Method for determining initial position of component, computer program product and particle beam apparatus

Abstract

The invention relates to a method for determining an initial position of a movable component, and also to a computer program product and to a particle beam apparatus for carrying out the method. The method comprises the steps of: moving the assembly along a first movement path; determining a first position of the assembly relative to the first sensor unit using a second sensor unit arranged on the assembly; positioning the first position as an initial position of orientation and / or positioning of the assembly in the sample chamber; predefining a second position of the assembly relative to the initial position; moving the assembly to a second position of the assembly along a second movement path; moving the assembly along a third movement path; a third position of the component relative to the first sensor unit is determined using the second sensor unit, and the third position is defined as an initial position of orientation and / or positioning of the component in the sample chamber.

Description

TECHNICAL FIELD

[0001] The present invention relates to a method for determining an initial position of a movable component in a particle beam device. The invention further relates to a computer program product and a particle beam device for implementing the method according to the invention. For example, the particle beam device is implemented as an electron beam device and / or an ion beam device. BACKGROUND

[0002] Electron beam devices, in particular scanning electron microscopes (hereinafter also referred to as SEM) and / or transmission electron microscopes (hereinafter also referred to as TEM), are used for inspecting objects (samples) in order to gain an understanding about properties and behavior under certain conditions.

[0003] In a SEM, an electron beam (hereinafter also referred to as primary electron beam) is generated by means of a beam generator and focused by means of a beam guiding system on an object to be inspected. The primary electron beam is guided in a raster scan fashion over the surface of the object to be inspected by means of deflection means. In the process, the electrons of the primary electron beam interact with the object to be inspected. As a result of the interaction, in particular, electrons are emitted by the object (so-called secondary electrons) and electrons of the primary electron beam are backscattered (so-called backscattered electrons). The secondary electrons and the backscattered electrons are detected and used for generating an image. Thus, an image representation of the object to be inspected is obtained. Furthermore, interaction radiation, for example x-ray radiation and / or cathodoluminescence, is generated as a result of the interaction. In particular, the interaction radiation is used for analyzing the object.

[0004] In the case of a TEM, a primary electron beam is likewise generated by means of a beam generator and focused by means of a beam guiding system on an object to be inspected. The primary electron beam radiates through the object to be inspected. When the primary electron beam passes through the object to be inspected, the electrons of the primary electron beam interact with the material of the object to be inspected. The electrons passing through the object to be inspected are imaged by means of a system consisting of an objective and a projection unit on a fluorescent screen or a detector, for example a camera. Here, imaging can also be carried out in a scanning mode of the TEM. Usually, such a TEM is referred to as STEM. Additionally, it can be provided that further detectors are used to detect electrons backscattered at the object to be inspected and / or secondary electrons emitted by the object to be inspected in order to image the object to be inspected.

[0005] Furthermore, the prior art discloses the use of a combination device for inspecting an object, in which both electrons and ions can be directed onto the object to be inspected. For example, it is known to equip a SEM additionally with an ion beam column. Using an ion beam generator arranged in the ion beam column, ions are generated for preparing the object, for example ablating material from the object or applying material to the object, or for imaging. The SEM is used here in particular for observing the preparation, but also for further inspection of the prepared or unprepared object.

[0006] The use of a gas feed for applying material to an object in a particle beam device is known. The known particle beam device is a combination device which provides both an electron beam and an ion beam. The particle beam device comprises an electron beam column and an ion beam column. The electron beam column provides an electron beam which is focused on the object. The object is arranged in a sample chamber which is held under vacuum. The ion beam column provides an ion beam which is likewise focused on the object. For example, a layer of the surface of the object is removed by means of the ion beam. As soon as the layer has been removed, another surface of the object is exposed. By means of a gas feed device, a gaseous precursor substance, a so-called precursor, can be admitted into the sample chamber. It is known to implement the gas feed device as having a needle-like device which can be arranged very close to the position of the object, at a distance of a few pm, so that the gaseous precursor substance can be directed to this position as precisely as possible and in a high concentration. Due to the interaction of the ion beam with the gaseous precursor substance, a layer of the substance is deposited on the surface of the object. For example, it is known to admit gaseous phenanthrene as a gaseous precursor substance into the sample chamber by means of the gas feed device. Then, a substantially carbon layer or carbon-containing layer is deposited on the surface of the object. It is also known to use gaseous precursor substances which comprise metals in order to deposit a metal layer or metal-containing layer on the surface of the object. However, the deposit is not limited to carbon and / or metals. Rather, any desired substance can be deposited on the surface of the object, for example semiconductors, non-conductors or other compounds. Furthermore, it is known that gaseous precursor substances are used for ablating material from the object when interacting with the particle beam.

[0007] It is known to arrange the object on a movable object stage in order to carry out an orientation and / or positioning of the object in the sample chamber of the particle beam device. The known object stage is implemented to be movable in three directions which are arranged perpendicular to one another, in particular in the x-direction (first stage axis), the y-direction (second stage axis) and the z-direction (third stage axis). Furthermore, the known object stage can be rotated about two rotation axes (rotation axes of the stage) which are arranged perpendicular to one another. In addition, it is known that the object stage moves around or along further axes. Furthermore, it is known to provide the axes along which the object stage can move a plurality of times in a predefinable direction.

[0008] In the foregoing and in the following, the positioning of an object is to be understood as meaning that the object is arranged in a certain position in space with respect to an initial position in the form of a zero point. By way of example, the certain position is given by three coordinates, in particular by three coordinates of a Cartesian coordinate system. The origin of the coordinate system is then the initial position.

[0009] In the foregoing and in the following, the orientation of an object is to be understood as meaning the orientation of a surface of the object with respect to at least one predefinable axis or with respect to a plurality of predefinable axes. By way of example, the surface of the object is (i) arranged in a manner inclined or rotated at a certain angle with respect to a predefinable axis, or (ii) arranged at a certain angle with respect to a plurality of predefinable axes.

[0010] In order to determine the orientation and / or the positioning of an object arranged on a movable object table, methods are already known from the prior art and will be explained in the following.

[0011] By way of example, it is known to generate an electron-optical image of an object arranged on a movable object table by means of a particle beam device and to determine the orientation and / or the positioning of the object on the basis of the recorded electron-optical image of the object. The electron-optical image is generated, for example, by detecting secondary electrons and backscattered electrons which are produced by the interaction of a primary electron beam with the object.

[0012] In addition, it is known to generate an optical-optical image of an object arranged on a movable object table by means of a camera and to determine the orientation and / or the positioning of the object on the basis of the optical-optical image of the object.

[0013] Furthermore, it is known from the prior art to use the stepper motors of the movement device to move the object carrier in order to determine and control the orientation and / or position of an object arranged on the movable object carrier. The known stepper motors comprise a step counter for determining and controlling the aforementioned orientation and / or position. By means of the number of steps carried out by one or more stepper motors of the movement device, the aforementioned orientation and / or position of the object arranged on the movable object carrier relative to a predefinable initial position can be determined and / or controlled. However, the aforementioned known method has the disadvantage that errors often occur in the step count carried out by the step counter if the object carrier touches another component of the particle beam device. Furthermore, it is known that malfunctions occur in the known step counter such that the number of steps determined by the step counter does not correspond to the number of steps actually carried out (so-called step loss). This therefore leads to errors in determining and controlling the orientation and / or position of the object arranged on the movable object carrier. In order to avoid such errors, it is known to re-determine the initial position (relative to which the orientation and / or position of the object is determined and / or controlled) if the object carrier touches another component of the particle beam device. In this respect, if the object carrier touches another component of the particle beam device, the position of the object carrier at the time when the object carrier touches the other component is defined as the initial position. This essentially involves an initialization and thus a re-determination of the zero point in the form of the initial position, which is then the position of the object carrier at the time when the object carrier touches the other component. Thereafter, by means of the number of steps carried out by one or more stepper motors of the movement device, the orientation and / or position of the object relative to the re-determined initial position can be determined and / or controlled. The aforementioned method can also be carried out by means of further motors (e.g. piezo motors, linear motors or brushless motors). However, due to structural conditions, in some particle beam devices only a first part of the object carrier can touch another component of the particle beam device. Due to structural conditions, a second part of the object carrier can not touch another component of the particle beam device at all. It is then indeed possible that due to structural conditions neither the first part nor the second part of the object carrier touches another component of the particle beam device. The re-determination of the initial position is then not feasible. If further errors then occur, e.g. due to mechanical inaccuracies and / or malfunctions (e.g. wear phenomena in the gear mechanism of the stepper motor, collisions, foreign bodies in the drive, step loss and / or sluggishness), it can actually be the case that the orientation and / or position of the object cannot be determined and / or controlled correctly, since the initial position cannot be re-determined.

[0014] With regard to the prior art, reference is made to US 10,872,744 B2, US 11,239,051 B2, US 2021 / 0383519 A1, DE 10 2010 046 902 A1 and DE 10 2019 213 907 B3. SUMMARY

[0015] It is the object underlying the present application to specify a further method for determining an initial position of a movable component such that the orientation and / or positioning of the movable component relative to the initial position can be determined and / or controlled particularly well.

[0016] According to the application, this object is achieved by a method having the features of claim 1 or 14. The features of claim 11 or 16 give a computer program product comprising program code which controls a particle beam device to carry out the method according to the application. Further, the features of claim 12 or 17 give a particle beam device for imaging, analyzing and / or processing an object. Further features of the application become clear from the following description, the attached claims and / or the drawings.

[0017] The method according to the application serves for determining an initial position of a movable component relative to a first sensor unit, wherein the component and the first sensor unit are arranged in a sample chamber of a particle beam device for imaging, analyzing and / or processing an object. The particle beam device comprises at least one beam generator for generating a particle beam comprising charged particles. For example, the charged particles are electrons or ions. A second sensor unit is arranged on the component, wherein the second sensor unit cooperates contactlessly with the first sensor unit. In particular, the first sensor unit and the second sensor unit are embodied as inductive sensor units, capacitive sensor units and / or optical sensor units.

[0018] The movable component of the particle beam apparatus is embodied, for example, as an object holder for arranging an object, a manipulator, in particular a micromanipulator, for arranging an object, and / or an object stage for arranging an object. In addition, for example, it is provided that the movable component is embodied as a gas feed unit, a diaphragm unit, or a detector for detecting interaction particles and / or interaction radiation generated by the interaction of the particle beam with the object when the particle beam is incident on the object. Further embodiments of the component will be explained further below. By way of example, the movable component is embodied as being movable in three directions arranged perpendicular to one another, in particular in an x-direction (first axis), in a y-direction (second axis), and in a z-direction (third axis). Furthermore, the component can be rotatable, for example, about a first rotational axis and / or about a second rotational axis oriented perpendicular to the first rotational axis. A movement device is used for moving the component. For example, the movement device comprises at least one stepper motor or a plurality of stepper motors. However, the present application is not limited to the use of stepper motors as movement devices. Rather, any movement device suitable for the present application, for example a piezoelectric motor or a brushless motor, can be used as movement device.

[0019] The method according to the present application involves moving the component along a first movement path by means of a movement device of the particle beam apparatus. In other words, the component is moved along a first predefined path in the form of the first movement path within the sample chamber using the movement device. In this case, the component is moved a first predefined distance in the sample chamber.

[0020] In addition, the method according to the present application involves determining a first position of the component relative to the first sensor unit using (i) the first sensor unit, (ii) a second sensor unit arranged on the component, and (iii) a control unit of the particle beam apparatus. In other words, the non-contacting cooperation of the first sensor unit and the second sensor unit results in a signal being generated which is indicative of the first sensor unit detecting the second sensor unit and / or the second sensor unit detecting the first sensor unit. For example, the signal is forwarded to the control unit of the particle beam apparatus. The control unit then determines the position of the component relative to the first sensor unit. In other words, the control unit then determines the position of the position of the component relative to the first sensor unit. The determined position is the first position. The aforementioned process of determining the first position of the component relative to the first sensor unit takes place during the movement of the component along the first movement path.

[0021] Furthermore, the method according to the invention involves using a control unit to define a first position as the initial position for the orientation and / or positioning of the component in the sample chamber. In other words, initialization and thus the determination of a zero point in the form of an initial position are performed in the above method steps. The initial position is the first position of the object stage, i.e., the position of the object stage when the first sensor unit detects the second sensor unit and / or when the second sensor unit detects the first sensor unit. The initial position is then used for the orientation and / or positioning of the component in the sample chamber. In other words, this involves determining and / or controlling the orientation and / or positioning of the component relative to the initial position.

[0022] Furthermore, the method according to the invention involves using a control unit to predefine a second position of the component relative to an initial position, and using a moving device to move the component along a second movement path to the second position. In other words, the second position is predefined relative to a zero point in the form of the initial position. The moving device then moves the component within the sample chamber along a predefined second path in the form of the second movement path to the second position. In this case, the component moves a predefined second distance within the sample chamber.

[0023] Furthermore, the method according to the invention involves moving the component along a third movement path by means of a moving device. In other words, the moving device is used to move the component within the sample chamber along a predefined third path in the form of a third movement path. In this case, the component moves a third predefined distance within the sample chamber.

[0024] Furthermore, the method according to the invention involves using (i) a first sensor unit, (ii) a second sensor unit, and (iii) a control unit to determine a third position of the component relative to the first sensor unit. In other words, the non-contact cooperation of the first and second sensor units causes the generation of another signal indicating that the first sensor unit has detected the second sensor unit and / or the second sensor unit has detected the first sensor unit. For example, this other signal is forwarded to the control unit of the particle beam device. The control unit then determines the position of the component relative to the first sensor unit. In other words, the control unit then determines the position of the component relative to the first sensor unit. The determined position is the third position. The aforementioned process of determining the third position of the component relative to the first sensor unit occurs during the movement of the component along a third movement path. In the foregoing and hereinafter, the third movement path is understood to refer to a movement path that enables the first and second sensor units to cooperate non-contactly.

[0025] Furthermore, the method according to the invention involves using a control unit to define a third position as the initial position for the orientation and / or positioning of the component in the sample chamber. In other words, re-initialization and therefore re-determination of the zero point in the form of the initial position are performed in the above method steps. The initial position is the third position of the object stage, that is, the position of the object stage when the first sensor unit detects the second sensor unit and / or when the second sensor unit detects the first sensor unit during the movement of the component along the third movement path. Thus, the initial position can be used for further orientation and / or positioning of the component in the sample chamber. In other words, this involves determining and / or controlling the orientation and / or positioning of the component relative to the redefined initial position. In addition to defining the third position as the initial position for the orientation and / or positioning of the component, or as an alternative, the user of the particle beam device is also provided with the use of a control unit.

[0026] This invention provides a method for determining the initial position of a movable component. In the case of the initial position, the orientation and / or positioning of the movable component relative to the initial position can be determined and / or controlled particularly well. Due to the redetering of the initial position, and multiple repeatable redeterings, the user of the particle beam device reduces, avoids, or identifies errors in the orientation and / or positioning of the movable component, because errors arising from mechanical inaccuracies and / or malfunctions (e.g., wear in the gear mechanism of a stepper motor, collisions, foreign objects in the driver, step loss, and / or sluggishness) are taken into account, for example, by simultaneously redetermining the initial position. Therefore, the orientation and / or position of the component can be determined and / or controlled particularly well.

[0027] In one embodiment of the method according to the invention, additionally or alternatively, during the movement of the component along a first moving path, the first sensor unit cooperates with the second sensor unit without contact at a first time point. The position of the component relative to the first sensor unit at the first time point is determined as a first position. In other words, the position of the component relative to the position of the first sensor unit at the first time point is determined as a first position. Alternatively, during the movement of the component along a third moving path, the first sensor unit cooperates with the second sensor unit without contact at a second time point. The position of the component relative to the first sensor unit at the second time point is determined as a third position. In other words, the position of the component relative to the first sensor unit at the second time point is determined as a third position.

[0028] In another embodiment of the method according to the invention, the first, second, and / or third positions are additionally or alternatively provided to each have three coordinates. For example, the three coordinates are Cartesian coordinates in three-dimensional space. In particular, the initial position is the center of the Cartesian coordinate system. Alternatively, the first, second, and / or third positions are given by spherical coordinates in a spherical coordinate system. In this case, the initial position is the center of the spherical coordinate system.

[0029] In yet another embodiment of the method according to the invention, additionally or alternatively, the component is moved again after the initial position is defined or the initial position is redefined. For this purpose, this embodiment of the method according to the invention involves using a control unit to predefine a fourth position of the component relative to the initial position, and using a moving device to move the component along a fourth movement path to the fourth position. In other words, the fourth position is predefined relative to a zero point in the form of the initial position. The moving device then moves the component within the sample chamber along a predefined fourth path in the form of the fourth movement path to the fourth position. In this case, the component moves a predefined fourth distance within the sample chamber.

[0030] In yet another embodiment of the method according to the invention, additionally or alternatively, if the third position differs from the first position, the control unit defines the third position as the initial position for the orientation and / or positioning of the component in the sample chamber. Thus, this embodiment of the method according to the invention provides that the initial position is redefined only when the third position (in which the first sensor unit cooperates non-contactly with the second sensor unit) does not correspond to the first position (in which the first sensor unit also cooperates non-contactly with the second sensor unit). In other words, the initial position is redefined only when the third position differs from the first position. Alternatively, a position is calculated using the control unit by means of the first and third positions, and then that position is defined as the initial position for the orientation and / or positioning of the component in the sample chamber. For example, the calculated position is a position centered between the first and third positions (similar to calculating the average of two numbers). However, the invention is not limited to this embodiment of calculation. Rather, any mathematical calculation suitable for the first and third positions of the invention can be used.

[0031] In one embodiment of the method according to the invention, additionally or alternatively, the movement of the component along the third movement path occurs at a predefined movement time. As further explained above, the third position of the component relative to the first sensor unit is determined during the movement of the component along the third movement path. For example, the predefined movement time is predefined by the user of the particle beam device, the control unit, and / or by a control signal initiated by a random number generator from the control unit. In other words, the movement of the component along the third movement path can be initiated, and thus the third position is also determined and defined as the initial position. This occurs, for example, whenever the user and / or the control unit deems it necessary or advantageous. Additionally or alternatively, the initiation can also be random.

[0032] In another embodiment of the method according to the invention, additionally or alternatively, the component is arranged to move at a first speed while moving along a first moving path. Furthermore, the component moves at a second speed while moving along a third moving path. In this case, either the first speed is higher than the second speed, or the first speed is lower than the second speed.

[0033] In one embodiment of the method according to the invention, at least one of the following method steps is additionally or alternatively provided:

[0034] (i) The object holder used to arrange the object is used as a component;

[0035] (ii) Manipulators for arranging objects, especially micromanipulators, are used as components;

[0036] (iii) An object stage used for arranging objects is used as a component;

[0037] (iv) A gas feeding unit for feeding at least one gas into an object is used as an assembly;

[0038] (v) A detector is used as a component to detect interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object;

[0039] (vi) The aperture unit is used as a component;

[0040] (vii) An inductive sensor unit is used as a first sensor unit and a second sensor unit;

[0041] (viii) A capacitive sensor unit is used as a first sensor unit and a second sensor unit;

[0042] (ix) The optical sensor unit is used as the first sensor unit and the second sensor unit.

[0043] All embodiments of the method according to the invention described above and below are not limited to the order of the method steps explained. The invention also includes different orders of method steps suitable for solving problems within the scope of the invention. Alternatively or additionally, in the method according to the invention, at least two method steps are also provided to be performed in parallel. Furthermore, embodiments of the method according to the invention described above and below are not limited to the full scope of all method steps further mentioned above or below. Specifically, in other embodiments, one or more of the above or subsequent method steps are omitted.

[0044] The present invention also relates to a computer program product comprising program code loadable or loadable into a processor of a particle beam device, wherein, when executed in the processor, the program code controls the particle beam device to perform a method according to the present invention having at least one of the above-described features or a combination of at least two of the above-described features. In other words, the present invention also relates to a non-volatile computer-readable medium comprising software loadable or loadable into a processor of a particle beam device, wherein, when executed in the processor, the software controls the particle beam device to perform a method according to the present invention having at least one of the above-described features or a combination of at least two of the above-described features. The software includes executable code for implementing at least one method step.

[0045] In this respect, the invention also relates to a processor arranged on a particle beam device and designed to implement a method according to the invention having at least one of the above-described or following features, or a combination of at least two of the above-described or following features.

[0046] The present invention also relates to a particle beam apparatus for imaging, analyzing, and / or processing objects, wherein the particle beam apparatus has been further explained above and will be described in further detail below. The particle beam apparatus according to the invention is used to implement the method according to the invention. The particle beam apparatus according to the invention includes at least one beam generator for generating a particle beam comprising charged particles. Charged particles are, for example, electrons or ions. Furthermore, the particle beam apparatus according to the invention includes at least one movable component. The movable component of the particle beam apparatus is, for example, implemented as an object holder for arranging an object, a manipulator for arranging an object, an object stage for arranging an object, an aperture unit, or a detector for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object. Further embodiments of this component will be explained further below. Additionally, the movable component is provided, for example, as a gas feeding unit. Specifically, the component is implemented to be movable in three directions arranged perpendicular to each other, specifically in the x-direction (first axis), y-direction (second axis), and z-direction (third axis). Furthermore, the component can rotate, for example, about a first rotation axis and / or about a second rotation axis oriented perpendicular to the first rotation axis. Additionally, the particle beam device according to the invention includes at least one moving device for moving the component. For example, the moving device includes at least one stepper motor or multiple stepper motors. Furthermore, the particle beam device according to the invention includes: at least one sample chamber in which the component is disposed; and at least one first sensor unit disposed in the sample chamber. Furthermore, the particle beam device according to the invention includes at least one second sensor unit disposed on the component, wherein the first sensor unit and the second sensor unit cooperate without contact. Additionally, the particle beam device according to the invention includes at least one control unit, which includes a processor having a computer program product having the features already further mentioned above for implementing the method according to the invention.

[0047] In another embodiment of the particle beam device according to the invention, at least one of the following features is provided:

[0048] (i) The component is implemented as an object holder for arranging objects;

[0049] (ii) The component is implemented as a manipulator for placing objects;

[0050] (iii) The component is implemented as an object stage for placing objects;

[0051] (iv) The component is implemented as a gas feed unit for feeding at least one gas into an object;

[0052] (v) The component is implemented as a detector for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object;

[0053] (vi) This component is implemented as an aperture unit;

[0054] (vii) The first sensor unit and the second sensor unit are inductive sensor units;

[0055] (viii) The first sensor unit and the second sensor unit are capacitive sensor units;

[0056] (ix) The first sensor unit and the second sensor unit are optical sensor units. For example, the first sensor unit and / or the second sensor unit are implemented as a camera.

[0057] The present invention also relates to another method for determining the initial position of a movable component, wherein the component is arranged in a sample chamber of a particle beam apparatus for imaging, analyzing, and / or processing an object. The particle beam apparatus includes at least one beam generator for generating a particle beam comprising charged particles. For example, the charged particles are electrons or ions. The movable component of the particle beam apparatus is implemented as, for example, an object holder for arranging an object, a manipulator for arranging an object, and / or an object stage for arranging an object. Additionally, the movable component is provided as a gas feed unit, an aperture unit, or a detector for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object. Further embodiments of the component will be explained below. For example, the component is implemented to be movable in three directions arranged perpendicular to each other, specifically in the x-direction (first axis), the y-direction (second axis), and the z-direction (third axis). Furthermore, the component can rotate, for example, about a first axis of rotation and / or about a second axis of rotation oriented perpendicular to the first axis of rotation. A moving device is used to move the component. For example, the moving device includes at least one stepper motor or multiple stepper motors.

[0058] Another method according to the invention involves using a control unit of a particle beam device to determine a first position of a mark arranged on a component as the initial position of the component for orientation and / or positioning of the component in a sample chamber. For example, determining the first position of the mark arranged on the component is performed by recording an optical image of the mark arranged on the component using a photooptical camera. Alternatively, the first position of the mark arranged on the component is determined by recording a particle optical image of the mark arranged on the component using a particle beam device.

[0059] Alternatively, another method according to the invention involves moving a component along a movement path using a moving device of a particle beam apparatus. In other words, the moving device is used to move the component within a sample chamber along a predefined path in the form of a movement path. In this case, the component moves a predefined distance within the sample chamber.

[0060] Furthermore, another method according to the invention involves using a control unit to calculate a second position of a mark placed on the component during and / or after the component is moved along the movement path. In other words, the control unit calculates the position of the mark placed on the component at a specific point in time during and / or after the component is moved along the movement path. This is the second position.

[0061] Another method according to the invention involves recording an optical image of a mark arranged on the component using an optical camera during and / or after the component is moved along a movement path. Then, in this other method, the control unit compares whether the calculated second position of the mark arranged on the component corresponds to the position of the mark in the optical image at a specific point in time during and / or after the component's movement along the movement path. If the calculated second position of the mark on the component differs from the position of the mark in the optical image, the position of the mark in the optical image is determined as the initial position of the component for orientation and / or positioning of the component in the sample chamber. In other words, initialization and thus the determination of a zero point in the form of an initial position are performed in the above method steps. The initial position is the position of the mark arranged on the component in the optical image. This initial position is then used for orientation and / or positioning of the component in the sample chamber. In other words, this involves determining and / or controlling the orientation and / or positioning of the component relative to the initial position. In addition to determining the initial position of the markers arranged on the component in the optical image, or as an alternative, a control unit is configured to notify the user of the particle beam device if the calculated second position of the markers arranged on the component differs from the position of the markers arranged on the component in the optical image.

[0062] Another method according to the invention also provides a method for determining the initial position of a movable component. In the case of the initial position, the orientation and / or positioning of the movable component relative to the initial position can be determined and / or controlled particularly well. The redetering of the initial position, and the multiple repeatable redetering processes, reduces or avoids errors in the orientation and / or positioning of the movable component, because errors arising from mechanical inaccuracies and / or malfunctions (e.g., wear phenomena in the gear mechanism of a stepper motor, collisions, foreign objects in the driver, step loss, and / or sluggishness) are taken into account simultaneously, for example, by redetermining the initial position. Therefore, the orientation and / or position of the component can be correctly determined and / or controlled.

[0063] In one embodiment of another method according to the invention, at least one of the following method steps is additionally or alternatively provided:

[0064] (i) The object holder used to arrange the object is used as a component;

[0065] (ii) Manipulators used for arranging objects are used as components;

[0066] (iii) An object stage used for arranging objects is used as a component;

[0067] (iv) A gas feeding unit for feeding at least one gas into an object is used as an assembly;

[0068] (v) A detector is used as a component to detect interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object;

[0069] (vi) The aperture unit is used as a component.

[0070] All embodiments of another method according to the present invention described above and below are not limited to the order of the method steps explained. The invention also includes different orders of method steps suitable for solving problems within the meaning of the invention. Alternatively or additionally, in another method according to the present invention, at least two method steps are also provided to be performed in parallel. Furthermore, embodiments of another method according to the present invention described above and below are not limited to the full scope of all method steps further mentioned above or below. Specifically, in other embodiments, one or more of the above or following method steps are provided to be omitted.

[0071] The method according to the invention and another method according to the invention can also be combined with each other so that they are implemented sequentially. For example, another method according to the invention is used to determine coarseness faults that cause errors, for example, in the range of a few µm. If such a fault has been determined, the method according to the invention can be used to determine, for example, faults that cause errors less than 1 µm.

[0072] The present invention also relates to a computer program product comprising program code loadable or loadable into a processor of a particle beam device, wherein, when executed in the processor, the program code controls the particle beam device to implement an alternative method according to the present invention having at least one of the above-described features or a combination of at least two of the above-described features. In other words, the present invention also relates to a non-volatile computer-readable medium comprising software loadable or loadable into a processor of a particle beam device, wherein, when executed in the processor, the software controls the particle beam device to implement an alternative method according to the present invention having at least one of the above-described features or a combination of at least two of the above-described features. The software includes executable code for implementing at least one method step.

[0073] In this respect, the invention also relates to a processor arranged on a particle beam device and designed to implement another method according to the invention having at least one of the above-described or following features or a combination of at least two of the above-described or following features.

[0074] The present invention also relates to another particle beam apparatus for imaging, analyzing, and / or processing objects, wherein this other particle beam apparatus has been further explained above and will be described in further detail below. The other particle beam apparatus according to the invention is used to implement another method according to the invention. The other particle beam apparatus according to the invention includes at least one beam generator for generating a particle beam comprising charged particles. Charged particles are, for example, electrons or ions. Furthermore, the other particle beam apparatus according to the invention includes at least one movable component. The movable component of the other particle beam apparatus according to the invention is implemented, for example, as an object holder for arranging an object, a manipulator for arranging an object, and / or an object stage for arranging an object. Additionally, the movable component is provided, for example, as a gas feed unit, an aperture unit, or a detector for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object. Further embodiments of this component will be explained further below. Specifically, the component is implemented to be movable in three directions arranged perpendicular to each other, specifically in the x-direction (first axis), y-direction (second axis), and z-direction (third axis). Furthermore, the component can rotate, for example, about a first rotation axis and / or about a second rotation axis oriented perpendicular to the first rotation axis. Additionally, another particle beam device according to the invention includes at least one moving means for moving the component. For example, the moving means includes at least one stepper motor or multiple stepper motors. Furthermore, another particle beam device according to the invention includes at least one mark disposed on the component, and also a photooptical camera.

[0075] Furthermore, another particle beam device according to the invention includes at least one control unit, which includes a processor having a computer program product having the features already mentioned above for implementing another method according to the invention.

[0076] In another embodiment of the particle beam device according to the invention, at least one of the following features is provided:

[0077] (i) The component is implemented as an object holder for arranging objects;

[0078] (ii) The component is implemented as a manipulator for placing objects;

[0079] (iii) The component is implemented as an object stage for placing objects;

[0080] (iv) The component is implemented as a gas feed unit for feeding at least one gas into an object;

[0081] (v) The component is implemented as a detector for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object;

[0082] (vi) The component is implemented as an aperture unit.

[0083] In one embodiment of the particle beam apparatus according to the invention or another particle beam apparatus according to the invention, at least one scanning device is provided for scanning a particle beam onto an object. Additionally or alternatively, at least one additional detector is provided for detecting interacting particles and / or interacting radiation generated by the interaction between the particle beam and the object when the particle beam is incident on the object. For example, this additional detector is identical to at least one of the detectors mentioned above or below.

[0084] In another embodiment of the particle beam apparatus according to the invention or another particle beam apparatus according to the invention, at least one objective lens for focusing the particle beam onto an object is additionally or alternatively provided.

[0085] In yet another embodiment of the particle beam device according to the invention, or another particle beam device according to the invention, a beam generator is additionally or alternatively configured as a first beam generator and the particle beam is configured as a first particle beam comprising a first charged particle. An objective lens is configured as a first objective lens for focusing the first particle beam onto an object. Additionally, the particle beam device according to the invention, or another particle beam device according to the invention, includes at least one second beam generator for generating a second particle beam comprising a second charged particle. Furthermore, the particle beam device according to the invention, or another particle beam device according to the invention, includes at least one second objective lens for focusing the second particle beam onto an object. The second charged particle is, for example, an electron or an ion. Attached Figure Description

[0086] Further practical embodiments and advantages of the present invention are described below with reference to the accompanying drawings, in which:

[0087] Figure 1 A schematic diagram of a first embodiment of a particle beam device is shown;

[0088] Figure 2 A schematic diagram of a second embodiment of the particle beam device is shown;

[0089] Figure 3 A schematic diagram of a third embodiment of the particle beam device is shown;

[0090] Figure 4 A schematic diagram of an embodiment of the object stage of a particle beam device is shown;

[0091] Figure 5 It shows according to Figure 4 Another illustration of an embodiment of the object stage;

[0092] Figure 6 A schematic diagram of an embodiment of the method according to the present invention is shown;

[0093] Figure 7 A schematic diagram of another embodiment of the method according to the present invention is shown; and

[0094] Figure 8 A schematic diagram of an embodiment of another method according to the present invention is shown. Detailed Implementation

[0095] The invention will now be explained in more detail with the aid of particle beam apparatuses in the form of SEMs and combined apparatuses including electron beam columns and ion beam columns. It is explicitly stated that the invention can be used in any particle beam apparatus, particularly in any electron beam apparatus and / or any ion beam apparatus.

[0096] Figure 1 A schematic diagram of SEM 100 is shown. SEM 100 includes a first beam generator in the form of an electron source 101, which is implemented as a cathode. Additionally, SEM 100 is provided with an extraction electrode 102 and an anode 103, which is positioned at one end of a beam guide tube 104 of SEM 100. For example, the electron source 101 is implemented as a thermal field emitter. However, the invention is not limited to this electron source 101. Instead, any electron source can be used.

[0097] Electrons emitted from electron source 101 form a primary electron beam. The electrons are accelerated to the anode potential due to the potential difference between electron source 101 and anode 103. In the embodiment shown here, the anode potential relative to the ground potential of the sample chamber 120 is 100 V to 35 kV, for example 5 kV to 15 kV, particularly 8 kV. However, alternatively, the anode potential may also be at ground potential.

[0098] Two focusing lenses are arranged on the beam guide tube 104, specifically a first focusing lens 105 and a second focusing lens 106. When viewed from the direction of the first objective lens 107 starting from the electron source 101, in this case, the first focusing lens 105 is arranged in front, followed by the second focusing lens 106. It is explicitly stated that another embodiment of the SEM 100 may include only a single focusing lens. A first aperture unit 108 is arranged between the anode 103 and the first focusing lens 105. Together with the anode 103 and the beam guide tube 104, the first aperture unit 108 is at a high voltage potential (specifically the potential of the anode 103) or connected to ground. The first aperture unit 108 includes a plurality of first apertures 108A, in... Figure 1 One of these is shown. For example, there are two first apertures 108A. Each of the many first apertures 108A has a different aperture diameter. The desired first aperture 108A can be adjusted to the optical axis OA of the SEM 100 by means of an adjustment mechanism (not shown). It is explicitly mentioned that in another embodiment, the first aperture unit 108 may be provided with only a single aperture 108A. In this embodiment, the adjustment mechanism may not be provided. Thus, the first aperture unit 108 is stationary. A stationary second aperture unit 109 is arranged between the first condenser lens 105 and the second condenser lens 106. Alternatively, it is provided that the second aperture unit 109 is movable.

[0099] The first objective lens 107 includes pole shoes 110, in which boreholes are formed. A beam guide tube 104 is guided through the boreholes. Coils 111 are arranged in the pole shoes 110.

[0100] An electrostatic deceleration device is arranged in the lower region of the beam guide tube 104. The electrostatic deceleration device includes a single electrode 112 and a tubular electrode 113. The tubular electrode 113 is arranged at the end of the beam guide tube 104 facing the object 125, which is arranged on a holding device 114 for the object 125.

[0101] The tubular electrode 113, together with the beam guide tube 104, is at the potential of the anode 103, while the single electrode 112 and the object 125 are at a lower potential relative to the anode 103. In this case, this is the ground potential of the housing of the sample chamber 120. In this way, the electrons of the primary electron beam can be slowed down to the desired energy required to examine the object 125.

[0102] SEM 100 also includes a scanning device 115 by means of which a primary electron beam can be deflected and scanned on object 125. During this process, electrons from the primary electron beam interact with object 125. The interaction produces interacting particles, which are detected. Specifically, the interacting particles are electrons emitted from the surface of object 125 (so-called secondary electrons) or backscattered electrons from the primary electron beam (so-called backscattered electrons).

[0103] The object 125 and the single electrode 112 can also be at different potentials and at a potential different from ground. This allows for adjustment of the deceleration point of the primary electron beam relative to the object 125. For example, if deceleration occurs at a point very close to the object 125, the imaging aberrations become smaller.

[0104] A detector arrangement including a first detector 116 and a second detector 117 is arranged in the beam guide tube 104 for detecting secondary electrons and / or backscattered electrons. In this case, in the beam guide tube 104, the first detector 116 is arranged along the optical axis OA on the source side, while the second detector 117 is arranged along the optical axis OA on the object side. The first detector 116 and the second detector 117 are offset from each other along the direction of the optical axis OA of the SEM 100. Both the first detector 116 and the second detector 117 have corresponding through-holes through which the primary electron beam can pass. The first detector 116 and the second detector 117 are approximately at the potential of the anode 103 and the beam guide tube 104. The optical axis OA of the SEM 100 extends through the corresponding through-holes.

[0105] The second detector 117 is primarily used to detect secondary electrons. Upon exiting the object 125, the secondary electrons initially possess low kinetic energy and arbitrary direction of motion. They are accelerated towards the first objective lens 107 by a strong extraction field emanating from the tubular electrode 113. The secondary electrons enter the first objective lens 107 in a roughly parallel manner. The beam diameter of the secondary electron beam remains relatively small even within the first objective lens 107. The first objective lens 107 then exerts a strong influence on the secondary electrons and generates a relatively short focal point at a sufficiently steep angle relative to the optical axis OA, causing the secondary electrons to diverge significantly downstream of the focal point and incident on the effective region of the second detector 117. In contrast, the second detector 117 detects only a small fraction of the backscattered electrons at the object 125 (i.e., backscattered electrons with relatively high kinetic energy compared to the secondary electrons exiting the object 125). The high kinetic energy of the backscattered electrons upon exiting the object 125 and the angle relative to the optical axis OA result in the beam waist (i.e., the region of smallest diameter beam) of the backscattered electrons being located near the second detector 117. Most of the backscattered electrons pass through the opening in the second detector 117. Therefore, the first detector 116 is essentially used to detect the backscattered electrons.

[0106] In another embodiment of SEM 100, the first detector 116 may additionally be implemented with a reverse field grating 116A. The reverse field grating 116A is arranged on the side of the first detector 116 facing the object 125. The reverse field grating 116A has a negative potential relative to the potential of the beam guide tube 104, such that only high-energy backscattered electrons pass through the reverse field grating 116A to reach the first detector 116. Additionally or alternatively, the second detector 117 includes another reverse field grating having a similar embodiment to the aforementioned reverse field grating 116A of the first detector 116 and having similar functionality.

[0107] Additionally, in sample chamber 120, SEM 100 includes chamber detector 119, such as an Everhart-Thornley detector or ion detector, which has a detection surface coated with metal and blocking light.

[0108] The detection signals generated by the first detector 116, the second detector 117 and the chamber detector 119 are used to generate one or more images of the surface of the object 125.

[0109] The following facts are explicitly mentioned: the apertures of the first aperture unit 108 and the second aperture unit 109, as well as the passage openings of the first detector 116 and the second detector 117, are shown in an exaggerated manner. The passage openings of the first detector 116 and the second detector 117 have a range of 0.5 mm to 5 mm perpendicular to the optical axis OA. For example, the passage opening is circular and has a diameter in the range of 1 mm to 3 mm perpendicular to the optical axis OA.

[0110] In the embodiment shown here, the second aperture unit 109 is configured as a pinhole aperture and is provided with a second aperture 118 for the passage of a primary electron beam, the second aperture ranging from 5 µm to 500 µm, for example, 35 µm. Alternatively, in another embodiment, the second aperture unit 109 is provided with a plurality of apertures that can be mechanically displaced relative to the primary electron beam or can be directed to these apertures by using electrical and / or magnetic deflection elements. The second aperture unit 109 is implemented as a pressure stage aperture. This separates a first region from a second region, in which the electron source 101 is arranged and an ultra-high vacuum (10) is present. -7 hPa to 10 -12 hPa), this second region has a high vacuum (10 hPa), -3 hPa to 10 -7The second region is the intermediate pressure region of the bundle guide tube 104, which leads to the sample chamber 120.

[0111] Sample chamber 120 is under vacuum. A pump (not shown) is installed on sample chamber 120 to generate this vacuum. Figure 1 In the illustrated embodiment, the sample chamber 120 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 120 is vacuum-sealed to ensure these pressure ranges.

[0112] The holding device 114 is arranged on an object carrier in the form of an object stage 122. The object stage 122 is implemented to be movable in three directions perpendicular to each other, specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, the object stage 122 can rotate about two mutually perpendicular axes of rotation (the stage's rotation axes). The invention is not limited to the object stage 122 described above. Rather, the object stage 122 may have additional translational and rotational axes along or about which it can move. This will be discussed further in more detail below.

[0113] SEM 100 also includes a third detector 121 arranged in the sample chamber 120. More precisely, when viewed from the electron source 101 along the optical axis OA, the third detector 121 is positioned downstream of the object stage 122. The object stage 122, and therefore the holding device 114, can rotate so that a primary electron beam can radiate through the object 125 arranged on the holding device 114. As the primary electron beam passes through the object 125 to be examined, the electrons of the primary electron beam interact with the material of the object 125. The third detector 121 detects the electrons that have passed through the object 125 to be examined.

[0114] A radiation detector 500 for detecting interacting radiation (e.g., X-ray radiation and / or cathodoluminescence) is arranged on the sample chamber 120. Radiation detector 500, a first detector 116, a second detector 117, and a chamber detector 119 are connected to a control unit 123, which includes a processor 127 and a monitor 124. A third detector 121 is also connected to the control unit 123. (Not shown for clarity.) The control unit 123 processes the detection signals generated by the first detector 116, the second detector 117, the chamber detector 119, the third detector 121, and / or the radiation detector 500, and displays these detection signals as images on the monitor 124.

[0115] The control unit 123 also includes a database 126, in which data is stored and read from the database.

[0116] SEM 100 includes a gas feeding device 1000 having a gas feeding unit 1001 for feeding gas (e.g., a gaseous precursor substance) to a specific location on the surface of object 125. Additionally or alternatively, SEM 100 includes an object holder in the form of a manipulator device 1000A having a manipulator 1001A, in which case object 125 can be arranged on the manipulator 1001A. The gas feeding device 1000 and the manipulator device 1000A will be discussed in further detail below.

[0117] The first sensor unit 2000 of the sensor device is arranged in the sample chamber 120 of the SEM 100. For example, the first sensor unit 2000 is arranged to be stationary (i.e., immovable) in the sample chamber 120. Alternatively, the first sensor unit 2000 is arranged to be movable in the sample chamber 120. However, in this case, at least one position of the first sensor unit 2000 is determinable. The second sensor unit 2001 of the sensor device is arranged on the object stage 122. In addition to the foregoing embodiments or as alternatives, the second sensor unit 2001 is arranged, for example, on the gas feed unit 1001, on the manipulator 1001A, on another movable aperture unit 4000 arranged in the sample chamber 120, and / or on a movable detector (e.g., chamber detector 119) arranged in the sample chamber 120. For example, the second sensor unit 2001 is implemented as a metal strip. However, the invention is not limited thereto. Instead, any sensor unit suitable for the present invention can be used as the second sensor unit 2001. The second sensor unit 2001 cooperates with the first sensor unit 2000 without contact. In other words, the arrangement of the second sensor unit 2001 at one or more locations in the area of ​​the first sensor unit 2000 is identified, and the corresponding signal is forwarded to the control unit 123. For this purpose, the first sensor unit 2000 and / or the second sensor unit 2001 are connected in terms of signal transmission ( Figure 1 (Not shown in the image) to control unit 123. For example, the first sensor unit 2000 and the second sensor unit 2001 are implemented as inductive sensor units, capacitive sensor units and / or optical sensor units (e.g., in the form of a light shield).

[0118] according to Figure 1 The SEM 100 includes an optical camera 3000 arranged on a sample chamber 120. The function of the optical camera 3000 will be discussed in more detail below.

[0119] Figure 2 A particle beam apparatus in the form of a combined device 200 is shown. The combined device 200 includes two particle beam columns. First, as already shown... Figure 1 As shown, the combined apparatus 200 includes a SEM 100, but not a sample chamber 120. Instead, the SEM 100 is arranged in a sample chamber 201. Sample chamber 201 is under vacuum. To generate this vacuum, a pump (not shown) is arranged on sample chamber 201. Figure 2 In the illustrated embodiment, sample chamber 201 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 201 is vacuum-sealed to ensure these pressure ranges.

[0120] A chamber detector 119 is arranged in the sample chamber 201. This chamber detector is implemented, for example, as an Everhart-Thornley detector or an ion detector and includes a light-blocking, metal-coated detection surface. Additionally, a third detector 121 is arranged in the sample chamber 201.

[0121] SEM 100 is used to generate the first particle beam, specifically the primary electron beam as further described above, and has the optical axis mentioned above, which is in Figure 2 Reference numeral 709 is provided in the accompanying drawing and is hereinafter referred to as the first beam axis. Secondly, the combining device 200 is provided with an ion beam device 300, which is also arranged on the sample chamber 201. The ion beam device 300 also has an optical axis, which is located in… Figure 2 The figure is provided with reference numeral 710 and is referred to hereinafter as the second beam axis.

[0122] SEM 100 is arranged vertically relative to sample chamber 201. In contrast, ion beam equipment 300 is arranged at an angle of approximately 0° to 90° relative to SEM 100. Figure 2 An arrangement of approximately 50° is illustrated by way of example. The ion beam apparatus 300 includes a second beam generator in the form of an ion beam generator 301. The ion beam generator 301 generates ions that form a second particle beam in the form of an ion beam. These ions are accelerated by means of an extraction electrode 302 at a predefined potential. The second particle beam then passes through an ion optics unit of the ion beam apparatus 300, which includes a focusing lens 303 and a second objective lens 304. The second objective lens 304 ultimately generates an ion probe, which is focused onto an object 125 disposed on a holding device 114. The holding device 114 is disposed on an object stage 122.

[0123] Above the second objective lens 304 (i.e., in the direction of the ion beam generator 301), an adjustable or selectable aperture 306, a first electrode arrangement 307, and a second electrode arrangement 308 are arranged, wherein the first electrode arrangement 307 and the second electrode arrangement 308 are implemented as scanning electrodes. A second particle beam is scanned on the surface of the object 125 by means of the first electrode arrangement 307 and the second electrode arrangement 308, wherein the first electrode arrangement 307 operates along a first direction, and the second electrode arrangement 308 operates along a second direction opposite to the first direction. Thus, scanning is performed, for example, in the x-direction. Scanning in the y-direction, perpendicular to the x-direction, is achieved by additional electrodes (not shown) rotated 90° on the first electrode arrangement 307 and the second electrode arrangement 308.

[0124] As explained above, the holding device 114 is arranged on the object stage 122. Figure 2 In the illustrated embodiment, the object stage 122 is also configured to move in three directions perpendicular to each other, specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, the object stage 122 can rotate about two mutually perpendicular axes of rotation (the stage's rotation axes).

[0125] To better showcase the individual units of the combined device 200, Figure 2 The distances between the individual units of the combined device 200 shown in the image are presented in an exaggerated manner.

[0126] A radiation detector 500 for detecting interacting radiation (e.g., X-ray radiation and / or cathodoluminescence) is arranged on sample chamber 201. The radiation detector 500 is connected to a control unit 123, which includes a processor 127 and a monitor 124. The control unit 123 processes data generated by the first detector 116 (…). Figure 2 (Not shown in the text), second detector 117 ( Figure 2 The detector 124 displays the detection signals generated by the detector 119 (not shown), the third detector 121, and / or the radiation detector 500, and displays the detection signals as images on the monitor 124.

[0127] The control unit 123 also includes a database 126, in which data is stored and read from the database.

[0128] The combined device 200 includes a gas feeding device 1000 having a gas feeding unit 1001 for feeding gas (e.g., a gaseous precursor substance) to a specific location on the surface of the object 125. Additionally or alternatively, the combined device 200 includes an object holder in the form of a manipulator device 1000A having a manipulator 1001A, in which case the object 125 can be arranged on the manipulator 1001A. The gas feeding device 1000 and the manipulator device 1000A will be discussed in further detail below.

[0129] The first sensor unit 2000 of the sensor device is arranged in the sample chamber 201 of the combined device 200. For example, the first sensor unit 2000 is arranged to be stationary (i.e., immovable) in the sample chamber 201. Alternatively, the first sensor unit 2000 is arranged to be movable in the sample chamber 201. However, in this case, at least one position of the first sensor unit 2000 is determinable. The second sensor unit 2001 of the sensor device is arranged on the object stage 122. In addition to the foregoing embodiments or as alternatives, the second sensor unit 2001 is arranged, for example, on the gas feed unit 1001, on the manipulator 1001A, on another movable aperture unit 4000 arranged in the sample chamber 201, and / or on a movable detector (e.g., chamber detector 119) arranged in the sample chamber 201. For example, the second sensor unit 2001 is implemented as a metal strip. However, the invention is not limited thereto. Instead, any sensor unit suitable for the present invention can be used as the second sensor unit 2001. The second sensor unit 2001 cooperates with the first sensor unit 2000 without contact. In other words, the arrangement of the second sensor unit 2001 at one or more locations in the area of ​​the first sensor unit 2000 is identified, and the corresponding signal is forwarded to the control unit 123. For this purpose, the first sensor unit 2000 and / or the second sensor unit 2001 are connected in terms of signal transmission ( Figure 2 (Not shown in the image) to control unit 123. For example, the first sensor unit 2000 and the second sensor unit 2001 are implemented as inductive sensor units, capacitive sensor units and / or optical sensor units (e.g., in the form of a light shield).

[0130] according to Figure 3 The combined device 200 includes an optical camera 3000 arranged on a sample chamber 201. The function of the optical camera 3000 will be discussed in more detail below.

[0131] Figure 3This is a schematic diagram of another embodiment of a particle beam apparatus according to the present invention. This embodiment of the particle beam apparatus is provided with reference numeral 400 and includes a mirror corrector for correcting, for example, chromatic aberration and / or spherical aberration. The particle beam apparatus 400 includes a particle beam column 401, which is implemented as an electron beam column and substantially corresponds to the electron beam column of a corrected SEM. However, the particle beam apparatus 400 is not limited to an SEM with a mirror corrector. Rather, the particle beam apparatus 400 may include any type of corrector unit.

[0132] The particle beam column 401 includes a particle beam generator in the form of an electron source 402 (cathode), an extraction electrode 403, and an anode 404. For example, the electron source 402 is implemented as a thermal field emitter. Electrons emitted from the electron source 402 are accelerated to the anode 404 due to the potential difference between the electron source 402 and the anode 404. Accordingly, a particle beam in the form of an electron beam is formed along the first optical axis OA1.

[0133] After the particle beam is emitted from the electron source 402, the particle beam is guided along a beam path corresponding to the first optical axis OA1. The first electrostatic lens 405, the second electrostatic lens 406, and the third electrostatic lens 407 are used to guide the particle beam.

[0134] Furthermore, a beam guiding device is used to adjust the particle beam along the beam path. The beam guiding device in this embodiment includes a source adjustment unit having two magnetic deflection units 408 arranged along the first optical axis OA1. Additionally, the particle beam device 400 includes an electrostatic beam deflection unit. A first electrostatic beam deflection unit 409 (also implemented as a quadrupole in another embodiment) is arranged between the second electrostatic lens 406 and the third electrostatic lens 407. The first electrostatic beam deflection unit 409 is also arranged downstream of the magnetic deflection units 408. A first multipole unit 409A in the form of a first magnetic deflection unit is arranged on one side of the first electrostatic beam deflection unit 409. Furthermore, a second multipole unit 409B in the form of a second magnetic deflection unit is arranged on the other side of the first electrostatic beam deflection unit 409. The first electrostatic beam deflection unit 409, the first multipole unit 409A, and the second multipole unit 409B are adjusted for the purpose of adjusting the particle beam relative to the axis of the third electrostatic lens 407 and the entrance window of the beam deflection device 410. The first electrostatic beam deflection unit 409, the first multipole unit 409A, and the second multipole unit 409B can interact like a Wien filter. An additional magnetic deflection element 432 is arranged at the entrance of the beam deflection device 410.

[0135] A beam deflection device 410 is used as a particle beam deflector to deflect the particle beam in a specific manner. The beam deflection device 410 includes multiple magnetic sectors, specifically a first magnetic sector 411A, a second magnetic sector 411B, a third magnetic sector 411C, a fourth magnetic sector 411D, a fifth magnetic sector 411E, a sixth magnetic sector 411F, and a seventh magnetic sector 411G. The particle beam enters the beam deflection device 410 along a first optical axis OA1 and is deflected by the beam deflection device 410 towards a second optical axis OA2. The beam is deflected by angles from 30° to 120° by means of the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C. The second optical axis OA2 is oriented at the same angle relative to the first optical axis OA1. The beam deflection device 410 also precisely deflects the particle beam guided along the second optical axis OA2 towards a third optical axis OA3. The beam deflection is provided by the third magnetic sector 411C, the fourth magnetic sector 411D, and the fifth magnetic sector 411E. Figure 3 In the embodiments described herein, deflection relative to the second optical axis OA2 and relative to the third optical axis OA3 is provided by deflecting the particle beam by an angle of 90°. Therefore, the third optical axis OA3 extends coaxially relative to the first optical axis OA1. However, it should be noted that the particle beam device 400 according to the invention described herein is not limited to a deflection angle of 90°. Instead, the beam deflection device 410 can be selected at any suitable deflection angle, such as 70° or 110°, resulting in the first optical axis OA1 not extending coaxially relative to the third optical axis OA3. For further details regarding the beam deflection device 410, refer to WO 2002 / 067286 A2.

[0136] After the particle beam has been deflected by the first magnetic sector 411A, the second magnetic sector 411B, and the third magnetic sector 411C, the particle beam is guided along the second optical axis OA2. The particle beam is guided to the electrostatic mirror 414 and travels along the path to the electrostatic mirror 414 along the fourth electrostatic lens 415, the third multipole unit 416A in the form of a magnetic deflection unit, the second electrostatic beam deflection unit 416, the third electrostatic beam deflection unit 417, and the fourth multipole unit 416B in the form of a magnetic deflection unit. The electrostatic mirror 414 includes a first mirror electrode 413A, a second mirror electrode 413B, and a third mirror electrode 413C. Electrons of the particle beam reflected back at the electrostatic mirror 414 travel again along the second optical axis OA2 and re-enter the beam deflection device 410. These electrons are then deflected by the third magnetic sector 411C, the fourth magnetic sector 411D, and the fifth magnetic sector 411E to the third optical axis OA3.

[0137] Electrons from the particle beam exit the beam deflection device 410 and are guided along the third optical axis OA3 to the object 425 to be inspected and arranged in the holding device 114. Along the path to the object 425, the particle beam is guided to the fifth electrostatic lens 418, the beam guide tube 420, the fifth multipole unit 418A, the sixth multipole unit 418B, and the objective lens 421. The fifth electrostatic lens 418 is an electrostatic immersion lens. Through the fifth electrostatic lens 418, the particle beam is decelerated or accelerated to the potential of the beam guide tube 420.

[0138] Using objective lens 421, the particle beam is focused onto the focal plane on which object 425 is positioned. Holding device 114 is arranged on movable object stage 424. Movable object stage 424 is arranged in sample chamber 426 of particle beam apparatus 400. Object stage 424 is configured to move in three mutually perpendicular directions, specifically in the x-direction (first stage axis), y-direction (second stage axis), and z-direction (third stage axis). Furthermore, object stage 424 can rotate about two mutually perpendicular rotation axes (stage rotation axes). This will be discussed in more detail below.

[0139] Sample chamber 426 is under vacuum. A pump (not shown) is installed on sample chamber 426 to generate this vacuum. Figure 3 In the illustrated embodiment, sample chamber 426 operates within a first pressure range or a second pressure range. The first pressure range includes only pressures less than or equal to 10. -3 The pressure is hPa, and the second pressure range only includes pressures greater than 10. -3 The pressure is hPa. Sample chamber 426 is vacuum-sealed to ensure these pressure ranges.

[0140] Objective lens 421 can be implemented as a combination of magnetic lens 422 and sixth electrostatic lens 423. The end of beam guide tube 420 can also be an electrode of the electrostatic lens. After exiting beam guide tube 420, the particles in the particle beam device are decelerated to the potential of object 425. Objective lens 421 is not limited to the combination of magnetic lens 422 and sixth electrostatic lens 423. Rather, objective lens 421 can take any suitable form. For example, objective lens 421 can also be implemented as a purely magnetic lens or a purely electrostatic lens.

[0141] The particle beam focused onto object 425 interacts with object 425, generating interacting particles. Specifically, secondary electrons are emitted from object 425, or backscattered electrons are emitted from object 425. These secondary or backscattered electrons are also accelerated and guided along the third optical axis OA3 into the beam guide tube 420. In particular, the trajectories of the secondary and backscattered electrons travel in the opposite direction to the particle beam's path.

[0142] The particle beam apparatus 400 includes a first analytical detector 419 arranged along the beam path between the beam deflection device 410 and the objective lens 421. Secondary electrons traveling in a direction oriented at a large angle relative to the third optical axis OA3 are detected by the first analytical detector 419. Backscattered electrons and secondary electrons at a small axial distance relative to the third optical axis OA3 at the site of the first analytical detector 419 (i.e., backscattered electrons and secondary electrons at a short distance from the third optical axis OA3 at the site of the first analytical detector 419) enter the beam deflection device 410 and are deflected along the detection beam path 427 by the fifth magnetic sector 411E, the sixth magnetic sector 411F, and the seventh magnetic sector 411G to the second analytical detector 428. For example, the deflection angle is 90° or 110°.

[0143] The first analysis detector 419 generates a detection signal primarily composed of emitted secondary electrons. This detection signal is directed to the control unit 123 and used to obtain information about the characteristics of the interaction region between the focused particle beam and the object 425. Specifically, the focused particle beam is scanned across the object 425 using a scanning device 429. Using the detection signal generated by the first analysis detector 419, an image of the scanned area of ​​the object 425 can then be generated and displayed on a presentation unit. The presentation unit is, for example, a monitor 124 arranged on the control unit 123.

[0144] The second analysis detector 428 is also connected to the control unit 123. Detection signals from the second analysis detector 428 are directed to the control unit 123 and used to generate an image of the scanned area of ​​the object 425 and display the image on the presentation unit. The presentation unit is, for example, a monitor 124 arranged on the control unit 123.

[0145] A radiation detector 500 for detecting interacting radiation (e.g., X-ray radiation and / or cathodoluminescence) is arranged on sample chamber 426. The radiation detector 500 is connected to a control unit 123, which includes a processor 127 and a monitor 124. The control unit 123 processes the detection signals from the radiation detector 500 and displays these detection signals as images on the monitor 124.

[0146] The control unit 123 also includes a database 126, in which data is stored and read from the database.

[0147] The particle beam apparatus 400 includes a gas feeding device 1000 having a gas feeding unit 1001 for delivering gas (e.g., a gaseous precursor substance) to a specific location on the surface of an object 425. Additionally or alternatively, the particle beam apparatus 400 includes an object holder in the form of a manipulator device 1000A having a manipulator 1001A, in which case the object 425 can be arranged on the manipulator 1001A. The gas feeding device 1000 and the manipulator device 1000A will be discussed in further detail below.

[0148] A first sensor unit 2000 of the sensor device is arranged in the sample chamber 426 of the particle beam apparatus 400. For example, the first sensor unit 2000 is arranged to be stationary (i.e., immovable) in the sample chamber 426. Alternatively, the first sensor unit 2000 is arranged to be movable in the sample chamber 426. However, in this case, at least one position of the first sensor unit 2000 is determinable. A second sensor unit 2001 of the sensor device is arranged on the object stage 424. In addition to the foregoing embodiments or as alternatives, the second sensor unit 2001 is arranged, for example, on the gas feed unit 1001, on the manipulator 1001A, on another movable aperture unit 4000 arranged in the sample chamber 426, and / or on a movable detector (e.g., radiation detector 500) arranged in the sample chamber 426. For example, the second sensor unit 2001 is implemented as a metal strip. However, the invention is not limited thereto. Instead, any sensor unit suitable for the present invention can be used as the second sensor unit 2001. The second sensor unit 2001 cooperates with the first sensor unit 2000 without contact. In other words, the arrangement of the second sensor unit 2001 at one or more locations in the area of ​​the first sensor unit 2000 is identified, and the corresponding signal is forwarded to the control unit 123. For this purpose, the first sensor unit 2000 and / or the second sensor unit 2001 are connected in terms of signal transmission ( Figure 3 (Not shown in the image) to control unit 123. For example, the first sensor unit 2000 and the second sensor unit 2001 are implemented as inductive sensor units, capacitive sensor units and / or optical sensor units (e.g., in the form of a light shield).

[0149] according to Figure 4 The particle beam apparatus 400 includes an optical camera 3000 arranged on a sample chamber 426. The function of the optical camera 3000 will be discussed in more detail below.

[0150] The SEM 100, the combining device 200, and the particle beam device 400 include multiple movable components that can be moved by means of a moving device. This will be discussed in more detail below.

[0151] As explained above, SEM 100 and combined device 200 include a holding device 114 for holding object 125. The holding device 114 is arranged on a movable component in the form of object stage 122. Particle beam device 400 also includes a holding device 114 for holding object 425. The holding device 114 of particle beam device 400 is arranged on a movable component in the form of movable object stage 424. Object stages 122 and 424, and their moving devices, will be discussed in more detail below.

[0152] The object platforms 122 and 424 are implemented as movable object platforms, which are in Figure 5 and Figure 4 The following is illustrated schematically. It is noted that the invention is not limited to the object stages 122, 424 described herein. Rather, the invention can include any movable object stage suitable for the invention. A holding device 114 is arranged on the object stages 122, 424. The object stages 122, 424 include moving elements of a moving device that ensures that the movement of the object stages 122, 424 allows the region of interest on the objects 125, 425 to be examined, for example, by means of a particle beam. Figure 5 and Figure 5 The moving element is illustrated in the diagram and explained below.

[0153] The object stages 122, 424 include, for example, a first moving element 600 arranged on a housing 601 of a sample chamber 120, 201, or 426, in which the object stages 122, 424 are subsequently arranged. The first moving element 600 enables movement of the object stages 122, 424 along the z-axis (the axis of the third stage). Furthermore, a second moving element 602 is provided. The second moving element 602 enables rotation of the object stages 122, 424 about a first axis of rotation 603 (also referred to as the tilt axis) of the stage. This second moving element 602 is used to tilt the objects 125, 425 about the first axis of rotation 603 of the stage, wherein the objects 125, 425 are arranged on a holding device 114.

[0154] A third moving element 604 is arranged at the second moving element 602. This third moving element is implemented as a guide for the slider and ensures that the object platforms 122 and 424 can move in the x-direction (the axis of the first platform). The aforementioned slider is another moving element, specifically a fourth moving element 605. The fourth moving element 605 is implemented to allow the object platforms 122 and 424 to move in the y-direction (the axis of the second platform). For this purpose, the fourth moving element 605 includes a guide in which another slider is guided, and the holding device 114 is then arranged on this other slider.

[0155] The holding device 114 is further configured to have a fifth moving element 606, which enables the holding device 114 to rotate about a second rotation axis 607 of the stage. The second rotation axis 607 of the stage is oriented perpendicular to the first rotation axis 603 of the stage.

[0156] Due to the above arrangement, the object stages 122, 424 of the embodiments discussed herein have the following kinematic chain: first moving element 600 (moving along the z-axis) - second moving element 602 (rotating about the first rotation axis 603 of the stage) - third moving element 604 (moving along the x-axis) - fourth moving element 605 (moving along the y-axis) - fifth moving element 606 (rotating about the second rotation axis 607 of the stage). Additional or alternative kinematic chains may also be implemented.

[0157] In another embodiment (not shown), additional moving elements are arranged on the object stage 122, 424, making movement along an additional translation axis and / or about an additional rotation axis possible.

[0158] from Figure 5 As is evident, each of the aforementioned moving elements is connected to a drive unit in the form of motors M1 to M5. In this respect, the first moving element 600 is connected to the first drive unit M1 and is driven by the driving force provided by the first drive unit M1. The second moving element 602 is connected to the second drive unit M2, which drives the second moving element 602. The third moving element 604 is connected to the third drive unit M3. The third drive unit M3 provides the driving force for driving the third moving element 604. The fourth moving element 605 is connected to the fourth drive unit M4, whereby the fourth drive unit M4 drives the fourth moving element 605. Furthermore, the fifth moving element 606 is connected to the fifth drive unit M5. The fifth drive unit M5 provides the driving force for driving the fifth moving element 606.

[0159] The aforementioned drive units M1 to M5 can be implemented as, for example, stepper motors, and are controlled by the drive control unit 608, with each drive unit supplied with power current by the drive control unit 608 (see [link]).Figures 1 to 3 It is explicitly stated that the invention is not limited to movement by means of a stepper motor. Rather, any drive unit (e.g., a brushless motor) can be used as the drive unit.

[0160] As explained above, the SEM 100, the combination device 200, and the particle beam device 400 include a gas feeding device 1000 with a gas feeding unit 1001 for delivering gas (e.g., gaseous precursor material) to a specific location on the surface of objects 125, 425. The gas feeding unit 1001 is also a movable component that can be moved by means of a moving device. Figures 1 to 3 The gas feeding device 1000 includes a first moving unit 1002, a second moving unit 1003, and a third moving unit 1004. For example, the first moving unit 1002, the second moving unit 1003, and the third moving unit 1004 are implemented as stepper motors. Since the first moving unit 1002, the second moving unit 1003, and the third moving unit 1004 are configured to move in three directions perpendicular to each other, specifically by means of the first moving unit 1002 in the x-direction, by means of the second moving unit 1003 in the y-direction, and by means of the third moving unit 1004 in the z-direction. Furthermore, the gas feeding unit 1001 can, for example, rotate about two rotation axes perpendicular to each other. Figures 1 to 3 (Not shown in the text).

[0161] As explained above, the SEM 100, the combination device 200, and the particle beam device 400 additionally or alternatively include an object holder in the form of a manipulator device 1000A having a manipulator 1001A. Objects 125 and 425 can be arranged on the manipulator 1001A. The manipulator 1001A is also a movable component that can be moved by means of a moving device. Figures 1 to 3 The manipulator device 1000A includes a first moving unit 1002A, a second moving unit 1003A, and a third moving unit 1004A. For example, the first moving unit 1002A, the second moving unit 1003A, and the third moving unit 1004A are implemented as stepper motors. Since the first moving unit 1002A, the second moving unit 1003A, and the third moving unit 1004A are present, the manipulator 1001A is implemented to be movable in three directions perpendicular to each other, specifically moving in the x-direction by means of the first moving unit 1002A, in the y-direction by means of the second moving unit 1003A, and in the z-direction by means of the third moving unit 1004A. Furthermore, the manipulator 1001A can, for example, rotate about two rotation axes perpendicular to each other. Figure 1 (Not shown in the text).

[0162] As explained above, the SEM 100, the combining device 200, and the particle beam device 400 additionally or alternatively include another aperture unit 4000. This other aperture unit 4000 is also a movable component that can be moved by means of a moving device. For example, the other aperture unit 4000 is moved by a first aperture moving unit (not shown), a second aperture moving unit (not shown), and a third aperture moving unit (not shown), which are particularly similar to the moving unit implementations further explained above. For example, the first, second, and third aperture moving units are implemented as stepper motors. Due to the first, second, and third aperture moving units, the other aperture unit 4000 is implemented to be movable in three directions arranged perpendicular to each other: specifically, it moves in the x-direction by means of the first aperture moving unit, in the y-direction by means of the second aperture moving unit, and in the z-direction by means of the third aperture moving unit. In addition, another aperture unit 4000 can rotate, for example, around two rotation axes that are perpendicular to each other.

[0163] As explained above, the SEM 100, the combination device 200, and the particle beam device 400 additionally or alternatively include a movable detector. For example, the movable detector is implemented as a chamber detector 119 or a radiation detector 500. The movable detector can be moved by means of a moving device. For example, the movable detector is moved by a first detector moving unit (not shown), a second detector moving unit (not shown), and a third detector moving unit (not shown), which are particularly similar to the moving units further explained above. For example, the first, second, and third detector moving units are implemented as stepper motors. Due to the first, second, and third detector moving units, another detector unit is implemented to be movable in three directions perpendicular to each other, specifically by means of the first detector moving unit in the x-direction, by means of the second detector moving unit in the y-direction, and by means of the third detector moving unit in the z-direction. Furthermore, the movable detector can, for example, rotate about two mutually perpendicular axes of rotation.

[0164] Embodiments of the method according to the present invention will be discussed below. This will be based on... Figure 6The following explanation of the method according to the invention is based on SEM 100 and is explained by way of example. The following explanation of SEM 100, with necessary modifications, applies to embodiments of the method according to the invention relating to the combination device 200 and / or particle beam device 400. Furthermore, embodiments of the method according to the invention will be explained based on the movement of components in the form of object stage 122. The following explanation of object stage 122, with necessary modifications, applies to the movement of components in the form of gas feed unit 1001, manipulator 1001A, object stage 424, movable detectors 119, 500, and / or another movable aperture unit 4000.

[0165] Figure 7 A first embodiment of the method according to the invention is shown. Method step S1 involves moving the object stage 122 along a first movement path by means of a moving device as further explained above. In other words, the moving device is used to move the object stage 122 within the sample chamber 120 along a predefined first path in the form of the first movement path. In this case, the object stage 122 moves a first predefined distance within the sample chamber 120.

[0166] Method step S2 involves using (i) a first sensor unit 2000, (ii) a second sensor unit 2001 arranged on the object stage 122, and (iii) a control unit 123 of the SEM 100 to determine a first position of the object stage 122 relative to the first sensor unit 2000. In other words, non-contact cooperation between the first sensor unit 2000 and the second sensor unit 2001 causes the generation of a signal indicating that the first sensor unit 2000 has detected the second sensor unit 2001 and / or the second sensor unit 2001 has detected the first sensor unit 2000. This signal is forwarded to the control unit 123 of the SEM 100. The control unit 123 then determines the position of the object stage 122 relative to the first sensor unit 2000. In other words, the control unit 123 then determines the position of the object stage 122 relative to the first sensor unit 2000. The determined position is the first position. The aforementioned process of determining the first position of the object stage 122 relative to the first sensor unit 2000 occurs during the movement of the object stage 122 along a first movement path. For example, during the movement of the object stage 122 along the first moving path, the first sensor unit 2000 cooperates with the second sensor unit 2001 at a first time point. The position of the object stage 122 relative to the first sensor unit 2000 at the first time point is determined as the first position.

[0167] Furthermore, method step S3 involves using control unit 123 to define a first position as the initial position for the orientation and / or positioning of object stage 122 in sample chamber 120. In other words, initialization and thus the determination of a zero point in the form of an initial position are performed in method step S3. The initial position is a first position of object stage 122, i.e., the position of object stage 122 when first sensor unit 2000 detects second sensor unit 2001 and / or when second sensor unit 2001 detects first sensor unit 2000. The initial position is then used for the orientation and / or positioning of object stage 122 in sample chamber 120. In other words, this involves determining and / or controlling the orientation and / or positioning of object stage 122 relative to the initial position.

[0168] Once the initial position has been determined, method step S4 essentially involves orienting and / or positioning the object stage 122 relative to the initial position. Method step S4 involves predefining a second position of the object stage 122 relative to the initial position using the control unit 123. Furthermore, this method step involves moving the object stage 122 along a second movement path to the second position of the object stage 122 by means of a moving device of the object stage. In other words, the second position is predefined relative to a zero point in the form of the initial position. Then, using the moving device of the object stage, the object stage 122 is moved within the sample chamber 120 along a predefined second path in the form of the second movement path to the second position. In this case, the object stage 122 moves a predefined second distance within the sample chamber 120. At the second position, the object 125 can be imaged, analyzed, and / or processed, for example, by means of a single electron beam from the SEM 100. As explained above, the moving device of the object stage 122 includes drive units M1 to M5 in the form of stepper motors. The stepper motors include pedometers. Based on the steps covered, the object platform 122 can be positioned in a second location and oriented.

[0169] If errors then occur, for example due to mechanical inaccuracies and / or malfunctions (e.g., wear in the gear mechanism of drive units M1 to M5), it is indeed possible that the orientation and / or position of the object stage 122 cannot be correctly determined and / or controlled. To determine these errors, method step S5 of this embodiment of the method according to the invention involves moving the object stage 122 along a third movement path by means of a moving device of the object stage. In other words, using the moving device of the object stage, the object stage 122 is moved within the sample chamber 120 along a predefined third path in the form of a third movement path. In this case, the object stage 122 moves a third predefined distance within the sample chamber 120. Method step S6 then involves using (i) a first sensor unit 2000, (ii) a second sensor unit 2001, and (iii) a control unit 123 to determine a third position of the object stage 122 relative to the first sensor unit 2000. In other words, the non-contact collaboration between the first sensor unit 2000 and the second sensor unit 2001 generates another signal indicating that the first sensor unit 2000 has detected the second sensor unit 2001 and / or the second sensor unit 2001 has detected the first sensor unit 2000. This other signal is forwarded to the control unit 123 of the SEM 100. The control unit 123 then determines the position of the object stage 122 relative to the first sensor unit 2000. In other words, the control unit 123 then determines the position of the object stage 122 relative to the first sensor unit 2000.

[0170] The determined position is the third position. The aforementioned process of determining the third position of the object stage 122 relative to the first sensor unit 2000 occurs during the movement of the object stage 122 along the third movement path. For example, during the movement of the object stage 122 along the third movement path, the first sensor unit 2000 cooperates with the second sensor unit 2001 at a second time point. The position of the object stage 122 relative to the first sensor unit 2000 at the second time point is determined as the third position.

[0171] Method step S7 then involves using control unit 123 to define a third position as the initial position for the orientation and / or positioning of the object stage 122 in the sample chamber 120. In other words, re-initialization and therefore re-determination of the zero point in the form of the initial position are performed in the above method steps. The initial position is the third position of the object stage 122, that is, the position of the object stage 122 when the first sensor unit 2000 detects the second sensor unit 2001 and / or when the second sensor unit 2001 detects the first sensor unit 2000 during the movement of the object stage 122 along the third movement path. The initial position can then be used for further orientation and / or positioning of the object stage 122 in the sample chamber 120. For example, if the third position is different from the first position, the third position is defined by control unit 123 as the initial position for the orientation and / or positioning of the object stage 122 in the sample chamber 120. Therefore, this embodiment of the method according to the invention sets the initial position to be redefined only when the third position (in which the first sensor unit 2000 and the second sensor unit 2001 cooperate without contact) does not correspond to the first position (in which the first sensor unit 2000 also cooperates without contact with the second sensor unit 2001). In other words, the initial position is redefined only when the third position is different from the first position. In addition to defining the third position as the initial position for the orientation and / or positioning of the object stage 122, or as an alternative, method step S7 sets the method to notify the user using the control unit 123.

[0172] Then, the orientation and / or positioning of the object stage 122 relative to the redefined initial position can be determined and / or controlled. For example, in accordance with Figure 8 In another embodiment of the method according to the invention, method step S8 is performed after method step S7. Method step S8 involves using control unit 123 to predefine a fourth position of stage 122 relative to the now newly fixed initial position, and moving stage 122 along a fourth movement path to the fourth position of stage 122 by means of a moving device of the stage. In other words, the fourth position is predefined relative to a zero point presented in the form of the newly fixed initial position. Then, using the moving device of the stage, stage 122 is moved within sample chamber 120 along a predefined fourth path in the form of the fourth movement path to the fourth position. In this case, stage 122 moves a predefined fourth distance within sample chamber 120.

[0173] In another embodiment of the method according to the invention, the first, second, third, and / or fourth positions are additionally or alternatively provided to each have three coordinates. For example, the three coordinates are Cartesian coordinates in three-dimensional space. In particular, the initial position is the center of the Cartesian coordinate system. Alternatively, the first, second, third, and / or fourth positions are given by spherical coordinates of a spherical coordinate system. In this case, the initial position is the center of the spherical coordinate system.

[0174] In one embodiment of the method according to the invention, the movement of the object stage 122 along the third movement path is additionally or alternatively arranged to occur at a predefined movement time. As further explained above, the third position of the object stage 122 relative to the first sensor unit 2000 is determined during the movement of the object stage 122 along the third movement path. For example, the predefined movement time is predefined by the user of the SEM 100, the control unit 123, and / or by a control signal initiated by the random number generator of the processor 127 of the control unit 123. In other words, the movement of the object stage 122 along the third movement path can be initiated, and thus the third position is also determined and defined as the initial position. This occurs, for example, whenever the user and / or the control unit 123 deems it necessary or advantageous. Additionally or alternatively, the initiation can also be random. In other words, given a predefined target position, the movement path of the object stage 122 is modified to cause the first sensor unit 2000 and the second sensor unit 2001 to cooperate. Basically, the initial position can always be determined whenever the first sensor unit 2000 and the second sensor unit 2001 cooperate randomly with the selected movement path.

[0175] In another embodiment of the method according to the invention, additionally or alternatively, the object platform 122 is arranged to move at a first speed while moving along the first moving path. Furthermore, the object platform 122 moves at a second speed while moving along the third moving path. In this case, either the first speed is higher than the second speed, or the first speed is lower than the second speed.

[0176] An embodiment of the method according to the present invention provides a method for determining the initial position of a movable component (e.g., in the form of an object stage 122), such that the orientation and / or positioning of the movable component relative to the initial position can be determined and / or controlled particularly well. Errors in the orientation and / or positioning of the movable component are reduced or avoided due to the redetering of the initial position and the multiple repeatable redetering processes, because errors arising from mechanical inaccuracies and / or malfunctions (e.g., wear in the gear mechanism of a stepper motor) are simultaneously taken into account, for example, by redetermining the initial position. Therefore, the orientation and / or position of the component can be determined and / or controlled particularly well. Similarly, periodic detection of the initial position and comparison with previous initial positions can be used to identify minor deviations before the user notices a malfunction.

[0177] Figure 7 Another method according to the invention is shown. Method step S1A involves using the control unit 123 of the SEM 100 to determine a first position of a mark arranged on the object stage 122 as an initial position of the object stage 122 for orientation and / or positioning of the object stage 122 in the sample chamber 120. For example, determining the first position of the mark arranged on the object stage 122 is performed by recording an optical image of the mark arranged on the object stage 122 using an optical camera 3000.

[0178] In another method according to the invention, method step S2A involves moving the object stage 122 along a movement path by means of a moving device of the object stage. In other words, the moving device is used to move the object stage 122 within the sample chamber 120 along a predefined path in the form of a movement path. In this case, the object stage 122 moves a predefined distance within the sample chamber 120. In another method according to the invention, method step S3A then involves using a control unit 123 to calculate a second position of a mark arranged on the object stage 122 during and / or after the object stage 122 is moved along the movement path. In other words, the control unit 123 calculates the position of the mark arranged on the object stage 122 at a specific point in time during and / or after the object stage 122 is moved along the movement path. This is the second position.

[0179] In another method according to the invention, method step S4A involves recording an optical image of the marks arranged on the object stage 122 by means of an optical camera 3000 at a specific time point during and / or after the object stage 122 is moved along the moving path. In method step S5A, the control unit 123 then compares whether the calculated second position of the marks arranged on the object stage 122 corresponds to the position occupied by the marks arranged on the object stage 122 in the optical image. If the calculated second position of the marks arranged on the object stage 122 is different from the position occupied by the marks arranged on the object stage 122 in the optical image, then method step S6A involves determining, by means of the control unit 123, the position occupied by the marks arranged on the object stage 122 in the optical image as the initial position of the object stage 122 for orientation and / or positioning of the object stage 122 in the sample chamber 120. In other words, initialization and thus the determination of the zero point in the form of an initial position are performed in the above method steps. The initial position is the location occupied in the optical image by a mark arranged on the object stage 122. This initial position is then used for the orientation and / or positioning of the object stage 122 in the sample chamber 120. In other words, this involves determining and / or controlling the orientation and / or positioning of the object stage 122 relative to the initial position.

[0180] Another method according to the invention also provides a method for determining the initial position of a movable component (e.g., in the form of an object stage 122), such that the orientation and / or positioning of the movable component relative to the initial position can be determined and / or controlled particularly well. Errors in the orientation and / or positioning of the movable component are reduced or avoided due to the redetering of the initial position and the multiple repeatable redetering processes, because errors arising from mechanical inaccuracies and / or malfunctions (e.g., wear in the gear mechanism of a stepper motor) are simultaneously taken into account, for example, by redetermining the initial position. Therefore, the orientation and / or position of the component can be correctly determined and / or controlled.

[0181] Figure 8 and Figure 8 The embodiments described can also be combined with each other so that they are implemented sequentially. For example, according to Figure 7 This method is used to identify coarse faults that cause errors, for example, within a few µm range. If this type of fault has been identified, then according to... ​ The method can be used to identify faults that, for example, cause errors of less than 1 µm.

[0182] All embodiments of the method according to the invention described above and below are not limited to the order of the method steps explained. The invention also includes different orders of method steps suitable for solving problems within the scope of the invention. Alternatively or additionally, in the method according to the invention, at least two method steps are also provided to be performed in parallel. Furthermore, the foregoing and following embodiments of the method according to the invention are not limited to the full scope of the method steps described above or below. Specifically, in other embodiments, one or more of the above or below method steps are omitted.

[0183] The features of the invention disclosed in this specification, drawings, and claims may be essential for implementing the invention in various embodiments, either individually or in any desired combination. The invention is not limited to the described embodiments. Variations are possible within the scope of the claims and taking into account the knowledge of those skilled in the art.

[0184] * * * * *

[0185] List of reference numerals

[0186] 100SEM

[0187] 101 Electronic Source

[0188] 102 lead-out electrode

[0189] 103 anode

[0190] 104 bundles of guide tubes

[0191] 105 First Converging Lens

[0192] 106 Second Converging Lens

[0193] 107 First Objective

[0194] 108 First Aperture Unit

[0195] 108A First Aperture

[0196] 109 Second Aperture Unit

[0197] 110 Extreme Boots

[0198] 111 coil

[0199] 112 single electrode

[0200] 113 tubular electrode

[0201] 114 Holding Device

[0202] 115 scanning device

[0203] 116 First Detector

[0204] 116A Opposite Field Grating

[0205] 117 Second Detector

[0206] 118 Second Aperture

[0207] Detector in Room 119

[0208] 120 Sample Room

[0209] 121 Third Detector

[0210] 122 object stage

[0211] 123 Control Unit

[0212] 124 Monitor

[0213] 125 objects

[0214] 126 Database

[0215] 127 processor

[0216] 200 combination equipment

[0217] Sample Room 201

[0218] 300 Ion Beam Equipment

[0219] 301 Ion Beam Generator

[0220] Extraction electrodes in 302 ion beam equipment

[0221] 303 Converging Lens

[0222] 304 Second Objective

[0223] 306 Adjustable or Selectable Aperture

[0224] 307 First Electrode Arrangement

[0225] 308 Second Electrode Arrangement

[0226] 400 Particle beam devices with corrector units

[0227] 401 particle beam column

[0228] 402 Electronic Source

[0229] 403 lead-out electrode

[0230] 404 anode

[0231] 405 First Electrostatic Lens

[0232] 406 Second Electrostatic Lens

[0233] 407 Third Electrostatic Lens

[0234] 408 magnetic deflection unit

[0235] 409 First Electrostatic Beam Deflection Unit

[0236] 409A First Multipole Unit

[0237] 409B Second Multipole Unit

[0238] 410 beam deflection device

[0239] 411A First Magnetic Sector

[0240] 411B Second Sector

[0241] 411C Third Sector

[0242] 411D Fourth Magnetic Sector

[0243] 411E Fifth Sector

[0244] 411F Sixth Magnetic Sector

[0245] 411G Seventh Sector

[0246] 413A First Reflector Electrode

[0247] 413B Second Reflector Electrode

[0248] 413C Third Reflector Electrode

[0249] 414 electrostatic reflector

[0250] 415 Fourth Electrostatic Lens

[0251] 416 Second Electrostatic Beam Deflection Unit

[0252] 416A Third Multipole Unit

[0253] 416B Fourth Multipole Unit

[0254] 417 Third Electrostatic Beam Deflection Unit

[0255] 418 Fifth Electrostatic Lens

[0256] 418A Fifth Multipole Unit

[0257] 418B Sixth Multipole Unit

[0258] 419 First Analytical Detector

[0259] 420 bundle guide tubes

[0260] 421 Objective Lens

[0261] 422 Magnetic Lens

[0262] 423 Sixth Electrostatic Lens

[0263] 424 object stage

[0264] 425 objects

[0265] Sample Room 426

[0266] 427 Detection Beam Path

[0267] 428 Second Analysis Detector

[0268] 429 Scanning Device

[0269] 432 Other magnetic deflection elements

[0270] 500 radiation detector

[0271] 600 First Moving Component

[0272] 601 housing

[0273] 602 Second Moving Element

[0274] The first rotation axis of the 603 stage

[0275] 604 Third Moving Element

[0276] 605 Fourth Moving Element

[0277] 606 Fifth Moving Element

[0278] The second rotation axis of the 607 stage

[0279] 608 drive control unit

[0280] 709 First Axis

[0281] 710 Second Beam Axis

[0282] 1000 gas feeder

[0283] 1000A control device

[0284] 1001 Gas Feeding Unit

[0285] 1001A controller

[0286] The first moving unit of the 1002 gas feeding device

[0287] The first moving unit of the 1002A manipulator device

[0288] The second moving unit of the 1003 gas feeding device

[0289] The second moving unit of the 1003A manipulator device

[0290] The third moving unit of the 1004 gas feeding device

[0291] The third moving unit of the 1004A manipulator device

[0292] 2000 First Sensor Unit

[0293] 2001 Second Sensor Unit

[0294] 3000 optical camera

[0295] 4000 Another movable aperture unit

[0296] M1 is the first drive unit in the form of an electric motor.

[0297] M2 is a second drive unit in the form of a motor.

[0298] M3 is a third drive unit in the form of an electric motor.

[0299] M4 is the fourth drive unit in the form of an electric motor.

[0300] M5 is the fifth drive unit in the form of an electric motor.

[0301] OA optical axis

[0302] OA1 First Optical Axis

[0303] OA2 Second Optical Axis

[0304] OA3 Third Optical Axis

[0305] S1 to S8 Method Steps

[0306] S1A to S6A Method Steps

Claims

1. A method for determining an initial position of a movable component (119, 500, 122, 424, 1001, 1001A, 4000) relative to a first sensor unit (2000), wherein, The assembly (119, 500, 122, 424, 1001, 1001A, 4000) and the first sensor unit (2000) are arranged in a sample chamber (120, 201, 426) of a particle beam device (100, 200, 400) for imaging, analyzing and / or processing an object (125, 425), wherein the method comprises the following method steps: - moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along a first movement path by means of a movement apparatus (600, 602, 604 to 606, M1 to M5) of the particle beam device (100, 200, 400); - determining a first position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) using (i) the first sensor unit (2000), (ii) a second sensor unit (2001) arranged on the assembly (119, 500, 122, 424, 1001, 1001A, 4000) and cooperating contactlessly with the first sensor unit (2000), and (iii) a control unit (123) of the particle beam device (100, 200, 400), wherein the first position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) is determined during the movement of the assembly (119, 122, 424, 1001, 1001A, 4000) along the first movement path; - defining the first position as an initial position of an orientation and / or a positioning of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) in the sample chamber (120, 201, 426) using the control unit (123); - predefining a second position of the assembly (119, 122, 424, 1001, 1001A, 4000) relative to the initial position using the control unit (123) and moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) to the second position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along a second movement path by means of the movement apparatus (600, 602, 604 to 606, M1 to M5); - moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along a third movement path by means of the movement apparatus (600, 602, 604 to 606, M1 to M5); - determining, using (i) the first sensor unit (2000), (ii) the second sensor unit (2001), and (iii) the control unit (123), a third position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000), wherein the third position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) is determined during moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along the third movement path; and - (i) defining, using the control unit (123), the third position as an initial position of an orientation and / or a positioning of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) in the sample chamber (120, 201, 426), and / or (ii) informing, using the control unit (123), a user of the particle beam device (100, 200, 400).

2. The method according to claim 1, wherein - during moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along the first movement path, the first sensor unit (2000) cooperates with the second sensor unit (2001) at a first point in time, and wherein - a position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) at the first point in time is determined as the first position.

3. The method according to claim 1 or 2, wherein - during moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along the third movement path, the first sensor unit (2000) cooperates with the second sensor unit (2001) at a second point in time, and wherein - a position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) at the second point in time is determined as the third position.

4. The method according to any of the preceding claims, wherein, The first position, the second position, and / or the third position each have three coordinates.

5. The method according to any one of the preceding claims, wherein, The method comprises the following method step: - predefining, using the control unit (123), a fourth position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) relative to the initial position, and moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000) along a fourth movement path to the fourth position of the assembly (119, 500, 122, 424, 1001, 1001A, 4000) by the movement device (600, 602, 604 to 606, M1 to M5).

6. The method according to any one of the preceding claims, wherein, (i) defining the third position as an initial position of the orientation and / or the position of the component (119, 500, 122, 424, 1001, 1001A, 4000) in the sample chamber (120, 201, 426), and / or wherein (ii) if the third position is different from the first position, informing a user of the particle beam device (100, 200, 400) by the control unit (123).

7. The method according to any of the preceding claims, wherein, The moving of the component (119, 500, 122, 424, 1001, 1001A, 4000) along the third movement path takes place within a predefinable movement time, wherein during the moving of the component (119, 122, 424, 1001, 1001A, 4000) a third position of the component (119, 122, 424, 1001, 1001A, 4000) relative to the first sensor unit (2000) is determined.

8. The method of claim 7, wherein, The predefinable movement time is determined by a user of the particle beam device (100, 200, 400), the control unit (123) and / or a control signal initiated by a random number generator by the control unit (123).

9. The method according to any one of the preceding claims, wherein - during the moving of the component (119, 500, 122, 424, 1001, 1001A, 4000) along the first movement path, the component (119, 500, 122, 424, 1001, 1001A, 4000) is moved with a first speed, and wherein - during the moving of the component (119, 500, 122, 424, 1001, 1001A, 4000) along the third movement path, the component (119, 500, 122, 424, 1001, 1001A, 4000) is moved with a second speed, wherein the first speed is higher than the second speed or the first speed is lower than the second speed.

10. The method of any of the preceding claims, wherein, The method comprises at least one of the following method steps: (i) an object holder (114) for arranging the object (125, 425) is used as the component; (ii) a manipulator (1001A) for arranging the object (125, 425) is used as the component; (iii) an object stage (122, 424) for arranging the object (125, 425) is used as the component; (iv) a gas feed unit (1001) for feeding at least one gas to the object (125, 425) is used as the component; (v) a detector (119, 500) for detecting interaction particles and / or interaction radiation generated by an interaction of a particle beam with the object (125, 425) when the particle beam is incident on the object (125, 425) is used as the component; (vi) an aperture unit (4000) is used as the component; (vii) an inductive sensor unit is used as the first sensor unit (2000) and the second sensor unit (2001); (viii) a capacitive sensor unit is used as the first sensor unit (2000) and the second sensor unit (2001); (ix) an optical sensor unit is used as the first sensor unit (2000) and the second sensor unit (2001).

11. Computer program product comprising a program code, which is loadable into a processor (127) and, when executed, controls a particle beam apparatus (100, 200, 400) such that a method according to at least one of the preceding claims is carried out.

12. Particle beam apparatus (100, 200, 400) for machining, imaging and / or analyzing an object (125, 425), comprising - at least one beam generator (101, 301, 402) for generating a particle beam comprising charged particles; - at least one movable assembly (119, 500, 122, 424, 1001, 1001A, 4000), - at least one movement device (600, 602, 604 to 606, M1 to M5) for moving the assembly (119, 500, 122, 424, 1001, 1001A, 4000), - at least one sample chamber (120, 201, 426), wherein, the assembly (119, 500, 122, 424, 1001, 1001A, 4000) being arranged in the sample chamber, - at least one first sensor unit (2000) arranged in the sample chamber (120, 201, 426), - at least one second sensor unit (2001) arranged on the assembly (119, 500, 122, 424, 1001, 1001A, 4000), wherein the first sensor unit (2000) cooperates contactlessly with the second sensor unit (2001), and the particle beam apparatus comprises - at least one control unit (123) comprising a processor (127) into which a computer program product according to claim 11 is loaded.

13. The particle beam apparatus (100, 200, 400) of claim 12, wherein The particle beam apparatus (100, 200, 400) has at least one of the following features: (i) the assembly (114) is embodied as an object holder for arranging the object (125, 425); (ii) the assembly (1001A) is embodied as a manipulator for arranging the object (125, 425); (iii) the assembly (122, 424) is embodied as an object stage for arranging the object (125, 425); (iv) the assembly (1001) is embodied as a gas feed unit for feeding at least one gas to the object (125, 425); (v) the assembly (119, 500) is embodied as a detector for detecting interaction particles and / or interaction radiation resulting from an interaction of the particle beam with the object (125, 425) when the particle beam is incident on the object (125, 425); (vi) the assembly (4000) is embodied as a diaphragm unit; (vii) the first sensor unit (2000) and the second sensor unit (2001) are inductive sensor units; (viii) the first sensor unit (2000) and the second sensor unit (2001) are capacitive sensor units; (ix) the first sensor unit (2000) and the second sensor unit (2001) are optical sensor units.

14. A method for determining an initial position of a movable assembly (119, 500, 122, 424, 1001, 1001A, 4000), wherein, The assembly (119, 500, 122, 424, 1001, 1001A, 4000) is arranged in a sample chamber (120, 201, 426) of a particle beam device (100, 200, 400) for imaging, analyzing and / or processing an object (125, 425), wherein the method comprises the following method steps: - determining, using a control unit (123) of the particle beam device (100, 200, 400), a first position of a marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) as an initial position of the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) for the orientation and / or positioning of the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) in the sample chamber (120, 201, 426); - moving the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) along a movement path by means of a movement apparatus (600, 602, 604 to 606, M1 to M5) of the particle beam device (100, 200, 400); - calculating, using the control unit (123), a second position of a marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) during and / or after moving the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) along the movement path; - recording an optical-optical image of a marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) by means of an optical-optical camera (3000); - comparing, using the control unit (123), whether the calculated second position of the marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) corresponds to the position occupied by the marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) in the optical-optical image; and - if the calculated second position of the mark arranged on the component (119, 500, 114, 122, 424, 1001, 1001A, 4000) differs from the position occupied by the mark arranged on the component (119, 500, 114, 122, 424, 1001, 1001A, 4000) in the light optical image, (i) determining, using the control unit (123), the position occupied by the mark arranged on the component (119, 500, 114, 122, 424, 1001, 1001A, 4000) in the light optical image as an initial position of the component (119, 500, 114, 122, 424, 1001, 1001A, 4000) for the orientation and / or positioning of the component (119, 500, 114, 122, 424, 1001, 1001A, 4000) in the sample chamber (120, 201, 426), and / or (ii) informing, using the control unit (123), a user of the particle beam device (100, 200, 400).

15. The method of claim 14, wherein, The method comprises at least one of the following method steps: (i) an object holder (114, 122, 424, 1001A) for arranging the object (125, 425) is used as the component; (ii) a manipulator (1001A) for arranging the object (125, 425) is used as the component; (iii) an object stage (122, 424) for arranging the object (125, 425) is used as the component; (iv) a gas feed unit (1001) for feeding at least one gas to the object (125, 425) is used as the component; (v) a detector (119, 500) for detecting interaction particles and / or interaction radiation generated by an interaction of a particle beam with the object (125, 425) when the particle beam is incident on the object (125, 425) is used as the component; (vi) an aperture unit (4000) is used as the component.

16. A computer program product comprising a program code, which is loadable into a processor (127) and, when executed, controls a particle beam device (100, 200, 400) such that the method according to claim 14 or 15 is carried out.

17. A particle beam device (100, 200, 400) for machining, imaging and / or analyzing an object (125, 425), comprising - at least one beam generator (101, 301, 402) for generating a particle beam comprising charged particles; - at least one movable component (119, 500, 114, 122, 424, 1001, 1001A, 4000), - at least one movement apparatus (600, 602, 604 to 606, M1 to M5) for moving the component (119, 500, 114, 122, 424, 1001, 1001A, 4000), - at least one sample chamber (120, 201, 426), wherein, The assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000) is arranged in the sample chamber, - at least one marker arranged on the assembly (119, 500, 114, 122, 424, 1001, 1001A, 4000), - at least one light optical camera (3000), and comprising - at least one control unit (123) comprising a processor (127) into which a computer program product according to claim 16 is loaded.

18. The particle beam apparatus (100, 200, 400) of claim 17, wherein The particle beam device (100, 200, 400) has at least one of the following features: (i) the assembly (114, 122, 424, 1001A) is embodied as an object holder for arranging the object (125, 425); (ii) the assembly (1001A) is embodied as a manipulator for arranging the object (125, 425); (iii) the assembly (122, 424) is embodied as an object stage for arranging the object (125, 425); (iv) the assembly (1001) is embodied as a gas feed unit for feeding at least one gas to the object (125, 425); (v) the assembly (119, 500) is embodied as a detector for detecting interaction particles and / or interaction radiation resulting from an interaction of the particle beam with the object (125, 425) when the particle beam is incident on the object (125, 425); (vi) the assembly (4000) is embodied as a light barrier unit.

19. The particle beam apparatus (100, 200, 400) of claim 12, 13, 17 or 18, wherein The particle beam device (100, 200, 400) has at least one of the following features: - at least one scanning device (115, 307, 308, 429) for scanning the particle beam over the object (125, 425); - at least one further detector (116, 117, 119, 121, 419, 428, 500) for detecting interaction particles and / or interaction radiation resulting from an interaction of the particle beam with the object (125, 425) when the particle beam is incident on the object (125, 425).

20. The particle beam apparatus (100, 200, 400) of any one of claims 12, 13, and 17 to 19, wherein The particle beam device (100, 200, 400) comprises at least one objective (107, 304, 421) for focusing the particle beam onto the object (125, 425).

21. The particle beam apparatus (200) of claim 20, wherein The beam generator (101) is embodied as a first beam generator and the particle beam is embodied as a first particle beam comprising first charged particles, wherein the objective (107) is embodied as a first objective for focusing the first particle beam onto the object (125), and wherein the particle beam device (200) further comprises: - at least one second beam generator (301) for generating a second particle beam comprising second charged particles; and - at least one second objective (304) for focusing the second particle beam onto the object (125).

22. The particle beam apparatus (100, 200, 400) of any one of claims 12, 13, and 17 to 21, wherein The particle beam apparatus (100, 200, 400) is an electron beam apparatus and / or an ion beam apparatus.

Images