Eutectic welding equipment for chip processing

Abstract

The eutectic welding equipment for chip processing comprises a workbench, a processing table is arranged on the workbench, a heating assembly is arranged in the processing table, a moving plate is arranged on the workbench through a moving assembly, a mounting plate is arranged on the side wall of the moving plate, and a discharging assembly is arranged on the mounting plate. An auxiliary mechanism matched with the discharging assembly is arranged on the mounting plate, a protection assembly is arranged at the bottom end of the moving plate, and a discharging mechanism is arranged on the protection assembly. Movement adjustment is achieved through the multi-axis moving assembly, welding flux and chips can be conveniently discharged and placed in cooperation with the discharging assembly, welding operation can be conveniently conducted on different positions of a tube shell, sequential arrangement and one-by-one discharging of the welding flux and the chips are achieved, materials do not need to be frequently moved and sucked, operation is more convenient and faster, and the welding efficiency is improved. Meanwhile, introduction of new air is avoided, welding can be completed in the protective cover in the welding process, the using amount of protective gas is reduced, the protective gas only needs to be introduced at a time, and waste is avoided.

Description

Technical Field

[0001] This invention belongs to the field of chip eutectic bonding technology, specifically, it relates to a eutectic bonding device for chip processing. Background Technology

[0002] Chips, as functional semiconductor components containing miniature circuits (such as silicon-based integrated circuits), play a crucial role in electronic devices. They require packaging processes to achieve physical protection and electrical connectivity. The package, as the packaging carrier, is commonly made of ceramics or metals, providing mechanical support, achieving hermetic sealing, and creating heat dissipation channels for the chip. Eutectic bonding is used between the chip and the package to achieve high-reliability integration: In practice, the package is first heated to the solder's melting point (e.g., gold-tin solder has a melting point of 278°C). Then, a pick-and-place pen is used to sequentially place the solder and chip in their respective positions. The molten solder forms a metallurgical bonding layer between the chip and the package. After pressure treatment, low-voidity solder joints are formed, ensuring electrical conductivity and structural stability. This is a mature and commonly used process in chip packaging production.

[0003] However, in the actual production application of chip eutectic bonding agents, although existing chip eutectic bonding equipment uses protective gases such as nitrogen to ensure bonding effect and avoid oxidation, the equipment does have some defects that are not compatible with actual production needs: Firstly, from the perspective of device structural design, its overall area is relatively large, making it difficult to completely expel air from the welding chamber. This necessitates the introduction of a large amount of nitrogen, resulting in a waste of nitrogen resources. Furthermore, during chip welding, multiple chips often need to be welded to different locations, requiring frequent material handling and potentially introducing new air. In actual production, even with the introduction of protective gas, residual air due to the aforementioned reasons can still cause oxidation of the chips and solder during the welding process. Oxidized chips and solder directly affect welding quality, leading to an increased welding defect rate and higher production costs. In actual production, even if a protective gas is introduced, residual air may still cause oxidation of the chip and solder during the soldering process. Oxidized chips and solder will directly affect the soldering quality, causing an increase in the soldering defect rate and increasing production costs. Secondly, the existing equipment lacks an effective limiting structure for the solder. During the subsequent welding pressurization process, the molten solder is prone to flow due to pressure and overflow. After the solder overflows, it will not only contaminate the welding equipment and the surrounding environment, but also require subsequent cleaning and removal with chemical reagents such as formic acid. The cleaning process is relatively cumbersome, which not only increases the production process but also extends the production cycle. Furthermore, the use of chemical reagents such as formic acid will generate waste gas and wastewater, which require specialized collection and treatment equipment to handle; otherwise, they will pollute the environment. At the same time, improper handling may also affect the welding quality of the product due to chemical reagent residues, leading to unstable product performance. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a eutectic bonding device for chip processing.

[0005] To achieve the aforementioned objectives, the technical solution adopted by this invention includes: a workbench, a processing table on the workbench, a heating component inside the processing table, a moving plate on the workbench via a moving component, an mounting plate on the side wall of the moving plate, a feeding component on the mounting plate, an auxiliary mechanism matching the feeding component on the mounting plate, a feeding platform on one side of the workbench, a protective component at the bottom of the moving plate, a discharge mechanism on the protective component, a nitrogen protection mechanism matching the discharge mechanism under the workbench, and a pressing and limiting mechanism under the feeding component.

[0006] Preferably, the heating assembly includes a heating device disposed inside the processing table, and a heat insulation layer is provided between the heating device and the processing table.

[0007] Preferably, the moving component includes X-axis moving devices symmetrically arranged on the worktable, each of the two X-axis moving devices is provided with a Z-axis moving device, and a Y-axis moving device is provided between the two Z-axis moving devices. The Y-axis moving device is connected to the moving plate through a moving block.

[0008] In this invention, the movable component allows for easy movement and adjustment of the unloading component, facilitating the movement and adjustment of the chip and solder, and making it easy to place them onto the casing on the processing table. This allows for adjustments based on the soldering points, facilitating subsequent soldering operations.

[0009] Preferably, the protective component includes an adjusting plate fixedly installed at the bottom of the movable plate, a protective cover is fitted over the adjusting plate, and the periphery of the adjusting plate is connected to the protective cover through an elastic sealing gasket.

[0010] Preferably, a sleeve is rotatably provided on the circumferential side of the adjusting plate, and an extension rod is slidably provided inside the sleeve, with the end of the extension rod rotatably connected to the protective cover.

[0011] In this invention, the protective components can be conveniently covered before welding, reducing the area of ​​air to be exhausted and reducing nitrogen consumption. At the same time, after protection, the coordination of the adjustment plate and the moving components is not affected, and the position of the chip can be adjusted for easy welding at different positions as needed.

[0012] Preferably, the feeding assembly includes a feeding pipe mounted on the mounting plate, a guide cover at the top of the feeding pipe, the bottom of the feeding pipe passing through the adjustment plate and extending downwards, and a discharge port at the bottom of the feeding pipe via a telescopic sleeve.

[0013] Preferably, the auxiliary mechanism includes a motor mounted on the mounting plate on one side of the feed tube. A screw is fixedly mounted on the output end of the motor. A limiting ring is mounted on the screw. Two sets of lifting blocks are threaded onto the screw. The two lifting blocks are symmetrical about the center of the limiting ring. A lateral moving part is provided on the side of the lifting block near the feed tube. Permanent magnets are provided on the inclined surfaces of the lateral moving part and the lifting block that are close to each other. The lateral moving part slides into the feed tube. A support plate is provided at the end of the lower lateral moving part, and a clamping plate is provided at the end of the upper lateral moving part. Gaskets are provided on the side wall of the clamping plate and the top of the support plate.

[0014] Preferably, the clamping and limiting mechanism includes guide telescopic rods symmetrically arranged under the adjusting plate, the guide telescopic rods are provided with connecting plates, springs are sleeved on the outside of the guide telescopic rods, the connecting plates are fixedly connected to the discharge port, and a limiting cover is provided at the bottom of the connecting plate, the limiting cover being sleeved on the outside of the discharge port.

[0015] In this invention, the feeding component, in conjunction with the auxiliary mechanism, allows for the convenient sequential arrangement of solder and chips, and allows for feeding one by one, thus eliminating the need for frequent material handling and making the process relatively convenient and quick. Furthermore, the moving component facilitates welding operations at different locations on the casing, while the clamping and limiting mechanism helps avoid hard contact during the welding process, providing buffering to ensure welding effectiveness and eliminating the need for subsequent cleaning of spilled material.

[0016] Preferably, the pretreatment component includes a collection box fixedly mounted on the adjustment plate, with connecting pipes symmetrically arranged on both sides of the collection box, and collection ports symmetrically arranged at the ends of the two connecting pipes at an angle downwards. The collection ports extend into the feed pipe, and slots are symmetrically opened on both sides of the limiting cover, with baffles slidably arranged in the slots.

[0017] In this invention, the pre-treatment component allows for cleaning of the tube shell before the solder is placed, removing any surface dust or other debris. It also facilitates the removal of internal air and allows protective gas to enter the interior. The sealing plate then blocks the empty slot, ensuring the limiting effect of the limiting cover on the solder, without affecting the welding process, and guaranteeing the quality of the welding.

[0018] Preferably, the nitrogen protection mechanism includes a nitrogen storage device located at the bottom of the workbench, an outlet pipe at the output end of the nitrogen storage device, an electrically controlled valve on the outlet pipe, a supply pipe on the outlet pipe, the supply pipe passing through the workbench and extending upwards, and an outlet hole at the top of the supply pipe.

[0019] Preferably, the exhaust mechanism includes exhaust pipes symmetrically arranged on the protective cover, an annular groove is provided inside the exhaust pipe, and an adjustment component matching the annular groove is provided inside the exhaust pipe.

[0020] Preferably, the adjusting component includes a horizontal plate fixedly installed inside the exhaust pipe, the horizontal plate being located below the annular groove, a sealing plate being provided on the horizontal plate via a connecting rope, the diameter of the sealing plate being larger than the inner diameter of the exhaust pipe and smaller than the inner diameter of the annular groove, and a guide groove matching the sealing plate being provided under the annular groove.

[0021] In this invention, by using a nitrogen protection mechanism in conjunction with an exhaust mechanism, the air inside the protective cover can be exhausted before welding to prevent oxidation during the subsequent welding process, thus ensuring the quality of the welding. Furthermore, after exhausting, the exhaust pipe is automatically sealed to prevent outside air from entering the interior and affecting the welding effect.

[0022] Compared with the prior art, the advantages of the present invention include: (1) The present invention provides a eutectic welding equipment for chip processing. The multi-axis moving component realizes the movement adjustment. With the material feeding component, it can easily realize the feeding and placement of solder and chip, and facilitate welding operations at different positions of the shell. The material feeding component, with the auxiliary mechanism, can realize the sequential arrangement and feeding of solder and chip one by one. There is no need to frequently move to pick up materials, making the operation more convenient and faster. At the same time, it avoids the introduction of new air. During the welding process, the welding can be completed inside the protective cover, reducing the amount of protective gas used. When welding a chip on a shell, only one protective gas needs to be introduced to avoid waste. The clamping and limiting mechanism ensures the welding quality and prevents solder overflow. The protective component, with nitrogen protection and exhaust mechanism, effectively isolates oxidation and has the ability to flexibly adjust the welding position. The structure of each component is stable and durable, and the overall welding accuracy, reliability and stability are improved. (2) The present invention provides a eutectic welding device for chip processing. The limiting cover can limit the solder to prevent the solder from overflowing and ensure the welding effect. At the same time, the cooperation between the guide telescopic rod and the spring can avoid hard contact and achieve buffering. Together with the molten solder, the chip is solidified onto the shell, ensuring uniform solder distribution, reducing voids and improving welding quality. (3) The present invention provides a eutectic bonding equipment for chip processing, wherein the protective components work in conjunction with the nitrogen protection mechanism and the exhaust mechanism to provide a good protective atmosphere for the bonding process. Before bonding, the protective cover is clamped and limited by the processing table to reduce the area for air exhaust and reduce nitrogen consumption; the nitrogen protection mechanism introduces nitrogen into the protective cover through the gas supply pipe and works with the exhaust mechanism to exhaust the air. After exhaust, the adjustment component automatically seals the exhaust pipe to effectively prevent outside air from entering, avoid oxidation during the bonding process, and ensure bonding quality. (4) The eutectic welding equipment for chip processing provided by the present invention has a special connection method between the adjustment plate and the protective cover in the protective component, as well as the cooperation between the sleeve and the extension rod, so that after the protective cover is locked with the processing table, the adjustment plate can still move and adjust inside the protective cover under the drive of the moving component, which facilitates the welding of the chip to different positions of the tube shell and improves the flexibility and applicability of the equipment. (5) The eutectic welding equipment for chip processing provided by the present invention facilitates the movement and adjustment of the chip and solder through the cooperation of the X, Y, Z axis moving components and the unloading component, making it easy to place the chip and solder on the tube shell on the processing table, and then complete the adjustment operation according to the welding point, which facilitates the subsequent welding operation, meets the positioning requirements of chip welding processing, and improves the accuracy and efficiency of welding operation. (6) The eutectic welding equipment for chip processing provided by the present invention can clean the shell of the tube to be welded before the solder is placed by the pre-processing component, remove any floating dust that may exist on the surface, and at the same time facilitate the exhaust of internal air, assisting the protective gas to enter the interior. Then the sealing plate seals the empty slot, ensuring the limiting effect of the limiting cover on the solder, without affecting the welding use, and ensuring the quality of welding. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is an overall schematic diagram of a eutectic bonding device for chip processing according to the present invention; Figure 2 This is a schematic diagram of the structure on the moving plate in a eutectic bonding device for chip processing according to the present invention; Figure 3 This is a schematic diagram of the internal structure of the protective cover in a eutectic bonding device for chip processing according to the present invention; Figure 4 This is a schematic diagram of the internal structure of the protective cover in a eutectic bonding device for chip processing according to the present invention; Figure 5 This is a schematic diagram of the clamping and limiting mechanism in a eutectic bonding equipment for chip processing according to the present invention; Figure 6 This is a partial structural diagram of the auxiliary mechanism and the material feeding assembly in a eutectic bonding equipment for chip processing according to the present invention; Figure 7This is a schematic diagram of the internal structure of the exhaust pipe in a eutectic bonding device for chip processing according to the present invention; Figure 8 This is a schematic diagram of the structure of the bottom of the worktable in a eutectic bonding device for chip processing according to the present invention; Figure 9 This is a schematic diagram of the nitrogen protection mechanism in a eutectic bonding equipment for chip processing according to the present invention; Figure 10 This is a schematic diagram of the internal structure of the processing table in a eutectic bonding device for chip processing according to the present invention.

[0025] Figure label: 11. Workbench; 12. Feeding table; 13. X-axis moving device; 14. Z-axis moving device; 15. Y-axis moving device; 16. Moving plate; 17. Machining table; 18. Moving block; 21. Mounting plate; 22. Adjusting plate; 23. Protective cover; 31. Guide cover; 32. Telescopic sleeve; 33. Feed pipe; 34. Discharge port; 35. Connecting plate; 36. Limit cover; 37. Spring; 38. Guide telescopic rod; 41. Elastic sealing gasket; 42. Sleeve; 43. Extension rod; 51. Exhaust pipe; 52. 53. Horizontal plate; 54. Connecting rope; 55. Sealing plate; 56. Annular groove; 67. Guide groove; 68. Nitrogen storage device; 69. Gas outlet pipe; 60. Electric control valve; 61. Gas supply pipe; 62. Gas outlet hole; 73. Heating device; 74. Heat insulation layer; 85. Motor; 86. Screw; 87. Limiting ring; 88. Lifting block; 89. Lateral moving part; 80. Permanent magnet; 81. Support plate; 82. Clamping plate; 93. Gasket; 94. Empty groove; 95. Collection port; 96. Connecting pipe; 97. Collection box. Detailed Implementation

[0026] In view of the shortcomings of the prior art, the inventors of this invention, through long-term research and extensive practice, have proposed the technical solution of this invention. The technical solution, its implementation process, and principles will be further explained below with reference to the accompanying drawings and specific implementation examples in the embodiments of this application.

[0027] It should be noted that the embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, the present invention covers any substitutions, modifications, equivalent methods and solutions made on the spirit, principles and scope of the present invention as defined by the claims. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] In the description of this application, the terms "first," "second," "third," and similar words do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar words, do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar words, mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including," and their equivalents, but do not exclude other elements or objects. The terms "connected" or "linked," and similar words, are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0029] In the description of this application, the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used solely for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, when using positional terms such as "both sides," "outer side," and "upper and lower," it should be understood that they are used only for ease of understanding and description, taking into account that the structure may be oriented to other positions.

[0030] In the description of this application, unless otherwise expressly specified and limited, the technical or scientific terms used shall have the ordinary meaning understood by a person with ordinary skills in the art to which this application pertains. Terms such as “installation,” “connection,” and “joining” shall be interpreted broadly, for example, as fixed connection, detachable connection, mating connection, or integral connection. For a person skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0031] The present invention aims to introduce and explain the structural composition of a eutectic bonding equipment for chip processing and the cooperation relationship between the various components. Unless otherwise specified, the dimensions, materials and manufacturing processes of the various components in the eutectic bonding equipment suitable for chip processing in the present invention can be selected according to specific circumstances, and no special limitations or explanations are made here.

[0032] Furthermore, to provide the public with a better understanding of the present invention, certain specific details are described in detail in the following description of the invention. However, those skilled in the art will fully understand the invention even without these detailed descriptions.

[0033] Please see Figures 1-10A eutectic bonding device for chip processing includes a worktable 11, a processing stage 17 on the worktable 11, and a heating assembly inside the processing stage 17. The heating assembly includes a heating device 71 disposed inside the processing stage 17. The heating device 71 can be resistance heating or other heating methods. When bonding the chip to the casing with solder, it is heated to a suitable temperature with a temperature control accuracy of ±1°C. The maximum heating temperature is 360°C. The corresponding solder can be high melting point solders such as gold-tin (AuSn) or gold-germanium (AuGe). The mature technology will not be elaborated here. A heat insulation layer 72 is provided between the heating device 71 and the processing table 17. It can be made of quartz or zirconia ceramic and can work stably in high-temperature environments for a long time. Appropriate materials can also be selected according to actual conditions. A feeding platform 12 is provided on one side of the processing table 17. The feeding platform 12 can be a placement tray, vibratory plate, or conveyor belt, etc., to facilitate the placement of the tube shells for eutectic welding. Then, the tube shells can be picked up and moved by a suction or moving device (a robot arm in conjunction with a gripping device) to place the tube shells. The worktable 11 is equipped with a moving plate 16 via a moving component to facilitate subsequent welding processing. The moving component includes X-axis moving devices 13 symmetrically arranged on the worktable 11, each with a Z-axis moving device 14. A Y-axis moving device 15 is located between the two Z-axis moving devices 14. The Y-axis moving device 15 is connected to the moving plate 16 via a moving block 18. The moving devices on the X, Y, and Z axes can be adjusted using a motor and screw combination, a linear guide with a linear motor and slider, or an electric push rod. This allows for movement adjustment of the unloading component in the X, Y, and Z axes. Correspondingly, it can be used with a vision imaging system such as a global camera FFT algorithm for coarse positioning and a local camera SIFT feature matching combination for precise positioning. It can also be used with other systems to ensure accurate movement and facilitate chip welding processing. This is a relatively mature technology and will not be elaborated upon here.

[0034] Please see Figures 1-10To facilitate solder and chip feeding, simplify the soldering process, and prevent solder overflow during soldering to ensure soldering quality and eliminate the need for subsequent removal and cleaning of overflowed solder, a mounting plate 21 is provided on the side wall of the movable plate 16. The mounting plate 21 is equipped with a feeding assembly, and an auxiliary mechanism matching the feeding assembly is also provided on the mounting plate 21. The feeding assembly includes a feeding tube 33 mounted on the mounting plate 21, with a guide cover 31 at the top. The guide cover 31 has a cover plate (not shown in the figure) at its top, which allows the solder to pass through... After the chip is placed, the guide cover 31 is sealed to prevent external air, dust, and other impurities from entering the feed tube 33 through the guide cover 31. The guide cover 31 facilitates the placement of solder and chip into the feed tube 33. The solder and chip are placed alternately, i.e., from bottom to top, in a solder-chip-solder-chip arrangement. The bottom end of the feed tube 33 passes through the adjustment plate 22 and extends downwards. The bottom end of the feed tube 33 is connected by a telescopic sleeve 32 made of corrugated pipe, which does not affect the feeding of solder and chip. It can also extend and retract together with the guide telescopic rod 38 and spring 37 without affecting the extension and retraction during clamping. A discharge port 34 is provided. To facilitate the orderly feeding of solder and chips one by one, an auxiliary mechanism is provided on one side of the mounting plate 21. The auxiliary mechanism includes a motor 81 located on the side of the mounting plate 21 near the feeding tube 33. The output end of the motor 81 is fixedly connected to a screw 82 via a coupling. A limit ring 83 is provided on the screw 82. Two sets of lifting blocks 84 are threadedly engaged on the screw 82. The two lifting blocks 84 are symmetrical about the center of the limit ring 83. The lifting blocks 84 are located above and below the limiting ring 83. For the lifting blocks 84, a limiting guide rod (not shown in the diagram) is provided between the mounting plate 21 and the adjusting plate 22. The lifting blocks 84 can slide up and down on the limiting guide rod, ensuring that when the screw 82 rotates, the lifting blocks 84 slide vertically up and down under the limiting action of the limiting guide rod, avoiding axial rotation. This is a relatively mature technology and will not be elaborated upon here. A transverse moving part 85 is provided on the side of the lifting block 84 near the feeding pipe 33. The shapes of the lifting blocks 84 and the transverse moving part 85 are as follows: Figure 6As shown, the inclined surfaces of the lateral moving member 85 and the lifting block 84 that are close to each other are provided with permanent magnets 86. The permanent magnets 86 between the lateral moving member 85 and the lifting block 84 have opposite magnetic properties and attract each other, which facilitates the lateral moving member 85 to move horizontally when the lifting block 84 moves up and down, in conjunction with the inclined surfaces and permanent magnets 86. The lateral moving member 85 slides into the inside of the feeding tube 33. The lower end of the lateral moving member 85 is provided with a support plate 87, and the upper end of the lateral moving member 85 is provided with a clamping plate 88. The side walls of the clamping plate 88 and the top of the support plate 87 are provided with gaskets 89, for... To prevent solder overflow during the welding process and ensure welding effect, the molten solder is used to solidify the chip onto the casing, thus completing the eutectic bonding process. The clamping and limiting mechanism includes guide telescopic rods 38 symmetrically arranged under the adjusting plate 22. The guide telescopic rods 38 are equipped with connecting plates 35, and springs 37 are sleeved on the outside of the guide telescopic rods 38 to avoid hard contact during contact. The connecting plate 35 is fixedly connected to the outlet 34, and a limiting cover 36 is provided at the bottom of the connecting plate 35. The limiting cover 36 is sleeved on the outside of the outlet 34 to cover and limit the chip and solder, prevent solder overflow, and ensure the quality of welding.

[0035] Please see Figures 1-10 To allow for further cleaning of the pipe shell's weldable area before welding, removing floating dust and other impurities, and simultaneously drawing out internal air and introducing protective gas from inside the protective cover 23 to isolate oxygen and ensure the quality and effect of subsequent welding, a pre-treatment component is installed on the adjusting plate 22. This component includes a collection box 95 fixedly mounted on the adjusting plate 22. The collection box 95 contains an exhaust fan, operating on the same principle as a vacuum cleaner—a mature technology that will not be elaborated upon here. This facilitates the extraction of air from the limiting cover 36 and the feeding pipe, as well as cleaning the surface of the pipe shell's weldable area. It also allows protective gas to enter without affecting subsequent welding operations. Connecting pipes 94 are symmetrically arranged on both sides of the collection box 95. Two connecting pipes 94 are symmetrically provided with collection ports 93 at their ends, which extend into the feed pipe 33. This facilitates the operation of the exhaust fan in the collection box 95, making it convenient to clean the surface of the welded joint of the pipe shell and to allow protective gas to enter the interior. The limiting cover 36 has symmetrical slots 92 on both sides. A baffle 91 is slidably provided in the slot 92. The baffle 91 is connected to the slot 92 by a sliding component (not shown in the figure), which allows the baffle 91 to slide vertically up and down in the slot 92. The sliding component can be a combination of a slider and a groove, or it can be composed of other components, as long as it can slide up and down. The bottom of the corresponding two sides of the slot 92 is provided with a limiting plate (not shown in the figure) to prevent the baffle 91 from slipping off.

[0036] Please see Figures 1-10To prevent oxidation during welding and provide a better protective atmosphere, facilitating chip welding onto the corresponding housing while ensuring protection, a protective assembly is provided at the bottom of the movable plate 16. This assembly includes an adjusting plate 22 fixedly mounted at the bottom of the movable plate 16, with a protective cover 23 fitted over the adjusting plate 22. The inner diameter of the protective cover 23 is approximately equal to the outer diameter of the worktable 11, allowing it to lock and limit the worktable 11 during welding. The periphery of the adjusting plate 22 is sealed with an elastic gasket 41, which can be made of high-temperature resistant rubber or other high-temperature resistant elastic materials, depending on the application requirements. A sleeve 42 is rotatably mounted on the periphery of the adjusting plate 22, and an extension rod 43 slides within the sleeve 42. The end of 43 is rotatably connected to the protective cover 23. The sleeve 42 and the adjusting plate 22, and the extension rod 43 and the protective cover 23 can be rotatably connected via a ball joint and a groove, etc. This does not affect the adjustment plate 22's movement within the protective cover 23 after the protective cover 23 is engaged with the worktable 11, allowing for adjustment of the chip and solder positions by the movement of the moving components. This facilitates soldering the chip to different positions on the casing. For convenient automatic reset, the extension rod 43 and the sleeve 42 are slidably engaged. The extension rod 43 slides deep into the sleeve 42, and an elastic element (not shown in the diagram), such as a spring 37, can be installed inside. This is a mature technology and will not be elaborated upon here. During adjustment, the elastic element stores potential energy. After the protective cover 23 moves upward, the elastic element... The component resets under the influence of its potential energy, without affecting its next use. A nitrogen protection mechanism is installed at the bottom of the worktable 11 to facilitate the venting of air from the worktable 11 and the protective cover 23. This nitrogen protection mechanism includes a nitrogen storage device 61 located at the bottom of the worktable 11, which can be a nitrogen cylinder or a nitrogen generator, depending on the specific situation. This is a relatively mature technology and will not be elaborated upon here. The nitrogen storage device 61 has an outlet pipe 62 at its output end, with an electrically controlled valve 63 on the outlet pipe 62. An air supply pipe 64 is also installed on the outlet pipe 62, passing through the processing table 17 and extending upwards. An outlet hole 65 is opened at the top of the air supply pipe 64. There can be two, four, or eight sets of air supply pipes, evenly distributed on the worktable 11; four sets are preferred. Distributed around the workbench 11, nitrogen gas is easily introduced into the workbench 11 and the protective cover 23 through the vent holes 65. Air is then discharged through the exhaust pipes 51 of the exhaust mechanism at the top of the protective cover 23. The exhaust mechanism includes exhaust pipes 51 symmetrically arranged on the protective cover 23. An annular groove 55 is formed inside the exhaust pipe 51. An adjusting component matching the annular groove 55 is provided inside the exhaust pipe 51. The adjusting component includes a horizontal plate 52 fixedly installed inside the exhaust pipe 51, located below the annular groove 55. A sealing plate 54 is provided on the horizontal plate 52 via a connecting rope 53. The diameter of the sealing plate 54 is larger than the inner diameter of the exhaust pipe 51 but smaller than the inner diameter of the annular groove 55. A guide groove 56 matching the sealing plate 54 is formed below the annular groove 55.As shown in the diagram, the nitrogen exhaust pipe 51 is in a connected state. The guide groove 56 gradually decreases in diameter from the annular groove 55 to the horizontal plate 52, facilitating the repositioning of the sealing plate 54 under its own weight after the gas supply is stopped. This allows it to be easily placed flat and secured to the guide groove 56, sealing the exhaust pipe 51 and preventing outside air from re-entering.

[0037] Working principle: The tube shell is conveyed and placed by the feeding table 12, and then placed on the processing table 17. Solder and chip are sequentially placed into the unloading tube 33 through the guide cover 31. The guide cover 31 is sealed by the cover plate. At this time, the support plate 87 can support the bottom solder to prevent it from falling. At this time, the support plate 87 does not contact the side wall of the solder and chip, and does not clamp and fix the side, thus limiting the stacked materials on the top. When welding is required, the heating device 71 heats the processing table 17. The protective cover 23 can be moved above the processing table 17 by the X, Y and Z axis moving device. Then, the Z axis moving device 14 moves the whole structure down, and the protective cover 23 is locked and limited with the processing table 17. The control valve 63 opens, allowing nitrogen from the nitrogen storage device 61 to be discharged through the outlet pipe 62 and the outlet hole 65 on the supply pipe 64. Meanwhile, the pressure inside the protective cover 23 continuously increases, generating an upward thrust on the sealing plate 54 inside the exhaust pipe 51. The sealing plate 54 leaves the guide groove 56 and enters the annular groove 55, keeping the exhaust pipe 51 connected. The connecting rope 53 is taut, allowing internal air to escape through the exhaust pipe 51. After the air is exhausted, the control valve 63 closes, stopping the nitrogen supply. Then, under its own weight, the sealing plate 54 enters the guide groove 56, sealing the exhaust pipe 51 to prevent nitrogen from escaping from inside the protective cover 23 and to prevent outside air from entering, thus avoiding oxidation during welding. Then, the adjustment plate 22 is adjusted according to the welding position. During adjustment, the X and Y axis moving devices work, moving and adjusting the adjusting plate 22. At this time, the extension rod 43 extends and retracts within the sleeve 42, and the elastic sealing gasket 41 deforms accordingly, ensuring that the protective cover 23 remains stationary. The position of the discharge port 34 under the adjusting plate 22 is adjusted. After the adjustment is completed, the Z axis moving device 14 moves the entire structure downward, and the baffle 91 slides upward within the empty groove 92. At this time, the empty groove 92 is still in the open state. The exhaust fan in the collection box 95 works, cleaning and extracting the limiting cover 36 and the discharge pipe through the connecting pipe 94 and the collection port 93. This facilitates the re-cleaning of the surface of the welded joint of the pipe shell, removing floating dust and other impurities, and simultaneously extracting the internal air. The protective gas in the guide cover 31 enters through the empty groove 92. Inside the limiting cover 36, the Z-axis moving device 14 moves the entire assembly downwards, and the limiting cover 36 contacts the tube shell. When solder needs to be placed, the motor 81 rotates forward, causing the screw 82 to rotate forward. At this time, the two sets of lifting blocks 84, in conjunction with the limiting guide rod (not shown in the diagram), move downwards on the screw 82. With the help of the inclined plane and permanent magnet 86, the lower lateral moving part 85 can move away from the end of the feeding tube 33, and the support plate 87 leaves the bottom solder. The upper lateral moving part 85 moves towards the end inside the feeding tube 33. The clamping plate 88 can clamp the chip and the material above, preventing the chip on the solder from being fed out together. The presence of the gasket 89 prevents hard contact. At this time, the bottom solder moves downwards under the action of gravity.The chip falls through the telescopic sleeve 32 to the outlet 34 and is then placed on the tube shell welding position. The motor 81 rotates in the reverse direction, and the lifting block 84 moves downwards on the screw 82 to reset. At this time, the bottom support plate 87 moves towards one end inside the feeding tube 33, and the clamping plate 88 moves away from the feeding tube 33, losing its clamping grip on the chip. Then, under gravity, it moves downwards, and the support plate 87 can provide support and limit. Repeating this operation, the bottom chip is dropped above the solder. Then, the Z-axis moving device 14 moves the entire chip downwards, and the guide telescopic rod 38 and spring 37 contract to store potential energy for buffering and to avoid hard contact. Then, the Z-axis moving device 14 moves upwards, moving the limiting cover 36 upwards to reset. When welding other positions on the tube shell, the above operation can be repeated. After the solder sets, the chip continues to move upwards, and the protective cover 23 separates from the processing table 17, completing the welding process.

[0038] It should be understood that the above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. It should not be considered that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A eutectic bonding device for chip processing, comprising a worktable (11), a processing table (17) on the worktable (11), a heating component inside the processing table (17), and a moving plate (16) on the worktable (11) via a moving component, characterized in that: A mounting plate (21) is provided on the side wall of the movable plate (16), and a feeding assembly is provided on the mounting plate (21). An auxiliary mechanism matching the feeding assembly is provided on the mounting plate (21). A feeding platform (12) is provided on one side of the workbench (11). A protective assembly is provided at the bottom of the movable plate (16). A discharge mechanism is provided on the protective assembly. A nitrogen protection mechanism matching the discharge mechanism is provided under the workbench (11). A pressing and limiting mechanism is provided under the feeding assembly. The feeding assembly includes a feeding pipe (33) mounted on the mounting plate (21). The top end of the feeding pipe (33) is provided with a guide cover (31). The bottom end of the feeding pipe (33) passes through the adjusting plate (22) and extends downward. The bottom end of the feeding pipe (33) is provided with a discharge port (34) through a telescopic sleeve (32).

2. The eutectic bonding equipment for chip processing according to claim 1, characterized in that: The heating assembly includes a heating device (71) disposed inside the processing table (17), and a heat insulation layer (72) is provided between the heating device (71) and the processing table (17).

3. The eutectic bonding equipment for chip processing according to claim 2, characterized in that: The moving component includes X-axis moving devices (13) symmetrically arranged on the worktable (11), each of the two X-axis moving devices (13) is provided with a Z-axis moving device (14), and a Y-axis moving device (15) is provided between the two Z-axis moving devices (14). The Y-axis moving device (15) is connected to the moving plate (16) through a moving block (18).

4. The eutectic bonding equipment for chip processing according to claim 3, characterized in that: The protective assembly includes an adjustment plate (22) fixedly installed at the bottom of the movable plate (16). A protective cover (23) is fitted over the adjustment plate (22). The periphery of the adjustment plate (22) is connected to the protective cover (23) through an elastic sealing gasket (41). A sleeve (42) is rotatably provided on the periphery of the adjustment plate (22). An extension rod (43) is slidably provided inside the sleeve (42). The end of the extension rod (43) is rotatably connected to the protective cover (23). A pretreatment assembly is provided on the adjustment plate (22).

5. The eutectic bonding equipment for chip processing according to claim 4, characterized in that: The auxiliary mechanism includes a motor (81) located on the side of the mounting plate (21) on the feed tube (33). A screw (82) is fixedly provided at the output end of the motor (81). A limiting ring (83) is provided on the screw (82). Two sets of lifting blocks (84) are threaded on the screw (82). The two lifting blocks (84) are symmetrical about the center of the limiting ring (83). A lateral moving part (85) is provided on the side of the lifting block (84) near the feed tube (33). Permanent magnets (86) are provided on the inclined surfaces of the lateral moving part (85) and the lifting block (84) that are close to each other. The lateral moving part (85) slides into the feed tube (33). A support plate (87) is provided at the end of the lower lateral moving part (85). A clamping plate (88) is provided at the end of the upper lateral moving part (85). A gasket (89) is provided on the side wall of the clamping plate (88) and the top of the support plate (87).

6. The eutectic bonding equipment for chip processing according to claim 5, characterized in that: The pretreatment assembly includes a collection box (95) fixedly mounted on the adjustment plate (22). Connecting pipes (94) are symmetrically arranged on both sides of the collection box (95). The ends of the two connecting pipes (94) are symmetrically arranged with collection ports (93) tilted downwards. The collection ports (93) extend into the feed pipe (33). The limiting cover (36) has symmetrically opened slots (92) on both sides. A baffle (91) is slidably arranged in the slots (92).

7. The eutectic bonding equipment for chip processing according to claim 6, characterized in that: The pressing and limiting mechanism includes guide telescopic rods (38) symmetrically arranged under the adjusting plate (22). The bottom end of the guide telescopic rod (38) is provided with a connecting plate (35). A spring (37) is sleeved on the outside of the guide telescopic rod (38). The connecting plate (35) is fixedly connected to the discharge port (34). The bottom end of the connecting plate (35) is provided with a limiting cover (36). The limiting cover (36) is sleeved on the outside of the discharge port (34).

8. A eutectic bonding apparatus for chip processing according to any one of claims 1-7, characterized in that: The nitrogen protection mechanism includes a nitrogen storage device (61) located at the bottom of the workbench (11). The nitrogen storage device (61) has an outlet pipe (62) at its output end. An electric control valve (63) is provided on the outlet pipe (62). An air supply pipe (64) is provided on the outlet pipe (62). The air supply pipe (64) passes through the processing table (17) and extends upward. An outlet hole (65) is opened at the top of the air supply pipe (64).

9. The eutectic bonding equipment for chip processing according to claim 8, characterized in that: The exhaust mechanism includes an exhaust pipe (51) symmetrically arranged on the protective cover (23), an annular groove (55) is provided inside the exhaust pipe (51), and an adjustment component matching the annular groove (55) is provided inside the exhaust pipe (51).

10. A eutectic bonding apparatus for chip processing according to claim 9, characterized in that: The adjustment assembly includes a horizontal plate (52) fixedly installed inside the exhaust pipe (51). The horizontal plate (52) is located below the annular groove (55). A sealing plate (54) is provided on the horizontal plate (52) via a connecting rope (53). The diameter of the sealing plate (54) is larger than the inner diameter of the exhaust pipe (51) and smaller than the inner diameter of the annular groove (55). A guide groove (56) matching the sealing plate (54) is provided under the annular groove (55).

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