Integrated heater and temperature measurement

Abstract

An integrated heater and measurement (IHM) device is disclosed. The IHM device includes a heat-sensing element and a heat-sensing circuit. The heating-sensing element generates heat and determines a temperature of the IHM device. In some embodiments, the heating-sensing element may operate in a plurality of modes: a heating mode, a sensing mode, and / or a turn-off mode. The controller may dynamically adjust a property of the operating mode and / or time period based on the determined temperature. The adjusted properties may include the duration of the heating pattern, the on-time of the heating-sensing element, and the like. The controller may adjust the duration of the heating mode based on a temperature difference between the determined temperature and the set point temperature, such as decreasing the duration of the heating mode when there is a low temperature difference and increasing the duration of the heating mode when there is a high temperature difference.

Description

[0001] Cross-reference to related applications

[0002] This application claims the right to U.S. Nonprovisional Application No. 18 / 311,164, filed May 2, 2023, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This disclosure relates to a heating and temperature measurement system for electrical testing of integrated circuit devices. Background Technology

[0004] Testing integrated circuit (IC) devices involves using a heater to bring them to a setpoint temperature during testing. In some cases, accurate measurement of the heater's temperature is desirable. The measured temperature is used to actively control the heater. Incorrect measurement of the heater temperature can lead to incorrect IC temperatures, which may cause the device under test (DUT) to deviate from its intended performance or fail prematurely. In some cases, the temperature sensor used to measure the heater temperature is a separate component placed close to the heater. However, there are several disadvantages to separating the temperature sensor from the heater. A separate temperature sensor may not accurately measure the heater temperature. This incorrect measurement can be attributed to the separate temperature sensor not being close enough to the heater, resulting in an unwanted delay between any change in the heater temperature and the measured temperature. This unwanted delay is due to the heat that must be transferred along the path from the heater to the sensor. This unwanted delay is also due to the increased hysteresis between the actual temperature and the measured temperature caused by the thermal mass of the separate temperature sensor. Additionally, a separate temperature sensor can complicate the physical design and layout of the test system, requiring additional circuitry such as dedicated temperature sensing traces and I / O pins, especially in test systems using multiple heaters and temperature sensors. Furthermore, a separate temperature sensor may introduce additional failure modes. For example, a failure in a temperature sensor might not be recognized as a failure, and corrective measures might not be taken to adjust the heater's output. An integrated heater and temperature sensor that does not have these drawbacks is needed. Summary of the Invention

[0005] This document discloses an integrated heater and measurement (IHM) device that includes one or more heating-sensing elements. The heating-sensing elements can be configured to both generate heat and determine the temperature of the IHM device, resulting in a simpler, better-manufacturing-yield, smaller, and fewer-pin IHM device than a heater. In some embodiments, the heating-sensing elements can operate in multiple modes: a heating mode, a sensing mode, and / or an off mode. A controller can dynamically adjust the properties of the heating-sensing elements based on the determined temperature. The adjusted properties may include the duration of the heating mode, the on-time of the heating-sensing elements, etc. This dynamic adjustment of properties allows the IHM device to heat the device under test faster than a heater. In some embodiments, the IHM includes one or more heating-sensing circuitry for controlling the operation of the heating-sensing elements, such as providing power to the heating-sensing elements and determining the voltage drop across the heating-sensing elements.

[0006] A method for controlling the temperature of a device under test is disclosed. The method includes: during a heating mode of a heating-sensing element: sending one or more control signals to a drive voltage circuit using a controller, and generating power supplied to the heating-sensing element using the drive voltage circuit; and during a sensing mode of the heating-sensing element: sending current to the heating-sensing element using a current circuit, determining a voltage drop across the heating-sensing element using a sensing circuit, and determining the temperature of the device under test using the controller based on the current and voltage drop, wherein the heating-sensing element operates in both the heating mode and the sensing mode during different portions of a time period. Alternatively, in some embodiments, determining the temperature of the device under test includes: determining the resistance of the heating-sensing element based on the current and voltage drop, wherein the temperature of the device under test is related to the determined resistance. Alternatively, in some embodiments, the duration of the heating mode dynamically varies based on the difference between the determined temperature and a setpoint temperature. Alternatively, in some embodiments, the duration of the sensing mode is predetermined. Alternatively, in some embodiments, the heating-sensing element operates in an off mode during a portion of the time period. Alternatively, in some embodiments, the method further includes: dynamically adjusting the nature of the heating mode based on the determined temperature. Alternatively or alternatively, in some embodiments, adjusting the nature of the heating mode includes: reducing the duration of the heating mode for a low temperature difference between the determined temperature and the setpoint temperature; increasing the duration of the heating mode for a high temperature difference between the determined temperature and the setpoint temperature; or maintaining the duration of the heating mode for zero temperature difference between the determined temperature and the setpoint temperature. Alternatively or alternatively, in some embodiments, the time period is 200 µs. Alternatively or alternatively, in some embodiments, the heating-sensing element is included in multiple heating-sensing elements of the integrated heater and temperature measurement device, wherein the multiple heating-sensing elements operate simultaneously in a sensing mode. Alternatively or alternatively, in some embodiments, the heating-sensing element is included in multiple heating-sensing elements of the integrated heater and temperature measurement device, wherein the multiple heating-sensing elements operate simultaneously in a shutdown mode. Alternatively or alternatively, in some embodiments, the method further includes: determining whether one or more criteria have been met, wherein one or more criteria include: the determined temperature of the device under test is greater than a temperature threshold, the power of the device under test is greater than a power threshold, the heating-sensing element is short-circuited, or the heating-sensing element is open-circuited. Alternatively or in some embodiments, the method further includes preventing the drive voltage circuit from supplying power to the heating-sensing element during a heating mode of the heating-sensing element, based on satisfying one or more criteria.

[0007] An integrated heater and temperature measuring device is disclosed. The integrated heater and temperature measuring device includes: one or more heating-sensing elements configured to operate in a heating mode and a sensing mode during different portions of a time period; and one or more heating-sensing circuits, wherein at least one of the one or more heating-sensing circuits includes: a drive voltage circuit configured to provide power to the one or more heating-sensing elements to generate heat during the heating mode; a current circuit configured to send current to a corresponding heating-sensing element during the sensing mode; a sensing voltage circuit configured to determine a voltage drop across the corresponding heating-sensing element; and a controller configured to determine the temperature of the corresponding heating-sensing element based on the voltage drop. Additionally or alternatively, in some embodiments, the integrated heater and temperature measuring device further includes: a set of or more sets of pins coupled to the one or more heating-sensing elements, wherein the number of the set of or more sets of pins is equal to the number of the one or more heating-sensing elements. Alternatively or alternatively, in some embodiments, the integrated heater and temperature measuring device further includes: a first insulating layer, wherein at least one heating-sensing element is disposed on the first insulating layer; a second insulating layer disposed on the at least one heating-sensing element; a shield disposed on the second insulating layer; and a third insulating layer disposed on the shield. Alternatively or alternatively, in some embodiments, one or more heating-sensing elements include: a first heating-sensing element configured to heat and determine the temperature of a first region of the device under test; and a second heating-sensing element configured to heat and determine the temperature of a second region of the device under test. Alternatively or alternatively, in some embodiments, one or more heating-sensing elements include at least one controller that dynamically adjusts one or more properties of a heating mode, sensing mode, time period, or a combination thereof based on the determined temperature. Alternatively or alternatively, in some embodiments, one or more heating-sensing circuits are coupled to one or more heating-sensing elements using a 4-wire connection. Alternatively or alternatively, in some embodiments, each 4-wire connection includes a wire coupled to a 2-wire connection, each 2-wire connection being split outside the respective heating-sensing element. Alternatively, in some embodiments, each 4-wire connection includes a wire coupled to a 2-wire connection, each 2-wire connection being split inside the respective heating-sensing element. Alternatively, in some embodiments, the area corresponding to the respective heating-sensing element is smaller than the heating-sensing element.Alternatively, in some embodiments, the controller is further configured to determine whether one or more criteria have been met, including: the determined temperature of the device under test is greater than a temperature threshold, the power of the device under test is greater than a power threshold, the heating-sensing element is short-circuited, or the heating-sensing element is open-circuited. Alternatively, in some embodiments, one or more heating-sensing circuits include a fail-safe circuit configured to prevent the drive voltage circuit from supplying power to the heating-sensing element during a heating mode of the heating-sensing element, based on the satisfaction of one or more criteria.

[0008] It should be understood that any of the variations, aspects, features, and options described with respect to the system and method also apply to the method, and vice versa. It will also be understood that any one or more of the above variations, aspects, features, and options may be combined. It should be understood that the invention is not limited to the purposes mentioned above, but may also include other purposes, including those recognizable by one of ordinary skill in the art. Attached Figure Description

[0009] Figure 1 A cross-sectional view of an example heater is shown.

[0010] Figure 2A A cross-sectional view of an example integrated heater and temperature measurement (IHM) device according to an embodiment of this disclosure is shown.

[0011] Figure 2B An example stackup of an IHM device according to an embodiment of the present disclosure is shown.

[0012] Figure 3 A block diagram of an example circuit of a heating sensing element according to an embodiment of the present disclosure is shown.

[0013] Figure 4 Example time periods and operating modes of a heating-sensing element according to an embodiment of this disclosure are shown.

[0014] Figure 5A An example method of heating using a heating-sensing element in heating mode according to an embodiment of the present disclosure is shown.

[0015] Figure 5B An example method for determining the temperature of a heating-sensing element in sensing mode is shown according to an embodiment of the present disclosure.

[0016] Figure 6A and Figure 6B A block diagram illustrating an example four-line connection for coupling a heating-sensing circuit to a heating-sensing element according to an embodiment of the present disclosure is shown.

[0017] Figure 7A block diagram of an example heater according to an embodiment of the present disclosure is shown.

[0018] Figure 8 A block diagram of an example controller according to an embodiment of this disclosure is shown.

[0019] Figure 9 A block diagram of an example computer for one or more controllers according to an embodiment of the present disclosure is shown.

[0020] It should be understood that any of the variations, aspects, features, and options described in relation to the system also apply to the method, and vice versa. It will also be clear that any one or more of the aforementioned variations, aspects, features, and options can be combined. Detailed Implementation

[0021] This document discloses an integrated heater and measurement (IHM) device, which includes one or more heating-sensing elements. The heating-sensing elements can be configured to both generate heat and determine the temperature of the IHM device. In some embodiments, the heating-sensing elements can operate in multiple modes: a heating mode, a sensing mode, and / or an off mode. A controller can dynamically adjust the nature of the operating mode and / or time period based on the determined temperature. The adjusted nature may include the duration of the heating mode, the on-time of the heating-sensing elements, etc. In some embodiments, the controller can adjust the duration of the heating mode based on the temperature difference between the determined temperature and a setpoint temperature. If a low temperature difference exists, the controller can reduce the duration of the heating mode. If a high temperature difference exists, the controller can increase the duration of the heating mode. If a small to no temperature difference exists, the controller can maintain the duration of the heating mode.

[0022] In some embodiments, the IHM includes one or more heating-sensing circuits. The heating-sensing circuits are configured to control a heating-sensing element. The heating-sensing circuits may include a drive voltage circuit configured to provide power to the heating-sensing element during a heating mode, a current circuit configured to send current to the heating-sensing element during a sensing mode, a sensing voltage circuit configured to determine one or more voltage drops across the heating-sensing element, and a controller configured to determine the temperature of the heating-sensing element based on the voltage drops. In some embodiments, the heating-sensing circuit includes a fail-safe circuit configured to prevent the drive voltage circuit from providing power to the heating-sensing element. In some embodiments, the heating-sensing circuit is coupled to the heating-sensing element using a 2-wire or 4-wire connection.

[0023] The following description is presented to enable those skilled in the art to make and use various embodiments. The descriptions of specific apparatuses, techniques, and applications are provided only as examples. These examples are provided merely to add context and aid in understanding the described examples. Therefore, it will be apparent to those skilled in the art that the described examples can be practiced without some or all of the specific details. Other applications are possible, such that the following examples should not be considered limiting. Those skilled in the art will readily understand various modifications to the examples described herein, and that the general principles defined herein can be applied to other examples and applications without departing from the spirit and scope of the various embodiments. Therefore, the various embodiments are not intended to be limited to the examples described and shown herein, but should be accorded the scope consistent with the claims.

[0024] Various techniques and process steps will be described in detail with reference to the examples shown in the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of one or more aspects and / or features described or mentioned herein. However, it will be apparent to those skilled in the art that one or more aspects and / or features described or mentioned herein can be practiced without some or all of these specific details. In other instances, well-known process steps and / or structures have not been described in detail so as not to obscure some aspects and / or features described or mentioned herein.

[0025] In the following description of the examples, reference is made to the accompanying drawings, which form part of the examples, and specific examples that can be practiced are shown by way of illustration. It should be understood that other examples may be used, and structural changes may be made without departing from the scope of the disclosed examples.

[0026] The terminology used in the description of the various embodiments described herein is for the purpose of describing particular embodiments only and is not intended to be restrictive. As used in the description of the various described embodiments and the appended claims, the singular forms “a (a, an)” and “the” are intended to also include the plural forms, unless the context clearly indicates otherwise. It will also be understood that the term “and / or” as used herein refers to and covers any and all possible combinations of one or more of the associated listed terms. It will be further understood that, when used in this specification, the terms “includes”, “including”, “comprises”, and / or “comprising” specify the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0027] Figure 1A cross-sectional view of an example heater is shown. The heater 156 includes multiple pins, multiple heating elements 163, a measurement trace 161, and a shield 167. Some of the multiple pins 151 (including pins 151A and 151B), 153 (including pins 153A and 153B), and 155 (including pins 155A and 155B) may be pins for carrying current into and out of the heater 156. The multiple heating elements 163 generate heat for the heater 156. The measurement trace 161 determines the temperature of a surface 159 that contacts a component such as a DUT. As shown in the figure, the measurement trace 161 is positioned within the body of the heater 156, close to surface 159. The measurement trace 161 is separate from the heating elements 163 and coupled to pins 151 that are separate from pins 153 and 155 of the heating elements 163. The controller (not shown) is coupled to pins 151, 153, and 155 so that it can determine the temperature of heater 156 and adjust the temperature accordingly.

[0028] Figure 2A A cross-sectional view of an example integrated heater and temperature measurement (IHM) device according to an embodiment of the present disclosure is shown. The IHM device 256 includes multiple pins, multiple heating-sensing elements 263A and 263B, and a shield 267. Heating-sensing elements 263A and 263B generate heat for the IHM device 256. As discussed in more detail below, at least one heating-sensing element 263A or 263B also determines the temperature of the IHM device 256. Heating-sensing element 263A is coupled to pin 253 (including pins 253A and 253B), and heating-sensing element 263B is coupled to pin 255 (including pins 255A and 255B). One or more controllers are coupled to pins 253 and 255 for operating heating-sensing elements 263A and 263B to both heat and determine the temperature of the IHM device 256. In the IHM device 256, heating and temperature determination do not require separate measurement traces (e.g., Figure 1 The measurement trace 161) and separate pins (e.g., pins 153 and 155 for heating, and separate pin 151 for determining temperature, as shown) Figure 1 (As shown in the diagram). Embodiments of this disclosure include a single set of pins for each heating-sensing element 263 (the number of pin sets equals the number of heating-sensing elements), excluding additional pins for temperature sensing. For example, a set of pins 253A and 253B is coupled to heating-sensing element 263A, and a set of pins 255A and 255B is coupled to heating-sensing element 263B. Heating-sensing element 263A heats and determines the temperature of a first portion (e.g., a first region) of the IHM device 256, and heating-sensing element 263B heats and determines the temperature of a second portion (e.g., a second region). Therefore, the IHM device 256 is simpler (e.g., compared to...). Figure 1 The heater 156 is simpler, resulting in better manufacturing yield. For a given number of heating-sensing elements, the IHM device 256 is also smaller, allowing for smaller heaters or additional pins and / or heating-sensing elements to be included in a single IHM device 256. An IHM device 256 of the embodiments of this disclosure having a certain number of heating-sensing elements 263 has fewer pins than a heater having the same number of heating elements 163. For example, a heater including two heating elements... Figure 1 The heater 156 requires six pins, while the IHM device 256, which includes the same number of heating-sensing elements 263, requires only four pins. For test systems that include a large number of heating elements and / or temperature sensors, the number of pins and the resulting interconnects can be large, resulting in bulky, expensive, and complex heaters, hotheads, and test systems. Due to technological advancements leading to high component density and complex hybridization, it may be important for test systems to be able to handle thermal control components positioned close to each other. Therefore, bulky, expensive, and complex heaters, hotheads, and test systems may not be suitable.

[0029] In some embodiments, the heating-sensing element 263 includes a resistor and / or a resistive trace. Example materials for the heating-sensing element 263 may include, but are not limited to, tungsten, iron, Kovar, molybdenum, palladium, platinum, or combinations thereof. In some embodiments, the heating-sensing element 263 may have a similar... Figure 1 The temperature coefficient of resistance (TCR) of the measurement trace 161. For example, the heating-sensing element 263 may have a TCR of 0.0031 ppm / ℃ ± 20%. While a low TCR may be preferable when the heater includes a heating element separate from the temperature sensor, here, a high TCR for the heating-sensing element helps detect small temperature changes. For a high TCR, a large change in resistance can indicate a small change in temperature. Therefore, the IHM device 256 of this disclosure is comparable to ( Figure 1 The heater 156 is more sensitive.

[0030] The controller may send one or more signals (e.g., current or voltage signals) to pins 253 and 255 to provide power to heating-sensing elements 263A and 263B. Power applied to pins 253A and 253B causes electrically coupled heating-sensing element 263A to turn on and generate heat, and power applied to pins 255A and 255B causes electrically coupled heating-sensing element 263B to turn on and generate heat. In some embodiments, the IHM device 256 includes a plurality of heating-sensing elements 263 to increase the total power output from the IHM device 256 at a given voltage. For example, the IHM device 256 may include five heating-sensing elements 263, each configured to generate 200 W at 200 VDC, thereby generating a total output power of 1000 W. As discussed in more detail below, in some embodiments, the controller determines the resistance of the heating-sensing elements 263 and then determines their temperature based on the determined resistance.

[0031] In some embodiments, heating-sensing elements 263A and 263B may be formed on the same layer as each other, as shown in the figure. Alternatively, heating-sensing elements 263A and 263B may be formed on separate layers within the body of the IHM device 256. For example, heating-sensing elements 263A and 263B may be resistive traces formed on multiple layers to obtain a target resistance within a target area of ​​the IHM device 256. In some embodiments, heating-sensing elements 263A and 263B are positioned further away from the DUT 202 than the shield 267.

[0032] although Figure 2A The illustration shows four pins in a single row, but embodiments of this disclosure may include any configuration and number of pins, such as a single row of pins arranged around the periphery of the surface of the IHM device 256, two pins in a row on one side of the IHM device 256, 10 or more pins in a row, four pins in two rows on both sides, or the like. In some embodiments, multiple pins may occupy less than 10%, 30%, 50%, etc., of the surface of the IHM device 256. In some embodiments, the inner area of ​​the surface 258 of the IHM device 256 may exclude pins to allow the IHM device 256 to contact the adapter in the inner area.

[0033] In some implementations, the shield 267 is positioned closer to the DUT 202 than the heating-sensing element 263, such as Figure 2BThe example stack is illustrated. Stack 213 (in sequence) includes: a first insulating material layer 204 positioned at a surface 259 of the IHM device 256, a shield 267 disposed on the first insulating material layer 204, a second insulating material layer 214 disposed on the shield 267, a heating-sensing element 263 disposed on the second insulating material layer 214, and a third insulating material layer 224 disposed on the heating-sensing element 263. In some embodiments, the first insulating material layer 204 is positioned between the shield 267 and the DUT 202 (or an intermediate layer between the heating-sensing element 263 and the DUT 202). The insulating material of the first, second, and / or third layers may be a substrate. The substrate may include, for example, ceramic or aluminum nitride (AlN).

[0034] The shield 267 can be grounded, providing an electrical ground path to the IHM device 256 during testing. As discussed in more detail below, during testing, the heating-sensing element 263 rapidly and continuously turns on and off under high voltage and current, which can generate electrical noise. This electrical noise can interfere with the test system circuitry and / or measurements. The shield 267 reduces or eliminates unwanted electrical noise.

[0035] The test system may include one or more hotheads. Each zone of the hothead may include one or more heating-sensing elements 263. In some embodiments, any number of heating-sensing elements 263 may be associated with a zone, depending on the power requirements of that zone and the power limitations of the heating-sensing elements 263. As a non-limiting example, each heating-sensing element 263 heats and senses the temperature of its own zone. In some embodiments, a first heating-sensing element 263A is independent of a second heating-sensing element 263B, such that heating the first zone (using the first heating-sensing element 263A) does not heat the second zone, and vice versa. Additionally, or alternatively, the temperature and / or resistance determined for the first zone (using the first heating-sensing element 263A) is unaffected by the second zone.

[0036] The total area of ​​thermal control may be the same as or smaller than the total surface area of ​​the IHM device 256 (e.g., 20%). In some embodiments, the heating-sensing element 263 is located in a large percentage (e.g., 80% or more) of the surface of the IHM device 256 or in certain areas(s) of the IHM device 256. In some embodiments, different heating-sensing elements 263 may have different properties. For example, one or more first heating-sensing elements 263A are associated with one or more first regions, which are respectively high-power heating-sensing elements and high-power regions, while one or more second heating-sensing elements and second regions are respectively low-power heating-sensing elements and low-power regions.

[0037] Embodiments of this disclosure include a heating-sensing element 263 having a material, resistance, and / or TCR different from another heating-sensing element 263 within a given IHM device 256. In some embodiments, the IHM device 256 includes one or more insulating mechanisms to insulate two or more heating-sensing elements 263 or regions from each other, or the heating-sensing elements 263 or regions may be spatially separated by a predetermined distance. An example insulating mechanism includes a perforation or groove in the body of the IHM device 256 located between the edges of the heating-sensing elements and regions. In some embodiments, different heating-sensing elements 263 are associated with different regions.

[0038] Figure 3 A block diagram of an example circuit of a heating-sensing element according to an embodiment of the present disclosure is shown. The heating-sensing circuit 300 includes circuitry for operating the heating-sensing element 263 in multiple operating modes: a heating mode, a sensing mode, and a shutdown mode. The heating-sensing circuit 300 includes a drive voltage circuit 363, a controller 302, a forced current circuit 365, a sensing voltage circuit 364, and a fail-safe circuit 367. The drive voltage circuit 363 is coupled to the controller 302, the fail-safe circuit 367, and a node 375 of the heating-sensing element 263. The drive voltage circuit 363 receives one or more control signals 312 from the controller 302 and is configured to turn on the heating-sensing element 263, causing it to generate heat during the heating mode. The drive voltage circuit 363 can operate according to one or more control signals 312, such as turning off the heating-sensing element 263 to prevent it from generating heat (e.g., during the sensing or shutdown modes).

[0039] A forced current circuit 365 may be coupled to node 375 of the controller 302 and the heating-sensing element 263. The forced current circuit 365 provides a current signal to the heating-sensing element 263 during sensing mode in response to one or more control signals 312 from the controller 302. The current signal from the forced current circuit 365 causes current to flow through the heating-sensing element 263. A sensing voltage circuit 364 coupled to both nodes 373 and 375 of the heating-sensing element 263 determines the voltage drop across nodes 373 and 375 and generates a voltage signal 313 indicating this voltage drop. The voltage signal 313 is processed (e.g., including conversion by an analog-to-digital converter, amplification, etc.) and sent to the controller 302. Those skilled in the art will understand that the controller can be implemented in hardware or software.

[0040] In some embodiments, the heating-sensing circuit 300 includes a fail-safe circuit 367. The fail-safe circuit 367 is configured to reduce the likelihood of overheating and / or failure of one or more heating-sensing elements 263, or to prevent overheating and / or failure of one or more heating-sensing elements 263. In some examples, the heating-sensing element 263 may be unintentionally shorted to ground. In the case of shorting to ground, the controller 302 determines that the resistance of the heating-sensing element 263 is lower than its actual resistance. The controller 302 may also determine that the temperature of the heating-sensing element 263 is lower than its actual temperature, which may cause the controller 302 to attempt to increase the power supplied to the heating-sensing element 263 (if the fail-safe circuit 367 were not present). Excessive power can cause the heating-sensing element 263 to generate excessive heat and fail. The fail-safe circuit 367 prevents, for example, from sending excessive power to the heating-sensing element 263 during heating modes. In some embodiments, fail-safe circuitry 367 and / or controller 302 may determine that one or more criteria have not been met and prevent drive voltage circuitry 363 from supplying voltage to heating-sensing element 263. Example criteria include, but are not limited to, the DUT's temperature exceeding a temperature threshold, the DUT's power exceeding a power threshold, heating-sensing element 263 being short-circuited, or heating-sensing element 263 being open-circuited. For example, controller 302 may determine that the criteria have not been met and generate an error in response, which is then transmitted to fail-safe circuitry 367. In some embodiments, fail-safe circuitry 367 includes a fuse that fails and / or creates an open circuit when heating-sensing element 263 is short-circuited.

[0041] The controller 302 determines the temperature of the heating-sensing element 263 based on the voltage signal 313 and the current signal from the forced current circuit 365. In some embodiments, the controller 302 includes an FPGA. Using an FPGA for thermal control can be advantageous due to its time base accuracy, or the level of precision of the frequency used for timing. Any change in the time base will distort the "D" or derivative term in the PID algorithm and lead to errors in thermal control. Furthermore, the FPGA can support very fast floating-point calculations, which may be required by the control algorithm. Additionally, the FPGA can support high frequencies (e.g., 5 kHz, or in other words, temperature measurements every 200 µs) for driving one or more control signals to the heating-sensing element 263. The high rate of temperature measurement allows for more precise control of the temperature of the heating-sensing element 263.

[0042] In some embodiments, the heating-sensing circuit 300 operates as a feedback loop. The heating-sensing circuit 300 causes the heating-sensing element 263 to generate heat during a heating mode. The heating-sensing circuit 300 also determines the resistance or temperature of the heating-sensing element 263 during a sensing mode. Based on the resistance or temperature determined during the sensing mode, the properties of the heating-sensing circuit 300 during the heating mode are determined and / or dynamically adjusted. The heating-sensing circuit 300 alternates between modes. In some embodiments, the time period includes a portion of operation of the heating-sensing circuit 300 in a heating mode, a portion of operation of the heating-sensing circuit 300 in a sensing mode, and optionally, a portion of operation of the heating-sensing circuit 300 in a shutdown mode. In the shutdown mode, the heating-sensing element 263 neither generates heat nor senses temperature. In some embodiments, each heating-sensing element 263 is associated with a unique heating-sensing circuit 300.

[0043] Figure 4 Example time periods and operating modes of a heating-sensing element according to an embodiment of the present disclosure are shown. The timing diagram of the figure shows multiple time periods 402. The heating-sensing circuit 300 can operate under one or more of time periods 402A, 402B, or 402C.

[0044] Figure 4 The different time periods 402A, 402B, and 402C shown include different operating modes, different percentages of the time period for a given operating mode, etc. In some embodiments, the majority of time period 402A includes heating mode 422. For example, time period 402A may include 80% of the time period 402A in heating mode 422, 10% in off mode 432, and 10% in sensing mode 412. As another example, time period 402B includes 40% of the time period 402B in heating mode 422, 50% in off mode 432, and 10% in sensing mode 412. Time period 402C includes 90% of the time period in heating mode 422 and 10% in sensing mode 412. In some embodiments, when a time period includes heating mode, off mode, and sensing mode, the off mode follows the heating mode, and the sensing mode follows the off mode.

[0045] In some implementations, controller 302 dynamically adjusts the operating mode (such as a heating mode) and / or the nature of the time period based on the determined temperature. The duration of heating mode 422 (or the percentage of time period 402 occupied by heating mode 422) can be dynamically varied and adjusted (e.g., changed in real time) based on, for example, the temperature difference between the measured temperature and the setpoint temperature. If the temperature difference is greater than a difference threshold (e.g., there is a large difference between the measured temperature and the setpoint temperature), controller 302 activates the heating-sensing element 263 in heating mode 422.

[0046] If the temperature difference is within a threshold range (e.g., the measured temperature is close to the setpoint temperature), controller 302 determines the on-time of heating-sensing element 263, where the on-time can be the time required to maintain the temperature of heating-sensing element 263. In some embodiments, controller 302 determines the on-time based on a PID (proportional, integral, derivative) control algorithm. For example, the temperature of heating-sensing element 263 (determined during sensing mode) may be lower than the setpoint temperature by a certain (first) temperature difference. Controller 302 sets or adjusts the duration of the heating mode based on the first temperature difference. If the temperature of heating-sensing element 263 subsequently has a different second temperature difference, controller 302 adjusts the duration of the heating mode according to the second temperature difference. In a non-limiting example, the second (low) temperature difference is lower than the first (high) temperature difference, therefore controller 302 reduces the duration for which heating-sensing element 263 generates heat because the amount of heat to be generated is lower. When a high temperature difference exists between the determined temperature and the setpoint temperature, the controller 302 increases the duration (duration of the heating mode) of heat generation by the heating-sensing element 263 because the amount of heat to be generated is higher. For example, the heating-sensing circuit 300 operates according to time period 402C when the temperature difference is high, according to time period 402B when the temperature difference is low, and according to time period 402A when the temperature difference is in between. In some embodiments, the controller 302 is configured to maintain the temperature of the heating-sensing element 263 for one or more time periods. In some embodiments, when zero temperature difference exists, the controller 302 maintains the duration and / or percentage of the operating mode.

[0047] During heating mode 422, the heating-sensing element 263 can be operated by modulating an on-state pulse. In some embodiments, the duty cycle of the on-state pulse may be based on the temperature difference between the measured temperature and the setpoint temperature, or whether the measured temperature is greater than or less than the setpoint temperature. For example, when the measured temperature is less than the setpoint temperature, the duty cycle of the on-state pulse may be 90% (allowing the heating-sensing element 263 to heat the DUT quickly). As another example, when the measured temperature is greater than the setpoint temperature, the duty cycle of the on-state pulse may be 0% (allowing the heating-sensing element 263 to allow the cold plate to cool the DUT).

[0048] In some embodiments, time period 402C may not include shutdown mode 432. During shutdown mode 432, in some embodiments, drive voltage circuit 363, forced current circuit 365, and sensing voltage circuit 364 are turned off. In some embodiments, the duration of sensing mode 412 is predetermined. Controller 302 determines the percentage of time periods for different operating modes and / or a given operating mode.

[0049] In some embodiments, the IHM device 256 and / or test system include a plurality of heating-sensing elements 263 and a plurality of heating-sensing circuits 300. For example, the IHM device 256 includes 16 heating-sensing elements 263 and 16 heating-sensing circuits 300. When the heating-sensing elements 263 operate in off mode 432 and / or sensing mode 412, in some embodiments, other heating-sensing elements 263 (e.g., the remaining 15 of the 16 heating-sensing elements 263) also operate in the same mode. The simultaneous operation of multiple (e.g., all) heating-sensing elements 263 in the same IHM device 256 in the same mode (sensing mode, off mode, etc.) can help reduce or eliminate noise from, for example, switching of the heating-sensing circuits 300.

[0050] In some embodiments, the voltage measured by the sensing voltage circuit 364 is sensitive to noise in the heating-sensing circuit 300. This noise can interfere with the accuracy of the determined resistance and / or temperature. This is particularly problematic for high-voltage heaters (e.g., greater than 200 V, such as 240 V), which generate large EMI events when turned on and / or when fine temperature control is required. For example, some applications want or require the sensing voltage circuit 364 to be able to measure single-digit mV changes. To mitigate potential noise from heater switching, embodiments of this disclosure include measuring the temperature of the heating-sensing element 263 in sensing mode during a portion of a time period that differs from the heating mode. The time period 402 may include multiple operating modes of the heating-sensing element 263. In some embodiments, the time period 402 may be determined based on the frequency of temperature measurements. For example, the IHM device 256 of this disclosure may measure the temperature of the heating-sensing element every 200 µs, and the time period may be 200 µs.

[0051] Embodiments of this disclosure include methods for controlling the temperature of a DUT. Figure 5AAn example method of using a heating-sensing element in heating mode according to an embodiment of the present disclosure is shown. To heat the heating-sensing element 263, the controller 302 sends one or more control signals 312 to the drive voltage circuit 363 (step 502 of method 500). The drive voltage circuit 363 generates and provides power to the heating-sensing element 263 (step 504). The power turns on the heating-sensing element 263 (step 506). In some embodiments, the power may be based on the duty cycle of the turn-on pulse of the heating-sensing element 263. In step 508, the heating-sensing element 263 then generates heat, wherein the amount of heat generated is related to the power applied by the drive voltage circuit 363. One or more devices under test 202 are thermally coupled to the IHM device 256, so the heating-sensing element 263 of the IHM device 256 heats one or more devices under test 202 (step 510).

[0052] Figure 5B An example method for determining the temperature of a heating-sensing element in a sensing mode, according to an embodiment of the present disclosure, is illustrated. Method 550 includes step 552, in which controller 302 sends one or more control signals 312 to a current circuit (e.g., a forced current circuit 365). In step 554, the forced current circuit 365 generates a current (such as a fixed forced current) and sends it to the heating-sensing element 263. In some embodiments, the forced current circuit 365 sends a fixed forced current to node 375 of the heating-sensing element 263. The current through the heating-sensing element 263 causes a voltage drop across the heating-sensing element 263 (step 556). In step 558, a sensing circuit (e.g., a sensing voltage circuit 364) determines the voltage (e.g., a voltage drop) across nodes 373 and 375 of the heating-sensing element 263. The sensing voltage circuit 364 generates a voltage signal 313 indicating the measured voltage (step 560). The voltage signal 313 is then output to controller 302. In step 562, controller 302 receives voltage signal 313 and determines the resistance of heating-sensing element 263. In some embodiments, the resistance of heating-sensing element 263 is determined based on the measured voltage (from sensing voltage circuit 364) and the generated current (from forced current circuit 365). In some embodiments, in step 564, controller 302 determines the temperature of heating-sensing element 263 based on its resistance. In some embodiments, step 563 includes using a resistance-temperature relationship, which may be determined or adjusted based on calibration information.

[0053] In some embodiments, calibration information is determined after the IHM device 256 is manufactured. Multiple resistances of the heating-sensing element 263 are measured at different temperatures to generate predetermined calibration information, such as calibration curves, calibration tables, or correlations between resistance and temperature. Embodiments of this disclosure include multiple calibration data, including, but not limited to, heating-sensing element calibration data and printed circuit assembly calibration data. The heating-sensing element calibration data may be stored, for example, in a non-volatile memory chip, or encoded as a 1D or 2D code (e.g., a standard barcode or a 2D matrix barcode) or a remote database. In some embodiments, a printed circuit assembly (PCA) is associated with the IHM device 256. The PCA may have certain properties and relationships with temperature. The PCA may have its own calibration dataset, different from the heating-sensing element calibration data. PCA calibration data may be stored in a non-volatile memory chip, or encoded as a 1D or 2D code or a remote database. The controller 302 may use the predetermined calibration information to determine the measured temperature of the IHM device 256 or the temperature of one or more zones of the IHM device 256. Based on the determined temperature, the controller 302 controls one or more heating-sensing elements 263 accordingly.

[0054] In some implementations, when the test system is powered on, controller 302 reads associated heating-sensing element calibration data for heating-sensing element 263 from non-volatile memory. Controller 302 combines the heating-sensing element calibration data with PCA calibration data to generate a resistance-temperature relationship for a given heating-sensing element and PCA combination. As a non-limiting example, the resistance-temperature relationship may include a linear relationship. For example, this resistance-temperature relationship may be in the form of a slope with offset correction.

[0055] In some examples, the current and resistance characteristics of the connection between the heating-sensing element 263 and its associated heating-sensing circuit 300 can vary over time. These variations can lead to extrinsic temperature measurement errors. Embodiments of this disclosure include a four-wire connection that eliminates temperature measurement errors attributable to resistance variations in the current sensing path. Figure 6A A block diagram illustrating an example four-wire connection for coupling a heating-sensing circuit 300 to a heating-sensing element 263 according to an embodiment of the present disclosure is shown. The heating-sensing element 263A is coupled to ( Figure 2APins 253A and 253B may include, for example, two-wire connections. In some embodiments, a four-wire connection is formed by coupling line 677 to the two-wire connection at pad 671 and then splitting each connection to form line 675. In some embodiments, the connection splits outside the heating-sensing element 263A. Lines 675 and 677 provide electrical connections between the heating-sensing element 263A and the forced current circuit 365, and between the heating-sensing element 263A and the sensing voltage circuit 364. In some embodiments, line 677 is coupled to pad 671 via a solder connection. A very small or no current is present at the connection to the sensing voltage circuit 364, resulting in minimal or no drop in current resistance and allowing for stable voltage measurements.

[0056] In some implementation schemes, such as Figure 6B As shown, each 2-wire connection is split inside the heating-sensing element 263B. Wire 675 connects to a pad 671 inside the heating-sensing element 263B. In this example, the heating-sensing element 263B is coupled to four pins (e.g., Figure 2A Pins 253A, 253B, 255A, and 255B are used for electrical coupling to the forced current circuit 365 and the sensing voltage circuit 364. In some embodiments, a four-wire connection is formed by coupling line 679 to a four-wire connection at pad 671. In some embodiments, the connection between the forced current circuit 365 and the corresponding pad 671 includes low resistance (mΩ or µΩ) to minimize heat generated by the connection. This may be the case, for example, when the forced current is large (approximately 1 A). In some embodiments, the resistance of the connection between the forced current circuit 365 and the corresponding pad 671 is lower than the resistance of the connection between the sensing voltage circuit 364 and the corresponding pad 671. High resistance in the connection between the sensing voltage circuit 364 and the corresponding pad 671 is tolerable because this resistance does not affect the sensing voltage or generate unwanted heat. Although the number of pads 671 can be larger for a 4-wire connection with internal split connections, an example 4-wire connection with internal split connections may be suitable when the corresponding area is smaller than the heating-sensing element 263B, for example, as shown in the figure.

[0057] Embodiments of this disclosure include a heater that includes one or more heating-sensing elements, one or more heating elements, and one or more measurement traces. Figure 7A block diagram of an example heater according to an embodiment of the present disclosure is shown. The heater 756 includes a heating-sensing element 263, a heating element 163, and a measurement trace 161. The heating-sensing element 263 is configured for heating and measuring temperature. The heating element 163 is configured for heating, and the measurement trace 161 is configured for measuring the temperature of the heating element 163. The heating-sensing element 263 is coupled to pins 153A and 153B. The heating element 163 is coupled to pins 155A and 155B, and the measurement trace 161 is coupled to pins 151A and 151B.

[0058] Example Controller

[0059] Figure 8 A block diagram of an example controller 302 according to an embodiment of the present disclosure is shown. Controller 302 includes one or more components, such as (but not limited to) an FPGA 875 (or similar), an A / D converter 881, and a D / A converter 883. FPGA 875 may output one or more signals to D / A converter 883, which then converts the signals into a heater calibration signal 893 (as discussed above) for calibrating the heating-sensing element 263. The heater calibration signal 893 may include calibration information, and in some embodiments, the controller 302 may use the calibration information to determine the measured temperature of the IHM device 256.

[0060] The A / D converter 881 converts the voltage signal 313 and then outputs the converted signal to the FPGA 875. The voltage signal 313 indicates the voltage drop across the node of the heating-sensing element 263. The voltage signal 313 can be used to determine the measured temperature of the IHM device 256.

[0061] Additionally, the FPGA 875 outputs one or more control signals 312 to control the drive voltage circuit 363 for generating and supplying power to the heating-sensing element 263 (as discussed above). In some embodiments, the FPGA 875 may send external communication signals 883 to a controller (e.g., Figure 9 (A higher-level system controller 902) and / or receives external communication signals 883.

[0062] Example computing system

[0063] Figure 9A block diagram of an exemplary computer 902 according to an embodiment of the present disclosure is shown, which can be used in conjunction with the disclosed heating and temperature measurement system. According to embodiments of the present disclosure, the computer can be a machine within which a set of instructions can be executed to cause the machine to perform any of the methods discussed herein. In some embodiments, the machine can operate as a standalone device or be connectable (e.g., network-connected) to other machines. In a network-connected configuration, the machine can operate as a server or client machine in a server-client network environment, or as a peer machine in a peer-to-peer (or distributed) network environment. The machine can be a personal computer (PC), tablet PC, set-top box (STB), personal digital assistant (PDA), cellular phone, network device, network router, switch, or bridge, or any machine capable of executing a set of instructions (sequentially or otherwise) specifying actions to be taken by the machine. Mobile devices may include an antenna, a chip for transmitting and receiving radio frequency transmissions and wireless communications, and a keyboard. Furthermore, although only a single machine is shown, the term "machine" should also be considered as any collection of machines that individually or jointly execute one (or more) sets of instructions to perform any of the methods discussed herein.

[0064] The exemplary computer 902 includes a processor 904 (e.g., a central processing unit (CPU), a graphics processing unit (GPU), or both), a memory 906 (e.g., a read-only memory (ROM), flash memory, dynamic random access memory (DRAM), such as synchronous DRAM (SDRAM), etc.), and a static memory 908 (e.g., static random access memory (SRAM), etc.), which can communicate with each other via a bus 910.

[0065] Computer 902 may also include a video display 912 (e.g., a liquid crystal display (LCD) or a light-emitting diode (LED) display). Computer 902 also includes an alphanumeric input device 914 (e.g., a keyboard), a cursor control device 916 (e.g., a mouse), a disk drive unit 918, a signal generation device, a network interface device 922, and one or more wireless interface devices.

[0066] The computer 902 may also include other inputs and outputs, including digital I / O and / or analog I / O. For example, the inputs and outputs can communicate with external devices (such as coolers, pressure controllers, force controllers, flow rate controllers, etc.) using any type of communication protocol.

[0067] The drive unit 918 includes a machine-readable medium 920 on which one or more instruction sets 924 (e.g., software) embodying any or more of the methods or functions described herein are stored. The software may also reside wholly or at least partially within main memory 906 and / or processor 904 during execution by computer 902, which also constitute the machine-readable medium. The software may also be transmitted or received over a network via network interface device 922 and / or wireless device.

[0068] Although the machine-readable medium 920 is shown as a single medium in the exemplary embodiment, the term "machine-readable medium" should be considered as encompassing a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) storing one or more sets of instructions. The term "machine-readable medium" should also be considered as encompassing any medium capable of storing, encoding, or delivering sets of instructions that are executed by a machine and cause the machine to perform any one or more of the methods of the present invention. Therefore, the term "machine-readable medium" should be considered as encompassing, but not limited to, solid-state memory, optical and magnetic media, and carrier signals.

[0069] Although examples of this disclosure have been fully described with reference to the accompanying drawings, it should be noted that various changes and modifications will become apparent to those skilled in the art. Such changes and modifications should be understood to be included within the scope of the examples of this disclosure as defined by the appended claims.

Claims

1. A method for controlling the temperature of a measured device, comprising: During the heating mode of the heating-sensing element: The controller sends one or more control signals to the drive voltage circuit, and The driving voltage circuit is used to generate power supplied to the heating-sensing element; as well as During the sensing mode of the heating-sensing element: A current circuit is used to send current to the heating-sensing element. The voltage drop across the heating-sensing element is determined using a sensing circuit, and The controller is used to determine the temperature of the device under test based on the current and the voltage drop. The heating-sensing element operates in the heating mode and the sensing mode during different portions of the time period.

2. The method of claim 1, wherein determining the temperature of the measured device comprises: The resistance of the heating-sensing element is determined based on the current and the voltage drop, wherein the temperature of the device under test is related to the determined resistance.

3. The method of claim 1, wherein the duration of the heating mode varies dynamically based on the difference between the determined temperature and the setpoint temperature.

4. The method of claim 1, wherein the duration of the sensing mode is predetermined.

5. The method of claim 1, wherein the heating-sensing element operates in a shutdown mode during a portion of the time period.

6. The method of claim 1, further comprising: The properties of the heating mode are dynamically adjusted based on the determined temperature.

7. The method of claim 6, wherein adjusting the property of the heating mode comprises: For the low temperature difference between the determined temperature and the setpoint temperature, reduce the duration of the heating mode; For the high temperature difference between the determined temperature and the setpoint temperature, increase the duration of the heating mode; or The duration for which the heating mode is maintained is zero temperature difference between the determined temperature and the setpoint temperature.

8. The method of claim 1, wherein the time period is 200 µs.

9. The method of claim 1, wherein the heating-sensing element is included in a plurality of heating-sensing elements of an integrated heater and temperature measuring device, wherein the plurality of heating-sensing elements operate simultaneously in the sensing mode.

10. The method of claim 1, wherein the heating-sensing element is included in a plurality of heating-sensing elements of an integrated heater and temperature measuring device, wherein the plurality of heating-sensing elements operate simultaneously in a shutdown mode.

11. The method of claim 1, further comprising: Determine whether one or more criteria have been met, wherein the one or more criteria include: the determined temperature of the device under test is greater than a temperature threshold, the power of the device under test is greater than a power threshold, the heating-sensing element is short-circuited, or the heating-sensing element is open-circuited.

12. The method of claim 1, further comprising: According to one or more of the criteria, during the heating mode of the heating-sensing element, the drive voltage circuit is prevented from providing power to the heating-sensing element.

13. An integrated heater and temperature measuring device, comprising: One or more heating-sensing elements, the one or more heating-sensing elements being configured to operate in heating mode and sensing mode during different portions of a time period; as well as One or more heating-sensing circuits, wherein at least one of the one or more heating-sensing circuits comprises: A driving voltage circuit, the driving voltage circuit being configured to provide power to the one or more heating-sensing elements to generate heat during the heating mode; A current circuit configured to send current to a corresponding heating-sensing element during the sensing mode; A sensing voltage circuit, configured to determine the voltage drop across the corresponding heating-sensing element; and A controller configured to determine the temperature of the corresponding heating-sensing element based on the voltage drop.

14. The integrated heater and temperature measuring device as claimed in claim 13, further comprising: One or more sets of pins, said one or more sets of pins being coupled to said one or more heating-sensing elements, wherein the number of said one or more sets of pins is equal to the number of said one or more heating-sensing elements.

15. The integrated heater and temperature measuring device as claimed in claim 13, further comprising: A first insulating material layer, wherein the at least one heating-sensing element is disposed on the first insulating material layer; A second insulating material layer is disposed on the at least one heating-sensing element; A shielding element, wherein the shielding element is disposed on the second insulating material layer; as well as A third insulating material layer is disposed on the shielding component.

16. The integrated heater and temperature measuring device of claim 13, wherein the one or more heating-sensing elements comprise: A first heating-sensing element is configured to heat and determine the temperature of a first zone of the device under test; as well as A second heating-sensing element is configured to heat and determine the temperature of a second zone of the device under test.

17. The integrated heater and temperature measuring device of claim 13, wherein the one or more heating-sensing elements include at least one controller that dynamically adjusts one or more properties of the heating mode, the sensing mode, the time period, or a combination thereof based on the determined temperature.

18. The integrated heater and temperature measuring device of claim 13, wherein the one or more heating-sensing circuits are coupled to the one or more heating-sensing elements using a 4-wire connection.

19. The integrated heater and temperature measuring device of claim 18, wherein each 4-wire connection includes a wire coupled to a 2-wire connection, and each 2-wire connection is split outside the respective heating-sensing element.

20. The integrated heater and temperature measuring device of claim 18, wherein each 4-wire connection includes a wire coupled to a 2-wire connection, and each 2-wire connection is split inside the respective heating-sensing element.

21. The integrated heater and temperature measuring device of claim 13, wherein the area corresponding to the respective heating-sensing element is smaller than the heating-sensing element.

22. The integrated heater and temperature measuring device of claim 13, wherein the controller is further configured to determine whether one or more criteria have been met, the one or more criteria including: The determined temperature of the device under test is greater than a temperature threshold, the power of the device under test is greater than a power threshold, the heating-sensing element is short-circuited, or the heating-sensing element is open-circuited.

23. The integrated heater and temperature measuring device of claim 22, wherein the one or more heating-sensing circuits comprise: A fail-safe circuit is configured to prevent the drive voltage circuit from supplying power to the heating-sensing element during the heating mode of the heating-sensing element, based on satisfying one or more criteria.

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