Spin-coating uniform film formation device based on film thickness detection and liquid supplementing self-calibration

Abstract

The invention discloses a spin-coating uniform film formation device based on film thickness detection and liquid supplementing self-calibration. The spin-coating uniform film formation device comprises a precise spin-coating unit, a non-contact film thickness online detection unit, a multi-degree-of-freedom liquid supplementing execution unit and a central processing and control unit, by introducing real-time film thickness detection and dynamic liquid supplementing control, a closed-loop feedback system is constructed. In the high-speed spin-coating process, the non-contact film thickness online detection unit scans the film thickness distribution on the surface of the substrate in real time; the central processing and control unit generates a liquid supplementing instruction according to the deviation between the real-time film thickness data and the target film thickness; the multi-degree-of-freedom liquid supplementing execution unit accurately supplements the compensation liquid drops to the area with the thin film thickness according to the liquid supplementing instruction, and local fluid dynamic characteristics are changed through liquid supplementing, so that uniformization of the film thickness is achieved. According to the method, the uniformity and repeatability of the film layer are remarkably improved, the problem that the film thickness is not uniform in the traditional spin coating process is solved, and the method is particularly suitable for preparing high-precision films such as photoresist.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor and micro-nano processing technology, and particularly relates to a spin coating uniformization film forming device based on film thickness detection and liquid supplement self-calibration. BACKGROUND

[0002] In the traditional spin coating process, photoresist is uniformly coated on the substrate surface by centrifugal force. However, due to the influence of factors such as substrate surface morphology, spin coating rate, and photoresist viscosity, the spin coating process often leads to non-uniform film thickness, especially at the beginning and end of spin coating, the edge area usually has film thickness accumulation, and the center area may have film thickness too thin. This film thickness non-uniformity will affect the subsequent photoetching and etching process, and thus reduce the product yield. The traditional spin coating technology is difficult to correct the film thickness in real time during the processing, therefore, how to realize real-time feedback and control to ensure the high uniformity and high repeatability of the thin film has become a big challenge in the field of semiconductor and micro-nano processing technology. SUMMARY

[0003] In order to solve the above problems existing in the prior art, the present application designs a spin coating uniformization film forming device based on film thickness detection and liquid supplement self-calibration which can ensure the high uniformity and high repeatability of the thin film.

[0004] In order to achieve the above purpose, the technical scheme of the present application is as follows: A spin coating uniformization film forming device based on film thickness detection and liquid supplement self-calibration, comprising a precision spin coating unit, a non-contact film thickness online detection unit, a multi-degree-of-freedom liquid supplement execution unit, and a central processing and control unit. The central processing and control unit is connected with the precision spin coating unit, the non-contact film thickness online detection unit, and the multi-degree-of-freedom liquid supplement execution unit through control lines; the central processing and control unit is installed on the precision spin coating unit, and the non-contact film thickness online detection unit and the multi-degree-of-freedom liquid supplement execution unit are both installed around the precision spin coating unit. The precision spin coating unit is used for high-speed rotating the substrate and coating photoresist; the film thickness detection unit measures the thickness of the photoresist film on the substrate in real time through a non-contact thickness gauge to obtain film thickness distribution data; the central processing and control unit receives the film thickness data and generates liquid supplement instructions according to the real-time deviation; the central processing and control unit comprises a sensor, a processor, and a signal transmitter. The multi-degree-of-freedom liquid supplement execution unit accurately supplements liquid to the film thickness too thin area according to the liquid supplement instructions through a micro-flow nozzle.

[0005] Further, the non-contact film thickness online detection unit comprises a portable film thickness gauge and a multi-degree-of-freedom mechanical arm.

[0006] Further, the precision spin coating unit comprises a high-speed precision motor, a spin coating base and a substrate, the high-speed precision motor is connected with the spin coating base through a key, and the substrate is placed in a substrate groove of the spin coating base.

[0007] Further, the multi-degree-of-freedom liquid supplementing execution unit comprises a micro-flow nozzle and a multi-degree-of-freedom mechanical arm.

[0008] Further, the working method of the spin coating uniformization film forming device based on film thickness detection and liquid supplementing self-calibration comprises the following steps: A, installing and fixing the substrate in the spin coating base; B, starting the multi-degree-of-freedom mechanical arm in the multi-degree-of-freedom liquid supplementing execution unit, so that the micro-flow nozzle uniformly distributes the photoresist solution to the substrate until the substrate is fully covered with the photoresist solution; C, starting the high-speed precision motor in the precision spin coating unit to drive the spin coating base and the substrate to rotate at a high speed; D, starting the non-contact film thickness online detection unit to measure the film thickness of the complete substrate and transmit the data to the central processing and control unit for data processing; E, the central processing and control unit analyzes the film thickness distribution data, transmits the data of the thin film area to the multi-degree-of-freedom liquid supplementing execution unit, and moves the multi-degree-of-freedom mechanical arm to the area through the central processing and control unit, so that the micro-flow nozzle supplements the liquid to the area.

[0009] F, returning to step B until the spin coating process is completed.

[0010] Compared with the prior art, the beneficial effects of the present application are as follows: 1. By introducing the film thickness detection unit and the multi-degree-of-freedom liquid supplementing execution unit, the present application realizes closed-loop control of the spin coating process, compared with the traditional open-loop process, can dynamically adjust the liquid supplementing amount and position, effectively corrects the film thickness unevenness problem, and improves the uniformity of the film layer.

[0011] 2. The present application can monitor the film thickness distribution in real time, and automatically supplement the liquid according to the film thickness distribution, thereby actively inhibiting the edge effect and the film thickness unevenness problem in the central area, making the film thickness of the entire substrate uniform, which is much better than the film thickness unevenness in the traditional technology, greatly improving the quality of the thin film and the reliability of the subsequent process.

[0012] 3. The present application avoids the over-coating method in the traditional process to ensure the film thickness uniformity, significantly reduces the material waste, and has a significant advantage in the use of expensive materials such as photoresist.

[0013] 4、In summary, the application builds a closed-loop feedback system by introducing real-time film thickness detection and dynamic liquid compensation control. In the high-speed spin coating process, the film thickness detection unit scans the film thickness distribution on the substrate surface in real time; the central processing and control unit generates a liquid compensation instruction according to the deviation of the real-time film thickness data and the target film thickness; the multi-degree-of-freedom liquid compensation execution unit accurately supplements the compensation liquid drops to the area with thinner film thickness according to the liquid compensation instruction, and changes the local fluid dynamics through liquid compensation, thereby achieving film thickness uniformization. The application significantly improves the uniformity and repeatability of the film layer, overcomes the problem of non-uniform film thickness in the traditional spin coating process, and is particularly suitable for the preparation of high-precision thin films such as photoresist. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 is a structural schematic diagram (front view) of the application.

[0015] Figure 2 is a top view of Figure 1 .

[0016] Figure 3 is an axonometric view of Figure 1 .

[0017] In the figure: 1, portable film thickness meter, 2, high-speed precision motor, 3, central processing and control unit, 4, substrate, 5, multi-degree-of-freedom mechanical arm 1, 6, multi-degree-of-freedom mechanical arm 2, 7, motor base, 8, spin coating base, 9, micro-flow nozzle. DETAILED DESCRIPTION

[0018] The application will be further described below in conjunction with the drawings. As shown in Figures 1-3 , a spin coating uniformization film forming device based on film thickness detection and liquid self-calibration, comprising a precision spin coating unit, a non-contact film thickness online detection unit, a multi-degree-of-freedom liquid compensation execution unit, and a central processing and control unit 3; The central processing and control unit 3 is connected with the precision spin coating unit, the non-contact film thickness online detection unit and the multi-degree-of-freedom liquid compensation execution unit through control lines respectively; the central processing and control unit 3 is installed on the precision spin coating unit, and the non-contact film thickness online detection unit and the multi-degree-of-freedom liquid compensation execution unit are both installed around the precision spin coating unit; The precision spin coating unit is used for high-speed rotation of the substrate 4 and coating of photoresist; the film thickness detection unit measures the thickness of the photoresist film on the substrate 4 in real time through a non-contact film thickness meter to obtain film thickness distribution data; the central processing and control unit 3 receives the film thickness data and generates a liquid compensation instruction according to the real-time deviation; the multi-degree-of-freedom liquid compensation execution unit accurately supplements liquid to the area with thinner film thickness through the micro-flow nozzle 9 according to the liquid compensation instruction.

[0019] Further, the non-contact film thickness on-line detection unit comprises the portable film thickness gauge 1 and the multi-degree-of-freedom mechanical arm 2.

[0020] Further, the precise rotary coating unit comprises the high-speed precision motor 2, the spin coating base 8 and the substrate 4, the high-speed precision motor 2 is connected with the spin coating base 8 through a key, and the substrate 4 is placed in a substrate groove of the spin coating base 8.

[0021] Further, the multi-degree-of-freedom liquid supplementing execution unit comprises the micro-flow rate nozzle 9 and the multi-degree-of-freedom mechanical arm 1.

[0022] Further, the central processing and control unit 3 comprises a sensor, a processor and a signal transmitter.

[0023] Further, the working method of the spin coating uniformization film forming device based on film thickness detection and liquid supplementing self-calibration comprises the following steps: A. installing and fixing the substrate 4 in the spin coating base 8; B. starting the multi-degree-of-freedom mechanical arm 1 in the multi-degree-of-freedom liquid supplementing execution unit, so that the micro-flow rate nozzle 9 uniformly distributes the photoresist solution to the substrate 4 until the substrate 4 is fully covered with the photoresist solution; C. starting the high-speed precision motor 2 in the precise rotary coating unit, so that the spin coating base 8 and the substrate 4 are rotated at a high speed; D. starting the non-contact film thickness on-line detection unit to measure the film thickness of the complete substrate 4 and transmitting the data to the central processing and control unit 3 for data processing; E. the central processing and control unit 3 analyzes the film thickness distribution data, transmits the data of the thinner film area to the multi-degree-of-freedom liquid supplementing execution unit, and moves the multi-degree-of-freedom mechanical arm 1 to the area through the central processing and control unit 3, so that the micro-flow rate nozzle 9 supplements the liquid to the area.

[0024] F. returning to step B until the spin coating process is completed.

[0025] The present application is not limited to the present embodiment, and any equivalent concept or change within the technical scope disclosed in the present application is included in the protection scope of the present application.

Claims

1. A spin uniformization film forming apparatus based on film thickness detection and liquid replenishment self-calibration, characterized by: It comprises a precision spin coating unit, a non-contact film thickness on-line detection unit, a multi-degree-of-freedom liquid supplementing execution unit and a central processing and control unit (3). The central processing and control unit (3) is connected with the precision spin coating unit, the non-contact film thickness on-line detection unit and the multi-degree-of-freedom liquid supplementing execution unit through control lines respectively. The precision spin coating unit is used for high-speed rotating the substrate (4) and coating photoresist; the film thickness detection unit measures the thickness of the photoresist film on the substrate (4) in real time through a non-contact thickness gauge to obtain film thickness distribution data; the central processing and control unit (3) receives the film thickness data and generates liquid supplementing instructions according to real-time deviation; the multi-degree-of-freedom liquid supplementing execution unit supplements liquid to the area with too thin film thickness through the micro-flow rate nozzle (9) according to the liquid supplementing instructions.

2. The spin uniformization film forming device based on film thickness detection and liquid replenishment self-calibration according to claim 1, characterized in that: The non-contact film thickness on-line detection unit comprises a portable film thickness gauge (1) and a multi-degree-of-freedom mechanical arm II (6). 3.The spin coating uniform film forming device based on film thickness detection and liquid compensation self-calibration according to claim 1, wherein: The precision spin coating unit comprises a high-speed precision motor (2), a spin coating base (8) and a substrate (4), the high-speed precision motor (2) is connected with the spin coating base (8) through a key, and the substrate (4) is placed in a substrate groove of the spin coating base (8).

4. The spin uniformization film forming device based on film thickness detection and liquid replenishment self-calibration according to claim 1, characterized in that: The multi-degree-of-freedom liquid supplementing execution unit comprises a micro-flow rate nozzle (9) and a multi-degree-of-freedom mechanical arm I (5).

5. The spin uniformization film forming device based on film thickness detection and liquid replenishment self-calibration according to claim 1, characterized in that: The central processing and control unit (3) comprises a sensor, a processor and a signal transmitter.

6. The spin uniformization film forming apparatus based on film thickness detection and liquid replenishment self-calibration according to claim 1, characterized in that: The working method of the spin coating uniformization film forming device based on film thickness detection and liquid supplementing self-calibration comprises the following steps: A. mounting the substrate (4) in the spin coating base (8) and fixing it; B. starting the multi-degree-of-freedom mechanical arm I (5) in the multi-degree-of-freedom liquid supplementing execution unit to make the micro-flow rate nozzle (9) uniformly distribute liquid on the substrate (4) until the substrate (4) is covered with photoresist solution; C. starting the high-speed precision motor (2) in the precision spin coating unit to drive the spin coating base (8) and the substrate (4) to rotate at high speed; D. starting the non-contact film thickness on-line detection unit to measure the film thickness of the complete substrate (4) and transmitting the data to the central processing and control unit (3) for data processing; E. the central processing and control unit (3) analyzes the film thickness distribution data, transmits the data of the area with too thin film to the multi-degree-of-freedom liquid supplementing execution unit, and makes the multi-degree-of-freedom mechanical arm I (5) move to the area through the central processing and control unit (3), and the micro-flow rate nozzle (9) supplements liquid to the area; F. returning to step B until the spin coating process is completed.

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