN superlattice structure, the first semiconductor layer 132 is an aluminum gallium nitride material layer of the first doping type (N-type), the light-emitting layer 133 is, for example, a multiple quantum well (MQW) structure layer, the electron blocking layer is an aluminum gallium nitride material layer of the second doping type (P-type), and the second semiconductor layer 134 is a gallium nitride material layer of the second doping type (P-type). Among them, the MQW multi-quantum-well structure is, for example, made of AlGaN or AlGaInN material.

[0055] The second ohmic contact layer 136 is located on the surface of the second semiconductor layer 134 and has a second doping type. The second ohmic contact layer 136 is, for example, a nickel-silver stack, and exemplaryly, it can also serve as a mirror layer. The epitaxial layer further includes a step located around the perimeter of the epitaxial layer, sequentially penetrating the metal barrier layer, the second ohmic contact layer 136, the second semiconductor layer 134, the electron barrier layer, and the light-emitting layer 133, and exposing the surface of the first semiconductor layer 132 to separate adjacent LED light-emitting diodes 130. The first ohmic contact layer 135 is located on the surface of the first semiconductor layer 132 (the lower step surface of the step) and in contact with it. The first ohmic contact layer 135 has a first doping type, and a gap exists between it and the step sidewall. The first ohmic contact layer 135 includes, for example, at least one material selected from chromium, aluminum, titanium, hafnium, and vanadium. The dielectric layer 137 covers the surface of the step, the second ohmic contact layer 136, and the surface of the first ohmic contact layer 135. The dielectric layer 137 also has a first opening exposing the surface of the first ohmic contact layer 135 and a second opening exposing the surface of the second ohmic contact layer 136. The first electrode 101 is located on the surface of the dielectric layer 137, fills the first opening, and is in contact with the first ohmic contact layer 135. The second electrode 102 is located on the surface of the dielectric layer 137, fills the second opening, and is in contact with the second ohmic contact layer 136. The first electrode 101 and the second electrode 102 are separated from each other.

[0056] Furthermore, for example, the first electrode 101 and the second electrode 102 are prepared by processes such as magnetron sputtering and electron beam evaporation. The first electrode and the second electrode can be one or a combination of Au, Al, Sn, Ni, Pt, Ti, In, and Cr. The thickness of the first electrode and the second electrode is 100 Å to 50000 Å.

[0057] Furthermore, for example, ODR mirrors, DBR mirrors, and metal mirror structures can be fabricated to form the mirrors of the LED light-emitting diode 130, thereby improving the external quantum efficiency of the LED light-emitting diode 130.

[0058] For example, a first ohmic contact layer 135 is located around the epitaxial layer, and a first electrode 101 is disposed around the epitaxial layer. The first electrodes 101 of adjacent LEDs in each matrix unit 110 are in contact with each other to achieve electrical connection.

[0059] After the pixel array is formed but before it is bonded to the driver array, a testing machine is used to provide a test current to the pixel array to illuminate it for photoelectric detection. Unqualified matrix units or pixel arrays are then discarded to avoid integrating substandard pixel arrays into the LED module, thus improving the reliability of the LED module.

[0060] For example, such as Figure 5 As shown, a tester 500 using MicroLED light-emitting diodes performs photoelectric detection on a pixel array 100 comprising n matrix units 110. Further, the tester 500 employs a transparent fixing device 520 to adsorb or clamp the pixel array 100, wherein the material of the fixing device 520 includes, but is not limited to, glass. The tester 500 also includes a test module 540 located on a machine base 510 to drive the LEDs in the pixel array 100. The tester 500 identifies the LEDs in the pixel array 100 and the bumps 530 on the test module 540 using an image acquisition device (e.g., a binocular focusing lens), and controls the spacing and position of the bumps to electrically connect the first electrode 101 of the LEDs in the pixel array 100 to the first bump of the tester, and the second electrode 102 of the LEDs in the pixel array 100 to the second bump of the tester. The testing machine 500 provides a test current to each LED light-emitting diode through the first and second bumps, thereby inputting a drive current of approximately 1 mA to the LED light-emitting diode to test its electrical and optical performance. Furthermore, the testing machine 500 applies a pressure of, for example, approximately 50 g to ensure that each LED light-emitting diode and bump in the pixel array 100 forms an electrical connection. Further, optical test data is obtained, for example, through a photosensitive device 550.

[0061] Furthermore, if the number of LEDs with substandard photoelectric performance in a matrix unit or pixel array exceeds a set threshold, the matrix unit or pixel array is considered unqualified.

[0062] Alternatively, the bump 530 can be replaced, for example, with a probe. The first bump is replaced with a first-type probe, and the second bump is replaced with a second-type probe.

[0063] It should be noted that since the first electrodes 101 of the LEDs in the pixel array 100 are connected to each other, the number of first bumps or first type probes electrically connected to the first electrodes 101 in the tester 500 can be reduced when performing photoelectric testing on the pixel array.

[0064] Step S420: Provide an LED module including a pixel array and a driver array.

[0065] Furthermore, the pixel array provided in this step is, for example, a pixel array that has undergone photoelectric detection and whose detection result is qualified. The driving array includes a driving circuit, a plurality of pixel circuits corresponding one-to-one with each LED light-emitting diode 130 in the pixel array 100, and a plurality of communication pins corresponding one-to-one with the plurality of pixel circuits.

[0066] For example, such as Figure 3 As shown, the driving array 200 includes, for example, a plurality of pixel circuits 210 located in the central region, each corresponding to one of the LEDs 130 in the pixel array 100, and a plurality of communication pins 220 located in the edge region. Further, the driving array 200 also includes driving circuits 230 located in the edge region. The driving circuits 230 provide, for example, row control signals, column control signals, gate voltages, reference voltages, reference currents, etc. The driving circuits 230 are controlled by an external host via the communication pins 220, thereby adjusting the driving current output by the pixel circuits to the corresponding LEDs in the pixel array 100. Figure 3 The driving circuit 230 shown in the example is only a schematic diagram of the position of the driving circuit 230 in the driving array 200, and does not limit the number of integrated chips of the driving circuit 230.

[0067] Taking the N-type LED design in this embodiment as an example, the pixel circuit in the driving array 200 is driven by a current source, for example. It should be noted that when the pixel array has at least a portion of N-type LEDs, the pixel circuit in the driving array 200 is driven by a current sink, for example.

[0068] Furthermore, the first electrode of each LED in the pixel array is bonded to the first electrode of the corresponding pixel circuit in the driving array, and the second electrode of each LED in the pixel array is bonded to the second electrode of the corresponding pixel circuit in the driving array to form an LED module.

[0069] like Figure 4 As shown, an LED module 300 is formed by bonding the first electrode 101 of each LED light-emitting diode 130 in the pixel array 100 to the first electrode in the corresponding pixel circuit in the driving array 200, and bonding the second electrode 101 of each LED light-emitting diode 130 in the pixel array 100 to the second electrode in the corresponding pixel circuit in the driving array 200. Further, the bonding process can be, for example, a die-to-die process, a die-to-wafer process, or a wafer-to-wafer process. The bonding metal can be one or a combination of several metals selected from Au, Sn, Al, Ni, Pt, Ti, In, and Cr. The bonding temperature is either room temperature or high temperature bonding (e.g., 22℃-500℃).

[0070] Step S430: Place the LED module on the tester and connect the multiple communication pins in the LED module to the multiple bumps or probes of the tester one by one.

[0071] Furthermore, this includes: the tester obtaining the position and spacing of multiple communication pins; the tester adjusting the position and spacing of multiple bumps or probes based on the position and spacing of the multiple communication pins, so that the multiple communication pins correspond one-to-one with the multiple bumps or probes and are electrically connected.

[0072] Step S440: The testing machine performs photoelectric testing on the LED module and generates a corresponding compensation current to provide to the driver array. Further, see... Figure 8 Step S440 further includes:

[0073] Step S441: The tester provides test current to the drive array through multiple bumps or probes to multiple communication pins to light up the pixel array.

[0074] Step S442: The tester senses the first light test data of the pixel array and generates a compensation current based on the first light test data. Further, the tester sensing the first light test data of the pixel array includes: the tester steps along the light-collecting direction and performs multiple light collections to traverse the pixel array, obtaining multiple intermediate light test data; the first light test data is obtained based on the multiple intermediate light test data. Further, each light-collecting area includes m LEDs, where m is an integer, and the set of the multiple light-collecting areas constitutes the pixel array. Further, the light-collecting areas of adjacent light collection sequences partially overlap. Further, the light-collecting direction is a first direction, a second direction, or a serpentine pattern.

[0075] Step S443: The tester provides compensation current to the drive array through multiple bumps or probes to multiple communication pins to dim the pixel array.

[0076] like Figure 6 As shown, a tester 600 using MicroLED light-emitting diodes performs photoelectric detection on an LED module 300. Exemplarily, the tester 600 uses a transparent fixing device 520 to adsorb or clamp the LED module 300, wherein the material of the fixing device 520 includes, but is not limited to, glass. The tester 600 also includes a stage 610 to illuminate the pixel array 100. The tester 600 identifies the communication pins 220 in the LED module 300 and the probes 630 (or bumps 530) on the stage using an image acquisition device (e.g., a binocular focusing lens), and obtains the positions and spacing of multiple communication pins 220. Based on the positions and spacing of the multiple communication pins, the tester adjusts the positions and spacing of multiple bumps or probes to ensure that the multiple communication pins correspond one-to-one with and are electrically connected to the multiple bumps or probes. The tester 600 provides test current to the communication pins via bumps or probes, which in turn controls the drive circuit 230 in the drive array 200 and inputs drive current to the corresponding LED light-emitting diodes via the corresponding pixel circuit 210 to light up the pixel array 100, thereby testing the electrical and optical performance of the LED module 300 and obtaining first optical test data of the LED module 300. Further, the tester 600 applies a pressure of, for example, about 50g to ensure that the communication pins and bumps or probes form an electrical connection. Further, for example, the first optical test data is obtained via a photosensitive device 550.

[0077] Furthermore, one embodiment for obtaining the first light test data of the LED module 300 is as follows. For example... Figure 2As shown, the photosensitive device 550 of the test machine 600 steps along the light-collecting direction (e.g., along the first direction (X direction) indicated by the arrow) and performs multiple light collections to traverse the pixel array, obtaining multiple intermediate light test data, and obtaining the first light test data based on the multiple intermediate light test data. Exemplarily, each light-collecting area includes m LEDs (exemplarily, the light-collecting area includes 10×10 LEDs), where n is an integer. The set of the multiple light-collecting areas constitutes the pixel array. In this embodiment, the light-collecting areas of adjacent light collection sequences partially overlap. Specifically, the light-collecting area 121 of the first light collection and the light-collecting area 122 of the second light collection partially overlap.

[0078] In an alternative embodiment, with Figure 2 Taking the LED array shown as an example, during traversal, if each light-receiving area consists of 2×20 LEDs, then the light-receiving direction is the second direction (Y direction). The light-receiving areas for each traversal may partially overlap or not overlap. The collection of light-receiving areas from multiple traversals constitutes the pixel array.

[0079] In an alternative embodiment, with Figure 2 Taking the LED array shown as an example, during traversal, if each light-collecting area consists of 5×5 LEDs, the light-collecting direction is serpentine. The light-collecting areas for each collection may partially overlap or not. The collection of light-collecting areas from multiple collections constitutes the pixel array.

[0080] Furthermore, the test equipment 510 generates a compensation current based on the first light test data, and provides the compensation current to the drive array 200 through multiple bumps or multiple probes to multiple communication pins, so as to dim the pixel array 100 and improve the brightness consistency of the LED module 300.

[0081] For example, the pixel array 100 is illuminated in sections according to the light-receiving area of ​​matrix unit 110, and light is collected in a 5*10 matrix step along the first direction. Then, the overall light output brightness and uniformity of the LED module 300 are fitted to obtain the first light test data and automatically fed back to the test machine 600. The test machine 600 calculates the compensation current required for each LED or each matrix unit 110 to adjust the driving current of each LED, thereby improving the display effect and brightness consistency of the LED module.

[0082] The LED module packaging and testing method provided in this application involves bonding the first electrode of each LED in the pixel array to the first electrode of the corresponding pixel circuit in the driving array, and bonding the second electrode of each LED in the pixel array to the second electrode of the corresponding pixel circuit in the driving array to form an LED module. The LED module is then placed on a testing machine to perform photoelectric testing and generate a corresponding compensation current to be provided to the driving array. This application obtains the compensation current required by the pixel array through photoelectric testing of the LED module, thereby dimming the LEDs in the pixel array to improve the display effect and brightness consistency of the LED module.

[0083] Furthermore, this application performs a lighting test on the LEDs in the pixel array before forming the LED module, and discards any unqualified matrix units or pixel arrays to avoid integrating unqualified pixel arrays into the LED module. This improves the efficiency of photoelectric testing of the LED module.

[0084] Furthermore, the first electrodes of the LEDs in the pixel array of this application are connected to each other, which can reduce the number of bumps or probes electrically connected to the first electrodes in the testing machine, thereby improving testing efficiency.

[0085] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to effectively utilize the invention and its modifications. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A testing method for an LED module comprising a pixel array and a driving array, wherein the pixel array includes multiple LEDs, and the driving array includes a driving circuit, multiple communication pins, and multiple pixel circuits corresponding one-to-one with each LED in the pixel array, wherein... include: An LED module comprising a pixel array and a driving array is provided, wherein the first electrode of each LED light-emitting diode in the pixel array is bonded to the first electrode of the corresponding pixel circuit in the driving array, and the second electrode of each LED light-emitting diode in the pixel array is bonded to the second electrode of the corresponding pixel circuit in the driving array; The LED module is placed on the testing machine, and the multiple communication pins in the LED module are electrically connected to the multiple bumps or probes of the testing machine. as well as The testing machine performs photoelectric testing on the LED module and generates a corresponding compensation current to provide to the driving array.

2. The test method for an LED module comprising a pixel array and a driver array according to claim 1, wherein, The first electrodes of the plurality of LEDs are electrically connected to each other, and the second electrodes of each LED are independent of each other.

3. The test method for an LED module comprising a pixel array and a driver array according to claim 2, wherein, The first electrode of each LED is located around the second electrode, and the first electrodes of adjacent LEDs are connected to each other. The first electrode is one of an N electrode and a P electrode, and the second electrode is the other of an N electrode and a P electrode.

4. The test method for an LED module comprising a pixel array and a driver array according to claim 1, wherein, The testing machine performs photoelectric testing on the LED module and generates a corresponding compensation current to provide to the driving array, including: The test machine provides test current to the drive circuit of the drive array through the multiple bumps or multiple probes to illuminate the pixel array; The tester senses the first light test data of the pixel array and generates a compensation current based on the first light test data; The test machine provides the compensation current to the driving circuit of the driving array through the multiple bumps or multiple probes, and the driving circuit dims the pixel array according to the compensation current.

5. The test method for an LED module comprising a pixel array and a driver array according to claim 1, wherein, Connecting the plurality of communication pins in the LED module to the plurality of bumps or probes of the testing machine in a one-to-one manner includes: The test machine obtains the position and spacing of the plurality of communication pins; The testing machine adjusts the position and spacing of the multiple bumps or probes based on the position and spacing of the multiple communication pins, so that the multiple communication pins correspond one-to-one with the multiple bumps or probes and are electrically connected.

6. The test method for an LED module comprising a pixel array and a driver array according to claim 4, wherein, The first light test data sensed by the test machine from the pixel array includes: The test machine steps along the light-collecting direction and performs multiple light collections to traverse the pixel array and obtain multiple intermediate light test data. The first optical test data is obtained based on the multiple intermediate optical test data.

7. The test method for an LED module comprising a pixel array and a driver array according to claim 6, wherein, Each light-receiving area includes m LEDs, where m is an integer, and the collection of the light-receiving areas from multiple light-receiving events constitutes the pixel array.

8. The test method for an LED module comprising a pixel array and a driver array according to claim 6, wherein, The light-collecting areas of adjacent light-collecting sequences partially overlap.

9. The test method for an LED module comprising a pixel array and a driver array according to claim 6, wherein, The light-receiving direction is either a first direction, a second direction, or a serpentine pattern.

10. The test method for an LED module comprising a pixel array and a driver array according to claim 1, wherein, Providing the pixel array includes: Provide substrate; An epitaxial layer is formed on the substrate, the epitaxial layer comprising a first semiconductor layer, a light-emitting layer, and a second semiconductor layer sequentially formed on the surface of the substrate; Steps are formed on the epitaxial layer to form a plurality of LED functional units, wherein at least a portion of the first semiconductor layer and the second semiconductor layer in each LED functional unit are exposed to the outside; A first electrode is formed in each LED functional unit and is electrically connected to one of the first semiconductor layer and the second semiconductor layer; A second electrode is formed in each LED functional unit, which is electrically connected to the first semiconductor layer and the second semiconductor layer.

11. The test method for an LED module comprising a pixel array and a driver array according to claim 2, wherein, Also includes: The test machine provides a test current to the pixel array to illuminate the pixel array.

12. The test method for an LED module comprising a pixel array and a driver array according to claim 11, wherein, The testing machine provides a test current to the pixel array to illuminate the pixel array, including: The first electrodes of the plurality of LEDs in the pixel array are electrically connected to the first bump or the first type of probe of the test machine, and the second electrodes of the plurality of LEDs in the pixel array are electrically connected to the second bump or the second type of probe of the test machine to provide test current to the pixel array.

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