Radiation imaging device

Abstract

The invention discloses a radiation imaging apparatus. The radiation imaging apparatus includes: a radiation detection sensor configured to detect radiation; a circuit board; a first base including a radiation shielding member between the radiation detection sensor and the circuit board, the first base configured to support the circuit board; a housing containing the radiation detection sensor, the circuit board, and the first base in an inner space of the housing; and a first fixing portion configured to fix the first base to a back surface of the housing such that the circuit board faces the housing with a gap in the internal space, in which the first fixing portion is located in a region inside an outer periphery of the radiation shielding member in a plan view along a radiation incident direction.

Description

TECHNICAL FIELD

[0001] The present application relates to a radiation imaging apparatus. BACKGROUND

[0002] A radiation imaging apparatus that irradiates a target object with radiation and detects an intensity distribution of the radiation that has passed through the target object to obtain a radiation image is widely and commonly used in the fields of industrial non-destructive inspection and medical diagnosis. Generally, the radiation imaging apparatus includes a radiation detecting sensor that detects radiation, a sensor support base that supports the radiation detecting sensor, a circuit board on which various integrated circuits (ICs) are mounted, and the like.

[0003] In the radiation imaging apparatus, in the case where the IC mounted on the circuit board is irradiated with high-intensity radiation, the radiation can cause malfunction and / or deterioration of performance of the IC. Therefore, as described in Japanese Patent Application Laid-Open No. 9-152486, a radiation shielding member is provided between the radiation detecting sensor and the circuit board.

[0004] With the configuration discussed in Japanese Patent Application Laid-Open No. 9-152486, the radiation shielding performance can be ensured. However, since the circuit board is not sufficiently fixed to the housing of the circuit board, and the radiation shielding member is separated from the circuit board, the sensor support base is not sufficiently fixed to the housing. Therefore, there can be a deterioration in mechanical strength (e.g., impact resistance and vibration resistance of the circuit board or the radiation detecting sensor, and the like), and there is a concern that damage to these components can occur.

[0005] Japanese Patent Application Laid-Open No. 2002-116261 discusses a radiation imaging apparatus that includes a sensor substrate having a pixel region, a sensor support base that supports the sensor substrate, and a support base that supports a radiation shielding member. In the above-described radiation imaging apparatus, the support base is fixed to an inner surface of a housing of the sensor substrate by a columnar portion to fix the support base to the housing of the sensor substrate. On the other hand, a gap is formed in the circuit board for insertion and positioning of the columnar portion of the support base, and a mounting plate is provided at an end portion of the gap to fix the circuit board to the housing. However, such a configuration in which the mounting plate is directly provided at the end portion of the circuit board is not suitable for a device configuration that includes a support base that supports a circuit board. Therefore, with such a device configuration, the support base that supports the circuit board cannot be stably held, and a mechanical strength suitable for the circuit board cannot be obtained. SUMMARY

[0006] The present disclosure is made in view of the above-described problems. The present disclosure relates to a radiation imaging apparatus that can satisfy both high radiation shielding performance for a circuit board and sufficient mechanical strength for a radiation detecting sensor and the circuit board in a configuration that includes a support base that supports the circuit board.

[0007] According to one aspect of this disclosure, a radiation imaging device includes: a radiation detection sensor configured to detect radiation; a circuit board; a first base including a radiation shielding member located between the radiation detection sensor and the circuit board, the first base being configured to support the circuit board; a housing containing the radiation detection sensor, the circuit board, and the first base within an internal space of the housing; and a first fixing portion configured to fix the first base to a back surface of the housing such that the circuit board faces the housing with a gap in the internal space, wherein, in a plan view along the radiation incident direction, the first fixing portion is located in a region inside the outer periphery of the radiation shielding member.

[0008] The features of this disclosure will become apparent from the following description of embodiments with reference to the accompanying drawings. The following description of embodiments is by way of example. Attached Figure Description

[0009] Figure 1 This is a cross-sectional view showing an example of a radiation imaging device according to a first exemplary embodiment.

[0010] Figure 2 This is a cross-sectional view of a radiation imaging device illustrating a comparative example according to a first exemplary embodiment.

[0011] Figure 3 This is a cross-sectional view illustrating an example of a radiation imaging device according to a second exemplary embodiment.

[0012] Figure 4 This is a cross-sectional view showing an example of a radiation imaging device according to a third exemplary embodiment.

[0013] Figure 5 This is a cross-sectional view showing an example of a radiation imaging device according to a fourth exemplary embodiment. Detailed Implementation

[0014] Basic Structure of a Radiation Imaging Device According to an Exemplary Embodiment

[0015] Before disclosing specific exemplary embodiments, the basic structure of the radiation imaging apparatus according to the exemplary embodiments will be described.

[0016] A radiation imaging device includes a radiation detection sensor, a circuit board, a radiation shielding component located between the radiation detection sensor and the circuit board, and a first base supporting the circuit board. Furthermore, the radiation imaging device includes a housing containing the radiation detection sensor, the circuit board, and the first base within its internal space. In this configuration, a first fixing portion is provided to fix the first base to the rear surface of the housing, such that the circuit board faces the rear surface of the housing with a gap within the internal space. In a plan view along the radiation incident direction, the first fixing portion is located in a region inside the outer periphery of the radiation shielding component. When the first fixing portion is located outside the outer periphery of the radiation shielding component, sufficient mechanical strength cannot be obtained because the first base is fixed in an unbalanced and unstable manner by the first fixing portion. This becomes particularly noticeable in large radiation imaging devices. By arranging the first fixing portion in the internal region, high radiation shielding performance for the circuit board and mechanical strength for the circuit board supported by the first base fixed to the housing can be achieved, ultimately satisfying the mechanical strength requirements for the radiation detection sensor properly fixed to the housing via the first base.

[0017] Furthermore, ideally, the radiation imaging device may include a second base supporting the radiation detection sensor and a second fixing part that fixes the second base in the internal space of the housing. With this configuration, the first base is fixed to the housing while the first base, the radiation shielding component, and the second base are integrally fixed, thus achieving both high radiation shielding performance and sufficient mechanical strength for the circuit board and the radiation detection sensor. Specific examples of this configuration include the following configurations (1) to (4).

[0018] Construction (1)

[0019] The second fixing portion is configured to penetrate the radiation shielding component. For example, a gap is formed in the radiation shielding component, and the second fixing portion is arranged to pass through this gap. The second base faces the first base via the radiation shielding component, and the second fixing portion connects the first base and the second base. With this configuration, the first base, the radiation shielding component, and the second base are securely and integrally fixed, which helps to further improve mechanical strength. Details of this configuration will now be described according to a first exemplary embodiment.

[0020] Construction (2)

[0021] The second fixing part is an adhesive material disposed on both surfaces of the radiation shielding component to bond and fix one surface of the radiation shielding component to the first base, and the other surface of the radiation shielding component to the second base. With this construction, the first base, the radiation shielding component, and the second base are integrally fixed, which helps to further improve mechanical strength. Details of this construction will now be described according to a second exemplary embodiment.

[0022] Construction (3)

[0023] The second fixing part is a buffer component, which is arranged, for example, between the upper surface of the radiation detection sensor supported by the second base and the front surface of the housing (first configuration), and / or between the side surface of the second base and the side surface of the housing (second configuration). In the first configuration, the upper part of the second base supporting the radiation detection sensor contacts the housing via the buffer component, and its lower part contacts the first base via the radiation shielding component. Therefore, the second base is stably held in a floating state within the housing to suppress displacement and external impacts, particularly in the longitudinal direction. In the second configuration, since the side surface of the second base supporting the radiation detection sensor contacts the housing via the buffer component, and the second base is stably held in a floating state within the housing, the effects of displacement and external impacts can be suppressed, particularly in the lateral direction. By using both the first and second configurations, the second base is held more stably in a floating state within the housing, and the effects of displacement and external impacts are suppressed in both the longitudinal and lateral directions. In this case, in the first configuration, the buffer component and the front surface of the housing (as well as the buffer component and the radiation shielding component) can be fixed, while in the second configuration, the buffer component and the side surface of the housing can be fixed. By adopting this fixed state, a more stable state can be achieved.

[0024] Construction (4)

[0025] The first base is composed of radiation shielding components. More specifically, the first base does not have a radiation shielding component as a separate part; it is made of a material including radiation shielding material. The second base is easily fixed to the first base, which has a high radiation shielding function and is thus fixed to the housing together with the first base. With this construction, a safe radiation shielding function can be achieved through a first base with a reduced number of components and a simple structure, thereby improving mechanical strength.

[0026] Detailed description of exemplary embodiments -

[0027] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following exemplary embodiments do not limit the scope of the disclosure according to the claims. Although multiple features are described in the exemplary embodiments, not all features are necessary, and multiple features may be combined in any suitable manner. Furthermore, in the drawings, identical or similar components are indicated by the same reference numerals, and redundant descriptions will be omitted. The details of the dimensions and structures shown in the exemplary embodiments are not limited to those shown in the text and drawings. In this specification, radiation includes not only X-rays but also alpha rays, beta rays, gamma rays, particle beams, cosmic rays, etc.

[0028] The first exemplary embodiment will now be described with reference to the accompanying drawings. Figure 1 This is a cross-sectional view showing an example of a radiation imaging device 100 according to this exemplary embodiment.

[0029] The radiation imaging device 100 includes a sensor panel 101, a sensor support base 102, a circuit board 103, flexible wiring 104, a circuit support base 105, and a housing 106 that houses them therein.

[0030] Sensor panel 101 is a radiation detection sensor, such as a digital radiography (DR) sensor. Sensor panel 101 includes multiple pixels, each pixel generating an electrical signal corresponding to the radiation dose incident upon it. The construction of sensor panel 101 can be a known construction, examples of which will be described below. Each pixel of sensor panel 101 is formed by disposed of a switching element such as a thin-film transistor (TFT), a photoelectric conversion section, and a scintillator layer on an insulating substrate such as a glass substrate. The photoelectric conversion section can be made of amorphous silicon (a-Si), low-temperature polycrystalline silicon (LTPS), or indium bismuth oxide (IGZO), etc.

[0031] Incident radiation is converted into visible light by a scintillator layer, and the visible light is converted into electrical charge by a photoelectric conversion section. Cesium iodide (CsI), gadolinium oxysulfide (GOS or Gd₂O₂S:Tb), etc., can be used in the scintillator layer. In particular, thallium (Tl) or sodium (Na) can be used as activators for CsI. The scintillator layer is covered with a protective film, such as a parylene (p-xylene) resin film, a hot-melt resin film, or a laminate made of hot-melt resin and aluminum. Instead of the scintillator layer, each pixel may include a conversion section containing a material that directly converts radiation into electrical charge, etc. Amorphous selenium (a-Se), cadmium telluride (CdTe), cadmium zinc telluride (CdZnTe), etc., are suitable materials.

[0032] The sensor support base 102 is a second base for supporting the sensor panel 101 and supports the lower surface of the sensor panel 101 on its radiation incident surface (upper surface) side, the radiation incident direction being indicated by arrow A.

[0033] The sensor support base 102 can be made of materials such as resin, carbon fiber reinforced plastic (CFRP), magnesium alloy, aluminum alloy, steel plate or stainless steel to simultaneously meet the requirements of rigidity and light weight. The sensor support base 102 can be constructed from multiple components.

[0034] Various integrated circuits (ICs) are mounted on the circuit board 103, such as driver ICs that transmit electrical signals to drive the sensor panel 101 and amplifier ICs that amplify the electrical signals detected by the sensor panel 101. Flexible wiring 104 is the wiring that electrically connects the sensor panel 101 and the circuit board 103.

[0035] The circuit support base 105 is the first base that supports multiple circuit boards 103. For example... Figure 1 As shown, circuit board 103 is arranged on the lower surface of circuit support base 105, and radiation shielding component 107 with a layered structure is disposed on the upper surface of circuit support base 105. In a plan view along the radiation incident direction indicated by arrow A, radiation shielding component 107 is a component that absorbs or shields a portion of the radiation emitted from the radiation source, corresponds to the effective pixel area of ​​the sensor panel 101, and is located and sized to cover multiple circuit boards 103. Ideally, as a high radiation shielding material, radiation shielding component 107 comprises one or more metallic materials selected from the group consisting of lead (Pb), barium (Ba), tantalum (Ta), tungsten (W), and molybdenum (Mo). By providing radiation shielding component 107 as a simple single component with excellent radiation shielding performance, even when multiple circuit boards 103 are provided, radiation emission toward the circuit boards 103 is shielded, and IC failure and performance degradation due to radiation emission are prevented. Radiation shielding component 107 is arranged to be sandwiched between circuit support base 105 and sensor support base 102.

[0036] The circuit support base 105 supports multiple circuit boards 103 on its back side along the radial incident direction A. By using materials such as resin, CFRP, magnesium alloy, aluminum alloy, steel plate, or stainless steel, the circuit support base 105 can simultaneously achieve both rigidity and light weight.

[0037] The housing 106 is a housing component that contains a sensor panel 101, a sensor support base 102, a circuit board 103, flexible wiring 104, a circuit support base 105, etc. within its internal space. By using materials such as CFRP (carbon fiber reinforced polymer), magnesium alloy, aluminum alloy, iron, or stainless steel, the housing 106 can simultaneously meet the requirements of rigidity and light weight.

[0038] In this exemplary embodiment, the first columnar member 108 is configured as a first fixing portion, which fixes the sensor support base 102 to the back of the housing 106, such that the circuit board 103 faces the back of the housing 106 with a gap in the internal space of the housing 106. More specifically, the circuit support base 105 is formed of the aforementioned metal or resin material, and, for example, the hollow first columnar member 108, separate from the circuit support base 105, is press-fitted and embedded. Figure 1 The first columnar member 108 is located on the lower surface of the circuit support base 105. It can be formed of the same metal material as the circuit support base 105, or of a different metal material. Alternatively, instead of embedding the first columnar member 108 into the circuit support base 105, the circuit support base 105 can be integrally formed with the first columnar member 108 using, for example, a predetermined resin material, so that the first columnar member 108 protrudes from the surface of the circuit support base 105. Thus, with the circuit support base 105, which offers excellent ease of use and is appropriately equipped with the first columnar member 108, the radiation imaging device 100 according to this exemplary embodiment can be readily obtained.

[0039] Within the interior space of the housing 106, the end face of each first columnar member 108 contacts and is fixed to the back of the housing 106, thus placing the first columnar member 108 in an upright position. Each first columnar member 108 is secured and fixed by inserting, for example, a screw from the rear surface of the outer surface of the housing 106, penetrating the housing 106, one of the first columnar members 108, and the circuit support base 105, and securing the screw to the upper surface of the circuit support base 105 with, for example, a nut. In this way, the circuit support base 105 holding the circuit board 103 is firmly fixed to the housing 106, ensuring sufficient mechanical strength for the circuit board 103.

[0040] In a plan view along the incident radiation direction A, the first columnar member 108 is arranged in the region inside the outer periphery of the radiation shielding member 107, in a position where no IC is placed (hereinafter sometimes referred to as the IC non-placement area) and spaced apart from the IC on the circuit board 103. In the case where the first columnar member 108 is arranged as described above, it is assumed that the first columnar member 108 is arranged in a position such as... Figure 1The multiple locations shown may be used, but only one of the first columnar members 108 may be arranged at the location.

[0041] By arranging the first columnar member 108 in the region inside the outer periphery of the radiation shielding member 107, stable fixation of the circuit support base 105 to the housing 106 can be achieved, while reducing imbalance in the fixing position. By arranging the first columnar member 108 at a position spaced apart from the IC on the circuit board 103, interference between the first columnar member 108 and the IC is prevented. Figure 1 In the example, the first columnar member 108 is disposed in the gap between adjacent circuit boards 103. For example, when the circuit board 103 has a relatively large area, a through-hole can be formed at a location spaced apart from the IC on the circuit board 103, and the first columnar member 108 can be disposed through the through-hole. By arranging the first columnar member 108 as described above, the circuit support base 105 can be stably fixed to the housing 106 without interfering with the function of the IC on the circuit board 103.

[0042] Furthermore, in this exemplary embodiment, a second columnar member 109 is provided as a second fixing part. This second columnar member 109 fixes the sensor support base 102 and the circuit support base 105 by penetrating the radiation shielding member 107, while the radiation shielding member 107 is sandwiched between the sensor support base 102 and the circuit support base 105. More specifically, the circuit support base 105 is formed of the aforementioned metal material or resin material, and in... Figure 1On the upper surface of the circuit support base 105 shown, a hollow second columnar member 109, for example, separate from the circuit support base 105, is press-fitted and embedded therein. Therefore, in this case, the aforementioned first columnar member 108 is arranged on the lower surface of the circuit support base 105, and the second columnar member 109 is arranged on the upper surface of the circuit support base 105. The second columnar member 109 can be formed of the same metal material as the circuit support base 105, or of a different metal material. Furthermore, the following construction can be used instead of embedding the second columnar member 109 in the circuit support base 105: In this construction, the circuit support base 105 and the second columnar member 109 are integrally formed using, for example, a predetermined resin material, such that the second columnar member 109 protrudes from the main surface of one side of the circuit support base 105. Alternatively, the circuit support base 105 and the second columnar member 109 can be integrally formed using, for example, a predetermined resin material, such that the second columnar member 109 protrudes from one side of the main surface and the first columnar member 108 protrudes from the other side of the main surface. As described above, the radiation imaging device 100 according to this exemplary embodiment can be easily obtained by using the circuit support base 105, which is highly convenient to use and appropriately provided with the first columnar member 108 and the second columnar member 109.

[0043] The second columnar component 109 can be arranged in Figure 1 The sensor support base 102 is located on the lower surface of the sensor support base 102, rather than on the circuit support base 105. More specifically, the sensor support base 102 is formed of the aforementioned metallic material, and, for example, a hollow second columnar member 109 separate from the sensor support base 102 is embedded therein. Figure 1 The second columnar member 109 is located on the lower surface of the sensor support base 102. It can be formed of the same metal material as the sensor support base 102, or of a different metal material. Alternatively, a predetermined resin material can be used to integrally form the sensor support base 102 and the second columnar member 109, such that the second columnar member 109 protrudes from the surface of the sensor support base 102. Thus, with the sensor support base 102, which offers excellent ease of use and is appropriately equipped with the second columnar member 109, the radiation imaging device 100 according to this exemplary embodiment can be readily obtained.

[0044] In the radiation shielding component 107, a gap 107a is formed at a position corresponding to each of the second columnar components 109. The gap 107a is wider than each corresponding second columnar component 109, such that the second columnar component 109 does not contact or interfere with the radiation shielding component 107. Figure 1As shown, each second columnar component 109 is inserted into the corresponding gap 107a while being separated from the inner wall surface of the corresponding gap 107a, and the sensor support base 102 and the circuit support base 105 are fixed by the second columnar component 109.

[0045] More specifically, the sensor support base 102 and the circuit support base 105 are fastened and secured by inserting, for example, a screw through the lower surface of the circuit support base 105, one of the second columnar members 109, and the sensor support base 102, and the screw is secured to the upper surface of the sensor support base 102 with, for example, a nut. Alternatively, the sensor support base 102 and the circuit support base 105 are fastened and secured by inserting, for example, a screw through the upper surface of the sensor support base 102, one of the second columnar members 109, and the circuit support base 105, and the screw is secured to the lower surface of the circuit support base 105 with, for example, a nut. In this way, the sensor support base 102 holding the sensor panel 101 is firmly fixed to the circuit support base 105 via the radiation shielding member 107, ensuring sufficient mechanical strength for the sensor panel 101.

[0046] As described above, the sensor panel 101, sensor support base 102, radiation shielding component 107, circuit support base 105, and circuit board 103 are integrally fixed. Since the circuit support base 105 is fixed to the housing 106 via the first columnar component 108, the sensor panel 101, sensor support base 102, radiation shielding component 107, circuit support base 105, circuit board 103, etc., are all fixed to the housing 106.

[0047] As described above, in this exemplary embodiment, the sensor support base 102 holding the sensor panel 101 is fixed to the circuit support base 105 via the radiation shielding member 107, and the circuit support base 105 holding the circuit board 103 is fixed to the housing 106 via the first columnar member 108. Thus, the sensor panel 101 and the circuit board 103 are fixed to the housing 106 via the sensor support base 102 and the circuit support base 105. Therefore, both high radiation shielding performance for the circuit board 103 and sufficient mechanical strength for the sensor panel 101 and the circuit board 103 can be simultaneously achieved.

[0048] In a plan view along the incident radiation direction A, the second columnar member 109 is arranged in the effective pixel area of ​​the sensor panel 101 and the IC non-arrangement area on the circuit board 103 where no IC is arranged. In the case of arranging the second columnar member 109 as described above, it is assumed that the second columnar member 109 is arranged in such a... Figure 1Multiple locations are shown, but only one of the second columnar members 109 may be arranged at a location. By arranging the second columnar member 109 in the effective pixel area of ​​the camera, imbalance of the fixed position of the sensor support base 102 relative to the circuit support base 105 can be prevented, and the sensor support base 102 can be stably fixed. By arranging the second columnar member 109 in the IC non-disposing area of ​​the circuit board 103 where no IC is mounted in the plan view, radiation emission toward the IC due to the overlap between the gap 107a of the absence of the radiation shielding member 107 and the IC can be prevented. By arranging the second columnar member 109 as described above, the sensor support base 102 can be stably fixed to the circuit support base 105 without interfering with the function of the IC mounted on the circuit board 103.

[0049] Ideally, the first columnar member 108 and the second columnar member 109 can be arranged at different, non-overlapping positions in a plan view along the incident radiation direction A. This arrangement disperses the stress applied to the sensor support base 102 and the circuit support base 105 by the first columnar member 108 and the second columnar member 109. Therefore, stable fixation of the sensor support base 102 and the circuit support base 105 to the housing 106 is achieved.

[0050] Furthermore, a radiation shielding component 110 with a layered structure can be additionally arranged between the sensor panel 101 and the sensor support base 102. By arranging the radiation shielding component 110, reflections from ICs mounted on the circuit board 103, etc., can be prevented from being captured in the image.

[0051] <Comparison Example>

[0052] A comparative example of this exemplary embodiment will now be described.

[0053] Figure 2 This is a cross-sectional view showing a comparative example of a radiation imaging device 150 according to this exemplary embodiment. Figure 2 In, with Figure 1 The same components of the radiation imaging device 100 shown according to this exemplary embodiment are given the same reference numerals, and their descriptions are omitted.

[0054] like Figure 2As shown, the radiation imaging device 150 does not include either the first columnar member 108 provided in the radiation imaging device 100 according to this exemplary embodiment, nor the second columnar member 109 provided in the radiation imaging device 100 according to this exemplary embodiment. With this configuration, due to the presence of the radiation shielding member 107, the sensor support base 102 is not properly secured to the circuit support base 105, and furthermore, the circuit support base 105 is not properly secured to the housing 106. In this situation, for example, it is conceivable that the sensor support base 102, circuit support base 105, etc., could be held in place, for example, by allowing the inner surface of the housing 106 to contact specific components.

[0055] The radiation shielding performance of the circuit board 103 is ensured by the radiation shielding component 107 through the construction of the radiation imaging device 150. Neither the circuit support base 105 nor the sensor support base 102 is fixed to the housing 106. Therefore, the circuit board 103 and sensor panel 101 supported by these bases are susceptible to external impacts and vibrations, which can easily damage their mechanical strength.

[0056] On the other hand, since the radiation imaging device 100 according to this exemplary embodiment is provided with a first columnar member 108 and a second columnar member 109, the sensor support base 102, circuit support base 105, etc. are securely fixed to the housing 106, and radiation shielding performance and mechanical strength are ensured at the same time.

[0057] As described above, according to this exemplary embodiment, in the configuration including the circuit support base 105 supporting the circuit board 103, a radiation imaging device 100 is realized that simultaneously satisfies the high radiation shielding performance of the circuit board 103 and the sufficient mechanical strength of the sensor panel 101 and the circuit board 103.

[0058] Hereinafter, a second exemplary embodiment according to the present disclosure will be described. Similar to the first exemplary embodiment, a radiation imaging device is disclosed in the second exemplary embodiment, but the radiation imaging device in the second exemplary embodiment differs from that in the first exemplary embodiment in that the construction of the second fixing portion is different. Figure 3 This is a cross-sectional view showing an example of a radiation imaging device 200 according to this exemplary embodiment. Figure 3 In, with Figure 1 The same components of the radiation imaging device 100 shown according to the first exemplary embodiment are given the same reference numerals, and their detailed descriptions are omitted.

[0059] Similar to the radiation imaging device 100 according to the first exemplary embodiment, the radiation imaging device 200 includes a sensor panel 101, a sensor support base 102, a circuit board 103, flexible wiring 104, a circuit support base 105, and a housing 106 containing them. The circuit support base 105 supports a plurality of circuit boards 103 and is provided with a radiation shielding member 107 having a layered structure. A first columnar member 108 that fixes the circuit support base 105 to the back side of the housing 106 is configured such that the circuit boards 103 face the back side of the housing 106 opposite to the radiation incident surface with a gap in the internal space of the housing 106. In a plan view along the radiation incident direction A, the first columnar member 108 is arranged in a region inside the outer periphery of the radiation shielding member 107 and is arranged at a position spaced apart from the ICs on the circuit boards 103.

[0060] In this exemplary embodiment, adhesive material 111 is provided as a second fixing portion between the sensor support base 102 and the radiation shielding component 107, and adhesive material 112 is provided as a second fixing portion between the circuit support base 105 and the radiation shielding component 107. For example, glue or double-sided tape is used as adhesive materials 111 and 112.

[0061] Using adhesive materials 111 and 112, the sensor support base 102 is fixed to the circuit support base 105 via the radiation shielding component 107. In this way, the sensor panel 101, sensor support base 102, radiation shielding component 107, circuit support base 105, and circuit board 103 are integrally fixed. Since the circuit support base 105 is fixed to the housing 106 via the first columnar component 108, the sensor panel 101, sensor support base 102, radiation shielding component 107, circuit support base 105, circuit board 103, etc., are all fixed to the housing 106. Therefore, both high radiation shielding performance for the circuit board 103 and sufficient mechanical strength for the sensor panel 101 and circuit board 103 can be simultaneously achieved.

[0062] The adhesive materials 111 and 112 do not necessarily need to be applied to the entire surface of the radiation shielding member 107; they can be applied partially, as long as the adhesive strength is ensured. More specifically, in a plan view along the radiation incident direction A, the adhesive materials 111 and 112 are applied at one or more locations on the upper and lower surfaces of the radiation shielding member 107, corresponding to the interior of the effective pixel area of ​​the sensor panel 101. By partially applying the adhesive materials 111 and 112 within the effective pixel area in this manner, stable fixation of the sensor support base 102 to the circuit support base 105 is achieved, while reducing imbalances in the fixation position.

[0063] As described above, according to this exemplary embodiment, in the configuration including the circuit support base 105 supporting the circuit board 103, a radiation imaging device 200 is realized that simultaneously satisfies the high radiation shielding performance of the circuit board 103 and the sufficient mechanical strength of the sensor panel 101 and the circuit board 103.

[0064] Hereinafter, a third exemplary embodiment according to this disclosure will be described. Similar to the first exemplary embodiment, a radiation imaging device is disclosed in the third exemplary embodiment, but the radiation imaging device in the third exemplary embodiment differs from that in the first exemplary embodiment in the construction of the second fixing portion. Figure 4 This is a cross-sectional view showing an example of a radiation imaging device 300 according to this exemplary embodiment. Figure 4 In, with Figure 1 and Figure 3 The components of the radiation imaging devices 100 and 200 described in the figures are given the same reference numerals, and their detailed descriptions are omitted.

[0065] Similar to the radiation imaging device 100 according to the first exemplary embodiment, the radiation imaging device 300 includes a sensor panel 101, a sensor support base 102, a circuit board 103, flexible wiring 104, a circuit support base 105, and a housing 106 containing them. The circuit support base 105 supports a plurality of circuit boards 103 and is provided with a radiation shielding member 107 having a layered structure. A first columnar member 108 that fixes the circuit support base 105 to the back side of the housing 106 is configured such that the circuit boards 103 face the back side of the housing 106 opposite to the radiation incident surface with a gap in the internal space of the housing 106. In a plan view along the radiation incident direction A, the first columnar member 108 is arranged in a region inside the outer periphery of the radiation shielding member 107 and is arranged at a position spaced apart from the IC on the circuit board 103.

[0066] Similar to the second exemplary embodiment, in this exemplary embodiment, the adhesive material 112 is configured as a second fixing portion between the circuit support base 105 and the radiation shielding component 107, and the radiation shielding component 107 is bonded and fixed to the circuit support base 105. Thus, the circuit board 103, the circuit support base 105, and the radiation shielding component 107 are fixed to the housing 106.

[0067] Furthermore, in this exemplary embodiment, a pad member (buffer member) 113 is arranged as a second fixing part above the sensor support base 102 supporting the sensor panel 101 within the internal space of the housing 106. The lower surface of the pad member 113 contacts the upper surface of the sensor panel 101, and the upper surface of the pad member 113 contacts the front surface of the housing 106. The sensor support base 102 supporting the sensor panel 101 is held and fixed to the housing 106 in a floating state by the pad member 113 via the circuit support base 105, etc., in order to reduce the effects of displacement and external impacts, especially in the longitudinal direction.

[0068] Instead of the pad member 113 serving as the second fixing part, a pad member 114 can be arranged between the side surface of the sensor support base 102 supporting the sensor panel 101 and the side surface of the housing 106 within the internal space of the housing 106. The pad member 114 allows the sensor support base 102 to be held and fixed to the housing 106 in a floating state, thereby mitigating the effects of displacement and external impacts, particularly in the lateral direction. The pad member 114 can be a frame-shaped member with a portion removed, and to avoid interference with the flexible wiring 104, it can fill the gap between the side surface of the sensor support base 102 and the side surface of the housing 106 within the internal space of the housing 106, except for the portion through which the flexible wiring 104 passes. Furthermore, the pad member 114 can be partially provided with a gap between the side surface of the sensor support base 102 and the side surface of the housing 106, except for the portion through which the flexible wiring 104 passes. For example, the pad component 114 may be partially disposed at one or more locations on each of the opposite sides of the rectangular sensor support base 102, or in addition, at one or more locations on each of the sides orthogonal to the sides of the sensor support base 102. By arranging the pad component 114 in this way, the sensor support base 102 can be stably fixed to the housing 106 without imbalance.

[0069] In addition, such as Figure 4 As shown, pad components 113 and 114 can both be arranged within the internal space of the housing 106. This configuration further reduces the displacement of the sensor panel 101 and the sensor support base 102 in both the longitudinal and lateral directions, as well as the impact of external shocks.

[0070] Furthermore, in this exemplary embodiment, the front surfaces of the pad member 113 and the housing 106 can be fixed, or the sides of the pad member 114 and the housing 106 can be fixed. More specifically, they can be fastened and fixed with screws, or they can be glued and fixed with adhesive material. By fixing them in this way, more stable retention is achieved and mechanical strength is improved. In addition, adhesive material 111, as described in, for example, the second exemplary embodiment, can be used as a second fixing part to glue and fix the upper surface of the radiation shielding member 107 and the lower surface of the sensor support base 102 to further ensure mechanical strength.

[0071] Furthermore, similar to the first exemplary embodiment, in order to prevent reflections from the IC on the circuit board 103 from being captured in the captured image, a radiation shielding component 110 with a layered structure can be provided between the sensor panel 101 and the sensor support base 102.

[0072] As described above, according to this exemplary embodiment, in the configuration including the circuit support base 105 supporting the circuit board 103, a radiation imaging device 300 is realized that simultaneously satisfies the high radiation shielding performance of the circuit board 103 and the sufficient mechanical strength of the sensor panel 101 and the circuit board 103.

[0073] Hereinafter, a fourth exemplary embodiment according to the present disclosure will be described. Similar to the first exemplary embodiment, a radiation imaging device is disclosed in the fourth exemplary embodiment, but the radiation imaging device in the fourth exemplary embodiment differs from that in the first exemplary embodiment in that the construction of the radiation shielding component is different. Figure 5 This is a cross-sectional view showing an example of a radiation imaging device 400 according to this exemplary embodiment. Figure 5 In, with Figure 1 The same components of the radiation imaging device 100 shown are given the same reference numerals, and their detailed descriptions are omitted.

[0074] Similar to the radiation imaging device 100 according to the first exemplary embodiment, the radiation imaging device 400 includes a sensor panel 101, a sensor support base 102, a circuit board 103, flexible wiring 104, a circuit support base 115, and a housing 106 containing them. A first columnar member 108 that secures the circuit support base 115 to the back of the housing 106 is configured such that the circuit board 103 faces the back of the housing 106 opposite to the radiation incident surface with a gap within the interior space of the housing 106.

[0075] In the radiation imaging device 400, the circuit support base 115 is constituted by a radiation shielding component. More specifically, the circuit support base 115 does not have a radiation shielding component alone, but is made of a material including a radiation shielding material, and provides a circuit support base 115 that also serves as a radiation shielding component. Ideally, as a high radiation shielding material, the circuit support base 115 comprises one or more metallic materials selected from the group consisting of Pb, Ba, Ta, W, and Mo. Figure 5 As shown, the circuit support base 115 supports a plurality of circuit boards 103 on its lower surface, and the circuit support base 115 is bonded and fixed to the sensor support base 102 by providing an adhesive material (not shown) as a second fixing part between the upper surface of the circuit support base 115 and the sensor support base 102. This configuration can, for example, use screws instead of adhesive material as the second fixing part to fasten and fix the circuit support base 115 and the sensor support base 102.

[0076] In this exemplary embodiment, the circuit support base 115 itself has a high radiation shielding function.

[0077] In a plan view along the incident radiation direction A, the circuit board 103, supported by the lower surface of the circuit support base 115, is contained within the circuit support base 115. Therefore, the incident radiation is shielded by the circuit support base 115, and the IC on the circuit board 103 is protected from the radiation. In this exemplary embodiment, since a separate radiation shielding component is not required, the circuit support base 115 and the sensor support base 102, which have high radiation shielding capabilities, can be easily secured. As a result, using the simple circuit support base 115 with a reduced number of components, radiation shielding for the IC on the circuit board 103 can be reliably achieved.

[0078] In a plan view along the incident radiation direction A, the first columnar member 108 is arranged in the region inside the outer periphery of the circuit support base 115, which has a radiation shielding function, and is positioned at a distance from the IC on the circuit board 103. By arranging the first columnar member 108 in the region inside the outer periphery of the circuit support base 115, stable fixation of the circuit support base 115 to the housing 106 is achieved, while reducing imbalance in the fixing position. By arranging the first columnar member 108 at a distance from the IC on the circuit board 103, interference between the first columnar member 108 and the IC is prevented. Figure 5In the example, the first columnar member 108 is disposed in the gap between adjacent circuit boards 103. For example, when the circuit board 103 has a relatively large area, a through-hole can be formed at a location spaced apart from the IC on the circuit board 103, and the first columnar member 108 can be disposed through the through-hole. By arranging the first columnar member 108 as described above, the circuit support base 115 can be stably fixed to the housing 106 without interfering with the function of the IC on the circuit board 103.

[0079] The sensor support base 102 is directly fixed to the circuit support base 115 using adhesive materials or the like as a second fixing component. In this way, the sensor panel 101, sensor support base 102, circuit support base 115, and circuit board 103 are integrally fixed. Since the circuit support base 115 is fixed to the housing 106 via the first columnar member 108, the sensor panel 101, sensor support base 102, circuit support base 115, circuit board 103, etc., are all fixed to the housing 106. Therefore, both high radiation shielding performance for the circuit board 103 and sufficient mechanical strength for the sensor panel 101 and circuit board 103 can be simultaneously achieved.

[0080] As described above, according to this exemplary embodiment, in the configuration including the circuit support base 115 supporting the circuit board 103, a radiation imaging device 400 can be realized that simultaneously satisfies the high radiation shielding performance of the circuit board 103 and the sufficient mechanical strength of the sensor panel 101 and the circuit board 103.

[0081] While this disclosure has been described with reference to embodiments, it should be understood that this disclosure is not limited to the disclosed embodiments. The scope of the following claims should be given the broadest interpretation to cover all such modifications and equivalent structures and functions.

Claims

1. A radiographic apparatus comprising: a radiation detection sensor configured to detect radiation; a circuit board; a first base including a radiation shielding member between the radiation detection sensor and the circuit board, the first base configured to support the circuit board; a housing containing the radiation detection sensor, the circuit board, and the first base in an internal space of the housing; and a first fixing portion configured to fix the first base to a back surface of the housing such that the circuit board faces the housing with a gap in the internal space, wherein, in a plan view in a radiation incident direction, the first fixing portion is located in a region inside a periphery of the radiation shielding member. In the plan view in the radiation incident direction, the first fixing portion is arranged in a region inside the periphery of the radiation shielding member and at a position spaced apart from an integrated circuit on the circuit board.

2. The radiographic apparatus according to claim 1, wherein 3. The radiographic apparatus according to claim 1, further comprising a second base configured to support the radiation detection sensor.

4. The radiographic apparatus according to claim 3, further comprising a second fixing portion configured to fix the second base in the internal space. The second fixing portion is arranged to penetrate the radiation shielding member.

5. The radiographic apparatus according to claim 4, wherein 6. The radiographic apparatus according to claim 5, the second base faces the first base via the radiation shielding member, and wherein wherein the second fixing portion fixes the first base and the second base. The second fixing portion passes through a gap formed in the radiation shielding member.

7. The radiographic apparatus according to claim 5, wherein 8. The radiographic apparatus according to claim 7, the gap is formed wider than the second fixing portion, and wherein wherein the second fixing portion passes through the gap in a state spaced apart from an inner wall surface of the gap. The first fixing portion is integrally formed with the first base.

9. The radiographic apparatus according to claim 1, wherein The first fixing portion is formed separately from the first base.

10. The radiographic apparatus according to claim 1, wherein The second fixing portion is integrally formed with the first base.

11. The radiographic apparatus according to claim 5, wherein The second fixing portion is formed separately from the first base.

12. The radiographic apparatus according to claim 5, wherein, The second fixing portion is integrally formed with the second base.

13. The radiographic apparatus according to claim 5, wherein In the plan view, the second fixing portion is arranged in a radiographic effective pixel region of the radiation detection sensor and a region on the circuit board where no integrated circuit is arranged.

14. The radiographic apparatus according to claim 5, wherein In the plan view, the first fixing portion and the second fixing portion are arranged at different positions from each other.

15. The radiographic apparatus according to claim 5, wherein The first fixing portion is fastened and fixed.

16. The radiographic apparatus according to claim 1, wherein, The second fixing portion is fastened and fixed.

17. The radiographic apparatus according to claim 4, wherein The second fixing portion is an adhesive material.

18. The radiographic apparatus according to claim 4, wherein, 19. The radiographic apparatus according to claim 18, the adhesive material is provided on both surfaces of the radiation shielding member, and wherein, wherein one surface of the radiation shielding member and the first base are adhered and fixed, and the other surface of the radiation shielding member and the second base are adhered and fixed. ​ 20. The radiographic apparatus according to claim 4, wherein, The second fixing portion is a cushioning member disposed between the second base and the housing in the internal space to hold the second base to the housing.

21. The radiographic apparatus according to claim 19, wherein, The second base is in a floating state held by the housing, or in a fixed state fixed to the housing.

22. The radiographic apparatus according to claim 1, wherein, The first base is constructed of the radiation shielding member.

23. The radiographic apparatus according to claim 22, wherein, The first base is directly fixed to the second base supporting the radiation detection sensor by fixing the second base to the second fixing portion in the internal space.

24. The radiographic apparatus according to claim 1, wherein, The radiation shielding member includes one or more metal materials selected from a group consisting of lead (Pb), barium (Ba), tantalum (Ta), tungsten (W), and molybdenum (Mo). 25.The radiographic imaging apparatus of claim 3, further comprising another radiation shielding member between the radiation detection sensor and the second base.

Images