Electronic device

Abstract

The invention discloses an electronic device. The electronic equipment comprises a heat source, a soaking piece, a first heat dissipation piece, a second heat dissipation piece, a thermoelectric refrigerating unit and a fan. The soaking piece is located on one side of the heat source and conducts heat with the heat source; the first heat dissipation piece and the heat source are arranged corresponding to different positions of the soaking piece, the first heat dissipation piece comprises a first sub-bearing piece, a second sub-bearing piece and a plurality of first heat dissipation fins, the first sub-bearing piece is provided with a through hole, the first sub-bearing piece and the second sub-bearing piece form a first containing space, and the first heat dissipation fins are located in the first containing space; at least part of the first heat dissipation piece corresponds to the through hole so as to be in direct contact with the soaking piece; the thermoelectric refrigerating unit is arranged on the side, deviating from the soaking piece, of the first heat dissipation piece and provided with a cold face and a hot face, and the hot face deviates from the first heat dissipation piece compared with the cold face; the second heat dissipation piece is located on one side of the hot face and provided with a second air channel. The fan communicates with the first and second air ducts. The electronic equipment disclosed by the invention has a relatively good heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of communication technology, specifically to an electronic device. Background Technology

[0002] With technological advancements, mobile phones and other electronic devices are becoming increasingly ubiquitous and powerful. Consequently, the demands on heat dissipation in these devices are also rising. However, inadequate heat dissipation remains a persistent problem in related technologies. Summary of the Invention

[0003] In a first aspect, one embodiment of this application provides an electronic device, the electronic device comprising: Heat source; A heat spreader is located on one side of the heat source and conducts heat with the heat source; A first heat sink is located on the side of the heat spreader facing the heat source, and the first heat sink and the heat source are arranged at different positions on the heat spreader. The first heat sink includes a first sub-support member, a second sub-support member, and a plurality of first heat sink fins. The first sub-support member has a through hole. The second sub-support member is opposite to the first sub-support member and spaced apart to form a first receiving space. The first receiving space communicates with the through hole. The second sub-support member is further away from the heat spreader than the first sub-support member. The plurality of first heat sink fins are located in the first receiving space and are at least partially arranged corresponding to the through hole to directly contact the heat spreader. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the first heat sink that is away from the heat spreader. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the first heat sink relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan, the fan being connected to the first air duct and the fan being connected to the second air duct.

[0004] Secondly, embodiments of this application provide an electronic device, the electronic device comprising: Heat source; A heat spreader is located on one side of the heat source and conducts heat with the heat source; A first heat sink is located on the side of the heat spreader facing the heat source, and the first heat sink and the heat source are arranged at different positions on the heat spreader. The first heat sink includes a bracket, a first sub-support member, a second sub-support member, and a plurality of first heat dissipation fins. The bracket has a through hole. The first sub-support member is located on the side of the bracket away from the heat spreader. The first sub-support member is in direct contact with the heat spreader through the through hole. The second sub-support member is opposite to the first sub-support member and spaced apart to form a first receiving space. The second sub-support member is farther away from the heat spreader than the first sub-support member. The plurality of first heat dissipation fins are disposed in the first receiving space and abut against the first sub-support member and the second sub-support member. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the first heat sink away from the heat spreader. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the first heat sink relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan, the fan being connected to the first air duct and the fan being connected to the second air duct.

[0005] In summary, the electronic device provided by the embodiments of this application includes a heat source, a heat spreader, and a first heat sink. The heat spreader is located on one side of the heat source, and the first heat sink is located on the side of the heat spreader facing the heat source. The first heat sink and the heat source are arranged at different locations on the heat spreader. Therefore, in the electronic device provided by the embodiments of this application, the heat generated by the heat source is transferred to the first heat sink after being evenly distributed by the heat spreader. Furthermore, the arrangement of the heat source, the heat spreader, and the first heat sink allows the electronic device to have a smaller size in the stacking direction (also called the first direction) between the heat spreader and the heat source. In this embodiment, the first heat sink includes a first sub-support member with a through hole. A second sub-support member and the first sub-support member form the first receiving space. The first heat dissipation fin is located in the first receiving space, and the first heat dissipation fin is at least partially disposed corresponding to the through hole to directly contact the heat spreader. The energy of the heat spreader can be quickly transferred to the first heat dissipation fin and then to the second sub-support member via the first heat dissipation fin. The thermoelectric cooler is located on the side of the first heat sink away from the heat spreader. Therefore, when the thermoelectric cooler is in operation, it cools the first heat sink, transferring heat to the second heat sink to improve the heat dissipation effect. When the fan is in operation, airflow passes through both the first and second air ducts, further enhancing the heat dissipation effect. Attached Figure Description

[0006] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 A perspective view of an electronic device provided according to an embodiment of this application; Figure 2 One implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 3 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 4 for Figure 2 An exploded three-dimensional diagram of a portion of the structure of the electronic device shown. Figure 5 for Figure 2 or Figure 3 A detailed schematic diagram of the first heat sink shown in the image; Figure 6 This is a schematic diagram of the structure of a thermoelectric cooler provided in one embodiment of this application; Figure 7 A schematic diagram of a first heat dissipation fin provided in one embodiment of this application; Figure 8 for Figure 2 or Figure 3 Further detailed schematic diagram of the first heat sink shown; Figure 9 for Figure 2 or Figure 3 A detailed schematic diagram of the second heat sink shown; Figure 10 For another implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 11 for Figure 10 An exploded three-dimensional diagram of a portion of the structure of the electronic device shown. Figure 12 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 13 for Figure 12 An exploded three-dimensional diagram of a portion of the structure of the electronic device shown. Figure 14 A partial structural schematic diagram of an electronic device provided in another embodiment of this application; Figure 15 A partial structural schematic diagram of an electronic device provided in yet another embodiment of this application; Figure 16 A cross-sectional schematic diagram of some components of an electronic device provided in another embodiment; Figure 17 for Figure 16 An exploded three-dimensional diagram of the electronic device shown. Figure 18 for Figure 17 A schematic diagram of the structure of the first sub-supporting component in the first heat sink shown in the figure; Figure 19 for Figure 17 A detailed schematic diagram of the second heat sink shown; Figure 20 For another implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 21 for Figure 20 An exploded three-dimensional diagram of a portion of the structure of the electronic device shown. Figure 22 A cross-sectional schematic diagram of some components of an electronic device provided in yet another embodiment; Figure 23 for Figure 22 An exploded three-dimensional diagram of the electronic device shown. Figure 24 This is one embodiment of the present application. Figure 1 A schematic cross-sectional view of the provided electronic device along line II; Figure 25 for Figure 14 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 26 for Figure 15 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 27 This is a schematic diagram of an electronic device provided in yet another embodiment of this application. Detailed Implementation

[0007] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. In addition, the reference to "embodiment" or "implementation method" in this application means that a specific feature, structure or characteristic described in connection with the embodiment or implementation method can be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art will understand explicitly and implicitly that the embodiments described in this application can be combined with other embodiments. It should be noted that, for ease of explanation, the same reference numerals denote the same parts in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same parts are omitted in different embodiments.

[0008] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0009] This application provides an electronic device 1, which can be, but is not limited to, a mobile phone, watch, tablet computer, laptop computer, etc. This application uses a mobile phone as an example for illustration and description; however, this should not be construed as limiting the scope of this application. Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 A perspective view of an electronic device provided according to an embodiment of this application; Figure 2 One implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 3 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 4 for Figure 2The diagram shows a partial exploded perspective view of the structure of the electronic device 1. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and conducts heat with it. The first heat sink 130 is located on the side of the heat spreader 120 facing the heat source 110, and is arranged at different positions from the heat source 110 corresponding to the heat spreader 120. The first heat sink 130 includes a first sub-support member 131, a second sub-support member 132, and a plurality of first heat dissipation fins 133. The first sub-support member 131 has a through hole 131c. The second sub-support member 132 is opposite to and spaced apart from the first sub-support member 131 to form a first receiving space 130b. The first receiving space 130b communicates with the through hole 131c. The second sub-support member 132 is further away from the heat spreader 120 than the first sub-support member 131. The plurality of first heat dissipation fins 133 are located in the first receiving space 130b and are at least partially disposed corresponding to the through-hole 131c to directly contact the heat spreader 120. The first heat dissipation member 130 has a first airflow duct 130a. The thermoelectric cooler 140 is disposed on the side of the first heat dissipation member 130 away from the heat spreader 120. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b. The hot surface 140b is further away from the first heat dissipation member 130 than the cold surface 140a. The second heat dissipation member 150 is located on one side of the hot surface 140b. The second heat dissipation member 150 has a second airflow duct 150a. The fan 160 communicates with the first airflow duct 130a and the second airflow duct 150a.

[0010] In one embodiment, the heat source 110 is a functional device in the electronic device 1 that generates heat. The heat source 110 can be, but is not limited to, a central processing unit (CPU), a system-on-chip (SOC), a power management chip, or a camera, etc. This application does not limit the heat source 110. When the functional device is working, it generates heat. If the heat is not dissipated in time, the temperature of the functional device will become too high, which may damage the functional device or prevent it from performing its functions properly. Furthermore, when the temperature of the functional device is too high, it may also adversely affect other components around the functional device.

[0011] The heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b disposed opposite to each other. The heat spreader 120 is located on one side of the first heat dissipation surface 110a and conducts heat with the heat source 110. The heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b disposed opposite to each other along a first direction D1. In this embodiment, the first direction D1 is the thickness direction of the heat source 110. In the schematic diagram of this embodiment, the first heat dissipation surface 110a is the lower surface of the heat source 110, and the second heat dissipation surface 110b is the lower surface of the heat source 110. It can be understood that the positions of the first heat dissipation surface 110a and the second heat dissipation surface 110b will change depending on the placement posture of the electronic device 1. In this embodiment, the stacking direction of the heat spreader 120 and the heat source 110 is also the first direction D1.

[0012] It should be noted that the term "thermally conductive connection" mentioned in the electronic device 1 provided in this application is intended to indicate that one of the two components can transfer heat to the other, or that there is a heat transfer path between the two components. When the two components are "thermally conductive connected," one of the two components is fixed to the other; alternatively, one of the two components may not be fixed to the other. "Thermally conductive connection" should not be interpreted as meaning that one of the two components must necessarily be fixed to the other.

[0013] The heat spreader 120 is located on one side of the heat source 110 and is thermally connected to the heat source 110. Specifically, the heat spreader 120 is located on one side of the first heat dissipation surface 110a, and the heat spreader 120 can conduct heat with the first heat dissipation surface 110a. The heat spreader 120 being located on one side of the first heat dissipation surface 110a includes the heat spreader 120 being in direct contact with the first heat dissipation surface 110a, and also includes the heat spreader 120 being in indirect contact with the first heat dissipation surface 110a. The heat spreader 120 can receive the heat generated by the heat source 110. In other words, the heat generated by the heat source 110 can be transferred to the heat spreader 120. The heat generated by the heat source 110 is transferred to the heat spreader 120 and dissipated through the heat spreader 120. In one embodiment, the heat spreader 120 directly contacts the first heat dissipation surface 110a of the heat source 110 to conduct heat with the heat source 110. In another embodiment, the heat spreader 120 is indirectly in contact with the first heat dissipation surface 110a. For example, the heat spreader 120 conducts heat to the first heat dissipation surface 110a of the heat source 110 through a thermally conductive connector. This application does not limit the manner in which the heat spreader 120 is thermally connected to the heat source 110.

[0014] In one embodiment, the heat spreader 120 includes one or more sub-heat spreaders 120. The sub-heat spreader 120 includes one or more of the following: a vapor chamber (VC), a graphite sheet, a graphene sheet, a liquid cooling plate, and a thermally conductive metal sheet. See also... Figure 2 The heat spreader 120 includes a sub-heat spreader 120, and the sub-heat spreader 120 includes a heat spreader plate as an example.

[0015] Please see Figure 3 The heat spreader 120 includes two sub-heat spreaders 120 stacked on top of each other, as an example for illustration. This should not be construed as limiting the implementation of this application. In this embodiment, the two sub-heat spreaders 120 are a heat spreader plate and a graphite sheet, respectively. In other words, in this embodiment, the heat spreader 120 includes a heat spreader plate and a graphite sheet stacked on top of each other. For ease of description, the two sub-heat spreaders 120 are respectively named a first sub-heat spreader 121 and a second sub-heat spreader 122, which are stacked on top of each other. The first sub-heat spreader 121 includes a heat spreader plate (VC), and the second sub-heat spreader 122 includes a graphite sheet. The heat spreader plate can be, but is not limited to, a stainless steel heat spreader plate, a copper heat spreader plate, a stainless steel composite copper heat spreader plate, or an aluminum composite copper heat spreader plate. The thermally conductive metal sheet includes, but is not limited to, a copper sheet or an aluminum sheet. The second sub-heating element 122 of the heat-spreading element 120 is located away from the heat source 110 compared to the first sub-heating element 121.

[0016] In one embodiment, a portion of the heat spreader 120 is disposed corresponding to the heat source 110, and another portion of the heat spreader 120 protrudes from the outer periphery of the heat source 110. In other words, the orthographic projection of the heat source 110 onto the heat spreader 120 is located in a portion of the heat spreader 120. In the electronic device 1 provided in this application embodiment, a portion of the heat spreader 120 is disposed corresponding to the heat source 110, and another portion of the heat spreader 120 protrudes from the outer periphery of the heat source 110. Therefore, the heat spreader 120 is relatively large, and the heat generated by the heat source 110 can be better dispersed when transferred to the heat spreader 120, thereby improving the heat dissipation effect.

[0017] Please refer to the following: Figures 2 to 5 , Figure 5 for Figure 2 or Figure 3The diagram shows a detailed illustration of the first heat sink. The heat source 110 and the first heat sink 130 are arranged along a second direction D2. The second direction D2 intersects the first direction D1. In other words, the second direction D2 is different from the first direction D1. For example, in one embodiment, the second direction D2 is perpendicular to the first direction D1. In another embodiment, the second direction D2 is not perpendicular to the first direction D1. The arrangement of the heat source 110 and the first heat sink 130 along the second direction D2 fully utilizes the space in the second direction D2, making the size of the electronic device 1 relatively small in the first direction D1. In other words, the electronic device 1 provided in this application, with its heat source 110, heat spreader 120, and first heat sink 130, allows the electronic device 1 to have a smaller size in the stacking direction (also called the first direction D1) between the heat spreader 120 and the heat source 110.

[0018] In one embodiment, the first direction D1 is the thickness direction of the electronic device 1, and the second direction D2 is the width direction of the electronic device 1. Alternatively, in another embodiment, the first direction D1 is the thickness direction of the electronic device 1, and the second direction D2 is the length direction of the electronic device 1.

[0019] From the schematic view of this embodiment, the first sub-support member 131 is the component below the first heat sink 130, and the second sub-support member 132 is the component above the first heat sink 130. The first sub-support member 131 conducts heat with the heat spreader. The first sub-support member 131 is located on the side of the heat spreader facing the heat source 110. In other words, the first sub-support member 131 and the heat source 110 are both located on the same side of the heat spreader, and the first sub-support member 131 and the heat source 110 are respectively provided at different locations corresponding to the heat source 110. In this embodiment, the through hole 131c penetrates the surface of the first sub-support member 131 facing the heat spreader 120 and the surface of the first sub-support member 131 facing away from the heat spreader 120.

[0020] The second sub-support member 132 is further away from the heat spreader 120 than the first sub-support member 131. The second sub-support member 132 is disposed opposite to and spaced apart from the first sub-support member 131 in forming the first receiving space 130b. Since the first sub-support member 131 has the through hole 131c, the through hole 131c penetrates the first receiving space 130b.

[0021] The plurality of first heat dissipation fins 133 are located in the first receiving space 130b, and at least a portion of the first heat dissipation fins 133 are disposed corresponding to the through hole 131c. The first heat dissipation fins 133 are in direct contact with the heat spreader 120. Therefore, the heat from the heat spreader 120 can be quickly transferred to the first heat dissipation fins 133, and then transferred to the second sub-support member 132 via the first heat dissipation fins 133. The heat transferred to the second sub-support member 132 can be transferred to the hot surface 140b of the thermoelectric cooler 140 via the cold surface 140a, and then transferred to the second heat sink 150 via the heat source 110, thereby improving the heat dissipation effect. If airflow passes through the first air duct 130a of the first heat sink 130, the heat dissipation effect can be further accelerated.

[0022] In this embodiment, the first sub-support member 131, the second sub-support member 132, and the plurality of first heat dissipation fins 133 together form the first air duct 130a. In other embodiments, the plurality of first heat dissipation fins 133 cooperate with each other to form the first air duct 130a. In another embodiment, any one of the plurality of first heat dissipation fins 133, the first sub-support member 131, and the second sub-support member 132 cooperates to form the first air duct 130a.

[0023] The first sub-support member 131 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The first heat dissipation fin 133 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the first heat dissipation fin 133 may be the same as or different from that of the first sub-support member 131; no limitation is made here. The second sub-support member 132 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The first heat dissipation fin 133 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer.

[0024] Please see Figure 6 , Figure 6This is a schematic diagram of the structure of a thermoelectric cooler provided in one embodiment of this application. The thermoelectric cooler 140 (TEC) is also called a semiconductor cooler or a semiconductor refrigeration chip. A semiconductor refrigeration chip is generally composed of many N-type semiconductor particles and many P-type semiconductor particles arranged together. Specifically, the thermoelectric cooler 140 includes an N-type semiconductor 141 and a P-type semiconductor 142. The N-type semiconductor 141 and the P-type semiconductor 142 are connected by a conductor 143 to form a complete circuit. The conductor is typically copper, aluminum, or other metal. When current flows through the thermocouple pair formed by the N-type and P-type semiconductor materials, heat transfer occurs between the two ends, creating a temperature difference that forms a cold end and a hot end. The junction where current flows from the N-type semiconductor to the P-type semiconductor absorbs heat, becoming the cold end; the junction where current flows from the P-type semiconductor to the N-type semiconductor releases heat, becoming the hot end. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b, wherein the cold surface 140a corresponds to the cold end, and the hot surface 140b corresponds to the hot end. In this embodiment, the hot surface 140b of the thermoelectric cooler 140 is disposed opposite to the cold surface 140a. It should be noted that the cold surface 140a refers to the surface corresponding to the cold end when the thermoelectric cooler 140 is in the working state, and the hot surface 140b refers to the surface corresponding to the hot end when the thermoelectric cooler 140 is in operation; it is not a limitation on the working state of the thermoelectric cooler 140. The working state of the thermoelectric cooler 140 can be limited according to the specific situation of the electronic device 1. If the thermoelectric cooler 140 is in the working state, the temperature of the cold surface 140a is lower than the temperature of the hot surface 140b. If the thermoelectric cooler 140 is in the initial state, the temperature of the cold surface 140a is equal to or approximately equal to the temperature of the hot surface 140b.

[0025] The hot surface 140b of the thermoelectric cooler 140 is further away from the first heat sink 130 than the cold surface 140a. In other words, the cold surface 140a of the thermoelectric cooler 140 is closer to the first heat sink 130 than the hot surface 140b. The first heat sink 130 and the cold surface 140a are capable of conducting heat. Heat from the first heat sink 130 is transferred to the cold surface 140a. If the thermoelectric cooler 140 is in operation, heat from the cold surface 140a is transferred to the hot surface 140b. The temperature of the cold surface 140a is lower than the stable temperature of the hot surface 140b, thereby cooling the first heat sink 130 and improving the heat dissipation effect.

[0026] The second heat sink 150 is located on one side of the hot surface 140b, and the heat from the thermoelectric cooler 140 is conducted to the second heat sink 150 via the hot surface 140b. The second heat sink 150 may be in direct or indirect contact with the hot surface 140b of the thermoelectric cooler 140; this application does not limit this, as long as the heat from the thermoelectric cooler 140 can be transferred to the second heat sink 150 via the hot surface 140b. The second heat sink 150 has a second air duct 150a. Airflow in the second air duct 150a accelerates heat dissipation from the second heat sink 150, thereby accelerating the reduction of the temperature of the heat source 110.

[0027] Fan 160 is a heat dissipation device that accelerates airflow by being driven by electrical energy. Fan 160 can be, but is not limited to, a miniature centrifugal fan, a piezoelectric fan, or an axial fan, as long as it can actively move air from one side to the other. The number of fans 160 can be, but is not limited to, one or more sub-fans. If the electronic device 1 includes multiple sub-fans, these sub-fans can be connected in parallel, in series, or in a combination of series and parallel (which can be simply referred to as series + parallel) to further improve the heat dissipation effect. This can effectively increase airflow or overcome the system's air resistance.

[0028] The fan 160 is connected to the first air duct 130a. The fan 160 can draw air into the first air duct 130a or exhaust air out of the first air duct 130a to remove heat from the first heat sink 130, thereby accelerating the heat dissipation of the heat source 110.

[0029] Accordingly, the fan 160 is connected to the second air duct 150a. The fan 160 can draw air into the second air duct 150a or exhaust air from the second air duct 150a to remove heat from the second heat sink 150, thereby accelerating the heat dissipation of the heat source 110.

[0030] The electronic device 1 provided in this application embodiment includes a heat spreader 120, a first heat sink 130, and a second heat sink 150, all of which are passive heat dissipation devices. The thermoelectric cooler 140 and the fan 160 are both active heat dissipation devices. Compared to passive heat dissipation devices, active heat dissipation devices have a faster heat dissipation speed, thus achieving rapid heat dissipation. The electronic device 1 provided in this application embodiment includes a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. Appropriate heat dissipation strategies can be selected according to the actual situation of the electronic device 1. The heat dissipation strategies of the electronic device 1 will be described in detail later.

[0031] In summary, the electronic device 1 provided in this application includes a heat source 110, a heat spreader 120, and a first heat sink 130. The heat spreader 120 is located on one side of the heat source 110 and conducts heat with the heat source 110. The first heat sink 130 is located on the side of the heat spreader 120 facing the heat source 110, and the first heat sink 130 and the heat source 110 are arranged at different locations corresponding to the heat spreader 120. Therefore, in the electronic device 1 provided in this application, the heat generated by the heat source 110 is transferred to the first heat sink 130 after being heat-spread by the heat spreader 120. Furthermore, the arrangement of the heat source 110, the heat spreader 120, and the first heat sink 130 allows the electronic device 1 to have a smaller size in the stacking direction (also referred to as the first direction D1) between the heat spreader 120 and the heat source 110. In this embodiment, the first heat sink 130 includes a first sub-support member 131 with a through hole 131c. A second sub-support member 132 and the first sub-support member 131 form the first receiving space 130b. The first heat dissipation fin 133 is located in the first receiving space 130b and is at least partially disposed corresponding to the through hole 131c, so as to directly contact the heat spreader 120. The energy of the heat spreader 120 can be quickly transferred to the first heat dissipation fin 133 and then to the second sub-support member 132 via the first heat dissipation fin 133. The thermoelectric cooler 140 is disposed on the side of the first heat sink 130 away from the heat spreader 120. Therefore, if the thermoelectric cooler 140 is in operation, it cools the first heat sink 130, and the heat is transferred to the second heat sink 150 to improve the heat dissipation effect. If the fan 160 is in operation, airflow passes through the first air duct 130a and the second air duct 150a, further improving the heat dissipation effect.

[0032] Please see Figure 7 , Figure 7 This is a schematic diagram of a first heat dissipation fin provided in one embodiment of this application. The first heat dissipation fin 133 includes a fin body portion 1331 and a protrusion portion 1332. The fin body portion 1331 is located within the first receiving space 130b, and the fin body portion 1331 has a first end 1331a and a second end 1331b disposed opposite to each other. At least a portion of the first end 1331a abuts against the first sub-support member 131, and the second end 1331b abuts against the second sub-support member 132. The protrusion portion 1332 is connected to the first end 1331a, and the protrusion portion 1332 protrudes toward the second end 1331b in a direction pointing toward the first end 1331a. At least a portion of the protrusion portion 1332 is located within the through hole 131c, and the protrusion portion 1332 is in direct contact with the heat dissipation member 120.

[0033] The first heat dissipation fin 133 can be an integral structure or a separate structure; this application does not limit the specific implementation. In this embodiment, the first end 1331a and the second end 1331b of the fin body 1331 are opposite ends along the first direction D1. The first end 1331a is closer to the first sub-support member 131 than the second end 1331b, and a portion of the first end 1331a abuts against the first sub-support member 131. Therefore, heat transferred to the first sub-support member 131 can be transferred to the second end 1331b via the first end 1331a. Since the second end 1331b abuts against the second sub-support member 132, heat transferred to the second end 1331b can be transferred to the second sub-support member 132.

[0034] In this embodiment, the protrusion 1332 protrudes towards the second end 1331b in a direction pointing towards the first end 1331a. The protrusion 1332 is at least partially located within the through hole 131c and is in direct contact with the heat spreader 120. Therefore, the heat from the heat spreader 120 can be transferred to the fin body portion 1331 via the protrusion 1332. That is, the heat from the heat spreader 120 can be quickly transferred to the first heat dissipation fin 133, and then to the second sub-support member 132 via the first heat dissipation fin 133. The heat transferred to the second sub-support member 132 can be transferred to the hot surface 140b of the thermoelectric cooler 140 via the cold surface 140a, and then to the second heat sink 150 via the heat source 110, thereby improving the heat dissipation effect. If airflow passes through the first air duct 130a of the first heat sink 130, the heat dissipation effect can be further accelerated.

[0035] Please see Figure 8 , Figure 8 for Figure 2 or Figure 3 Further detailed schematic diagram of the first heat sink shown. The first sub-support member 131 includes a first sub-support portion 1311 and a second sub-support portion 1312 connected together. Figure 8 The boundary between the first sub-support portion 1311 and the second sub-support portion 1312 is indicated by a dashed line. The first sub-support portion 1311 has the through hole 131c. The first heat dissipation fin 133 is disposed corresponding to the first sub-support portion 1311 and avoids the second sub-support portion 1312. The second sub-support member 132 includes a third sub-support portion 1321 and a fourth sub-support portion 1322 connected together. Figure 8 The boundary between the third sub-support portion 1321 and the fourth sub-support portion 1322 is indicated by a dashed line. The third sub-support portion 1321 is disposed opposite to the first sub-support portion 1311. The first heat dissipation fin 133 is also disposed corresponding to the third sub-support portion 1321. The fourth sub-support portion 1322 is disposed opposite to the second sub-support portion 1312. The first heat dissipation fin 133 is also disposed corresponding to the third sub-support portion 1321, but avoids the fourth sub-support portion 1322. The fan 160 is disposed on the side of the fourth sub-support portion 1322 that is away from the second sub-support portion 1312.

[0036] In this embodiment, the first heat dissipation fin 133 is disposed corresponding to the first sub-support portion 1311 and avoids the second sub-support portion 1312; the first heat dissipation fin 133 is disposed corresponding to the third sub-support portion 1321 and avoids the fourth sub-support portion 1322; therefore, the first heat dissipation fin 133 is located within the space defined by the first sub-support portion 1311 and the third sub-support portion 1321; the first heat dissipation fin 133 avoids the space defined by the second sub-support portion 1312 and the fourth sub-support portion 1322; the fan 160 is disposed on the fourth sub-support portion 1322, and the fan 160 is disposed on the side of the fourth sub-support portion 1322 away from the second sub-support portion 1312, thereby facilitating the fan 160 to be disposed corresponding to the fourth sub-support portion 1322.

[0037] In this embodiment, the second sub-support portion 1312 is closer to the heat source 110 than the first sub-support portion 1311, and the fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321.

[0038] Furthermore, in this embodiment, the thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321. The cold surface 140a of the thermoelectric cooler 140 conducts heat with the third sub-support portion 1321. Therefore, the heat of the third sub-support portion 1321 can be quickly conducted and transferred to the cold surface 140a of the thermoelectric cooler 140, and then conducted to the hot surface 140b of the thermoelectric cooler 140 via the action of the thermoelectric cooler 140.

[0039] Please continue reading. Figures 1 to 4 and Figure 8 The thermoelectric cooler 140 is located on the side of the third sub-support portion 1321 opposite to the first sub-support portion 1311. In addition to the cold surface 140a and the heat source 110, the thermoelectric cooler 140 also has a peripheral surface 140c. The peripheral surface 140c connects to the cold surface 140a and the hot surface 140b, and is a surface surrounding the periphery of the thermoelectric cooler 140. In the schematic diagram of this embodiment, the peripheral surface 140c is marked on the left side of the diagram for illustrative purposes; however, this should not be construed as a limitation of the embodiment of this application. In a preset direction D0, the first heat dissipation fin 133 at least partially protrudes from the peripheral surface 140c. The preset direction D0 is a direction perpendicular to the cold surface 140a and pointing towards the hot surface 140b.

[0040] In this embodiment, in the preset direction D0, the first heat dissipation fin 133 at least partially protrudes from the peripheral surface 140c of the thermoelectric cooler 140. Therefore, the first heat dissipation fin 133 is relatively large, enabling it to quickly transfer heat from the heat spreader 120 to the cold surface 140a of the thermoelectric cooler 140. Figure 3 In this configuration, the left side of the first heat sink 133 protrudes beyond the left side of the peripheral surface 140c of the thermoelectric cooler 140. When the thermoelectric cooler 140 is in operation, it cools the first heat sink 130, transferring heat to the second heat sink 150 to improve heat dissipation. When the fan 160 is in operation, airflow passes through both the first air duct 130a and the second air duct 150a, further enhancing the heat dissipation effect.

[0041] Furthermore, in one embodiment, both the fan 160 and the second heat sink 150 are located on the side of the first heat sink 130 away from the heat spreader, and the fan 160 is closer to the heat source 110 than the second heat sink 150.

[0042] In this embodiment, the fourth sub-support portion 1322 is closer to the heat source 110 than the third sub-support portion 1321. The thermoelectric cooler 140 is disposed corresponding to the third sub-support portion 1321, and the fan 160 is supported on the fourth sub-support portion 1322. Therefore, the fan 160 is closer to the heat source 110 than the thermoelectric cooler 140. In this embodiment, the fan 160 is closer to the heat source 110 than the second heat sink 150.

[0043] If the fan 160 is in operation, the fan 160 blows airflow from the first air duct 130a to the outside of the electronic device 1, and the fan 160 blows airflow from the second air duct 150a to the outside of the electronic device 1.

[0044] In this embodiment, the first air duct 130a has a first opening 131a adjacent to the fan 160 and a second opening 131b away from the fan 160. The second air duct 150a has a third opening 151a adjacent to the fan 160 and a fourth opening 151b away from the fan 160. In one embodiment, if the fan 160 is in operation: the fan 160 blows airflow into the first air duct 130a from the first opening 131a, and the airflow entering the first air duct 130a is blown out of the electronic device 1 through the second opening 131b; the fan 160 blows airflow into the second air duct 150a from the third opening 151a, and the airflow entering the second air duct 150a is blown out of the electronic device 1 through the fourth opening 151b.

[0045] Therefore, it can be seen that the electronic device 1 provided in this application embodiment has a positional relationship between the third sub-supporting part 1321 and the fourth sub-supporting part 1322 and the heat source 110. When the fan 160 is in working state, it can efficiently blow heat out of the first air duct 130a of the first heat sink 130 to the outside of the electronic device 1, and can also efficiently blow heat out of the second air duct 150a of the second heat sink 150 to the outside of the electronic device 1.

[0046] Please see Figure 9 , Figure 9 for Figure 2 or Figure 3The diagram shows a detailed illustration of the second heat sink. The second heat sink 150 further includes a third sub-support member 151, a fourth sub-support member 152, and a second heat dissipation fin 153. The third sub-support member 151 is disposed on the side of the hot surface 140b facing away from the cold surface 140a, and the third sub-support member 151 conducts heat with the hot surface 140b. The fourth sub-support member 152 is opposite to the third sub-support member 151 and spaced apart to form a second receiving space 150b, and the fourth sub-support member 152 is further away from the thermoelectric cooler 140 than the third sub-support member 151. The second heat dissipation fin 153 is located in the second receiving space 150b, with one end of the second heat dissipation fin 153 abutting against the third sub-support member 151 and the other end of the second heat dissipation fin 153 abutting against the fourth sub-support member 152.

[0047] In this embodiment, the third sub-support member 151 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The second heat dissipation fin 153 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the second heat dissipation fin 153 may be the same as or different from that of the third sub-support member 151, and is not limited thereto. The fourth sub-support member 152 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the fourth sub-support member 152 may be the same as or different from that of the third sub-support member 151, and is not limited thereto.

[0048] One end of the second heat dissipation fin 153 abuts against the third sub-support member 151, and the other end of the second heat dissipation fin 153 abuts against the fourth sub-support member 152. Therefore, the heat transferred from the heat source 110 of the thermoelectric cooler 140 to the third sub-support member 151 can be quickly transferred to the second heat dissipation fin 153, and then quickly transferred to the fourth sub-support member 152 via the second heat dissipation fin 153, thereby improving the heat dissipation effect. Furthermore, if the airflow in the second air duct 150a is accelerated, the heat dissipation of the second heat dissipation member 150 can be accelerated, thereby accelerating the reduction of the temperature of the heat source 110.

[0049] Please continue reading. Figures 1 to 4 The thermoelectric cooler 140 further has a peripheral surface 140c, which is connected to the cold surface 140a and the hot surface 140b. The second heat dissipation fin 153 protrudes at least partially from the peripheral surface 140c in a predetermined direction D0. The predetermined direction D0 is a direction perpendicular to the cold surface 140a and pointing towards the hot surface 140b.

[0050] The peripheral surface 140c is bent and connected to the cold surface 140a, and the peripheral surface 140c is bent and connected to the hot surface 140b. In the preset direction D0, the second heat dissipation fin 153 at least partially protrudes from the peripheral surface 140c. Figure 3 In this configuration, the left side of the second heat dissipation fin 153 protrudes from the left side of the peripheral surface 140c of the thermoelectric cooler 140, and the right side of the second heat dissipation fin 153 protrudes from the right side of the peripheral surface 140c of the thermoelectric cooler 140. Therefore, the second heat dissipation fin 153 has a relatively large volume, which can improve the heat dissipation effect of the second heat sink 150.

[0051] Please see Figure 10 and Figure 11 , Figure 10 For another implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 11 for Figure 10 The diagram shows a partial exploded perspective view of the electronic device. The electronic device 1 provided in this embodiment and... Figure 2 The electronic device 1 provided in the previous embodiment is the same as that provided in the previous embodiment, except that in this embodiment, the electronic device 1 further includes a first circuit board 171, a first electronic device 181, a second circuit board 172, a second electronic device 182, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is carried on the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182.

[0052] The first circuit board 171 can be, but is not limited to, a printed circuit board (PCB). The heat source 110 and the first electronic device 181 are located on opposite sides of the first circuit board 171. The second circuit board 172 can be, but is not limited to, a printed circuit board (PCB). The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is supported by the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. Thus, the first circuit board 171 and the second circuit board 172 are stacked. In the electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can also be referred to as a stacked board.

[0053] The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182 to reduce or even eliminate electromagnetic interference from the second electronic device 182 to other devices outside the shielding cover 190; correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the second electronic device 182 inside the electromagnetic shielding cover 190.

[0054] In this embodiment, the second circuit board 172 and the first circuit board 171 are stacked along the first direction D1. The heat source 110 and the first heat sink 130 are arranged in the second direction D2. The second direction D2 intersects the first direction D1. In one embodiment, the second direction D2 is different from the first direction D1. For example, the second direction D2 is perpendicular to or not perpendicular to the first direction D1. In one embodiment, the second direction D2 is the same as or opposite to the preset direction D0. In this embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can fully utilize the space of the electronic device 1 in the first direction D1 and reduce the space occupied in the second direction D2.

[0055] Please refer to the following: Figure 12 and Figure 13 , Figure 12 Another implementation Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 13 for Figure 12The diagram shows a partial exploded perspective view of the structure of the electronic device 1. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat source 110 has a first heat dissipation surface 110a and a second heat dissipation surface 110b arranged opposite each other. The heat spreader 120 is located on one side of the first heat dissipation surface 110a and conducts heat with the heat source 110. The first heat sink 130 is located on the side of the heat spreader 120 facing the heat source 110, and the first heat sink 130 and the heat source 110 are arranged at different positions corresponding to the heat spreader 120. The first heat sink 130 includes a first sub-support member 131, a second sub-support member 132, and a plurality of first heat dissipation fins 133. The first sub-support member 131 has a through hole 131c. The second sub-support member 132 is opposite to and spaced apart from the first sub-support member 131 to form a first receiving space 130b. The first receiving space 130b communicates with the through hole 131c. The second sub-support member 132 is further away from the heat spreader 120 than the first sub-support member 131. The plurality of first heat dissipation fins 133 are located in the first receiving space 130b and are at least partially disposed corresponding to the through hole 131c to directly contact the heat spreader 120. The first heat dissipation member 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on the side of the first heat dissipation member 130 away from the heat spreader 120. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b. The hot surface 140b is further away from the first heat dissipation member 130 than the cold surface 140a. The second heat dissipation member 150 is located on one side of the hot surface 140b. The second heat dissipation member 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0056] The heat source 110, the heat spreader 120, the first heat sink 130, the thermoelectric cooler 140, the second heat sink 150, and the fan 160 are described above and will not be repeated here. The electronic device 1 provided in this embodiment and Figure 2 or Figure 3 The electronic devices in them are basically the same, except that... Figure 2The corresponding embodiment provides an electronic device 1 that is a stacked board, while the electronic device 1 provided in this application is a single board, as described in detail below. In this embodiment, the electronic device 1 further includes a first circuit board 171, a first electronic device 181, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110, and the shielding cover 190 is used to house the first electronic device 181.

[0057] In this embodiment, the first circuit board 171 can be, but is not limited to, a printed circuit board. In this embodiment, the heat source 110 and the first electronic device 181 are respectively disposed on opposite sides of the first circuit board 171 along the thickness direction.

[0058] The electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171 and the first electronic device 181, is also referred to as a single board.

[0059] The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is used to house the first electronic device 181 to reduce or even eliminate electromagnetic interference from the first electronic device 181 to other devices outside the shielding cover 190. Correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the electronic device 180 inside the electromagnetic shielding cover 190.

[0060] Compared to Figure 2 Regarding the electronic device 1 in the corresponding embodiment, the layout of the first circuit board 171 and the first electronic device 181 in the electronic device 1 provided in this application embodiment can reduce the occupancy of the first direction D1 by utilizing the size of the second direction D2.

[0061] Furthermore, in conjunction with the electronic device 1 in any of the preceding embodiments, the electronic device 1 provided in this application includes at least one of the first connector 210 and the second connector 220. Figure 23 Please refer to the following: Figure 10 and Figure 14 Or refer to Figure 12 and Figure 15 , Figure 14 A partial structural schematic diagram of an electronic device provided in another embodiment of this application; Figure 15This is a partial structural schematic diagram of an electronic device provided in yet another embodiment of this application. Figure 14 and Figure 10 The difference in the corresponding electronic device 1 is that, Figure 14 The corresponding electronic device 1 also includes a first connector 210 and a second connector 220. Figure 15 and Figure 12 The difference in the corresponding electronic device 1 is that, Figure 15 The corresponding electronic device 1 also includes a first connector 210 and a second connector 220. In the schematic diagram of this embodiment, the electronic device 1 including the first connector 210 and the second connector 220 is used as an example for illustration; it should be understood that this should not be construed as a limitation on the embodiments of this application. The electronic device 1 also includes at least one of the first connector 210 and the second connector 220, which can be incorporated into the electronic device 1 provided in any of the preceding embodiments. Figure 14 and Figure 15 The electronic device 1 shown should not be construed as a limitation on the electronic device 1 provided in the embodiments of this application. In this embodiment, the electronic device 1 further includes a first connector 210. The first connector 210 is used for thermally connecting the heat source 110 and the heat spreader 120.

[0062] The first connector 210 can also be referred to as the first thermally conductive connector. The first thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermal pad, thermal gel, thermal grease, and liquid metal. In another embodiment, the first thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in the conventional foam may be filled with thermal gel, thermal grease, or liquid metal.

[0063] The electronic device 1 includes the first connector 210, which thermally connects the heat source 110 and the heat spreader 120, thereby enabling the heat generated by the heat source 110 to be quickly transferred to the heat spreader 120 via the first connector 210, thus improving the heat dissipation effect of the electronic device 1.

[0064] Furthermore, in one embodiment, the electronic device 1 further includes a second connector 220, which is used for thermally conductively connecting the shielding cover 190 to the electronic device housed within the shielding cover 190. Figure 14 In this configuration, the second connector 220 provides a thermally conductive connection between the second electronic device 182 and the shielding cover 190. Figure 15 In this configuration, the second connector 220 is used for thermally conductive connection between the first electronic device 181 and the shielding cover 190.

[0065] The second connector 220 can also be referred to as the second thermally conductive connector. The second thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, thermally conductive gel, thermally conductive silicone grease, and liquid metal. In another embodiment, the second thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in conventional foam may be filled with thermally conductive gel, thermally conductive silicone grease, or liquid metal. The second connector 220 and the first connector 210 may be of the same type or different, and this embodiment is not limited thereto.

[0066] The electronic device 1 includes the second connector 220, which thermally connects the electronic device housed in the shielding cover 190 to the shielding cover 190. This allows the heat source 110 and the heat generated by the heat source 110 to be quickly transferred to the shielding cover 190 via the second connector 220, and the heat transferred to the shielding cover 190 to be quickly dissipated, thereby improving the heat dissipation effect of the electronic device 1.

[0067] Please refer to the following: Figure 1 , Figure 16 and Figure 17 , Figure 16 A cross-sectional schematic diagram of some components of an electronic device provided in another embodiment; Figure 17 for Figure 16The diagram shows an exploded perspective view of the electronic device 1. The electronic device 1 includes a heat source 110, a heat spreader 120, a first heat sink 130, a thermoelectric cooler 140, a second heat sink 150, and a fan 160. The heat spreader 120 is located on one side of the heat source 110 and conducts heat with the heat source 110. The first heat sink 130 is located on the side of the heat spreader 120 facing the heat source 110, and the first heat sink 130 is arranged at a different position from the heat source 110 corresponding to the heat spreader 120. The first heat sink 130 includes a bracket 135, a first sub-support member 131, a second sub-support member 132, and a plurality of first heat dissipation fins 133. The bracket 135 has a through hole 135a. The first sub-support member 131 is located on the side of the bracket 135 opposite to the heat spreader 120. The first sub-support member 131 is in direct contact with the heat spreader 120 through the through hole 135a. The second sub-support member 132 is opposite to the first sub-support member 131 and spaced apart to form a first receiving space 130b. The second sub-support member 132 is farther away from the heat spreader 120 than the first sub-support member 131. The plurality of first heat dissipation fins 133 are disposed in the first receiving space 130b and abut against the first sub-support member 131 and the second sub-support member 132. The first heat dissipation member 130 has a first air duct 130a. The thermoelectric cooler 140 is disposed on the side of the first heat dissipation member 130 opposite to the heat spreader 120. The thermoelectric cooler 140 has a cold surface 140a and a hot surface 140b. The hot surface 140b is farther away from the first heat dissipation member 130 than the cold surface 140a. The second heat sink 150 is located on one side of the hot surface 140b. The second heat sink 150 has a second air duct 150a. The fan 160 is connected to the first air duct 130a and the second air duct 150a.

[0068] In this embodiment, the heat source 110, the heat spreader 120, the thermoelectric cooler 140, the second heat sink 150, and the fan 160 are described above and will not be repeated here.

[0069] The electronic device 1 provided in this embodiment and Figure 2 The difference between the electronic device 1 provided in the corresponding embodiment and the one provided in this embodiment is that the structure of the first heat sink 130 is different. Figure 2The structures of the first heat sink 130 in the corresponding embodiments of the electronic device 1 are different. Specifically, in this embodiment, the first heat sink 130 includes a bracket 135, which supports and accommodates the first sub-support member 131. Further, in one embodiment, the bracket 135 is also used to accommodate at least one of the thermoelectric cooler 140, the second heat sink 150, and the fan 160. Thus, the bracket 135 can improve the modularity of the electronic device 1, at least facilitating the assembly of the first heat sink 130 in the electronic device 1 with other components. The through hole 135a of the bracket 135 penetrates the surface of the bracket 135 facing the heat spreader 120 and the surface of the bracket 135 away from the heat spreader 120.

[0070] The first sub-support member 131 is in direct contact with the heat spreader 120 through the through hole 135a, thus the heat from the heat spreader 120 can be quickly transferred to the first sub-support member 131. The first sub-support member 131 and the second sub-support member 132 cooperate to house the first heat dissipation fin 133. The first heat dissipation fin 133 is disposed in the first receiving space 130b and abuts against the first sub-support member 131 and the second sub-support member 132. Therefore, after the heat from the heat spreader 120 is transferred to the first sub-support member 131, it can be quickly transferred to the second sub-support member 132 via the first heat dissipation fin 133. The heat transferred to the second sub-support member 132 can be transferred to the hot surface 140b of the thermoelectric cooler 140 via the cold surface 140a, and then to the second heat sink 150 via the heat source 110, thereby improving the heat dissipation effect. If airflow passes through the first air duct 130a of the first heat sink 130, the heat dissipation effect can be further accelerated.

[0071] In this embodiment, the first sub-support member 131, the second sub-support member 132, and the plurality of first heat dissipation fins 133 together form the first air duct 130a. In other embodiments, the plurality of first heat dissipation fins 133 cooperate with each other to form the first air duct 130a. In another embodiment, any one of the plurality of first heat dissipation fins 133, the first sub-support member 131, and the second sub-support member 132 cooperates to form the first air duct 130a.

[0072] The first sub-support member 131 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The first heat dissipation fin 133 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the first heat dissipation fin 133 may be the same as or different from that of the first sub-support member 131; this is not limited here. The second sub-support member 132 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The second heat dissipation fin 153134 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer.

[0073] In summary, the electronic device 1 provided in this application includes a heat source 110, a heat spreader 120, and a first heat sink 130. The heat spreader 120 is located on one side of the first heat dissipation surface 110a of the heat source 110, and the first heat sink 130 is located on the side of the heat spreader 120 facing the heat source 110. The first heat sink 130 and the heat source 110 are arranged at different locations corresponding to the heat spreader 120. Therefore, in the electronic device 1 provided in this application, the heat generated by the heat source 110 is evenly distributed through the heat spreader 120 and then transferred to the first heat sink 130. Furthermore, the arrangement of the heat source 110, the heat spreader 120, and the first heat sink 130 allows the electronic device 1 to have a smaller size in the stacking direction (also referred to as the first direction D1) between the heat spreader 120 and the heat source 110. In this embodiment, the first heat sink 130 includes a bracket 135, a first sub-support member 131, a second sub-support member 132, and a plurality of first heat dissipation fins 133. The bracket 135 has a through hole 135a. The first sub-support member 131 is located on the side of the bracket 135 opposite to the heat spreader 120. The first sub-support member 131 is in direct contact with the heat spreader 120 through the through hole 135a. Therefore, the heat from the heat spreader 120 can be quickly transferred to the first sub-support member 131. Since the first heat dissipation fins 133 abut against the first sub-support member 131 and the second sub-support member 132, the heat transferred to the first sub-support member 131 can be quickly transferred to the first heat dissipation fins 133, and then quickly transferred to the second sub-support member 132 via the first heat dissipation fins 133, thereby improving the heat dissipation effect. The thermoelectric cooler 140 is disposed on the side of the first heat sink 130 away from the heat spreader 120. Therefore, when the thermoelectric cooler 140 is in operation, it cools the first heat sink 130, transferring heat to the second heat sink 150 to improve the heat dissipation effect. When the fan 160 is in operation, airflow passes through both the first air duct 130a and the second air duct 150a, further enhancing the heat dissipation effect.

[0074] Please see Figures 16 to 18 , Figure 18 for Figure 17 The diagram shows the structure of the first sub-support member in the first heat sink. The first sub-support member 131 has a support body portion 1313 and a protrusion portion 1314. The support body portion 1313 is located on the side of the bracket 135 opposite to the heat spreader 120. The protrusion portion 1314 is connected to the support body portion 1313 and protrudes toward the bracket 135. At least a portion of the protrusion portion 1314 is located in the through hole 135a, and the protrusion portion 1314 is in direct contact with the heat spreader 120.

[0075] In this embodiment, the first sub-support member 131 has a support body portion 1313 and a protrusion portion 1314. The protrusion portion 1314 is connected to the support body portion 1313 and protrudes toward the bracket 135. At least a portion of the protrusion portion 1314 is located in the through hole 135a of the bracket 135, and the protrusion portion 1314 is in direct contact with the heat spreader 120. Therefore, the heat of the heat spreader 120 can be quickly transferred to the protrusion portion 1314 and then to the support body portion 1313 via the protrusion portion 1314, thereby realizing the rapid transfer of the heat of the heat spreader 120 to the first sub-support member 131.

[0076] Furthermore, in the first sub-carrier 131 of the electronic device 1 provided in this application embodiment, at least a portion of the protrusion 1314 is located in the through hole 135a. The first sub-carrier 131 and the bracket 135 are limited by the protrusion 1314 of the first sub-carrier 131 and the through hole 135a of the bracket 135, thereby eliminating the need for additional limiting members.

[0077] Please see Figure 19 , Figure 19 for Figure 17The diagram shows a detailed illustration of the second heat sink. The second heat sink 150 further includes a third sub-support member 151, a fourth sub-support member 152, and a second heat dissipation fin 153. The third sub-support member 151 is disposed on the side of the hot surface 140b facing away from the cold surface 140a, and the third sub-support member 151 conducts heat with the hot surface 140b. The fourth sub-support member 152 is opposite to the third sub-support member 151 and spaced apart to form a second receiving space 150b, and the fourth sub-support member 152 is further away from the thermoelectric cooler 140 than the third sub-support member 151. The second heat dissipation fin 153 is located in the second receiving space 150b, with one end of the second heat dissipation fin 153 abutting against the third sub-support member 151 and the other end of the second heat dissipation fin 153 abutting against the fourth sub-support member 152.

[0078] In this embodiment, the third sub-support member 151 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The second heat dissipation fin 153 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the second heat dissipation fin 153 may be the same as or different from that of the third sub-support member 151, and is not limited thereto. The fourth sub-support member 152 may include, but is not limited to, aluminum, copper, graphite, and a high thermal conductivity polymer. The material of the fourth sub-support member 152 may be the same as or different from that of the third sub-support member 151, and is not limited thereto.

[0079] One end of the second heat dissipation fin 153 abuts against the third sub-support member 151, and the other end of the second heat dissipation fin 153 abuts against the fourth sub-support member 152. Therefore, the heat transferred from the heat source 110 of the thermoelectric cooler 140 to the third sub-support member 151 can be quickly transferred to the second heat dissipation fin 153, and then quickly transferred to the fourth sub-support member 152 via the second heat dissipation fin 153, thereby improving the heat dissipation effect. Furthermore, if the airflow in the second air duct 150a is accelerated, the heat dissipation of the second heat dissipation member 150 can be accelerated, thereby accelerating the reduction of the temperature of the heat source 110.

[0080] Further, please refer to Figure 16 and Figure 17 The thermoelectric cooler 140 further has a peripheral surface 140c, which is connected to the cold surface 140a and the hot surface 140b. The second heat dissipation fin 153 protrudes from the peripheral surface 140c.

[0081] The peripheral surface 140c is bent and connected to the cold surface 140a, and the peripheral surface 140c is bent and connected to the hot surface 140b. The second heat dissipation fin 153 protrudes from the peripheral surface 140c. Therefore, the volume of the second heat dissipation fin 153 is relatively large, which can improve the heat dissipation effect of the second heat sink 150.

[0082] Furthermore, please refer to the following: Figure 20 and Figure 21 , Figure 20 For another implementation method Figure 1 A cross-sectional schematic diagram of some components of an electronic device; Figure 21 for Figure 20 The diagram shows a partial exploded perspective view of the electronic device. The electronic device 1 provided in this embodiment and... Figure 16 The corresponding electronic device 1 is basically the same, except that in this embodiment, the electronic device 1 further includes a first circuit board 171, a first electronic device 181, a second circuit board 172, a second electronic device 182, and a shielding cover 190. The first circuit board 171 is used to carry the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is carried on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is carried on the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182.

[0083] The first circuit board 171 can be, but is not limited to, a printed circuit board (PCB). The heat source 110 and the first electronic device 181 are located on opposite sides of the first circuit board 171. The second circuit board 172 can be, but is not limited to, a printed circuit board (PCB). The second circuit board 172 is disposed on the side of the first electronic device 181 opposite to the first circuit board 171. The second electronic device 182 is supported by the second circuit board 172 and is located on the side of the second circuit board 172 opposite to the first circuit board 171. Thus, the first circuit board 171 and the second circuit board 172 are stacked. In the electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can also be referred to as a stacked board.

[0084] The shielding cover 190 is located on the side of the second circuit board 172 opposite to the first circuit board 171 and is used to house the second electronic device 182 to reduce or even eliminate electromagnetic interference from the second electronic device 182 to other devices outside the shielding cover 190; correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the second electronic device 182 inside the electromagnetic shielding cover 190.

[0085] In this embodiment, the second circuit board 172 and the first circuit board 171 are stacked along the first direction D1. The heat source 110 and the first heat sink 130 are arranged in the second direction D2. In this embodiment, the arrangement of the heat source 110, the first circuit board 171, the first electronic device 181, the second circuit board 172, and the second electronic device 182 can make full use of the space of the electronic device 1 in the first direction D1 and reduce the space occupied in the second direction D2.

[0086] Please see Figure 22 and Figure 23 , Figure 22 A cross-sectional schematic diagram of some components of an electronic device provided in yet another embodiment; Figure 23 for Figure 22 The diagram shows an exploded perspective view of the electronic device. The heat source 110, the heat spreader 120, the first heat sink 130, the thermoelectric cooler 140, the second heat sink 150, and the fan 160 are described previously and will not be repeated here. Figure 16 and Figure 17The electronic devices in them are basically the same, except that... Figure 16 The corresponding embodiment provides an electronic device 1 that is a stacked board, while the electronic device 1 provided in this application is a single board, as described in detail below. The electronic device 1 further includes a first circuit board 171, a first electronic device 181, and a shielding cover 190. The first circuit board 171 is used to support the heat source 110, and the first circuit board 171 is disposed on the side of the heat source 110 away from the heat spreader 120. The first electronic device 181 is supported on the first circuit board 171 and is located on the side of the first circuit board 171 opposite to the heat source 110. The shielding cover 190 is located on the side of the first circuit board 171 opposite to the heat source 110, and the shielding cover 190 is used to house the first electronic device 181.

[0087] In this embodiment, the first circuit board 171 can be, but is not limited to, a printed circuit board. In this embodiment, the heat source 110 and the first electronic device 181 are respectively disposed on opposite sides of the first circuit board 171 along the thickness direction.

[0088] The electronic device 1 provided in this application embodiment, the arrangement of the heat source 110, the first circuit board 171 and the first electronic device 181, is also referred to as a single board.

[0089] The shielding cover 190 is located on the side of the first circuit board 171 away from the heat source 110. The shielding cover 190 is used to house the first electronic device 181 to reduce or even eliminate electromagnetic interference from the first electronic device 181 to other devices outside the shielding cover 190. Correspondingly, the shielding cover 190 can also reduce or even eliminate electromagnetic interference from other devices outside the shielding cover 190 to the electronic device inside the electromagnetic shielding cover 190.

[0090] Compared to Figure 16 Regarding the electronic device 1 in the corresponding embodiment, the layout of the first circuit board 171 and the first electronic device 181 in the electronic device 1 provided in this application embodiment can reduce the size occupied by the first direction D1 by utilizing the size of the second direction D2.

[0091] Please continue reading. Figure 20 and Figure 21 ,or Figure 22 and Figure 23 The electronic device 1 provided in this application includes at least one of a first connector 210 and a second connector 220. In the schematic diagram of this embodiment, the electronic device 1 including the first connector 210 and the second connector 220 is used as an example for illustration; it should be understood that this should not be construed as a limitation of the embodiment of this application.

[0092] The first connector 210 can also be referred to as the first thermally conductive connector. The first thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermal pad, thermal gel, thermal grease, and liquid metal. In another embodiment, the first thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in the conventional foam may be filled with thermal gel, thermal grease, or liquid metal.

[0093] The electronic device 1 includes the first connector 210, which thermally connects the heat source 110 and the heat spreader 120, thereby enabling the heat generated by the heat source 110 to be quickly transferred to the heat spreader 120 via the first connector 210, thus improving the heat dissipation effect of the electronic device 1.

[0094] Furthermore, in one embodiment, the electronic device 1 further includes a second connector 220, which is used for thermally conductively connecting the shielding cover 190 to the electronic device housed within the shielding cover 190. Figure 20 and Figure 21 In this configuration, the second connector 220 provides a thermally conductive connection between the second electronic device 182 and the shielding cover 190. Figure 22 and Figure 23 In this configuration, the second connector 220 is used for thermally conductive connection between the first electronic device 181 and the shielding cover 190.

[0095] The second connector 220 can also be referred to as the second thermally conductive connector. The second thermally conductive connector may include, but is not limited to, one or more of a thermal interface connector and thermally conductive foam. The thermal interface connector is made of a thermal interface material. The thermal interface connector includes one or more of a thermally conductive pad, thermally conductive gel, thermally conductive silicone grease, and liquid metal. In another embodiment, the second thermally conductive connector may also be a combination of conventional foam and a thermal interface material; for example, the gaps in conventional foam may be filled with thermally conductive gel, thermally conductive silicone grease, or liquid metal. The second connector 220 and the first connector 210 may be of the same type or different, and this embodiment is not limited thereto.

[0096] The electronic device 1 includes the second connector 220, which thermally connects the electronic device housed in the shielding cover 190 to the shielding cover 190. This allows the heat source 110 and the heat generated by the heat source 110 to be quickly transferred to the shielding cover 190 via the second connector 220, and the heat transferred to the shielding cover 190 to be quickly dissipated, thereby improving the heat dissipation effect of the electronic device 1.

[0097] Please see Figure 24 , Figure 24 This is one embodiment of the present application. Figure 1 A cross-sectional view of the provided electronic device along line II. The electronic device 1 further includes a mid-frame 260, a battery cover 250, and a display screen 270. The mid-frame 260 includes a mid-plate 261 and a frame 230, the frame 230 being bent and connected to the mid-plate 261. The battery cover 250 and the display screen 270 are respectively disposed on opposite sides of the mid-plate 261. In this embodiment, the electronic device 1 also has a first through hole 230a and a second through hole 230b. Specifically, in this embodiment, the battery cover 250 has a first through hole 230a. The frame 230 has a second through hole 230b. It can be understood that in other embodiments, the frame 230 has both the first through hole 230a and the second through hole 230b. The first through hole 230a connects the exterior of the electronic device 1 to the fan 160. The second through hole 230b connects the outside of the electronic device 1 with the first air duct 130a, and the second through hole 230b also connects the outside of the electronic device 1 with the second air duct 150a.

[0098] The electronic device 1 provided in this application embodiment also includes a frame 230 that can be integrated into the electronic device 1 provided in any of the preceding embodiments. In the schematic diagram of this application embodiment, the electronic device 1 further includes a frame 230 integrated into the electronic device 1 of the preceding embodiment (see reference). Figure 10 The illustrations in this paper are for illustrative purposes only and should not be construed as limiting the electronic device 1 provided in the embodiments of this application.

[0099] In one embodiment, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet. In another embodiment, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. Alternatively, in other embodiments, during a first time period, the first through hole 230a is an air inlet, and the second through hole 230b is an air outlet; during a second time period, the first through hole 230a is an air outlet, and the second through hole 230b is an air inlet. This application does not limit which of the first through hole 230a and the second through hole 230b serves as an air inlet and which serves as an air outlet.

[0100] In this embodiment, the heat spreader 120, the heat source 110, the thermoelectric cooler 140, the first heat sink 130, the second heat sink 150, and the fan 160 are all located on one side of the second bearing surface 260b of the middle plate 261, and the heat spreader 120 is closer to the second bearing surface 260b than the heat source 110. The heat generated by the heat source 110 is transferred to the heat spreader 120, and then to the middle frame 260. Some of the heat is dissipated through the middle frame 260, and some of the heat is conducted through the middle frame 260 to the display screen 270, and then dissipated by the display screen 270. Therefore, the electronic device 1 provided in this embodiment can also dissipate heat through the middle frame 260 and the display screen 270, improving the heat dissipation effect.

[0101] In another embodiment, the middle plate 261 of the middle frame 260 has a receiving groove located on the second bearing surface 260b, and the receiving groove does not penetrate the first bearing surface 260a. At least one of the heat spreader 120, the heat source 110, the thermoelectric cooler 140, the first heat sink 130, the second heat sink 150, and the fan 160 is housed in the receiving groove, and the second heat sink 150 is closer to the battery cover 250 than the heat spreader 120. Compared to a middle plate 261 without a receiving groove, the electronic device 1 provided in this application embodiment has a receiving groove in the middle plate 261, which allows the electronic device 1 to be thinner.

[0102] In another embodiment, the mid-frame 260 has a receiving hole. The receiving hole extends through the first bearing surface 260a and the second bearing surface 260b. The heat source 110 is located in the receiving hole. The heat spreader 120 is closer to the display screen 270 than the heat source 110. In this embodiment, the heat source 110 is housed in the receiving hole, thereby allowing the electronic device 1 to be thinner.

[0103] Based on the electronic device 1 provided in any of the preceding embodiments, the heat dissipation strategy of the electronic device 1 provided in one embodiment of this application will be described in detail below. In one embodiment, the electronic device 1 has a first heat dissipation mode, a second heat dissipation mode, and a third heat dissipation mode. The first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode are described in detail below. If the electronic device 1 is in the first heat dissipation mode, the fan 160 is in a closed state, and the thermoelectric cooler 140 is in a closed state. If the electronic device 1 is in the second heat dissipation mode, the fan 160 is in a working state, and the thermoelectric cooler 140 is in a closed state. If the electronic device 1 is in the third heat dissipation mode, the fan 160 is in a working state, and the thermoelectric cooler 140 is in a working state.

[0104] In this embodiment, if the electronic device 1 is in the first heat dissipation mode, the fan 160 is off, and the thermoelectric cooler 140 is off. When the electronic device 1 is in the first heat dissipation mode, the heat generated by the heat source 110 in the electronic device 1 is dissipated after being evenly heated by the heat spreader 120, resulting in the lowest heat dissipation power consumption.

[0105] If the electronic device 1 is in the second heat dissipation mode, the fan 160 is in operation, and the thermoelectric cooler 140 is in the off state. In the second heat dissipation mode, the heat generated by the heat source 110 of the electronic device 1 is dissipated after being evenly heated by the heat spreader 120, and the heat generated by the heat source 110 is transferred to the first heat sink 130 and dissipated through the first heat sink 130. With the fan 160 in operation, the air blown out or drawn into the first air duct 130a by the fan 160 can quickly remove heat and transfer it outside the electronic device 1.

[0106] Please see Figure 14 and Figure 25 And see Figure 15 and Figure 26 , Figure 25 for Figure 14 The diagram shows the heat dissipation path of the electronic device in the third heat dissipation mode. Figure 26 for Figure 15The diagram illustrates the heat dissipation path of the electronic device in its third heat dissipation mode. In this mode, the fan 160 is operational, and the thermoelectric cooler 140 is off. In this mode, the heat generated by the heat source 110 is dissipated after being homogenized by the heat spreader 120, and the heat from the heat source 110 is transferred to the first heat sink 130. The fan 160 is operational, and the cold air blown out by the fan exchanges heat with the first heat sink fins 133 in the first heat sink 130, thus cooling the first heat sink fins 133. The cold air becomes hot air after heat exchange and is blown out of the electronic device 1, such as out of the casing of the electronic device 1, thereby achieving overall cooling of the electronic device 1. The first heat sink 130 transfers heat to the cold surface 140a of the thermoelectric cooler 140. When the thermoelectric cooler 140 is in operation, it transfers the heat from the cold surface 140a to the hot surface 140b. The heat transferred to the hot surface 140b is then conducted to the second heat sink 150 and dissipated through it. Furthermore, the fan 160 is in operation, and the air blown out or drawn into the first air duct 130a and the second air duct 150a by the fan 160 can quickly remove heat from the electronic device 1. In other words, in the electronic device 1 provided in this embodiment, the fan 160 can dissipate heat through the air from the first air duct 130a and the second air duct 150a (also called dual air ducts).

[0107] The electronic device 1 can select one of the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode according to the actual situation of the heat source 110. Therefore, the electronic device 1 provided in this embodiment has three heat dissipation schemes—the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode—enabling optimal heat dissipation in multiple scenarios and optimal overall power consumption.

[0108] Please see Figure 27 , Figure 27This is a schematic diagram of an electronic device provided in yet another embodiment of this application. In this embodiment, the electronic device 1 further includes a temperature sensor 240. The electronic device 1 provided in this embodiment, which also includes a temperature sensor 240, can be incorporated into any of the electronic devices 1 provided in the preceding embodiments. In the schematic diagram of this embodiment, the example of the electronic device 1 including a temperature sensor 240 incorporated into an electronic device 1 provided in a preceding embodiment is used for illustration. It should be understood that this should not be construed as a limitation on the electronic device 1 provided in the embodiments of this application. The temperature sensor 240 is used to detect the temperature of the heat source 110 to obtain a detected temperature T. If the detected temperature T is greater than or equal to a threshold temperature T0 and less than a first preset temperature T1 (i.e., T0 ≤ T < T1), the electronic device 1 is in a first heat dissipation mode, wherein the first preset temperature is greater than the threshold temperature. If the detected temperature T is greater than or equal to the first preset temperature T1 and less than a second preset temperature T2 (i.e., T1 ≤ T < T2), the electronic device 1 is in a second heat dissipation mode, wherein the second preset temperature is greater than the first preset temperature. If the detected temperature T is greater than or equal to the second preset temperature T2 (i.e., T≥T2), the electronic device 1 is in the third heat dissipation mode.

[0109] The temperature sensor 240 can be, but is not limited to, a negative temperature coefficient (NTC) thermistor or a positive temperature coefficient thermistor. For example, the temperature sensor 240 is disposed adjacent to the heat source 110 to detect the temperature of the heat source 110. In one embodiment, both the temperature sensor 240 and the heat source 110 are located on the circuit board.

[0110] If the detected temperature is greater than or equal to the threshold temperature, it indicates that the heat source 110 of the electronic device 1 has relatively high heat, and heat dissipation is required for the heat source 110. In one embodiment, the selection of the threshold temperature is related to the type of heat source 110; different types of heat sources 110 correspond to different threshold temperatures. In another embodiment, the same threshold temperature can be selected for different types of heat sources 110.

[0111] The first preset temperature and the second preset temperature can be selected according to the actual situation of the electronic device 1, as long as the first preset temperature is greater than the threshold temperature and the second preset temperature is greater than the first preset temperature.

[0112] In one embodiment, the software system (such as a temperature control system) of the electronic device 1 controls the operating state of the fan 160 and the thermoelectric cooler 140. For example, the electronic device 1 further includes a memory and a processor. The memory stores computer program code, which is read and executed by the processor to control the operating state of the fan 160 and the thermoelectric cooler 140.

[0113] Therefore, the electronic device 1 provided in one embodiment of this application, through a temperature sensor 240 and a temperature control system, wherein the temperature sensor 240 identifies the detected temperature of the heat source 110, and the temperature control system, based on the detected temperature and the magnitude between the detected temperature and the threshold temperature, the first preset temperature and the second preset temperature, realizes a multi-level adjustable heat dissipation scheme (i.e., the first heat dissipation mode, the second heat dissipation mode and the third heat dissipation mode), thereby achieving better or optimal heat dissipation in multiple scenarios and overall power consumption.

[0114] In summary, the electronic device 1 provided in this application embodiment utilizes the temperature sensor 240 to detect the temperature of the heat source 110 to obtain the detected temperature; the detected temperature is compared with the threshold temperature, the first preset temperature, and the second preset temperature to control the electronic device 1 to be in one of the first heat dissipation mode, the second heat dissipation mode, and the third heat dissipation mode according to the temperature range in which the detected temperature is located. Therefore, the electronic device 1 provided in this application embodiment can adopt a corresponding heat dissipation mode according to the detected temperature of the heat source 110 detected by the temperature sensor 240, thereby achieving a better or optimal heat dissipation of the heat source 110 and the overall power consumption of the electronic device 1 under multiple temperature scenarios.

[0115] In one embodiment, the electronic device 1 has a first load scenario, a second load scenario, and a third load scenario. If the electronic device 1 is in the first load scenario, its power consumption per unit time is a first power consumption. If the electronic device 1 is in the second load scenario, its power consumption per unit time is a second power consumption, wherein the second power consumption is greater than the first power consumption. If the electronic device 1 is in the third load scenario, its power consumption per unit time is a third power consumption, wherein the third power consumption is greater than the second power consumption. If the electronic device 1 is in the first load scenario, it is in a first heat dissipation mode; if the electronic device 1 is in the second load scenario, it is in a second heat dissipation mode; if the electronic device 1 is in the third load scenario, it is in the third heat dissipation mode.

[0116] In this embodiment, the first power consumption is less than the second power consumption, and the third power consumption is greater than the second power consumption. Therefore, the first load scenario can be referred to as a low-to-medium load scenario, the second load scenario can be referred to as a medium-to-high load scenario, and the third load scenario can be referred to as a heavy load scenario.

[0117] For example, the first load scenario includes, but is not limited to, scenarios such as viewing information in instant messaging applications. The second load scenario includes, but is not limited to, scenarios such as taking photos, playing games for a short time, recording videos for a short time, or playing videos for a short time. In this embodiment, a duration less than or equal to the first duration is considered short; a duration greater than or equal to the second duration is considered long, wherein the second duration is longer than the first duration. For example, the first duration can be, but is not limited to, 10 minutes or 15 minutes; the second duration can be, but is not limited to, 30 minutes or 35 minutes; however, it is not limited to this example.

[0118] In one embodiment, the electronic device 1 further includes a processor, which activates a corresponding heat dissipation mode based on the current scene of the electronic device 1 and the duration of the current scene.

[0119] It should be noted that, The first heat sink 130 is located on one side of the cold side 140a of the thermoelectric cooler 140 (TEC). Therefore, the first heat sink 130 can also be called a TEC cold side heat sink, and the first heat sink 133 in the first heat sink 130 is also called a TEC cold side fin. The second heat sink 153 is located on one side of the hot side 140b of the thermoelectric cooler 140. Therefore, the second heat sink 150 is also called a TEC hot side heat sink, and the second heat sink 153 in the second heat sink 150 is also called a TEC hot side fin.

[0120] For a single-board solution, the first circuit board 171 of the electronic device 1 can also be called the motherboard. Correspondingly, since the shielding cover 190 in the single-board solution is located on the side of the first circuit board 171 away from the heat source 110, the shielding component can also be called the motherboard bottom (BOT) shielding cover 190 or the motherboard BOT side shielding cover 190.

[0121] The electronic device 1 provided in this application includes a heat spreader 120, which is thermally connected to the heat source 110. Therefore, the heat spreader 120 can evenly distribute the heat generated by the heat source 110. When the fan 160 is in operation, the cold air blown out by the fan 160 exchanges heat with the first heat sink 133 and the second heat sink 153134 in the first heat sink 130, thereby cooling the first heat sink 133 and the second heat sink 153134. After heat exchange, the cold air becomes hot air, which is then blown out of the electronic device 1, such as out of the casing of the electronic device 1, thereby achieving overall cooling of the electronic device 1.

[0122] Furthermore, the electronic device 1 provided in this application embodiment also includes a temperature sensor 240, which can detect the temperature in real time and has a multi-level intelligent heat dissipation adjustment function, enabling it to achieve a better or optimal solution for heat dissipation and overall power consumption in various scenarios. The electronic device 1 provided in this application embodiment can solve the heat dissipation problem of the electronic device 1 under third-load scenarios (also known as high-load scenarios) such as long-term gaming or long-term video recording, thereby solving the problem of the electronic device 1 overheating under these scenarios. The electronic device 1 provides a very good user experience. For example, the electronic device 1 provided in this application embodiment can solve the problem of the electronic device 1 overheating under high-load scenarios such as long-term gaming or long-term video recording in related technologies, resulting in a very good user experience.

[0123] The above description represents some embodiments of this application. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: Heat source; A heat spreader is located on one side of the heat source and conducts heat with the heat source; A first heat sink is located on the side of the heat spreader facing the heat source, and the first heat sink and the heat source are arranged at different positions on the heat spreader. The first heat sink includes a first sub-support member, a second sub-support member, and a plurality of first heat sink fins. The first sub-support member has a through hole. The second sub-support member is opposite to the first sub-support member and spaced apart to form a first receiving space. The first receiving space communicates with the through hole. The second sub-support member is further away from the heat spreader than the first sub-support member. The plurality of first heat sink fins are located in the first receiving space and are at least partially arranged corresponding to the through hole to directly contact the heat spreader. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the first heat sink that is away from the heat spreader. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the first heat sink relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan, the fan being connected to the first air duct and the fan being connected to the second air duct.

2. The electronic device as claimed in claim 1, characterized in that, The first heat dissipation fin includes: A fin body portion, located within the receiving space, having a first end and a second end disposed opposite to each other, at least a portion of the first end abutting against the first sub-support member, and the second end abutting against the second sub-support member; and The protrusion is connected to the first end and protrudes toward the second end in a direction pointing toward the first end. The protrusion is at least partially located inside the through hole and is in direct contact with the heat exchanger.

3. The electronic device as claimed in claim 1, characterized in that, The first sub-support member includes a first sub-support portion and a second sub-support portion connected together. The first sub-support portion has the through hole. The first heat dissipation fin is disposed corresponding to the first sub-support portion and avoids the second sub-support portion. The second sub-support member includes a third sub-support portion and a fourth sub-support portion connected together. The third sub-support portion is disposed opposite to the first sub-support portion. The first heat dissipation fin is also disposed corresponding to the third sub-support portion. The fourth sub-support portion is disposed opposite to the second sub-support portion. The first heat dissipation fin is also disposed corresponding to the third sub-support portion and avoids the fourth sub-support portion. The fan is located on the side of the fourth sub-support unit opposite to the second sub-support unit.

4. The electronic device as claimed in claim 3, characterized in that, The thermoelectric cooler is located on the side of the third sub-support portion opposite to the first sub-support portion; the thermoelectric cooler also has: A peripheral surface, the peripheral surface being connected to the cold surface and the hot surface; In a preset direction, the first heat dissipation fin at least partially protrudes from the peripheral surface, and the preset direction is a direction perpendicular to the cold surface and pointing towards the hot surface.

5. The electronic device as claimed in claim 1, characterized in that, The second heat sink also includes: The third sub-support member is disposed on the side of the hot surface away from the cold surface, and the third sub-support member conducts heat with the hot surface; A fourth sub-carrier, which is opposite to and spaced apart from the third sub-carrier to form a second receiving space, and which is further away from the thermoelectric cooler than the third sub-carrier; and The second heat dissipation fin is located in the second receiving space, and one end of the second heat dissipation fin abuts against the third sub-support member, while the other end of the second heat dissipation fin abuts against the fourth sub-support member.

6. The electronic device as claimed in claim 5, characterized in that, The thermoelectric cooler also has: A peripheral surface, the peripheral surface being connected to the cold surface and the hot surface; In a preset direction, the second heat dissipation fin at least partially protrudes from the peripheral surface, and the preset direction is a direction perpendicular to the cold surface and pointing towards the hot surface.

7. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device is mounted on the first circuit board and located on the side of the first circuit board away from the heat source. A second circuit board is disposed on the side of the first electronic device that is away from the first circuit board; A second electronic device, the second electronic device being mounted on the second circuit board and located on the side of the second circuit board opposite to the first circuit board; and A shielding cover is located on the side of the second circuit board opposite to the first circuit board and is used to house the second electronic device.

8. The electronic device as claimed in claim 1, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device, the first electronic device being mounted on the first circuit board and located on the side of the first circuit board away from the heat source; and A shielding cover is located on the side of the first circuit board away from the heat source, and the shielding cover is used to house the first electronic device.

9. The electronic device according to any one of claims 1-8, characterized in that, The electronic device has: In the first heat dissipation mode, if the electronic device is in the first heat dissipation mode, the fan is turned off and the thermoelectric cooler is turned off. In the second heat dissipation mode, if the electronic device is in the second heat dissipation mode, the fan is in the working state and the thermoelectric cooler is in the off state; and In the third heat dissipation mode, the fan is in operation and the thermoelectric cooler is in operation.

10. An electronic device, characterized in that, The electronic device includes: Heat source; A heat spreader is located on one side of the heat source and conducts heat with the heat source; A first heat sink is located on the side of the heat spreader facing the heat source, and the first heat sink and the heat source are arranged at different positions on the heat spreader. The first heat sink includes a bracket, a first sub-support member, a second sub-support member, and a plurality of first heat dissipation fins. The bracket has a through hole. The first sub-support member is located on the side of the bracket away from the heat spreader. The first sub-support member is in direct contact with the heat spreader through the through hole. The second sub-support member is opposite to the first sub-support member and spaced apart to form a first receiving space. The second sub-support member is farther away from the heat spreader than the first sub-support member. The plurality of first heat dissipation fins are disposed in the first receiving space and abut against the first sub-support member and the second sub-support member. The first heat sink has a first air duct. A thermoelectric cooler is disposed on the side of the first heat sink away from the heat spreader. The thermoelectric cooler has a cold surface and a hot surface, and the hot surface is away from the first heat sink relative to the cold surface. A second heat sink is located on one side of the hot surface, and the second heat sink has a second air duct; and A fan, the fan being connected to the first air duct and the fan being connected to the second air duct.

11. The electronic device as claimed in claim 10, characterized in that, The first sub-bearing member has: A support body portion, the support body portion being located on the side of the bracket opposite to the heat spreader; and A protrusion is connected to the supporting body and protrudes toward the bracket. At least a portion of the protrusion is located in the through hole and is in direct contact with the heat exchanger.

12. The electronic device as claimed in claim 10, characterized in that, The second heat sink also includes: The third sub-support member is disposed on the side of the hot surface away from the cold surface, and the third sub-support member conducts heat with the hot surface; A fourth sub-carrier, which is opposite to and spaced apart from the third sub-carrier to form a second receiving space, and which is further away from the thermoelectric cooler than the third sub-carrier; and The second heat dissipation fin is located in the second receiving space, and one end of the second heat dissipation fin abuts against the third sub-support member, while the other end of the second heat dissipation fin abuts against the fourth sub-support member.

13. The electronic device as claimed in claim 10, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device is mounted on the first circuit board and located on the side of the first circuit board away from the heat source. A second circuit board is disposed on the side of the first electronic device that is away from the first circuit board; A second electronic device, the second electronic device being mounted on the second circuit board and located on the side of the second circuit board opposite to the first circuit board; and A shielding cover is located on the side of the second circuit board opposite to the first circuit board and is used to house the second electronic device.

14. The electronic device as claimed in claim 10, characterized in that, The electronic device also includes: A first circuit board is used to carry the heat source, and the first circuit board is disposed on the side of the heat source away from the heat spreader; A first electronic device, the first electronic device being mounted on the first circuit board and located on the side of the first circuit board away from the heat source; and A shielding cover is located on the side of the first circuit board away from the heat source, and the shielding cover is used to house the first electronic device.

15. The electronic device according to any one of claims 10-14, characterized in that, The electronic device has: In the first heat dissipation mode, if the electronic device is in the first heat dissipation mode, the fan is turned off and the thermoelectric cooler is turned off. In the second heat dissipation mode, if the electronic device is in the second heat dissipation mode, the fan is in the working state and the thermoelectric cooler is in the off state; and In the third heat dissipation mode, the fan is in operation and the thermoelectric cooler is in operation.

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