Embedded power supply system for ONU

Abstract

The invention provides an embedded power supply system for an ONU (Optical Network Unit), which relates to the field of network testing and comprises an ONU mainboard, a DC (Direct Current) power supply connecting assembly, a battery arranged at the bottom of the ONU mainboard, a power supply change-over switch and a power supply management assembly, the DC power supply connecting assembly and the battery are electrically connected with the power supply management assembly, and the DC power supply connecting assembly is electrically connected with the power supply management assembly. The power supply management assembly is used for supplying power to the ONU mainboard based on the state of the power supply change-over switch; a chip protection assembly is further arranged at the bottom of the ONU main board, the chip protection assembly is used for collecting the chip power supply state of the ONU main board and executing protection measures on the basis of the chip power supply state of the ONU main board, and the network testing device has the advantages that portable and uninterrupted power supply of the ONU is achieved, and the network testing efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of network testing, and in particular to an embedded power supply system for ONUs. Background Technology

[0002] An ONU (Optical Network Unit) is a user-side device in a Passive Optical Network (PON) that converts optical signals into electrical signals, enabling seamless connection between the fiber optic network and user equipment. The ONU receives optical signals from the optical line terminal (OLT), converts them into electrical signals via its built-in optical module for user equipment (such as computers and routers) to recognize; simultaneously, it converts electrical signals sent by user equipment back into optical signals, establishing a bidirectional communication link. In network operator maintenance, comprehensive line testing is frequently required in areas such as corridors, equipment rooms, and optical distribution boxes. The ONU is a crucial device for photoelectric conversion in PONs and an indispensable tool for maintenance testing. The ONU operates at 12V and has a current of approximately 0.4A, requiring a continuous and stable mains power supply. In outdoor scenarios (such as corridors, communication poles, and optical distribution boxes), the lack of mains power prevents the ONU from starting, hindering the rapid diagnosis of network problems using its built-in testing functions (such as optical power detection and bit error rate analysis). Two maintenance engineers are required to simultaneously test the fiber at both ends (e.g., end A and end B) using tools such as an optical power meter, and locate the fault by comparing the data. However, this method relies on manual coordination, and poor communication or large time synchronization errors can easily lead to inaccurate results. In optical splitter boxes, if the fiber ports are unlabeled or the labels have aged and fallen off, maintenance personnel need to manually connect one end of the fiber to all ports on the other end in sequence, and confirm the correspondence by observing signal continuity (e.g., changes in optical power meter readings). This process is time-consuming and error-prone, especially in optical distribution boxes with densely packed ports, where efficiency is extremely low.

[0003] Indoor environments can be powered by a UPS (Uninterruptible Power Supply). In special outdoor maintenance environments, battery power can generally be provided, or power can be obtained from a vehicle's power supply via inverter. Installing a UPS is costly and runs counter to the passive power conversion strategies of various operators. In special outdoor maintenance environments, there are many problems such as the bulky and heavy weight of portable batteries, insufficient electrical safety measures, low efficiency, and high costs. Using a vehicle inverter also presents challenges such as inconvenient wiring, significant damage to the car battery over time, and potential electrical safety issues like water ingress and leakage during rainy weather.

[0004] Therefore, there is a need to provide an embedded power supply system for ONUs to enable portable and uninterrupted power supply to ONUs and improve the efficiency of network testing. Summary of the Invention

[0005] This invention provides an embedded power supply system for an ONU, including an ONU motherboard and a DC power connection component, and further including a battery, a power switching switch, and a power management component disposed at the bottom of the ONU motherboard. The DC power connection component and the battery are electrically connected to the power management component, and the power management component is used to supply power to the ONU motherboard based on the state of the power switching switch. A chip protection component is also disposed at the bottom of the ONU motherboard, and the chip protection component is used to collect the chip power supply status of the ONU motherboard and perform protection measures based on the chip power supply status of the ONU motherboard.

[0006] Furthermore, the positive terminal of the DC power supply is electrically connected to the input terminal of the power management component via the DC power connection assembly, and the negative terminal of the DC power supply is electrically connected to the output terminal of the power management component via the DC power connection assembly. The output terminal of the power management component is electrically connected to the ONU motherboard. The positive terminal of the battery is connected to the positive charging output terminal of the DC power connection assembly, and the negative terminal of the battery is connected to the negative charging output terminal of the DC power connection assembly. The power switching switch is connected in series between the positive terminal of the battery and the positive charging output terminal of the DC power connection assembly.

[0007] Furthermore, the power management component supplies power to the ONU motherboard based on the state of the power switch, including: when the power switch is in the off state, the power management component supplies power to the ONU motherboard based on DC power; when the power switch is in the closed state and the DC power is connected, the power management component supplies power to the ONU motherboard based on DC power and charges the battery; when the power switch is in the closed state and the DC power is disconnected, the power management component supplies power to the ONU motherboard based on the battery.

[0008] Furthermore, the power management component charges the battery based on DC power, including: determining real-time three-stage charging parameters based on the chip power supply status of the ONU motherboard; and charging the battery based on DC power according to the real-time three-stage charging parameters.

[0009] Furthermore, the chip protection component includes: a temperature monitoring unit, comprising multiple temperature monitoring devices respectively disposed at multiple target locations on the ONU motherboard; a discharge monitoring unit for acquiring the battery's output voltage; an output monitoring unit for acquiring the output voltage of the power supply management component; and a chip protection unit for executing protection measures based on the real-time temperature sequence acquired by the multiple temperature monitoring devices, the battery's output voltage, and the power supply management component's output voltage. The chip power supply status of the ONU motherboard includes the chip temperature status, the battery's output voltage, and the power supply management component's output voltage, and the chip temperature status includes the real-time temperature sequence acquired by the multiple temperature monitoring devices.

[0010] Furthermore, multiple temperature monitoring devices are set up, including: determining multiple ONU test tasks, multiple ONU performance indicators, and multiple temperature test locations on the ONU motherboard; for each ONU test task, collecting temperature sequences from multiple temperature test locations on the ONU motherboard; based on the temperature sequences from multiple temperature test locations on the ONU motherboard corresponding to each ONU test task and multiple ONU performance indicators, selecting effective temperature test locations from the multiple temperature test locations on the ONU motherboard; extracting temperature sequences from the multiple effective temperature test locations on the ONU motherboard corresponding to each ONU test task; based on the temperature sequences from the multiple effective temperature test locations on the ONU motherboard corresponding to each ONU test task, selecting multiple target locations from the multiple effective temperature test locations on the ONU motherboard; and setting up multiple temperature monitoring devices at the multiple target locations on the ONU motherboard.

[0011] Furthermore, the chip protection unit executes protection measures based on the real-time temperature sequences collected by multiple temperature monitoring devices, the battery output voltage, and the power management component output voltage. These measures include: extracting temperature sequences from multiple target locations on the ONU motherboard corresponding to each ONU test task from the temperature sequences of multiple effective temperature test locations on the ONU motherboard; grouping the multiple target locations based on the temperature sequences of the multiple target locations on the ONU motherboard corresponding to each ONU test task to determine multiple location groups; and for each location group, determining whether to execute overheat protection measures based on the real-time temperature sequences collected by the temperature monitoring devices at the target locations included in the location group.

[0012] Furthermore, the power management component determines real-time three-stage charging parameters based on the chip power supply status of the ONU motherboard, including: grouping multiple ONU test tasks based on the temperature sequence of multiple target locations on the ONU motherboard corresponding to each ONU test task to determine multiple ONU test task groups; establishing a charging evaluation function; for each ONU test task group, determining the optimal three-stage charging parameters for multiple sample chip temperature states corresponding to the ONU test task group based on the charging evaluation function; and determining real-time three-stage charging parameters based on the ONU motherboard test tasks and chip power supply status, as well as the optimal three-stage charging parameters for multiple sample chip temperature states corresponding to each ONU test task group.

[0013] Furthermore, the power management component determines real-time three-stage charging parameters based on the ONU motherboard's test tasks and chip power supply status, as well as the optimal three-stage charging parameters for multiple sample chip temperature states corresponding to each ONU test task group. This includes: determining a target ONU test task group from multiple ONU test task groups based on the ONU motherboard's test tasks; filtering similar sample chip temperature states from multiple sample chip temperature states corresponding to the target ONU test task group based on the ONU motherboard's chip power supply status; and determining real-time three-stage charging parameters based on the optimal three-stage charging parameters for similar sample chip temperature states corresponding to the target ONU test task group.

[0014] Furthermore, the chip protection unit executes protection measures based on the real-time temperature sequence collected by multiple temperature monitoring devices, the battery output voltage, and the output voltage of the power supply management component. The measures also include: determining whether to execute a power supply stop measure based on the battery output voltage; and determining whether to execute an output short-circuit protection measure based on the output voltage of the power supply management component.

[0015] Compared with existing technologies, the embedded power supply system for ONUs provided by this invention has at least the following advantages: 1. The installation does not damage the appearance of the original ONU equipment and cleverly utilizes the existing space for installation, without the need for large-scale modifications to the equipment structure. At the same time, the original switches are utilized, and the wiring modifications are minimal, achieving efficient reuse of actual space. This ensures both the integrity of the equipment and full utilization of limited space.

[0016] 2. It boasts excellent battery life, lasting up to 3.5 hours under full power operation and up to 5 hours under low power operation. This provides stable power support for ONU devices in different working scenarios, ensuring that the devices can continue to operate for extended periods without external power input, meeting a variety of usage needs.

[0017] 3. The chip protection component located on the bottom of the ONU motherboard can collect the power supply status of the motherboard chips in real time and execute corresponding protection measures based on the collected status information. This can effectively prevent chip damage caused by abnormal power supply, improve the reliability and stability of the equipment, and extend the service life of the equipment. Attached Figure Description

[0018] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein: Figure 1 This is a schematic diagram of an embedded power supply system for an ONU, shown according to some embodiments of this specification. Figure 2 This is a circuit diagram of an embedded power supply system for an ONU, shown according to some embodiments of this specification; Figure 3 This is a schematic diagram of a chip protection component according to some embodiments of this specification; Figure 4 This is a schematic diagram illustrating the process of setting up multiple temperature monitoring devices according to some embodiments of this specification. Detailed Implementation

[0019] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0020] Figure 1 This is a schematic diagram of an embedded power supply system for an ONU, shown in some embodiments of this specification, such as... Figure 1 As shown, an embedded power supply system for an ONU may include an ONU motherboard and a DC power connection component, as well as a battery, a power switching switch, and a power management component disposed on the bottom of the ONU motherboard. The DC power connection component and the battery are electrically connected to the power management component, which supplies power to the ONU motherboard based on the state of the power switching switch. A chip protection component is also disposed on the bottom of the ONU motherboard, which collects the chip power supply status of the ONU motherboard and performs protection measures based on the chip power supply status. The power management component may include a UPS (Uninterruptible Power Supply) management module.

[0021] In some embodiments, Figure 2 This is a circuit diagram of an embedded power supply system for an ONU, as shown in some embodiments of this specification. Figure 2 As shown, the positive terminal of the DC power supply is electrically connected to the input terminal of the power management component via the DC power connection assembly, and the negative terminal of the DC power supply is electrically connected to the output terminal of the power management component via the DC power connection assembly. The output terminal of the power management component is electrically connected to the ONU motherboard. The positive terminal of the battery is connected to the positive charging output terminal of the DC power connection assembly, and the negative terminal of the battery is connected to the negative charging output terminal of the DC power connection assembly. A power switching switch is connected in series between the positive terminal of the battery and the positive charging output terminal of the DC power connection assembly.

[0022] In some embodiments, the power management component supplies power to the ONU motherboard based on the state of the power switching switch, including: When the power switch is in the off state, the power management component supplies power to the ONU motherboard based on DC power. When the power switch is closed and the DC power supply is connected, the power management component supplies power to the ONU motherboard and charges the battery based on the DC power supply. When the power switch is closed and the DC power is off, the power management component supplies power to the ONU motherboard based on the battery.

[0023] Specifically, the power supply system for the ONU device incorporates a composite power supply system integrating a DC power supply, a battery, and a UPS management module. The power management component, as the core control unit, precisely regulates the power supply path based on the state of the power switching switch to ensure a stable and reliable power supply to the ONU motherboard. In terms of wiring connections, the DC power supply and the power management component form a direct input channel, while the battery is connected to the power management component via the power switching switch. Simultaneously, the output of the power management component is connected to the output of the power switching switch, and their negative terminals share a common ground, laying the physical foundation for seamless power switching.

[0024] When the power switch is off, the system's power supply logic is relatively simple. The positive terminal of the DC power supply is directly connected to the input terminal of the power management component, and the negative terminal of the DC power supply is electrically connected to the output terminal of the power management component through the DC power connection component, forming a single power supply loop. In this mode, the battery is in standby mode and does not participate in the power supply process; the entire system relies on an external DC power supply to maintain operation.

[0025] When the power switch is closed and the DC power supply is connected, the system enters a hybrid power supply and charging mode. On one hand, the power management component continues to use the DC power supply as the main power source, providing a continuous and stable power supply to the ONU motherboard to meet its power requirements for normal operation. On the other hand, the power management component uses the energy of the DC power supply to charge the battery through its internal charging management circuit, ensuring safe and efficient charging of the battery, and automatically stopping charging when the battery is fully charged to prevent overcharging from damaging battery performance and lifespan.

[0026] When the power switching switch is closed but the DC power supply is disconnected, the power management component responds quickly to this state change. Thanks to its rapid switching capability, it seamlessly switches the power supply from DC power to battery, ensuring that the ONU motherboard continues to receive uninterrupted power even when the external DC power supply is interrupted, maintaining business continuity.

[0027] Figure 3 This is a schematic diagram of a chip protection component according to some embodiments of this specification, such as... Figure 3 As shown, the chip protection component includes: The temperature monitoring unit includes multiple temperature monitoring devices respectively installed at multiple target locations on the ONU motherboard; Discharge monitoring unit, used to collect the battery's output voltage; The output monitoring unit is used to collect the output voltage of the power management component; The chip protection unit is used to perform protection measures based on the real-time temperature sequence collected by multiple temperature monitoring devices, the output voltage of the battery, and the output voltage of the power management component. The chip power supply status of the ONU motherboard includes the chip temperature status, the output voltage of the battery, and the output voltage of the power management component. The chip temperature status includes the real-time temperature sequence collected by multiple temperature monitoring devices.

[0028] Specifically, the discharge monitoring unit consists of a high-precision voltage sensor and a signal processing circuit. The voltage sensor is directly connected to the battery's output terminal, capable of sensing minute changes in the battery's output voltage and converting them into a proportional electrical signal. The signal processing circuit amplifies and filters the electrical signal output by the sensor, removing noise interference to ensure the accuracy and reliability of the acquired voltage data. The processed signal is then transmitted to the chip protection unit for further analysis and processing.

[0029] The output monitoring unit also employs a high-precision voltage sensor to acquire the output voltage of the power management component. The voltage sensor is installed at the output terminal of the power management component, sensing changes in the output voltage in real time and converting them into an electrical signal. Subsequently, the electrical signal is processed by a signal processing circuit to remove interference and improve data accuracy. The processed voltage data is then transmitted to the chip protection unit for further analysis and judgment.

[0030] Figure 4 This is a schematic diagram illustrating the process of setting up multiple temperature monitoring devices according to some embodiments of this specification, such as... Figure 4 As shown, in some embodiments, multiple temperature monitoring devices are provided, including: Determine multiple ONU test tasks, multiple ONU performance indicators, and multiple temperature test locations on the ONU motherboard; For each ONU test task, temperature sequences are collected from multiple temperature test locations on the ONU motherboard. The temperature sequence can be formed by arranging the temperatures collected at multiple time points in chronological order. High-precision temperature sensors (such as thermocouples, infrared temperature sensors, etc.) can be used to measure the temperature sequence in real time at each temperature test location and record the temperature data at certain time intervals (such as once per second) to form a temperature sequence. For example, in the high-definition video streaming test task, the temperature of the temperature test location is recorded every 1 second for 2 hours to obtain the temperature sequence of each temperature test location. Based on the temperature sequence of multiple temperature test locations on the ONU motherboard corresponding to each ONU test task and multiple ONU performance indicators, effective temperature test locations are selected from the multiple temperature test locations on the ONU motherboard. Extract the temperature sequence of multiple effective temperature test locations of the ONU motherboard corresponding to each ONU test task from the temperature sequence of multiple temperature test locations of the ONU motherboard corresponding to each ONU test task. Based on the temperature sequence of multiple effective temperature test locations of the ONU motherboard corresponding to each ONU test task, multiple target locations are selected from the temperature sequence of multiple effective temperature test locations of the ONU motherboard. Multiple temperature monitoring devices are installed at various target locations on the ONU motherboard.

[0031] Specifically, the ONU testing task aims to comprehensively evaluate the performance of ONU devices under different operating scenarios and load conditions. By setting diverse test tasks, it is possible to simulate various operating conditions of the ONU in a real network environment, thereby gaining a more accurate understanding of its temperature change patterns. Multiple ONU test tasks can include different service types, such as high-definition video streaming, large data file downloads, and voice calls; they can also cover different network bandwidth requirements, such as low bandwidth (10Mbps), medium bandwidth (50Mbps), and high bandwidth (100Mbps) scenarios; and they can consider different operating durations, such as short-term (10 minutes) high-intensity operation and long-term (several hours) continuous operation. As an example, one test task is set up to continuously stream high-definition video for 2 hours at 100Mbps bandwidth to observe the temperature changes of the ONU under high load for a long period of time.

[0032] ONU performance metrics are key parameters for measuring the operating status and performance of ONU devices. By monitoring these metrics, we can understand how the ONU operates under different test tasks, and further analyze the relationship between temperature changes and performance. As examples, ONU performance metrics include data transmission rate, bit error rate, packet loss rate, and signal strength. Data transmission rate reflects the ONU's data transmission capability; bit error rate and packet loss rate reflect the accuracy of data transmission; and signal strength is related to the communication quality between the ONU and upstream devices.

[0033] Components in different locations on the ONU motherboard generate varying amounts of heat during operation, resulting in different temperature distributions. Selecting multiple temperature testing locations allows for a comprehensive understanding of the motherboard's temperature distribution and accurate identification of key areas of temperature variation. Based on the ONU motherboard's circuit layout and component distribution, representative locations are chosen as temperature testing points. For example, locations near ONU chips (such as the CPU, optical module chip, etc.), the battery, power switching switches, and power management components can be selected.

[0034] In some embodiments, the following process can be used to select valid temperature test locations from multiple temperature test locations on the ONU motherboard based on the temperature sequence of multiple temperature test locations and multiple ONU performance indicators corresponding to each ONU test task: S11. For each ONU test task, collect the index sequence corresponding to each ONU performance index. The index sequence can be formed by arranging the values ​​of ONU performance indices collected at multiple time points in chronological order. S12. For each temperature test location and each ONU test task, calculate the temperature standard deviation of the temperature sequence at the temperature test location. S13. For each temperature test location, calculate the mean of the temperature standard deviation of the temperature sequence for each ONU test task corresponding to the temperature test location, and obtain the mean of the temperature standard deviation of the temperature test location. S14. Temperature test locations with a mean temperature standard deviation greater than a threshold (e.g., 0.5) are selected as the first candidate temperature test locations. S15. For each first candidate temperature test location, calculate the cosine similarity between the temperature sequences of any two ONU test tasks corresponding to the first candidate temperature test location, and calculate the mean of the cosine similarity between the temperature sequences of any two ONU test tasks corresponding to the first candidate temperature test location to obtain the mean cosine similarity of the first candidate temperature test location. S16. The first candidate temperature test location whose mean cosine similarity is less than the mean cosine similarity threshold (e.g., 0.7) is selected as the second candidate temperature test location. S17. For each ONU test task, each of the two candidate temperature test locations, and each ONU performance index, the correlation coefficient between the temperature sequence of the two candidate temperature test locations and the index sequence corresponding to the ONU performance index can be calculated using the correlation coefficient (e.g., Pearson correlation coefficient) calculation formula. S18. For each second candidate temperature test location and each ONU performance index, calculate the average correlation coefficient between the temperature sequence of the second candidate temperature test location and the index sequence corresponding to the ONU performance index under each ONU test task, and obtain the average correlation coefficient between the second candidate temperature test location and the ONU performance index. S19. For each second candidate temperature test location, determine whether the average correlation coefficient between the second candidate temperature test location and at least one ONU performance index is greater than the average correlation coefficient threshold (e.g., 0.5). If so, the second candidate temperature test location is taken as the valid temperature test location.

[0035] Understandably, by calculating the temperature standard deviation (S12) of the temperature sequence at each temperature test location under various ONU test tasks, and further calculating the mean of the temperature standard deviation (S13), the degree of temperature fluctuation at each temperature test location is quantitatively measured. The temperature standard deviation reflects the dispersion of temperature data around the mean; the larger the standard deviation, the more severe the temperature fluctuation. Temperature test locations with a mean temperature standard deviation greater than a set threshold (e.g., 0.5) are selected as the first candidate locations (S14). This step effectively filters out locations with significant temperature changes, which may have a significant impact on the ONU's performance, thus providing more targeted candidate locations for subsequent analysis.

[0036] For each first candidate temperature test location, the cosine similarity of the temperature sequences of any two corresponding ONU test tasks is calculated, and the mean cosine similarity is obtained (S15). Cosine similarity measures the degree of similarity between two vectors in a direction, and here it is used to measure whether the temperature sequence change patterns are similar under different test tasks. The first candidate temperature test locations with a mean cosine similarity less than a set threshold (e.g., 0.7) are selected as second candidate locations (S16). This step eliminates locations with similar temperature change patterns under different test tasks, while retaining locations with different temperature change patterns. The temperature changes at these locations may better reflect the characteristics of the ONU under different operating scenarios, helping to analyze the relationship between temperature and performance more accurately.

[0037] For each ONU test task, each second candidate temperature test location, and each ONU performance index, the correlation coefficient (e.g., Pearson correlation coefficient) between the temperature sequence and the corresponding performance index sequence is calculated (S17). The correlation coefficient measures the degree of linear correlation between two variables. By calculating the correlation coefficient, the relationship between temperature changes and performance index changes can be quantified. For each second candidate temperature test location and each ONU performance index, the mean of the correlation coefficients under each ONU test task is calculated to obtain the mean correlation coefficient between the second candidate temperature test location and the ONU performance index (S18). This step comprehensively considers the situation under different test tasks, making the calculation of the correlation coefficient more comprehensive and accurate. It is determined whether the mean correlation coefficient between each second candidate temperature test location and at least one ONU performance index is greater than a set threshold (e.g., 0.5). If so, the location is taken as a valid temperature test location (S19). Through this step, locations with significant correlation between temperature changes and ONU performance index changes are selected. The temperature changes at these locations can more accurately reflect the performance status of the ONU, providing an important basis for subsequent temperature monitoring and performance optimization.

[0038] In some embodiments, multiple target locations can be selected from the temperature sequences of multiple effective temperature test locations on the ONU motherboard based on the temperature sequences of multiple effective temperature test locations corresponding to each ONU test task, using the following process: S21. For any two effective temperature test locations and each ONU test task, calculate the cosine similarity of the temperature sequences of the ONU test tasks corresponding to the two effective temperature test locations. S22. For any two effective temperature test locations, calculate the mean cosine similarity of the temperature sequences of each ONU test task corresponding to the two effective temperature test locations to obtain the mean cosine similarity of the two effective temperature test locations. S23. For any two valid temperature test locations, if the mean cosine similarity between the two valid temperature test locations is greater than the mean cosine similarity threshold (e.g., 0.7), then one of the valid temperature test locations is removed. S24. For any two remaining valid temperature test locations, determine whether the mean cosine similarity of any two valid temperature test locations is less than or equal to the mean cosine similarity threshold. If yes, proceed to S25; otherwise, proceed to S23. S25. Use the remaining effective temperature test locations as target locations.

[0039] By calculating the cosine similarity of temperature sequences from any two valid temperature test locations and taking the average, locations with a cosine similarity average greater than a threshold are removed. This process eliminates highly similar temperature test location data, preventing duplicate information from interfering with subsequent analysis and making the data more representative. The target locations selected through this process can more accurately reflect the unique temperature change characteristics of different areas of the ONU motherboard, providing crucial and effective data support for analyzing the impact of temperature on ONU performance.

[0040] Understandably, to improve the effectiveness of identifying multiple target locations and reduce random errors, multiple tests can be performed for each ONU test task, and the data from one test can be used to filter multiple target locations. For example, test data with a high recurrence frequency can be used to filter multiple target locations.

[0041] In some embodiments, the chip protection unit performs protection measures based on the real-time temperature sequence collected by multiple temperature monitoring devices, the battery output voltage, and the output voltage of the power management component, including: From the temperature sequences of multiple effective temperature test locations of the ONU motherboard corresponding to each ONU test task, extract the temperature sequences of multiple target locations of the ONU motherboard corresponding to each ONU test task; Based on the temperature sequence of multiple target locations on the ONU motherboard corresponding to each ONU test task, the multiple target locations are grouped to determine multiple location groups; For each location group, based on the real-time temperature sequence collected by the temperature monitoring devices at the target locations included in the location group, it is determined whether to implement overheat protection measures.

[0042] Specifically, the following process can be used to group multiple target locations based on the temperature sequence of multiple target locations on the ONU motherboard corresponding to each ONU test task, thus determining multiple location groups: S31. For any two target locations and each ONU test task, calculate the correlation coefficient of the temperature sequence of the ONU test task corresponding to the two target locations using the correlation coefficient calculation formula (e.g., Pearson correlation coefficient). S32. For any two target locations, calculate the mean of the correlation coefficients of the temperature sequences of each ONU test task corresponding to the two target locations, and use it as the mean of the correlation coefficients corresponding to the two target locations. S33. Using clustering algorithms (e.g., K-Means algorithm, K-Medoids algorithm, split hierarchical clustering, etc.), multiple target locations are grouped according to the mean correlation coefficient between any two target locations to determine multiple location groups. The larger the mean correlation coefficient between any two target locations, the greater the probability that the two target locations are grouped into the same location group.

[0043] Understandably, by calculating the average correlation coefficient of the temperature sequences at target locations and grouping them, locations with similar temperature change trends can be grouped together. This allows for more accurate detection of chip overheating risks caused by abnormally high temperatures in localized areas, based on the overall temperature of the location group rather than a single location, when determining whether to implement overheat protection measures. This avoids misjudgments or omissions due to temperature fluctuations at individual locations, improving the accuracy of chip protection measures. In actual ONU device operation, temperature changes at different locations may be affected by multiple factors, exhibiting complex correlations. Grouping can adapt to this complex scenario, grouping locations affected by the same or similar factors together, which better reflects the actual temperature distribution patterns during device operation, thus providing more realistic protection for the chip.

[0044] By grouping multiple target locations, it is only necessary to monitor and manage each location group as a whole, rather than performing complex analysis and judgment on each target location individually. This greatly reduces the amount of data processing and computational complexity of the monitoring system, improves monitoring efficiency, and reduces the demand on system resources (such as computing and storage resources), enabling the system to operate more efficiently.

[0045] The following process can be used to determine whether overheat protection measures should be implemented based on the real-time temperature sequence collected by temperature monitoring devices at the target locations included in the location group: S41. For any two target locations included in the location group, take the minimum correlation coefficient of the temperature sequence of each ONU test task corresponding to the two target locations to obtain the minimum correlation coefficient corresponding to the two target locations included in the location group. S42. Calculate the mean of the minimum correlation coefficients for any two target locations included in the location group to obtain the mean of the minimum correlation coefficients for the location group. S43. For each target location included in the location group, calculate the average temperature of the target location based on the real-time temperature sequence collected by the temperature monitoring device of the target location, and determine whether the average temperature of the target location is greater than the temperature threshold (e.g., 100°). If not, determine that no temperature abnormality has occurred in the location group; if so, execute S45. S45. For any two target locations included in the location group, calculate the real-time correlation coefficient of the real-time temperature sequence collected by the temperature monitoring device of the two target locations using the correlation coefficient (e.g., Pearson correlation coefficient) calculation formula. S44. Calculate the average real-time correlation coefficient of the real-time temperature sequences collected by the temperature monitoring devices of any two target locations included in the location group to obtain the average real-time correlation coefficient of the location group. S45. Determine whether the average real-time correlation coefficient of the location group is greater than the average minimum correlation coefficient of the location group. If not, determine that no temperature abnormality has occurred in the location group. If so, implement overheat protection measures (e.g., power outage).

[0046] Understandably, the minimum correlation coefficient of the temperature sequence of each ONU test task corresponding to any two target locations in the location group is calculated first, and then the average value is calculated to obtain the minimum correlation coefficient mean. This process fully considers the long-term correlation of temperature changes among target locations within the location group. Because in actual operation, the temperature changes of target locations within the same location group often have certain inherent connections, this correlation analysis based on historical data can more accurately grasp the normal pattern of the overall temperature change of the location group. In the judgment process, not only is attention paid to whether the average temperature of a single target location exceeds the temperature threshold, but the real-time average correlation coefficient is also calculated and compared with the minimum correlation coefficient mean. Even if the average temperature of a certain target location exceeds the threshold, if the real-time average correlation coefficient is not greater than the minimum correlation coefficient mean, it indicates that the temperature change within the location group does not conform to its normal correlation pattern, and may not be a true overheating anomaly. This avoids misjudging the entire location group as overheating due to an occasional temperature increase at a single location, thereby improving the accuracy of temperature anomaly judgment. Through the above precise judgment process, it is possible to effectively avoid the false triggering of overheat protection measures due to local, occasional temperature fluctuations. In scenarios with extremely high stability requirements, such as communication equipment, accidental triggering of protection measures may cause equipment malfunctions and affect normal communication services. This process ensures that protection measures are only implemented when an overheating situation that does not conform to the normal temperature correlation pattern of the location group actually occurs, thereby guaranteeing the stable operation of the system.

[0047] In some embodiments, the power management component charges the battery based on a DC power source, including: Based on the chip power supply status of the ONU motherboard, the real-time three-stage charging parameters are determined. The battery is charged using DC power based on real-time three-stage charging parameters.

[0048] In some embodiments, the power management component determines real-time three-stage charging parameters based on the chip power supply status of the ONU motherboard, including: Based on the temperature sequence of multiple target locations on the ONU motherboard corresponding to each ONU test task, multiple ONU test tasks are grouped to determine multiple ONU test task groups; Establish a charging evaluation function; For each ONU test task group, the optimal three-stage charging parameters for various sample chip temperature states corresponding to the ONU test task group are determined based on the charging evaluation function. Based on the ONU motherboard's test tasks and chip power supply status, as well as the optimal three-stage charging parameters corresponding to the temperature status of various sample chips in each ONU test task group, the real-time three-stage charging parameters are determined.

[0049] Specifically, multiple ONU test task groups can be determined according to the following process: S51. For each ONU test task, generate a temperature matrix corresponding to the ONU test task based on the temperature sequences of multiple target locations on the ONU motherboard corresponding to the ONU test task. Here, one row vector of the temperature matrix is ​​the temperature sequence of a target location. S52. For any two ONU test tasks, calculate the Euclidean distance between the temperature matrices corresponding to the two ONU test tasks. S53. Using clustering algorithms (e.g., K-Means algorithm, K-Medoids algorithm, split hierarchical clustering, etc.), multiple ONU test tasks are grouped according to the Euclidean distance of the temperature matrices corresponding to any two ONU test tasks, thus determining multiple ONU test task groups. The smaller the Euclidean distance of the temperature matrices corresponding to any two ONU test tasks, the greater the probability that the two ONU test tasks will be grouped into the same ONU test task group.

[0050] The charging evaluation function can include the following factors: Charging efficiency: This reflects the efficiency with which electrical energy is converted into usable energy in the battery during the charging process. It can be expressed as the ratio of charging power to the actual power absorbed by the battery. Efficient charging can reduce energy loss and shorten charging time.

[0051] Chip Temperature Impact: This section considers the impact of the charging process on the ONU motherboard chip temperature. Excessive chip temperature can affect its performance and lifespan; therefore, the evaluation function needs to include temperature-related indicators, such as the maximum and average chip temperature, and the rate of temperature rise. This can be achieved by processing and analyzing the temperature series, transforming it into a temperature impact factor in the evaluation function.

[0052] Battery life: Charging parameters have a significant impact on battery cycle life. Excessive charging speed or excessively high charging voltage can damage the internal structure of the battery, shortening its lifespan. Evaluation functions can incorporate models or metrics related to battery life, such as battery capacity degradation rate and cycle count.

[0053] The sample chip temperature states are set to simulate the temperature conditions of the ONU motherboard chips under different operating conditions. A series of representative chip temperature states, such as low temperature, normal temperature, and high temperature, can be determined based on historical data, theoretical analysis, or actual testing. Each sample chip temperature state corresponds to a specific set of temperature sequence characteristics.

[0054] Three-stage charging typically includes a constant current charging stage, a constant voltage charging stage, and a float charging stage. Each stage has corresponding parameters, such as the current value in the constant current charging stage, the voltage value in the constant voltage charging stage, and the charging time. First, it is necessary to determine the reasonable range of values ​​for these parameters. This range can be determined based on factors such as battery specifications, chip power supply requirements, and system safety limitations.

[0055] Within a defined parameter range, various combinations of three-stage charging parameters can be generated. Parameter combinations can be generated using methods such as grid search and random search. For example, for the two parameters of constant current charging current and constant voltage charging voltage, multiple combinations can be generated within a certain value range, following a set step size.

[0056] For each generated parameter combination, charging simulation or actual testing is performed under the corresponding sample chip temperature conditions, and its evaluation value is calculated according to the charging evaluation function. By comparing the evaluation values ​​of different parameter combinations, the parameter combination with the highest evaluation value is selected as the optimal three-stage charging parameters under that sample chip temperature conditions.

[0057] In some embodiments, the power management component determines real-time three-stage charging parameters based on the ONU motherboard's test tasks and chip power supply status, as well as the optimal three-stage charging parameters corresponding to the temperature states of multiple sample chips for each ONU test task group. This includes: Based on the ONU motherboard test tasks, the target ONU test task group is determined from multiple ONU test task groups. The target ONU test task group is the ONU test task group that includes the current ONU motherboard test tasks. Based on the chip power supply status of the ONU motherboard, similar sample chip temperature states are selected from multiple sample chip temperature states corresponding to the target ONU test task group. For example, the Euclidean distance between the current chip temperature state of the ONU motherboard and the sample chip temperature state is calculated, and the sample chip temperature state with the smallest Euclidean distance is selected as the similar sample chip temperature state. Based on the optimal three-stage charging parameters of similar sample chips corresponding to the target ONU test task group at the temperature state, the real-time three-stage charging parameters are determined. For example, the optimal three-stage charging parameters of similar sample chips corresponding to the target ONU test task group at the temperature state are used as the real-time three-stage charging parameters.

[0058] Understandably, by grouping test tasks based on the temperature sequence of multiple target locations on the ONU motherboard and establishing a charging evaluation function, the optimal three-stage charging parameters can be determined for each task group based on the temperature state of various sample chips. Finally, by combining the motherboard test tasks and chip power supply status, real-time parameters can be obtained, enabling precise dynamic adjustment of charging parameters, improving charging efficiency and safety, and ensuring the stable operation of the ONU motherboard.

[0059] In some embodiments, the chip protection unit performs protection measures based on the real-time temperature sequence collected by multiple temperature monitoring devices, the output voltage of the battery, and the output voltage of the power management component, and further includes: Based on the battery's output voltage, determine whether to implement a power supply shutdown measure; Based on the output voltage of the power management component, determine whether to implement output short-circuit protection measures.

[0060] Specifically, as one of the power sources for chips and related devices, the stability of the battery's output voltage is crucial for the normal operation of the equipment. Abnormal battery output voltage can damage the chip, affect device performance, or even cause device failure. Therefore, the chip protection unit needs to monitor the battery's output voltage in real time and determine whether to implement a power supply shutdown measure based on preset rules. According to the battery specifications, chip operating requirements, and equipment safety standards, upper and lower threshold values ​​for the battery output voltage are preset. For example, for a specific battery model, the normal operating voltage range might be 3.6V-4.2V, so the upper threshold can be set to 4.2V, and the lower threshold to 3.6V. The chip protection unit continuously collects the battery's output voltage and compares it with the set upper and lower threshold values. If the battery output voltage exceeds the upper threshold, it indicates that the battery may be overcharged or that other abnormalities are causing the voltage increase. Excessive voltage may break down internal chip components, causing permanent damage. In this case, the chip protection unit will immediately implement a power supply shutdown measure, disconnecting the battery from the chip and related devices to protect the chip from high voltage damage. When the battery output voltage is below the lower threshold, it indicates that the battery power is insufficient or the battery performance has degraded. In this situation, continuing to supply power to the chip may lead to voltage instability, causing the chip to operate in an abnormal state and easily resulting in data errors, logic confusion, and other problems. Furthermore, excessively low voltage may prevent the chip from starting or operating normally, and could even damage it. Therefore, the chip protection unit will also implement power-off measures to prevent damage to the chip due to undervoltage. This is achieved by controlling a hardware switch (such as a relay, MOSFET, etc.) to disconnect the circuit connection between the battery and the chip. When it is determined that power supply needs to be stopped, the chip protection unit sends a control signal to open the hardware switch, thereby stopping the power supply.

[0061] The power management component is responsible for converting and regulating the voltage from the battery or other power source to provide a stable and suitable operating voltage for the chip. However, during device use, an output short circuit may occur, where the output terminal of the power management component is directly connected to ground or another low-impedance path. A short circuit causes a sharp increase in current, which may burn out the power management component, the chip, and other related components. Therefore, it is necessary to detect and implement output short circuit protection measures in a timely manner. Based on the rated output current of the power management component and the chip's withstand capability, a current threshold or voltage change threshold for short circuit detection is set. When the output current exceeds this threshold or the output voltage drops sharply within a short period of time, an output short circuit is identified. Similarly, when the output voltage drops below the set threshold within a short period (e.g., within milliseconds), an output short circuit is also identified, as a short circuit causes the output voltage to be pulled down, resulting in a sharp voltage drop. Once an output short circuit is detected, the chip protection unit immediately implements output short circuit protection measures. The chip protection unit can quickly control the switching transistor (such as a MOSFET) inside the power management component to turn off, cutting off the output current path and preventing the short-circuit current from continuing to flow, thereby protecting the power management component and the chip from damage.

[0062] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be illustrative rather than limiting, and should be considered consistent with the teachings of this specification. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An embedded power system for an ONU, comprising an ONU mainboard and a DC power connection assembly, characterized in that, The ONU mainboard is further provided with a battery, a power switch and a power supply management component arranged at the bottom of the ONU mainboard, the DC power supply connecting component and the battery are electrically connected with the power supply management component, and the power supply management component is configured to supply power to the ONU mainboard based on the state of the power switch; The bottom of the ONU mainboard is further provided with a chip protection component, and the chip protection component is configured to collect a chip power supply state of the ONU mainboard and execute a protection measure based on the chip power supply state of the ONU mainboard.

2. The embedded power supply system for an ONU according to claim 1, wherein, The positive electrode of the DC power supply is electrically connected with the input end of the power supply management component through the DC power supply connecting component, the negative electrode of the DC power supply is electrically connected with the output end of the power supply management component through the DC power supply connecting component, and the output end of the power supply management component is electrically connected with the ONU mainboard. The positive electrode of the battery is connected with the charging output positive electrode end of the DC power supply connecting component, the negative electrode of the battery is connected with the charging output negative electrode end of the DC power supply connecting component, and the positive electrode of the battery and the charging output positive electrode end of the DC power supply connecting component are connected in series through the power switch.

3. The embedded power system for an ONU according to claim 2, wherein, The power supply management component supplies power to the ONU mainboard based on the state of the power switch, and the method comprises the following steps: When the power switch is in an open state, the power supply management component supplies power to the ONU mainboard based on the DC power supply; When the power switch is in a closed state and the DC power supply is connected, the power supply management component supplies power to the ONU mainboard based on the DC power supply and charges the battery; When the power switch is in a closed state and the DC power supply is disconnected, the power supply management component supplies power to the ONU mainboard based on the battery.

4. The embedded power system for an ONU according to claim 3, wherein, The power supply management component charges the battery based on the DC power supply, and the method comprises the following steps: determining real-time three-stage charging parameters based on the chip power supply state of the ONU mainboard; charging the battery based on the DC power supply according to the real-time three-stage charging parameters.

5. The embedded power system for an ONU according to claim 4, wherein, The chip protection component comprises: a temperature monitoring unit comprising a plurality of temperature monitoring devices arranged at a plurality of target positions of the ONU mainboard; a discharge monitoring unit configured to collect an output voltage of the battery; an output monitoring unit configured to collect an output voltage of the power supply management component; a chip protection unit configured to execute a protection measure according to a real-time temperature sequence collected by the plurality of temperature monitoring devices, the output voltage of the battery and the output voltage of the power supply management component, wherein the chip power supply state of the ONU mainboard comprises a chip temperature state, the output voltage of the battery and the output voltage of the power supply management component, and the chip temperature state comprises the real-time temperature sequence collected by the plurality of temperature monitoring devices.

6. The embedded power system for an ONU according to claim 5, wherein, The plurality of temperature monitoring devices are arranged, and the method comprises the following steps: determining a plurality of ONU test tasks, a plurality of ONU performance indicators and a plurality of temperature test positions of the ONU mainboard; for each ONU test task, collecting a temperature sequence of the plurality of temperature test positions of the ONU mainboard; based on the temperature sequence of the plurality of temperature test positions of the ONU mainboard corresponding to each ONU test task and the plurality of ONU performance indicators, screening effective temperature test positions from the plurality of temperature test positions of the ONU mainboard; extract a temperature sequence of a plurality of target positions of the ONU mainboard corresponding to each ONU test task from the temperature sequence of the plurality of temperature test positions of the ONU mainboard corresponding to each ONU test task; screen a plurality of target positions from the temperature sequence of the plurality of effective temperature test positions of the ONU mainboard based on the temperature sequence of the plurality of effective temperature test positions of the ONU mainboard corresponding to each ONU test task; respectively set a plurality of temperature monitoring devices at the plurality of target positions of the ONU mainboard.

7. The embedded power system for an ONU according to claim 6, wherein, The chip protection unit executes protection measures according to the real-time temperature sequence collected by the plurality of temperature monitoring devices, the output voltage of the battery, and the output voltage of the power supply management component, including: extract a temperature sequence of a plurality of target positions of the ONU mainboard corresponding to each ONU test task from the temperature sequence of the plurality of temperature test positions of the ONU mainboard corresponding to each ONU test task; group the plurality of target positions based on the temperature sequence of the plurality of target positions of the ONU mainboard corresponding to each ONU test task, and determine a plurality of position groups; for each position group, determine whether to execute an overheat protection measure based on the real-time temperature sequence collected by the temperature monitoring device of the target position included in the position group.

8. The embedded power system for an ONU according to claim 7, wherein, The power supply management component determines real-time three-stage charging parameters based on the chip power supply state of the ONU mainboard, including: group a plurality of ONU test tasks based on the temperature sequence of the plurality of target positions of the ONU mainboard corresponding to each ONU test task, and determine a plurality of ONU test task groups; establish a charging evaluation function; for each ONU test task group, determine optimal three-stage charging parameters of a plurality of sample chip temperature states corresponding to the ONU test task group based on the charging evaluation function; determine real-time three-stage charging parameters based on the test task of the ONU mainboard, the chip power supply state, and the optimal three-stage charging parameters of the plurality of sample chip temperature states corresponding to each ONU test task group.

9. The embedded power system for an ONU according to claim 8, wherein, The power supply management component determines real-time three-stage charging parameters based on the test task of the ONU mainboard, the chip power supply state, and the optimal three-stage charging parameters of the plurality of sample chip temperature states corresponding to each ONU test task group, including: determine a target ONU test task group from the plurality of ONU test task groups based on the test task of the ONU mainboard; screen a similar sample chip temperature state from the plurality of sample chip temperature states corresponding to the target ONU test task group based on the chip power supply state of the ONU mainboard; determine real-time three-stage charging parameters based on the optimal three-stage charging parameters of the similar sample chip temperature state corresponding to the target ONU test task group.

10. The embedded power system for an ONU according to any of claims 7-9, wherein, The chip protection unit executes protection measures according to the real-time temperature sequence collected by the plurality of temperature monitoring devices, the output voltage of the battery, and the output voltage of the power supply management component, and further includes: determine whether to execute a power supply stop measure based on the output voltage of the battery; determine whether to execute an output short circuit protection measure based on the output voltage of the power supply management component.

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