Semiconductor processing lettering positioning jig for new energy electric drive system

Abstract

The invention discloses a semiconductor processing lettering positioning jig for a new energy electric drive system, and relates to the technical field of semiconductor manufacturing. A processing frame is fixedly connected to the upper surface of one end of a workbench, a processing guide rail is fixedly connected to one side of the processing frame, and a lettering assembly is slidably connected to the surface of the processing guide rail; a positioning mechanism for fixing the semiconductor carrier plate in the center of the processing groove is arranged in the processing groove, a detection mechanism for detecting whether the semiconductor carrier plate is correctly placed in the processing groove is arranged on one side of the positioning mechanism, and when the semiconductor carrier plate is placed in the processing groove in the wrong direction, the system can immediately trigger automatic alarm. Orientation errors caused by human negligence are effectively prevented through the function, the follow-up lettering procedure is prevented from being executed at the wrong chip position, therefore, machining scrapping of a whole batch of products and potential collision damage of lettering assemblies and equipment are completely eradicated, and zero errors, high reliability and production safety of the machining process are fundamentally guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to a semiconductor processing engraving and positioning fixture for a new energy electric drive system. Background Technology

[0002] Semiconductor processing marking and positioning fixtures are specialized high-precision jigs used in the post-processing of chip manufacturing. Their core function is to accurately fix and position wafers or individual chips to ensure that laser or ink marking equipment can make clear and consistent markings at predetermined positions. In the packaging and testing stage, each chip needs to be marked with key information such as model number, batch number, and tracking code. This fixture achieves rapid and batch-based precise positioning, thereby ensuring the uniformity and readability of the marking content. It is an important process equipment for improving the degree of production automation and product quality reliability.

[0003] Semiconductor processing marking and positioning fixtures precisely place the chip to be marked into the fixture's positioning structure. The fixture typically uses a clamping mechanism to firmly fix the chip, eliminating any slight displacement. After positioning and clamping are completed, the entire fixture unit is moved or guided to the marking equipment. At this point, the machine vision system will perform alignment calibration on the chip itself using preset reference marks on the fixture or directly. The laser beam or inkjet head will then, according to a preset program, engrave permanent marking information on a designated area on the firmly fixed chip surface, thereby achieving the marking operation for chips in a uniform position.

[0004] During semiconductor processing, if a semiconductor substrate is placed in the processing tank in the wrong direction due to human error, the subsequent engraving process will be performed on the wrong chip position, resulting in the scrapping of the entire batch of products, potential collision damage between the engraving components and the equipment, production interruption, material loss, and subsequent troubleshooting and repair work. This will seriously impact processing efficiency and increase production costs. Summary of the Invention

[0005] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a semiconductor processing engraving and positioning fixture for new energy electric drive systems, which solves the problems mentioned in the background art.

[0006] Technical solution To achieve the above objectives, the present invention provides the following technical solution: a semiconductor processing engraving and positioning fixture for a new energy electric drive system, comprising a worktable, a processing frame fixedly connected to the upper surface of one end of the worktable, a processing guide rail fixedly connected to one side of the processing frame, an engraving component slidably connected to the surface of the processing guide rail, a processing fixture provided on the upper surface of the worktable, a processing groove formed on the upper surface of the processing fixture, a semiconductor carrier plate provided inside the processing groove, and a plurality of semiconductor chips arranged in a rectangular array on the surface of the semiconductor carrier plate; The processing tank is equipped with a positioning mechanism that fixes the semiconductor carrier plate in the center of the processing tank. A detection mechanism is provided on one side of the positioning mechanism to detect whether the semiconductor carrier plate is correctly placed inside the processing tank.

[0007] Preferably, a feeding guide rail is fixedly connected to the upper surface of the workbench, the processing fixture is slidably connected to the upper surface of the feeding guide rail, feeding guide blocks are fixedly connected to both ends of the lower surface of the processing fixture, the feeding guide blocks are slidably connected to the inside of the feeding guide rail, a feeding electric telescopic rod is fixedly connected to the upper surface of one end of the workbench, and the output shaft of the feeding electric telescopic rod is fixedly connected to the processing fixture.

[0008] Preferably, the positioning mechanism includes a central adjustment groove formed inside the machining fixture, a rotating plate rotatably connected to the interior of the central adjustment groove via a rotating shaft, and symmetrically formed long sliding grooves, each L-shaped, with its vertical portion connected to the machining groove. A long sliding rod, also L-shaped, is slidably connected inside the long sliding groove. Similarly, symmetrically formed short sliding grooves are formed on the inner wall of the central adjustment groove, with their vertical portions connected to the machining groove. Short sliding rods are slidably connected inside the short sliding grooves. The short slide bar is L-shaped, and the four side walls of the processing groove are provided with shrinkage grooves. The vertical parts of the long slide bar and the short slide bar are connected to the adjacent shrinkage grooves. The interior of each of the four shrinkage grooves is slidably connected to a pressing block. The long slide bar and the short slide bar are fixedly connected to the adjacent pressing block. The surface of the rotating plate is provided with four arc-shaped grooves in a circumferential array. One end of the horizontal part of the long slide bar and the short slide bar is fixedly connected to a face-holding shaft. The face-holding shaft extends into the interior of the adjacent arc-shaped groove. The processing fixture is provided with a power mechanism inside.

[0009] Preferably, the power mechanism includes a transmission electric telescopic rod fixedly connected to one side surface of the processing fixture, an extension groove is provided on the inner wall of the contraction groove near the transmission electric telescopic rod, a pressure tube is slidably connected inside the extension groove, the output shaft of the transmission electric telescopic rod extends into the interior of the extension groove and is fixedly connected to the pressure tube, and a drive spring is fixedly connected between the pressure tube and the adjacent pressure block.

[0010] Preferably, the detection mechanism includes a central abutment slidably connected inside the pressure tube; a detection groove is formed on the side of the semiconductor carrier near the pressure tube; the central abutment extends through the pressure block into the detection groove; a piston plate is slidably connected inside the pressure tube; the piston plate is fixedly connected to the central abutment; a pressure spring is fixedly connected to the inner wall of the pressure tube; the pressure spring is fixedly connected to the piston plate; an extension frame is fixedly connected to the end of the pressure tube away from the pressure block; a communicating groove is formed between the extension frame and the pressure tube; a piston rod is slidably connected inside the communicating groove; a piston head is provided at the end of the piston rod near the pressure spring; an extension slide rod is slidably connected inside the extension frame; the piston rod is fixedly connected to the extension slide rod; and a prompting mechanism is provided on one side of the extension frame.

[0011] Preferably, the prompting mechanism includes a side frame fixedly connected to one side of the extension frame. A power groove is provided on the side of the extension frame near the side frame, and the extension frame is connected to the side frame via the power groove. A bell is fixedly connected to the top of the extension frame. A rotating rod is rotatably connected to the inside of the side frame via a rotating shaft. A striking hammer is fixedly connected to one end of the rotating rod, and the bell is located on the rotation path of the striking hammer. A spring-loaded paddle is fixedly connected to the inside of the side frame, and the spring-loaded paddle is located on the rotation path of the rotating rod. A contact block is fixedly connected to the side of the rotating rod away from the spring-loaded paddle. The contact block has inclined surfaces on both sides near the end of the extension frame. Multiple power blocks are arranged in a linear array from top to bottom on the surface of the extension slide rod. The inclined portion of the contact block is located on the sliding path of the power block. A connecting mechanism is provided above the rotating plate.

[0012] Preferably, the connecting mechanism includes a top groove formed on the inner wall above the central adjusting groove. A lifting shaft is rotatably connected to the inner wall above the top groove. A power disk is fixedly connected to the upper surface of the rotating plate. An annular frame is slidably connected to the surface of the lifting shaft. Error grooves are symmetrically formed on the surface of the lifting shaft. Extension blocks are symmetrically arranged on the inner wall of the annular frame. The extension blocks are slidably connected to the inside of the error grooves. A connecting disk is fixedly connected to the lower surface of the annular frame. Multiple helical teeth are arranged in a circumferential array on the lower surface of the connecting disk and the upper surface of the power disk. The helical teeth of the connecting disk and the helical teeth of the power disk have opposite inclined plane directions. The helical teeth of the connecting disk and the helical teeth of the power disk mesh with each other. A lifting mechanism is provided inside the top groove. A connecting spring is fixedly connected between the connecting disk and the lifting shaft.

[0013] Preferably, the lifting mechanism includes multiple lifting slots arranged in a circumferential array on the inner wall of the top slot. A receiving slot is provided on the inner wall of the processing slot. A lifting plate is slidably connected inside the receiving slot. One end of the lifting slot passes through the processing fixture and communicates with the receiving slot. A lifting rod is slidably connected inside the lifting slot. The lifting plate is fixedly connected to the multiple lifting rods. Multiple inclined sliding slots are arranged in a circumferential array on the surface of the lifting shaft. A straight sliding slot is provided between the upper end of the inclined sliding slot and the lower end of the adjacent inclined sliding slot. The depth of the inclined sliding slot is greater than that of the straight sliding slot. A compression receiving slot is provided at one end of the lifting rod. A stop shaft is slidably connected inside the compression receiving slot. An extension spring is fixedly connected to the inner wall of the compression receiving slot. The extension spring is fixedly connected to the stop shaft, and one end of the stop shaft extends into the interior of the inclined sliding slot.

[0014] Beneficial effects The semiconductor processing engraving and positioning fixture for new energy electric drive systems provided by this invention has the following beneficial effects: 1. This special semiconductor processing and engraving positioning fixture for new energy electric drive systems uses four pressure blocks to firmly clamp the semiconductor carrier board in the center position, ensuring that it maintains precise positioning throughout the processing. When the electric telescopic rod pushes the processing fixture along the predetermined trajectory, this design enables each row of semiconductor chips on the carrier board surface to form a precise spatial correspondence with the engraving components, thereby achieving automatic alignment of the chips with the engraving station and effectively improving the positioning accuracy and processing consistency of the engraving process.

[0015] 2. When the semiconductor substrate is placed in the processing tank in the wrong direction, the system can immediately trigger an automatic alarm. This function effectively prevents orientation errors caused by human negligence and avoids subsequent engraving processes being performed on the wrong chip positions. This eliminates the scrapping of the entire batch of products and potential collision damage between the engraving components and the equipment, fundamentally ensuring zero errors, high reliability and production safety in the processing flow.

[0016] 3. After processing, the positioning fixture has the function of automatically ejecting the precisely positioned semiconductor substrate from the processing slot. This design effectively avoids chip scratches, substrate surface scratches, or positioning failures caused by manual removal of the substrate. Its smooth ejection action ensures the integrity of the finished product and achieves seamless connection with the next station or material receiving process, significantly improving the overall production rhythm and automation level. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the position and structure of the processing fixture of the present invention; Figure 3 This is a schematic diagram of the internal structure of the processing groove of the present invention; Figure 4 This is a schematic diagram of the internal structure of the long groove of the present invention; Figure 5 For the present invention Figure 4 A magnified view of part A in the image; Figure 6 This is a schematic diagram of the internal structure of the short groove of the present invention; Figure 7 This is a schematic diagram of the rotating plate connection structure of the present invention; Figure 8 This is a schematic diagram of the internal structure of the extension groove of the present invention; Figure 9 This is a schematic diagram of the pressure pipe connection structure of the present invention; Figure 10 For the present invention Figure 6 A magnified view of part B in the image; Figure 11 This is a schematic diagram of the power disk connection structure of the present invention; Figure 12 This is a schematic diagram of the lifting shaft connection structure of the present invention.

[0018] The labels in the diagram represent: 1. Worktable; 2. Machining rack; 21. Machining guide rail; 22. Engraving component; 23. Feeding guide rail; 24. Feeding guide block; 25. Machining fixture; 26. Machining groove; 27. Semiconductor carrier; 3. Center adjustment groove; 31. Rotary plate; 32. Long slide groove; 33. Long slide rod; 34. Arc groove; 35. Abutment shaft; 36. Short slide groove; 37. Short slide rod; 38. Shrinkage groove; 39. Pressing block; 4. Extension groove; 41. Pressure tube; 42. Center abutment shaft; 43. Drive spring; 44. Piston plate; 45. Extension frame; 46. Extension 47. Slide rod; 48. Pressure spring; 49. Detection groove; 410. Connecting groove; 5. Piston rod; 5. Side frame; 51. Rotating rod; 52. Striking hammer; 53. Bell; 54. Contact block; 55. Power block; 56. Rebound lever; 6. Top groove; 61. Power disc; 62. Connecting disc; 63. Annular frame; 64. Connecting spring; 65. Lifting shaft; 66. Error groove; 67. Extension block; 78. Slanted slide groove; 79. Straight slide groove; 70. Lifting groove; 71. Lifting rod; 72. Compression groove; 73. Extension spring; 74. Abutment shaft; 75. Lifting plate. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] refer to Figures 1 to 12 According to a preferred embodiment of the present invention, a semiconductor processing marking and positioning fixture for a new energy electric drive system will be described in detail below. It includes a worktable 1, a processing frame 2 fixedly connected to the upper surface of one end of the worktable 1, a processing guide rail 21 fixedly connected to one side of the processing frame 2, a marking component 22 slidably connected to the surface of the processing guide rail 21, and a semiconductor passing below the marking component 22 is horizontally marked by the reciprocating sliding of the marking component 22 on the surface of the processing guide rail 21. A processing fixture 25 is provided on the upper surface of the worktable 1, and a processing groove 26 is opened on the upper surface of the processing fixture 25. A semiconductor carrier 27 is provided inside the processing groove 26, and a plurality of semiconductor chips are arranged in a rectangular array on the surface of the semiconductor carrier 27. The processing tank 26 is equipped with a positioning mechanism that fixes the semiconductor carrier 27 at the center of the processing tank 26. The positioning mechanism ensures that the semiconductor carrier 27 is located at the center of the processing tank 26, so that the semiconductor on the surface of the semiconductor carrier 27 can be accurately aligned with the lettering component 22 for lettering processing. A detection mechanism is provided on one side of the positioning mechanism to detect whether the semiconductor carrier 27 is correctly placed inside the processing tank 26. The detection mechanism determines the placement direction of the semiconductor carrier 27 to ensure the accuracy of subsequent lettering processing.

[0021] refer to Figure 1 The upper surface of the worktable 1 is symmetrically and fixedly connected with a feeding guide rail 23. The processing fixture 25 is slidably connected to the upper surface of the feeding guide rail 23. The lower surface of the processing fixture 25 is symmetrically and fixedly connected with a feeding guide block 24. The feeding guide block 24 is slidably connected to the inside of the feeding guide rail 23. By sliding the feeding guide block 24 inside the feeding guide rail 23, the processing fixture 25 is driven to reciprocate stably along the surface of the feeding guide rail 23. One end of the upper surface of the worktable 1 is fixedly connected with a feeding electric telescopic rod. The output shaft of the feeding electric telescopic rod is fixedly connected to the processing fixture 25.

[0022] When engraving on the surface of a semiconductor chip, the semiconductor carrier 27 containing the semiconductor chip is placed inside the processing tank 26, and the semiconductor carrier 27 is positioned and fixed by a positioning mechanism. The processing fixture 25 is pushed along the surface of the loading guide rail 23 towards the engraving assembly 22 by an electric telescopic rod until the semiconductor chip is directly below the engraving assembly 22 and the engraving assembly 22 slides laterally on the surface of the processing guide rail 21. The row of semiconductors located below the processing guide rail 21 is engraved. As the loading electric telescopic rod gradually pushes the processing fixture 25 to slide, the semiconductor chips on the surface of the semiconductor carrier 27 are processed row by row.

[0023] refer to Figure 4 and Figure 5The positioning mechanism includes a central adjustment groove 3 located inside the machining fixture 25. A rotating plate 31 is rotatably connected to the interior of the central adjustment groove 3 via a rotating shaft. Long sliding grooves 32, L-shaped, are symmetrically formed on the inner wall of the central adjustment groove 3. The vertical portion of the long sliding groove 32 communicates with the machining groove 26. A long sliding rod 33, also L-shaped, is slidably connected inside the long sliding groove 32. One end of the horizontal portion of the long sliding rod 33 is located below the rotating plate 31. (See reference...) Figure 6 The inner wall of the central adjustment groove 3 is symmetrically provided with short sliding grooves 36. The vertical part of the short sliding groove 36 is connected to the processing groove 26. A short sliding rod 37 is slidably connected inside the short sliding groove 36. The short sliding rod 37 is L-shaped. One end of the short sliding rod 37 is located below the rotating plate 31. The distance from the horizontal part of the long sliding rod 33 and the short sliding rod 37 to the center line of the rotating plate 31 is equal. The distance from the vertical part of the long sliding rod 33 and the short sliding rod 37 to the side wall of the semiconductor carrier 27 is equal. The upper surface of the vertical part of the long sliding rod 33 and the short sliding rod 37 is aligned with the lower inner wall of the processing groove 26. The two long sliding grooves 32 and the two short sliding grooves 36 are arranged in a ring array, and the long sliding grooves 32 and the short sliding grooves 36 are arranged in a ring array. The processing tank 26 is alternately distributed, with shrinkage grooves 38 on each of its four side walls. The vertical portions of the long slide grooves 32 and the short slide grooves 36 are connected to the adjacent shrinkage grooves 38. Each of the four shrinkage grooves 38 has a pressure block 39 slidably connected inside. The long slide rod 33 and the short slide rod 37 are fixedly connected to the adjacent pressure block 39. Initially, the four pressure blocks 39 shrink into the shrinkage grooves 38. When the semiconductor carrier 27 is in the center of the processing tank 26, that is, when the semiconductor carrier 27 drives the chip to be processed to be in the correct position, the four pressure blocks 39 are equidistant from the side wall of the adjacent semiconductor carrier 27. The semiconductor carrier 27 can be accurately positioned by the cooperation of the four pressure blocks 39. refer to Figure 7 The surface of the rotating plate 31 has four arc-shaped grooves 34 arranged in a circular array. The arc-shaped grooves 34 are distributed from the outside to the inside towards the center line of the rotating plate 31. One end of the transverse part of the long slide rod 33 and the short slide rod 37 is fixedly connected to the abutment shaft 35. The abutment shaft 35 extends into the arc-shaped groove 34 that is close to it. The machining fixture 25 is equipped with a power mechanism. Initially, the abutment shaft 35 is located inside the arc-shaped groove 34 at the end away from the center line of the rotating plate 31.

[0024] refer to Figure 8The power mechanism includes a transmission electric telescopic rod fixedly connected to one side surface of the processing fixture 25. An extension groove 4 is provided on the inner wall of the contraction groove 38 near the transmission electric telescopic rod. A pressure tube 41 is slidably connected inside the extension groove 4. The output shaft of the transmission electric telescopic rod extends into the interior of the extension groove 4 and is fixedly connected to the pressure tube 41. A drive spring 43 is fixedly connected between the pressure tube 41 and the adjacent pressing block 39. The elastic force generated by the spring coefficient of the drive spring 43 is much greater than the frictional force between the abutment shaft 35 and the arc groove 34, thereby preventing the drive spring 43 from being compressed under the reverse thrust of the frictional force between the abutment shaft 35 and the arc groove 34 when the drive spring 43 pushes the pressing block 39 to slide. Initially, the pressure tube 41 is located at the end of the extension groove 4 away from the pressing block 39, and the drive spring 43 is in an uncompressed state at this time.

[0025] When the semiconductor carrier 27 is placed inside the processing tank 26 and needs to be positioned, the output shaft of the transmission electric telescopic rod pushes the pressure tube 41 to slide towards the semiconductor carrier 27. The elastic force of the central abutment shaft 42 drives the long slide rod 33, which is fixedly connected to it, to slide synchronously through the pressure block 39. During the process of the long slide rod 33 sliding towards the center line of the rotating plate 31, a thrust is given to the inner wall of the nearby arc groove 34 through the surface abutment shaft 35, thereby pushing the rotating plate 31 to rotate around the rotating shaft. During the rotation of the rotating plate 31, the inner walls of the other three arc-shaped grooves 34 on the surface provide a thrust to the corresponding abutment shaft 35 in the direction of the center line of the rotating plate 31. This causes the adjacent long slide rod 33 and short slide rod 37 to move closer to the semiconductor carrier 27 along the long slide groove 32 and short slide groove 36, respectively. This, in turn, causes the pressing blocks 39 to press the semiconductor carrier 27 from four directions. Since the four pressing blocks 39 are equidistant from the sidewalls of the adjacent semiconductor carrier 27 and have equal sliding distances, they push the semiconductor carrier 27 closer to the center. When the abutment shaft 35 slides close to the center line of the rotating plate 31, the four pressing blocks 39... 9. The semiconductor carrier 27 is fixed in the center position to ensure that when the electric telescopic rod pushes the processing fixture 25 to slide, each row of semiconductor chips on the surface of the semiconductor carrier 27 is aligned with the engraving component 22. As the pressing block 39 contacts the surface of the semiconductor carrier 27, the pressing block 39 can no longer slide. At this time, the pressure tube 41 continues to slide under the drive of the output shaft of the electric telescopic rod. The drive spring 43 is compressed under the push of the pressure tube 41 until it can no longer be compressed. The pressure tube 41 holds the pressing block 39 in place by the drive spring 43 in the compression limit state, thereby preventing the pressing block 39 from sliding. This special semiconductor processing and engraving positioning fixture for new energy electric drive systems uses four pressure blocks 39 to firmly clamp the semiconductor carrier 27 in the center position, ensuring that it maintains precise positioning throughout the processing. When the electric telescopic rod pushes the processing fixture 25 to slide along the predetermined trajectory, this design enables each row of semiconductor chips on the carrier surface to form a precise spatial correspondence with the engraving component 22, thereby achieving automatic alignment of the chips with the engraving station and effectively improving the positioning accuracy and processing consistency of the engraving process.

[0026] refer to Figure 8 The testing mechanism includes a central abutment shaft 42 that is slidably connected inside the pressure tube 41, such as... Figure 3 In the process trough 26, a detection groove 48 is formed on the side of the semiconductor carrier 27 near the pressure tube 41. The central abutment 42 extends through the pressure block 39 into the detection groove 48. A piston plate 44 is slidably connected inside the pressure tube 41 and is fixedly connected to the central abutment 42. Initially, the central abutment 42 retracts into the pressure block 39 under the action of the pressure tube 41. When the semiconductor carrier 27 is positioned and clamped inside the process trough 26 and is placed in the correct direction inside the process trough 26, one end of the central abutment 42 is aligned with the detection groove 48. A pressure spring 47 is fixedly connected to the inner wall of the pressure tube 41 and is fixedly connected to the piston plate 44. The pressure tube 41 moves away from the pressure block 39. An extension frame 45 is fixedly connected to one end of the extension frame 45. A connecting groove 49 is provided between the extension frame 45 and the pressure tube 41. A piston rod 410 is slidably connected inside the connecting groove 49. An extension slide rod 46 is slidably connected inside the extension frame 45. The piston rod 410 and the extension slide rod 46 are fixedly connected. A piston head is provided at the end of the piston rod 410 near the pressure spring 47. The piston head slides in the connecting groove 49 and achieves a seal. A prompting mechanism is provided on one side of the extension frame 45. The piston plate 44 is located at the end of the pressure tube 41 near the pressure block 39. The pressure spring 47 is in the normal state. The extension slide rod 46 is located at the end of the extension frame 45 near the pressure tube 41. The piston head of the piston rod 410 is located at the end of the connecting groove 49 near the pressure spring 47.

[0027] When the pressing block 39 contacts the surface of the semiconductor carrier 27, the pressing block 39 can no longer slide. The pressure tube 41 continues to slide under the drive of the output shaft of the electric telescopic rod. At this time, the pressure tube 41 moves closer to the semiconductor carrier 27 and at the same time, the pressure tube 41 squeezes the drive spring 43. Under the action of the elastic force of the drive spring 43, the positioning mechanism can firmly clamp and position the semiconductor carrier 27. When the pressure tube 41 moves, the pressure spring 47 drives the central abutment shaft 42 to slide synchronously. When the semiconductor carrier 27 is placed in the processing tank 26 in the correct direction, and the semiconductor carrier 27 is positioned and clamped inside the processing tank 26, the detection tank 48 is aligned with the central abutment shaft 42. The central abutment shaft 42 extends into the detection tank 48 under the push of the pressure tube 41, indicating that the prompting mechanism will not react. When the semiconductor carrier 27 is not placed in the processing groove 26 in the correct orientation after positioning and clamping, the detection groove 48 and the central abutment 42 cannot be aligned. The central abutment 42, pushed by the pressure tube 41, contacts the side wall of the semiconductor carrier 27, causing the semiconductor carrier 27 to abut against the central abutment 42 and preventing further sliding. At this time, the pressure tube 41 continues to slide under the push of the output shaft of the drive electric telescopic rod, causing the pressure tube 41 to slide on the surface of the central abutment 42, resulting in a relative displacement between the pressure tube 41 and the central abutment 42. The pressure tube 41 is slowly fitted onto the central abutment shaft 42, while the piston plate 44 squeezes the pressure spring 47. When the pressure tube 41 slides on the surface of the central abutment shaft 42, the piston plate 44 pushes the gas inside the pressure tube 41 from inside the pressure tube 41 into the communicating groove 49, thereby pushing the piston rod 410 upward through the piston head, which in turn drives the extension slide rod 46 to slide upward synchronously, thereby providing power to the prompting mechanism, thus prompting the operator that the semiconductor carrier 27 is placed in the processing tank 26 in the wrong direction. refer to Figure 9 The prompting mechanism includes a side frame 5 fixedly connected to one side of the extension frame 45. A power groove is provided on the side of the extension frame 45 near the side frame 5. The extension frame 45 is connected to the side frame 5 via the power groove. The gas inside the pressure pipe 41 is insufficient to push the piston rod 410 out of the connecting groove 49, and the piston head at one end of the piston rod 410 will only slide stably up and down along the inner wall of the connecting groove 49 under the pushing and pulling of the gas inside the pressure pipe 41. A bell 53 is fixedly connected to the top of the extension frame 45. A rotating rod 51 is rotatably connected to the inside of the side frame 5 via a rotating shaft. A striking hammer 52 is fixedly connected to one end of the rotating rod 51. The bell 53 is located at... On the rotation path of the hammer 52, a spring-loaded paddle 56 is fixedly connected inside the side frame 5. The spring-loaded paddle 56 is located on the rotation path of the rotating rod 51. A contact block 54 is fixedly connected on the side of the rotating rod 51 away from the spring-loaded paddle 56. The contact block 54 has inclined surfaces on both sides near the end of the extension frame 45. Multiple power blocks 55 are arranged in a linear array from top to bottom on the surface of the extension slide rod 46. The inclined part of the contact block 54 is located on the sliding path of the power block 55. A connecting mechanism is provided above the rotating plate 31. The hammer 52 is in contact with the bell 53 under the push of the spring-loaded paddle 56. Semiconductor carrier 27 is not placed in the processing tank 26 in the correct orientation. After the semiconductor carrier 27 is positioned and clamped, piston plate 44 pushes the gas inside pressure tube 41 into the communicating groove 49. As the piston rod 410 drives the extension slide rod 46 to slide upward synchronously, the extension slide rod 46 provides a thrust to the inclined surface of contact block 54 through power block 55. At this time, the rotating rod 51 rotates around the axis under the thrust of power block 55. At this time, the return lever 56 is on the rotating rod 51. Under pressure, it is gradually compressed. As the power block 55 disengages from the surface of the contact block 54 and the gap between the contact block 54 and the adjacent power block 55 is aligned, the rotating rod 51 loses the resistance of the power block 55. The rotating rod 51 rotates around the axis under the push of the spring-loaded paddle 56 until the contact block 54 extends into the gap between the adjacent power blocks 55. The hammer 52, driven by the rotating rod 51, collides with the bell 53 to produce a sound. This process is repeated through multiple power blocks 55 to alert the operator. When the semiconductor substrate 27 is placed inside the processing tank 26 in the wrong orientation, the system can immediately trigger an automatic alarm before the engraving process. This function effectively prevents orientation errors caused by human negligence and avoids subsequent engraving processes being performed on the wrong chip positions. This eliminates the scrapping of the entire batch of products and potential collision damage between the engraving component 22 and the equipment, fundamentally ensuring zero errors, high reliability and production safety in the processing flow.

[0028] refer to Figure 10 and Figure 11The connecting mechanism includes a top groove 6 formed on the inner wall above the central adjusting groove 3. A lifting shaft 65 is rotatably connected to the inner wall above the top groove 6. A power disk 61 is fixedly connected to the upper surface of the rotating plate 31. The rotating plate 31 and the power disk 61 are coaxial, thus ensuring that the power disk 61 rotates synchronously with the rotating plate 31. An annular frame 63 is slidably connected to the surface of the lifting shaft 65. Error grooves 66 are symmetrically formed on the surface of the lifting shaft 65. Extension blocks 67 are symmetrically arranged on the inner wall of the annular frame 63. The extension blocks 67 are slidably connected to the inside of the error grooves 66. A connecting disk 62 is fixedly connected to the lower surface of the annular frame 63. Multiple helical teeth are arranged in a circumferential array on the lower surface of the connecting disk 62 and the upper surface of the power disk 61. The helical teeth of the connecting disk 62 have opposite slope directions to the helical teeth of the power disk 61. The helical gear block meshes with the helical gear block of the power disk 61. A lifting mechanism is provided inside the top groove 6. The power disk 61 rotates counterclockwise synchronously with the rotating plate 31. At this time, the helical gear block of the connecting disk 62 and the inclined surface of the helical gear block of the power disk 61 are in contact with each other. The connecting disk 62 slides upward under the push of the inclined surface of the power disk 61, and slides inside the error groove 66 through the extension block 67, thereby stably sliding on the surface of the lifting shaft 65, avoiding the lifting shaft 65 from sliding upward under the drive of the connecting disk 62 and thus abutting against the inner wall of the top groove 6. A connecting spring 64 is fixedly connected between the connecting disk 62 and the lifting shaft 65. Through the connecting spring 64, the extension block 67 is located at the end of the error groove 66 near the rotating plate 31, and the connecting disk 62 and the power disk 61 are always in a meshing state under the push of the connecting spring 64.

[0029] When the rotating plate 31 rotates counterclockwise, it drives the pressure block 39 to move towards the center to clamp the semiconductor carrier plate 27. When the inclined surfaces of the connecting disc 62 and the power disc 61 are in contact with each other, the connecting disc 62 slides upward under the push of the power disc 61, thus sliding stably on the surface of the lifting shaft 65. At this time, the lifting shaft 65 will not rotate. As the rotating plate 31 rotates clockwise and the pressing block 39 retracts back into the shrinkage groove 38, the vertical part of the helical tooth block of the connecting disc 62 comes into contact with the vertical part of the helical tooth block of the power disc 61. The power disc 61 drives the connecting disc 62 to rotate synchronously with the rotating plate 31, thereby driving the lifting shaft 65 to rotate synchronously through the extension block 67, thus providing power for the lifting mechanism.

[0030] refer to Figure 10 and Figure 12The lifting mechanism includes multiple lifting slots 72 arranged in a circular array on the inner wall of the top slot 6. A receiving slot is provided on the inner wall of the processing slot 26. A lifting plate 77 is slidably connected inside the receiving slot. The upper surface of the lifting plate 77 is flush with the lower inner wall of the processing slot 26. One end of each lifting slot 72 passes through the processing fixture 25 and communicates with the receiving slot. A lifting rod 73 is slidably connected inside the lifting slot 72. The lifting plate 77 is fixedly connected to the multiple lifting rods 73. The lifting rods 73 slide within the lifting slot 72, thereby pushing the lifting plate 77 to slide stably up and down within the processing slot 26. The lifting shaft... The surface of 65 has multiple inclined grooves 7 arranged in a circular array. The inclined grooves 7 are inclined grooves. A straight groove 71 is formed between the upper end of the inclined groove 7 and the lower end of the adjacent inclined groove 7. The depth of the inclined groove 7 is greater than that of the straight groove 71. A compression groove 74 is formed at one end of the lifting rod 73. A bearing 76 is slidably connected inside the compression groove 74. An extension spring 75 is fixedly connected to the inner wall of the compression groove 74. The extension spring 75 is fixedly connected to the bearing 76. One end of the bearing 76 extends into the interior of the inclined groove 7. The bearing 76 is located at the bottom end of the inclined groove 7, and the extension spring 75 is in the normal state at this time.

[0031] As the pressing block 39 retracts back into the shrinkage groove 38, the lifting shaft 65 rotates synchronously with the rotating plate 31. During this process, the lifting shaft 65 provides an upward thrust to the abutment shaft 76 through the inner wall of the surface inclined slide groove 7, thereby pushing the lifting rod 73 to slide upward synchronously. The lifting plate 77 pushes the semiconductor carrier plate 27 to slide upward synchronously through the lifting rod 73. When the abutment shaft 76 slides to the upper end of the inclined slide groove 7, the upper surface of the lifting plate 77 is flush with the upper surface of the processing fixture 25, and the semiconductor carrier plate 27 is completely located outside the processing groove 26. The positioned semiconductor carrier plate 27 is pushed out of the processing groove 26, which not only avoids the contamination of the workpiece caused by manual handling, but also facilitates the clamping of the subsequent transportation mechanism. When processing the next workpiece, first control the pressing block 39 so that it cannot be moved out of the shrinkage groove 38. Then press the lifting plate 77 down until it retracts into the receiving groove. Since the rotating plate 31 is fixed under the restriction of the abutment shaft 35, and the power disc 61 and the connecting disc 62 are restricted and can only rotate in one direction, the lifting shaft 65 cannot rotate. By manually pressing the lifting plate 77, the lifting rod 73 is driven to slide down synchronously. Since the lifting shaft 65 cannot rotate, the abutment shaft 76 is driven by the lifting rod 73, the extension spring 75 is compressed, and the abutment shaft 76 retracts into the inside of the compression receiving groove 74, thus sliding down along the straight slide groove 71 until it falls into the lower end of the adjacent inclined slide groove 7, which facilitates the re-lifting of the next workpiece. After processing, the positioning fixture has the function of automatically ejecting the precisely positioned semiconductor carrier 27 from the processing slot 26. This design effectively avoids chip scratches, carrier surface scratches or positioning failures caused by manual removal of the carrier. Its smooth ejection action ensures the integrity of the finished product and achieves seamless connection with the next station or material receiving process, significantly improving the overall production rhythm and automation level.

[0032] Working principle: When engraving on the surface of a semiconductor chip, the semiconductor carrier 27 containing the semiconductor chip is placed inside the processing groove 26, and the semiconductor carrier 27 is positioned and fixed by the positioning mechanism. The processing fixture 25 is pushed along the surface of the feeding guide rail 23 towards the engraving assembly 22 by the electric telescopic rod until the semiconductor chip is directly below the engraving assembly 22 and the engraving assembly 22 slides laterally on the surface of the processing guide rail 21. The row of semiconductors located below the processing guide rail 21 is engraved. As the feeding electric telescopic rod gradually pushes the processing fixture 25 to slide, the semiconductor chips on the surface of the semiconductor carrier 27 are processed row by row.

[0033] When the semiconductor carrier 27 is placed inside the processing tank 26 and needs to be positioned, the output shaft of the transmission electric telescopic rod pushes the pressure tube 41 to slide towards the semiconductor carrier 27. The elastic force of the central abutment shaft 42 drives the long slide rod 33, which is fixedly connected to it, to slide synchronously through the pressure block 39. During the process of the long slide rod 33 sliding towards the center line of the rotating plate 31, a thrust is given to the inner wall of the nearby arc groove 34 through the surface abutment shaft 35, thereby pushing the rotating plate 31 to rotate around the rotating shaft. During the rotation of the rotating plate 31, the inner walls of the three other arc-shaped grooves 34 on the surface provide a thrust to the corresponding abutment shaft 35 in the direction of the center line of the rotating plate 31. This causes the adjacent long slide rod 33 and short slide rod 37 to move closer to the semiconductor carrier 27 along the long slide groove 32 and short slide groove 36, respectively. This, in turn, causes the pressing blocks 39 to press the semiconductor carrier 27 from four directions. Since the four pressing blocks 39 are equidistant from the side wall of the semiconductor carrier 27 and have equal sliding distances, they push the semiconductor carrier 27 towards the center. When the abutment shaft 35 slides close to the center line of the rotating plate 31, the four pressing blocks 39 press the semiconductor carrier... The plate 27 is fixed so that the semiconductor carrier plate 27 is in the center of the processing groove 26, thereby ensuring that when the subsequent feeding electric telescopic rod pushes the processing fixture 25 to slide, each row of semiconductor chips on the surface of the semiconductor carrier plate 27 is aligned with the engraving component 22. As the pressure block 39 contacts the surface of the semiconductor carrier plate 27, the pressure block 39 can no longer slide. At this time, the pressure tube 41 continues to slide under the drive of the output shaft of the transmission electric telescopic rod. The drive spring 43 is compressed under the push of the pressure tube 41 until it can no longer be compressed. The pressure tube 41 holds the pressure block 39 against the drive spring 43 in the compression limit state, thereby preventing the pressure block 39 from sliding. This special semiconductor processing and engraving positioning fixture for new energy electric drive systems uses four pressure blocks 39 to firmly clamp the semiconductor carrier 27 in the center position, ensuring that it maintains precise positioning throughout the processing. When the electric telescopic rod pushes the processing fixture 25 to slide along the predetermined trajectory, this design enables each row of semiconductor chips on the carrier surface to form a precise spatial correspondence with the engraving component 22, thereby achieving automatic alignment of the chips with the engraving station and effectively improving the positioning accuracy and processing consistency of the engraving process.

[0034] When the pressing block 39 contacts the surface of the semiconductor carrier 27, the pressing block 39 can no longer slide. The pressure tube 41 continues to slide under the drive of the output shaft of the electric telescopic rod. At this time, the pressure tube 41 moves closer to the semiconductor carrier 27 and at the same time, the pressure tube 41 squeezes the drive spring 43. Under the action of the elastic force of the drive spring 43, the positioning mechanism can firmly clamp and position the semiconductor carrier 27. When the pressure tube 41 moves, the pressure spring 47 drives the central abutment shaft 42 to slide synchronously. When the semiconductor carrier 27 is placed in the processing tank 26 in the correct direction, and the semiconductor carrier 27 is positioned and clamped inside the processing tank 26, the detection tank 48 is aligned with the central abutment shaft 42. The central abutment shaft 42 extends into the detection tank 48 under the push of the pressure tube 41, indicating that the prompting mechanism will not react. When the semiconductor carrier 27 is not placed in the processing groove 26 in the correct orientation after positioning and clamping, the detection groove 48 and the central abutment 42 cannot be aligned. The central abutment 42, pushed by the pressure tube 41, contacts the side wall of the semiconductor carrier 27, causing the semiconductor carrier 27 to abut against the central abutment 42 and preventing further sliding. At this time, the pressure tube 41 continues to slide under the push of the output shaft of the drive electric telescopic rod, causing the pressure tube 41 to slide on the surface of the central abutment 42, resulting in a relative displacement between the pressure tube 41 and the central abutment 42. The pressure tube 41 is slowly fitted onto the central abutment shaft 42, while the piston plate 44 squeezes the pressure spring 47. When the pressure tube 41 slides on the surface of the central abutment shaft 42, the piston plate 44 pushes the gas inside the pressure tube 41 from inside the pressure tube 41 into the communicating groove 49, thereby pushing the piston rod 410 upward through the piston head, which in turn drives the extension slide rod 46 to slide upward synchronously, thereby providing power to the prompting mechanism, thus prompting the operator that the semiconductor carrier 27 is placed in the processing tank 26 in the wrong direction. Semiconductor carrier 27 is not placed in the processing tank 26 in the correct orientation. After the semiconductor carrier 27 is positioned and clamped, piston plate 44 pushes the gas inside pressure tube 41 into the communicating groove 49. As the piston rod 410 drives the extension slide rod 46 to slide upward synchronously, the extension slide rod 46 provides a thrust to the inclined surface of contact block 54 through power block 55. At this time, the rotating rod 51 rotates around the axis under the thrust of power block 55. At this time, the return lever 56 is on the rotating rod 51. Under pressure, it is gradually compressed. As the power block 55 disengages from the surface of the contact block 54 and the gap between the contact block 54 and the adjacent power block 55 is aligned, the rotating rod 51 loses the resistance of the power block 55. The rotating rod 51 rotates around the axis under the push of the spring-loaded paddle 56 until the contact block 54 extends into the gap between the adjacent power blocks 55. The hammer 52, driven by the rotating rod 51, collides with the bell 53 to produce a sound. This process is repeated through multiple power blocks 55 to alert the operator. When the semiconductor substrate 27 is placed inside the processing tank 26 in the wrong orientation, the system can immediately trigger an automatic alarm before the engraving process. This function effectively prevents orientation errors caused by human negligence and avoids subsequent engraving processes being performed on the wrong chip positions. This eliminates the scrapping of the entire batch of products and potential collision damage between the engraving component 22 and the equipment, fundamentally ensuring zero errors, high reliability and production safety in the processing flow.

[0035] When the rotating plate 31 rotates counterclockwise, it drives the pressure block 39 to move towards the center to clamp the semiconductor carrier plate 27. When the inclined surfaces of the connecting disc 62 and the power disc 61 are in contact with each other, the connecting disc 62 slides upward under the push of the power disc 61, thus sliding stably on the surface of the lifting shaft 65. At this time, the lifting shaft 65 will not rotate. As the rotating plate 31 rotates clockwise and the pressing block 39 retracts back into the shrinkage groove 38, the vertical part of the helical tooth block of the connecting disc 62 comes into contact with the vertical part of the helical tooth block of the power disc 61. The power disc 61 drives the connecting disc 62 to rotate synchronously with the rotating plate 31, thereby driving the lifting shaft 65 to rotate synchronously through the extension block 67, thus providing power for the lifting mechanism. As the pressing block 39 retracts back into the shrinkage groove 38, the lifting shaft 65 rotates synchronously with the rotating plate 31. During this process, the lifting shaft 65 provides an upward thrust to the abutment shaft 76 through the inner wall of the surface inclined slide groove 7, thereby pushing the lifting rod 73 to slide upward synchronously. The lifting plate 77 pushes the semiconductor carrier plate 27 to slide upward synchronously through the lifting rod 73. When the abutment shaft 76 slides to the upper end of the inclined slide groove 7, the upper surface of the lifting plate 77 is flush with the upper surface of the processing fixture 25, and the semiconductor carrier plate 27 is completely located outside the processing groove 26. The positioned semiconductor carrier plate 27 is pushed out of the processing groove 26, which not only avoids the contamination of the workpiece caused by manual handling, but also facilitates the clamping of the subsequent transportation mechanism. When processing the next workpiece, first control the pressing block 39 so that it cannot be moved out of the shrinkage groove 38. Then press the lifting plate 77 down until it retracts into the receiving groove. Since the rotating plate 31 is fixed under the restriction of the abutment shaft 35, and the power disc 61 and the connecting disc 62 are restricted and can only rotate in one direction, the lifting shaft 65 cannot rotate. By manually pressing the lifting plate 77, the lifting rod 73 is driven to slide down synchronously. Since the lifting shaft 65 cannot rotate, the abutment shaft 76 is driven by the lifting rod 73, the extension spring 75 is compressed, and the abutment shaft 76 retracts into the inside of the compression receiving groove 74, thus sliding down along the straight slide groove 71 until it falls into the lower end of the adjacent inclined slide groove 7, which facilitates the re-lifting of the next workpiece. After processing, the positioning fixture has the function of automatically ejecting the precisely positioned semiconductor carrier 27 from the processing slot 26. This design effectively avoids chip scratches, carrier surface scratches or positioning failures caused by manual removal of the carrier. Its smooth ejection action ensures the integrity of the finished product and achieves seamless connection with the next station or material receiving process, significantly improving the overall production rhythm and automation level.

Claims

1. A semiconductor processing engraving and positioning fixture for a new energy electric drive system, comprising a worktable (1), characterized in that: A processing rack (2) is fixedly connected to the upper surface of one end of the workbench (1). A processing guide rail (21) is fixedly connected to one side of the processing rack (2). A lettering component (22) is slidably connected to the surface of the processing guide rail (21). A processing fixture (25) is provided on the upper surface of the workbench (1). A processing groove (26) is opened on the upper surface of the processing fixture (25). A semiconductor carrier plate (27) is provided inside the processing groove (26). Multiple semiconductor chips are arranged in a rectangular array on the surface of the semiconductor carrier plate (27). The processing tank (26) is provided with a positioning mechanism that fixes the semiconductor substrate (27) at the center of the processing tank (26). A detection mechanism is provided on one side of the positioning mechanism to detect whether the semiconductor substrate (27) is correctly placed inside the processing tank (26).

2. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 1, characterized in that: The upper surface of the workbench (1) is symmetrically and fixedly connected with a feeding guide rail (23). The processing fixture (25) is slidably connected to the upper surface of the feeding guide rail (23). The lower surface of the processing fixture (25) is symmetrically and fixedly connected with a feeding guide block (24). The feeding guide block (24) is slidably connected to the inside of the feeding guide rail (23). One end of the upper surface of the workbench (1) is fixedly connected with a feeding electric telescopic rod. The output shaft of the feeding electric telescopic rod is fixedly connected to the processing fixture (25).

3. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 2, characterized in that: The positioning mechanism includes a central adjustment groove (3) inside the machining fixture (25). A rotating plate (31) is rotatably connected inside the central adjustment groove (3) via a rotating shaft. Long slide grooves (32) are symmetrically provided on the inner wall of the central adjustment groove (3). The long slide grooves (32) are L-shaped. The vertical part of the long slide grooves (32) is connected to the machining groove (26). A long slide rod (33) is slidably connected inside the long slide grooves (32). The long slide rod (33) is L-shaped. Short slide grooves (36) are symmetrically provided on the inner wall of the central adjustment groove (3). The vertical part of the short slide grooves (36) is connected to the machining groove (26). A short slide rod (37) is slidably connected inside the short slide grooves (36). (37) is L-shaped. The four side walls of the processing groove (26) are provided with shrinkage grooves (38). The vertical parts of the long slide groove (32) and the short slide groove (36) are connected to the adjacent shrinkage grooves (38). The interior of the four shrinkage grooves (38) is slidably connected with pressing blocks (39). The long slide rod (33) and the short slide rod (37) are fixedly connected to the adjacent pressing blocks (39). The surface of the rotating plate (31) is provided with four arc-shaped grooves (34) in a circumferential array. One end of the horizontal part of the long slide rod (33) and the short slide rod (37) is fixedly connected with a face-holding shaft (35). The face-holding shaft (35) extends into the interior of the adjacent arc-shaped groove (34). The processing fixture (25) is provided with a power mechanism inside.

4. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 3, characterized in that: The power mechanism includes a transmission electric telescopic rod fixedly connected to one side surface of the processing fixture (25). An extension groove (4) is provided on the inner wall of the contraction groove (38) near the transmission electric telescopic rod. A pressure tube (41) is slidably connected inside the extension groove (4). The output shaft of the transmission electric telescopic rod extends into the extension groove (4) and is fixedly connected to the pressure tube (41). A drive spring (43) is fixedly connected between the pressure tube (41) and the adjacent pressure block (39).

5. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 4, characterized in that: The detection mechanism includes a central abutment shaft (42) slidably connected inside the pressure tube (41). A detection groove (48) is formed on the side of the semiconductor carrier plate (27) near the pressure tube (41). The central abutment shaft (42) extends through the pressure block (39) into the detection groove (48). A piston plate (44) is slidably connected inside the pressure tube (41). The piston plate (44) is fixedly connected to the central abutment shaft (42). A pressure spring (47) is fixedly connected to the inner wall of the pressure tube (41). The pressure spring (47) is fixedly connected to the piston plate (44). The pressure tube (41) is fixedly connected to an extension frame (45) at one end away from the pressure block (39). A connecting groove (49) is provided between the extension frame (45) and the pressure tube (41). A piston rod (410) is slidably connected inside the connecting groove (49). A piston head is provided at one end of the piston rod (410) near the pressure spring (47). An extension slide rod (46) is slidably connected inside the extension frame (45). The piston rod (410) and the extension slide rod (46) are fixedly connected. A prompting mechanism is provided on one side of the extension frame (45).

6. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 5, characterized in that: The prompting mechanism includes a side frame (5) fixedly connected to one side of the extension frame (45). A power slot is provided on the side of the extension frame (45) near the side frame (5). The extension frame (45) is connected to the side frame (5) via the power slot. A bell (53) is fixedly connected to the top of the extension frame (45). A rotating rod (51) is rotatably connected to the inside of the side frame (5) via a rotating shaft. A striking hammer (52) is fixedly connected to one end of the rotating rod (51). The bell (53) is located on the rotation path of the striking hammer (52). The inside of the side frame (5)... A spring-loaded paddle (56) is fixedly connected to the rotating rod (51) and the rotating rod (51) is located on the rotation path of the rotating rod (51). A contact block (54) is fixedly connected to the side of the rotating rod (51) away from the spring-loaded paddle (56). The contact block (54) has inclined surfaces on both sides near the end of the extension frame (45). Multiple power blocks (55) are arranged in a linear array from top to bottom on the surface of the extension slide rod (46). The inclined part of the contact block (54) is located on the sliding path of the power block (55). A connecting mechanism is provided above the rotating plate (31).

7. A semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 3, characterized in that: The connecting mechanism includes a top groove (6) formed on the inner wall above the central adjustment groove (3). A lifting shaft (65) is rotatably connected to the inner wall above the top groove (6). A power disc (61) is fixedly connected to the upper surface of the rotating plate (31). An annular frame (63) is slidably connected to the surface of the lifting shaft (65). Error grooves (66) are symmetrically formed on the surface of the lifting shaft (65). Extension blocks (67) are symmetrically arranged on the inner wall of the annular frame (63). The extension blocks (67) are slidably connected to the inside of the error grooves (66). A connecting disc (62) is fixedly connected to the lower surface of the annular frame (63). The lower surface of the connecting disc (62) and the upper surface of the power disc (61) are both arranged in a circumferential array with multiple helical teeth blocks. The inclined surfaces of the helical teeth blocks of the connecting disc (62) and the helical teeth blocks of the power disc (61) are opposite in direction. The helical teeth blocks of the connecting disc (62) and the helical teeth blocks of the power disc (61) mesh with each other. A lifting mechanism is provided inside the top groove (6). A connecting spring (64) is fixedly connected between the connecting disc (62) and the lifting shaft (65).

8. The semiconductor processing engraving and positioning fixture for a new energy electric drive system according to claim 7, characterized in that: The lifting mechanism includes multiple lifting slots (72) arranged in a circumferential array on the inner wall of the top slot (6). A receiving slot is provided on the inner wall of the processing slot (26). A lifting plate (77) is slidably connected inside the receiving slot. One end of the lifting slot (72) passes through the processing fixture (25) and communicates with the receiving slot. A lifting rod (73) is slidably connected inside the lifting slot (72). The lifting plate (77) is fixedly connected to the multiple lifting rods (73). Multiple oblique grooves are arranged in a circumferential array on the surface of the lifting shaft (65). 7) A straight groove (71) is provided between the upper end of the inclined groove (7) and the lower end of the adjacent inclined groove (7). The depth of the inclined groove (7) is greater than that of the straight groove (71). A compression groove (74) is provided at one end of the lifting rod (73). A retaining shaft (76) is slidably connected inside the compression groove (74). An extension spring (75) is fixedly connected to the inner wall of the compression groove (74). The extension spring (75) is fixedly connected to the retaining shaft (76). One end of the retaining shaft (76) extends into the interior of the inclined groove (7).

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