Electronic device test fixture and test system

Abstract

The invention discloses an electronic device test fixture and a test system, and relates to the technical field of capacitance detection. The electronic device test fixture comprises a sample mounting unit and a test switching unit, the sample mounting unit comprises a test piece connecting part and a test signal interface, and the test switching unit comprises a signal input interface and a signal output interface. Wherein the test piece connecting parts are used for connecting electronic devices, the plurality of test piece connecting parts of the sample mounting unit are adapted to at least two electronic devices of different specifications, and a plurality of mutually independent conductive paths are formed between the test switching unit and the plurality of test piece connecting parts. And the test switching unit is used for transmitting a test electric signal received by the signal input interface to an electronic device loaded on the sample mounting unit. The test fixture can test the reliability of electronic devices of one or more specifications, and improves the test efficiency of the reliability of the electronic devices.

Description

Technical Field

[0001] This application relates to the field of capacitance testing technology, and in particular to an electronic device testing fixture and testing system. Background Technology

[0002] Multilayer ceramic capacitors (MLCCs), as key passive components in electronic systems, are seeing their application density continuously increase with technological advancements. Their usage is significantly expanding in scenarios such as 5G base stations and new energy vehicle electronic control systems, and the corresponding reliability requirements are constantly increasing from the ppm (parts per million) level to the ppb (parts per billion) level. Since potential failure hazards of MLCCs are difficult to detect through room temperature testing, it is necessary to accelerate the exposure of their design flaws and weaknesses by increasing environmental stress to ensure product application stability. Summary of the Invention

[0003] This application provides an electronic device test fixture and test system to at least solve the problem in the related art that when there are multiple specifications of test products to be tested for reliability testing of electronic devices, it is necessary to perform reliability testing on test products of different specifications separately, resulting in long total testing time and low testing efficiency.

[0004] This application provides an electronic device test fixture, including: a sample mounting unit and a test adapter unit.

[0005] The sample mounting unit includes multiple test piece connectors and multiple test signal interfaces. The test piece connectors and test signal interfaces are electrically connected in a one-to-one correspondence. The test piece connectors are used to connect electronic devices, and the multiple test piece connectors are adapted to at least two different specifications of electronic devices.

[0006] The test adapter unit includes multiple signal input interfaces and multiple signal output interfaces, with each signal input interface and signal output interface electrically connected in a one-to-one correspondence.

[0007] The test adapter unit forms multiple independent conductive paths with the connection parts of multiple test pieces; the test adapter unit is used to transmit the test electrical signals received by the signal input interface to the electronic devices loaded on the sample mounting unit.

[0008] The sample mounting unit of the electronic device test fixture of this application can be equipped with at least two different specifications of electronic devices, and these electronic devices can receive test electrical signals individually through different conductive paths. Therefore, when it is necessary to perform reliability testing on multiple electronic devices of different specifications, the same or different test electrical signals can be transmitted to the electronic devices under test of different specifications on the sample mounting unit through the test adapter unit, so as to perform reliability testing on electronic devices of different specifications at the same time and improve the testing efficiency of reliability testing of multiple specifications of electronic devices.

[0009] In some embodiments, the test adapter unit and the sample mounting unit can be electrically connected separately.

[0010] In some embodiments, the sample mounting unit includes a first circuit board, and a gold finger is provided on a selected side of the first circuit board. The test adapter unit includes a second circuit board and a connector, the connector serving as a signal output interface; the connector has a conductive structure corresponding to the gold finger within its slot, and the conductive structure is electrically connected to conductive lines on the second circuit board. When the selected side of the first circuit board is inserted into the slot of the connector, the gold finger contacts the conductive structure.

[0011] In some embodiments, the plurality of test signal interfaces includes a plurality of first test signal interfaces and a plurality of second test signal interfaces. The test component connection includes a first connection portion and a second connection portion, wherein the plurality of first connection portions are electrically connected to the plurality of first test signal interfaces in a one-to-one correspondence, and the plurality of second connection portions are collectively connected to the second test signal interface.

[0012] In some embodiments, the electronic device includes a capacitor.

[0013] This application also provides an electronic device testing system, including: an electronic device testing fixture and a power supply device. The electronic device testing fixture includes multiple test piece connection parts; the test piece connection parts are used to connect electronic devices, and the multiple test piece connection parts are adapted to at least two different specifications of electronic devices. The power supply device is electrically connected to the electronic device under test mounted on the electronic device testing fixture.

[0014] The power supply device forms multiple independent power channels with the connection points of multiple test pieces. The power supply device applies test voltage or test current to the electronic devices electrically connected to it through the power channels.

[0015] In some embodiments, the electronic device testing system further includes: a sealed test chamber, a temperature control device, and a humidity control device. The electronic device testing fixture is disposed inside the sealed test chamber, at least a portion of the temperature control device is disposed inside the sealed test chamber, and at least a portion of the humidity control device is disposed inside the sealed test chamber.

[0016] The temperature control device is used to acquire the real-time temperature inside the sealed test chamber and, in response to a temperature control signal, adjust the temperature inside the sealed test chamber to a set temperature range. The humidity control device is used to acquire the real-time humidity inside the sealed test chamber and, in response to a humidity control signal, adjust the humidity inside the sealed test chamber to a set humidity range.

[0017] In some embodiments, the sealed test chamber includes at least two independent sealed spaces, each of which is equipped with a temperature control device and a humidity control device, and the environmental parameters in different sealed spaces can be adjusted individually; the environmental parameters include temperature values ​​and / or humidity values.

[0018] In some embodiments, the electronic device testing system further includes a data acquisition device. The data acquisition device is electrically connected to the electronic device testing fixture, a temperature control device, and a humidity control device. The data acquisition device is used to acquire environmental parameters within the sealed test chamber, and / or the electrical performance parameters of the electronic devices connected to the electronic device testing fixture.

[0019] Among them, environmental parameters include temperature and / or humidity values; electrical performance parameters include the internal resistance of electronic devices; and when the electronic device is a capacitor, the electrical performance parameters also include the capacitance value.

[0020] In some embodiments, the electronic device test fixture in the electronic device test system is the electronic device test fixture as described in any of the foregoing embodiments. Attached Figure Description

[0021] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A plan view of the sample mounting unit provided in the embodiments of this application; Figure 2 A planar structural diagram of the test adapter unit provided in the embodiments of this application; Figure 3 A structural block diagram of an electronic device testing system provided in an embodiment of this application; Figure 4 Another structural block diagram of the electronic device testing system provided in the embodiments of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0024] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0025] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] Traditional test fixtures only support single channels. When conducting reliability testing of electronic devices, only one specification can be tested at a time, and multiple specifications cannot be tested simultaneously, which greatly affects testing efficiency and cannot meet the needs of use.

[0027] Based on this, embodiments of this application provide an electronic device testing fixture.

[0028] The electronic device test fixture includes a sample mounting unit 1, which is used to mount the electronic device under test.

[0029] For example, electronic devices include, but are not limited to, capacitors, resistors, and inductors.

[0030] Taking electronic devices as examples, capacitors can be multilayer ceramic capacitors (MLCCs) or other types of capacitors. The specific settings can be adapted according to actual needs, and this application does not limit them.

[0031] like Figure 1 As shown, the sample mounting unit 1 includes multiple test piece connectors, which are arranged in at least one row (one, two, three, or more rows). Each test piece connector is used to connect to one electronic device under test, and the multiple test piece connectors are compatible with at least two different specifications of electronic devices.

[0032] Taking capacitors as an example in electronic devices, capacitors of different specifications can refer to: capacitors with different capacitance values, capacitors with the same capacitance value but from different manufacturers, or capacitors from different production batches produced by the same manufacturer (capacitors with the same capacitance value but from different production batches).

[0033] The above is merely an exemplary description of some possible implementations of "electronic devices of different specifications" and does not constitute a limitation on the specific implementation and protection scope of this application. "Electronic devices of different specifications" may also cover other reasonable situations.

[0034] In some embodiments, such as Figure 1 As shown, the sample mounting unit 1 includes a first circuit board. In this case, the test piece connection part can be a pad or a socket on the first circuit board.

[0035] For example, the electronic device under test (DUT) is mounted onto the test piece connection part of the sample mounting unit 1 using SMT (Surface Mount Technology) or DIP (Dual In-line Package) technology to fix the DUT and achieve electrical connection between the DUT and the sample mounting unit 1.

[0036] In some embodiments, such as Figure 1 As shown, the sample mounting unit 1 also includes multiple test signal interfaces, with each test piece connecting part electrically connected to a corresponding test signal interface. The multiple test signal interfaces include multiple first test signal interfaces and multiple second test signal interfaces. The test piece connecting part has first connecting parts and second connecting parts; the multiple first connecting parts are electrically connected to the multiple first test signal interfaces, and the multiple second connecting parts are all connected to the second test signal interfaces.

[0037] This connection structure allows for the transmission of the same or different test electrical signals to different test component connections, satisfying the synchronous testing requirements of multi-specification electronic devices while ensuring the signal independence of each test channel, thus achieving a balance between testing flexibility and stability.

[0038] In some embodiments, such as Figure 1 As shown, the first circuit board includes conductive lines and gold fingers, which are disposed along a selected side of the first circuit board. Pads / connectors on the first circuit board for connecting electronic devices are electrically connected to the gold fingers of the first circuit board via the conductive lines.

[0039] Figure 1J1~Jn and GND shown are different contact points of the gold fingers of the first circuit board. Multiple contact points of the gold fingers of the first circuit board serve as multiple test signal interfaces of the sample mounting unit 1. Specifically, contact points J1~Jn serve as multiple first test signal interfaces of the sample mounting unit 1, and contact point GND serves as a second test signal interface of the sample mounting unit 1.

[0040] For example, multiple test piece connection parts in the same row are electrically connected to multiple first test signal interfaces one by one through the wire circuit of the first circuit board.

[0041] For example, multiple test piece connectors on the sample mounting unit 1 are arranged in multiple rows (two or more rows) and multiple columns. For example, Figure 1 The test piece connectors on the sample mounting unit 1 shown are arranged in two rows and n columns, with one row of test piece connectors being... Figure 1 The C11~C1n shown in the figure, the other row of test piece connection parts are Figure 1 C21~C2n are shown in the figure.

[0042] The connecting parts of adjacent rows of test pieces are aligned or staggered in the column direction. Figure 1 The diagram shows the alignment of the connecting parts of two adjacent rows of test pieces in the column direction.

[0043] like Figure 1 As shown, the first connecting parts of the test piece connecting parts C11~C1n are electrically connected to the first test signal interfaces J1~Jn in a one-to-one correspondence (connection lines) Figure 1 (Not shown in the image). The first connecting parts of the test piece connecting parts C21~C2n are electrically connected to the first test signal interfaces J1~Jn one by one. The first connecting parts of the test piece connecting parts in the same column can be electrically connected to the same first test signal interface.

[0044] The second connection parts of each test component connection part (C11~C1n and C21~C2n) are all connected to the second test signal interface. That is, the first connection parts of each test component connection part of the sample mounting unit 1 are respectively connected to the corresponding first test signal interface, and the second connection parts of each test component connection part of the sample mounting unit 1 are shorted together and connected to the second test signal interface, ensuring that the grounding terminal or reference voltage terminal of all electronic devices under test are consistent and reducing signal interference.

[0045] Multiple test signal channels can be formed by conductive lines on the first circuit board between the test component connection and the test signal interface, thereby transmitting test electrical signals from external devices to the corresponding test component connection through the test signal interface to apply corresponding voltage or current stress to the electronic device under test connected to the test component connection.

[0046] Taking the test electrical signal as a voltage signal as an example, the first test signal interface is used to receive the test voltage, and the second signal interface is used to receive the reference voltage or ground. The test voltage is greater than the reference voltage.

[0047] Taking the test electrical signal as a current signal as an example, the test current is transmitted through each first test signal interface to the first connection part of the corresponding test component connection part, and then flows out through the second connection part and the second test signal interface of each test component connection part.

[0048] Based on the above embodiments, the number of test piece connectors on the sample mounting unit 1 is unlimited and can be set according to actual needs. Taking the test piece connector as a pad as an example, each row or multiple rows of pads can be set to the same or different sizes. By setting multiple rows of pads or sockets with different packages in the sample mounting unit 1, products of different sizes and different withstand voltages can be tested simultaneously, increasing the number of test channels by at least 50% and significantly improving testing efficiency.

[0049] In some embodiments, such as Figure 2 As shown, the electronic device test fixture also includes a test adapter unit 2, which is used to load the sample mounting unit 1 and apply corresponding electrical test conditions.

[0050] The test adapter unit 2 includes multiple signal input interfaces and multiple signal output interfaces P, with each signal input interface and signal output interface P electrically connected in a one-to-one correspondence. Multiple independent conductive paths are formed between the test adapter unit 2 and the multiple test component connections. The test adapter unit 2 is used to transmit the test electrical signals received by the signal input interfaces to the electronic devices mounted on the sample mounting unit 1.

[0051] For example, the test electrical signal can be voltage or current. By using independent conductive paths, it can be ensured that the test electrical signals received by different test component connections do not interfere with each other, thus improving the accuracy of the test data.

[0052] In some embodiments, the test adapter unit 2 and the sample mounting unit 1 are detachably electrically connected.

[0053] By setting a slot-type connector in the test adapter unit 2, the sample mounting unit 1 can be flexibly switched for testing, eliminating the need to repeatedly build the external test environment and reducing the time cost of building the test platform.

[0054] In some embodiments, the test adapter unit 2 includes a second circuit board and a connector, with the connector serving as a signal output interface. The connector slot has a conductive structure corresponding to the gold fingers of the first circuit board, and this conductive structure is electrically connected to conductive lines on the second circuit board. Specifically, when a selected side of the first circuit board is inserted into the connector slot, the gold fingers of the first circuit board contact the conductive structure within the connector slot.

[0055] For example, the conductive structure may be a plurality of metal pins corresponding to the gold fingers of the first circuit board. The metal pins are made of copper and gold plating to reduce the contact impedance between the connector and the sample mounting unit 1, thereby reducing test errors and improving the reliability of test data.

[0056] When the sample mounting unit 1 is inserted into the slot of the connector on the test adapter unit 2, a specified test electrical signal is applied to the electronic device under test on the sample mounting unit 1 through the metal PIN and the gold fingers of the first circuit board.

[0057] By setting a connector on the test adapter unit 2, it is possible to connect with the sample mounting unit 1, which allows for flexible switching of the sample mounting unit 1 for testing, reducing the time required to set up the test platform.

[0058] For example, the test adapter unit 2 is provided with one or more connectors with slots.

[0059] like Figure 2 As shown, the test adapter unit 2 is equipped with multiple connectors 2.1 to 2.n. Each connector 2.1 to 2.n has two rows of metal pins inside its slot, as shown... Figure 2 P11~P1n and P21~P2n are shown in the figure, where, as Figure 1 and Figure 2 As shown, P11 and P21 are correspondingly set to J1, P12 and P22 are correspondingly set to J2, ..., P1n and P2n are correspondingly set to Jn. When the first circuit board is inserted into the connector, each contact point of the gold fingers of the first circuit board is clamped by a set of metal pins of the connector, realizing tight contact between the metal pins and the gold fingers, and improving the connection stability between the connector and the first circuit board.

[0060] Taking the test adapter unit 2, which includes a second circuit board, as an example, the power supply pin of the connector can be electrically connected to the conductive lines on the second circuit board using SMT or DIP technology. For example... Figure 2 As shown, the two opposite ends of connectors 2.1 to 2.n are provided with positioning structures 2.1.1 to 2.n.1, which are used to enhance the connection stability between the connector and the test adapter unit 2.

[0061] The positioning structure can be a metal harpoon pin. The metal harpoon pin can be soldered or plugged into the second circuit board.

[0062] Alternatively, the positioning structure can be a positioning hole, and correspondingly, the second circuit board is provided with positioning posts that are adapted to the positioning hole.

[0063] Alternatively, the positioning structure can also be a positioning post, and correspondingly, the second circuit board is provided with positioning holes that are compatible with the positioning post.

[0064] This application also provides an electrical device testing system. For example... Figure 3 As shown, the electronic device testing system includes an electronic device testing fixture and a power supply unit. The electronic device testing fixture includes multiple test piece connection parts; these test piece connection parts are used to connect electronic devices, and the multiple test piece connection parts are adapted to at least two different specifications of electronic devices. The power supply unit is electrically connected to the electronic device under test mounted on the electronic device testing fixture.

[0065] The power supply device forms multiple independent power channels with the connection points of multiple test pieces. The power supply device applies test voltage or test current to the electronic devices electrically connected to it through the power channels.

[0066] For example, the electronic device test fixture included in the electronic device test system can be the electronic device test fixture described in any of the foregoing embodiments.

[0067] In some embodiments, the power supply device includes a multi-channel digital power supply, and a power channel is formed between one output terminal of the multi-channel digital power supply and at least one test piece connection portion; the output terminal of the multi-channel digital power supply is used to output a constant voltage power supply in a first output mode, a constant current power supply in a second output mode, and a constant power power supply in a third output mode, and the output modes of the different output terminals of the multi-channel digital power supply are independent of each other. The power supply device adopts a high-precision multi-channel digital power supply, which supports automatic switching between three modes: voltage, current, and power. It can provide stable voltage or current to the multilayer ceramic capacitor under test and can display the corresponding output value in real time, meeting the requirements for applying electrical stress under different test scenarios.

[0068] In some embodiments, the electronic device testing system further includes: a sealed test chamber, a temperature control device, and a humidity control device. The electronic device testing fixture is disposed inside the sealed test chamber, the temperature control device is at least partially disposed inside the sealed test chamber, and the humidity control device is at least partially disposed inside the sealed test chamber.

[0069] The temperature control device is used to acquire the real-time temperature inside the sealed test chamber and, in response to a temperature control signal, to regulate the temperature inside the sealed test chamber to a set temperature range. In other words, the temperature control device is used to heat or cool the sealed test chamber.

[0070] The humidity control device is used to acquire the real-time humidity inside the sealed test chamber and, in response to a humidity control signal, adjust the humidity inside the sealed test chamber to a set humidity range. The humidity control device is used to humidify or dehumidify the sealed test chamber.

[0071] The electronic device testing system described in this application can simultaneously apply multiple stresses, such as temperature, humidity, and voltage, to devices, increasing the failure exposure rate by 3-5 times. This significantly reduces the testing time, for example, shortening the aging time from 1000 hours to 100 hours. This assists and drives manufacturers to continuously optimize and improve their products, reducing the probability of mistakenly selecting potentially high-risk materials in product design and improving the reliability of end products. Through this electronic device testing system, the impact of temperature and voltage stress on products can be studied and analyzed simultaneously. It allows for a comprehensive comparative analysis of the lifespan characteristics of various products in one go, solving the problem that traditional testing cannot quickly distinguish between superior and inferior products.

[0072] In some embodiments, the sealed test chamber includes at least two independent sealed spaces, each of which is equipped with a temperature control device and a humidity control device, and the environmental parameters in different sealed spaces can be adjusted individually; the environmental parameters include temperature values ​​and / or humidity values.

[0073] The sealed test chamber has multiple independent sealed spaces, which can simultaneously carry out experiments under different test temperatures and humidity conditions. There is no need to configure separate equipment for different test conditions, which reduces the number of experimental equipment and the total experimental time.

[0074] For example, such as Figure 3 As shown, the sealed test chamber is divided into upper and lower sections, each with its own independent temperature and humidity control system. These systems can operate simultaneously or independently to control the upper and lower layers of the chamber, ultimately achieving the required environmental stress conditions for the experiment (e.g., 105℃ for the upper layer and 85℃ for the lower layer). The test chamber can hold the relevant samples and tooling fixtures. Figure 3 As shown, the sealed test chamber can have one or more sealed spaces inside. Taking two sealed spaces as an example, they are the first sealed test chamber and the second sealed test chamber. Each of the two sealed spaces has an independent temperature and humidity control system, which can work simultaneously or independently to control the first sealed test chamber and the second sealed test chamber respectively, so as to achieve the corresponding environmental stress conditions required for the experiment (e.g., 105°C for the upper layer and 85°C for the lower layer). The sample mounting unit 1 and the test transfer unit 2 can be placed inside the sealed test chamber to apply the corresponding environmental stress to the sample to be tested.

[0075] In some embodiments, such as Figure 3As shown, the electronic device testing system also includes a data acquisition device, which is electrically connected to the electronic device testing fixture 10, the temperature control device, and the humidity control device. The data acquisition device is used to acquire environmental parameters within the sealed test chamber, and / or the electrical performance parameters of the electronic devices connected to the electronic device testing fixture. The environmental parameters include temperature and / or humidity values, and the electrical performance parameters include the internal resistance of the electronic device. When the electronic device is a capacitor, the electrical performance parameters also include the capacitance value.

[0076] In some embodiments, the acquisition device includes a multi-channel data acquisition unit.

[0077] The data acquisition device uses a high-precision multi-channel data acquisition instrument. The multi-channel data acquisition instrument is used to acquire relevant environmental parameters or electrical performance parameters of the multilayer ceramic capacitor under test in real time within the sealed test chamber, ensuring the real-time nature and integrity of the test data.

[0078] In some embodiments, the electronic device testing system further includes a control device, which has multi-threaded task processing capabilities, supports coordinated control of environmental parameters and electrical performance parameters, and is used to receive and / or send relevant signals to the acquisition device and the power supply device. Through the coordinated scheduling of the control device, the precise synchronous application of environmental stress and electrical stress can be achieved, thereby improving the controllability of the testing process.

[0079] In some embodiments, the electronic device testing system also includes an operating platform. The operating platform supports linkage with host computer software, real-time signal interaction with the control device, receiving and / or issuing execution instructions, and supports dynamic monitoring and recording functions. Operators can conveniently set test parameters, monitor the test process, and automatically record test data through the operating platform, reducing the intensity of manual operation and data recording errors.

[0080] In conjunction with the above embodiments, in the electronic device testing system of some embodiments of this application, at least a portion of the capacitors to be tested connected on the sample mounting unit 1 are connected in parallel. The user issues output commands to the power supply device through the control device on the operating platform (host computer). The power supply device outputs the corresponding test voltage and current to the test adapter unit 2 according to the command set by the user, and applies them to the capacitor body on the sample mounting unit 1 through the connector. The acquisition device monitors and acquires the test data of the capacitor sample under test in real time and sends it back to the operating platform for analysis and backup, forming a complete test closed loop.

[0081] The following uses a ceramic capacitor as an example to illustrate the test method of the electronic device test system of this application.

[0082] The testing methods of electronic device testing systems include: 101. Set up the test environment; 102. Once the ceramic capacitor is fixed onto the sample mounting unit, insert it into the connector slot of the test adapter unit and place it in a sealed test chamber; 103. Set the temperature and humidity inside the sealed test chamber to the target values ​​and wait for 30 minutes; 104. Control the power supply device to output the target voltage and / or current to the ceramic capacitor; 105. Continuously monitor the capacitance and / or internal resistance of ceramic capacitors using a data acquisition device; 106. Record the failure time of each test sample. The test will end after 100 hours. 107. Based on the acceleration model, analyze the data and plot the Weber distribution curve.

[0083] Specifically, for example, by increasing the stress effect of temperature and voltage factors on ceramic capacitors, the performance of various products can be quickly tested. To verify the impact of temperature and voltage factors on the ultimate lifespan of ceramic capacitors, reasonable test conditions are established to quickly verify and compare the differences in ultimate lifespan among multiple ceramic capacitor manufacturers without disrupting the failure mechanisms of each product. Samples of the same specifications from different manufacturers (A, B, C, D, and E) are selected, with a rated operating temperature of 105℃ and a rated operating voltage of 16V. These are divided into three groups, with 100 samples from each manufacturer in each group, numbered, and installed on sample mounting unit 1. These samples are then inserted into the connector slots on test adapter unit 2, thus setting up the relevant test environment.

[0084] The first group was placed in the first sealed test chamber, with the chamber temperature set at 150℃ and the voltage at 24V (first test condition); the second group was placed in the second sealed test chamber, with the chamber temperature set at 125℃ and the voltage at 32V (second test condition); the third group was placed in the third sealed test chamber, with the chamber temperature set at 125℃ and the voltage at 40V (third test condition). After the test started, the data acquisition device continuously monitored the change in internal resistance of each test sample and recorded the time when the internal resistance exceeded the specification. After 100 hours of testing, the experimental data was analyzed, and the number of failures and the failure time of each product were recorded. The test data are as follows: <B1-life>: The time it takes for the cumulative failure rate to reach 1%, i.e., the failure time of the first failure (NG) out of 100 samples. A higher value is better, and the unit is hours. The experimental results show that under the first test condition, except for samples from manufacturer A, samples from other manufacturers failed rapidly, with failure times all less than 10 hours. This indicates that the stress condition is too harsh and cannot effectively differentiate the quality of different products. Under the second and third test conditions, based on the length of failure time, it can be distinguished that manufacturer A's product is superior to manufacturer E's, manufacturer E's is superior to manufacturer B's, and manufacturer B's is superior to manufacturers C and D's. Among these, the experimental data under the second test condition is more reasonable, and the second test condition can be preferred as the product performance evaluation standard.

[0085] <Failure Rate>: The percentage of IR (insulation resistance) degradation within 100 hours; the lower the value, the better. Under the first test condition, all samples from manufacturers other than Manufacturer A failed, indicating that the temperature and voltage stress under this condition was too harsh. Under the third test condition, samples from three manufacturers also experienced batch failures. Only under the second test condition did each product maintain a certain failure rate, and no complete failures occurred, indicating that the applied temperature and voltage had not damaged the product's inherent failure mechanism, further verifying the rationality of the second test condition as an evaluation standard.

[0086] <Weber Chart>: Based on the number of failures and the time of failure, Weber charts of the characteristics of each product are drawn, which can more intuitively show the performance advantages and disadvantages of each product and provide accurate basis for product selection.

[0087] In conventional reliability life tests, failures are generally not detected in 1000-hour tests; however, based on the electronic device testing system and method provided in this application, the failure detection rate can reach 100%. At the same time, by controlling the stress settings, the performance of each product can be quickly identified within 100-hour test time, which greatly shortens the test cycle.

[0088] Multiple sealed test chambers, coupled with external power supply, data acquisition, and control devices, enable simultaneous experiments under varying stress conditions. This eliminates the need for independent repetition or additional equipment for different tests, significantly reducing testing costs and time. By simultaneously setting three or more test conditions within a 100-hour testing period, the performance of various products under temperature, voltage, and current stresses can be quickly assessed, allowing for a comparative analysis of their strengths and weaknesses under specific conditions. Compared to the industry-standard 1000-hour reliability test, this application effectively shortens the testing time and enhances the intuitiveness of ranking product performance.

[0089] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0090] The above provides a detailed description of an electronic device testing fixture and testing system provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An electronic device testing fixture, comprising: The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system.

2. The electronic device testing fixture of claim 1, wherein, The application relates to an electronic device testing system.

3. The electronic device testing fixture of claim 1, wherein, The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system.

4. The electronic device testing fixture of claim 1, wherein, The application relates to an electronic device testing system. The application relates to an electronic device testing system.

5. The electronic device testing fixture of any one of claims 1-4, wherein, The application relates to an electronic device testing system.

6. An electronic device testing system, characterized by The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system.

7. The electronic device testing system of claim 6, wherein, The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. 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The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing system. The application relates to an electronic device testing 8. The electronic device testing system of claim 7, wherein, The closed test box comprises at least two closed spaces independent of each other, each of the closed spaces is provided with the temperature control device and the humidity control device, and the environment parameters in different closed spaces can be independently regulated; the environment parameters comprise the temperature value and / or the humidity value.

9. The electronic device testing system of claim 7, wherein, The electronic device testing system further comprises: The acquisition device is electrically connected with the electronic device testing fixture, the temperature control device and the humidity control device; The acquisition device is used for acquiring the environment parameters in the closed test box and / or the electrical performance parameters of the electronic device connected to the electronic device testing fixture; The environment parameters comprise the temperature value and / or the humidity value; The electrical performance parameters comprise the internal resistance of the electronic device; when the electronic device is a capacitor, the electrical performance parameters further comprise the capacitance of the capacitor.

10. The electronic device testing system of claim 6, wherein, The power supply device comprises a multi-channel digital power supply, one output end of the multi-channel digital power supply and at least one test piece connecting part form the power supply channel; the output end of the multi-channel digital power supply is used for outputting constant voltage power supply in a first output mode, constant current power supply in a second output mode and constant power power supply in a third output mode, and the output modes of different output ends of the multi-channel digital power supply are independent of each other; The electronic device testing system further comprises an acquisition device electrically connected with the electronic device testing fixture; The acquisition device comprises a multi-channel data acquisition instrument.

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