Double-station turret testing device and testing method for testing and sorting chips

Abstract

The invention discloses a double-station turret testing device and method for chip testing and sorting. The device comprises a supporting assembly, a turret rotating part, a visual station, a mold closing station, a pressing station, a plurality of sets of testing stations and a cover opening station. The turret rotating part, the visual station, the mold closing station and the pressing station are all hung on the supporting assembly; the turret rotating part comprises a rotating driving unit, a rotating disc and a plurality of double-test-seat stations, and the plurality of double-test-seat stations are distributed on the circumference of the rotating disc; during testing, the turret rotating part rotates intermittently, and the double-test-seat station is sequentially moved to the positions of the vision station, the die assembly station, the pressing station, the test station and the uncovering station. The method comprises the steps that feeding and visual positioning are carried out; closing the mold; testing in parallel; and uncovering and blanking. According to the technology provided by the invention, parallel testing is realized by integrating double testing seats at each turret station, and the testing efficiency is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of printed circuit chip manufacturing and automated testing technology, and in particular to a dual-station turret testing device and method for chip testing and sorting. Background Technology

[0002] In the back-end processes of semiconductor manufacturing, chip testing and sorting equipment is used to perform electrical performance tests on chips and classify them according to the test results. Currently, the mainstream testing and sorting equipment mainly consists of two types of structures: linear and turret.

[0003] Linear equipment uses a linear conveyor track, with chips being transported by robotic arms along a straight path through stations such as loading, testing, and sorting. Its operation is serial, with long reciprocating paths and frequent acceleration and deceleration of the robotic arms, resulting in low uptime per hour (UPH), typically struggling to exceed 2000 units, thus failing to meet the high-throughput testing requirements of third-generation semiconductors.

[0004] The core of a turret-type testing device is an intermittently rotating disk (turret), with multiple chip-carrying stations (mandrels) evenly distributed along its edge. Each rotation of the turret increments the number of chips, causing all stations to move synchronously to the next process, enabling parallel chip flow between stations and significantly improving efficiency compared to linear systems. However, the core testing module of existing turret-type devices still has a fundamental limitation: in the most time-consuming testing phase, each testing station can only test one chip per single stop cycle. This means that even if the turret rotation speed reaches its limit, the testing throughput is still limited by the serial mode of single station and single chip, which is the core reason why the UPH (Universal Power Hours) of domestic equipment currently hovers around 2000.

[0005] To improve efficiency, the most direct method is to increase the number of test stations on the turret. However, this leads to an increase in turret diameter and inertia, placing extremely high demands on the rigidity and control precision of the drive system, making the equipment bulky, expensive, and degrading in dynamic performance. Furthermore, once the structure of the existing turret test module and the function of the test stations are determined, it is difficult to flexibly adjust or expand, resulting in insufficient equipment flexibility.

[0006] Therefore, there is an urgent need for a new turret testing solution that can significantly improve test throughput while maintaining equipment compactness and control precision. Summary of the Invention

[0007] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a dual-station turret testing device and testing method for chip testing and sorting, which can improve the testing efficiency of the equipment by more than double, while significantly improving production flexibility and testing reliability while maintaining the compact structure of the equipment.

[0008] To achieve the above objectives, a first aspect of the present invention provides a dual-station turret testing device for chip testing and sorting, the testing device comprising a support assembly, a turret rotation part, a vision station, a mold closing station, a pressing station, multiple sets of testing stations, and a cap opening station;

[0009] The turret rotating part, vision station, mold closing station and pressing station are all mounted on the support assembly;

[0010] The turret rotation unit includes a rotation drive unit, a turntable, and multiple dual-test base stations, which are distributed on the circumference of the turntable.

[0011] During testing, the turret rotating part rotates intermittently under the drive of the rotation drive unit, moving the dual test seat station sequentially to the positions of the vision station, mold closing station, pressing station, test station and cover opening station.

[0012] In some embodiments of the first aspect of this application, each of the dual test fixture stations is equipped with two sets of test fixture kits. Each set of test fixture kits can independently carry and position a chip to be tested, so that the station transfer and testing of the two chips can be completed simultaneously for each division of the turret rotation.

[0013] In some embodiments of the first aspect of this application, the test fixture kit includes a mounting body, an upper test fixture, a lower test fixture, a flip cover, a snap-fit ​​mechanism, and a status detector;

[0014] The upper test seat is mounted on the flip cover, and the flip cover is rotatably connected to the mounting body through a rotating shaft. The lower test seat is fixed to the mounting body and is set correspondingly to the upper test seat.

[0015] The latching mechanism includes a latch, a latching shaft, and a latching spring. The latching spring drives the latch to engage the flip cover to achieve locking.

[0016] The state detector includes a mold-closed state detection sensor and a mold-opening state detection sensor, which are used to detect the mold-closed and mold-opening states of the flip cover, respectively.

[0017] In some embodiments of the first aspect of this application, the test fixture kit further includes a Z-guide post, a Z-axis lifting spring, and a downward pressure buffer;

[0018] The Z-guide post passes through the Z-direction linear bearing installed on the mounting body, and the Z-direction lifting spring is sleeved on the Z-guide post;

[0019] The pressure buffer is installed on the mounting body and is used for buffer protection during pressure testing.

[0020] In some embodiments of the first aspect of this application, the test fixture kit is connected to the dual test fixture station via a quick-change connection structure. The dual test fixture station includes a Z-axis slide structure. The quick-change connection structure includes a quick-change-fixed side and a quick-change-fixed side. The quick-change-fixed side is mounted on the Z-axis slide structure via a quick-change-fixed side mounting plate. The quick-change-fixed side is disposed on the test fixture kit. The test fixture kit is detachably connected to the quick-change-fixed side via the quick-change-fixed side.

[0021] In some embodiments of the first aspect of this application, the vision station includes a camera, a lens, a point light source, and a ring light source;

[0022] The camera is mounted on the mounting base plate via a camera adjustment block, and the lens is connected to the camera and secured with the aid of a lens clamp.

[0023] The point light source and the ring light source are fixed to the mounting base plate by the light source fixing sheet metal, and are used to take pictures and position the lower test seat to guide the precise placement of the chip.

[0024] In some embodiments of the first aspect of this application, the pressing station includes a Z-shaped pressing cylinder, a pressing structure, and a pressing buffer;

[0025] The Z-push-down cylinder is mounted on the mounting base plate, the push-down structure is connected to the Z-push-down cylinder, and the push-down buffer is mounted on the push-down structure.

[0026] In some embodiments of the first aspect of this application, the mold closing station includes an X-axis cylinder, a Z-axis cylinder, a primary roller, a secondary roller, and a linear guide assembly;

[0027] The X-axis cylinder drives the Z-axis cylinder to move along the X-axis, so that the first-stage wheel contacts the flip cover and pushes the flip cover to rotate to a horizontal state.

[0028] The Z-axis cylinder drives the first-stage wheel and the second-stage roller to move along the Z-axis, pushing the flip cover down and causing the buckle mechanism to automatically lock the flip cover;

[0029] The opening station includes a Z-axis lifting cylinder, an R-axis rotating cylinder, a rotating lever, and a tension spring;

[0030] The Z-axis lifting cylinder drives the R-axis rotating cylinder to rise and fall, the R-axis rotating cylinder drives the rotating lever to rotate around the pivot, the rotating lever pushes the buckle to unlock, and the tension spring drives the rotating lever to reset.

[0031] In some embodiments of the first aspect of this application, the test station includes a DC test station and an AC test station;

[0032] The DC test station includes a DC test board assembly, a Z-axis adjustment assembly, a Z-axis base plate, an X-axis adjustment base plate, and a Y-axis adjustment base plate;

[0033] The DC test board assembly is mounted on the Z-axis base plate via the Z-axis adjustment assembly, the Z-axis base plate is mounted on the X-axis adjustment base plate, and the X-axis adjustment base plate is mounted on the Y-axis adjustment base plate.

[0034] The AC test station includes an AC test cabinet, a Z-axis adjustment component, an X-axis adjustment component, and a Y-axis adjustment component.

[0035] The AC test cabinet is installed on a primary fixed plate. The primary fixed plate is connected to a secondary fixed plate via a Z-axis adjustment component. The secondary fixed plate is connected to a tertiary fixed bracket via an X-axis adjustment component. The tertiary fixed bracket is installed on the machine via a Y-axis adjustment component.

[0036] To achieve the above objectives, a second aspect of the present invention provides a dual-station turret testing method for chip testing and sorting, the testing method comprising the following steps:

[0037] S1: Place the two chips to be tested onto the lower test sockets of the two test socket fixtures at the dual test socket station. First, use the vision station to take pictures and position them to ensure accurate placement, and then start the vacuum to fix the chips.

[0038] S2: The turret moves the chip to the mold closing station, pushes the flip cover to rotate and press down, so that the buckle locks the mold, and at the same time, nitrogen gas is filled for protection and the lower test socket is heated.

[0039] S3: The turret rotates sequentially to each test station. The pressure station pushes the test fixture kit to dock with the test station. The test station simultaneously performs electrical performance tests on the two chips. After the test is completed, the pressure station resets.

[0040] S4: The turret moves the test fixture kit containing the chip to the opening station. The opening station pushes the latch to unlock, and the flip cover opens under the action of the flip cover torsion spring, and the nitrogen gas is turned off.

[0041] S5: The turret moves to the unloading station, the vacuum is turned off, and the two tested chips are transferred to the corresponding station;

[0042] in:

[0043] The electrical performance test includes DC test and AC test. The turntable first rotates to the DC test station to complete the high-temperature DC test, and then rotates to the AC test station to complete the high-temperature AC test. During the test, the temperature control module keeps the chip temperature stable.

[0044] When it is necessary to replace the test product or handle test abnormalities, the test fixture kit and the dual test station can be separated by unlocking the quick-change connection structure, and a brand new test fixture kit can be replaced and then locked again to achieve quick product change or maintenance.

[0045] The advantages of this invention are as follows: First, by adopting a dual-station parallel testing architecture and integrating two independent test fixtures at each turret station, the testing of two chips can be completed simultaneously in a single turret stop, thereby achieving a significant improvement in testing efficiency, increasing the output per hour (UPH) from approximately 2000 to over 4000. Second, by employing a precision mechanical structure and a high-precision vision-guided positioning system, combined with a nitrogen-protected environment and a precise temperature control module, high repeatability of chip placement and testing alignment is ensured, and oxidation of the chips during high-temperature testing is effectively prevented, significantly enhancing the reliability and effectiveness of the testing. Thirdly, the modular test fixture kit design and unique quick-change interface significantly shorten maintenance and product changeover time. Combined with the multi-directional adjustment mechanism of the test station, the equipment can quickly adapt to diverse chip testing needs, thereby significantly improving the overall utilization rate and production flexibility of the equipment. Fourthly, by highly integrating multiple processes such as loading and unloading, positioning, mold closing, testing, and mold opening into a compact system, and achieving collaborative control and complete status monitoring of each functional station, a fully automated and intelligently managed testing platform has been built, comprehensively improving the system's integration, reliability, and intelligence level. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a front view of the assembly of the dual-station turret testing device of the present invention;

[0048] Figure 2 This is a top view of the overall assembly of the dual-station turret testing device of the present invention;

[0049] Figure 3 This is a schematic diagram of the structure of the rotating part of the turret in this invention;

[0050] Figure 4 This is a schematic diagram of the dual-test station structure of the present invention;

[0051] Figure 5 This is a schematic diagram of the structure of the test fixture of the present invention;

[0052] Figure 6 This is a schematic diagram of the structure of the vision workstation of the present invention;

[0053] Figure 7 This is a schematic diagram of the mold closing station of the present invention;

[0054] Figure 8 This is a schematic diagram of the pressing station of the present invention;

[0055] Figure 9 This is a schematic diagram of the structure of the DC test station of the present invention;

[0056] Figure 10 This is a schematic diagram of the AC test station of the present invention;

[0057] Figure 11 This is a schematic diagram of the opening station of the present invention;

[0058] Figure 12 This is a flowchart illustrating the dual-station turret testing method of the present invention. Detailed Implementation

[0059] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0060] Example 1:

[0061] Figure 1 and Figure 2 The diagram shows a front view and a top view of the assembled dual-station turret testing device for chip testing and sorting according to the present invention. Figure 1 and Figure 2 As shown, the device mainly consists of a support assembly 100, a turret rotating part 200, a vision station 300, a mold closing station 400, a pressing station 500, a DC testing station 600, an AC testing station 700, and a cover opening station 800.

[0062] Among them, the vision station 300, the mold closing station 400, and the pressing station 500 are all connected and mounted on the support component 100; the DC test station 600, the AC test station 700, and the cover opening station 800 are all installed on the machine base and can be adjusted in installation position relative to the turret rotating part 200.

[0063] The structure and configuration of each module in the device will be explained in detail below.

[0064] like Figure 3As shown, the turret rotating part 200 mainly consists of a rotating drive unit 201, an electrical slip ring 202, an electrical component group 203, a dual test seat station 210, a turntable 204, and a fixed base plate 205.

[0065] The fixed end of the rotary drive unit 201 is mounted on the fixed base plate 205, and the turntable 204 is mounted on the rotating side of the rotary drive unit 201. The rotating side of the electric slip ring 202 is mounted on the turntable 204, and the fixed side of the electric slip ring 202 is mounted on the support assembly 100, so that the station circuit can be connected normally and the gas can be supplied during the 360° rotation. The electrical component group 203 is mounted on the turntable 204. The built-in electrical component group 203 mainly includes solenoid valves, vacuum generators, temperature control modules, etc., to realize the control and signal transmission inside the turret. The dual test seat station 210 is mounted on the turntable 204 in a circumferentially divided manner.

[0066] It should be noted that the rotary drive unit 201 can use a DD motor, magnetic levitation conveyor line, motor plus cam divider, motor plus reducer, etc. to achieve rotary transfer; the number of dual test station 210 on the turntable 204 can be adjusted to six or eight according to actual production capacity requirements; the number and type of test stations (such as DC test station 600, AC test station 700) can also be increased, decreased or replaced according to test process requirements (such as adding UIS function test station), and this invention does not impose any special limitations.

[0067] like Figure 4 As shown, the dual-test station 210 mainly consists of a fixed structure assembly 211, a Z-axis slide structure 212, a pre-pressure adjustment assembly 213, a buffer 214, a quick-change fixed side 215, a flow adjustment assembly 216, a pressure monitoring and display component 217, a guide rail assembly 218, a Z-axis height adjustment component 219, a quick-change fixed side mounting plate 222, a spring 221, and a test station fixture kit 220. In this embodiment of the invention, there are two sets of test station fixture kits 220, which are independent of each other. Each set of test station fixture kits 220 is configured to simultaneously accommodate and test one chip, thereby realizing parallel testing at dual stations.

[0068] The fixed structure assembly 211 is mounted on the turntable 204. The flow adjustment assembly 216, the pressure monitoring display 217, and the guide rail assembly 218 are mounted on the fixed structure assembly 211. The Z-axis slide structure 212 is mounted on the guide rail assembly 218 to enable it to move along the Z-axis. The Z-axis height adjustment component 219 is mounted on the Z-axis slide structure 212. The pre-pressure adjustment assembly 213 is mounted on the fixed structure assembly 211. The spring 221 is sleeved on the pre-pressure adjustment assembly 213 to provide buffer pre-pressure in the Z-axis direction. The quick-change fixed side mounting plate 222 is mounted on the Z-axis slide structure 212. The quick-change fixed side 215 is mounted on the quick-change fixed side mounting plate 222. The test fixture kit 220 is mounted on the quick-change fixed side 215 via a quick-change connection.

[0069] like Figure 5 As shown, the test fixture kit 220 mainly consists of a lower test seat 251, an upper test seat 252, a quick-change fixture side 230, a quick-change connector 231, a mounting body 232, a Z-axis floating block 233, a downward pressure buffer 234, a flip cover 235, a guide bushing 236, a mold closing status sensor 237, a mold opening status sensor 238, a mold opening status detection sensor 239, a mold closing status detection sensor 240, a mold closing buffer 241, a Z-axis lifting spring 242, a Z-axis guide post 243, a flip cover torsion spring 244, a flip cover pivot 249, a positioning pin 245, a latch pivot 246, a latch 247, a latch spring 248, a Z-axis linear bearing 250, a pivot bearing 253, a mold opening status detection sensor fixing component 254, a latch base 255, a latch bearing 256, and a pivot clamp 257.

[0070] The quick-change fixture side 230 is mounted on the quick-change fixed side 215 via a quick-change connector. A quick-change connector 231 is mounted on the quick-change fixture side 230. The mounting body 232 is mounted on the quick-change connector 231. The upper test seat 252 is mounted on the flip cover 235. The flip cover 235 is mounted on the flip cover pivot 249 via a pivot bearing 253. The flip cover pivot 249 passes through a Z-axis floating block 233 and is axially fixed using a pivot clamp 257. A flip cover torsion spring 244 is mounted on the flip cover pivot 249 and acts between the flip cover 235 and the Z-axis floating block 233. A Z-axis guide post 243 passes through a Z-axis linear bearing 250 mounted on the mounting body 232. A Z-axis lifting spring 242 is sleeved on the Z-axis guide post 243 and acts between the quick-change connector 231 and the Z-axis floating block 233. The Z-axis floating block 233 is mounted on the Z-axis guide post 243. A positioning pin 245 is installed... On the mounting body 232, a downward pressure buffer 234 is mounted on the mounting body 232, a mold closing state sensor 237 is mounted on the flip cover 235, a mold opening state sensor 238 is mounted on the flip cover 235, a mold opening state detection sensor fixing part 254 is mounted on the Z-direction floating block 233 and the rotating shaft clamp 257, a mold opening state detection sensor 239 is mounted on the mold opening state detection sensor fixing part 254, a mold closing state detection sensor 240 is mounted on the mounting body 232, and a mold closing buffer 241 is mounted on the mounting body 232; a snap-fit ​​base 255 is mounted on the mounting body 232, a snap-fit ​​bearing 256 is mounted on the snap-fit ​​base 255, a snap-fit ​​rotating shaft 246 passes through the snap-fit ​​247 and the snap-fit ​​bearing 256, allowing the snap-fit ​​247 to rotate around it, and a snap-fit ​​spring 248 is mounted between the snap-fit ​​base 255 and the snap-fit ​​247 to provide a rebound force for the snap-fit.

[0071] It should be noted that the mechanical opening and closing mechanism composed of the flip cover 235, buckle 247, etc., described above can also be implemented by an electric locking mechanism such as an electromagnetic lock, provided that the locking force and reliability requirements are met. This invention does not impose any special limitations.

[0072] like Figure 6 As shown, the vision station 300 mainly consists of a camera 301, a lens 303, a point light source 304, a ring light source 302, a mounting base plate 305, a lower fixed support 306, an upper fixed support 307, a light source fixing sheet metal 308, a lens clamp 309, and a camera adjustment block 310.

[0073] The lower fixed support 306 and the upper fixed support 307 are bolted to the support assembly 100. The mounting base plate 305 is mounted on the lower fixed support 306 and the upper fixed support 307. The lens 303 is connected to the camera 301 through its own interface. The camera 301 is mounted on the camera adjustment block 310. The camera adjustment block 310 is mounted on the mounting base plate 305. The point light source 304 and the ring light source 302 are mounted on the light source fixing sheet metal 308. The light source fixing sheet metal 308 is mounted on the mounting base plate 305. The lens 303 passes through the lens clamp 309, which provides auxiliary support and prevents loosening of the lens 303.

[0074] like Figure 7 As shown, the mold closing station 400 mainly consists of a mounting support 401, an X-axis cylinder 402, a Z-axis cylinder 403, a downward pressure buffer 404, a Z-axis adapter block 405, a secondary wheel fixing component 406, a secondary roller 407, a primary wheel fixing component 408, a primary wheel 409, an X-axis cylinder mounting plate 410, a linear guide rail assembly 411, a linear guide rail slider mounting component 412, a Z-axis cylinder mounting component 413, and a linear guide rail mounting component 414.

[0075] Among them, the X-direction cylinder mounting plate 410 is mounted on the mounting support 401, the fixed side of the X-direction cylinder 402 is mounted on the X-direction cylinder mounting plate 410, the linear guide rail assembly 411 is mounted on the linear guide rail mounting piece 414, the linear guide rail mounting piece 414 is mounted on the X-direction cylinder mounting plate 410, the linear guide rail slider mounting piece 412 is mounted on the linear guide rail assembly 411, and the Z-direction cylinder mounting piece 413 is mounted on the linear guide rail slider mounting piece 412 and the X-direction cylinder 402, so that it can move in the X direction; the Z-direction cylinder 403 is mounted on the Z-direction cylinder mounting piece 413, the Z-direction adapter block 405 is mounted on the Z-direction cylinder 403, the secondary wheel fixing piece 406 and the primary wheel fixing piece 408 are mounted on the Z-direction adapter block 405, the primary wheel 409 is mounted on the primary wheel fixing piece 408, and the secondary roller 407 is mounted on the secondary wheel fixing piece 406.

[0076] like Figure 8 As shown, the pressing station 500 mainly consists of a mounting base plate 501, a Z-shaped pressing cylinder 502, a pressing structure 503, a pressing buffer 504, and a fixed mounting component 505.

[0077] The fixed mounting component 505 is mounted on the mounting base plate 501, the Z-down pressing cylinder 502 is mounted on the mounting base plate 501, the pressing structure component 503 is mounted on the Z-down pressing cylinder 502, and the pressing buffer 504 is mounted on the pressing structure component 503.

[0078] It should be noted that the cylinders mentioned above, including the X-direction cylinder 402 and Z-direction cylinder 403 of the mold closing station 400, and the Z-direction downward pressing cylinder 502 of the pressing station 500, can also be replaced by electric cylinders or servo modules to achieve more precise control. This invention does not impose any special limitations.

[0079] like Figure 9 As shown, the DC test station 600 mainly consists of a DC test board assembly 601, a Z-axis adjustment assembly 602, a Z-axis base plate 603, an X-axis adjustment base plate 604, and a Y-axis adjustment base plate 605.

[0080] The DC test board assembly 601 is mounted on the Z-axis base plate 603 via the Z-axis adjustment assembly 602. The Z-axis base plate 603 is mounted on the X-axis adjustment base plate 604, and the X-axis adjustment base plate 604 is mounted on the Y-axis adjustment base plate 605.

[0081] like Figure 10 As shown, the AC test station 700 mainly consists of an AC test cabinet 701, a Z-axis adjustment component 702, a primary fixing plate 703, a secondary fixing plate 704, a tertiary fixing bracket 705, an X-axis adjustment component 706, and a Y-axis adjustment component 707.

[0082] The AC test cabinet 701 is mounted on the primary fixed plate 703. The primary fixed plate 703 is connected to the secondary fixed plate 704 via the Z-axis adjustment component 702, allowing its Z-axis height and level to be adjusted. The secondary fixed plate 704 and the X-axis adjustment component 706 are mounted on the tertiary fixed bracket 705, allowing the X-axis position of the secondary fixed plate 704 relative to the tertiary fixed bracket 705 to be adjusted via the X-axis adjustment component 706. The tertiary fixed bracket 705 and the Y-axis adjustment component 707 are mounted on the machine platform, allowing the X-axis position of the tertiary fixed bracket 705 relative to the tertiary fixed bracket 705 to be adjusted via the Y-axis adjustment component 707.

[0083] like Figure 11 As shown, the cover opening station 800 mainly consists of a mounting base 801, a Z-axis lifting cylinder 802, an R-axis rotating cylinder 803, an R-axis cylinder buffer 807, a tension spring 804, a rotating shaft 805, a rotating lever 806, an R-axis component mounting plate 808, an R-axis support column 809, a bearing fixing component 810, a bearing 812, a spring column 813, a cylinder adjusting block 814, and a Z-axis cylinder top plate 815.

[0084] The mounting base 801 is mounted on the machine platform. The fixed side of the Z-axis lifting cylinder 802 is mounted on the mounting base 801. The Z-axis cylinder top plate 815 is mounted on the movable side of the Z-axis lifting cylinder 802. The R-axis component mounting plate 808 is mounted on the Z-axis cylinder top plate 815. The R-axis rotary cylinder 803 is mounted on the cylinder adjusting block 814. The cylinder adjusting block 814 is mounted on the R-axis component mounting plate 808. The R-axis support column 809 is mounted on the R-axis component mounting plate 808. The bearing fixing component 810 is mounted on the R-axis support column 809. The rotating shaft 805 passes through the rotating lever 806 and the bearing 812. The bearing 812 is mounted on the bearing fixing component 810, allowing the rotating lever 806 to rotate around the rotating shaft 805. The spring column 813 is located on the rotating lever 806 and the R-axis support column 809, respectively, and is held in place by the tension spring 804.

[0085] The above is a detailed description of the structure and configuration of the dual-station turret testing device of the present invention. This device integrates two test sockets at each turret station to form a parallel processing architecture, and works in conjunction with modular functional stations, enabling the simultaneous testing of two chips in a single turret stop, thus achieving a significant increase in testing efficiency and full-process automation.

[0086] Example 2:

[0087] Based on the dual-station turret testing device of Embodiment 1, this embodiment provides a dual-station turret testing method for chip testing and sorting. This testing method constructs a complete workflow from material loading and positioning, mold closing, parallel testing to cap opening and unloading. Through dual-station synchronous processing and multi-station collaboration, it achieves a doubling of testing efficiency and full-process automation. Figure 12 As shown, the test method specifically includes the following steps:

[0088] Step S1: Material loading and visual positioning.

[0089] This step is the initial stage of the testing process, aiming to accurately and reliably mount the two chips onto the dual-test socket. The specific process can be divided into the following sub-steps:

[0090] Step S1.1: Visual positioning calibration of the lower test stand.

[0091] Before the chip is transferred to the external loading structure, the working program of vision station 300 is started. This working program performs the following tasks:

[0092] First, the camera 301 at the vision station, along with lens 303, point light source 304 and ring light source 302, takes pictures of the lower test seat 251 of the two test seat fixture kits 220 on the dual test seat station 210.

[0093] Then, the real-time position coordinates of the lower test stand 251 are obtained by analyzing the captured image through visual algorithms, and the deviation between it and the preset reference position is determined. Visual guidance data is generated to provide position reference for the subsequent precise placement of the chip and avoid chip misplacement due to slight offset of the lower test stand.

[0094] Step S1.2: Simultaneous loading and transfer of dual chips.

[0095] After receiving the guidance data from the vision station 300, the external loading structure picks up two chips to be tested and transfers them to the lower test sockets 251 corresponding to the two test socket fixture kits 220 of the dual test socket station 210.

[0096] During the transfer process, the robot arm's posture was adjusted strictly according to the visual guidance data to ensure that the two chips were precisely aligned with their respective lower test mount 251 bearing areas, achieving synchronous placement of the two chips and meeting the architecture requirements of dual-station parallel testing.

[0097] Step S1.3: Vacuum adsorption fixation of the chip.

[0098] Once both chips are fully placed in their designated positions on the corresponding lower test socket 251, the vacuum generator in the electrical component group 203 is activated, opening the vacuum circuit of the lower test socket 251.

[0099] In this way, the two chips are tightly fixed on the lower test base 251 by negative pressure adsorption, preventing the chips from shifting or falling off during the subsequent turret rotation, and providing a stable chip bearing state for subsequent mold closing, testing and other processes.

[0100] Step S2: Mold closing.

[0101] This step aims to precisely close and reliably lock the upper and lower test sockets of the dual test socket station, which have already been loaded with the chip, forming a sealed testing environment. The specific process can be divided into the following sub-steps:

[0102] Step S2.1: The turret transports the material to the mold closing station.

[0103] The rotary drive unit 201 is activated, driving the turntable 204 to rotate and accurately transfer the dual test seat station 210 (containing two vacuum-fixed chips) that has completed loading and visual positioning to the corresponding working area of ​​the mold closing station 400. This ensures that the test seat fixture kit 220 of the dual test seat station 210 is aligned with the first-stage wheel 409 and the second-stage roller 407 of the mold closing station 400, preparing for the subsequent mold closing action.

[0104] Step S2.2: The X-axis cylinder pushes the flip cover to rotate to a horizontal position.

[0105] The X-axis cylinder 402 of the mold closing station 400 extends, driving the linear guide slider mounting piece 412 connected to it to move along the linear guide assembly 411 toward the test seat fixture kit 220, so that the first stage wheel 409 contacts the upper surface of the flip cover 235.

[0106] As the X-axis cylinder 402 continues to extend, the first-stage wheel 409 pushes the flip cover 235 to rotate around the flip cover pivot 249 until the lower surface of the upper test seat 252 is parallel to the upper surface of the lower test seat 251, at which point the X-axis cylinder 402 extends to its final position and stops.

[0107] Step S2.3: The Z-axis cylinder pushes the flip cover down and locks it in place.

[0108] The Z-axis cylinder 403 of the mold closing station 400 is activated and extends, driving the Z-axis adapter block 405 and the primary wheel 409 and secondary roller 407 mounted on it to move downward along the Z-axis.

[0109] Then, the secondary roller 407 pushes the flip cover 235 to move downward along the Z direction. At this time, the latch 247 maintains a continuous inward latching force under the action of the latch spring 248. As the flip cover 235 is pressed down, the latch 247 slowly rotates around the latch axis 246 to open due to the contact pressure angle and component force.

[0110] Once the flip cover 235 is fully depressed, the latch 247 is reset by the rebound force of the latch spring 248 and snaps into the groove of the flip cover 235, thus completing the mold closing and locking of the test fixture kit 220.

[0111] During this process, the mold closing status detection sensor detects the mold closing status of the flip cover 235 and confirms that the mold is closed in place.

[0112] Step S2.4: Nitrogen charging and heating module start-up.

[0113] After the mold is closed and locked, the nitrogen circuit is opened, and nitrogen is filled into the sealed cavity formed by the closing of the lower test seat 251 and the upper test seat 252. During the filling of nitrogen, the pressure in the cavity is monitored in real time by the pressure monitoring display 217 to ensure that the cavity is in an inert gas protection state and to prevent the chip from oxidizing during subsequent high-temperature tests.

[0114] At the same time, the temperature control module in the electrical component group 203 is activated, controlling the heating module of the lower test socket 251 to perform closed-loop heating of the chip, so that the chip temperature reaches the preset temperature required for testing.

[0115] Step S2.5: Reset the cylinder at the mold closing station.

[0116] After the nitrogen filling pressure reaches the standard and the heating module enters a stable temperature control state, the Z-axis cylinder 403 of the mold closing station 400 retracts first, driving the Z-axis adapter block 405, the first-stage wheel 409, and the second-stage roller 407 back to the initial Z-axis position.

[0117] After the Z-axis cylinder 403 is reset, the X-axis cylinder 402 retracts, driving the linear guide slider mounting part 412 and related components back to the initial X-axis position. The mold closing station 400 returns to its initial state, waiting for the next mold closing operation.

[0118] Step S3: DC test.

[0119] DC testing (direct current characteristic testing) is a crucial step in chip testing, verifying the chip's electrical performance by measuring parameters such as current, voltage, and resistance. The specific process can be divided into the following sub-steps:

[0120] Step S3.1: Transfer the turret to the DC test station.

[0121] The rotary drive unit 201 is activated, driving the turntable 204 to rotate and precisely transfer the dual test stand station 210 (carrying two chips to be tested), which has completed mold closing (nitrogen protection and stable temperature control by the heating module), to directly above the DC test station 600. At the same time, it ensures that the test stand fixture kit 220 of this station is aligned with the pressing structure of the pressing station 500, in preparation for subsequent test contact.

[0122] Step S3.2: Align the pressure station drive fixture.

[0123] The Z-shaped downward pressing cylinder 502 of the pressing station 500 extends out, pushing the pressing structure 503 and the pressing buffer 504 connected to it to move towards the test fixture kit 220.

[0124] After the pressure buffer 504 contacts the pressure buffer 234 on the test fixture kit 220, it continues to drive the test fixture kit 220 to move downward in the Z direction along the guide rail assembly 218 of the dual test station 210 until the lower surface of the lower test seat 251 is in complete contact with the upper surface of the DC test board assembly 601 of the DC test station 600, ensuring stable electrical connection.

[0125] Step S3.3: Simultaneously perform dual-chip high-temperature DC testing.

[0126] The external tester is started, and test signals are applied synchronously to the two chips through the DC test board component 601 to test the DC performance parameters of the chips under high temperature environment.

[0127] During the test, the heating module of the lower test socket 251 continuously maintains closed-loop temperature control to maintain the high-temperature operating conditions required for chip testing. At the same time, the pressure monitoring display 217 continuously monitors the nitrogen pressure in the sealed cavity to ensure a stable test environment.

[0128] Meanwhile, the testing machine collects and records the test data of the two chips in real time to determine whether the DC performance of the chips meets the specifications.

[0129] Step S3.4: Reset the pressing station.

[0130] When the DC test is completed and the test machine sends a test end signal, the Z-axis downward pressing cylinder 502 of the pressing station 500 retracts, driving the pressing structure 503 and the pressing buffer 504 back to their initial positions.

[0131] Meanwhile, under the rebound action of the pre-pressure adjustment component 213 and the spring 221 of the dual test seat station 210, the test seat fixture kit 220 is reset upward along the Z direction of the guide rail assembly 218, and the lower test seat 251 separates from the DC test board assembly 601, waiting to enter the next process.

[0132] Step S4: AC test.

[0133] This step aims to perform AC parameter testing on the chip that has completed DC testing. The process is similar to DC testing but is conducted at a different test station. The specific sub-steps are as follows:

[0134] Step S4.1: Transfer the turret to the AC test station.

[0135] The rotary drive unit 201 is activated, driving the turntable 204 to rotate, precisely transferring the dual test stand station 210 (which carries two chips that have completed DC testing) which has completed DC testing and is still in the mold-closed state (nitrogen protection continues, and the lower test stand heating module maintains a high temperature) directly above the AC test station 700.

[0136] At the same time, it ensures that the two sets of test fixture kits 220 on the dual test fixture station 210 are precisely aligned with the pressing structure of the upper pressing station 500, providing a positional reference for the electrical contact of the subsequent AC test.

[0137] Step S4.2: The pressure station drive fixture contacts the AC test cabinet.

[0138] The Z-shaped downward pressing cylinder 502 of the pressing station 500 is activated and extended, pushing the pressing structure 503 connected to it and the pressing buffer 504 installed on it to move towards the test fixture kit 220.

[0139] After the pressure buffer 504 contacts the pressure buffer 234 on the test socket fixture kit 220, the Z-push cylinder 502 continues to output thrust, causing the entire test socket fixture kit 220 to slide downward along the guide rail assembly 218 of the dual test socket station 210 until the lower surface of the lower test socket 251 is completely in contact with the surface of the AC test cabinet 701 of the AC test station 700, ensuring a stable electrical connection between the chip and the AC test cabinet to meet the AC signal transmission requirements.

[0140] Step S4.3: Simultaneously perform dual-chip high-temperature AC test.

[0141] The external tester is started, and AC test signals are simultaneously applied to the two chips on the dual test socket station 210 through the AC test cabinet 701 of the AC test station 700 to test the AC performance parameters of the chips under high temperature environment.

[0142] During the test, the heating module of the lower test fixture 251 continuously maintains closed-loop temperature control to maintain the high-temperature test conditions required by the chip. At the same time, the pressure monitoring display 217 monitors the nitrogen pressure in the sealed cavity of the test fixture kit 220 in real time to ensure the stability of the inert protection environment.

[0143] Meanwhile, the testing machine collects AC test data from the two chips in real time and analyzes the data to determine whether the chip's AC performance meets the preset specifications.

[0144] Step S4.4: Reset the pressing station and stop the heating module.

[0145] When the AC test is completed, the testing machine sends a test completion signal to the device control system. The Z-shaped downward pressing cylinder 502 of the pressing station 500 retracts, driving the pressing structure 503 and the pressing buffer 504 back to their initial positions.

[0146] Under the rebound action of the spring 221 installed on the pre-pressure adjustment component 213 of the dual test seat station 210, the test seat fixture kit 220 resets upward along the Z direction of the guide rail assembly 218, and the lower test seat 251 separates from the AC test cabinet 701.

[0147] At the same time, the temperature control module in the electrical component group 203 is turned off, the heating module in the lower test socket 251 stops working, the chip enters a natural cooling state, and the dual test socket station 210 waits to enter the next process.

[0148] Step S5: Open the lid.

[0149] This step aims to safely unlock and open the upper and lower test sockets of the dual-test socket station, which have already undergone testing, in preparation for chip unloading. The specific process can be divided into the following sub-steps:

[0150] Step S5.1: The turret is transferred to the opening station.

[0151] The rotary drive unit 201 is activated, driving the turntable 204 to rotate and precisely transfer the dual test socket station 210 (which carries two chips that have completed AC testing and are still in the mold-locked state) to directly above the capping station 800. This ensures that the test socket fixture kit 220 on the dual test socket station 210 is aligned with the rotary lever 806 of the capping station 800, preparing for the subsequent capping action.

[0152] Step S5.2: The Z-axis lifting cylinder drives the R-axis component to rise.

[0153] The Z-axis lifting cylinder 802 of the opening station 800 is activated and extended, pushing the Z-axis cylinder top plate 815, the R-axis component mounting plate 808, and the R-axis rotary cylinder 803 and rotary lever 806 mounted on the R-axis component mounting plate, which are connected to its movable side, to rise along the Z-axis until the rotary lever 806 and the buckle 247 of the test fixture kit 220 are at the same horizontal height and reach the working position where they can be pushed. Then the Z-axis lifting cylinder 802 stops extending.

[0154] Step S5.3: The R-axis rotary cylinder drives the rotary lever to unlock the latch.

[0155] R-direction rotary cylinder 803 starts and extends. After its output end contacts the rotary shaft 805 and rotary lever 806, it pushes the rotary lever 806 to rotate around the rotary shaft 805.

[0156] During the rotation of the rotating lever 806, it comes into contact with the buckle 247, pushing the buckle 247 to rotate around the buckle pivot 246. The buckle spring 248 is compressed until the buckle 247 completely disengages from the groove of the flip cover 235, thus unlocking the device.

[0157] Step S5.4: The flip cover opens automatically and the nitrogen circuit closes.

[0158] Once the latch 247 is completely disengaged from the flip cover 235, the flip cover 235 automatically rotates and opens around the flip cover pivot 249 under the restoring force of the flip cover torsion spring 244 mounted on the flip cover pivot 249.

[0159] At the same time, the nitrogen circuit of the test fixture kit 220 is closed, stopping the supply of nitrogen to the original sealed cavity and completing the release of the inert protection state.

[0160] During this process, the mold opening status detection sensor detects the mold opening status of the flip cover 235 and confirms that the cover is in place.

[0161] Step S5.5: Reset the R-direction and Z-direction cylinders.

[0162] Once it is confirmed that the flip cover 235 is fully open, the R-axis rotary cylinder 803 is activated and retracted. Under the restoring force of the tension spring 804, the rotary lever 806 rotates in the opposite direction around the rotary shaft 805 to reset to the initial position.

[0163] Subsequently, the Z-axis lifting cylinder 802 is activated and retracted, causing the Z-axis cylinder top plate 815, the R-axis component mounting plate 808 and related components to descend along the Z-axis and return to their initial positions. The cover opening station 800 returns to its initial state, ready for the next cover opening, and the dual test seat station 210 waits to enter the next process.

[0164] Step S6: Unloading.

[0165] This step is the final stage of the testing process, designed to safely remove the tested chips from the dual-test socket and classify and transport them according to the test results. The specific process can be divided into the following sub-steps:

[0166] Step S6.1: The turret transfers the material to the unloading station.

[0167] The rotary drive unit 201 is activated, driving the turntable 204 to rotate and accurately transfer the dual test socket station 210 (which carries two chips that have completed DC / AC testing and have no adsorption or fixing constraints) that has completed the opening process to the preset unloading station area. This ensures that the two sets of test socket fixture kits 220 of the dual test socket station 210 are aligned with the material picking path of the external unloading structure, preparing for subsequent chip picking.

[0168] Step S6.2: Close the vacuum circuit to release the chip from its fixed position.

[0169] The vacuum control module in the electrical component group 203 is activated, shutting down the vacuum circuit of the lower test socket 251 of the two test socket fixture kits 220 on the dual test socket station 210, cutting off the negative pressure adsorption source, so that the chip loses the adsorption force constraint between the chip and the lower test socket 251, and the chip is in a state that can be freely picked up and put down, avoiding the chip picking displacement or damage caused by vacuum residue.

[0170] Step S6.3: Complete the dual-chip transfer

[0171] Whether by external unloading structure or manual operation, two completed test chips are simultaneously picked up from two sets of lower test sockets 251 on the dual test socket station 210.

[0172] Based on the chip performance data fed back by the testing machine, the chips are transferred to the corresponding subsequent workstations: if the chip has completed all tests, it is transferred to the good product sorting area or the defective product recycling area; if the chip still needs to undergo other tests such as room temperature and low temperature, it is transferred to the corresponding subsequent testing workstation, thus realizing classified transfer.

[0173] Step S6.4: Confirm that the material feeding is completed and the workstation is reset.

[0174] After the chip transfer is completed, the position sensor of the device confirms that there are no chip residues in either of the two lower test sockets 251 of the dual test socket station 210.

[0175] Once confirmed, the turret rotation drive unit 201 drives the turntable 204 to continue rotating, turning the dual test seat station 210 back to the vicinity of the initial loading station, ready to welcome the next cycle and complete the closed loop of the entire unloading process.

[0176] The above describes the complete process of the dual-station turret testing method of the present invention in the chip testing process. Based on the aforementioned dual-station parallel testing architecture and multi-station collaborative working mechanism, this method achieves a significant increase in testing efficiency and full automation of the testing process.

[0177] It should be noted that the testing device and testing method based on the present invention support the quick-change function of relevant modules throughout the entire chip testing cycle. Specifically, when changing the test product, when test data is abnormal, or when the chip explodes due to temperature difference, the quick-change-fixed side 230 of the test socket fixture kit 220 can be separated from the quick-change-fixed side 215 by unlocking the quick-change-fixed side 215. At this time, the entire old test socket fixture kit 220 can be removed, and then a brand new test socket fixture kit 220 can be replaced. This can effectively reduce the impact of equipment downtime caused by test abnormalities.

[0178] The advantages of this invention are as follows: First, by adopting a dual-station parallel testing architecture and integrating two independent test fixtures at each turret station, the testing of two chips can be completed simultaneously in a single turret stop, thereby achieving a significant improvement in testing efficiency, increasing the output per hour (UPH) from approximately 2000 to over 4000. Second, by employing a precision mechanical structure and a high-precision vision-guided positioning system, combined with a nitrogen-protected environment and a precise temperature control module, high repeatability of chip placement and testing alignment is ensured, and oxidation of the chips during high-temperature testing is effectively prevented, significantly enhancing the reliability and effectiveness of the testing. Thirdly, the modular test fixture kit design and unique quick-change interface significantly shorten maintenance and product changeover time. Combined with the multi-directional adjustment mechanism of the test station, the equipment can quickly adapt to diverse chip testing needs, thereby significantly improving the overall utilization rate and production flexibility of the equipment. Fourthly, by highly integrating multiple processes such as loading and unloading, positioning, mold closing, testing, and mold opening into a compact system, and achieving collaborative control and complete status monitoring of each functional station, a fully automated and intelligently managed testing platform has been built, comprehensively improving the system's integration, reliability, and intelligence level.

[0179] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. For example, the dual-station test architecture of this application is not only suitable for high-temperature DC / AC testing, but also for room temperature testing, low-temperature testing, or other specific electrical performance parameter testing. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this invention should be included within the scope of protection of this invention. Therefore, the scope of protection of this invention should be determined by the scope of the claims.

Claims

1. A dual-station turret testing device for chip testing and sorting, characterized in that, The testing device includes a support assembly, a turret rotation section, a vision station, a mold closing station, a pressing station, multiple sets of testing stations, and a cover opening station. The turret rotating part, vision station, mold closing station and pressing station are all mounted on the support assembly; The turret rotation unit includes a rotation drive unit, a turntable, and multiple dual-test base stations, which are distributed on the circumference of the turntable. During testing, the turret rotating part rotates intermittently under the drive of the rotation drive unit, moving the dual test seat station sequentially to the positions of the vision station, mold closing station, pressing station, test station and cover opening station.

2. The dual-station turret testing device according to claim 1, characterized in that, Each of the dual test fixture stations is equipped with two sets of test fixture kits. Each set of test fixture kits can independently carry and position a chip to be tested, so that the station transfer and testing of the two chips can be completed simultaneously with each division of the turret rotation.

3. The dual-station turret testing device according to claim 2, characterized in that, The test fixture kit includes a main mounting component, an upper test fixture, a lower test fixture, a flip cover, a snap-fit ​​mechanism, and a status detector; The upper test seat is mounted on the flip cover, and the flip cover is rotatably connected to the mounting body through a rotating shaft. The lower test seat is fixed to the mounting body and is set correspondingly to the upper test seat. The latching mechanism includes a latch, a latching shaft, and a latching spring. The latching spring drives the latch to engage the flip cover to achieve locking. The state detector includes a mold-closed state detection sensor and a mold-opening state detection sensor, which are used to detect the mold-closed and mold-opening states of the flip cover, respectively.

4. The dual-station turret testing device according to claim 3, characterized in that, The test fixture kit also includes a Z-guide column, a Z-axis lifting spring, and a downward pressure buffer; The Z-guide post passes through the Z-direction linear bearing installed on the mounting body, and the Z-direction lifting spring is sleeved on the Z-guide post; The pressure buffer is installed on the mounting body and is used for buffer protection during pressure testing.

5. The dual-station turret testing device according to claim 2, characterized in that, The test fixture kit is connected to the dual test fixture station via a quick-change connection structure. The dual test fixture station includes a Z-axis slide structure. The quick-change connection structure includes a quick-change-fixed side and a quick-change-fixture side. The quick-change-fixed side is mounted on the Z-axis slide structure via a quick-change-fixed side mounting plate. The quick-change-fixture side is disposed on the test fixture kit. The test fixture kit is detachably connected to the quick-change-fixed side via the quick-change-fixture side.

6. The dual-station turret testing device according to claim 1, characterized in that, The vision station includes a camera, a lens, a point light source, and a ring light source; The camera is mounted on the mounting base plate via a camera adjustment block, and the lens is connected to the camera and secured with the aid of a lens clamp. The point light source and the ring light source are fixed to the mounting base plate by the light source fixing sheet metal, and are used to take pictures and position the lower test seat to guide the precise placement of the chip.

7. The dual-station turret testing device according to claim 1, characterized in that, The pressing station includes a Z-shaped pressing cylinder, a pressing structural component, and a pressing buffer; The Z-push-down cylinder is mounted on the mounting base plate, the push-down structure is connected to the Z-push-down cylinder, and the push-down buffer is mounted on the push-down structure.

8. The dual-station turret testing device according to claim 1, characterized in that, The mold closing station includes an X-axis cylinder, a Z-axis cylinder, a primary roller, a secondary roller, and a linear guide rail assembly; The X-axis cylinder drives the Z-axis cylinder to move along the X-axis, so that the first-stage wheel contacts the flip cover and pushes the flip cover to rotate to a horizontal state. The Z-axis cylinder drives the first-stage wheel and the second-stage roller to move along the Z-axis, pushing the flip cover down and causing the buckle mechanism to automatically lock the flip cover; The opening station includes a Z-axis lifting cylinder, an R-axis rotating cylinder, a rotating lever, and a tension spring. The Z-axis lifting cylinder drives the R-axis rotating cylinder to rise and fall, the R-axis rotating cylinder drives the rotating lever to rotate around the pivot, the rotating lever pushes the buckle to unlock, and the tension spring drives the rotating lever to reset.

9. The dual-station turret testing device according to any one of claims 1 to 8, characterized in that, The test station includes a DC test station and an AC test station; The DC test station includes a DC test board assembly, a Z-axis adjustment assembly, a Z-axis base plate, an X-axis adjustment base plate, and a Y-axis adjustment base plate; The DC test board assembly is mounted on the Z-axis base plate via the Z-axis adjustment assembly, the Z-axis base plate is mounted on the X-axis adjustment base plate, and the X-axis adjustment base plate is mounted on the Y-axis adjustment base plate. The AC test station includes an AC test cabinet, a Z-axis adjustment component, an X-axis adjustment component, and a Y-axis adjustment component. The AC test cabinet is installed on a primary fixed plate. The primary fixed plate is connected to a secondary fixed plate via a Z-axis adjustment component. The secondary fixed plate is connected to a tertiary fixed bracket via an X-axis adjustment component. The tertiary fixed bracket is installed on the machine via a Y-axis adjustment component.

10. A dual-station turret testing method for chip testing and sorting, implemented based on a dual-station turret testing device, characterized in that, The method includes the following steps: S1: Place the two chips to be tested onto the lower test sockets of the two test socket fixtures at the dual test socket station. First, use the vision station to take pictures and position them to ensure accurate placement, and then start the vacuum to fix the chips. S2: The turret moves the chip to the mold closing station, pushes the flip cover to rotate and press down, so that the buckle locks the mold, and at the same time, nitrogen gas is filled for protection and the lower test socket is heated. S3: The turret rotates sequentially to each test station. The pressure station pushes the test fixture kit to dock with the test station. The test station simultaneously performs electrical performance tests on the two chips. After the test is completed, the pressure station resets. S4: The turret moves the test fixture kit containing the chip to the opening station. The opening station pushes the latch to unlock, and the flip cover opens under the action of the flip cover torsion spring, and the nitrogen gas is turned off. S5: The turret moves to the unloading station, the vacuum is turned off, and the two tested chips are transferred to the corresponding station; in: The electrical performance test includes DC test and AC test. The turntable first rotates to the DC test station to complete the high-temperature DC test, and then rotates to the AC test station to complete the high-temperature AC test. During the test, the temperature control module keeps the chip temperature stable. When it is necessary to replace the test product or handle test abnormalities, the test fixture kit and the dual test station can be separated by unlocking the quick-change connection structure, and a brand new test fixture kit can be replaced and then locked again to achieve quick product change or maintenance.

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