Overheat protection system, control method, electronic equipment, storage medium and computer program product

Abstract

The invention discloses an overheating protection system, a control method, electronic equipment, a storage medium and a computer program product, and relates to the technical field of circuits, and comprehensive real-time monitoring of temperature is realized through temperature characteristics of a thermistor; the overheating protection system comprises a thermistor array and a monitoring circuit module. The thermistor array comprises a plurality of thermistor modules, and the plurality of thermistor modules are distributed on the plurality of blocks of the mainboard; the thermistor module comprises a resistor element and a thermistor unit; the resistor element and the thermistor unit are connected in series between a power supply end and a grounding end; a connection point between the resistor element and the thermistor unit is used as a voltage monitoring node; the monitoring circuit module comprises a plurality of monitoring circuits, and each monitoring circuit corresponds to one thermistor module; the monitoring circuit module is configured to send out a first control signal when the voltage at the voltage monitoring node is greater than the reference voltage, and the first control signal is used for controlling the electronic components in the block to be powered off.

Description

Technical Field

[0001] This application relates to the field of circuit technology, and in particular to an overheat protection system, control method, electronic device, storage medium, and computer program product. Background Technology

[0002] With the rapid development of big data, cloud computing, and artificial intelligence technologies, the demand for server computing power and data processing is increasing daily across all industries. This places extremely high demands on the long-term operational stability and reliability of servers. The server motherboard, as a core component, contains a large number of densely integrated electronic components. In complex working environments, the motherboard may experience partial short circuits due to component aging, foreign object intrusion, or design flaws, or heat buildup due to poor heat dissipation. If these short circuits or overheating problems are not detected and addressed in a timely manner, they can lead to minor issues such as performance degradation and shortened lifespan of electronic components, or even serious accidents such as board burnout, resulting in permanent equipment damage and loss of critical data, causing huge economic losses.

[0003] In current technological practices, server motherboards commonly employ a temperature control and protection scheme using a Baseboard Management Controller (BMC) and a Complex Programmable Logic Device (CPLD). Typically, only a limited number of temperature sensors are deployed in a few areas on the motherboard. The primary function of these sensors is to collect ambient temperature data and report it to the BMC. However, this solution suffers from insufficient monitoring coverage. The deployment strategy of temperature sensors usually focuses only on a few core or high-power areas, resulting in large areas of the motherboard's edges, the vicinity of various interface circuits, and other potential hotspots remaining in monitoring blind spots. This prevents comprehensive, all-around monitoring of the board's temperature. Furthermore, the protection mechanism suffers from poor real-time performance; the entire protection process is lengthy and involves multiple layers of logic devices and information transmission, leading to slow response times. Summary of the Invention

[0004] This application provides an overheat protection system, control method, electronic device, storage medium, and computer program product to at least address the problems of limited temperature monitoring range and slow protection response of existing server motherboards.

[0005] This application provides an overheat protection system mounted on a motherboard divided into multiple blocks. The overheat protection system includes: a thermistor array and a monitoring circuit module; the thermistor array includes multiple thermistor modules, which are distributed across multiple blocks on the motherboard; each thermistor module includes a resistive element and a thermistor unit; the resistive element and the thermistor unit are connected in series between a power supply terminal and a ground terminal; the connection point between the resistive element and the thermistor unit serves as a voltage monitoring node; the monitoring circuit module includes multiple monitoring circuits, each corresponding to one thermistor module; the monitoring circuit module is configured to issue a first control signal when the voltage at the voltage monitoring node exceeds a reference voltage, the first control signal being used to control the electronic components in the block to disconnect from power.

[0006] This application also provides a control method for an overheat protection system, the method comprising: determining whether the voltage at the voltage monitoring node is greater than a reference voltage; if so, issuing a first control signal to cut off the power supply to the corresponding block of the motherboard.

[0007] This application also provides an electronic device, including: a memory for storing a computer program; and a processor for executing the computer program to implement the control method of any of the above-described overheat protection systems.

[0008] This application also provides a computer-readable storage medium storing a computer program, wherein when the computer program is executed by a processor, it implements the steps of the control method of any of the above-described overheat protection systems.

[0009] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the control method for any of the above-described overheat protection systems.

[0010] This application, through its distributed thermistor array and zoned judgment architecture of monitoring circuit modules, fundamentally overcomes the monitoring blind spot problem caused by traditional solutions that only deploy sensors at a few points. Simultaneously, each monitoring module forms a voltage divider circuit by connecting a resistive element in series with a thermistor at a specific temperature inflection point, accurately converting the physical quantity of temperature into a voltage signal. The monitoring circuit module then uses a comparator to compare this voltage with a preset reference voltage in real time. This decision-making mechanism enables signal acquisition, comparison, and generation of the first control signal within milliseconds when any area experiences a sudden temperature rise due to a short circuit, directly cutting off the corresponding power supply and achieving rapid response. Compared to the lengthy software process in existing technologies that requires reporting through the board management controller and then executing power-off through complex programmable logic devices, this system significantly shortens the delay of protection actions, effectively curbing the escalation of faults and fundamentally avoiding board burn-out accidents caused by slow response, thus significantly improving server reliability and data security. Attached Figure Description

[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of an existing overheat protection system; Figure 2 A schematic diagram of the distribution of a thermistor array provided in an embodiment of this application; Figure 3 This is a schematic diagram of an overheat protection system provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a monitoring circuit module provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a thermistor module provided in an embodiment of this application; Figure 6 This is a schematic diagram of another thermistor module provided in an embodiment of this application; Figure 7 This is a schematic diagram of another thermistor module provided in an embodiment of this application; Figure 8 This is a schematic diagram of another monitoring circuit module provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a power control module provided in an embodiment of this application; Figure 10This is a schematic diagram of the structure of an intelligent monitoring unit provided in an embodiment of this application.

[0013] Explanation of reference numerals in the attached figures: 1. Thermistor array; 11. Thermistor module; 111. Resistor element; 112. Thermistor unit; 113. Switching circuit; 2. Monitoring circuit module; 21. Monitoring circuit; 211. Comparator; 212. NOT gate logic circuit; 213. OR gate logic circuit; 22. Intelligent monitoring unit; 3. Power control module; R1. First resistor; RT. Thermistor; RP. Sliding rheostat; K. Relay; C1. First capacitor; 100. Overheat protection system; 150. Main board. Detailed Implementation

[0014] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0015] It should be noted that, in the description of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. The terms "first," "second," etc., in this application are used to distinguish similar objects and are not used to describe a specific order or sequence.

[0016] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] With the rapid development of big data, cloud computing, and artificial intelligence technologies, the demand for server computing power and data processing is increasing daily across various industries. This places extremely high demands on the long-term operational stability and reliability of servers. The server motherboard, as a core component, contains a large number of densely integrated electronic components. In complex working environments, the motherboard may experience partial short circuits due to component aging, foreign object intrusion, or design flaws, or heat buildup due to poor heat dissipation. If these short circuits or overheating problems are not detected and addressed in a timely manner, they can lead to minor issues such as performance degradation and shortened lifespan of electronic components, or even serious accidents such as board burnout, resulting in permanent equipment damage and loss of critical data, causing significant economic losses.

[0018] In current technological practices, server motherboards generally employ a temperature control and protection scheme based on a Baseboard Management Controller (BMC) and a Complex Programmable Logic Device (CPLD). Typically, only a limited number of temperature sensors are deployed in a few areas on the motherboard. The primary function of these sensors is to collect ambient temperature data and report it to the Baseboard Management Controller.

[0019] For example, the baseboard management controller dynamically adjusts the speed of the cooling fan based on the received temperature data according to a preset fan control strategy, such as increasing the speed to enhance heat dissipation when the temperature rises. Only when the temperature continues to rise abnormally, exceeding a certain absolute safety threshold even when the fan is running at full speed, will the baseboard management controller transmit an abnormal signal to the complex programmable logic device, which will then ultimately execute a power-down or shutdown command.

[0020] However, refer to Figure 1 Currently available temperature sensors are scarce and do not cover most circuit components, resulting in severely insufficient monitoring coverage. Temperature sensor deployment strategies typically focus only on a few core or high-power areas, leaving large areas of the motherboard's edges, the vicinity of various interface circuits, and other potential hotspots in monitoring blind spots, failing to achieve comprehensive, all-around monitoring of the board's temperature. Secondly, the protection mechanism suffers from poor real-time performance. The entire protection process is lengthy and involves multiple layers of logic devices and information transmission, leading to slow response times.

[0021] When an overheating or short circuit event occurs, the system prioritizes a relatively mild cooling measure, such as adjusting the fan speed, rather than directly cutting off the power to the faulty source. This slow response of adjusting the speed first and then cutting off the power cannot achieve millisecond-level rapid power cut-off in emergency situations, and there is a risk of protection delay.

[0022] Based on this, this application provides an overheat protection system, such as... Figure 2 and Figure 3 As shown, the motherboard 150 is divided into multiple blocks; the overheat protection system 100 includes: a thermistor array 1 and a monitoring circuit module 2.

[0023] The thermistor array 1 includes multiple thermistor modules 11, which are distributed across multiple blocks on the motherboard 150.

[0024] The thermistor module 11 includes a resistive element 111 and a thermistor unit 112; the resistive element 111 and the thermistor unit 112 are connected in series between the power supply terminal and the ground terminal; the connection point between the resistive element 111 and the thermistor unit 112 serves as a voltage monitoring node; the thermistor unit 112 includes multiple thermistors RT.

[0025] The monitoring circuit module 2 includes multiple monitoring circuits 21, each monitoring circuit 21 corresponding to a thermistor module 11; the monitoring circuit module 2 is configured to issue a first control signal when the voltage at the voltage monitoring node is greater than the reference voltage, the first control signal being used to control the electronic components in the block to be powered off.

[0026] The motherboard 150 is divided into multiple blocks, as shown in the reference. Figure 2 , Figure 2 Each block is surrounded by a ring of thermistor modules 11; at the same time, thermistor modules 11 are also set on the edge of the motherboard.

[0027] Distributed setup refers to the use of multiple thermistors instead of a single thermistor to accurately monitor and control the temperature of different parts of the motherboard (especially around high-power chips). Each thermistor module is responsible for monitoring the temperature of its own area. If one thermistor fails, the sensors in other areas can still work, and the overheat protection system will not completely lose its temperature monitoring capability. This enables accurate, independent, and real-time acquisition of local temperatures, thus providing a data foundation for efficient heat dissipation control and overheat protection.

[0028] In some embodiments, the overheat protection system 100 is integrated on the server motherboard 150, which is divided into multiple independent blocks such as the CPU core power supply area, the memory power supply area, and the PCIe slot power supply area.

[0029] At key locations and edges of each block, thermistor modules 11, consisting of positive temperature coefficient thermistor units 112 and resistor elements 111 connected in series, are distributed and installed.

[0030] In the CPU power supply area, a resistor 111 is connected to three PTC thermistors RT in series between the 3.3V power supply and ground. The connection point between them serves as a voltage monitoring node for this area. A monitoring circuit 21 continuously compares the voltage at this node with a precise 2.5V reference voltage. If the temperature in this area rises sharply due to a short circuit or heat dissipation failure, causing the PTC resistance to increase rapidly and the node voltage to exceed 2.5V, the monitoring circuit 21 will immediately output a first control signal to directly shut down the enable signal of the power chip supplying power to the CPU, thereby achieving rapid power-off.

[0031] In some embodiments, the overheat protection system 100 is integrated into the server hard drive backplane. This hard drive backplane includes multiple critical power supply lines and heat-prone areas, specifically: three power paths (P12V_HDD, P5V_HDD, P3V3_STBY), and four physical locations: the area around the first hard drive connector, the area around the second hard drive connector, the area around the CPLD and its surrounding devices, and the edge of the motherboard 150. The overheat protection system 100 deploys seven independent monitoring circuits 21 corresponding to seven thermistors RT in these seven critical areas to achieve comprehensive coverage.

[0032] Each monitoring circuit 21 is equipped with a thermistor module 11. To address the different operating characteristics of various areas and the temperature resistance of components, the overheat protection system 100 selects positive temperature coefficient thermistors RT with different temperature inflection points. Specifically, the monitoring circuits 21 deployed on the three high-current power paths P12V_HDD, P5V_HDD, and P3V3_STBY use PTC thermistors RT with a temperature inflection point of 100℃ to match the higher temperature resistance of the power supply components and the risk of high temperatures during faults. The monitoring circuits 21 deployed around the two hard drive connectors, in the CPLD area, and at the edge of the board use PTC thermistors RT with a temperature inflection point of 85℃, because the normal operating temperature in these areas is lower and the components are more sensitive to overheating.

[0033] Each thermistor module 11 consists of a resistor element 111 connected in series with multiple PTC thermistors RT of the same type, and connected between a 3.3V power supply and ground. The connection point between the resistor element 111 and the thermistor unit 112 is the voltage monitoring node Vmon, and the seven links generate seven monitoring voltages from Vmon1 to Vmon7.

[0034] These seven monitoring voltages are each connected to a monitoring circuit module 2, which integrates seven independent monitoring circuits 21. One input terminal of each monitoring circuit 21 is connected to the corresponding Vmon, and the other input terminal is connected to a reference voltage (Vref1 to Vref7) generated by a reference voltage source. The voltage value of each Vref is precisely calculated to correspond to the voltage division value of the PTC thermistor RT in its circuit when it is near the inflection point temperature of 85°C or 100°C.

[0035] Once the temperature in the area rises sharply due to a short circuit or heat dissipation failure, the PTC resistance increases rapidly, causing the node voltage to exceed the voltage division value corresponding to the temperature. The monitoring circuit 21 will immediately output a first control signal to directly turn off the enable signal of the power chip in the corresponding area, thereby achieving rapid power-off.

[0036] In other words, during normal operation, the temperature of all monitoring points is below their threshold, and Vmon1-Vmon7 are all below their corresponding Vref. The monitoring circuit 21 outputs a high-level signal, and the power supply of each path works normally.

[0037] If an anomaly occurs in a certain area, such as a sharp temperature rise due to a short circuit in the P12V_HDD power path, the resistance of its corresponding PTC thermistor RT (inflection point 100℃) will increase sharply, causing the Vmon1 voltage to rise rapidly. When Vmon1 exceeds the preset Vref1, the state of the corresponding monitoring circuit 21 immediately flips, outputting a valid first control signal. According to the preset protection logic, the P12V_HDD link is responsible for powering all hard drives, and its failure will affect the entire board's function, belonging to the highest priority. Therefore, the first control signal is directly sent to the enable terminal of the P12V_HDD power circuit, immediately cutting off its output, thereby achieving protection of the hard drive backplane within milliseconds and effectively avoiding board burnout accidents caused by continuous excessive current.

[0038] This application fundamentally solves the problem of limited monitoring range in existing technologies by constructing a comprehensive thermistor array 1. As shown in the embodiment, on the server hard drive backplane, a total of 7 monitoring links are deployed not only in core power paths such as P12V_HDD, but also in traditionally non-critical or blind spots such as around the hard drive connector, the CPLD area, and even the edge of the board. This uniform and dense layout strategy along the edge of the motherboard and around components ensures that no local hotspot caused by short circuits or heat dissipation failures in any corner can escape the system's monitoring. Compared with existing technologies that deploy sensors at only a few points, this system expands the monitoring network from a few points to a network, greatly improving the comprehensiveness and preventativeness of protection, and is able to detect and prevent potential board burn-out risks that traditional solutions cannot detect.

[0039] In some embodiments, multiple thermistors RT connected in series in the same thermistor unit 112 have the same temperature coefficient.

[0040] Using thermistors RT with the same temperature coefficient in series has the advantage of ensuring the uniformity and consistency of temperature response within the monitoring area. Since all thermistors RT have the same characteristics, the total resistance of the entire series branch will exhibit a smooth and predictable multiplication relationship as the temperature rises. This simplifies circuit design and threshold calculation, makes the calibration of protection points very convenient, and avoids the problem of excessively high or low local temperature sensitivity caused by differences in component characteristics, thereby achieving stable and reliable monitoring of the entire area.

[0041] In some embodiments, multiple thermistors RT connected in series in the same thermistor unit 112 have the same model and resistance value.

[0042] This ensures the consistency and repeatability of product performance in mass production to the greatest extent possible; the same model and resistance value mean that the voltage divider characteristics of each module are almost identical, which allows the motherboard 150 to achieve a uniform protection threshold without complex individual calibration at the factory, significantly reducing production costs and testing time, while improving product quality reliability.

[0043] In summary, this application provides an overheat protection system. This overheat protection system 100, through its distributed thermistor array 1 and zoned judgment architecture of the monitoring circuit module 2, fundamentally overcomes the monitoring blind spot problem caused by traditional solutions that only deploy sensors at a few points. Simultaneously, each monitoring module forms a voltage divider circuit by connecting a resistive element 111 in series with a thermistor unit 112 at a specific temperature inflection point, accurately converting the temperature physical quantity into a voltage signal. The monitoring circuit module 2 then uses a comparator 211 to compare this voltage with a preset reference voltage in real time. This decision-making mechanism enables signal acquisition, comparison, and generation of a first control signal within milliseconds when any area experiences a sudden temperature rise due to a short circuit, directly cutting off the corresponding power supply and achieving rapid response. Compared to the lengthy software process in existing technologies that requires reporting through the board management controller and then power-off by the CPLD, this system significantly shortens the delay of protection actions, effectively curbing the expansion of faults and fundamentally avoiding board burn-out accidents caused by slow response, significantly improving server reliability and data security.

[0044] like Figure 4 As shown, the monitoring circuit 21 also includes: a comparator 211 and a NOT gate logic circuit 212.

[0045] The first input terminal of comparator 211 is connected to the voltage monitoring node, the second input terminal of comparator 211 is electrically connected to the reference voltage terminal for receiving the reference voltage, and the output terminal of comparator 211 is electrically connected to the input terminal of NOT gate logic circuit 212.

[0046] When the voltage at the voltage monitoring node is greater than the reference voltage, the output of comparator 211 outputs a first comparison signal; the NOT gate logic circuit 212 is configured to receive the first comparison signal and convert the first comparison signal into a first control signal.

[0047] In some embodiments, each monitoring circuit 21 can be implemented using an independent voltage comparator 211 (such as LM339) and a NOT gate logic circuit 212 (such as 74HC04). The inverting input of the comparator 211 is connected to the voltage monitoring node, the non-inverting input is connected to the 2.5V reference voltage generated by the voltage reference chip, and the output of the comparator 211 is connected to the input of the NOT gate.

[0048] Under normal operating temperature, when the monitoring node voltage is below 2.5V, the comparator 211 outputs a low level, which becomes a high level after being inverted by the NOT gate. At this time, the power supply enable signal is valid.

[0049] When overheating occurs, the monitoring node voltage exceeds 2.5V, and comparator 211 flips to output a high level, which is the first comparison signal; after receiving the high level, the NOT gate outputs a low level first control signal, thereby turning off the power supply.

[0050] In some embodiments, the overheat protection system 100 is integrated into the server hard drive backplane. The hard drive backplane includes multiple critical power supply lines and heat-prone areas, specifically including: three power paths: P12V_HDD, P5V_HDD, and P3V3_STBY, as well as four physical locations: the periphery of the first hard drive connector, the periphery of the second hard drive connector, the area of ​​the CPLD and its surrounding devices, and the edge of the motherboard 150.

[0051] Considering the differences in the operating characteristics and temperature resistance of components in different areas, the overheat protection system 100 uses thermistors RT with different temperature characteristics. Among them, the three high-current power supply paths P12V_HDD, P5V_HDD, and P3V3_STBY use positive temperature coefficient thermistors RT with a temperature inflection point of 100℃; while the areas around the first hard drive connector, the second hard drive connector, the CPLD area, and the edge of the motherboard 150 use positive temperature coefficient thermistors RT with a temperature inflection point of 85℃.

[0052] Taking the P12V_HDD monitoring circuit 21 as an example, it consists of a resistor element 111 and three series-connected 100°C inflection point PTC thermistors RT, connected between the 3.3V standby power supply and ground. The connection point of the resistor element 111 and the PTC thermistor RT series serves as the voltage monitoring node Vmon1. Vmon1 is connected to the inverting input of an independent comparator 211, while the non-inverting input of comparator 211 is connected to a reference voltage Vref1 (e.g., 2.5V) generated by a voltage reference circuit. The output of comparator 211 is connected to the input of a NOT gate logic circuit 212.

[0053] Under normal operating temperature, the PTC thermistor RT remains in a low-resistance state, the voltage Vmon1 is lower than Vref1, the comparator 211 outputs a low level, and after being inverted by the NOT gate, it outputs a high level. At this time, the enable signal of the P12V_HDD power supply remains valid.

[0054] When the P12V_HDD path experiences a rapid temperature rise exceeding 100℃ due to an abnormal condition such as a short circuit, the resistance of the PTC thermistor RT increases sharply, causing the Vmon1 voltage to rise rapidly. When Vmon1 exceeds Vref1, the comparator 211 immediately flips to output a high-level first comparison signal. After receiving this high-level signal, the NOT gate outputs a low-level first control signal, directly cutting off the enable signal of the P12V_HDD power supply, achieving millisecond-level rapid protection.

[0055] Similarly, the other six monitoring links use the same hardware architecture, and each is matched with a protection threshold of 85°C or 100°C by setting different Vref values. This implementation scheme based on pure hardware comparison circuit avoids the response delay caused by the participation of logic devices such as the baseboard management controller or complex programmable logic devices, and provides comprehensive and fast regional overheat protection for the hard disk backplane, effectively preventing the occurrence of board burn-out accidents.

[0056] This application utilizes a simple circuit consisting of a resistor 111 connected in series with a thermistor RT to directly convert a temperature signal into a voltage signal. A hardware comparator 211 enables extremely fast response, effectively overcoming the protection delay defects of existing technologies. In a specific embodiment, each monitoring circuit 21 is equipped with a resistor 111 and multiple thermistors RT connected in series to form a voltage divider. When the temperature rises sharply, the resistance of the thermistor RT changes drastically, causing a momentary change in the voltage at the voltage monitoring node. This voltage is directly fed into the comparator 211 for comparison with a reference voltage. If the voltage exceeds the limit, a shutdown signal is immediately issued. This process is entirely completed by pure hardware circuitry, without the need for software intervention from a baseboard management controller or complex programmable logic devices, achieving a response time in milliseconds. In contrast, existing technologies require lengthy processes such as data reporting, strategy judgment, and command issuance. This application's rapid hardware closed-loop provides time for the protection action to prevent the fault from escalating.

[0057] like Figure 5 As shown, exemplarily, the resistive element 111 includes: a first resistor R1; the thermistor unit 112 includes: a plurality of thermistors RT, which are connected in series in a row.

[0058] The first end of the first resistor R1 is electrically connected to the power supply terminal, and the second end of the first resistor R1 is electrically connected to the first input terminal of the comparator 211.

[0059] For example, in a specific circuit, the resistor 111 is a fixed resistor with an accuracy of 1% and a resistance of 10kΩ. Multiple identical PTC thermistors RT, each with a resistance of 1kΩ at 25°C, are connected in series and then connected in series with the 10kΩ fixed resistor. The other end of the first resistor R1 is connected to a 3.3V power supply, and the other end of the series-connected thermistor RT is grounded. The voltage monitoring node is then led from the connection point of the 10kΩ resistor and the first PTC thermistor RT to the comparator 211.

[0060] In other words, resistor 111 is a fixed resistor. Using a fixed resistor as resistor 111 results in a stable circuit structure, controllable cost, and good parameter consistency. The resistance value of a fixed resistor is stable and does not change with the environment. This makes the temperature-voltage characteristic curve of the voltage divider circuit formed by it and the thermistor RT fixed and predictable, facilitating precise setting of the protection temperature threshold during the design and production stages. Furthermore, fixed resistors are standard components, resulting in low procurement costs and suitability for mass production.

[0061] like Figure 6 As shown, for example, the resistive element 111 includes a sliding rheostat RP.

[0062] The first terminal of the sliding rheostat RP is electrically connected to the power supply terminal, and the second terminal of the sliding rheostat RP is electrically connected to the first input terminal of the comparator 211.

[0063] The sliding rheostat RP is configured to either increase the resistance value of the resistive element 111 to increase the temperature threshold of the overheat protection of the main board 150, or decrease the resistance value of the resistive element 111 to decrease the temperature threshold of the overheat protection of the main board 150.

[0064] For example, resistor 111 is replaced with a precision sliding rheostat RP with a resistance of 20kΩ. The resistance value connected to the circuit can be changed by finely adjusting the knob of the sliding rheostat RP.

[0065] When the resistance is adjusted from 10kΩ to 15kΩ, according to the voltage divider formula, a higher monitoring node voltage is required, which corresponds to a higher temperature, to trigger the comparator 211 to flip, thereby achieving the purpose of increasing the protection temperature threshold.

[0066] This allows the same motherboard 150 to flexibly adjust its overheat protection point according to different application scenarios or different reliability requirements. In environments with good heat dissipation, the threshold can be appropriately increased to reduce false triggering; while in harsh environments, the threshold can be decreased to improve protection sensitivity.

[0067] like Figure 7As shown, the thermistor module 11 also includes: a switching circuit 113; the thermistor unit 112 includes: multiple thermistors RT; the multiple thermistors RT include: multiple rows of thermistors RT; the multiple thermistors RT in each row are connected in series.

[0068] The first terminal of the multi-row thermistor RT is electrically connected to the first terminal of the switching circuit 113, and the second terminal of the multi-row thermistor RT is electrically connected to the ground terminal.

[0069] For example, to implement more complex monitoring strategies, a switching circuit 113 composed of MOSFETs is added to the thermistor module 11. The module contains two parallel rows of thermistors RT: one row consists of three conventional PTCs connected in series, and the other row consists of three PTCs with higher Curie temperatures connected in series. The common terminal of the two rows of resistors is connected to a fixed resistor via a MOSFET switch, the gate of which is controlled by a control signal. The first row is turned on by default when the system is powered on; when the system enters a specific mode, it can switch to the second row via a control signal, thereby changing the monitored temperature range.

[0070] By introducing a switching circuit 113 and multiple rows of thermistors RT, configurability of the monitoring range and protection strategy is achieved. The benefit is that the system can dynamically switch the monitored thermistor RT network according to different operating modes or fault diagnosis needs. For example, one row can be configured for conventional overheat protection, while another row can be configured to monitor emergency situations at higher temperatures. Alternatively, rows of thermistor RT with different temperature coefficients can be used to broaden the effective monitoring range, thereby providing a smarter and more flexible protection mechanism.

[0071] like Figure 7 As shown, in some embodiments, the switching circuit 113 includes a plurality of relays K.

[0072] A relay K is connected to a series of thermistors RT; when any relay K is turned on, the series of thermistors RT connected to it is connected to the resistor element 111.

[0073] For example, in a high-power or electrically isolated application, the switching circuit 113 uses multiple small electromagnetic relays K. Each column of thermistors RT is connected in series with the normally open contact of a relay K. The coil of the relay K is driven by a transistor through the GPIO port of the motherboard 150. When the system software needs to switch the temperature monitoring range, it controls the corresponding relay K to engage via GPIO, thereby connecting the corresponding column of thermistors RT to the monitoring circuit.

[0074] Using relay K as a switching element achieves electrical isolation between the control circuit and the monitoring circuit 21, and the low contact resistance introduces almost no additional measurement error; this is crucial for high-precision temperature monitoring. At the same time, relay K is simple to drive, can withstand a certain surge current, and is more robust than semiconductor switches when switching long lead thermistor RT networks that may have parasitic capacitance.

[0075] In some embodiments, relay K is a MOSFET, and by controlling the corresponding MOSFET to turn on, the corresponding thermistor is connected to the circuit.

[0076] For example, in a multi-column thermistor RT, each column of thermistor RT has a different temperature coefficient.

[0077] In one embodiment, the thermistor module 11 includes two columns of resistors connected in parallel: one column uses positive temperature coefficient (PTC) thermistors RT, and the other column uses negative temperature coefficient (NTC) thermistors RT. These two columns of resistors are selectively connected to the main circuit via a switching circuit 113. When the PTC column is selected, the overheat protection system 100 is sensitive to temperature rise; when the NTC column is selected, the overheat protection system 100 is more sensitive to low temperature. Alternatively, they can be used in combination to obtain a more suitable voltage-temperature change curve within a specific temperature range.

[0078] The core advantage of using a series of thermistors with different temperature coefficients lies in significantly enhancing the system's ability to sense and adapt to temperature changes. By switching between resistor series with different temperature characteristics, the same monitoring circuit 21 can handle diverse protection needs, such as extreme environments requiring protection against both overheating and low-temperature condensation. Furthermore, a clever combination of PTC and NTC can create composite sensors with customized response curves to meet the ultra-high sensitivity monitoring requirements at specific temperature points.

[0079] like Figure 8 As shown, in some embodiments, the monitoring circuit module 2 further includes an OR gate logic circuit 213.

[0080] The OR gate logic circuit 213 is disposed between the comparator 211 and the NOT gate logic circuit 212; one input terminal of the OR gate logic circuit 213 is electrically connected to the output terminal of one of the comparators 211.

[0081] The OR gate logic circuit 213 is configured to output a second comparison signal when at least one first comparison signal is received.

[0082] The NOT gate logic circuit 212 is configured to receive a second comparison signal and convert the second comparison signal into a first control signal.

[0083] For example, in a complex scenario where multiple sub-regions need to be monitored simultaneously but share the same power supply, three independent comparators 211 are set up to monitor the temperature of three sub-regions respectively. The outputs of these three comparators 211 are connected to the input of a three-input OR gate chip. The output of the OR gate is then connected to an NOT gate. In this way, if any of the three sub-regions overheats, its corresponding comparator 211 will output a high level, which will cause the OR gate to output a high level, ultimately triggering the NOT gate to output a turn-off signal, cutting off the power supply to the entire region.

[0084] The introduction of OR gate logic circuit 213 realizes a multi-point early warning protection mechanism, which enables the overheat protection system to logically connect multiple scattered monitoring points under a block. As long as any key point has a problem, overheat protection will be taken immediately, further simplifying the power control logic and ensuring that protection action can be triggered at any potential fault point. This greatly enhances the comprehensiveness and reliability of protection and avoids protection failure due to the failure of a single monitoring point.

[0085] like Figures 4-8 As shown, in some embodiments, the monitoring circuit 21 further includes a first capacitor C1.

[0086] The first terminal of the first capacitor C1 is electrically connected to the reference voltage terminal, and the second terminal of the first capacitor C1 is electrically connected to the ground terminal.

[0087] A 100nF ceramic capacitor, known as the first capacitor C1, is connected in parallel between the reference voltage terminal, i.e., the non-inverting input terminal of comparator 211, and ground. This first capacitor is placed as close as possible to the power supply pin of comparator 211 and the reference voltage source.

[0088] Adding the first capacitor C1 improves the stability and anti-interference capability of the reference voltage. As a decoupling capacitor and filter capacitor, this capacitor can absorb power supply ripple and suppress high-frequency noise introduced from the line, providing a reference for comparator 211. This can effectively prevent comparator 211 from flipping erroneously due to reference voltage jitter, greatly improving the anti-interference and working stability of the entire protection system and avoiding false protection actions in noisy digital power supply environments.

[0089] like Figure 9 As shown, in some embodiments, the overheat protection system 100 further includes a power control module 3.

[0090] The power control module 3 is electrically connected to the monitoring circuit module 2.

[0091] The power control module 3 is configured to cut off the power supply to the corresponding block when it receives the first control signal.

[0092] The power control module 3 can be a dedicated power timing management chip or a simple MOSFET switch. The first control signal (active low) output by the monitoring circuit module 2 is directly connected to the enable pin of the power management module; when a low-level signal is received, the power management module will immediately turn off its internal power MOSFET, cutting off the current flowing to the corresponding block.

[0093] This achieves separation of monitoring and execution, providing direct and powerful power-off capability. The power control module 3, as the final execution unit for protection actions, can reliably shut down high-current power paths, ensuring the effectiveness of the protection. This modular design also makes the system more flexible, adaptable to different types and power supplies, enhancing the overall versatility and reliability of the solution.

[0094] like Figure 10 As shown, in some embodiments, the monitoring circuit module 2 includes an intelligent monitoring unit 22.

[0095] The first end of the intelligent monitoring unit 22 is electrically connected to the voltage monitoring node; the second end of the intelligent monitoring unit 22 is electrically connected to the power control module 3.

[0096] The intelligent monitoring unit 22 is configured to determine that the motherboard 150 area corresponding to the voltage monitoring node is overheating when it detects that the voltage of the voltage monitoring node exceeds the normal range and reaches the set overheat voltage change threshold; and outputs the first control signal to the power control module 3.

[0097] In other words, the core of the monitoring circuit module 2 is an intelligent monitoring unit 22, which has a built-in multi-channel ADC. The multiple ADC pins of the intelligent monitoring unit 22 are connected to the voltage monitoring nodes in various areas of the motherboard 150. The internal program of the intelligent monitoring unit 22 reads these voltage values ​​in real time and compares and makes logical judgments with various thresholds (such as warning threshold, slight overheating threshold, and severe overheating threshold) stored in Flash. Finally, it sends the corresponding control signals to the power control module 3 through the GPIO port.

[0098] The introduction of the intelligent monitoring unit 22 enables software-definable and intelligent protection strategies, allowing for complex multi-level protection. Simultaneously, it can record temperature event logs, perform trend analysis, and even dynamically adjust thresholds through algorithms to adapt to component aging and other conditions. This greatly enriches the system's functionality and improves the accuracy and management capabilities of protection.

[0099] For example, the system deploys thermistor (RT) monitoring links with different temperature characteristics in seven key areas: the three power paths (P12V_HDD, P5V_HDD, P3V3_STBY) on the hard drive backplane, the area around the first hard drive connector, the area around the second hard drive connector, the CPLD and its surrounding devices, and the edge of the motherboard 150. Specifically, the high-current power paths use PTC thermistors (RT) with a temperature inflection point of 100℃, while other areas use PTC thermistors (RT) with a temperature inflection point of 85℃.

[0100] By employing an intelligent monitoring unit 22, which incorporates a multi-channel high-precision ADC module, the voltage signals Vmon1 to Vmon7 generated by the seven monitoring links are respectively connected to the seven ADC input pins of the intelligent monitoring unit 22. The internal memory of the intelligent monitoring unit 22 pre-stores multiple threshold parameters for each monitoring channel, including: a warning threshold (corresponding to a temperature 5-10℃ below the inflection point), a slight overheating threshold (corresponding to the inflection point temperature), and a severe overheating threshold (corresponding to a temperature 5℃ above the inflection point).

[0101] When the overheat protection system 100 is working, the intelligent monitoring unit 22 cyclically samples the voltage values ​​of all monitoring nodes at millisecond intervals and performs real-time analysis and multi-level judgment through internal algorithms.

[0102] When Vmon1 exceeds the warning threshold for the first time, the intelligent monitoring unit 22 can send a warning message to the substrate management controller through the I²C interface to remind it to pay attention to the temperature trend of the P12V_HDD path; when Vmon1 continues to rise and exceeds the slight overheating threshold, the intelligent monitoring unit 22 can control the relevant fan to speed up; only when Vmon1 reaches the severe overheating threshold will the intelligent monitoring unit 22 immediately output a control signal through the GPIO port to directly cut off the enable signal of the P12V_HDD power supply.

[0103] In summary, the thermistor array 1 proposed in this application is laid out with its wiring separate from the original CPU, memory, and other functional circuits of the motherboard 150. It is connected to the dedicated monitoring circuit 21 only through tiny solder joints or wires. This design offers two advantages: first, it does not interfere with the integrity of high-speed signals, provides great flexibility in layout, and can be easily deployed in any corner of the board; second, even if the temperature monitoring system itself malfunctions, it will not affect the normal operation of the main functional circuit, achieving fault isolation. This allows the system to be integrated into various board designs as a standard, portable protection module, exhibiting extremely high versatility.

[0104] It also provides a variety of flexible threshold configuration methods, enabling the protection system to accurately adapt to the temperature resistance characteristics of different components and diverse application scenarios; the protection temperature point can be adjusted in three main ways: first, by adjusting the reference voltage of comparator 211; second, by inserting a sliding rheostat RP in series in the thermistor link and calibrating or changing the trigger point by changing the voltage division ratio; and third, by combining thermistor links with different temperature coefficients (such as 85℃ and 100℃ inflection points) through switching circuit 113.

[0105] Furthermore, by introducing the intelligent monitoring unit 22, which collects data from all voltage monitoring nodes in real time and has built-in multi-level thresholds, when a certain area experiences slight overheating but does not endanger the entire board, it may only trigger fan speed increase or report an early warning, rather than directly cutting off power, thus ensuring business continuity. Power-off operations will only be performed when the core area experiences severe overheating, minimizing unnecessary service interruptions while ensuring safety.

[0106] This application also provides a control method for an overheat protection system, the control method comprising: S1. Determine whether the voltage at the voltage monitoring node is greater than the reference voltage.

[0107] S2. If so, then issue the first control signal to de-energize the electronic components in the control block.

[0108] After the system is powered on, it continuously or periodically samples the voltage Vmon of the voltage monitoring node. Vmon is compared with a preset reference voltage Vref. Once Vmon > Vref is detected, the system immediately generates and sends a first control signal (such as a low-level pulse), which is sent to the enable terminal of the target block to force the power off.

[0109] This application also provides a control method for an overheat protection system, the control method comprising: Control methods also include: S101. When the voltage at the voltage monitoring node is greater than the reference voltage, the comparator outputs the first comparison signal. S102, the NOT gate logic circuit receives the first comparison signal and converts the first comparison signal into a first control signal.

[0110] In a system employing comparators and NOT gates, the control method is as follows: the comparator continuously compares Vmon and Vref. When overheating occurs and Vmon > Vref, the comparator output transitions from low to high (the first comparison signal). This high-level signal is then fed into the input of the NOT gate logic circuit. The NOT gate then performs a logic inversion operation, converting its input high level to low, which becomes the final first control signal.

[0111] Control methods also include: S201. Control the sliding rheostat to increase the resistance value of the resistive element and increase the temperature threshold of the main board overheat protection.

[0112] S202. Control the sliding rheostat to reduce the resistance value of the resistive element and reduce the temperature threshold of the motherboard overheat protection.

[0113] During system debugging or operation, the resistance of the sliding rheostat can be adjusted via software or manually. At the same temperature, increasing the resistance of the sliding rheostat will cause Vmon to decrease, which means that a higher temperature is required for Vmon to exceed Vref again, thereby achieving the purpose of raising the protection threshold.

[0114] Thermistor module 11 further includes: a switching circuit 113; the switching circuit 113 includes: multiple relays K; thermistor unit 112 includes: multiple rows of thermistors; multiple thermistors RT in each row are connected in series; the control method further includes: S301: When any relay K is turned on, a row of thermistors RT connected to it will be connected to the resistive element, thereby changing the temperature threshold of the main board 150 overheat protection.

[0115] Among them, the temperature coefficient of each column of thermistors RT is different.

[0116] When the system needs to switch monitoring modes, the control method includes the following steps: A high-level signal is output through the GPIO port to energize and engage the coil of a designated relay K. The contacts of relay K close, connecting a series of thermistors RT with specific temperature coefficients to the monitoring circuit, replacing the original resistor series. Due to the different temperature characteristics of the new resistor series, the protection threshold is switched.

[0117] In summary, through the above steps, the comparator outputs a high-level first comparison signal when Vmon > Vref, and the NOT gate logic circuit then converts it into a low-level active first control signal. This direct hardware connection scheme completely avoids software flow delays, ensuring extreme speed and determinism in protection. Simultaneously, by controlling the sliding rheostat to change its resistance value, the protection temperature point can be fine-tuned to avoid false triggering. Furthermore, by controlling the relay to switch between thermistor arrays with different temperature coefficients, the protection zones can be changed. These two adjustment methods allow the same protection system to flexibly adapt to different heat dissipation conditions, greatly enhancing the product's applicability and market competitiveness.

[0118] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above-described embodiments of the control method for an overheat protection system.

[0119] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above-described embodiments of the control method for overheat protection systems when it is run.

[0120] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0121] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above-described overheat protection system control method embodiments.

[0122] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps in any of the above-described overheat protection system control method embodiments.

[0123] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0124] The above provides a detailed description of an overheat protection system, control method, electronic device, storage medium, and computer program product provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only intended to help understand the methods and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An overheat protection system, characterized in that, The overheat protection system is mounted on a motherboard, which is divided into multiple blocks, and includes: A thermistor array includes multiple thermistor modules, which are distributed across multiple blocks on the motherboard. The thermistor module includes: a resistive element and a thermistor unit; the resistive element and the thermistor unit are connected in series between the power supply terminal and the ground terminal; the connection point between the resistive element and the thermistor unit serves as a voltage monitoring node. The monitoring circuit module includes multiple monitoring circuits, each of which corresponds to one of the thermistor modules; the monitoring circuit module is configured to issue a first control signal when the voltage at the voltage monitoring node is greater than the reference voltage. The first control signal is used to control the electronic components in the block to be powered off.

2. The overheat protection system according to claim 1, characterized in that, The monitoring circuit also includes: a comparator and a NOT gate logic circuit; The first input terminal of the comparator is connected to the voltage monitoring node, the second input terminal of the comparator is electrically connected to the reference voltage terminal for receiving the reference voltage, and the output terminal of the comparator is electrically connected to the input terminal of the NOT gate logic circuit. When the voltage at the voltage monitoring node is greater than the reference voltage, the output of the comparator outputs a first comparison signal; the NOT gate logic circuit is configured to receive the first comparison signal and convert the first comparison signal into the first control signal.

3. The overheat protection system according to claim 2, characterized in that, The resistive element includes: a first resistor; the thermistor unit includes: a plurality of thermistors, wherein the plurality of thermistors are connected in series in a row. The first end of the first resistor is electrically connected to the power supply terminal, and the second end of the first resistor is electrically connected to the first input terminal of the comparator.

4. The overheat protection system according to claim 2, characterized in that, The resistive element includes: a sliding rheostat; The first end of the sliding rheostat is electrically connected to the power supply terminal, and the second end of the sliding rheostat is electrically connected to the first input terminal of the comparator. The sliding rheostat is configured to either increase the resistance value of the resistive element to increase the temperature threshold of the motherboard overheat protection, or decrease the resistance value of the resistive element to decrease the temperature threshold of the motherboard overheat protection.

5. The overheat protection system according to claim 2, characterized in that, The thermistor module further includes: a switching circuit; the thermistor unit includes: multiple thermistors; the multiple thermistors include: multiple rows of thermistors; the multiple thermistors in each row of thermistors are connected in series sequentially; The first end of the multi-row thermistor is electrically connected to the first end of the switching circuit, and the second end of the multi-row thermistor is electrically connected to the grounding terminal.

6. The overheat protection system according to claim 5, characterized in that, The switching circuit includes: multiple relays; One of the relays is connected to a column of thermistors; when any one of the relays is turned on, the column of thermistors connected to it is connected to the resistive element.

7. The overheat protection system according to claim 5, characterized in that, In the multi-row thermistors, each row of thermistors has a different temperature coefficient.

8. The overheat protection system according to claim 2, characterized in that, The monitoring circuit module further includes: an OR gate logic circuit; The OR gate logic circuit is disposed between the comparator and the NOT gate logic circuit; one input terminal of the OR gate logic circuit is electrically connected to one output terminal of the comparator. The OR gate logic circuit is configured to output a second comparison signal when at least one of the first comparison signals is received; The NOT gate logic circuit is configured to receive the second comparison signal and convert the second comparison signal into the first control signal.

9. The overheat protection system according to claim 3 or 5, characterized in that, The multiple thermistors connected in series in the same thermistor unit have the same temperature coefficient.

10. The overheat protection system according to claim 1, characterized in that, The multiple thermistors connected in series in the same thermistor module have the same model and resistance value.

11. The overheat protection system according to claim 2, characterized in that, The monitoring circuit also includes: a first capacitor; The first terminal of the first capacitor is electrically connected to the reference voltage terminal, and the second terminal of the first capacitor is electrically connected to the ground terminal.

12. The overheat protection system according to claim 1, characterized in that, The overheat protection system also includes: a power control module; The power control module is electrically connected to the monitoring circuit module; The power control module is configured to cut off the power supply to the corresponding block when it receives the first control signal.

13. The overheat protection system according to claim 12, characterized in that, The monitoring circuit module includes: an intelligent monitoring unit; The first end of the intelligent monitoring unit is electrically connected to the voltage monitoring node; the second end of the intelligent monitoring unit is electrically connected to the power control module. The intelligent monitoring unit is configured to determine that the motherboard area corresponding to the voltage monitoring node is overheating when it detects that the voltage of the voltage monitoring node exceeds the normal range and reaches the set overheat voltage change threshold; and output the first control signal to the power control module.

14. A control method for an overheat protection system, characterized in that, The method, applied to an overheat protection system as described in any one of claims 1 to 13, comprises: Determine whether the voltage at the voltage monitoring node is greater than the reference voltage; If so, a first control signal is issued to power off the electronic components in the block.

15. The control method according to claim 14, characterized in that, The method further includes: When the voltage at the voltage monitoring node is greater than the reference voltage, the comparator outputs a first comparison signal. The NOT gate logic circuit receives the first comparison signal and converts the first comparison signal into the first control signal.

16. The control method according to claim 14, characterized in that, The resistive element includes: a sliding rheostat; the method further includes: Controlling the sliding rheostat to slide increases the resistance value of the resistive element and increases the temperature threshold of the motherboard overheat protection; Controlling the sliding rheostat to slide reduces the resistance value of the resistive element and decreases the temperature threshold of the motherboard overheat protection.

17. The control method according to claim 14, characterized in that, The thermistor module further includes: a switching circuit; the switching circuit includes: multiple relays; the thermistor unit includes: multiple rows of thermistors; multiple thermistors in each row of thermistors are connected in series; the method further includes: When any one of the relays is turned on, a row of thermistors connected to it is connected to the resistive element, thereby changing the temperature threshold of the motherboard overheat protection. Among the multiple rows of thermistors, each row of thermistors has a different temperature coefficient.

18. An electronic device, characterized in that, include: Memory, used to store computer programs; A processor, configured to execute the computer program to implement the steps of the control method for the overheat protection system as described in any one of claims 14 to 17.

19. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, it implements the steps of the control method for the overheat protection system as described in any one of claims 14 to 17.

20. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the steps of the control method for the overheat protection system as described in any one of claims 14 to 17.

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