Preparation method of adapter plate, adapter plate and packaging structure

Abstract

The invention provides a preparation method of an adapter plate, the adapter plate and a packaging structure, and the method comprises the steps: removing a part of a metal block, forming a plurality of metal columns which are arranged at intervals, and coating the sides, away from a bearing plate, of the metal columns with a liquid insulating material; and curing the liquid insulating material. The side, away from the bearing plate, of the metal column is coated with the liquid insulating material instead of punching holes in the substrate and arranging the metal column in the holes, so that the substrate is prevented from being damaged during punching, and the liquid insulating material can be cured into any shape according to needs. In addition, the metal column is formed by removing the part of the metal block, a seed layer does not need to be formed in the through hole, and then a metal material does not need to be electroplated to form the metal column, so that the preparation difficulty of the metal column is reduced.

Description

Technical Field

[0001] This application relates to the field of chip packaging technology, specifically to a method for preparing an adapter board, the adapter board, and the packaging structure. Background Technology

[0002] With the booming development of emerging fields such as smartphones, wearable devices, automotive electronics, and artificial intelligence, integrated circuits are moving towards diversified applications, and packaging technology is gradually becoming an important means to achieve miniaturization, lightweighting, and multifunctionality of electronic products. However, packaging technology still faces technical challenges. Summary of the Invention

[0003] To address the aforementioned issues, this application provides a method for preparing an adapter board, the adapter board itself, and its packaging structure.

[0004] In a first aspect, embodiments of this application provide a method for preparing an adapter plate, comprising: setting a metal block on a support plate; patterning the metal block to form a plurality of spaced metal pillars extending in a direction perpendicular to the support plate; coating a side of the metal pillars away from the support plate with a liquid insulating material, wherein at least a portion of the liquid insulating material fills the space between two adjacent metal pillars; and curing the liquid insulating material.

[0005] In conjunction with the first aspect, the metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; wherein, the metal block is patterned to form a plurality of spaced metal columns, including: removing the portion of the second part away from the support plate and retaining the portion of the second part close to the support plate, to form a plurality of spaced metal columns and a metal layer located between the metal columns and the support plate, wherein the orthographic projection of the metal layer on the support plate coincides with the orthographic projection of the first part and the second part on the support plate.

[0006] In conjunction with the first aspect, after curing the liquid insulating material, the preparation method further includes: removing the carrier plate to obtain a substrate, the substrate including a first surface and a second surface disposed opposite to each other, and a metal layer close to the first surface of the substrate; using a grinding process to grind the first surface to expose the metal layer, and grinding the metal layer to expose the metal pillars; and / or using a grinding process to grind the second surface to expose the metal pillars.

[0007] In conjunction with the first aspect, the metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; wherein, the metal block is patterned to form a plurality of spaced metal columns, including: removing the second part to expose the support plate, thereby obtaining a plurality of spaced metal columns.

[0008] In conjunction with the first aspect, after the liquid insulating material is cured, the preparation method further includes: removing the carrier plate to obtain a substrate, the substrate including a first surface and a second surface disposed opposite to each other; and grinding the first surface and / or the second surface using a grinding process to expose the metal pillars.

[0009] In conjunction with the first aspect, the metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; wherein, patterning the metal block to form a plurality of spaced metal columns includes: removing at least a portion of the second part using a laser process; preferably, the pulse width of the laser process is on the picosecond or femtosecond level.

[0010] In conjunction with the first aspect, the metal block includes a first part and a second part, wherein the orthographic projection of the first part on the carrier plate coincides with the orthographic projection of the metal pillar on the carrier plate; wherein, the metal block is patterned to form a plurality of spaced metal pillars, including: forming a patterned photoresist layer on the surface of the first part away from the carrier plate, the photoresist layer having a plurality of photoresist openings, the photoresist openings exposing the surface of the second part away from the carrier plate; and etching at least a portion of the second part.

[0011] In conjunction with the first aspect, the supporting plate includes a base plate and a enclosure structure perpendicular to the base plate, with metal columns disposed on the base plate and the enclosure structure surrounding the metal columns; coating the side of the metal columns away from the supporting plate with a liquid insulating material includes: coating the side of the metal columns away from the supporting plate with a liquid insulating material such that the liquid insulating material fills the gap between two adjacent metal columns and the gap between the metal columns and the enclosure structure; preferably, the height of the enclosure structure perpendicular to the base plate is greater than or equal to the height of the metal columns perpendicular to the base plate; preferably, the liquid insulating material is cured, including: heating the liquid insulating material to cure it; preferably, the liquid insulating material includes a liquid glass material. Preferably, after the liquid insulating material is cured, the carrier plate is removed to obtain a substrate. The substrate includes a first surface and a second surface disposed opposite to each other. The preparation method further includes: sequentially preparing a first redistribution layer, a first solder resist layer, and bumps on the first surface. The first redistribution layer includes a first metal trace layer, or the first redistribution layer includes multiple first metal trace layers and a first dielectric layer disposed between adjacent first metal trace layers, which are sequentially stacked along a direction away from the substrate. Adjacent first metal trace layers are electrically connected through a first interconnect structure. At least a portion of the first metal trace layers are electrically connected to metal pillars. The first solder resist layer has a first solder opening, which exposes at least a portion of the first metal trace layer. The bumps are electrically connected to the portion of the first metal trace layer exposed in the first solder opening. On the second surface, a first redistribution layer, a first solder resist layer, and a first solder resist layer are sequentially prepared. The first redistribution layer includes a first solder resist layer, a first solder resist layer, and a first dielectric layer disposed between adjacent first metal trace layers, which are electrically connected to the portion of the first metal trace layer exposed in the first solder opening. The preparation method further includes: sequentially preparing a first redistribution ... a first dielectric layer, and a first dielectric layer disposed between adjacent first metal trace layers, which are electrically connected to the portion of the first metal trace layer exposed in the first solder opening. The preparation method further includes: sequentially preparing a first redistribution layer, a first solder resist layer, and a first dielectric layer, a first dielectric layer, and a first dielectric layer disposed between adjacent first metal trace layers, a first dielectric layer, and a first dielectric layer disposed between adjacent first metal trace layers, a first dielectric layer, and a first dielectric layer disposed between adjacent first metal trace layers, a first dielectric layer, and a first dielectric layer disposed between The second redistribution layer and the second solder mask layer are then fabricated. The second redistribution layer includes a second metal trace layer, or the second redistribution layer includes multiple second metal trace layers stacked sequentially along a direction away from the substrate and a second dielectric layer disposed between adjacent second metal trace layers. Adjacent second metal trace layers are electrically connected through a second interconnect structure. At least a portion of the second metal trace layers are electrically connected to metal pillars. The second solder mask layer is provided with a second solder opening, which exposes at least a portion of the second metal trace layer. Preferably, after fabricating the first solder mask layer and before fabricating the bumps, the fabrication method further includes: surface treating the portion of the first metal trace layer exposed to the first solder opening using a surface treatment material. Preferably, the surface treatment material includes any one or more of organic solder resist film, immersion nickel gold, immersion nickel palladium gold, and immersion tin.

[0012] Secondly, embodiments of this application provide an adapter board, including an adapter board prepared by the method mentioned above.

[0013] In conjunction with the second aspect, the depth-to-width ratio of the metal column is greater than or equal to 5:1.

[0014] Thirdly, embodiments of this application provide a packaging structure, including: a chip, an adapter board, and a printed circuit board; the adapter board includes the aforementioned adapter board; wherein the chip and the printed circuit board are electrically connected through the adapter board.

[0015] This application provides a method for preparing an adapter board, the adapter board itself, and a packaging structure. The method for preparing the adapter board includes removing a portion of a metal block to form multiple spaced metal pillars; coating the side of the metal pillars away from the support plate with a liquid insulating material; and curing the liquid insulating material. This application coats the side of the metal pillars away from the support plate with liquid insulating material, rather than drilling holes in the substrate and placing metal pillars within the holes. This avoids damage to the substrate during drilling and allows the liquid insulating material to be cured into any shape as needed. Furthermore, this application forms the metal pillars by removing a portion of the metal block, eliminating the need to form a seed layer within the through-hole before electroplating metal material, thus reducing the difficulty of preparing the metal pillars. Attached Figure Description

[0016] Figure 1 This is a schematic flowchart of a method for preparing an adapter plate according to an embodiment of this application.

[0017] Figure 2 This is a schematic diagram of the structure of the metal block and the support plate provided in another embodiment of this application.

[0018] Figure 3 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0019] Figure 4 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0020] Figure 5 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0021] Figure 6 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0022] Figure 7 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0023] Figure 8 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0024] Figure 9 This is a schematic diagram of the fabrication process of the adapter plate provided in another embodiment of this application.

[0025] Figure 10 This is a schematic diagram of the fabrication process of the first redistribution layer, the first solder mask layer, and the bumps provided in another embodiment of this application.

[0026] Figure 11 This is a schematic diagram of the structure of an adapter plate provided in another embodiment of this application.

[0027] Figure 12 This is a schematic diagram of the packaging structure provided in one embodiment of this application.

[0028] Explanation of reference numerals in the attached figures 100 Adapter board; 110 Substrate; 111 First surface; 112 Second surface; 12 Metal block; 120 Metal pillar; 121 First part; 122 Second part; 123 Metal layer; 130 Carrier plate; 131 Base plate; 132 Enclosure structure; 141 First redistribution layer; 142 Bump; 1431 First metal trace layer; 1433 First interconnect structure; 1441 First dielectric layer; 1461 Second dielectric layer; 151 Second redistribution layer; 1521 Second metal trace layer; 1523 Second interconnect structure; 161 First solder mask layer; 1611 First solder opening; 162 Second solder mask layer; 1621 Second solder opening; 170 Liquid insulating material; 180 Photoresist layer; 181 Photoresist opening; 200 Chip; 300 Printed circuit board; 400 Packaging structure. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0031] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0032] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0033] In this specification, the term "same-layer setup" refers to a structure formed by two (or more) structures through the same patterning process, and their materials may be the same or different.

[0034] Through-Glass-Via (TGV) technology has become a key technology for achieving high-functionality chip integration due to its excellent high-frequency electrical, mechanical, and thermal properties. Specifically, through-holes are fabricated on a substrate, and conductive material is filled within them to form an interconnect. Electrical components (e.g., chips, interconnects) are vertically electrically connected via these interconnects. However, fabricating through-holes with high aspect ratios remains a significant challenge.

[0035] Figure 1 This is a schematic flowchart illustrating a method for preparing an adapter plate according to an embodiment of this application. Figure 1 As shown, the method for preparing the adapter plate includes: Step S101: Set a metal block on the support plate.

[0036] Depending on the actual needs, a metal block with a height equal to the target through-hole depth can be selected, or a metal block with a height greater than the target through-hole depth can be selected. The metal block is fixed to the support plate; for example, the metal block is adhered to the support plate. The metal block can be a copper block.

[0037] Step S102: Pattern the metal block to form multiple spaced metal pillars. The metal pillars extend in a direction perpendicular to the supporting plate.

[0038] Step S103: Coat the side of the metal column away from the support plate with liquid insulating material.

[0039] For example, a coating process is used to coat the side of the metal column away from the support plate with liquid insulating material, and at least part of the liquid insulating material fills the space between two adjacent metal columns.

[0040] Step S104: Curing the liquid insulating material.

[0041] In this embodiment, a liquid insulating material is coated on the side of the metal pillar facing away from the support plate, instead of drilling holes in the substrate and placing the metal pillar inside the holes. This avoids damage to the substrate during drilling and allows the liquid insulating material to be solidified into any shape as needed. Furthermore, this application provides a method for processing copper pillars, namely, forming the metal pillar by removing a portion of a metal block. This eliminates the need to form a seed layer inside the through-hole before electroplating metal material, especially for through-holes with high aspect ratios. This application reduces the difficulty of metal pillar fabrication and offers high processing selectivity.

[0042] Figure 2This is a structural schematic diagram of the metal block 12 and the supporting plate 130 provided in another embodiment of this application. Figure 2 As shown, in some embodiments, the support plate 130 includes a base plate 131 and a surrounding structure 132. The surrounding structure 132 is perpendicular to the base plate 131. Metal pillars 120 are disposed on the base plate 131, and the surrounding structure 132 surrounds the metal pillars 120. The metal block 12 includes a first part 121 and a second part 122. The orthographic projection of the first part 121 on the support plate 130 coincides with the orthographic projection of the subsequently etched metal pillars on the support plate 130.

[0043] In some embodiments, the height of the enclosure structure 132 perpendicular to the base plate 131 is greater than or equal to the height of the metal column 120 perpendicular to the base plate 131, in order to prevent liquid insulating material from overflowing from the enclosure structure 132.

[0044] It is worth noting that Figure 2 The shape of the metal block 12 is a cube, which is only for illustrative purposes. The metal block 12 can be any shape, and this application does not limit the shape of the metal block 12. It can be understood that the first part 121 corresponds to the metal pillar 120, and the second part 122 is the part of the metal block 12 excluding the metal pillar 120. Since the shape of the metal block 12 is arbitrary, this application does not limit the specific shape of the second part 122.

[0045] Figure 3 This is a schematic diagram of the fabrication process of an adapter plate according to another embodiment of this application. Figure 3 As shown, in some embodiments, the portion of the second part 122 away from the base plate 131 is removed, while the portion of the second part 122 close to the base plate 131 is retained, to form a plurality of spaced metal pillars 120 and a metal layer 123 located between the metal pillars 120 and the base plate 131, wherein the orthographic projection of the metal layer 123 on the base plate 131 coincides with the orthographic projection of the first part and the second part on the base plate 131.

[0046] In this embodiment, the metal layer 123 has a large contact area with the base plate 131, which prevents the metal column 120 from tilting or shaking. The metal layer 123 can improve the stability of the metal column 120 and ensure the vertical connectivity of the adapter plate.

[0047] Specifically, Figure 4 This is a schematic diagram of the fabrication process of an adapter plate according to another embodiment of this application. Figure 4As shown, in some embodiments, a portion of the metal block 12 is removed along a direction perpendicular to the base plate 131 to form a plurality of spaced metal pillars 120. This includes: forming a patterned photoresist layer 180 on the surface of the first portion 121 facing away from the base plate 131, the photoresist layer 180 having a plurality of photoresist openings 181 exposing the surface of the second portion 122 away from the base plate 131; etching a portion of the second portion 122, exemplarily, along a direction perpendicular to the base plate 131, using a wet etching process. In this embodiment, by using photoresist for exposure and development, followed by wet etching to form the metal pillars 120, a large area of ​​the second portion 122 can be removed, ensuring fabrication efficiency. Furthermore, the simultaneous etching of the surfaces of the second portion 122 with multiple exposed openings away from the support plate 130 further ensures fabrication efficiency.

[0048] In some embodiments, a portion of the metal block 12 is removed along a direction perpendicular to the base plate 131 to form a plurality of spaced-apart metal pillars 120. This includes removing a portion of the second part 122 using a laser process to form a plurality of spaced-apart metal pillars 120 and a metal layer 123 located between the metal pillars 120 and the base plate 131. In this embodiment, due to the high precision and high energy density of the laser process, a portion of the second part 122 can be precisely removed, improving the fabrication accuracy of the metal pillars 120.

[0049] Optionally, the pulse width of the laser process can be in the picosecond or femtosecond range. Specifically, when the pulse width of the laser process is in the picosecond range, the pulse width is greater than or equal to 0.05 picoseconds and greater than or equal to 10 picoseconds. For example, the pulse width of the laser process can be any of 0.05 picoseconds, 0.1 picoseconds, 1 picosecond, 3 picoseconds, 5 picoseconds, 7 picoseconds, 9 picoseconds, and 10 picoseconds. When the pulse width of the laser process is in the femtosecond range, the pulse width is greater than or equal to 10 femtoseconds and less than or equal to 100 femtoseconds. For example, the pulse width of the laser process can be any of 10 femtoseconds, 20 femtoseconds, 40 femtoseconds, 50 femtoseconds, 60 femtoseconds, 80 femtoseconds, and 100 femtoseconds.

[0050] Understandably, laser processes with pulse widths in the picosecond or femtosecond range can form a greater number of metal pillars 120 per unit area, and the metal pillars 120 have smaller surface roughness and smaller size. For example, if the metal pillars 120 are cylindrical, the laser process can produce metal pillars 120 with smaller diameters.

[0051] Figure 5 This is a schematic diagram of the fabrication process of an adapter plate according to another embodiment of this application. Figure 5As shown, a coating process is used to coat the entire side of the metal pillar 120 facing away from the support plate 130 with liquid insulating material 170, such that at least part of the liquid insulating material 170 fills the gap between two adjacent metal pillars 120 and the gap between the metal pillar 120 and the enclosure structure 132. The liquid insulating material 170 is then cured, specifically by heat treatment to solidify it. In this embodiment, the liquid insulating material 170 is coated on the side of the metal pillar 120 facing away from the base plate 131, instead of drilling holes in the substrate and placing the metal pillar 120 in the holes. This avoids damage to the substrate during drilling and allows the liquid insulating material 170 to be cured into any shape as needed.

[0052] In some embodiments, the liquid insulating material 170 includes a liquid glass material. The glass material possesses excellent insulation properties, chemical stability, and mechanical properties, providing reliable insulation protection for the adapter plate 100. The liquid glass material exhibits good flowability and filling properties during coating and curing, effectively filling the gaps between the metal pillars 120 and ensuring the structural stability of the adapter plate 100. For example, liquid glass material (Spin-On Glass, SOG) is spin-coated onto the entire side of the metal pillars 120 facing away from the support plate 130, followed by high-temperature curing.

[0053] Figure 6 This is a schematic diagram of the fabrication process of an adapter plate according to another embodiment of this application. Figure 6 As shown, in some embodiments, after curing the liquid insulating material 170, the preparation method further includes: removing the carrier plate 130 to obtain a substrate 110, the substrate 110 including a first surface 111 and a second surface 112 disposed opposite to each other, with the metal layer 123 close to the first surface 111 of the substrate 110; grinding the first surface 111 using a grinding process to expose the metal layer 123, and grinding the metal layer 123 to expose the metal pillars 120. And / or, grinding the second surface 112 using a grinding process to expose the metal pillars 120. It is worth noting that in some embodiments, because the metal block and the base plate are difficult to fit tightly, some of the liquid insulating material 170 flows between the metal layer 123 and the base plate, so grinding the first surface 111 is necessary to expose the metal layer 123 (not shown in the figure). In this embodiment, grinding the first surface 111 and the second surface 112 using a grinding process exposes the metal pillars 120, improving the flatness and smoothness of the first surface 111 and the second surface 112.

[0054] It is worth noting that Figure 6The illustrated embodiments involve grinding both the first surface 111 and the second surface 112. In some embodiments, when the liquid insulating material 170 is applied, it does not cover the surface of the metal pillar 120 facing away from the support plate 130. After removing the support plate 130, the second surface 112 exposes the metal pillar 120, thus eliminating the need for grinding the second surface 112. In other embodiments, after removing the support plate 130, the second surface 112 exposes the metal pillar 120, and is also ground to improve its flatness and smoothness.

[0055] Figure 7 This is a schematic diagram illustrating the fabrication process of an adapter plate provided in another embodiment of this application. For example... Figure 7 As shown, in some embodiments, removing a portion of the metal block 12 to form a plurality of spaced-apart metal pillars 120 includes: removing a second portion along a direction perpendicular to the base plate 131 to expose the base plate 131 of the support plate 130, thereby obtaining a plurality of spaced-apart metal pillars 120. In this embodiment, by completely removing the second portion to form a plurality of spaced-apart metal pillars 120, no further processing of the metal pillars 120 is required in subsequent processes, simplifying the process and improving preparation efficiency.

[0056] Understandably, in some embodiments, a patterned photoresist layer 180 is formed on the surface of the first portion 121 facing away from the carrier plate 130. The photoresist layer 180 has multiple photoresist openings 181, which expose the surface of the second portion 122 away from the carrier plate 130. The second portion 122 (not shown) is then etched. In this embodiment, by using photoresist for exposure and development, followed by wet etching to form the metal pillar 120, a large area of ​​the second portion 122 can be removed, ensuring fabrication efficiency. Furthermore, the simultaneous etching of the surface of the second portion 122 away from the carrier plate 130 with multiple exposed openings further ensures fabrication efficiency.

[0057] In some embodiments, the second part 122 is removed using a laser process. In this embodiment, because the laser process has the characteristics of high precision and high energy density, it can accurately remove the second part 122, thereby improving the accuracy of preparing the metal column 120.

[0058] Figure 8 This is a schematic diagram illustrating the fabrication process of an adapter plate provided in another embodiment of this application. For example... Figure 8As shown, a coating process is used to coat the entire side of the metal pillar 120 facing away from the base plate 131 with liquid insulating material 170, such that at least part of the liquid insulating material 170 fills the gap between two adjacent metal pillars 120 and the gap between the metal pillar 120 and the enclosure structure 132. The liquid insulating material 170 is then cured, specifically by heat treatment to solidify it. In this embodiment, the liquid insulating material 170 is coated on the side of the metal pillar 120 facing away from the support plate 130, rather than drilling holes in the substrate and placing the metal pillar 120 inside the holes. This avoids damage to the substrate during drilling and allows the liquid insulating material 170 to be cured into any shape as needed.

[0059] In some embodiments, the liquid insulating material 170 includes liquid glass material. Glass material has good insulation properties, chemical stability, and mechanical properties, and liquid glass material has good fluidity and filling properties during coating and curing, which can fully fill the gaps between the metal pillars 120 and ensure the structural stability of the adapter plate 100.

[0060] Figure 9 This is a schematic diagram illustrating the fabrication process of an adapter plate provided in another embodiment of this application. For example... Figure 9 As shown, in some embodiments, after curing the liquid insulating material, the preparation method further includes: removing the carrier plate to obtain a substrate 110, the substrate 110 including a first surface 111 and a second surface 112 disposed opposite to each other; and grinding the first surface 111 and / or the second surface 112 using a grinding process to expose the metal pillars 120. In this embodiment, grinding the first surface 111 and the second surface 112 exposes the metal pillars 120, improving the flatness and smoothness of the first surface 111 and the second surface 112.

[0061] It is worth noting that Figure 9 The illustrated embodiments involve grinding both the first surface 111 and the second surface 112. In some embodiments, when the liquid insulating material is applied, it does not cover the surface of the metal pillar 120 facing away from the base plate. After removing the support plate, the second surface 112 exposes the metal pillar 120, thus eliminating the need for grinding the second surface 112. In other embodiments, after removing the support plate 130, the second surface 112 exposes the metal pillar 120, and is also ground to improve its flatness and smoothness.

[0062] In some embodiments, the metal pillar 120 is tightly fitted to the base plate without any gaps between them, i.e., there is no liquid insulating material between them. Therefore, after removing the support plate, the first surface 111 exposes the metal pillar 120, and there is no need to grind the first surface 111. In other embodiments, after removing the support plate, the first surface 111 exposes the metal pillar 120, and the first surface 111 is ground to improve its flatness and smoothness.

[0063] In some embodiments, after exposing the metal pillars, the fabrication method further includes: sequentially fabricating a first redistribution layer, a first solder mask layer, and a bump on a first surface 111; and sequentially fabricating a second redistribution layer and a second solder mask layer on a second surface 112. The first redistribution layer includes a first metal trace layer, or the first redistribution layer includes multiple first metal trace layers stacked sequentially along a direction away from the substrate 110 and a first dielectric layer disposed between adjacent first metal trace layers, with adjacent first metal trace layers electrically connected through a first interconnect structure; at least a portion of the first metal trace layers is electrically connected to the metal pillars. Preferably, in embodiments including multiple first metal trace layers, at least a portion of the first metal trace layer closest to the substrate is electrically connected to the metal pillars to improve the vertical connectivity of the adapter board 100 and reduce wiring difficulty. The first solder mask layer has a first solder opening that exposes at least a portion of the first metal trace layer; preferably, the first solder opening exposes at least a portion of the first metal trace layer furthest from the substrate to reduce wiring difficulty. The bumps are electrically connected to the portion of the first metal trace layer furthest from the substrate exposed at the first solder opening. The second wiring layer includes a second metal trace layer, or the second wiring layer includes multiple second metal trace layers stacked sequentially along a direction away from the substrate 110 and a second dielectric layer disposed between adjacent second metal trace layers, with adjacent second metal trace layers electrically connected through a second interconnect structure; at least a portion of the second metal trace layers are electrically connected to metal pillars. Preferably, in embodiments including multiple second metal trace layers, at least a portion of the second metal trace layer closest to the substrate is electrically connected to the metal pillars to improve the vertical connectivity of the adapter board 100 and reduce wiring difficulty. The second solder mask layer is provided with a second solder opening, which exposes at least a portion of the second metal trace layers. Preferably, the second solder opening exposes at least a portion of the second metal trace layer furthest from the substrate to reduce wiring difficulty.

[0064] Understandably, the first dielectric layer is provided with a first via, and the first interconnect structure is located in the first via of the first dielectric layer; the second dielectric layer is provided with a second via, and the second interconnect structure is located in the second via of the second dielectric layer.

[0065] The materials used for the bumps include one or more of the following: tin, tin-silver alloy, a mixture of copper and tin-silver alloy, and a mixture of copper, nickel, and tin-silver alloy.

[0066] In this embodiment, by providing a first solder mask layer and a second solder mask layer, solder overflow during the soldering process is prevented, avoiding short circuits between adjacent bumps or metal traces, thus improving the soldering quality and electrical performance of the adapter board. Simultaneously, the first and second solder openings accurately expose the parts to be soldered, ensuring the accuracy and reliability of the soldering operation. Furthermore, the first and second solder mask layers also prevent the first and second rewiring layers from being corroded and damaged by external environmental factors (such as moisture, dust, and chemicals), thereby extending the service life of the adapter board.

[0067] In some embodiments, after fabricating the first solder mask layer and before fabricating the bumps, the fabrication method further includes: using a surface treatment material to perform surface treatment on the portion of the first metal trace layer furthest from the substrate that is exposed to the first solder opening. In this embodiment, by performing surface treatment on the portion of the first metal trace layer exposed to the first solder opening, the smoothness and cleanliness of the surface of the portion of the first metal trace layer exposed to the first solder opening are improved, the adhesion of the surface is enhanced, and the stability and reliability of subsequent electrical connections are ensured.

[0068] In some embodiments, after preparing the second solder resist layer, the preparation method further includes: using a surface treatment material to perform surface treatment on the portion of the second metal trace layer furthest from the substrate that is exposed to the second solder opening, so as to improve the flatness and cleanliness of the surface and ensure the stability and reliability of subsequent electrical connections.

[0069] Specifically, the surface treatment materials include any one or more of organic solder resist film, immersion nickel gold, immersion nickel palladium gold, and immersion tin.

[0070] Figure 10 This is a schematic diagram illustrating the fabrication process of the first redistribution layer, the first solder mask layer, and the bumps provided in another embodiment of this application. (See attached diagram.) Figure 10 As shown, a first redistribution layer 141 is fabricated on the first surface 111. Figure 10 The first redistribution layer 141 includes three first metal trace layers 1431, and adjacent first metal trace layers 1431 are separated by a first dielectric layer 1441 along a direction perpendicular to the substrate 110. A first solder resist layer 161 is provided on the side of the first redistribution layer 141 away from the substrate 110, and the portion of the first metal trace layer 1431 furthest from the substrate 110 exposed to the first solder opening 1611 is surface-treated. Bumps 142 are provided on the surface of the surface-treated first metal trace layer 1431.

[0071] It is worth noting that in some embodiments, a first redistribution layer 141 may be simultaneously prepared on the first surface 111, and a second redistribution layer may be sequentially prepared on the second surface 112; a first solder mask layer 161 may be simultaneously prepared on the first redistribution layer 141, and a second solder mask layer may be prepared on the second redistribution layer, which is not illustrated here.

[0072] In some embodiments, a first metal trace layer 1431 and / or a second metal trace layer are formed by physical vapor deposition, sputtering, coating, photolithography, development, electroplating, resist removal, etching, and other processes; and a first dielectric layer 1441 and / or a second dielectric layer are formed by coating, lamination, and other processes.

[0073] The material of the first metal trace layer 1431 and / or the second metal trace layer can be any of copper (Cu), aluminum (Al), nickel (Ni), and gold (Au).

[0074] The preparation of bumps 142 on the side of the first superwiring layer 141 away from the substrate 110 includes: preparing bumps 142 on the side of the first superwiring layer 141 away from the substrate 110 using any one of electroplating, printing, ball-mounting, etc.

[0075] This application provides an adapter plate 100, comprising an adapter plate prepared by the aforementioned method. In this embodiment, a liquid insulating material is coated on the side of the metal pillar facing away from the base plate of the support plate, instead of drilling holes in the substrate and placing the metal pillar within the holes. This avoids damage to the substrate during drilling and allows the liquid insulating material to be solidified into any shape as needed. Furthermore, this application forms the metal pillar by removing a portion of the metal block, eliminating the need to form a seed layer within the through-hole before electroplating metal material, thus reducing the difficulty of metal pillar preparation.

[0076] In some embodiments, the aspect ratio of the metal pillar is greater than or equal to 5:1. For example, the aspect ratio of the metal pillar can be any one of 5:1, 6:1, 7:1, 8:1, 9:1, 10:1, 12:1, and 14:1. A metal pillar with a higher aspect ratio can improve the electrical performance of the adapter plate 100.

[0077] Figure 11 This is a schematic diagram of the structure of an adapter plate provided in another embodiment of this application. For example... Figure 11 As shown, in some embodiments, the substrate 110 includes a first surface 111 and a second surface 112 disposed opposite to each other, and the adapter plate 100 further includes a first redistribution layer 141, a first solder mask layer 161, bumps 142, a second redistribution layer 151, and a second solder mask layer 162.

[0078] Specifically, the first redistribution layer 141 is located on the first surface 111. The first redistribution layer 141 includes three first metal trace layers 1431 and a first dielectric layer 1441 disposed between adjacent first metal trace layers 1431. Adjacent first metal trace layers 1431 are electrically connected through a first interconnect structure 1433. The first metal trace layer 1431 closest to the substrate 110 is electrically connected to the metal pillar 120. It is understood that the first redistribution layer 141 may include multiple first metal trace layers 1431, or it may include only one first metal trace layer 1431. This application does not limit the number of first metal trace layers 1431 included in the first redistribution layer 141.

[0079] The first solder mask layer 161 is located on the side of the first redistribution layer 141 away from the substrate 110. The first solder mask layer 161 includes a first solder opening 1611, which exposes at least a portion of the first metal trace layer 1431 that is furthest from the substrate 110.

[0080] At least a portion of the bump 142 is located within the first solder opening 1611, and the bump 142 is electrically connected to a portion of the first metal trace layer 1431 furthest from the substrate 110 that is exposed in the first solder opening 1611.

[0081] The second redistribution layer 151 is located on the second surface 112. The second redistribution layer 151 includes three second metal trace layers 1521 and a second dielectric layer 1461 disposed between adjacent second metal trace layers 1521. Adjacent second metal trace layers 1521 are electrically connected via a second interconnect structure 1523. The second metal trace layer 1521 closest to the substrate 110 is electrically connected to the metal pillar 120. It is understood that the second redistribution layer 151 may include multiple second metal trace layers 1521, or it may include only one second metal trace layer 1521. This application does not limit the number of second metal trace layers 1521 included in the second redistribution layer 151.

[0082] The second solder mask layer 162 is located on the side of the second redistribution layer 151 away from the substrate 110. The second solder mask layer 162 is provided with a second solder opening 1621, which exposes at least a portion of the second metal trace layer 1521 that is furthest from the substrate 110.

[0083] In this embodiment, the first solder mask layer 161 and the second solder mask layer 162 can prevent solder overflow during the soldering process, avoid short circuits between adjacent bumps 142 or metal traces, and improve the soldering quality and electrical performance of the adapter board 100. Simultaneously, the first soldering opening 1611 and the second soldering opening 1621 can accurately expose the parts to be soldered, ensuring the accuracy and reliability of the soldering operation. Furthermore, the first solder mask layer 161 and the second solder mask layer 162 can also prevent the first redistribution layer 141 and the second redistribution layer 151 from being corroded and damaged by external environmental factors (such as moisture, dust, chemicals, etc.), thereby extending the service life of the adapter board 100.

[0084] Optionally, the material of bump 142 includes one or more of tin, tin-silver alloy, a mixture of copper and tin-silver alloy, copper, nickel, and tin-silver alloy.

[0085] Figure 12 This is a schematic diagram of the packaging structure provided in one embodiment of this application. For example... Figure 12 As shown, this application also provides a packaging structure 400, which includes a chip 200, an adapter board 100 and a printed circuit board 300, wherein the adapter board 100 includes the aforementioned adapter board 100; the chip 200 and the printed circuit board 300 are electrically connected through the adapter board 100.

[0086] Understandably, the adapter board 100 is connected to the chip 200 via bump 142, and the adapter board 100 is also connected to the printed circuit board 300 via bump 142.

[0087] In some embodiments, the bump 142 may be made of one or more of the following materials: tin, tin-silver alloy, a mixture of copper and tin-silver alloy, or a mixture of copper, nickel, and tin-silver alloy; and the manufacturing process may be any of the following: electroplating, printing, or ball bonding.

[0088] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0089] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0090] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0091] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0092] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0093] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for preparing an adapter plate, characterized in that, include: A metal block is placed on the support plate; The metal block is patterned to form multiple spaced metal pillars, which extend in a direction perpendicular to the support plate. A liquid insulating material is coated on the side of the metal column away from the support plate, and at least part of the liquid insulating material fills the space between two adjacent metal columns; The liquid insulating material is cured.

2. The method for preparing the adapter plate according to claim 1, characterized in that, The metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; The step of patterning the metal block to form multiple spaced metal pillars includes: The portion of the second part away from the support plate is removed, while the portion of the second part close to the support plate is retained, to form the plurality of spaced metal pillars and a metal layer located between the metal pillars and the support plate, wherein the orthographic projection of the metal layer on the support plate coincides with the orthographic projection of the first part and the second part on the support plate.

3. The method for preparing the adapter plate according to claim 2, characterized in that, After curing the liquid insulating material, the preparation method further includes: Remove the carrier plate to obtain a substrate, the substrate including a first surface and a second surface disposed opposite to each other, the metal layer being close to the first surface of the substrate; The first surface is ground using a grinding process to expose the metal layer, and the metal layer is ground to expose the metal pillar; and / or, the second surface is ground using a grinding process to expose the metal pillar.

4. The method for preparing the adapter plate according to claim 1, characterized in that, The metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; The step of patterning the metal block to form multiple spaced metal pillars includes: The second part is removed to expose the support plate, resulting in the plurality of spaced metal columns.

5. The method for preparing the adapter plate according to claim 4, characterized in that, After curing the liquid insulating material, the preparation method further includes: Remove the carrier plate to obtain a substrate, the substrate including a first surface and a second surface disposed opposite to each other; The first surface and / or the second surface are ground using a grinding process to expose the metal pillar.

6. The method for preparing the adapter plate according to any one of claims 1 to 5, characterized in that, The metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; The step of patterning the metal block to form multiple spaced metal pillars includes: At least a portion of the second part is removed using a laser process; Preferably, the pulse width of the laser process is in the picosecond or femtosecond range.

7. The method for preparing the adapter plate according to any one of claims 1 to 5, characterized in that, The metal block includes a first part and a second part, wherein the orthographic projection of the first part on the support plate coincides with the orthographic projection of the metal column on the support plate; The step of patterning the metal block to form multiple spaced metal pillars includes: A patterned photoresist layer is formed on the surface of the first part away from the carrier plate, the photoresist layer having a plurality of photoresist openings, the photoresist openings exposing the surface of the second part away from the carrier plate; At least a portion of the second part is etched.

8. The method for preparing the adapter plate according to claim 1, characterized in that, The supporting plate includes a base plate and a surrounding structure perpendicular to the base plate. The metal column is disposed on the base plate, and the surrounding structure surrounds the metal column. The coating of the side of the metal column opposite to the supporting plate with a liquid insulating material includes: A liquid insulating material is coated on the side of the metal column away from the supporting plate, such that the liquid insulating material fills the gap between two adjacent metal columns and the gap between the metal column and the enclosure structure; Preferably, the height of the enclosure structure perpendicular to the base plate is greater than or equal to the height of the metal column perpendicular to the base plate; Preferably, the curing of the liquid insulating material includes: heating the liquid insulating material to cure it; Preferably, the liquid insulating material includes liquid glass material; Preferably, after the liquid insulating material is cured, the carrier plate is removed to obtain a substrate, the substrate comprising a first surface and a second surface disposed opposite to each other, and the preparation method further includes: A first redistribution layer, a first solder mask layer, and bumps are sequentially formed on the first surface. The first redistribution layer includes a first metal trace layer, or the first redistribution layer includes multiple first metal trace layers stacked sequentially along a direction away from the substrate and a first dielectric layer disposed between adjacent first metal trace layers. Adjacent first metal trace layers are electrically connected through a first interconnect structure. At least a portion of the first metal trace layers are electrically connected to the metal pillars. The first solder mask layer has a first solder opening that exposes at least a portion of the first metal trace layer. The bumps are electrically connected to the portion of the first metal trace layer exposed by the first solder opening. A second redistribution layer and a second solder mask layer are sequentially formed on the second surface. The second redistribution layer includes a second metal trace layer, or the second redistribution layer includes multiple layers of second metal trace layers stacked sequentially along a direction away from the substrate and a second dielectric layer disposed between adjacent second metal trace layers. Adjacent second metal trace layers are electrically connected through a second interconnect structure. At least a portion of the second metal trace layers are electrically connected to the metal pillars. The second solder mask layer is provided with a second solder opening, which exposes at least a portion of the second metal trace layers. Preferably, after preparing the first solder resist layer and before preparing the bump, the preparation method further includes: using a surface treatment material to perform surface treatment on the portion of the first metal trace layer exposed to the first solder opening; Preferably, the surface treatment material includes any one or more of organic solder resist film, immersion nickel gold, immersion nickel palladium gold, and immersion tin.

9. An adapter board, characterized in that, The adapter plate prepared according to any one of claims 1 to 8.

10. The adapter board according to claim 9, characterized in that, The depth-to-width ratio of the metal column is greater than or equal to 5:

1.

11. A packaging structure, characterized in that, include: chip; Adapter board, including the adapter board as described in claim 9 or 10; A printed circuit board, wherein the chip and the printed circuit board are electrically connected via the adapter board.

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