High-heat-dissipation RGB chip packaging structure and preparation method thereof

Abstract

The invention relates to the technical field of RGB chips, in particular to a high-heat-dissipation RGB chip packaging structure which comprises an upper substrate, two long round openings are formed in the upper surface of the upper substrate, two sets of boss parts are inserted into the two long round openings respectively, a connecting part is installed on one face of each boss part, heat conduction sleeves are installed at the two ends of each connecting part and inserted into upper semicircular grooves, and the two ends of each connecting part are provided with heat dissipation grooves. The ceramic base is installed in the middle of the face, away from the lower substrate, of the upper substrate, three RGB chips are installed on the face, away from the upper substrate, of the ceramic base, two rows of wiring pins are installed on the outer surface of the ceramic base, the ends, away from the ceramic base, of the wiring pins extend into the long round openings, and the wiring pins are connected with the boss parts through molten and solidified tin blocks. The tin block has the following beneficial effects that the limitation of single heat dissipation of a traditional tin block is broken through, and the heat dissipation efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of RGB chip technology, specifically to a high heat dissipation RGB chip packaging structure and its fabrication method. Background Technology

[0002] In the field of lighting and display technology, the RGB three-color chip solution is one of the most widely used and technologically mature core solutions for achieving white light. Its core principle is to simultaneously activate three light-emitting chips with different wavelengths—red, blue, and green—and utilize the mixing and superposition effect of the three primary colors to ultimately synthesize white light that meets the usage requirements, adapting to various scenarios such as lighting fixtures and display screens. In the actual assembly process of this solution, the connection between the wiring pins of the red, blue, and green light-emitting chips and the substrate is generally achieved using soldering. Soldering has become a commonly used connection method in electronic component assembly due to its advantages of convenient operation, strong connection, and controllable cost. Its core is to use molten solder to tightly adhere the wiring pins to the pads on the substrate, forming a stable electrical connection and mechanical fixing structure after the solder cools and solidifies.

[0003] The heat dissipation efficiency of the wiring pins directly depends on their contact area with the heat sink and the heat conduction path. In the soldering process, heat conduction between the wiring pins and the substrate mainly relies on the solidified solder block. Due to the limitations of the soldering process and pin size, the contact area formed by the solder block is limited to the size of the solder block itself, which significantly restricts the heat dissipation area of ​​the wiring pins. When the LED chip is working, it generates a large amount of heat, which needs to be transferred to the substrate through the wiring pins and then dissipated. However, limited by the heat dissipation area of ​​the solder block, the heat cannot be conducted and diffused quickly and efficiently, easily accumulating at the connection between the wiring pins and the solder joint, leading to a localized temperature increase. Long-term heat accumulation not only affects the luminous efficiency and color stability of the LED chip but may also accelerate the aging of the chip and wiring pins, shortening the product's lifespan. This poor heat dissipation problem has become one of the key factors restricting further optimization of the performance and improvement of the reliability of RGB three-color chip solutions. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of this invention is to provide a high heat dissipation RGB chip packaging structure and its preparation method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides a high heat dissipation RGB chip packaging structure, comprising: The upper substrate has four upper semi-circular grooves on one edge, two elongated oval openings on the upper surface, and two symmetrically connected grooves on the lower surface. The two ends of the connected grooves are connected to the two upper semi-circular grooves, and the two connected grooves are connected to the two elongated oval openings. The boss portion has two sets, and the two sets of boss portions are respectively inserted into two elongated oval openings. A connecting portion is installed on one side of the boss portion, and the connecting portion is inserted into a communicating groove. Both ends of the connecting portion are equipped with heat-conducting sleeves. The heat-conducting sleeves have a semi-circular structure and are inserted into the upper semi-circular groove. The boss portion, the connecting portion, and the heat-conducting sleeves are all good conductors of heat. A ceramic base is installed in the middle of the side of the upper substrate facing away from the lower substrate. Three RGB three-color chips are installed on the side of the ceramic base facing away from the upper substrate. Two rows of wiring pins are installed on the outer surface of the ceramic base. The wiring pins are electrically connected to the RGB three-color chips. The end of the wiring pin away from the ceramic base extends into the elongated oval opening. The wiring pin is connected to the boss part through a molten and solidified solder block.

[0006] The upper semi-circular groove, oblong opening, and connecting groove of the upper substrate provide precise mounting space for the boss, connecting part, and heat-conducting sleeve, forming an integrated heat conduction path. The wiring pins are connected to the boss through solder blocks, allowing heat to be quickly transferred from the pins to the boss, and then diffused through the connecting part and heat-conducting sleeve, breaking through the limitation of traditional solder blocks for single heat dissipation and improving heat dissipation efficiency.

[0007] The ceramic base is fixed in the middle of the upper substrate. The RGB three-color chip and the wiring pin are precisely installed. The pins extend into the elongated opening and contact the boss, which not only ensures stable electrical connection, but also avoids collision between the chip and external components, laying the foundation for subsequent optimization of heat dissipation and protection structure.

[0008] Specifically, a lower substrate is provided on the side of the upper substrate away from the ceramic base. Four semi-circular grooves are formed on one edge of the lower substrate. These semi-circular grooves are concentrically arranged with the upper semi-circular grooves. The heat-conducting sleeve is inserted into the space formed by the upper and lower semi-circular grooves. The depths of the upper and lower semi-circular grooves are equal, and the thickness of the heat-conducting sleeve is twice the depth of the upper semi-circular groove. The lower and upper semi-circular grooves form a complete installation space. After the heat-conducting sleeve is tightly embedded, it can simultaneously contact both the upper and lower substrates, increasing the heat dissipation area by more than double compared to a single substrate. The concentric arrangement of the lower and upper semi-circular grooves ensures that the heat-conducting sleeve does not shift after installation. The upper and lower substrates fit tightly together, preventing the heat dissipation path from breaking due to structural misalignment. This also enhances the overall packaging structure's vibration resistance and reduces the risk of component loosening.

[0009] Specifically, the side of the boss facing away from the connecting part has a plurality of flared holes evenly spaced, and the side of the connecting part facing away from the boss has a plurality of through holes evenly spaced. Each of the through holes communicates with and is concentric with one of the flared holes. The inner diameter of the flared hole near the through hole is equal to the inner diameter of the through hole. A solder rod is inserted into the channel formed by the flared hole and the through hole. One end of the solder rod is connected to the lower substrate, and the other end extends into an elongated opening. The solder rod melts into the flared hole after being heated by the molten solder, forming a flared structure. The melting of the solder rod into the flared hole creates a flared structure, improving the stability of the connection between the upper and lower substrates.

[0010] Specifically, a heat-conducting strip is installed in the area of ​​the lower substrate covered by the connecting part, and multiple solder rods are evenly installed on one side of the heat-conducting strip. The heat-conducting strip is installed in the area of ​​the lower substrate covered by the connecting part, and the solder rods are evenly fixed on the surface. Heat can be quickly transferred from the solder rods to the heat-conducting strip, and then a large heat dissipation area is formed below through the heat-conducting strip.

[0011] Specifically, the lower substrate has two recessed grooves on the side facing the upper substrate. The two ends of each groove are connected to two matching lower semi-circular grooves. The heat-conducting strip is installed within the grooves. The depth of the grooves is equal to the thickness of the heat-conducting strip. Both ends of the heat-conducting strip are machined with arc-shaped surfaces that mate with the surface of the heat-conducting sleeve. The arc-shaped surfaces of the heat-conducting strip are in close contact with the surface of the heat-conducting sleeve. The heat-conducting strip is a good conductor of heat. The depth of the grooves on the lower substrate is equal to the thickness of the heat-conducting strip, and the heat-conducting strip is flush with the surface of the lower substrate after being embedded.

[0012] Specifically, two symmetrically arranged flat surfaces are machined on the annular side of the ceramic base, and three wiring pins are mounted on each of the two flat surfaces. A transparent spherical cover is mounted on the side of the ceramic base facing away from the upper substrate, and the RGB three-color chip is placed inside the transparent spherical cover. The transparent spherical cover completely encloses the RGB three-color chip, which can prevent dust and moisture from entering and avoid performance degradation caused by moisture or contamination of the chip. Specifically, a bent portion is installed at the end of the wiring pin away from the ceramic base. The bent portion and the wiring pin are integrally formed. The bent portion is located within an elongated opening and contacts the boss portion. This ensures the stability of the electrical connection and avoids chip flickering or malfunction due to poor contact of the wiring pin.

[0013] Specifically, the three RGB three-color chips are a red light chip, a blue light chip, and a green light chip.

[0014] A method for fabricating a high heat dissipation RGB chip package structure includes the following steps: S01. Select a heat-conducting material to process the boss, connecting part, and heat-conducting sleeve, and form them as a single piece; process the upper substrate, and open four upper semi-circular grooves on one edge of the upper substrate, open two elongated oval openings on the upper surface, and open two symmetrical connecting grooves on the lower surface, ensuring that the two ends of the connecting grooves are connected to the corresponding upper semi-circular grooves and the elongated oval openings respectively; process the lower substrate, and open four lower semi-circular grooves on one edge of it, so that the lower semi-circular grooves are concentrically arranged with the upper semi-circular grooves of the upper substrate, and the upper and lower semi-circular grooves have the same depth, and the thickness of the heat-conducting sleeve is twice the depth of the upper semi-circular grooves; S02. Insert the boss into the elongated opening of the upper substrate, so that the connecting part is embedded in the connecting groove, and the heat-conducting sleeve is correspondingly inserted into the upper semi-circular groove; install the heat-conducting strip into the strip groove of the lower substrate, ensuring that the arc surfaces at both ends of the heat-conducting strip are in contact with the surface of the heat-conducting sleeve, and that the depth of the strip groove is equal to the thickness of the heat-conducting strip, and that both ends of the strip groove are connected to the lower semi-circular groove. S03. The upper substrate and the lower substrate are attached to each other so that the heat-conducting sleeve is embedded in the space formed by the upper semi-circular groove and the lower semi-circular groove, thus completing the positioning and assembly of the upper and lower substrates. S04. Evenly fix multiple solder rods on the upper surface of the heat-conducting strip, so that the solder rods pass through the through holes of the connecting part and extend into the horn hole of the boss part, ensuring that one end of the solder rod is in contact with the lower substrate, and that the inner diameter of the horn hole near the through hole is equal to the inner diameter of the through hole. S05. Fix three RGB three-color chips on the side of the ceramic base away from the upper substrate, install three wiring pins on the two flat surfaces of the annular side of the ceramic base respectively, so that the wiring pins are electrically connected to the RGB three-color chips, and process the end of the wiring pin away from the ceramic base into a bent part; S06. Install the ceramic base to the middle of the side of the upper substrate facing away from the lower substrate, so that the bent part of the wiring pin extends into the elongated opening and contacts the boss part. S07. Heat the solder block and solder rod head so that the solder block melts and fills the space between the bent part of the wiring pin and the boss part. After the solder rod head melts, it forms a horn-shaped structure in the horn hole. After the solder cools and solidifies, the connection between the wiring pin and the boss part, the solder rod head and the boss part and the lower substrate is completed. S08. Install a transparent spherical cover on the side of the ceramic base away from the upper substrate, so that the RGB three-color chip is placed inside the transparent spherical cover, thus completing the fabrication of the high heat dissipation RGB chip packaging structure.

[0015] The beneficial effects of this invention are: The boss, connector, heat-conducting sleeve, and heat-conducting strip are all good conductors of heat, forming a through-type heat dissipation network. The heat of the wiring pins is transferred to the boss through the solder block, and then conducted to the heat-conducting strip through the connector and heat-conducting sleeve, and finally diffused to the upper and lower substrates. This breaks through the limitation of traditional solder block heat dissipation and greatly improves heat dissipation efficiency.

[0016] After the solder rod melts, it forms a trumpet-shaped structure inside the trumpet hole. At this time, the trumpet-shaped structure formed by the solder rod inside the trumpet hole cooperates with the trumpet hole, making the lower substrate tend to move to the upper substrate. This increases the contact area with the boss and strengthens the mechanical connection stability between the lower substrate and the upper substrate.

[0017] The wiring pins are fixed to the boss by solder blocks, and the solder rod head connects the boss to the heat-conducting strip. The upper and lower substrates are positioned and attached by heat-conducting sleeves to form a multi-fixed structure, which avoids loosening of the connection due to vibration or thermal expansion and contraction when the chip is working, and improves the damage resistance of the packaging structure. The design of the lower and upper substrates makes it easy to hide and encapsulate components such as the connection part and the heat-conducting strip.

[0018] The wiring pins are firmly electrically connected to the RGB three-color chip, and the bent part and the boss part are tightly fitted with solder blocks to ensure stable current transmission, avoid chip flickering or failure caused by poor contact, and ensure stable electrical performance. Attached Figure Description

[0019] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of a high heat dissipation RGB chip packaging structure according to the present invention; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is an exploded view of an RGB chip packaging structure with high heat dissipation according to the present invention; Figure 4 This is an exploded view of another perspective of the high heat dissipation RGB chip packaging structure of the present invention; Figure 5 for Figure 4 Enlarged view at point B in the middle; Figure 6 This is a schematic diagram of the assembly of the heat-conducting sleeve, the connecting part and the upper substrate in a high heat dissipation RGB chip packaging structure of the present invention. Figure 7 This is an assembly diagram of the heat-conducting sleeve, connecting part, and boss part in a high heat dissipation RGB chip packaging structure of the present invention. Figure 8 This is a cross-sectional assembly diagram of the heat-conducting sleeve, connecting part, and boss part in a high heat dissipation RGB chip packaging structure of the present invention. In the picture: 100. Upper substrate; 101. Oblong opening; 102. Upper semicircular groove; 103. Connecting groove; 200. Ceramic base; 201. Transparent spherical cover; 202. Flat surface; 203. Wiring pin; 2031. Bending part; 204. RGB three-color chip; 300. Boss part; 301. Heat-conducting sleeve; 302. Speaker hole; 303. Through hole; 304. Connecting part; 400. Solder block; 500. Lower substrate; 501. Lower semicircular groove; 502. Strip groove; 600. Solder rod head; 601. Heat-conducting strip; 602. Curved surface. Detailed Implementation

[0020] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0021] Please see Figures 1-8 This invention provides a technical solution: a high heat dissipation RGB chip packaging structure, including an upper substrate 100. Four upper semi-circular grooves 102 are formed on one edge of the upper substrate 100. Two elongated openings 101 are formed on the upper surface of the upper substrate 100. Two connecting grooves 103 are symmetrically formed on the lower surface of the upper substrate 100. The two ends of the connecting grooves 103 communicate with the two upper semi-circular grooves 102, and the two connecting grooves 103 communicate with the two elongated openings 101. Two sets of bosses 300 are respectively inserted into the two elongated openings 101. A connecting part 304 is mounted on one side of each boss 300. The connecting part 304 is inserted into the connecting groove 101. Inside the groove 103, heat-conducting sleeves 301 are installed at both ends of the connecting part 304. The heat-conducting sleeves 301 have a semi-circular structure and are inserted into the upper semi-circular groove 102. The upper substrate 100 has a lower substrate 500 on the side opposite to the ceramic seat 200. Four lower semi-circular grooves 501 are opened on one edge of the lower substrate 500. The lower semi-circular grooves 501 are arranged concentrically with the upper semi-circular grooves 102. The heat-conducting sleeves 301 are inserted into the space formed by the upper semi-circular grooves 102 and the lower semi-circular grooves 501. The depth of the upper semi-circular groove 102 is equal to the depth of the lower semi-circular groove 501. The thickness of the heat-conducting sleeves 301 is twice the depth of the upper semi-circular groove 102. The boss portion 300, the connecting portion 304, the heat-conducting sleeve 301, and the heat-conducting strip 601 are all good conductors of heat, forming a through-type heat dissipation network. The heat of the wiring pin 203 is transferred to the boss portion 300 through the solder block 400, and then conducted to the heat-conducting strip 601 through the connecting portion 304 and the heat-conducting sleeve 301, and finally diffused to the upper and lower substrates 500. This breaks through the limitation of the traditional solder block 400 for single heat dissipation and greatly improves the heat dissipation efficiency.

[0022] A ceramic base 200 is mounted on the middle of the side of the upper substrate 100 facing away from the lower substrate 500. Three RGB three-color chips 204 are mounted on the side of the ceramic base 200 facing away from the upper substrate 100, representing red, blue, and green light respectively. Two symmetrically arranged flat surfaces 202 are machined on the annular side of the ceramic base 200, each with three wiring pins 203. A transparent spherical cover 201 is mounted on the side of the ceramic base 200 facing away from the upper substrate 100, housing the RGB three-color chips 204. The circuit is housed within a transparent dome 201. A wiring pin 203 is electrically connected to an RGB three-color chip 204. The end of the wiring pin 203 furthest from the ceramic base 200 extends into an elongated opening 101. A bent portion 2031 is installed at the end of the wiring pin 203 furthest from the ceramic base 200. The bent portion 2031 and the wiring pin 203 are integrally formed. The bent portion 2031 is located within the elongated opening 101 and contacts the boss portion 300. The wiring pin 203 is connected to the boss portion 300 via a molten and solidified solder block 400. The wiring pin 203 and the RGB three-color chip 204 are securely electrically connected. The bent portion 2031 and the boss portion 300 are tightly fitted via the solder block 400, ensuring stable current transmission, preventing chip flickering or malfunctions caused by poor contact, and guaranteeing stable electrical performance.

[0023] The boss portion 300 has a plurality of horn holes 302 evenly spaced on the side facing away from the connecting portion 304. The connecting portion 304 has a plurality of through holes 303 evenly spaced on the side facing away from the boss portion 300. The plurality of through holes 303 are respectively connected to the plurality of horn holes 302 and are concentric. The inner diameter of the horn hole 302 near the through hole 303 is equal to the inner diameter of the through hole 303. The lower substrate 500 has two grooves 502 recessed on the side facing the upper substrate 100. The two ends of the grooves 502 are connected to two matching lower semicircular grooves 501. The heat-conducting strip 601 is installed in the grooves 502. Inside the 2nd section, the depth of the strip groove 502 is equal to the thickness of the heat-conducting strip 601. Both ends of the heat-conducting strip 601 are machined with arc-shaped surfaces 602 that match the surface of the heat-conducting sleeve 301. The arc-shaped surfaces 602 on the heat-conducting strip 601 are in close contact with the surface of the heat-conducting sleeve 301. The heat-conducting strip 601 is a good conductor of heat. Multiple solder rods 600 are evenly installed on one side of the heat-conducting strip 601. The end of the solder rod 600 away from the lower substrate 500 extends into the elongated opening 101. The solder rod 600 is heated by the molten solder block 400 and melted into the horn hole 302 to form a horn-shaped structure. After the solder rod head 600 melts, it forms a horn-shaped structure inside the horn hole 302. It cooperates with the horn hole 302 to make the lower substrate 500 tend to move towards the upper substrate 100. This increases the contact area with the boss 300 and strengthens the mechanical connection stability between the lower substrate 500 and the upper substrate 100. The wiring pin 203 is fixed to the boss 300 by the solder block 400. The solder rod head 600 connects the boss 300 and the heat-conducting strip 601. The upper substrate 100 and the lower substrate 500 are positioned and attached by the heat-conducting sleeve 301 to form a multi-fixed structure. This prevents the connection from loosening due to vibration or thermal expansion and contraction during chip operation and improves the damage resistance of the packaging structure. The design of the lower substrate 500 and the upper substrate 100 makes it easy to hide and package components such as the connection part 304 and the heat-conducting strip 601.

[0024] A method for fabricating a high heat dissipation RGB chip packaging structure: A boss portion 300, a connecting portion 304, and a heat-conducting sleeve 301 are fabricated using a material with good thermal conductivity, forming a single integral structure. An upper substrate 100 is fabricated, with four upper semi-circular grooves 102 formed on one edge of the upper substrate 100, two elongated openings 101 formed on the upper surface, and two symmetrically formed connecting grooves 103 on the lower surface, ensuring that both ends of the connecting grooves 103 communicate with the corresponding upper semi-circular grooves 102 and with the elongated openings 101. A lower substrate 500 is fabricated, with four lower semi-circular grooves 501 formed on one edge of the lower substrate 500, such that the lower semi-circular grooves 501 communicate with the upper... The upper semicircular grooves 102 of the substrate 100 are concentrically arranged, and the upper semicircular grooves 102 and the lower semicircular grooves 501 have the same depth. The thickness of the heat-conducting sleeve 301 is twice the depth of the upper semicircular grooves 102. The boss portion 300 is inserted into the elongated oval opening 101 of the upper substrate 100, so that the connecting portion 304 is embedded in the connecting groove 103, and the heat-conducting sleeve 301 is correspondingly inserted into the upper semicircular groove 102. The heat-conducting strip 601 is installed into the strip groove 502 of the lower substrate 500, ensuring that the arc-shaped surfaces 602 at both ends of the heat-conducting strip 601 are in contact with the surface of the heat-conducting sleeve 301. Multiple solder rod heads are evenly fixed on the upper surface of the heat-conducting strip 601. 600, so that the solder rod head 600 passes through the through hole 303 of the connecting part 304 and extends into the horn hole 302 of the boss part 300, ensuring that one end of the solder rod head 600 is in contact with the lower substrate 500; three RGB three-color chips 204 are fixed on the side of the ceramic base 200 away from the upper substrate 100, and three wiring pins 203 are respectively installed on the two flat surfaces 202 of the annular side of the ceramic base 200, so that the wiring pins 203 are electrically connected to the RGB three-color chips 204, and the end of the wiring pin 203 away from the ceramic base 200 is processed into a bent part 2031; for the solder block 40 The solder rod 600 is heated to melt the solder block 400 and fill it between the bent portion 2031 of the wiring pin 203 and the boss portion 300. After the solder rod 600 melts, it forms a horn-shaped structure in the horn hole 302. After the solder cools and solidifies, the connection between the wiring pin 203 and the boss portion 300, the solder rod 600 and the boss portion 300 and the lower substrate 500 are fixedly connected. A transparent spherical cover 201 is installed on the side of the ceramic base 200 away from the upper substrate 100, so that the RGB three-color chip 204 is placed in the transparent spherical cover 201, thus completing the preparation of the high heat dissipation RGB chip packaging structure.

[0025] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A high heat dissipation RGB chip packaging structure, characterized in that, include: The upper substrate (100) has four upper semi-circular grooves (102) on one edge. The upper surface of the upper substrate (100) has two elongated oval openings (101). The lower surface of the upper substrate (100) has two symmetrically arranged connecting grooves (103). The two ends of the connecting grooves (103) are respectively connected to the two upper semi-circular grooves (102), and the two connecting grooves (103) are respectively connected to the two elongated oval openings (101). The boss (300) is provided in two sets. The two sets of bosses (300) are respectively inserted into two elongated openings (101). A connecting part (304) is installed on one side of the boss (300). The connecting part (304) is inserted into the connecting groove (103). A heat-conducting sleeve (301) is installed at both ends of the connecting part (304). The heat-conducting sleeve (301) has a semi-circular structure and is inserted into the upper semi-circular groove (102). The boss (300), the connecting part (304) and the heat-conducting sleeve (301) are all good conductors of heat. A ceramic base (200) is installed on the middle part of the side of the upper substrate (100) facing away from the lower substrate (500). Three RGB three-color chips (204) are installed on the side of the ceramic base (200) facing away from the upper substrate (100). Two rows of wiring pins (203) are installed on the outer surface of the ceramic base (200). The wiring pins (203) are electrically connected to the RGB three-color chips (204). The end of the wiring pin (203) away from the ceramic base (200) extends into the elongated opening (101). The wiring pin (203) is connected to the boss part (300) through the molten and solidified tin block (400).

2. The high heat dissipation RGB chip packaging structure according to claim 1, characterized in that: The upper substrate (100) has a lower substrate (500) on the side opposite to the ceramic base (200). The lower substrate (500) has four lower semicircular grooves (501) on one edge. The lower semicircular grooves (501) are arranged concentrically with the upper semicircular grooves (102). The heat-conducting sleeve (301) is inserted into the space formed by the upper semicircular grooves (102) and the lower semicircular grooves (501). The depth of the upper semicircular groove (102) is equal to the depth of the lower semicircular groove (501). The thickness of the heat-conducting sleeve (301) is twice the depth of the upper semicircular groove (102).

3. The high heat dissipation RGB chip packaging structure according to claim 2, characterized in that: The boss portion (300) has a plurality of horn holes (302) evenly distributed on the side away from the connecting portion (304). The connecting portion (304) has a plurality of through holes (303) evenly distributed on the side away from the boss portion (300). The plurality of through holes (303) are connected to the plurality of horn holes (302) and are concentric. The inner diameter of the horn hole (302) near the through hole (303) is equal to the inner diameter of the through hole (303). A solder rod head (600) is inserted into the channel formed by the horn hole (302) and the through hole (303). One end of the solder rod head (600) is connected to the lower substrate (500). The end of the solder rod head (600) away from the lower substrate (500) extends into the elongated opening (101). The solder rod head (600) is heated by the molten solder block (400) and melted in the horn hole (302) to form a horn-shaped structure.

4. The high heat dissipation RGB chip packaging structure according to claim 3, characterized in that: The area of ​​the lower substrate (500) covered by the connecting part (304) is equipped with a heat-conducting strip (601), and a plurality of solder rod heads (600) are uniformly installed on one side of the heat-conducting strip (601).

5. The high heat dissipation RGB chip packaging structure according to claim 4, characterized in that: The lower substrate (500) has two recessed grooves (502) on the side facing the upper substrate (100). The two ends of the grooves (502) are connected to two matching lower semi-circular grooves (501). The heat-conducting strip (601) is installed in the grooves (502). The depth of the grooves (502) is equal to the thickness of the heat-conducting strip (601). Both ends of the heat-conducting strip (601) are machined with arc-shaped surfaces (602) that match the surface of the heat-conducting sleeve (301). The arc-shaped surfaces (602) on the heat-conducting strip (601) are in contact with the surface of the heat-conducting sleeve (301). The heat-conducting strip (601) is a good conductor of heat.

6. The high heat dissipation RGB chip packaging structure according to claim 1, characterized in that: The ceramic base (200) has two symmetrically arranged flat surfaces (202) on its annular side. Three wiring pins (203) are installed on each of the two flat surfaces (202). A transparent spherical cover (201) is installed on the side of the ceramic base (200) away from the upper substrate (100). The RGB three-color chip (204) is set inside the transparent spherical cover (201).

7. The high heat dissipation RGB chip packaging structure according to claim 6, characterized in that: The end of the wiring pin (203) away from the ceramic base (200) is equipped with a bent part (2031). The bent part (2031) and the wiring pin (203) are integrally formed. The bent part (2031) is located inside the elongated opening (101) and is in contact with the boss part (300).

8. The high heat dissipation RGB chip packaging structure according to claim 7, characterized in that: The three RGB three-color chips (204) are red light chip, blue light chip and green light chip respectively.

9. A method for fabricating a high heat dissipation RGB chip packaging structure according to claims 1-8, characterized in that... Includes the following steps: S01. Select a heat-conducting material to process the boss (300), the connecting part (304) and the heat-conducting sleeve (301) so that the three are integrally formed; process the upper substrate (100), and open four upper semi-circular grooves (102) on one side edge of the upper substrate (100), open two elongated oval openings (101) on the upper surface, and open two connecting grooves (103) symmetrically on the lower surface, so that the two ends of the connecting grooves (103) are respectively connected to the corresponding upper semi-circular grooves (102) and connected to the elongated oval openings (101); process the lower substrate (500), and open four lower semi-circular grooves (501) on one side edge, so that the lower semi-circular grooves (501) are concentrically arranged with the upper semi-circular grooves (102) of the upper substrate (100), and the upper semi-circular grooves (102) and the lower semi-circular grooves (501) have the same depth, and the thickness of the heat-conducting sleeve (301) is twice the depth of the upper semi-circular grooves (102); S02. Insert the boss (300) into the elongated opening (101) of the upper substrate (100), so that the connecting part (304) is embedded in the connecting groove (103), and the heat-conducting sleeve (301) is correspondingly inserted into the upper semi-circular groove (102); install the heat-conducting strip (601) into the strip groove (502) of the lower substrate (500), ensuring that the arc surfaces (602) at both ends of the heat-conducting strip (601) are in contact with the surface of the heat-conducting sleeve (301), and that the depth of the strip groove (502) is equal to the thickness of the heat-conducting strip (601), and that both ends of the strip groove (502) are connected to the lower semi-circular groove (501); S03. The upper substrate (100) and the lower substrate (500) are attached to each other so that the heat-conducting sleeve (301) is embedded in the space formed by the upper semi-circular groove (102) and the lower semi-circular groove (501) to complete the positioning and assembly of the upper and lower substrates (500); S04. A plurality of solder rod heads (600) are uniformly fixed on the upper surface of the heat-conducting strip (601), so that the solder rod heads (600) pass through the through hole (303) of the connecting part (304) and extend into the horn hole (302) of the boss part (300), ensuring that one end of the solder rod head (600) is in contact with the lower substrate (500), and the inner diameter of the horn hole (302) near the through hole (303) is equal to the inner diameter of the through hole (303); S05. Fix three RGB three-color chips (204) on the side of the ceramic base (200) away from the upper substrate (100), install three wiring pins (203) on the two flat surfaces (202) of the annular side of the ceramic base (200) respectively, so that the wiring pins (203) are electrically connected to the RGB three-color chips (204), and process the end of the wiring pin (203) away from the ceramic base (200) into a bent part (2031). S06. Install the ceramic base (200) to the middle of the side of the upper substrate (100) away from the lower substrate (500), so that the bent part (2031) of the wiring pin (203) extends into the elongated opening (101) and contacts the boss part (300); S07. Heat the solder block (400) and the solder rod head (600) so that the solder block (400) melts and fills the space between the bent part (2031) and the boss part (300) of the wiring pin (203). After the solder rod head (600) melts, it forms a horn-shaped structure in the horn hole (302). After the solder cools and solidifies, the connection between the wiring pin (203) and the boss part (300), the solder rod head (600) and the boss part (300) and the lower substrate (500) is completed. S08. Install a transparent spherical cover (201) on the side of the ceramic base (200) away from the upper substrate (100) so that the RGB three-color chip (204) is placed inside the transparent spherical cover (201), thus completing the preparation of the high heat dissipation RGB chip packaging structure.

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