Heat exchange module and substrate processing apparatus including same

Abstract

The present invention relates to a heat exchange module and a substrate processing apparatus including the same, and more particularly, to a heat exchange module for high pressure and a substrate processing apparatus including the same. The present invention, which is a heat exchange module that constantly communicates with a high-pressure vessel that forms a heating space (S2) under high-temperature and high-pressure process conditions, is provided with: a main body part (500) in which a heat exchange space (S4) is formed; a flow path forming unit (600) that forms, in the heat exchange space (S4), a flow path through which exhaust gas discharged from the high-pressure vessel flows; and a heat medium duct part (700), at least a part of which is provided in the heat exchange space (S4), and in which a heat medium for direct or indirect heat exchange with the exhaust gas flows.

Description

Technical Field

[0001] The present invention relates to a heat exchange module and a substrate processing apparatus including the same, and more specifically, to a high-voltage heat exchange module and a substrate processing apparatus including the same. Background Technology

[0002] A substrate processing apparatus is a device for processing substrates such as wafers. In order to perform processes such as deposition, etching, and heat treatment on multiple substrates, a reactor utilizing a small boat can be used.

[0003] This type of reactor-shaped conventional substrate processing device is suitable for single or double tubes in which multiple substrates are inserted through a small boat to perform substrate processing, and has a heater on the outermost perimeter to supply heat to form a process temperature atmosphere.

[0004] In addition, for various processes of the substrate, especially the annealing process to improve the film quality by removing residues on the substrate surface and inside, it is necessary to form a high temperature of over 800°C and a high pressure of over 2ATM to process the substrate.

[0005] However, traditional substrate processing devices use dual tubes to protect against tube breakage under high pressure conditions above 2ATM. However, quartz materials are at greater risk of damage under high pressure, resulting in lower durability. If damaged, they may cause pollution problems due to gas leakage.

[0006] Furthermore, when the material of the dual tubes is strengthened to address the aforementioned issues, it is difficult to achieve the necessary high-temperature conditions for substrate processing due to the low heat transfer rate of the material, which makes it difficult to receive the heat supplied by the heater located at the outermost perimeter.

[0007] In addition, this substrate processing apparatus has a heat sink, which introduces cooling gas after the high-temperature process to cool the heater and surrounding components, and cools the discharged cooling gas after heat exchange.

[0008] However, according to conventional substrate processing equipment, after substrate processing is performed under internal pressure of more than 2 ATM and high temperature of more than 800°C, during the process of introducing and expelling cooling gas, the temperature of the cooling gas is very high. If the sealing components between the heat sink and the tube are damaged, the seal between the heat sink and the inside of the tube will not be maintained, and the heat sink will be damaged due to being exposed to high pressure inside the tube. Summary of the Invention

[0009] Technical problems to be solved

[0010] The purpose of this invention is to provide a heat exchange module and a substrate processing apparatus including the module that can be used under high pressure to solve the aforementioned problems.

[0011] Problem-solving methods

[0012] To achieve the objectives of the present invention, a heat exchange module is disclosed, which is in constant communication with a high-pressure vessel that forms a heating space S2 for high-temperature and high-pressure process conditions. The module includes: a main body 500, which forms a heat exchange space S4 inside; a flow path forming part 600, which forms a flow path for exhaust gas from the high-pressure vessel within the heat exchange space S4; a heat medium pipe part 700, at least a portion of which is disposed within the heat exchange space S4, for which a heat medium for direct or indirect heat exchange with the exhaust gas flows; and a reinforcing rib 800, which, depending on the high-pressure state of the heat exchange space S4, is disposed on at least a portion outside the main body 500 to reinforce the main body 500. The longitudinal section of the main body 500 including the heat exchange space S4 is quadrilateral, and the end of the reinforcing rib 800 is connected to an extension part 540 that extends laterally from the top of the main body 500.

[0013] The reinforcing ribs 800 have a length and are parallel to each other in a direction that intersects with a virtual straight plane between the end where the exhaust gas flows in and the other end where the exhaust gas is discharged from the main body 500.

[0014] The reinforcing ribs 800 have a planar length in a virtual straight line direction between the end where the exhaust gas flows in and the other end where the exhaust gas exits, and are parallel to each other.

[0015] The present invention further includes: a buffer space forming portion 900 disposed on the inner surface of the main body portion 500, forming a buffer space S5 between the flow path forming portion 600 and the main body portion 500, such that the flow path forming portion 600 is separated from the inner surface of the main body portion 500.

[0016] The longitudinal section of the main body 500, including the heat exchange space S4, is quadrilateral, and the buffer space forming part 900 is located at at least one of the top surface, bottom surface, and two side surfaces of the main body 500.

[0017] The main body 500 includes: a housing 510 forming the heat exchange space S4; a first flange 520 located at one end of the housing 510 to allow the exhaust gas to flow in; and a second flange 530 located at the other end of the housing 510 to allow the exhaust gas to discharge.

[0018] A sensor 8 for measuring parameters of the exhaust gas discharged from the housing 510 is provided on the second flange 530.

[0019] The flow path forming section 600 includes a plurality of flow path forming plates 610 that are parallel to each other and form a plurality of flow paths between them.

[0020] The heat medium conduit section 700 includes: a heat exchange conduit section 710, which intersects with the flow path formed by the flow path forming section 600, in which the heat medium flows; and a heat medium transfer section 720, which extends from the outside of the main body section 500 through the main body section 500 and is connected to the end of the heat exchange conduit section 710, thereby supplying and discharging the heat medium.

[0021] The heat medium pipeline section 700 further includes: a branched heat medium transfer section 730, and a heat medium flow path 501 formed by branching from the heat medium transfer section 720 to transfer the heat medium to the main body section 500.

[0022] The heat medium flow path 501 is formed in the main body 500 at a position adjacent to the high-pressure vessel.

[0023] The main body 500 also includes a second sealing member 521 located between the main body 500 and the high-pressure vessel, wherein the heat medium flow path 501 is formed in the main body 500 adjacent to the second sealing member 521.

[0024] Furthermore, the present invention discloses a substrate processing apparatus, comprising: an inner tube 100, forming a processing space S1 inside; a heater section 200, surrounding at least a portion of the inner tube 100 and forming a heating space S2 between the heater section 200 and the inner tube 100; an outer tube 300, internally disposed of the inner tube 100 and the heater section 200, forming an internal space S3 between the outer tube 300 and the heater section 200; and a heat exchange module 90, located outside the heater section 200, constantly communicating with the heating space S2, and exchanging heat with exhaust gas discharged from the heating space S2.

[0025] The heat exchange module 90 is attached to the outer tube 300 outside the outer tube 300.

[0026] The outer tube 300 includes: a container portion 310 forming the internal space S3, with an opening 301 on its side; a flange portion 320 protruding from the container portion 310 at a position corresponding to the opening 301; and an opening / closing door portion 330 disposed on the flange portion 320 to open and close the opening 301, thus forming a door opening 331.

[0027] The heat exchange module 90 is disposed on the opening and closing door portion 330, covering the door opening 331, so as to communicate with the heating space S2 through the door opening 331.

[0028] The present invention also includes: a shock absorber section 400 disposed between the heater section 200 and the heat exchange module 90, connecting the heating space S2 and the heat exchange module 90.

[0029] The heater section 200 includes: a side heat insulation section 210 surrounding the inner tube 100; a heating section 220 located inside the side heat insulation section 210 and heated by an applied power source; and an upper heat insulation section 230 located at the upper end of the side heat insulation section 210, forming an exhaust flow path 231 for exhaust gas to be discharged from the heating space S2 and connected to the shock absorber section 400.

[0030] The heating space S2 is connected to the internal space S3.

[0031] The inner tube 100 comprises quartz, and the outer tube 300 comprises SUS.

[0032] The pressure in the internal space S3 is higher than the pressure in the processing space S1.

[0033] During the process of performing the process in the processing space S1, the heating space S2 maintains a temperature above 800°C for at least a portion of the time.

[0034] During the process of performing the process in the processing space S1, the internal space S3 maintains a pressure of 2 ATM or higher for at least a portion of the time.

[0035] The effects of the invention

[0036] The advantages of the heat exchange module and substrate processing apparatus including the present invention are that the outer tube, which will not be damaged under high pressure of 2 ATM or above, is applied to the outermost contour, thereby improving the protection function, and the heating efficiency is increased by the inner tube close to the heater section.

[0037] Furthermore, the advantage of the heat exchange module and the substrate processing apparatus including it of the present invention is that it employs a reinforced and rigid heat exchange module that can prevent damage caused by high voltage exposure, and can perform high voltage processes of 2ATM or more even when in constant contact with the heat exchange module.

[0038] Furthermore, the advantages of the heat exchange module and the substrate processing apparatus including it of the present invention are that, through the pressure-resistant design of the heat exchange module, stable heat exchange and other functions can be achieved even when exposed to high pressure and high temperature process environments at any time. Attached Figure Description

[0039] Figure 1 This is a perspective view showing the substrate processing apparatus of the present invention.

[0040] Figure 2 It is shown Figure 1A cross-sectional view of the substrate processing apparatus.

[0041] Figure 3 It is shown Figure 2 An enlarged cross-sectional view of the connection portion of the heat exchange module in the substrate processing apparatus.

[0042] Figure 4 This is a perspective view showing the appearance of the heat exchange module of the present invention.

[0043] Figure 5 It is shown Figure 4 A bottom perspective view of the heat exchange module.

[0044] Figure 6 It is shown Figure 4 A plan view of the heat exchange module along the A-A' direction.

[0045] Figure 7 It is shown Figure 4 A cross-sectional view of the heat exchange module along the B-B' direction.

[0046] Figure 8 It is shown Figure 4 A bottom perspective view of the heat exchange section as seen from the outside of the main body in the heat exchange module.

[0047] (Explanation of reference numerals in the attached diagram)

[0048] 100: Inner tube; 200: Heater section

[0049] 300: External Management Detailed Implementation

[0050] The heat exchange module and substrate processing apparatus including the present invention will be described in detail with reference to the accompanying drawings.

[0051] The substrate processing apparatus of the present invention, such as Figure 1 and Figure 2 As shown, it includes: an inner tube 100, which forms a processing space S1 inside; a heater section 200, which surrounds at least a portion of the inner tube 100 and forms a heating space S2 between itself and the inner tube 100; an outer tube 300, which houses the inner tube 100 and the heater section 200 inside and forms an internal space S3 between itself and the heater section 200; and a heat exchange module 90, which is outside the heater section 200 and is in constant communication with the heating space S2, and exchanges heat with the exhaust gas discharged from the heating space S2.

[0052] Furthermore, the substrate processing apparatus of the present invention also includes a shock absorber 400, which is disposed between the heater 200 and the heat exchange module 90, and connects the heating space S2 and the heat exchange module 90.

[0053] The substrates to be processed include all substrates such as substrates used in display devices such as LED, LCD, and OLED, semiconductor substrates, solar cell substrates, and glass substrates.

[0054] Furthermore, as long as the process performed by the substrate processing apparatus of the present invention is a substrate processing process, all previously disclosed processes can be used. For example, processes such as deposition, etching, and heat treatment can be performed.

[0055] For example, the substrate processing apparatus according to the present invention can perform annealing or other processes on substrates such as wafers to improve film quality. In particular, by effectively removing impurities that remain on the surface and inside of the substrate or film or that form weak bonds, recrystallization or migration phenomena on the substrate surface can be promoted, thereby effectively improving film quality.

[0056] According to the substrate processing apparatus of the present invention, in the processing space S1 where substrate processing is performed, high-pressure processes that generate high pressures greater than atmospheric pressure, such as 2 ATM or higher, and low-pressure processes in a vacuum state can be repeatedly performed, and heat treatment based on high temperatures of 800°C or higher can be performed as needed.

[0057] The inner tube 100 is a component that forms the processing space S1 inside, and various components can be used.

[0058] The inner tube 100 is a vertical cylindrical tube with a dome, forming a processing space S1 inside and being open at the bottom, allowing the small boat 40, which carries the multiple substrates described later, to be moved in and out.

[0059] That is, the lower part of the inner tube 100 is open, so that the small boat 40 carrying multiple substrates is inserted into the interior through the lower part to form a closed processing space S1 to perform substrate processing. After the substrate processing is completed, the small boat 40 is lowered to the side and carried out.

[0060] The small boat 40 includes: a support part 43 that supports multiple substrates spaced apart in the upward and downward directions; a heat insulation part 42 located below the support part 43 to prevent heat from the processing space S1 from dissipating outward; and a nut and washer 41 located below the heat insulation part 42 to support the heat insulation part 42 and the substrate support part 43.

[0061] Therefore, when the small boat 40 is raised and moved into the processing space S1 inside the inner tube 100, the nut and washer 41 are pressed against the lower end of the manifold 20, and the clamp 30 that clamps the edge of the lower end of the manifold 20 together forms a closed processing space S1.

[0062] In particular, the clamp 30 clamps and fixes the manifold 20 and the nut washer 41, so when a high-pressure process of 2ATM or higher is performed in the processing space S1, the nut washer 41 can be prevented from moving downward due to the internal high pressure, thus maintaining the sealed state of the processing space S1.

[0063] In addition, the inner tube 100 is supported by the open lower end manifold 20 and communicates with the manifold 20, wherein process gas is received from the external first gas supply unit 80 through the supply port on the manifold 20.

[0064] Furthermore, the inner tube 100 discharges process gas to the external first gas exhaust section 70 through the exhaust port on the manifold 20, thereby venting the processing space S1.

[0065] The inner tube 100 is made of non-metallic material, such as quartz, and has a dome as mentioned above, but is not limited to this. The ceiling can also be a flat cylindrical shape.

[0066] The heater section 200 is a component that surrounds at least a portion of the inner tube 100 and forms a heating space S2 between itself and the inner tube 100.

[0067] That is, the heater section 200 has an inner tube 100 inside, and a heating space S2 is formed between the heater section 200 and the inner tube 100, so that a process temperature atmosphere is formed in the processing space S1 by heating.

[0068] Therefore, the heater section 200 includes: a side heat insulation section 210 surrounding the inner tube 100; a heating section 220 located inside the side heat insulation section 210 and heated by an applied power source; and an upper heat insulation section 230 located at the upper end of the side heat insulation section 210, forming an exhaust flow path 231 for exhaust gas to be discharged from the heating space S2 and connected to the shock absorber section 400.

[0069] The side heat insulation part 210 is a component that surrounds the inner tube 100 and forms the side of the heater part 200.

[0070] The side heat insulation part 210 is a component formed by multiple heat insulation materials on the side surface. It is a component that concentrates heat into the heating space S2 and the processing space S1 by setting the heating part 220 on the inner surface, thereby minimizing the heat loss in the outer direction of the side heat insulation part 210.

[0071] Furthermore, the side heat insulation portion 210 is formed by stacking multiple annular components, wherein it has multiple gas supply ports (not shown in the figure) formed in the radial direction between or on the annular components, so that the internal space S3 and the heating space S2 are connected to each other, and the cooling gas supplied from the outside is guided into the heating space S2.

[0072] The heating element 220 is a component located inside the side heat insulation element 210 and heated by an applied power source; various components may be used.

[0073] The heating element 220 is a component that generates heat through resistive heat produced by an applied current through a resistive element. The heat generation and temperature can be adjusted by appropriately adjusting the applied current.

[0074] In addition, a plurality of heating elements 220 are provided on the inner surface of the side heat insulation portion 210 in the upward and downward direction, and the terminal portions located outside the side heat insulation portion 210 through the end of the side heat insulation portion 210 receive power supplied from the outside.

[0075] The upper heat insulation part 230 is a component located above the side heat insulation part 210 and forming an exhaust flow path 231 for exhaust gas to be discharged from the heating space S2.

[0076] That is, the upper heat insulation part 230 is a component that forms the upper end and roof of the heater part 200, and includes multiple heat insulation plates located at the upper end of the side heat insulation part 210 to prevent heat loss from the heating space S2 to the upper side.

[0077] In addition, the upper heat insulation part 230 forms an exhaust flow path 231 to discharge the cooling gas supplied to the heating space S2 to the outside. As an example, the exhaust flow path 231 extends from the outlet formed on the bottom surface of the upper heat insulation part 230, i.e. the top surface of the heater part 200, to the side of the upper heat insulation part 230, and guides the cooling gas that has completed heat exchange, i.e. the exhaust gas, to the outside.

[0078] The side of the upper heat insulation part 230 is combined with the shock absorber part 400 described later to communicate with the discharge flow path 231, thereby guiding the discharge gas, which is the cooling gas supplied to the heating space S2 to perform heat exchange, to be transmitted to the shock absorber part 400 through the discharge flow path 231.

[0079] The outer tube 300 is a component that has an inner tube 100 and a heater section 200 inside and forms an internal space S3 between the outer tube and the heater section 200. Various components can be used.

[0080] That is, the outer tube 300 is a component that surrounds the heater section 200 and forms an internal space S3 between itself and the heater section 200. It is a vertical structure with a dome corresponding to the aforementioned inner tube 100.

[0081] In addition, the outer tube 300 is disposed outside the inner tube 100 and the heater section 200 surrounding the inner tube 100, which are used for high-temperature and high-pressure substrate processing, to form an internal space S3 as a protective space. Accordingly, external leakage of process gas caused by damage to the inner tube 100 during high-pressure substrate processing can be prevented, and it has sufficient rigidity to cope with high pressure.

[0082] Therefore, the outer tube 300 is made of metal, such as SUS.

[0083] In addition, the internal space S3 formed between the outer tube 300 and the heater section 200 serves as a protective space as described above, thereby maintaining a pressure higher than that of the processing space S1. The heater section 200 is not sealed, allowing gas to pass through, and thus it is in communication with the heating space S2.

[0084] That is, regarding the internal space, during the process of performing the process in the processing space S1, the pressure is maintained at 2 ATM or higher for at least a portion of the time, and the temperature is maintained at a similar temperature when the heating space S2 is maintained at 800°C or higher for at least a portion of the time during the process of performing the process in the processing space S1.

[0085] In addition, the outer tube 300 has another supply port and exhaust port on its side, which are respectively connected to the second gas supply unit 60 and the second gas exhaust unit 50, supplying gas from the outside to the internal space S3 and exhausting gas from the internal space S3.

[0086] Furthermore, the heater section 200 and the outer tube 300 each have an open lower end structure, and the open lower end is supported by the base 10, wherein the aforementioned manifold 20 is attached to the bottom surface of the base 10.

[0087] As an example, the outer tube 300 includes: a container portion 310 forming the internal space S3, with an opening 301 formed on the side; a flange portion 320 protruding from the container portion 310 at a position corresponding to the opening 301; and an opening / closing door portion 330 disposed on the flange portion 320 to open and close the opening 301, thus forming a door opening 331.

[0088] The container part 310 is a component that forms an internal space S3 and has an opening 301 on its side, and various components can be used.

[0089] For example, the container 310 is made of SUS material, has a dome, and is internally fitted with a heater 200 and an inner tube 100. It is supported by the base 100 when the lower end is open.

[0090] The container section 310 has an opening 301 on its side, which allows it to be close to the shock absorber section 400 in the internal space S3, which is provided with cooling gas supplied to the heating space S2 and is used for maintenance.

[0091] The flange portion 320 is a component that protrudes from the container portion 310 at a position corresponding to the opening 301, and an opening and closing door portion 330 can be provided to open and close the opening 301.

[0092] The opening and closing door portion 330 is a component on the flange portion 320 that can be engaged and disengaged with the first sealing member 332 located in the middle, thereby closing and opening the opening 301.

[0093] In addition, the opening and closing door 330 is connected to the flange 320 by bolts with the first sealing member 332 located in the middle, and has a hinge at one end so that the opening 301 can be opened by rotating the hinge after the bolts are released.

[0094] Furthermore, the opening and closing door portion 330 also includes a door opening 331, which is formed through to connect the shock absorber portion 400 (described later) with the external heat exchange module 90.

[0095] That is, when the door opening 330 is formed through the door opening 331, it is combined with the inner side of the flange 320 with the shock absorber 400 covering the door opening 331, and with the outer side with the heat exchange module 90 covering the door opening 331, thereby connecting the shock absorber 400 and the heat exchange module 90.

[0096] Furthermore, the opening and closing door portion 330 and the flange portion 320 of the opening and closing door portion 330 are provided to correspond to the shock absorber portion 400 described later and have a quadrilateral shape on the front.

[0097] The shock absorber section 400 is a component that is disposed between the heater section 200 and the heat exchange module 90 to connect the heating space S2 and the heat exchange module 90, and various components can be used.

[0098] For example, at least a portion of the shock absorber section 400 is disposed within the flange section 320, and is coupled to the opening and closing door section 330 by covering the door opening 331 with one end connected to the heater section 200 and the other end connected to the heat exchange module 90.

[0099] That is, the shock absorber section 400 forms an end opening 401 at the end of the opening and closing door section 330 and covers the door opening 331, thereby forming a flow path for exhaust gas flow in the order of shock absorber section 400, door opening 331 of opening and closing door section 330, and heat exchange module 90.

[0100] The end opening 401 has a size corresponding to the door opening 331. For example, it may be larger or smaller than the door opening 331.

[0101] For example, the shock absorber section 400, as Figure 3 As shown, it includes: a shock absorber body 410, which forms a flow path for the exhaust gas; and a flow regulating unit 420, located inside the shock absorber body 410, which adjusts the degree of opening of the flow path.

[0102] More specifically, regarding the shock absorber section 400, one end of the shock absorber body 410, which has an internal flow path for the discharge gas to flow through the discharge flow path 231, is connected to the discharge flow path flange 232 formed on the side wall of the upper heat insulation section 230 and communicates with the discharge flow path 231, and the other end is connected to the opening and closing door section 330.

[0103] The shock absorber section 400 internally serves as a flow regulation section 420, which includes a drive section 422 that generates power from a motor, actuator, etc. to drive the blades 421, and blades 421 that control the flow of the exhaust gas through the flow path via the drive section 422, thereby appropriately adjusting the flow rate of the exhaust gas discharged through the shock absorber section 400.

[0104] In addition, the shock absorber 400 can be a component that can be opened and closed, but not completely closed. It can be a component that is constantly connected to the discharge flow path 231 and the heat exchange module 80 described later. Accordingly, it is constantly connected to the heating space S2 and the internal space S3 connected to the heating space S2, thereby forming a high pressure inside and transmitting high-temperature exhaust gas.

[0105] That is, the shock absorber 400 is a component that transmits high temperature and high pressure exhaust gas. Together with the heat exchange module 90 described later, it cannot be kept in a sealed state by the sealing component. Therefore, it cannot be kept in a completely sealed state and is in constant communication with the heating space S2 and the heat exchange module 90.

[0106] The heat exchange module 90 is a component located outside the heater section 200, which is constantly in communication with the heating space S2 and exchanges heat with the exhaust gas discharged from the heating space S2. Various components can be used.

[0107] More specifically, the heat exchange module 90 may be a heat sink component that supplies cooling gas to the heating space S2 through the outer pipe 300 after the substrate is heated by the heater section 200 in order to quickly cool the heating space S2, the inner pipe 100, etc., and then discharges the supplied cooling gas through the discharge path 231 after heat exchange is performed in the heating space S2.

[0108] In particular, as mentioned above, the heat exchange module 90 needs to cool the high-temperature and high-pressure exhaust gas and discharge it to the outside. Due to the high-temperature and high-pressure atmosphere, sealing components cannot be used, and it cannot maintain a complete seal with the aforementioned shock absorber section 400 and the internal space S3. Therefore, a structure that is constantly connected to the heating space S2 is suitable.

[0109] Therefore, the heat exchange module 90 is connected to the outer tube 300 from the outside of the outer tube 300 to cool and exhaust the gas and discharge it to the outside.

[0110] For example, the heat exchange module 90 is provided on the opening and closing door 330 to connect to the heating space S2 through the door opening 331 formed in the opening and closing door 330, thereby covering the door opening 331. Accordingly, it can be directly connected to and communicated with the aforementioned shock absorber section 400.

[0111] In addition, since the heat exchange module 90 is constantly connected to the aforementioned heating space S2, when the substrate is processed in the processing space S1, high pressure is formed inside, and after the substrate processing is completed, high-temperature exhaust gas can be transferred.

[0112] Therefore, reinforced rigid components are adopted, which will not deform even under high pressure, thus achieving stable heat exchange and venting exhaust gas to the outside.

[0113] The heat exchange module of the present invention will now be described in detail with reference to the accompanying drawings.

[0114] The heat exchange module of the present invention is as follows: Figure 3 As shown, it includes: a main body 500, which forms a heat exchange space S4 inside; a flow path forming part 600, which forms a flow path for the exhaust gas discharged from the high-pressure vessel to flow in the heat exchange space S4; and a heat medium pipeline part 700, at least a portion of which is disposed in the heat exchange space S4, for the heat medium to flow inside for direct or indirect heat exchange with the exhaust gas.

[0115] The heat exchange module of the present invention is connected to a high-pressure container of the heating space S2 that forms high-temperature and high-pressure process conditions, wherein the high-pressure container is a component corresponding to the aforementioned outer tube 300.

[0116] Furthermore, the heat exchange module of the present invention may include: a reinforcing rib 800, which is disposed on at least a portion outside the main body 500 to reinforce the main body 500 according to the high pressure state of the heat exchange space S4.

[0117] Furthermore, the heat exchange module of the present invention may include: a buffer space forming part 900 located on the inner surface of the main body part 500, wherein a buffer space S5 is formed between the flow path forming part 600 and the main body part 500 in order to separate the flow path forming part 600 from the inner surface of the main body part 500.

[0118] The main body 500 is a component that forms a heat exchange space S4 inside, and various components can be used.

[0119] For example, the main body 500 may include: a housing 510 forming a heat exchange space S4; a first flange 520 located at one end of the housing 510 to allow exhaust gas to flow in; and a second flange 530 located at the other end of the housing 510 to allow exhaust gas to discharge.

[0120] The outer shell 510 is a component that forms a heat exchange space S4 inside. Corresponding to the aforementioned shock absorber part 400 and opening / closing door part 330, it can be a hexahedron with a longitudinal section containing the heat exchange space S4 that forms a quadrilateral shape.

[0121] Additionally, the housing 510 may include an extension 540 that extends laterally from the top of the housing 510 to accommodate the reinforcing ribs 800 described later. The extension 540 extends laterally from the top of the housing 510 in a direction that intersects with the flow path of the exhaust gas, or may be additionally attached to the top 510 and protrude laterally.

[0122] The first flange portion 520 is a component located at one end of the housing 510 to allow exhaust gas to flow in, and is a component that is attached to the opening and closing door portion 330 to cover the door opening 331.

[0123] The first flange portion 520 contacts the door opening 331 of the opening and closing door portion 330, and a second sealing component 521 may be provided therebetween.

[0124] Furthermore, the first flange 520 can be fastened to the bottom surface of the opening and closing door 330 by bolts, forming a hot medium flow path 501 inside to allow the hot medium to flow, which can appropriately adjust the temperature rise caused by the high-temperature exhaust gas flowing in.

[0125] In particular, the hot medium flow path 501 of the first flange portion 520 contacts and is formed along the door opening 331 of the opening and closing door portion 330 at a position adjacent to the second sealing member 521, which can reduce the temperature of the adjacent position of the second sealing member 521, prevent the second sealing member 521 from deteriorating or being damaged due to the temperature rise caused by the inflow of high-temperature exhaust gas, and enhance the durability of the second sealing member 521.

[0126] The second flange 530 is provided with a component of a sensor 8 for measuring the parameters of the exhaust gas discharged from the housing 510.

[0127] The second flange 530 is connected to an exhaust pipe equipped with valve 9, which transmits the cooled exhaust gas that has completed heat exchange to the exhaust pipe.

[0128] The device includes a sensor 8 that measures the temperature of the discharged gas, thereby allowing for appropriate control of the heat medium pipeline section 700.

[0129] The flow path forming part 600 is a component that forms a flow path for the exhaust gas discharged from the high-pressure vessel within the heat exchange space S4, and various components can be used.

[0130] For example, the flow path forming section 600 is as follows Figure 6 and Figure 7 As shown, multiple flow path forming plates 610 are parallel to each other and multiple flow paths are formed between them, so that the exhaust gas flowing in through the first flange portion 520 can flow. In this process, the heat medium pipe portion 700, which will be described later, is provided in the flow path to guide heat exchange based on the contact between the exhaust gas and the heat medium pipe portion 700.

[0131] Additionally, the flow path forming portion 600 may have a fixing portion (not shown in the figures) provided at the end for fixing a plurality of flow path forming plates 610, which is formed by being separated from the inner surface of the housing 510 by the buffer space forming portion 900 described later.

[0132] Furthermore, the flow path forming section 600 may differ from the aforementioned one, having multiple plates parallel to each other and perpendicular to the direction of the exhaust gas flow. In order to form a flow path for the exhaust gas flow on these plates, multiple flow path forming ports are formed. The flow path forming ports between adjacent plates are arranged neatly to each other, but in order to increase the heat exchange time and area of ​​the exhaust gas, the flow path forming ports may be arranged irregularly and staggered to each other.

[0133] Furthermore, the flow path forming section 600 may differ from the aforementioned one. As long as it is a flow path forming structure that guides the movement of the discharged gas within the main body 500, such as a connecting pipe that connects the inflow side of the gas flowing into the main body 500 and the discharge side of the gas flowing out, it may adopt various forms disclosed previously without limitation.

[0134] The heat medium pipeline section 700 is a component in which at least a portion is disposed within the heat exchange space S4 and for direct or indirect heat exchange with the exhaust gas, and the heat medium flows within it. Various components may be used.

[0135] As an example, the heat medium conduit section 700 is provided in contact with the exhaust gas to the flow path forming section 600 that forms the flow path of the exhaust gas, and the heat medium flows inside and exchanges heat with the high-temperature exhaust gas to guide cooling.

[0136] For example, the heat medium conduit section 700 intersects with the flow path formed by the flow path forming section 600, including a heat exchange conduit section 710 in which the heat medium flows internally, and a heat medium transfer section 720 that passes through the outside of the main body section 500 and is connected to the end of the heat exchange conduit section 710 to supply and discharge the heat medium.

[0137] Furthermore, the heat medium conduit section 700, as... Figure 8 As shown, it may also include: a branched heat medium transfer section 730, and a heat medium flow path 501 that branches off from the heat medium transfer section 720 to transfer heat medium to the main body section 500.

[0138] The heat exchange pipe section 710 is a component in which the heat medium flows internally, and is provided to the flow path forming section 600 in a manner that intersects with the flow path formed by the flow path forming section 600.

[0139] The heat exchange pipe section 710 extends through the flow path forming plate 610 in a direction intersecting the length direction of the flow path. It is formed by a combination of straight lines and curves to increase the contact time and contact area with the exhaust gas.

[0140] The heat medium transfer section 720 is a component that supplies and discharges heat medium by passing through the outside of the main body 500 and connecting to the end of the heat exchange pipe section 710. It may include: a heat medium supply section 721, which receives heat medium from the outside and transfers it to one end of the heat exchange pipe section 710; and a heat medium recovery section 722, which receives heat medium that has completed heat exchange from the other end of the heat exchange pipe section 710 and transfers it to the outside.

[0141] The heat transfer medium 720 extends through the side wall of the outer casing 510 while remaining sealed, and is connected to the heat exchange pipe section 710.

[0142] The branched heat medium transfer section 730 is a component that branches off from the heat medium transfer section 720 to transfer the heat medium to the main body section 500, forming a heat medium flow path 501. Various components can be used.

[0143] For example, the branched heat transfer section 730 may include: a branched heat supply section 731, which branches off from the heat supply section 721 to transfer heat medium to one end of the heat medium flow path 501 formed in the aforementioned first flange section 520; and a branched heat recovery section 732, which branches off from the heat recovery section 721 to recover the heat medium that has completed heat exchange from the other end of the aforementioned heat medium flow path 501.

[0144] The branched heat medium supply unit 731 and the branched heat medium recovery unit 732 respectively include a branched pipe for receiving heat medium from the heat medium transfer unit 720 and a branched pipe port connecting the branched pipe to the first flange unit 520.

[0145] In addition, as described above, the heat medium conduit 700 can be a component that directly contacts the exhaust gas and guides the heat exchange between the exhaust gas and the heat medium. Alternatively, it can be a component that indirectly guides the heat exchange between the heat medium and the exhaust gas through another medium.

[0146] For example, when the ends of the plurality of flow path forming plates 610 of the flow path forming section 600 are in contact with each other and heat conduction is possible, the heat medium conduit section 700 contacts the flow path forming plates 610 at both ends, thereby guiding the heat exchange between the flow path forming section 600 and the heat medium, and guiding the heat exchange between the flow path forming section 600 and the exhaust gas.

[0147] Furthermore, when at least a portion of the heat medium pipe section 700, such as the heat exchange pipe section 710, is located in the heat exchange space S4, the overall temperature within the heat exchange space S4 decreases, thereby guiding heat exchange with the exhaust gas and performing cooling of the exhaust gas.

[0148] The reinforcing rib 800 is a component that reinforces the main body 500 by being installed outside the main body 500 in accordance with the high pressure state of the heat exchange space S4. Various components may be used.

[0149] For example, the reinforcing rib 800 is as follows Figure 4 and Figure 5 As shown, there are multiple directions that intersect on a virtual straight plane between the end where the exhaust gas flows into the main body 500 and the other end where the exhaust gas is discharged, and these directions are parallel to each other. Preferably, they have a length that is perpendicular to the virtual straight line on the plane and are located on both sides and the bottom of the outer casing 510.

[0150] In order to enhance rigidity, the reinforcing rib 800 is connected to the extension portion 540, which extends laterally from the upper surface of the main body portion 500. The rigidity is further enhanced by the fixing force between the extension portion 540 and the end of the extension portion 800.

[0151] In another example, the reinforcing ribs 800 are provided in a number of parallel directions that intersect a virtual straight plane between the end from which the exhaust gas flows into the main body 500 and the other end from which the exhaust gas is discharged, and are thus provided on the bottom surface and a portion of both ends of the housing 510.

[0152] The buffer space forming part 900 is a component located on the inner surface of the main body part 500, forming a buffer space S5 between the flow path forming part 600 and the main body part 500, so that the flow path forming part 600 is separated from the inner surface of the main body part 500. Various components can be used.

[0153] The buffer space forming part 900 may be located on at least one of the top surface, bottom surface and two sides of the hexahedral outer shell 510. Preferably, it is located on the top surface, bottom surface and two sides, while the flow path forming part 600 is separated from the inner surface of the outer shell 510.

[0154] Accordingly, the buffer space forming part 900 forms a buffer space S5 inside the outer shell 510, which is kept under high pressure due to constant communication with the heating space S2, thereby preventing pressure increase caused by direct pressure increase on the wall of the outer shell 510 and strengthening rigidity.

[0155] In another case, the buffer space S5 in the buffer space forming section 900 is connected to the flow path forming section 600, forming an independent space separate from the flow path forming section 600.

[0156] Furthermore, the buffer space forming part 900 is composed of a bracket disposed on the inner surface of the housing 510 and a frame or plate located on the bracket spaced apart from the inner surface of the housing 510, thereby forming a buffer space S5 between the bracket and the inner surface of the housing 510.

[0157] The above description only illustrates a portion of the preferred embodiments that can be implemented by the present invention. Therefore, it is well known that the scope of the present invention should not be limited to the above embodiments, and the technical ideas of the present invention described above and those with the same root are all included within the scope of the present invention.

Claims

1. A heat exchange module as a heat exchange module in constant communication with a high-pressure vessel forming a heating space (S2) of high temperature and high pressure process conditions, characterized by comprising: a main body portion (500) that internally forms a heat exchange space (S4); a flow path forming portion (600) that forms a flow path for the flow of discharge gas discharged from the high-pressure container within the heat exchange space (S4); a heat medium pipe portion (700) that is provided to at least a portion of the heat exchange space (S4) and in which a heat medium for direct or indirect heat exchange with the discharge gas flows.

2. The heat exchange module according to claim 1, characterized in that includes: a reinforcing rib (800) that reinforces the main body portion (500) is provided to at least a portion of the outer surface of the main body portion (500) in accordance with the high-pressure state of the heat exchange space (S4).

3. The heat exchange module according to claim 2, characterized in that the longitudinal section of the main body portion (500) that includes the heat exchange space (S4) forms a quadrilateral, and the distal end of the reinforcing rib (800) is joined to an extension portion (540) that extends laterally from the upper surface of the main body portion (500).

4. The heat exchange module according to claim 2, characterized in that the reinforcing rib (800) has a length in a direction that intersects a virtual straight plane that connects one end through which the discharge gas flows and the other end from which the discharge gas is discharged of the main body portion (500) and has a plurality of portions parallel to each other.

5. The heat exchange module according to claim 2, characterized in that the reinforcing rib (800) has a length in a direction that intersects a virtual straight plane that connects one end through which the discharge gas flows and the other end from which the discharge gas is discharged of the main body portion (500) and has a plurality of portions parallel to each other.

6. The heat exchange module according to claim 1, characterized in that the application further comprises a buffer space forming portion (900) that is provided to the inner surface of the main body portion (500) and forms a buffer space (S5) between the flow path forming portion (600) and the main body portion (500) so that the flow path forming portion (600) is spaced apart from the inner surface of the main body portion (500).

7. The heat exchange module according to claim 6, characterized in that the longitudinal section of the main body portion (500) that includes the heat exchange space (S4) forms a quadrilateral, and the buffer space forming portion (900) is located at at least one of the ceiling surface, the bottom surface, and the two side surfaces of the main body portion (500).

8. The heat exchange module according to claim 1, characterized in that the main body portion (500) includes a housing (510) that forms the heat exchange space (S4), a first flange portion (520) that is located at one end of the housing (510) and through which the discharge gas flows, and a second flange portion (530) that is located at the other end of the housing (510) and from which the discharge gas is discharged.

9. The heat exchange module according to claim 8, characterized in that a sensor (8) for measuring a parameter of the discharge gas discharged from the housing (510) is provided to the second flange portion (530).

10. The heat exchange module according to claim 1, wherein the flow path forming section (600) includes a plurality of flow path forming plates (610) which are parallel to each other and form a plurality of flow paths therebetween.

11. The heat exchange module according to claim 1, wherein the heat medium pipe section (700) includes: a heat exchange pipe section (710) which crosses the flow paths formed by the flow path forming section (600) and in which the heat medium flows; and a heat medium transfer section (720) which penetrates the main body section (500) from the outside thereof and is connected to the ends of the heat exchange pipe section (710), respectively, to supply and discharge the heat medium.

12. The heat exchange module according to claim 11, wherein the heat medium pipe section (700) further includes: a branched heat medium transfer section (730) which branches from the heat medium transfer section (720) and transfers the heat medium to a heat medium flow path (501) formed in the main body section (500).

13. The heat exchange module according to claim 12, wherein the heat medium flow path (501) is formed in the main body section (500) at a position adjacent to the high-pressure container.

14. The heat exchange module according to claim 12, wherein the main body section (500) further includes a second sealing member (521) between the high-pressure container, the heat medium flow path (501) is formed in the main body section (500) at a position adjacent to the second sealing member (521).

15. A substrate processing apparatus, comprising: an inner tube (100) in which a processing space (SI) is formed; a heater section (200) which surrounds at least a portion of the inner tube (100) and forms a heating space (S2) between the inner tube (100); an outer tube (300) in which the inner tube (100) and the heater section (200) are disposed and which forms an inner space (S3) between the heater section (200); a heat exchange module (90) which is disposed outside the heater section (200) and is in constant communication with the heating space (S2) to exchange heat with exhaust gas discharged from the heating space (S2).

16. The substrate processing apparatus according to claim 15, wherein the heat exchange module (90) is attached to the outer tube (300) outside the outer tube (300).

17. The substrate processing apparatus according to claim 15, wherein the outer tube (300) includes: a container section (310) which forms the inner space (S3) and has an opening (301) formed on a side surface thereof; a flange section (320) which protrudes from the container section (310) at a position corresponding to the opening (301); and an opening and closing door section (330) which is attached to the flange section (320) to open and close the opening (301) and has a door opening (331) formed therethrough.

18. The substrate processing apparatus according to claim 17, wherein ​ The heat exchange module (90) is provided to the opening and closing door portion (330) covering the door opening (331) to communicate to the heating space (S2) through the door opening (331).

19. The substrate processing apparatus according to claim 17, wherein Further comprising: a damper portion (400) provided between the heater portion (200) and the heat exchange module (90) to communicate the heating space (S2) and the heat exchange module (90).

20. The substrate processing apparatus according to claim 19, wherein The heater portion (200) includes: a side heat insulating portion (210) surrounding the inner tube (100); a heat generating portion (220) located on an inner surface of the side heat insulating portion (210) to generate heat by applying power; and an upper end heat insulating portion (230) located on an upper end of the side heat insulating portion (210) to form an exhaust flow path (231) to exhaust exhaust gas from the heating space (S2) and to be coupled to the damper portion (400).

21. The substrate processing apparatus according to claim 15, wherein The heating space (S2) and the inner space (S3) communicate with each other.

22. The substrate processing apparatus according to claim 15, wherein The inner tube (100) includes quartz, The outer tube (300) includes SUS.

23. The substrate processing apparatus according to claim 15, wherein The pressure of the inner space (S3) is maintained higher than the pressure of the processing space (S1).

24. The substrate processing apparatus according to claim 15, wherein During a process performed in the processing space (S1), the heating space (S2) is maintained at a temperature of 800°C or higher for at least a part of the time.

25. The substrate processing apparatus according to claim 15, wherein During a process performed in the processing space (S1), the inner space (S3) is maintained at a pressure of 2 ATM or higher for at least a part of the time.

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