Silicon wafer suction variable-pitch transplanting mechanism

Abstract

The invention relates to a silicon wafer suction variable-pitch transplanting mechanism which comprises a rack assembly, a transplanting assembly and a variable-pitch assembly, the rack assembly is movably connected with the transplanting assembly, and the top end of the rack assembly is provided with the variable-pitch assembly. A short-size variable-pitch screw rod is adopted, the working mode of the screw rod is optimized, the screw rod only moves when the variable-pitch position is adjusted, and long-time high-speed rotation of the screw rod in the traditional scheme is not needed.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer transfer, specifically a silicon wafer pick-up and variable-pitch transfer mechanism. Background Technology

[0002] In industries such as photovoltaics and semiconductors that rely on silicon wafer processing, the silicon wafer pick-up and transfer mechanism is a core piece of equipment on the production line, and its performance directly affects production efficiency and product yield. Currently, most silicon wafer pick-up and transfer mechanisms on the market generally use a lead screw drive system to move the picked-up components. To match the high transfer speed requirements of the silicon wafer production line, the lead screw needs to rotate at high speed. However, the silicon wafer transfer path has a certain length, requiring the lead screw to be designed to be large enough to cover sufficient travel. When a large-sized lead screw rotates at high speed, the frequency and intensity of frictional contact with the matching nut increase significantly. This not only causes severe mechanical wear but also leads to a rapid increase in component temperature due to frictional heat. Excessive temperature can alter the physical properties of the materials of the lead screw and nut, such as causing thermal expansion and deformation of the components, further exacerbating the misalignment of the fit and creating a vicious cycle of "wear-heating-deformation-more severe wear." This situation can easily cause the transmission mechanism to jam or fail, leading to equipment downtime, shortening the service life of the transfer mechanism, increasing the company's equipment maintenance costs and production interruption risks. At the same time, it is difficult to meet the stringent requirements of the silicon wafer processing industry for production continuity, stability and long-term equipment durability, becoming a major bottleneck restricting the improvement of production line efficiency. Therefore, a silicon wafer pick-up variable pitch transfer mechanism is proposed. Summary of the Invention

[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0004] Given the following technical problems in existing technologies: traditional lead screw drive designs are prone to equipment damage and have short service life. Current mechanisms generally use lead screw drives to move the pick-up components. To meet the transfer speed requirements of silicon wafer production lines, the lead screw needs to maintain high-speed rotation; simultaneously, to cover the stroke required for silicon wafer transfer, the lead screw size is usually designed to be large. However, during high-speed rotation, the frequency and intensity of frictional contact between the large-sized lead screw and the matching nut significantly increase. This leads to severe mechanical wear, accelerating component aging; and secondly, it generates a large amount of heat due to friction, causing the temperature of the lead screw and nut to rise rapidly. Excessive temperature alters the physical properties of the component materials, causing thermal expansion and deformation, which in turn compromises the fit precision between the lead screw and nut, creating a vicious cycle of "wear-heating-deformation-more severe wear." This vicious cycle not only easily causes the transmission mechanism to jam or fail, leading to equipment downtime, but also significantly shortens the service life of the entire transfer mechanism, increasing the company's equipment maintenance and replacement costs. Frequent downtime also disrupts the production process, affecting production continuity.

[0005] To solve the above technical problems, the present invention provides the following technical solution: a silicon wafer pick-up and transfer mechanism with variable pitch, comprising a frame assembly, a transfer assembly and a variable pitch assembly, wherein the transfer assembly is movably connected to the frame assembly and the variable pitch assembly is provided at the top of the frame assembly; The frame assembly includes a frame 1, a frame platform, and a frame arm. One end of the frame 1 is connected to the frame platform via a support frame. A frame arm is installed on one side of the frame platform. A transplanting assembly is movably connected to the frame arm. A pitch-changing assembly is installed on the upper side of the frame arm near the end of the frame platform.

[0006] As a preferred technical solution for a silicon wafer pick-up and transfer mechanism with variable pitch, the transfer assembly includes a movable frame, a support frame, a drive mechanism, and a pick-up mechanism. The movable frame is U-shaped and slidably connected to the frame arm. The support frame is located on the front of the movable frame, and the pick-up mechanism is located on the front of the support frame. The drive mechanism is located inside the frame arm and connected to the movable frame. The U-shaped movable frame stably supports the components, and its slidable connection with the frame arm ensures smooth movement. The built-in drive mechanism reduces interference and improves the smoothness and reliability of the transfer assembly's operation.

[0007] As a preferred technical solution for a silicon wafer pick-up and transfer mechanism with variable pitch, the transfer assembly further includes a connecting arm. A long groove is formed on the front of the frame arm, and the groove is horizontally positioned. The connecting arm is located inside the movable frame and extends into the long groove to connect with the drive mechanism. The connecting arm forms a stable transmission path, while the long groove guides and limits its movement range, making the drive more precise and stable, reducing transmission sway, and improving the movement accuracy of the pick-up mechanism.

[0008] As a preferred technical solution for a silicon wafer pick-up and transfer mechanism with variable pitch, the drive mechanism includes a servo electric cylinder, which is located on the inner side of the frame arm, and its movable end is connected to the connecting arm. The servo electric cylinder as the drive mechanism precisely controls the movement of the connecting arm, meeting accuracy requirements; the built-in cylinder on the frame arm prevents dust and impurities from entering, extends its lifespan, and has a compact, space-saving structure.

[0009] As a preferred technical solution for a silicon wafer pick-up and variable-pitch transfer mechanism, the drive mechanism includes synchronous pulleys and a synchronous belt. A drive groove is formed inside the frame arm, with one side of the drive groove connected to a long groove. A synchronous pulley is rotatably connected to each end of the drive groove, and a synchronous belt connects between the pulleys. The inner side of the synchronous belt engages with the pulleys, and the synchronous belt is fixedly connected to the connecting arm. The drive mechanism uses synchronous pulleys and a synchronous belt, resulting in smooth transmission and low noise, preventing silicon wafer displacement. The drive groove provides installation space and connects to the long groove, ensuring smooth operation of the connecting arm.

[0010] As a preferred technical solution for a silicon wafer pick-up and transfer mechanism with variable spacing, the pick-up mechanism includes a vertical electric cylinder and a transfer plate. The vertical electric cylinder is located on the front of the support frame, and the movable end of the vertical electric cylinder is fixedly connected to the transfer plate. Several suction cups are mounted on the transfer plate. The pick-up mechanism consists of a vertical electric cylinder and a multi-suction cup transfer plate. The electric cylinder precisely adjusts the suction height, and the multiple suction cups increase the suction force and distribute the force evenly, preventing the silicon wafer from falling off or deforming.

[0011] As a preferred technical solution for a silicon wafer pick-up and variable-pitch transfer mechanism, a connecting groove is provided on the upper side of the frame arm, which connects to the drive groove. The variable-pitch assembly also includes a limiting plate, a constraint groove, a limiting rod, and a moving seat. A limiting plate is provided on one of the synchronous pulleys, and a constraint groove is provided on the limiting plate. A limiting rod is movably connected within the constraint groove, and the top of the limiting rod extends out of the connecting groove. The connecting groove allows the limiting rod to move. The addition of the limiting plate and other components allows the limiting plate to drive the limiting rod to move, providing feedback on the rotation of the synchronous pulley and laying the foundation for precise control of the number of rotations.

[0012] As a preferred technical solution for a silicon wafer pick-up and variable-pitch transplanting mechanism, the variable-pitch assembly also includes a limiting frame. Two parallel limiting frames are mounted on the frame arm, distributed on both sides of the connecting groove. The moving seat is rotatably connected to the limiting rod, located between the two limiting frames, and slidably connected to them. The limiting frames are rectangular columns, and the constraint groove is an equidistant spiral. The addition of the limiting frames guides and limits the moving seat, and the equidistant spiral design of the constraint groove allows the limiting rod to move evenly, improving the stability and uniformity of the variable-pitch assembly and enhancing transplanting accuracy.

[0013] As a preferred technical solution for a silicon wafer pick-up and variable-pitch transfer mechanism, the variable-pitch assembly also includes a position limiting platform. Each end of the position limiting platform is equipped with a constraint cylinder, which is movably connected to a limit frame. The position limiting platform also movably abuts against a movable seat. The addition of the position limiting platform, with the constraint cylinders working in conjunction with the limit frame to ensure stable positioning, limits the movement range of the movable seat, prevents component collisions, and improves the operational safety of the mechanism.

[0014] As a preferred technical solution for a silicon wafer pick-up and transfer mechanism with variable pitch, the variable pitch assembly also includes a movable seat and a variable pitch screw. The movable seat is mounted on the frame arm, and its power output end is fixedly connected to one end of the variable pitch screw. The variable pitch screw is rotatably connected to a bracket on one side of the limiting frame. Brackets are provided at both ends of the limiting frame, which is connected to the frame arm via these brackets. The connection between the variable pitch screw and the component is clearly defined; the shorter dimension of the variable pitch screw only moves when adjusting the position, reducing friction and heat generation. The limiting frame is stably installed via brackets, ensuring the structural stability of the variable pitch assembly.

[0015] The beneficial effects of the silicon wafer pick-up and transfer mechanism of the present invention are as follows: it adopts a short-sized variable pitch lead screw and optimizes the working mode of the lead screw—it only moves when adjusting the variable pitch position, without having to rotate at high speed for a long time like the traditional solution.

[0016] This design significantly reduces the frictional contact time and intensity between the lead screw and its components, fundamentally reducing the intense interaction and heat generation between parts, and preventing equipment failures caused by thermal deformation and mechanical wear. Simultaneously, the shorter lead screw reduces the difficulty and cost of component manufacturing, minimizes the overall space required for the equipment, and facilitates integration with other equipment on the production line. Furthermore, in terms of motion control precision, this mechanism relies on the precise fit within the pitch-changing components to achieve accurate control of the transfer process.

[0017] The variable pitch assembly comprises a limiting disc, constraint grooves, and limiting rods, forming a complete limiting and transmission adjustment system. When the limiting disc rotates, the equidistant spiral constraint grooves on its surface drive the limiting rods to move precisely along the connecting grooves. The cooperation between the limiting rods and the moving seat precisely limits the number of rotations of the synchronous pulley. The number of rotations of the synchronous pulleys directly determines the travel distance of the synchronous belt, which is then connected to the movable frame. This ultimately achieves precise position control of the movable frame and its transfer plate, effectively avoiding the risks of bumps and scratches during silicon wafer transfer and ensuring the quality of silicon wafer processing. Simultaneously, precise variable pitch control allows the mechanism to quickly adapt to the transfer needs of silicon wafers of different specifications without frequent component replacements or equipment parameter adjustments, improving the efficiency and flexibility of silicon wafer transfer. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a top view of the structure of the present invention; Figure 3 This is a schematic diagram of the cross-sectional structure of the frame arm (103) of the present invention; Figure 4 This is a schematic diagram of the structure of the constraint groove (302) of the present invention.

[0019] Reference numerals: 100, Frame assembly; 101, Frame one; 102, Frame platform; 103, Frame arm; 104, Long groove; 105, Drive groove; 107, Connecting groove; 200, Transplanting assembly; 201, Movable frame; 202, Support frame; 203, Vertical electric cylinder; 204, Transplanting plate; 205, Connecting arm; 206, Synchronous pulley; 207, Synchronous belt; 300, Pitch variable assembly; 301, Limiting plate; 302, Constraint groove; 303, Limiting rod; 304, Servo motor one; 305, Moving seat; 306, Pitch variable lead screw; 308, Limiting frame; 309, Position limiting platform. Detailed Implementation

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0022] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0023] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include three-dimensional spatial dimensions of length, width, and depth.

[0024] like Figures 1-4 As shown, the present invention proposes a silicon wafer pick-up and transfer mechanism with variable pitch, including a frame assembly 100, a transfer assembly 200 and a variable pitch assembly 300. The transfer assembly 200 is movably connected to the frame assembly 100, and the variable pitch assembly 300 is provided at the top of the frame assembly 100. The frame assembly 100 includes a frame 101, a frame platform 102, and a frame arm 103. One end of the frame 101 is connected to the frame platform 102 via a support frame. A frame arm 103 is provided on one side of the frame platform 102. A transplanting assembly 200 is movably connected to the frame arm 103. A pitch-changing assembly 300 is provided on the upper side of the frame arm 103 near the end of the frame platform 102.

[0025] The transplanting assembly 200 includes a movable frame 201, a support frame 202, a drive mechanism, and a suction mechanism. The movable frame 201 is U-shaped and is slidably connected to the frame arm 103. The support frame 202 is located on the front of the movable frame 201, and the suction mechanism is located on the front of the support frame 202. The drive mechanism is located inside the frame arm 103 and is connected to the movable frame 201. The U-shaped movable frame 201 stably supports the components, and its slidable connection with the frame arm 103 ensures smooth movement. The drive mechanism is built into the frame arm 103 to reduce interference, thus improving the smoothness and reliability of the transplanting assembly 200's operation.

[0026] The transplanting assembly 200 also includes a connecting arm 205. A long groove 104 is formed on the front of the frame arm 103, and the long groove 104 is horizontally positioned. The connecting arm 205 is located inside the movable frame 201 and extends into the long groove 104 to connect with the drive mechanism. The connecting arm 205 forms a stable transmission path, and the long groove 104 guides and limits its movement range, making the drive more precise and stable, reducing transmission sway, and improving the movement accuracy of the suction mechanism.

[0027] The drive mechanism includes a servo electric cylinder, which is located inside the frame arm 103. The movable end of the servo electric cylinder is connected to the connecting arm 205. The drive mechanism is a servo electric cylinder, which precisely controls the movement of the connecting arm 205 to meet accuracy requirements. The electric cylinder is built into the frame arm 103, which prevents dust and impurities, extends its service life, and has a compact structure that saves space.

[0028] The drive mechanism includes a synchronous pulley 206 and a synchronous belt 207. A drive groove 105 is formed inside the frame arm 103. One side of the drive groove 105 connects to a long groove 104. A synchronous pulley 206 is rotatably connected to each end of the drive groove 105. A synchronous belt 207 connects between the synchronous pulleys 206, with the inner side of the synchronous belt 207 engaging with the synchronous pulleys 206. The synchronous belt 207 is fixedly connected to the connecting arm 205. The drive mechanism uses synchronous pulleys 206 and a synchronous belt 207, resulting in smooth transmission and low noise, preventing silicon wafer displacement. The drive groove 105 provides installation space and connects to the long groove 104, ensuring smooth operation of the connecting arm 205.

[0029] The suction mechanism includes a vertical electric cylinder 203 and a transplanting plate 204. The vertical electric cylinder 203 is located on the front of the support frame 202, and the movable end of the vertical electric cylinder 203 is fixedly connected to the transplanting plate 204. Several suction cups are provided on the transplanting plate 204. The suction mechanism consists of the vertical electric cylinder 203 and the multi-suction cup transplanting plate 204. The electric cylinder 203 precisely adjusts the suction height, and the multiple suction cups increase the suction force and distribute the force evenly, preventing the silicon wafer from falling off and deforming.

[0030] The upper side of the frame arm 103 is provided with a connecting groove 107, which is connected to the drive groove 105. The pitch conversion assembly 300 also includes a limiting plate 301, a constraint groove 302, a limiting rod 303, and a moving seat 305. One of the synchronous pulleys 206 is provided with a limiting plate 301, which has a constraint groove 302. The limiting rod 303 is movably connected within the constraint groove 302, and the top of the limiting rod 303 extends out of the connecting groove 107. The connecting groove 107 allows the limiting rod 303 to move. The addition of the limiting plate 301 and other components allows the limiting plate 301 to drive the limiting rod 303 to move, providing feedback on the rotation of the synchronous pulley 206 and laying the foundation for precise control of the number of rotations.

[0031] The suction cup is connected to the vacuum generator via an air tube.

[0032] The pitch-changing assembly 300 also includes limiting frames 308. Two parallel limiting frames 308 are installed on the frame arm 103, distributed on both sides of the connecting groove 107. The movable seat 305 is rotatably connected to the limiting rod 303, and is located between the two limiting frames 308. The movable seat 305 is slidably connected to the limiting frames 308. The limiting frames 308 are rectangular columns, and the constraint groove 302 is an equidistant spiral. The addition of the limiting frames 308 guides and limits the movable seat 305, and the constraint groove 302 is an equidistant spiral, allowing the limiting rod 303 to move evenly, improving the stability and uniformity of the pitch-changing assembly 300, and increasing the transplanting accuracy.

[0033] The pitch-changing assembly 300 also includes a position limiting platform 309. Each end of the position limiting platform 309 has a constraint cylinder, which is movably connected to the limit frame 308. The position limiting platform 309 also movably abuts against the movable seat 305. The addition of the position limiting platform 309, along with the constraint cylinders working in conjunction with the limit frame 308, ensures stable positioning, limits the movement range of the movable seat 305, prevents component collisions, and improves the operational safety of the mechanism.

[0034] The pitch control assembly 300 also includes a movable base 305 and a pitch control screw 306. The movable base 305 is mounted on the frame arm 103, and its power output end is fixedly connected to one end of the pitch control screw 306. The pitch control screw 306 is rotatably connected to a bracket on one side of the limit frame 308. Both ends of the limit frame 308 are equipped with brackets, and the limit frame 308 is connected to the frame arm 103 via these brackets. The pitch control screw 306 is clearly connected to the component; its shorter dimension only moves when adjusting the position, reducing friction and heat generation. The limit frame 308 is stably installed via the brackets, ensuring the structural stability of the pitch control assembly 300.

[0035] The limiting frame 308 is a rectangular column. The vertical surface of the limiting frame 308 is slidably connected to the outer side of the movable seat 305. The two ends of the movable seat 305 are constrained by the two limiting frames 308.

[0036] The vertical electric cylinder 203 is a servo electric cylinder, and one of the synchronous pulleys 206 is connected to the servo motor 2.

[0037] The specific implementation method is as follows: Servo motor 2 controls the synchronous pulley 206 to rotate, the synchronous pulley 206 drives the limiting disk 301 to rotate, the limiting disk 301 rotates during the rotation, the constraint groove 302 rotates with the constraint groove 302, the constraint groove 302 drives the limiting rod 303 to move along the connecting groove 107, the variable pitch assembly 300 limits the position of the limiting rod 303 to limit the number of rotations of the limiting disk 301 and the synchronous pulley 206, thereby controlling the moving distance of the synchronous belt 207, thereby quickly controlling the moving position of the movable frame 201, thereby achieving the purpose of variable pitch transfer of silicon wafers, wherein the suction mechanism on the movable frame 201 is used to suction silicon wafers; Compared to existing technologies that control the movement of the suction mechanism via a lead screw, which requires a lead screw much larger than the variable pitch lead screw 306, and requires the lead screw to rotate rapidly to achieve rapid movement, the lead screw and nut interact violently and generate a lot of heat, which can easily lead to damage to the device and greatly reduce its service life. In contrast, the variable pitch lead screw 306 is very short and only needs to move when adjusting the pitch position, and does not require long-term violent rotation.

[0038] It should be understood that numerous specific implementation decisions can be made during the development of any practical implementation, such as in any engineering or design project. Such development efforts may be complex and time-consuming, but for those skilled in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0039] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A silicon wafer suction pitch change transplanting mechanism characterized by comprising: It comprises a rack assembly (100), a transplanting assembly (200) and a variable distance assembly (300), the transplanting assembly (200) is movably connected to the rack assembly (100), and the variable distance assembly (300) is arranged at the top end of the rack assembly (100); The rack assembly (100) comprises a rack one (101), a rack table (102) and a rack arm (103), one end of the rack one (101) is connected to the rack table (102) through a support frame, one side of the rack table (102) is provided with the rack arm (103), the rack arm (103) is movably connected to the transplanting assembly (200), and the variable distance assembly (300) is arranged on the upper side of the end of the rack arm (103) close to the rack table (102).

2. The silicon wafer pick-and-place mechanism of claim 1, wherein: The transplanting assembly (200) comprises a movable moving frame (201), a supporting frame (202), a driving mechanism and a suction mechanism, the movable moving frame (201) is in the shape of a U, the movable moving frame (201) is slidably connected to the rack arm (103), the supporting frame (202) is arranged on the front of the movable moving frame (201), the suction mechanism is arranged on the front of the supporting frame (202), the driving mechanism is arranged in the rack arm (103), and the driving mechanism is connected to the movable moving frame (201).

3. The silicon wafer pick-and-place mechanism of claim 2, wherein: The transplanting assembly (200) further comprises a connecting arm (205), a long groove (104) is formed in the front of the rack arm (103), the long groove (104) is transversely arranged, the connecting arm (205) is arranged on the inner side of the movable moving frame (201), and the connecting arm (205) extends into the long groove (104) and is connected to the driving mechanism.

4. The silicon wafer pick-and-place mechanism of claim 3, wherein: The driving mechanism comprises a servo cylinder, the servo cylinder is arranged on the inner side of the rack arm (103), and the movable end of the servo cylinder is connected to the connecting arm (205).

5. The silicon wafer pick-and-place mechanism of claim 3, wherein: The driving mechanism comprises a synchronous pulley (206) and a synchronous belt (207), a driving groove (105) is formed in the rack arm (103), one side of the driving groove (105) is communicated with the long groove (104), and the two ends of the driving groove (105) are rotatably connected with the synchronous pulleys (206), respectively, the synchronous pulleys (206) are connected with the synchronous belt (207), the inner side of the synchronous belt (207) is engaged with the synchronous pulleys (206), and the synchronous belt (207) is fixedly connected with the connecting arm (205).

6. A silicon wafer pick-and-relocate mechanism according to claim 4 or 5, wherein: The suction mechanism comprises a vertical cylinder (203) and a transplanting plate (204), the vertical cylinder (203) is arranged on the front of the supporting frame (202), the movable end of the vertical cylinder (203) is fixedly connected with the transplanting plate (204), and a plurality of suction cups are arranged on the transplanting plate (204).

7. The silicon wafer pick-and-place mechanism of claim 6, wherein: The upper side of the rack arm (103) is provided with a connecting groove (107), the connecting groove (107) is communicated with the driving groove (105), the variable distance assembly (300) further comprises a limiting disc (301), a constraint groove (302), a limiting rod (303) and a moving seat (305), one of the synchronous pulleys (206) is provided with the limiting disc (301), the limiting disc (301) is provided with the constraint groove (302), the limiting rod (303) is movably connected in the constraint groove (302), and the top of the limiting rod (303) extends out of the connecting groove (107).

8. The silicon wafer pick-and-place mechanism of claim 7, wherein: The variable distance assembly (300) further comprises a moving seat (305) and a variable distance screw rod (306), the rack arm (103) is provided with the moving seat (305), the power output end of the moving seat (305) is fixedly connected with one end of the variable distance screw rod (306), the variable distance screw rod (306) is rotatably connected with the support on one side of the limiting frame (308), the limiting frame (308) is provided with the support at both ends, and the limiting frame (308) is connected with the rack arm (103) through the support.

9. The silicon wafer pick-and-place mechanism of claim 8, wherein: The variable distance assembly (300) further comprises a limiting frame (308), the rack arm (103) is provided with two parallel limiting frames (308), the limiting frames (308) are distributed on both sides of the connecting groove (107), the moving seat (305) is rotatably connected with the limiting rod (303), the moving seat (305) is located between the two limiting frames (308), the moving seat (305) is slidably connected with the limiting frame (308), the limiting frame (308) is a rectangular column, and the constraint groove (302) is an equidistant spiral line.

10. The silicon wafer pick-and-place mechanism of claim 9, wherein: The variable distance assembly (300) further comprises a position limiting table (309), the position limiting table (309) is provided with a constraint cylinder at both ends, the constraint cylinder is movably sleeved with the limiting frame (308), and the position limiting table (309) movably abuts against the moving seat (305).

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