Capacitance testing mechanism and capacitance testing and sorting apparatus

Abstract

The application discloses a kind of capacitor test mechanism and capacitor test sorting equipment, belong to electronic component test technical field, capacitor test mechanism includes pedestal, test disc and test wheel.Test wheel is rotatably arranged on pressing seat by test shaft, test wheel is rotatably sleeved on the outer periphery side of test shaft, the outer periphery of test shaft is provided with chip removal groove, chip removal groove extends spirally along the axis direction of test shaft;Wherein, chip removal groove is configured to accommodate foreign matter between test wheel and test shaft, test wheel is configured to drive foreign matter between test wheel and test shaft to be conveyed along the extension direction of chip removal groove and be discharged from the shaft end of test shaft.By discharging foreign matter, parasitic resistance can be reduced, test accuracy is improved, so that the patch capacitor has higher product performance, so that the patch capacitor can better meet the use requirements of electrical instruments and meters, solar equipment precision measurement analysis instrument, portable or vehicle-mounted energy-saving detection equipment and the like.

Description

Technical Field

[0001] This invention relates to the field of electronic component testing technology, and in particular to a capacitance testing mechanism and capacitance testing and sorting equipment. Background Technology

[0002] Surface mount capacitors (MLCCs), as key components in the electronics field, are commonly used in electrical instruments and meters such as power load control systems; they are also frequently used in solar energy flux density and solar concentrator accuracy measurement and analysis instruments; and they are also used in consumer electronics (such as mobile phones, computers, etc.), communication equipment (such as routers, optical modules, etc.), and automotive electronics (such as portable or in-vehicle energy-saving testing equipment in automotive safety systems, in-vehicle entertainment, etc.). MLCCs are constructed by alternating layers of ceramic dielectric and internal electrodes, with leads extended from the external electrodes to form a chip structure. Thanks to this unique structure, they can achieve large capacitance values ​​within a limited space and maintain stable electrical performance, thus being widely used in various electronic device circuits. The market demand is huge, and the requirements for quality control are extremely high, leading to the development of high-speed capacitor testing and sorting equipment, with the testing mechanism being the core component.

[0003] The primary task of a high-speed capacitor testing mechanism is to accurately test the electrical performance of surface-mount capacitors, thereby ensuring product quality. As a specialized mechanism for testing the electrical performance of multilayer surface-mount capacitors (covering key indicators such as capacitance, loss tangent, and insulation resistance), its components each perform their specific functions while working closely together. The test tray carries and transports the capacitor under test, ensuring it arrives at the test position systematically and at a controlled speed; the test rollers make elastic contact with one end of the capacitor, connecting the capacitor to the test circuit while accommodating capacitor size and positional deviations; the lower electrode assembly contacts the other end of the capacitor, forming a complete test circuit together with the test rollers; and the testing instruments are used to accurately measure various electrical performance indicators, their precision and stability being crucial to the accuracy of the test results.

[0004] However, prolonged exposure of the copper test shaft to air easily leads to the formation of a very thin copper dioxide oxide layer on its surface. Simultaneously, during operation, the capacitance testing mechanism drives the test disk to rotate, causing the capacitor to pass tangentially along the test wheel at a specific frequency. Each pass pushes the test wheel to rotate a certain angle and simultaneously lifts it upwards, causing the inner cylindrical surface of the test wheel to collide and rub against the outer cylindrical surface of the test shaft. Over time, the collisions between the inner and outer cylindrical surfaces of the test wheel and test shaft break up the oxide layer, forming tiny foreign objects. The accumulation of these foreign objects increases the parasitic resistance between the test wheel and test shaft, resulting in reduced testing accuracy. Furthermore, wear between the test wheel and test shaft shortens the lifespan of the capacitance testing mechanism. Summary of the Invention

[0005] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a capacitance testing mechanism that can remove foreign objects between the inner cylindrical surface of the test wheel and the outer cylindrical surface of the test shaft, thereby reducing parasitic resistance, improving capacitance testing accuracy, and extending the service life of the mechanism.

[0006] The present invention also proposes a capacitance testing and sorting device having the above-mentioned capacitance testing mechanism.

[0007] According to a first aspect of the present invention, the capacitance testing mechanism comprises:

[0008] A base, wherein a lower electrode assembly is provided;

[0009] A test tray, movably mounted on the base, for mounting surface-mount capacitors, with the lower electrode assembly located below the test tray; and

[0010] The test wheel is mounted on the base via a pressure seat and located above the test disk. The test wheel is rotatably mounted on the pressure seat via a test shaft and is rotatably sleeved on the outer periphery of the test shaft. A chip removal groove is formed on the outer periphery of the test shaft, and the chip removal groove extends spirally along the axial direction of the test shaft.

[0011] The test wheel and the lower electrode assembly are positioned vertically relative to each other on the test disk. The test disk can drive the chip capacitor to pass between the test wheel and the lower electrode assembly. When the chip capacitor passes between the test wheel and the lower electrode assembly, the upper end face of the chip capacitor abuts against the outer circumferential surface of the test wheel and the lower end face of the chip capacitor abuts against the upper end face of the lower electrode assembly, thereby driving the test wheel to rotate relative to the test shaft. The chip removal groove is configured to accommodate foreign objects between the test wheel and the test shaft. The test wheel is configured to drive the foreign objects between the test wheel and the test shaft to be conveyed along the extension direction of the chip removal groove and discharged from the shaft end of the test shaft.

[0012] The capacitance testing mechanism according to embodiments of the present invention has at least the following beneficial effects: A spiral-shaped chip removal groove is provided on the outer circumferential surface of the test shaft. During the testing process, when foreign objects are generated, the chip removal groove can promptly accommodate these tiny foreign objects. With the rotation of the test wheel, the spiral shape guides the foreign objects smoothly out, preventing accumulation between the test shaft and the test wheel, thereby reducing the parasitic resistance between the test wheel and the test shaft, and thus improving the testing accuracy of the surface mount capacitor. Furthermore, the smooth removal of foreign objects also reduces wear between the test wheel and the test shaft, thereby extending the service life of the capacitance testing mechanism. Secondly, due to the reduced adverse effects caused by foreign object accumulation, the fit between the test wheel and the test shaft is more stable, allowing the test wheel to make more precise elastic contact with the surface mount capacitor. Simultaneously, the stable contact between the lower electrode assembly and the lower end of the surface mount capacitor, together constructing a more reliable test circuit, ensures the accuracy of the testing instrument's measurement of various electrical performance indicators of the surface mount capacitor, and improves the product quality control level. Furthermore, while achieving efficient chip removal and stable testing functions, it can be directly machined using existing test shafts, thus not increasing the complexity of the mechanism excessively and reducing investment costs.

[0013] According to some embodiments of the present invention, the pressure seat is mounted on the base via a fixing frame, the test wheel is mounted on the first end of the pressure seat, and a rotating shaft is provided at the second end of the pressure seat. The second end of the pressure seat is rotatably mounted on the fixing frame via the rotating shaft. The first end and the second end of the pressure seat are located at opposite ends of the pressure seat. An elastic element is also provided in the fixing frame, one end of which abuts against the fixing frame, and the other end of which abuts against the top of the first end of the pressure seat.

[0014] According to some embodiments of the present invention, the test shaft has a mating section extending along the axial direction and mounting sections respectively connected to both ends of the mating section. The test wheel is sleeved on the mating section, the chip removal groove is formed on the outer peripheral surface of the mating section, the pressure seat is provided with a snap-fit ​​groove and a receiving groove, the test wheel is disposed in the receiving groove, the snap-fit ​​groove is located at both ends of the receiving groove, the mounting section is detachably mounted in the snap-fit ​​groove, and the cross-sectional shape of the snap-fit ​​groove is adapted to the cross-sectional shape of the mounting section.

[0015] According to some embodiments of the present invention, the mounting segment is snapped into the snap-fit ​​groove, and the outer surface of the mounting segment and the inner surface of the snap-fit ​​groove have multiple contact surfaces.

[0016] According to some embodiments of the present invention, the capacitance testing mechanism further includes an elastic pressure plate, one end of which is disposed on the pressure base, and the other end of which presses against the mounting section so that the mounting section is engaged in the engagement groove.

[0017] According to some embodiments of the present invention, the thread profile of the chip removal groove is a triangular thread profile, and the thread angle of the triangular thread profile is α, wherein α satisfies: 0° < α < 90°.

[0018] According to some embodiments of the present invention, the tooth depth of the chip removal groove ranges from 0.15 mm to 0.25 mm, so that foreign objects can be accommodated in the chip removal groove.

[0019] According to some embodiments of the present invention, the number of spiral turns of the chip removal groove includes at least one turn, and the two ends of the chip removal groove are respectively connected to the two ends of the mating section.

[0020] According to some embodiments of the present invention, multiple pressure seats and test wheels are provided, with each pressure seat and test wheel corresponding to the other. Multiple pressure seats can be arrayed in the fixed frame along the length direction of the fixed frame, and the surface mount capacitors are arranged and loaded in the test tray along the arrangement direction of the pressure seats.

[0021] The capacitance testing and sorting device according to a second aspect of the present invention includes a capacitance testing mechanism according to the first aspect of the present invention described above.

[0022] The capacitance testing and sorting apparatus according to a second aspect of the present invention has at least the following beneficial effects: the capacitance testing and sorting apparatus has all the beneficial effects brought about by the above-described capacitance testing mechanism, which will not be repeated here.

[0023] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a schematic diagram of the structure of the capacitance testing mechanism of the capacitance testing and sorting device according to a second aspect embodiment of the present invention;

[0026] Figure 2 for Figure 1 The diagram shows the assembly of the base, test plate, and mounting frame of the capacitance testing mechanism.

[0027] Figure 3 for Figure 2 The diagram shows the assembly of the fixing frame, test wheels, test plate, and lower electrode assembly of the capacitance testing mechanism.

[0028] Figure 4 for Figure 3The diagram shows the cooperation between the pressure base, test wheel, and elastic pressure plate of the capacitance testing mechanism.

[0029] Figure 5 for Figure 3 A schematic diagram showing the engagement of the pressure base, test wheel, and elastic pressure plate in another embodiment of the capacitance testing mechanism;

[0030] Figure 6 for Figure 4 The diagram shows the structure of the explosion.

[0031] Figure 7 for Figure 3 The diagram shows the test state of the capacitance testing mechanism.

[0032] Icon labels:

[0033] Surface mount capacitor 1; base 10; pressure seat 20; snap-fit ​​groove 21; receiving groove 22; rotating shaft 23; first end 24; second end 25; test wheel 30; test shaft 31; mounting section 311; mating section 312; chip removal groove 3121; test plate 40; receiving hole 41; lower electrode assembly 50; elastic pressure plate 60; testing instrument 70; fixing frame 80. Detailed Implementation

[0034] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0035] In the description of this invention, the use of "first" and "second" is for the purpose of distinguishing technical features only, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of the technical features indicated.

[0036] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0037] Reference Figures 1 to 7According to a first aspect of the present invention, the capacitance testing mechanism includes a base 10, a test disk 40, and a test wheel 30. The base 10 is provided with a lower electrode assembly 50; the test disk 40 is movably disposed on the base 10 and is used to load a surface-mount capacitor 1; the lower electrode assembly 50 is located below the test disk 40; the test wheel 30 is disposed on the base 10 via a pressure seat 20 and is located above the test disk 40; the test wheel 30 is rotatably disposed on the pressure seat 20 via a test shaft 31, and is rotatably sleeved on the outer periphery of the test shaft 31; a chip removal groove 3121 is formed on the outer periphery of the test shaft 31, and the chip removal groove 3121 extends spirally along the axial direction of the test shaft 31; wherein, the test wheel 30 and the lower electrode assembly 50 are located on the upper part of the test disk 40. Corresponding to the downward position, the test disk 40 can drive the chip capacitor 1 to pass between the test wheel 30 and the lower electrode assembly 50. When the chip capacitor 1 passes between the test wheel 30 and the lower electrode assembly 50, the upper end face of the chip capacitor 1 abuts against the outer peripheral surface of the test wheel 30 and the lower end face of the chip capacitor 1 abuts against the upper end face of the lower electrode assembly 50, thereby driving the test wheel 30 to rotate relative to the test shaft 31. The chip removal groove 3121 is configured to accommodate foreign objects between the test wheel 30 and the test shaft 31. The test wheel 30 is configured to drive the foreign objects between the test wheel 30 and the test shaft 31 to be conveyed along the extension direction of the chip removal groove 3121 and discharged from the shaft end of the test shaft 31.

[0038] Specifically, the capacitance testing mechanism of the present invention will be described in detail below with reference to the accompanying drawings.

[0039] Reference Figures 2 to 5 as well as Figure 7 The capacitance testing mechanism in this embodiment mainly comprises three parts: a base 10, a test plate 40, and a test wheel 30. The base 10 serves as the supporting foundation for the entire mechanism, providing a stable mounting platform for other components; the test plate 40 is used to carry and transport the surface-mount capacitor 1, ensuring that it arrives at the test position in a regular manner; the test wheel 30 makes elastic contact with the surface-mount capacitor 1, connecting the capacitor to the test circuit, and together with the lower electrode assembly 50, forms a complete test circuit to realize the testing of the electrical performance of the capacitor.

[0040] Reference Figure 2 as well as Figure 7 The base 10 is made of high-strength metal to ensure sufficient structural strength and stability. A lower electrode assembly 50 is mounted below the base 10, ensuring its position remains fixed. The upper surface of the lower electrode assembly 50 makes good contact with the lower end of the surface mount capacitor 1, forming a stable electrical connection. The lower electrode assembly 50 is connected to the testing instrument 70 via wires, transmitting the electrical signal of the surface mount capacitor 1 to the testing instrument 70 for accurate measurement.

[0041] Reference Figures 1 to 3The test plate 40 is movably mounted on the base 10, specifically through a rotating shaft 23 or a guide rail mounted on the base 10. The main function of the test plate 40 is to load the surface mount capacitor 1, neatly placing the surface mount capacitor 1 to be tested on the test plate 40. The lower electrode assembly 50 is located below the test plate 40, ensuring that the surface mount capacitor 1 accurately reaches the position corresponding to the lower electrode assembly 50 when the test plate 40 moves it.

[0042] Reference Figures 2 to 4 The test wheel 30 is mounted on the base 10 via the pressure seat 20 and is positioned above the test disc 40. The pressure seat 20 serves to fix and support the test wheel 30, stably installing it at a suitable height. The test wheel 30 is rotatably mounted on the pressure seat 20 via the test shaft 31, and is rotatably fitted onto the outer periphery of the test shaft 31. Crucially, the outer periphery of the test shaft 31 has a chip removal groove 3121, which extends spirally along the axial direction of the test shaft 31. This spirally designed chip removal groove 3121 forms a conveying channel for foreign objects when the test wheel 30 rotates relative to the test shaft 31.

[0043] During use, the test disk 40 drives the mounted chip capacitor 1 to pass between the test wheel 30 and the lower electrode assembly 50. When the chip capacitor 1 reaches the test position, its upper surface abuts against the outer circumferential surface of the test wheel 30, and its lower surface abuts against the upper surface of the lower electrode assembly 50. At this time, driven by the test disk 40 and through the contact between the chip capacitor 1 and the test wheel 30 and the lower electrode assembly 50, the chip capacitor 1 drives the test wheel 30 to rotate relative to the test shaft 31.

[0044] During the relative rotation of the test wheel 30 and the test shaft 31, oxide particles and other foreign objects are inevitably generated due to impact and friction between them. These foreign objects fall into the chip removal groove 3121 on the outer circumference of the test shaft 31. As the test wheel 30 rotates intermittently, the chip removal groove 3121 uses its spiral structure to drive the foreign objects along the extension direction of the groove 3121, and finally discharge them from the shaft end of the test shaft 31. This avoids the accumulation of foreign objects on the contact surface between the test wheel 30 and the test shaft 31, ensuring good contact and rotational flexibility between the test wheel 30 and the test shaft 31, thereby ensuring the normal operation and testing accuracy of the entire capacitance testing mechanism.

[0045] For example, in actual production, this capacitor testing mechanism is installed on a high-speed capacitor testing and sorting equipment. After the equipment is started, the test disc 40 rotates at a set frequency and speed, continuously driving the chip capacitors 1 to pass sequentially between the test wheel 30 and the lower electrode assembly 50 for testing. Simultaneously with the capacitor testing, foreign objects are continuously discharged between the test shaft 31 and the test wheel 30.

[0046] Reference Figure 6 Specifically, in the foreign object collection stage: the driving device drives the test disk 40 to rotate. The test disk 40 has a receiving hole 41 for loading the chip capacitor 1. The receiving hole 41 on the test disk 40 moves accordingly, transporting the chip capacitor 1 to the top of the lower electrode assembly 50. When the chip capacitor 1 reaches the designated position, its lower end abuts against the upper end of the lower electrode assembly 50. At the same time, the test disk 40 continues to drive the receiving hole 41 to move, so that the chip capacitor 1 passes under the test wheel 30 along the tangential direction of the test wheel 30. When the capacitor passes the test wheel 30, the upper end of the chip capacitor 1 abuts against the outer circumference of the test wheel 30. The upper end of the chip capacitor 1 pushes the test wheel 30 to rotate and lifts the inner circumference of the test wheel 30 to impact the test shaft 31. During the rotation, the test wheel 30 and the test shaft 31 will inevitably collide and rub against each other, thus generating foreign objects. However, since the test shaft 31 mating section 312 is provided with a spiral-shaped chip removal groove 3121, the generated foreign objects fall into the thread groove under the action of impact force and friction force.

[0047] Foreign object directional movement stage: The test wheel 30 rotates at a certain angle with the capacitor, and the inner wall of the test wheel 30 contacts the inclined surface of the chip removal groove 3121 to generate an oblique force, which is decomposed into an axial thrust, pushing the particle to move along the thread groove to one end of the test wheel 30 axially. For example, the particle moves axially by about 0.13 mm each time it rotates.

[0048] Foreign object removal and anti-fallback stage: After 10 consecutive capacitor tests, the particle located at the center of the test wheel 30 moves a total of 1.35 mm, which is half the width of the test wheel 30. It eventually reaches the axial edge of the test wheel 30 and falls naturally along the end of the test wheel 30 into the collection tank at the bottom of the equipment, without falling back into the gap. In this way, the parasitic resistance between the test wheel 30 and the test shaft 31 remains at a low level, ensuring stable operation of the test circuit and accurate measurement of various electrical performance indicators of the chip capacitor 1, such as capacitance, loss tangent, and insulation resistance. The entire testing process is efficient and stable, meeting the requirements for capacitor quality inspection in large-scale production.

[0049] As can be seen from the above specific embodiments, the capacitance testing mechanism of the present invention effectively solves the problem of foreign matter accumulation in traditional mechanisms by setting a spiral chip removal groove 3121 in the mating section 312 of the test shaft 31, thereby improving the accuracy of the test and the service life of the mechanism.

[0050] Therefore, it is understandable that, referring to Figures 1 to 3 as well as Figure 7According to an embodiment of the capacitance testing mechanism of the present invention, firstly, a spiral-shaped chip removal groove 3121 is provided on the outer circumferential surface of the test shaft 31 of the test wheel 30. When the test disk 40 drives the chip capacitor 1 to pass under it along the tangential direction of the test wheel 30, pushing the test wheel 30 to rotate and causing it to collide and rub against the test shaft 31, the generated foreign matter can be promptly contained by the chip removal groove 3121. As the test wheel 30 continues to rotate, the chip removal groove 3121 uses its spiral structure to smoothly discharge the foreign matter, effectively avoiding the accumulation of foreign matter between the inner cylindrical surface of the test wheel 30 and the outer cylindrical surface of the test shaft 31. This improvement solves a series of problems caused by the accumulation of foreign matter in traditional capacitance testing mechanisms, reduces the parasitic resistance between the test wheel 30 and the test shaft 31, ensures the stability of the electrical performance of the test circuit, thereby improving the accuracy of the capacitor electrical performance test, and ensuring that the test instrument 70 measures various electrical performance indicators of the chip capacitor 1 through this test circuit. Secondly, since foreign matter no longer accumulates, the wear between the test wheel 30 and the test shaft 31 is improved, effectively extending the service life of the capacitor testing mechanism, reducing equipment maintenance costs and replacement frequency. The test wheel 30 can make more precise elastic contact with the chip capacitor 1, and the stable contact between the lower electrode assembly 50 and the lower end of the chip capacitor 1 together forms a more reliable test circuit, thereby ensuring the accuracy of the test instrument 70 in measuring various electrical performance indicators of the chip capacitor 1 (such as capacitance, loss tangent, insulation resistance, etc.). In addition, this design has a simple structure, is easy to process, manufacture, install and maintain, and can be directly processed using the existing test shaft 31 without increasing costs excessively, making it highly practical and economical, thus reducing investment costs.

[0051] It is also conceivable that this improvement reduces the parasitic resistance between the test wheel 30 and the test shaft 31, ensuring the stability of the electrical performance of the test circuit and improving the accuracy of capacitor electrical performance testing. Based on this, in the field of testing instruments for surface mount capacitors 1, such as electrical instruments and meters like power load control systems; solar energy flow density and solar concentrator accuracy measurement and analysis instruments; electricity meters and automatic meter reading systems; and fast and accurate portable or vehicle-mounted energy-saving testing equipment, surface mount capacitors 1, tested by the capacitor testing mechanism provided in this embodiment of the invention, possess high accuracy in capacitor electrical performance testing. Therefore, surface mount capacitors 1 can ensure the testing accuracy of these testing instruments.

[0052] Furthermore, referring to Figures 1 to 4In some embodiments of the present invention, the pressure seat 20 is mounted on the base 10 via a fixing frame 80, the test wheel 30 is mounted on the first end 24 of the pressure seat 20, and the second end 25 of the pressure seat 20 is provided with a rotating shaft 23. The second end 25 of the pressure seat 20 is rotatably mounted on the fixing frame 80 via the rotating shaft 23. The first end 24 and the second end 25 of the pressure seat 20 are located at opposite ends of the pressure seat 20, respectively. An elastic element (not shown in the figure) is also provided in the fixing frame 80. One end of the elastic element abuts against the fixing frame 80, and the other end of the elastic element abuts against the top of the first end 24 of the pressure seat 20.

[0053] Specifically, in the capacitance testing mechanism of this embodiment, the pressure seat 20 is mounted on the base 10 via a fixing frame 80. Specifically, the fixing frame 80 can be mounted on the base 10 via a frame (not shown in the figure), providing a stable and reliable support frame for the entire structure. The test wheel 30 is disposed at the first end 24 of the pressure seat 20. The pressure seat 20 has an overall elongated structure with opposing first ends 24 and second ends 25. A rotating shaft 23 is provided at the second end 25 of the pressure seat 20, and this rotating shaft 23 is made of a wear-resistant and rigid material. The second end 25 of the pressure seat 20 is rotatably mounted on the fixing frame 80 via this rotating shaft 23. This rotatable connection allows the pressure seat 20 to swing around the rotating shaft 23 at a certain angle, thereby providing the necessary space for elastic contact between the test wheel 30 and the chip capacitor 1.

[0054] An elastic element is also installed inside the fixing frame 80. This elastic element can be a spring, which has good elasticity and restoring properties. One end of the spring abuts against a pre-set groove or positioning structure inside the fixing frame 80 to ensure its fixed position; the other end of the spring abuts against the top of the first end 24 of the pressure seat 20. When the test disc 40 moves the chip capacitor 1 and contacts the test wheel 30, the chip capacitor 1 applies a certain pressure to the test wheel 30, causing the pressure seat 20 to rotate around the shaft 23. At this time, the spring is compressed. The elastic force of the spring acts as a buffer, ensuring that the contact pressure between the test wheel 30 and the chip capacitor 1 is moderate and stable. Excessive pressure will not damage the chip capacitor 1 or the test wheel 30, nor will insufficient pressure lead to poor contact and affect the accuracy of the test results. After the chip capacitor 1 passes the test wheel 30, the restoring force of the spring will cause the pressure seat 20 to quickly return to its initial position, preparing for the next test and ensuring that the entire capacitor testing mechanism can operate continuously, stably, and efficiently.

[0055] Reference Figures 3 to 6In some embodiments of the present invention, the test shaft 31 has a mating section 312 extending along the axial direction and mounting sections 311 respectively connected to the two axial ends of the mating section 312. The test wheel 30 is sleeved on the mating section 312. The chip removal groove 3121 is opened on the outer peripheral surface of the mating section 312. The pressure seat 20 is provided with a snap-fit ​​groove 21 and a receiving groove 22. The test wheel 30 is disposed in the receiving groove 22. The snap-fit ​​groove 21 is located at both ends of the receiving groove 22. The mounting section 311 is detachably installed in the snap-fit ​​groove 21. The cross-sectional shape of the snap-fit ​​groove 21 is adapted to the cross-sectional shape of the mounting section 311.

[0056] In the capacitance testing mechanism of this embodiment, the test shaft 31 is clearly divided along its axial direction into a mating section 312 and mounting sections 311 respectively connected to both ends of the mating section 312. The mating section 312 is a key part for mounting the test wheel 30; the test wheel 30 is fitted onto the mating section 312, ensuring stable and flexible relative rotation between the two. A chip removal groove 3121 is formed on the outer circumferential surface of the mating section 312. As described in the previous embodiment, it extends spirally along the axial direction of the test shaft 31 to accommodate and remove foreign matter generated between the test wheel 30 and the test shaft 31 due to friction.

[0057] The pressure base 20 supports and secures the test shaft 31 and the test wheel 30, and is also provided with a snap-fit ​​groove 21 and a receiving groove 22. The receiving groove 22 accommodates the test wheel 30, providing a stable mounting space for the test wheel 30 and preventing it from shifting or shaking during operation. The snap-fit ​​grooves 21 are located at both ends of the receiving groove 22, and their function is to cooperate with the mounting section 311 of the test shaft 31. The mounting section 311 is detachably installed in the snap-fit ​​groove 21. This detachable design facilitates the quick and convenient removal of the test shaft 31 from the pressure base 20 when maintenance or replacement of parts is required, improving the maintainability of the equipment.

[0058] To ensure the stability and reliability of the installation, the cross-sectional shape of the locking groove 21 is adapted to the cross-sectional shape of the mounting section 311. For example, if the cross-sectional shape of the mounting section 311 is rectangular, then the cross-section of the locking groove 21 is also designed to be a corresponding rectangle, so that the mounting section 311 can be embedded in the locking groove 21. During the rotation of the test wheel 30 and the operation of the entire mechanism, it will not loosen or fall off due to vibration or external force, thus ensuring the overall structural stability and testing accuracy of the capacitance testing mechanism. In the actual installation process, the test wheel 30 is first fitted onto the mating section 312 of the test shaft 31. Then, the mounting sections 311 at both ends of the test shaft 31 are aligned with the locking groove 21 on the pressure seat 20, and pressure is applied to embed the mounting sections 311 into the locking groove 21 until the mounting sections 311 and the locking groove 21 are fully engaged. At this time, the test wheel 30 is also located in the receiving groove 22 of the pressure seat 20, completing the installation connection between the test shaft 31 and the pressure seat 20.

[0059] This detachable installation method has many advantages. On the one hand, if the test wheel 30 or test shaft 31 wears or is damaged during equipment use, it can be easily and quickly replaced without replacing the entire pressure seat 20, reducing maintenance costs and time. On the other hand, during equipment assembly and debugging, it also allows for more flexible installation and adjustment of components, improving production efficiency. Simultaneously, the tight snap-fit ​​structure ensures the stability of the test shaft 31 during operation, preventing it from loosening due to vibration or other reasons, thus ensuring the continuous and stable operation of the capacitance testing mechanism.

[0060] Furthermore, referring to Figures 4 to 6 In some embodiments of the present invention, the mounting segment 311 is snapped into the snap-fit ​​groove 21, and the cross-sectional shape of the snap-fit ​​groove 21 is adapted to the cross-sectional shape of the mounting segment 311. Multiple contact surfaces exist between the outer surface of the mounting segment 311 and the inner surface of the snap-fit ​​groove 21. The snap-fit ​​groove 21 is disposed on the pressure base 20, and its function is to snap and fix the mounting segment 311 of the test shaft 31, ensuring that the test shaft 31 is accurately and stably positioned on the pressure base 20. The cross-sectional shape of the snap-fit ​​groove 21 is adapted to the cross-sectional shape of the mounting segment 311, which is designed with a rectangular cross-section to meet requirements for structural strength and installation stability. Correspondingly, the cross-section of the snap-fit ​​groove 21 is also designed to be rectangular. During the capacitor test, even if the capacitor passes quickly in the tangential direction of the test wheel 30 and generates an interaction force, the multiple contact surfaces between the locking shaft and the locking groove 21 can effectively disperse the force, reduce the shaking and offset of the test wheel 30, thereby maintaining a stable contact state between the test wheel 30 and the capacitor, avoiding parasitic resistance changes caused by unstable contact, and thus improving the accuracy of capacitor electrical performance measurement, which can more realistically reflect the actual performance of the capacitor.

[0061] It should be noted that the mounting segment 311 and the snap-fit ​​groove 21 are snapped together through contact surfaces. Therefore, the contact surfaces can be continuous curved surfaces, such as elliptical curved surfaces or other irregular curved surfaces, as long as they can achieve a stable snap-fit ​​between the mounting segment 311 and the snap-fit ​​groove 21. In this embodiment, no specific limitation is required. When the mounting segment 311 and the snap-fit ​​groove 21 are snapped together through multiple (e.g., two) contact surfaces, there can be two intersecting contact surfaces. That is, when the snap-fit ​​groove 21 is a V-groove, the two contact surfaces of the mounting segment 311 are two intersecting contact surfaces. Stable snap-fit ​​between the mounting segment 311 and the snap-fit ​​groove 21 can also be achieved through these two intersecting contact surfaces. Of course, in some other embodiments, there can also be three contact surfaces. The cross-section of the contact surface portion of the mounting segment 311 is square, and the corresponding snap-fit ​​groove 21 matches it. Stable snap-fit ​​between the mounting segment 311 and the snap-fit ​​groove 21 can also be achieved through the three square contact surfaces. Therefore, it is understandable that there may be four, five, or even more contact surfaces. In this embodiment, no specific limitation is made, as long as the installation section 311 and the snap-fit ​​groove 21 are relatively fixed.

[0062] Reference Figures 4 to 6 In some embodiments of the present invention, the capacitance testing mechanism further includes an elastic pressure plate 60, one end of which is disposed on the pressure base 20, and the other end of which presses against the mounting section 311 so that the mounting section 311 is engaged in the locking groove 21.

[0063] In the capacitance testing mechanism of this embodiment, the elastic pressure plate 60 is made of a metal material with good elasticity and toughness, such as spring steel. This material can ensure sufficient elasticity while having high fatigue strength, ensuring that it is not easily deformed or damaged during long-term use.

[0064] One end of the elastic pressure plate 60 is fixed to a pre-designed installation position on the pressure base 20 by bolts. This installation position is precisely calculated and laid out to ensure both stable installation of the elastic pressure plate 60 and accurate and reasonable force direction when it exerts its elastic force. When installing the bolts, a torque wrench is used to tighten them to the specified torque value to ensure the bolt connection is secure and to prevent loosening during use. The other end of the elastic pressure plate 60 is designed with a specific shape, such as being bent into an arc shape that fits the outer surface of the mounting section 311, to better press against the mounting section 311. When installing the elastic pressure plate 60, its other end is accurately pressed against the mounting section 311, and the elastic force of the elastic pressure plate 60 itself applies a continuous and stable pressure to the mounting section 311. This pressure allows the mounting section 311 to be more tightly engaged in the locking groove 21, further enhancing the connection stability between the mounting section 311 and the locking groove 21. During actual testing, when the test wheel 30 is subjected to external force, the test shaft 31 may tend to wobble. The pressure provided by the elastic pressure plate 60 can effectively counteract this wobble, preventing the mounting section 311 from dislodging from the locking groove 21. This ensures that the mounting position of the test shaft 31 on the pressure base 20 remains accurate, thereby ensuring the stable operation and testing accuracy of the entire capacitor testing mechanism. Simultaneously, the elastic pressure plate 60 also has a certain buffering effect, reducing damage to the mounting section 311 and locking groove 21 caused by impact during testing, and extending the service life of the components.

[0065] In some embodiments of the present invention, the thread profile of the chip removal groove 3121 is a triangular thread profile, and the thread angle of the triangular thread profile is α (not shown in the figure), where α satisfies: 0° < α < 90°. The chip removal groove 3121 on the mating section 312 of the test shaft 31 adopts a triangular thread profile design. The triangular thread profile has sharp tooth crests and roots, which can better guide and accommodate foreign objects. Specifically, the thread angle can be set to 60°. This angle is determined after comprehensively considering factors such as chip removal efficiency, structural strength of the test shaft 31, and processing difficulty. After multiple experiments, it has been verified that when the thread angle α of the triangular thread profile is 60°, the chip removal groove 3121 has a highly efficient chip removal function. When machining the chip removal groove 3121, a high-precision CNC thread machining machine tool is used. By precisely controlling the feed rate and cutting speed of the tool, it is ensured that the thread angle of each chip removal groove 3121 can strictly reach 60°. This design allows the triangular tooth-shaped chip removal groove 3121 to smoothly guide foreign objects into its interior during testing when they are generated. As the test wheel 30 rotates, the foreign objects are discharged along the spiral direction of the chip removal groove 3121, effectively preventing the accumulation of foreign objects between the test shaft 31 and the test wheel 30, and ensuring the stable operation and testing accuracy of the testing mechanism.

[0066] Furthermore, in some embodiments of the present invention, the tooth depth of the chip removal groove 3121 ranges from 0.15 mm to 0.25 mm to allow foreign objects to be accommodated within it. If the tooth depth is too small, for example, less than 0.15 mm, the accommodating space of the chip removal groove 3121 is insufficient, failing to effectively accommodate foreign objects generated during the testing process. This can lead to blockages within the chip removal groove 3121, or even overflow onto the contact surface between the test shaft 31 and the test wheel 30, affecting testing accuracy and the lifespan of the mechanism. Conversely, if the tooth depth is too large, exceeding 0.25 mm, it weakens the structural strength of the mating section 312 of the test shaft 31. During the rotation of the test wheel 30, the test shaft 31 is prone to deformation or damage due to uneven stress. When machining the chip removal groove 3121, the cutting depth of the tool is precisely controlled to ensure that the tooth depth of each chip removal groove 3121 remains stably within the range of 0.15 mm to 0.25 mm. This design ensures that the chip removal groove 3121 provides sufficient space to accommodate foreign objects while also ensuring that the test shaft 31 has sufficient structural strength, thereby guaranteeing the long-term stable operation of the capacitance testing mechanism.

[0067] Furthermore, in some embodiments of the present invention, reference is made to... Figure 6 The chip removal groove 3121 has at least one spiral turn, and its two ends are respectively connected to the two ends of the mating section 312. In this embodiment, depending on the size of the test shaft 31 and actual testing requirements, the chip removal groove 3121 can also be designed with four spiral turns. This multi-turn design increases the total length and accommodating space of the chip removal groove 3121, improving chip removal efficiency. The chip removal groove 3121's two ends are respectively connected to the two ends of the mating section 312. This design allows foreign objects, regardless of their location on the test shaft 31, to smoothly enter the chip removal groove 3121 and be discharged from one end of the mating section 312 to the other along the spiral direction of the chip removal groove 3121. It is also conceivable that in some embodiments of the present invention, two chip removal grooves 3121 can be provided, namely, a double-threaded spiral chip removal groove 3121. Using two chip removal grooves 3121 can further improve chip removal efficiency.

[0068] Reference Figures 1 to 3 In some embodiments of the present invention, multiple pressure seats 20 and test wheels 30 are provided, and the pressure seats 20 and test wheels 30 are arranged in a one-to-one correspondence. Multiple pressure seats 20 can be arranged in an array on the fixing frame 80 along the length direction of the fixing frame 80, and the chip capacitors 1 are arranged and loaded in the test disk 40 along the arrangement direction of the pressure seats 20.

[0069] To meet the needs of large-scale, high-efficiency testing of surface mount capacitors 1, multiple pressure holders 20 and test rollers 30 are provided, and a one-to-one correspondence is adopted between the pressure holders 20 and the test rollers 30. Specifically, according to the requirements of production scale and testing efficiency, multiple pressure holders 20 and multiple test rollers 30 are provided in this embodiment. Each pressure holder 20 corresponds precisely to one test roller 30, ensuring that during the testing process, each test roller 30 can accurately test the surface mount capacitor 1 under the stable support and cooperation of the corresponding pressure holder 20.

[0070] Multiple pressure holders 20 are arranged in a straight line on the mounting frame 80. This arrangement not only facilitates the structural design and layout of the mounting frame 80 but also makes the entire testing mechanism more compact and organized. Receiving holes 41 are arranged along the direction of the pressure holders 20. The function of the receiving holes 41 is to place the surface-mount capacitor 1 to be tested. Receiving holes 41 are made on the mounting frame 80 corresponding to the position below each pressure holder 20, arranged in the same manner. Simultaneously, the spacing between the receiving holes 41 is consistent with the spacing between the pressure holders 20, ensuring that each test wheel 30 accurately corresponds to the surface-mount capacitor 1 in the receiving hole 41 below, achieving one-to-one precise testing. This arrangement of multiple pressure holders 20 and test wheels 30, along with the corresponding arrangement of the receiving holes 41, greatly improves the working efficiency of the capacitor testing mechanism, enabling simultaneous testing of multiple surface-mount capacitors 1, meeting the needs of large-scale production.

[0071] Specifically, if the test disk 40 rotates, the receiving holes 41 are evenly spaced along the circumference of the test disk 40. This design ensures that during the rotation of the test disk 40, each receiving hole 41 passes through a specific test position of the lower electrode assembly 50 in sequence, guaranteeing that each surface-mount capacitor 1 placed in the receiving hole 41 is tested. If the test disk 40 slides linearly, the receiving holes 41 are arranged at equal intervals along the linear sliding direction of the test disk 40. This spaced arrangement not only makes full use of the space of the test disk 40 and improves testing efficiency, but also ensures that the surface-mount capacitors 1 do not interfere with each other during testing, ensuring that each capacitor can be tested in an independent and stable environment, thereby improving the accuracy and reliability of the test results.

[0072] The capacitance testing and sorting device (not shown in the figure) according to a second aspect of the present invention includes a capacitance testing mechanism according to the first aspect of the present invention described above.

[0073] In the specific implementation of this capacitor testing and sorting equipment, the overall capacitor testing and sorting equipment has a frame structure. The base 10 is made of high-strength and high-rigidity metal materials, such as aluminum alloy. After precision processing and assembly, it ensures that the equipment has sufficient stability and shock resistance during operation, and can withstand various forces generated during the test, avoiding the impact of vibration or shaking on the test accuracy.

[0074] The equipment contains multiple capacitance testing mechanisms, as described above, arranged neatly on the base 10 in a specific pattern. For control, it is equipped with an advanced automated control system. This system uses a programmable logic controller (PLC) as the core control unit, and through pre-programmed instructions, it can precisely control the operating parameters of each capacitance testing mechanism, such as the rotation speed of the test wheel 30 and the downward pressure of the pressure seat 20. Simultaneously, the control system communicates with a host computer, allowing operators to easily set test parameters, monitor the testing process, and obtain test results through the host computer interface.

[0075] To achieve automatic sorting of the surface mount capacitors 1, the equipment is also equipped with a sorting device. This sorting device works closely with the capacitor testing mechanism. After the capacitor testing mechanism completes the electrical performance test of the surface mount capacitors 1, it transmits the test data to the control system in real time. The control system judges the test results according to preset sorting criteria, such as capacitance range and loss tangent, and issues instructions to the sorting device. Following these instructions, the sorting device uses a robotic arm or pneumatic device to place surface mount capacitors 1 with different performance characteristics into different collection containers, achieving automatic sorting.

[0076] In addition, the equipment is equipped with comprehensive fault diagnosis and alarm functions. During equipment operation, the control system monitors the operating status of each component in real time, such as motor temperature and sensor signals. Once an abnormality is detected, such as motor overheating or abnormal sensor signals, the control system will immediately issue an alarm signal and display the fault information on the host computer interface, facilitating timely troubleshooting and repair by operators to ensure the normal operation of the equipment. The capacitor testing mechanism applied to the capacitor testing and sorting equipment gives the equipment advantages such as high efficiency, accuracy, and a high degree of automation, meeting the needs of large-scale surface mount capacitor production and testing.

[0077] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] Of course, the present invention is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A capacitance testing mechanism, characterized in that, include: A base, wherein a lower electrode assembly is provided; A test tray, which is movably disposed on the base, is used to load surface mount capacitors, and the lower electrode assembly is located below the test tray; as well as The test wheel is mounted on the base via a pressure seat and located above the test disk. The test wheel is rotatably mounted on the pressure seat via a test shaft and is rotatably sleeved on the outer periphery of the test shaft. A chip removal groove is formed on the outer periphery of the test shaft, and the chip removal groove extends spirally along the axial direction of the test shaft. The test wheel and the lower electrode assembly are positioned vertically relative to each other on the test disk. The test disk can drive the chip capacitor to pass between the test wheel and the lower electrode assembly. When the chip capacitor passes between the test wheel and the lower electrode assembly, the upper end face of the chip capacitor abuts against the outer peripheral surface of the test wheel and the lower end face of the chip capacitor abuts against the upper end face of the lower electrode assembly, thereby driving the test wheel to rotate relative to the test shaft. The chip removal groove is configured to accommodate foreign objects between the test wheel and the test shaft. The test wheel is configured to drive the foreign objects between the test wheel and the test shaft to be conveyed along the extension direction of the chip removal groove and discharged from the shaft end of the test shaft. The pressure seat is mounted on the base via a fixing frame. The test wheel is located at the first end of the pressure seat, and a rotating shaft is provided at the second end of the pressure seat. The second end of the pressure seat is rotatably mounted on the fixing frame via the rotating shaft. The first end and the second end of the pressure seat are located at opposite ends of the pressure seat. An elastic element is also provided in the fixing frame. One end of the elastic element abuts against the fixing frame, and the other end of the elastic element abuts against the top of the first end of the pressure seat. The test shaft has a mating section extending along the axial direction and mounting sections connected to the axial ends of the mating section. The test wheel is sleeved on the mating section. The chip removal groove is opened on the outer peripheral surface of the mating section. The pressure seat is provided with a snap-fit ​​groove and a receiving groove. The test wheel is located in the receiving groove. The snap-fit ​​groove is located at both ends of the receiving groove. The mounting section is detachably mounted in the snap-fit ​​groove. The cross-sectional shape of the snap-fit ​​groove is adapted to the cross-sectional shape of the mounting section.

2. The capacitance testing mechanism according to claim 1, characterized in that, The mounting section is snapped into the snap-fit ​​groove, and the outer surface of the mounting section has multiple contact surfaces with the inner surface of the snap-fit ​​groove.

3. The capacitance testing mechanism according to claim 1, characterized in that, It also includes an elastic pressure plate, one end of which is disposed on the pressure base, and the other end of which presses against the mounting section so that the mounting section is engaged in the engagement groove.

4. The capacitance testing mechanism according to claim 1, characterized in that, The chip removal groove has a triangular thread profile, and the thread angle of the triangular thread profile is α, where α satisfies: 0° < α < 90°.

5. The capacitance testing mechanism according to claim 4, characterized in that, The depth of the chip removal groove ranges from 0.15 mm to 0.25 mm to allow foreign objects to be accommodated within it.

6. The capacitance testing mechanism according to claim 5, characterized in that, The chip removal groove has at least one spiral turn, and the two ends of the chip removal groove are respectively connected to the two ends of the mating section.

7. The capacitance testing mechanism according to claim 1, characterized in that, Multiple pressure seats and test wheels are provided, with each pressure seat and test wheel corresponding to the other. Multiple pressure seats can be arrayed in the fixing frame along the length direction of the fixing frame, and the surface mount capacitors are arranged and loaded in the test tray along the arrangement direction of the pressure seats.

8. A capacitance testing and sorting device, characterized in that, Includes the capacitance testing mechanism as described in any one of claims 1 to 7.

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