Driving unit, driving device, camera module and driving unit preparation method

By introducing a magnetic adhesive layer into the voice coil motor, a high-permeability channel and magnetic circuit coupling are formed, which solves the problem of insufficient driving force of the voice coil motor in the same or smaller volume, and realizes the improvement of driving performance and stability.

CN121578463BActive Publication Date: 2026-04-24NINGBO SUNNY OPOTECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
NINGBO SUNNY OPOTECH CO LTD
Filing Date
2026-01-27
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing voice coil motors have difficulty increasing driving force within the same or smaller size, resulting in problems such as shortened focusing travel, limited image stabilization compensation angle, and reduced zoom speed in camera modules.

Method used

A magnetic adhesive layer is introduced into the drive unit. By forming a high-permeability magnetic channel and magnetic circuit coupling method inside the coil, the magnetic field strength between the coil and the magnet is enhanced. The magnetic adhesive layer fills the unused space inside the coil without increasing the volume.

Benefits of technology

Significantly improves driving force within the same or smaller volume, enhances the driving performance of camera modules, strengthens the clamping force of optical components, reduces magnetic field loss, and improves driving stability and accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to a driving unit, a driving device, a camera module and a preparation method of the driving unit. The driving unit is used for driving an optical element and comprises a substrate, a coil, a magnet and a magnetic adhesive layer. The coil is fixed to the substrate, the coil and the magnet are arranged in a first direction, and the coil can drive the magnet to move relative to the coil after being electrified. The magnetic adhesive layer is fixed to the coil and / or the substrate, and a projection of the magnetic adhesive layer along the first direction is completely located within a projection range of the coil, so as to enhance the driving force between the coil and the magnet. In addition, the magnetic adhesive layer fills the original idle space in the coil, and no additional volume is occupied, so that the driving force of the driving unit can be increased under the premise of the same or even smaller volume.
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Description

Technical Field

[0001] This invention relates to the technical field of camera modules, and in particular to a driving unit, driving device, camera module, and method for manufacturing the driving unit. Background Technology

[0002] Camera modules have become standard in electronic devices such as smartphones, tablets, and wearable devices. To ensure image quality, camera modules need to integrate functions such as optical autofocus (AF), optical image stabilization (OIS), or optical zoom. The realization of any of these functions relies on a motor driving the lens assembly or image sensor to make micro-displacement or rotation in at least one direction.

[0003] As consumers' demands for image quality continue to rise, so do their requirements for motor drive performance. Among these, high thrust is the primary bottleneck; insufficient thrust can lead to problems such as shortened focus throw, limited image stabilization compensation angle, and reduced zoom speed.

[0004] The current mainstream solution in the market is the voice coil motor (VCM), which uses the Lorentz force between an energized coil and a magnet to generate driving force. Therefore, how to significantly improve the coil-magnet coupling efficiency within the same or even smaller volume, thereby increasing the driving force of the motor and breaking through the thrust bottleneck of the motor, has become a core technical problem that urgently needs to be solved in the field of camera module motors. Summary of the Invention

[0005] Therefore, it is necessary to address the problem that voice coil motors currently used to drive optical elements cannot increase driving force under the same or smaller volume conditions, and to provide a driving unit, driving device, camera module, and driving unit manufacturing method that can increase driving force under the same or smaller volume conditions.

[0006] This application first provides a driving unit for driving optical elements, including a substrate, a coil, a magnet, and a magnetic adhesive layer. The coil is fixed to the substrate, and the coil and the magnet are spaced apart along a first direction. When the coil is energized, it can drive the magnet to move relative to the coil. The magnetic adhesive layer is fixed to the coil and / or the substrate, and the projection of the magnetic adhesive layer along the first direction is completely within the projection range of the coil, so as to enhance the driving force between the coil and the magnet.

[0007] In one embodiment, the magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers distributed within the adhesive layer matrix, wherein the magnetic fillers include soft magnetic powder and / or permanent magnetic powder.

[0008] In one embodiment, the magnetic filler is uniformly distributed within the adhesive matrix, and the magnetic filler accounts for 1wt% to 30wt% of the magnetic adhesive layer.

[0009] In one embodiment, the adhesive matrix is ​​an insulating material.

[0010] In one embodiment, the adhesive matrix is ​​black.

[0011] In one embodiment, the drive unit further includes a protective layer fixed to the magnetic adhesive layer and covering the exposed surface of the magnetic adhesive layer.

[0012] In one embodiment, the protective layer is black.

[0013] In one embodiment, the spacing between the protective layer and the magnet along the first direction is greater than or equal to the spacing between the coil and the magnet along the first direction.

[0014] In one embodiment, the distance between the magnetic adhesive layer and the magnet along the first direction is greater than or equal to the distance between the coil and the magnet along the first direction.

[0015] In one embodiment, the coil is annular to form a receiving cavity between the inner wall of the coil and the substrate; the magnetic adhesive layer is disposed within the receiving cavity and / or within the gaps between the wires in the coil.

[0016] In one embodiment, the magnetic adhesive layer is fixed to the substrate and contacts the inner wall of the coil.

[0017] In one embodiment, the projection of the magnetic adhesive layer along the first direction completely covers the accommodating cavity.

[0018] In one embodiment, the magnetic adhesive layer is fixed to the substrate, and the magnetic adhesive layer is spaced apart from the inner wall of the coil.

[0019] In one embodiment, the cross-sectional area of ​​the magnetic adhesive layer perpendicular to the first direction gradually decreases towards the magnet along the first direction.

[0020] In one embodiment, the thixotropic ratio of the magnetic adhesive liquid used to cure the magnetic adhesive layer is in the range of 3 to 5.

[0021] In one embodiment, the magnetic adhesive layer is fixed to the substrate, and two magnetic adhesive layers are disposed in the accommodating cavity at intervals along a plane perpendicular to the first direction.

[0022] In one embodiment, the two magnetic adhesive layers are spaced apart along the length of the coil.

[0023] In one embodiment, the portion of the accommodating cavity located between the two magnetic adhesive layers, along the first direction, accounts for a proportion of 1 / 4 to 1 / 2 of the total projected area of ​​the accommodating cavity.

[0024] In one embodiment, the magnetic adhesive layer is fixed to the substrate, and the magnetic adhesive layer is centrally or eccentrically disposed within the accommodating cavity along a plane perpendicular to the first direction.

[0025] In one embodiment, the thickness of the magnetic adhesive layer along the first direction accounts for 50% to 100% of the thickness of the coil.

[0026] In one embodiment, within the range of movement of the magnet relative to the coil, the projection of the magnetic adhesive layer along the first direction is always completely within the magnet.

[0027] In one embodiment, the magnetic adhesive layer is symmetrically arranged with the center line of the coil as the center, the center line is parallel to the second direction and divides the coil equally along the third direction, the second direction and the third direction are both perpendicular to the first direction, and the two are perpendicular to each other.

[0028] In one embodiment, the drive unit further includes a position sensor fixed to the substrate along the first direction near the magnet and used to detect the movement of the magnet relative to itself; the position sensor is located inside or outside the annular coil.

[0029] In one embodiment, the driving unit further includes a capacitor fixed to the substrate along the first direction near the magnet, and both the capacitor and the position sensor are located outside the coil.

[0030] In one embodiment, the position sensor is located inside the coil and spaced apart from the magnetic adhesive layer.

[0031] In one embodiment, the position sensor is located inside the coil, and the surface of the position sensor near the magnet is at least partially not covered by the magnetic adhesive layer, or the magnetic adhesive layer completely covers the position sensor.

[0032] This application also provides a driving device for driving an optical element, including a first frame, a second frame, a support member, and a driving assembly; wherein the first frame is used to support the optical element, the support member is disposed between the first frame and the second frame and is used to movably suspend the first frame in the second frame; the driving assembly includes the aforementioned driving unit and is configured to drive the first frame to move relative to the second frame.

[0033] This application also provides a camera module, including an optical lens, a photosensitive module, and the aforementioned driving device; the optical lens is disposed in one of the first frame or the second frame, and is used to receive and emit light along its own optical axis; the photosensitive module is disposed in the other of the first frame or the second frame, and is used to receive the light emitted by the optical lens for imaging.

[0034] This application also provides a method for fabricating a driving unit, including the following steps:

[0035] a. Fix the coil to the substrate to form an accommodating cavity between the inner wall of the coil and the substrate;

[0036] b. Apply magnetic adhesive to the cavity and cure it to form a magnetic adhesive layer;

[0037] c. The substrate and the magnet are spaced apart on two frames along a first direction.

[0038] In one embodiment, a further step is included between step b and step c:

[0039] d. Apply adhesive to the magnetic adhesive layer and cure it to form a protective layer that completely covers the exposed surface of the magnetic adhesive layer.

[0040] The aforementioned driving unit, by incorporating a magnetic adhesive layer within the coil, achieves two key benefits. First, the magnetic adhesive layer forms a high-permeability channel within the coil, allowing the magnetic flux generated after energization to preferentially close through this channel, reducing the flux's travel distance and leakage loss in the air. This effectively enhances the strength of the coil's magnetic field within the working air gap under the same input current conditions. Second, the magnetic adhesive layer provides a low-resistance bypass for the magnet flux through magnetic circuit coupling, guiding and converging the magnet flux that would otherwise diffuse into the surrounding space into the working air gap, thereby increasing the magnet's magnetic field strength within the working air gap. Therefore, under the same current input conditions, the magnetic adhesive layer effectively increases the total magnetic field strength generated by the coil and magnet within the working air gap through its dual effects of enhancing the coil's magnetic field and converging the magnet's magnetic field, thus effectively increasing the driving force between the coil and magnet. Furthermore, since the projection of the magnetic adhesive layer along the first direction is entirely within the coil's projection range, the magnetic adhesive layer can be placed within the coil to fill existing unused space, without requiring additional volume. This allows for an increase in the driving force of the driving unit within the same or even smaller volume. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the first embodiment of the driving unit of this application;

[0042] Figure 2 This is an exploded view of the second embodiment of the driving unit of this application;

[0043] Figure 3 This is a cross-sectional view of the third embodiment of the driving unit of this application;

[0044] Figure 4 This is a cross-sectional view of the fourth embodiment of the driving unit of this application;

[0045] Figure 5 This is a perspective view of the fifth embodiment of the driving unit of this application after the magnet is hidden;

[0046] Figure 6 for Figure 5 A sectional view;

[0047] Figure 7 This is a cross-sectional view of the sixth embodiment of the driving unit of this application;

[0048] Figure 8 This is a cross-sectional view of the seventh embodiment of the driving unit of this application;

[0049] Figure 9 This is a perspective view of the camera module of this application;

[0050] Figure 10 This is a perspective view of the drive device of this application;

[0051] Figure 11 for Figure 10 An exploded view showing the optical lens hidden behind the lens.

[0052] Figure 12 for Figure 10 A three-dimensional view of the third frame structure from a low angle, after the third frame is hidden.

[0053] Reference numerals: 1. Optical lens; 2. Photosensitive module; 10. Substrate; 20. Coil; 21. Receptacle; 30. Magnet; 40. Magnetic adhesive layer; 50. Position sensor; 60. Capacitor; 70. Protective layer; 100. First frame; 200. Second frame; 300. Third frame; 411. First coil; 412. First magnet; 421. Second coil; 422. Second magnet; 510. First circuit section; 520. Second circuit section; 531. Circuit connector; 532. Circuit lead-out component; 610. First position sensor; 620. First capacitor; 630. Second position sensor; 640. Second capacitor; 711. First support section; 712. First magnetic attraction section; 721. Second support section; 722. Second magnetic attraction section; 800. Top cover. Detailed Implementation

[0054] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0055] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0056] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0057] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0058] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0059] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0060] For ease of description, in this application, the relative orientation of the coil 20 and the magnet 30 is defined as the first direction C1, and two directions perpendicular to the first direction C1 and mutually perpendicular are defined as the second direction C2 and the third direction C3, respectively. Both the second direction C2 and the third direction C3 are parallel to the winding plane of the coil 20.

[0061] Please refer to Figure 1 As shown, this application first provides a driving unit for driving optical elements, including a substrate 10, a coil 20, a magnet 30, and a magnetic adhesive layer 40. The coil 20 is fixed to the substrate 10, and the coil 20 and the magnet 30 are spaced apart along a first direction. When the coil 20 is energized, it can drive the magnet 30 to move relative to the coil 20. The magnetic adhesive layer 40 is fixed to the coil 20 and / or the substrate 10. The projection of the magnetic adhesive layer 40 along the first direction is completely within the projection range of the coil 20, so as to enhance the driving force between the coil 20 and the magnet 30.

[0062] Among them, optical components include, but are not limited to, optical lens 1, optical lens group or photosensitive chip, etc.

[0063] In this application, by providing a magnetic adhesive layer 40 on the coil 20 and / or the substrate 10, on the one hand, the magnetic adhesive layer 40 can form a high-permeability channel inside the coil 20, allowing the magnetic flux generated after the coil 20 is energized to preferentially close through this channel, reducing the travel distance and leakage loss of the magnetic flux in the air. Thus, under the same input current conditions, the strength of the coil magnetic field within the working air gap is effectively increased. On the other hand, the magnetic adhesive layer 40 can also provide a low-resistance bypass for the magnetic flux through magnetic circuit coupling, guiding and converging the magnetic flux that would otherwise diffuse into the surrounding space into the working air gap, thereby increasing the magnetic field strength of the magnet within the working air gap. Therefore, under the same current input conditions, the magnetic adhesive layer 40, through its dual effect of enhancing the coil magnetic field and converging the magnet magnetic field, effectively increases the total magnetic field strength generated by the coil 20 and the magnet 30 within the working air gap, thereby effectively increasing the driving force generated between the coil 20 and the magnet 30.

[0064] The working air gap refers to the air gap between the magnet 30 and the coil 20 where energy conversion actually occurs. In other words, it is the effective area where the magnetic field of the coil 20 interacts with the magnetic field of the magnet to generate driving force after the coil 20 is energized.

[0065] Furthermore, since the projection of the magnetic adhesive layer 40 along the first direction C1 is entirely within the projection range of the coil 20 (i.e., the outer contour of the coil 20), the magnetic adhesive layer 40 can be placed in the coil to fill the original unused space inside the coil 20 without occupying additional volume. This allows for an increase in the driving force of the driving unit while maintaining the same or even smaller volume. Simultaneously, while achieving the same driving force, the size or number of turns of the coil 20 can be reduced by using the magnetic adhesive layer 40, thereby reducing the overall size and weight of the driving unit to some extent.

[0066] In addition, the magnetic adhesive layer 40 is magnetic, and the magnetic attraction or repulsion generated between it and the magnet 30 can increase or decrease the clamping force between the coil 20 and the frame containing the magnet 30, so as to adjust the clamping force between the frames.

[0067] It is worth mentioning that the coil 20 and the magnet 30 are spaced apart, with an air gap between them, so that the magnet 30 and the coil 20 will not interfere with each other during the operation of the drive unit. Furthermore, the magnetic adhesive layer 40 is also spaced apart from the magnet 30, and there is also an air gap between the magnetic adhesive layer 40 and the magnet 30.

[0068] In some embodiments, the coil 20 is fixed to the side of the substrate 10 close to the magnet 30 along the first direction C1, and the substrate 10 and the magnet 30 are also spaced apart along the first direction C1.

[0069] In some embodiments, when the coil 20 is energized, it can drive the magnet 30 to move relative to the coil 20 in a direction perpendicular to the first direction C1 (e.g., along the second direction C2); in other embodiments, when the coil 20 is energized, it can drive the magnet 30 to move relative to the coil 20 in the first direction C1.

[0070] In some embodiments, the magnetic adhesive layer 40 includes an adhesive layer matrix and magnetic fillers uniformly distributed within the adhesive layer matrix. The magnetic fillers include soft magnetic powder and / or permanent magnetic powder. When the magnetic fillers include permanent magnetic powder, in one embodiment, the magnetic field direction of the magnetic adhesive layer 40 is parallel to the magnetic field direction of the magnet.

[0071] The magnetic adhesive layer 40 is obtained by curing a magnetic adhesive liquid, which includes an adhesive liquid and magnetic fillers dispersed in the adhesive liquid. After the magnetic adhesive liquid is applied to the substrate 10, the magnetic adhesive liquid is cured to obtain the magnetic adhesive layer 40 fixed to the substrate 10. In one embodiment, the magnetic fillers are uniformly distributed in the adhesive liquid, and correspondingly, after the magnetic adhesive liquid is cured, the magnetic fillers are uniformly distributed inside the adhesive layer matrix.

[0072] In this application, a magnetic adhesive layer 40 containing permanent magnet powder is provided, which can be magnetized according to the magnetic field direction of the magnet 30 to ensure that the magnetic field direction of the magnetic adhesive layer 40 is completely parallel and in the same direction as the magnetic field of the magnet 30.

[0073] It is worth mentioning that the magnetic adhesive layer 40 has high structural plasticity. If other permanent magnets with fixed structures and shapes (such as magnets) are set inside the coil 20, the process of accurately magnetizing a specific direction of magnetic field in a precise and tiny structure (such as a voice coil motor) is extremely difficult. If the magnetization is not based on the magnetic field of the magnet 30, the newly added permanent magnet, as a new magnetic field source, will disrupt the original magnetic circuit balance of the magnet 30 and interfere with the original magnetic field distribution of the magnet 30, thereby causing a decrease in magnetic field strength or even failure.

[0074] In addition, permanent magnet powder is difficult to demagnetize and has high coercivity, and can maintain a magnetic field for a long time after being magnetized once. Therefore, the magnetic adhesive layer 40 with permanent magnet powder is suitable for generating magnetic attraction or magnetic repulsion with the magnet 30, thereby increasing or decreasing the clamping force between the coil 20 and the frame containing the magnet 30 by utilizing the magnetic attraction or magnetic repulsion between the magnetic adhesive layer 40 and the magnet 30.

[0075] Specifically, the permanent magnet powder can be implemented as one or more of neodymium iron boron powder, aluminum nickel cobalt powder, ferrite permanent magnet powder, etc.

[0076] In this application, the magnetic adhesive layer 40, which contains soft magnetic powder, has high magnetic permeability. On the one hand, it can form a high-permeability channel inside the coil 20, so that the magnetic flux generated after the coil 20 is energized will preferentially close through this channel, reducing the travel distance of the magnetic flux in the air and the leakage loss. On the other hand, it can also provide a low magnetic resistance bypass for the magnetic flux of the magnet through magnetic circuit coupling, so that the magnetic flux of the magnet that originally diffuses into the surrounding space is guided and converged into the working air gap, thereby increasing the magnetic field strength of the magnet in the working air gap, and thus achieving the effect of increasing the driving force between the coil 20 and the magnet 30.

[0077] Meanwhile, the magnetic adhesive layer 40, which contains soft magnetic powder, can make the magnetic field of the coil 20 more stable and uniform, thereby reducing magnetic field fluctuations and noise, and improving the stability and accuracy of the drive unit operation.

[0078] It is worth mentioning that, compared to other soft magnetic components with fixed structures and shapes placed inside the coil 20, most of them are difficult to perfectly fit the complex, narrow, and irregular space inside the coil 20, thus failing to make full use of the space. At the same time, the existence of gaps will also affect the magnetic field converging efficiency and weaken the magnetic field enhancement effect. However, the magnetic adhesive layer 40 of this application is formed by curing liquid magnetic adhesive, which can seamlessly fill the internal space of the coil 20, thereby making full use of the internal space of the coil 20 while achieving excellent magnetic field enhancement effect.

[0079] In addition, soft magnetic powder has the characteristics of easy magnetization, easy demagnetization, low coercivity and high permeability; therefore, the magnetic adhesive layer 40 has good permeability and is suitable for generating magnetic attraction with the magnet 30, thereby enhancing the clamping force between the coil 20 and the frame containing the magnet 30.

[0080] Specifically, the soft magnetic powder can be one or more of the following: nickel-iron soft magnetic alloy powder, low carbon steel powder, 430 stainless steel powder, and iron oxide powder.

[0081] It should be understood that in some other embodiments, the magnetic filler can be unevenly distributed in the adhesive matrix to control the magnetic attraction / repulsion at different positions of the magnetic adhesive layer 40, thereby achieving precise control of the clamping force between the frame containing the coil 20 and the magnet 30.

[0082] Furthermore, in some embodiments, the magnetic filler accounts for 1wt% to 30wt% of the magnetic adhesive layer 40.

[0083] This setup ensures that the density of the magnetic filler is sufficient to form an effective magnetic conductive path, while avoiding the deterioration of the fluidity of the adhesive matrix due to excessive filler.

[0084] Specifically, if the proportion of magnetic filler is too low, the magnetic resistance of the magnetic circuit cannot be significantly reduced, and the driving force improvement effect is weak; conversely, if the proportion of magnetic filler is too high, on the one hand, it will reduce the fluidity of the magnetic adhesive, which may cause the magnetic adhesive layer 40 to fail to completely fill the internal space of the coil 20, resulting in incomplete filling or the generation of air bubbles.

[0085] Furthermore, in some embodiments, the adhesive layer substrate is an insulating material. Since the coil 20 carries a driving current, using an insulating material as the adhesive layer substrate avoids the formation of conductive paths, thereby preventing leakage or short circuits in the coil 20 due to conductivity of the magnetic adhesive layer 40. Therefore, ensuring that the proportion of magnetic filler in the magnetic adhesive layer 40 is less than or equal to 30 wt% also helps maintain the electrical insulation properties of the magnetic adhesive layer 40.

[0086] Furthermore, please combine Figure 2 , Figure 3 as well as Figure 4 As shown, in some embodiments, the drive unit further includes a protective layer 70, which is fixed to the magnetic adhesive layer 40 and covers the exposed surface of the magnetic adhesive layer 40.

[0087] This design physically isolates the magnetic filler inside the magnetic adhesive layer 40 from the outside world, preventing powder from falling off and entering the drive unit due to long-term use or vibration. This avoids the risk of magnetic filler contaminating optical components from the source and ensures the long-term reliability of the drive unit during precision displacement.

[0088] Specifically, the protective layer 70 is formed by curing the adhesive. The liquid adhesive can completely cover the exposed surface of the magnetic adhesive layer 40 by its own fluidity, so as to ensure that the cured protective layer 70 completely covers the exposed surface of the magnetic adhesive layer 40 and completely avoids the risk of magnetic filler leakage.

[0089] Furthermore, in some embodiments, the adhesive substrate is black. A black adhesive substrate can efficiently absorb incident light, preventing the magnetic adhesive layer 40 from reflecting stray light into the optical path of the optical element, thereby reducing the risk of stray light.

[0090] Furthermore, when a protective layer 70 is provided in the drive unit, the protective layer 70 is black. The black protective layer 70 can reduce the risk of stray light. At this time, since the magnetic adhesive layer 40 is covered by the protective layer 70, the adhesive layer substrate can be black or other colors.

[0091] Please refer to Figure 3 , Figure 4 , Figure 7 as well as Figure 8As shown, in some embodiments, the distance between the magnetic adhesive layer 40 and the magnet 30 along the first direction C1 is greater than or equal to the distance between the coil 20 and the magnet 30 along the first direction C1, ensuring that the magnetic adhesive layer 40 does not protrude from the coil 20 on the side near the magnet 30 along the first direction C1. Correspondingly, the distance between the magnetic adhesive layer 40 and the magnet 30 along the first direction C1 is greater than or equal to the distance between the coil 20 and the magnet 30 along the first direction C1. It should be understood that if the magnetic adhesive layer 40 protrudes from the coil 20 on the side near the magnet 30 along the first direction C1, to avoid the risk of interference between the magnetic adhesive layer 40 and the magnet 30, a certain gap needs to be maintained between the magnetic adhesive layer 40 and the magnet 30, thereby increasing the distance between the coil 20 and the magnet 30. However, an increased distance between the coil 20 and the magnet 30 leads to a decrease in driving force.

[0092] With this configuration, when the magnet 30 and the coil 20 move relative to each other, the magnetic adhesive layer 40 will not mechanically interfere with the magnet 30. By avoiding spatial interference, the magnetic adhesive layer 40 effectively reduces the interference of the original degree of freedom of movement of the magnet 30, thus ensuring driving stability.

[0093] Furthermore, when a protective layer 70 is provided in the drive unit, the distance between the protective layer 70 and the magnet 30 along the first direction C1 is greater than or equal to the distance between the coil 20 and the magnet 30 along the first direction C1. That is, the protective layer 70 does not protrude from the coil 20 along the first direction C1, so as to avoid interference between the protective layer 70 and the magnet 30, thereby reducing the influence of the setting of the protective layer 70 on the relative movement between the magnet 30 and the coil 20.

[0094] Please combine Figure 1 as well as Figure 2 As shown, in some embodiments, the coil 20 is formed by winding a wire along a winding plane perpendicular to the first direction C1. The coil 20 is annular, and the annular coil 20 has an inner annular wall and an outer annular wall in the radial direction. The inner annular wall and the substrate 10 surround and form a receiving cavity 21. The magnetic adhesive layer 40 is disposed in the receiving cavity 21 and / or in the gap between each wire in the coil 20.

[0095] With this configuration, whether the magnetic adhesive layer 40 is placed inside the accommodating cavity 21 or in the gap between the wires, the unused space at the location of the coil 20 can be fully utilized, avoiding additional volume occupation.

[0096] Specifically, if the magnetic adhesive layer 40 is placed inside the accommodating cavity 21, it can form a high magnetic permeability channel inside the coil 20 or provide a low magnetic resistance bypass for the magnetic flux of the magnet through magnetic circuit coupling; if the magnetic adhesive layer 40 is placed in the gap between the wires, its fine filling can reduce magnetic field leakage, optimize the magnetic field line path, and help optimize the magnetic field of the coil 20.

[0097] More specifically, the coil 20 has a preset thickness along the first direction C1, which is perpendicular to the winding plane of the coil 20; the coil 20 has two leads, which are respectively soldered to two coil pads on the substrate 10 to make the coil 20 electrically connected to the substrate 10, wherein the coil pads are two spaced pads on the substrate 10.

[0098] Furthermore, please combine Figure 1 , Figure 3 as well as Figure 4 As shown, in some embodiments, the magnetic adhesive layer 40 is disposed in the accommodating cavity 21 and fixed to the substrate 10, and the magnetic adhesive layer 40 is in contact with the annular inner wall of the coil 20.

[0099] By physically contacting the magnetic adhesive layer 40 with the annular inner wall of the coil 20, the gap between the magnetic adhesive layer 40 and the coil 20 can be reduced or even eliminated, thereby maximizing the volume of the magnetic adhesive layer 40 and improving its effectiveness. Furthermore, when the magnetic filler of the magnetic adhesive layer 40 is soft magnetic powder, eliminating the gap through contact can also ensure efficient connection between the magnetic circuit channel and the low magnetic resistance path of the magnetic adhesive layer 40, thereby improving the collection efficiency and density of magnetic lines of force.

[0100] On the other hand, the magnetic adhesive layer 40 simultaneously contacts and fixes the inner wall of the coil 20 and the substrate 10, increasing the fixing area of ​​the magnetic adhesive layer 40 and the fixing reliability of the coil 20, thereby enhancing the structural stability and reliability during dynamic movement processes such as focusing and image stabilization.

[0101] In addition, the physical contact between the magnetic adhesive layer 40 and the coil 20 helps dissipate heat when the coil 20 is working, thereby improving the heat dissipation effect of the drive unit.

[0102] Experiments have shown that, in the experimental group where a magnetic adhesive layer 40 is placed in the accommodating cavity 21 and contacts the annular inner wall of the coil 20, the magnetic field strength in the working air gap increases by approximately 15% compared to the control group where no magnetic adhesive layer 40 is placed.

[0103] Furthermore, the projection of the magnetic adhesive layer 40 along the first direction C1 completely covers the accommodating cavity 21. That is, the magnetic adhesive layer 40 is in complete contact with the annular inner wall of the coil 20.

[0104] By projecting the entire area, the magnetic adhesive layer 40 is ensured to fill the entire space of the accommodating cavity 21 to the maximum extent. The high space utilization ensures no waste in a compact volume, thereby further reducing the loss of the edge magnetic field.

[0105] Compared to partial coverage, full coverage can further optimize the uniformity of magnetic field distribution, enhance the driving force more comprehensively, and avoid the "blind spot" effect caused by uncovered areas.

[0106] Furthermore, please combine Figure 5 , Figure 6 as well as Figure 7 As shown, the magnetic adhesive layer 40 is disposed in the accommodating cavity 21 and fixed to the substrate 10, and the magnetic adhesive layer 40 is spaced apart from the annular inner wall of the coil 20.

[0107] This configuration, by maintaining a physical gap between the magnetic adhesive layer 40 and the coil 20, can isolate the magnetic adhesive layer 40 from direct contact with the coil 20, thus avoiding the risk of short circuit.

[0108] Specifically, experiments have shown that in the experimental group where a magnetic adhesive layer 40 is provided in the accommodating cavity 21 at intervals from the annular inner wall of the coil 20, the magnetic field strength at the location of the coil 20 increases by approximately 10% compared to the control group where no magnetic adhesive layer 40 is provided.

[0109] Furthermore, please combine Figure 5 as well as Figure 6 As shown, the cross-sectional area of ​​the magnetic adhesive layer 40 along the first direction C1 gradually decreases towards the magnet 30 along the first direction C1.

[0110] It is easy to understand that because the magnetic adhesive layer 40 and the annular inner wall of the coil 20 are spaced apart and do not directly contact each other, when magnetic adhesive is applied into the accommodating cavity 21, the magnetic adhesive will form a structure that is larger at the bottom and smaller at the top under the action of gravity. This gradient cross-section structure matches the magnetic field attenuation law of the magnet 30, which can make the magnetic flux more efficiently converge to the sensitive area of ​​the coil 20 and optimize the magnetic circuit. In addition, it can also reduce the amount of material used on the side of the magnetic adhesive layer 40 close to the magnet 30, reducing the ineffective weight while meeting the magnetic field enhancement requirements, and avoiding the impact of redundant mass on the response speed.

[0111] Specifically, the magnetic adhesive layer 40 can be formed by curing after a single application of adhesive, or by curing after multiple applications of adhesive (i.e., applying adhesive again after curing once, and repeating this process multiple times to achieve the required thickness).

[0112] More specifically, the thixotropic ratio of the magnetic adhesive liquid used to cure and form the magnetic adhesive layer 40 is in the range of 3 to 5.

[0113] By controlling the thixotropic ratio of the magnetic adhesive within this range, the slope of the gradient cross-sectional structure of the magnetic adhesive layer 40 formed after curing can be controlled, thereby minimizing the weight of the magnetic adhesive layer 40 while ensuring that the magnetic induction intensity enhancement effect of the magnetic adhesive layer 40 meets the requirements.

[0114] The thixotropic ratio (H / W) refers to the ratio of the initial height (H) of the extruded adhesive stacked into a cylindrical or elongated shape to the lateral spreading width (W) of the extruded adhesive after standing for 180 seconds. The test conditions for the above thixotropic ratio range are a temperature of 25°C and a humidity of 50%.

[0115] Further, please refer to Figure 8 As shown, the magnetic adhesive layer 40 is disposed in the accommodating cavity 21 and fixed to the substrate 10. Two magnetic adhesive layers 40 are disposed in the accommodating cavity 21 at intervals along a plane perpendicular to the first direction C1.

[0116] It should be noted that the magnetic adhesive layer 40 not only increases the driving force between the coil 20 and the magnet 30, but also increases the magnetic attraction between the coil 20 and the frame containing the magnet 30. This leads to an increase in friction when the two move relative to each other. The increase in friction is not conducive to improving the overall driving force of the drive unit. The overall driving force of the drive unit refers to the driving force generated between the coil 20 and the magnet 30 minus the driving resistance (such as friction).

[0117] In this regard, the above embodiment sets two magnetic adhesive layers 40 at intervals. While ensuring the magnetic field enhancement effect, it limits the non-magnetic adhesive layer 40 in the middle area of ​​the accommodating cavity 21, thereby weakening the magnetic attraction between the magnetic adhesive layer 40 and the magnet 30 and avoiding excessive friction caused by excessive clamping force between the frame where the coil 20 and the magnet 30 are located.

[0118] It is worth mentioning that although reducing the volume of the magnetic adhesive layer 40 will also reduce its enhancement effect on the magnetic field of the coil 20 (reduce the effect of increasing the driving force), experiments have verified that by restricting the absence of the magnetic adhesive layer 40 in the middle region of the accommodating cavity 21, compared with the case where the magnetic adhesive layer 40 completely fills the accommodating cavity 21, the decrease in the driving force generated by the driving unit is less than the decrease in the frictional force. In other words, the overall driving force of the driving unit can be improved.

[0119] Furthermore, the two magnetic adhesive layers 40 are spaced apart along the length of the coil 20. The lengthwise spacing makes full use of the shape of the accommodating cavity 21, which can accommodate more magnetic adhesive layers 40 to maximize the magnetic field enhancement effect. In addition, the area of ​​the middle interval region is larger, which can reduce the increase of friction, thereby improving the overall driving force of the driving unit.

[0120] Furthermore, the projected area of ​​the portion of the accommodating cavity 21 located between the two magnetic adhesive layers 40 along the first direction C1 accounts for a proportion of 1 / 4 to 1 / 2 of the total projected area of ​​the accommodating cavity 21.

[0121] This ratio range was verified through electromagnetic simulation, achieving an optimal balance between the gain of the coil-magnet driving force and the controllable clamping force. Specifically, if the ratio is less than 1 / 4, i.e. the spacing area is too small, the adhesive layer will cover too much, and the increased magnetic attraction will lead to increased driving resistance, thus limiting the overall driving force improvement of the driving unit. Conversely, if the ratio is greater than 1 / 2, the spacing area will be too large, the magnetic field will not be enhanced enough, the increase in coil-magnet driving force will be limited, and thus the overall driving force improvement of the driving unit will also be limited.

[0122] Furthermore, in addition to covering the exposed surface of the magnetic adhesive layer 40, the protective layer 70 fills the gap between the two magnetic adhesive layers 40. The fluid properties of the adhesive in the protective layer 70 allow it to completely fill this gap, thus reducing the difficulty of setting up the protective layer 70. Specifically, after the two magnetic adhesive layers 40 have cured, the adhesive of the protective layer 70 is applied to the middle gap and cured.

[0123] Furthermore, please combine Figure 1 ,as well as Figures 3 to 8 As shown, the magnetic adhesive layer 40 is disposed in the accommodating cavity 21 and fixed to the substrate 10. The magnetic adhesive layer 40 is disposed centered or eccentrically in the accommodating cavity 21 along a plane perpendicular to the first direction C1.

[0124] The centered setting ensures that the magnetic lines of force pass through the coil 20 evenly, enhancing the symmetry and stability of the driving force; while the eccentric configuration (e.g., set in a dotted pattern within the accommodating cavity 21) can adjust the point of application of the magnetic attraction / repulsion force by offsetting the position of the magnetic adhesive layer 40, thereby precisely controlling the distribution of the clamping force between the frame containing the coil 20 and the magnet 30.

[0125] In some embodiments, the thickness of the magnetic adhesive layer 40 along the first direction C1 accounts for 50% to 100% of the thickness of the coil 20, so as to make full use of the idle space inside the coil 20 to achieve a balance between efficient magnetic field enhancement and volume control.

[0126] The thickness of the magnetic adhesive layer 40 is ≥50%, which ensures that the magnetic adhesive layer 40 has sufficient volume to fill the internal space of the coil 20, guaranteeing the effect of improving the permeability or magnetic field superposition strength, thereby achieving the minimum effective threshold for enhancing the driving force; while the thickness is ≤100%, which can avoid the risk of interference with the magnet 30 due to the excessive protrusion of the magnetic adhesive layer 40.

[0127] Furthermore, in some embodiments, the thickness of the magnetic adhesive layer 40 at different locations can be the same or different. Under the same conditions, it can increase the magnetic field enhancement effect and the uniformity of the clamping force between the coil 20 and the frame containing the magnet 30. Adjusting the thickness of the magnetic adhesive layer 40 at different locations as needed can adjust the point of application of the magnetic attraction / repulsion force, thereby precisely controlling the distribution of the clamping force between the coil 20 and the frame containing the magnet 30.

[0128] In some embodiments, within the range of movement of the magnet 30 relative to the coil 20, the projection of the magnetic adhesive layer 40 along the first direction C1 is always completely within the magnet 30, so as to ensure that the magnetic reinforcement effect of the magnetic adhesive layer 40 on the magnetic field covers the entire movement stroke of the magnet 30, while avoiding the situation where the clamping force distribution between the coil 20 and the frame containing the magnet 30 is greatly offset due to the magnetic adhesive layer 40 exceeding the range of the magnet 30, which could lead to the frame overturning.

[0129] Preferably, in the initial state, the projection of the coil 20 along the first direction C1 is completely within the range of the magnet 30, that is, the projection of the magnetic adhesive layer 40 along the first direction C1 is also completely within the range of the magnet 30.

[0130] Please combine Figure 1 , Figure 5 as well as Figure 8 As shown, in some embodiments, the magnetic adhesive layer 40 is symmetrically arranged with the center line of the coil 20 as the center. The center line of the coil 20 is parallel to the second direction C2 and divides the coil 20 evenly along the third direction C3. The symmetrical arrangement can eliminate the driving force offset and solve the problem of motion jitter or jamming caused by uneven distribution of magnetic driving force.

[0131] Please combine Figure 1 , Figure 3 , Figure 4 as well as Figure 7 As shown, in some embodiments, the drive unit further includes a position sensor 50, which is fixed to the substrate 10 along the first direction C1 near the magnet 30 and is used to detect the movement of the magnet 30 relative to itself; the position sensor 50 is located inside or outside the annular coil 20.

[0132] The position sensor 50 can be arranged inside or outside the coil 20 to meet the needs of different scenarios. Specifically, when the position sensor 50 is arranged inside the coil 20, the unused space in the center of the coil 20 can be utilized to reduce the area of ​​the substrate 10 and achieve miniaturization.

[0133] Furthermore, since the position sensor 50 outputs a displacement signal by detecting changes in the magnetic field of the magnet 30, it is necessary to ensure that the background magnetic field is stable. Therefore, when the position sensor 50 is arranged outside the coil 20, the influence of the magnetic field of the coil 20 can be reduced, the interference of the coil 20 with the position sensor 50 signal can be reduced, thereby improving the sensing accuracy of the position sensor 50.

[0134] Further, please refer to Figure 1 As shown, the driving unit also includes a capacitor 60 fixed on the side of the substrate 10 along the first direction C1 near the magnet 30. The capacitor 60 and the position sensor 50 are both located outside the coil 20.

[0135] By placing both the capacitor 60 and the position sensor 50 on the outside of the coil 20, it is possible to prevent them from intruding into the interior of the coil 20, thereby increasing the space for the magnetic adhesive layer 40 to be placed inside the coil 20, allowing the magnetic adhesive layer 40 to maintain a relatively large volume.

[0136] Further, please refer to Figure 7 As shown, the position sensor 50 is located inside the coil 20 and spaced apart from the magnetic adhesive layer 40.

[0137] This configuration ensures the detection accuracy of the position sensor 50 while reducing the volume of the substrate 10, balancing improved driving force and stable detection function within a limited space. Specifically, the spacing ensures that the position sensor 50 does not contact the magnetic adhesive layer 40, thus avoiding displacement signal distortion caused by the magnetic conduction / magnetization effect of the magnetic adhesive layer 40. At the same time, the position sensor 50 is arranged inside the coil 20, which utilizes the unused space inside the coil 20, reducing the area of ​​the substrate 10 and achieving miniaturization.

[0138] Furthermore, the magnetic adhesive layer 40 is arranged at intervals with both the position sensor 50 and the coil 20 to prevent the magnetic adhesive layer 40 from interfering with the normal operation of the position sensor 50 and the coil 20.

[0139] Furthermore, please combine Figure 3 as well as Figure 4 As shown, in some embodiments, the position sensor 50 is located inside the coil 20, and the surface of the position sensor near the magnet 30 is at least partially not covered by the magnetic adhesive layer 40, or the magnetic adhesive layer 40 completely covers the position sensor.

[0140] Both encapsulation modes utilize the space inside the coil 20 to accommodate the position sensor 50, thus eliminating the need to occupy additional space on the substrate 10 and facilitating the miniaturization of the drive unit.

[0141] Where, at least part of the surface of the position sensor near the magnet 30 is not covered by the magnetic adhesive layer 40 ( Figure 3 The magnetic adhesive layer 40 retains an open window at the top of the position sensor 50, ensuring that the magnetic field of the magnet 30 can penetrate into the sensing area of ​​the position sensor 50 without obstruction, reducing the impact of the magnetic adhesive layer 40 on the position detection function, thereby maximizing the use of the lateral space inside the coil 20 and avoiding the magnetic adhesive layer 40 from blocking the magnetic field propagation path.

[0142] When the magnetic adhesive layer 40 completely covers the position sensor 50 ( Figure 4 The magnetic adhesive layer 40 is maximized in volume, which can effectively enhance the magnetic induction intensity at the location of the coil 20.

[0143] In some embodiments of this application, the magnetic adhesive layer 40 mainly functions to enhance the driving force between the coil 20 and the magnet 30, and its auxiliary function is to adjust the clamping force between the frame containing the coil 20 and the magnet 30. Therefore, the driving unit also includes a magnetic attraction part that is spaced apart from the magnet 30. The magnetic attraction part and the coil 20 are disposed in the same frame, and the magnetic attraction part and the magnet 30 are magnetically attracted to each other, so that the frame containing the magnet 30 is supported on the frame containing the coil 20.

[0144] In one specific embodiment, the magnetic attraction part is disposed on the side of the substrate 10 away from the coil 20 along the first direction C1, so that the frame where the magnet 30 is located is supported on the frame where the coil 20 is located along the first direction C1, thereby maintaining the distance between the magnet 30 and the coil 20 along the first direction C1.

[0145] Please combine Figure 10 as well as Figure 11 As shown, this application also provides a driving device for driving an optical element, including a first frame 100, a second frame 200, a support member, and a driving assembly; wherein, the first frame 100 is used to support the optical element, the support member is disposed between the first frame 100 and the second frame 200 and is used to movably suspend the first frame 100 on the second frame 200; the driving assembly includes the aforementioned driving unit and is configured to drive the first frame 100 to move relative to the second frame 200.

[0146] The optical element driven by the driving device has an optical axis o. When the optical element is implemented as an optical lens 1, the optical axis o of the optical element is the optical axis o of the optical lens 1, which is the coaxial alignment line of the optical axes o of each lens in the optical lens 1. When the optical element is implemented as a photosensitive chip, the optical axis o of the optical element is the optical axis o of the photosensitive chip, which is the axis perpendicular to the geometric center of the effective imaging area of ​​the photosensitive chip.

[0147] Please combine Figure 10 as well as Figure 11 As shown, in some embodiments, the driving assembly includes at least one first driving unit, the first driving unit including at least one first coil 411 and at least one first magnet 412, the first coil 411 and the first magnet 412 are disposed opposite to each other, the first frame 100 is movably suspended in the second frame 200, the first coil 411 is fixed to one of the first frame 100 and the second frame 200, and the first magnet 412 is fixed to the other of the first frame 100 and the second frame 200.

[0148] Please refer to Figure 11As shown, in some embodiments, the first coil 411 is fixed to the second frame 200, and the first magnet 412 is fixed to the first frame 100, forming a moving magnet drive structure. After the first coil 411 is energized, the first coil 411 drives the first frame 100 and the first magnet 412 fixed to the first frame 100 to move relative to the second frame 200.

[0149] In the above embodiments, the first magnet 412 moves relative to the first coil 411 along the optical axis o, and the first driving unit drives the first frame 100 to move relative to the second frame 200 along the optical axis o, thereby achieving optical focusing. It should be understood that in other examples of this application, the first driving unit may also drive the first frame 100 to move relative to the second frame 200 in a direction perpendicular to the optical axis o, thereby achieving optical image stabilization.

[0150] In addition, in other examples of this application, the first magnet 412 may also be fixed to the second frame 200, while the first coil 411 may be fixed to the first frame 100, thereby forming a moving coil drive architecture.

[0151] Furthermore, the driving device also includes a conductive component for providing current to the driving component. The conductive component includes a first circuit section 510 for providing current to the first coil 411. The first circuit section 510 is disposed on the side of the first coil 411 away from the first magnet 412 and is fixed to and electrically connected to the first coil 411.

[0152] The first circuit section 510 and the first coil 411 are fixed to the same frame. In the aforementioned embodiment, the first circuit section 510 is fixed to the second frame 200, and the first coil 411 is fixed to the first circuit section 510, thereby the first coil 411 is indirectly fixed to the second frame 200 through the first circuit section 510. It should be understood that in other embodiments of this application, when the first coil 411 is fixed to the first frame 100, the first circuit section 510 is also fixed to the first frame 100, in which case the first coil 411 is indirectly fixed to the first frame 100 through the first circuit section 510.

[0153] It is worth mentioning that, in this application, the first circuit section 510 can be implemented as follows: Figure 1 The circuit board shown in the middle substrate 10; the first circuit section 510 can also be implemented as other conductive components, such as conductive metal inserts. The metal insert is embedded in the second frame 200 by an insert injection molding process to give the second frame 200 electrical function, and the first coil 411 is fixed to the second frame 200 and electrically connected to the metal insert.

[0154] Furthermore, the first driving unit also includes a first position detection component. The first position detection component includes at least one first position sensor 610 for acquiring position change information of the first frame 100 relative to the second frame 200. The first position sensor 610 is fixed and electrically connected to the first circuit section 510. The first position sensor 610 is opposite to the first magnet 412 and acquires the magnetic field information of the first magnet 412. By acquiring changes in the magnetic field information of the first magnet 412, the first position sensor 610 acquires the position change information of the first magnet 412 relative to the first position sensor 610, and thus acquires the position change information of the first frame 100 relative to the second frame 200.

[0155] It is worth mentioning that the first position sensor 610 can be implemented as a Hall effect sensor, a TMR sensor, or a driver chip with integrated position sensing function. In some cases, the position detection component also includes at least one first capacitor 620, which is disposed adjacent to the first position sensor 610. The first capacitor 620 is fixed and electrically connected to the first circuit section 510 to assist in position sensing.

[0156] Furthermore, the drive device also includes a first holding assembly for movably suspending the first frame 100 on the second frame 200. In one embodiment, the first holding assembly includes a first support portion 711 and a first magnetic attraction portion 712, wherein the first support portion 711 is disposed between the first frame 100 and the second frame 200, and the first frame 100 is supported on the second frame 200 by the first support portion 711, and the first magnetic attraction portion 712 and the first coil 411 are fixed to the same frame (see reference). Figure 11 In the embodiment shown, the first magnetic part 712 is fixed to the second frame 200, so that the first magnetic part 712 and the first magnet 412 are magnetically attracted to each other, so that the first frame 100 and the second frame 200 clamp the first support part 711 and the first frame 100 is supported on the second frame 200.

[0157] Please refer to Figure 11 As shown, in some embodiments, the first support 711 is implemented as two guide rods, which restrict the direction of movement of the first frame 100. Specifically, the two guide rods are disposed on both sides of the first magnet 412 and the first coil 411. In other embodiments, the first support 711 may also be implemented as at least three ball bearings, at least three sliders, or a combination of at least two of ball bearings, sliders, and guide rods.

[0158] The first magnetic attraction portion 712 is implemented as a magnetic object suitable for being attracted by a magnet, such as a magnetic yoke. The first magnetic attraction portion 712 is disposed on the side of the first coil 411 away from the first magnet 412. In some embodiments, the first magnetic attraction portion 712 is fixed to the side of the first circuit portion 510 away from the first coil 411.

[0159] Furthermore, in some embodiments, the driving device further includes a third frame 300, to which the second frame 200 is movably suspended, thereby allowing the first frame 100 to move within the third frame 300 under the influence of the second frame 200. The driving assembly also includes at least one second driving unit, each second driving unit including at least one second coil 421 and at least one second magnet 422, with the second coil 421 and the second magnet 422 disposed opposite to each other. The second coil 421 is fixed to one of the second frame 200 and the third frame 300, and the second magnet 422 is fixed to the other of the second frame 200 and the third frame 300.

[0160] Please refer to Figure 11 As shown, in some embodiments, the second magnet 422 is fixed to the second frame 200, and the second coil 421 is fixed to the third frame 300, forming a moving magnet drive structure. After the second coil 421 is energized, the second coil 421 drives the second frame 200 and the second magnet 422 fixed to the second frame 200 to move relative to the third frame 300.

[0161] Specifically, in the above embodiments, the second magnet 422 moves relative to the second coil 421 in a direction perpendicular to the optical axis o, and the second driving unit drives the second frame 200 to move relative to the third frame 300 in a direction perpendicular to the optical axis o, thereby achieving optical image stabilization. It should be understood that in other examples of this application, the second driving unit can also drive the second frame 200 to move relative to the third frame 300 in a direction perpendicular to the optical axis o, thereby achieving optical focusing.

[0162] It should be understood that in other examples of this application, the second magnet 422 may also be fixed to the third frame 300, and the second coil 421 may be fixed to the second frame 200, thereby forming a moving coil drive architecture.

[0163] Please combine Figure 9 as well as Figure 10 As shown, in some embodiments, the driving device can be divided into a first side S1, a second side S2, a third side S3 and a fourth side S4 around the optical lens 1 with the optical axis o as the center; the driving assembly includes two sets of second driving units, which are located on the first side S1 and the second side S2 of the optical lens 1 respectively, and are used to drive the second frame 200 to move relative to the third frame 300 in the direction of the first side S1-the third side S3 and the direction of the second side S2-the fourth side S4.

[0164] Specifically, in the above embodiment, the second driving unit located on the first side S1 includes a second coil 421 and a second magnet 422, and the second driving unit located on the second side S2 includes two second coils 421 and two second magnets 422, and the two second coils 421 are spaced apart along a direction parallel to the first side S1 to the third side S3.

[0165] Furthermore, the drive assembly includes a set of first drive units located on the fourth side S4 of the optical lens 1.

[0166] In addition, in some other embodiments, the third frame 300 is movably suspended from the second frame 200, and the first frame 100 is movably suspended from the third frame 300, so that the first frame 100 can move in the second frame 200 under the drive of the third frame 300.

[0167] Furthermore, the conductive component includes a second circuit section 520 for providing current to the second coil 421. The second circuit section 520 is disposed on the side of the second coil 421 away from the second magnet 422 and is fixed and electrically connected to the second coil 421.

[0168] The second circuit section 520 and the second coil 421 are fixed to the same frame. Figure 11 In the illustrated embodiment, the second circuit section 520 is fixed to the third frame 300, and the second coil 421 is fixed to the second circuit section 520, thereby the second coil 421 is indirectly fixed to the third frame 300 through the second circuit section 520. It should be understood that in some other embodiments, when the second coil 421 is fixed to the second frame 200, the second circuit section 520 is also fixed to the second frame 200; in this case, the second coil 421 is indirectly fixed to the second frame 200 through the second circuit section 520.

[0169] It is worth mentioning that, in this application, the second circuit section 520 can be implemented as follows: Figure 1 The circuit board shown in the middle substrate 10; the second circuit section 520 can also be implemented as other conductive components, such as conductive metal inserts. The metal insert is embedded in the third frame 300 by an insert injection molding process so that the third frame 300 has electrical functions, and the second coil 421 is fixed to the third frame 300 and electrically connected to the metal insert.

[0170] Furthermore, the conductive component also includes a circuit outlet section electrically connected to the first circuit section 510 and the second circuit section 520. The circuit outlet section serves as a circuit outlet component of the driving component and is used to electrically connect the first circuit section 510, the second circuit section 520, and the photosensitive module 2. In some cases, the circuit outlet section can also be used for the electrical connection of the first circuit section 510 and the second circuit section 520.

[0171] In this application, the circuit output section includes a circuit connector 531 and a circuit output component 532. One end of the circuit connector 531 is electrically connected to the first circuit section 510, and the other end is fixed to the third frame 300 and electrically connected to the circuit output component 532. The circuit output component 532 is embedded in the third frame 300 and has a partially exposed soldering area (visible from the side and bottom). Through the soldering area of ​​the circuit output component 532, the circuit connector 531 and the second circuit section 520 are electrically connected to the circuit output component 532 (e.g., by laser welding, soldering, conductive adhesive, etc.), so that both the first circuit section 510 and the second circuit section 520 are electrically connected to external components (e.g., the photosensitive module 2) through the circuit output component 532.

[0172] In some other embodiments, the first circuit section 510 may also be directly electrically connected to external components via the circuit connector 531.

[0173] Furthermore, the second driving unit also includes a second position detection component, which includes at least one second position sensor 630 for acquiring position change information of the second frame 200 relative to the third frame 300. The second position sensor 630 is fixed and electrically connected to the second circuit section 520. The second position sensor 630 is opposite to the second magnet 422 and acquires the magnetic field information of the second magnet 422. By acquiring the change in the magnetic field information of the second magnet 422, the second position sensor 630 acquires the position change information of the second magnet 422 relative to the second position sensor 630, and thus acquires the position change information of the second frame 200 relative to the third frame 300.

[0174] It is worth mentioning that the second position sensor 630 can be implemented as a Hall effect sensor, a TMR sensor, or a driver chip with integrated position sensing functionality. In some cases, the position detection component also includes at least one second capacitor 640, which is disposed adjacent to the second position sensor 630. The second capacitor 640 is fixed and electrically connected to the second circuit section 520 to assist in position sensing.

[0175] Please combine Figure 11 as well as Figure 12As shown, in some embodiments, the second position sensor 630 is disposed on the side of the second circuit section 520 away from the second coil 421, and the second position sensor 630 and the second coil 421 are disposed on opposite sides of the second circuit section 520. Correspondingly, the second capacitor 640 is also disposed on the side of the second circuit section 520 away from the second coil 421, and the second capacitor 640 and the second coil 421 are disposed on opposite sides of the second circuit section 520.

[0176] Furthermore, the drive device also includes a second holding assembly for movably suspending the second frame 200 on the third frame 300. In some embodiments, the second holding assembly includes a second support portion 721 and a second magnetic attraction portion 722. The second support portion 721 is disposed between the second frame 200 and the third frame 300, thereby supporting the second frame 200 on the third frame 300 via the second support portion 721. The second magnetic attraction portion 722 and the second coil 421 are fixed to the same frame (in... Figure 11 and Figure 12 In the embodiment shown, the second magnetic part 722 is fixed to the third frame 300, so that the second magnetic part 722 and the second magnet 422 magnetically attract each other, so that the second frame 200 and the third frame 300 clamp the second support part 721, and the second frame 200 is supported on the third frame 300.

[0177] In some embodiments, the second support 721 is implemented as at least three balls, specifically, at least three balls are disposed at three corners between the second frame 200 and the third frame 300. In other embodiments, the second support 721 may also be implemented as at least two guide rods, at least three sliders, or a combination of at least two of balls, sliders, and guide rods.

[0178] The second magnetic attraction part 722 is implemented as a magnetic object suitable for being attracted by a magnet, such as a magnetic yoke. The second magnetic attraction part 722 is disposed on the side of the second coil 421 away from the second magnet 422. In some embodiments, the second magnetic attraction part 722 is fixed to the side of the second circuit part 520 away from the second coil 421.

[0179] Furthermore, the drive unit also includes a top cover 800, which is adapted to engage with the third frame 300 to form a receiving space for accommodating and protecting other components.

[0180] In some embodiments, at least one first driving unit or a second driving unit includes the aforementioned magnetic adhesive layer 40. The driving unit can be used to drive one of the first frame 100 and the second frame 200 to move relative to the other along the optical axis, drive one of the first frame 100 and the second frame 200 to move relative to the other along a direction perpendicular to the optical axis, drive one of the second frame 200 and the third frame 300 to move relative to the other along the optical axis, and / or drive one of the second frame 200 and the third frame 300 to move relative to the other along a direction perpendicular to the optical axis.

[0181] In other words, the aforementioned driving unit can be applied to the focusing drive section, the image stabilization drive section, or both of the driving device. Taking at least one first driving unit including a magnetic adhesive layer 40 as an example, the first circuit section 510 is a substrate 10, the first coil 411 fixed to the first circuit section 510 is a coil 20, the first magnet 412 corresponding to the first coil 411 is a magnet 30, the magnetic adhesive layer 40 is fixed to the first circuit section 510 and / or the first coil 411, and the projection of the magnetic adhesive layer 40 along the relative arrangement direction of the first coil 411 and the first magnet 412 is completely located within the outer contour range of the first coil 411, so as to enhance the driving force between the first coil 411 and the first magnet 412.

[0182] In addition, the drive unit can be such as Figure 10 The vertical lens driving device shown may also be other types of driving devices not illustrated, such as chip driving devices, periscope driving devices, gimbal driving devices, etc., which will not be listed here.

[0183] Please refer to Figure 9 As shown, this application also provides a camera module, including an optical lens 1, a photosensitive module 2, and the aforementioned driving device; the optical lens 1 is disposed in one of the first frame 100 or the second frame 200, and is used to receive and emit light along its own optical axis; the photosensitive module 2 is disposed in the other of the first frame 100 or the second frame 200, and is used to receive the light emitted from the optical lens 1 for imaging. That is, the driving device is used to drive one of the optical lens 1 or the photosensitive module 2 to move relative to the other, so as to achieve focusing and / or image stabilization.

[0184] The optical lens 1 can be a part of an optical system consisting of only one or a few lenses, or it can be a complete optical system. The photosensitive module 2 includes a photosensitive chip. Specifically, the photosensitive module 2 includes a chip circuit board and a photosensitive chip electrically connected to the chip circuit board.

[0185] In some embodiments, the photosensitive module 2 further includes a filter and a filter holder, wherein the filter element is disposed between the photosensitive chip and the optical lens 1 and is used to filter out unwanted wavelengths of light (e.g., infrared light) from the light entering the photosensitive chip, the filter is supported on the filter holder, and the filter holder is fixed to the chip circuit board.

[0186] This application also provides a method for fabricating a driving unit, including the following steps:

[0187] S100. Fix the coil to the substrate to form an accommodating cavity between the inner wall of the coil and the substrate;

[0188] S200. Apply magnetic adhesive to the cavity and cure it to form a magnetic adhesive layer;

[0189] S300. The substrate and the magnet are spaced apart on two frames along a first direction.

[0190] In this application, by first fixing the coil to the substrate and then applying magnetic adhesive to the accommodating cavity, the inner wall of the coil and the substrate can form a limiting space to restrict the flow range of the magnetic adhesive after it is applied. This ensures that the magnetic adhesive can be confined inside the coil without the need for an additional mold.

[0191] Furthermore, in step S100, by applying adhesive to the substrate, placing the coil at the adhesive position on the substrate, and curing the adhesive, the coil and the substrate are fixed together. The adhesive fixation ensures that there are no gaps between the coil and the substrate, so as to avoid leakage through gaps after the magnetic adhesive is applied later. Of course, other commonly used fixing methods can also be used to fix the two together, as long as there are no gaps between the coil and the substrate. This application will not give examples of each method here.

[0192] In some embodiments, the step prior to step S100 is: electrically connecting the position sensor and the capacitor on the substrate via an SMT process.

[0193] In some embodiments, after step S100, the method further includes step S400: soldering the terminals of the coil to the coil pads on the substrate. That is, step S400 can be performed after step S100 or after step S200, as long as the coil is fixed first.

[0194] In some embodiments, the curing method in step S200 is thermal curing, which offers high reliability. Of course, in other embodiments, the magnetic adhesive can also be cured by other curing methods such as light curing and moisture curing; these will not be listed here.

[0195] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0196] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A driving unit for driving optical elements, characterized in that, The device includes a substrate, a coil, a magnet, and a magnetic adhesive layer. The coil is fixed to the substrate, and the coil and the magnet are spaced apart along a first direction. When the coil is energized, it can drive the magnet to move relative to the coil. The magnetic adhesive layer is fixed to the coil and / or the substrate, and the projection of the magnetic adhesive layer along the first direction is completely within the projection range of the coil, so as to enhance the driving force between the coil and the magnet. The magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers distributed within the adhesive layer matrix, wherein the magnetic fillers include soft magnetic powder and / or permanent magnetic powder.

2. The driving unit according to claim 1, characterized in that, The magnetic filler is uniformly distributed inside the adhesive matrix, and the magnetic filler accounts for 1wt% to 30wt% of the magnetic adhesive layer.

3. The driving unit according to claim 1, characterized in that, The adhesive matrix is ​​an insulating material.

4. The driving unit according to claim 1, characterized in that, The adhesive matrix is ​​black.

5. The driving unit according to claim 1, characterized in that, The drive unit also includes a protective layer, which is fixed to the magnetic adhesive layer and covers the exposed surface of the magnetic adhesive layer.

6. The driving unit according to claim 5, characterized in that, The protective layer is black.

7. The driving unit according to claim 5, characterized in that, The distance between the protective layer and the magnet along the first direction is greater than or equal to the distance between the coil and the magnet along the first direction.

8. The driving unit according to claim 1, characterized in that, The distance between the magnetic adhesive layer and the magnet along the first direction is greater than or equal to the distance between the coil and the magnet along the first direction.

9. The driving unit according to claim 1, characterized in that, The coil is annular to form a cavity between the inner wall of the coil and the substrate; the magnetic adhesive layer is disposed in the cavity and / or in the gaps between the wires in the coil.

10. The driving unit according to claim 9, characterized in that, The magnetic adhesive layer is fixed to the substrate and is in contact with the inner wall of the coil.

11. The driving unit according to claim 10, characterized in that, The projection of the magnetic adhesive layer along the first direction completely covers the accommodating cavity.

12. The driving unit according to claim 9, characterized in that, The magnetic adhesive layer is fixed to the substrate, and the magnetic adhesive layer is spaced apart from the inner wall of the coil.

13. The driving unit according to claim 12, characterized in that, The cross-sectional area of ​​the magnetic adhesive layer perpendicular to the first direction gradually decreases towards the magnet along the first direction.

14. The driving unit according to claim 13, characterized in that, The thixotropic ratio of the magnetic adhesive liquid used to cure and form the magnetic adhesive layer is in the range of 3 to 5.

15. The driving unit according to claim 9, characterized in that, The magnetic adhesive layer is fixed to the substrate, and two magnetic adhesive layers are disposed in the accommodating cavity, which are spaced apart along a plane perpendicular to the first direction.

16. The driving unit according to claim 15, characterized in that, The two magnetic adhesive layers are spaced apart along the length of the coil.

17. The driving unit according to claim 15, characterized in that, The portion of the accommodating cavity located between the two magnetic adhesive layers, along the first direction, accounts for a proportion of 1 / 4 to 1 / 2 of the total projected area of ​​the accommodating cavity.

18. The driving unit according to claim 9, characterized in that, The magnetic adhesive layer is fixed to the substrate, and the magnetic adhesive layer is centrally or eccentrically disposed in the accommodating cavity along a plane perpendicular to the first direction.

19. The driving unit according to claim 1, characterized in that, The thickness of the magnetic adhesive layer along the first direction accounts for 50% to 100% of the thickness of the coil.

20. The driving unit according to claim 1, characterized in that, Within the range of movement of the magnet relative to the coil, the projection of the magnetic adhesive layer along the first direction is always completely located within the magnet.

21. The driving unit according to claim 1, characterized in that, The magnetic adhesive layer is symmetrically arranged with the center line of the coil as the center. The center line is parallel to the second direction and divides the coil equally along the third direction. Both the second direction and the third direction are perpendicular to the first direction and are perpendicular to each other.

22. The driving unit according to claim 1, characterized in that, The drive unit further includes a position sensor, which is fixed to the substrate along the first direction near the magnet and is used to detect the movement of the magnet relative to itself; the position sensor is located inside or outside the annular coil.

23. The driving unit according to claim 22, characterized in that, The driving unit also includes a capacitor fixed to the side of the substrate close to the magnet along the first direction, and the capacitor and the position sensor are both located outside the coil.

24. The driving unit according to claim 22, characterized in that, The position sensor is located inside the coil and spaced apart from the magnetic adhesive layer.

25. The driving unit according to claim 22, characterized in that, The position sensor is located inside the coil, and the surface of the position sensor near the magnet is either not covered by the magnetic adhesive layer or the magnetic adhesive layer completely covers the position sensor.

26. A driving device for driving optical elements, characterized in that, Includes a first frame, a second frame, supporting components, and driving components; The first frame is used to support the optical element, and the support member is disposed between the first frame and the second frame and is used to movably suspend the first frame in the second frame. The driving component includes the driving unit as described in any one of claims 1 to 25, and is configured to drive the first frame to move relative to the second frame.

27. A camera module, characterized in that, Includes an optical lens, a photosensitive module, and a driving device as described in claim 26; The optical lens is disposed in one of the first frame or the second frame and is used to receive and emit light along its own optical axis. The photosensitive module is disposed in the first frame or the other of the second frame, and is used to receive the light emitted from the optical lens for imaging.

28. A method for fabricating a driving unit, characterized in that, Including the following steps: a. Fix the coil to the substrate to form an accommodating cavity between the inner wall of the coil and the substrate; b. Applying a magnetic adhesive to the accommodating cavity and curing it to form a magnetic adhesive layer, wherein the magnetic adhesive includes an adhesive and magnetic fillers dispersed in the adhesive, and the magnetic fillers include soft magnetic powder and / or permanent magnet powder; c. The substrate and the magnet are spaced apart on two frames along a first direction.

29. The method for preparing the driving unit according to claim 28, characterized in that, Between step b and step c, there is also a step: d. Apply adhesive to the magnetic adhesive layer and cure it to form a protective layer that completely covers the exposed surface of the magnetic adhesive layer.

Citation Information

Patent Citations

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    CN120871455A

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