Driving device, camera module and driving device preparation method

Abstract

The application relates to a driving device, a camera module and a preparation method of the driving device. The driving device is used for driving an optical element and comprises a first frame, a second frame, a first supporting part and a first driving unit. The first supporting part is used for movably suspending the first frame on the second frame. The first driving unit comprises a first circuit part, a first coil, a first magnet and a first magnetic adhesive layer. The first magnet is fixed on one of the first frame and the second frame, the first circuit part is fixed on the other one, the first coil and the first magnetic adhesive layer are both fixed on the first circuit part, and both are arranged in a first direction and spaced from the first magnet. The first magnetic adhesive layer is used for magnetically attracting the first magnet, and the first coil can drive the first magnet to move relative to the first coil after being electrified. The first supporting part is clamped by the magnetic attraction force between the first magnetic adhesive layer and the first magnet, the magnetic yoke in the traditional structure is cancelled, and the thickness of the driving device in the first direction is reduced.

Description

Technical Field

[0001] This invention relates to the technical field of camera modules, and in particular to a driving device, a camera module, and a method for manufacturing the driving device. Background Technology

[0002] Camera modules have become standard in electronic devices such as smartphones, tablets, and wearable devices. To ensure image quality, camera modules need to integrate functions such as optical autofocus (AF), optical image stabilization (OIS), or optical zoom. The realization of any of these functions relies on a motor driving the lens assembly or image sensor to make micro-displacement or rotation in at least one direction.

[0003] The current mainstream solution is the voice coil motor (VCM), which utilizes the Lorentz force between an energized coil and a magnet to generate driving force. In traditional voice coil motor structures, a magnetic yoke is often placed on the circuit board opposite the coil side to attract the magnet, thereby clamping the support components and achieving stable frame support. However, the presence of the magnetic yoke increases the thickness and overall size of the motor, especially in thinner and lighter electronic devices. This limits design freedom, increases manufacturing costs, and hinders miniaturization. Therefore, how to overcome the bottleneck of the motor and further simplify its structure and reduce its size has become a core technical problem that urgently needs to be solved. Summary of the Invention

[0004] Therefore, it is necessary to address the problem that current motors must have a magnetic yoke for magnetic attraction with magnets, which limits the thickness and overall size of the motor. A method for manufacturing a drive device, camera module, and drive device that can further simplify the structure and reduce the size while ensuring stable frame support is needed.

[0005] This application first provides a driving device for driving an optical element, including a first frame, a second frame, a first support portion and a first driving unit, wherein one of the first frame and the second frame is used to carry the optical element, and the first support portion is disposed between the first frame and the second frame and is used to movably suspend the first frame on the second frame.

[0006] The first driving unit includes a first circuit section, a first coil, a first magnet, and a first magnetic adhesive layer. The first magnet is fixed to one of the first frame and the second frame, and the first circuit section is fixed to the other. The first coil and the first magnetic adhesive layer are both fixed to the first circuit section, and both are spaced apart from the first magnet along a first direction. The first magnetic adhesive layer is used to magnetically attract the first magnet so that the first frame and the second frame clamp the first support section along the first direction. When the first coil is energized, it can drive the first magnet to move relative to the first coil.

[0007] In one embodiment, the first coil is annular, and the first magnetic adhesive layer includes a first outer magnetic adhesive layer located outside the annular outer wall of the first coil.

[0008] In one embodiment, the dimension of the first outer magnetic adhesive layer along the second direction is greater than the dimension of the first magnet along the second direction, and the second direction is perpendicular to the first direction.

[0009] In one embodiment, the first magnet is movable relative to the first coil along the second direction, and the dimension of the first outer magnetic adhesive layer along the second direction is greater than the sum of the dimension of the first magnet along the second direction and its movement distance along the second direction.

[0010] In one embodiment, the dimension of the first outer magnetic adhesive layer along a third direction is greater than the dimension of the first magnet along the third direction, which is perpendicular to the first direction and the second direction.

[0011] In one embodiment, the first outer magnetic adhesive layer is in contact with the outer wall of the first coil.

[0012] In one embodiment, the first outer magnetic adhesive layer does not contact the outer wall of the first coil.

[0013] In one embodiment, the first circuit section is provided with a coil pad, the lead of the first coil is soldered to the coil pad, and the first outer magnetic adhesive layer covers at least a portion of the coil pad.

[0014] In one embodiment, the first outer magnetic adhesive layer is symmetrically arranged with respect to the centerline of the first magnet. The centerline of the first magnet is parallel to the second direction and divides the first magnet into three equal parts along the third direction. The second direction and the third direction are both perpendicular to the first direction and are perpendicular to each other.

[0015] In one embodiment, the centroid of the first outer magnetic adhesive layer is offset from the projection of the centroid of the first magnet onto the same plane along the first direction.

[0016] In one embodiment, two first support portions are provided between the first frame and the second frame, located on both sides of the first magnet along a third direction. One of the first support portions is used for guidance and support, and the side of the first support portion along the third direction is the guiding side. The other first support portion is only used for support, and the side of the first support portion along the third direction is the supporting side.

[0017] The projection of the centroid of the first outer magnetic adhesive layer onto the same plane as the centroid of the first magnet along the first direction is biased toward the guide side, and the third direction is perpendicular to the first direction.

[0018] In one embodiment, the portion of the first outer magnetic adhesive layer biased toward the support side has a material reduction hole.

[0019] In one embodiment, the thickness of the portion of the first outer magnetic adhesive layer biased toward the guide side is greater than the thickness of the portion biased toward the support side.

[0020] In one embodiment, the portion of the first circuit section biased toward the support side is provided with a protrusion and / or the portion biased toward the guide side is provided with a recess.

[0021] In one embodiment, the first magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers distributed within the adhesive layer matrix, wherein the density of the magnetic fillers in the portion of the first magnetic adhesive layer biased towards the guide side is greater than that in the portion biased towards the support side.

[0022] In one embodiment, the distance between the first magnetic adhesive layer and the first magnet along the first direction is greater than or equal to the distance between the first coil and the first magnet along the first direction.

[0023] In one embodiment, the first coil is annular to form a receiving cavity between the inner wall of the first coil and the first circuit portion; the first magnetic adhesive layer includes a first outer magnetic adhesive layer and a first inner magnetic adhesive layer, the first outer magnetic adhesive layer is located outside the annular outer wall of the first coil, and the first inner magnetic adhesive layer is disposed in the receiving cavity and / or in the gaps between the wires in the first coil.

[0024] In one embodiment, the thickness of the first inner magnetic adhesive layer along the first direction is greater than that of the first outer magnetic adhesive layer.

[0025] In one embodiment, the first magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers uniformly distributed within the adhesive layer matrix, wherein the magnetic fillers include soft magnetic powder and / or permanent magnetic powder.

[0026] In one embodiment, the adhesive matrix is ​​black.

[0027] In one embodiment, the drive device further includes a protective layer fixed to the first magnetic adhesive layer and covering the exposed surface of the first magnetic adhesive layer.

[0028] This application also provides a camera module, including an optical lens, a photosensitive module, and the aforementioned driving device;

[0029] The optical lens is disposed in one of the first frame or the second frame and is used to receive and emit light along its own optical axis.

[0030] The photosensitive module is disposed in the other of the first frame or the second frame, and is used to receive the light emitted from the optical lens for imaging.

[0031] This application also provides a method for manufacturing a drive device, including the following steps:

[0032] a. Fix the first coil to the first circuit section;

[0033] b. Apply magnetic adhesive to the first circuit section and cure it to form a first magnetic adhesive layer;

[0034] c. Fix the first circuit part to the second frame, and fix the first magnet to the first frame;

[0035] d. The first frame is suspended from the second frame by a support member, such that the first magnet and the first coil are spaced apart along the first direction, and the first magnetic adhesive layer and the first magnet are magnetically attracted along the first direction.

[0036] The aforementioned driving device, by setting a magnetic adhesive layer on the side of the substrate close to the magnet, utilizes the magnetic attraction between the magnetic adhesive layer and the magnet to clamp the support member along the first direction, thereby stably suspending the movable part. This eliminates the need for the magnetic yoke located on the side of the substrate away from the coil in the traditional structure, and reduces the thickness of the driving device along the first direction. Attached Figure Description

[0037] Figure 1A This is a cross-sectional view of the first embodiment of the driving device of this application;

[0038] Figure 1B This is a perspective view of the first driving unit in the first embodiment of the driving device of this application;

[0039] Figure 2 for Figure 1B A schematic diagram showing the hidden magnet;

[0040] Figure 3 This is a schematic diagram of the first driving unit after the magnet is hidden in the second embodiment of the driving device of this application;

[0041] Figure 4 This is a cross-sectional view of the position of the protrusion of the first driving unit in the third embodiment of the driving device of this application;

[0042] Figure 5 This is a cross-sectional view of the recessed portion of the first drive unit in the fourth embodiment of the drive device of this application.

[0043] Figure 6 This is a cross-sectional view of the first driving unit in the fifth embodiment of the driving device of this application;

[0044] Figure 7 This is a perspective view of the camera module of this application;

[0045] Figure 8 This is a perspective view of the drive device of this application;

[0046] Figure 9 for Figure 8 An exploded view showing the optical lens hidden behind the lens.

[0047] Figure 10 for Figure 9 A three-dimensional view of the third frame structure from a low angle, after the third frame is hidden.

[0048] Reference numerals: 1. Optical lens; 2. Photosensitive module; 510. First circuit section; 11. Protrusion; 12. Recess; 13. Coil pad; 411. First coil; 21. Receiving cavity; 412. First magnet; 40. First magnetic adhesive layer; 41. First outer magnetic adhesive layer; 41a. Material reduction hole; 42. First inner magnetic adhesive layer; 610. First position sensor; 620. First capacitor; 70. Protective layer; 100. First frame; 200. Second frame; 300. Third frame; 421. Second coil; 422. Second magnet; 520. Second circuit section; 531. Circuit connector; 532. Circuit lead-out component; 630. Second position sensor; 640. Second capacitor; 711. First support section; 721. Second support section; 800. Top cover. Detailed Implementation

[0049] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0050] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0052] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0053] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" of the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0054] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0055] For ease of description, in this application, the relative orientation of the first coil 411 and the first magnet 412 is defined as the first direction C1, and two directions perpendicular to the first direction C1 and mutually perpendicular are defined as the second direction C2 and the third direction C3, respectively. The second direction C2 and the third direction C3 are both parallel to the winding plane of the first coil 411.

[0056] Please combine Figure 1A , Figure 1B as well as Figure 2 As shown, this application first provides a driving device for driving optical elements, including a first frame 100, a second frame 200, a first support 711 and a first driving unit, wherein the first frame 100 is used to support the optical elements, and the first support 711 is disposed between the first frame 100 and the second frame 200 and is used to movably suspend the first frame 100 in the second frame 200.

[0057] The first driving unit includes a first circuit section 510, a first coil 411, a first magnet 412, and a first magnetic adhesive layer 40. The first magnet 412 is fixed to one of the first frame 100 and the second frame 200, and the first circuit section 510 is fixed to the other. The first coil 411 and the first magnetic adhesive layer 40 are both fixed to the first circuit section 510, and both are spaced apart from the first magnet 412 along a first direction. The first magnetic adhesive layer 40 is used to magnetically attract the first magnet 412 so that the first frame 100 and the second frame 200 clamp the first support section 711 along the first direction. When the first coil 411 is energized, it can drive the first magnet 412 to move relative to the first coil 411.

[0058] Optical components include, but are not limited to, optical lenses, optical lens assemblies, or photosensitive chips.

[0059] In one example of this application, after the first coil 411 is energized, it can drive the first frame 100 to move relative to the second frame 200 along a direction perpendicular to the first direction C1 (e.g., along the second direction C2 or along the third direction C3, etc.) via the first magnet 412. In another example of this application, after the first coil 411 is energized, it can drive the first frame 100 to move relative to the second frame 200 along the first direction C1 via the first magnet 412.

[0060] In this application, neither the first circuit section 510 nor the frame on which the first circuit section 510 is located is provided with a magnetic yoke. By providing the first magnetic adhesive layer 40 on the side of the first circuit section 510 close to the first magnet 412 (on the same side as the first coil 411), the magnetic attraction between the first magnetic adhesive layer 40 and the first magnet 412 is used to clamp the first support section 711 along the first direction C1 to stably suspend the movable part. This eliminates the magnetic yoke provided on the side of the first circuit section 510 away from the first coil 411 in the conventional structure and reduces the thickness of the drive device along the first direction C1.

[0061] Specifically, in conventional mechanisms, the thickness of the coil portion of the drive device along the first direction C1 can be considered as the magnetic yoke + substrate + coil. In this application, the thickness of the coil portion along the first direction C1 can be considered as the first circuit portion 510 + the first coil 411 / the first magnetic adhesive layer 40. That is to say, in this application, since the first coil 411 and the first magnetic adhesive layer 40 are located on the same side and can share the same thickness, there is no need to accumulate the thickness of the two. The total thickness of the coil portion is simply the thickness of the thicker of the first coil 411 and the first magnetic adhesive layer 40 added above the thickness of the first circuit portion 510, which effectively reduces the overall thickness of the drive device along the first direction C1.

[0062] It is worth mentioning that, compared to other fixed-shape magnetic yokes or magnetic attractors, the first magnetic adhesive layer 40 is obtained by curing magnetic adhesive liquid. The magnetic adhesive liquid includes adhesive liquid and magnetic filler dispersed in the adhesive liquid. After the magnetic adhesive liquid is applied to the first circuit section 510, the first magnetic adhesive layer 40 is obtained after curing the magnetic adhesive liquid. In other words, the magnetic adhesive liquid before curing has fluidity, so it can adapt to the space around the first coil 411 to make full use of the space on the side of the first circuit section 510 near the first magnet 412.

[0063] Furthermore, the first coil 411 and the first magnet 412 are spaced apart, with an air gap between them to prevent interference between the first magnet 412 and the first coil 411 during operation of the drive device. Additionally, the first magnetic adhesive layer 40 is also spaced apart from the first magnet 412, and an air gap is also present between them.

[0064] In some embodiments, the first coil 411 is fixed to the first circuit section 510 on the side close to the first magnet 412 along the first direction C1, and the first circuit section 510 and the first magnet 412 are also spaced apart along the first direction C1.

[0065] Please combine Figure 1B as well as Figure 2 As shown, in some embodiments, the first coil 411 is made of wire and is annular. The annular first coil 411 has an inner annular wall and an outer annular wall in the radial direction. The first magnetic adhesive layer 40 includes a first outer magnetic adhesive layer 41 located outside the outer annular wall of the first coil 411.

[0066] It is easy to understand that the space outside the first coil 411 is relatively large and the structure is open. Therefore, by setting the first outer magnetic adhesive layer 41 in this place, the overall volume of the first magnetic adhesive layer 40 can be increased by filling this area, thereby improving the magnetic attraction between the first magnetic adhesive layer 40 and the first magnet 412, enhancing the clamping stability of the first frame 100 and the second frame 200 along the first direction C1, and ensuring the reliable suspension of the moving parts by the first support 711.

[0067] Furthermore, the projection of the first outer magnetic adhesive layer 41 along the first direction C1 is completely located within the first circuit section 510, so as to avoid the situation where it protrudes from the first circuit section 510 along the first direction C1 and occupies additional space.

[0068] Please refer to Figure 1B As shown, in some embodiments, the size of the first outer magnetic adhesive layer 41 along the second direction C2 is greater than the size of the first magnet 412 along the second direction C2, and / or the size of the first outer magnetic adhesive layer 41 along the third direction C3 is greater than the size of the first magnet 412 along the third direction C3.

[0069] The larger size of the first outer magnetic adhesive layer 41 can provide a certain installation margin for the first magnet 412. That is, when the first magnet 412 is misaligned during assembly (such as when the first magnet 412 is not perfectly aligned due to tolerance), the larger first magnetic adhesive layer 40 can ensure that the first magnet 412 is still aligned with the first magnetic adhesive layer 40, so as to maintain the uniformity and strength of the magnetic attraction force, avoid fluctuations in the magnetic attraction force due to small installation misalignment, ensure the mechanical stability of the first support part 711 in the clamping state, and improve the reliability of the drive device under complex working conditions.

[0070] Specifically, the size of the first outer magnetic adhesive layer 41 along the second direction C2 is larger than the size of the first magnet 412 along the second direction C2, in order to avoid a large magnetic attraction force component along the second direction C2 due to assembly tolerance; and the size of the first outer magnetic adhesive layer 41 along the third direction C3 is larger than the size of the first magnet 412 along the third direction C3, in order to avoid a large magnetic attraction force component along the third direction C3 due to assembly tolerance.

[0071] Furthermore, in some embodiments, the area of ​​the first magnetic adhesive layer 40 perpendicular to the first direction C1 is uniformly distributed along the second direction C2 and / or along the third direction C3 to further increase the uniformity of the magnetic attraction force.

[0072] Furthermore, in some embodiments, the first magnet 412 is movable relative to the first coil 411 along the second direction C2, and the size of the first outer magnetic adhesive layer 41 along the second direction C2 is greater than the sum of the size of the first magnet 412 along the second direction C2 and its movement distance along the second direction C2.

[0073] This configuration ensures that within the movement range of the first magnet 412 relative to the first circuit section 510, the first magnet 412 and the first outer magnetic adhesive layer 41 are always directly opposite each other. This ensures that no matter where the first magnet 412 moves along the second direction C2, the corresponding areas of the first outer magnetic adhesive layer 41 and the first magnet 412 remain relatively constant. The magnetic attraction force will not decrease or increase significantly due to changes in relative position, thus ensuring that the movement of the first frame 100 relative to the second frame 200 is smooth and vibration-free.

[0074] Please combine Figure 1B as well as Figure 2 As shown, in some embodiments, the first outer magnetic adhesive layer 41 contacts the outer wall of the first coil 411, reducing the assembly gap between the two.

[0075] By making contact between the first outer magnetic adhesive layer 41 and the outer wall of the first coil 411, the gap between them is reduced. On the one hand, the limited space on the side of the first circuit section 510 near the first magnet 412 is fully utilized, and the space utilization rate is improved by eliminating the gap. On the other hand, the larger contact area allows more first outer magnetic adhesive layers 41 to be arranged on the same surface of the first circuit section 510, thereby enhancing the overall magnetic attraction between the first magnetic adhesive layer 40 and the first magnet 412, ensuring the stability of the frame support, and maintaining the ultra-thin design.

[0076] Furthermore, the first outer magnetic adhesive layer 41 is in complete contact with the outer wall of the first coil 411 in the circumferential direction, so as to further increase the space utilization of the first circuit section 510 and the magnetic attraction of the first magnetic adhesive layer 40.

[0077] In some other embodiments, the first outer magnetic adhesive layer 41 does not contact the outer wall of the first coil 411.

[0078] By limiting the physical distance between the first outer magnetic adhesive layer 41 and the outer wall of the first coil 411, the interference of magnetic materials on the working magnetic field of the first coil 411 is reduced. It is easy to understand that when the first coil 411 is energized, it needs to generate a precise Lorentz force through the first magnet 412 to drive the frame displacement. If the first magnetic adhesive layer 40 is too close to the first coil 411, it may distort the distribution of the working magnetic field, leading to a decrease in driving efficiency or displacement accuracy. This application eliminates the risk of magnetic interference through physical isolation, ensuring driving reliability.

[0079] Please combine Figure 1B as well as Figure 2 As shown, in some embodiments, a coil pad 13 is provided on the first circuit section 510, the lead of the first coil 411 is soldered to the coil pad 13, and the first outer magnetic adhesive layer 41 covers at least part of the coil pad 13.

[0080] Since the substrate of the first magnetic adhesive layer 40 is an insulating material, the first magnetic adhesive layer 40 itself is a non-conductive material. Covering the solder pads will not cause an electrical short circuit, and it can expand the effective placement area of ​​the first magnetic adhesive layer 40 on the first circuit part 510, maximizing the magnetic attraction force. At the same time, the cured first magnetic adhesive layer 40 can form a physical protective layer for the exposed solder joints, preventing oxidation or mechanical damage and improving structural durability.

[0081] Specifically, the first coil 411 has a predetermined thickness along the axial direction, which is parallel to the first direction C1; the winding plane of the first coil 411 is perpendicular to the first direction C1; the first coil 411 has two leads, and the two leads of the first coil 411 are respectively soldered to two coil pads 13 on the first circuit section 510 so that the first coil 411 is electrically connected to the first circuit section 510, wherein the coil pads 13 are two spaced pads exposed on the first circuit section 510.

[0082] Please combine Figure 1B as well as Figure 2 As shown, in some embodiments, the first outer magnetic adhesive layer 41 is symmetrically arranged with respect to the centerline of the first magnet 412. The centerline of the first magnet 412 is parallel to the second direction C2 and divides the first magnet 412 evenly along the third direction C3. This symmetrical arrangement can eliminate magnetic force offset and reduce motion jitter or jamming problems caused by uneven magnetic force distribution.

[0083] Please refer to Figure 3 As shown, in some embodiments, the centroid of the first outer magnetic adhesive layer 41 is offset from the projection of the centroid of the first magnet 412 onto the same plane along the first direction C1, so as to actively adjust the position of the magnetic attraction point.

[0084] This configuration allows for precise control of the clamping force distribution between the first frame 100 and the second frame 200 as needed. For example, by biasing the magnetic attraction force to one side, it can compensate for any assembly tolerances or deformations that may exist in the first support 711, ensuring balanced clamping forces between the frames and improving suspension stability.

[0085] Furthermore, in some embodiments, two first support portions 711 are provided between the first frame 100 and the second frame 200, located on both sides of the first magnet 412 along a third direction C3. One of the first support portions 711 is used for guidance and support, and the side of the first support portion 711 along the third direction is the guiding side; the other first support portion 711 is only used for support, and the side of the first support portion 711 along the third direction is the supporting side; the centroid of the first outer magnetic adhesive layer 41 is biased toward the guiding side relative to the projection of the centroid of the first magnet 412 onto the same plane along the first direction C1.

[0086] It is understandable that, since the first support portion 711 located on the guide side has both guiding and supporting functions, compared to the first support portion 711 on the other side which is only used for supporting, the first support portion 711 located on the guide side needs to resist displacement and bear a greater torque load when the frame moves.

[0087] In the above embodiments of this application, by setting the centroid of the first outer magnetic adhesive layer 41 eccentrically relative to the centroid of the first magnet 412 along the third direction C3 and biased towards the guide side, the point of application of the magnetic attraction force can be directionally offset, so that the magnetic attraction force generates a larger clamping force on the guide side, thereby specifically enhancing the constraint between the first frame 100 and the second frame 200 on the guide side, effectively offsetting the overturning torque generated by the relative displacement between the frames, thereby reducing the risk of frame overturning and improving the stability of optical component movement.

[0088] Preferably, the first support portions 711 located on both sides of the first magnet 412 form different numbers of support points, with the number of support points on the guide side of the first support portion 711 being greater than the number of support points on the support side of the first support portion 711. For example, the support side of the first support portion 711 forms one support point, and the guide side of the first support portion 711 forms two support points. The centroid of the first outer magnetic adhesive layer 41 is offset along the third direction C3 towards one of the two support points, so that the magnetic attraction between the first outer magnetic adhesive layer 41 and the first magnet 412 is offset towards the guide side, thereby improving the support stability of the first support portion 711.

[0089] Furthermore, please refer to Figure 3 As shown, in some embodiments, the portion of the first outer magnetic adhesive layer 41 biased toward the support side has a material reduction hole 41a.

[0090] Since the magnetic attraction force is positively correlated with the volume of the first magnetic adhesive layer 40, the volume of the first outer magnetic adhesive layer 41 on the support side can be reduced by opening the material reduction hole 41a. This makes the volume of the first outer magnetic adhesive layer 41 on the guide side larger than that on the support side, and the magnetic attraction force on the guide side is greater than that on the support side. This allows for the active biasing of the magnetic attraction force in the third direction C3. Compared with other magnetic attraction force biasing methods, the hole design does not require increasing the overall thickness, and the hole position can be precisely controlled by the template before curing, making it more adaptable to the process.

[0091] In some embodiments, the thickness of the portion of the first outer magnetic adhesive layer 41 biased toward the guide side is greater than the thickness of the portion biased toward the support side.

[0092] When the thickness of the first magnetic adhesive layer 40 on the guiding side is larger, the volume of the first magnetic adhesive layer 40 on that side is larger, and the magnetic attraction force with the first magnet 412 is enhanced. However, when the thickness on the supporting side is smaller, the magnetic attraction force is weakened. This asymmetrical design makes the point of application of the magnetic attraction force biased towards the thicker side (i.e., the guiding side), thereby adjusting the bias direction and magnitude of the magnetic attraction force.

[0093] Please combine Figure 4 as well as Figure 5 As shown, in some embodiments, the portion of the first circuit section 510 biased towards the support side is provided with a protrusion 11 and / or the portion biased towards the guide side is provided with a recess 12.

[0094] By providing a protrusion 11 and / or a recess 12 on the first circuit section 510, the amount of adhesive at the corresponding position can be changed. For example, the position where the recess 12 is located can accommodate more magnetic adhesive to form a larger first magnetic adhesive layer 40, while the position where the protrusion 11 is located can accommodate less magnetic adhesive to reduce the volume of the first magnetic adhesive layer 40 formed. This forces the magnetic attraction force to be biased towards the recess 12 side or avoid the protrusion 11 side, thereby controlling the position of the magnetic attraction force.

[0095] More specifically, by providing a protrusion 11 on the support side of the first circuit section 510, when magnetic adhesive is applied to the first circuit section 510, the magnetic adhesive will avoid the position of the protrusion 11, so that after the first magnetic adhesive layer 40 is cured, the volume of the first magnetic adhesive layer 40 on the support side is smaller than that on the guide side, and the first magnetic adhesive layer 40 on the guide side can generate a greater magnetic attraction force, so that the overall magnetic attraction force is biased towards the guide side.

[0096] Similarly, by providing a recess 12 on the guide side of the first circuit section 510, when magnetic adhesive is applied to the first circuit section 510, the recess 12 can additionally accommodate the magnetic adhesive, so that after the first magnetic adhesive layer 40 is cured, the volume of the first magnetic adhesive layer 40 on the guide side is larger than that on the support side, and the first magnetic adhesive layer 40 on the guide side can generate a greater magnetic attraction force, so that the overall magnetic attraction force is biased towards the guide side.

[0097] Furthermore, the protrusion 11 can be integrally formed with the insulating layer (ink layer) on the surface of the first circuit part 510, or it can be formed separately, for example, by pasting or fixing it to the surface of the first circuit part 510 after the first circuit part 510 is manufactured.

[0098] In some embodiments, the first magnetic adhesive layer 40 includes an adhesive layer matrix and magnetic fillers distributed within the adhesive layer matrix, the magnetic fillers including soft magnetic powder and / or permanent magnet powder. In some specific embodiments, the magnetic fillers are uniformly distributed within the adhesive layer matrix.

[0099] Specifically, when the magnetic filler includes soft magnetic powder, the magnetic field generated by the first magnet 412 will magnetize the soft magnetic powder in the magnetic field, forming a closed magnetic pole path, thereby enhancing the adsorption force on the first magnet 412 and reducing magnetic leakage; wherein, the magnetic attraction force responds in real time to the change of the magnetic field, ensuring that the first frame 100 and the second frame 200 tightly clamp the first support part 711 along the first direction C1.

[0100] When the magnetic filler includes permanent magnet powder, its inherent magnetism can directly generate a strong attraction with the first magnet 412, providing a stable static magnetic attraction force.

[0101] More specifically, the permanent magnet powder can be implemented as one or more of neodymium iron boron powder, aluminum nickel cobalt powder, ferrite permanent magnet powder, etc.; the soft magnetic powder can be implemented as one or more of nickel iron soft magnetic alloy powder, low carbon steel powder, 430 stainless steel powder, iron oxide powder, etc.

[0102] It should be understood that in some other embodiments, the magnetic force at different positions of the first magnetic adhesive layer 40 can be controlled by unevenly distributing the magnetic filler in the adhesive matrix, thereby achieving precise control of the clamping force between the first frame 100 and the second frame 200.

[0103] Furthermore, in some embodiments, the density of the magnetic filler inside the portion of the first magnetic adhesive layer 40 biased towards the guide side is greater than that of the portion biased towards the support side, so that the magnetic attraction force of the portion of the first magnetic adhesive layer 40 biased towards the guide side is greater than that of the portion biased towards the support side, thereby causing the overall magnetic attraction force to be biased towards the guide side.

[0104] Furthermore, in some embodiments, the magnetic filler accounts for 1 wt% to 30 wt% of the first magnetic adhesive layer 40.

[0105] This configuration ensures that the density of the magnetic filler is sufficient to form an effective magnetic attraction field, guaranteeing that the second frame 200 and the first frame 100 can stably clamp the first support 711, while avoiding the deterioration of the fluidity of the adhesive matrix due to excessive filler.

[0106] Specifically, if the proportion of magnetic filler is too low, the magnetic attraction between the first magnetic adhesive layer 40 and the first magnet 412 will be weak, which will not meet the magnetic attraction requirements of the magnetic frame and the first frame 100 clamping the first support 711. Conversely, if the proportion of magnetic filler is too high, it will reduce the fluidity of the magnetic adhesive, thereby causing problems such as insufficient adhesion of the first magnetic adhesive layer 40 or easy detachment of the magnetic filler.

[0107] Furthermore, in some embodiments, the adhesive layer substrate is an insulating material. Since the first coil 411 carries a driving current, using an insulating material as the adhesive layer substrate can prevent the formation of a conductive path, thereby avoiding leakage or short circuit of the first coil 411 due to the conductivity of the first magnetic adhesive layer 40.

[0108] Further, please refer to Figure 6 As shown, in some embodiments, the driving device further includes a protective layer 70, which is fixed to the first magnetic adhesive layer 40 and covers the exposed surface of the first magnetic adhesive layer 40.

[0109] This design physically isolates the magnetic filler inside the first magnetic adhesive layer 40 from the outside world, preventing powder from falling off and entering the drive device due to long-term use or vibration. This avoids the risk of magnetic filler contaminating optical components from the source and ensures the long-term reliability of the drive device during precision displacement.

[0110] Specifically, the protective layer 70 is formed by curing the adhesive. The liquid adhesive can completely cover the exposed surface of the first magnetic adhesive layer 40 by its own fluidity, so as to ensure that the cured protective layer 70 completely covers the exposed surface of the first magnetic adhesive layer 40 and completely avoids the risk of magnetic filler leakage.

[0111] Furthermore, in some embodiments, the adhesive substrate is black. A black adhesive substrate can efficiently absorb incident light, preventing the first magnetic adhesive layer 40 from reflecting stray light into the optical path of the optical element, thereby reducing the risk of stray light in the system. Even further, the protective layer 70 is also black, and the black protective layer 70 can also reduce the risk of stray light.

[0112] Please combine Figure 1B as well as Figure 6 As shown, in some embodiments, the distance between the first magnetic adhesive layer 40 and the first magnet 412 along the first direction C1 is greater than or equal to the distance between the first coil 411 and the first magnet 412 along the first direction C1, that is, to ensure that the side of the first magnetic adhesive layer 40 near the first magnet 412 along the first direction C1 does not protrude from the first coil 411.

[0113] With this configuration, when the first magnet 412 and the first coil 411 move relative to each other, the first magnetic adhesive layer 40 will not mechanically interfere with the first magnet 412. By avoiding spatial interference, the interference of the first magnetic adhesive layer 40 on the original degree of freedom of the first magnet 412 is effectively reduced, thus ensuring driving stability.

[0114] Furthermore, the distance between the first magnetic adhesive layer 40 and the protective layer 70 along the first direction C1 and the first magnet 412 is greater than or equal to the distance between the first coil 411 along the first direction C1 and the first magnet 412. That is, the protective layer 70 does not protrude from the first coil 411 along the first direction C1, so as to avoid interference between the protective layer 70 and the first magnet 412, thereby reducing the influence of the setting of the protective layer 70 on the relative movement between the first magnet 412 and the first coil 411.

[0115] Please refer to Figure 2 As shown, in some embodiments, the first coil 411 is annular to form a receiving cavity 21 between the annular inner wall of the first coil 411 and the first circuit portion 510; the first magnetic adhesive layer 40 includes a first outer magnetic adhesive layer 41 and a first inner magnetic adhesive layer 42. The first outer magnetic adhesive layer 41 is located outside the annular outer wall of the first coil 411, and the first inner magnetic adhesive layer 42 is disposed in the receiving cavity 21 and / or disposed in the gaps between the wires in the first coil 411.

[0116] By providing a first outer magnetic adhesive layer 41 and a first inner magnetic adhesive layer 42 inside and outside the first coil 411 respectively, the overall volume of the first magnetic adhesive layer 40 is further increased, improving the magnetic attraction reliability between it and the first magnet 412. Regarding the first inner magnetic adhesive layer 42, whether it is located within the accommodating cavity 21 or within the wire gap, it can fully utilize the unused space at the location of the first coil 411, avoiding additional volume occupation. This satisfies the magnetic attraction requirement within a smaller drive device size and allows for indirect adjustment of the clamping force between the first frame 100 and the second frame 200 through magnetic attraction.

[0117] Furthermore, in this application, the first inner magnetic adhesive layer 42 can also enhance the driving force between the first coil 411 and the first magnet 412. On one hand, the first inner magnetic adhesive layer 42 can form a high-permeability channel inside the first coil 411, so that the magnetic flux generated after the first coil 411 is energized will preferentially close through this channel, reducing the winding distance and leakage loss of the magnetic flux in the air. Thus, under the same input current conditions, the strength of the coil magnetic field in the working air gap is effectively increased. On the other hand, the first inner magnetic adhesive layer 42 can also provide a low magnetic reluctance bypass for the magnet magnetic flux through magnetic circuit coupling, so that the magnet magnetic flux that originally diffused into the surrounding space is guided and converged into the working air gap, thereby increasing the strength of the magnet magnetic field in the working air gap. Therefore, under the same current input conditions, the first inner magnetic adhesive layer 42 effectively increases the total magnetic field strength generated by the first coil 411 and the first magnet 412 in the working air gap through the dual effects of enhancing the coil magnetic field and converging the magnet magnetic field, thereby effectively increasing the driving force generated between the first coil 411 and the first magnet 412.

[0118] The working air gap refers to the air gap between the first magnet 412 and the first coil 411 where energy conversion actually occurs. In other words, it is the effective area where the magnetic field of the first coil 411 interacts with the magnetic field of the magnet after it is energized, generating driving force.

[0119] Furthermore, since the projection of the first inner magnetic adhesive layer 42 along the first direction C1 is entirely within the projection range of the first coil 411 (i.e., the outer contour of the first coil 411), the first inner magnetic adhesive layer 42 can be placed in the coil to fill the original unused space inside the first coil 411 without occupying additional volume. This allows for an increase in the driving force of the driving device while maintaining the same or even smaller volume. Simultaneously, while achieving the same driving force, the size or number of turns of the first coil 411 can be reduced by using the first inner magnetic adhesive layer 42, thereby reducing the overall size and weight of the driving device to a certain extent.

[0120] Specifically, if the first inner magnetic adhesive layer 42 is placed within the accommodating cavity 21, it can form a high-permeability channel inside the first coil 411 or provide a low-resistance bypass for the magnetic flux of the magnet through magnetic circuit coupling. If the first inner magnetic adhesive layer 42 is placed in the gap between the wires, its fine filling can reduce magnetic field leakage, optimize the magnetic field line path, and help optimize the magnetic field of the first coil 411. Further, the magnetic powder of the first inner magnetic adhesive layer 42 includes soft magnetic powder and / or permanent magnet powder; when the magnetic filler includes permanent magnet powder, in one embodiment, the magnetic field direction of the first magnetic adhesive layer 40 is parallel to the magnetic field direction of the magnet.

[0121] When the magnetic powder of the first inner magnetic adhesive layer 42 includes permanent magnet powder, the structure of the first inner magnetic adhesive layer 42 has high plasticity and can achieve precise magnetization. Specifically, if other permanent magnets with fixed structures and shapes (such as magnets) are set inside the first coil 411, the process of precisely magnetizing a magnetic field in a specific direction in a precise and tiny structure (such as a voice coil motor) is extremely difficult. If the magnetization is not based on the magnetic field of the first magnet 412, the newly added permanent magnet, as a new magnetic field source, will disrupt the original magnetic circuit balance of the first magnet 412, interfere with the original magnetic field distribution of the first magnet 412, and thus lead to a decrease in magnetic field strength or even failure.

[0122] In addition, permanent magnet powder is characterized by being difficult to demagnetize and having high coercivity, and it can maintain a magnetic field for a long time after being magnetized once.

[0123] When the magnetic powder of the first inner magnetic adhesive layer 42 includes soft magnetic powder, the first inner magnetic adhesive layer 42 has high magnetic permeability. Specifically, on the one hand, it can form a high magnetic permeability channel inside the first coil 411, so that the magnetic flux generated after the first coil 411 is energized will preferentially close through the channel, reducing the winding distance of the magnetic flux in the air and the leakage magnetic loss; on the other hand, it can also provide a low magnetic reluctance bypass for the magnetic flux of the magnet through magnetic circuit coupling, so that the magnetic flux of the magnet that originally diffuses into the surrounding space is guided and converged into the working air gap, thereby increasing the magnetic field strength of the magnet in the working air gap, and thus achieving the effect of increasing the driving force between the first coil 411 and the first magnet 412.

[0124] Meanwhile, the first internal magnetic adhesive layer 42, which contains soft magnetic powder, can make the magnetic field of the first coil 411 more stable and uniform, thereby reducing magnetic field fluctuations and noise, and improving the stability and accuracy of the drive device operation.

[0125] It is worth mentioning that, compared to other soft magnetic components with fixed structures and shapes placed inside the first coil 411, most of them are difficult to perfectly fit the complex, narrow, and irregular space inside the first coil 411, thus failing to make full use of the space. At the same time, the existence of gaps will also affect the magnetic field focusing efficiency and weaken the magnetic field enhancement effect. However, the first inner magnetic adhesive layer 42 of this application is formed by curing liquid magnetic adhesive, which can seamlessly fill the internal space of the first coil 411, thereby making full use of the internal space of the first coil 411 while achieving excellent magnetic field enhancement effect.

[0126] In addition, soft magnetic powder also has the characteristics of easy magnetization, easy demagnetization, low coercivity and high permeability.

[0127] Furthermore, in some embodiments, the ratio of magnetic filler in the first outer magnetic adhesive layer 41 and the first inner magnetic adhesive layer 42 may be the same or different, as long as the magnetic attraction requirement of the first magnetic adhesive layer 40 as a whole and the magnetic field enhancement requirement of the first inner magnetic adhesive layer 42 for the first coil 411 can be met simultaneously.

[0128] Further, please refer to Figure 6 As shown, in some embodiments, the thickness of the first inner magnetic adhesive layer 42 along the first direction C1 is greater than that of the first outer magnetic adhesive layer 41, so as to meet the minimum effective threshold for enhancing the driving force of the first inner magnetic adhesive layer 42.

[0129] Furthermore, the thickness of the first inner magnetic adhesive layer 42 along the first direction C1 accounts for 50% to 100% of the thickness of the first coil 411, so as to make full use of the idle space inside the first coil 411 to achieve a balance between efficient magnetic field enhancement and volume control.

[0130] The thickness of the first inner magnetic adhesive layer 42 along the first direction C1 is ≥50% of the thickness of the first coil 411, which ensures that the first inner magnetic adhesive layer 42 has sufficient volume to fill the internal space of the first coil 411, thereby reaching the minimum effective threshold for enhancing the driving force; while the thickness of the first inner magnetic adhesive layer 42 along the first direction C1 is ≤100% of the thickness of the first coil 411, which avoids the risk of interference with the first magnet 412 due to excessive protrusion of the first inner magnetic adhesive layer 42.

[0131] Furthermore, in some embodiments, the thickness of the first inner magnetic adhesive layer 42 at different positions can be the same or different. Under the same conditions, the magnetic field enhancement effect and the uniformity of the clamping force between the first frame 100 and the second frame 200 can be increased. Adjusting the thickness of the first magnetic adhesive layer 40 at different positions as needed can adjust the point of application of the magnetic attraction force, thereby precisely controlling the distribution of the clamping force between the first frame 100 and the second frame 200.

[0132] Further, please refer to Figure 6 As shown, in some embodiments, the first inner magnetic adhesive layer 42 is disposed in the accommodating cavity 21 and fixed to the first circuit part 510, and the first inner magnetic adhesive layer 42 is in contact with the annular inner wall of the first coil 411.

[0133] By physically contacting the first inner magnetic adhesive layer 42 with the annular inner wall of the first coil 411, the gap between the first inner magnetic adhesive layer 42 and the first coil 411 can be eliminated, thereby maximizing the volume of the first inner magnetic adhesive layer 42 and improving its effect on enhancing magnetic induction intensity. Furthermore, when the magnetic filler of the first inner magnetic adhesive layer 42 is soft magnetic powder, eliminating the gap through contact can also ensure efficient connection between the magnetic circuit channel and the low magnetic resistance path of the first inner magnetic adhesive layer 42, thereby improving the collection efficiency and density of magnetic lines of force.

[0134] On the other hand, the first inner magnetic adhesive layer 42 simultaneously contacts and fixes the inner wall of the first coil 411 and the first circuit part 510, increasing the fixing area of ​​the first inner magnetic adhesive layer 42 and enhancing the structural stability and reliability during dynamic movement processes such as focusing and image stabilization.

[0135] Furthermore, the projection of the first inner magnetic adhesive layer 42 along the first direction C1 completely covers the accommodating cavity 21. That is, the first inner magnetic adhesive layer 42 is in complete contact with the annular inner wall of the first coil 411.

[0136] By projecting the entire surface, the first inner magnetic adhesive layer 42 is ensured to fill the entire space of the accommodating cavity 21 to the maximum extent. The high space utilization ensures no waste in a compact volume, thereby forming a complete magnetic conductive or magnetic field enhancement layer and reducing the loss of magnetic field at the edges. At the same time, the complete contact between the first inner magnetic adhesive layer 42 and the annular inner wall of the first coil 411 also helps to dissipate heat when the first coil 411 is working, thereby improving the heat dissipation performance of the drive device of this application.

[0137] Compared to partial coverage, full coverage can further optimize the uniformity of magnetic field distribution, enhance the driving force more comprehensively, and avoid the "blind spot" effect caused by uncovered areas.

[0138] Furthermore, in some embodiments, the first inner magnetic adhesive layer 42 is disposed in the accommodating cavity 21 and fixed to the first circuit part 510, and the first inner magnetic adhesive layer 42 is spaced apart from the annular inner wall of the first coil 411.

[0139] This configuration, by maintaining a physical gap between the first inner magnetic adhesive layer 42 and the first coil 411, can isolate the direct contact between the first inner magnetic adhesive layer 42 and the first coil 411, preventing current leakage or short circuit and avoiding the risk of short circuit.

[0140] Furthermore, in some embodiments, the cross-sectional area of ​​the first inner magnetic adhesive layer 42 along the first direction C1 gradually decreases towards the side closer to the first magnet 412.

[0141] It is easy to understand that because the first inner magnetic adhesive layer 42 and the annular inner wall of the first coil 411 are spaced apart and do not directly contact each other, when magnetic adhesive is applied into the accommodating cavity 21, the magnetic adhesive will form a structure that is larger at the bottom and smaller at the top under the action of gravity. This gradient cross-section structure matches the magnetic field attenuation law of the first magnet 412, which can make the magnetic flux more efficiently converge to the sensitive area of ​​the first coil 411 and optimize the magnetic circuit. In addition, it can also reduce the amount of material used on the side of the first inner magnetic adhesive layer 42 close to the first magnet 412, reducing the ineffective weight while meeting the magnetic field enhancement requirements, and avoiding the impact of redundant mass on the response speed.

[0142] Specifically, the first inner magnetic adhesive layer 42 can be formed by curing after a single application of adhesive, or by curing after multiple applications of adhesive (i.e., applying adhesive again after curing once, and repeating this process multiple times to achieve the required thickness).

[0143] More specifically, the thixotropic ratio of the magnetic adhesive liquid used to cure and form the first inner magnetic adhesive layer 42 is in the range of 3 to 5.

[0144] By controlling the thixotropic ratio of the magnetic adhesive within this range, the slope of the gradient cross-section structure of the first inner magnetic adhesive layer 42 formed after curing can be controlled, thereby minimizing the weight of the first inner magnetic adhesive layer 42 while ensuring that the magnetic induction intensity enhancement effect of the first inner magnetic adhesive layer 42 meets the requirements.

[0145] The thixotropic ratio (H / W) refers to the ratio of the initial height (H) of the extruded adhesive stacked into a cylindrical or elongated shape to the lateral spreading width (W) of the extruded adhesive after standing for 180 seconds. The test conditions for the above thixotropic ratio range are a temperature of 23°C and a humidity of 50%.

[0146] Furthermore, in some embodiments, the first inner magnetic adhesive layer 42 is disposed in the accommodating cavity 21 and fixed to the first circuit part 510, and two first inner magnetic adhesive layers 42 are disposed in the accommodating cavity 21 at intervals along a plane perpendicular to the first direction C1.

[0147] Two first inner magnetic adhesive layers 42 are spaced apart. While ensuring the magnetic field enhancement effect, the absence of first inner magnetic adhesive layers 42 in the middle region of the accommodating cavity 21 weakens the magnetic attraction between the first inner magnetic adhesive layer 42 and the first magnet 412. This avoids the situation where the frictional force increases due to excessive clamping force between the first frame 100 and the second frame 200, which in turn increases the driving force required by the driving device. The driving sensitivity of the driving device of this application can be ensured by adjusting the magnetic attraction force.

[0148] Furthermore, the two first inner magnetic adhesive layers 42 are spaced apart along the length of the first coil 411. The lengthwise spacing makes full use of the linear space of the accommodating cavity 21, which can accommodate more first inner magnetic adhesive layers 42 to maximize the magnetic field enhancement effect, and the larger area of ​​the intermediate spacing region can further increase the driving sensitivity of the driving device.

[0149] Furthermore, the projected area of ​​the portion of the accommodating cavity 21 located between the two first inner magnetic adhesive layers 42 along the first direction C1 accounts for a proportion of 1 / 4 to 1 / 2 of the total projected area of ​​the accommodating cavity 21.

[0150] This ratio range, verified through electromagnetic simulation, achieves the optimal balance between controllable driving force gain and clamping force, meeting the minimum requirement for enhancing the magnetic flux density in the first coil 411 region to improve driving force. Specifically, if the ratio is less than 1 / 4, i.e., the interval area is too small, the adhesive layer will cover too much, and the surge in magnetic attraction will lead to increased driving resistance and decreased response speed; conversely, if the ratio is greater than 1 / 2, the interval area will be too large, the magnetic field enhancement will be insufficient, the driving force improvement will be limited, and it will be unable to break through the thrust bottleneck.

[0151] Furthermore, the protective layer 70 completely fills the gap between the two first inner magnetic adhesive layers 42. The fluid properties of the adhesive in the protective layer 70 enable it to completely fill this gap, thus reducing the difficulty of preparing the protective layer 70. Specifically, after the two first inner magnetic adhesive layers 42 have cured, the adhesive of the protective layer 70 is applied to the middle gap and cured.

[0152] Furthermore, in some embodiments, the first inner magnetic adhesive layer 42 is disposed in the accommodating cavity 21 and fixed to the first circuit part 510, and the first inner magnetic adhesive layer 42 is disposed centrally or eccentrically in the accommodating cavity 21 along a plane perpendicular to the first direction C1.

[0153] The central setting ensures that the magnetic lines of force pass through the first coil 411 evenly, enhancing the symmetry and stability of the driving force; while the eccentric configuration (e.g., set in a dotted pattern within the accommodating cavity 21) can adjust the point of application of the magnetic attraction force by offsetting the position of the first inner magnetic adhesive layer 42, thereby precisely controlling the distribution of the clamping force between the first frame 100 and the second frame 200.

[0154] Please refer to Figure 6 As shown, in some embodiments, the driving device further includes a first position sensor 610 and a first capacitor 620. The first position sensor 610 and the first capacitor 620 are fixed to the side of the first circuit section 510 close to the first magnet 412 along the first direction C1 and are used to detect the movement of the first magnet 412 relative to itself. The first position sensor 610 and the first capacitor 620 are located inside or outside the annular first coil 411 to meet the needs of different scenarios.

[0155] Furthermore, in some embodiments, the first position sensor 610 is spaced apart from the first magnetic adhesive layer 40. This spacing ensures that the first position sensor 610 does not come into contact with the first magnetic adhesive layer 40, thereby avoiding distortion of the displacement signal due to the magnetic field of the first magnetic adhesive layer 40.

[0156] Furthermore, the first magnetic adhesive layer 40 is arranged at intervals with both the first position sensor 610 and the first coil 411 to avoid the first magnetic adhesive layer 40 interfering with the normal operation of the first position sensor 610 and the first coil 411.

[0157] Furthermore, in some embodiments, the first magnetic adhesive layer 40 contacts the first position sensor 610, and at least part of the surface of the first position sensor 610 near the first magnet 412 is not covered by the first magnetic adhesive layer 40, or the first magnetic adhesive layer 40 completely covers the first position sensor 610. By having the first magnetic adhesive layer 40 contact the first position sensor 610, the gap between them can be reduced. In other words, both covering modes can make fuller use of the space of the first circuit section 510, which facilitates the miniaturization of the drive device.

[0158] When the first magnetic adhesive layer 40 only covers the side of the first position sensor 610, the first magnetic adhesive layer 40 retains an open window at the top of the first position sensor 610, ensuring that the magnetic field of the first magnet 412 can penetrate into the sensing area of ​​the first position sensor 610 without obstruction, reducing the impact of the first magnetic adhesive layer 40 on the position detection function, thereby maximizing the use of the lateral space inside the first coil 411 and avoiding the first magnetic adhesive layer 40 from blocking the magnetic field propagation path.

[0159] When the first magnetic adhesive layer 40 completely covers the first position sensor 610, the volume of the first magnetic adhesive layer 40 is maximized, which can effectively increase the magnetic attraction strength and improve the support reliability between the first frame 100 and the second frame 200.

[0160] Please combine Figure 7 , Figure 8 as well as Figure 9 As shown, this application also provides a driving device for driving optical elements, including a first frame 100, a second frame 200, a first support portion 711, and a driving assembly; wherein, the first support portion 711 is disposed between the first frame 100 and the second frame 200, and the first frame 100 is movably supported on the second frame 200 through the first support portion 711, and the first frame 100 is used to carry the optical elements; the driving assembly is configured to drive the first frame 100 to move relative to the second frame 200.

[0161] The optical element has an optical axis. When the optical element is implemented as an optical lens 1, the optical axis of the optical element is the optical axis of the optical lens 1, which is the coaxial alignment line of the optical axes of each lens in the optical lens 1. When the optical element is implemented as a photosensitive chip, the optical axis of the optical element is the optical axis of the photosensitive chip, which is the axis perpendicular to the geometric center of the effective imaging area of ​​the photosensitive chip.

[0162] Furthermore, the driving assembly includes at least one first driving unit, each first driving unit including at least one first coil 411 and at least one first magnet 412, the first coil 411 and the first magnet 412 being disposed opposite to each other, the first frame 100 being movably suspended in the second frame 200, the first coil 411 being fixed to the other of the first frame 100 and the second frame 200, and the first magnet 412 being fixed to the other of the first frame 100 and the second frame 200.

[0163] Please refer to Figure 9 As shown, in some embodiments, the first coil 411 is fixed to the second frame 200, and the first magnet 412 is fixed to the first frame 100, forming a moving magnet drive structure. After the first coil 411 is energized, the first coil 411 drives the first frame 100 and the first magnet 412 fixed to the first frame 100 to move relative to the second frame 200.

[0164] In the above embodiments, the first magnet 412 moves relative to the first coil 411 along the optical axis, and the first driving unit drives the first frame 100 to move relative to the second frame 200 along the optical axis, thereby achieving optical focusing. It should be understood that in other examples of this application, the first driving unit can also drive the first frame 100 to move relative to the second frame 200 in a direction perpendicular to the optical axis, thereby achieving optical image stabilization. That is, the first driving unit can be applied to a driving device that achieves focusing driving function or a driving device that achieves image stabilization driving function.

[0165] In addition, in other examples of this application, the first magnet 412 may also be fixed to the second frame 200, while the first coil 411 may be fixed to the first frame 100, thereby forming a moving coil drive architecture.

[0166] Furthermore, the first drive assembly also includes a first circuit section 510 for providing current to the first coil 411. The first circuit section 510 is disposed on the side of the first coil 411 away from the first magnet 412 and is fixed and electrically connected to the first coil 411.

[0167] The first circuit section 510 and the first coil 411 are fixed to the same frame. In the aforementioned embodiment, the first circuit section 510 is fixed to the second frame 200, and the first coil 411 is fixed to the first circuit section 510, thereby the first coil 411 is indirectly fixed to the second frame 200 through the first circuit section 510. It should be understood that in other embodiments of this application, when the first coil 411 is fixed to the first frame 100, the first circuit section 510 is also fixed to the first frame 100, in which case the first coil 411 is indirectly fixed to the first frame 100 through the first circuit section 510.

[0168] It is worth mentioning that, in this application, the first circuit section 510 can be implemented as follows: Figure 1B The circuit board shown; the first circuit section 510 can also be implemented as other conductive components, such as conductive metal inserts. The metal insert is embedded in the second frame 200 by an insert injection molding process to give the second frame 200 electrical functionality, and the first coil 411 is fixed to the second frame 200 and electrically connected to the metal insert.

[0169] Furthermore, the driving device also includes a first position detection component. This first position detection component includes at least one first position sensor 610 for acquiring position change information of the first frame 100 relative to the second frame 200. The first position sensor 610 is fixed and electrically connected to the first circuit section 510. The first position sensor 610 is opposite to the first magnet 412 and acquires the magnetic field information of the first magnet 412. By acquiring changes in the magnetic field information of the first magnet 412, the first position sensor 610 acquires the position change information of the first magnet 412 relative to itself, and thus acquires the position change information of the first frame 100 relative to the second frame 200.

[0170] It is worth mentioning that the first position sensor 610 can be implemented as a Hall effect sensor, a TMR sensor, or a driver chip with integrated position sensing function. In some cases, the first position detection component also includes at least one first capacitor 620, which is disposed adjacent to the first position sensor 610. The first capacitor 620 is fixed and electrically connected to the first circuit section 510 to assist in position sensing.

[0171] Please refer to Figure 9 As shown, in some embodiments, the first support 711 is implemented as two guide rods, which restrict the direction of movement of the first frame 100. Specifically, the two guide rods are disposed on both sides of the first magnet 412 and the first coil 411. In other embodiments, the first support 711 may also be implemented as at least three ball bearings, at least three sliders, or a combination of at least two of ball bearings, sliders, and guide rods.

[0172] Furthermore, in some embodiments, the driving device further includes a third frame 300 and a second support portion 721. The second support portion 721 is disposed between the second frame 200 and the third frame 300. The second frame 200 is movably suspended in the third frame 300 by the second support portion 721, so that the first frame 100 can move in the third frame 300 under the drive of the second frame 200.

[0173] The driving assembly also includes at least one second driving unit configured to drive the second frame 200 to move relative to the third frame 300. Each second driving unit includes at least one second coil 421 and at least one second magnet 422, with the second coil 421 and the second magnet 422 disposed opposite to each other. The second coil 421 is fixed to one of the second frame 200 and the third frame 300, and the second magnet 422 is fixed to the other of the second frame 200 and the third frame 300.

[0174] In some embodiments, the second driving unit further includes a second magnetic adhesive layer and a second circuit section 520. The second circuit section 520 is fixed to the frame where the second coil 421 is located. The second coil 421 and the second magnetic adhesive layer are both fixed to the second circuit section 520. The second magnetic adhesive layer is used to magnetically attract the second magnet 422 so that the second frame 200 and the third frame 300 clamp the second support section 721. After the second coil 421 is energized, it can drive the second magnet 422 to move relative to the second coil 421.

[0175] Furthermore, in some embodiments, the second coil 421 is annular, and the annular second coil 421 has an annular inner wall and an annular outer wall in the radial direction. The second magnetic adhesive layer includes a second outer magnetic adhesive layer located outside the annular outer wall of the second coil 421.

[0176] Furthermore, in some embodiments, the second magnetic adhesive layer also includes a second inner magnetic adhesive layer located inside the annular inner wall of the second coil 421.

[0177] Please combine Figure 9 as well as Figure 10 As shown, in some embodiments, the second magnet 422 is fixed to the second frame 200, and the second coil 421 is fixed to the third frame 300, forming a moving magnet drive structure. After the second coil 421 is energized, the second coil 421 drives the second frame 200 and the second magnet 422 fixed to the second frame 200 to move relative to the third frame 300.

[0178] Specifically, in the above embodiments, the second magnet 422 moves relative to the second coil 421 in a direction perpendicular to the optical axis, and the second driving unit drives the second frame 200 to move relative to the third frame 300 in a direction perpendicular to the optical axis, thereby achieving optical image stabilization. It should be understood that in other examples of this application, the second driving unit can also drive the second frame 200 to move relative to the third frame 300 in a direction perpendicular to the optical axis, thereby achieving optical focusing. That is, the second driving unit can be applied to the focusing drive section, the image stabilization drive section, or both of the driving device.

[0179] Please combine Figure 7 as well as Figure 8As shown, in some embodiments, the driving device can be divided into a first side S1, a second side S2, a third side S3 and a fourth side S4 around the optical lens 1 with the optical axis as the center; the driving assembly also includes two sets of second driving units, which are located on the first side S1 and the second side S2 of the optical lens 1 respectively, and are used to drive the second frame 200 to move relative to the third frame 300 in the direction of the first side S1-the third side S3 and the direction of the second side S2-the fourth side S4.

[0180] Specifically, in the above embodiment, the second driving unit located on the first side S1 includes a second coil 421 and a second magnet 422, and the second driving unit located on the second side S2 includes two second coils 421 and two second magnets 422, and the two second coils 421 are spaced apart along a direction parallel to the first side S1 to the third side S3.

[0181] Furthermore, the drive assembly includes a set of first drive units located on the fourth side S4 of the optical lens 1.

[0182] In addition, in some other embodiments, the third frame 300 is movably suspended from the second frame 200, and the first frame 100 is movably suspended from the third frame 300, so that the first frame 100 can move in the second frame 200 under the drive of the third frame 300.

[0183] Furthermore, a second circuit section 520 is disposed on the side of the second coil 421 away from the second magnet 422 and is fixed and electrically connected to the second coil 421 for supplying current to the second coil 421.

[0184] The second circuit section 520 and the second coil 421 are fixed to the same frame. Figure 10 In the illustrated embodiment, the second circuit section 520 is fixed to the third frame 300, and the second coil 421 is fixed to the second circuit section 520, thereby the second coil 421 is indirectly fixed to the third frame 300 through the second circuit section 520. It should be understood that in some other embodiments, when the second coil 421 is fixed to the second frame 200, the second circuit section 520 is also fixed to the second frame 200; in this case, the second coil 421 is indirectly fixed to the second frame 200 through the second circuit section 520.

[0185] It is worth mentioning that, in this application, the second circuit section 520 can be implemented as follows: Figure 1B The circuit board shown; the second circuit section 520 can also be implemented as other conductive components, such as conductive metal inserts. The metal insert is embedded in the third frame 300 by an insert injection molding process to give the third frame 300 electrical functionality, and the second coil 421 is fixed to the third frame 300 and electrically connected to the metal insert.

[0186] Furthermore, the driving device also includes a circuit output section electrically connected to the first circuit section 510 and the second circuit section 520. The circuit output section serves as a circuit output component of the driving device and is used to electrically connect the first circuit section 510, the second circuit section 520, and the photosensitive module 2. In some cases, the circuit output section can also be used for the electrical connection of the first circuit section 510 and the second circuit section 520.

[0187] In this application, the circuit output section includes a circuit connector 531 and a circuit output component 532. One end of the circuit connector 531 is electrically connected to the first circuit section 510, and the other end is fixed to the third frame 300 and electrically connected to the circuit output component 532. The circuit output component 532 is embedded in the third frame 300 and has a partially exposed soldering area (visible from the side and bottom). Through the soldering area of ​​the circuit output component 532, the circuit connector 531 and the second circuit section 520 are electrically connected to the circuit output component 532 (e.g., by laser welding, soldering, conductive adhesive, etc.), so that both the first circuit section 510 and the second circuit section 520 are electrically connected to external components (e.g., the photosensitive module 2) through the circuit output component 532.

[0188] In some other embodiments, the first circuit section 510 may also be directly electrically connected to external components via the circuit connector 531.

[0189] Furthermore, the driving device also includes a second position detection component, which includes at least one second position sensor 630 for acquiring position change information of the second frame 200 relative to the third frame 300. The second position sensor 630 is fixed and electrically connected to the second circuit section 520. The second position sensor 630 is opposite to the second magnet 422 and acquires the magnetic field information of the second magnet 422. By acquiring the change in the magnetic field information of the second magnet 422, the second position sensor 630 acquires the position change information of the second magnet 422 relative to the second position sensor 630, and thus acquires the position change information of the second frame 200 relative to the third frame 300.

[0190] It is worth mentioning that the second position sensor 630 can be implemented as a Hall effect sensor, a TMR sensor, or a driver chip with integrated position sensing functionality. In some cases, the second position detection component also includes at least one second capacitor 640, which is disposed adjacent to the second position sensor 630. The second capacitor 640 is fixed and electrically connected to the second circuit section 520 to assist in position sensing.

[0191] Please combine Figure 9 as well as Figure 10As shown, in some embodiments, the second position sensor 630 is disposed on the side of the second circuit section 520 away from the second coil 421, and the second position sensor 630 and the second coil 421 are disposed on opposite sides of the second circuit section 520. Correspondingly, the second capacitor 640 is also disposed on the side of the second circuit section 520 away from the second coil 421, and the second capacitor 640 and the second coil 421 are disposed on opposite sides of the second circuit section 520.

[0192] In some embodiments, the second support 721 is implemented as at least three balls, specifically, at least three balls are disposed at three corners between the second frame 200 and the third frame 300. In other embodiments, the second support 721 may also be implemented as at least two guide rods, at least three sliders, or a combination of at least two of balls, sliders, and guide rods.

[0193] Furthermore, the drive unit also includes a top cover 800, which is adapted to engage with the third frame 300 to form a receiving space for accommodating and protecting other components.

[0194] In addition, the drive unit can be such as Figure 8 The vertical lens driving device shown may also be other types of driving devices not illustrated, such as vertical chip driving devices, periscope driving devices, gimbal driving devices, etc., which will not be listed here.

[0195] Please combine Figure 7 as well as Figure 8 As shown, this application also provides a camera module, including an optical lens 1, a photosensitive module 2, and the aforementioned driving device; the optical lens 1 is disposed in one of the first frame 100 or the second frame 200, and is used to receive and emit light along its own optical axis; the photosensitive module 2 is disposed in the other of the first frame 100 or the second frame 200, and is used to receive the light emitted by the optical lens 1 for imaging; that is, the driving device is used to drive one of the optical lens 1 or the photosensitive module 2 to move relative to the other, so as to achieve focusing and / or image stabilization.

[0196] The optical lens 1 can be a part of an optical system consisting of only one or a few lenses, or it can be a complete optical system. The photosensitive module 2 includes a photosensitive chip. Specifically, the photosensitive module 2 includes a chip circuit board and a photosensitive chip electrically connected to the chip circuit board.

[0197] In some embodiments, the photosensitive module 2 further includes a filter and a filter holder, wherein the filter element is disposed between the photosensitive chip and the optical lens 1 and is used to filter out unwanted wavelengths of light (e.g., infrared light) from the light entering the photosensitive chip, the filter is supported on the filter holder, and the filter holder is fixed to the chip circuit board.

[0198] This application also provides a method for manufacturing a drive device, including the following steps:

[0199] S100. Fix the first coil to the first circuit section;

[0200] S200. Apply magnetic adhesive to the first circuit section and cure it to form a first magnetic adhesive layer;

[0201] S300. Fix the first circuit part to the second frame, and fix the first magnet to the first frame;

[0202] S400. The first frame is suspended from the second frame by the first support member, so that the first magnet and the first coil are spaced apart along the first direction, and the first magnetic adhesive layer and the first magnet are magnetically attracted along the first direction.

[0203] In this application, by first fixing the first coil to the first circuit section and then applying magnetic adhesive to the first circuit section, a limiting space can be formed between the first coil and the first circuit section to limit the flow range of the magnetic adhesive after it is applied, and the magnetic adhesive can be limited and shaped without the need for an additional mold.

[0204] Furthermore, in step S100, by applying adhesive to the first circuit section, placing the first coil at the adhesive position of the first circuit section, and curing the adhesive, the fixation between the first coil and the first circuit section is completed. The adhesive fixation ensures that there are no gaps between the first coil and the first circuit section, so as to prevent leakage of magnetic adhesive beyond the specified range through gaps after subsequent application. Of course, other commonly used fixing methods can also be used to fix the two, as long as there are no gaps between the first coil and the first circuit section. This application will not give examples of each method here.

[0205] In some embodiments, before step S100, the method further includes the step of electrically connecting the first position sensor and the first capacitor on the first circuit section via an SMT process.

[0206] In some embodiments, between step S100 and step S200, the step of soldering the terminals of the first coil to the coil pad 13 of the first circuit portion is further included. This involves covering the coil pad 13 with magnetic adhesive and fixing it to form a solder joint protective layer 70.

[0207] In some embodiments, the curing method in step S200 is thermal curing, which offers high reliability. Of course, in other embodiments, the magnetic adhesive can also be cured by other curing methods such as light curing and moisture curing; these will not be listed here.

[0208] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0209] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A driving device for driving optical elements, characterized in that, It includes a first frame, a second frame, a first support portion, and a first driving unit, wherein one of the first frame and the second frame is used to carry the optical element, and the first support portion is disposed between the first frame and the second frame and is used to movably suspend the first frame on the second frame. The first driving unit includes a first circuit section, a first coil, a first magnet, and a first magnetic adhesive layer. The first magnet is fixed to one of the first frame and the second frame, and the first circuit section is fixed to the other. The first coil and the first magnetic adhesive layer are both fixed to the first circuit section. The first coil and the first magnetic adhesive layer are located on the same side of the first circuit section along a first direction, and both are spaced apart from the first magnet along the first direction. The first magnetic adhesive layer is used to magnetically attract the first magnet so that the first frame and the second frame clamp the first support section along the first direction. When the first coil is energized, it can drive the first magnet to move relative to the first coil. The first coil is annular, and the first magnetic adhesive layer includes a first outer magnetic adhesive layer located outside the annular outer wall of the first coil.

2. The driving device according to claim 1, characterized in that, The dimension of the first outer magnetic adhesive layer along the second direction is larger than the dimension of the first magnet along the second direction, and the second direction is perpendicular to the first direction.

3. The driving device according to claim 2, characterized in that, The first magnet is movable relative to the first coil along the second direction, and the dimension of the first outer magnetic adhesive layer along the second direction is greater than the sum of the dimension of the first magnet along the second direction and its movement distance along the second direction.

4. The driving device according to claim 2, characterized in that, The dimension of the first outer magnetic adhesive layer along the third direction is larger than the dimension of the first magnet along the third direction, and the third direction is perpendicular to the first direction and the second direction.

5. The driving device according to claim 1, characterized in that, The first outer magnetic adhesive layer is in contact with the outer wall of the first coil.

6. The driving device according to claim 1, characterized in that, The first outer magnetic adhesive layer does not contact the outer wall of the first coil.

7. The driving device according to claim 1, characterized in that, The first circuit section is provided with a coil pad, the lead of the first coil is soldered to the coil pad, and the first outer magnetic adhesive layer covers at least a portion of the coil pad.

8. The driving device according to claim 1, characterized in that, The first outer magnetic adhesive layer is symmetrically arranged with the center line of the first magnet as the reference point. The center line of the first magnet is parallel to the second direction and divides the first magnet into three equal parts along the third direction. The second direction and the third direction are both perpendicular to the first direction and are perpendicular to each other.

9. The driving device according to claim 1, characterized in that, The centroid of the first outer magnetic adhesive layer is offset from the projection of the centroid of the first magnet onto the same plane along the first direction.

10. The driving device according to claim 9, characterized in that, Two first support portions are provided between the first frame and the second frame, located on both sides of the first magnet along a third direction. One of the first support portions is used for guidance and support, and the side of the first support portion along the third direction is the guide side. The other first support portion is only used for support, and the side of the first support portion along the third direction is the support side. The projection of the centroid of the first outer magnetic adhesive layer onto the same plane as the centroid of the first magnet along the first direction is biased toward the guide side, and the third direction is perpendicular to the first direction.

11. The driving device according to claim 10, characterized in that, The portion of the first outer magnetic adhesive layer biased toward the support side has a material reduction hole.

12. The driving device according to claim 10, characterized in that, The thickness of the portion of the first outer magnetic adhesive layer biased toward the guide side is greater than the thickness of the portion biased toward the support side.

13. The driving device according to claim 10, characterized in that, The portion of the first circuit section biased towards the support side has a protrusion and / or the portion biased towards the guide side has a recess.

14. The driving device according to claim 10, characterized in that, The first magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers distributed within the adhesive layer matrix. The density of the magnetic fillers in the portion of the first magnetic adhesive layer biased towards the guide side is greater than that in the portion biased towards the support side.

15. The driving device according to claim 1, characterized in that, The distance between the first magnetic adhesive layer and the first magnet along the first direction is greater than or equal to the distance between the first coil and the first magnet along the first direction.

16. The driving device according to claim 15, characterized in that, The first coil is annular to form a cavity between the inner wall of the first coil and the first circuit section; the first magnetic adhesive layer includes a first outer magnetic adhesive layer and a first inner magnetic adhesive layer. The first outer magnetic adhesive layer is located outside the annular outer wall of the first coil, and the first inner magnetic adhesive layer is disposed in the cavity and / or in the gaps between the wires in the first coil.

17. The driving device according to claim 16, characterized in that, The thickness of the first inner magnetic adhesive layer along the first direction is greater than that of the first outer magnetic adhesive layer.

18. The driving device according to claim 1, characterized in that, The first magnetic adhesive layer includes an adhesive layer matrix and magnetic fillers uniformly distributed within the adhesive layer matrix, wherein the magnetic fillers include soft magnetic powder and / or permanent magnetic powder.

19. The driving device according to claim 18, characterized in that, The adhesive matrix is ​​black.

20. The driving device according to claim 18, characterized in that, The driving device further includes a protective layer, which is fixed to the first magnetic adhesive layer and covers the exposed surface of the first magnetic adhesive layer.

21. A camera module, characterized in that, Includes an optical lens, a photosensitive module, and a driving device as described in any one of claims 1 to 20; The optical lens is disposed in one of the first frame or the second frame and is used to receive and emit light along its own optical axis. The photosensitive module is disposed in the other of the first frame or the second frame, and is used to receive the light emitted from the optical lens for imaging.

22. A method for manufacturing a driving device, applicable to the driving device according to claim 1, characterized in that, Including the following steps: a. Fix the first coil to the first circuit section; b. Apply magnetic adhesive to the first circuit section and cure it to form a first magnetic adhesive layer; c. Fix the first circuit part to the second frame, and fix the first magnet to the first frame; d. The first frame is suspended from the second frame by a support member, such that the first magnet and the first coil are spaced apart along the first direction, and the first magnetic adhesive layer and the first magnet are magnetically attracted along the first direction.

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