A regulating device, a regulating method and a server board

Abstract

The application discloses a kind of adjusting device, adjusting method and server board, it is related to controller adjustment technical field, adjusting device is applied to server board card, the adjusting device includes: load monitoring module obtains the load information of each device of controller in target detection period;Temperature monitoring module obtains the first temperature information of controller and the second temperature information of each device in target detection period;Data processing module determines the load correction coefficient of each device according to load information and second temperature information respectively;According to the load correction coefficient of each device and first temperature information, the adjustment coefficient of controller is obtained;Signal output module generates adjustment signal according to adjustment coefficient, so that protection circuit is protected according to adjustment signal to controller.The adjusting device of the application can dynamically track the temperature change of controller, and synchronously dynamically output adjustment signal to guarantee that controller works stably.

Description

Technical Field

[0001] This application relates to the field of field controller adjustment technology, and in particular to an adjustment device, adjustment method, and server board. Background Technology

[0002] The operating current of the controller varies under different temperatures and operating conditions. The controller has a temperature characteristic that the operating current increases with the increase of temperature. This characteristic means that when the controller is handling the same business, the current required at high temperatures is significantly greater than the current required at normal temperatures.

[0003] At the same time, as the temperature rises, the current increases, and the voltage drop in the controller's circuit path also increases. If the current increase is too large, the voltage drop in the circuit path will be too large, and the voltage at the controller's input pin may drop out of its normal operating voltage range, causing the controller to malfunction and the service to be interrupted.

[0004] The fixed-value power supply method used in related technologies cannot guarantee that the controller will always operate stably under ideal voltage and high-temperature conditions. Therefore, the driver and protection flexibility of server boards using the controller is poor, which may lead to system crashes and reduce the reliability of the server in severe cases. Summary of the Invention

[0005] This application provides an adjustment device, adjustment method, and server board to at least solve the problem in the related art where the fixed overcurrent protection value of the controller in the server board easily causes system interruption.

[0006] In a first aspect, this application provides an adjustment device applied to a server board, the server board including a controller and a protection circuit connected to the controller.

[0007] The regulating device includes:

[0008] The load monitoring module is used to obtain the load information of each device of the controller during the target detection period;

[0009] The temperature monitoring module is used to obtain the first temperature information of the controller and the second temperature information of each device during the target detection period.

[0010] The data processing module is used to determine the load correction coefficient of each of the devices based on the load information and the second temperature information; and to obtain the adjustment coefficient of the controller based on the load correction coefficient of each device and the first temperature information.

[0011] The signal output module is used to generate an adjustment signal based on the adjustment coefficient, so that the protection circuit can protect the controller according to the adjustment signal.

[0012] Secondly, this application also provides a server board, which includes the adjustment device of the first aspect.

[0013] Thirdly, this application also provides an adjustment method using the adjustment device described in the first aspect, the adjustment method comprising:

[0014] Obtain the load information of each device in the controller during the target detection period;

[0015] Obtain the first temperature information of the controller and the second temperature information of each device during the target detection period;

[0016] The load correction factor for each device is determined based on the load information and the second temperature information.

[0017] The adjustment coefficient of the controller is obtained based on the load correction coefficient of each device and the first temperature information;

[0018] An adjustment signal is generated based on the adjustment coefficient, so that the protection circuit protects the controller according to the adjustment signal.

[0019] The regulating device of this application realizes the coordinated regulation of load and temperature. By collecting the load and second temperature information of the device, the regulation coefficient of the protection circuit is dynamically corrected according to the actual working state of the controller, so as to ensure that the protection circuit can respond to the state changes of the controller in a timely manner, thereby improving the accuracy of protection control and ensuring the stable operation of the controller. Attached Figure Description

[0020] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the power supply circuit for the controller of the related technology;

[0022] Figure 2 This is a schematic diagram illustrating the calculation method for overcurrent protection values ​​in related technologies.

[0023] Figure 3 This is a schematic diagram of the frame of the adjustment device according to the first embodiment of this application;

[0024] Figure 4 This invention provides a schematic diagram of the frame of an adjustment device according to an optional embodiment of the present application.

[0025] Figure 5This diagram illustrates a flow chart of a data processing module performing temperature correction according to an optional embodiment of this application.

[0026] Figure 6 A flowchart illustrating an adjustment method according to another embodiment of this application is shown;

[0027] Figure 7 A schematic diagram of the structure of a server board according to another embodiment of this application is shown. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0029] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0030] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Figure 1 and Figure 2 The diagram shows a power supply schematic for the controller in a server board of the related technology. In the related technology, the controller is driven and protected by means of power supply circuit, current protection and temperature control.

[0032] like Figure 1 As shown, in related technologies, the power supply path from the voltage regulator to the controller on the server board is: voltage regulator, printed circuit board and controller. In the design of the power supply circuit, the impedance on this path will be minimized as much as possible to reduce the voltage drop and power loss on the path.

[0033] like Figure 2 As shown, the voltage regulator reports the sensed current value to the voltage regulator control module via the current sensing line in each cycle. The voltage regulator control module uses a comparison voltage regulator to compare the sensed current value. and the set overcurrent protection value (Over Current Protection, OCP value) The overcurrent protection value is generally 1.2 times the controller's maximum current value. After comparison, a control signal is output. When the sensed current value is less than the overcurrent protection value, the voltage regulator control module does not take any action and normally controls the voltage regulator to output the voltage and current required by the controller. However, when the sensed current value is greater than the set overcurrent protection value, the voltage regulator control module immediately shuts off the voltage regulator to stop the power supply, preventing damage to the voltage regulator or controller due to overcurrent.

[0034] The existing controller's temperature control method is as follows: read the controller's operating temperature, and when the controller's operating temperature exceeds the set temperature threshold, control the fan to rotate at full speed to reduce the controller's temperature and prevent the controller from stopping due to overheating.

[0035] The above-mentioned design for the controller's drive circuit and overload protection has the following drawbacks:

[0036] 1. Poor flexibility in setting OCP values.

[0037] The controller has a temperature characteristic that the operating current increases with increasing temperature. This characteristic means that when the controller is handling the same business, the current required at high temperatures is significantly greater than the current required at normal temperatures.

[0038] The existing OCP value is set based on the maximum current value of the controller at normal temperature. This OCP value is fixed. The current value required for the controller to work normally at high temperature may trigger the OCP value, causing the voltage regulator control module to shut down the voltage regulator and stop the controller from working.

[0039] If the OCP value is set based on the controller's maximum current at high temperatures, and the OCP threshold is set too high, then if an abnormal overcurrent occurs in the circuit, such as a component or controller failure, the voltage regulator control module will not be able to detect the overcurrent in time and shut down the voltage controller in time. This will lead to the fault being aggravated and serious consequences such as board burning or controller burnout.

[0040] 2. Poor flexibility in voltage setting.

[0041] In related technologies, the controller's operating voltage is also output in a fixed manner. However, since the controller's operating current varies under different temperatures and operating conditions, and the voltage drop of the same circuit path also varies at different temperatures, the voltage at the controller's input pin fluctuates. The voltage-driven method of related technologies cannot guarantee that the controller will always operate at the ideal voltage, which reduces the controller's performance.

[0042] 3. The temperature control method has poor precision.

[0043] In related technologies, the temperature control method involves maintaining the fan speed at its initial speed until the controller's operating temperature reaches the threshold. Once the operating temperature reaches the threshold, the fan immediately rotates at full speed. During this process, the fan's power consumption increases sharply, causing a sudden increase in the power supply current of the server board, which puts pressure on the system's power supply capacity. The system voltage and current fluctuate suddenly, and this fluctuation will directly affect the controller's drive, leading to serious consequences such as board burnout or controller burnout.

[0044] Therefore, how to flexibly adjust the drive mode and protection mode in sync with the increase of the controller's operating temperature to ensure the controller works normally without interrupting business and to effectively protect the controller has become an urgent technical problem to be solved.

[0045] In view of this, this application proposes an adjustment device, adjustment method, and server board to solve one or more of the above problems.

[0046] The first embodiment of this application proposes an adjustment device applied to a server board, such as... Figure 3 As shown, the server board includes a controller and a protection circuit connected to the controller. The protection circuit, such as an overcurrent protection circuit, provides protection for the controller. For example, the overcurrent protection circuit is connected in series with the controller.

[0047] The regulating device includes:

[0048] The load monitoring module is used to obtain the load information of each device of the controller during the target detection period;

[0049] The temperature monitoring module is used to obtain the first temperature information of the controller and the second temperature information of each device during the target detection period.

[0050] The data processing module is used to determine the load correction coefficient of each of the devices based on the load information and the second temperature information; and to obtain the adjustment coefficient of the controller based on the load correction coefficient of each device and the first temperature information.

[0051] The signal output module is used to generate an adjustment signal based on the adjustment coefficient, so that the protection circuit can protect the controller according to the adjustment signal.

[0052] The load monitoring module of this application is responsible for collecting the load status of each device in the controller during the target detection period. For example, if the target detection period is 3 minutes, it can collect the computing utilization rate of the controller's DSP module (digital signal processing module) and the read / write frequency ratio of the BRAM module (block random access memory). The temperature monitoring module simultaneously acquires two parts of temperature data: the overall first temperature information of the controller and the second temperature information of each device within the controller. The temperature monitoring module detects the temperature data of the controller within 3 minutes. The data processing module first combines the load information and the corresponding second temperature information of each device to calculate the load correction coefficient of each device; then, based on the load correction coefficients of all devices and the overall first temperature information of the controller, it comprehensively derives the adjustment coefficient used to regulate and protect the controller as a whole. The signal output module generates an adjustment signal based on this adjustment coefficient. After receiving the signal, the protection circuit implements protection for the controller.

[0053] The regulating device of this application realizes the coordinated regulation of load and temperature. By collecting the load and second temperature information of the device, the regulation coefficient of the protection circuit is dynamically corrected according to the actual working state of the controller, so as to ensure that the protection circuit can respond to the state changes of the controller in a timely manner, thereby improving the accuracy of protection control and ensuring the stable operation of the controller.

[0054] In an optional embodiment, the data processing module is further configured to determine a load correction coefficient for each of the devices based on the current ratio of each device, the load information, and the second temperature information, wherein the current ratio is the ratio of the device current to the total current value of the controller.

[0055] This embodiment further refines the functionality of the data processing module. The data processing module introduces the current percentage of each device to determine the load correction coefficient for each device. The current percentage refers to the ratio of the operating current of a single device to the total operating current of the controller. For example, if the DSP module's operating current accounts for 60% of the controller's total current, its current percentage is 0.6. In specific calculations, the data processing module combines this current percentage with the device load information collected by the load monitoring module and the device's second temperature information collected by the temperature monitoring module to calculate the load correction coefficient for each device. This allows the correction coefficient to more comprehensively reflect the device's impact on the controller's total current.

[0056] This embodiment quantifies the contribution weight of different devices to the total current of the controller by introducing a current ratio parameter, adapting to the characteristic of large differences in current consumption of internal devices of the controller, avoiding the imbalance caused by the correction coefficients of low current devices and high current devices, and further improving the accuracy of dynamic protection.

[0057] In an optional embodiment, the data processing module is further configured to determine the device operating state of the device based on the second temperature information, and determine whether to perform device temperature correction based on the device operating state. If the determination result is to confirm the device temperature correction, a temperature correction coefficient between adjacent devices is generated based on the second temperature information and the load correction coefficient.

[0058] The adjustment coefficient is obtained based on the temperature correction coefficient, the load correction coefficient of each of the devices, and the first temperature information.

[0059] The data processing module in this embodiment adds correction logic for temperature coupling between devices. The data processing module first determines the current working state of each device based on the second temperature information of each device, such as whether the temperature is rising, cooling or stabilizing.

[0060] For example, the device operating states include:

[0061] The first device operating state is a state in which the device temperature change value during the target detection period is greater than the maximum value of the target device change value.

[0062] The second device operating state is a state in which the device temperature change value during the target detection period is greater than or equal to the minimum value of the target change value and less than or equal to the maximum value of the target change value; and

[0063] The third device operating state is the state in which the device temperature change value during the target detection period is less than the minimum value of the target change value.

[0064] like Figure 5 As shown, based on the device's operating status, the data processing module determines whether temperature correction is needed for that device. If correction is required, it calculates the temperature correction coefficient between adjacent devices by combining the device's second temperature information and the load correction coefficient. For example, the temperature impact coefficient of a high-heat-generating DSP module on an adjacent BRAM module. Finally, the data processing module combines the temperature correction coefficient, the load correction coefficient of each device, and the overall first temperature information of the controller to comprehensively calculate the controller's adjustment coefficient, ensuring that the adjustment coefficient simultaneously considers the load, its own temperature, and the temperature effects of adjacent devices.

[0065] This embodiment takes into account the thermal coupling effect between internal components of the controller, reduces the correction deviation caused by the temperature influence of adjacent components, and thus improves the adjustment accuracy of the adjustment coefficient.

[0066] In an optional embodiment, the data processing module is further configured to determine the overall operating state of the controller based on the first temperature information, and determine whether to perform global temperature correction based on the overall operating state. If the determination result is to confirm the performance of global temperature correction, the global correction coefficient is adjusted based on the second temperature information; and the adjustment coefficient is adjusted based on the adjusted global correction coefficient.

[0067] In an optional embodiment, the overall operating state includes:

[0068] The first working state is a state in which the overall temperature change value of the controller during the target detection period is greater than the maximum value of the overall target change value;

[0069] The second operating state is a state in which the overall temperature change value of the controller during the target detection period is greater than or equal to the minimum value of the overall target change value and less than or equal to the maximum value of the overall target change value; and

[0070] The third working state is a state in which the overall temperature change value of the controller during the target detection period is less than the minimum value of the overall target change value;

[0071] The data processing module further determines, based on the first temperature information, that the controller is in one of the first operating state, the second operating state, and the third operating state.

[0072] In this embodiment, the first working state is the heating state, which is a state in which the overall temperature change value during the target detection period increases beyond the overall target change value. For example, the maximum value of the overall target change value is 10℃, and the minimum value of the overall target change value is -10℃. A temperature greater than 10℃ indicates that the controller is in a temperature rise state. The second operating state is the temperature stability state, where the overall temperature change is within the range of the overall target change value, for example, -10℃. A temperature of 10℃ indicates that the controller is in a temperature stable state. The third operating state is the cooling state, which is when the overall temperature change value decreases beyond the overall target change value, for example... A reading of -15℃ indicates that the controller is in a temperature stable state.

[0073] This embodiment adds the function of determining the overall operating status of the controller and correcting the global temperature using the data processing module. Based on the controller's initial temperature information, such as the change in temperature between the current overall temperature and the previous detection period, the data processing module determines the overall operating status of the controller, i.e., whether the controller is in a state of overall temperature increase, overall stability, or overall temperature decrease.

[0074] The data processing module further determines whether global temperature correction is needed based on the overall operating status. If so, it adjusts the specific value of the global correction coefficient by combining the second temperature information of each device.

[0075] For example, under the rising temperature condition, appropriately increase the global correction coefficient h, such as increasing the global weak correction coefficient from "0.5k" to "0.6k" to allow the total coefficient to follow the overall temperature increase more quickly and adapt to the demand for rapid current increase; for example, under the cooling condition, decrease the global weak correction coefficient from "0.5k" to "0.4k" to avoid the total coefficient dropping too quickly and causing false protection; for example, maintain "0.5k" unchanged under the stable condition.

[0076] Considering that excessive overall temperature correction can cause the total coefficient to fluctuate significantly with the overall temperature, thus negating the accuracy of local temperature correction within the module (e.g., if the local temperature of a device has been corrected by 5%, and the overall temperature is corrected by 3%, it can easily lead to an overly large or small adjustment coefficient, increasing the risk of false protection or failure), the data processing unit uses the adjusted global correction coefficient to perform a secondary correction on the adjustment coefficient. This ensures that the adjustment coefficient takes into account the influence of local devices, avoids excessive correction that could cause excessive fluctuations in the current protection value or misjudgment, and prevents control imbalances caused by local device temperature fluctuations or changes in the overall temperature trend, thus ensuring the stable operation of the controller under different operating conditions.

[0077] In an optional embodiment, such as Figure 4 As shown, the signal output module includes:

[0078] The signal output module includes:

[0079] A threshold adjustment unit is used to adjust the overcurrent protection value according to an adjustment coefficient and generate the current adjustment signal, so that the protection circuit protects the controller according to the adjusted overcurrent protection value; and

[0080] A voltage regulation unit is used to generate a voltage regulation signal based on the regulation coefficient and the overcurrent protection value to adjust the overvoltage protection value of the protection circuit.

[0081] The adjustment signal includes one or more of the current adjustment signal and the voltage adjustment signal.

[0082] In this embodiment, the signal output module includes two units: a threshold adjustment unit and a voltage adjustment unit. The threshold adjustment unit receives the adjustment coefficient output from the data processing module, dynamically adjusts the overcurrent protection value of the protection circuit based on this coefficient, and generates a corresponding current adjustment signal. Upon receiving this current adjustment signal, the protection circuit performs overcurrent protection on the controller according to the adjusted overcurrent protection value, preventing damage to the controller due to abnormal current. The voltage adjustment unit combines the adjustment coefficient and the adjusted overcurrent protection value to generate a voltage adjustment signal, which is used to adjust the overvoltage protection value of the protection circuit, preventing damage to the controller due to excessive input voltage. The adjustment signal can be selected from one or more of the current adjustment signal and voltage adjustment signal, depending on the actual operating conditions, and can also be used in conjunction with a heat dissipation adjustment signal.

[0083] This embodiment can achieve dynamic linkage adjustment of overcurrent protection value and overvoltage protection value, avoiding the problem of untimely protection or false protection caused by a single fixed protection threshold.

[0084] In an optional embodiment, the signal output module further includes a speed adjustment unit for generating a heat dissipation adjustment signal based on the adjustment coefficient and the second temperature information to adjust the heat dissipation power of the heat sink, wherein the adjustment signal includes one or more of the current adjustment signal, the voltage adjustment signal, and the heat dissipation adjustment signal.

[0085] In this embodiment, the signal output module includes a speed adjustment unit. The core function of the speed adjustment unit is to comprehensively determine the controller's heat dissipation requirements based on the adjustment coefficient generated by the data processing module and the second temperature information of each component, and generate a corresponding heat dissipation adjustment signal. This heat dissipation adjustment signal is output to the heat sink of the server board, such as a fan. By adjusting the heat dissipation power of the heat sink, such as increasing or decreasing the fan speed, the temperature environment of the controller is controlled. At this time, the adjustment signal may include one or more of current adjustment signals, voltage adjustment signals, and heat dissipation adjustment signals, achieving coordinated control of current protection, voltage protection, and temperature control. This solves the problem of imbalance caused by independent control of voltage, current, and heat dissipation in related technologies, and improves the accuracy of control.

[0086] This embodiment dynamically adjusts the overcurrent protection value, output voltage value, and heat sink power by monitoring the controller temperature change in real time. This solves the problems in related power supply schemes where improper setting of fixed overcurrent protection value leads to premature protection when the controller is in a heated working state, or where the overcurrent protection value is too large and cannot provide timely protection. It also solves the problem of excessive power supply fluctuations and excessive power consumption in the system caused by large-scale adjustment of the heat sink power, which affects the working stability of the controller.

[0087] In an optional embodiment, the current percentage of the device, the load information, the second temperature information, and the load correction factor satisfy the following formula:

[0088] ;

[0089] Where n is the nth device in the controller, and the load correction factor is... The current ratio is The load information is Let n be the nth device in the controller, where the load correction factor is... The current ratio is The load information is , The second temperature information refers to the device's temperature value at that moment. This is the reference temperature value for the device under normal operating conditions, and k is a constant.

[0090] That is, Let be the load correction factor for the nth device. Let n be the current percentage of the nth device. This refers to the second temperature information of the nth device; other definitions can be found elsewhere. In this embodiment, k is a safety redundancy factor. Those skilled in the art can design it according to actual applications; for example, k can be 1.2.

[0091] In an optional embodiment, the second temperature information, the load correction factor, and the temperature correction factor satisfy the following formula:

[0092] ;

[0093] Among them, temperature correction coefficient The load correction factor is , The time temperature value of the device being corrected in the second temperature information. ω is the reference temperature value when the device is in normal operating condition, and ω is a weighting constant.

[0094] In this embodiment, ω is the thermal coupling weighting coefficient, which can be fixed at 0.2. This covers most of the thermal conduction phenomena between adjacent devices within the controller. The actual thermal impact of high-heat-generating devices on adjacent devices is usually between 15% and 25%, and taking the intermediate value of 0.2 can meet most of the requirements.

[0095] In an optional embodiment, the temperature correction coefficient, the first temperature information, and the adjustment coefficient satisfy the following formula:

[0096] ;

[0097] in, For adjustment coefficients, The time temperature value in the first temperature information. The reference temperature value is the temperature at which the controller is in normal operating condition, h is the global correction factor, and k is a constant;

[0098] in, This represents the temperature correction factor for all N devices in the controller. Perform summation.

[0099] In an optional embodiment, the temperature correction coefficient, the global correction coefficient, the first temperature information, and the adjustment coefficient satisfy the following formula:

[0100] ;

[0101] Among them, among them, For adjustment coefficients, The time temperature value in the first temperature information. The reference temperature value is the temperature at which the controller is in normal operating condition, h is the global correction factor, and k is a constant;

[0102] in, This represents the temperature correction factor for all N devices in the controller. Perform summation.

[0103] This embodiment presents specific calculation formulas for various coefficients and overcurrent protection values. First, based on these formulas, the load correction coefficient for each device can be directly calculated. Second, when a high-heat-generating module exists, a temperature correction coefficient between adjacent devices is calculated to correct for the temperature influence of adjacent devices. Then, based on the global correction coefficient and the overall temperature of the controller, calibration is performed to generate an adjustment coefficient that accurately monitors the controller's status, effectively improving adjustment accuracy.

[0104] In an optional embodiment, the adjustment coefficient and the overcurrent protection value Satisfy the following formula:

[0105] ,

[0106] Where k is a constant, This is the maximum current value of the controller.

[0107] This embodiment uses the above formula to dynamically adjust the overcurrent protection value based on the real-time calculation adjustment coefficient, so that the overcurrent protection value can adapt to the load and temperature changes of the controller, which can both avoid triggering false protection under high temperature and high load and respond in time when the current is abnormal.

[0108] In an optional embodiment, the voltage regulation unit is further configured to obtain the impedance value between the output pin of the voltage regulation unit and the input pin of the controller, and adjust the output voltage value output to the controller according to the ideal voltage of the controller, the impedance value and the output current value output by the voltage regulation unit, wherein the output voltage value is less than or equal to the overvoltage protection value.

[0109] In this embodiment, the voltage regulation unit not only adjusts the overvoltage protection value according to the operating state and overcurrent protection value, but also adjusts the output voltage value to the controller according to the controller's operating state. The voltage regulation unit obtains the impedance value between its output pin and the controller's input pin. The voltage regulation unit, combined with the controller's ideal voltage, and the output current value input to the input pin of the controller Finally, the output voltage value is determined, and the adjusted output voltage value must not exceed the overvoltage protection value of the protection circuit to avoid damage to the controller due to excessive voltage.

[0110] Based on the above settings, the voltage regulation unit adjusts the output voltage value in conjunction with the controller's operating status and path impedance, solving the problem of insufficient controller voltage caused by ignoring impedance loss in related technologies. Even when the current increases and the impedance loss increases, the voltage regulation unit's dynamic adjustment of the output voltage value will not cause the output voltage value to drop below the operating voltage at the controller's input pin, thus balancing voltage stability and safety protection, thereby improving the controller's operational stability.

[0111] In an optional embodiment, the output voltage value satisfies the following formula:

[0112] ;in, This refers to the voltage at the controller's input pin. The ideal voltage for the controller. This is the output current value. This is the impedance value.

[0113] For example, impedance value Including the impedance value of the printed circuit board connected in series between the voltage regulation unit and the controller. DC impedance value of ferrite beads For example, the voltage regulation unit can sense the output current value output to the controller pin. .

[0114] For example, if =1.2V, =20A, =0.0051Ω, then =20 × 0.0051 = 0.102V, =1.2 + 0.102 = 1.302V, therefore the voltage regulation unit needs to output 1.302V to ensure that the voltage at the controller's input pin is 1.2V; if If the current is increased to 25A, the output voltage needs to be 1.2 + 25 × 0.0051 = 1.327V. The impedance loss caused by the increase in current is dynamically offset by increasing the output voltage value.

[0115] Based on this adjustment formula, the voltage of the controller input pin under different currents is always equal to the ideal voltage, avoiding the degradation of controller performance caused by voltage fluctuations, ensuring the consistency and accuracy of voltage adjustment under different scenarios, and further improving the stability of the controller's operating voltage. This adjustment scheme is highly reproducible and easy to apply in batches.

[0116] In an optional embodiment, the signal output module is further configured to generate a continuous detection signal for detecting the next target detection period when the determination result is a first working state or a third working state, until the determination result is a second working state, at which point the signal output module stops outputting the continuous detection signal;

[0117] The load monitoring module is also used to obtain load information for the next target detection period based on the continuous detection signal;

[0118] The temperature monitoring module is also used to obtain the first temperature information and the second temperature information for the next target detection period based on the continuous detection signal;

[0119] The data processing module is further configured to determine the load correction coefficient of each device based on the load information of the next target detection period and the second temperature information; and to obtain the adjustment coefficient of the next target detection period based on the load correction coefficient of each device and the first temperature information.

[0120] The signal output module is also used to generate an adjustment signal based on the adjustment coefficient of the next target detection period, so that the protection circuit can protect the controller according to the adjustment signal.

[0121] During the controller's initial target detection period, if the determination result is the first operating state (heating state) or the third operating state (cooling state), the signal output module generates a continuous detection signal; the temperature monitoring module obtains the temperature information for the next target detection period based on the continuous detection signal; the data processing module re-determines the operating state and generates a new adjustment signal, such as increasing the power of the heat sink or increasing the overcurrent protection value if the temperature is rising; the above steps are repeated until the determination result of a certain target detection period is the second operating state where the controller temperature changes stably, at which point the signal output module stops outputting the continuous detection signal and pauses the control.

[0122] For example, if the overall temperature change value of the controller within 3 minutes of the initial target detection period... =+13℃, the data processing module determines that the controller is in the first working state of heating up, the adjustment coefficient is positive, and the adjustment signal is positively adjusted according to the determination result and the adjustment coefficient. The signal output module outputs the adjustment signal. For example, the heat dissipation adjustment signal increases the speed of the heat sink from 30% to 35%, the current adjustment signal increases the overcurrent protection value from 24A to 26A, and the voltage adjustment signal increases the overvoltage protection value.

[0123] Simultaneously, the signal output module also outputs a continuous detection signal, and the temperature monitoring module detects the temperature change during the next 3-minute target detection period. When the temperature reaches +8℃, the data processing module determines that the controller is in the second stable operating state, and then stops outputting the continuous detection signal. The controller operates according to the adjustment signal, that is, it maintains the current heat dissipation adjustment signal, overcurrent protection value and overvoltage protection value to achieve stable operation of the controller.

[0124] It is worth noting that the maximum value of the overall target change value, the minimum value of the overall target change value, the maximum value of the device target change value, and the minimum value of the device target change value in this application can be set according to the controller model. Those skilled in the art can design conventional parameters according to actual applications.

[0125] This embodiment can dynamically track the temperature changes of the controller and gradually adjust it until it reaches equilibrium, avoiding the problem of temperature rebound after a one-time adjustment and avoiding large fluctuations in power supply caused by a one-time adjustment. It only continuously adjusts when the controller is unstable, ensuring that the controller is in a stable temperature state for a long time, avoiding frequent changes in current and voltage caused by temperature fluctuations, improving the overall reliability of the system, and also reducing the computational load of the adjustment device and the adjustment frequency of the hardware module, thus extending the life of the hardware.

[0126] Another embodiment of this application proposes an adjustment method using the adjustment device described in the above embodiments, such as... Figure 6 As shown, the adjustment methods include:

[0127] S10. Obtain the load information of each device of the controller during the target detection period;

[0128] S20. Obtain the first temperature information of the controller and the second temperature information of each device during the target detection period;

[0129] S30. Determine the load correction coefficient for each of the devices based on the load information and the second temperature information;

[0130] S40. Obtain the adjustment coefficient of the controller based on the load correction coefficient of each device and the first temperature information;

[0131] S50. Generate an adjustment signal based on the adjustment coefficient, so that the protection circuit protects the controller according to the adjustment signal.

[0132] In this embodiment, the description of the features of the adjustment device corresponding to the adjustment method in the embodiment can be found in the relevant descriptions of the above embodiments, and will not be repeated here.

[0133] Another embodiment of this application provides a server board that includes the adjustment device described in the above embodiments of this application.

[0134] The adjustment device of this application can be directly applied to server boards, improving the power supply control capability and heat dissipation efficiency of the server boards to the controller, and enhancing the market competitiveness of the server boards.

[0135] In an optional embodiment, such as Figure 7 As shown, the server board also includes a voltage regulator control module, a voltage regulator, a printed circuit board, a controller, a baseboard management controller, protection circuitry, and a heatsink.

[0136] The voltage regulator control module includes a current sensing input terminal 11 and a control signal output terminal 13;

[0137] The voltage regulator includes:

[0138] Current sensing output terminal 12 is connected to current sensing input terminal 11;

[0139] The control signal input terminal 14 is connected to the control signal output terminal 13; and

[0140] The voltage output terminal 15 is connected to the first terminal of the protection circuit;

[0141] The second end of the protection circuit is connected to the first end of the printed circuit board, and the second end of the printed circuit board is connected to the input pin 16 of the controller.

[0142] The voltage regulator control module also includes:

[0143] Voltage sensing terminal 17, the second terminal of the protection circuit is connected to voltage sensing terminal 17; and

[0144] The first data interaction terminal 18 is connected to the second data interaction terminal 19 of the baseboard management controller;

[0145] The baseboard management controller also includes:

[0146] The third data interaction terminal 20 is connected to the fourth data interaction terminal 21 of the controller; and

[0147] The heat dissipation adjustment signal output terminal 22 is connected to the heat sink;

[0148] The various modules of the regulating device are distributed in one or more of the voltage regulator control module, voltage regulator, and baseboard management controller.

[0149] The hardware of the server board in this embodiment includes a voltage regulator control module, a voltage regulator (VR), a printed circuit board (PCB), a controller, a baseboard management controller (BMC), protection circuitry, and a heat sink.

[0150] In this embodiment, the voltage regulator control module is responsible for the dynamic adjustment of the overcurrent protection value, the voltage regulator is responsible for the dynamic adjustment of the output voltage value, the baseboard management controller is the core control unit of the server board, the protection circuit provides overcurrent and overvoltage protection for the controller, and executes the control calculation function of the server board. The various modules of the adjustment device can be distributed in one or more of the above hardware to realize distributed design, reduce the difficulty of engineering implementation, ensure the hardware compatibility of the adjustment device and the server board, improve the manufacturability of the product, adapt to hardware from different manufacturers, and improve the compatibility of the solution.

[0151] In an optional embodiment, the server board further includes a heat sink; the controller includes a temperature register for outputting the controller's temperature information.

[0152] like Figure 7 As shown, both the temperature monitoring module and the data processing module are integrated into the baseboard management controller;

[0153] The signal output module includes a threshold adjustment unit, a voltage adjustment unit, and a speed adjustment unit;

[0154] The threshold adjustment unit is integrated into the voltage regulator control module;

[0155] The voltage regulation unit is integrated into the voltage regulator, and the voltage output terminal 15 of the voltage regulator serves as the output pin of the voltage regulation unit.

[0156] The speed regulation unit is integrated into the baseboard management controller.

[0157] This embodiment utilizes the controller's unique temperature register to acquire temperature information.

[0158] The substrate management controller integrates a temperature monitoring module, a load monitoring module, and a data processing module. Data exchange occurs between the second data interaction terminal 19 of the substrate management controller and the first data interaction terminal 18 of the voltage regulator control module. Simultaneously, the substrate management controller integrates a speed regulation unit of a signal output module, which connects to a heat sink via a heat dissipation regulation signal output terminal 22 to transmit the heat sink's regulation power.

[0159] The voltage regulator control module integrates a threshold adjustment unit for dynamically calculating overcurrent protection values ​​and output current adjustment signals.

[0160] The voltage regulator integrates a voltage regulation unit for dynamically calculating the output voltage value and transmitting voltage regulation signals. The voltage output terminal 15 of the voltage regulator directly serves as the output pin of the voltage regulation unit, responsible for voltage supply.

[0161] This embodiment integrates the temperature monitoring module, load monitoring module, data processing module, and speed regulation unit into the baseboard management controller, reducing cross-hardware signal transmission. For example, the baseboard management controller does not need to send temperature data to other chips, reducing communication latency and improving regulation response speed. Utilizing existing hardware structures to integrate the various modules of the control unit eliminates the need for additional chips, reducing the cost and size of the server board. The functional modules of the regulation device are integrated into different hardware components of the server board, reducing communication latency between modules, improving regulation response speed, and simplifying hardware design and wiring, thereby reducing product cost and failure rate.

[0162] The server board in this embodiment has strong adaptability, making it suitable for different operating scenarios of the controller, reducing system power fluctuations and improving system stability. Furthermore, the server board responds quickly, dynamically reducing the overcurrent protection value when the controller operating temperature is low, detecting abnormal short circuits in advance and quickly cutting off power, effectively avoiding board burnout caused by excessively high protection current settings; conversely, dynamically increasing the overcurrent protection value when the controller operating temperature is high, preventing the voltage regulator from prematurely protecting itself due to excessively low overcurrent protection values, thus improving system safety and reliability.

[0163] It is worth noting that the controller in this application includes one or more of the following: FPGA (Field Programmable Gate Array), reconfigurable computing accelerator card, heterogeneous programmable chip, in-memory programmable chip, programmable logic extender, programmable timing controller, programmable protocol controller, etc., and has wide applicability.

[0164] In this embodiment, the description of the features of each module of the adjustment device in the embodiment corresponding to the server board can be found in the relevant descriptions of the above embodiments, and will not be repeated here.

[0165] The adjustment device, adjustment method, and server board provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the methods and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An adjusting device, characterized in that, This is applied to server boards, which include a controller and a protection circuit connected to the controller. The regulating device includes: The load monitoring module is used to obtain the load information of each device of the controller during the target detection period; The temperature monitoring module is used to obtain the first temperature information of the controller and the second temperature information of each device during the target detection period. The data processing module is used to determine the load correction coefficient of each of the devices based on the load information and the second temperature information; and to obtain the adjustment coefficient of the controller based on the load correction coefficient of each device and the first temperature information. A signal output module is used to generate an adjustment signal based on the adjustment coefficient, so that the protection circuit protects the controller based on the adjustment signal; The data processing module is further configured to determine the load correction coefficient of each device based on the current ratio of each device, the load information and the second temperature information, wherein the current ratio is the ratio of the device current to the total current value of the controller. The current percentage of the device, the load information, the second temperature information, and the load correction coefficient satisfy the following formula: ； Wherein, the load correction factor is The current ratio is The load information is , where n is the nth device in the controller. The second temperature information refers to the device's temperature value at that moment. This is the reference temperature value for the device under normal operating conditions, where k is a constant; The second temperature information, the load correction factor, and the temperature correction factor satisfy the following formula: ； Among them, temperature correction coefficient The load correction factor is , The time temperature value of the device being corrected in the second temperature information. ω is the reference temperature value when the device is in normal operating condition, and ω is a weighting constant.

2. The adjusting device according to claim 1, characterized in that, The data processing module is further configured to determine the device operating state of the device based on the second temperature information, and determine whether to perform device temperature correction based on the device operating state. If the determination result is to confirm the device temperature correction, a temperature correction coefficient between adjacent devices is generated based on the second temperature information and the load correction coefficient. The adjustment coefficient is obtained based on the temperature correction coefficient, the load correction coefficient of each of the devices, and the first temperature information.

3. The adjusting device according to claim 2, characterized in that, The data processing module is also used to determine the overall working state of the controller based on the first temperature information, and to determine whether to perform global temperature correction based on the overall working state. If the determination result is to confirm the performance of global temperature correction, the global correction coefficient is adjusted based on the second temperature information. And the adjustment coefficient is adjusted based on the adjusted global correction coefficient.

4. The adjusting device according to claim 3, characterized in that, The signal output module includes: A threshold adjustment unit is used to adjust the overcurrent protection value according to an adjustment coefficient and generate a current adjustment signal, so that the protection circuit protects the controller according to the adjusted overcurrent protection value; and A voltage regulation unit is used to generate a voltage regulation signal based on the regulation coefficient and the overcurrent protection value to adjust the overvoltage protection value of the protection circuit. The adjustment signal includes one or more of the current adjustment signal and the voltage adjustment signal.

5. The adjusting device according to claim 4, characterized in that, The server board also includes a heat sink; the signal output module also includes: The speed regulation unit is used to generate a heat dissipation regulation signal based on the regulation coefficient and the second temperature information to adjust the heat dissipation power of the heat sink. The adjustment signal includes one or more of the current adjustment signal, the voltage adjustment signal, and the heat dissipation adjustment signal.

6. The adjusting device according to claim 4, characterized in that, The temperature correction coefficient, the global correction coefficient, the first temperature information, and the adjustment coefficient satisfy the following formula: ； in, For adjustment coefficients, The temperature value at that moment is the first temperature information from the controller. The reference temperature value is the temperature at which the controller is in normal operating condition, h is the global correction factor, and k is a constant; in, This represents the temperature correction factor for all N devices in the controller. Perform summation.

7. The adjusting device according to claim 6, characterized in that, The adjustment coefficient and overcurrent protection value Satisfy the following formula: ， Where k is a constant, This is the maximum current value of the controller.

8. The adjusting device according to claim 4, characterized in that, The voltage regulation unit is also used to obtain the impedance value between the output pin of the voltage regulation unit and the input pin of the controller, and adjust the output voltage value to the controller according to the ideal voltage of the controller, the impedance value and the output current value to the controller, wherein the output voltage value is less than or equal to the overvoltage protection value; The output voltage value Satisfy the following formula: ； in, The ideal voltage for the controller. The output current value is output to the controller. The impedance value is given.

9. The adjusting device according to claim 3, characterized in that, The overall operating status includes: The first working state is a state in which the overall temperature change value of the controller during the target detection period is greater than the maximum value of the overall target change value; The second operating state is a state in which the overall temperature change value of the controller during the target detection period is greater than or equal to the minimum value of the overall target change value and less than or equal to the maximum value of the overall target change value; and The third working state is when the overall temperature change value of the controller during the target detection period is less than the minimum value of the overall target change value.

10. The adjusting device according to claim 9, characterized in that, The signal output module is further configured to generate a continuous detection signal for detecting the next target detection period when the determination result is the first working state or the third working state, until the determination result is the second working state, at which point the signal output module stops outputting the continuous detection signal; the load monitoring module is further configured to obtain load information for the next target detection period based on the continuous detection signal; The temperature monitoring module is also used to obtain the first temperature information and the second temperature information for the next target detection period based on the continuous detection signal; The data processing module is further configured to determine the load correction coefficient of each device based on the load information of the next target detection period and the second temperature information; and to obtain the adjustment coefficient of the next target detection period based on the load correction coefficient of each device and the first temperature information. The signal output module is also used to generate an adjustment signal based on the adjustment coefficient of the next target detection period, so that the protection circuit can protect the controller according to the adjustment signal.

11. A server board, characterized in that, The server board includes the adjustment device as described in any one of claims 1-10.

12. The server board according to claim 11, characterized in that, The server board also includes a voltage regulator control module, a voltage regulator, a printed circuit board, a controller, a baseboard management controller, protection circuitry, and a heat sink. The voltage regulator control module includes a current sensing input terminal and a control signal output terminal; The voltage regulator includes: The current sensing output terminal is connected to the current sensing input terminal; The control signal input terminal is connected to the control signal output terminal; and The voltage output terminal is connected to the first terminal of the protection circuit; The second end of the protection circuit is connected to the first end of the printed circuit board, and the second end of the printed circuit board is connected to the input pin of the controller. The voltage regulator control module further includes: The voltage sensing terminal, and the second terminal of the protection circuit are connected to the voltage sensing terminal; and The first data interaction terminal is connected to the second data interaction terminal of the substrate management controller; The substrate management controller also includes: The third data interaction terminal is connected to the fourth data interaction terminal of the controller; and The heat dissipation adjustment signal output terminal is connected to the heat sink. The various modules of the adjustment device are distributed in one or more of the voltage regulator control module, the voltage regulator, and the substrate management controller.

13. The server board according to claim 12, characterized in that, The controller includes a temperature register for outputting the controller's temperature information; in, The temperature monitoring module, the load monitoring module, and the data processing module are all integrated into the baseboard management controller; The signal output module includes a threshold adjustment unit, a voltage adjustment unit, and a speed adjustment unit; The threshold adjustment unit is integrated into the voltage regulator control module; The voltage regulation unit is integrated within the voltage regulator, and the voltage output terminal of the voltage regulator serves as the output pin of the voltage regulation unit. The speed regulation unit is integrated into the baseboard management controller.

14. A method for adjustment using the adjustment device according to any one of claims 1-10, characterized in that, The adjustment method includes: Obtain the load information of each device in the controller during the target detection period; Obtain the first temperature information of the controller and the second temperature information of each device during the target detection period; The load correction factor for each device is determined based on the load information and the second temperature information. The adjustment coefficient of the controller is obtained based on the load correction coefficient of each device and the first temperature information; An adjustment signal is generated based on the adjustment coefficient, so that the protection circuit protects the controller according to the adjustment signal.

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