Network equipment and processing method thereof
By adding a multi-level signal conditioning device between the switch chip and the LPO module, the compensation level is adjusted to solve the problem of insufficient compensation by the LPO module, thereby achieving low-power and low-latency signal transmission. It is suitable for existing system architectures and ecosystems and solves the problems of signal attenuation and high power consumption in high-speed signal transmission.
Patent Information
- Application Number
- CN202610090373.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-22
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2046-01-22
AI Technical Summary
In high-speed signal transmission, the existing LPO module has insufficient compensation capability, especially in long-link scenarios where signal attenuation cannot be compensated. Furthermore, the DSP module has high power consumption and large latency, which cannot meet the low latency requirements of AI networking. At the same time, the ecosystems of NPO and CPO are immature, difficult to operate and maintain, and costly.
A multi-level signal conditioning device is added between the switch chip and the linear direct-drive pluggable optical module, including N driving continuous-time linear equalizers and N+1 switches. The switch states are controlled by a controller, and the compensation level is adjusted according to the data transmission quality parameters to achieve signal compensation.
It improves compensation capabilities without increasing power consumption, meets low latency requirements, maintains the existing overall architecture and ecosystem, reduces operation and maintenance costs, and is suitable for higher-speed signal transmission.
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Figure CN121585940A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical module technology, and in particular to a network device and its processing method. Background Technology
[0002] High-speed signals experience significant attenuation over long distances, leading to reduced signal bandwidth and degraded signal quality. Currently, two common methods address this: one involves retiming the signal using DSP (Digital Signal Processing), and the other uses LPO (Linear Positioning Programming). Linearly driven pluggable optical modules (LPOs) are used for signal relay. Among these, the DSP solution utilizes digital signal processing technology and boasts the strongest performance; however, DSPs also consume significant power, with higher power consumption resulting from higher data rates and stronger compensation capabilities. The LPO solution, on the other hand, uses analog signal processing technology. While its compensation capability is moderate, its power consumption is lower, making it more suitable for links with less stringent compensation requirements.
[0003] In higher-speed links, the LPO solution's compensation capability is insufficient, especially for long-link scenarios, where signal attenuation caused by link loss cannot be compensated by the LPO module; however, the DSP solution has high power consumption and high cost, and aside from cost, its latency is too high, which cannot meet the low latency requirements of AI (Artificial Intelligence) networking. Summary of the Invention
[0004] This application provides a network device and its processing method to achieve low power consumption and low latency while improving compensation capabilities.
[0005] This application provides a network device that connects to a linear direct-drive pluggable optical module. The network device includes a switch chip and at least one multi-level signal conditioning device. The first signal pin of the switch chip is connected to the linear direct-drive pluggable optical module through the multi-level signal conditioning device. The multi-level signal conditioning device includes N driving continuous-time linear equalizers, N+1 switches, a controller, an input port, and an output port, where N is a positive integer greater than 1. The N continuous-time linear equalizers are connected in series. The output of each continuous-time linear equalizer is connected to the output port through a switch. Along the series connection direction of the N continuous-time linear equalizers, the input of the first continuous-time linear equalizer is connected to the input port and also connected to the output port through a switch. The controller is used to control the on / off state of the N+1 switches according to the control signals sent by the network device.
[0006] This application also provides a method for processing a network device, wherein the network device is the network device described in the first aspect, and the method includes: Send a first control signal to the controller, causing the multi-level signal conditioning device to connect only the switch connected to the input port; When the multi-level signal conditioning device is located at the receiving end, the data transmission quality parameters of the network port of the network device are obtained; Based on the data transmission quality parameters, a compensation level is determined, and based on the compensation level, a second control signal is generated, causing the controller to connect the corresponding switch according to the second control signal.
[0007] This application also provides an electronic device, including: a memory for storing a computer program; and a processor for executing the computer program to implement the processing method of any of the above-described network devices.
[0008] This application also provides a computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor, implements the steps of the processing method of any of the above-described network devices.
[0009] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the processing method of any of the above-described network devices.
[0010] This application adds a multi-stage signal conditioning device between the switch chip and the linear direct-drive pluggable optical module. Based on the data transmission quality parameters, the compensation level of the multi-stage signal conditioning device is adjusted, and the transmitted signal is compensated according to the determined compensation level. This improves the compensation capability while achieving low power consumption and low latency. This solution can expand the application scenarios of pluggable low-power LPO optical modules to higher-speed products based on the original overall architecture and printed circuit board design. Attached Figure Description
[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0012] Figure 1 This application provides a schematic diagram of the structure of a network device according to an embodiment of the present application. Figure 2 A schematic diagram of a multi-stage signal conditioning device is provided as an example of this application; Figure 3 This is a schematic diagram of the structure of a network device provided as an example of this application.
[0013] Figure 4 A flowchart illustrating a processing method for a network device provided in this application embodiment; Figure 5 This is a schematic diagram of the structure of a processing device for a network device provided in an embodiment of the present disclosure. Detailed Implementation
[0014] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.
[0015] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.
[0016] Terminology Explanation: DSP: Digital Signal Processing, is a technology that processes digital signals using mathematical algorithms. Unlike analog signals (continuous time, continuous amplitude), digital signals are discrete time and discrete amplitude. They require an analog-to-digital converter (ADC) to convert them into digital form, and then a digital-to-analog converter (DAC) to restore them to analog form. In the field of high-speed signals, DSPs can perform signal compensation, shaping, and optimization through digital signal algorithms.
[0017] Optical modules are an important component of optical fiber communication, and are optoelectronic devices that realize photoelectric conversion and electro-optic conversion functions.
[0018] Serdes: Serializers / deserializers convert parallel data into high-speed serial signals for transmission (serialization), and the receiving end restores it to parallel data (deserialization). They are used for long-distance communication between chips and devices (such as PCIe, Ethernet, and fiber optic communication). Their core function is to solve signal integrity issues by using clock recovery and equalization techniques to combat interference and attenuation.
[0019] LPO: Linear-direct-drive Pluggable Optical Modules. These modules do not contain a DSP and have the lowest power consumption among pluggable modules, but they also have the worst signal compensation capability. NPO: Near Packaged Optics. Compared to pluggable modules, NPO places the optical engine in the optical module on the PCB board, around the switch chip. This greatly shortens the distance between the switch chip and the optical engine, and reduces the loss caused by the wiring. CPO: Co-Packaged Optics. Compared to NPO, CPO places the optical engine and the switch chip closer together, directly packaged together. This results in minimal signal loss due to wiring and better signal integrity.
[0020] In related technologies, high-speed signals experience severe attenuation during long-distance transmission, leading to reduced signal bandwidth and degraded signal transmission quality. Currently, two common methods exist: one is to retime the signal using a DSP module, and the other is to relay the signal using an LPO module. The DSP solution utilizes digital signal processing technology and boasts the strongest performance; however, DSPs also consume significant power, with higher power consumption resulting from higher data rates and stronger compensation capabilities. The LPO solution, on the other hand, employs analog signal processing technology. While its compensation capability is moderate, its lower power consumption makes it more suitable for links with less stringent compensation requirements.
[0021] Optical modules, a crucial component of fiber optic communication, are optoelectronic devices that perform photoelectric and electro-optic conversion. They enable interconnection between network interface cards (NICs) and switches, as well as between switches at different tiers. However, with the increasing speed of SerDes, signal loss and crosstalk have become more significant, impacting transmission stability. Therefore, pluggable optical modules began employing DSP (Digital Signal Processing) solutions to improve signal quality in the 50G / lane era, and DSP modules saw widespread use in 50G / lane and 100G / lane. However, DSP modules also have drawbacks: high power consumption, high latency, and high cost. Aside from cost, high power consumption is the fundamental reason limiting their continued large-scale use; secondly, the excessively high latency fails to meet the low-latency requirements of AI networking.
[0022] In current AI networking, the power consumption of a 400G optical module is as high as 9W. Currently, the power consumption of DSP modules in the entire network accounts for more than 20%. It is not only the power consumption of the module itself that has increased, but also the device side needs to be equipped with higher power fans or increase costs by adopting liquid cooling solutions to dissipate heat in order to cool the module.
[0023] In the 100G era, LPO (Low Power Propagation) solutions emerged. LPO modules reduced power consumption by 50-70% compared to DSP modules (approximately 2.5-4W for 400G), a significant reduction. Furthermore, LPO modules greatly reduced network latency, crucial for AI computing. Currently, LPO modules are being mass-produced and deployed on 51.2T switches with 100G / lane. However, the increased bit error rate brought about by the higher SerDes speeds forced the adoption of CDR (Clock Data Recovery) and DSP solutions. Due to power consumption issues, LPO has regained importance in the higher-speed 100G / lane era. Whether LPO can continue to be used in 200G / lane and higher speed models remains to be seen, with many issues needing to be resolved. The main problem is the insufficient compensation capability of LPO modules in higher-speed links, especially in long-link scenarios where signal attenuation due to link losses cannot be compensated for by LPO modules.
[0024] To shorten link trace distances, reduce losses, and avoid returning to the high power consumption of the DSP module era, two product forms, NPO and CPO, emerged in the 200G / lane era. NPO, or Near-Package Optics, places the optical engine on the PCB (Printed Circuit Board), outside the switch chip, significantly shortening the distance between the switch chip and the optical engine, resulting in less trace loss. CPO, or Co-Package Optics, places the optical engine even closer to the switch chip than NPO, directly packaged together. This minimizes trace loss within the chip package and provides better signal integrity. Both NPO and CPO are continuations of the LPO (Low-Package Optics) form, simply replacing the pluggable module form with onboard near-packing or co-packing, eliminating the need for pluggable optical modules for network interconnection. In the higher-speed 400G / lane era, the performance advantages of NPO or CPO will be very significant; however, currently, large-scale application of NPO and CPO faces serious challenges.
[0025] The biggest challenges facing NPOs and CPOs are their immature ecosystems and high subsequent maintenance costs. Firstly, regarding maintenance, LPOs still utilize pluggable optical modules, resulting in very low maintenance costs. A faulty module can be simply replaced without affecting other modules or causing large-scale network outages. However, NPOs and CPOs have significant maintenance issues. Firstly, both NPOs and CPOs have highly integrated optical engines (OEs), with the current mainstream pluggable optical modules supporting 400G / 800G speeds. A single OE typically integrates multiple links; a failure in one OE will affect multiple links. Furthermore, the current mainstream solutions for NPOs and CPOs use external lasers, meaning one laser provides light for multiple OEs, making laser malfunctions even more impactful. In addition, regardless of whether it's an NPO or CPO, an optical path malfunction requires shutdown, opening the cover, or even returning the device to the factory for repair, leading to large-scale network outages—a fatal flaw for AI intelligent computing networks. Another issue is that the current industry ecosystem for NPO and CPO differs significantly from the existing pluggable optical module industry. The NPO and CPO industry is dominated by a few chip manufacturers, and its ecosystem is highly closed. For equipment vendors like ours, we are no longer just purchasing chips, but entire solutions, or even complete systems, leaving little room for maneuver. In contrast, the existing optical module industry chain comprises hundreds or even thousands of companies, with a complete supply chain from basic components, adhesives, and materials to modules, software, and more. This entire chain is open, collaborative, and operates effectively. If chip manufacturers continue to maintain a closed ecosystem, preventing existing optical module suppliers from participating in its development, the cost of NPO or CPO may become very high, hindering large-scale adoption.
[0026] Faced with the above situation, some opinions suggest continuing to use pluggable DSP optical modules with more effective cooling methods, such as cold plate or immersion liquid cooling, to dissipate heat from the modules. This approach minimizes the challenges to the overall ecosystem, but it also increases the R&D and maintenance difficulties for equipment manufacturers and end-users. Disadvantages include high power consumption and the need for a completely new liquid cooling design. Currently, a 1.6T optical module for 200G / lane consumes around 30W, and in the next generation of 400G / lane 3.2T optical modules... The estimated power consumption of the module is 50-60W. Currently, mainstream optical module DSPs already use TSMC's 3nm process technology, making it difficult to reduce power consumption through process optimization. For 1.6T switches, some equipment manufacturers are planning to use cold-plate liquid cooling solutions for heat dissipation of 1.6T optical modules, as traditional air-cooling designs are insufficient. However, the solution of laying water pipes on the optical cage for heat dissipation has always been an industry challenge. Firstly, the optical cage is relatively small and irregularly shaped, lacking a flat surface, unlike the feasible cold-plate liquid cooling design on the PCB. For 400G / lane 3.2T optical modules, cold-plate cooling is also insufficient for effective heat dissipation, necessitating immersion liquid cooling, which presents a significant challenge for the entire industry. Another viewpoint is to abandon pluggable optical module interconnection solutions and build a new NPO or CPO ecosystem, adopting a linear optical solution that encapsulates the optical engine close to the switch chip, shortening the link traces and ensuring better link signal quality. However, the problems with NPO and CPO solutions are: inconvenient operation and maintenance; failure of a single optical engine or laser can lead to the shutdown of multiple links, and once a problem occurs, it cannot be replaced by plugging and unplugging; the entire machine must be powered off for maintenance, or even returned to the factory for repair. The ecosystem is closed, the industrial chain is incomplete, and currently only a few chip manufacturers are involved, resulting in high costs.
[0027] Against this backdrop, the entire industry is considering solutions, including equipment manufacturers, optical module manufacturers, and upstream analog chip manufacturers. This application, from the perspective of equipment manufacturers, proposes a solution that allows the continued use of LPO modules at higher speeds to maintain the ecosystem of overall PCB design and pluggable modules. This solution does not lead to a significant increase in power consumption and can meet the low latency requirements of AI networking. It continues to use the existing overall architecture, resulting in a more mature ecosystem, shorter overall system development cycle, and minimal risk. It eliminates the need to develop more complex cold plate solutions for irregularly shaped optical cages, avoids concerns about maintenance issues associated with immersion liquid cooling solutions, and does not require rebuilding the NPO or CPO ecosystem.
[0028] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0029] Embodiments of this application provide a network device. Figure 1 This is a schematic diagram of the structure of a network device according to an embodiment of this application, such as... Figure 1 As shown, the network device is connected to a linear direct-drive pluggable optical module. The network device includes a switch chip and at least one multi-level signal conditioning device. The first signal pin of the switch chip is connected to the linear direct-drive pluggable optical module through the multi-level signal conditioning device.
[0030] In some embodiments, the multi-stage signal conditioning device is a controllable multi-stage amplification onboard Re-Driver chip. By using this multi-stage amplification onboard Re-driver to compensate for the signal link, it is possible to continue using the low-power pluggable LPO optical module solution (and the LPO module continues to use air cooling) within the existing equipment framework, while also meeting the needs of higher-speed signal transmission.
[0031] In some embodiments, the multi-level signal conditioning device includes N driver continuous-time linear equalizers (DriverCTLE), N+1 switches, a controller, an input port (INPUT), and an output port (OUTPUT), where N is a positive integer greater than 1; the N driver continuous-time linear equalizers are connected in series, and the output terminal of each driver continuous-time linear equalizer is connected to the output port through a switch. Along the series connection direction of the N driver continuous-time linear equalizers, the input terminal of the foremost driver continuous-time linear equalizer is connected to the input port and connected to the output port through a switch. The controller is used to control the on / off state of the N+1 switches according to the control signals sent by the network device.
[0032] As an example, such as Figure 2As shown, this multi-stage signal conditioning device includes a 3-stage step control system with 4 switches. When switch SW0 is on, the multi-stage signal conditioning device acts like a high-speed wire, and the chip is essentially bypassed. Only the controller is active, and all multi-stage continuous-time linear equalizers are powered down, resulting in minimal power consumption (milliwatt level), suitable for short links or scenarios with sufficient compensation capabilities within an LPO. When switch SW1 is on, only the first-stage continuous-time linear equalizer is active, while the other two stages are powered down. In this case, the multi-stage signal conditioning device performs primary compensation for the high-speed link. It does not need to operate at maximum power consumption, effectively reducing power consumption. When switch SW2 is on, the first two stages of the continuous-time linear equalizer are active, while the third-stage continuous-time linear equalizer is powered down. In this case, the multi-stage signal conditioning device performs intermediate compensation for the high-speed link. The multi-stage signal conditioning device still does not need to operate at the highest power consumption. When switch SW3 is connected, all the driven continuous-time linear equalizers in the multi-stage signal conditioning device are in operation. At this time, the multi-stage signal conditioning device will provide the maximum compensation for the high-speed link. The multi-stage signal conditioning device operates at the highest power consumption, but the compensation capability is the strongest at this time.
[0033] In addition to high-speed links and power supplies, the external interface of this multi-level signal conditioning device also includes a low-speed signal channel that connects to the controller. This low-speed signal channel can be of type I2C or GPIO. The network device controls the controller through the low-speed signal, thereby controlling the on / off state of each level of CTLE switch.
[0034] It should be noted that this multi-stage signal conditioning device is essentially a driver with multiple CTLE stages. To ensure the linearity of high-speed signals, the compensation capability of each CTLE stage is controlled at a relatively small level. This ensures the linearity of high-speed signals as much as possible. For multi-stage signal conditioning devices, there is no limit to the number of control stages. If the number of control stages is N, then there are N+1 switches inside. These switches are controlled by an internal controller. The switch can send control signals or control commands to the controller through I2C or other GPIO interfaces to control the on / off state of the switches.
[0035] This application innovatively proposes a multi-level controllable driving scheme for LPO optical modules used in high-speed links. By employing a multi-level signal conditioning device, specifically a driver with multi-level CTLE, power consumption can be minimized while ensuring signal transmission quality. This scheme amplifies and shapes the signal by adding a controllable multi-level onboard multi-stage signal conditioning device between the switch chip and the pluggable LPO module. This scheme does not require the LPO module to have strong compensation capabilities, therefore the power consumption of the LPO module is not high, and the LPO module does not require liquid cooling. The task of relay amplification of the signal is transferred to the controllable multi-level onboard multi-stage signal conditioning device chip. Compared to the digital signal compensation mechanism of DSP, the analog signal compensation mechanism of multi-level signal conditioning device consumes less power. According to calculations, a single 1.6T link only needs to increase power consumption by about 1.5W-2W. In short link scenarios where excessive compensation is not required, its power consumption is even at the milliwatt level. Compared to using DSP modules, this solution still has a very large power reduction capability (currently, the power consumption of a single 1.6T DSP module is 25W-30W, and the power consumption of a single 1.6T LPO module is 10W-12W).
[0036] To better ensure port compatibility with LPO modules in network devices, in some embodiments, the network device includes a printed circuit board, such as... Figure 3 As shown, the network device includes multiple multi-level signal conditioning devices (Re-Driver chips). Each multi-level signal conditioning device corresponds one-to-one with multiple optical ports of the network device, and the trace distance between each multi-level signal conditioning device and its corresponding optical port on the printed circuit board is the same.
[0037] In other words, by controlling the same routing distance between each multi-level signal conditioning device and the optical port, the port compatibility of the network device with the LPO module is ensured.
[0038] In some embodiments, the controller can be a microcontroller such as a single-chip microcomputer. This controller includes registers, and different values are written to the registers according to different control signals. Based on the values written to the registers, the corresponding switches among N+1 switches are controlled to open. In other words, different switches are controlled to open and close through simple register writes. This scheme is simple in structure and easy to implement.
[0039] It should also be noted that the inventive concept of this solution is not only applicable to LPO optical modules, but also to ACC active copper cables, and not only to existing network protocols (Ethernet, Infiniband networks), but can also be applied to network devices with other communication protocols, such as PCIe, SATA and other interfaces.
[0040] Based on the above embodiments, this application also provides a processing method for a network device, such as... Figure 4As shown, the processing method of this network device includes the following steps: Step 401: Send a first control signal to the controller, causing the multi-level signal conditioning device to connect only the switch connected to the input port.
[0041] This can be understood as follows: the solution first requires bypassing the multi-stage signal conditioning device, then obtaining data transmission quality parameters such as bit error rate; and finally determining whether the compensation effect of the multi-stage signal conditioning device is needed based on the obtained data transmission quality parameters.
[0042] Step 402: When the multi-level signal conditioning device is located at the receiving end, obtain the data transmission quality parameters of the network port of the network device, and determine the compensation level based on the data transmission quality parameters.
[0043] In some embodiments, the data transmission quality parameter is the bit error rate, that is, the need for compensation and the level of compensation are determined based on the bit error rate of the signal.
[0044] In some embodiments, determining the compensation level based on data transmission quality parameters includes: determining the compensation level based on the correspondence between the range of data transmission quality parameters and the compensation level, as well as the data transmission quality parameters.
[0045] In other words, the correspondence between the data transmission quality parameter range and the compensation level is pre-defined. After obtaining the data transmission quality parameter, it is determined which data transmission quality parameter range the parameter falls into, and the corresponding compensation level is determined based on the range.
[0046] In some embodiments, determining the compensation level based on data transmission quality parameters includes: determining the compensation level based on data transmission quality parameters and the trace distance between the multi-level signal conditioning device and the switch chip.
[0047] In other words, both data transmission quality and routing distance can be considered simultaneously, and the compensation level can be determined based on these two factors, such as by setting different weights and performing a weighted summation to determine the compensation level.
[0048] In some embodiments, before obtaining the data transmission quality parameters of the network port of the network device, the method includes: configuring the parameters of the linear direct-drive pluggable optical module through a link training mechanism.
[0049] Therefore, for LPO modules from different manufacturers with different compensation capabilities, the network device can configure the optimal parameters through the link training mechanism. By configuring the parameters, the optimal compensation capability of the LPO module can be achieved. On this basis, it can be determined whether a multi-level signal conditioning device is needed and the required compensation level based on data transmission quality parameters such as bit error rate, so as to save power consumption to the maximum extent.
[0050] Step 403: When the multi-level signal conditioning device is located at the transmitting end, obtain the data transmission quality parameters fed back from the other end, and determine the compensation level based on the data transmission quality parameters; or, determine the compensation level based on the trace distance between the multi-level signal conditioning device and the switch chip.
[0051] When the multi-stage signal conditioning device is located at the transmitting end, data transmission quality parameters cannot be directly obtained. Therefore, the corresponding receiving end needs to provide feedback on data transmission quality parameters, such as the bit error rate, and the compensation level is determined based on the bit error rate. If the data transmission quality parameters of the other end cannot be obtained, the compensation level can be determined based on the trace distance between the multi-stage signal conditioning device and the switch chip. The longer the trace distance, the higher the compensation level.
[0052] This can be understood as follows: due to limitations in chip size and structural layout, the trace distances between the switch chip and each multi-level signal conditioning device will vary. The compensation amount of the multi-level signal conditioning device is configured according to the trace length. The longer the trace, the greater the compensation amount, in order to ensure the consistency of the signal coming from the multi-level signal conditioning device, thus ensuring better port consistency.
[0053] Step 404: Generate a second control signal according to the compensation level, and instruct the controller to connect the corresponding switch according to the second control signal.
[0054] This can be understood as controlling the connection of different switches by sending control signals to the controller, which then controls the connection of the corresponding switches.
[0055] The processing method of the network device in this application embodiment adds a multi-level signal conditioning device between the switch chip and the linear direct-drive pluggable optical module. According to the data transmission quality parameters, the compensation level of the multi-level signal conditioning device is adjusted, and the transmitted signal is compensated according to the determined compensation level. While improving the compensation capability, low power consumption and low latency are achieved. This solution can expand the application scenarios of pluggable low-power LPO optical modules to 200G / lane or even higher speed products based on the original overall architecture and printed circuit board design. Compared with the DSP solution, it does not require the design of high-power fans or the use of higher-cost liquid cooling solutions. It can still use the original overall architecture. Compared with the NPO or CPO solution, it has lower cost, a more complete ecosystem, and lower maintenance costs.
[0056] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method.
[0057] To implement the network device processing method provided in this disclosure, this disclosure also provides a network device processing apparatus, which is configured in the network device processing system, such as... Figure 5 As shown, the device includes: The transmitting module 510 is used to send a first control signal to the controller, causing the multi-level signal conditioning device to connect only the switch connected to the input port; The data processing module 520 is used to acquire the data transmission quality parameters of the network port of the network device when the multi-level signal conditioning device is located at the receiving end, and to determine the compensation level based on the data transmission quality parameters. The signal generation module 530 is used to generate a second control signal according to the compensation level, so that the controller can connect the corresponding switch according to the second control signal.
[0058] In some implementations, the data processing module 520 is also used for: When the multi-level signal conditioning device is located at the transmitting end, the data transmission quality parameters fed back from the other end are obtained, and the compensation level is determined based on the data transmission quality parameters; or, the compensation level is determined based on the trace distance between the multi-level signal conditioning device and the switch chip.
[0059] In some implementations, the data processing module 520, when determining the compensation level based on data transmission quality parameters, is specifically used for: The compensation level is determined based on the correspondence between the data transmission quality parameter range and the compensation level, as well as the data transmission quality parameters.
[0060] In some implementations, the data processing module 520, when determining the compensation level based on data transmission quality parameters, is specifically used for: The compensation level is determined based on the data transmission quality parameters and the trace distance between the multi-level signal conditioning device and the switch chip.
[0061] In some implementations, before obtaining the data transmission quality parameters of the network port of the network device, the data processing module 520 is also used for: The parameters of the linear direct-drive pluggable optical module are configured through the link training mechanism.
[0062] In some implementations, the data transmission quality parameter is the bit error rate.
[0063] For a description of the features in the embodiment corresponding to the processing device of the network device, please refer to the relevant description in the embodiment corresponding to the processing method of the network device, which will not be repeated here.
[0064] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above-described network device processing method embodiments.
[0065] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described network device processing method embodiments when it is run.
[0066] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.
[0067] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described network device processing method embodiments.
[0068] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described network device processing method embodiments.
[0069] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.
[0070] The foregoing has provided a detailed description of a link failure root cause localization method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.
Claims
1. A network device, characterized in that, The network device connects to a linear direct-drive pluggable optical module. The network device includes a switch chip and at least one multi-level signal conditioning device. The first signal pin of the switch chip is connected to the linear direct-drive pluggable optical module through the multi-level signal conditioning device. The multi-level signal conditioning device includes N driving continuous-time linear equalizers, N+1 switches, a controller, an input port, and an output port, where N is a positive integer greater than 1. The N continuous-time linear equalizers are connected in series. The output of each continuous-time linear equalizer is connected to the output port through a switch. Along the series connection direction of the N continuous-time linear equalizers, the input of the first continuous-time linear equalizer is connected to the input port and also connected to the output port through a switch. The controller is used to control the on / off state of the N+1 switches according to the control signals sent by the network device.
2. The network device according to claim 1, characterized in that, The network device includes a printed circuit board and a plurality of the multi-level signal conditioning devices. Each multi-level signal conditioning device corresponds one-to-one with a plurality of optical ports of the network device, and the trace distance between each multi-level signal conditioning device and its corresponding optical port on the printed circuit board is the same.
3. The network device according to claim 1, characterized in that, The controller includes a register. The controller writes different values into the register according to different control signals, and controls the corresponding switches among the N+1 switches to be turned on according to the values written in the register.
4. A processing method for a network device, characterized in that, The network device is the network device as described in claim 1 or claim 2, and the method includes: Send a first control signal to the controller, causing the multi-level signal conditioning device to connect only the switch connected to the input port; When the multi-level signal conditioning device is located at the receiving end, the data transmission quality parameters of the network port of the network device are obtained, and the compensation level is determined based on the data transmission quality parameters. Based on the compensation level, a second control signal is generated, causing the controller to activate the corresponding switch according to the second control signal.
5. The method according to claim 4, characterized in that, The method further includes: When the multi-level signal conditioning device is located at the transmitting end, the data transmission quality parameters fed back from the other end are obtained, and the compensation level is determined based on the data transmission quality parameters; or, the compensation level is determined based on the trace distance between the multi-level signal conditioning device and the switch chip.
6. The method according to claim 4, characterized in that, Determining the compensation level based on the data transmission quality parameters includes: The compensation level is determined based on the correspondence between the data transmission quality parameter range and the compensation level, as well as the data transmission quality parameters.
7. The method according to claim 4, characterized in that, Determining the compensation level based on the data transmission quality parameters includes: The compensation level is determined based on the data transmission quality parameters and the trace distance between the multi-level signal conditioning device and the switch chip.
8. The method according to claim 4, characterized in that, Before obtaining the data transmission quality parameters of the network port of the network device, the following steps are included: The parameters of the linear direct-drive pluggable optical module are configured through a link training mechanism.
9. The method according to claim 4, characterized in that, The data transmission quality parameter is the bit error rate.
10. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor for executing the computer program to implement the steps of the method as described in any one of claims 4 to 9.
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