Data center and system for conditioning and recirculating air in a data center

Abstract

The invention relates to a data center and a system for conditioning and recirculating air in a data center. The data center cooling system includes a first interior space for accommodating an electronic device, a second interior space for accommodating at least one fan, and a third interior space for accommodating at least one cooling unit. The first interior space is thermally separated from the second interior space and the third interior space such that hot air is drawn from the first interior space, conditioned, and then cold air is delivered again into the first interior space. At least one fan is positioned over the electronic device, such as in a ceiling, to improve air distribution and increase maximum airflow. The at least one cooling unit is positioned to at least one side of the first interior space. In use, the at least one fan and the at least one cooling unit operate together to condition and recirculate air through the interior space.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 683,983, filed August 16, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure generally relates to cooling solutions for data centers and other controlled temperature environments, and more specifically, to cooling schemes that utilize separate and strategically positioned cooling units / coils and fans to increase airflow and distribution while maximizing the use of room space where electronic equipment is installed. Background Technology

[0004] A data center is a facility that houses electronic equipment such as servers, network equipment, storage devices, power supplies, and related cabling. Within a data center, electronic equipment is typically mounted in racks, and these racks are usually arranged to form rows and aisles for organization and easy access to the electronic equipment. Depending on the amount of electronic equipment and data being processed, data centers can be small-scale, such as prefabricated and portable, large-scale and permanent, or hyperscale.

[0005] Electronic devices consume electrical energy, and therefore the larger the data center, the more energy it consumes. Advances in computing technology and connectors have enabled extremely high-density applications. An undesirable byproduct of electronic devices is heat, which can degrade performance and cause malfunctions. Therefore, cooling solutions have been developed to manage heat generation in data centers.

[0006] Traditional cooling solutions for high-density applications utilize row or back-door heat exchangers installed near rack servers. While effective in some applications, heat exchangers require extensive supply and return coolant piping networks, occupy valuable floor space in the data center, restrict rack and aisle placement, and introduce the potential for coolant leaks that can be harmful to electronic equipment.

[0007] Other traditional cooling solutions for data centers utilize integrated units that combine both coils and fans, and these units are mounted around the perimeter of the room. While effective in some applications, these units face challenges in airflow distribution due to their installation location at the room's edge and their distance from some electronic devices within the electronics system.

[0008] Therefore, what is needed is a cooling solution that overcomes the shortcomings of existing technologies, is suitable for use with various data center configurations, positions air handling components outside valuable data center floor space, and eliminates the possibility of coolant leakage near electronic equipment. Summary of the Invention

[0009] According to a first aspect, this disclosure relates to a data center comprising: a first interior space for housing electronic equipment; a second interior space positioned above the first interior space and housing or supporting at least one fan; and a third interior space positioned laterally to the first interior space and housing at least one cooling unit / coil. A first thermal separator / barrier is positioned between the first and second interior spaces. A second physical separator / thermal barrier is positioned between the third and first interior spaces. In use: at least one fan is operable to draw hot air from the first interior space through the first thermal barrier into the second interior space; the second and third interior spaces are fluidly connected to allow hot air to flow from the second interior space to the third interior space; and at least one cooling unit / coil is operable to conditioned the hot air in the third interior space into cold air and deliver the cold air through the second thermal barrier into the first interior space.

[0010] In some implementations, at least one fan and at least one cooling unit / coil are configured to recirculate air sequentially through the first internal space, the second internal space, and the third internal space.

[0011] In some implementations, the first thermal barrier is a ceiling or partition, at least one fan is mounted in the ceiling, the second thermal barrier is a wall, and at least one cooling unit / coil is positioned adjacent to the wall.

[0012] In some embodiments, the data center further includes: at least one sensor located in at least one of a first interior space or a second interior space, the at least one sensor being configured to sense at least one of air temperature or pressure; and a controller communicatively coupled to at least one fan and at least one sensor. The controller includes processing circuitry configured to receive output from the at least one sensor and independently control the at least one fan based on the output received from the at least one sensor.

[0013] In some implementations, the controller is also communicatively coupled to at least one cooling unit / coil, and the processing circuitry is also configured to control at least one cooling unit based on input received from at least one sensor.

[0014] In some embodiments, at least one fan includes a plurality of fans forming at least one fan row, the at least one fan row being positioned above at least one row / channel of electronic devices housed in a first internal space.

[0015] In some implementations, the data center further includes: at least one rack row for mounting electronic equipment located in a first interior space; and at least one aisle located adjacent to the at least one rack row, wherein: at least one fan is located above the at least one rack row and configured to draw hot air from above the at least one rack row; and at least one cooling unit / coil is configured to direct cool air toward the at least one aisle.

[0016] According to another aspect, this disclosure relates to a data center comprising: a first interior space for housing electronic equipment; a second interior space positioned laterally to the first interior space and housing at least one cooling unit / coil; and a third interior space positioned above the first interior space and housing / supporting at least one fan. A first thermal separator / barrier is positioned between the first and second interior spaces. A second thermal separator / barrier is positioned between the third and first interior spaces. In use: at least one cooling unit / coil is operable to draw hot air from the first interior space through the first thermal barrier into the second interior space, conditioned the hot air into cold air; the second and third interior spaces are fluidly connected such that cold air flows from the second interior space to the third interior space; and at least one fan is operable to deliver cold air from the third interior space through the second thermal barrier to the first interior space.

[0017] According to another aspect, this disclosure relates to a system for regulating and recirculating air in a data center, the data center including electronics positioned within an interior space. In one embodiment, the system includes: a first air chamber positioned above the interior space and housing at least one fan; a second air chamber positioned laterally to the interior space and housing at least one cooling unit / coil; at least one sensor positioned within the interior space and configured to sense at least one of air temperature and pressure within the interior space; and a controller communicatively coupled to the at least one fan, the at least one sensor, and the at least one cooling unit. In another embodiment, the controller includes processing circuitry configured to: receive output from the at least one sensor; independently control the at least one fan based on the output received from the at least one sensor; and independently control the at least one cooling unit based on the output received from the at least one sensor.

[0018] In some embodiments, the controller is configured to: operate at least one fan to draw hot air from the interior space into a first air chamber; operate at least one cooling unit to regulate the hot air in a second air chamber into cold air; and operate at least one cooling unit to deliver cold air into the interior space.

[0019] In some embodiments, at least one fan is positioned to draw hot air from above at least one electronic device rack, and at least one cooling unit is configured to direct cool air to at least one channel positioned adjacent to at least one electronic device rack.

[0020] In some embodiments, the controller is configured to: operate at least one cooling unit to draw hot air from the interior space, regulate the hot air to cold air, and deliver the cold air to the second air chamber; and operate at least one fan to deliver the cold air in the first air chamber to the interior space.

[0021] In some embodiments, at least one cooling unit is configured to draw hot air from a channel in the interior space; and at least one fan is configured to direct cool air toward at least one electronic device rack located adjacent to at least one channel.

[0022] In some implementations, the first and second air chambers are thermally separated from the interior space.

[0023] This summary is provided solely as an introduction to the subject matter fully described in the following detailed description and accompanying drawings. It should not be construed as describing essential features or used to define the scope of the claims. Furthermore, it should be understood that both the foregoing summary and the following detailed description are illustrative only and are not necessarily limiting of the claimed subject matter. Attached Figure Description

[0024] The implementation of this disclosure can be better understood when considering the following detailed description. Such description refers to the included drawings, which are not necessarily drawn to scale, and for clarity, some features may be exaggerated, while others may be omitted or schematically represented. Similar reference numerals in the drawings may indicate and refer to the same or similar elements, features, or functions. In the drawings:

[0025] Figure 1 This is a schematic diagram of a data center cooling system according to the present disclosure;

[0026] Figure 2 This is a schematic diagram illustrating a first embodiment of a data center cooling system according to the present disclosure;

[0027] Figure 3 yes Figure 2A top view of a data center implementation method, illustrating a first recirculation airflow configuration;

[0028] Figure 4 yes Figure 2 A top-down view of the data center, illustrating the second recirculation airflow configuration;

[0029] Figure 5 This is a schematic diagram illustrating a second embodiment of a data center cooling system according to the present disclosure;

[0030] Figure 6 yes Figure 5 A top view of a data center implementation method, illustrating a first recirculation airflow configuration; and

[0031] Figure 7 yes Figure 5 A top view of a data center implementation method, illustrating the second recirculation airflow configuration. Detailed Implementation

[0032] Before explaining one or more embodiments of this disclosure in detail, it should be understood that the embodiments, in their application, are not limited to the details of the construction and arrangement of the components, steps, or methods set forth in the following description or illustrated in the accompanying drawings. In the following detailed description of the embodiments, many specific details may be set forth to provide a more thorough understanding of this disclosure. However, it will be readily understood by those skilled in the art who will benefit from this disclosure that the embodiments disclosed herein can be practiced without some of these specific details. In other instances, well-known features may not be described in detail to avoid unnecessarily complicating this disclosure.

[0033] As used herein, the letters following the reference numerals are intended to designate embodiments of features or elements that may be similar to, but not necessarily identical to, previously described elements or features having the same reference numerals (e.g., 1, 1a, 1b). Such abbreviated symbols are used for convenience only and should not be construed as limiting this disclosure in any way unless expressly stated otherwise.

[0034] Furthermore, unless explicitly stated otherwise, "or" refers to an inclusive "or," not an exclusive "or." For example, conditions A or B are satisfied by any of the following: A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); and both A and B are true (or exist).

[0035] Additionally, the terms "a" or "an" may be used to describe elements and components of the embodiments disclosed herein. This is done merely for convenience, and "a" and "an" are intended to include "one" or "at least one," and the singular forms also include the plural, unless it is obvious otherwise.

[0036] Finally, as used herein, any reference to “one embodiment” or “some embodiments” means that a particular element, feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment disclosed herein. The phrase “in some embodiments” appearing in various places throughout this specification does not necessarily refer to the same embodiment, and an embodiment may include one or more features explicitly described or inherent in this document, or any combination or sub-combination of two or more such features, as well as any other features that may not necessarily be explicitly described or inherent in this disclosure.

[0037] In a broader sense, embodiments of this disclosure relate to systems for cooling a volume of air in a data center to manage heat generated by operating electronic devices. In these embodiments, separate internal spaces are provided, and these separate internal spaces are thermally separated from other internal spaces. At least some of the internal spaces contain devices for circulating and / or regulating air. The internal spaces and the contained devices are configured such that a recirculating airflow is generated to draw hot air away from the electronic devices and return cool air to the electronic devices by sequentially flowing air through the internal spaces. In some embodiments, at least one fan is positioned above the electronic devices such that air moves through the ceiling, and at least one cooling unit is positioned laterally relative to the electronic devices such that air further moves through at least one wall.

[0038] The benefits and advantages of the embodiments disclosed herein include, but are not limited to, increased volume of recirculated air in the data center environment due to the use of multiple fans per row, and more uniform air temperature distribution (e.g., reduced hot spots) due to the proximity of fans to the rack and the controllability of individual fans. Furthermore, compared to conventional cooling systems, benefits include greater flexibility in positioning electronics, increased device density, and fewer coolant supply and delivery connections.

[0039] Figure 1This illustration shows a schematic diagram of a data center cooling system 100 according to the present disclosure. The system typically includes partitioned and thermally separated internal spaces to house different devices. In one embodiment, a first internal space 102 houses electronic devices such as computing devices, storage devices, power supplies, cables, etc. The electronic devices can be mounted to racks 104, which are arranged to form rack rows 106 separated by aisles 108a, 108b for easy access to the electronic devices. The racks can be mounted on the floor and extend upwards. As shown, rack rows 106 and aisles 108a, 108b are oriented parallel to the longitudinal axis of the first internal space 102. A data center can include any number of racks 104, rack rows 106, aisles 108a, 108b, etc., in various non-limiting configurations. The rack rows 106 and aisles 108a, 108b are in specific configurations as shown, taking into account the position of additional internal spaces relative to the first internal space 102.

[0040] System 100 also includes a second internal space 110 positioned above the first internal space 102. In embodiments, the second internal space 110 may be defined or positioned within a ceiling, air chamber, isolation partition, etc. The second internal space 110 accommodates at least one fan 112, and alternatively accommodates multiple fans 112. The number and position of the fans 112 may correspond to at least one of the number of rack rows 106, the size of the rack rows 106, etc. As shown, multiple fans 112 are positioned to form fan rows 114, wherein each row of fans 112 corresponds to and is aligned with one row of rack rows 106, as discussed further below. Isolation strategies 111 can be applied to physically separate hot and cold air within space 102 to prevent hot and cold air from mixing, thereby ensuring optimal performance of electronic equipment. For example, two types of isolation systems may exist, including different aisle arrangements, namely hot aisle isolation 108a and cold aisle isolation 108b. Hot aisle isolation may include enclosing a hot aisle where hot air is exhausted from the server, and cold air isolation may include enclosing a cold aisle where cold air is supplied to the server.

[0041] The first internal space 102 is configured to contain a first volume of air. As described above, system 100 can apply isolation strategies to prevent hot and cold air from mixing. For illustrative and comparative purposes, the volume of air contained in the first internal space 102 and the cold aisle 108b can be considered as “cold” air from the cooling unit / coil, and the hot aisle 108a can be considered “hot” due to heat generated by operating the electronics housed in the rack 104 of the first internal space 102. The second internal space 110 is configured to contain a second volume of air. A first thermal barrier 116 is positioned between the first internal space 102 and the second internal space 110 to provide thermal separation between the volumes of air. In embodiments, the first thermal barrier 116 can be a physical barrier such as a ceiling, false ceiling, air chamber wall, etc. At least one fan 112 can be mounted to the first thermal barrier 116, for example, mounted in the ceiling. In use, at least one fan 112 operates to move air through the first thermal barrier 116, for example, to draw hot air from the first internal space 102 into the second internal space 110.

[0042] System 100 also includes a third internal space 118 located to at least one lateral side of the first internal space 102. As shown, the third internal space 118 is implemented as a columnar portion located to a single lateral side of the first internal space 102. The third internal space 118 is configured to house at least one cooling unit 120, also referred to as a wound coil or heat exchanger, which is operated to regulate air. The third internal space 118 houses a third volume of air that is thermally separated from the first volume of air by a second thermal barrier 122 located between the third internal space 118 and the first internal space 102. In embodiments, the second thermal barrier 122 may be a physical barrier such as a wall, housing, or combination of walls and housing of at least one cooling unit 118. In use, at least one cooling unit 120 is operated to regulate hot air drawn into the cooling unit into “cold” air, such as air from within the third internal space 118, and to deliver the cold air to, for example, the first internal space 102. Specific airflow configurations are further described below.

[0043] System 100 also includes at least one sensor 124 for sensing conditions within the data center. In one embodiment, the at least one sensor 124 is positioned within a first interior space 102 and relative to at least one rack row 106. In an exemplary embodiment, the at least one sensor 124 includes a plurality of sensors positioned to form sensor rows, wherein each row of sensors corresponds to at least one row in the rack row 106 or at least one predetermined portion of the first interior space 102. For example, the at least one sensor 124 may be mounted to or on top of the rack row 106 to sense at least one condition relating to the environment adjacent to a particular electronic device. The sensed conditions may include, but are not limited to, air temperature (cold and / or hot) and air pressure, and the sensor type may include any conventional sensor type used for sensing the aforementioned conditions. In one embodiment, the sensor 124 may be networked according to rows, predefined areas, etc.

[0044] System 100 also includes at least one controller 126, which includes processing circuitry 128. The at least one controller 126 may be located within a data center, remotely, or both. In one embodiment, the at least one controller 126 is communicatively coupled to at least one sensor 124, at least one fan 112, and at least one cooling unit 120. In use, the processing circuitry 128 is configured to receive output data from the at least one sensor 124, process the received output data, and use the processed data to control each of the at least one fan 112 and the at least one cooling unit 120. The at least one cooling unit 120 may employ a sensor to define the supply temperature. In an exemplary embodiment, each of the at least one fan 112 and the at least one cooling unit 120 is independently controllable, allowing for the application of greater airflow and / or cooling effects where needed, for example, to avoid hotspots. The at least one controller 126 may be configured to operate the equipment programmatically or on demand.

[0045] In some embodiments, at least one controller 126 is configured to receive, determine, instruct, execute, etc. At least one controller 126 may include at least one processor, memory, and a communication interface, wherein the processor provides processing functionality for at least one respective controller and may include any number of processors, microcontrollers, circuits, field-programmable gate arrays (FPGAs) or other processing systems, as well as resident or external memory for storing data, executable code, and other information accessed or generated by the respective controller. The processor may execute one or more software programs embodied in a non-transitory computer-readable medium (e.g., memory) implementing the techniques described herein. The processor is not limited by the materials forming the processor or the processing mechanisms employed in the processor, and therefore may be implemented via semiconductors and / or transistors (e.g., using electronic integrated circuit (IC) components), etc.

[0046] Memory can be an example of a tangible computer-readable storage medium that provides storage functionality to store various data and / or program code associated with the operation of a processor, such as software programs and / or code segments, or other data used to instruct the processor and possibly other components of a controller to perform the functions described herein. Thus, memory can store data, such as instruction programs for operating a corresponding controller, including components of the corresponding controller (e.g., processor, communication interface, etc.). It should be noted that while a single memory is described, various types and combinations of memory (e.g., tangible non-transitory memory) can be employed. Memory can be integrated with a processor, can include independent memory, or can be a combination of both. Some examples of memory can include removable and non-removable memory components, such as random access memory (RAM), read-only memory (ROM), flash memory (e.g., Secure Digital (SD) memory cards, mini SD memory cards, and / or micro SD memory cards), solid-state drive (SSD) memory, magnetic storage, optical storage, universal serial bus (USB) memory devices, hard disk storage, external storage, etc.

[0047] The communication interface can be operatively configured to communicate with components of the corresponding controller. For example, the communication interface can be configured to retrieve data from a processor or other device, transfer data for storage in memory, retrieve data from storage devices in memory, etc. The communication interface can also be communicatively coupled to a processor to facilitate data transfer between components of the corresponding controller and the processor. It should be noted that although the communication interface is described as a component of the corresponding controller, one or more components of the communication interface can be implemented as communicatively coupled to external components of the corresponding controller via wired and / or wireless connections. The corresponding controller may also include and / or be connected via the communication interface to one or more input / output (I / O) devices (e.g., human-machine interface (HMI) devices). In embodiments, the communication interface may include a transmitter and a receiver.

[0048] Figure 2A first airflow configuration of system 100 is schematically illustrated. As shown, a second interior space 110 is positioned above the first interior space 102, and a third interior space 118 is positioned to the side of the first interior space 102. In some embodiments, the second interior space 110 and the third interior space 118 may be fluidly connected, for example, integrally formed, allowing air to flow freely between the two spaces and through a pressure difference between the two volumes of air. In the illustrated configuration, at least one fan 112 is operable to draw hot air from the first interior space 102, particularly from the hot passage 108a, through the first thermal barrier 116 into the second interior space 110, and at least one cooling unit 120 is operable to conditioned the hot air in the third interior space 118 into cold air and deliver or reintroduce the cold air through the second thermal barrier 122 into the first interior space 102. As used herein, the terms “hot” and “cold” do not refer to a specific temperature or temperature range, but are used relatively to define “hot” as having a higher temperature compared to “cold”.

[0049] At least one fan 112 and at least one cooling unit 120 are disconnected and isolated such that they cooperate to sequentially recirculate air through the first internal space 102, the second internal space 110, and the third internal space 118. In use, air draws heat upward from the first internal space 102, which houses the electronics, removes the heat to the outside of the first internal space 102, and reintroduces cool air into the first internal space 102. At least one fan 112 is positioned above the first internal space 102 to draw hot air upward. A fluid connection allows hot air to flow between the second internal space 110 and the third internal space 118. Hot air in the third internal space 118 is drawn into at least one cooling unit 120 and conditioned into cool air before being reintroduced into the first internal space 102. In a non-limiting example, at least one cooling unit 120 may be a heat exchanger.

[0050] Figure 3 The illustration shows the following based on Figure 2A first implementation of a first embodiment of the airflow configuration. As shown, rack rows 106 and channels 108 (e.g., hot channels 108a and cold channels 108b) are positioned parallel to each other, and the longitudinal axes of rack rows 106 and channels 108 are aligned with the direction of airflow delivered from the third interior space 118. Fan rows 114 are similarly oriented and positioned laterally displaced relative to their respective rack rows 106, such that fan rows 114 are positioned above channels 108. Each cooling unit 120 is positioned longitudinally along rack rows 106. As the distance away from at least one cooling unit 120 increases, the controller can operate at least one fan 112 positioned away from at least one cooling unit 120 at a greater speed, so that at least one fan 112 positioned away from at least one cooling unit 120 moves a larger volume of air compared to at least one fan 112 positioned nearby.

[0051] Figure 4 The illustration shows the following based on Figure 2 A second implementation of the first embodiment of the airflow configuration. As shown, rack rows 106 and channels 108 (e.g., hot channels 108a and cold channels 108b) are positioned parallel to each other, and the longitudinal axes of rack rows 106 and channels 108 are aligned with the direction of airflow delivered from the third interior space 118. Fan rows 114 are positioned directly above the respective rack rows 106, and at least one cooling unit 120 is positioned to direct cold air toward the rack rows 106. Each cooling unit 120 is positioned relative to at least one rack row 106 such that the main return airflow runs longitudinally along the rack row 106. As the distance away from at least one cooling unit 120 increases, the controller can operate at least one fan 112 positioned away from at least one cooling unit 120 at a greater speed, so that at least one fan 112 positioned away from at least one cooling unit 120 moves a larger volume of air compared to at least one fan 112 positioned nearby.

[0052] Figure 5A second airflow configuration of system 100 is schematically illustrated. As shown, a second interior space 110 is positioned above a first interior space 102, and a third interior space 118 is positioned laterally to the first interior space 102. In some embodiments, the second interior space 110 and the third interior space 118 may be fluidly connected, for example, integrally formed, allowing air to flow freely between the two spaces. In the illustrated configuration, at least a cooling unit 120 is operable to draw hot air laterally from the first interior space 102 through a second thermal barrier 122. The drawn-in air is conditioned to remove heat to generate cold air, and the generated cold air is delivered to the third interior space 118. Considering the fluid connection between the second interior space 110 and the third interior space 118, cold air migrates from the third interior space 118 to the second interior space 110 due to the negative pressure generated in the second interior space 110 by operating at least one fan 112. The cold air is then delivered, for example, through a first thermal barrier 116 from a thermal passage 108s into the first interior space 102. Similarly, as used in this article, the terms “hot” and “cold” do not refer to a specific temperature or temperature range, but are used comparatively.

[0053] Similar to the first embodiment described above, at least one fan 112 and at least one cooling unit 120 are disconnected and separated such that they cooperate to sequentially recirculate air through the third internal space 118, the second internal space 110, and the first internal space 102. In use, the air draws heat laterally away from the first internal space 102 housing the electronics, removes the heat to the outside of the first internal space 102, and reintroduces cool air from above into the first internal space 102. At least one fan 112 is positioned above the first internal space 102 to direct the cool air downwards. In a non-limiting example, at least one cooling unit 120 may be a heat exchanger.

[0054] Figure 6 The illustration shows the following based on Figure 5 The first implementation of the second embodiment of the airflow configuration. As shown, rack rows 106 and channels 108 (e.g., hot channels 108a and cold channels 108b) are positioned parallel to each other, and the longitudinal axes of rack rows 106 and channels 108 are aligned with the airflow direction toward the third interior space 118. Fan rows 114 are similarly oriented and positioned laterally displaced relative to their respective rack rows 106, such that fan rows 114 are positioned above channels 108. As the distance away from at least one cooling unit 120 increases, the controller can operate at least one fan 112 positioned away from at least one cooling unit 120 at a greater speed, so that at least one fan 112 positioned away from at least one cooling unit 120 moves a larger volume of air compared to at least one fan 112 positioned nearby.

[0055] Figure 7 The illustration shows the following based on Figure 5 A second implementation of the second embodiment of the airflow configuration. As shown, rack rows 106 and channels 108 (e.g., hot channels 108a and cold channels 108b) are positioned parallel to each other, and the longitudinal axes of rack rows 106 and channels 108 are aligned with the direction of airflow drawn into the third internal space 118. Fan rows 114 are positioned directly above the respective rack rows 106, and at least one cooling unit 120 is positioned to draw hot air away from the rack rows 106. As the distance from at least one cooling unit 120 increases, the controller can operate at least one fan 112 positioned away from at least one cooling unit 120 at a greater speed, so that at least one fan 112 positioned away from at least one cooling unit 120 moves a larger volume of air compared to at least one fan 112 positioned nearby.

[0056] Based on the above description, it is clear that the present disclosure disclosed herein is well suited to achieving the purposes mentioned herein and obtaining the advantages mentioned herein as well as those inherent in the present disclosure. While exemplary embodiments of the present disclosure have been described for the purposes of this disclosure, it will be understood that many modifications can be made that will be readily apparent to those skilled in the art, and that such modifications are implemented within the broad scope and coverage of the present disclosure and claims.

Claims

1. A data center, comprising: A first internal space, in which electronic devices are disposed, the first internal space including at least one hot aisle and at least one cold aisle separated according to an isolation strategy; A second interior space, defined above the first interior space, the second interior space accommodating at least one fan; A third interior space, defined to the side of the first interior space, the third interior space accommodating at least one cooling unit or heat exchanger; A first thermal barrier is positioned between the first internal space and the second internal space; as well as A second thermal barrier is located between the third internal space and the first internal space; In use: The at least one fan is configured to draw hot air from the first interior space through the first thermal barrier into the second interior space; The second interior space and the third interior space are fluidly connected such that hot air flows from the second interior space to the third interior space; and The at least one cooling unit is configured to regulate hot air in the third interior space into cold air and deliver the cold air through the second thermal barrier into the first interior space.

2. The data center according to claim 1, wherein, The at least one fan and the at least one cooling unit are configured to recirculate air sequentially through the first internal space, the second internal space, and the third internal space.

3. The data center according to claim 1, wherein: The first thermal barrier is the ceiling; The at least one fan is installed in the ceiling; The second thermal barrier is a wall; and The at least one cooling unit is disposed adjacent to the wall.

4. The data center according to claim 1, further comprising: At least one sensor is disposed in the first interior space, and the at least one sensor is configured to sense at least one of air temperature or air pressure in the first interior space; as well as A controller, communicatively connected to the at least one fan and the at least one sensor, includes processing circuitry configured to: Receive at least one output from the at least one sensor; and The at least one fan is controlled independently based on the output received from the at least one sensor.

5. The data center according to claim 4, wherein, The controller is also communicatively connected to the at least one cooling unit, and the processing circuitry is further configured to control the at least one cooling unit based on inputs received from the at least one sensor.

6. The data center according to claim 4, wherein, The at least one fan includes a plurality of fans defining at least one fan row, the at least one fan row being disposed above at least one electronic device row being disposed in the first internal space.

7. The data center according to claim 1, further comprising: At least one rack row, the at least one rack row being used to mount electronic devices positioned in the first internal space; as well as At least one hot aisle and at least one cold aisle are defined adjacent to the at least one rack row; in: The at least one fan is positioned above the at least one rack row and configured to draw hot air from above the at least one rack row; and The at least one cooling unit is configured to direct cold air toward at least one channel.

8. A data center, comprising: A first internal space, the first internal space being used to accommodate electronic devices; A second interior space, positioned to the side of the first interior space, the second interior space accommodating at least one cooling unit; A third interior space, positioned above the first interior space, is provided to accommodate at least one fan. A first thermal barrier is positioned between the first internal space and the second internal space; as well as A second thermal barrier is located between the third internal space and the first internal space; In use: The at least one cooling unit is operable to draw hot air from the first internal space through the first thermal barrier into the second internal space and to regulate the hot air into cold air. The second interior space and the third interior space are fluidly connected such that cold air flows from the second interior space to the third interior space; and The at least one fan is operable to deliver cool air from the third interior space through the second thermal barrier into the first interior space.

9. The data center according to claim 8, wherein, The at least one cooling unit and the at least one fan are configured to recirculate air sequentially through the first internal space, the second internal space, and the third internal space.

10. The data center according to claim 8, wherein: The first thermal barrier is a wall; The at least one cooling unit is positioned adjacent to the wall; The second thermal barrier is the ceiling; and The at least one fan is installed in the ceiling.

11. The data center according to claim 8, further comprising: At least one sensor, the at least one sensor being positioned in the first interior space, the at least one sensor being configured to sense at least one of air temperature or air pressure in the first interior space; as well as A controller, communicatively connected to the at least one fan and the at least one sensor, includes processing circuitry configured to: Receive at least one output from the at least one sensor; and The at least one fan is controlled independently based on the output received from the at least one sensor.

12. The data center according to claim 11, wherein, The controller is also communicatively connected to the at least one cooling unit, and the processing circuitry is further configured to control the at least one cooling unit based on inputs received from the at least one sensor.

13. The data center according to claim 11, wherein, The at least one fan includes a plurality of fans forming at least one fan row, the at least one fan row being positioned above at least one row of electronic devices housed in the first interior space.

14. The data center according to claim 8, further comprising: At least one rack row, the at least one rack row being used to mount electronic devices positioned in the first internal space; as well as At least one hot aisle and at least one cold aisle, the at least one hot aisle and at least one cold aisle being adjacent to the at least one rack row; in: The at least one cooling unit is configured to draw hot air from at least one channel; and The at least one fan is positioned above the at least one rack row and configured to direct cool air toward the at least one rack row.

15. A system for conditioning and recirculating air in a data center, the data center including electronic equipment positioned within an interior space, the system comprising: A first space, which can be positioned above the interior space, and the first space accommodates at least one fan; A second space, which can be positioned to the side of the interior space, accommodates at least one cooling unit and is fluidly connected to the first space; At least one sensor, the at least one sensor being able to be located in the interior space, the at least one sensor being configured to sense at least one of air temperature or air pressure in the interior space; A controller, communicatively connected to the at least one fan, the at least one sensor, and the at least one cooling unit, includes processing circuitry configured to: Receive at least one output from the at least one sensor; The at least one fan is independently controlled based on at least one output received from the at least one sensor; and The at least one cooling unit is independently controlled based on at least one output received from the at least one sensor.

16. The system according to claim 15, wherein, The controller is configured to: The at least one fan is operated to draw hot air from the interior space into the first space; The at least one cooling unit is operated to regulate the hot air in the second space into cold air; and The at least one cooling unit is operated to deliver cold air into the interior space.

17. The system according to claim 16, wherein: The at least one fan is configured to draw hot air from above at least one electronic device rack; and The at least one cooling unit is configured to direct cold air to at least one channel located adjacent to the rack of the at least one electronic device.

18. The system according to claim 15, wherein, The controller is configured to: The at least one cooling unit is operated to draw hot air from the internal space, adjust the hot air into cold air, and deliver the cold air into the second space; and The at least one fan is operated to deliver cool air from the first space to the interior space.

19. The system according to claim 18, wherein: The at least one cooling unit is configured to draw hot air from a channel in the interior space; and The at least one fan is configured to direct cold air toward at least one electronic device rack located adjacent to at least one channel.

20. The system according to claim 15, wherein, Each of the first space and the second air chamber is thermally separated from the internal space.

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