Molding device

Abstract

The present invention suppresses wear caused by contact between a spring plate and a substrate. A molding device (100) for press-molding a resin sheet (10), which is a resin separator for a fuel cell, is provided with: a lower mold (20) on which the resin sheet is placed; an upper die disposed facing the lower die; a spring plate having a first surface and a second surface facing each other in the plate thickness direction, the spring plate being bent so that a central portion in the first direction intersecting the plate thickness direction protrudes toward the side opposite to the second surface, and the upper mold being attached so as to be in contact with the first surface; and a substrate for pressing the spring plate so that the upper die approaches the lower die, forming a chamfered structure on both ends of the first surface of the spring plate in the first direction, the curved first surface and second surface being deformed so as to approach a flat surface as the pressing load for pressing the spring plate increases, and forming a chamfered structure on both ends of the second surface of the spring plate. A contact point of the second surface and the substrate is displaced in the first direction from a first position away from the central portion to a second position close to the central portion.

Description

Technical Field

[0001] This invention relates to a molding apparatus. Background Technology

[0002] There is a known manufacturing method for electronic components that uses a bent elastic resin sheet (equivalent to an upper mold) to expel air from the resin sheet, which is the molded product (see Patent Document 1).

[0003] Patent Document 1: Japanese Patent Application Publication No. 2021-174932

[0004] In the case of shaping an object, the object, existing between an upper and lower die, is shaped by pressing a spring plate via a substrate. The upper die is mounted on a bent spring plate, which is bent along the shape of the spring plate. In this case, both ends of the spring plate contact the substrate, and these contact points wear. If the wear intensifies, the bending shape of the spring plate and the upper die changes, affecting the quality of the shaped object. Summary of the Invention

[0005] The present invention provides a molding apparatus capable of suppressing wear caused by contact between a spring plate and a substrate.

[0006] One aspect of the present invention relates to a molding apparatus for pressing and molding a resin sheet as a resin separator for a fuel cell. The molding apparatus comprises: a lower mold for holding the resin sheet; an upper mold disposed opposite to the lower mold; a spring plate having a first surface and a second surface opposite each other in the thickness direction, bent such that it extends from the center of a first direction intersecting the thickness direction toward a side opposite to the second surface, and mounted to contact the first surface; and a substrate for pressing the spring plate so that the upper mold approaches the lower mold. In a first direction, an arc-shaped chamfer structure with an arc-shaped chamfer formed at both ends of the second surface of the spring plate is formed. As the pressing load on the spring plate increases, the bent first and second surfaces deform in a near-planar manner, and the contact point between the second surface and the substrate shifts in the first direction from a first position away from the center to a second position closer to the center.

[0007] According to one aspect of the present invention, it is possible to provide a molding apparatus that can suppress wear caused by contact between the spring plate and the substrate. Attached Figure Description

[0008] Figure 1 This is a cross-sectional view showing the molding apparatus according to the first embodiment.

[0009] Figure 2 It is an enlarged cross-sectional view showing the contact area between the spring plate and the substrate.

[0010] Figure 3This is a graph showing the contact pressure between the spring plate and the substrate in the molding apparatus involved in the comparative example.

[0011] Figure 4 It is a graph showing the contact surface pressure between the spring plate and the substrate in the molding apparatus according to the first embodiment.

[0012] Figure 5 This is an enlarged cross-sectional view showing the contact portion between the spring plate and the substrate in the molding apparatus according to the second embodiment.

[0013] Figure 6 This is an enlarged cross-sectional view showing the contact portion between the spring plate and the substrate in the molding apparatus according to the third embodiment.

[0014] Explanation of reference numerals in the attached figures

[0015] 100… Molding device; 10… Resin sheet; 20… Lower mold; 30… Upper mold; 40… Spring plate; 50… Substrate; 81… Curved chamfer structure; 82… Curved chamfer structure (second curved surface); 83… Curved chamfer structure (first curved surface); C1… Center position of radius of curvature; X… X-axis direction (first direction, length direction); Y… Y-axis direction; Z… Z-axis direction (thickness direction). Detailed Implementation

[0016] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0017] [The molding apparatus 100 according to the first embodiment]

[0018] Figure 1 This is a cross-sectional view of the molding apparatus 100 according to the first embodiment. Figure 2 This is an enlarged cross-sectional view showing the contact area between the spring plate 40 and the base plate 50. Additionally, in Figure 1 and Figure 2 The diagram illustrates arrows representing intersecting X-axis, Y-axis, and Z-axis directions. The X-axis direction can be, for example, along the length of the resin sheet 10. The Z-axis direction can be, for example, along the thickness of the resin sheet 10. The Z-axis direction can also be a vertical direction. The X-axis direction includes the direction indicated by the arrow and its opposite. The Y-axis direction includes the direction indicated by the arrow and its opposite. The Z-axis direction includes the direction indicated by the arrow and its opposite.

[0019] Figure 1 The molding apparatus 100 shown is an apparatus for pressing and molding a resin sheet 10, which is used as a resin separator for a fuel cell. The molding apparatus 100 includes a lower mold 20, an upper mold 30, a spring plate 40, and a substrate 50. Figure 1 The figure shows a molding apparatus 100 before the resin sheet 10 is pressed and molded.

[0020] The resin sheet 10 has an upper surface 11 and a lower surface 12 facing each other in the Z-axis direction. For example, an uneven shape is formed on the upper surface 11 and the lower surface 12. Before compression molding, the resin sheet 10 has a plurality of pores 14. The resin sheet 10 is, for example, a resin sheet in which a matrix resin is impregnated with reinforcing fibers, etc.

[0021] Multiple resin sheets 10 are stacked in the thickness direction. Flow paths for fluid flow are formed between the multiple resin sheets 10.

[0022] For example, a solid polymer fuel cell (PEFC) stack has a conductive resin membrane between each cell. The resin membrane has a manifold for supplying fuel gas (hydrogen) and oxidant gas (air) and a gas flow path for allowing these gases to flow to the power generation unit. The membrane has irregular shapes to form the flow path.

[0023] In the molding apparatus 100, a resin sheet 10 is placed on the upper surface 21 of the lower mold 20. The upper mold 30 is disposed opposite to the lower mold 20 in the Z-axis direction. The resin sheet 10 is disposed between the lower mold 20 and the upper mold 30. A mold for transferring the resin sheet 10 to the lower surface 12 is formed on the upper surface 21 of the lower mold 20.

[0024] The upper mold 30 is plate-shaped and elastic. The upper mold 30 has an upper surface 31 and a lower surface 32 facing each other in the thickness direction. The upper mold 30 is mounted on the spring plate 40 and deforms according to the shape of the spring plate 40. The lower surface 32 is positioned opposite the upper surface 11 of the resin sheet 10 in the Z-axis direction. A mold for transferring the image to the upper surface 11 of the resin sheet 10 is formed on the lower surface 32.

[0025] The spring plate 40 has an upper surface 41 and a lower surface 42 facing each other in the thickness direction. The thickness of the spring plate 40 may, for example, be greater than the thickness of the upper mold 30. The lower surface 42 is arranged opposite to the upper surface 31 of the upper mold 30 in the Z-axis direction. In the X-axis direction, the central portion of the spring plate 40 is bent in a manner that extends downward beyond both ends. The spring plate 40 is bent in a state where no load is applied.

[0026] The upper mold 30 is mounted to the spring plate 40 by a plurality of fastening bolts 60. The upper surface 31 of the upper mold 30 abuts against the lower surface 42 of the spring plate 40. The fastening bolts 60 penetrate the spring plate 40 in the thickness direction to hold the upper mold 30 in place. The upper mold 30 can deform integrally with the spring plate 40.

[0027] The substrate 50 is disposed above the spring plate 40, pressing the spring plate 40. The lower surface 51 of the substrate 50 is disposed opposite the spring plate 40 in the Z-axis direction. The lower surface 51 of the substrate 50 includes a plane parallel to the XY plane. The lower surface 51 includes a surface that contacts the spring plate 40. The substrate 50 is driven, for example, by hydraulic pressure. In the unloaded state, the central portion of the spring plate 40 in the X-axis direction is separated from the lower surface 51 of the substrate 50. The two ends of the spring plate 40 in the X-axis direction contact the lower surface 51 of the substrate 50. In the X-axis direction, the substrate 50 is longer than the spring plate 40. The substrate 50 is formed to extend in the X-axis direction to a position outside the side surface 43 of the spring plate 40.

[0028] Spring plate 40 is temporarily fixed to substrate 50 by suspension bolt 70. A load is applied to substrate 50, pressing spring plate 40 towards resin sheet 10. The load on substrate 50 causes spring plate 40 to deform. The upper surface 41 and lower surface 42 of spring plate 40 deform in a near-planar manner. The upper surface 41 and lower surface 42 deform in a manner that becomes a plane along the XY plane. Upper mold 30 deforms along with the deformation of spring plate 40. By removing the load acting on spring plate 40, spring plate 40 returns to its bent shape. Suspension bolt 70 is displaced relative to substrate 50 according to the deformation of spring plate 40. Suspension bolt 70 is capable of displacement in the Z-axis direction.

[0029] An opening for arranging multiple fastening bolts 60 may be formed in the substrate 50, and a step for arranging the head of the fastening bolt 60 may be formed in the spring plate 40. An opening for arranging a suspension bolt 70 may be formed in the substrate 50. A step portion for arranging the head of the suspension bolt 70 may be formed in the substrate 50.

[0030] Next, the chamfered arc surfaces 81 formed at both ends of the spring plate 40 will be described. Figure 2 As shown, an arc-shaped chamfered structure 81 is formed on the upper surface 41 of the spring plate 40. The arc-shaped chamfered structure 81 is provided at both ends of the upper surface 41 in the X-axis direction.

[0031] The upper surface 41 of the spring plate 40 includes a curved surface 91 and a chamfered arc surface 81. The curved surface 91 is formed in the central portion of the upper surface 41 in the X-axis direction. The curved surface 91 is formed in a downwardly recessed manner. The center of the radius of curvature of the curved surface 91 is located above the spring plate 40. The curved surface 91 is formed when no load is applied to the spring plate 40. If a load is applied to the spring plate 40, the curved surface 91 deforms in a manner with a gradually decreasing curvature. The curved surface 91 deforms in a near-planar manner, eventually becoming a plane and contacting the lower surface 51 of the substrate 50.

[0032] The curved chamfer structure 81 is positioned on the outer side of the curved surface 91 in the X-axis direction. The curved surface 91 is formed between the curved surface 91 and the side surface 43. The center of the radius of curvature of the curved chamfer structure 81 is located below the upper surface 41.

[0033] The positions of the contact portions P101, P102, and P103 between the spring plate 40 and the substrate 50 are displaced according to the magnitude of the load. If the load transmitted from the substrate 50 to the spring plate 40 increases, the spring plate 40 deforms. When the bending surface 91 deforms in a near-planar manner, contact portions P101 to P103 are generated sequentially.

[0034] For example, under low load, the curvature of the bending surface 91 is large, and the spring plate 40 contacts the substrate 50 at the contact portion P101 near the side surface 43. If the load increases, the bending surface 91 deforms in a manner that reduces its curvature, and the spring plate 40 contacts the substrate 50 at the contact portion P102, which is closer to the contact portion P101. If the load increases further, the bending surface 91 deforms in a manner that approaches a plane, and the spring plate 40 contacts the substrate 50 at the contact portion P103, which is closer to the contact portion P102. As the load increases, the positions of the contact portions P101 to P103 between the spring plate 40 and the substrate 50 shift away from the side surface 43. The contact portions P101 to P103 may also have a predetermined length in the X-axis direction. In addition, the length of the contact portions P101 to P103 in the X-axis direction may also increase in the order of contact portion P101, contact portion P102, and contact portion P103.

[0035] If the load is reduced from a state where the curved surface 91 is close to a plane, the curved surface 91 deforms in a manner that increases curvature. As the curvature increases, the gap between the upper surface 41 and the lower surface 51 increases in the Z-axis direction. At this time, the contact portions P103, P102, and P101 between the spring plate 40 and the base plate 50 are displaced outward in the X-axis direction.

[0036] Next, the contact surface pressure between the spring plate and the substrate in the molding apparatus involved in the comparative example will be explained. Figure 3 This is a graph showing the contact surface pressure between the spring plate and the substrate in the molding apparatus of the comparative example. The molding apparatus of the comparative example differs from the molding apparatus 100 of the first embodiment in that the curved chamfer structure 81 is not formed at both ends of the spring plate 40. In the molding apparatus of the comparative example, a curved surface 91 is formed on the entire surface of the upper surface 41 of the spring plate 40.

[0037] exist Figure 3In the diagram, the horizontal axis represents the position (mm) of the spring plate 40 along its length (X-axis). Positions X11, X12, X13, X15, and X16 are successively located away from the center of the spring plate 40 along its length. Position X11 is closest to the center, and position X16 is furthest from the center. A side surface 43 exists between positions X15 and X16. The intervals between positions X11, X12, X13, X15, and X16 are equal.

[0038] exist Figure 3 In the diagram, the vertical axis represents the contact surface pressure (MPa) between the spring plate 40 and the base plate 50. The contact surface pressures P10, P20, P30, P40, P50, and P60 are values ​​that increase sequentially. Contact surface pressure P10 is the minimum value among contact surface pressures P10 to P60. Contact surface pressure P60 is the maximum value among contact surface pressures P10 to P60.

[0039] In the molding apparatus described in the comparative example, the load acting on the spring plate 40 from the substrate 50 was sequentially increased, and the contact position and contact surface pressure between the spring plate 40 and the substrate 50 were measured. Figure 3 The results are shown in the figure.

[0040] Loads K10, K20, K30, K40, K50, K100, K150, and K200 are values ​​that increase sequentially. Load K10 is the minimum value, and load K200 is the maximum value.

[0041] In the comparative example, as the load increases, the location where the contact surface pressure peaks does not shift in the X-axis direction, but remains approximately the same. In the comparative example, as the load increases, the location where the contact surface pressure peaks shifts slightly outward in the X-axis direction.

[0042] Next, the contact surface pressure between the spring plate 40 and the substrate 50 in the molding apparatus 100 according to the first embodiment will be described. Figure 4 It is a graph showing the contact surface pressure between the spring plate 40 and the substrate 50 in the molding apparatus 100 according to the first embodiment.

[0043] exist Figure 4In the diagram, the horizontal axis represents the position (mm) of the spring plate 40 along its length (X-axis). Positions X21, X22, X23, X25, and X26 are positions that are successively farther from the center of the spring plate 40 along its length. Position X21 is closest to the center, and position X26 is farthest from the center. A side surface 43 exists between positions X25 and X26. The intervals between positions X21, X22, X23, X25, and X26 are equal. The intervals between positions X21, X22, X23, X25, and X26 are the same as the intervals between positions X11, X12, X13, X15, and X16. For example, the interval between positions X21 and X22 is the same as the interval between positions X11 and X12.

[0044] exist Figure 4 In the diagram, the vertical axis represents the contact surface pressure (MPa) between the spring plate 40 and the base plate 50. The contact surface pressures P10, P20, P30, P40, P50, and P60 are respectively the pressures on the spring plate 40 and the base plate 50. Figure 3 The contact surface pressures P10, P20, P30, P40, P50, and P60 shown are the same.

[0045] In the molding apparatus 100 according to the first embodiment, the load acting on the spring plate 40 from the substrate 50 is sequentially increased, and the contact position and contact surface pressure between the spring plate 40 and the substrate 50 are measured. Figure 4 The results are shown in the figure.

[0046] In the first embodiment and the comparative example, the same loads K10, K20, K30, K40, K50, K100, K150, and K200 were applied.

[0047] In the molding apparatus 100 according to the first embodiment, as the load increases, the position where the contact surface pressure reaches its peak shifts inward toward the center in the X-axis direction. In the molding apparatus 100 according to the first embodiment, the contact surface pressure increases as the load increases.

[0048] The maximum value of the contact surface pressure in the molding apparatus 100 according to the first embodiment is, for example, less than 1 / 3 of the maximum value of the contact surface pressure in the molding apparatus according to the comparative example.

[0049] [Effects of the molding apparatus 100 according to the first embodiment]

[0050] The molding apparatus (100) according to the first embodiment is a molding apparatus for pressing a resin sheet (10) used as a resin separator for a fuel cell between an upper mold (30) and a lower mold (20). The molding apparatus (100) includes: a spring plate (40) having a lower surface (first surface) (42) and an upper surface (second surface) (41) facing each other in the thickness direction, which is bent so as to extend from the center of the X-axis direction (first direction, length direction) intersecting the thickness direction to the side opposite to the upper surface (41), and the upper mold (30) is mounted in contact with the lower surface (42). The upper mold (30) is pressed against the lower mold (20) by pressing the spring plate (40) against the substrate (50). In the X-axis direction, an arc chamfer structure with an arc chamfering process is formed at both ends of the upper surface (41) of the spring plate (40). As the pressing load of the spring plate (40) increases, the bent lower surface (42) and upper surface (41) deform in a manner close to the plane (XY plane). The contact point between the upper surface (41) and the substrate is displaced in the X-axis direction from the contact part (first position) (P101) away from the center to the contact part (second position) (P103) close to the center.

[0051] According to this molding apparatus 100, by displacing the contact portions P101 to P103 between the spring plate 40 and the substrate 50, the position where the load is applied can be changed. Therefore, the contact position between the spring plate 40 and the substrate 50 is prevented from becoming localized. As a result, wear caused by the contact between the spring plate 40 and the substrate 50 can be suppressed. In the molding apparatus 100, by suppressing wear, the deformation of the spring plate 40 over time can be suppressed. According to the molding apparatus 100, the lifespan of the spring plate 40 and the substrate 50 can be extended. In the molding apparatus 100, the quality of the molded resin sheet 10 can be stabilized.

[0052] In the molding apparatus 100, the pores 14 in the resin sheet 10 disposed between the lower mold 20 and the upper mold 30 can be disposed on the outside of the resin sheet 10.

[0053] In the molding apparatus 100, by forming an arc-shaped chamfer structure 81, the contact point between the spring plate 40 and the substrate 50 can be displaced in the X-axis direction. This allows the load concentration points to be staggered. Furthermore, the molding apparatus 100 has an arc-shaped chamfer structure 81 that undergoes an arc-shaped chamfering process in the opposite direction to the curved surface 91. This increases the contact area between the spring plate 40 and the substrate 50, and reduces the contact surface pressure between the spring plate 40 and the substrate 50 compared to the prior art.

[0054] [The molding apparatus 100 according to the second embodiment]

[0055] Figure 5This is an enlarged cross-sectional view showing the contact portion between the spring plate 40 and the substrate 50 in the molding apparatus 100 according to the second embodiment. Figure 5 The molding apparatus 100 involved in the second embodiment shown is... Figure 2 The difference between the molding apparatus 100 shown in the first embodiment and the one described above is that the shape of the curved chamfer structure 82 is different. Furthermore, in the description of the second embodiment, some descriptions identical to those in the first embodiment described above are sometimes omitted.

[0056] A chamfered surface structure 82 is formed at both ends of the upper surface 41 of the spring plate 40 in the X-axis direction. The center position C1 of the radius of curvature of the chamfered surface structure 82 is located in the X-axis direction at a position closer to the inside of the side surface 43. In addition, the center position C1 of the radius of curvature of the chamfered surface structure 82 is located in the Z-axis direction between the upper surface 41 and the lower surface 42.

[0057] In addition, the center position C1 of the radius of curvature of the chamfered surface structure 82 can be located on the side 43 in the X-axis direction, or it can be located on the outside of the side 43 in the X-axis direction.

[0058] Alternatively, the center position C1 of the radius of curvature of the chamfered surface 82 can also be positioned below the lower surface 42 in the Z-axis direction.

[0059] [The molding apparatus 100 according to the third embodiment]

[0060] Figure 6 This is an enlarged cross-sectional view showing the contact portion between the spring plate 40 and the substrate 50 in the molding apparatus 100 according to the third embodiment. Figure 6 The molding apparatus 100 involved in the third embodiment shown is... Figure 5 The difference in the molding apparatus 100 according to the second embodiment shown is that it has a curved chamfer structure 82 and a curved chamfer structure 83. Furthermore, in the description of the third embodiment, descriptions identical to those in the above embodiments are sometimes omitted.

[0061] An arc-shaped chamfered structure 82 and an arc-shaped chamfered structure 83 are formed at both ends of the upper surface 41 of the spring plate 40 in the X-axis direction. The arc-shaped chamfered structure 82 is an example of a second curved surface, and the arc-shaped chamfered structure 83 is an example of a first curved surface. The arc-shaped chamfered structure 83 is formed on the outer side of the arc-shaped chamfered structure 82 in the X-axis direction. The arc-shaped chamfered structure 83 is formed at the corner corresponding to the intersection of the upper surface 41 and the side surface 43. The arc-shaped chamfered structure 83 is formed to be continuous with the side surface 43. The arc-shaped chamfered structure 83 is formed to connect the arc-shaped chamfered structure 82 and the side surface 43. The arc-shaped chamfered structure 82 is formed on the inner side of the arc-shaped chamfered structure 83 in the X-axis direction. The radius of curvature of the arc-shaped chamfered structure 82 is larger than the radius of curvature of the arc-shaped chamfered structure 83.

[0062] In this third embodiment of the molding apparatus 100, it also performs the same function as the molding apparatus 100 of the first embodiment described above.

[0063] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to these embodiments. Various modifications or alterations can be made within the scope of the spirit of the present invention as described in the technical solution.

Claims

1. A molding device that performs press molding by disposing a resin sheet that is a resin separator for a fuel cell between an upper mold and a lower mold, characterized by comprising: a spring plate having a first face and a second face that oppose each other in a plate thickness direction, curved in a manner that a central portion in a first direction that intersects the plate thickness direction protrudes toward a side opposite the second face, and mounting the upper mold in contact with the first face; and a base plate that presses the spring plate in a manner that the upper mold approaches the lower mold, wherein an arc chamfer structure that implements arc chamfer processing is formed at both end portions of the second face of the spring plate in the first direction, and as a press load that presses the spring plate increases, the curved first face and second face deform in a manner that approaches a plane, and a contact point of the second face with the base plate shifts from a first position that is distal from the central portion to a second position that is proximal to the central portion in the first direction.

2. The molding device according to claim 1, wherein a center position of a radius of curvature in the arc chamfer structure is on an inner side than side faces that oppose each other in the first direction, and is disposed between the first face and the second face in the plate thickness direction.

3. The molding device according to claim 1 or 2, wherein the arc chamfer structure includes: a first curved face that corresponds to a corner portion where the second face intersects a side face that opposes in the first direction; and a second curved face that is disposed at a position that is on an inner side than the first curved face in the first direction, and a radius of curvature of the second curved face is larger than a radius of curvature of the first curved face. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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