Refrigerator

Abstract

The refrigerator includes: a main body; a storage chamber formed inside the main body; a door provided so that the storage compartment can be opened and closed; an evaporator that evaporates the refrigerant to generate cold air; an evaporator duct disposed at a rear side of the storage compartment to supply the cold air generated by the evaporator to the storage compartment; and a thermoelectric cooling device including a thermoelectric element having a heating unit and a cooling unit. The thermoelectric cooling device is configured to heat air from the outside of the main body by the heating unit and discharge the air heated by the heating unit to the outside of the main body, cool air from the storage compartment by the cooling unit, and supply the air cooled by the cooling unit to the storage compartment, and is disposed above the storage compartment.

Description

Technical Field

[0001] This disclosure relates to a refrigerator, and more specifically, to a refrigerator including a thermoelectric element for cooling the storage compartment. Background Technology

[0002] A refrigerator is a household appliance that keeps food fresh by including a main body and a cold air supply device, the main body including a storage compartment and the cold air supply device being configured to supply cold air to the storage compartment.

[0003] Thermoelectric cooling devices that perform heating and cooling functions through the Peltier effect can be used as cold air supply devices for refrigerators. Thermoelectric cooling devices may include thermoelectric elements. The thermoelectric element includes a heating portion formed on one side and a cooling portion formed on the other side, and when an electric current is applied to the thermoelectric element, heat may be generated in the heating portion and heat may be absorbed in the cooling portion.

[0004] Thermoelectric cooling devices can be equipped with heat sinks, cooling fins, cooling fans, cooling fans, heat dissipation ducts, and cooling ducts to improve the cooling efficiency of the storage compartment. Summary of the Invention

[0005] Technical issues

[0006] This disclosure aims to provide a refrigerator that includes a thermoelectric cooling device using thermoelectric elements.

[0007] Furthermore, this disclosure aims to provide a refrigerator with improved heat dissipation efficiency of the thermoelectric cooling device.

[0008] Furthermore, this disclosure aims to provide a refrigerator that improves the cooling efficiency of the storage compartment through a thermoelectric cooling device.

[0009] Furthermore, this disclosure aims to provide a refrigerator capable of utilizing waste heat generated from a thermoelectric cooling device.

[0010] Furthermore, this disclosure aims to provide a refrigerator that facilitates the assembly, disassembly, replacement, and repair of the thermoelectric cooling device.

[0011] The technical problems to be solved by the present invention are not limited to those described above, and based on the following description, those skilled in the art will clearly understand other technical problems not mentioned above.

[0012] Technical solution

[0013] In one aspect of this disclosure, a refrigerator may include: a main body; a storage compartment within the main body; a door configured to open and close the storage compartment; an evaporator configured to evaporate refrigerant to generate cold air; an evaporator duct located at the rear of the storage compartment and configured to supply the cold air generated by the evaporator to the storage compartment; and a thermoelectric cooling device including a thermoelectric element comprising a heating portion and a cooling portion, the heating portion generating heat and thereby heating air, the cooling portion absorbing heat and thereby cooling air, wherein the thermoelectric cooling device is configured to heat air from outside the main body using the heating portion and exhaust the air heated by the heating portion to the outside of the main body, and to cool air from the storage compartment using the cooling portion and supply the air cooled by the cooling portion to the storage compartment, and the thermoelectric cooling device is disposed above the storage compartment.

[0014] The heating section can face upwards from the thermoelectric element, and the cooling section can face downwards from the thermoelectric element.

[0015] The thermoelectric cooling device may include a heat sink. The heat sink may include a heat sink base in contact with the heated portion, and a plurality of heat dissipation fins protruding from the heat sink base in a first direction perpendicular to the upper surface of the heat sink base.

[0016] The thermoelectric cooling device may include a cooling fan configured to generate airflow toward the heat sink in a second direction parallel to the upper surface of the heat sink base.

[0017] The cooling fan can be a centrifugal fan, configured to draw air into the centrifugal fan along its axial direction and exhaust the airflow radially. The heat sink can be located in the radial direction.

[0018] The thermoelectric cooling device may include a fan housing, in which a cooling fan is housed, and the fan housing directs airflow from the cooling fan to the heat sink.

[0019] The fan housing may include: a housing bottom to which a cooling fan is rotatably coupled; a housing volute portion extending upward from the edge of the housing bottom; and a housing guide extending upward from the housing bottom and spaced apart from the housing volute portion, wherein the housing bottom, housing volute portion, and housing guide are configured to guide airflow from the cooling fan toward the heatsink.

[0020] Depending on the rotation direction of the cooling fan, the volute portion of the housing may include a downstream end and an upstream end. The opening in the volute portion may be between the downstream and upstream ends and may open towards the heatsink.

[0021] The housing guide can be configured to direct airflow toward the upstream end of the housing volute portion.

[0022] The thermoelectric cooling device may include a heat dissipation duct located on the upper side of the main body to guide airflow for heat exchange with the heat sink.

[0023] The heat dissipation duct may include an external air inlet for drawing air from the outside of the main body into the heat dissipation duct, and an external air outlet for discharging the air drawn into the heat dissipation duct and exchanging heat with the heat sink to the outside of the main body.

[0024] The heat dissipation duct may include: a fan housing portion forming a fan housing space for accommodating the heat dissipation fan; and a sink accommodating portion forming a sink accommodating space for accommodating the heat sink.

[0025] The fan housing and the plate housing can be set horizontally relative to each other.

[0026] The cooling duct may include an air intake duct section located upstream of the fan housing section, forming an air intake space to guide air drawn into the cooling duct from the outside of the main body through the external air intake to the fan housing space.

[0027] The heat dissipation duct may include an exhaust duct section, which forms an exhaust space on the downstream side of the heat sink housing section to guide the air that exchanges heat with the heat sink to the external air exhaust port.

[0028] Another aspect of this disclosure provides a refrigerator comprising: a main body including an upper wall, a lower wall, a left wall, a right wall, and a rear wall; a storage compartment formed within the main body; a door configured to open and close the storage compartment; a thermoelectric element including a heating portion and a cooling portion, the thermoelectric element being disposed on the upper wall to allow the heating portion to face upwards and the cooling portion to face downwards; a heat sink including a heat sink base in contact with the heating portion; and a plurality of heat sink fins configured to project in a first direction perpendicular to an upper surface of the heat sink base and to extend in a second direction parallel to the upper surface of the heat sink base; a cooling fan disposed on the upper wall to blow air toward the plurality of heat sink fins in the second direction; and a heat dissipation duct disposed on the upper wall to guide the air flowing through the cooling fan.

[0029] The cooling fan can be a centrifugal fan, configured to draw in air in the axial direction and expel air in the radial direction. The cooling fan can be mounted on the upper surface of the body such that the fan's axis of rotation is perpendicular to the upper surface of the body, and the heat sink is located in one radial direction of the cooling fan.

[0030] The heat dissipation duct may include a fin receiving portion configured to form a fin receiving space, the fin receiving space being configured to receive the heat sink. The fin receiving space may be formed on the lower surface of the fin receiving portion.

[0031] The heat dissipation duct may include a channel blocking protrusion protruding from the lower surface of the fin receiving portion, which is positioned on a heat dissipation channel that is wider than other heat dissipation channels in the heat dissipation channel formed between multiple heat dissipation fins.

[0032] Another aspect of this disclosure provides a refrigerator comprising: a main body including an upper wall, a lower wall, a left wall, a right wall, and a rear wall; a storage compartment formed within the main body; a door configured to open and close the storage compartment; a thermoelectric element including a heating portion and a cooling portion, the thermoelectric element being disposed on the upper wall such that the heating portion faces upwards from the thermoelectric element and the cooling portion faces downwards from the thermoelectric element; a heat sink configured to contact the heating portion; a cooling fan configured to generate an airflow; and a cooling duct comprising: an external air inlet configured to draw in air from outside the main body; and an external air outlet configured to discharge air that has exchanged heat with the heat sink toward the outside of the main body.

[0033] Beneficial effects

[0034] It can improve the heat dissipation efficiency of thermoelectric cooling devices.

[0035] In addition, the cooling efficiency of thermoelectric cooling devices can be improved through the natural convection of heat.

[0036] In addition, energy consumption can be reduced by utilizing waste heat generated from thermoelectric cooling devices.

[0037] In addition, it facilitates the assembly, disassembly, replacement, and repair of thermoelectric cooling devices.

[0038] The effects that can be obtained through this disclosure are not limited to those described above, and other effects not described above will be clearly understood by those skilled in the art to which this disclosure pertains from the following description. Attached Figure Description

[0039] Figure 1 This is a diagram illustrating a refrigerator according to one embodiment of the present disclosure.

[0040] Figure 2 This is a diagram showing the refrigerator door in an open state according to an embodiment of the present invention.

[0041] Figure 3 This is a bottom view of the upper part of the storage compartment of a refrigerator according to an embodiment of the present disclosure.

[0042] Figure 4 This is a schematic side sectional view of a refrigerator according to an embodiment of the present disclosure.

[0043] Figure 5 It is along Figure 2 The sectional view taken from line II.

[0044] Figure 6 This is a diagram illustrating the inner shell, outer shell, and connecting frame according to one embodiment of the present disclosure.

[0045] Figure 7 This is a diagram illustrating a connection frame according to an embodiment of the present disclosure.

[0046] Figure 8 This is a perspective view of the connection structure between the thermoelectric module and the upper wall of a refrigerator according to an embodiment of the present disclosure.

[0047] Figure 9 This is an exploded view of a cooling fan and a thermoelectric module according to an embodiment of the present disclosure.

[0048] Figure 10 This is a diagram illustrating a heat sink according to one embodiment of the present disclosure.

[0049] Figure 11 This is a diagram illustrating a cooling plate according to an embodiment of the present disclosure.

[0050] Figure 12 This is a diagram showing a top cover separate from the main body of the refrigerator according to an embodiment of the present disclosure.

[0051] Figure 13 This is a diagram showing a top cover and a heat dissipation duct cover separate from the main body of the refrigerator according to an embodiment of the present disclosure.

[0052] Figure 14 This is a diagram showing a top cover, a heat dissipation duct cover, a heat dissipation duct body, and an extended duct, separate from the main body of the refrigerator, according to an embodiment of the present disclosure.

[0053] Figure 15 This is an exploded view of a heat dissipation duct according to an embodiment of the present disclosure.

[0054] Figure 16 This is a diagram showing the lower surface of a heat dissipation duct according to an embodiment of the present disclosure.

[0055] Figure 17 This is an enlarged view of a portion of a heat dissipation duct and a thermoelectric module according to an embodiment of the present disclosure.

[0056] Figure 18 This is a diagram illustrating a top cover according to an embodiment of the present disclosure.

[0057] Figure 19 This is a diagram of the lower surface of a top cover according to an embodiment of the present disclosure.

[0058] Figure 20 This is a diagram illustrating a first heat dissipation flow path, a second heat dissipation flow path, and a top cover flow path according to an embodiment of the present disclosure.

[0059] Figure 21 This is a diagram illustrating a first heat dissipation flow path and a top cover flow path according to an embodiment of the present disclosure.

[0060] Figure 22 This is a diagram illustrating a first heat dissipation flow path according to an embodiment of the present disclosure.

[0061] Figure 23 This is a diagram illustrating the positional relationship between a cooling fan and a heat sink according to an embodiment of the present disclosure. Detailed Implementation

[0062] The various embodiments and terminology used in this document are not intended to limit the technical features described herein to the particular embodiments, and should be understood to include various modifications, equivalents, or alternatives to the corresponding embodiments.

[0063] Similar reference numerals may be used for similar or related parts in conjunction with the description in the accompanying drawings.

[0064] Unless otherwise explicitly stated in the relevant context, the singular form of the noun corresponding to an item may include one or more items.

[0065] In this document, phrases such as “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “at least one of A, B or C” can include any one or all possible combinations of the items listed together in the corresponding phrases in the phrase.

[0066] As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0067] Terms such as “first,” “second,” “primary,” or “secondary” may be used only to distinguish a component from other components, without limiting the component in other ways (e.g., importance or order).

[0068] Furthermore, as used in this disclosure, the terms “front,” “rear,” “top,” “bottom,” “side,” “left,” “right,” “upper,” “lower,” etc., are defined with reference to the accompanying drawings and are not intended to limit the shape and position of each component.

[0069] It will be understood that when the terms “comprising” and / or “including” are used in this specification, it indicates the presence of the stated features, drawings, steps, operations, parts, components, or combinations thereof, but does not exclude the presence or addition of one or more other features, drawings, steps, operations, parts, components, or combinations thereof.

[0070] It should be understood that when a component is referred to as being "connected to," "coupled to," "supported by," or "in contact with" another component, it can be directly or indirectly connected to, coupled to, supported by, or in contact with the other component. When a component is indirectly connected to, coupled to, supported by, or in contact with another component, it can be connected to, coupled to, supported by, or in contact with the other component through a third component.

[0071] It will also be understood that when a component is referred to as being "on" or "above" another component, the component may be directly on the other component or there may be an intermediate component.

[0072] A refrigerator according to an embodiment of this disclosure may include a body.

[0073] The main body may include thermal insulation material. The thermal insulation material isolates the interior of the storage room from the exterior to maintain the interior temperature at an appropriate level, unaffected by the external environment. According to embodiments of this disclosure, the thermal insulation material may include foamed thermal insulation material. According to embodiments of this disclosure, in addition to foamed thermal insulation material, the thermal insulation material may also include vacuum insulation material, or may consist only of vacuum insulation material instead of foamed thermal insulation material.

[0074] A "storage room" may include a space defined by an inner shell. A storage room may also include an inner shell defining the space. One side of the storage room may open to allow a user to place or retrieve food. The storage room may store "food" within it. Food may include food for human consumption, and specifically, food may include meat, fish, seafood, fruits, vegetables, water, ice, beverages, pickles, alcoholic beverages such as wine, etc. However, medicines or cosmetics, as well as food, may be stored in the storage room, and there are no restrictions on the items that can be stored in the storage room.

[0075] A refrigerator may include one or more storage compartments. In the case of two or more storage compartments in a refrigerator, each compartment may have a different purpose and may be maintained at a different temperature. For this purpose, the storage compartments may be separated by partition walls including insulating material. According to embodiments of this disclosure, the partition may be part of the main body. According to embodiments of this disclosure, the partition may be set independently of the main body and then assembled into the main body.

[0076] Storage compartments can be maintained within an appropriate temperature range depending on their intended use, and can be categorized as "refrigeration compartment," "freezer compartment," and "temperature conversion compartment" based on their intended use and / or temperature range. A refrigerator compartment can be maintained at an appropriate temperature to keep food refrigerated, and a freezer compartment can be maintained at an appropriate temperature to keep food frozen. "Refrigeration" can mean keeping food refrigerated without freezing it; for example, a refrigerator compartment can be maintained in the range of 0°C to 7°C. "Freezing" can mean freezing food or keeping food frozen, and for example, a freezer compartment can be maintained in the range of -20°C to -1°C. A temperature conversion compartment can be used as either a refrigerator compartment or a freezer compartment, depending on the user's choice or without considering the user's choice. According to embodiments of this disclosure, an area of ​​the storage compartment can be used as a refrigerator compartment, and the remaining area of ​​the storage compartment can be used as a freezer compartment.

[0077] In addition to “refrigeration room,” “freezer,” and “temperature conversion room,” storage rooms can also be referred to by various other terms, such as “vegetable room,” “freshness room,” “cooling room,” and “ice-making room.” Furthermore, terms such as “refrigeration room,” “freezer,” and “temperature conversion room” used below should be understood to refer to storage rooms with corresponding intended uses and corresponding temperature ranges.

[0078] A refrigerator according to embodiments of the present disclosure may include at least one door configured to open or close an opening side of a storage compartment. Different doors may be provided to open and close one or more storage compartments, or a single door may be provided to open and close multiple storage compartments. The door may be rotatably or slidably mounted on the front of the body.

[0079] The "door" can seal the storage compartment when closed. Like the main body, the door may include insulation material to keep the storage compartment insulated when closed.

[0080] According to one embodiment, the door may include an outer door panel forming the front surface of the door, an inner door panel forming the rear surface of the door and facing the storage compartment, a top cover, a bottom cover, and door insulation material disposed therein.

[0081] Gaskets can be installed on the edges of the inner door panel to seal the storage compartment by making tight contact with the front surface of the body when the door is closed. The inner door panel may include a rearward-projecting enclosure to allow for the installation of a door basket for storing items.

[0082] According to an embodiment, the door may include a door body and a front panel, the front panel being detachably attached to the front of the door body and forming the front surface of the door. The door body may include an outer door panel forming the front surface of the door body, an inner door panel forming the rear surface of the door body and facing the storage compartment, a top cover, a bottom cover, and door insulation material disposed therein.

[0083] Based on the arrangement of the doors and storage compartments, refrigerators can be divided into French door type, side-by-side type, bottom-mounted freezer (BMF), top-mounted freezer (TMF), or single-door refrigerators.

[0084] A refrigerator according to an embodiment of the present disclosure may include a cold air supply device for supplying cold air to the storage compartment.

[0085] "Cold air supply equipment" can include machines, equipment, electronic devices and / or combinations thereof capable of generating and directing cold air to cool storage rooms.

[0086] According to embodiments of this disclosure, a cold air supply device can generate cold air through a cooling cycle including the compression, condensation, expansion, and evaporation processes of a refrigerant. For this purpose, the cold air supply device may include a cooling cycle device having a compressor, a condenser, an expander, and an evaporator to drive the cooling cycle. According to embodiments of this disclosure, the cold air supply device may include a semiconductor such as a thermoelectric element. The thermoelectric element can cool the storage compartment through heating and cooling effects of the Peltier effect.

[0087] A refrigerator according to an embodiment of the present disclosure may include a machine compartment in which at least some components belonging to a cold air supply device are installed.

[0088] The "machine room" can be separated from and insulated from the storage room to prevent heat generated by components installed in the machine room from being transferred to the storage room. To allow heat dissipation from components installed in the machine room, the machine room can be connected to the outside of the main structure.

[0089] A refrigerator according to embodiments of the present disclosure may include a dispenser disposed on the door to provide water and / or ice. The dispenser may be disposed on the door to allow a user to access the water without opening the door.

[0090] A refrigerator according to an embodiment of the present disclosure may include an ice-making device for producing ice. The ice-making device may include an ice tray for storing water, an ice-transfer device for separating ice from the ice tray, and an ice bucket for storing the ice produced in the ice tray.

[0091] A refrigerator according to an embodiment of the present disclosure may include a controller for controlling the refrigerator.

[0092] The “controller” may include a memory for storing and / or memorizing data and / or programs for controlling the refrigerator, and a processor for outputting control signals for controlling the cold air supply device, etc., based on the programs and / or data stored in the memory.

[0093] The memory can store or record various information, data, commands, programs, etc., required for the operation of the refrigerator. The memory can store temporary data generated when control signals are produced to control components included in the refrigerator. The memory can include at least one or a combination of volatile memory and non-volatile memory.

[0094] The processor controls the overall operation of the refrigerator. It can control the refrigerator's components by executing programs stored in memory. The processor may include a separate neural processing unit (NPU) that executes artificial intelligence (AI) models. Furthermore, the processor may include a central processing unit (CPU), a graphics processing unit (GPU), etc. The processor can generate control signals to control the operation of the cold air supply unit. For example, the processor can receive temperature information from a temperature sensor in the refrigerator compartment and generate cooling control signals based on this information to control the operation of the cold air supply unit.

[0095] Furthermore, the processor can process user input to the user interface and control the operation of the user interface based on programs and / or data stored in memory. Input and output interfaces can be used to provide the user interface. The processor can receive user input from the user interface. Additionally, in response to user input, the processor can send display control signals and image data to the user interface for displaying images on the user interface.

[0096] The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one sub-processor. The memory may include one or more memory units.

[0097] A refrigerator according to embodiments of the present disclosure may include a processor and a memory for controlling all components included in the refrigerator, and may include multiple processors and multiple memories for individually controlling components of the refrigerator. For example, the refrigerator may include a processor and memory for controlling the operation of a cold air supply device based on the output of a temperature sensor. Additionally, the refrigerator may be separately equipped with a processor and memory for controlling the operation of a user interface based on user input.

[0098] The communication module can communicate with external devices (such as servers, mobile devices, and other home appliances) via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.

[0099] Input interfaces can include buttons, touchscreens, microphones, etc. Input interfaces can receive user input and pass the received user input to the processor.

[0100] Output interfaces can include displays, speakers, etc. Output interfaces can output various notifications, messages, and information generated by the processor.

[0101] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0102] Figure 1 This is a diagram illustrating a refrigerator according to one embodiment of the present disclosure. Figure 2 This is a diagram showing the refrigerator door in an open state according to an embodiment of the present invention. Figure 3 This is a bottom view of the upper part of the storage compartment of a refrigerator according to an embodiment of the present disclosure. Figure 4 This is a schematic side sectional view of a refrigerator according to an embodiment of the present disclosure. Figure 5 It is along Figure 2 Sectional view taken from line II

[0103] refer to Figures 1 to 5 The refrigerator 1 may include a main body 100, storage compartments 11, 12 and 13 formed inside the main body 100, and doors 21, 22, 23 and 24 configured to open and close the storage compartments 11, 12 and 13.

[0104] The main body 100 may include an inner shell 170, an outer shell 180 connected to the outside of the inner shell 170, and a heat insulation material 190 disposed between the inner shell 170 and the outer shell 180 (see reference). Figure 6 The inner shell 170 can form storage chambers 11, 12 and 13, and the outer shell 180 can form the exterior of the main body 100.

[0105] In addition, the main body 100 may include an upper wall 110, a lower wall 120, a left wall 130, a right wall 140, and a rear wall 150. The upper wall 110, lower wall 120, left wall 130, right wall 140, and rear wall 150 may respectively form the upper surface, lower surface, left surface, right surface, and rear surface of the main body 100.

[0106] The upper wall 110, lower wall 120, left wall 130, right wall 140, and rear wall 150 may each be formed with an inner shell 170, an outer shell 180, and a heat insulation material 190. For example, the upper surface of the upper wall 110 may be formed by the outer shell 180, the lower surface of the upper wall 110 may be formed by the inner shell 170, and the heat insulation material 190 may be disposed inside the upper wall 110.

[0107] Storage compartments 11, 12, and 13 can hold items. Storage compartments 11, 12, and 13 may have openable front sides to allow items to be inserted into or removed from them. The main body 100 may include a horizontal partition 160 for separating the first storage compartment 11 from the second storage compartment 12 and the third storage compartment 13, and a vertical partition 161 for separating the second storage compartment 12 from the third storage compartment 13. The first storage compartment 11 may be located in the upper part of the main body 100, and the second and third storage compartments 12 may be located in the lower part of the main body 100. The first storage compartment 11 may be a refrigerator compartment, the second storage compartment 12 may be a freezer compartment, and the third storage compartment 13 may be a variable temperature compartment.

[0108] Doors 21, 22, 23, and 24 can open and close storage rooms 11, 12, and 13. First door 21 and second door 22 can open and close the first storage room 11, third door 23 can open and close the second storage room 12, and fourth door 24 can open and close the third storage room 13. Doors 21, 22, 23, and 24 can be rotatably connected to the main body 100.

[0109] Doors 21, 22, 23, and 24 can be rotatably connected to the body 100 via hinges. For example, the first door 21 and the second door 22 can be rotatably connected to the body 100 via a hinge 31 located on the upper part of the body 100 and a hinge located in the middle of the body 100. The hinge 31 may include a hinge pin that protrudes vertically to form a pivot for the door. The hinge 31 may be covered by a top cover 300, which is configured to cover the upper front surface of the body 100.

[0110] One of the first door 21 and the second door 22 may be provided with a rotating rod 40, configured to cover the gap formed between the first door 21 and the second door 22 when the first door 21 and the second door 22 are closed. The rotating rod 40 may be rotatably mounted on one of the first door 21 and the second door 22. The rotating rod 40 may have a rod shape that extends in the vertical direction. The rotating rod 40 may also be referred to as a "support", "vertical frame", etc.

[0111] The guide protrusion 46 can be provided at the upper end of the rotating rod 40, and the rotation guide 119 configured to guide the rotation of the guide protrusion 46 can be provided in the upper part of the main body 100.

[0112] Doors 21, 22, 23, and 24 may include washers 51. When doors 21, 22, 23, and 24 are closed, washers 51 may be in close contact with the front surface of body 100. Doors 21, 22, 23, and 24 may include rearwardly projecting enclosures 52. Enclosures 52 may be equipped with gantry frames 53 capable of storing goods. A rotating rod 40 may be rotatably mounted on enclosures 52.

[0113] The number and arrangement of storage compartments and the number and arrangement of doors have been described above, but the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure are not limited thereto.

[0114] The refrigerator 1 may include a thermoelectric cooling device 400 configured to cool the storage compartment 11.

[0115] The thermoelectric cooling device 400 can be installed on the upper side of the storage chamber 11 to cool the storage chamber 11. That is, the thermoelectric cooling device can be installed on the upper wall 110 of the main body 100.

[0116] The thermoelectric cooling device may include a thermoelectric element 530. The thermoelectric element 530 may be a semiconductor element that converts heat energy into electrical energy using the thermoelectric effect, and may also be called a "thermoelectric semiconductor element", "Peltier element", etc.

[0117] The thermoelectric element 530 includes a heating portion 531 and a cooling portion 532. When an electric current is applied to the thermoelectric element 530, heat can be generated in the heating portion 531 and heat can be absorbed in the cooling portion 532. The thermoelectric element 530 may have a thin hexahedral shape. The heating portion 531 may be disposed on one surface of the thermoelectric element 530, and the cooling portion 532 may be disposed on the opposite surface.

[0118] The thermoelectric element 530 can be disposed on the upper wall 110 such that the heating portion 531 faces upward and the cooling portion 532 faces downward. That is, the heating portion 531 can face the outside of the main body 100 and the cooling portion 532 can face the inside of the storage chamber 11. Therefore, air heated by heat exchange with the heating portion 531 can be discharged to the outside of the main body 100, and air cooled by heat exchange with the cooling portion 532 can be supplied to the storage chamber 11.

[0119] The thermoelectric cooling device 400 may include heat sinks 520 that are in contact with the heating portion 531 to effectively exchange heat between the heating portion 531 and the air outside the main body 100.

[0120] The heat sink 520 can be located on the outside of the main body 100. The heat sink 520 can be in contact with the heating element 531 to absorb heat from the heating element 531 and dissipate the heat to the outside of the main body 100. The heat sink 520 can also be referred to as a "heat sink", "heat dissipation device", "radiator", etc.

[0121] The heat sink 520 can be formed from a metallic material with relatively high thermal conductivity. For example, the heat sink 520 can be formed from aluminum or copper.

[0122] The heat sink 520 may include a heat sink base 521 that contacts the heating portion 531 and a plurality of heat sink fins 525 that protrude from the heat sink base 521 to increase the heat dissipation area. The plurality of heat sink fins 525 may protrude upward from the heat sink base 521.

[0123] The thermoelectric cooling device 400 may include cooling fins 570 in contact with the cooling section 532 to effectively exchange heat between the cooling section 532 and the air inside the storage chamber 11.

[0124] Cooling fin 570 can be located inside storage chamber 11. Cooling fin 570 cools storage chamber 11 by absorbing heat from storage chamber 11 and transferring the heat to cooling section 532. Cooling fin 570 can also be referred to as "cooling sink", "cooling plate", "cooling radiator", "cold radiator", "cooling heat sink", etc.

[0125] The cooling fin 570 can be formed from a metallic material with relatively high thermal conductivity. For example, the cooling fin 570 can be formed from aluminum or copper.

[0126] The cooling fin 570 may include a cooling fin base 571 in contact with the cooling portion 532 and a plurality of cooling fins 575 protruding from the cooling fin base 571 to increase the heat transfer area. The plurality of cooling fins 525 may protrude downward from the cooling fin base 571. The cooling fin base 571 and the plurality of cooling fins 575 may be integrally formed with each other.

[0127] The thermoelectric cooling device 400 may include a cooling fan 600 configured to move air to effectively exchange heat between the heat sink 520 and the air outside the body 100.

[0128] The cooling fan 600 can be configured to blow air toward the heat sink 520. The cooling fan 600 can be located in the horizontal direction of the heat sink 520. The cooling fan 600 can be located on the outside of the main body 100. The cooling fan 600 can be located on the upper side of the upper wall 110.

[0129] The cooling fan 600 may be a centrifugal fan configured to draw in air axially and exhaust the drawn-in air radially. The centrifugal fan may include a blower fan. The rotation axis 610 of the cooling fan 600 may be disposed perpendicular to the upper surface of the upper wall 110.

[0130] The thermoelectric cooling device 400 may include a heat dissipation duct 700, which is configured to guide air flowing through the cooling fan 600. The heat dissipation duct 700 can draw in air from outside the main body 100 and guide the drawn-in air to exchange heat with the heat sink 520, and exhaust the air that has exchanged heat with the heat sink 520 back to the outside of the main body 100.

[0131] The cooling duct 700 can draw in air from the external space above the main body 100. The cooling duct 700 can exhaust the air that has exchanged heat with the heat sink 520 to the external space above the main body 100. The cooling fan 600 can be located inside the cooling duct 700. The heat sink 520 can be located inside the cooling duct 700. The cooling duct 700 can be installed on the upper surface of the upper wall 110.

[0132] The heat dissipation duct 700 may include: an external air inlet 751 for drawing air from outside the main body 100 into the heat dissipation duct 700; and an external air outlet 782 for discharging air that has exchanged heat with the heat sink 520 to the outside of the main body 100.

[0133] The thermoelectric cooling device 400 may include a cooling fan 800 configured to move air to effectively exchange heat between the cooling fins 570 and the air within the storage chamber 11.

[0134] The cooling fan 800 can be configured to blow air toward the cooling fin 570. The cooling fan 800 can be located in the horizontal direction of the cooling fin 570. The cooling fan 800 can be installed inside the storage chamber 11. The cooling fan 800 can be installed on the lower side of the upper wall 110.

[0135] The cooling fan 800 may be a centrifugal fan, configured to draw in air axially and exhaust the drawn-in air radially. The rotating shaft 810 of the cooling fan 800 may be arranged perpendicular to the lower surface of the upper wall 110.

[0136] The thermoelectric cooling device 400 may include a cooling duct 900 configured to guide air flowing through the cooling fan 800. The cooling duct 700 may draw in air from the storage chamber 11 and guide the drawn-in air to exchange heat with the cooling fins 570, and exhaust the air that has exchanged heat with the cooling fins 570 back into the storage chamber 11.

[0137] The cooling fan 800 can be located inside the cooling duct 900. The cooling fins 570 can be located inside the cooling duct 900. The cooling duct 800 can be set on the lower surface of the upper wall 110.

[0138] The cooling duct 900 may include an internal air inlet 991 for drawing air from inside the storage chamber 11 into the cooling duct 900, and an internal air outlet 992 for discharging air that has exchanged heat with the cooling fins 570 into the storage chamber 11.

[0139] refer to Figure 4 The refrigerator 1 may include a refrigeration cycle device to cool the storage compartments via a refrigeration cycle. The refrigeration cycle device may include a compressor 2, a condenser (not shown), an expansion device (not shown), and an evaporator 3. The evaporator 3 may be located behind the storage compartments 12 and 13.

[0140] Refrigerator 1 may include evaporator ducts 60 and 70, configured to guide cold air generated in evaporator 3. A first evaporator duct 60 may be provided behind the second storage compartment 12 and the third storage compartment 13. A second evaporator duct 70 may be provided behind the first storage compartment 11.

[0141] The cold air generated in evaporator 3 can be drawn into the first evaporator duct 60 by evaporator fan 80. The cold air drawn into the first evaporator duct 60 can be discharged to the second storage chamber 12 or the third storage chamber 13 through a cold air outlet (not shown) formed on the front surface. Alternatively, the cold air drawn into the first evaporator duct 60 can be guided into the internal flow path 78 of the second evaporator duct 70. The first evaporator duct 60 may be provided with a baffle 61, which is configured to control the supply of cold air from inside the first evaporator duct 60 to the second evaporator duct 70. A connecting duct 90 can be provided between the first evaporator duct 60 and the second evaporator duct 70 to connect them.

[0142] The cold air introduced into the internal flow path 78 of the second evaporator duct 70 can be supplied to the first storage chamber 11 through the cold air outlet 72 formed on the front surface of the second evaporator duct 70.

[0143] However, unlike the embodiments described above, the cold air generated in the evaporator 3 can be directly supplied to the second evaporator duct 70 without passing through the first evaporator duct 60. Alternatively, a separate evaporator 3 can be installed behind the first storage chamber 11 to supply cold air to the second evaporator duct 70.

[0144] As described above, a refrigerator 1 according to an embodiment of the present disclosure may include a thermoelectric cooling device and a refrigeration cycle device for cooling the storage compartment 11. Therefore, a method for supplying cold air to the storage compartment 11 may include: a first method of supplying only the cold air generated by the thermoelectric cooling device 400; a second method of supplying only the cold air generated by the refrigeration cycle device; and a third method of supplying both the cold air generated by the thermoelectric cooling device and the cold air generated by the refrigeration cycle device.

[0145] Refrigerator 1 can supply cold air to storage compartment 11 in an appropriate manner according to external and internal conditions. For example, refrigerator 1 can use a method to cool storage compartment 11 based on the temperature of the indoor space where refrigerator 1 is installed. That is, when the indoor temperature is higher than a predetermined temperature and cooling by the refrigeration cycle device is more effective than cooling by the thermoelectric cooling device, storage compartment 11 can be cooled using only the cold air generated by the refrigeration cycle device. Conversely, when the indoor temperature is lower than a predetermined temperature and cooling by the thermoelectric cooling device is more effective than cooling by the refrigeration cycle device, storage compartment 11 can be cooled using only the cold air generated by the thermoelectric cooling device. Refrigerator 1 can operate the thermoelectric cooling device only when noise reduction is required. When rapid cooling of storage compartment 11 is required, refrigerator 1 can simultaneously supply cold air generated by the thermoelectric cooling device and cold air generated by the refrigeration cycle device to storage compartment 11.

[0146] As described above, according to one embodiment of this disclosure, the refrigerator may include a thermoelectric cooling device and a refrigeration cycle device, but this disclosure is not limited thereto. Alternatively, the refrigerator may include only the thermoelectric cooling device 400.

[0147] Figure 6 This is a diagram illustrating the inner shell, outer shell, and connecting frame according to one embodiment of the present disclosure. Figure 7 This is a diagram illustrating a connection frame according to an embodiment of the present disclosure. Figure 8 This is a perspective view of the connection structure between the thermoelectric module and the upper wall of a refrigerator according to an embodiment of the present disclosure. Figure 9 This is an exploded view of a cooling fan and a thermoelectric module according to an embodiment of the present disclosure. Figure 10 This is a diagram illustrating a heat sink according to one embodiment of the present disclosure. Figure 11 This is a diagram illustrating a cooling plate according to an embodiment of the present disclosure.

[0148] Reference Figures 6 to 11 The present disclosure describes the configuration of the thermoelectric module and the mounting structure of the thermoelectric module in a thermoelectric cooling device according to an embodiment of the present disclosure.

[0149] The main body 100 of the refrigerator 1 may include an inner shell 170 forming a storage compartment and an outer shell 180 connected to the outside of the inner shell 170. Insulation material 190, configured to insulate the storage compartment, may be disposed between the inner shell 170 and the outer shell 180. The inner shell 170 may include an inner shell opening 171. The outer shell 180 may include an outer shell opening 181.

[0150] The inner shell opening 171 may be larger than the outer shell opening 181. However, unlike this embodiment, the inner shell opening 171 and the outer shell opening 181 may be formed to have the same size. In this case, the connecting frame 200, which will be described later, may consist only of the connecting frame body 270, without the connecting frame base 210.

[0151] The main body 100 may include a connecting frame 200, which is disposed between the inner shell 170 and the outer shell 180 to connect the inner shell opening 171 and the outer shell opening 181, thereby forming a through hole 115 penetrating the upper wall 110.

[0152] One surface of the connecting frame 200 can be supported on the inner surface of the inner shell 170 (the surface facing the insulation material), and the other surface of the connecting frame 200 can be supported on the inner surface of the outer shell 180 (the surface facing the insulation material).

[0153] With the connecting frame 200 positioned between the inner shell 170 and the outer shell 180, the thermal insulation space can be formed by the inner shell 170, the outer shell 180, and the connecting frame 200. The inner shell 170, the outer shell 180, and the connecting frame 200 can be connected to each other by filling the thermal insulation space with foamed thermal insulation material and allowing it to foam. The connecting frame 200 can be formed of a material with relatively low thermal conductivity. The connecting frame 200 can be formed of a resin material.

[0154] The connecting frame 200 may include a frame base 210 connected to the inner shell opening 171, and a frame body 270 protruding from the upper surface of the frame base 210 and connected to the outer shell opening 181.

[0155] The frame base 210 may have dimensions corresponding to the size of the inner shell opening 171. The frame base 210 may include a frame base opening 211. The frame base opening 211 may have dimensions corresponding to the size of the outer shell opening 181.

[0156] The frame body 270 may have a rectangular frame shape with a predetermined thickness. The frame body 270 may include a frame body opening 271. The frame body opening 271 may have dimensions corresponding to the dimensions of the outer shell opening 181. The frame base opening 211 and the frame body opening 271 may form a through hole 115 in the upper wall 110.

[0157] The frame base 210 and the frame body 270 can be separately disposed and connected to each other. The frame base 210 and the frame body 270 can be connected by a frame connecting member 201. For this purpose, a connecting hole 240 can be formed in the frame base 210, and a connecting hole 280 can be formed in the frame body 270. The frame connecting member 201 can be a connecting mechanical element, such as a screw, pin, bolt, rivet, etc. However, the frame base 210 and the frame body 270 can also be integrally formed together.

[0158] The frame base 210 may include an upwardly projecting base protrusion 230. A receiving space may be formed on the lower surface of the base protrusion 230 to receive a portion of the cooling air duct 900.

[0159] The thermoelectric cooling device 400 may include a thermoelectric module 500.

[0160] The aforementioned thermoelectric element 530, heat sink 520, and cooling plate 570 can be integrally assembled to form a thermoelectric module 500. That is, the thermoelectric module 500 may include the thermoelectric element 530, heat sink 520, cooling plate 570, and module board 550.

[0161] like Figure 8 As shown, the thermoelectric module 500 can be connected to the upper wall 110 of the main body 100 via a separate connecting member S. The thermoelectric module 500 can penetrate through the through hole 115 of the upper wall 110 so that the heat sink 520 is located outside the main body 100 and the cooling fin 570 is located inside the storage chamber 11. A sealing member 560 for sealing can be disposed between the module plate 550 of the thermoelectric module 500 and the upper surface of the upper wall 110.

[0162] Module plate 550 can be used as a frame for the thermoelectric module. Module plate 550 can be formed of a resin material with relatively low thermal conductivity. Module plate 550 can maintain the gap between heat sink 520 and cooling fin 570, and support heat sink 520 and cooling fin 570. Figure 8 and Figure 9 As shown, the module board 550 can be integrally formed with the fan housing 650 described later. However, the module board 550 can also be disposed separately from the fan housing 650.

[0163] The module board 550 may include a heat sink support portion 552 configured to support the heat sink 520.

[0164] Module board 550 may include module board opening 551. Thermoelectric element 530 may be disposed inside module board opening 551. The vertical length of module board opening 551 may be greater than the vertical length of thermoelectric element 530, and thermoelectric element 530 may be disposed at the upper end of module board opening 551. The reason for disposing of thermoelectric element 530 at the upper end of module board opening 551 is that the heat generated by thermoelectric element 530 is generally greater than the heat absorbed, and in terms of heat dissipation of heating portion 531, the upper end of module board opening 551 is suitable for thermoelectric element 530.

[0165] Since the thermoelectric element 530 is disposed at the upper end of the module plate opening 551 as described above, the cooling plate 570 may include a cooling conduction portion 574 protruding from the cooling plate base 571 to contact the cooling portion 532 of the thermoelectric element 530.

[0166] The thermoelectric module 500 may include element insulation material 540 configured to insulate the module plate 550 and the thermoelectric element 530 from heat. The element insulation material 540 may be disposed in an opening 551 in the module plate to prevent the side of the thermoelectric device 530 from contacting the module plate 550. The element insulation material 540 may include an element insulation material opening 541, and the thermoelectric device 530 may be accommodated in the element insulation material opening 541.

[0167] The thermoelectric module 500 may include a sheet of thermal insulation material 580 disposed between the module plate 550 and the cooling fin 570. The sheet of thermal insulation material 580 prevents heat from being transferred between the heat sink 520 and the cooling fin 570 through the module plate 550. The sheet of thermal insulation material 580 may include an opening 581. However, the sheet of thermal insulation material 580 may be omitted. In this case, the heat sink 520 may be supported on the upper surface of the module plate 550, and the cooling fin 570 may be supported on the lower surface of the module plate 550.

[0168] refer to Figures 8 to 10 The thermoelectric cooling device 400 may include a fan housing 650, in which a cooling fan 600 is mounted, and the fan housing 650 may also guide the air blown by the cooling fan 600. The fan housing 650 may be integrally formed with the aforementioned module board 550, or it may be provided separately.

[0169] The fan housing 650 may include: a housing bottom 660 on which the cooling fan 600 is rotatably mounted; and a housing volute portion 670 extending upward from the edge of the housing bottom 660 to guide air blown by the cooling fan 600 to the heat sink 520. The cooling fan 600 may be a centrifugal fan and may be mounted on the housing bottom 660 to allow the rotation axis 610 to be perpendicular to the housing bottom 660. Additionally, the heat sink 520 may be located in a radial direction of the cooling fan 600. With this structure, the entire vertical length of the thermoelectric cooling device 400 can be compact.

[0170] The housing volute portion 670 may be formed to surround the cooling fan 600. The housing volute portion 670 may include a volute portion opening 673 configured to open toward the heat sink 520. The housing volute portion 670 may include a downstream end 671 and an upstream end 672 relative to the rotation direction R of the cooling fan 600.

[0171] The downstream end 671 and the upstream end 672 can be spaced apart from each other, and the opening 673 of the volute portion can be formed between the downstream end 671 and the upstream end 672.

[0172] The air blown by the cooling fan 600 can be discharged radially and move along the inner surface of the housing volute portion 670 toward the heat sink 520. Therefore, the air blown by the cooling fan 600 may flow more towards the downstream end 671 of the housing volute portion 670 than towards the upstream end 672 of the housing volute portion 670.

[0173] The fan housing 650 may include a housing guide 680 configured to guide air flowing from the cooling fan 600 to the vicinity of the downstream end 671 of the housing volute portion 670.

[0174] The housing guide 680 can protrude upward from the bottom 660 of the housing. The housing guide 680 can be spaced apart from the housing volute portion 670. The housing guide 680 can guide air flowing to the vicinity of the downstream end 671 of the housing volute portion 670 toward the upstream end 672 of the housing volute portion 670. Therefore, the air blown from the cooling fan 600 can be evenly distributed to the heat dissipation channel 528 of the heat sink 520 through the housing guide 680, and the heat exchange efficiency of the heat sink 520 can be improved.

[0175] refer to Figure 10 Multiple heat dissipation fins 525 can protrude from the upper surface 522 of the heat dissipation base 521. Multiple heat dissipation fins 525 can protrude in a first direction 526 perpendicular to the upper surface 522 of the heat dissipation base 521.

[0176] Multiple heat dissipation fins 525 may be formed extending in a second direction 527 parallel to the upper surface 522 of the heat dissipation base 521. The second direction 527 may be perpendicular to the first direction 526. Heat dissipation channels 528 may be formed between the multiple heat dissipation fins 525 that are adjacent to each other. The heat dissipation channels 528 may extend in the second direction 527 in the same manner as the multiple heat dissipation fins 525. In the heat dissipation channels 528, some heat dissipation channels 529 may have a larger width than the other heat dissipation channels.

[0177] Air moved by the cooling fan 600 can pass through the heat dissipation channel 528 and exchange heat with multiple heat dissipation fins 525. The airflow (A) flowing by the cooling fan 600 can pass through the heat dissipation channel 528 in a direction parallel to the second direction 527.

[0178] refer to Figure 11 Multiple cooling fins 575 may protrude from the lower surface 572 of the cooling fin base 571. Multiple cooling fins 575 may protrude in a first direction 576 perpendicular to the lower surface 572 of the cooling fin base 571.

[0179] Multiple cooling fins 575 may be formed extending in a second direction 577 parallel to the lower surface 572 of the cooling fin base 571. The second direction 577 may be perpendicular to the first direction 576. Cooling channels 578 may be formed between multiple adjacent cooling fins 575. In the cooling channels 578, some cooling channels 579 may have a larger width than the other cooling channels 578.

[0180] Air moved by the cooling fan 800 can pass through the cooling channel 578 and exchange heat with multiple cooling fins 575. The airflow (B) flowing by the cooling fan 800 can pass through the cooling channel 578 in a direction parallel to the second direction 577.

[0181] Figure 12 This is a diagram showing a top cover separate from the main body of the refrigerator according to an embodiment of the present disclosure. Figure 13 This is a diagram showing a top cover and a heat dissipation duct cover separate from the main body of the refrigerator according to an embodiment of the present disclosure. Figure 14 This is a diagram showing a top cover, a heat dissipation duct cover, a heat dissipation duct body, and an extended duct, separate from the main body of the refrigerator, according to an embodiment of the present disclosure. Figure 15 This is an exploded view of a heat dissipation duct according to an embodiment of the present disclosure. Figure 16 This is a diagram showing the lower surface of a heat dissipation duct according to an embodiment of the present disclosure. Figure 17 This is an enlarged view of a portion of a heat dissipation duct and a thermoelectric module according to an embodiment of the present disclosure.

[0182] Reference Figures 12 to 17The structure of a heat dissipation duct 700 according to an embodiment of the present disclosure is described.

[0183] The refrigerator 1 may include a heat dissipation duct 700 disposed on the upper wall 110 and configured to draw in air from outside the main body 100 for heat exchange with the heat sink 520, and allow the air that has exchanged heat with the heat sink 520 to be discharged back to the outside of the main body 100.

[0184] The heat dissipation duct 700 may include a heat dissipation duct body 720, a heat dissipation duct cover 710, and an extension duct 740.

[0185] The cooling duct body 720 can be connected to the upper surface of the body 100. The cooling duct body 720 can cover the cooling fan 600 and the heat sink 520. An external air inlet 751 can be formed on the front upper surface of the cooling duct body 720, and the external air inlet 751 can be covered by the top cover 300.

[0186] The heat dissipation duct cover 710 can be attached to the upper part of the heat dissipation duct body 720 to cover the upper side of the heat dissipation duct body 720. For this purpose, a duct cover connecting portion 711 can be provided on the heat dissipation duct cover 710, and a duct body connecting portion 721 connected to the duct cover connecting portion 711 can be provided on the heat dissipation duct body 720. The duct cover connecting portion 711 and the duct body connecting portion 721 can be connected by a hook method or an assembly method.

[0187] The extended air duct 740 can be positioned in front of the heat dissipation air duct body 720 to connect to the heat dissipation air duct body 720. For example... Figure 15 As shown, the extended air duct 740 can be installed separately from the heat dissipation air duct body 720. Alternatively, the extended air duct 740 can be installed integrally with the heat dissipation air duct body 720.

[0188] The extension duct 740 can be disposed below the top cover 300, and the upper side of the extension duct 740 can be covered by the top cover 300. The extension duct 740 can be connected to the lower part of the top cover 300. For this purpose, the extension duct 740 can be provided with an extension duct connecting portion 745, and the top cover 300 can be provided with a top cover connecting portion 380 connected to the extension duct connecting portion 745. The extension duct connecting portion 745 and the top cover connecting portion 380 can be connected by a hook method or an assembly method.

[0189] The heat dissipation duct 700 may include an external air inlet 751 configured to draw in air from outside the main body. Specifically, the heat dissipation duct main body 720 may include the external air inlet 751.

[0190] An external air inlet 751 may be formed on the upper surface of the heat dissipation duct body 720. The external air inlet 751 may be located closer to the front surface of the body 100 than the rear surface of the body 100. The reason for the external air inlet 751 being located closer to the front surface of the body 100 than the rear surface of the body 100 is to prevent heat generated by the compressor 2 and condenser located at the rear of the body 100 from being transferred through the external air inlet 751.

[0191] The heat dissipation duct 700 may include external air outlets 782 and 794, configured to exhaust air that has exchanged heat with the heat sink 520 to the outside of the body 100.

[0192] The heat dissipation duct body 720 may include a first external air outlet 782, configured to discharge air that has exchanged heat with the heat sink 520 to the outside of the body 100. The first external air outlet 782 may discharge the air that has exchanged heat with the heat sink 520 toward the external space above the body 100.

[0193] The extended air duct 740 may include a second external air outlet 794 configured to discharge air that has exchanged heat with the heat sink 520 to the rotating rod 40. Since the air that has exchanged heat with the heat sink 520 is discharged toward the rotating rod 40, condensation in the rotating rod 40 can be prevented.

[0194] However, the heat dissipation duct 700 does not necessarily include a first external air outlet 782 and a second external air outlet 794. Furthermore, the second external air outlet 794 can be omitted.

[0195] The cooling duct 700 may include a fan housing portion 760, which is configured to form a fan housing space 762, which is configured to house the cooling fan 600. Specifically, the cooling duct body 720 may include the fan housing portion 760, which is configured to form a fan housing space 762, which is configured to house the cooling fan 600.

[0196] A fan housing space 762 may be formed on the lower surface of the fan housing portion 760. The lower side of the fan housing space 762 may be open, and the open lower side of the fan housing space 762 may be covered by the fan housing 650. The fan housing portion 760 may include a fan inlet 761 through which air flows into the fan housing space 762. The fan inlet 761 may be formed on the upper side of the fan housing space 762.

[0197] The heat dissipation duct 700 may include a fin receiving portion 770, configured to form a fin receiving space 771, which is configured to receive a heat sink 520. The fin receiving space 771 may be formed on the lower surface of the fin receiving portion 770. The lower side of the fin receiving space 771 may be open. The open lower side of the fin receiving space 771 may be covered by the module plate 550. The fin receiving space 771 may be formed downstream of the fan receiving space 762.

[0198] like Figure 16 and Figure 17 As shown, the fin receiving portion 770 may include a channel blocking protrusion 772 projecting from the lower surface of the fin receiving portion 770. The channel blocking protrusion 772 may be disposed in a heat dissipation channel 529, which is wider than other heat dissipation channels 528 formed between the plurality of heat dissipation fins 525. The channel blocking protrusion 772 can prevent air from flowing into the wide heat dissipation channel 529 and induce air to flow into other heat dissipation channels 528.

[0199] The reason for providing the channel blocking protrusion 772 in the wide heat dissipation channel 529 is that, due to the long distance between the pair of heat dissipation fins 525 adjacent to the wide heat dissipation channel 529, the airflow velocity or heat exchange efficiency of the air flowing through the wide heat dissipation channel 529 is reduced.

[0200] like Figure 16 As shown, the fin receiving portion 770 may include an airflow guide 773 protruding from the lower surface of the fin receiving portion 770. The airflow guide 773 may have a shape corresponding to the housing guide 680 protruding to the upper side of the fan housing 650, and may be positioned corresponding to the housing guide 680. That is, the lower surface of the airflow guide 773 may contact or be adjacent to the upper surface of the housing guide 680. The airflow guide 773 may guide the air blown from the cooling fan 600. The airflow guide 773 may evenly distribute the air blown from the cooling fan 600 to the heat dissipation channel 528 of the heat sink 520, thereby improving the heat exchange efficiency of the heat sink 520.

[0201] The fan housing space 762 and the plate housing space 771 can be arranged horizontally relative to each other. The fan housing space 762 and the plate housing space 771 can be arranged in the left-right direction relative to the main body 100. The fan housing space 762 and the plate housing space 771 can be located closer to the rear surface of the main body 100 than the front surface of the main body 100.

[0202] In other words, the cooling fan 600 housed in the fan housing space 762 and the heat sink 520 housed in the fin housing space 771 can be arranged horizontally relative to each other. The cooling fan 600 and the heat sink 520 can be arranged in the left-right direction relative to the main body 100. The cooling fan 600 and the heat sink 520 can be located closer to the rear surface of the main body 100 than the front surface of the main body 100.

[0203] The cooling duct 700 may include an intake duct portion 750 configured to guide air drawn in through an external air intake 751 to a fan housing space 762. Specifically, the cooling duct body 720 may include the intake duct portion 750. The intake duct portion 750 may extend forward from the fan housing portion 760. The external air intake 751 may be formed on the upper surface of the intake duct portion 750.

[0204] An intake space 752 can be formed on the upper surface of the heat dissipation duct body 720. The upper side of the intake space 752 can be open, and the open upper side of the intake space 752 can be covered by the heat dissipation duct cover 710. The intake space 752 can be formed upstream of the fan housing space 762. The intake space 752 can be connected to the fan housing space 762 through the fan inlet 761.

[0205] The heat dissipation duct 700 may include a first exhaust duct portion 780 configured to guide air that exchanges heat with the heat sink 520 to a first external air outlet 782. Specifically, the heat dissipation duct body 720 may include the first exhaust duct portion 780. The first exhaust duct portion 780 may extend from the fin receiving portion 770. For example, the first exhaust duct portion 780 may be formed to extend diagonally from the fin receiving portion 770 toward a front corner of the body 100 by a predetermined length, and then extend forward.

[0206] The first discharge space 781 can be formed on the upper surface of the heat dissipation duct body 720. The upper side of the first discharge space 781 can be open, and the upper side of the opening of the first discharge space can be covered by the heat dissipation duct cover 710. The first discharge space 781 can be formed on the downstream side of the sheet receiving space 771.

[0207] The heat dissipation duct 700 may include a second exhaust duct portion 790, configured to guide air that exchanges heat with the heat sink 520 to a second external air exhaust port 794. Specifically, the heat dissipation duct body 720 may include the second exhaust duct portion 790. The second exhaust duct portion 790 may branch from the first exhaust duct portion 780 and extend forward.

[0208] The second discharge space 791 can be formed on the upper surface of the second discharge duct portion 790. The upper side of the second discharge space 791 can be open, and the open upper side of the second discharge space 791 can be covered by the heat dissipation duct cover 710. The second discharge space 791 can be formed on the downstream side of the plate receiving space 771.

[0209] As described above, the second exhaust duct portion 790 can be formed by branching from the first exhaust duct portion 780. Alternatively, the first exhaust duct portion 780 and the second exhaust duct portion 790 can be formed independently of each other.

[0210] Figure 18 This is a diagram illustrating a top cover according to an embodiment of the present disclosure. Figure 19 This is a diagram showing the lower surface of a top cover according to an embodiment of the present disclosure.

[0211] As described above, the refrigerator 1 may include a top cover 300, which is attached to the front of the upper surface of the body 100 to cover a plurality of hinges 31.

[0212] The top cover 300 may include a top cover upper surface 310, a top cover front surface 311 extending downward from the leading edge of the top cover upper surface 310, a top cover side surface 314 extending downward from the side edge of the top cover upper surface 310, a top cover rear surface 315 extending downward from the rear edge of the top cover upper surface 310, and a top cover interior space 320 formed by the top cover upper surface 310, the top cover front surface 311, the top cover side surface 314, and the top cover rear surface 315. The lower side of the top cover interior space 320 may be open, and the lower side of the top cover interior space 320 may be covered by the upper surface of the upper wall 110.

[0213] The top cover 300 may include forward protrusions 313 projecting forward from both ends of the top cover to cover a plurality of hinges 31.

[0214] The top cover 300 may include an air intake grille 350 located above the external air intake 751. The air intake grille 350 prevents foreign objects from entering the interior of the cooling duct 700 through the external air intake 751, protects the dust filter 390 described later, and guides the air drawn in through the external air intake 751.

[0215] The top cover 300 may be equipped with a dust filter 390, configured to filter out foreign objects. The dust filter 390 may be located below the air intake grille 350 and configured to filter out small foreign objects.

[0216] The top cover 300 may include an outlet forming portion 312 formed on the front surface 311 of the top cover 300 to form a second external air outlet 794 together with the extended air duct 740. The outlet forming portion 312 may protrude forward from the front surface 311 of the top cover.

[0217] At least a portion of the air discharged from the heat dissipation duct 700 through the first external air outlet 782 can flow into the interior space 320 of the top cover. That is, air warmed by heat exchange with the heat sink 520 can flow into the interior space 320 of the top cover. For this purpose, a top cover inlet 330 can be formed in the top cover 300. The top cover inlet 330 can be formed in the rear surface 315 of the top cover.

[0218] The first external air outlet 782 may include a top cover outlet 784 configured to guide air from inside the heat dissipation duct 700 into the top cover interior space 320. The top cover outlet 784 may be connected to the top cover inlet 330. Air exhausted through the top cover outlet 784 may flow into the top cover interior space 320 through the top cover inlet 330.

[0219] The first external air outlet 782 may include an external outlet 783 separate from the top cover outlet 784 to exhaust air from the heat dissipation duct 700 to the outside of the top cover 300. An outlet grille may be formed at the external outlet 783 to prevent foreign objects from flowing into the interior of the heat dissipation duct 700 through the external outlet 783.

[0220] Air flowing into the interior space 320 of the top cover can pass through the interior space 320 and be discharged to the outside of the top cover 300. For this purpose, the top cover 300 may include a top cover outlet 340. The top cover outlet 340 may be formed on the front protrusion 313 of the top cover 300. The top cover outlet 340 may be formed on the front protrusion 313 that is furthest from the top cover inlet 330. The top cover outlet 340 may be formed on the upper surface of the front protrusion 313. Because the top cover outlet 340 is formed on the front protrusion 313, it is possible to prevent air discharged through the top cover outlet 340 from being re-drawn into the external air inlet 751 as much as possible.

[0221] When air that exchanges heat with the heat sink 520 passes through the internal space 320 of the top cover, the air can heat the upper surface of the main body 100. Therefore, condensation can be prevented in the upper part of the front surface of the main body 100.

[0222] The top cover 300 may include a discharge guide portion 381 configured to guide air discharged through the external outlet 783 of the first external air outlet 782 to the outside of the heat dissipation duct 700. The discharge guide portion 381 may be formed at an angle on the rear surface 315 of the top cover. The air discharged through the external outlet 783 can be guided to be discharged smoothly without disturbing the top cover 300.

[0223] Figure 20 This is a diagram illustrating a first heat dissipation flow path, a second heat dissipation flow path, and a top cover flow path according to an embodiment of the present disclosure.

[0224] Reference Figure 20 A first heat dissipation flow path, a second heat dissipation flow path, and a top cover flow path are described according to an embodiment of the present disclosure.

[0225] With the aforementioned structure of the heat dissipation duct 700 and the top cover 300, the refrigerator 1 may include a first heat dissipation flow path 401 and a second heat dissipation flow path 402. Air exchanging heat with the heat sink 520 is discharged to the outside of the main body 100 through the first heat dissipation flow path 401, and air exchanging heat with the heat sink 520 is discharged toward the rotating rod 40 through the second heat dissipation flow path 402. The second heat dissipation flow path 402 may be formed by branching from the first heat dissipation flow path 401.

[0226] The first heat dissipation flow path 401 can be formed by an external air inlet 751, an air intake space 752, a fan inlet 761, a fan housing space 762, a plate housing space 771, a first exhaust space 781, and a first external air outlet 782.

[0227] The second heat dissipation flow path 402 can be formed by an external air inlet 751, an air inlet space 752, a fan inlet 761, a fan housing space 762, a plate housing space 771, a second exhaust space 791, and a second external air outlet 794.

[0228] The refrigerator 1 may include a top cover flow path 388, through which air discharged through the first heat dissipation flow path 401 flows into the interior of the top cover 300 through the top cover flow path 388, passes through the interior space 320 of the top cover 300, and is then discharged to the outside of the top cover 300.

[0229] The top cover flow path 388 can be connected to the end of the first heat dissipation flow path 401. That is, the top cover flow path 388 can be connected to the top cover outlet 784 of the first external air outlet 782.

[0230] Figure 21 This is a diagram illustrating a first heat dissipation flow path and a top cover flow path according to an embodiment of the present disclosure. Figure 22 This is a diagram illustrating a first heat dissipation flow path according to an embodiment of the present disclosure.

[0231] The aforementioned second heat dissipation flow path 402 and top cover flow path 388 are not necessary and can be omitted according to the embodiment.

[0232] For example, such as Figure 21 As shown, the second heat dissipation flow path 402 can be omitted, and the refrigerator can include only the first heat dissipation flow path 401 and the top cover flow path 388. That is, in the heat dissipation air duct 700, the second exhaust air duct portion 790 that forms the second exhaust space 791 can be omitted.

[0233] Furthermore, such as Figure 22As shown, both the second heat dissipation flow path 402 and the top cover flow path 388 can be omitted. That is, in the heat dissipation duct 700, the second exhaust duct portion 790 forming the second exhaust space 791 can be omitted, and the first external air exhaust port 782 can be formed only by the external outlet 783. In this case, the air inside the heat dissipation duct 700 can be exhausted to the outside of the main body 100 instead of being exhausted to the inside of the rotating rod 40 or the top cover 300.

[0234] Figure 23 This is a diagram illustrating the positional relationship between a cooling fan and a heat sink according to an embodiment of the present disclosure.

[0235] According to the embodiment, the positions of the fan housing space 762 and the plate housing space 771 of the heat dissipation duct 700 can be changed.

[0236] For example, such as Figure 23 As shown, the heat sink 520 housed in the heat sink 771 and the fan housing 762 can be arranged in the front-back direction relative to the main body 100. That is, the heat sink 520 housed in the heat sink 771 and the cooling fan 600 housed in the fan housing 762 can be arranged in the front-back direction relative to the main body 100.

[0237] In this case, heat sink 520 can be provided to allow the airflow from cooling fan 600 to flow in a direction parallel to the direction in which the heat sink fins 525 extend.

[0238] As described above, according to the embodiments of this disclosure, it is sufficient for the heat sink 520 and the cooling fan 600 to be arranged horizontally on the upper wall 110, and there are no restrictions on their positions.

[0239] As described above, according to embodiments of the present disclosure, the thermoelectric cooling device 400 can be disposed on the upper part of the main body 100. Even when the refrigerator 1 is installed in a manner that allows the rear surface of the main body 100 to be in close contact with the rear wall of the interior space, heat dissipation of the thermoelectric cooling device 400 can proceed smoothly. However, when the thermoelectric cooling device 400 is disposed at the rear of the main body 100, it may be difficult to access the thermoelectric cooling device 400. However, according to one embodiment of the present disclosure, the thermoelectric cooling device 400 can be mounted in the upper part of the main body 100, thus making it easily accessible. Therefore, the assembly, disassembly, replacement, and repair of the thermoelectric cooling device 400 can be facilitated.

[0240] In addition, the cold air generated by the thermoelectric cooling device 400 falls downwards due to its high density, and the cold air is effectively transported in the storage chamber through convection, thus improving the cooling efficiency of the storage chamber through the thermoelectric cooling device 400.

[0241] In addition, because the cooling plate 570 is located below the thermoelectric element 530, it can prevent the defrosting water generated in the cooling plate 570 from penetrating into the thermoelectric element 530, and can prevent the thermoelectric element 530 from failing or malfunctioning.

[0242] Additionally, a cooling fan 600 can be mounted on the upper wall 110 in the horizontal direction of the heat sink 520, and a cooling fan 800 can be mounted on the upper wall 110 in the horizontal direction of the cooling fin 570. Therefore, the thermoelectric cooling device can be compact, and the reduction in space of the storage chamber 11 due to the installation of the thermoelectric cooling device can be minimized.

[0243] Although this disclosure has been specifically described with reference to exemplary embodiments, those skilled in the art will understand that various changes in form and detail may be made without departing from the spirit and scope of this disclosure.

Claims

1. A refrigerator, comprising: main body; Storage room within the main building; The door is configured to open and close the storage room; An evaporator is configured to evaporate refrigerant to produce cold air. An evaporator duct, located at the rear of the storage compartment, is configured to supply cold air generated by the evaporator to the storage compartment. and A thermoelectric cooling device includes a thermoelectric element comprising a heating section and a cooling section, the heating section generating heat and thereby heating air, and the cooling section absorbing heat and thereby cooling air. The thermoelectric cooling device is configured to heat air from outside the main body using the heating part and discharge the air heated by the heating part to the outside of the main body, and to cool air from the storage chamber using the cooling part and supply the air cooled by the cooling part to the storage chamber, and the thermoelectric cooling device is disposed on the upper side of the storage chamber.

2. The refrigerator according to claim 1, wherein, The heating portion faces upwards from the thermoelectric element, and the cooling portion faces downwards from the thermoelectric element.

3. The refrigerator according to claim 1, wherein, The thermoelectric cooling device includes a heat sink, the heat sink comprising: The heat sink base in contact with the heating part; and Multiple heat dissipation fins protrude from the heat dissipation base along a first direction perpendicular to the upper surface of the heat dissipation base.

4. The refrigerator according to claim 3, wherein, The thermoelectric cooling device includes a cooling fan configured to generate airflow in a second direction parallel to the upper surface of the heat sink base and toward the heat sink.

5. The refrigerator according to claim 4, wherein, The cooling fan is a centrifugal fan, configured to draw air into the centrifugal fan along its axial direction and exhaust airflow along its radial direction. The heat sink is located in the radial direction.

6. The refrigerator according to claim 4, wherein, The thermoelectric cooling device includes a fan housing, in which a cooling fan is housed, and the fan housing guides airflow from the cooling fan toward the heat sink.

7. The refrigerator according to claim 6, wherein, The fan housing includes: At the bottom of the housing, the cooling fan is rotatably connected to the bottom of the housing. The shell volute portion extends upward from the bottom edge of the shell; and A housing guide extends upward from the bottom of the housing and is spaced apart from the housing volute portion; and The bottom of the housing, the housing volute portion, and the housing guide are configured to direct airflow from the cooling fan toward the heat sink.

8. The refrigerator according to claim 7, wherein, The housing volute portion includes a downstream end and an upstream end according to the rotation direction of the cooling fan, and The volute portion has an opening between the downstream end and the upstream end, and is open toward the heat sink.

9. The refrigerator according to claim 8, wherein, The housing guide is configured to direct airflow toward the upstream end of the housing volute portion.

10. The refrigerator according to claim 4, wherein, The thermoelectric cooling device includes a heat dissipation duct located on the upper side of the main body for guiding airflow to exchange heat with the heat sink.

11. The refrigerator according to claim 10, wherein, The heat dissipation duct includes: An external air intake draws air from the outside of the main body into the heat dissipation duct; and An external air outlet is used to discharge the air that has been drawn into the heat dissipation duct and exchanged heat with the heat sink toward the outside of the main body.

12. The refrigerator according to claim 11, wherein, The heat dissipation duct includes: The fan housing portion forms a fan housing space for accommodating the cooling fan; and The heat sink accommodating portion forms a heat sink accommodating space for accommodating the heat sink.

13. The refrigerator according to claim 12, wherein, The fan housing space and the plate housing space are arranged horizontally relative to each other.

14. The refrigerator according to claim 12, wherein, The heat dissipation duct includes an air intake duct section located upstream of the fan housing portion. The air intake duct section forms an air intake space to guide air drawn into the heat dissipation duct from the outside of the main body through the external air intake to the fan housing space.

15. The refrigerator according to claim 12, wherein, The heat dissipation duct includes an exhaust duct portion located downstream of the fin housing portion, the exhaust duct portion forming an exhaust space to guide air that exchanges heat with the heat sink to the external air exhaust port.

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