Current sensing device

Abstract

A current sensing device includes a lead frame and a sensing wafer. The lead frame comprises a first contact pad, a second contact pad, a third contact pad and a connecting lead. The first contact pad is used for being coupled with a power supply device and receiving a specific current from the power supply device. The second contact pad is used for coupling a load. The third contact pad is used for providing a data signal to a microcontroller. The connecting wire is electrically connected with the first contact pad and the second contact pad. The sensing chip obtains information of current flowing through the connecting wire according to the equivalent impedance of the connecting wire and the voltage difference between the first contact pad and the second contact pad, and provides a data signal according to the information of the current flowing through the connecting wire. The lead frame and the sensing wafer are packaged together.

Description

Technical Field

[0001] This invention relates to a current sensing device, and more particularly to a current sensing device that integrates a lead frame and a sensing chip. Background Technology

[0002] In daily life, electronic products require power supplies to drive electronic circuits. Under the concept of energy conservation, accurately monitoring the voltage and current of the power supply in real time will be an important issue. Therefore, current monitoring will be a significant trend. Summary of the Invention

[0003] An embodiment of the present invention provides a current sensing device, including a lead frame and a sensing chip. The lead frame includes a first contact pad, a second contact pad, a third contact pad, and a connecting wire. The first contact pad is used to couple to a power supply device and receive a specific current from the power supply device. The second contact pad is used to couple to a load. The third contact pad is used to provide a data signal to a microcontroller. The connecting wire electrically connects the first and second contact pads. The sensing chip obtains information about the current flowing through the connecting wire based on the equivalent impedance of the connecting wire and the voltage difference between the first and second contact pads, and provides a data signal based on the information about the current flowing through the connecting wire. The lead frame and the sensing chip are co-packaged together. Attached Figure Description

[0004] Figure 1 This is a schematic diagram of the current sensing device of the present invention.

[0005] Figure 2A This is a schematic diagram of the package of the current sensing device of the present invention.

[0006] Figure 2B This is a schematic diagram of the current sensing device of the present invention.

[0007] Figure 3A This is another package schematic diagram of the current sensing device of the present invention.

[0008] Figure 3B This is another schematic diagram of the current sensing device of the present invention.

[0009] Figures 4A to 4C This is another schematic diagram of the current sensing device of the present invention.

[0010] Figure 5A This is another package schematic diagram of the current sensing device of the present invention.

[0011] Figure 5B This is another package schematic diagram of the current sensing device of the present invention.

[0012] Figure 6AThis is a schematic diagram of the sensing chip of the present invention.

[0013] Figure 6B This is another schematic diagram of the sensing chip of the present invention.

[0014] The reference numerals in the attached figures are explained as follows:

[0015] 110, 230: Power supply unit

[0016] 120, 220: Current sensing devices

[0017] 121, 221: Conductor frame

[0018] 122, 222: Sensing chips

[0019] 130: Load

[0020] 140: Microcontroller

[0021] 240: Power supply circuit

[0022] P1~P9, IO_1~IO_3, IO_A, IO_B: Contact pads

[0023] LN: Connecting wire

[0024] W_1~W_5、W_A: Metal wire

[0025] EPY: Plastic material

[0026] PN_1~PN_4: External pins

[0027] CS: Encapsulation housing

[0028] I_IN: Specific current

[0029] SD: Data signal

[0030] SC: Control signal

[0031] CLK: Clock signal

[0032] VCC: Operating voltage

[0033] GND: Grounding voltage

[0034] 310: Operational amplifier

[0035] 320: Processing circuit

[0036] 321: Integrated bus circuit interface

[0037] SW1~SW4: Switches

[0038] R1~R4: Resistors

[0039] SS1~SS4: Switching signals

[0040] CR1~CR4: Correction signals Detailed Implementation

[0041] To make the objectives, features, and advantages of this invention more apparent and understandable, specific embodiments are provided below, along with detailed descriptions in conjunction with the accompanying drawings. This specification provides different embodiments to illustrate the technical features of different implementations of the invention. The configuration of the elements in the embodiments is for illustrative purposes only and is not intended to limit the invention. Furthermore, the repetition of some reference numerals in the embodiments is for simplification and does not imply any correlation between different embodiments.

[0042] Figure 1 This is a schematic diagram of the current sensing device of the present invention. As shown, the current sensing device 120 includes a lead frame 121 and a sensor die 122. The lead frame 121 includes contact pads P1-P3 and a connecting wire LN. The present invention does not limit the manufacturing process of the lead frame 121. In one possible embodiment, the lead frame 121 is formed by a stamping process or an etching process. In another possible embodiment, for high precision requirements, the lead frame 121 is formed by a laser cutting process. In this example, the contact pads P1-P3 are less likely to have burrs. In some embodiments, the material of the lead frame 121 is a nickel-copper alloy.

[0043] Contact pad P1 is used to couple to a power source 110 and receive a specific current I_IN from the power source 110. In one possible embodiment, the specific current I_IN may be between 3 and 30 amperes (A). Contact pad P2 is used to couple to a load 130 and output the specific current I_IN to the load 130. Contact pad P3 is used to provide a data signal SD to a microcontroller 140. Connecting wire LN is electrically connected to contact pads P1 and P2. In one possible embodiment, the equivalent impedance of connecting wire LN is 1 to 20 milliohms (mΩ). The present invention does not limit the width of connecting wire LN. In this embodiment, the width of connecting wire LN is smaller than the width of contact pad P1, but this is not intended to limit the present invention. In one possible embodiment, the width of connecting wire LN is the same as the width of contact pad P1.

[0044] In some embodiments, the size of contact pad P1 is equal to the size of contact pad P2 and larger than the size of contact pad P3. In this example, contact pads P1 and P2 have larger sizes to withstand the large current flowing through them.

[0045] The sensing chip 122 obtains information about the current flowing through the connecting wire LN based on the equivalent impedance of the connecting wire LN and the voltage difference between contact pads P1 and P2. In one possible embodiment, the sensing chip 122 knows the voltage difference between contact pads P1 and P2. The sensing chip 122 obtains information about the current flowing through the connecting wire LN based on the equivalent impedance of the connecting wire LN and the voltage difference between contact pads P1 and P2. In this embodiment, the sensing chip 122 provides a data signal SD based on the information about the current flowing through the connecting wire LN. The microcontroller 140 knows the current flowing through the connecting wire LN based on the data signal SD. In one possible embodiment, the data signal SD is an analog signal. In one possible embodiment, the sensing chip 122 has an analog-to-digital conversion function. In this example, the data signal SD is a digital signal. In some embodiments, the voltage of contact pad P1 is used as the operating voltage of the sensing chip 122. In other words, the power supply device 110 supplies power to the sensing chip 122.

[0046] In this embodiment, the lead frame 121 and the sensing chip 122 are co-packaged as a single component. In some embodiments, a flip-chip package or a wire bond package is used to package the lead frame 121 and the sensing chip 122. Since the lead frame 121 and the sensing chip 122 are not two independent components, there is no need to solder them onto the same circuit board (PCB), thereby reducing the contact resistance increased by additional soldering and improving the accuracy of current detection by the sensing chip 122. Furthermore, since the lead frame 121 and the sensing chip 122 are co-packaged, the sensing chip 122 is very close to the connecting wire LN. During the measurement of the current flowing through the connecting wire LN, the measurement results of the sensing chip 122 are less susceptible to noise interference.

[0047] During the production phase, a final test process is conducted using power supply unit 110, load 130, and microcontroller 140 to sequentially or simultaneously calibrate the error values ​​of numerous current sensing devices. After calibration, these current sensing devices can be used in servers, industrial computers, smart meters, and USB power delivery applications as current monitoring components. Since power supply unit 110, load 130, and microcontroller 140 serve as testing instruments, current sensing device 120 no longer needs to be coupled to power supply unit 110, load 130, and microcontroller 140 after testing. Users can apply current sensing device 120 to any electronic product according to their needs.

[0048] Figure 2AThis is a schematic diagram of the packaging of the current sensing device 120 of the present invention. The lead frame 121 has contact pads P1 to P3. In one possible embodiment, the lead frame 121 is disposed within a plastic material EPY. The plastic material EPY is used to support the lead frame 121 and fix the contact pads P1 to P3. The present invention does not limit the type of plastic material EPY. In one possible embodiment, the plastic material EPY is epoxy resin. In addition, the present invention does not limit the number of contact pads of the lead frame 121. In some embodiments, the lead frame 121 further has contact pad PA.

[0049] Figure 2A The front side of the sensing chip 122 is shown. As shown, the sensing chip 122 has contact pads IO_1 to IO_3. Generally, each wafer produced by a wafer fabrication plant has many dies. After a wafer saw process, many individual dies are obtained. In this embodiment, the sensing chip 122 is a die cut from a wafer.

[0050] exist Figure 2A In this embodiment, the sensing chip 122 is positioned with its front side facing the lead frame 121 and in contact with the lead frame 121. In this example, contact pad 10_1 of the sensing chip 122 contacts and is electrically connected to contact pad P2 of the lead frame 121, contact pad 10_2 of the sensing chip 122 contacts and is electrically connected to contact pad P1 of the lead frame 121, and contact pad 10_3 of the sensing chip 122 contacts and is electrically connected to contact pad PA of the lead frame 121. In other embodiments, the front side of the sensing chip 122 also includes a contact pad 10_A for electrically connecting to contact pad P3 of the lead frame 121.

[0051] Next, the lead frame 121 and the sensing chip 122 are packaged together using a housing. Figure 2B for Figure 2A A schematic diagram of the current sensing device 120. A package housing CS encapsulates the packaged lead frame 121 and the sensing chip 122. In some embodiments, the package housing CS has a heat dissipation function to release the heat generated when current flows through the connecting wire LN.

[0052] In some embodiments, the current sensing device 120 further includes a plurality of external pins for electrically connecting to the sensing chip 122. For ease of explanation, Figure 2B Only external pins PN_1 and PN_2 are shown. External pin PN_1 is electrically connected to contact pad IO_1. External pin PN_2 is electrically connected to contact pad IO_2. External pins PN_1 and PN_2 are exposed outside the package housing CS.

[0053] In this embodiment, the lead frame 121 and the sensing chip 122 are packaged using a flip-chip packaging technology. The packaged lead frame 121 and sensing chip 122 serve as a current sensing device 120. The current sensing device 120 may be soldered onto a circuit board (PCB). In this example, external pin PN_1 is coupled to the power supply device 110 via a trace (not shown) on the PCB, and external pin PN_2 is coupled to the load 130 via another trace on the PCB.

[0054] Figure 3A This is another schematic diagram of the current sensing device of the present invention. In this embodiment, the packaging technology of the lead frame 121 and the sensing chip 122 is a wire bonding packaging technology. Figure 3A Presenting the front side of the sensing chip 122. First, the back side of the sensing chip 122 faces the lead frame 121. Next, the contact pads on the front side of the sensing chip 122 and the lead frame 121 are electrically connected using bonding wires W_1 to W_3 and W_A.

[0055] As shown in the figure, metal wire W_1 is electrically connected to contact pad IO_1 of the sensing chip 122 and contact pad P1 of the lead frame 121. Metal wire W_2 is electrically connected to contact pad IO_2 of the sensing chip 122 and contact pad P2 of the lead frame 121. Metal wire W_3 is electrically connected to contact pad IO_3 of the sensing chip 122 and contact pad P3 of the lead frame 121. Metal wire W_A is electrically connected to contact pad IO_A of the sensing chip 122 and contact pad PA of the lead frame 121.

[0056] Figure 3B for Figure 3A A schematic diagram of the current sensing device. Figure 3B Similar to Figure 2B The difference is that, Figure 3B The connection between the sensing chip 122 inside the current sensing device and the lead frame 121 is achieved using metal wires W_1 to W_3 and W_A. For ease of explanation, Figure 3B Only external pins PN_3 and PN_4 are displayed. External pin PN_3 is electrically connected to contact pad IO_2 via metal wire W_2. External pin PN_4 is electrically connected to contact pad IO_1 via metal wire W_1.

[0057] Figure 4A This is another schematic diagram of the current sensing device of the present invention. The current sensing device 220 includes a lead frame 221 and a sensing chip 222. The lead frame 221 is similar to... Figure 1The lead frame 121 differs from the lead frame 221 in that it also includes contact pads P4 to P7. Contact pad P4 is electrically connected to contact pad P1 and sensing chip 222. Contact pad P5 is electrically connected to contact pad P2 and sensing chip 222. In this example, sensing chip 222 senses the voltages of contact pads P4 and P5 to determine the voltage difference between contact pads P1 and P2. Based on the voltage difference between contact pads P1 and P2 and the equivalent impedance of the connecting wire LN, sensing chip 222 determines the current flowing through the connecting wire LN. Based on the current flowing through the connecting wire LN, sensing chip 222 provides a data signal SD. Since the characteristics of sensing chip 222 are similar to those of sensing chip 122, they will not be described further.

[0058] In one possible embodiment, the sensing chip 222 directly uses the current flowing through the connecting wire LN as the data signal SD. In another possible embodiment, the sensing chip 222 converts the current flowing through the connecting wire LN and uses the converted result as the data signal SD. In this example, the data signal SD may be an analog signal or a digital signal.

[0059] Contact pad P6 is coupled to a power supply device 230 to receive the operating voltage VCC provided by the power supply device 230. Contact pad P6 provides the operating voltage VCC to the sensing chip 222. Contact pad P7 receives a ground voltage GND and provides the ground voltage GND to the sensing chip 222. After receiving the operating voltage VCC and the ground voltage GND, the sensing chip 222 begins to sense the voltages of contact pads P1 and P2 to obtain information about the current flowing through the connecting wire LN.

[0060] Figure 4B This is another schematic diagram of the current sensing device of the present invention. Figure 4B resemblance Figure 4A The difference is that, Figure 4B The sensing chip 222 receives the operating voltage VCC provided by the power supply device 110 via contact pad P4. In this example, contact pad P6 may be omitted. In one possible embodiment, the sensing chip 222 has a power supply circuit 240. The power supply circuit 240 converts the operating voltage VCC and then provides the converted voltage to other components inside the sensing chip 222. The present invention does not limit how the power supply circuit 240 receives the operating voltage VCC. In one possible embodiment, the power supply circuit 240 receives the operating voltage VCC via contact pad P1. In another possible embodiment, the power supply circuit 240 receives the operating voltage VCC via contact pad P4. In other embodiments, the power supply circuit 240 receives the operating voltage VCC via connecting wire LN and contact pad P2. In some embodiments, the power supply circuit 240 is a low dropout regulator (LDO).

[0061] Figure 4CThis is another schematic diagram of the current sensing device of the present invention. Figure 4C Similar to Figure 4A The difference lies in that the lead frame 221 further includes a contact pad P8. The contact pad P8 is used to couple to the microcontroller 140 and receive a control signal SC from the microcontroller 140. The sensing chip 222 adjusts the data signal SD according to the control signal SC, and then provides the adjusted data signal SD to the microcontroller 140. This invention does not limit how the sensing chip 222 adjusts the data signal SD. In one possible embodiment, the sensing chip 222 generates a correction signal according to the control signal SC and integrates the correction signal into the data signal SD.

[0062] The microcontroller 140 determines whether the adjusted data signal SD reaches a preset value. If the data signal SD does not reach the preset value, the microcontroller 140 sends the control signal SC again, requesting the sensing chip 222 to continue adjusting the data signal SD. In one possible embodiment, the sensing chip 222 integrates another correction signal into the data signal SD until the data signal SD reaches a preset value. When the data signal SD reaches the preset value, the microcontroller 140 requests the sensing chip 222 to record the adjustment range of the data signal SD and uses this adjustment range as a reference value (offset). In future current sensing results, the sensing chip 222 adds this reference value to the measurement result to obtain the final current measurement result.

[0063] For example, suppose the data signal SD output by the sensing chip 222 represents a current of 9.8A flowing through the connecting wire LN. Since the current flowing through the connecting wire LN (9.8A) is not equal to the preset value (10A), the microcontroller 140 sends a control signal SC, requesting the sensing chip 222 to adjust the data signal SD. In one possible embodiment, the sensing chip 222 increases the data signal SD according to the control signal SC, so that the data signal SD corresponds to a current of 9.9A. Since the current represented by the data signal SD (9.9A) is not equal to the preset value (10A), the microcontroller 140 sends the control signal SC again. The sensing chip 222 continues to increase the data signal SD, so that the data signal SD corresponds to a current of 10A. Since the current corresponding to the data signal SD (10A) is equal to the preset value (10A), the microcontroller 140 stops sending the control signal SC. The sensing chip 222 records the increase in the data signal SD (0.2A).

[0064] After the current sensing device 220 is manufactured, it may be used in a server. Suppose that the sensing chip 222 measures a current of 5A flowing through the connecting wire LN. In this example, the sensing chip 222 adds a pre-recorded correction value (0.2A) to the actual measurement result (5A), and then generates a data signal SD based on the corrected current value (5.2A), which is then used by an external testing instrument or a microprocessor.

[0065] Since the data signal SD generated by the current sensing device 220 has been calibrated to compensate for errors caused by any factors within the common package, accurate current monitoring results can be provided. Furthermore, since the connecting wire LN measured by the sensing chip 222 is part of the lead frame 221, no additional components are required, thus not increasing component costs while still providing current monitoring functionality.

[0066] In some embodiments, the lead frame 221 further includes a contact pad P9. The contact pad P9 is used to couple to the microcontroller 140 and receive a clock signal CLK from the microcontroller 140. In this example, the sensing chip 222 receives a control signal SC based on the clock signal CLK. In one possible embodiment, the clock signal CLK and the control signal SC conform to an Inter-Integrated Circuit (I2C) protocol.

[0067] This invention does not limit the size of contact pads P1 to P9. In one possible embodiment, contact pads P1 to P9 have the same size. In another possible embodiment, contact pads P1 and P2 have the same size and are larger than the size of contact pads P3 to P9. In some embodiments, contact pads P1, P2, P4, and P5 have the same size and are larger than the size of contact pads P3, P6, and P9.

[0068] Figure 5A for Figure 4A A schematic diagram of the package of the current sensing device 220. The lead frame 221 has contact pads P1 to P7. The contact pads P1 to P7 are fixed by EPY plastic material. Figure 5A The front side of the sensor chip 222 is shown. As shown, the front side of the sensor chip 222 has contact pads IO_1 to IO_3, IO_A, and IO_B.

[0069] Next, the front side of the sensing chip 222 is positioned facing the lead frame 221. In this example, contact pad IO_1 of the sensing chip 222 contacts and is electrically connected to contact pad P5 of the lead frame 221. Additionally, contact pad IO_2 of the sensing chip 222 contacts and is electrically connected to contact pad P4 of the lead frame 221. Contact pad IO_3 of the sensing chip 222 contacts and is electrically connected to contact pad P6 of the lead frame 221. Contact pad IO_A of the sensing chip 222 contacts and is electrically connected to contact pad P7 of the lead frame 221. Contact pad IO_B of the sensing chip 222 contacts and is electrically connected to contact pad P3 of the lead frame 221.

[0070] Finally, the lead frame 221 and the sensing chip 222 are packaged together using a housing. In this embodiment, the packaging technology for the lead frame 221 and the sensing chip 222 is a flip-chip packaging technology. The packaged lead frame 221 and sensing chip 222 serve as a current sensing device 220. The current sensing device 220 may be soldered onto a circuit board to measure the current between two components on the circuit board. Since... Figure 5A The appearance diagram after packaging is similar to Figure 2B Therefore, I will not elaborate further.

[0071] Figure 5B This is another packaged schematic diagram of the current sensing device 220 of the present invention. In this embodiment, the lead frame 221 and the sensing chip 222 are packaged using a wire bonding technology. The back side of the sensing chip 222 faces the lead frame 221. Next, metal wires W_1 to W_5 are used to electrically connect the sensing chip 222 and the lead frame 221. As shown, metal wire W_1 electrically connects the contact pad IO_1 of the sensing chip 222 to the contact pad P4 of the lead frame 221; metal wire W_2 electrically connects the contact pad IO_2 of the sensing chip 222 to the contact pad P5 of the lead frame 221; metal wire W_3 electrically connects the contact pad IO_B of the sensing chip 222 to the contact pad P3 of the lead frame 221; metal wire W_4 electrically connects the contact pad IO_3 of the sensing chip 222 to the contact pad P7 of the lead frame 221; and metal wire W_5 electrically connects the contact pad IO_A of the sensing chip 222 to the contact pad P6 of the lead frame 221. Finally, the lead frame 221 and the sensing chip 222 are packaged together using a housing. The current sensing device 220 may be soldered onto a circuit board (not shown). Because... Figure 5B The appearance diagram after packaging is similar to Figure 3B Therefore, I will not elaborate further.

[0072] Figure 6AThis is a schematic diagram of the sensing chip 122 of the present invention. In this embodiment, the sensing chip 122 includes an operational amplifier 310, a processing circuit 320, switches SW1-SW4, and resistors R1-R4. The non-inverting input terminal of the operational amplifier 310 is coupled to contact pad P5, and its inverting input terminal is coupled to contact pad P4. The output terminal of the operational amplifier 310 is coupled to contact pad P3 to provide a data signal SD. In one possible embodiment, the operational amplifier 310 may output the voltage difference between contact pads P4 and P5. In another possible embodiment, the operational amplifier 310 may output a current corresponding to the voltage difference between contact pads P4 and P5.

[0073] Switch SW1 and resistor R1 are connected between contact pads P4 and P3, and receive a switching signal SS1. Switch SW2 and resistor R2 are connected between contact pads P4 and P3, and receive a switching signal SS2. Switch SW3 and resistor R3 are connected between contact pads P4 and P3, and receive a switching signal SS3. Switch SW4 and resistor R4 are connected between contact pads P4 and P3, and receive a switching signal SS4. The present invention does not limit the number of switches and resistors. The number of switches is the same as the number of resistors. In other embodiments, the sensing chip 122 has more or fewer switches and resistors.

[0074] The processing circuit 320 generates switching signals SS1 to SS4 based on the control signal SC, to turn on or off the corresponding switches. Taking switch SW1 as an example, switch SW1 may switch from an on state to a off state, or from a off state to an on state, based on the switching signal SS1. This invention does not limit the types of switches SW1 to SW4. In one possible embodiment, switches SW1 to SW4 are electronic fuses (eFuse). Taking switch SW1 as an example, switch SW1 may switch from a short-circuit state to an open-circuit state, or from an open-circuit state to a short-circuit state, based on the switching signal SS1.

[0075] Suppose that the power supply 110 provides a specific current I_IN of 10A. When the microcontroller 140 learns from the data signal SD that the current flowing through the connecting wire LN is 9.8A, it indicates that the current sensing device 220 has an error of 0.2A. Therefore, the microcontroller 140 requests the sensing chip 222 to perform an error correction via the control signal SC. In this example, the sensing chip 222 adjusts the data signal SD according to the control signal SC.

[0076] For example, processing circuit 320 enables switching signal SS1 and disables switching signals SS2-SS4 according to control signal SC. Therefore, switch SW1 is turned on, and switches SW2-SW4 are turned off. A negative feedback loop is formed by switch SW1 and resistor R1, adding a correction signal CR1 to data signal SD. At this time, microcontroller 140 determines from data signal SD that the current in connecting wire LN is 9.9A. Since the current in connecting wire LN is not equal to the specific current I_IN, microcontroller 140 issues control signal SC again. Processing circuit 320 enables switching signal SS2 and disables switching signals SS1, SS3, and SS4 according to control signal SC. Therefore, switch SW2 is turned on, and switches SW1, SW3, and SW4 are turned off. A negative feedback loop is formed by switch SW2 and resistor R2, and sensing chip 122 adds a correction signal CR2 to data signal SD. At this time, microcontroller 140 determines from data signal SD that the current in connecting wire LN is 10A. Since the current in the connecting wire LN has reached a preset value (i.e., a specific current I_IN), the microcontroller 140 requests the sensing chip 222 to add a fixed correction signal CR2 to the data signal SD via the control signal SC. Therefore, the processing circuit 320 maintains the enable switching signal SS2 and maintains the disable switching signals SS1, SS3, and SS4.

[0077] In one possible embodiment, when switches SW1 to SW4 are electronic fuses, the processing circuit 320 may blow switches SW1, SW3, and SW4, making switches SW1, SW3, and SW4 open circuits. In this example, only switch SW2 is short circuit, so the correction signal CR2 is applied to the data signal SD.

[0078] In other embodiments, the sensing chip 222 further includes a memory (not shown) for recording the correction signal CR2. In this example, the sensing chip 122 adjusts the data signal SD based on the correction signal recorded in the memory. In some embodiments, the processing circuitry 320 further includes an integrated bus circuit (I2C) interface 321. The integrated bus circuit interface 321 is coupled to contact pads P8 and P9 for receiving control signal SC and clock signal CLK.

[0079] Figure 6B This is another schematic diagram of the sensing chip 122 of the present invention. Figure 6B Similar to Figure 6A The difference is that, Figure 6BIt also includes an analog-to-digital converter (ADC) 330. The ADC 330 converts the output of the operational amplifier 310 with the added result of correction signals (at least one of CR1 to CR4) from an analog format to a digital format. The conversion result produced by the ADC 330 may serve as a data signal SD. In this example, the data signal SD is a digital signal.

[0080] Unless otherwise defined, all terms herein (including technical and scientific terms) are as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, unless expressly stated otherwise, definitions of terms in general dictionaries should be interpreted as consistent with their meaning in the context of their respective technical fields, and not as idealized or overly formal expressions. While terms such as “first,” “second,” etc., may be used to describe various elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. In the claims, terms such as “first,” “second,” etc., are used as designations and are not intended to impose numerical requirements on their contents.

[0081] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make modifications and variations without departing from the concept and scope of the invention. For example, the systems, apparatus, or methods described in the embodiments of the present invention can be implemented in physical embodiments using hardware, software, or a combination of hardware and software. Therefore, the scope of protection of the present invention is determined by the claims.

Claims

1. A current sensing device, comprising: A conductor frame, comprising: A first contact pad for coupling to a first power supply device and receiving a specific current from the first power supply device; A second contact pad is used to couple a load; A third contact pad is used to provide a data signal to a microcontroller; and A connecting wire electrically connects the first contact pad and the second contact pad; A sensing chip obtains information about the current flowing through the connecting wire based on the equivalent impedance of the connecting wire and the voltage difference between the first contact pad and the second contact pad, and provides a data signal based on the information about the current flowing through the connecting wire. The lead frame and the sensing chip are packaged together.

2. The current sensing device as claimed in claim 1, wherein the sensing chip comprises: A power supply circuit converts an operating power supply and provides the converted voltage to the sensing chip. The operating power is provided by the first power supply device, and the power circuit receives the operating power through the first contact pad.

3. The current sensing device as claimed in claim 1, wherein the sensing chip comprises: A power supply circuit converts an operating power supply and provides the converted voltage to the sensing chip. The operating power is provided by the first power supply device, and the power circuit receives the operating power through the connecting wire and the second contact pad.

4. The current sensing device as claimed in claim 1, wherein the conductor frame further comprises: A fourth contact pad is used to couple to a second power supply device, receive an operating voltage from the second power supply device, and provide the operating voltage to the sensing chip.

5. The current sensing device of claim 1, wherein the conductor frame further comprises: A fifth contact pad is used to couple to the microcontroller and receive a control signal from the microcontroller. The sensing chip generates a correction signal based on the control signal and integrates the correction signal into the data signal.

6. The current sensing device of claim 5, wherein when the data signal reaches a preset value, the microcontroller requests the sensing chip to maintain the correction signal.

7. The current sensing device of claim 6, wherein the sensing chip includes a plurality of electronic fuses, and the microcontroller controls the plurality of electronic fuses through the control signal.

8. The current sensing device of claim 6, wherein the sensing chip includes a memory for recording the correction signal.

9. The current sensing device as claimed in claim 5, wherein, The conductor frame also includes: A sixth contact pad is used to couple to the microcontroller and receive a clock signal from the microcontroller. The sensing chip receives the control signal based on the clock signal.

10. The current sensing device of claim 9, wherein the sensing chip includes an integrated bus circuit interface coupled to the fifth contact pad and the sixth contact pad.

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