Control device and method and storage medium

Abstract

The invention relates to a control device and method and a storage medium. The control device comprises a prism assembly, a height adjusting assembly, a bearing structure and a horizontal adjusting mechanism. The prism assembly comprises a first prism module and a second prism module which can rotate; the height adjusting assembly is detachably installed at the lower end of the prism assembly. The bearing structure is used for bearing a wafer, and the horizontal adjusting mechanism is installed on the bearing structure; when the first prism module is rotated, the horizontal plane of the bearing structure is adjusted through the horizontal adjusting mechanism, so that the first prism module sends a vertical reference beam to the wafer; and when the second prism module is rotated, the height is adjusted through the height adjusting assembly, so that the second prism module and the first prism module form an orthogonal light path. Therefore, mechanical errors generated by rotation of the prism can be detected in real time when suction nozzles of different specifications are replaced, and clear imaging is ensured.

Description

Technical Field

[0001] This application relates primarily to the field of semiconductor equipment, and more particularly to a control device, method, and storage medium. Background Technology

[0002] With the rapid development of semiconductor technology, the market has placed higher demands on the compatibility and adaptability of D2W (Die to Wafer) equipment. It requires compatibility with chips of various sizes and to achieve Class 1 cleanliness levels to avoid adverse effects of external contaminants on chip performance.

[0003] To enable product switching between different sizes, components such as the vision system, ejector pins, and nozzles of the D2W equipment need to be automatically replaced and adjusted. To ensure high-precision placement of the equipment, the vision system is subject to extremely high requirements during product switching. Therefore, in order to ensure the accuracy requirements of the vision system, it is necessary to conduct offline inspection and adjustment of the vision system.

[0004] However, during offline testing and adjustment, the camera of the vision system needs to adapt to chips of different sizes when switching fields of view. At this time, it is affected by factors such as mechanical structure movement gaps, component assembly errors and power transmission fluctuations, which can easily generate mechanical errors. This can directly lead to the offset of the vision positioning reference, causing chip placement deviation, and in severe cases, it may cause chip damage or packaging failure.

[0005] On the other hand, the nozzle is in direct contact with the chip, and the clarity of the nozzle's imaging directly affects the accuracy of the vision system's recognition. However, the nozzle's specifications need to be changed in sync with the chip size. Since different specifications of nozzles have different structural dimensions and material characteristics, the imaging optical path of the vision system may change after replacement. At this time, it is impossible to ensure the clarity of the new specification nozzle, which further restricts the device's placement accuracy. Summary of the Invention

[0006] One objective of this application is to provide a control device, method, and storage medium that solves the problems in the prior art of not being able to detect mechanical errors generated when the camera switches fields of view and not being able to ensure image clarity when changing to different sizes of nozzles.

[0007] According to one aspect of this application, a control device is provided, the device comprising: a prism assembly, a height adjustment assembly, a support structure, and a horizontal adjustment mechanism;

[0008] The prism assembly includes a rotatable first prism module and a second prism module.

[0009] The height adjustment component is detachably mounted on the lower end of the prism component;

[0010] The support structure is used to support the wafer, and the horizontal adjustment mechanism is mounted on the support structure;

[0011] When the first prism module is rotated, the horizontal plane of the support structure is adjusted by the horizontal adjustment mechanism so that the first prism module sends a vertical reference beam to the wafer;

[0012] When the second prism module is rotated, the height is adjusted by the height adjustment component so that the second prism module and the first prism module form an orthogonal optical path.

[0013] Optionally, the height component includes a first height adjustment structure and a second height adjustment structure;

[0014] The first height adjustment mechanism is installed on the first prism module and is used to adjust the height of the first prism module;

[0015] The second height adjustment mechanism is installed on the second prism module and is used to adjust the height of the second prism module.

[0016] Optionally, the control device includes a spectral confocal module detachably connected to the lower end of the prism assembly. When the first prism module is rotated, the spectral confocal module is used to measure the height between the first prism module and the wafer. When the second prism module is rotated, the spectral confocal module is used to detect the generated mechanical error.

[0017] Optionally, a clamping structure is installed at the lower end of the prism assembly to fix the spectral confocal module.

[0018] Optionally, the control device includes a controller connected to the spectral confocal module and the height adjustment component, used to determine whether the requirements for optical error decomposition are met based on the mechanical error detected by the spectral confocal module; if not, the controller controls the height adjustment component to perform lifting and lowering movements to compensate for the error.

[0019] Optionally, the height adjustment assembly includes a guide mechanism and a ruler. The guide mechanism includes a pin groove and a pin for cooperating to provide the direction of the lifting movement, and the ruler is used to determine the amount of adjustment of the lifting movement.

[0020] According to another aspect of this application, a control method using the aforementioned control device is also provided, the method comprising:

[0021] Rotate the first prism module and adjust the horizontal plane of the support structure through the horizontal adjustment mechanism so that the first prism module sends a vertical reference beam to the wafer;

[0022] Rotate the second prism module to control the height adjustment component to perform lifting and lowering movements, thereby adjusting the height of the second prism module so that the second prism module and the first prism module form orthogonal optical paths.

[0023] Optionally, adjusting the horizontal plane of the load-bearing structure via the horizontal adjustment mechanism includes:

[0024] The height between the first prism module and the wafer is detected by the spectral confocal module.

[0025] The horizontal adjustment mechanism adjusts the horizontal plane of the support structure according to the detected height so that the wafer adsorbed on the support structure is perpendicular to the first prism module.

[0026] Optionally, controlling the height adjustment component to perform lifting and lowering movements includes:

[0027] The mechanical error generated during the rotation of the second prism module is detected by the spectral confocal module.

[0028] Based on the mechanical error, it is determined whether the requirements for optical error decomposition are met. If not, the height adjustment component is controlled to perform lifting and lowering movements to compensate for the error.

[0029] Optionally, the method further includes:

[0030] The spectral confocal module acquires the height data at the current imaging point on the wafer to determine the optimal position of the prism assembly at the optimal imaging point.

[0031] The height adjustment amount of the prism assembly is determined based on the optimal position and the depth of field of the prism assembly.

[0032] The height adjustment component is controlled to move up and down according to the height adjustment amount.

[0033] According to another aspect of this application, a computer-readable storage medium is also provided, having stored thereon computer-readable instructions that can be executed by a processor to implement the control method as described above.

[0034] Compared with existing technologies, this application provides a control device comprising: a prism assembly, a height adjustment assembly, a support structure, and a horizontal adjustment mechanism; the prism assembly includes a rotatable first prism module and a second prism module; the height adjustment assembly is detachably mounted on the lower end of the prism assembly; the support structure supports a wafer, and the horizontal adjustment mechanism is mounted on the support structure; when the first prism module is rotated, the horizontal plane of the support structure is adjusted by the horizontal adjustment mechanism to allow the first prism module to send a vertical reference beam to the wafer; when the second prism module is rotated, the height is adjusted by the height adjustment assembly to ensure that the second prism module and the first prism module form orthogonal optical paths. This ensures that mechanical errors caused by prism rotation can be detected in real time when changing different sized nozzles and ensures clear imaging. Attached Figure Description

[0035] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings, wherein:

[0036] Figure 1 A schematic diagram of a control device structure provided according to one aspect of this application is shown;

[0037] Figure 2 This diagram shows a schematic representation of the height adjustment component in one embodiment of the present application.

[0038] Figure 3 This illustration shows a vertical diagram of the prism assembly and the wafer in one embodiment of the present application.

[0039] Figure 4 This is a visual schematic diagram showing the nozzle after switching between different products in one embodiment of this application;

[0040] Figure 5 A schematic diagram of a control method provided according to another aspect of this application is shown.

[0041] The same or similar reference numerals in the accompanying drawings represent the same or similar parts. Detailed Implementation

[0042] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0043] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein, and therefore this application is not limited to the specific embodiments disclosed below.

[0044] In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0045] Furthermore, the terms “up,” “down,” “left,” “right,” “top,” “bottom,” “horizontal,” and “vertical” used in the following description should be understood as the orientations shown in the paragraph and related figures. This relative terminology is for illustrative purposes only and does not imply that the described device must be manufactured or operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] It is understood that although terms such as “first,” “second,” “third,” etc., may be used here to describe various pipes, channels, components, areas, layers, and / or parts, these components, areas, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different pipes, channels, components, areas, layers, and / or parts.

[0047] Figure 1 The diagram shows a control device structure according to one aspect of this application, the device including: a prism assembly 10, a height adjustment assembly 20, a support structure 30 and a horizontal adjustment mechanism 40.

[0048] The prism assembly 10 includes a rotatable first prism module 101 and a second prism module 102; the height adjustment component 20 is detachably mounted on the lower end of the prism assembly 10; the support structure 30 is used to support the wafer 50, and the horizontal adjustment mechanism 40 is mounted on the support structure 30; when the first prism module 101 is rotated, the horizontal plane of the support structure 30 is adjusted by the horizontal adjustment mechanism 40 so that the first prism module 101 sends a vertical reference beam to the wafer 50; when the second prism module 102 is rotated, the height is adjusted by the height adjustment component 20 so that the second prism module 102 and the first prism module 101 form an orthogonal optical path.

[0049] The prism assembly comprises two rotatable prism modules, forming a vision system. Each prism module includes a camera, a lens barrel, and a prism. The two prism modules can be fastened together with screws.

[0050] When it is necessary to change to a different size nozzle, the optical path length of the vision system changes, affecting the clarity of the image. The first prism module 101 can be used for benchmark calibration first, and then the second prism module 102 and the first prism module 101 can be adjusted to ensure clear imaging.

[0051] It is determined whether the first prism module 101 is perpendicular to the support structure 30. If it is not perpendicular, the horizontal plane of the support structure 30 is adjusted by the horizontal adjustment structure 40 installed on the support structure 30, so as to ensure that the wafer 50 adsorbed on the support structure 30 is perpendicular to the first prism module 101. That is, the first prism module 101 is installed in the vertical reference optical path, so as to emit a reference beam to the wafer.

[0052] The second prism module 102 is rotatable, such as rotating in the vertical direction. Based on the mechanical error caused by the rotation, the height of the first prism module 101 and the second prism module 102 is adjusted by the height adjustment component 20 to compensate for the mechanical error, so that the first prism module 101 and the second prism module 102 form an orthogonal optical path. This ensures that when changing to different sizes of nozzles, the image is clear after compensation by the orthogonal optical path formed by the two prisms.

[0053] In one embodiment of this application, as Figure 2 As shown, the height component 20 includes a first height adjustment structure 201 and a second height adjustment structure 202; the first height adjustment mechanism 201 is mounted on the first prism module 101 and is used to adjust the height of the first prism module 101; the second height adjustment mechanism 202 is mounted on the second prism module 102 and is used to adjust the height of the second prism module 102.

[0054] The rotatable double prism module is designed with an independent height adjustment structure. The height of the first prism module 101 is adjusted via a first height adjustment mechanism 201 to bring its optical path parameters to calibrated values. The height of the second prism module 102 is adjusted via a second height adjustment mechanism 202 to match the optical path of the second prism module 102 with that of the first prism module 101, ensuring clear imaging by the vision system. The first and second height adjustment mechanisms 201 and 202 can be screw-type adjustment mechanisms, electric push-rod type adjustment mechanisms, etc.

[0055] In one embodiment of this application, the control device includes a spectral confocal module 60 detachably connected to the lower end of the prism assembly. When the first prism module 101 is rotated, the spectral confocal module 60 is used to measure the height between the first prism module 101 and the wafer 50. When the second prism module 102 is rotated, the spectral confocal module 60 is used to detect the generated mechanical error.

[0056] Rotate the first prism module 101, and measure the height between the first prism module 101 and the wafer 50 through the spectral confocal module 60. Then, the horizontal plane of the wafer 50 adsorbed on the support structure 30 can be adjusted by the horizontal adjustment structure 40. For example, if the wafer is tilted and there is a different value between it and the first prism module 101, it can be adjusted to keep the first prism module 101 perpendicular to the wafer 50, thus completing the benchmark verification.

[0057] The supporting structure 30 can be a chuck, and the horizontal adjustment structure 40 can be multiple studs, such as studs installed in three positions on the chuck. When the first prism module 101 rotates, the height difference on the wafer horizontal plane is measured by the spectral confocal module 60, and the height of the studs is adjusted. Three-point leveling can be used.

[0058] The spectral confocal module 60 detects the mechanical error during the rotation of the second prism module 102. Based on the mechanical error data, the height of the prism module is adjusted through a first height adjustment structure / second height adjustment mechanism, thereby matching the optical path of the second prism module 102 with that of the first prism module 101 to ensure clear imaging by the vision system. The mechanical error includes angular or displacement deviations generated during the rotation of the prism modules; for example, one prism module may tilt upwards while the other tilts downwards.

[0059] In one embodiment of this application, a clamping structure is installed at the lower end of the prism assembly for fixing the spectral confocal module.

[0060] Each prism is equipped with a clamping structure to secure the spectral confocal module. This clamping structure includes locking bolts, which allow for detachable fixing of the spectral confocal module by tightening or loosening them. The spacing between the prism and the wafer is within the operating range of the spectral confocal module, for example, 1.7 ± 0.75 mm. This ensures that the height adjustment mechanism matches the working spacing, preventing the spacing from exceeding the operating range after adjustment.

[0061] In one embodiment of this application, the height adjustment assembly includes a guide mechanism and a ruler. The guide mechanism includes a pin groove and a pin for cooperating to provide the direction of the lifting movement, and the ruler is used to determine the adjustment amount of the lifting movement.

[0062] The pin is fixed to the housing of the height adjustment component. The pin groove is aligned with the lifting direction. The pin is inserted into the pin groove for sliding fit. The pin groove and pin machined in the workpiece serve as guides to constrain the vertical lifting direction and prevent horizontal deviation. The ruler head is fixed to the fixed end of the height adjustment component. The reading reference plane is aligned with the lifting trajectory of the prism module. A micrometer head can be used to adjust the micrometer head to determine the adjustment amount and synchronously feed it back to the controller.

[0063] In a specific embodiment of this application, the aforementioned control device can be used for D2W prism rotation detection and adjustment. The control device includes a vision system with a first prism module, a second prism module, a spectral confocal module, a chuck, a horizontal adjustment mechanism, a first height adjustment module for the first prism module, and a second height adjustment module for the second prism module. The vision system includes the first and second prism modules. The spectral confocal module, the first height adjustment module, and the second height adjustment module are fixed to the vision system and removed from the vision system after detection and adjustment are completed. The chuck serves as a support structure, with the wafer adsorbed on it, and multiple horizontal adjustment mechanisms are fixed to the chuck, thereby enabling wafer leveling.

[0064] In one embodiment of this application, the control device includes: a controller (not shown) connected to the spectral confocal module and the height adjustment component, used to determine whether the requirements for optical error decomposition are met based on the mechanical error detected by the spectral confocal module; if not, to control the height adjustment component to perform lifting and lowering movements for error compensation.

[0065] The controller determines whether the optical error decomposition requirements are met. If they are met, no adjustment is needed. If not, the controller calculates compensation based on the mechanical error and sends a lifting command to the height adjustment component. The height adjustment component then performs the lifting motion to offset the mechanical error. By determining the optical error decomposition requirements, the controller ensures that the height adjustment component's actions only address mechanical errors, avoiding the impact of ineffective adjustments on the stability of the optical path.

[0066] Adjust the chuck 30 horizontally using the first prism module 101 as a reference, making the chuck perpendicular to the first prism module. Measure whether the second prism module 102 and the chuck are perpendicular. If not, measure the mechanical error caused by the rotation of the second prism module 102. Adjust the height of the prism using the height adjustment component, and then determine again whether the first prism module 101 and the second prism module 102 form orthogonal optical paths. Figure 3 The vertical schematic diagram is shown.

[0067] Specifically, the second prism is rotated, and the height value measured by spectral confocal measurement is used to adjust the leveling mechanism to make the second prism perpendicular to the wafer adsorbed on the chuck. The height difference measured by spectral confocal measurement during prism rotation is used for judgment; if the height difference is ≤3µm, it can be considered perpendicular. After the wafer is adsorbed on the high-precision chuck, it is assumed to be an absolute water surface. The first prism is rotated to take three points and level the chuck.

[0068] Rotate the second prism and measure the mechanical error introduced by the prism rotation using spectral confocal measurement. Determine if the requirements for optical error decomposition are met. The mechanical error caused by prism rotation must not exceed 3µm. After chuck leveling, judge the height difference by measuring the spectral confocal measurement of the rotating prism. If the difference within the stroke does not exceed 3µm, the requirement is considered met.

[0069] Adjust the first and second height adjustment modules to find the optimal imaging point. After finding the optimal imaging point, adjust the distance upwards or downwards by half the depth of field (ensuring the adjustment directions of the first and second prisms are consistent). This ensures that the wafer is clearly imaged simultaneously at close depth-of-field positions using both the first and second prisms. Simulate actual working conditions to ensure clear imaging at these close depth-of-field positions.

[0070] like Figure 4 The diagram shows the visual representation of changing the suction nozzle when switching between different products. The two blank rectangles represent the depth of field of the two prisms. The object being tested needs to be within one of the two blank rectangles to achieve a clear image. The first two blank rectangles represent the state without depth of field adjustment. The first image shows that a clear image can be achieved in this state. The second image shows that after changing the suction nozzle, the flatness and parallelism of the nozzle affect the image, making it impossible to achieve a clear image simultaneously. Therefore, the depth of field needs to be adjusted to a horizontal level (the third image) to ensure a clear image even after changing the suction nozzle.

[0071] Figure 5 The diagram illustrates a control method according to another aspect of this application, using the aforementioned control device, the method comprising: steps S11 to S12.

[0072] Step S11: Rotate the first prism module and adjust the horizontal plane of the support structure through the horizontal adjustment mechanism so that the first prism module sends a vertical reference beam to the wafer.

[0073] The horizontal adjustment mechanism is used to adjust the horizontal plane of the supporting structure and correct the pitch or tilt error in the horizontal direction. The first prism module is used to emit a vertical reference beam to the wafer after attitude calibration, providing a reference for the optical path matching of the subsequent second prism module.

[0074] Step S12: Rotate the second prism module and control the height adjustment component to perform lifting and lowering movements to adjust the height of the second prism module so that the second prism module and the first prism module form an orthogonal optical path.

[0075] Based on the mechanical error caused by the rotation of the second prism module, the height of the first and second prisms is adjusted by a height adjustment structure to compensate for the mechanical error, so that the first and second prisms form an orthogonal optical path; thus, it can be ensured that when changing to different specifications of nozzles, the image is clear after compensation by the orthogonal optical path formed by the two prisms.

[0076] In one embodiment of this application, in step S11, the height between the first prism module and the wafer is detected by the spectral confocal module; the horizontal adjustment mechanism adjusts the horizontal plane of the support structure according to the detected height so that the wafer adsorbed on the support structure is perpendicular to the first prism module.

[0077] The spectral confocal module detects the height data between the first prism module and the wafer surface. It can collect the height of multiple feature points such as the edge or center of the wafer, compare the height data of each feature point, and determine whether there is a height difference. If the height difference is greater than a preset threshold (e.g., 3µm), the horizontal adjustment mechanism calculates the tilt angle based on the height difference, and then adjusts the corresponding support points of the bearing structure in a targeted manner until the wafer surface is horizontal and perpendicular to the first prism module.

[0078] In one embodiment of this application, in step S12, the mechanical error generated when the second prism module rotates is detected by the spectral confocal module; based on the mechanical error, it is determined whether the requirements for optical error decomposition are met; if not, the height adjustment component is controlled to perform lifting and lowering movements to compensate for the error.

[0079] The system determines whether the mechanical error detected by the spectral confocal module meets the requirements for optical error decomposition. If it does, no adjustment is needed. If not, a compensation amount is calculated based on the mechanical error, and a lifting command is sent to the height adjustment component. The height adjustment component then performs the lifting motion to offset the mechanical error. By determining the requirements for optical error decomposition, the system ensures that the action of the height adjustment component is only aimed at mechanical errors, avoiding the impact of ineffective adjustments on the stability of the optical path.

[0080] The spectral confocal module can perform two functions in one: it can measure the height of the first prism module and the wafer to detect the wafer tilt state, and it can also detect mechanical errors without the need for additional detection components, thus simplifying the system structure.

[0081] In one embodiment of this application, the height data at the current imaging point of the wafer can also be obtained through the spectral confocal module to determine the optimal position of the prism assembly at the optimal imaging point; the height adjustment amount of the prism assembly is determined according to the optimal position and the depth of field of the prism assembly; and the height adjustment assembly is controlled to move up and down according to the height adjustment amount.

[0082] The horizontal adjustment mechanism completes the vertical alignment of the wafer and the prism assembly. The spectral confocal module collects the height data of the current imaging point on the wafer and simultaneously acquires imaging quality data. Based on the height and imaging quality data, the optimal position of the prism assembly corresponding to the optimal imaging point is determined. The optimal imaging point refers to the wafer surface point where the imaging sharpness meets the preset index, and the corresponding height of the prism assembly and the wafer is the optimal position. The depth-of-field parameter of the prism is known. The depth-of-field parameter of the prism assembly is called to calculate the height adjustment amount. The adjustment amount = optimal position - current height of the prism assembly, and satisfies the condition that optimal position - depth of field / 2 ≤ adjusted height ≤ optimal position + depth of field / 2. This ensures that the adjusted position of the prism assembly falls within the depth of field range, avoiding imaging blur caused by mechanical errors. The height adjustment assembly performs the lifting and lowering movement, and the adjustment amount is fed back in real time by the ruler. Adjustment stops when the target adjustment amount is reached.

[0083] According to another aspect of this application, a computer-readable storage medium is also provided, having stored thereon computer-readable instructions that can be executed by a processor to implement the control method as described above.

[0084] When the control method is implemented as a computer program, it can also be stored as an article of manufacture in a computer-readable storage medium. For example, a computer-readable storage medium may include, but is not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic stripes), optical discs (e.g., compact discs (CDs), digital multifunction discs (DVDs)), smart cards, and flash memory devices (e.g., electrically erasable programmable read-only memory (EPROM), cards, sticks, key drives). Furthermore, the various storage media described herein can represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" may include, but is not limited to, wireless channels and various other media (and / or storage media) capable of storing, containing, and / or carrying code and / or instructions and / or data.

[0085] It should be understood that the embodiments described above are merely illustrative. The embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For hardware implementation, the processor may be implemented within one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions described herein, or combinations thereof.

[0086] Some aspects of this application can be executed entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. The aforementioned hardware or software may be referred to as a "data block," "module," "engine," "unit," "component," or "system." The processor may be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DAPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. Furthermore, aspects of this application may manifest as computer products residing in one or more computer-readable media, including computer-readable program code. For example, computer-readable media may include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic tapes, etc.), optical discs (e.g., compressed CDs, digital multifunction DVDs, etc.), smart cards, and flash memory devices (e.g., cards, sticks, key drives, etc.).

[0087] A computer-readable storage medium may contain a propagated data signal containing computer program encoding, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and so on, or suitable combinations thereof. A computer-readable storage medium can be any other type of computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program encoding located on the computer-readable medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, radio frequency signals, or similar media, or any combination of the above media.

[0088] The basic concepts have been described above. Obviously, for those skilled in the art, the above disclosure is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0089] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0090] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

Claims

1. A control device, characterized in that, The device includes: a prism assembly, a height adjustment assembly, a load-bearing structure, and a horizontal adjustment mechanism; The prism assembly includes a rotatable first prism module and a second prism module. The height adjustment component is detachably mounted on the lower end of the prism component; The support structure is used to support the wafer, and the horizontal adjustment mechanism is mounted on the support structure; When the first prism module is rotated, the horizontal plane of the support structure is adjusted by the horizontal adjustment mechanism so that the first prism module sends a vertical reference beam to the wafer; When the second prism module is rotated, the height is adjusted by the height adjustment component so that the second prism module and the first prism module form an orthogonal optical path.

2. The control device according to claim 1, characterized in that, The height component includes a first height adjustment structure and a second height adjustment structure; The first height adjustment mechanism is installed on the first prism module and is used to adjust the height of the first prism module; The second height adjustment mechanism is installed on the second prism module and is used to adjust the height of the second prism module.

3. The control device according to claim 1, characterized in that, The control device includes a spectral confocal module detachably connected to the lower end of the prism assembly; When the first prism module is rotated, it is used to measure the height between the first prism module and the wafer; When the second prism module is rotated, the spectral confocal module is used to detect the generated mechanical errors.

4. The control device according to claim 3, characterized in that, The lower end of the prism assembly is fitted with a clamp structure for fixing the spectral confocal module.

5. The control device according to claim 3, characterized in that, The control device includes a controller connected to the spectral confocal module and the height adjustment component, used to determine whether the requirements for optical error decomposition are met based on the mechanical error detected by the spectral confocal module; if not, the controller controls the height adjustment component to perform lifting and lowering movements to compensate for the error.

6. The control device according to claim 1, characterized in that, The height adjustment assembly includes a guide mechanism and a ruler. The guide mechanism includes a pin groove and a pin for cooperating to provide the direction of the lifting movement. The ruler is used to determine the adjustment amount of the lifting movement.

7. A control method using the control device as described in any one of claims 1 to 6, characterized in that, The method includes: Rotate the first prism module and adjust the horizontal plane of the support structure through the horizontal adjustment mechanism so that the first prism module sends a vertical reference beam to the wafer; Rotate the second prism module to control the height adjustment component to perform lifting and lowering movements, thereby adjusting the height of the second prism module so that the second prism module and the first prism module form orthogonal optical paths.

8. The method according to claim 7, characterized in that, The adjustment of the horizontal plane of the load-bearing structure via the horizontal adjustment mechanism includes: The height between the first prism module and the wafer is detected by the spectral confocal module. The horizontal adjustment mechanism adjusts the horizontal plane of the support structure according to the detected height so that the wafer adsorbed on the support structure is perpendicular to the first prism module.

9. The method according to claim 7, characterized in that, The control of the height adjustment component to perform lifting and lowering movements includes: The mechanical error generated during the rotation of the second prism module is detected by the spectral confocal module. Based on the mechanical error, it is determined whether the requirements for optical error decomposition are met. If not, the height adjustment component is controlled to perform lifting and lowering movements to compensate for the error.

10. The method according to claim 7, characterized in that, The method further includes: The spectral confocal module acquires the height data at the current imaging point on the wafer to determine the optimal position of the prism assembly at the optimal imaging point. The height adjustment amount of the prism assembly is determined based on the optimal position and the depth of field of the prism assembly. The height adjustment component is controlled to move up and down according to the height adjustment amount.

11. A computer-readable storage medium storing computer-readable instructions thereon, characterized in that, The computer-readable instructions can be executed by a processor to implement the method as described in any one of claims 7 to 10.

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