A dual station press-fit device for wafer cassette assembly

Abstract

The present application relates to the technical fields of semiconductor assembly, and particularly relates to a double-station press-fitting equipment for wafer box assembly, which comprises an equipment rack, mobile stations and pressing assemblies. Each mobile station comprises a slide rail assembly, a carrier, a nylon plate and a stopper. Each pressing assembly comprises a support structure, a servo cylinder and a pressure head mechanism. The pressure head mechanism comprises a lifting plate, a guide column, a pressing plate, a driving assembly and a movable clamp jaw. The movable clamp jaw comprises a base, a connecting part and a pressing end. Compared with the prior art, the present application can perform multi-stage pressing operation through the servo cylinder, and can press the buffer piece in multiple sections, so that air in the insertion part does not cause the buffer piece to pop out when pressed in one time, and the press-fitting efficiency is effectively improved, and the product yield is improved. The movable clamp jaw is inserted into the diamond structure of the buffer piece, and then pressed, so that the diamond structure of the buffer piece does not cause incomplete press-fitting.

Description

Technical Field

[0001] This invention relates to the field of semiconductor assembly technology, and in particular to a dual-station press-fitting device for wafer cassette assembly. Background Technology

[0002] A wafer carrier, also known as a wafer cassette, is a type of semiconductor carrier. It is a precision-designed device specifically for holding semiconductor wafers and plays a crucial role in semiconductor production. It is primarily used to place and transport wafers, simplifying the wafer transport process, reducing the risk of wafer contamination, and ensuring the smooth flow of wafers between different production stages.

[0003] In existing technologies, wafers are transported by inserting them into the placement slots of a wafer cassette. During transport, the wafers may vibrate and shift, potentially causing damage. Therefore, a buffer abutment is installed at the top of the wafer cassette to cushion and reduce shock, as mentioned in the invention patent CN119673833B, which describes a wafer cassette with a protective limiting device.

[0004] However, in order to achieve a better cushioning effect, the aforementioned buffer abutment adopts a rhomboid elastic structure. Directly pressing the end of the buffer abutment will cause the rhomboid structure to deform and become unable to bear force. It is necessary to press the inside of the rhomboid structure to install the buffer abutment onto the corresponding part on the top of the wafer box. Therefore, a more reliable pressing device is needed. Summary of the Invention

[0005] In view of this, the present invention provides a dual-station press-fitting device for wafer cassette assembly to solve the above-mentioned technical problems.

[0006] A dual-station pressing device for wafer cassette assembly includes a frame, two movable stations disposed within the frame, and two pressing assemblies acting on the movable stations respectively. The wafer cassette used in the dual-station pressing device comprises a base, a cover fastened to the base, multiple insertion seats disposed on the cover, and multiple buffers inserted into the insertion seats. Each buffer includes an insertion portion and a buffer portion disposed on the insertion portion. The buffer portion is a rhomboid structure formed by multiple spring clips. Each movable station includes a slide rail assembly, a platform disposed on the slide rail assembly, a nylon plate disposed on the platform, and four stops disposed around the nylon plate. The nylon plate is concentrically disposed with the platform. The stops are vertically fixed to the platform by fasteners. The two pressing assemblies are respectively disposed on the two movable stations. Each pressing assembly includes a support structure, a servo electric cylinder disposed on the support structure, and a pressing head mechanism connected to the servo electric cylinder. The servo electric cylinder employs a multi-stage pressing process during operation, with the pressure gradually increasing to press down on the buffer component in multiple segments. The pressing head mechanism includes a lifting plate connected to the servo electric cylinder, two guide posts connected to the lifting plate, a pressure plate connected to the lifting plate, four sets of drive assemblies mounted on the pressure plate, and four movable grippers mounted on the drive assemblies. All four drive assemblies are fixed to the pressure plate and located on the side of the pressure plate away from the lifting plate. Each movable gripper includes a base connected to the drive assembly, a connecting portion perpendicular to the base, and a pressing end perpendicular to the connecting portion. The base is fixed to the drive assembly. The connecting portion extends vertically outward away from the drive assembly. One end of the pressing end is vertically fixed to the connecting portion, and the other end is parallel to the base. The surface of the pressing end away from the base is the pressing surface. The distance from the pressing surface of the pressing end to the base is less than the spacing of the buffer component in the deformation direction in its free state. The pressing end is inserted into the rhomboid structure of the buffer under the action of the driving component, and is pressed down under the action of the servo electric cylinder to press the buffer into the insertion seat.

[0007] Furthermore, the equipment rack includes a cabinet, a workbench mounted on the cabinet, and a housing covering the workbench.

[0008] Furthermore, the two mobile workstations are arranged side by side and spaced apart on the workbench.

[0009] Furthermore, each of the moving workstations also includes a photoelectric sensing component disposed on one side of the slide rail assembly. The photoelectric sensing component includes an adjustment rail disposed on the worktable, two photoelectric sensors disposed within the adjustment rail, and a sensor sheet metal part disposed on the platform. The adjustment rail is parallel to and spaced apart from the linear guide rail of the slide rail assembly. The sensor sheet metal part is fixed to the edge of the platform by fasteners, extends and is inserted into the sensing part of the photoelectric sensor.

[0010] Furthermore, the slide rail assembly includes two parallel and spaced linear guide rails, a plurality of sliders disposed on the linear guide rails, and a drive cylinder.

[0011] Furthermore, the platform is also provided with four receiving slots for setting the stop blocks. Each receiving slot has two waist-shaped holes. The receiving slots are all located between the edge of the nylon plate and the edge of the platform. The length direction of the waist-shaped holes is perpendicular to the edges of the nylon plate and the platform.

[0012] Furthermore, the support structure includes four support columns vertically fixed on the workbench, and a fixing plate disposed on the support columns.

[0013] Furthermore, the lifting plate is located on the other side of the servo electric cylinder passing through the support structure, and the guide column passes through the fixing plate and is connected to the lifting plate.

[0014] Furthermore, the pressure plate is fixed to the side of the lifting plate away from the servo electric cylinder and is concentrically arranged with the lifting plate. The shape of the pressure plate is circular or regular octagonal.

[0015] Furthermore, each of the drive components includes an axially arranged linear guide rail and a slider, a mounting plate disposed on the slider, and a drive device connected to the mounting plate.

[0016] Compared with existing technologies, the dual-station pressing equipment for wafer cassette assembly provided by this invention, by setting up the moving station, moves the wafer cassette from the loading station to the pressing station for pressing operations, achieving semi-automatic operation and reducing the risks of human-machine interaction. By setting up the servo electric cylinder for multi-stage pressing operations, the buffer component is pressed down in multiple segments, avoiding air in the insertion part during a single press that could cause the buffer component to pop out, effectively improving pressing efficiency and increasing the product yield. By setting up the pressing head mechanism, the movable gripper is inserted into the diamond-shaped structure of the buffer component before pressing, avoiding incomplete pressing caused by the diamond-shaped structure of the buffer component, solving practical problems in wafer cassette assembly, improving wafer cassette assembly efficiency, achieving automated assembly, and reducing manual intervention. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a dual-station press-fitting device for wafer cassette assembly provided by the present invention.

[0018] Figure 2 for Figure 1 A schematic diagram of the structure of a wafer cassette operated by a dual-station press-fitting machine for wafer cassette assembly.

[0019] Figure 3 for Figure 1 A cross-sectional structural diagram of a wafer cassette operated by a dual-station press-fitting machine for wafer cassette assembly.

[0020] Figure 4 for Figure 1 A schematic diagram of the moving station and pressing components of a dual-station pressing machine for wafer cassette assembly.

[0021] Figure 5 for Figure 1 A schematic diagram of the pressure head mechanism of a dual-station pressing machine used for wafer cassette assembly.

[0022] Explanation of reference numerals in the attached drawings: Equipment frame 10, cabinet 11, workbench 12, housing 13, moving station 20, slide rail assembly 21, platform 22, nylon plate 23, stop block 24, photoelectric sensing assembly 25, adjusting rail 251, photoelectric sensor 252, sensor sheet metal part 253, pressing assembly 30, support structure 31, servo electric cylinder 32, pressing head mechanism 33, lifting plate 331, guide column 332, pressure plate 333, drive assembly 334, movable gripper 335, base 3351, connecting part 3352, pressing end 3353, wafer box 40, base 41, box cover 42, insertion seat 43, buffer 44, insertion part 441, buffer part 442. Detailed Implementation

[0023] The following provides a more detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0024] like Figures 1 to 5The diagram shows a structural schematic of the dual-station pressing equipment for wafer cassette assembly provided by the present invention. The dual-station pressing equipment for wafer cassette assembly includes a machine frame 10, two movable stations 20 disposed within the machine frame 10, and two pressing components 30 respectively acting on the movable stations 20. It is conceivable that the dual-station pressing equipment for wafer cassette assembly also includes other functional modules such as a power supply device, operation buttons, etc., which are technologies well known to those skilled in the art and will not be described in detail here.

[0025] like Figures 2 to 3 As shown, the wafer cassette 40 used in the dual-station press assembly equipment for wafer cassette assembly includes a base 41, a cover 42 fastened to the base 41, a plurality of insertion seats 43 disposed on the cover 42, and a plurality of buffer members 44 inserted into the insertion seats 43.

[0026] The base 41 can be a rectangular plate structure, and multiple other components are provided on the base 41, including but not limited to locking components, check valves and guide components, which are all common technologies used in the field of mechanical equipment, and are not the main content of this application, so they will not be described in detail here.

[0027] The cover 42 is a rectangular box with an opening on one side and an interior cavity for placing wafers. The opening of the cover 42 is fastened to the base 41 to form a closed rectangular box, thereby preventing the wafers from being contaminated by dust or other substances during storage and transportation.

[0028] The insertion seat 43 is a fixing seat disposed on the inner wall of the cover 42 and located at the top of the cover 42 away from the opening. It can be a hollow columnar protrusion for the buffer member 44 to be inserted and fixed. Furthermore, reinforcing ribs can be provided around the insertion seat 43 to increase structural strength. These structures are common technologies in the industrial field and are therefore only briefly described here. In one embodiment of this application, four insertion seats 43 are provided in a rectangular array to provide sufficient support for the wafer.

[0029] Each of the buffer members 44 includes an insertion portion 441 and a buffer portion 442 disposed on the insertion portion 441. The insertion portion 441 may be a columnar structure that can be inserted into the insertion seat 43 to fix the buffer member 44. The buffer portion 442 is a rhomboid structure formed by multiple spring pieces, and may be integrally injection molded so that when the buffer member 44 is subjected to external force, it will deform toward the insertion portion 441 to play a buffering and supporting role.

[0030] It is conceivable that, in order to achieve better cushioning performance, the buffer element 44 is made of materials such as rubber or silicone. During assembly, if it is directly pressed into the insertion seat 43 in one go, it will rebound due to the air compression in the hole, thereby squeezing the buffer element 44 out of the hole, resulting in an unsatisfactory installation effect.

[0031] The equipment rack 10 includes a cabinet 11, a workbench 12 mounted on the cabinet 11, and a housing 13 covering the workbench 12.

[0032] The cabinet 11 is formed by a support frame and multiple side panels. It can be constructed using aluminum profiles through welding or fasteners, and the side panels can be made of stainless steel, alloy, or other metal materials. They can be connected to each other via snap-fit ​​or threaded structures to form a vertical and stable support structure. The cabinet 11 is equipped with doors, handles, locks, and other structures to facilitate the installation of actuators or other equipment. Four support legs are also provided at the four corners of the cabinet 11 near the ground. These legs can be structures such as casters to support and stabilize the main body and facilitate the relocation of the equipment; no specific restrictions are placed here.

[0033] The workbench 12 is a device plane located on top of the cabinet 11, parallel to the ground, for installing and fixing the movable workstation 20 and the pressing assembly 30, and for performing pressing operations.

[0034] The housing 13 covers the workbench 12, with an opening at the moving station 20 and a cabinet door at the pressing assembly 30. These will be described in detail below with reference to the specific structures of each part. Furthermore, the housing 13 is also equipped with a display screen, touch panel, and operation buttons, all of which are common technologies in the field of mechanical equipment and will not be listed or described in detail here.

[0035] Two moving workstations 20 are arranged side by side and spaced apart on the worktable 12. Each moving workstation 20 includes a slide rail assembly 21 on the worktable 12, a platform 22 on the slide rail assembly 21, a nylon plate 23 on the platform 22, four blocks 24 around the nylon plate 23, and a photoelectric sensing assembly 25 on one side of the slide rail assembly 21.

[0036] The slide rail assembly 21 is a prior art technology, comprising two parallel and spaced linear guide rails, a plurality of sliders disposed on the linear guide rails, and a drive cylinder for driving the sliders to slide along the guide rails. By mounting the stage 22 on the sliders and driving it under the drive cylinder, the stage 22 can move along the linear guide rails to transport the wafer cassette from the loading port to directly below the pressing assembly 30 for pressing operations.

[0037] The stage 22 is a rectangular plate that spans and is mounted on the two linear guide rails, and is fixedly connected to the slider. It is driven by the drive cylinder to achieve reciprocating motion. The stage 22 is also provided with four receiving slots for mounting the stop 24. Each receiving slot has two oblong holes. The receiving slots are all located between the edge of the nylon plate 23 and the edge of the stage 22. The length direction of the oblong holes is perpendicular to the edges of the nylon plate 23 and the stage 22, so that when the size of the wafer cassette changes, the distance between the stop 24 and the nylon plate 23 can be changed by adjusting the fasteners.

[0038] The nylon plate 23 can be fixed to the platform 22 by fasteners and is concentrically arranged with the platform 22 for placing the wafer cassette and for supporting the wafer when the pressing assembly 30 performs the pressing operation.

[0039] The stop block 24 is vertically fixed to the platform 22 by fasteners and is located in the receiving groove of the platform 22 to abut against the four sides of the wafer box, limit the wafer box and prevent the wafer box from shifting during the pressing operation and affecting the pressing effect.

[0040] The photoelectric sensing component 25 includes an adjustment rail 251 mounted on the worktable 12, two photoelectric sensors 252 mounted on the adjustment rail 251, and a sensor sheet metal part 253 mounted on the platform 22. The adjustment rail 251 is parallel to and spaced apart from the linear guide rail of the slide rail assembly 21, used to set and adjust the position of the photoelectric sensors 252. The photoelectric sensor 252 is a device that converts light signals into electrical signals. When the sensor sheet metal part 253 is inserted into the sensing part of the photoelectric sensor 252, it blocks the light propagation within the photoelectric sensor 252, thereby generating an electrical signal marking the position of the platform 22. The two photoelectric sensors 252 are located at the loading station and the pressing station, respectively. Thus, when the sensor sheet metal part 253 is inserted into the corresponding photoelectric sensor 252, it indicates that the platform 22 has reached the corresponding station. The sensor sheet metal part 253 is fixed to the edge of the platform 22 by fasteners and can extend and be inserted into the sensing part of any one of the photoelectric sensors 252.

[0041] The two pressing components 30 are respectively disposed on the two moving workstations 20. Each pressing component 30 includes a support structure 31 fixed on the worktable 12, a servo electric cylinder 32 disposed on the support structure 31, and a pressing head mechanism 33 connected to the servo electric cylinder 32.

[0042] The support structure 31 includes four support columns that are vertically fixed on the worktable 12, and a fixing plate set on the support columns, thereby forming a stable carrier for setting the servo electric cylinder 32 and the pressure head mechanism 33.

[0043] The drive end of the servo cylinder 32 passes through the fixed plate of the support structure 31 and extends toward the moving station 20, thereby generating a vertically downward pressure on the wafer cassette placed on the moving station 20. The servo cylinder 32 is a modular product integrating a servo motor and a lead screw, with a speed of 0.1~2 m / s. Due to its closed-loop servo control, the servo cylinder 32 offers high control precision and features low cost and flexible configuration, making it the best alternative to hydraulic and pneumatic cylinders. It is widely used in industries such as manufacturing, military, entertainment facilities, and automobiles. In this embodiment, the servo cylinder 32 employs a multi-stage downward pressing process, with the pressure gradually increasing. This multi-stage pressing action on the buffer component prevents it from being pressed into the wafer cassette all at once, avoiding air pockets that could cause the buffer component to pop out.

[0044] In addition, a photoelectric sensing component 25 is also provided on one side of the servo electric cylinder 32 to sense the running position of the pressing head mechanism 33 during the pressing operation.

[0045] The pressure head mechanism 33 includes a lifting plate 331 connected to the servo electric cylinder 32, two guide columns 332 connected to the lifting plate 331, a pressure plate 333 connected to the lifting plate 331, four sets of drive components 334 arranged on the pressure plate 333, and four movable grippers 335 arranged on the drive components 334.

[0046] The lifting plate 331 is located on the other side of the servo electric cylinder 32 passing through the support structure 31, serving as a connection. The guide column 332 passes through the fixed plate and is connected to the lifting plate 331, serving as a stabilizer and guide.

[0047] The pressure plate 333 is fixed to the side of the lifting plate 331 away from the servo cylinder 32 and is concentrically arranged with the lifting plate 331 to accommodate the drive assembly 334 and the movable gripper 335. The pressure plate 333 is circular or octagonal in shape to accommodate the drive assembly 334 and the movable gripper 335.

[0048] All four sets of drive components 334 are fixed to the pressure plate 333 and located on the side of the pressure plate 333 away from the lifting plate 331. Each set of drive components 334 includes an axially arranged linear guide rail and a slider, a mounting plate disposed on the slider, and a drive device connected to the mounting plate. The aforementioned linear guide rail, slider, and drive device are common technologies in the field of mechanical manufacturing and should be well known to those skilled in the art; therefore, only a brief description is provided here. The mounting plate is used to connect the drive device and to house the movable gripper 335.

[0049] The movable gripper 335 includes a base 3351 connected to the drive assembly 334, a connecting portion 3352 perpendicular to the base 3351, and a pressing end 3353 perpendicular to the connecting portion 3352. The base 3351, connecting portion 3352, and pressing end 3353 may be integrally forged. The base 3351 is fixed to the drive assembly 334. The connecting portion 3352 extends vertically outward away from the drive assembly 334. One end of the pressing end 3353 is vertically fixed to the connecting part 3352, and the other end is set parallel to the base 3351 to form a U-shaped structure. Under the action of the driving component 334, it is inserted into the rhomboid structure of the buffer 44 and pressed down under the action of the servo electric cylinder 32 to press the buffer 44 into the insertion seat 43. Correspondingly, the position of the movable gripper 335 after movement is consistent with the position of the insertion seat 43 and the buffer 44.

[0050] It is conceivable that after the pressing end 3353 is inserted into the buffer member 44, the surface of the pressing end 3353 away from the base 3351 is the pressing surface, which abuts against the connection between the insertion part 441 and the buffer part 442 of the buffer member 44 when pressed down, thereby pressing the buffer member 44 into the insertion seat 43. Furthermore, the distance from the pressing surface of the pressing end 3353 to the base 3351 is less than the spacing of the buffer portion 442 in the deformation direction in its free state. This allows the base 3351 to first abut against the outer surface of the buffer portion 442 away from the insertion portion 441 when the pressing end 3353 is inserted into the buffer portion 442 and a pressing operation is performed. During the continuous pressing of the movable gripper 335, the spring of the buffer portion 442 undergoes slight deformation. Then, the pressing end 3353 abuts against the connection between the buffer portion 442 and the buffer portion 442 and continues to press down, pressing the buffer member 44 into the insertion seat 43. This prevents the buffer member 44 from being tilted by external force when it is placed on the insertion seat 43 without a pressing operation, thus affecting the installation effect of the buffer member 44.

[0051] Compared with existing technologies, the dual-station pressing equipment for wafer cassette assembly provided by this invention, through the setting of the moving station 20, moves the wafer cassette from the loading station to the pressing station for pressing operations, achieving semi-automatic operation and reducing the risks of human-machine interaction. By setting the servo electric cylinder 32 for multi-stage pressing operations, the buffer component is pressed down in multiple segments, avoiding air in the insertion part during a single press that could cause the buffer component to pop out, effectively improving pressing efficiency and increasing the product yield. By setting the pressing head mechanism 33, the movable gripper 335 is inserted into the diamond-shaped structure of the buffer component before pressing, avoiding incomplete pressing caused by the diamond-shaped structure of the buffer component, solving practical problems in wafer cassette assembly, improving wafer cassette assembly efficiency, achieving automated assembly, and reducing manual intervention.

[0052] The above are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions or improvements within the spirit of the present invention are covered within the scope of the claims of the present invention.

Claims

1. A dual-station press-fitting device for wafer cassette assembly, characterized in that: The dual-station pressing equipment for wafer cassette assembly includes a machine frame, two movable stations disposed within the machine frame, and two pressing components acting on the movable stations respectively. The wafer cassette used by the dual-station pressing equipment includes a base, a cover fastened to the base, multiple insertion seats disposed on the cover, and multiple buffer components inserted into the insertion seats. Each buffer component includes an insertion portion and a buffer portion disposed on the insertion portion. The buffer portion is a rhomboid structure formed by multiple spring clips. Each movable station... Each moving station includes a slide rail assembly, a platform mounted on the slide rail assembly, a nylon plate mounted on the platform, and four stops around the nylon plate. The nylon plate is concentrically mounted with the platform, and the stops are vertically fixed to the platform by fasteners. Two pressing assemblies are respectively mounted on the two moving stations. Each pressing assembly includes a support structure, a servo electric cylinder mounted on the support structure, and a pressure head mechanism connected to the servo electric cylinder. The servo electric cylinder employs a multi-stage pressing process during operation, and the pressure... The pressure head mechanism gradually increases the pressure on the buffer component in multiple segments. It includes a lifting plate connected to the servo cylinder, two guide pillars connected to the lifting plate, a pressure plate connected to the lifting plate, four sets of drive assemblies mounted on the pressure plate, and four movable grippers mounted on the drive assemblies. All four drive assemblies are fixed to the pressure plate and located on the side of the pressure plate away from the lifting plate. Each movable gripper includes a base connected to the drive assembly, a connecting portion perpendicular to the base, and a gripper perpendicular to the connecting portion. The base is fixed to the drive assembly, and the connecting part extends vertically outward away from the drive assembly. One end of the pressing end is vertically fixed to the connecting part, and the other end is set parallel to the base. The surface of the pressing end away from the base is the pressing surface. The distance from the pressing surface of the pressing end to the base is less than the spacing of the buffer part in the deformation direction in the free state. Under the action of the drive assembly, the pressing end is inserted into the rhomboid structure of the buffer member and pressed down under the action of the servo electric cylinder to press the buffer member into the insertion seat.

2. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 1, characterized in that: The equipment frame includes a cabinet, a workbench mounted on the cabinet, and a housing covering the workbench.

3. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 2, characterized in that: The two mobile workstations are arranged side by side and spaced apart on the worktable.

4. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 2, characterized in that: Each of the moving workstations also includes a photoelectric sensing component disposed on one side of the slide rail assembly. The photoelectric sensing component includes an adjustment rail disposed on the worktable, two photoelectric sensors disposed within the adjustment rail, and a sensor sheet metal part disposed on the platform. The adjustment rail is parallel to and spaced apart from the linear guide rail of the slide rail assembly. The sensor sheet metal part is fixed to the edge of the platform by fasteners, extends and is inserted into the sensing part of the photoelectric sensor.

5. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 1, characterized in that: The slide rail assembly includes two parallel and spaced linear guide rails, multiple sliders mounted on the linear guide rails, and a drive cylinder.

6. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 1, characterized in that: The platform is also provided with four receiving slots for setting the blocks. Each receiving slot has two waist-shaped holes. The receiving slots are all located between the edge of the nylon plate and the edge of the platform. The length direction of the waist-shaped holes is perpendicular to the edges of the nylon plate and the platform.

7. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 2, characterized in that: The support structure includes four support columns that are vertically fixed on the workbench, and a fixing plate that is mounted on the support columns.

8. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 7, characterized in that: The lifting plate is located on the other side of the servo electric cylinder that passes through the support structure, and the guide column passes through the fixed plate and is connected to the lifting plate.

9. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 1, characterized in that: The pressure plate is fixed to the side of the lifting plate away from the servo electric cylinder and is concentrically arranged with the lifting plate. The shape of the pressure plate is circular or regular octagonal.

10. The dual-station press-fitting equipment for wafer cassette assembly as described in claim 1, characterized in that: Each drive assembly includes an axially arranged linear guide and a slider, a mounting plate disposed on the slider, and a drive device connected to the mounting plate.

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