Potting module capacitor and preparation method thereof

Abstract

The invention discloses a potting module capacitor and a preparation method thereof. The potting module capacitor comprises a shell, a potting layer and a capacitor body, the shell is provided with a fixing cavity for fixing the capacitor body; the encapsulation layer is filled in the fixing cavity to fix the capacitor body; the capacitor body is arranged in the fixed cavity and comprises two leading-out end frames which are oppositely arranged, a plurality of capacitor chip modules which are arranged between the two leading-out end frames at intervals and a plurality of connecting frames which are respectively arranged on two adjacent capacitor chip modules; the connecting frame comprises a connecting frame body, a plurality of first welding pins arranged on one side of the connecting frame body at intervals and a plurality of second welding pins arranged on the other side of the connecting frame body at intervals, and the first welding pins and the second welding pins are sequentially and alternately arranged; through the arrangement of the connecting frame and the leading-out end frame, the endurance capability of the prepared capacitor under high-voltage and complex working conditions can be improved, and the capacitor has higher reliability in a special working environment.

Description

Technical Field

[0001] This invention belongs to the field of capacitor manufacturing, specifically relating to a potted module capacitor and its manufacturing method. Background Technology

[0002] Encapsulation is the process of mechanically or manually injecting a liquid compound into a device containing electronic components and circuitry, which then cures at room temperature or under heating conditions to form a high-performance thermosetting polymer insulating material. Encapsulation can enhance the overall integrity of electronic devices, improve their resistance to external impacts and vibrations; improve the insulation between internal components and circuitry, which is beneficial for device miniaturization and weight reduction; avoid direct exposure of components and circuitry, improve the device's waterproof and moisture-proof performance, and enhance its performance and stability parameters.

[0003] Existing potted capacitors suffer from reduced reliability and stability during use due to structural limitations, making them unsuitable for high-voltage and complex operating conditions and requiring further improvement. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a potted module capacitor and its preparation method.

[0005] The present invention adopts the following technical solution: A potted module capacitor includes a housing, a potting layer, and a capacitor body; The outer casing has a fixing cavity for fixing the capacitor body; Encapsulation layer, filling the fixing cavity to fix the capacitor body; The capacitor body is disposed in a fixed cavity and includes two lead-out frames arranged opposite each other, multiple capacitor chip modules spaced apart between the two lead-out frames, and multiple connecting frames respectively disposed in two adjacent capacitor chip modules. The two adjacent capacitor chip modules are arranged alternately. Each capacitor chip module includes multiple capacitor chips arranged in sequence. The upper end of the lead-out frame is supported on the outer shell. The connection frame includes a connection frame body, a plurality of first welding pins spaced apart on one side of the connection frame body, and a plurality of second welding pins spaced apart on the other side of the connection frame body. The plurality of first welding pins and the plurality of second welding pins are alternately arranged in sequence, and the plurality of capacitor chips are respectively connected to the plurality of first welding pins or the plurality of second welding pins.

[0006] Furthermore, the first welding pin includes a first extension section arranged perpendicularly to the upper end of the connecting frame body and a first welding section extending downwardly connected to the first extension section, and the second welding pin includes a second extension section arranged perpendicularly to the lower end of the connecting frame body and a second welding section extending upwardly connected to the second extension section, and the capacitor chip is connected to the opposite first welding section or second welding section.

[0007] Furthermore, the connecting frame body is provided with a plurality of first clearance holes that are respectively opposite to a plurality of first welding segments and a plurality of second welding segments.

[0008] Furthermore, the lead-out frame includes a lead-out frame body, connection pins arranged vertically to the upper end of the lead-out frame body, and a plurality of frame pins spaced apart on one side of the lead-out frame body, wherein the plurality of frame pins are one-to-one with a plurality of capacitor chips of a relative capacitor chip module.

[0009] Furthermore, the frame pin includes a horizontal segment connected to the lead-out frame body and a connecting segment that extends upward or downward connected to the horizontal segment.

[0010] Furthermore, the connection pin is provided with multiple connection holes.

[0011] A method for manufacturing a potted module capacitor includes the following steps: Step 1: Place multiple capacitor chips, multiple connection frames, and two lead-out frame frames into the welding fixture according to their structural composition; Step 2: Place a first PTFE block between the multiple first welding pins and the connecting frame body and between the multiple second welding pins and the connecting frame body, and place a second PTFE block between the lead-out end frame and the welding fixture. Step 3: Close the welding fixture and place it in the welding equipment to weld it into shape. After welding, first remove the welding fixture, and then remove the second PTFE block and the first PTFE block respectively to obtain the capacitor body. Step 4: Place the capacitor body into the fixed cavity so that the upper end of the lead frame is supported on the outer shell, then pour in potting compound and cure to form the potted module capacitor.

[0012] Furthermore, the welding fixture includes a first welding seat, a second welding seat, and a fixing member; The first welding base includes a first welding base body and a plurality of first positioning blocks spaced apart on the first welding base body for fixing a plurality of capacitor chip modules respectively. The second welding base is supported on the first welding base and includes a second welding base body supported on multiple capacitor chip modules and multiple second positioning blocks spaced apart on the second welding base body. The multiple second positioning blocks correspond one-to-one with the multiple first positioning blocks. The capacitor chip modules are fixed between the upper and lower opposing first positioning blocks and second positioning blocks. The fastener locks the second welding seat onto the first welding seat.

[0013] Furthermore, the first positioning block includes a first positioning plate supported at the bottom of the first welding base body and a plurality of first positioning parts spaced apart on the first positioning plate. The first welding base body is provided with a plurality of first through holes through which the plurality of first positioning parts pass. The lower end of the capacitor chip is positioned between two adjacent first positioning parts. The second positioning block includes a second positioning plate supported at the top of the second welding base body and a plurality of second positioning parts spaced apart on the second positioning plate. The second welding base body is provided with a plurality of second through holes through which the plurality of second positioning parts pass. The upper end of the capacitor chip is positioned between two adjacent second positioning parts.

[0014] Furthermore, the fastener includes a plurality of first fixing holes disposed on the first welding base body, a plurality of second fixing holes disposed on the second welding base body opposite to the plurality of first fixing holes, a plurality of fixing magnets disposed in the plurality of first fixing holes, a plurality of first fixing bolts passing through the second fixing holes and cooperating with the corresponding fixing magnets, a plurality of fixing blocks disposed on the second welding base body, and a plurality of second fixing bolts fixing the plurality of fixing blocks to the corresponding connecting pins respectively. One end of the fixing block is connected to the second welding base body, and the other end is supported on the top of the lead-out end frame.

[0015] As can be seen from the above description of the present invention, compared with the prior art, the beneficial effects of the present invention are as follows: The present application defines the structure of the potted module capacitor, sets a connection frame between two adjacent capacitor chip modules, and further defines the structure of the connection frame. By setting multiple first welding pins and second welding pins with staggered design, the space utilization is maximized. Moreover, the set connection frame and lead-out frame can withstand the strain during the operation of the capacitor, reduce the transmitted stress at the end of the capacitor chip, and have a better electric field distribution. This avoids weak insulation in local design, reduces the hidden danger of discharge at the electric field concentration point, and improves its tolerance to high voltage and complex working conditions, so that the capacitor has higher reliability in special working environments. The structure of the welding fixture is further defined by the cooperation of the first welding seat and the second welding seat to ensure the positioning accuracy between the two lead-out frames, multiple connecting frames and multiple capacitor chip modules, thereby ensuring the welding quality of the capacitor body. At the same time, when the welding fixture is assembled with the capacitor body, a first PTFE block is embedded between the connecting frames or lead-out frames to avoid deformation of the connecting frames or lead-out frames caused by the extrusion stress on both sides during welding. A second PTFE block is embedded between the lead-out frames and the first welding seat body to play a buffering role and prevent the capacitor chip from cracking due to the rigid fixation of the positioning bolts. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a potted module capacitor; Figure 2This is a partial structural exploded view of a potted module capacitor. Figure 3 This is a structural exploded view of the capacitor body; Figure 4 This is a schematic diagram of the lead-out end frame; Figure 5 This is a structural diagram of the connecting frame; Figure 6 This is a schematic diagram of the welding fixture. Figure 7 Schematic diagram of the structure of the welding fixture Figure 1 ; Figure 8 Schematic diagram of the structure of the welding fixture Figure 2 ; Figure 9 This is a schematic diagram of the structure of the second positioning block; In the diagram, 1. Outer shell; 2. Encapsulation layer; 3. Capacitor body; 4. First welding seat; 5. Second welding seat; 6. Fixing component; 7. Demolding bolt; 8. First PTFE block; 9. Second PTFE block; 11. Fixing cavity; 31. Lead-out frame; 311. Lead-out frame body; 312. Connecting pin; 313. Frame pin; 314. Connecting hole; 315. Horizontal section; 316. Connecting section; 317. Second clearance hole; 32. Capacitor chip module; 321. Capacitor chip; 33. Connecting frame; 331. Connecting frame body; 332. First welding pin; 333. Second welding pin; 334. First clearance hole; 335. First extension section. 336. First welding section; 337. Second extension section; 338. Second welding section; 41. First welding seat body; 42. First positioning block; 43. First positioning plate; 44. First positioning part; 45. First through hole; 46. First demolding screw hole; 47. Support part; 48. Positioning bolt; 49. Positioning screw hole; 51. Second welding seat body; 52. Second positioning block; 53. Second positioning plate; 54. Second positioning part; 55. Second through hole; 56. Second demolding screw hole; 61. First fixing hole; 62. Second fixing hole; 63. Fixing magnet; 64. First fixing bolt; 65. Fixing block; 66. Second fixing bolt; 67. Third fixing hole. Detailed Implementation

[0017] The present invention will be further described below through specific embodiments.

[0018] Reference Figures 1 to 5 As shown, a potted module capacitor includes a housing 1, a potting layer 2, and a capacitor body 3; wherein, the housing 1 is provided with a fixing cavity 11 for fixing the capacitor body 3; the potting layer 2 fills the fixing cavity 11 to fix the capacitor body 3.

[0019] The capacitor body 3 is fixed in the fixed cavity 11 by the potting layer 2. It includes two lead-out frames 31 arranged opposite each other, a plurality of capacitor chip modules 32 spaced apart between the two lead-out frames 31, and a plurality of connecting frames 33 respectively arranged in two adjacent capacitor chip modules 32. The two adjacent capacitor chip modules 32 are arranged alternately, and the capacitor chip module 32 includes a plurality of capacitor chips 321 arranged in sequence.

[0020] The lead-out frame 31 includes a lead-out frame body 311, connection pins 312 arranged vertically to the upper end of the lead-out frame body 311, a plurality of frame pins 313 spaced apart on one side of the lead-out frame body 311, and a plurality of connection holes 314 spaced apart on the connection pins 312. The connection pins 312 are supported on the housing 1, the plurality of connection holes 314 are used for connection to the adapter base of the capacitor, and the plurality of frame pins 313 are one-to-one with the plurality of capacitor chips 321 of the capacitor chip module 32. Specifically, the lead-out frame body 311 is provided with a plurality of second clearance holes 317 corresponding to the plurality of frame pins 313. Further, the frame pins 313 include a horizontal segment 315 connected to the lead-out frame body 311 and a connecting segment 316 extending upward or downward connected to the horizontal segment 315. The connecting segment 316 is soldered to the end of the capacitor chip 321.

[0021] The connecting frame 33 includes a connecting frame body 331, a plurality of first welding pins 332 spaced apart on one side of the connecting frame body 331, and a plurality of second welding pins 333 spaced apart on the other side of the connecting frame body 331. The plurality of first welding pins 332 and the plurality of second welding pins 333 are alternately arranged sequentially, and a plurality of capacitor chips 321 are respectively connected to the corresponding plurality of first welding pins 332 or the plurality of second welding pins 333. Specifically, the connecting frame body 331 is provided with a plurality of first clearance holes 334 spaced apart, each corresponding to one of the first welding pins 332 and the other to one of the second welding pins 333. The cooperation between the first clearance holes 334 and the corresponding first welding pins 332 or second welding pins 333 effectively buffers the expansion stress borne by the capacitor, preventing the capacitor from cracking. Furthermore, the plurality of first welding pins 332 and the plurality of second welding pins 333 are integrally formed with the connecting frame body 331.

[0022] The first solder pin 332 includes a first extension 335 arranged perpendicularly to the upper end of the connecting frame body 331 and a first soldering section 336 extending downwardly connected to the first extension 335; the second solder pin 333 includes a second extension 337 arranged perpendicularly to the lower end of the connecting frame body 331 and a second soldering section 338 extending upwardly connected to the second extension 337, wherein the end of the capacitor chip 321 is connected to the opposite first soldering section 336 or second soldering section 338; during fabrication, the two ends of the capacitor chip 321 are respectively connected to the two opposite first soldering pins 332 or two opposite second soldering pins 333 or the first soldering pin 332 and the frame via solder. The frame pin 313 or the second welding pin 333 is welded to the frame pin 313. By defining the structural composition of the connecting frame 33, and by setting multiple first welding pins 332 and second welding pins 333 in a staggered design, the space utilization is maximized. The connecting frame 33 and the lead-out frame 31 can withstand the strain during the operation of the capacitor, reduce the stress transmitted at the end of the capacitor chip 321, and have a better electric field distribution. This avoids weak insulation in local design, reduces the risk of discharge at the electric field concentration point, and improves its tolerance to high voltage and complex working conditions, making the capacitor more reliable in special working environments.

[0023] The potted module capacitor is formed by welding using a welding fixture, wherein, as referenced Figures 6 to 9 As shown, the welding fixture includes a first welding seat 4, a second welding seat 5, a fixing member 6, and two demolding bolts 7.

[0024] The first welding base 4 includes a first welding base body 41 and a plurality of first positioning blocks 42 spaced apart on the first welding base body 41 for fixing a plurality of capacitor chip modules 32. Specifically, the first positioning block 42 includes a first positioning plate 43 supported at the bottom of the first welding base body 41 and a plurality of first positioning parts 44 spaced apart on the first positioning plate 43. The first welding base body 41 is provided with a plurality of first through holes 45 for the plurality of first positioning parts 44 to pass through. The lower end of the capacitor chip 321 is positioned between two adjacent first positioning parts 44. Further, the first positioning block 42 is provided with a first demolding screw hole 46 that cooperates with two demolding bolts 7. When the capacitor body 3 is welded, the demolding bolts 7 cooperate with the corresponding first demolding screw hole 46, so that the first positioning block 42 that is stuck to the solder moves away from the first welding base body 41, thereby demolding.

[0025] The first welding base body 41 is provided with two support parts 47 arranged opposite to each other, and the connecting pins 312 of the two lead-out end frames 31 are supported on the opposite support parts 47; wherein, the support parts 47 are provided with positioning bolts 48 for positioning the opposite lead-out end frame body 311, and the support parts 47 are provided with positioning screw holes 49 that cooperate with the positioning bolts 48.

[0026] The second welding base 5, supported on the first welding base 4, includes a second welding base body 51 supported on multiple capacitor chip modules 32 and multiple second positioning blocks 52 spaced apart on the second welding base body 51. Specifically, each second positioning block 52 includes a second positioning plate 53 supported on the top of the second welding base body 51 and multiple second positioning portions 54 spaced apart on the second positioning plate 53. The second welding base body 51 is provided with multiple second through holes 55 for the multiple second positioning portions 54 to pass through. The upper ends of the capacitor chips 321 are positioned on two adjacent second positioning portions. Between 54; furthermore, the second positioning block 53 is provided with two second demolding screw holes 56 that cooperate with the two demolding bolts 7. After the capacitor body 3 is welded, the demolding bolts 7 cooperate with the corresponding second demolding screw holes 56, so that the second positioning plate 52, which is stuck to the solder, moves away from the second welding seat body 51, thereby realizing demolding; by limiting the detachable setting of the first positioning block 42 and the second positioning block 52, it is convenient to demold the welded capacitor body 3, thereby protecting the capacitor chip 321 end from uneven force caused by overall demolding and preventing damage to the capacitor body 3.

[0027] The fastener 6, which locks the second welding seat 5 onto the first welding seat 4, includes multiple first fixing holes 61 on the first welding seat body 41, multiple second fixing holes 62 on the second welding seat body 51 opposite to the multiple first fixing holes 61, multiple fixing magnets 63 in the multiple first fixing holes 61, multiple first fixing bolts 64 passing through the second fixing holes 62 and engaging with the corresponding fixing magnets 63, multiple fixing blocks 65 on the second welding seat body 51, and multiple second fixing bolts 66 fixing the multiple fixing blocks 65 to the corresponding connecting pins 312. Each fixing block 65 has a third fixing hole 67 opposite to the connecting hole 314 on the corresponding connecting pin 312. The second fixing bolts 66 pass through the third fixing hole 67 and are embedded in the corresponding connecting hole 314 to fix the lead-out frame 31. Specifically, four fixing blocks 65 are provided, arranged in a matrix on the second welding seat body 51, and integrally formed with the second welding seat body 51.

[0028] A method for preparing a potted module capacitor specifically includes the following steps: Step 1: Support multiple first positioning blocks 42 at the bottom of the first welding base body 41, so that the first positioning part 44 passes through the opposite first through hole 45. Then, place multiple capacitor chips 321, multiple connecting frames 33 and two lead-out frame 31 into the first welding base 4 according to the structural composition, so that the lower end of the capacitor chip 321 is positioned between the two first positioning parts 44, the two lead-out frame 31 is supported on the two support parts 47 respectively, and the multiple connecting frames 33 are supported between two adjacent capacitor chip modules 32 respectively. Among them, the two ends of the capacitor chip 321 are respectively connected to the opposite two first welding pins 332 or two second welding pins 333 or the first welding pins 332 and the frame pins 313 or the second welding pins 333 and the frame pins 313 via solder. Step 2: Place a first PTFE block 8 between multiple first welding pins 332 and the connecting frame body 331, between multiple second welding pins 333 and the connecting frame body 331, and between multiple frame pins 313 and the lead-out frame body 311, and place a second PTFE block 9 between the lead-out frame 31 and the support part 47. Step 3: Support the second welding base body 51 on multiple capacitor chip modules 32, and then support multiple second positioning blocks 52 on the second welding base body 51 so that the second positioning part 54 is embedded in the corresponding second through hole 55. At this time, the upper end of the capacitor chip 321 is positioned between two adjacent second positioning parts 54. Then, through the cooperation of the first fixing bolt 64 and the fixing magnet 63, the mold closing of the first welding base 4 and the second welding base 5 is completed. Step 4: Insert the second fixing bolt 66 into the third fixing hole 67, and fine-tune the lead-out end frame 31 so that the second fixing bolt 66 is embedded in the corresponding connecting hole 314. Then, through the cooperation of the positioning bolt 48 and the positioning screw hole 49, the second PTFE block 9 positions the corresponding lead-out end frame 31 and provides a small amount of clamping stress. Next, transfer the welding fixture to the welding table of the welding equipment, and complete the welding of the capacitor body 3 according to the preset welding program. Step 5: After welding and forming, first demold multiple second positioning blocks 52 in sequence, then demold the second welding seat 5, the first welding seat 4, the first PTFE block 8 and the second PTFE block 9 to obtain the capacitor body 3. Step 6: Place the capacitor body 3 into the fixed cavity 11, so that the connection pins 312 of the lead frame 31 are supported on the outer shell 1, and then pour in potting compound to cure and form a potted module capacitor.

[0029] This application defines the structure of the encapsulated module capacitor by setting a connecting frame 33 between two adjacent capacitor chip modules 32, and further defines the structure of the connecting frame 33. Through the staggered design of multiple first welding pins 332 and second welding pins 333, space utilization is maximized. Furthermore, the connecting frame 33 and the lead-out frame 31 can withstand strain during capacitor operation, reducing the transmitted stress at the capacitor chip 321 ends. Simultaneously, it provides better electric field distribution, avoids weak insulation in localized designs, reduces the risk of discharge at electric field concentration points, and improves its withstand capability under high voltage and complex operating conditions. This results in higher performance of the capacitor under special operating environments. The reliability is further defined by the structure of the welding fixture, which is formed by the cooperation of the first welding seat 4 and the second welding seat 5 to ensure the positioning accuracy between the two lead-out frames 31, the multiple connecting frames 33 and the multiple capacitor chip modules 32, thereby ensuring the welding quality of the capacitor body 3. At the same time, when the welding fixture is assembled with the capacitor body 3, a first PTFE block 8 is embedded between the connecting frames 33 or the lead-out frames 31 to avoid deformation of the connecting frames 33 or the lead-out frames 31 caused by the extrusion stress on both sides during welding. A second PTFE block 9 is embedded between the lead-out frames 31 and the first welding seat body 41 to play a buffering role and prevent the capacitor chip 321 from cracking due to the rigid fixation of the positioning bolts 48.

[0030] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made in accordance with the scope of the present invention and the contents of the specification should still fall within the scope of the present invention.

Claims

1. A potted module capacitor, characterized in that: Includes the casing, potting layer, and capacitor body; The outer casing has a fixing cavity for fixing the capacitor body; Encapsulation layer, filling the fixing cavity to fix the capacitor body; The capacitor body is disposed in a fixed cavity and includes two lead-out frames arranged opposite each other, multiple capacitor chip modules spaced apart between the two lead-out frames, and multiple connecting frames respectively disposed in two adjacent capacitor chip modules. The two adjacent capacitor chip modules are arranged alternately. Each capacitor chip module includes multiple capacitor chips arranged in sequence. The upper end of the lead-out frame is supported on the outer shell. The connection frame includes a connection frame body, a plurality of first welding pins spaced apart on one side of the connection frame body, and a plurality of second welding pins spaced apart on the other side of the connection frame body. The plurality of first welding pins and the plurality of second welding pins are alternately arranged in sequence, and the plurality of capacitor chips are respectively connected to the plurality of first welding pins or the plurality of second welding pins.

2. The potted module capacitor according to claim 1, characterized in that: The first welding pin includes a first extension section arranged perpendicularly to the upper end of the connecting frame body and a first welding section extending downwardly connected to the first extension section. The second welding pin includes a second extension section arranged perpendicularly to the lower end of the connecting frame body and a second welding section extending upwardly connected to the second extension section. The capacitor chip is connected to the opposite first welding section or second welding section.

3. A potted module capacitor according to claim 2, characterized in that: The connecting frame body is provided with a plurality of first clearance holes at intervals, which are respectively opposite to a plurality of first welding segments and a plurality of second welding segments.

4. A potted module capacitor according to claim 1, characterized in that: The lead-out frame includes a lead-out frame body, connection pins arranged vertically to the upper end of the lead-out frame body, and multiple frame pins spaced apart on one side of the lead-out frame body. Each of the multiple frame pins is opposite to a multiple capacitor chip of the relative capacitor chip module.

5. A potted module capacitor according to claim 4, characterized in that: The frame pin includes a horizontal segment connected to the lead-out frame body and a connecting segment that extends upward or downward connected to the horizontal segment.

6. A potted module capacitor according to claim 4, characterized in that: The connection pin has multiple connection holes.

7. The method for preparing a potted module capacitor according to claim 1, characterized in that: Includes the following steps: Step 1: Place multiple capacitor chips, multiple connection frames, and two lead-out frame frames into the welding fixture according to their structural composition; Step 2: Place a first PTFE block between the multiple first welding pins and the connecting frame body and between the multiple second welding pins and the connecting frame body, and place a second PTFE block between the lead-out end frame and the welding fixture. Step 3: Close the welding fixture and place it in the welding equipment to weld it into shape. After welding, first remove the welding fixture, and then remove the second PTFE block and the first PTFE block respectively to obtain the capacitor body. Step 4: Place the capacitor body into the fixed cavity so that the upper end of the lead frame is supported on the outer shell, then pour in potting compound and cure to form the potted module capacitor.

8. The method for preparing a potted module capacitor according to claim 7, characterized in that: The welding fixture includes a first welding seat, a second welding seat, and a fixing component; The first welding base includes a first welding base body and a plurality of first positioning blocks spaced apart on the first welding base body for fixing a plurality of capacitor chip modules respectively. The second welding base is supported on the first welding base and includes a second welding base body supported on multiple capacitor chip modules and multiple second positioning blocks spaced apart on the second welding base body. The multiple second positioning blocks correspond one-to-one with the multiple first positioning blocks. The capacitor chip modules are fixed between the upper and lower opposing first positioning blocks and second positioning blocks. The fastener locks the second welding seat onto the first welding seat.

9. The method for preparing a potted module capacitor according to claim 8, characterized in that: The first positioning block includes a first positioning plate supported at the bottom of the first welding base body and a plurality of first positioning parts spaced apart on the first positioning plate. The first welding base body is provided with a plurality of first through holes through which the plurality of first positioning parts pass. The lower end of the capacitor chip is positioned between two adjacent first positioning parts. The second positioning block includes a second positioning plate supported at the top of the second welding base body and a plurality of second positioning parts spaced apart on the second positioning plate. The second welding base body is provided with a plurality of second through holes through which the plurality of second positioning parts pass. The upper end of the capacitor chip is positioned between two adjacent second positioning parts.

10. The method for preparing a potted module capacitor according to claim 8, characterized in that: The fastener includes a plurality of first fixing holes on the first welding base body, a plurality of second fixing holes on the second welding base body opposite to the plurality of first fixing holes, a plurality of fixing magnets disposed in the plurality of first fixing holes, a plurality of first fixing bolts passing through the second fixing holes and cooperating with the corresponding fixing magnets, a plurality of fixing blocks disposed on the second welding base body, and a plurality of second fixing bolts fixing the plurality of fixing blocks to the corresponding connecting pins respectively. One end of the fixing block is connected to the second welding base body, and the other end is supported on the top of the lead-out end frame.

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