Differential electroplating method and hanger
By providing different current densities for different areas of the electroplated device and using a differentiated electroplating method with a dual power supply system, combined with an electroplating rack designed with insulating materials, the problems of incomplete plating and low efficiency in the existing technology have been solved, achieving a highly efficient and uniform differentiated electroplating effect. In particular, in the application of integrated circuit metal casings, the yield rate has been increased by 5% and the cost has been reduced by 30%.
Patent Information
- Application Number
- CN202511931072.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-19
- Publication Date
- 2026-02-27
AI Technical Summary
Existing differentiated electroplating methods suffer from problems such as incomplete plating, low production efficiency, and low yield. In particular, in the field of integrated circuit metal casings, existing methods are difficult to achieve differentiated electroplating that is easy to implement and not prone to incomplete plating.
By providing different current densities to different areas of the device to be electroplated, combined with electroplating racks designed using a dual power supply system and insulating materials, differentiated electroplating is achieved, avoiding incomplete plating. Furthermore, by controlling the current density and changing the electrolyte, the plating thickness and material of different areas can be differentiated.
It achieves high coating uniformity and high yield, reduces electroplating costs, and improves production efficiency and yield. In particular, during the electroplating process of integrated circuit metal casings, the coating has strong adhesion and the cost is reduced by 30%.
Smart Images
Figure CN121575459A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electroplating technology, specifically to a differentiated electroplating method and fixture. Background Technology
[0002] Differential electroplating, also known as selective electroplating, is used to apply different types and thicknesses of metal plating to specific surfaces of workpieces, especially in the field of integrated circuit metal casings, such as nickel-plated cavities with gold-plated leads; nickel-plated cavities with tin-plated leads; and thin gold-plated cavities with thick gold-plated leads.
[0003] In existing technologies, the methods for achieving differentiated electroplating are mainly divided into three categories. The first is to use the potential difference of different metal plating layers to achieve differentiated electroplating. This method is only suitable for metal plating layers with potential differences and is prone to displacement reactions, leading to incomplete plating and peeling, resulting in low product yield. The second is to use masking technology to mask the differentiated positions before electroplating. This method requires manual application of adhesive to each product for masking. It can achieve differentiated electroplating on the same metal conductive circuit, but the operation is complex, the production efficiency is low, and the pollution is high. The third is to use a complex wire binding method to connect the insulated circuits in the product with copper wires of different circuits. Differentiated electroplating is achieved by controlling the opening and closing of different current circuits during the electroplating process. This method requires high skill from the electroplating personnel, and the wire binding during the electroplating process can interfere with the electric field in the plating solution and easily induce plating, resulting in incomplete plating and reduced adhesion of the product plating layer.
[0004] Therefore, there is an urgent need for a differentiated electroplating method that is easy to implement and less prone to false plating. Summary of the Invention
[0005] In view of this, this application discloses a differentiated electroplating method and a plating fixture to solve the above problems;
[0006] A differential electroplating method includes: immersing a device to be differentially electroplated and an electroplating metal in an electrolyte, connecting the electroplating metal to the positive terminal of a power supply, and connecting the device to be differentially electroplated to the negative terminal of a power supply, thereby completing the electroplating; the device to be differentially electroplated includes a first electroplating area and a second electroplating area; during the electroplating process, the current density of the first electroplating area and the second electroplating area is different.
[0007] A differentiated electroplating fixture includes: a conductive rod, a conductive post, a conductive clamp, and a base;
[0008] The conductive post includes a horizontal conductive post and a vertical conductive post; a conductive ring is provided on the vertical conductive post, and a conductive hook is provided on the horizontal conductive post; the bottom of the vertical conductive post is fixed to the base, and the horizontal conductive post is fixed to the vertical conductive post; the conductive post and the base are wrapped with insulating material, and the conductive hook and conductive ring are exposed; a conductive rod is provided on the top of the conductive post, and the lead end of the conductive clamp is connected to the conductive ring.
[0009] The differentiated electroplating method designed in this application achieves differentiated electroplating by providing different current densities to different electroplating areas. It is easy to implement, has high coating uniformity, and high yield. Attached Figure Description
[0010] Figure 1 This is a front view of the differentiated electroplating fixture in the embodiments of this application;
[0011] Figure 2 This is a side view of the differentiated electroplating fixture in an embodiment of this application;
[0012] Figure 3 This is a schematic diagram illustrating the implementation of the differentiated electroplating fixture combined with the differentiated electroplating method in the embodiments of this application;
[0013] Reference numerals: 1-Conductive rod, 2-Conductive post, 21-Horizontal conductive post, 22-Vertical conductive post, 211-Conductive hook, 221-Conductive ring, 3-Conductive clamp, 4-Base, 5-Insulating ring. Detailed Implementation
[0014] To make the objectives, technical solutions, features, and advantages of this application clearer and to enable those skilled in the art to better understand the technical solutions of this application, the following detailed description of this application is provided in conjunction with the accompanying drawings and embodiments.
[0015] Example 1:
[0016] This embodiment includes a differentiated electroplating method, comprising: immersing the device to be differentiated in an electrolyte and an electroplating metal, connecting the electroplating metal to the positive terminal of a power supply, and connecting the device to be differentiated in an electrolyte to the negative terminal of a power supply, thereby completing the electroplating; characterized in that the device to be differentiated in an electrolyte includes a first electroplating area and a second electroplating area; during the electroplating process, the current density of the first electroplating area and the second electroplating area is different.
[0017] In some embodiments, the device to be differentiated by electroplating also includes a third electroplating region. During electroplating, the current density in the third electroplating region needs to be further controlled.
[0018] Specifically, the scenarios involved in differentiated electroplating methods include: electroplating the same material with different thicknesses in different electroplating areas, and electroplating different materials in different electroplating areas.
[0019] The method of electroplating the same material to different thicknesses in different electroplating areas includes: using a dual power supply system and two electroplating metals of the same material, with the two negative terminals of the dual power supply system connected to the first electroplating area and the second electroplating area respectively, and the two positive terminals of the dual power supply system connected to the two electroplating metals respectively, and controlling the current of the dual power supply system to adjust the coating thickness.
[0020] The method of electroplating different materials onto different plating areas includes: using a dual power supply system and two plating metals of the same material; connecting the two negative terminals of the dual power supply system to the first plating area and the second plating area respectively, and connecting the two positive terminals of the dual power supply system to the two plating metals respectively; electroplating the first plating area; changing the electrolyte and plating metal to electroplat the second plating area; during the electroplating of the first and second plating areas respectively, current is always flowing through both plating areas. The current differs between the different plating areas during the electroplating process; this current difference is used to prevent the occurrence of incomplete plating.
[0021] The differentiated electroplating method designed in this application can reduce the difficulty and cost of implementing differentiated electroplating and improve the yield of electroplated products.
[0022] Example 2:
[0023] This embodiment includes a differentiated electroplating method, in which different materials are electroplated on different electroplating areas. The difference from Embodiment 1 is that the electroplating process includes:
[0024] Disconnect the second electroplating area from the negative terminal of the power supply, while keeping the first electroplating area connected to the negative terminal of the power supply, and perform electroplating on the first electroplating area.
[0025] Replace the electrolyte and the electroplating metal, disconnect the first electroplating area from the negative terminal of the power supply, keep the second electroplating area connected to the negative terminal of the power supply, and perform electroplating on the second electroplating area.
[0026] Example 3:
[0027] This embodiment includes a differentiated electroplating fixture for implementing the differentiated electroplating method described in the embodiment, comprising: a conductive rod 1, a conductive post 2, a conductive clamp 3, and a base 4.
[0028] The conductive posts include a horizontal conductive post 21 and a vertical conductive post 22; a conductive ring 221 is provided on the vertical conductive post 22, and a conductive hook 211 is provided on the horizontal conductive post 21; the bottom of the vertical conductive post 22 is welded and fixed to the base 4, and the horizontal conductive post 21 is fixed to the vertical conductive post 22; the conductive posts and the base 4 are wrapped with insulating material, while the conductive hook 211 and the conductive ring 221 are exposed; a conductive rod is provided on the top of the conductive post, and the lead end of the conductive clamp 3 is connected to the conductive ring 221. The conductive clamp 3 is used to clamp the negative terminal of the power supply.
[0029] like Figure 1 , Figure 2 As shown, the conductive post 2 and base 4 are made of copper, the conductive hook 211 is made of stainless steel, the cyan and green areas are copper rods with adhesive insulation, the cyan and green conductive posts are disconnected, and the yellow area is the exposed metal area used to transmit current between the power supply and the workpiece. The conductive clamp 3 is responsible for disconnecting and connecting the two circuits; the electroplating area of the device to be differentiated is connected to the conductive hook 211, and the current is led out through the conductive hook-conductive post-conductive ring-conductive clamp. In this embodiment, the device to be differentiated is connected to the conductive hook 211 by copper wire for conduction before entering the electroplating tank for production. By changing the size and structure of the fixture, differentiated electroplating of different products can be achieved.
[0030] Furthermore, in this embodiment, the differentiated electroplating fixture also includes an insulating ring 5, which is used to achieve insulation between different conductive posts 2.
[0031] Example 4:
[0032] This embodiment includes a differentiated electroplating method. Specifically, the device to be differentiated by electroplating is an integrated circuit metal shell. The first electroplating area is a lead wire, and the second electroplating area is a cavity. The integrated circuit metal shell has a cavity made of No. 10 steel, and the lead wire is made of 4J29 and oxygen-free copper. The lead wire and the cavity are insulated with electronic packaging glass.
[0033] In this embodiment, the metal casing needs to be gold-plated, and the plating thickness of the metal casing is different from that of the lead wire. During the gold plating, the first power supply provides a current of 1A, which is connected to the lead wire circuit; the second power supply provides a current of 0.5A, which is connected to the cavity circuit. During the same plating time, the cavity current density is 1 / 5 of that of the lead wire, thereby achieving a gold plating thickness of 1μm for the lead wire and 0.2μm for the cavity. Figure 3 In the diagram, the green area represents circuit one, and the cyan area represents circuit two, corresponding to the lead circuit and the cavity circuit, respectively. Testing showed that by changing the electric field lines in the plating tank, the uniformity of the device plating layer can be improved by 10%, the yield rate by 5%, and thin gold plating can be achieved in non-essential areas of the casing, while thicker gold plating is possible in essential areas. Compared to traditional methods that can only perform electroplating of the same thickness in all areas, the gold plating cost is reduced by 30%.
[0034] Finally, it should be noted that the above description only depicts some embodiments of this application. For those skilled in the art, various changes, modifications, substitutions, and variations can be conceived of these embodiments without departing from the principles and spirit of this application. The scope of protection of this application is defined by the appended claims and their equivalents, and all the above-mentioned behaviors should be covered within the scope of protection of this application.
[0035] Furthermore, in the above description of the embodiments, unless otherwise explicitly specified and limited, the use of terms such as "upper," "lower," "horizontal," and "inner" to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, or the orientation or positional relationships commonly used when the invention is in use, is merely for the convenience of describing this application and simplifying the description, and does not limit or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The use of terms such as "first" and "second" is merely for distinguishing descriptions and should not be construed as indicating or implying relative importance. Components shown in the accompanying drawings and described in the embodiments can be arranged and designed in various different configurations; the use of the term "horizontal" does not mean that the component is required to be absolutely horizontal, but rather that it can be slightly tilted. "Horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted. The terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.
Claims
1. A method of differential electroplating, comprising: The device to be differentiated by electroplating and the electroplating metal are immersed in an electrolyte. The electroplating metal is connected to the positive terminal of a power supply, and the device to be differentiated by electroplating is connected to the negative terminal of a power supply to complete the electroplating. The device to be differentiated by electroplating includes a first electroplating area and a second electroplating area. During the electroplating process, the current density of the first electroplating area and the second electroplating area are different.
2. The differential electroplating method according to claim 1, wherein, The device to be differentiated by electroplating also includes a third electroplating area.
3. The differential electroplating method of claim 1, wherein, The differentiated electroplating method includes: electroplating the same material with different thicknesses in different electroplating areas, and electroplating different materials in different electroplating areas.
4. The differential plating method according to claim 3, wherein, The differentiated electroplating method, wherein different thicknesses of the same material are electroplated in different electroplating areas, includes: using a dual power supply system and two electroplating metals of the same material, wherein the two negative terminals of the dual power supply system are respectively connected to the first electroplating area and the second electroplating area, and the two positive terminals of the dual power supply system are respectively connected to the two electroplating metals, and the coating thickness is controlled by controlling the current of the dual power supply system.
5. The differential plating method according to claim 3, wherein, The differentiated electroplating method, wherein different materials are electroplated on different electroplating areas, includes: using a dual power supply system and two electroplating metals of the same material, wherein the two negative terminals of the dual power supply system are respectively connected to the first electroplating area and the second electroplating area, and the two positive terminals of the dual power supply system are respectively connected to the two electroplating metals. Electroplating is performed on the first electroplating area; the electrolyte and electroplating metal are replaced, and electroplating is performed on the second electroplating area; during the electroplating process of the first electroplating area and the second electroplating area respectively, current is always flowing through both electroplating areas.
6. The differential plating method according to claim 3, wherein, The differentiated electroplating method, wherein different materials are electroplated on different electroplating areas, includes: Disconnect the second electroplating area from the negative terminal of the power supply, while keeping the first electroplating area connected to the negative terminal of the power supply, and perform electroplating on the first electroplating area. Replace the electrolyte and the electroplating metal, disconnect the first electroplating area from the negative terminal of the power supply, keep the second electroplating area connected to the negative terminal of the power supply, and perform electroplating on the second electroplating area.
7. A differential electroplating rack for implementing the differential electroplating method according to any one of claims 1 to 6, comprising: Conductive rod, conductive post, conductive clamp, base; The conductive pillars include horizontal conductive pillars and vertical conductive pillars; A conductive ring is installed on the vertical conductive post, and a conductive hook is installed on the horizontal conductive post; the bottom of the vertical conductive post is fixed to the base, and the horizontal conductive post is fixed to the vertical conductive post; the conductive post and the base are wrapped with insulating material, while the conductive hook and conductive ring are exposed; the conductive rod is set on the top of the conductive post, and the lead end of the conductive clamp is connected to the conductive ring.
8. The differential plating method and rack of claim 7, wherein, The conductive hook is made of stainless steel, while the conductive post and base are made of copper.
9. The differential plating method and rack of claim 7, wherein, The electroplating area of the device to be differentiated is connected to a conductive hook, and current is drawn out through the conductive hook-conductive post-conductive ring-conductive clamp.