Structure of tackifying hot plate for slightly warped sheet

Abstract

The invention discloses a tackifying hot plate structure for a slightly warped sheet. The tackifying hot plate structure comprises a base plate, a hot plate assembly is installed on the base plate, an upper cover is arranged above the hot plate assembly, two lifting assemblies for driving the upper cover to ascend and descend are installed on the base plate, and a jacking mechanism is installed on the base plate. The heating disc assembly comprises a bottom disc and a top disc, a heating wire is installed between the bottom disc and the top disc, a groove is formed in the outer side of the top end of the top disc, a silica gel ring and a sealing ring are installed on the portions, located on the inner side and the outer side of the groove, of the top disc respectively, and a plurality of threaded holes communicated with the groove are formed in the side face of the top disc. And a third air pipe joint is mounted at the threaded hole of the top tray. A silica gel ring and a sealing ring are installed on the inner side and the outer side of the groove of the top disc respectively, the silica gel ring is used for keeping the cavity sealed, the sealing ring is used for keeping nitrogen sealed, three nitrogen inlets are formed in the periphery, and nitrogen is filled through a connector.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor manufacturing equipment, specifically a structure for an adhesive heating plate used in micro-warped wafers. Background Technology

[0002] The existing surface mount bonding process requires heating the wafer using a wafer heating pad, which requires a high degree of flatness on the surface of the wafer heating pad during the heating process.

[0003] The existing publication number CN119852233A discloses a wafer heating plate and a semiconductor production line, belonging to the field of semiconductor processing. The wafer heating plate includes a vacuum adsorption platform, a heating platform, a heat insulation platform, a vacuum pump connector, and a controller. The vacuum adsorption platform has a vacuum groove, and the heating platform is located on its lower surface. The heat insulation platform has first and second heat insulation layers. Multiple spring blocks are provided along the edge of the second heat insulation layer, with one end of each spring block abutting against the upper surface of the vacuum adsorption platform. The first and second heat insulation layers are used for heat insulation and heat dissipation, respectively, and the spring blocks restrict the thermal expansion of the vacuum adsorption platform. Each platform and heat insulation layer has corresponding first, second, third, and fourth channels, forming a vacuum channel. The vacuum groove communicates with the vacuum channel, and one end of the fourth channel is connected to the vacuum pump connector. The controller connects the heating platform and the vacuum pump connector, and is used to adjust the heating state and the gas pressure within the vacuum channel. This application can increase the flatness of the wafer heating plate surface under high-temperature conditions and improve the bonding effect.

[0004] While existing technologies have achieved wafer heating, the sealing performance at the wafer is poor. To address this, we propose a structure for an adhesive heating plate for micro-warped wafers. Summary of the Invention

[0005] The purpose of this invention is to provide a structure for an adhesive heating plate for micro-warped plates, in order to solve the problems in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a structure for an adhesive heating plate for a micro-warped sheet, comprising a substrate, a heating plate assembly mounted on the substrate, a top cover disposed above the heating plate assembly, two lifting assemblies for driving the top cover to rise and fall on the substrate, and a lifting mechanism mounted on the substrate; the heating plate assembly includes a base plate and a top plate, a heating wire is installed between the base plate and the top plate, a groove is formed on the outer side of the top of the top plate, a silicone ring and a sealing ring are respectively installed on the inner and outer sides of the groove on the top plate, a plurality of threaded holes communicating with the groove are formed on the side of the top plate, and a third air pipe connector is installed on the top plate at the threaded holes.

[0007] Preferably, the top plate is provided with a plurality of limit guide posts at equal intervals, and the bottom plate is provided with a heat insulation pad; the bottom plate is provided with a temperature control switch and a temperature sensor, and the plate is mounted on a base plate by support posts.

[0008] Preferably, the upper cover includes a cover plate and an air inlet plate, the cover plate has an air inlet in the middle, and the air inlet plate is installed on the cover plate at the air inlet; the lifting assembly includes a first adapter plate and a lifting cylinder, the lifting cylinder drives the first adapter plate to lift and lower, and the first adapter plate and the cover plate are fixed by screws.

[0009] Preferably, the lifting mechanism includes a lifting mechanism and a sealing mechanism, wherein the lifting mechanism drives the sealing mechanism to move up and down.

[0010] Preferably, the lifting mechanism includes a base plate, a motor and a back plate mounted on the base plate, a lead screw seat mounted on the back plate, a lead screw mounted on the lead screw seat, a driven synchronous pulley mounted at the bottom end of the lead screw, a driving synchronous pulley driven by the motor, and a synchronous belt connecting the driven and driving synchronous pulleys; a second adapter plate is slidably mounted on one side of the back plate, a fourth adapter plate is mounted on the top of the second adapter plate, and a nut that mates with the lead screw is mounted on the fourth adapter plate; a third adapter plate is mounted at the bottom end of the second adapter plate, and a lifting plate is mounted on the third adapter plate.

[0011] Preferably, the sealing mechanism includes a lifting column fixing plate, a lifting column, a guide spline shaft, and a sealing plate. The sealing plate is fixed to the hot plate assembly with screws. A guide spline shaft is installed in the middle of the sealing plate. The guide spline shaft is a hollow shaft. A first air pipe connector is installed at the bottom end of the guide spline shaft. The sealing plate has a lifting column through hole and an air groove. The air groove extends to the lifting column through hole. A lifting column fixing plate is slidably installed on the guide spline shaft. Multiple lifting columns are installed at equal intervals on the lifting column fixing plate. The lifting column is a hollow structure. A suction cup is installed at the top of the lifting column. The lifting column fixing plate has an annular air passage that cooperates with the lifting column. A second air pipe connector communicating with the annular air passage is installed on the lifting column fixing plate.

[0012] Preferably, the substrate is equipped with a first protective cover and a second protective cover.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] 1. The top plate has silicone rings and sealing rings installed on the inner and outer sides of the groove, respectively. The silicone rings maintain the cavity seal, while the sealing rings are used for nitrogen gas sealing. There are three nitrogen inlets around the perimeter, which are filled with nitrogen through connectors. The sealing mechanism is located below the hot plate and evacuates air through the gap holes in the support column to maintain a vacuum on the plate surface. It also seals the support column, preventing vacuum leakage when the support column moves up and down. The top cover is raised and lowered by a cylinder, pressing against the sealing ring on the hot plate surface to maintain a vacuum inside the cavity. An HMDS pipeline is located above for injecting HMDS. The raising and lowering mechanism is connected to the sealing mechanism, causing the support column to rise and fall.

[0015] 2. Silicone rings and sealing rings are installed on the inner and outer sides of the top plate in the groove, respectively. The silicone rings are used to maintain the cavity seal, and the sealing rings are used to maintain the seal with nitrogen, which can effectively maintain the overall airtightness of the hot plate cavity. At the same time, the upper plate surface integrates a four-sided nitrogen sealing function, which, together with the sealing rings, can achieve better sealing. The sealing mechanism below provides a channel for vacuuming the plate surface, while ensuring a seal during the lifting and lowering of the support column, and also allowing a vacuum to be applied to the support column. A suction cup is installed above to prevent the warped wafer from moving or springing back and deforming during the lifting and lowering process. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a schematic diagram of the structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0019] Figure 3 This is the present invention. Figure 2 Partial structural diagram;

[0020] Figure 4 This is a top view of the present invention;

[0021] Figure 5 This is a cross-sectional view of the present invention;

[0022] Figure 6 This is the present invention. Figure 3 A structural diagram from the bottom view;

[0023] Figure 7 This is a schematic diagram of the hot plate assembly of the present invention;

[0024] Figure 8 This is the present invention. Figure 7 Top view;

[0025] Figure 9 This is the present invention. Figure 8 A sectional view;

[0026] Figure 10 This is a schematic diagram of the structure of the upper cover and lifting assembly of the present invention;

[0027] Figure 11 This is a schematic diagram of the lifting mechanism of the present invention;

[0028] Figure 12 This is a schematic diagram of the sealing mechanism of the present invention;

[0029] Figure 13This is a structural schematic diagram of the sealing mechanism of the present invention from the upper view.

[0030] In the diagram: 1. Base plate; 2. First protective cover; 3. Second protective cover; 4. Top cover; 5. Lifting assembly; 6. Hot plate assembly; 7. Lifting mechanism; 41. Cover plate; 42. Air inlet plate; 51. First adapter plate; 52. Lifting cylinder; 71. Lifting mechanism; 72. Sealing mechanism; 711. Base plate; 712. Motor; 713. Lead screw; 714. Lead screw seat; 715. Back plate; 716. Second adapter plate; 717. Third adapter plate; 718. Lifting plate; 719. Fourth adapter plate; 721, Lifting column fixing plate; 722, Lifting column; 723, Suction cup; 724, Guide spline shaft; 725, Sealing plate; 726, First air pipe connector; 727, Second air pipe connector; 601, Support column; 602, Heat insulation pad; 603, Temperature control switch; 604, Chassis; 605, Top plate; 606, Temperature sensor; 607, Third air pipe connector; 608, Sealing ring; 609, Groove; 610, Silicone ring; 611, Limiting guide column. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0032] Please see Figure 1-13In this embodiment of the invention, a structure for an adhesive-enhancing hot plate for a micro-warped sheet includes a substrate 1, on which a hot plate assembly 6 is mounted. A top cover 4 is positioned above the hot plate assembly 6. Two lifting assemblies 5 are mounted on the substrate 1 to drive the top cover 4 up and down. A lifting mechanism 7 is mounted on the substrate 1. A first protective cover 2 and a second protective cover 3 are mounted on the substrate 1. A silicone ring 610 and a sealing ring 608 are respectively mounted on the inner and outer sides of a groove 609 on a top plate 605. The silicone ring 610 is used to maintain a sealed cavity, and the sealing ring 608 is used to maintain a sealed environment with nitrogen. There are three nitrogen inlets around the top plate, through which nitrogen is introduced via connectors. The sealing mechanism 72 is located below the hot plate and evacuates air through gaps in the support column to maintain a vacuum on the plate surface. It also seals the support column, preventing vacuum leakage when the support column moves up and down. The top cover is lifted and lowered by a cylinder, pressing against the sealing ring on the hot plate surface to ensure a vacuum within the cavity. An HMDS pipeline is located above the top, allowing for the injection of HMDS. The lifting mechanism 71 is connected to the sealing mechanism, which drives the support column to rise and fall.

[0033] The heating plate assembly 6 includes a base plate 604 and a top plate 605. A heating wire is installed between the base plate 604 and the top plate 605. A groove 609 is formed on the outer side of the top of the top plate 605. A silicone ring 610 and a sealing ring 608 are respectively installed on the inner and outer sides of the groove 609 on the top plate 605. Multiple threaded holes communicating with the groove 609 are formed on the side of the top plate 605. A third air pipe connector 607 is installed at the threaded holes on the top plate 605. Multiple limiting guide posts 611 are installed at equal intervals on the top of the top plate 605. A heat insulation pad 602 is installed on the bottom of the base plate 604. A temperature control switch 603 and a temperature sensor 606 are installed on the bottom of the base plate 604. The base plate 604 is mounted on the base plate 1 by a support post 601. The top plate 60 has three threaded holes on its side that communicate with the groove. A connector can be installed at these threaded holes to allow nitrogen gas to be supplied. The nitrogen gas is then positioned between the two sealing rings, providing auxiliary sealing. Below the heating plate is a groove for the heating wire. The heating wire is inserted and locked to the bottom of the plate, enabling heating. Compared to other adhesive-enhancing heating plate structures, this design achieves the required function in a simpler way.

[0034] The upper cover 4 includes a cover plate 41 and an air inlet plate 42. An air inlet is provided in the middle of the cover plate 41, and the air inlet plate 42 is installed at the air inlet of the cover plate 41. The lifting assembly 5 includes a first adapter plate 51 and a lifting cylinder 52. The lifting cylinder 52 drives the first adapter plate 51 to rise and fall. The first adapter plate 51 and the cover plate 41 are fixed by screws.

[0035] The lifting mechanism 7 includes a lifting mechanism 71 and a sealing mechanism 72. The lifting mechanism 71 drives the sealing mechanism 72 to rise and fall. The lifting mechanism 71 includes a base plate 711, on which a motor 712 and a back plate 715 are mounted. The back plate 715 is equipped with a lead screw seat 714, on which a lead screw 713 is mounted. A driven synchronous pulley is mounted at the bottom of the lead screw 713. The motor 712 drives a driving synchronous pulley, and the driven and driving synchronous pulleys are connected by a synchronous belt. A second adapter plate 716 is slidably mounted on one side of the back plate 715. A fourth adapter plate 719 is mounted at the top of the second adapter plate 716. A nut that mates with the lead screw 713 is mounted on the fourth adapter plate 719. A third adapter plate 717 is mounted at the bottom of the second adapter plate 716. A lifting plate 718 is mounted on the third adapter plate 717.

[0036] The sealing mechanism 72 includes a lifting column fixing plate 721, a lifting column 722, a guide spline shaft 724, and a sealing plate 725. The sealing plate 725 is fixed to the hot plate assembly 6 by screws. The guide spline shaft 724 is installed in the middle of the sealing plate 725. The guide spline shaft 724 is a hollow shaft. A first air pipe connector 726 is installed at the bottom end of the guide spline shaft 724. The sealing plate 725 has a through hole for the lifting column 722 and an air groove, with the air groove extending to the lifting column 722. At the through hole, a lifting column fixing plate 721 is slidably mounted on the guide spline shaft 724. Multiple lifting columns 722 are evenly spaced on the lifting column fixing plate 721. The lifting column 722 has a hollow structure. A suction cup 723 is installed at the top of the lifting column 722. The lifting column fixing plate 721 has an annular air passage that cooperates with the lifting column 722. A second air pipe connector 727 that communicates with the annular air passage is installed on the lifting column fixing plate 721. The sealing mechanism below communicates with the cavity of the disk surface through three through holes of the lifting column 722. The spline shaft is fixed on the bottom disk surface and is hollow inside. It is connected to the connector through the internal air passage, which can draw vacuum from the disk surface. The guide spline shaft and bushing are used to fix the lifting column 722. The lifting column fixing plate 721 has an annular air passage that cooperates with the lifting column 722. The lifting column fixing plate 721 is equipped with a second air pipe connector 727 that communicates with the annular air passage, which allows the lifting column 722 to be fixed while a vacuum can be passed through.

[0037] The working principle of this invention is as follows: A silicone ring 610 and a sealing ring 608 are respectively installed on the inner and outer sides of the top plate 605 in the groove 609. The silicone ring 610 is used to maintain the cavity seal, and the sealing ring 608 is used to maintain the seal with nitrogen. There are three nitrogen inlets around the top plate, and nitrogen is introduced through the connector. The sealing mechanism 72 is located below the hot plate and evacuates air through the gap holes of the support column to maintain a vacuum on the plate surface. It also seals the support column, preventing vacuum leakage when the support column moves up and down. The top cover is lifted and lowered by a cylinder, pressing against the sealing ring on the hot plate surface to ensure a vacuum inside the cavity. An HMDS pipeline is located above, allowing HMDS to be injected. The lifting mechanism 71 is connected to the sealing mechanism and drives the support column to rise and fall.

[0038] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A structure for an adhesive heating plate for micro-warped wafers, comprising a substrate (1), characterized in that: The base plate (1) is equipped with a heating plate assembly (6), and a top cover (4) is provided above the heating plate assembly (6). The base plate (1) is equipped with two lifting assemblies (5) for driving the top cover (4) to rise and fall. The base plate (1) is equipped with a lifting mechanism (7). The heating plate assembly (6) includes a base plate (604) and a top plate (605). A heating wire is installed between the base plate (604) and the top plate (605). A groove (609) is opened on the outer side of the top of the top plate (605). A silicone ring (610) and a sealing ring (608) are respectively installed on the inner and outer sides of the groove (609) of the top plate (605). A plurality of threaded holes communicating with the groove (609) are opened on the side of the top plate (605). A third air pipe connector (607) is installed on the top plate (605) at the threaded hole.

2. The structure of the adhesive heating plate for a micro-warped plate according to claim 1, characterized in that: The top plate (605) is equipped with multiple limit guide posts (611) at equal intervals at its top end, and the bottom plate (604) is equipped with a heat insulation pad (602); the bottom plate (604) is equipped with a temperature control switch (603) and a temperature sensor (606), and the bottom plate (604) is mounted on the base plate (1) by a support post (601).

3. The structure of the adhesive heating plate for a micro-warped plate according to claim 1, characterized in that: The upper cover (4) includes a cover plate (41) and an air inlet plate (42). An air inlet is provided in the middle of the cover plate (41), and the air inlet plate (42) is installed on the cover plate (41) at the air inlet. The lifting assembly (5) includes a first adapter plate (51) and a lifting cylinder (52). The lifting cylinder (52) drives the first adapter plate (51) to lift. The first adapter plate (51) and the cover plate (41) are fixed by screws.

4. The structure of the adhesive heating plate for a micro-warped plate according to claim 1, characterized in that: The lifting mechanism (7) includes a lifting mechanism (71) and a sealing mechanism (72), wherein the lifting mechanism (71) drives the sealing mechanism (72) to rise and fall.

5. The structure of the adhesive heating plate for a micro-warped plate according to claim 4, characterized in that: The lifting mechanism (71) includes a base plate (711), on which a motor (712) and a back plate (715) are mounted. A lead screw seat (714) is mounted on the back plate (715), and a lead screw (713) is mounted on the lead screw (713). A driven synchronous pulley is mounted on the bottom end of the lead screw (713). The motor (712) drives a driving synchronous pulley. The driven synchronous pulley and the driving synchronous pulley are connected by a synchronous belt. A second adapter plate (716) is slidably mounted on one side of the back plate (715). A fourth adapter plate (719) is mounted on the top end of the second adapter plate (716). A nut that mates with the lead screw (713) is mounted on the fourth adapter plate (719). A third adapter plate (717) is mounted on the bottom end of the second adapter plate (716). A lifting plate (718) is mounted on the third adapter plate (717).

6. The structure of the adhesive heating plate for a micro-warped plate according to claim 5, characterized in that: The sealing mechanism (72) includes a lifting column fixing plate (721), a lifting column (722), a guide spline shaft (724), and a sealing plate (725). The sealing plate (725) is fixed to the hot plate assembly (6) by screws. The guide spline shaft (724) is installed in the middle of the sealing plate (725). The guide spline shaft (724) is a hollow shaft. A first air pipe connector (726) is installed at the bottom end of the guide spline shaft (724). The sealing plate (725) has a through hole for the lifting column (722) and an air groove. The air groove extends to the lifting column. (722) At the through hole, a lifting column fixing plate (721) is slidably installed on the guide spline shaft (724). Multiple lifting columns (722) are installed at equal intervals on the lifting column fixing plate (721). The lifting column (722) has a hollow structure. A suction cup (723) is installed at the top of the lifting column (722). The lifting column fixing plate (721) has an annular air passage that cooperates with the lifting column (722). The lifting column fixing plate (721) is equipped with a second air pipe connector (727) that communicates with the annular air passage.

7. The structure of the adhesive heating plate for a micro-warped plate according to claim 1, characterized in that: The substrate (1) is equipped with a first protective cover (2) and a second protective cover (3).

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